Display device and manufacturing method thereof

Abstract

A display device may include: a lower substrate including at least one LED light source; the upper substrate comprises at least one quantum dot color filter; and a bonding layer configured to bond the lower substrate and the upper substrate. The upper substrate may include a partition wall structure in which a plurality of sub-bars are repeatedly disposed in an edge region of a partition wall layer.

Description

TECHNICAL FIELD

[0001] The disclosure relates to a display apparatus including a color filter and a manufacturing method thereof. BACKGROUND

[0002] A display apparatus is an apparatus that processes an image signal and / or image data input from an external source or stored internally after being processed. The display apparatus displays the processed image signal and / or image data as an image on a display panel or screen, and can be implemented on various displays such as a television, a monitor, or a portable media player.

[0003] The display apparatus can include a lower substrate including a plurality of pixels, and an upper substrate including a color filter and a color conversion unit to enhance display quality. For example, the color conversion unit can convert a wavelength of light provided from the lower substrate. Accordingly, the display apparatus including the color conversion unit can emit light having a color different from a color of incident light. For example, the color conversion unit can include wavelength conversion particles such as quantum dots.

[0004] The wavelength conversion particles such as quantum dots can be deteriorated due to impurities permeated into the display apparatus. When the quantum dots are deteriorated, the display apparatus can cause deterioration of display quality due to luminance unevenness. SUMMARY

[0005] TECHNICAL PROBLEM A display apparatus and a manufacturing method thereof that can prevent deterioration of quantum dots by minimizing impurities permeated via a partition wall structure are provided.

[0006] Additional aspects will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following description and the attached drawings.

[0007] TECHNICAL SOLUTION According to an aspect of the disclosure, a display apparatus can include a lower substrate including at least one light emitting diode (LED) light source, an upper substrate including at least one quantum dot color filter, and a bonding layer configured to bond the lower substrate and the upper substrate. The upper substrate can include a partition wall structure including a plurality of sub-rods repeatedly disposed in an edge region of a partition wall layer.

[0008] At least one of the plurality of sub-rods can be configured to prevent impurities including at least one of oxygen or moisture from permeating through the edge region.

[0009] The upper substrate can include a glass substrate configured to output light, a black matrix layer configured to prevent light interference, a color filter layer including at least one quantum dot color filter, a color conversion layer including at least one color converter, the separation wall layer including the at least one sub-rod of the plurality of sub-rods, and an inorganic encapsulation layer configured to control light reflection.

[0010] The lower substrate can include a base substrate, a buffer layer including an inorganic insulating material, and a light emitting element layer including the at least one LED light source.

[0011] The bonding layer can include an optical bonding material configured to transmit light, and the bonding layer can be configured to bond the lower substrate and the upper substrate with the optical bonding material.

[0012] In the separation wall structure, the plurality of sub-rods can be repeatedly disposed at intervals of 1 µm to 100 µm.

[0013] The at least one sub-rod of the plurality of sub-rods of the separation wall structure can have a cubic shape, and can be formed to have a height of 1 µm to 100 µm.

[0014] The inorganic encapsulation layer can be configured to fill a recessed area between at least two sub-rods of the plurality of sub-rods, and can be configured to be parallel to the black matrix layer.

[0015] The upper substrate can further include a functional planarization layer between the color filter layer and the separation wall layer, and the functional planarization layer can include a low refractive index material.

[0016] The plurality of sub-rods can be repeatedly disposed between at least two quantum dot color filters.

[0017] According to an aspect of the disclosure, a method for manufacturing a display device can include forming a light emitting substrate including at least one LED light source, forming a color conversion substrate including at least one quantum dot color filter, and forming a bonding layer bonding the light emitting substrate and the color conversion substrate. Here, the step of forming the color conversion substrate can include forming a separation wall structure including a plurality of sub-rods repeatedly disposed in an edge area of a separation wall layer.

[0018] The separation wall structure can include at least one sub-rod of the plurality of sub-rods for preventing penetration of impurities including at least one of oxygen and moisture through the edge area.

[0019] The step of forming the color conversion substrate can include forming a glass substrate outputting light; forming a black matrix layer preventing light interference; forming a color filter layer including the at least one quantum dot color filter; forming a color conversion layer including at least one color converter; forming the separation wall layer including the at least one sub-rod of the plurality of sub-rods; and forming an inorganic encapsulation layer controlling light reflection.

[0020] The step of forming the light emitting substrate can include forming a base substrate; forming a buffer layer including an inorganic insulating material; and forming a light emitting element layer including the at least one LED light source.

[0021] The bonding layer can include an optical bonding material transmitting light, and the light emitting substrate and the color conversion substrate can be bonded with the optical bonding material.

[0022] In the separation wall structure, the plurality of sub-rods can be repeatedly disposed at intervals of 1 μm to 100 μm.

[0023] The at least one sub-rod of the separation wall structure can have a cubic shape, and can be formed to have a height of 1 μm to 100 μm.

[0024] The step of forming the inorganic encapsulation layer can include filling a recessed area between at least two sub-rods and forming the inorganic encapsulation layer parallel to the black matrix layer.

[0025] The step of forming the color conversion substrate can further include forming a functional planarization layer disposed between the color filter layer and the separation wall layer and including a low refractive index material.

[0026] The plurality of sub-rods can be repeatedly disposed between at least two quantum dot color filters.

[0027] Advantages of Invention According to various embodiments of the present disclosure, the display device and the manufacturing method thereof according to the present disclosure can prevent quantum dot degradation by minimizing impurities that penetrate inside via a separation wall structure. Accordingly, the display device and the manufacturing method thereof according to the present disclosure can ensure reliable display quality and improve brightness uniformity.

[0028] Effects of the present disclosure are not limited to the aforementioned, and other unmentioned effects will be easily understood by those skilled in the art from the following description. In other words, non-expected effects, which are derivable by those skilled in the art from the embodiments of the present disclosure, in practicing the embodiments of the present disclosure, will also be within the scope of the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0029] The above and other aspects, features, and advantages of certain embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which: Figure 1 is an example plan view illustrating a display device according to one or more embodiments.

[0030] Figure 2 is an example cross-sectional view illustrating a display device according to one or more embodiments.

[0031] Figure 3 is an example stack structure of a display device according to one or more embodiments.

[0032] Figure 4 is an example stack structure of a lower substrate according to one or more embodiments.

[0033] Figure 5 is an example stack structure of an upper substrate according to one or more embodiments.

[0034] Figure 6a and Figure 6b is an example display device in which a lower substrate and an upper substrate are bonded by a bonding layer according to one or more embodiments.

[0035] Figure 7 is an example stack structure of a display device according to one or more embodiments.

[0036] Figure 8 is an example stack structure of a display device according to one or more embodiments.

[0037] Figure 9 is an example stack structure of a display device according to one or more embodiments.

[0038] Figure 10 is an example stack structure of a display device according to one or more embodiments.

[0039] Figure 11 is an example stack structure of a display device according to one or more embodiments.

[0040] Figure 12 is an example flow diagram illustrating a method for manufacturing a display device according to one or more embodiments. DETAILED DESCRIPTION

[0041] Embodiments of the present disclosure are described below with reference to the accompanying drawings in detail. The present disclosure may, however, be embodied in other various forms, and is not limited to the embodiments set forth herein. Throughout the disclosure and the accompanying drawings, like or similar components can be designated by like reference numerals.

[0042] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and constructions can be omitted for clarity and conciseness.

[0043] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but are merely used to enable a clear and consistent in understanding of the present disclosure. Therefore, it should be understood that the following description of various embodiments of the present disclosure is merely provided for illustration purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0044] It will be further understood that the terms "comprises" and / or "has," as used herein, specify the presence of stated features, numbers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof.

[0045] The term "and / or" can mean a combination of the listed components or any component.

[0046] Hereinafter, the working principles and embodiments of the present disclosure are described with reference to the accompanying drawings.

[0047] Figure 1 is an example plan view illustrating a display device 10 according to one or more embodiments. Figure 2 is an example cross-sectional view illustrating a display device 10 according to one or more embodiments.

[0048] Referring to Figure 1 , the display device 10 can include a display area on which an image is displayed and a bezel area disposed outside the display area. For example, in a plan view, the bezel area can surround the display area.

[0049] To provide an image display function according to an example embodiment of the present disclosure, the display device 10 can include a display panel in which a plurality of data lines and a plurality of gate lines are arranged and a plurality of sub-pixels defined by the plurality of data lines and the plurality of gate lines are arranged, a data driving circuit to drive the plurality of data lines, a gate driving circuit to drive the plurality of gate lines, and a display controller to control the data driving circuit and the gate driving circuit.

[0050] The data driving circuit, the gate driving circuit, and the display controller can each be implemented as one or more individual components. In some cases, two or more of the data driving circuit, the gate driving circuit, and the display controller can be integrated into a single component. For example, the data driving circuit and the display controller can be implemented as a single integrated circuit chip (IC chip).

[0051] In particular, to provide a touch sensing function, the display apparatus 10 according to an example embodiment of the present disclosure can include a touch panel (e.g., a touch screen panel) having a plurality of touch electrodes, and a touch sensing circuit for providing a touch driving signal to the touch panel, detecting a touch sensing signal from the touch panel, and determining whether a user's touch (e.g., a user's input) exists and / or a touch position (touch coordinates) on the touch panel based on the detected touch sensing signal.

[0052] For example, the touch sensing circuit can include at least one of a touch driving circuit for providing a touch driving signal to the touch panel and detecting a touch sensing signal from the touch panel, and a touch controller for detecting whether a user's touch exists and a touch position on the touch panel based on the touch sensing signal detected by the touch driving circuit.

[0053] The touch driving circuit can include a first circuit portion for providing a touch driving signal to the touch panel and a second circuit portion for detecting a touch sensing signal from the touch panel. The touch driving circuit and the touch controller can be implemented as separate (or independent) components, or can be integrated and implemented as one component.

[0054] Each of the data driving circuit, the gate driving circuit, and the touch driving circuit can be implemented as one or more ICs, and can be implemented in a Chip On Glass (COG) type, a Chip On Film (COF) type, or a Tape Carrier Package (TCP) type in relation to the display panel and electrical connections. The gate driving circuit can also be implemented in a Gate In Panel (GIP) type.

[0055] Each of the circuit components for driving the display and for touch sensing (e.g., detecting a signal input) can be implemented as one or more individual components. In some cases, one or more of the circuit components for display driving and one or more of the circuit components for touch sensing can be functionally integrated and implemented as one or more components.

[0056] For example, the data driving circuit and the touch driving circuit can be implemented by being integrated into one or more IC chips. If the data driving circuit and the touch driving circuit are integrated into two or more IC chips, each of the two or more IC chips can have a data driving function and a touch driving function.

[0057] Referring to Figure 2 The display device 10 can include a lower substrate 100, an upper substrate 200, and a bonding layer 300. For example, referring to Figure 2 A bottom side of the upper substrate 200 can be disposed to face a top side of the lower substrate 100 and can be positioned in a first direction. For example, the first direction can be a direction facing or opposite to a front of the display device 10 with respect to the lower substrate 100. The bonding layer 300 can be connected or bonded to the lower substrate 100 and the upper substrate 200.

[0058] The lower substrate 100 can include a plurality of LED light sources. The LED light sources can be disposed in a display area of the lower substrate 100. Each of the LED light sources can include a driving element and a light emitting element. The driving element can include at least one thin film transistor. The light emitting element can generate light according to a driving signal. For example, the light emitting element can be an organic LED or an inorganic LED.

[0059] The upper substrate 200 can include a color conversion unit (or color converter). The color conversion unit can be disposed in a display area and configured to convert a wavelength of light generated from the light emitting element of the lower substrate 100. The upper substrate 200 can include a color filter layer 230 that transmits light of a specific color.

[0060] The bonding layer 300 can be bonded or attached to the lower substrate 100 and the upper substrate 200. The bonding layer 300 can be disposed in a bonding area between the lower substrate 100 and the upper substrate 200. For example, the bonding layer 300 can have a planar shape including a bonding material. However, embodiments of the disclosure are not limited thereto, and the bonding layer 300 can have various planar shapes according to a planar shape of the lower substrate 100 or the upper substrate 200. For example, if the lower substrate 100 or the upper substrate 200 has a planar shape such as a triangle, a rhombus, a polygon, a circle, or an ellipse, the bonding layer 300 can have a planar shape such as a hollow triangle, a hollow rhombus, a hollow polygon, a hollow circle, or a hollow ellipse.

[0061] In an example embodiment, the bonding layer 300 can include a filler. For example, the filler can provide a cushion to external pressure applied to the display device 10. For example, the filler can maintain a gap between the lower substrate 100 and the upper substrate 200.

[0062] The display device 10 can include a partition wall structure (PWS) for preventing impurities from penetrating into the display device 10. The display device 10 can prevent quantum dot degradation by minimizing impurities that penetrate or enter into the display device 10 via the PWS. Accordingly, the display device 10 can improve brightness uniformity and ensure reliability of display quality.

[0063] Figure 3 An example stack structure of the display device 10 according to one or more embodiments is illustrated, Figure 4 An example stack structure of the lower substrate 100 according to one or more embodiments is illustrated, Figure 5 An example stack structure of the upper substrate 200 according to one or more embodiments is illustrated.

[0064] Referring to Figure 3 The display device 10 can include a lower substrate 100 including at least one LED light source, an upper substrate 200 including at least one quantum dot color filter, and a bonding layer 300 bonding the lower substrate 100 and the upper substrate 200. For example, the bonding layer 300 can be formed on the lower substrate 100. For example, the upper substrate 200 can be formed on the bonding layer 300.

[0065] In an embodiment, the upper substrate 200 can include a PWS in which at least one sub-rod is repeatedly disposed in an edge region of the partition wall layer 250. The PWS can include at least one sub-rod to prevent impurities including at least one of oxygen (O2) and moisture (H2O) from penetrating through the edge region.

[0066] As Figure 4 The lower substrate 100 can include a base substrate 110, a buffer layer 120 including an inorganic insulating material, and a light emitting element layer 130 including at least one LED light source, as illustrated in

[0067] The base substrate 110 can be a substrate forming a basic structure of the lower substrate 100. The base substrate 110 can be an insulating substrate formed of a transparent or non-transparent material. For example, the base substrate 110 can be at least one of a glass substrate, a plastic substrate, and a silicon substrate. If the base substrate 110 is a glass substrate, the base substrate 110 can be a rigid substrate. If the base substrate 110 is a plastic substrate, the base substrate 110 can be a flexible substrate.

[0068] The buffer layer 120 can include an inorganic insulating material such as a silicon compound or a metal oxide. For example, the buffer layer 120 can include at least one of silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), silicon oxycarbide (SiOC), silicon carbonitride (SiCN), aluminum oxide (AlO), aluminum nitride (AlN), tantalum oxide (TaO), hafnium oxide (HfO), zirconium oxide (ZrO), and titanium oxide (TiO). The buffer layer 120 can have a single layer structure or a multi-layer structure including a plurality of insulating layers.

[0069] The light emitting element layer can generate light on the lower substrate 100. The light emitting element layer can include at least one LED light source (e.g., LED1, LED2, and LED3). For example, the at least one LED light source can include micro-LEDs emitting different colors (e.g., red, blue, and green). For example, the at least one LED light source can include blue micro-LEDs emitting the same light (e.g., blue). Each of the at least one LED light source can include a driving element and a light emitting element. The driving element can include at least one thin film transistor. The light emitting element can generate light according to a driving signal. For example, the light emitting element can be an organic LED or an inorganic LED.

[0070] As shown in FIG. 1A, Figure 5 The upper substrate 200 can include a glass substrate 210 for outputting light, a black matrix layer 220 for preventing interference of light, a color filter layer 230 having at least one quantum dot color filter, a color conversion layer 240 having at least one color conversion unit (or color converter), a partition wall layer 250 having at least one sub-rod, and an inorganic encapsulation layer 260 for controlling reflection of light. For example, the upper substrate 200 can be a color conversion substrate.

[0071] The glass substrate 210 can output light generated by the lower substrate 100 to the outside. For example, the glass substrate 210 can be formed with a transparent material (e.g., glass).

[0072] The black matrix layer 220 can be formed on the glass substrate 210. For example, the black matrix layer 220 can be formed on the glass substrate 210. The black matrix layer 220 can prevent interference of light generated by the lower substrate 100. For example, the black matrix layer 220 can absorb light to minimize reflection, thereby increasing brightness of output light.

[0073] A color filter layer 230 can be formed on the black matrix layer 220. For example, the color filter layer 230 can be formed on the black matrix layer 220. The color filter layer 230 can include at least one quantum dot color filter (e.g., CF1, CF2, or CF3). The color filter layer 230 can include at least one of a red color filter CF1, a green color filter CF2, and a blue transmission layer CF3. The red color filter CF1 can block blue light and transmit red light. The green color filter CF2 can block blue light and transmit green light. The blue transmission layer CF3 can transmit input blue light.

[0074] A color conversion layer 240 can be formed on the color filter layer 230. The color conversion layer 240 can include at least one color conversion unit (e.g., CC1, CC2, and CC3). The at least one color conversion unit can be formed on the at least one quantum dot color filter. For example, the at least one color conversion unit can be disposed in each of the openings of the separation wall layer 250. The color conversion layer 240 can include quantum dots that change the wavelength of incident light. For example, a first color conversion unit CC1 can include red quantum dots dispersed in a resin. For example, a second color conversion unit CC2 can include green quantum dots dispersed in a resin. A third color conversion unit CC3 can include a transparent resin.

[0075] A separation wall layer 250 can be formed on the color filter layer 230. For example, the separation wall layer 250 can be formed on the color filter layer 230. The separation wall layer 250 can be configured to minimize light leakage. The separation wall layer 250 can include an organic material. The separation wall layer 250 can also include a light-blocking material. For example, at least a portion of the separation wall layer 250 can include a light-blocking material such as a black pigment, a dye, or carbon black.

[0076] The separation wall layer 250 can include at least one sub-rod located in the edge area. Since the sub-rod can be repeatedly formed in the edge area of the separation wall layer 250 at a predetermined interval, the upper substrate 200 can include a separation wall structure.

[0077] An inorganic encapsulation layer 260 can be formed on the separation wall layer 250, for example, by at least one of plasma-enhanced chemical vapor deposition (PECVD) and chemical vapor deposition (CVD). The inorganic encapsulation layer 260 can include an inorganic material such as SiO x N x , SiN x , or SiO. The inorganic encapsulation layer 260 can improve color accuracy of light output to the outside by controlling reflection of light.

[0078] Figure 6a and Figure 6b An example display device 10 in which the lower substrate 100 and the upper substrate 200 are bonded by the bonding layer 300 according to one or more embodiments is illustrated.

[0079] Referring to Figure 6a and Figure 6b The bonding layer 300 can include an optical bonding material, and bond the lower substrate 100 and the upper substrate 200 with the optical bonding material.

[0080] For example, the bonding layer 300 can have a light transmittance. The bonding layer 300 can maintain optical properties of light output from the lower substrate 100 by maximizing light transmission and minimizing light reflection.

[0081] For example, the optical bonding material can fill a bonding area between the lower substrate 100 and the upper substrate 200. For example, the optical bonding material can include at least one of an Epoxy adhesive, an Acrylic adhesive, a Silicone adhesive, a Melamine adhesive, a UV-curable adhesive, a Hot melt adhesive, or a Polyurethane adhesive.

[0082] As shown in Figure 6a , the bonding material of the bonding layer 300 can fill the entire bonding area. For example, the bonding material can be in contact (or touch) with each of the lower substrate 100 and the upper substrate 200, and can be bonded or attached to the lower substrate 100 and the upper substrate 200.

[0083] In an embodiment, as shown in Figure 6b , the bonding material of the bonding layer 300 can fill only a portion of the bonding area. For example, the bonding layer 300 can include an air gap that is not filled with the bonding material. The bonding layer 300 can be in contact with the lower substrate 100, and can not be in contact with a portion of the upper substrate 200.

[0084] The display device 10 can include a PWS for preventing impurities from penetrating or entering into the display device 10. The display device 10 can prevent quantum dot degradation by minimizing impurities that penetrate into the display device 10 via the PWS.

[0085] The upper substrate 200 can include a PWS in which at least one sub-stick can be repeatedly disposed in an edge area of the partition wall layer 250. The PWS can include at least one sub-stick to prevent impurities including at least one of oxygen (O2) and moisture (H2O) from penetrating or entering into the edge area.

[0086] For example, in the PWS, at least two sub-rods can be repeatedly arranged at intervals of between 1 µm and 100 µm. The intervals between the at least one sub-rod can be the same. The intervals between the at least one sub-rod can be different from each other. The PWS can include a recessed region according to the intervals between the at least two sub-rods.

[0087] In an example embodiment, the at least one sub-rod of the PWS can have a cubic shape and be formed to have a height of 1 µm to 100 µm. For example, the at least one sub-rod can be a cube having a side length in a range of between 1 µm and 100 µm. However, the shape and size of the sub-rod included in the display device 10 of the disclosure are not limited thereto.

[0088] Figure 7 An example stack structure of the display device 10 according to one or more embodiments is illustrated.

[0089] Referring to Figure 7 , the display device 10 can include an upper substrate 200 including a PWS. The PWS can include a recessed region according to intervals between at least two sub-rods.

[0090] In an embodiment, the inorganic encapsulation layer 260 can fill the recessed region between the at least two sub-rods. For example, the inorganic encapsulation layer 260 can fill the recessed region and can be formed in a structure parallel to the black matrix layer 220.

[0091] Figure 8 An example stack structure of the display device 10 according to one or more embodiments is illustrated.

[0092] Referring to Figure 8 , the display device 10 can include an upper substrate 200 including a PWS. The upper substrate 200 can further include a functional planarization layer 270 disposed between the color filter layer 230 and the partition wall layer 250. For example, the display device 10 can further include the functional planarization layer 270, thereby improving the refractive index of light and increasing the brightness of output light.

[0093] The functional planarization layer 270 can reduce or eliminate a step difference caused by the color filter layer 230. The functional planarization layer 270 can include an organic material and an inorganic material. For example, the functional planarization layer can include at least one of silicon oxide and silicon nitride.

[0094] The functional planarization layer 270 can include a low refractive index material having a refractive index in a range of 1.0 to 1.6. For example, the functional planarization layer 270 can include hollow particles. For example, the hollow particles can include an inorganic material. The hollow particles can be dispersed in a resin matrix. For example, the hollow particles can include at least one of silicon dioxide (SiO2), magnesium fluoride (MgF2), and iron oxide (Fe3O4). For example, the resin matrix can include an acrylic resin, a silicone resin, a polyurethane resin, or an imide resin, and can be selected in consideration of a refractive index and processability.

[0095] Figure 9 An example stack structure of a display device 10 according to one or more embodiments is illustrated.

[0096] Referring to Figure 9 , the display device 10 can include an upper substrate 200 including a PWS. The PWS can be formed between quantum dot color filters. For example, the upper substrate 200 can include a PWS in which sub-rods are repeatedly disposed between a plurality of quantum dot color filters.

[0097] If the PWS is formed between the quantum dot color filters, quantum dot degradation due to impurities introduced between the quantum dot color filters can be minimized. For example, the sub-rods can be repeatedly arranged at intervals of 1 µm to 100 µm between the quantum dot color filters.

[0098] Figure 10 An example stack structure of a display device 10 according to one or more embodiments is illustrated.

[0099] Referring to Figure 10 , the display device 10 can include an upper substrate 200 including a PWS. The PWS can be formed in each of an edge area and a display area. For example, the PWS can be formed in the edge area of the partition wall layer 250 and between the quantum dot color filters, respectively.

[0100] If the PWS is formed in the edge area and the display area, the PWS can prevent impurities from being introduced into the edge area and between the quantum dot color filters.

[0101] Figure 11 An example stack structure of a display device 10 according to one or more embodiments is illustrated. Referring to Figure 11 , the display device 10 can include an upper substrate 200 including a PWS. For example, the PWS can include sub-rods of various shapes and sizes.

[0102] In one example construction, the sub-rods can have a trapezoidal shape. However, the shape of the sub-rods is not limited to the trapezoidal shape, and the shape of the sub-rods can have various shapes including a circular shape, a triangular shape, an elliptical shape, and combinations thereof.

[0103] Further, as shown in Figure 11 As the sub-rods of the PWS have various shapes, the inorganic encapsulation layer 260 can be formed in a shape corresponding to the shape of the sub-rods.

[0104] Figure 12 is an example flowchart illustrating a method for manufacturing a display device according to one or more embodiments.

[0105] Referring to Figure 12 , the method for manufacturing a display device according to the present disclosure can form a light emitting substrate (e.g., 100) (step 1210); form a color conversion substrate (e.g., 200) (step 1220); and bond the light emitting substrate (e.g., 100) and the color conversion substrate (e.g., 200) (step 1230). Specifically, the method for manufacturing a display device can form a PWS in which a plurality of sub-rods are repeatedly provided in an edge region of a partition wall layer 250. The PWS can include at least one sub-rod to prevent impurities including at least one of oxygen and moisture from penetrating through the edge region.

[0106] According to an embodiment, in step 1210, the method of manufacturing a display device 10 can form a light emitting substrate 100 including at least one LED light source.

[0107] The method of manufacturing a display device can include forming a base substrate 110; forming a buffer layer 120 including an inorganic insulating material; and forming a light emitting element layer 130 including at least one LED light source.

[0108] According to an embodiment, in step 1220, the method of manufacturing a display device can form a color conversion substrate 200 including at least one quantum dot color filter.

[0109] The method of manufacturing a display device 10 can include forming a glass substrate 210 for outputting light; forming a black matrix layer 220 to prevent interference of light; forming a color filter layer 230 including at least one quantum dot color filter; forming a partition wall layer 250 including at least one sub-rod; and forming an inorganic encapsulation layer 260 to control reflection of light.

[0110] For example, a plurality of sub-rods can be repeatedly arranged on the PWS at intervals of between 1 µm and 100 µm. For example, the at least one sub-rod can have a cubic shape, and a height can be formed in a range of 1 µm to 100 µm.

[0111] According to an example embodiment, in step 1230, the method of manufacturing a display device 10 can form a bonding layer 300 for bonding the light emitting substrate 100 and the color conversion substrate 200. For example, the bonding layer 300 can include an optical bonding material, and the light emitting substrate 100 and the color conversion substrate 200 are bonded with the optical bonding material.

[0112] The method for manufacturing a display device according to the present disclosure can prevent quantum dot degradation by minimizing impurities that penetrate into the inside via PWS. Accordingly, the method for manufacturing an electronic device according to the present disclosure can ensure reliable display quality and improve brightness uniformity.

[0113] However, since this has been described above, a repetitive description is not given.

[0114] The display device according to various embodiments of the present disclosure can be one of various types of electronic devices. The display device can include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The display device according to an embodiment of the present disclosure is not limited to the above-described devices.

[0115] It should be understood that various embodiments of the present disclosure and the terms used therein are not intended to limit technical features described herein to specific embodiments and include various changes, equivalents, or replacements of the technical features according to the concept and scope of the present disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. As used herein, the term "includes" and "comprises" and "has" and any variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a combination of units should not be limited to the combination of units as stated by the disclosure. As used herein, each of the phrases "at least one of," "at least one of A or / and B," "at least one of A and B," "at least one of A or B [including] at least one of A or B," "at least one of A and / or B," "at least one of A or B," "at least one of A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include all possible combinations of the items enumerated together in a related clause containing these phrases. As used herein, the terms "first," "second," "third," "fourth," "fifth," "sixth," and the like, do not limit the quantity or order of the components, but are used to distinguish one component from another.

[0116] As used in various embodiments of the present disclosure, the term "if" can be interpreted as "when" or "responsive to the determination" or "in response to the detection" according to context. Similarly, the term "if determined" or "if detecting" can be interpreted as "upon determining" or "in response to determining" or "upon detecting" or "in response to detecting" according to context.

Claims

1. A display device, comprising: The lower substrate includes at least one light-emitting diode (LED) light source; The upper substrate includes at least one quantum dot color filter; as well as A bonding layer is configured to bond the lower substrate and the upper substrate. The upper substrate includes a partition wall structure, which includes a plurality of sub-bars repeatedly disposed in the edge region of the partition wall layer.

2. The display device according to claim 1, wherein, At least one of the plurality of sub-bars is configured to prevent impurities, including at least one of oxygen or moisture, from penetrating through the edge region.

3. The display device according to claim 2, wherein, The upper substrate includes: A glass substrate is configured to output light; The black matrix layer is configured to prevent light interference. A color filter layer, comprising at least one quantum dot color filter; A color conversion layer, including at least one color converter; The partition wall layer includes at least one of the plurality of sub-bars; and The inorganic encapsulation layer is configured to control light reflection.

4. The display device according to claim 3, wherein, The lower substrate includes: Substrate; The buffer layer includes inorganic insulating materials; and The light-emitting element layer includes the at least one LED light source.

5. The display device according to claim 3, wherein, The bonding layer includes an optical bonding material configured to transmit light, and the bonding layer is configured to bond the lower substrate and the upper substrate using the optical bonding material.

6. The display device according to claim 3, wherein, In the partition wall structure, the plurality of sub-bars are repeatedly arranged at intervals of 1 μm to 100 μm.

7. The display device according to claim 3, wherein, At least one of the plurality of sub-bars in the partition wall structure has a cubic shape and is formed to have a height of 1 μm to 100 μm.

8. The display device according to claim 3, wherein, The inorganic encapsulation layer fills the recessed region between at least two of the plurality of sub-bars and is parallel to the black matrix layer.

9. The display device according to claim 3, wherein, The upper substrate further includes a functional planarization layer located between the color filter layer and the partition wall layer, and the functional planarization layer comprises a low refractive index material.

10. The display device according to claim 3, wherein, The plurality of sub-bars are repeatedly arranged between at least two quantum dot color filters.

11. A method for manufacturing a display device, the method comprising: Forming a light-emitting substrate including at least one light-emitting diode (LED) light source; Forming a color conversion substrate including at least one quantum dot color filter; as well as A bonding layer is formed to bond the light-emitting substrate and the color conversion substrate. The step of forming the color conversion substrate includes forming a partition wall structure, the partition wall structure including a plurality of sub-bars repeatedly disposed in the edge region of the partition wall layer.

12. The method according to claim 11, wherein, At least one of the plurality of sub-bars is configured to prevent impurities, including at least one of oxygen and moisture, from penetrating through the edge region.

13. The method according to claim 12, wherein, The steps for forming the color conversion substrate include: A glass substrate that forms the output light; A black matrix layer is formed to prevent light interference; Forming a color filter layer including the at least one quantum dot color filter; Form a color conversion layer including at least one color converter; Forming the partition wall layer comprising at least one of the plurality of sub-bars; and An inorganic encapsulation layer is formed to control light reflection.

14. The method according to claim 13, wherein, The steps for forming the light-emitting substrate include: Forming a substrate; Forming a buffer layer comprising inorganic insulating materials; and A light-emitting element layer comprising the at least one LED light source is formed.

15. The method according to claim 13, wherein, The bonding layer includes an optical bonding material that transmits light, and the light-emitting substrate and the color conversion substrate are bonded using the optical bonding material.

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