Electronic device including metal housing and method of manufacturing the same

Abstract

An electronic device according to one embodiment of the present disclosure may include: a display; and a housing in which the display is disposed. The housing may include a first metal component at least partially exposed to an exterior of the electronic device, a second metal component surrounded by the first metal component, and an injection molded portion. The first metal component includes an opening formed through a portion of the first metal component, and the opening may be formed such that a space expands toward a first direction. The second metal component includes a bonding portion for bonding with the opening of the first metal component, and a melt may be formed in a portion of the bonding portion. The injection molded portion may cover at least a portion of the coupling portion and the opening.

Description

Technical Field

[0001] The embodiments described herein relate to an electronic device including a metal casing and a method of manufacturing the same. Background Technology

[0002] With the significant advancements in information and communication technologies and semiconductor technologies, the popularity and use of various electronic devices have increased rapidly. In particular, recent electronic devices are being developed to be portable and capable of communication.

[0003] Electronic devices can refer to any device that performs a specific function according to programs installed therein, ranging from household appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and vehicle navigation systems. For example, such electronic devices can output stored information as audio or video. With the increasing integration density of electronic devices and the widespread adoption of ultra-high-speed, high-capacity wireless communication, a wide variety of functions can now be integrated into a single electronic device, such as a mobile communication terminal. For example, communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions for calendar management or e-wallets are being integrated into a single electronic device. These electronic devices are being miniaturized to allow users to carry them conveniently.

[0004] In recent electronic devices, the outer casing is made of metal to meet consumers' demand for aesthetic design. Summary of the Invention

[0005] Technical solution An electronic device according to embodiments of the present disclosure may include a display and a housing thereon. The housing may include a first metal component at least partially exposed to the outside of the electronic device, a second metal component surrounded by the first metal component, and a molded portion. The first metal component may include an opening formed through a portion of the first metal component, and the opening may be formed to have a space extending in a first direction. The second metal component may include a joint for engaging with the opening of the first metal component, and a portion of the joint may form a molten portion. The molded portion may cover at least a portion of the joint and the opening.

[0006] The housing of an electronic device according to embodiments of the present disclosure may include a first metal component at least partially exposed to the outside of the electronic device, and a second metal component surrounded by the first metal component. The first metal component may include an opening formed through a portion of the first metal component and formed to have a space extending in a first direction. The second metal component may include a joint for engaging with the opening of the first metal component, and a portion of the joint may form a molten portion.

[0007] A method for manufacturing a housing for an electronic device according to embodiments of the present disclosure may include: a process for processing a first metal substrate, the first metal substrate including an opening formed having a space extending in a first direction; a process for processing a second metal substrate, the second metal substrate including a joining portion joined to the opening of the first metal substrate; an alignment process for joining the first metal substrate and the second metal substrate, wherein a support portion of the joining portion is configured to contact an edge of the opening of the first metal substrate, and a protrusion extending from the support portion is configured to be inserted into the opening of the first metal substrate; a bonding process for applying heat to a surface of the support portion of the second metal substrate that is aligned with the first metal substrate, the surface facing a second direction opposite to the first direction; and an injection molding process for forming a molded substrate portion in a region adjacent to the first metal substrate and the second metal substrate. Attached Figure Description

[0008] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0009] Figure 2 This is a perspective view showing the front surface of an electronic device according to an embodiment disclosed herein.

[0010] Figure 3 This illustrates embodiments according to the disclosure herein. Figure 2 A perspective view of the rear surface of the electronic device shown.

[0011] Figure 4a According to the embodiments disclosed herein Figure 2 The diagram shows an exploded perspective view of the electronic device, and also shows the front surface of the electronic device.

[0012] Figure 4b According to the embodiments disclosed herein Figure 2 The diagram shows an exploded perspective view of the electronic device, and also shows the rear surface of the electronic device.

[0013] Figure 5 This is a perspective view showing a portion of the housing of an electronic device according to an embodiment of the present disclosure, excluding electrical components.

[0014] Figure 6 This illustrates an embodiment according to the present disclosure. Figure 5 An enlarged cross-sectional view of a portion of the shell joint section taken by line A-A'.

[0015] Figure 7 This is a flowchart of the assembly structure for forming the housing of an electronic device according to an embodiment of the present disclosure.

[0016] Figure 8aThe diagram illustrates the bonding state between a first metal substrate and a second metal substrate during the process of forming a housing of an electronic device, according to an embodiment of the present disclosure.

[0017] Figure 8b The assembly state between a first metal component, a second metal component, and a molded portion of the housing of an electronic device according to an embodiment of the present disclosure is shown.

[0018] Figure 9 The bonding process between a first metal substrate, a second metal substrate, and a molded substrate of an electronic device housing according to embodiments of the present disclosure is shown sequentially.

[0019] Figure 10 The bonding process between a first metal substrate, a second metal substrate, and a molded substrate of an electronic device housing according to embodiments of the present disclosure is shown sequentially.

[0020] Figure 11 The bonding process between a first metal substrate, a second metal substrate, and a molded substrate of an electronic device housing according to embodiments of the present disclosure is shown sequentially.

[0021] Figure 12a The assembly relationship between a first metal component and a second metal component of the housing of an electronic device according to an embodiment of the present disclosure is shown.

[0022] Figure 12b The illustration shows the assembly state between a first metal substrate and a second metal substrate in the housing forming process of an electronic device according to an embodiment of the present disclosure, prior to the bonding process.

[0023] Figure 12c The diagram illustrates the bonding state between a first metal substrate and a second metal substrate after a bonding process in the housing forming process of an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0024] The electronic device according to the various embodiments can be one of a variety of types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to embodiments of this disclosure, the electronic device is not limited to the electronic devices described above.

[0025] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions for the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to an item may include one or more things. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items listed together in the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used only to distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that if, when the terms “operational location” or “communication location” are used, or when the terms “operational location” or “communication location” are not used, an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element),” it means that the first element can be directly (e.g., wiredly) combined with the second element, wirelessly combined with the second element, or combined with the second element via a third element.

[0026] As used in conjunction with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0027] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be run in a different order or omitted, or one or more other operations may be added.

[0028] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0029] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (e.g., display module 160).

[0030] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 in conjunction with processor 120, and may perform various data processing or calculations. According to embodiments, as at least part of the data processing or calculations, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or a coprocessor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with main processor 121. For example, when electronic device 101 includes a main processor 121 and a coprocessor 123, the coprocessor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The coprocessor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0031] When the main processor 121 is inactive (e.g., in sleep) state, the coprocessor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the coprocessor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the coprocessor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the coprocessor 123. According to embodiments, the coprocessor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed by an electronic device 101 that performs artificial intelligence or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of these, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0032] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0033] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0034] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0035] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0037] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can acquire sound via the input module 150, or output sound via the sound output module 155 or via headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0038] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0039] Interface 177 may support one or more specific protocols used to enable electronic device 101 to be directly (e.g., wired) or wirelessly coupled to external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0040] Connection terminal 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0042] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0043] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0044] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0045] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify or verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0046] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0047] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductor or conductive pattern formed on a base (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 197.

[0048] According to an embodiment, antenna module 197 can form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, an RFIC, and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on a second surface (e.g., the top surface or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals in the specified high-frequency band.

[0049] At least some of the aforementioned components can be combined with each other and exchange signals (e.g., commands or data) between them via inter-peripheral communication schemes (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0050] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 may be performed on one or more of external electronic devices 102, 104, or 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0051] Figure 2 This is a perspective view showing the front surface of an electronic device according to an embodiment disclosed herein.

[0052] Figure 3 This illustrates embodiments according to the disclosure herein. Figure 2 A perspective view of the rear surface of the electronic device shown.

[0053] Reference Figure 2 and Figure 3 According to the embodiment, the electronic device 101 (e.g., Figure 1The electronic device 101 may include a housing 110, which includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding the space between the first surface 110A and the second surface 110B. In an embodiment (not shown), the housing 110 may also refer to a device formed of... Figure 2 The first surface 110A in Figure 3 The second surface 110B and Figure 3 Some structures in the side surface 110C.

[0054] According to an embodiment, a first surface 110A may be formed at least partially from a substantially transparent front panel 102 (e.g., a glass or polymer panel with various coatings). A second surface 110B may be formed from a substantially opaque back panel 111. The back panel 111 may be formed, for example, from coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. A side surface 110C may be formed from a side structure (or “side frame structure”) 118, which is bonded to the front panel 102 and the back panel 111 and comprises metal and / or polymer. In an embodiment, the back panel 111 and the side structure 118 may be integrally formed and may comprise the same material (e.g., a metallic material such as aluminum).

[0055] According to an embodiment, the front panel 102 may include a region (multiple regions) that bends and extends seamlessly toward the rear panel 111 at least a portion of its edge. For example, the front panel 102 (or the rear panel 111) may include only one of the regions that bend and extend toward the rear panel 111 (or the front panel 102) from one edge of the first surface 110A. According to an embodiment, the front panel 102 or the rear panel 111 may have a substantially flat shape, in which case the bent and extended regions may not be included. When the front panel 102 or the rear panel 111 includes the bent and extended regions, the thickness of the electronic device 101 at the portion including the bent and extended regions may be less than the thickness of other portions.

[0056] According to an embodiment, the electronic device 101 may include at least one of the following: a display 101, an audio module (e.g., a microphone hole 103, an external speaker hole 107, and a call receiver hole 114), a sensor module (e.g., a first sensor module 104, a second sensor module (not shown), and a third sensor module 119), a camera module (e.g., a first camera device 105, a second camera device 112, and a flash 113), a key input device 117, a light-emitting element 106, and connector holes (e.g., a first connector hole 108 and a second connector hole 109). In an embodiment, the electronic device 101 may omit at least one of the components (e.g., the key input device 117 or the light-emitting element 106) or additionally include other components.

[0057] Display 101 may output a screen or be visually exposed through a large portion of a first surface 110A (e.g., front panel 102). In embodiments, at least a portion of display 101 may be visually exposed through the front panel 102 forming the first surface 110A or through a portion of a side surface 110C. In embodiments, the edges of display 101 may be formed to be substantially the same as the adjacent outer contour of the front panel 102. In embodiments (not shown), to increase the visually exposed area of ​​display 101, the gap between the outer edge of display 101 and the outer edge of front panel 102 may be formed to be substantially uniform.

[0058] According to an embodiment, a recess or opening may be formed in a portion of the screen display area of ​​the display 101, and the display 101 may include at least one of an audio module (e.g., a call receiver hole 114), a sensor module (e.g., a first sensor module 104), a camera module (e.g., a first camera device 105), and a light-emitting element 106 aligned with the recess and opening. In an embodiment (not shown), the rear surface of the screen display area of ​​the display 101 may include at least one of an audio module (e.g., a call receiver hole 114), a sensor module (e.g., a first sensor module 104), a camera module (e.g., a first camera device 105), a fingerprint sensor (not shown), and a light-emitting element 106. In an embodiment (not shown), the display 101 may be integrated with a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer capable of detecting a magnetic field type stylus, or configured to be adjacent to the touch sensing circuit, the pressure sensor capable of measuring touch intensity (pressure), and / or the digitizer capable of detecting a magnetic field type stylus.

[0059] According to embodiments, audio modules 103, 107, and 114 may include a microphone hole 103 and a speaker hole (e.g., an external speaker hole 107 and a call receiver hole 114). The microphone hole 103 may have a microphone disposed therein to receive external sound, and in embodiments, multiple microphones may be disposed to detect the direction of sound. The speaker hole may include an external speaker hole 107 and a call receiver hole 114. In embodiments, the speaker hole (e.g., external speaker hole 107 and call receiver hole 114) and the microphone hole 103 may be implemented as a single hole, or may include a speaker (e.g., a piezoelectric speaker) without a speaker hole (e.g., external speaker hole 107 and call receiver hole 114).

[0060] According to an embodiment, the sensor module can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 101. The sensor module may include, for example, a first sensor module 104 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 110A of the housing 110, and / or a third sensor module 119 disposed on a second surface 110B of the housing 110. The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed not only on the first surface 110A of the housing 110 (e.g., the display 101), but also on the second surface 110B or a side surface 110C. The electronic device 101 may also include at least one of, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an ambient light sensor 104.

[0061] According to an embodiment, the camera module may include a first camera device 105 disposed on a first surface 110A of the electronic device 101, a second camera device 112 disposed on a second surface 110B, and / or a flash 113. The camera devices (e.g., the first camera device 105 and the second camera device 112) may each include one or more lenses, an image sensor, and / or an image signal processor. The flash 113 may include, for example, a light-emitting diode or a xenon lamp. In an embodiment, one or more lenses (infrared camera, wide-angle lens, and telephoto lens) and an image sensor may be disposed on one surface of the electronic device 101. In an embodiment, the flash 113 may emit infrared light and may receive the infrared light emitted by the flash 113 and reflected by an object via a third sensor module 119. The electronic device 101 or the processor of the electronic device 101 (e.g., Figure 1 The processor 120 in the middle can detect the depth information of the object based on the timing of infrared light received by the third sensor module 119.

[0062] According to an embodiment, the key input device 117 may be disposed on the side surface 110C of the housing 110. In an embodiment, the electronic device 101 may not include some or all of the aforementioned key input devices 117, and any omitted key input devices 117 may be implemented on the display 101 in other forms (such as soft keys). In an embodiment, the key input device may include a sensor module disposed on the second surface 110B of the housing 110.

[0063] According to an embodiment, the light-emitting element 106 may be disposed on, for example, a first surface 110A of the housing 110. The light-emitting element 106 may provide, for example, status information of the electronic device 101 in the form of light. In an embodiment, the light-emitting element 106 may provide, for example, a light source that operates in conjunction with the operation of a camera module (e.g., a first camera device 105). The light-emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.

[0064] According to an embodiment, the connector hole (e.g., a first connector hole 108 and a second connector hole 109) may include a first connector hole 108 and / or a second connector hole (e.g., a headphone jack) 109, wherein the first connector hole 108 is capable of accommodating external electronic devices (e.g., Figure 1 Electronic device 1002 in the middle transmits power and / or data and receives data from external electronic devices (e.g., Figure 1 The electronic device 102 in the middle receives power and / or data through a connector (e.g., a USB connector), and the second connector hole 109 is capable of accommodating a connector for sending audio signals to and receiving audio signals from an external electronic device.

[0065] Figure 4a According to the embodiments disclosed herein Figure 2 The diagram shows an exploded perspective view of the electronic device, and also shows the front surface of the electronic device.

[0066] Figure 4b According to the embodiments disclosed herein Figure 2 The diagram shows an exploded perspective view of the electronic device, and also shows the rear surface of the electronic device.

[0067] Reference Figure 4a and Figure 4b Electronic device 101 (e.g., Figure 1 , Figure 2 or Figure 3 The electronic device 101 may include a side structure 210, a first support member 211 (e.g., a bracket), and a front panel 220 (e.g., Figure 2 Front panel 102), display 230 (e.g., Figure 2 and Figure 3 The display 101), printed circuit board (or board assembly) 240, battery 250, second support member 260 (e.g., rear housing), antenna, camera assembly 207, and rear plate 280 (e.g., Figure 3 (Back plate 111 in the middle).

[0068] According to embodiments, the electronic device 101 may omit at least one of the components (e.g., the first support member 211 or the second support member 260) or additionally include other components. At least one component of the electronic device 101 may be... Figure 2 or Figure 3 At least one of the components of the electronic device 101 shown is the same or similar, and redundant descriptions are omitted below.

[0069] According to an embodiment, the first support member 211 may be disposed inside the electronic device 101 and be connectable to the side structure 210, or may be integrally formed with the side structure 210. The first support member 211 may be formed using, for example, metallic and / or non-metallic materials (e.g., polymers). When formed at least partially using a metallic material, a portion of the side structure 210 or the first support member 211 may serve as an antenna. The first support member 211 may have one surface bonded to the display 230 and another surface bonded to the printed circuit board 240. The printed circuit board 240 may be equipped with a processor (e.g., ...). Figure 1 The processor 120 in the memory (e.g., Figure 1 The memory 130 in the memory) and / or interface (e.g., Figure 1 (Interface 177 in the document). The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor central processor, or a communication processor.

[0070] According to an embodiment, the first support member 211 and the side structure 210 may be combined and referred to as the front housing or housing 201. According to an embodiment, housing 201 is generally understood as a structure for housing, protecting, or arranging the printed circuit board 240 or the battery 250. In an embodiment, housing 201 may be understood as including structures external to the electronic device 101 that are visually or tactilely perceptible to a user, such as the side structure 210, the front panel 220, and / or the rear panel 280. In an embodiment, "front surface or rear surface of housing 201" may refer to... Figure 2 The first surface 110A or Figure 3 The second surface 110B in the middle. In an embodiment, the first support member 211 may be provided in the front plate 220 (e.g., Figure 2 The first surface 110A in the middle) and the rear plate 280 (e.g., Figure 3 Between the second surface 110B, and can be used as a structure for mounting electrical / electronic components such as printed circuit board 240 or camera assembly 207.

[0071] According to an embodiment, the display 230 may include a display panel 231 and a flexible printed circuit board 233 extending from the display panel 231. The flexible printed circuit board 233 is understood to be, for example, at least partially disposed on the rear surface of the display panel 231 and electrically connected to the display panel 231. In an embodiment, the reference numeral "231" is understood to refer to a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise distinguished in the following detailed description, the protective sheet is understood to be part of the display panel 231. In an embodiment, the protective sheet may serve as a buffer structure for absorbing external forces (e.g., a low-density elastic material such as sponge) or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to an embodiment, the display 230 may be disposed on the inner surface of the front panel 220 and may be illuminated by including a light-emitting layer. Figure 2 The first surface 110A or at least a portion of the front panel 220 is used as the output screen. As described above, the display 230 can substantially be located on... Figure 2 The output screen is displayed on the entire area of ​​the first surface 110A or the front panel 220.

[0072] According to embodiments, the memory may include, for example, volatile memory or non-volatile memory.

[0073] According to an embodiment, the interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect electronic device 101 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0074] According to an embodiment, the second support member 260 may include, for example, an upper support member 260a and a lower support member 260b. In an embodiment, the upper support member 260a may be configured to surround a printed circuit board 240 together with a portion of the first support member 211. Circuit devices implemented as integrated circuit chips (e.g., processors, communication modules, or memory) or various electrical / electronic components may be arranged on the printed circuit board 240. According to an embodiment, the printed circuit board 240 may receive an electromagnetic shielding environment from the upper support member 260a. In an embodiment, the lower support member 260b may serve as a structure for arranging electrical / electronic components such as speaker modules, interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors). In an embodiment, electrical / electronic components such as speaker modules, interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors) may be arranged on an additional printed circuit board (not shown). In this case, the lower support member 260b may be configured to surround an additional printed circuit board together with another portion of the first support member 211. The speaker module or interface, arranged on an additional printed circuit board (not shown) or lower support member 260b, can be configured to... Figure 2 The audio module (e.g., microphone hole 103 or speaker hole (e.g., external speaker hole 107 and call receiver hole 114)) or connector hole (e.g., first connector hole 108 and second connector hole 109) in the middle corresponds to the audio module (e.g., microphone hole 103 or speaker hole (e.g., external speaker hole 107 and call receiver hole 114)) or connector hole (e.g., first connector hole 108 and second connector hole 109).

[0075] According to an embodiment, the speaker module or interface may be arranged corresponding to the audio module 207 or the connector hole 108 or 109.

[0076] According to an embodiment, battery 250 may be a means for supplying power to at least one component of electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell. At least a portion of battery 250 may be substantially coplanar with, for example, printed circuit board 240. Battery 250 may be integrally disposed in electronic device 101, or may be detachably disposed in electronic device 101.

[0077] According to an embodiment, the electronic device 101 may further include a separate sub-circuit board 290 disposed in the first support member 211 and spaced apart from the printed circuit board 240. The sub-circuit board 290 may be electrically connected to the printed circuit board 240 via a connection member such as a flexible connection substrate or a cable. The sub-circuit board 290 may be electrically connected to a battery 289 or electrical components (such as a speaker, USB connector, antenna connector, and / or SIM socket) disposed in the end region of the electronic device 101 to transmit signals and power.

[0078] Although not shown, the antenna may include, for example, a conductive pattern formed on the surface of the second support member 260 via a laser direct structuring process. In an embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin-film antenna may be disposed between the rear plate 280 and the battery 250. The antenna may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The antenna may, for example, perform near-field communication with an external device or wirelessly transmit and receive power required to charge an external device. In an embodiment, other antenna structures may be formed from a portion of the side structure 210 and / or the first support member 211, or a combination thereof.

[0079] According to an embodiment, camera assembly 207 may include at least one camera module. Inside electronic device 101, camera assembly 207 may receive at least a portion of light incident through optical apertures or camera windows 212, 213, and 219. In an embodiment, camera assembly 207 may be disposed on a first support member 211 at a location adjacent to printed circuit board 240. In an embodiment, the camera module of camera assembly 207 may be substantially aligned with one of camera windows 212, 213, and 219, and may be at least partially surrounded by a second support member 260 (e.g., upper support member 260a).

[0080] The assembly structure of the shell will be described in detail below.

[0081] Figure 5 This is a perspective view showing a portion of the housing of an electronic device according to an embodiment of the present disclosure, excluding electrical components.

[0082] Figure 6 This illustrates an embodiment according to the present disclosure. Figure 5 An enlarged cross-sectional view of a portion of the shell joint section taken by line A-A'.

[0083] According to an embodiment, the electronic device 101 may include a housing 201 (e.g., Figure 4a and Figure 4b The housing 201 may include a first metal component 310 (e.g., an outer metal component), a second metal component 320 (e.g., an inner metal component), and a molded portion 330. According to an embodiment, the housing 201 can be understood as being used to house, protect, or arrange a printed circuit board (e.g., Figure 4a and Figure 4b Printed circuit board 240) or battery ( Figure 4a and Figure 4b The structure of the battery (250).

[0084] Figure 5 and Figure 6 The structure of the shell 201 in the middle can be compared with Figure 4a and Figure 4b The structure of the shell 201 is either identical or completely the same. Figure 5 and Figure 6 The embodiments in the example can be compared with Figures 1 to 4b The embodiments in the text are partially combined or combined with... Figures 7 to 12c The embodiments described are partially combined.

[0085] According to an embodiment, the housing 201 may include a first metal component 310 and a second metal component 320 surrounded by the first metal component 310. According to an embodiment, the housing 201 may include the first metal component 310, the second metal component 320 surrounded by the first metal component 310, and a molded portion 330.

[0086] According to an embodiment, the first metal component 310 of the housing 201 may form the appearance of the electronic device 101. The second metal component 320 of the housing 201 may support a display (e.g., Figure 4a and Figure 4b The display 220 in the housing 201 provides space for arranging internal components. The molded portion 330 of the housing 201 may be disposed along the boundary surface between the first metal component 310 and the second metal component 320.

[0087] According to an embodiment, the first metal component 310 and the second metal component 320 may be formed using a single metal material. For example, the first metal component 310 forming the exterior and the second metal component 320 disposed inside the first metal component 310 may be formed using at least one material selected from stainless steel (SUS), titanium, magnesium, aluminum, ceramic, or glass.

[0088] According to an embodiment, the first metal component 310 and the second metal component 320 of the housing 201 may be formed using different metallic materials (e.g., dissimilar metallic materials). For example, the first metal component 310, which forms the appearance, may be formed using a material that provides an aesthetic appearance (such as stainless steel (SUS), titanium, or magnesium). The second metal component 320 disposed inside the first metal component 310 may be formed using a material that is easy to process (such as aluminum).

[0089] According to an embodiment, after the first metal component 310 and the second metal component 320 of the housing 201 are joined, a molded portion 330 formed by an injection molding process can be disposed on at least a portion of the surfaces of the first metal component 310 and the second metal component 320 and on the joint. The molded portion 330 can cover the joint to prevent corrosion and enable the design of the overall shape of the housing 201. Subsequently, the final shape of the housing 201 can be designed by a computer numerical control (CNC) process.

[0090] According to an embodiment, the housing 201 may be formed by a bonding structure between a first metal component 310 and a second metal component 320. The first metal component 310 is a portion at least partially exposed to the outside of the electronic device 101 and may include an opening 315 formed through a region therethrough. The second metal component 320 may include a coupling portion 325 for engaging with the opening 315 of the first metal component 310. The overall shape of the first metal component 310, the opening 315 formed in a portion of the first metal component 310, and / or the coupling portion 325 of the second metal component 320 may be formed by computer numerical control (CNC) technology.

[0091] According to an embodiment, the opening 315 of the first metal component 310 (e.g., the diameter of the opening 315) may have a shape in which at least a portion of the space extends in the -P direction. For example, the -P direction may be the upward direction (e.g., the display direction) or the downward direction (e.g., the back panel direction) of the electronic device 101. For example, the -P direction may be the direction faced by the protrusion 323 projecting from the support portion 321 of the second metal component 320. For example, the -P direction may be the direction opposite to a surface of the support portion 321 of the second metal component 320 on which a joining process (e.g., a welding process, a laser process, or a heating process) is performed (e.g., a surface facing the +P direction).

[0092] According to an embodiment, an opening 315 of the first metal member 310 may be formed through a portion of the first metal member 310. The opening 315 formed through a portion of the first metal member 310 may be configured such that the internal space varies along the +P or -P direction. For example, the opening 315 of the first metal member 310 may be configured such that the internal space (e.g., the diameter of the opening 315) expands continuously (or gradually) along the -P direction. For example, the opening 315 of the first metal member 310 may expand along the -P direction only within a portion of the internal space.

[0093] According to an embodiment, the cross-section of the opening 315 of the first metal component 310 may have a trapezoidal shape. For example, when viewed from above along the -P direction or from below along the +P direction, the opening 315 may be circular, square, or polygonal. When the opening 315 is a circular opening, the diameter of the upper space of the opening 315 may differ from the diameter of the lower space when viewed from the -P direction or from the +P direction. For example, the diameter of the lower space of the opening 315 may be larger than the diameter of the upper space of the opening 315.

[0094] According to an embodiment, the opening 315 of the first metal component 310 may have an undercut shape. For example, the inner surface 311c of the first metal component 310 forming the opening 315 may be formed as an inclined surface with a specified inclination relative to the upper surface 311a (e.g., the surface facing +P) or the lower surface 311b (e.g., the surface facing -P) of the first metal component 310 adjacent to the opening 315.

[0095] According to an embodiment, the height of the opening 315 of the first metal member 310 (e.g., the length in the -P or +P direction) may be greater than the height of the protrusion 323 (e.g., the length in the -P or +P direction). For example, the protrusion 323 of the second metal member 320 inserted into the opening 315 formed through a region of the first metal member 310 may be located within the opening 315 and may not be exposed outside the opening 315.

[0096] According to an embodiment, the housing 201 may be formed by a connection structure between a first metal component 310 and a second metal component 320. The second metal component 320 may be formed such that at least a portion thereof is surrounded by the first metal component, and may include a connection portion 325 for engaging with an opening 315 of the first metal component 310. The connection portion 325 of the second metal component 320 may include a support portion 321 adjacent to the edge of the opening 315 of the first metal component 310 and a protrusion 323 projecting from the support portion 321.

[0097] According to an embodiment, the support portion 321 of the second metal component 320 may be configured to contact the first metal component 310 and may face the upper space of the opening 315 (e.g., the space facing the +P direction). The protrusion 323 of the second metal component 320 may protrude from the support portion 321 along the -P direction and may be inserted into the opening 315 and engaged with a portion of the inner surface of the first metal component 310. The protrusion 323 of the second metal component 320 may have a shape such as a pole, a projection, or a rib.

[0098] According to an embodiment, a plurality of bonding structures may be formed between the first metal component 310 and the second metal component 320. The bonding structures may be formed in various ways in the areas where the first metal component 310 and the second metal component 320 contact each other. According to an embodiment, the bonding structure (e.g., a joining structure) between the first metal component 310 and the second metal component 320 may include a first bonding portion formed by chemical bonding (e.g., melting) and a second bonding portion formed by physical bonding.

[0099] According to an embodiment, the joining structure between the first metal component 310 and the second metal component 320 may be a structure in which the support portion 321 of the second metal component 320 is configured to contact the adjacent edge of the opening 315 of the first metal component 310, and the protrusion 323 of the second metal component 320 is inserted into the opening 315 of the first metal component 310. Hereinafter, prior to the final product, such as prior to joining processes (e.g., welding, laser processing), the first metal component 310 may be referred to as the first metal substrate, and the second metal component 320 may be referred to as the second metal substrate. The joining portion 325 (e.g., the support portion 321 and the protrusion 323) of the first metal component 310 may be referred to in the same manner. The opening 315 of the second metal component 320 may be referred to in the same manner.

[0100] Prior to the joining process (e.g., welding, laser, or heating), the protrusion 323 of the second metal substrate may be smaller than the internal space of the opening 315 of the first metal component 310, and therefore may not be in an assembled or joined state. When heat (e.g., welding or laser) is applied to the upper surface of the support 321 (e.g., a surface facing +P), heat can be transferred to the support 321 and the protrusion 323 protruding from the lower surface of the support 321 (e.g., a surface facing -P). The protrusion 323, melted by the transferred heat, may be deformed into a shape corresponding to the shape of the opening 315 (e.g., an undercut shape). The protrusion 323 corresponding to the opening 315 may have an undercut shape and may be fitted into and joined to the opening 315.

[0101] According to an embodiment, the joining structure between the first metal component 310 and the second metal component 320 may be a structure in which the support portion 321 of the second metal component 320 is configured to contact the adjacent edge of the opening 315 of the first metal component 310 and the protrusion 323 of the second metal component 320 is inserted into the opening of the first metal component 310. According to an embodiment, the support portion 321 of the second metal component 320 may be partially melted by a joining process to form a chemical bond (e.g., a first bond) with the first metal component 310 in contact with the support portion 321. The joining process may be performed using physical force (such as agitation or welding) without applying heat, or it may be performed using at least one of a laser process utilizing light or a heating process utilizing heat. According to an embodiment, the adjacent edge of the opening 315 of the first metal component 310 may be partially melted by a joining process to form a chemical bond (e.g., a first bond) with the second metal component 320 in contact with the edge of the first metal component 310. The adjacent edge 401 of the support portion 321 and / or opening 315 of the second metal component 320, which melts together with the support portion 321, may be referred to as the melted portion.

[0102] According to the embodiment, in addition to the support portion 321, the melting portion 401 may also include the portion of the protrusion 323 adjacent to the support portion 321 and the interior of the opening 315 that melts together with the portion of the protrusion 323.

[0103] According to an embodiment, the protrusion 323 of the second metal component 320, which is inserted into the opening 315 of the first metal component 310, forms a physical connection (e.g., a second connection) by being fitted into and bonded to the opening 315. For example, the protrusion 323 of the second metal substrate can be melted by a bonding process (e.g., welding, laser, or heating) to fill a portion of the opening 315. Subsequently, the cooled protrusion 323 can be fitted into and bonded to the opening 315 of the first metal component 310. A portion of the protrusion 323 and / or the portion of the opening 315 fitted onto and bonded to the protrusion 323 (e.g., the inner surface of the first metal component 310 forming the opening 315) can be referred to as a non-melting portion 402. The protrusion 323 of the second metal component 320 may be inserted only into a portion of the opening 315 of the first metal component 310.

[0104] According to an embodiment, the bonding structure (e.g., a joint structure) between the first metal component 310 and the second metal component 320 may include a first joint formed by chemical bonding (e.g., melting) and a second joint formed by physical bonding. Within the extended structure (e.g., an undercut structure) of the opening 315 of the first metal component 310, a molten joint and a non-molten joint may be formed, in which a portion of the second metal substrate is melted and filled by a bonding process. The bonding structure between the first metal component 310 and the second metal component 320, which are melted and joined together, can increase the bonding strength through chemical bonding. By increasing the area of ​​the protrusion 323 of the unmelted extended structure shape of the opening 315 of the second metal component, the contact area with the first metal component 310 can be increased, thereby forming a structure resistant to external forces in three dimensions and increasing the bonding strength.

[0105] According to an embodiment, the molded portion 330 may be located on the upper and / or lower side of the bonding structure (e.g., a joint structure) between the first metal component 310 and the second metal component 320. The molded portion 330 may be configured to cover the bonding structure between the first metal component 310 and the second metal component 320, thereby limiting or reducing corrosion of the bonding structure.

[0106] According to an embodiment, the molding portion 330 may include a first molding portion 330 disposed on the upper side (e.g., in the +P direction) of the bonding structure and a second molding portion 330 disposed on the lower side (e.g., in the -P direction) of the bonding structure. The first molding portion 330 may be disposed around the upper surface (e.g., the surface facing the +P direction) of the support portion 321 of the second metal member 320 and around the first metal member 310 that contacts the upper surface. For example, the first molding portion 330 may be disposed around at least a portion of the molten portion (e.g., the adjacent edge 401 of the support portion 321 and / or the opening 315 of the second metal member 320 that melts together with the support portion 321). The second molding portion 330 may be disposed around the outer surface (e.g., the surface facing the -P direction) of the protrusion 323 of the second metal member 320 and around the first metal member 310 that contacts the outer surface. For example, the second molding portion 330 may be disposed together with the protrusion 323 of the second metal member 320 within the opening 315. For example, the second molded portion 330 may be disposed around at least a portion of the non-melting portion 402 (e.g., a portion of the protrusion 323 of the second metal member 320 and the inner surface of the forming opening 315 of the first metal member 310).

[0107] Figure 7 This is a flowchart of the assembly structure for forming the housing of an electronic device according to an embodiment of the present disclosure.

[0108] Figure 8a The diagram illustrates the bonding state between a first metal substrate and a second metal substrate during the process of forming a housing of an electronic device, according to an embodiment of the present disclosure.

[0109] Figure 8b The assembly state between a first metal component, a second metal component, and a molded portion of the housing of an electronic device according to an embodiment of the present disclosure is shown.

[0110] Figure 9 The bonding process between a first metal substrate, a second metal substrate, and a molded substrate of an electronic device housing according to embodiments of the present disclosure is shown sequentially.

[0111] According to an embodiment, the electronic device 101 may include a housing 201 (e.g., Figure 4a and Figure 4b The housing 201 may include a first metal component 310 (e.g., an outer metal component), a second metal component 320 (e.g., an inner metal component), and a molded portion 330.

[0112] Figures 7 to 9 The structure of the shell 201 in the middle can be compared with Figure 4a and Figure 4b The structure of the shell 201 is either identical or completely the same. Figures 7 to 9 The embodiments can be compared with Figures 1 to 4b The embodiments are partially combined, or combined with Figures 10 to 12c The embodiments are partially combined.

[0113] In the following text, prior to the final product, such as prior to joining processes (e.g., welding, laser processing, or heating processes) or prior to computer numerical control (CNC) machining, the first metal part 310 may be referred to as the first metal substrate 310a, and the second metal part 320 may be referred to as the second metal substrate 320a. The joining portion 325 (e.g., the support portion 321 and the protrusion 323) of the first metal part 310 may be referred to in the same manner. The opening 315 of the second metal part 320 may be referred to in the same manner. The molding portion 330 prior to CNC machining may be referred to as the molding substrate 330a.

[0114] According to an embodiment, the process for forming the housing 201 can be performed by the following steps: aligning the portions to be joined of two metal substrates, joining a portion of one metal substrate to another metal substrate by a joining process (e.g., welding, laser, or heating), and then performing an injection molding process on the joined portions. Specific processes will be described below.

[0115] First, a process for fabricating two metal substrates (e.g., a first metal substrate 310a and a second metal substrate 320a) can be performed. The first metal substrate 310a is a first metal component used to form the appearance of an electronic device (e.g., Figure 5 The first metal component 310 in the housing 201 is in its unprocessed form and can be defined as an outer metal substrate. The second metal substrate 320a can be the first metal component (e.g., disposed in the housing 201) in its unprocessed form. Figure 5 The second metal component (e.g., inside the first metal component 310) Figure 5 The second metal component 320 in the process is in its unprocessed form and can be defined as an inner metal substrate.

[0116] According to an embodiment, the first metal substrate 310a and the second metal substrate 320a can be formed using a single material. When the first metal substrate 310a and the second metal substrate 320a are formed using a single material, the single material can be at least one of stainless steel (SUS), titanium, magnesium, aluminum, ceramic, or glass.

[0117] According to an embodiment, the first metal substrate 310a and the second metal substrate 320a may be formed from different dissimilar metal materials. When formed from dissimilar metal materials, the first metal substrate 310a may be at least one of stainless steel (SUS), titanium, or magnesium, while the second metal substrate 320a may be a material that is easier to process than the first metal substrate 310a, such as aluminum.

[0118] The first metal substrate 310a prepared may undergo processing techniques (e.g., Figure 7 Process 10) is used to bond the first metal substrate 310a to the second metal substrate 320a. The first metal substrate 310a can be processed by computer numerical control (CNC) technology. In the CNC process, a portion of the first metal substrate 310a can be processed to form an opening 315 for bonding with the second metal substrate 320a.

[0119] According to an embodiment, the opening 315 of the first metal substrate 310a may have a shape in which at least a portion of its space extends in the -P direction. The -P direction may be the upward direction (e.g., display direction) or the downward direction (e.g., back panel direction) of the electronic device 101. For example, the -P direction may be the direction facing the protrusion 323 protruding from the support portion 321 of the second metal substrate 320a (or the second metal component 320) (e.g., the -P direction). For example, the -P direction may be the direction opposite to a surface of the support portion 321 of the second metal substrate 320a (or the second metal component 320) on which a joining process (e.g., a welding process or a laser process) is performed (e.g., a surface facing the +P direction).

[0120] According to an embodiment, an opening 315 of the first metal substrate 310a may be formed through a region of the first metal member 310. The opening 315 formed through a region of the first metal substrate 310a may be configured such that its internal space varies along the +P or -P direction. For example, the internal space of the opening 315 of the first metal substrate 310a may expand continuously (or gradually) along the -P direction. For example, the opening 315 of the first metal substrate 310a may have an undercut shape. For example, the inner surface of the first metal substrate 310a forming the opening 315 may be formed as an inclined surface with a specified inclination relative to the upper surface (e.g., the surface facing +P) or lower surface (e.g., the surface facing -P) of the first metal substrate 310a adjacent to the opening 315. For example, the upper space (e.g., the space facing -P) and the lower space (e.g., the space facing +P) of the opening 315 of the first metal substrate 310a may have different dimensions.

[0121] The prepared second metal substrate 320a may undergo a processing process (e.g., process 20) to be bonded to the opening 315 and surrounding area of ​​the first metal substrate 310a. The second metal substrate 320a may be processed by a casting process. According to an embodiment, in the casting process, the second metal substrate 320a may be processed to form a support portion 321 for bonding with the first metal substrate 310a. According to an embodiment, in the casting process, the second metal substrate 320a may be processed to form the support portion 321 for bonding with the first metal substrate 310a and a protrusion 323 extending from the support portion 321.

[0122] According to an embodiment, the support portion 321 of the second metal substrate 320a may contact the edge of the opening 315 of the first metal substrate 310a, and may be the portion for which a heating process (e.g., welding, laser, or heating) is performed. The protrusion 323 of the second metal substrate 320a may be the portion to be inserted into the opening 315 of the first metal substrate 310a, and may be formed to have a size smaller than the size (e.g., diameter) of the opening 315. The protrusion 323 of the second metal substrate 320a may be columnar, and may be formed such that when inserted into a portion of the opening 315, the protrusion 323 melts through a bonding process to contact the inner surface of the opening 315.

[0123] Subsequently, an alignment process (e.g., process 30) for bonding the first metal substrate 310a and the second metal substrate 320a can be performed.

[0124] According to embodiments, multiple bonding structures can be formed between the first metal substrate 310a and the second metal substrate 320a. The bonding structures can be formed in various ways within the contact area between the first metal substrate 310a and the second metal substrate 320a.

[0125] According to an embodiment, when the second metal substrate 320a includes a support portion 321 and a protrusion 323, the support portion 321 of the second metal substrate 320a may be configured to contact the adjacent edge of the opening 315 of the first metal substrate 310a, and the protrusion 323 of the second metal component 320 may be inserted into the opening of the first metal component 310.

[0126] According to an embodiment, when the second metal substrate 320a only includes a support portion 321, the support portion 321 of the second metal substrate 320a may be configured to contact the adjacent edge of the opening 315 of the first metal substrate 310a.

[0127] Subsequently, a bonding process (e.g., process 40) for bonding the first metal substrate 310a and the second metal substrate 320a can be performed. A laser process or a welding process can be performed on the portion of the second metal substrate 320a that is aligned with the first metal substrate 310a.

[0128] According to an embodiment, when the second metal substrate 320a includes a support portion 321 and a protrusion 323, before the bonding process, the size of the protrusion 323 of the second metal substrate 320a may be smaller than the internal space of the opening 315 of the first metal substrate 310a, and therefore it may not be in an assembled or bonded state. When heat is applied to the upper surface (e.g., the surface facing +P) of the support portion 321 of the second metal substrate 320a (e.g., during the bonding process), heat can be transferred to the support portion 321 and the protrusion 323 protruding from the lower surface (e.g., the surface facing -P) of the support portion 321. The portion of the protrusion 323 that is melted by the transferred heat can be deformed into a shape corresponding to the shape of the opening 315 (e.g., an undercut shape). After the bonding process is completed, the shape of the protrusion 323 corresponding to the opening 315 may be an undercut shape, and it can be assembled into and bonded to the opening 315.

[0129] According to embodiments of this disclosure, compared to a process that performs heat treatment (e.g., heat treatment from the opposite direction to this disclosure) at the end of the protrusion into the opening, a process that performs heat treatment (e.g., welding or laser processing) toward the upper surface of the support portion 321 of the second metal substrate 320a (e.g., a surface facing +P) reduces the degree of machining of the outer metal (e.g., the first metal substrate). Therefore, the total processing time can be reduced. Furthermore, since the degree of machining of the outer metal (e.g., the first metal substrate) is reduced, the overall rigidity of the housing can be increased.

[0130] According to an embodiment, the adjacent edges of the opening 315 of the first metal substrate 310a and the support portion 321 of the second metal substrate 320a can be partially melted to form a chemical bond. The adjacent edges 401 of the support portion 321 and / or the opening 315 of the second metal substrate 320a, which are melted together with the support portion 321 (see...) Figure 6 This can be referred to as the melting section. For example, the melting section may include the portion of the support 321 and the portion of the protrusion 323 adjacent to the support 321. For example, the melting section may include the support 321, the portion of the protrusion 323 adjacent to the support 321, and the interior of the opening 315 that melts together with that portion of the protrusion 323.

[0131] According to an embodiment, a protrusion 323 of the second metal substrate 320a, inserted into an opening 315 of the first metal substrate 310a, can be fitted into and bonded to the opening 315 to form a physical bond. In a bonding process (e.g., welding, laser, or heating), heat can be applied to the protrusion 323 of the second metal substrate 320a, so that a portion of the protrusion 323 melts and fills a portion of the opening 315. Subsequently, the cooled protrusion 323 can be fitted into and bonded to the opening 315 of the first metal substrate 310a. A portion of the protrusion 323 and / or the portion of the opening 315 fitted onto and bonded to the protrusion 323 (e.g., the inner surface of the first metal substrate 310a forming the opening 315) can be referred to as a non-melting portion. The protrusion 323 of the second metal substrate 320a can be configured to be inserted only into a portion of the opening 315 of the first metal component 310. Following a bonding process (e.g., welding, laser, or heating), the melting of the first metal substrate 310a and the increase in the bonding area of ​​the second metal substrate 320a can enhance the chemical bond strength. The increase in the size of the unmelted protrusion 323 of the second metal substrate 320a, which fills the extended structural shape of the opening 315, can enhance the physical bond strength by increasing the contact area with the first metal substrate 310a.

[0132] According to an embodiment, when the second metal substrate 320a includes only the support portion 321, when heat (e.g., a bonding process) is applied to the upper surface of the support portion 321 of the second metal substrate 320a (e.g., the surface facing the +P direction), heat can be transferred throughout the support portion 321. A portion of the support portion 321 that melts due to the transferred heat can flow into the opening 315 and fill a portion of the opening 315, thereby deforming it into a shape corresponding to the shape of a portion of the opening (e.g., an undercut shape). After the bonding process (e.g., welding, laser, or heating process) is completed, the modified portion of the support portion 321 protruding into the opening 315 can have an undercut shape and can be fitted into and bonded to the opening 315.

[0133] Table 1 below shows the bonding strength between the first metal substrate 310a and the second metal substrate 320a (or the second metal part 320) depending on the presence or absence of the protrusion.

[0134] Table 1 shows the results of a push test performed on the bond structure between the first metal part 310 and the second metal part 320 after the bonding process is completed. When the bond strength in the push test is greater than or equal to 10 kgf, it is determined that the bond structure can maintain high bond strength without affecting the injection pressure provided during the injection molding process.

[0135] [Table 1]

[0136] Five samples were selected for each case, depending on the presence or absence of the protrusion on the second metal substrate 320a (or the second metal part 320). A bonding process was then performed, followed by a pressing test under the same conditions.

[0137] When the second metal substrate 320a does not have a protrusion, the results of the compression test for the bonding strength between the second metal substrate 320a and the first metal substrate 310a are approximately 38 kgf, 41 kgf, 35 kgf, 38 kgf and 40 kgf for the specimen.

[0138] When the second metal substrate 320a has a protrusion, the results of the compression test for the bonding strength between the second metal substrate 320a and the first metal substrate 310a are approximately 44 kgf, 48 kgf, 43 kgf, 44 kgf and 47 kgf for the specimen.

[0139] In both the absence and presence of the protrusion in the second metal substrate 320a, test results of the specimens undergoing the bonding process show that all specimens exhibit a compression strength greater than or equal to 10 kgf in the pressing test and maintain a high bonding strength with the first metal substrate to adequately withstand injection pressure. Therefore, it can be observed that the bonding structure between the first and second metal substrates according to this disclosure does not lose mechanical rigidity due to the injection pressure of subsequent processes (e.g., injection molding processes) and maintains the bonding surface throughout.

[0140] When the second metal substrate 320a has a protrusion, a higher pressing test result can be observed compared to when the second metal substrate 320a does not have a protrusion. The protrusion 323 of the second metal substrate 320a provides a guide for alignment when it is directly inserted into the opening 315 of the first metal substrate 310a before the bonding process, and provides a more robust bonding structure with the first metal substrate 310a after the bonding process is completed.

[0141] Following the bonding process, an injection molding process (e.g., process 50) may be performed. Performing the injection molding process via insert injection molding can create a high bond strength between the first metal substrate 310a and the second metal substrate 320a, and can limit or reduce corrosion of the bond structure formed between the first metal substrate 310a and the second metal substrate 320a.

[0142] According to an embodiment, the molded substrate 330a formed by injection molding may include a first molded substrate portion 331a disposed on the upper side (e.g., in the +P direction) of the bonding structure and a second molded substrate portion 332a disposed on the lower side (e.g., in the -P direction) of the bonding structure. The first molded portion 330 may be disposed on the upper surface (e.g., the surface facing the +P direction) of the support portion 321 of the second metal substrate 320a and around the first metal substrate 310a in contact with it. For example, the first molded substrate portion 330a may be disposed in the molten portion (e.g., the adjacent edge 401 of the support portion 321 and / or the opening 315 of the second metal substrate 320a that melts together with the support portion 321) (see Figure 6 The second molded substrate portion 332a may be disposed around at least a portion of the outer surface (e.g., the surface facing the -P direction) of the protrusion 323 of the second metal substrate 320a and the first metal substrate 310a in contact with it. For example, the second molded substrate portion 332a may be disposed together with the protrusion 323 of the second metal substrate 320a within the opening 315. For example, the second molded substrate portion 332a may be disposed around at least a portion of the non-melting portion (e.g., a portion of the protrusion 323 of the second metal substrate 320a and the inner surface of the first metal substrate 310a forming the opening 315).

[0143] After the injection molding process, the final form of the housing 201 can be designed using computer numerical control (CNC) technology (e.g., process 60).

[0144] Figure 10 The bonding process between a first metal substrate, a second metal substrate, and a molded substrate of an electronic device housing according to embodiments of the present disclosure is shown sequentially.

[0145] Figure 11 The bonding process between a first metal substrate, a second metal substrate, and a molded substrate of an electronic device housing according to embodiments of the present disclosure is shown sequentially.

[0146] According to an embodiment, the electronic device 101 may include a housing 201 (e.g., Figure 4a and Figure 4b The housing 201 may include a first metal component (e.g., an outer metal component), a second metal component (e.g., an inner metal component), and a molded portion.

[0147] Figure 10 and Figure 11 The structure of the shell 201 in the middle can be compared with Figure 4a and Figure 4b The structure of the shell 201 is partially or entirely the same. Figure 10 and Figure 11 The embodiments can be compared with Figures 1 to 9 Implementation examples or related Figures 12a to 12c The embodiments are partially combined.

[0148] In the following text, prior to the final product, such as prior to joining processes (e.g., welding, laser processing, or heating processes) or prior to computer numerical control (CNC) machining, the first metal component may be referred to as the first metal substrate 310a, and the second metal component may be referred to as the second metal substrate 320a. The joining portion 325 (e.g., the support portion 321 and the protrusion 323) of the first metal component may be referred to in the same manner. The opening 315 of the second metal component may be referred to in the same manner. The molded portion prior to CNC machining may be referred to as the molded substrate 330a.

[0149] According to an embodiment, the process for forming the housing 201 can be performed by the following steps: aligning the portions to be joined of two metal substrates, joining a portion of one metal substrate to the other metal substrate by a joining process (e.g., welding or melting), and then performing an injection molding process on the joined portions. Specific processes will be described below.

[0150] First, a process for preparing two metal substrates (e.g., a first metal substrate 310a and a second metal substrate 320a) can be performed. According to an embodiment, the first metal substrate 310a and the second metal substrate 320a can be formed using a single material or dissimilar materials.

[0151] The first metal substrate 310a prepared may undergo processing techniques (e.g., Figure 7 Process 10) is used to bond the first metal substrate 310a to the second metal substrate 320a. The first metal substrate 310a can be processed by computer numerical control (CNC) technology. In the CNC process, a portion of the first metal substrate 310a can be processed to form an opening 315 for bonding with the second metal substrate 320a.

[0152] According to an embodiment, the opening 315 of the first metal substrate 310a may have a shape in which at least a portion of the space of the opening extends in the -P direction. The -P direction may be the upward direction (e.g., the display direction) or the downward direction (e.g., the back panel direction) of the electronic device 101.

[0153] Reference Figure 10 The opening 315 of the first metal substrate 310a can form a channel with a substantially constant diameter, and grooves or spiral grooves can be formed at specified intervals (e.g., regular intervals) on the inner surface of the opening 315 of the first metal substrate 310a. For example, the inner surface of the opening 315 of the first metal substrate 310a can be screw tapping.

[0154] Reference Figure 11 The opening 315 of the first metal substrate 310a can be processed such that only one side is open while the other side is closed. For example, the opening 315 of the first metal substrate 310a can be processed such that the upper space (e.g., the space facing the +P direction) is open while the lower space (e.g., the space facing the -P direction) is closed. For example, the opening 315 of the first metal substrate 310a can be a recess or a groove shape.

[0155] Figure 11 The depth of the opening 315 (e.g., its length in the -P or +P direction) may be less than Figure 10 The depth of the opening 315 (e.g., the length in the -P or +P direction). Grooves or spiral grooves may be formed at specified intervals (e.g., regular intervals) on the inner surface of the first metal substrate 310a forming the opening 315. For example, the inner surface of the first metal substrate 310a forming the opening 315 may have grooves or spiral grooves formed at specified intervals (e.g., regular intervals).

[0156] The prepared second metal substrate 320a may undergo processing techniques (e.g., Figure 7 Process 20) in the process of bonding to the opening of the first metal substrate 310a (e.g., Figure 10 or Figure 11 The opening 315 and its surrounding area. The second metal substrate 320a can be processed by casting.

[0157] Subsequent processes (e.g.) Figure 7 Processes 30, 40, 50, and 60 in the process can be followed Figures 7 to 9 The shell forming process disclosed in the paper.

[0158] Figure 12a The assembly relationship between a first metal component and a second metal component of the housing of an electronic device according to an embodiment of the present disclosure is shown.

[0159] Figure 12b The illustration shows the assembly state between a first metal substrate and a second metal substrate in the housing forming process of an electronic device according to an embodiment of the present disclosure, prior to the bonding process.

[0160] Figure 12c The diagram illustrates the bonding state between a first metal substrate and a second metal substrate after a bonding process in the housing forming process of an electronic device according to an embodiment of the present disclosure.

[0161] Figure 12b and Figure 12c It is along Figure 12a The cross-sectional view taken by line B-B' in the diagram.

[0162] According to an embodiment, the electronic device 101 may include a housing 201 (e.g., Figure 4a and Figure 4b The housing 201 may include a first metal component (e.g., an outer metal component) and a second metal component (e.g., an inner metal component).

[0163] Figures 12a to 12c The structure of the shell 201 in the middle can be compared with Figure 4a and Figure 4b The structure of the shell 201 is partially or entirely the same. Figures 12a to 12c The embodiments in the example can be compared with Figures 1 to 10 The embodiments described are partially combined.

[0164] According to an embodiment, the process for forming the housing 201 can be performed by the following steps: aligning the portions of two metal substrates to be joined, joining a portion of one metal substrate to another metal substrate by a joining process (e.g., welding or melting), and then performing an injection molding process on the joined portions.

[0165] In the following text, prior to the final product, such as prior to joining processes (e.g., welding, laser processing, or heating processes) or prior to computer numerical control (CNC) machining, the first metal component may be referred to as the first metal substrate 310a, and the second metal component may be referred to as the second metal substrate 320a. The joining portion 325 (e.g., the support portion 321 and the protrusion 323) of the first metal component may be referred to in the same manner. The opening 315 of the second metal component may be referred to in the same manner.

[0166] First, a process for preparing two metal substrates (e.g., a first metal substrate 310a and a second metal substrate 320a) can be performed. According to an embodiment, the first metal substrate 310a and the second metal substrate 320a can be formed using a single material or dissimilar materials.

[0167] The first metal substrate 310a prepared may undergo processing techniques (e.g., Figure 7 Process 10) is used to bond the first metal substrate 310a to the second metal substrate 320a. The first metal substrate 310a can be processed by computer numerical control (CNC) technology. In the CNC process, a portion of the first metal substrate 310a can be processed to form an opening 315 for bonding with the second metal substrate 320a.

[0168] According to an embodiment, the opening 315 of the first metal substrate 310a may have a shape in which at least a portion of the space of the opening extends in the -P direction. For example, the -P direction may be the upward direction (e.g., display direction) or the downward direction (e.g., back panel direction) of the electronic device 101. For example, the -P direction may be the direction facing the protrusion 323 protruding from the support portion 321 of the second metal substrate 320a (e.g., the -P direction). For example, the -P direction may be the direction opposite to a surface of the support portion 321 of the second metal component 320 on which a process of applying heat (e.g., a welding process) is performed (e.g., the +P direction). According to an embodiment, the opening 315 of the first metal substrate 310a (or the first metal component 310) may have a channel shape with a consistent diameter (or area).

[0169] The prepared second metal substrate 320a may undergo processing techniques (e.g., Figure 7 Process 20) in the process of bonding to the opening of the first metal substrate 310a (e.g., Figure 10 or Figure 11 The opening 315 in the middle and its surrounding area.

[0170] According to an embodiment, the second metal substrate 320a may be at least partially surrounded by the first metal substrate 310a, and may include a joining portion 325 for engaging with the opening 315 of the first metal substrate 310a. The joining portion 325 of the second metal substrate 320a may include a support portion 321 adjacent to the edge of the upper space of the opening 315 of the first metal substrate 310a, a protrusion 323 extending from the support portion 321, and a hook portion 327 extending from the protrusion 323 and adjacent to the edge of the lower space of the opening 315.

[0171] Subsequently, an alignment process (e.g., process 30) for bonding the first metal substrate 310a and the second metal substrate 320a and a bonding process (e.g., process 40) for bonding the first metal substrate 310a and the second metal substrate 320a can be performed.

[0172] According to an embodiment, the support portion 321 of the second metal substrate 320a may be configured to contact the upper surface of the first metal substrate 310a (e.g., the surface facing the +P direction) and may face the upper space of the opening 315 (e.g., the space facing the +P direction). The protrusion 323 of the second metal substrate 320a may be formed to protrude from the support portion 321 along the -P direction and may be inserted into the opening 315 and bonded to a portion of the inner surface of the first metal substrate 310a. The protrusion 323 of the second metal substrate 320a may be columnar and may be formed by a bonding process (e.g., welding, laser, or heating) to contact the inner surface of the opening 315 while being inserted into a portion of the opening 315.

[0173] According to an embodiment, the protrusion 323 of the second metal substrate 320a may be columnar and may be formed by a bonding process (e.g., a melting process) such that while the protrusion 323 is inserted to extend through the opening 315, the upper portion of the protrusion 323 contacts the inner surface of the opening 315. At least a portion of the hook 327 of the second metal member 320 is configured to contact the lower surface of the first metal member 310 (e.g., the surface facing the -P direction) and may face the upper space of the opening 315 (e.g., the space facing the +P direction). The hook 327 of the second metal member 320 may protrude partially along a direction perpendicular to the +P direction together with the protrusion 323, thereby preventing the second metal member 320 from disengaging from the opening 315.

[0174] Reference Figure 12b In the alignment process used to bond the first metal substrate 310a and the second metal substrate 320a (e.g., Figure 7 During process 30), the protrusion 323 and hook 327 of the second metal substrate 320a can be inserted into the opening 315 of the first metal substrate 310a to extend through the opening 315. Therefore, in the aligned state of the first metal substrate 310a and the second metal substrate 320a, the protrusion 323 of the second metal substrate 320a can be located inside the opening 315 of the first metal substrate 310a, simultaneously forming a gap space, and the support portion 321 of the second metal substrate 320a can be disposed around the upper space of the opening 315 of the first metal substrate 310a. The hook 327 of the second metal substrate 320a can be disposed around the lower space of the opening 315 of the first metal substrate 310a.

[0175] Reference Figure 12c In the bonding process used to bond the first metal substrate 310a and the second metal substrate 320a (e.g., Figure 7In process 40), a joining process (e.g., laser process or welding process) can be performed on the portion of the second metal substrate 320a aligned with the first metal substrate 310a. Before the joining process, the size of the protrusion 323 of the second metal substrate 320a may be smaller than the internal space of the opening 315 of the first metal substrate 310a, so it may not be in an assembled and joined state. When heat is applied to the upper surface (e.g., the surface facing the +P direction) of the support portion 321 of the second metal substrate 320a (e.g., joining process), heat can be transferred to the support portion 321 and a portion of the protrusion 323 protruding from the lower surface (e.g., the surface facing the -P direction) of the support portion 321. The portion of the protrusion 323 that melts due to the transferred heat can be deformed into a shape corresponding to the shape of the opening 315. For example, the upper portion of the protrusion 323 may expand when assembled in and joined to the opening 315, while the lower portion of the protrusion 323 that remains unmelted may be smaller than the internal space of the opening 315, so it may not be in an assembled and joined state. After the joining process (e.g., laser process, welding process or heating process) is completed, the shape of the protrusion 323 corresponding to the opening 315 can be an undercut shape.

[0176] According to an embodiment, the bonding process can be performed when the second metal substrate 320a has moved a predetermined distance in a direction perpendicular to the +P / -P direction. Therefore, when viewed from below the first metal substrate 310a (e.g., when viewed along the +P direction), the hook portion 327 of the second metal substrate 320a may have a portion formed to overlap with the first metal substrate 310a, thereby limiting or reducing the separation of the bonding portion 325 of the second metal substrate 320a from the first metal substrate 310a.

[0177] According to an embodiment, through a bonding process, the opening 315 of the first metal substrate 310a, its surrounding area, and the bonding portion 325 of the second metal substrate 320a may include a molten portion 401 (see...). Figure 6 ) and non-melting part 402 (see Figure 6 The non-melting portion can be identified as the part of the substrate that is melted and assembled and joined. The molten portion can provide chemical bonding between the first metal substrate 310a and the second metal substrate 320a, while the non-melting portion can provide physical bonding between the first metal substrate 310a and the second metal substrate 320a.

[0178] In a structure used to join two metal parts to form a housing for an electronic device, a protrusion of one metal part (e.g., an inner metal part) may be inserted to extend through an opening in another metal part (e.g., an outer metal part), and then joined by welding the area protruding from the opening. In this case, the end of the heated protruding area may deform into a dome shape. However, since heat is not transferred to the area of ​​the inner metal part inserted into the opening, a space may form within the joined structure between the outer and inner metal parts. When the contact area between the outer and inner metal parts is insufficient, warping and poor bonding between the outer and inner metal parts may occur due to the injection pressure generated during the subsequent injection molding process.

[0179] Furthermore, in the housing forming process, when the contact area between the outer metal part and the inner metal part is insufficient, the voltage may not be able to be fully transmitted from the inner metal part to the outer metal part during the surface treatment process, resulting in uneven coloring during surface treatment (e.g., anodizing).

[0180] Furthermore, during the housing formation process, warping of certain metal components within the housing can adversely affect antenna performance (e.g., VSWR performance).

[0181] According to the various embodiments disclosed herein, when forming a housing for an electronic device, a stable connection between the outer metal component and the inner metal component can be provided by changing the shape of the opening in the outer metal component and controlling the joining direction of the inner metal component inserted into the opening and / or the direction of the joining process.

[0182] In the electronic devices according to various embodiments, the bonding between the outer metal component and the inner metal component of the housing may include chemical bonding through molten portions and physical bonding through non-molten portions. A stable bonding between the outer and inner metal components reduces color uniformity caused by surface treatment and provides a structure beneficial to antenna performance.

[0183] The housing of the electronic device according to various embodiments can provide a robust bond between an outer metal component and an inner metal component. For example, an outer metal structure having an opening (e.g., an undercut opening) extending therein can be assembled with an opening adjacent to the outer metal structure or with an inner metal structure inserted into that opening. After assembly, the inner metal component can undergo a joining process (e.g., welding, laser processing, or heating process), whereby a portion of the inner metal component melts and another portion of the inner metal component melts and is securely bonded to the opening of the outer metal component and the area surrounding the opening.

[0184] In the housing forming process for an electronic device according to various embodiments, after the protrusion of the inner metal component is inserted into the opening of the outer metal component and assembled, a joining process (e.g., welding or laser process) can be performed. During the joining process, the inserted protrusion can be fully fitted into and joined to the opening by applying heat to the portion opposite to the end of the protrusion, thereby providing a strong connection with the outer metal component. Subsequently, in the machining process, the area of ​​the outer metal component within the housing can be increased because the machining area of ​​the outer metal component is reduced, thereby enhancing the rigidity of the housing.

[0185] The effects that can be obtained from this disclosure are not limited to those described above, and other effects not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains from the following description.

[0186] Electronic devices according to embodiments of the present disclosure (e.g., Figure 1 The electronic device 101 in FIG4 may include a display 230 and a housing 201 therein, wherein the display is disposed. The housing 201 may include a first metal component 310 at least partially exposed outside the electronic device, a second metal component 320 surrounded by the first metal component, and a molded portion 330. The first metal component may include an opening 315 formed through a portion of the first metal component, and the opening may be formed to have a space extending in a first direction. The second metal component 320 may include a joint portion 321 or 323 for engaging with the opening of the first metal component, and a portion of the joint portion may form a molten portion. The molded portion 330 may cover at least a portion of the joint portion and the opening.

[0187] According to an embodiment, the portion of the joint of the second metal component 320 adjacent to the opening of the first metal component 310 may form a molten portion.

[0188] According to an embodiment, the portion of the joint of the second metal component 320 that is inserted into the opening of the first metal component 310 can form a non-meltable portion.

[0189] According to an embodiment, a first metal component 310 forming a region of an upper space surrounding an opening and facing a second direction opposite to the first direction may be formed into a molten portion.

[0190] According to an embodiment, a portion of the inner surface of the first metal component 310 forming the opening may be formed into a non-melting portion.

[0191] According to an embodiment, the joint of the second metal component 320 may include a support portion 321 configured to be adjacent to the edge of the opening of the first metal component 310 and a protrusion 323 extending from the support portion and inserted into the opening.

[0192] According to an embodiment, the support portion of the second metal component is configured such that the portion in contact with the first metal component and the portion of the protrusion adjacent to the support portion can form a molten portion.

[0193] According to an embodiment, the first direction along which the diameter of the opening expands may be the same as the direction facing the protrusion protruding from the support portion of the second metal component.

[0194] According to an embodiment, the diameter of the opening in the first metal component can gradually expand in a first direction.

[0195] According to an embodiment, the protrusion of the second metal component may be formed to correspond to the shape of the opening, thereby engaging with the opening.

[0196] According to an embodiment, the height of the opening of the first metal component may be greater than the height of the protrusion of the second metal component.

[0197] According to an embodiment, in the opening of the first metal component, the diameter of the lower space facing the direction opposite to the support portion of the second metal component can be larger than the diameter of the upper space facing the support portion of the second metal component.

[0198] According to an embodiment, the inner surface of the first metal component forming the opening may have a specified inclination relative to a surface of the first metal component facing the support portion.

[0199] According to an embodiment, the adjacent edges of the support portion of the second metal component and the opening of the first metal component, which are melted together with the support portion, can provide a chemical bond.

[0200] According to an embodiment, the protrusion of the second metal component inserted into the opening of the first metal component can provide a physical connection by being fitted into and engaged with the opening.

[0201] According to an embodiment, the molding portion 330 may include: a first molding portion 331 disposed on the upper surface of the support portion of the second metal component facing the direction opposite to the first direction and around the first metal component adjacent to the upper surface; and a second molding portion 332 disposed on the end of the protrusion of the second metal component facing the first direction and around the first metal component adjacent to the end.

[0202] According to an embodiment, the inner surface of the first metal component forming the opening may include grooves or spiral grooves formed at specified intervals.

[0203] According to an embodiment, the opening of the first metal component may be open at its upper part and closed at its lower part to allow a portion of the second metal component to be inserted.

[0204] According to an embodiment, the joining portion of the second metal component may further include a hook portion 327 extending from the protrusion and adjacent to the edge of the lower space of the opening of the first metal component.

[0205] According to an embodiment, when viewed from below the first metal component, a portion of the hook portion of the second metal substrate may overlap with the first metal component.

[0206] Electronic devices according to embodiments of the present disclosure (e.g., Figure 1 The housing of the electronic device 101 in FIG4 may include a first metal component 310 at least partially exposed to the outside of the electronic device, and a second metal component 320 surrounded by the first metal component. The first metal component may include an opening 315 formed through a portion of the first metal component and formed to have a space extending in a first direction. The second metal component may include a joint portion 325 for engaging with the opening of the first metal component, and a portion of the joint portion may form a molten portion.

[0207] According to an embodiment, the joining portion 325 of the second metal component may include a support portion 321 configured to be adjacent to the edge of the opening of the first metal component 310 and a protrusion 323 extending from the support portion and inserted into the opening.

[0208] According to the embodiment, the portion of the joint 325 of the second metal component adjacent to the opening of the first metal component 310 can form a molten portion, and the portion of the joint 325 of the second metal component inserted into the opening of the first metal component 310 can form a non-molten portion.

[0209] A method for manufacturing a housing for an electronic device according to embodiments of the present disclosure may include: a process for processing a first metal substrate, the first metal substrate including an opening formed having a space extending in a first direction; a process for processing a second metal substrate, the second metal substrate including a joining portion joined to the opening of the first metal substrate; an alignment process for joining the first metal substrate and the second metal substrate, wherein a support portion of the joining portion is configured to contact an edge of the opening of the first metal substrate, and a protrusion extending from the support portion is configured to be inserted into the opening of the first metal substrate; a bonding process for applying heat to the aligned surface of the support portion of the second metal substrate with respect to the first metal substrate, the surface of the support portion facing a second direction opposite to the first direction; and an injection molding process for forming a molded substrate portion in a region adjacent to the first metal substrate and the second metal substrate.

[0210] According to an embodiment, after the bonding process, a molten portion can be formed in the region of the upper space surrounding the opening and facing a second direction opposite to the first direction, and a non-molten portion can be formed in a portion of the inner surface of the first metal substrate forming the opening.

Claims

1. An electronic device (101) comprising a housing (201). in, The housing (201) includes: A first metal component (310) is at least partially exposed to the outside of the electronic device and includes an opening (315) formed through a portion of the first metal component, wherein the opening is formed to extend space toward a first direction; The second metal component (320) is surrounded by the first metal component and includes a joining portion (321, 323) for joining to the opening of the first metal component, wherein a portion of the joining portion is formed as a molten portion.

2. The electronic device according to claim 1, in, The portion of the joint of the second metal component (320) adjacent to the opening of the first metal component (310) is formed as a molten portion, and The portion of the second metal component (320) inserted into the opening of the first metal component (310) is formed as a non-meltable portion.

3. The electronic device according to claim 1 or 2, in, The first metal component (310) forming the periphery of the upper space surrounding the opening, facing a second direction opposite to the first direction, is formed as a molten portion, and In this case, a portion of the opening formed on the inner surface of the first metal component (310) is formed as a non-melting portion.

4. The electronic device according to any one of claims 1 to 3, in, The joining portion of the second metal component (320) includes: a support portion (321) configured to be adjacent to the edge of the opening of the first metal component (310); and a protrusion (323) extending from the support portion and inserted into the opening.

5. The electronic device according to claim 4, in, The support portion of the second metal component is configured such that the portion in contact with the first metal component and the portion of the protrusion adjacent to the support portion form a melting portion.

6. The electronic device according to any one of claims 4 or 5, in, The first direction along which the diameter of the opening expands is the same as the direction in which the protrusion protruding from the support portion of the second metal component points.

7. The electronic device according to any one of claims 4 to 5, in, The diameter of the opening in the first metal component gradually expands along the first direction, and The protrusion of the second metal component is formed to correspond to the shape of the opening and is attached to the opening.

8. The electronic device according to any one of claims 4 to 6, in, The height of the opening in the first metal component is greater than the height of the protrusion in the second metal component.

9. The electronic device according to any one of claims 4 to 6, in, In the opening of the first metal component, the diameter of the lower space facing the direction opposite to the support portion of the second metal component is larger than the diameter of the upper space facing the support portion of the second metal component.

10. The electronic device according to any one of claims 4 to 6, in, The inner surface of the first metal component forming the opening has a specified inclination relative to the surface of the first metal component facing the support.

11. The electronic device according to any one of claims 4 to 10, in, The adjacent edges of the support portion of the second metal component and the opening of the first metal component, which melt together with the support portion, provide chemical bonding, and The protrusion of the second metal component, which is inserted into the opening of the first metal component, is fitted into the opening to provide a physical engagement.

12. The electronic device according to any one of claims 4 to 10, further comprising a molded portion 330 covering at least a portion of the joint and the opening. in, The molded portion (330) includes: A first molded portion (331) is disposed on the upper surface of the support portion of the second metal component facing the opposite direction to the first direction and around the first metal component adjacent to the upper surface; and The second molding portion (332) is configured around the end of the protrusion of the second metal member facing the first direction and around the first metal member adjacent to the end.

13. The electronic device according to any one of claims 4 to 10, in, The inner surface of the first metal component forming the opening includes grooves or spiral grooves formed at specified intervals.

14. The electronic device according to claim 13, in, The opening in the first metal component is configured such that it is open at the top and closed at the bottom, so as to allow a portion of the second metal component to be inserted into the opening.

15. The electronic device according to any one of claims 4 to 10, in, The second metal component's joining portion further includes a hook (327) extending from the protrusion and adjacent to the edge of the lower space of the opening of the first metal component, and When viewed from below the first metal component, a portion of the hook portion of the second metal substrate overlaps with the first metal component.

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