Heat dissipation device of electronic equipment

Abstract

The present invention relates to a heat dissipation device of an electronic device, the heat dissipation device comprising: a heat dissipation case having an inner space with a front opening; a plurality of types of heating elements arranged in a plurality of regions in the vertical direction on the inner side surface corresponding to the inner space of the heat dissipation case; and a plurality of heat sink fins which are arranged on the back surface portion of the heat sink housing so as to be elongated in the vertical direction, are detachably coupled to each other so as to be spaced apart from each other by a predetermined distance in the horizontal direction, and are arranged so as to be discontinuous in the vertical direction in the vicinity of the boundaries of the plurality of regions. Therefore, the heat dissipation performance is greatly improved.

Description

Technical Field

[0001] This invention relates to a heat dissipation apparatus for electronic devices, and more specifically, to a heat dissipation apparatus for electronic devices capable of responding to multiple heat-generating elements with different heat generation and heat generation locations and having higher heat dissipation performance. Background Technology

[0002] In various industries such as communications, electronics, and electrical engineering, related technologies are constantly being developed to adapt to more advanced industries. This advanced technological development requires high-power energy, and equipment using high-power energy inevitably faces the problem of high heat generation. Therefore, it is necessary to develop cooling systems suitable for this level of technology.

[0003] Cooling systems are used in a variety of industries, such as air conditioners, mobile communications, data centers, aviation, electric vehicles, energy storage devices, and displays. These cooling systems are a major contributor to electricity consumption, which is gradually increasing with industrial development.

[0004] Generally, heat dissipation devices are broadly classified into active cooling devices and passive cooling devices. Active cooling devices mainly utilize forced convection generated by fans, while passive cooling devices can be categorized as those that utilize natural convection without fans.

[0005] However, existing heat dissipation systems have limitations in effectively dissipating the high heat generated by continuously evolving advanced technologies. Therefore, innovative technologies capable of addressing these issues are needed in related industries, and heat dissipation mechanisms utilizing phase change materials are being developed as one component in this effort.

[0006] In addition, electronic devices are equipped with a variety of heat-generating components that perform electrical operations but generate different amounts of heat. Depending on the purpose and usage of the electronic device, there may be situations where multiple heat-generating components can only dissipate heat through any one surface.

[0007] In order to dissipate heat smoothly from the internal space of the electronic device to the outside (outside air), a heat dissipation housing made of thermally conductive material can be provided to cover any of the surfaces for heat dissipation, and multiple heat sink fins are provided on the outer surface of the heat dissipation housing in an integral or detachable manner to increase the heat exchange area with the outside air.

[0008] However, if multiple heat-generating elements and their arrangement are not considered, and multiple heat sink fins are arranged vertically and slenderly on the outer surface of the heat sink housing with the same specifications and the same spacing to prevent interference from the rising airflow, then the heat inside the electronic device will be biased upwards due to the rising airflow, resulting in different heat dissipation requirements in the vertical direction. Therefore, it is difficult to achieve uniform heat dissipation.

[0009] Furthermore, even if each individual heat sink fin that makes up multiple heat sink fins is long enough to span the entire vertical direction of the outer surface of the heat sink housing, the heat transferred from the lower side of the electronic device to the upper side may affect the heating elements mounted on it that are susceptible to high temperatures, potentially leading to a reduction in the performance of certain heat-generating elements.

[0010] As an example, when the substance used as the heat transfer medium is a phase-change refrigerant, unlike the case where the thermal conductivity depends on the metal material itself, the high temperature of the condensation heat generated when the gaseous refrigerant condenses into the liquid refrigerant may reduce the function of heat-sensitive heating elements due to its excellent heat dissipation performance. Summary of the Invention

[0011] Technical issues The present invention is proposed to solve the above-mentioned technical problems. Its purpose is to provide a heat dissipation device for electronic devices that divides specific heat dissipation areas according to the upper and lower positions of the back of the heat dissipation housing, thereby installing multiple heat sink fins on the back of the heat dissipation housing so that the internal heat is dissipated with uniform heat dissipation performance as a whole.

[0012] Furthermore, another object of the present invention is to provide a heat dissipation device for electronic devices that can prevent the reverse conduction of heat inside the heat sink housing when the heat dissipation performance of multiple heat sink fins is significantly improved.

[0013] Furthermore, another object of the present invention is to provide a heat dissipation device for an electronic device that can rapidly dissipate heat in the left-right horizontal direction relative to a portion of the high-heat-generating heat-generating element.

[0014] Furthermore, another object of the present invention is to provide a heat dissipation device for electronic devices that utilizes not only the heat conduction of the inherent material of the heat sink fins but also the phase change of the refrigerant, depending on the arrangement of the multiple heat sink fins.

[0015] Furthermore, another object of the present invention is to provide a heat dissipation device for electronic devices that, in the case of multiple heat sink fins utilizing the phase change of refrigerant, designs heat dissipation areas separately in the vertical direction to minimize the functional degradation of heat-generating elements caused by condensation heat.

[0016] The technical problems of this invention are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0017] Technical solution A heat dissipation device for an electronic device according to an embodiment of the present invention includes: a heat dissipation housing having an internal space with a front opening; multiple heat-generating elements arranged in multiple regions in the vertical direction on the inner side surface corresponding to the internal space of the heat dissipation housing; and multiple heat sink fins arranged elongatedly in the vertical direction on the back side of the heat dissipation housing and disassembled and assembled at predetermined distances in the horizontal direction, wherein the multiple heat sink fins are arranged discontinuously in the vertical direction near the boundaries of the multiple regions.

[0018] The plurality of radiator fins can be arranged separately, such that heat transfer is blocked in the vertical direction relative to the back of the heat sink housing.

[0019] Furthermore, when the plurality of radiator fins are divided into an upper region located on the upper side, a middle region located in the middle, and a lower region located on the lower side of the back side of the heat dissipation housing, they are arranged on the back side of the heat dissipation housing in such a way that after independently receiving heat from the heat-generating element located in each region, heat is dissipated through an independent heat transfer path.

[0020] Furthermore, when the plurality of regions can be divided into an upper region located on the upper side of the back surface of the heat dissipation housing, a middle region located in the middle, and a lower region located on the lower side, the plurality of heat sink fins may include: an upper heat sink fin, attached to the upper region, to dissipate heat from the upper heat sink located in the upper region among the plurality of heat sinks; a middle heat sink fin, attached to the middle region, to dissipate heat from the middle heat sink located in the middle region among the plurality of heat sinks; and a lower heat sink fin, attached to the lower region, to dissipate heat from the lower heat sink located in the lower region among the plurality of heat sinks.

[0021] Furthermore, the upper radiator fins, the middle radiator fins, and the lower radiator fins can be arranged on a vertical line that is a straight line in the vertical direction.

[0022] Furthermore, the upper radiator fins and the middle radiator fins have a first thermal conductivity, and the lower radiator fins have a second thermal conductivity that is relatively lower than the first thermal conductivity. The upper heating element and the middle heating element located in the upper region and the middle region can dissipate heat at a higher temperature than the lower heating element located in the lower region.

[0023] Furthermore, the upper radiator fins and the middle radiator fins are filled with a phase-change refrigerant, and the refrigerant can have the first thermal conductivity through the flow generated by the phase change of the refrigerant.

[0024] Furthermore, the lower heat sink fins can have the second thermal conductivity due to the thermal conductivity of the material itself.

[0025] Furthermore, the upper radiator fins may be integrally formed with an extended heat dissipation plate portion, such that a portion of its upper end extends forward beyond the back of the heat dissipation housing and at least covers a portion of the upper surface of the heat dissipation housing.

[0026] Furthermore, the extended heat sink portion can be configured such that the refrigerant flow space is expanded within the refrigerant-filled interior of the upper heat sink fins.

[0027] In addition, in the intermediate region, besides the intermediate heating element, a high heating element with a heat output greater than that of the intermediate heating element is also provided. The intermediate region can be divided into an upper intermediate region including the part where the high heating element is provided and a lower intermediate region including the part where the high heating element is not provided.

[0028] Furthermore, multiple heat pipes for dispersing the heat generated by the high-heat-generating element to the left and right horizontal directions of the heat dissipation housing may be arranged on the inner side of the internal space of the heat dissipation housing corresponding to the upper middle region.

[0029] Furthermore, the back side of the heat sink housing may be further provided with a pressing portion for setting the plurality of heat sink fins. When the pressing portion may include an upper pressing portion that combines the upper heat sink fins, a middle pressing portion that combines the middle heat sink fins, and a lower pressing portion that combines the lower heat sink fins, the back side of the middle pressing portion formed in the heat sink housing is formed to be separated by having a stepped surface.

[0030] Furthermore, the front end of the intermediate radiator fin located in the upper middle region can be formed to be recessed in a stepped manner further rearward than the front end of the intermediate radiator fin located in the lower middle region.

[0031] In addition, the upper radiator fins and the middle radiator fins may include: a heat-conducting plate body having a refrigerant flow space, the refrigerant flow space providing space for gas-liquid circulation, so that the refrigerant can undergo a phase change and release heat in the enclosed space filled with refrigerant.

[0032] Furthermore, the refrigerant flow space may include: a first refrigerant flow path, which is an evaporation region at one end in the width direction, supplying heat from the upper heating element and the middle heating element, which are heat dissipation objects, to the heat-conducting plate body; and a second refrigerant flow path, which is formed in a plurality of condensation regions other than the first refrigerant flow path, from the other end in the width direction of the heat-conducting plate body, allowing the liquid refrigerant that has condensed from a gaseous state to a liquid state in the refrigerant to act as a flow path on the side of the first refrigerant flow path by surface tension or gravity.

[0033] In addition, the heat-conducting plate body of the upper heat sink fins and the middle heat sink fins can be equipped with a plate of SUS material, and the lower heat sink fins can be equipped with a plate of aluminum material with a higher thermal conductivity than the heat-conducting plate body.

[0034] Furthermore, the heat-conducting plate body of the upper radiator fins and the middle radiator fins can be configured as a plate of SUS material that forms the refrigerant flow space inside, and the lower radiator fins can be configured as a plate of SUS material that does not have the refrigerant flow space.

[0035] Invention Effects The heat dissipation device for an electronic device according to the present invention has the effect of significantly improving heat dissipation performance by preventing heat imbalance caused by multiple heat-generating elements inside the heat dissipation shell that is elongated in the vertical direction and achieving heat dissipation with uniform heat dissipation performance as a whole.

[0036] Furthermore, the heat dissipation device of the electronic device according to the present invention protects the internal heat-generating element that is susceptible to high temperatures by preventing the reverse conduction of heat that may be generated due to the high heat dissipation performance of multiple heat sink fins, thereby improving the reliability of the product. Attached Figure Description

[0037] Figure 1 This is a perspective view showing the front and rear portions of a heat dissipation device for an electronic device according to an embodiment of the present invention.

[0038] Figure 2a and Figure 2b yes Figure 1 The front and rear partial solution diagrams of the solid.

[0039] Figure 3 It is used for explanation Figure 1 A partially exploded perspective view of the rear part of the structure showing the connection relationship between multiple heat sink fins.

[0040] Figure 4 It is shown Figure 1 The three-dimensional view (a, b, c) of multiple heat sink fins in the structure and the sectional view (d, e) taken along lines AA and BB.

[0041] Figure 5 It is shown Figure 1 A three-dimensional projection of the upper radiator fin among multiple radiator fins.

[0042] Figure 6 yes Figure 5 An exploded 3D diagram.

[0043] Figure 7 yes Figure 5 Partial sectional perspective view (a), enlarged view (b), and sectional view (c).

[0044] Figure 8 It is used to explain the basis Figure 1 An exploded perspective view of the type of heating element in the structure and the functional relationship of multiple heat sink fins at the mounting positions.

[0045] Figure 9 yes Figure 8 Rear view (a) and side view (b).

[0046] Figure 10a and Figure 10b It is used to illustrate that in order to Figure 1 A partial cross-sectional perspective view of the connection relationship between the heat pipes that disperse heat in the horizontal direction inside the heat dissipation shell of the structure. Explanation of reference numerals in the attached figures 1: Antenna assembly; 10: Heat dissipation housing 20: Motherboard 21: Upper heating element 22C: High-temperature heating element; 22: Intermediate-temperature heating element 25: Flip cover; 30: PSU board 40: RF module 41: MBF component 42: Antenna element; 50: Antenna radome panel 60: Finger guard assembly 60h-1, 60h-2: Ventilation holes 70: External mounting components; 100: Multiple radiator fins 110: Upper radiator fins; 120: Middle radiator fins 130: Lower radiator fins Detailed Implementation

[0047] Hereinafter, a heat dissipation device for an electronic device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0048] It should be noted that when assigning reference numerals to the constituent elements of the various figures, the same reference numerals should be assigned to the same constituent elements as much as possible, even if they are shown in different figures. Furthermore, in describing embodiments of the present invention, detailed descriptions of related well-known structures or functions are omitted if it is determined that such detailed descriptions would impede understanding of the embodiments of the present invention.

[0049] In describing the constituent elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish one constituent element from other constituent elements, and the nature, order, or sequence of the corresponding constituent elements are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms identical to those defined in commonly used dictionaries should be interpreted as having the same meaning as in the context of the related art, and should not be construed as having an ideal or overly formal meaning unless explicitly defined in this application.

[0050] Figure 1 This is a perspective view showing the front and rear portions of a heat dissipation device for an electronic device according to an embodiment of the present invention. Figure 2a and Figure 2b yes Figure 1 The front and rear partial solution diagrams of the solid.

[0051] Typically, heat-generating devices (electronic devices) are manufactured in various forms throughout the industry, but the applicant of this invention is a company engaged in the manufacturing of other wireless communication devices. Hereinafter, when describing a heat dissipation device for an electronic device according to an embodiment of the present invention, the antenna device 1, which is a representative heat-generating device (electronic device) that is the object of heat dissipation of the heat dissipation device, will be described as a specific example.

[0052] However, the electronic device of the heat dissipation device of an embodiment of the present invention described below is not limited to the antenna device 1. It should be noted that the specific terms “antenna device 1” and “related components thereto” used below should be interpreted to include the concept of all similar electronic devices and their components.

[0053] First, the antenna device 1, which is used as an example of a representative electronic device, will be described as follows.

[0054] like Figures 1 to 2bAs shown, an antenna device 1 adapted to a heat dissipation device according to an embodiment of the present invention includes: a heat dissipation housing 10, forming an internal space 10S with a forward opening, and being formed into a cuboid shape having a generally elongated and thinner front and rear receiving width along the vertical direction.

[0055] The heat dissipation housing 10 provides a place (internal space 10S) for the various internal structures described later and is made of a robust material to protect the internal structures from external impacts. In particular, the internal structures are preferably made of a metal material with excellent thermal conductivity so that the heat generated during system operation can be dissipated to the outside by utilizing the thermal conductivity properties of the material itself.

[0056] Inside the internal space 10S of the heat sink housing 10, an RF module 40, which is a digital transceiver unit (DTU) substrate, is arranged on the front surface by a clamshell 25, consisting of a combination of multiple micro bellows filter (MBF) elements 41 and antenna elements 42, and a motherboard 20 with a heat-generating element mounted on the back can be stacked.

[0057] The motherboard 20 can be equipped with heat-generating components, such as radio frequency integrated circuits (RFICs), radio frequency power amplifiers (PAs), and field-programmable gate arrays (FPGAs), which generate significant heat during operation (see below). Figure 8 The components are indicated by reference numerals 21, 22, and 22C in the accompanying drawings.

[0058] However, it should be noted that in the embodiments of the present invention, only electronic devices are used as antenna devices 1 for description, and the heating elements 21, 22, and 22C are not limited to the described structure. For example, semiconductors can also be used as representative heating elements for the heating elements 21, 22, and 22C.

[0059] Furthermore, in the lower part of the internal space 10S of the heat sink housing 10, the power supply unit board 30, which is equipped with electrical components related to the power amplifier unit (PAU), can be stacked to have the same layer as the motherboard 20.

[0060] However, the PSU board 30 does not need to be arranged on the same layer as the motherboard 20 in the internal space 10S of the heat sink housing 10. Considering the shape or rearward protrusion length of the mounting components on the back of the motherboard 20 and the back of the PSU board 30, they can also be arranged on different layers.

[0061] For reference, the following is stated (see Figure 8 The aforementioned motherboard 20 is stacked in the upper region I and the middle region II in the internal space 10S of the heat sink housing 10, and can generate heat with a relatively high amount of heat compared to the heat-generating element of the electrical component of the PSU board 30 arranged in the lower region III corresponding to its lower part.

[0062] In addition, the antenna cover panel 50 is disposed on the front surface of the internal space 10S of the heat dissipation housing 10, thereby protecting the radiating element composed of the antenna element 42 from external influences while enabling the radiating element to radiate smoothly.

[0063] Among them, the antenna cover panel 50 is formed of a material that is easily permeable to the radiation beam of the radiating element, and can be classified as a component that prevents the system operating heat generated in the internal space 10S of the heat dissipation housing 10 from being dissipated to the front side. Therefore, in order to increase the heat dissipation surface area for concentrated heat dissipation to the rear side of the heat dissipation housing 10, the heat dissipation housing 10 itself is also designed to be longer in the vertical direction.

[0064] A heat dissipation device according to an embodiment of the present invention can be provided on the back side of such a heat dissipation housing 10. The heat dissipation device according to an embodiment of the present invention may be equipped with a plurality of heat sink fins 100 protruding rearward from the back side of the heat dissipation housing 10 by a predetermined distance. A detailed description of the plurality of heat sink fins 100 will be given later.

[0065] In addition, such as Figure 2a and Figure 2b As shown, the heat dissipation device of an electronic device according to an embodiment of the present invention may further include: a finger guard assembly 60, configured to surround a portion of the rear side and upper side of the heat dissipation housing 10, thereby preventing external objects (or people) from approaching the plurality of heat sink fins 100.

[0066] The finger protection panel assembly 60 may include: a rear finger protection panel 61, configured vertically to cover the entire rear end of a plurality of heat sink fins 100; an upper surface finger protection panel 62, configured with its rear end attached to the upper end of the rear finger protection panel 61 and its front end extending horizontally forward; a right finger protection panel 63, with its front end attached to the right rear end of the heat sink housing 10 and its rear end attached to the right end of the rear finger protection panel 61, and arranged to cover the rear right side of the heat sink housing 10; a left finger protection panel 64, with its front end attached to the left rear end of the heat sink housing 10 and its rear end attached to the left end of the rear finger protection panel 61, and arranged to cover the rear left side of the heat sink housing 10; and an upper front surface finger protection panel 65, arranged to cover the area between the front end of the upper surface finger protection panel 62 and the front upper end of the heat sink housing 10.

[0067] The right-side finger protection panel 63 and the left-side finger protection panel 64 may include: upper side surface protection panels 63-1 and 64-1, which are set on the upper side based on the clamping bracket 5 described later; and lower side surface protection panels 63-2 and 64-2, which are set on the lower side based on the clamping bracket 5.

[0068] Therefore, the upper side surface protective panels 63-1 and 64-1 can be divided into the upper right side surface protective panel 63-1, which corresponds to the upper right finger protective panel 63 on the upper side, based on the clamping bracket 5, and the upper left side surface protective panel 64-1, which corresponds to the upper left finger protective panel 64 on the upper side, based on the clamping bracket 5. The lower side surface protective panels 63-2 and 64-2 can be divided into the lower right side surface protective panel 63-2, which corresponds to the lower right finger protective panel 63 on the lower side, based on the clamping bracket 5, and the lower left side surface protective panel 64-2, which corresponds to the lower left finger protective panel 64 on the lower side, based on the clamping bracket 5.

[0069] Additionally, the finger guard assembly 60 may also include: guard mounting rods 66, 67, 68, each edge having a predetermined screw fastening hole 69 for threaded engagement, while also reinforcing the rigidity of the edge.

[0070] Among them, the rear finger protection panel 61 to the front finger protection panel 65 can be made of plastic material to reduce the weight of the overall antenna device 1, and the protective mounting rods 66, 67, and 68 can be manufactured in the form of aluminum extrusion rods to enhance rigidity.

[0071] The protective mounting rods 66, 67, and 68 may further include: a front protective mounting rod 66, which is arranged between the upper surface finger protection panel 62 and the upper front surface finger protection panel 65 and provides multiple screw fastening holes 69; a rear protective mounting rod 67, which is arranged between the upper surface finger protection panel 62 and the rear finger protection panel 61 and provides multiple screw fastening holes 69; and a lower protective mounting rod 68, which is arranged at the lower end of the rear finger protection panel 61 and forms multiple screw fastening holes 69.

[0072] Furthermore, the finger guard assembly 60 should allow air from the external space (external air) to flow in for heat exchange with the multiple heat sink fins 100 provided inside it, thus forming multiple vent holes 60h-1, 60h-2 in a mesh (or grid) shape.

[0073] like Figures 1 to 2bAs shown, the finger guard assembly 60 having the structure described above can be arranged to surround all of the plurality of radiator fins 100 except for the lower ends of the plurality of radiator fins 100 which are attached to the back of the heat sink housing 10.

[0074] Additionally, clamping brackets 5 may be provided at the left and right ends of the heat dissipation housing 10 to mediate the installation of the support rod (not shown) to surround the outer surface of the rear finger protection panel 61 in the structure of the aforementioned finger protection plate assembly 60.

[0075] As described above, the clamping bracket 5 not only facilitates the installation of the support rod, but also functions as a handle that allows on-site personnel to grab and move the antenna device 1. Furthermore, handle holes 6 in the shape of holes can be formed at the left and right ends for easy gripping.

[0076] Additionally, thermal contact portions 11, 12, and 13 may be formed on the inner side of the internal space 10S of the heat sink housing 10 to match the shape of the heat-generating elements 21, 22, 22C or the back of the PSU board 30 that are mounted on the back of the motherboard 20.

[0077] The thermal contact portions 11, 12, and 13 may include: heating element contact portions 11 and 12, configured to protrude or recess in order to make surface thermal contact with the heating surfaces of the heating elements 21, 22, and 22C mounted on the back of the motherboard 20; and heat pipe contact portions 13, configured in a groove shape to allow the plurality of heat pipes 140 (see below) to be connected. Figure 8 Insert and set.

[0078] Additionally, an external mounting component 70 for electrical or signal connection to the motherboard 20 of the internal space 10S may be provided at the lower end of the heat sink housing 10. The external mounting component 70 can be understood as a component that performs the connection terminals for all connection lines in a typical electronic device, including power cables or wires for connecting and supplying power or signals.

[0079] Figure 3 It is used for explanation Figure 1 A partially exploded perspective view of the rear part showing the connection relationship between multiple heat sink fins in the structure. Figure 4 It is shown Figure 1 The three-dimensional view (a, b, c) of multiple heat sink fins in the structure and the sectional view (d, e) taken along lines AA and BB. Figure 5 It is shown Figure 1 A three-dimensional projection of the upper radiator fin among multiple radiator fins. Figure 6 yes Figure 5 Decomposed 3D diagram, Figure 7 yes Figure 5 Partial sectional perspective view (a), enlarged view (b), and sectional view (c). Figure 8 It is used to explain the basis Figure 1 An exploded perspective view showing the types of heating elements in the structure and the functional relationships of multiple heat sink fins at their mounting locations. Figure 9 yes Figure 8 Rear view (a) and side view (b). Figure 10a and Figure 10b It is used to illustrate that in order to Figure 1 A partial cross-sectional perspective view of the connection relationship between the heat pipes that disperse heat in the horizontal direction inside the heat dissipation shell of the structure.

[0080] like Figure 3 As shown, a heat dissipation device for an electronic device according to an embodiment of the present invention may include: a plurality of heat sink fins 100, and press-in portions 16, 17, and 18 formed on the back side of the heat sink housing 10.

[0081] The pressing parts 16, 17, and 18 may include: an upper pressing part 17 for connecting the upper heat sink fin 110 among the plurality of heat sink fins 100; a middle pressing part 16 for connecting the middle heat sink fin 120 among the plurality of heat sink fins 100; and a lower pressing part 18 for connecting the lower heat sink fin 130 among the plurality of heat sink fins 100.

[0082] As described above, the pressing portions 16, 17, and 18 are integrally formed on the back side of the heat sink housing 10 and can be configured as elongated slots in the vertical direction, so that a portion of the front end of the plurality of heat sink fins 100 can be inserted in a forced insertion manner.

[0083] However, the pressing portions 16, 17, and 18 can be recessed forward based on the back surface of the heat sink housing 10 to form the aforementioned elongated slots, or they can be formed to protrude rearward based on the back surface of the heat sink housing 10 so that a pair of slot ribs (not shown in the reference numerals) form the aforementioned elongated slots.

[0084] Among them, the middle pressing part 16 of the pressing parts 16, 17, and 18 can be divided into a middle lower pressing part 16a, which inserts and sets the lower end of the middle heat sink fin 120 of the plurality of heat sink fins 100 described later, and a middle upper pressing part 16b, which inserts and sets the upper end of the middle heat sink fin 120.

[0085] On the inner side of the internal space 10S of the heat dissipation housing 10, which has a middle upper side press-in portion 16b, the heat pipe contact portion 13, which is provided with a plurality of heat pipes 140 (described later), can be formed to protrude slightly rearward.

[0086] The depth of the slots forming the upper middle pressing portion 16b and the lower middle pressing portion 16a, or the protrusion length of the pair of slot ribs, are the same. On the back side of the heat sink housing 10, which serves as the basis for their formation, the portions forming the upper middle pressing portion 16b and the lower middle pressing portion 16a can be separated by having a stepped surface. This will be explained in more detail later.

[0087] In addition, such as Figures 1 to 3 As shown, in a heat dissipation device for an electronic device according to an embodiment of the present invention, a plurality of heat sink fins 100 may include an upper heat sink fin 110 and a middle heat sink fin 120 that actively dissipate heat generated from heat-generating bodies 21, 22, 22C to the outside by utilizing a phase change material, and a lower heat sink fin 130 that dissipates heat generated from heat-generating bodies 21, 22, 22C to the outside by means of heat conduction based on the inherent thermal conductivity of the material itself (rather than the phase change material).

[0088] Multiple heat sink fins 100 are arranged elongatedly in the vertical direction on the back side of the heat sink housing 10, and can be detachably assembled in the horizontal direction at predetermined intervals. In order to individually press and install multiple heat sink fins 100, multiple press-in portions 16, 17, 18 formed on the back side of the heat sink housing 10 are also arranged elongatedly in the vertical direction, and can be formed to be spaced at predetermined intervals in the horizontal direction.

[0089] At this time, multiple radiator fins 100 can be arranged discontinuously along the vertical direction near the boundaries of multiple regions I, II, and III.

[0090] The multiple radiator fins 100 are arranged discontinuously in the vertical direction, which means that the phase change flow range of the refrigerant filling the closed refrigerant flow spaces 111, 112 inside each of the multiple radiator fins 100 described later is separated into multiple regions in the vertical direction on the back side of the heat sink housing 10, or means that the heat transfer regions are physically separated.

[0091] More specifically, such as Figure 8 and Figure 9 As shown, the aforementioned regions I, II, and III are divided into an upper region I located on the upper side of the back of the heat sink 10, a middle region II located in the middle, and a lower region III located on the lower side.

[0092] In this configuration, the plurality of heat sink fins 100 may include: an upper heat sink fin 110, which is attached to the back side of the heat sink housing 10 corresponding to the upper region I, so that the upper heat sink 21 located in the upper region I among the plurality of heat sinks 21, 22, 22C can dissipate heat; an intermediate heat sink fin 120, which is attached to the back side of the heat sink housing 10 corresponding to the intermediate region II, so that the intermediate heat sinks 22, 22C located in the intermediate region II among the plurality of heat sinks 21, 22, 22C can dissipate heat; and an intermediate heat sink fin 120, which is attached to the back side of the heat sink housing 10 corresponding to the lower region III, so that the lower heat sink (not shown, for example, a PSU electrical component) located in the lower region III among the plurality of heat sinks 21, 22, 22C can dissipate heat.

[0093] As described above, the multiple radiator fins 100, which span three regions in the vertical direction and are arranged in different ways, can arrange the upper radiator fin 110, the middle radiator fin 120 and the lower radiator fin 130 on a vertical line that is a straight line in the vertical direction, so that the hot air generated by heat dissipation in the vertical direction will not be interfered with when forming an upward airflow and can be easily discharged to the upper side.

[0094] The plurality of heat sink fins 100 configured as described above can be press-fitted into the press-fit portions 16, 17, and 18 formed on the back side of the heat sink housing 10 by press-fitting.

[0095] At this time, although not shown, preferably, after the insertion parts 16, 17, and 18 are treated with thermal epoxy resin, the plurality of heat sink fins 100 are pressed in respectively to improve heat transfer efficiency.

[0096] The upper heat sink fin 110 and the middle heat sink fin 120 of the plurality of heat sink fins 100 may have a first thermal conductivity, and the lower heat sink fin 130 may be equipped with a second thermal conductivity that is relatively lower than the first thermal conductivity.

[0097] As described later, the upper radiator fins 110 and the middle radiator fins 120 are equipped with heat-conducting plate bodies made of SUS material (stainless steel), and SUS material is known to have a lower thermal conductivity than metals such as aluminum (Al). However, the upper radiator fins 110 and the middle radiator fins 120 can dissipate heat smoothly through the phase change of the refrigerant in the refrigerant flow spaces 111, 112 filled with refrigerant, thereby the upper radiator fins 110 and the middle radiator fins 120 have a higher thermal conductivity than the lower radiator fins 130.

[0098] Therefore, the upper heat sink fins 110 and the middle heat sink fins 120 are located in the upper region I and the middle region II, and can be used to dissipate heat relatively well for high-heat-generating components 21, 22, 22C, while the lower heat sink fins 130 are located in the lower region III and can be used to dissipate heat relatively well for low-heat-generating components (e.g., electrical components of the PSU board).

[0099] However, the positional definitions of the upper region I to the lower region III are merely limitations used to help understand the heat dissipation device of an electronic device according to an embodiment of the present invention, and it is not necessary to arrange high-heat-generating elements 21, 22, 22C in the upper region I and the middle region II and low-heat-generating elements in the lower region III; their arrangement positions can also be mixed.

[0100] The upper radiator fins 110 may be integrally formed with an extended heat sink portion 105, a portion of which extends forward beyond the press-in portion (e.g., upper press-in portion 17) relative to the back side of the heat sink housing 10, to cover at least a portion of the rear upper end of the heat sink housing 10.

[0101] The fact that the extended heat sink portion 105 is further integrally formed with respect to the upper heat sink fins 110 means that the phase change flow range of the refrigerant filling the internal refrigerant flow spaces 111, 112 is increased to a larger area.

[0102] That is, the extended heat sink portion 105 can be configured to expand the refrigerant flow spaces 111 and 112 that are filled with refrigerant inside the upper heat sink fins 110.

[0103] Therefore, it can be said that this is consistent with the increase in heat dissipation area resulting from heat exchange with the outside air through a single upper radiator fin 110.

[0104] Therefore, the extended heat dissipation plate portion 105 formed on the upper side of the upper heat sink fin 110 performs the function of guiding and conducting the heat transferred from the upper heat-generating body 21 in the upper region I to the external air space side on the upper side of the heat dissipation housing 10, and dissipating heat with higher heat dissipation performance.

[0105] In addition, in the intermediate region II, besides the intermediate heating element 22, a high-heat element 22C with a higher heat generation than the intermediate heating element 22 can also be provided. In one embodiment of the present invention, when the electronic device is used as the antenna device 1, the upper heating element 21 and the intermediate heating element 22 can be defined as RFIC elements or PA elements with high heat generation during their electrical operation, while the high-heat element 22C can be defined as an FPGA element.

[0106] In this case, the intermediate region II can be divided into the upper intermediate region II-U, which includes the part where the high-heat body 22C is located, and the lower intermediate region II-D, which does not include the high-heat body 22C but only includes the part where the intermediate heating body 22 is located.

[0107] In this process, multiple heat pipes 140 can be arranged on the inner side of the internal space 10S of the heat dissipation housing 10 corresponding to the upper middle region II-U for dispersing the heat generated by the high-heat-generating body 22C to the left and right horizontal directions of the heat dissipation housing 10.

[0108] In particular, the front end of the intermediate radiator fin 120 located in the upper middle region II-U may be recessed further rearward in a stepped manner than the front end of the intermediate radiator fin 120 located in the lower middle region II-D.

[0109] As described above, this is because the various parts of the back side of the heat dissipation housing 10 formed by the middle upper side press-in portion 16b and the middle lower side press-in portion 16a are formed to be distinguished by having a stepped surface. In order to ensure the installation space of the multiple heat pipes 140 arranged in the upper middle region II-U, the shape design is changed to accommodate the middle upper side press-in portion 16b, which is relatively more prominent on the rear side of the back side of the heat dissipation housing 10.

[0110] In addition, such as Figures 4 to 7 As shown, the upper radiator fin 110 and the middle radiator fin 120 of the plurality of radiator fins 100 include heat-conducting plate bodies 110A and 110B, which have refrigerant flow spaces 111 and 112 for gas-liquid circulation, so that the refrigerant can dissipate heat while undergoing phase change in the enclosed space filled with refrigerant.

[0111] However, apart from the difference in forming the extended heat dissipation plate portion 105 as described above, the upper radiator fins 110 and the middle radiator fins 120 both have refrigerant flow spaces 111 and 112 inside the heat conduction plate bodies 110A and 110B for refrigerant flow. Therefore, only the upper radiator fins 110 will be described below using the attached drawings, but their detailed functions and structures can be understood as being the same.

[0112] Although the heat-conducting plate bodies 110A and 110B are not shown, the heat-conducting plate bodies 110A and 110B, which are composed of a single metal plate component, can be processed in a predetermined bending manner and formed by sealing them by joining along their edge ends, thereby forming the aforementioned refrigerant flow spaces 111 and 112.

[0113] However, the method of forming the refrigerant flow spaces 111 and 112 is not limited to the processing method using the single metal plate component type and bending method described above, such as... Figures 4 to 7As shown, of course, the entire edge ends of the two metal plate components 110A and 110B can also be joined by a predetermined joining method, thereby forming refrigerant flow spaces 111 and 112 inside them.

[0114] Among them, such as Figures 4 to 7 As shown, the refrigerant flow spaces 111 and 112 may include: a first refrigerant flow path 111, which is formed elongated in the vertical direction corresponding to the evaporation region where liquid refrigerant is filled by heat transferred from the heating elements 21, 22, and 22C; and a second refrigerant flow path 112, which is the flow path of the liquid refrigerant, which is formed in the condensation region outside the evaporation region, with one end connected to the first refrigerant flow path 111 and the other end inclined in the rearward direction at a higher position than the aforementioned end in the direction of gravity, thereby guiding the liquid refrigerant condensed from the condensation region to flow towards the first refrigerant flow path 111.

[0115] The shape of the second refrigerant flow path 112 can actually be defined by a plurality of inclined guides 112a protruding toward the refrigerant flow spaces 111, 112, thereby preventing the condensed liquid refrigerant from falling directly along the direction of gravity, and guiding the inclined flow toward the first refrigerant flow path 111 by means of the surface tension property of the liquid.

[0116] In the heat-conducting plate bodies 110A and 110B corresponding to the condensation area, multiple strength-enhancing parts 113 can be symmetrically formed in a protruding manner into the refrigerant flow spaces 111 and 112, respectively.

[0117] When multiple strength-enhancing parts 113 are joined together by bending or joining the heat-conducting plate bodies 110A and 110B, the opposing parts are joined together in the refrigerant flow space 111 and 112 by various joining methods such as laser welding, thereby enhancing the overall strength of the heat-conducting plate bodies 110A and 110B.

[0118] In addition, the multiple strength-enhancing parts 113 can also achieve active condensation by providing more interference area in the condensation region for the gaseous refrigerant to collide and dissipate heat.

[0119] Furthermore, multiple strength-enhancing parts 113 are recessed on the outer surfaces of the planar heat-conducting plate bodies 110A and 110B toward the refrigerant flow spaces 111 and 112, thereby creating a larger contact area with the outside air to further perform the function of active heat exchange.

[0120] In addition, an absorber 116 may be provided in the evaporation region corresponding to the first refrigerant flow path 111 so that after absorbing the liquid refrigerant, the vaporization of the absorbed liquid refrigerant is actively carried out by the heat provided from the heating elements 21, 22, 22C.

[0121] The absorber 116 itself may be made of a fibrous material such as nonwoven fabric with multiple pores, and from the perspective of its arrangement in the first refrigerant flow path 111 which is elongated in the vertical direction, it is preferably made of a material that can at least overcome the gravity in the vertical direction at a predetermined height (i.e., in the opposite direction of gravity) and disperse and move the liquid refrigerant through capillary phenomenon (or its own absorption force).

[0122] However, similar to the upper radiator fins 110, if an extended heat sink portion 105 is also provided on the upper side, auxiliary absorbers 117 and 118 may be further provided in any part of the second refrigerant flow path 112 that forms a boundary with the extended heat sink portion 105.

[0123] The auxiliary absorbers 117 and 118 can be placed in the auxiliary absorber placement parts 114 and 115, which are modified to have a wider portion in the second refrigerant flow path 112.

[0124] The auxiliary absorbers 117 and 118 may include a first auxiliary absorber 117 disposed at the middle part of the upper radiator fins 110 and a second auxiliary absorber 118 disposed at the boundary part of the extended heat sink portion 105.

[0125] Furthermore, in order to separately provide the first auxiliary absorber 117 and the second auxiliary absorber 118, the auxiliary absorber setting parts 114 and 115 can also be respectively equipped in two positions.

[0126] In particular, the auxiliary absorbers 117 and 118 are configured to be inserted and joined during the mutual joining and molding of the heat-conducting plate bodies 110A and 110B, so as to prevent the auxiliary absorbers 117A and 118A on one side and the auxiliary absorbers 117B and 118B on the other side from flowing between the multiple fixed ribs 119.

[0127] In addition, although not shown, an isolation protrusion may be provided for stably fixing the absorber 116 arranged inside the first refrigerant flow path 111 which is formed elongated vertically. The aforementioned plurality of fixing ribs 119 are the same as the isolation protrusion for fixing the absorber 116, and all serve to stably fix the auxiliary absorbers 117 and 118.

[0128] This fixing rib 119 can be integrally formed during the molding of a pair of heat-conducting plate bodies 110A, 110B.

[0129] Preferably, the lower ends of the auxiliary absorbers 117 and 118 are connected to the absorber 116 in an interconnected manner. This is to allow the condensed refrigerant (liquid refrigerant) absorbed by the auxiliary absorbers 117 and 118 to easily and naturally permeate to the absorber 116 side (or the first refrigerant flow path 111 side) closest to the heat sources 21, 22, and 22C.

[0130] In addition, the heat-conducting plate bodies 110A and 110B of the upper heat sink fins 110 and the middle heat sink fins 120 can be made of SUS material (stainless steel), and the lower heat sink fins 130 can be made of aluminum (Al material) sheet material with a higher thermal conductivity than the heat-conducting plate bodies 110A and 110B of the upper heat sink fins 110 and the middle heat sink fins 120.

[0131] While the heat dissipation effect of the lower heat sink fin 130, made of aluminum, depends on the thermal conductivity of its material, it is expected to achieve higher heat dissipation performance compared to the upper heat sink fin 110 and the middle heat sink fin 120, which are based on the thermal conductivity of their materials. However, just like the upper heat sink fin 110 and the middle heat sink fin 120, from the viewpoint of having a significant improvement in heat dissipation performance when using a heat transfer method with phase change materials, the lower heat sink fin 130 can be used as a heat dissipation structure suitable for heat-generating elements (such as electrical components of the PSU) with slightly lower heat generation in the heat-generating element within the internal space 10S of the heat sink housing 10.

[0132] However, the lower radiator fins 130 are not necessarily made of a different metal material than the upper radiator fins 110 and the middle radiator fins 120. They can also be made of the same SUS material sheet as the upper radiator fins 110 and the middle radiator fins 120.

[0133] That is, the heat-conducting plate bodies 110A and 110B that constitute the upper heat sink fins 110 and the middle heat sink fins 120 are equipped with SUS material plates that form refrigerant flow spaces 111 and 112 inside. The lower heat sink fins 130 are also equipped with SUS material plates but do not have refrigerant flow spaces 111 and 112, and can transfer heat solely through the thermal conductivity of the SUS material itself.

[0134] In addition, for the high-heat-generating element 22C located in the upper middle region II-U, the high thermal conductivity of the intermediate heat sink fins 120 using phase change material may actually have a negative impact on heating.

[0135] More specifically, such as Figure 8 and Figure 9As shown, there is a concern that high-heat-generating components 21C located in the upper middle region II-U, such as FPGA components, may be damaged by heat due to the high temperature at the front end of the middle heat sink fins 120.

[0136] To solve this problem, multiple heat pipes 140 can be arranged on the inner side of the internal space 10S of the heat dissipation housing 10 corresponding to the upper middle region II-U to disperse the heat generated by the high heat-generating body 21C to the left and right horizontal directions of the heat dissipation housing 10.

[0137] The heat pipe 140 is also filled with a phase-change refrigerant in its closed interior. The refrigerant changes phase to gaseous refrigerant by the heat provided from the high-heat body 21C. The gaseous refrigerant diffuses through the wick structure (not shown) with multiple pores inside, and exchanges heat with the inner side of the heat sink 10 (especially the heat pipe contact portion 13) as a medium and condenses, thereby changing phase to liquid refrigerant.

[0138] In particular, the plurality of heat pipes 140 are configured such that at least one end surface is in thermal contact with the heating surface of the high-heat-generating element 21C, and the other end is arranged to extend toward the left or right end of the heat sink housing 10, so as to uniformly disperse and supply the high-temperature concentrated heat supplied from the high-heat-generating element 21C to a plurality of intermediate heat sink fins 120 spaced apart at a predetermined distance in the left-right horizontal direction on the back side of the heat sink housing 10.

[0139] As described above, the advantage of the heat dissipation device for an electronic device according to an embodiment of the present invention is that, compared with the case where multiple heat sink fins arranged vertically in a uniform manner are used to dissipate heat generated from various heat-generating bodies 21, 22, 22C, by providing specific regions (e.g., upper region, middle region, lower region, etc.) suitable for the heat generation of each heat-generating body 21, 22, 22C and equipping them for heat dissipation differentiated along the vertical direction, higher heat dissipation performance can be ensured.

[0140] In particular, the heat dissipation device of an electronic device according to an embodiment of the present invention is described as a representative electronic device, taking the "antenna device 1" and its associated components, which are very familiar to the applicant of the present invention, as an example. However, if the heat dissipation of heat-generating bodies with different heat generation in multiple fields is involved, it is described that it has technical features applicable to all types of machines.

[0141] The above description, with reference to the accompanying drawings, details one embodiment of a heat dissipation device for an electronic device according to the present invention. However, the embodiments of the present invention are not limited to the one described above, and it is natural that those skilled in the art can make various modifications and implement the invention within equivalent scope. Therefore, the true scope of the present invention should be determined by the claims. Industrial applicability

[0142] The present invention provides a heat dissipation device for electronic devices that divides specific heat dissipation areas according to the vertical position of the back of the heat dissipation housing, thereby installing multiple heat sink fins on the back of the heat dissipation housing to dissipate internal heat with uniform heat dissipation performance.

Claims

1. A heat dissipation device for an electronic device, comprising: The heat dissipation housing has an internal space with a front opening; Multiple heating elements are arranged in multiple regions in the vertical direction on the inner side of the internal space corresponding to the heat dissipation housing. as well as Multiple radiator fins are arranged slenderly vertically on the back side of the heat sink housing, and are detached and assembled separately at predetermined intervals along the horizontal direction. The plurality of radiator fins are arranged discontinuously in the vertical direction near the boundaries of the plurality of regions.

2. The heat dissipation device for an electronic device as described in claim 1, wherein, The plurality of radiator fins are arranged separately, such that heat transfer is blocked in the vertical direction relative to the back of the heat sink housing.

3. The heat dissipation device for an electronic device as described in claim 1, wherein, When the plurality of radiator fins are divided into an upper region located on the upper side, a middle region located in the middle, and a lower region located on the lower side of the back side of the heat dissipation housing, they are arranged on the back side of the heat dissipation housing in such a way that after independently receiving heat from the heat-generating element located in each region, heat is dissipated through an independent heat transfer path.

4. The heat dissipation device for an electronic device as described in claim 1, wherein, When the plurality of regions can be divided into an upper region located on the upper side of the back surface of the heat sink housing, a middle region located in the middle, and a lower region located on the lower side, the plurality of heat sink fins include: The upper heat sink fins are attached to the upper region so that the upper heat sink located in the upper region among the various heat sinks can dissipate heat. Intermediate heat sink fins, integrated into the intermediate region, to dissipate heat from the intermediate heat sink located in the intermediate region among the plurality of heat sinks; and The lower heat sink fins are attached to the lower region to allow the lower heat sink located in the lower region to dissipate heat among the various heat sinks.

5. The heat dissipation device for an electronic device as described in claim 4, wherein, The upper radiator fins, the middle radiator fins, and the lower radiator fins are arranged on a vertical line that forms a straight line in the vertical direction.

6. The heat dissipation device for an electronic device as described in claim 4, wherein, The upper radiator fins and the middle radiator fins have a first thermal conductivity. The lower radiator fins have a second thermal conductivity that is relatively lower than the first thermal conductivity. The upper heating element and the middle heating element located in the upper region and the middle region dissipate heat at a higher temperature than the lower heating element located in the lower region.

7. The heat dissipation device for an electronic device as described in claim 6, wherein, The upper radiator fins and the middle radiator fins are filled with a refrigerant capable of phase change, and have the first thermal conductivity through the flow generated by the phase change of the refrigerant.

8. The heat dissipation device for an electronic device as described in claim 6, wherein, The lower radiator fins have the second thermal conductivity due to the thermal conductivity of the material itself.

9. The heat dissipation device for an electronic device as described in claim 6, wherein, The upper radiator fins are further integrally formed with an extended heat dissipation plate portion, such that a portion of its upper end extends forward beyond the back of the heat dissipation housing and at least covers a portion of the upper surface of the heat dissipation housing.

10. The heat dissipation device for an electronic device as claimed in claim 9, wherein, The extended heat sink portion is formed in a shape that expands the refrigerant flow space inside the upper heat sink fins where refrigerant is filled.

11. The heat dissipation device for an electronic device as claimed in claim 6, wherein, In the intermediate region, in addition to the intermediate heating element, a high-heat-generating element with a greater heat output than the intermediate heating element is also provided. The intermediate region is divided into an upper intermediate region including the part where the high-heat-generating element is located and a lower intermediate region including the part where the high-heat-generating element is not located.

12. The heat dissipation device for an electronic device as claimed in claim 11, wherein, Multiple heat pipes are arranged on the inner side of the internal space of the heat dissipation housing corresponding to the upper middle region to disperse the heat generated by the high-heat-generating element to the left and right horizontal direction of the heat dissipation housing.

13. The heat dissipation device for an electronic device as claimed in claim 12, wherein, The back of the heat sink housing is further provided with a press-in portion for mounting the plurality of heat sink fins. When the pressing-in portion includes an upper pressing-in portion that connects to the upper radiator fins of the plurality of radiator fins, a middle pressing-in portion that connects to the middle radiator fins of the plurality of radiator fins, and a lower pressing-in portion that connects to the lower radiator fins of the plurality of radiator fins, The back side of the intermediate press-in portion formed in the heat dissipation housing is separated by a stepped surface.

14. The heat dissipation device for an electronic device as claimed in claim 12, wherein, The front end of the intermediate radiator fin located in the upper middle region is formed to be recessed in a stepped manner further rearward than the front end of the intermediate radiator fin located in the lower middle region.

15. The heat dissipation device for an electronic device as claimed in claim 4, wherein, The upper radiator fins and the middle radiator fins include: The heat-conducting plate body has a refrigerant flow space, which provides space for gas-liquid circulation so that the refrigerant can undergo a phase change and release heat in the enclosed space filled with refrigerant.

16. The heat dissipation device for an electronic device as claimed in claim 15, wherein, The refrigerant flow space includes: The first refrigerant flow path, serving as an evaporation region at one end in the width direction, supplies heat from the upper and middle heating elements, which are the objects of heat dissipation, to the heat-conducting plate body; and The second refrigerant flow path is formed in multiple ways in the condensation area other than the first refrigerant flow path. It extends from the other end of the heat-conducting plate body in the width direction, so that the liquid refrigerant condenses from the gaseous state to the liquid state in the refrigerant acts as the flow path on the side of the first refrigerant flow path by means of surface tension or gravity.

17. The heat dissipation device for an electronic device as claimed in claim 15, wherein, The heat-conducting plate body of the upper heat sink fins and the middle heat sink fins is made of SUS material. The lower heat sink fins are made of aluminum sheet material with a higher thermal conductivity than the main body of the heat-conducting plate.

18. The heat dissipation device for an electronic device as claimed in claim 15, wherein, The heat-conducting plate body of the upper radiator fins and the middle radiator fins is equipped with a plate shape made of SUS material to form the refrigerant flow space. The lower radiator fins are configured as SUS material plates that do not have the refrigerant flow space.

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