Organic light emitting display device

Abstract

An organic light emitting display device may include: a bank between sub-pixels on a substrate; an anode electrode at the sub-pixel; an organic light emitting layer on the anode electrode and the bank; a cathode electrode on the organic light emitting layer; and a protruding portion disposed on the upper side of the bank at a distance from the organic light-emitting layer. The protruding portion includes: a connection structure including an auxiliary electrode in contact with the cathode electrode; and a bridge electrode disposed on the connection structure and electrically connected to the auxiliary electrode.

Description

Technical Field

[0001] The embodiments relate to an organic light-emitting display device. Background Technology

[0002] With the increasing demand for portable information media, attempts to further apply organic light-emitting diode (OLED) displays to various lightweight and thin information electronic devices are expanding. Recently, the application trend of OLED displays in product groups such as laptops and automobiles has surpassed that of televisions and mobile phones. OLED displays used in laptops and automobiles require long lifespans due to their long-term operation as static images. To extend lifespan, it is necessary to maximize light extraction from the OLEDs. Furthermore, to reduce costs, it is particularly important to expand the technology to produce OLEDs on substrates of 8.5-generation (2200×2500mm) and 10.5-generation (3370×2940mm). To produce long-life OLEDs, sub-pixels with side-by-side structures, while serving as top-emission structures, need to be implemented using structures of two or more stacked OLEDs.

[0003] The structure of this organic light-emitting element (OLED) can be obtained using a fine metal mask (FMM) deposition apparatus. However, with the FMM deposition method, the production flow can only be produced using a cluster method rather than an in-line method, resulting in low production efficiency. Furthermore, there is a reduction in the positional precision (PPA) of the sub-pixels between the FMM and the substrate. Consequently, the luminous area ratio (EAR) is small, limiting product lifespan. The EAR is calculated by dividing the luminous area of ​​a sub-pixel by the area of ​​the sub-pixel.

[0004] Therefore, there is an urgent need to develop new deposition methods to solve the aforementioned problems, as well as organic light-emitting display devices with new organic light-emitting element structures utilizing new deposition methods. Summary of the Invention

[0005] Technical problems to be solved The purpose of these embodiments is to solve the aforementioned problems and other issues.

[0006] Another objective of this embodiment is to provide an organic light-emitting display device with a novel structure.

[0007] Another objective of the embodiments is to provide an organic light-emitting display device that can improve lifespan.

[0008] Another objective of the embodiments is to provide an organic light-emitting display device that can improve production efficiency and yield.

[0009] Another objective of the embodiments is to provide an organic light-emitting display device that can improve image quality.

[0010] The technical problems to be solved by the embodiments are not limited to those described in this project, but include those that can be understood through the invention.

[0011] Technical solution To achieve the above and other objectives, according to one aspect of an embodiment, an organic light-emitting display device includes: a bank between sub-pixels on a substrate; an anode electrode at the sub-pixel; an organic light-emitting layer on the anode electrode and the bank; a cathode electrode on the organic light-emitting layer; and a protrusion disposed on the upper side of the bank and at a distance from the organic light-emitting layer, the protrusion including: a connection structure including an auxiliary electrode connected to the cathode electrode; and a bridging electrode disposed on the connection structure for electrically connecting to the auxiliary electrode.

[0012] The protrusion may include: a first layer on the embankment; a second layer on the first layer; and a third layer below the first layer. The side portions of the third layer and the second layer may be located on the same line or diagonally, or extend from the side portion of the second layer toward the sub-pixel. The side portion of the first layer may be recessed from the side portion of the second layer toward the inside of the protrusion.

[0013] The bridging electrode may include: a first bridging electrode on the second layer; and a second bridging electrode disposed on the first bridging electrode for electrical connection with the first bridging electrode.

[0014] The first bridging electrode can be a connecting electrode used to connect the auxiliary electrode to the second bridging electrode.

[0015] The protrusion may further include a fourth layer between the second layer and the first bridging electrode.

[0016] The first bridging electrode can be disposed on the lower side of the second layer via the side portion of the fourth layer.

[0017] At least one of the first bridging electrode or the fourth layer may include an etch-prevention layer.

[0018] At least one of the first layer, the second layer, or the third layer can be the auxiliary electrode.

[0019] The protrusion may be disposed on the connection structure and include a sensing element for sensing touch.

[0020] The sensing element may include: a first sensing electrode on the second layer; a second sensing electrode on the first sensing electrode; and a dielectric layer having a set dielectric constant between the first sensing electrode and the second sensing electrode.

[0021] One of the first sensing electrode and the second sensing electrode can provide a driving signal, and the other can output a sensing signal corresponding to the driving signal.

[0022] The organic light-emitting display device may further include a black resin layer on the bridging electrode.

[0023] The auxiliary electrode and the bridging electrode can be connected together to the power line.

[0024] The organic light-emitting display device may further include a blocking structure that guides the hole injection layer of the organic light-emitting layer to break at the dike.

[0025] Beneficial effects The effects of the organic light-emitting display device according to the embodiment are explained below.

[0026] According to at least one of the embodiments, no FMM is required, thus simplifying the process and offering the advantage of saving process costs.

[0027] According to at least one of the embodiments, FMM is not required, thus increasing the EAR within the sub-pixel, which has the advantage of improving lifespan.

[0028] According to at least one of the embodiments, in a tandem deposition system, organic light-emitting elements are deposited on a large-area substrate, thereby having the advantages of improving production efficiency, yield, and material utilization efficiency.

[0029] The additional scope of application possibilities of the embodiments will become apparent from the following detailed description. However, those skilled in the art will clearly understand that various modifications and alterations are possible within the spirit and scope of the embodiments; therefore, it should be understood that specific embodiments, such as the detailed descriptions and preferred embodiments, are provided only as examples. Attached Figure Description

[0030] Figure 1 A plan view of the organic light-emitting display device according to the first embodiment is shown in schematic form; Figure 2 To show Figure 1 A planar image of one pixel; Figure 3 A circuit diagram of an organic light-emitting display device according to an embodiment is shown; Figure 4a In order to be in Figure 2A cross-sectional view taken along line A-A' from the pixels; Figure 4b In order to be in Figure 2 A cross-sectional view taken along line B-B' from the pixels; Figure 4c In order to be in Figure 2 A cross-sectional view taken along the C-C' line from the pixels; Figure 5 A cross-sectional view of the organic light-emitting display device according to the first embodiment is shown; Figure 6 A cross-sectional view of the organic light-emitting display device according to the second embodiment is shown; Figure 7 A cross-sectional view of the organic light-emitting display device according to the third embodiment is shown.

[0031] The size, shape, and values ​​of the components shown in the accompanying drawings may differ from the actual values. Furthermore, even if the same component is shown in different sizes, shapes, and values ​​in different drawings, this is merely an example; the same component can have the same size, shape, and values ​​across different drawings. Detailed Implementation

[0032] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the accompanying drawings. Regardless of the drawing numbers, the same or similar constituent elements will be given the same reference numerals, and repeated descriptions of them will be omitted. The suffixes "module" and "part" used for constituent elements in the following description are assigned or used interchangeably for the sake of simplicity in writing the specification, and do not necessarily have different meanings or functions. Furthermore, the accompanying drawings are provided to facilitate a clearer understanding of the embodiments disclosed in this specification, and the technical concepts disclosed in this specification are not limited by the drawings. Additionally, when an element such as a layer, region, or substrate 110 is described as existing "on" other constituent elements, this includes elements that can exist directly on other elements, or elements that have other intermediate elements between them.

[0033] The following discloses an organic light-emitting display device with a side-by-side structure fabricated using photolithography. This structure is called Ph-SbS (Side by side structure by photolithography). By utilizing photolithography, the use of a f-MM (fiber-modulated matrix) is eliminated, thus simplifying the process and reducing costs. Furthermore, the increased EAR (earth extensibility) within the sub-pixels improves lifetime. Moreover, the organic light-emitting elements are deposited on a large-area substrate in a tandem deposition system, thereby improving production efficiency, yield, and material utilization efficiency.

[0034] Hereinafter, the red subpixel SPr can be named the first subpixel, the green subpixel SPg can be named the second subpixel, and the blue subpixel SPb can be named the third subpixel. In addition, the red organic light-emitting element 120r can be named the first organic light-emitting element, the green organic light-emitting element 120g can be named the second organic light-emitting element, and the blue organic light-emitting element 120b can be named the third organic light-emitting element.

[0035] Hereinafter, the organic light-emitting display device 100 is an upper light-emitting method that emits light in the upper direction toward the substrate 110 and displays an image, but a lower light-emitting method that emits light in the lower direction toward the substrate 110 and displays an image may also be included in the technical concept of the present invention.

[0036] Hereinafter, without assigning separate reference numerals, the reference numerals for the auxiliary electrodes may be assigned... Figure 3 AC is shown.

[0037] Figure 1 To schematically illustrate a plan view of the organic light-emitting display device according to the first embodiment, Figure 2 To show Figure 1 A planar image of a single pixel.

[0038] Reference Figure 1 and Figure 2 The organic light-emitting display device 100 according to the first embodiment may include a plurality of pixels P arranged in a matrix. The plurality of pixels P may be located in a display area AA. The remaining area other than the display area AA may be a non-display area NAA.

[0039] For example, each pixel P may include a red subpixel SPr, a green subpixel SPg, and a blue subpixel SPb. For example, a red organic light-emitting element 120r may be configured in the red subpixel SPr, a green organic light-emitting element 120g may be configured in the green subpixel SPg, and a blue organic light-emitting element 120b may be configured in the blue subpixel SPb. Although the figure shows a pixel P including three subpixels SPr, SPg, and SPb, it may also include more subpixels.

[0040] Although the figure shows that the area of ​​the blue sub-pixel SPb is larger than the area of ​​the red sub-pixel SPr or the area of ​​the green sub-pixel SPg, other variations are also possible.

[0041] Each sub-pixel SPr, SPg, SPb may include a light-emitting region EA and a non-light-emitting region NEA. The light-emitting region EA may be the area of ​​the organic light-emitting elements 120r, 120g, 120b configured with each sub-pixel SPr, SPg, SPb, and the non-light-emitting region NEA may be the remaining area in each sub-pixel SPr, SPg, SPb other than the light-emitting region EA.

[0042] On one hand, in order to supply power to each sub-pixel SPr, SPg, SPb, a first power line PL1 and a second power line PL2 can be provided. A first power terminal 101 can be electrically connected to one end of the first power line PL1, and a second power terminal 102 can be electrically connected to one end of the second power line PL2. The first power terminal 101 and the second power terminal 102 can be electrically connected to a power supply unit (not shown) and receive a first potential voltage and a second potential voltage. The second potential voltage can be greater than the first potential voltage, and the first potential voltage can be grounded.

[0043] The first power line PL1 and the second power line PL2 can be arranged along the first direction X between the non-light-emitting areas NEA. The first power line PL1 and the second power line PL2 can be electrically connected to each sub-pixel SPr, SPg, SPb.

[0044] Contact plate 103 can be located in the non-light-emitting area NEA. The first power line PL1 can be electrically connected to contact plate 103.

[0045] Auxiliary electrode ( Figure 3 The auxiliary electrode AC can be located in the non-light-emitting region NEA. The auxiliary electrode AC can be located in the non-light-emitting region NEA along the second direction Y, but this is not a limitation.

[0046] The auxiliary electrode AC can be located in the non-light-emitting area NEA adjacent to each sub-pixel SPr, SPg, SPb. The auxiliary electrode AC can be electrically connected to the first power line PL1 via the contact plate 103.

[0047] The first power line PL1, contact plate 103, and auxiliary electrode AC can be configured on different layers.

[0048] The auxiliary electrode AC can be electrically connected to the cathode electrodes of the adjacent organic light-emitting elements 120r, 120g, and 120b of each adjacent sub-pixel SPr, SPg, and SPb. For example, if the auxiliary electrode AC is located between the red sub-pixel SPr and the green sub-pixel SPg, the auxiliary electrode AC can be electrically connected to the cathode electrodes of the red organic light-emitting element 120r and the green organic light-emitting element 120g.

[0049] Thus, the auxiliary electrode AC can provide the first potential voltage from the first power line PL1 to the cathode electrode of each organic light-emitting element 120r, 120g, 120b.

[0050] On the other hand, the second power supply line PL2 can be electrically connected to the driving circuit 106 of each sub-pixel SPr, SPg, SPb, for example, a driving transistor, but is not limited thereto. Thus, in response to a scan signal provided through a specific gate line and when a specific sub-pixel is selected, light with a brightness corresponding to the current flowing at the driving transistor of the specific sub-pixel can be emitted by the first potential voltage of the first power supply line PL1 and the second potential voltage of the second power supply line PL2.

[0051] Multiple organic light-emitting elements 120r, 120g, and 120b can be arranged in a strip shape along the second direction Y. That is, multiple organic light-emitting elements 120r, 120g, and 120b can be arranged continuously without separation along the second direction Y. For example, red organic light-emitting element 120r can be arranged continuously along the second direction Y, green organic light-emitting element 120g can be arranged continuously along the second direction Y, and blue organic light-emitting element 120b can be arranged continuously along the second direction Y.

[0052] As another example, multiple organic light-emitting elements 120r, 120g, and 120b can be separated along the second direction Y in pixel units or row line units. That is, the red organic light-emitting element 120r can be separated along the second direction Y in pixel units or row line units, the green organic light-emitting element 120g can be separated along the second direction Y in pixel units or row line units, and the blue organic light-emitting element 120b can be separated along the second direction Y in pixel units or row line units.

[0053] The red sub-pixel SPr, green sub-pixel SPg, and blue sub-pixel SPb can be arranged alternately along the first direction X in column units. That is, the red sub-pixel SPr, green sub-pixel SPg, and blue sub-pixel SPb, which have different colors, can be positioned sequentially along the first direction X to realize an organic light-emitting display device with a side-by-side structure.

[0054] On one hand, the asymmetric open-connect (AOC) structure 105 can be located in the non-light-emitting region NEA. In the embodiment, the asymmetric open-connect structure 105 may include a connecting structure 105A and an blocking structure 105B. Since the connecting structure 105A and the blocking structure 105B have different ratios of depth and gap at their respective undercut structures, it can be named the asymmetric open-connect structure 105. The depth refers to the width of the undercut structure in the horizontal direction, and the gap refers to the width of the undercut structure in the vertical direction.

[0055] As described below, the asymmetric blocking connection structure 105 prevents lateral leakage current between multiple sub-pixels SPr, SPg, and SPb. Lateral leakage current refers to the leakage current flowing along the first direction X between adjacent sub-pixels SPr, SPg, and SPb. Furthermore, the asymmetric blocking connection structure 105 prevents short circuits between the anode and cathode electrodes at the corresponding sub-pixels SPr, SPg, and SPb. Therefore, by utilizing the asymmetric blocking connection structure 105, color spots caused by leakage current can be improved, and luminous efficiency and brightness can be significantly enhanced.

[0056] The connection structure 105A can be a structure that electrically connects the auxiliary electrode AC to the cathode electrodes of each organic light-emitting element 120r, 120g, and 120b. The blocking structure 105B can be a structure that separates the layers of low-resistance organic light-emitting materials, such as hole injection layers and charge generation layers, of each organic light-emitting element 120r, 120g, and 120b, and prevents electrical short circuits between the anode and cathode electrodes, thereby reducing leakage current between sub-pixels. The asymmetric blocking connection structure 105 can also be referred to as a "paradoxical open-connect structure".

[0057] Figure 3 This is a circuit diagram illustrating an organic light-emitting display device according to an embodiment. Figure 3 It can be the corresponding Figure 2 The circuit diagram shows the electrical connections from the first power terminal 101 and the second power terminal 102 to the green sub-pixel SPg. Figure 2 The circuit diagram shown can also be applied to the circuit diagram corresponding to the electrical connections from the first power terminal 101 and the second power terminal 102 to the red sub-pixel SPr or the blue sub-pixel SPb.

[0058] like Figure 3 As shown, the first power terminal 101 and the second power terminal 102 can be configured in the non-display area NAA, and the first power line PL1 and the second power line PL2 can be configured in the non-display area NAA and the display area AA.

[0059] Contact plate 103 can be configured in the non-light-emitting area NEA and electrically connected to the first power line PL1. The first power line PL1 can be electrically connected to the auxiliary electrode AC through contact plate 103.

[0060] The organic light-emitting element 120g can be disposed in the light-emitting region EA of the sub-pixel SPg, and the connecting structure 105A and the blocking structure 105B can be disposed in the non-light-emitting region NEA. Through the connecting structure 105A and the blocking structure 105B, a configuration can be formed... Figure 2The asymmetric blocking connection structure 105 is shown. The auxiliary electrode AC can be electrically connected to the cathode electrode 123g of the organic light-emitting element 120g through the connection structure 105A. The hole injection layer of the organic light-emitting element 120g can be disconnected through the blocking structure 105B, and the anode electrode 121g and the cathode electrode 123g can be electrically disconnected.

[0061] On the other hand, such as Figure 3 As shown in the embodiment, the auxiliary electrode AC can be electrically connected to the first power line PL1 via the bridging electrode 150.

[0062] In this case, three current paths can be formed between the auxiliary electrode AC and the first power line PL3. In the first current path, the auxiliary electrode AC can be directly electrically connected to the first power line PL. In the second current path, the auxiliary electrode AC can be electrically connected to the first power line PL1 via the contact plate 103. In the third current path, the auxiliary electrode AC can be electrically connected to the first power line PL1 via the bridging electrode 150.

[0063] The first, second, and third current paths can be connected in parallel between the auxiliary electrode AC and the first power supply line PL. Therefore, the individual resistances of the three parallel current paths are calculated together, significantly reducing the total resistance between the auxiliary electrode AC and the first power supply line PL.

[0064] On the one hand, such as Figure 3 As shown, various resistances can be formed between the constituent elements. Each resistance can be defined as follows.

[0065] R1: Connection resistance between contact plate 103 and auxiliary electrode AC R2: Resistance between auxiliary electrode AC and cathode electrode 123g R3: Resistance between auxiliary electrode AC and bridging electrode 150 R4: Resistance between the anode electrode 121g and the cathode electrode 123g caused by factors such as the horizontally arranged hole injection layer. R5: Resistance between the anode electrode 121g and the cathode electrode 123g caused by multiple organic light-emitting layers arranged vertically. R6: Resistor between power line PL1 and contact plate 103 R7: Resistor between power line PL1 and auxiliary electrode AC R8: Resistor between bridging electrode 150 and first power line PL1 In the aforementioned resistors, since the hole injection layer forming the fourth resistor R4 is composed of a low-resistance organic light-emitting material, leakage current can easily flow through the hole injection layer. When leakage current flows through the hole injection layer, a short circuit occurs between the anode electrode 121g and the cathode electrode 123g. This may result in light not being emitted from the corresponding sub-pixels SPr, SPg, and SPb, or the light intensity being far lower than the desired intensity.

[0066] In the embodiment, the hole injection layer corresponding to the blocking structure 105B is disconnected by the blocking structure 105B, thereby blocking the leakage current flowing to the hole injection layer, etc.

[0067] In the embodiment, the cathode electrode 123g can be easily connected to the auxiliary electrode AC through the connection structure 105A, and the deposition area of ​​the organic light-emitting element 120g can be maximized, thereby improving the luminous efficiency.

[0068] Figure 4a In order to be in Figure 2 A cross-sectional view taken from the pixels along line A-A'. Figure 4b In order to be in Figure 2 A cross-sectional view taken from the pixels along the B-B' line. Figure 4c In order to be in Figure 2 A cross-sectional view taken along the C-C' line from the pixels.

[0069] Reference Figure 1 , Figure 2 as well as Figures 4a to 4c The organic light-emitting display device according to the embodiment may include a plurality of dikes 111-1, 111-2, a plurality of protrusions 130-1, 130-2, and a plurality of organic light-emitting elements 120r, 120g, 120b, etc.

[0070] Multiple dams 111-1, 111-2, multiple protrusions 130-1, 130-2, and multiple organic light-emitting elements 120r, 120g, 120b can be disposed on substrate 110. The multiple dams 111-1, 111-2, multiple protrusions 130-1, 130-2, and / or multiple organic light-emitting elements 120r, 120g, 120b can be respectively arranged in a strip shape along the second direction Y on substrate 110. In this case, sub-pixels of the same color can be arranged along the second direction Y. For example, multiple red sub-pixels SPr can be arranged in a strip shape along the second direction Y. Dams 111-1, 111-2 can contain inorganic or organic materials. For example, dams 111-1, 111-2 can contain inorganic materials such as SiNx, SiON, etc.

[0071] On the other hand, such as Figure 4cAs shown, the transverse embankment 111-3 can be arranged in rows along the second direction Y. In contrast, the protrusion may not be arranged in rows along the second direction Y. That is, the protrusion may not be arranged on the transverse embankment 111-3 along the second direction Y.

[0072] To distinguish them from the transverse dike 111-3, the first dike 111-1 and the second dike 111-2 can be referred to as longitudinal dikes.

[0073] Multiple sub-pixels SPr, SPg, and SPb can be separated from each other by multiple dikes 111-1 and 111-2. The first dike 111-1 can be configured between the red sub-pixel SPr and the green sub-pixel SPg, and the second dike 111-2 can be configured between the green sub-pixel SPg and the blue sub-pixel SPb. Although not shown, the third dike can be configured between the blue sub-pixel SPb and another red sub-pixel SPr.

[0074] Multiple organic light-emitting elements 120r, 120g, and 120b can be spatially separated and electrically disconnected from each other through multiple dikes 111-1 and 111-2. As a result, the lateral leakage current between multiple sub-pixels SPr, SPg, and SPb is blocked, thereby improving the color speckle and increasing luminous efficiency and brightness.

[0075] The red organic light-emitting element 120r can be configured in the red sub-pixel SPr, the green organic light-emitting element 120g can be configured in the green sub-pixel SPg, and the blue organic light-emitting element 120b can be configured in the blue sub-pixel SPb.

[0076] Multiple dikes 111-1 and 111-2 can have a grid pattern. For example, dikes 111-1 and 111-2 can be arranged around sub-pixels SPr, SPg, and SPb. That is, multiple dikes 111-1 and 111-2 can be arranged between adjacent sub-pixels SPr, SPg, and SPb along a first direction X, and between adjacent sub-pixels SPr, SPg, and SPb along a second direction Y. In this case, sub-pixels SPr, SPg, and SPb adjacent along the first direction X can have different colors from each other, while sub-pixels SPr, SPg, and SPb adjacent along the second direction Y can have the same color from each other.

[0077] Multiple organic light-emitting elements 120r, 120g, and 120b can be separated from each other by multiple dikes 111-1 and 111-2. The multiple dikes 111-1 and 111-2 can be configured to distinguish the multiple organic light-emitting elements 120r, 120g, and 120b. The red organic light-emitting element 120r and the green organic light-emitting element 120g can be separated by the first dike 111-1, and the green organic light-emitting element 120g and the blue organic light-emitting element 120b can be separated by the second dike 111-2.

[0078] On one hand, the organic light-emitting display device according to the embodiment may include a blocking structure 105B in the edge region of each of the plurality of dikes 111-1, 111-2. For example, the blocking structure 105B may be disposed in the lower edge region of each of the plurality of dikes 111-1, 111-2, but this is not limited.

[0079] The blocking structure 105B can be disposed along the first direction X in the edge regions of the dikes 111-1 and 111-2 between sub-pixels SPr, SPg, and SPb. The blocking structure 105B can also be disposed along the second direction Y in the edge regions of the dikes 111-1 and 111-2 between sub-pixels SPr, SPg, and SPb.

[0080] When organic light-emitting elements 120r, 120g, and 120b are deposited on dikes 111-1 and 111-2, portions of the organic light-emitting elements 120r, 120g, and 120b can be disconnected by the blocking structure 105B. For example, the blocking structure 105B can disconnect the low-resistance layers of each organic light-emitting element 120r, 120g, and 120b. Low-resistance layers may include, for example, hole injection layers, charge generation layers, etc. A low-resistance layer can refer to a layer having a resistance value lower than that of high-resistance layers, such as organic light-emitting layers, electron transport layers, and electron injection layers.

[0081] For example, the organic light-emitting layers 122r, 122g, and 122b of each organic light-emitting element 120r, 120g, and 120b can have separation structures 125-1 to 125-3 corresponding to the blocking structure 105B. Separation structures 125-1 to 125-3 can refer to shapes where a portion of the organic light-emitting layers 122r, 122g, and 122b is broken. Therefore, in separation structures 125-1 to 125-3, for example, hole injection layers, charge generation layers, etc., can be broken.

[0082] The blocking structure 105B may include at least one blocking layer 113 recessed inward from the sides of the dikes 111-1 and 111-2. Undercut structures may be formed in the edge regions of the dikes 111-1 and 111-2 through the blocking layer 113. The blocking layer 113 may contain silicon-based inorganic materials, aluminum (Al), molybdenum (Mo), and molybdenum alloys, but is not limited thereto.

[0083] As described above, when organic light-emitting elements 120r, 120g, and 120b are deposited on dikes 111-1 and 111-2 with undercut structures, the partial layers in the organic light-emitting layers 122r, 122g, and 122b of the organic light-emitting elements 120r, 120g, and 120b corresponding to the undercut structure, namely the hole injection layer and the charge generation layer, can be disconnected.

[0084] On the other hand, as mentioned above, organic light-emitting elements 120r, 120g, and 120b corresponding to each sub-pixel SPr, SPg, and SPb can be configured.

[0085] The red organic light-emitting element 120r may include an anode electrode 121r, a red organic light-emitting layer 122r, and a cathode electrode 123r. The red organic light-emitting layer 122r may be disposed on the anode electrode 121r, and the cathode electrode 123r may be disposed on the red organic light-emitting layer 122r. The green organic light-emitting element 120g may include an anode electrode 121g, a green organic light-emitting layer 122g, and a cathode electrode 123g. The green organic light-emitting layer 122g may be disposed on the anode electrode 121g, and the cathode electrode 123g may be disposed on the green organic light-emitting layer 122g. The blue organic light-emitting element 120b may include an anode electrode 121b, a blue organic light-emitting layer 122b, and a cathode electrode 123b. The blue organic light-emitting layer 122b may be disposed on the anode electrode 121b, and the cathode electrode 123b may be disposed on the blue organic light-emitting layer 122b.

[0086] The anode electrodes 121r, 121g, and 121b may include multiple conductive layers. The anode electrodes 121r, 121g, and 121b may have a triple structure composed of ITO / Ag alloy / ITO. The anode electrodes 121r, 121g, and 121b may also have a triple structure composed of ITO / Ag alloy / (Ti, Mo, or MoTi).

[0087] One end of the anode electrodes 121r, 121g, and 121b can be positioned below the embankments 111-1 and 111-2. That is, one end of the embankments 111-1 and 111-2 can be positioned on one end of the anode electrodes 121r, 121g, and 121b. One end of the anode electrodes 121r, 121g, and 121b can overlap perpendicularly with the embankments 111-1 and 111-2.

[0088] The red organic light-emitting layer 122r, the green organic light-emitting layer 122g, and the blue organic light-emitting layer 122b may include at least a hole injection layer, which includes a low-resistance organic light-emitting material.

[0089] On one hand, one end of the hole injection layer and / or charge generation layer can be connected to the cathode electrodes 123r, 123g, and 123b. Furthermore, the lower surface of the hole injection layer can be connected to the anode electrodes 121r, 121g, and 121b. In this case, due to the low resistance of the hole injection layer, leakage current may flow between the anode electrodes 121r, 121g, and 121b and the cathode electrodes 123r, 123g, and 123b, potentially causing a short circuit between them.

[0090] However, according to the embodiment, the hole injection layer and / or charge generation layer are disconnected by the blocking structure 105B disposed in the edge region of the dikes 111-1, 111-2, and the anode electrodes 121r, 121g, 121b and the cathode electrodes 123r, 123g, 123b can be electrically disconnected, thereby preventing electrical short circuits.

[0091] On the other hand, the organic light-emitting display device according to the embodiment may include a plurality of protrusions 130-1, 130-2.

[0092] Multiple organic light-emitting elements 120r, 120g, and 120b can be spatially separated and electrically disconnected from each other through multiple protrusions 130-1 and 130-2. As a result, lateral leakage current is blocked between the multiple sub-pixels SPr, SPg, and SPb, thereby improving the color speckle and increasing luminous efficiency and brightness.

[0093] Multiple protrusions 130-1 and 130-2 can be disposed on the upper side of multiple dikes 111-1 and 111-2. A first protrusion 130-1 can be disposed on the upper side of the first dike 111-1 between a red sub-pixel SPr and a green sub-pixel SPg. A second protrusion 130-2 can be disposed on the upper side of the second dike 111-2 between a green sub-pixel SPg and a blue sub-pixel SPb.

[0094] The left and right sides of protrusions 130-1 and 130-2 may have shapes that are symmetrical with respect to the central normal of protrusions 130-1 and 130-2, but this is not limited. For example, the left and right sides of protrusions 130-1 and 130-2 may each have an undercut structure. In this case, the undercut structures on the left and right sides may have shapes that are symmetrical with respect to the central normal of protrusions 130-1 and 130-2.

[0095] The protrusions 130-1 and 130-2 may have a connection structure 105A including an auxiliary electrode AC electrically connected to the cathode electrodes 123r, 123g, and 123b.

[0096] The protrusions 130-1 and 130-2 may include a first layer 131 and a second layer 132 on the first layer 131.

[0097] The side portion of the first layer 131 can be recessed into the inside of the protrusion from the side portion of the second layer 132. Thus, an undercut structure can be formed on the side portion of the protrusion using the first layer 131 and the second layer 132. The undercut structure can have a cavity shape. For example, the undercut structure can have a U-shaped cavity. Therefore, the undercut structure can be referred to as a cavity, a U-shaped cavity, or a cavity portion, etc. To form the undercut structure, the first layer 131 and the second layer 132 can have different etching selectivity. For example, the first layer 131 can contain a material with a fast etching rate, and the second layer 132 can contain a material with a slow etching rate. Therefore, after the photosensitive pattern is formed on the second layer 132, when the first layer 131 and the second layer 132 are etched, the side portion of the first layer 131 is etched faster than the side portion of the second layer 132, thereby forming an undercut structure on the side portion of the protrusions 130-1 and 130-2.

[0098] At least one of the first layer 131 or the second layer 132 may contain a metal or a conductive oxide material with excellent electrical conductivity. As the metal, titanium (Ti), molybdenum (Mo), molybdenum-titanium (MoTi), aluminum (Al), copper (Cu), and their alloys may be used. The conductive oxide material may include ITO, IZO, etc.

[0099] On the other hand, by adjusting the target-source distance of the evaporation source (or evaporation source device), the deposition material can be deposited on the substrate 110 at different deposition angles. The target-source distance can be the distance between the evaporation source and the substrate 110. The deposition angle can be the angle between the evaporation source relative to the normal direction and the imaginary line between the lower edge 132a of the second layer 132. For example, the larger the target-source distance, the smaller the deposition angle can be. The smaller the deposition angle, the closer the layer formed by the deposition material can be deposited to the adjacent sub-pixels. The larger the deposition angle, the closer the corresponding layer can be deposited to the protrusions 130-1, 130-2.

[0100] like Figure 4a , Figure 4b as well as Figure 4c As shown, the deposition materials are deposited at different deposition angles, so that one end of the organic light-emitting layers 122r, 122g, 122b and one end of the first conductive layer 123-1 of the cathode electrodes 123r, 123g, 123b can be located at different locations.

[0101] The cathode electrodes 123r, 123g, and 123b may include multiple conductive layers 123-1 and 123-2. For example, the cathode electrodes 123r, 123g, and 123b may include a first conductive layer 123-1 and a second conductive layer 123-2 on the first conductive layer 123-1, but may also include three or more conductive layers.

[0102] One end of the organic light-emitting layers 122r, 122g, and 122b and one end of the first conductive layer 123-1 can be located on the upper side of the dikes 111-1 and 111-2. For example, one end of the organic light-emitting layers 122r, 122g, and 122b can be located closer to the first layer 131 than one end of the first conductive layer 123-1.

[0103] The second conductive layer 123-2 can be disposed on the entire area of ​​the substrate 110. The second conductive layer 123-2 can be deposited using a sputtering process. That is, the second conductive layer 123-2 can be disposed on the upper side of the first conductive layer 123-1, the upper side of the embankments 111-1 and 111-2, and the sides and upper side of the protrusions 130-1 and 130-2 of each sub-pixel SPr, SPg, and SPb. The second conductive layer 123-2 can be connected to the side of the first layer 131 and / or the lower side of the second layer 132.

[0104] For example, the first conductive layer 123-1 may contain a metal with excellent electrical conductivity, and the second conductive layer 123-2 may contain a conductive oxide material. For example, the first conductive layer 123-1 may contain a Mg:Ag alloy, and the second conductive layer 123-2 may contain ITO, IZO, etc.

[0105] By utilizing an evaporation source for deposition, a first conductive layer 123-1 can be formed from Mg:Ag alloy. However, Mg:Ag has poor step coverage characteristics, making it difficult for the deposited material containing Mg:Ag alloy to be deposited deep within the undercut structure of the connection structure 105A. Furthermore, if the uniformity of the film thickness of the first conductive layer 123-1 containing Mg:Ag alloy is insufficient or the process margin is inadequate, the first conductive layer 123-1 may not be electrically connected to the auxiliary electrode AC included in the connection structure 105A, resulting in poor electrical connection.

[0106] To address this issue, a conductive oxide material such as ITO, which exhibits excellent step coverage, is deposited onto the substrate 110 using a sputtering process, allowing deposition deep within the undercut structure of the connection structure 105A. This enables the second conductive layer 123-2 to be stably deposited on the side of the first layer 131, which serves as the auxiliary electrode AC, thereby preventing poor electrical connection between the cathode electrodes 123r, 123g, and 123b, including the first and second conductive layers 123-1 and 123-2, and the auxiliary electrode AC. Furthermore, this ensures uniformity in the conductive layer thickness and improves the stability of production quality.

[0107] When the second conductive layer 123-2 is formed on the first conductive layer 123-1, there is no need to adjust or manage the deposition angle to deposit the first conductive layer 123-1 using the evaporation source. Furthermore, not only the organic light-emitting layers 122r, 122g, and 122b using the evaporation source, but also the organic light-emitting layers 122r, 122g, and 122b can be deposited on the corresponding sub-pixels SPr, SPg, and SPb, even when the first conductive layer 123-1 is freely deposited without being restricted by the deposition angle. The cathode electrodes 123r, 123g, and 123b can be stably connected to the auxiliary electrodes AC of the protrusions 130-1 and 130-2 through the second conductive layer 123-2. Therefore, when configured as a combination of the aforementioned connection structure 105A and blocking structure 105B, production efficiency and material utilization efficiency can be improved through a more flexible deposition process.

[0108] Furthermore, when an organic light-emitting display device is implemented using an upper light-emitting method, the light-emitting efficiency can be improved by using cathode electrodes 123r, 123g, and 123b, which include a first conductive layer 123-1 containing an Ag:Mg alloy, and anode electrodes 121r, 121g, and 121b containing a semi-permeable material, and by utilizing the reinforcing interference between the anode electrodes 121r, 121g, and 121b and the cathode electrodes 123r, 123g, and 123b.

[0109] On the other hand, protrusions 130-1 and 130-2 may include a fourth layer 134 on the second layer 132. The fourth layer 134 may also be omitted. The fourth layer 134 may contain inorganic materials such as SiO2, SiNx, and SiONx. The fourth layer 134 may contain conductive oxide materials such as ITO. The fourth layer 134 may act as a stopper for the second layer 132. As mentioned above, in order to form a side-by-side structure, the red sub-pixel SPr, the green sub-pixel SPg, and the blue sub-pixel SPb may each be etched twice. At this time, when these two etchings are performed, the area or thickness of the second layer 132 may change. In this case, the deposition angle determined by the lower edge 132a of the second layer 132 becomes different, and the deposition area at each sub-pixel SPr, SPg, and SPb becomes different, ultimately leading to a problem of reduced image quality.

[0110] To address the aforementioned issues, when the fourth layer 134, which acts as a barrier, is formed on the second layer 132, even if two etching processes are performed, the etching of the second layer 132 can be suppressed or prevented by the fourth layer 134, and the deposition angle determined by the lower edge 132a of the second layer 132 can be fixed. Therefore, the deposition area at each sub-pixel SPr, SPg, and SPb can be ensured to be the target area, thereby improving image quality.

[0111] Although not illustrated, the third layer can be positioned below the first layer 131, but this is not a limitation. The third layer may contain a material with a slow etch rate. The third layer may contain a metal or conductive oxide material with excellent electrical conductivity. The third layer may contain an inorganic material with a high etch rate.

[0112] If the third layer contains a metal or a conductive oxide material, the third layer can be an auxiliary electrode AC.

[0113] The etching rate of the third layer can be the same as or slower than that of the second layer 132. When the second and third layers are etched simultaneously, since the etching rate of the third layer is the same as or slower than that of the second layer 132, the side of the third layer can be located on the same vertical line as the side of the second layer 132, or it can be configured to extend further from the side of the second layer 132 toward the adjacent sub-pixel.

[0114] On one hand, the organic light-emitting display device according to the embodiment may include an encapsulation layer 135. The encapsulation layer 135 may be a barrier layer to prevent moisture and other substances from penetrating into the organic light-emitting elements 120r, 120g, and 120b.

[0115] On the other hand, the organic light-emitting display device according to the embodiment may include a plurality of color filter layers 140r, 140g, 140b and a plurality of encapsulation layers 141r, 141g, 141b.

[0116] Multiple color filter layers 140r, 140g, and 140b may contain resin materials. Multiple encapsulation layers 141r, 141g, and 141b may include multiple layers. Some layers of the multiple layers may contain inorganic materials, while the remaining layers may contain organic materials.

[0117] The red color filter layer 140r can be configured on the red sub-pixel SPr. The red color filter layer 140r can be configured on the red organic light-emitting element 120r at the red sub-pixel SPr, so that only the target red wavelength corresponding to the red wavelength already set on the red color filter layer 140r is emitted from the red light emitted from the red organic light-emitting element 120r.

[0118] The green color filter layer 140g can be configured on the green sub-pixel SPg. The green color filter layer 140g can be configured on the green organic light-emitting element 120g at the green sub-pixel SPg, so that only the green light corresponding to the target green wavelength band set on the green color filter layer 140g is emitted from the green light emitted from the green organic light-emitting element 120g.

[0119] The blue color filter layer 140b can be configured on the blue sub-pixel SPb. The blue color filter layer 140b can be configured on the blue organic light-emitting element 120b at the blue sub-pixel SPb, so that only the blue light corresponding to the target blue wavelength band set in the blue color filter layer 140b is emitted from the blue organic light-emitting element 120b.

[0120] Multiple color filter layers 140r, 140g, and 140b can have a color filtering function that emits only colored light in the separately set wavelength bands.

[0121] As described above, compared to the absence of color filter layers, multiple color filter layers 140r, 140g, and 140b can further improve the color purity of each color, especially in organic light-emitting display devices with an upper light-emitting structure, where they play a role in improving the change of color purity with viewing angle. Currently, a polarizing plate is attached to remove external light incident and reflected light through the reflective material of the anode electrodes 121r, 121g, and 121b. However, the most important function of multiple color filter layers 140r, 140g, and 140b is that they not only absorb external light and improve the brightness-to-dark ratio, but also, more importantly, eliminate the need for a polarizing plate, thus contributing to cost savings.

[0122] On the one hand, multiple color filter layers 140r, 140g, and 140b can have the function of photosensitive patterns to form patterns for each encapsulation layer 135, cathode electrodes 123r, 123g, and 123b, and organic light-emitting layers 122r, 122g, and 122b.

[0123] like Figure 4a As shown, the encapsulation layer 135, cathode electrode 123r, and red organic light-emitting layer 122r are etched using a red color filter layer 140r, so that they can be formed only on the red sub-pixel SPr. In this case, one end of the encapsulation layer 135, one end of the cathode electrode 123r, and one end of the red organic light-emitting layer 122r can be located on the same vertical line or diagonal line on the first protrusion 130-1.

[0124] like Figure 4b As shown, the green color filter layer 140g is used to etch the encapsulation layer 135, the cathode electrode 123g, and the green organic light-emitting layer 122g, so that they can be formed only on the green sub-pixel SPg. In this case, one end of the encapsulation layer 135, one end of the cathode electrode 123g, and one end of the green organic light-emitting layer 122g can be located on the same vertical line or diagonal line on the first protrusion 130-1.

[0125] like Figure 4c As shown, the encapsulation layer 135, cathode electrode 123b, and blue organic light-emitting layer 122b are etched using the blue color filter layer 140b, so that they can be formed only on the blue sub-pixel SPb. In this case, one end of the encapsulation layer 135, one end of the cathode electrode 123b, and one end of the blue organic light-emitting layer 122b can be located on the same vertical line or diagonal line on the first protrusion 130-1.

[0126] As an example, the organic light-emitting element 120b, the green organic light-emitting element 120g, and the red organic light-emitting element 120r can be formed in that order, but this is not a limitation.

[0127] On the one hand, the encapsulation layers 141r, 141g, and 141b may include multiple layers containing organic or inorganic materials.

[0128] Encapsulation layers 141r, 141g, and 141b protect multiple color filter layers 140r, 140g, and 140b, composed of resin material, from etching. For example, a blue encapsulation layer 141b is formed on a patterned blue color filter layer 140b for a blue organic light-emitting element 120b, thus preventing the blue color filter layer 140b from etching during the etching of the green organic light-emitting element 120g. Similarly, a green encapsulation layer 141g is formed on a patterned green color filter layer 140g for a green organic light-emitting element 120g, thus preventing the green color filter layer 140g from etching during the etching of the red organic light-emitting element 120r. Therefore, the red encapsulation layer 141r, the green encapsulation layer 141g, and the blue encapsulation layer 141b act as stoppers to prevent etching.

[0129] On the other hand, the multiple color filter layers 140r, 140g, and 140b can each contain a light scattering agent or a light diffusing agent. Through the light scattering agent or light diffusing agent, light is scattered or diffused, thereby improving luminous efficiency.

[0130] On the one hand, the red encapsulation layer 141r, the green encapsulation layer 141g, and the blue encapsulation layer 141b may each include multiple layers containing inorganic and organic materials.

[0131] The red encapsulation layer 141r can be configured on the red color filter layer 140r, the green encapsulation layer 141g can be configured on the green color filter layer 140g, and the blue encapsulation layer 141b can be configured on the blue color filter layer 140b.

[0132] The red encapsulation layer 141r, green encapsulation layer 141g, and blue encapsulation layer 141b may each include at least one layer. For example, the red encapsulation layer 141r, green encapsulation layer 141g, and blue encapsulation layer 141b may each include a first inorganic layer, an organic layer on the first inorganic layer, and a second inorganic layer on the organic layer, etc., but this is not limited. The first inorganic layer and the second inorganic layer may contain inorganic materials such as SiNx, and the organic layer may contain resin materials, but this is not limited.

[0133] According to an embodiment, in order to manufacture an organic light-emitting display device with a side-by-side structure, a plurality of sub-pixels SPr, SPg, and SPb can be formed sequentially. For example, a blue organic light-emitting element 120b, a blue color filter layer 140b, and a blue encapsulation layer 141b can be formed and patterned on the entire area of ​​the substrate 110 using a photolithography process, thereby forming a blue sub-pixel SPb. Then, a green organic light-emitting element 120g, a green color filter layer 140g, and a green encapsulation layer 141g can be formed and patterned on the entire area of ​​the substrate 110 using a photolithography process, thereby forming a green sub-pixel SPg. Then, a red organic light-emitting element 120r, a red color filter layer 140r, and a red encapsulation layer 141r can be formed and patterned on the entire area of ​​the substrate 110 using a photolithography process, thereby forming a red sub-pixel SPr.

[0134] On the other hand, the first embodiment ( Figure 1 and Figure 2 In the design, the red organic light-emitting element 120r, the green organic light-emitting element 120g, and the blue organic light-emitting element 120b can be arranged in a strip along the second direction Y.

[0135] In contrast, although not illustrated, the red organic light-emitting element 120r, the green organic light-emitting element 120g, and the blue organic light-emitting element 120b can be arranged in a dotted pattern, spaced apart from each other. The red organic light-emitting element 120r can be arranged in the red sub-pixel SPr, the green organic light-emitting element 120g can be arranged in the green sub-pixel SPg, and the blue organic light-emitting element 120b can be arranged in the blue sub-pixel SPb. A pixel P can be formed by the red organic light-emitting element 120r, the green organic light-emitting element 120g, and the blue organic light-emitting element 120b.

[0136] For example, the red organic light-emitting element 120r and the green organic light-emitting element 120g can each be broken along the second direction Y by one row line unit. For example, the blue organic light-emitting element 120b can be broken along the second direction Y by two row line units.

[0137] For example, the area of ​​the blue organic light-emitting element 120b can be larger than the area of ​​the red organic light-emitting element 120r or the red organic light-emitting element 120g. The length of the blue organic light-emitting element 120b along the second direction Y can be similar to the sum of the width of the red organic light-emitting element 120r and the width of the green organic light-emitting element 120g, but this is not limited.

[0138] In a pixel structure in which red organic light-emitting element 120r, green organic light-emitting element 120g, and blue organic light-emitting element 120b are arranged in a dot-like pattern, there may be no connection structure between adjacent sub-pixels along the first direction X. Figure 4a(105A), but each sub-pixel SPr, SPg, SPb along the second direction Y can have an asymmetric blocking connection structure 105 at at least two or more corners, namely connection structure 105A and blocking structure 105B.

[0139] Figure 5 A cross-sectional view of the organic light-emitting display device according to the first embodiment is shown. Although Figure 5 It shows Figures 4a to 4c The first dike 111-1 and the first protrusion 130-1, but the second dike 111-2 can also have and Figure 5 It has the same structure or shape as the first dike 111-1 shown. Figure 5 Other constituent elements not shown in the diagram may also be combined with Figures 4a to 4c The corresponding constituent elements shown are similarly shown in Figure 5 .

[0140] Reference Figure 5 The organic light-emitting display device according to the first embodiment may include a first dam 111-1, a first protrusion 130-1, a red organic light-emitting element 120r, a green organic light-emitting element 120g, a blocking structure 105B, an encapsulation layer 135, a red color filter layer 140r, a red encapsulation layer 141r, a green color filter layer 140g, and a green encapsulation layer 141g, etc.

[0141] The first dike 111-1, the blocking structure 105B, the red color filter layer 140r, the red encapsulation layer 141r, the green color filter layer 140g, and the green encapsulation layer 141g have been... Figures 4a to 4c The explanation is in the text, therefore detailed instructions are omitted.

[0142] The first protrusion 130-1 can be disposed on the first embankment 111-1. The red sub-pixel SPr and the green sub-pixel SPg can be distinguished by the first embankment 111-1 and / or the first protrusion 130-1. The red organic light-emitting element 120r can be disposed on the red sub-pixel SPr, and the green organic light-emitting element 120g can be disposed on the green sub-pixel SPg.

[0143] The red organic light-emitting element 120r may include an anode electrode, a red organic light-emitting layer 122r, a cathode electrode 123r, etc. The green organic light-emitting element 120g may include an anode electrode, a green organic light-emitting layer 122g, a cathode electrode 123g, etc.

[0144] The red organic light-emitting layer 122r of the red organic light-emitting element 120r and / or the green organic light-emitting layer 122g of the green organic light-emitting element 120g can be configured to be spaced from the first protrusion 130-1.

[0145] The cathode electrode 123r of the red organic light-emitting element 120r and the cathode electrode 123g of the green organic light-emitting element 120g can be electrically connected to the first protrusion 130-1.

[0146] The encapsulation layer 135 can be disposed on the red organic light-emitting element 120r, the green organic light-emitting element 120g, and the first protrusion 130-1. The encapsulation layer 135 can block the penetration of moisture and other substances into the red organic light-emitting element 120r and the green organic light-emitting element 120g.

[0147] The encapsulation layer 135 may include multiple insulating layers 135-1 and 135-2, but is not limited thereto. For example, the encapsulation layer 135 may include a first insulating layer 135-1 and a first insulating layer 135-2 on the first insulating layer 135-1. For example, the first insulating layer 135-1 may be an inorganic layer containing SiO2 or the like, and the first insulating layer 135-2 may be an inorganic layer containing SiNx or the like, but is not limited thereto.

[0148] like Figure 5 As shown, the first insulating layer 135-1 can also be disposed inside the undercut structure 151 of the connecting structure 105A. That is, the first insulating layer 135-1 can be disposed on the side of the first layer 131, the underside of the second layer 132, etc. The first insulating layer 135-2 may not be disposed inside the undercut structure 151 of the connecting structure 105A, but this is not a limitation.

[0149] The first protrusion 130-1 may include a connection structure 105A containing an auxiliary electrode AC. For example... Figure 3 As shown, the auxiliary electrode AC can be electrically connected to the first power line PL1 via the contact plate 103 or directly.

[0150] The first protrusion 130-1 may include a first layer 131, a second layer 132, a third layer 133, and a fourth layer 134. For example, the second layer 132 may be disposed on the first layer 131, the third layer 133 may be disposed below the first layer 131, and the fourth layer 134 may be disposed on the second layer 132. The third layer 133 and / or the fourth layer 134 may be omitted.

[0151] At least one of the first layer 131, the second layer 132, or the third layer 133 can be an auxiliary electrode AC. Therefore, the cathode electrode 123r of the red organic light-emitting element 120r and the cathode electrode 123g of the green organic light-emitting element 120g can be electrically connected to at least one of the first layer 131, the second layer 132, or the third layer 133.

[0152] Layer 131, Layer 232, and Layer 33 can have different etch selectivity ratios. For example, the etch rate of Layer 131 can be greater than that of Layer 232 or Layer 33. When Layer 131, Layer 232, and Layer 33 are etched, the side portion of Layer 131 is etched the fastest, thereby forming an undercut structure 151. That is, the side portion of Layer 131 can be recessed from the side portion of Layer 232 or Layer 23 toward the inside of the first protrusion 130-1, thereby forming an undercut structure 151. The side portion of Layer 33 can be located on the same line or diagonally as the side portion of Layer 232, or extend from the side portion of Layer 232 toward the sub-pixels SPr and SPg. When performing a deposition process using an evaporation source through an undercut structure 151 of a connection structure 105A, the red organic light-emitting layer 122r and the green organic light-emitting layer 122g can be configured to be spaced apart from the first protrusion 130-1, while the cathode electrodes 123r and 123g can be electrically connected to the auxiliary electrode AC.

[0153] On one hand, the first protrusion 130-1 may include a bridging structure 105C. The bridging structure 105C may be disposed on the connecting structure 105A or the auxiliary electrode AC.

[0154] The bridging structure 105C may include bridging electrodes 150. For example... Figure 3 As shown, the bridging electrode 150 can be electrically connected to the first power line PL1. In this case, the second bridging electrode 150-2 of the bridging electrode 150 can be arranged in the non-light-emitting region along the second direction Y, but this is not limited.

[0155] The bridging electrode 150 may include a first bridging electrode 150-1 and a second bridging electrode 150-2.

[0156] For electrical connection to the first bridging electrode 150-1, a second bridging electrode 150-2 can be disposed on the first bridging electrode 150-1. For example, the second bridging electrode 150-2 can be electrically connected to the first bridging electrode 150-1 through a red encapsulation layer 141r or a green encapsulation layer 141g. For example, the red encapsulation layer 141r can be disposed on a portion of the upper side of the first bridging electrode 150-1, and the green encapsulation layer 141g can be disposed on another portion of the upper side of the first bridging electrode 150-1. The red encapsulation layer 141r and the green encapsulation layer 141g can be spaced apart on the upper side of the first bridging electrode 150-1, thereby exposing the first bridging electrode 150-1. Thus, the second bridging electrode 150-2 can be connected to the exposed upper side of the first bridging electrode 150-1.

[0157] The first bridging electrode 150-1 may contain a material with excellent electrical conductivity or strong etching resistance. For example, the first bridging electrode 150-1 may contain a conductive oxide material such as ITO, or a metal such as copper (Cu).

[0158] The second bridging electrode 150-2 may contain a metal with excellent conductivity or a low-resistance metal. For example, the second bridging electrode 150-2 may contain metals such as aluminum (Al), titanium (Ti), copper (Cu), molybdenum-titanium (MoTi), and their alloys. The first bridging electrode 150-1 and the second bridging electrode 150-2 may contain the same metal, but this is not limited.

[0159] The first bridging electrode 150-1 can be a connecting electrode for connecting the auxiliary electrode AC to the second bridging electrode 150-2. Thus, the second bridging electrode 150-2 can be electrically connected to the cathode electrodes 123r and 123g via the first bridging electrode 150-1 and the auxiliary electrode AC.

[0160] The first bridging electrode 150-1 may wrap around the second layer 132 of the connection structure 105A. For example, the first bridging electrode 150-1 may be disposed on the upper side, side and lower side of the second layer 132.

[0161] The first bridging electrode 150-1 may enclose the fourth layer 134 of the connection structure 105A. For example, the first bridging electrode 150-1 may be disposed on the upper side, side, and lower side of the fourth layer 134. The first bridging electrode 150-1 may be electrically connected to the lower side of the second layer 132 via the side of the fourth layer 134.

[0162] As previously stated, the auxiliary electrode AC can be electrically connected to the first power supply line PL1. Additionally, the bridging electrode 150 can also be electrically connected to the first power supply line PL1. Therefore, as... Figure 3 As shown, the auxiliary electrode AC and the bridging electrode 150 can be connected in parallel to the first power line PL1. Therefore, a third resistor R3 and an eighth resistor R8 can be connected in series between the auxiliary electrode AC and the first power line PL1, and a seventh resistor R7 can also be connected. Thus, by connecting the third resistor R3 and the eighth resistor R8 in parallel with the eighth resistor R8, the total resistance can be reduced. This reduces the current loss flowing at the red organic light-emitting element 120r and the green organic light-emitting element 120g, thereby improving luminous efficiency and image quality while reducing power consumption.

[0163] On the other hand, the fourth layer 134 of the first bridging electrode 150-1 or the first protrusion 130-1 can be used as an etching prevention layer. Therefore, the first bridging electrode 150-1 or the fourth layer 134 can contain a material with strong corrosion resistance. For example, the first bridging electrode 150-1 can contain a conductive oxide material such as ITO. For example, the fourth layer 134 can contain an insulating material such as Al2O3.

[0164] Organic deposition materials used to form organic light-emitting layers 122r, 122g, etc., deposition materials used to form cathode electrodes 123r, 123g, and organic or inorganic materials used to form encapsulation layer 135 can be subjected to dry etching processes using gases such as CF4, SF6, O2, and Cl2. During dry etching, the first protrusion 130-1 is also etched, which may change the size or shape of the first protrusion 130-1.

[0165] When the size or shape of the first protrusion 130-1 changes, the opening depth or opening gap of the undercut structure 151 of the connecting structure 105A becomes different, which may affect the connection resistance (or contact resistance) between the auxiliary electrode AC and the cathode electrodes 123r and 123g. As a result, depending on the characteristics of the organic light-emitting elements of each sub-pixel SPr and SPg, image quality defects such as spots and color patches may occur.

[0166] To address this issue, the fourth layer 134 of the first bridging electrode 150-1 or the first protrusion 130-1 can be used as an etching prevention layer. That is, the first bridging electrode 150-1 or the fourth layer 134 can contain a highly corrosion-resistant material. In this case, the etching prevention layer protects the first protrusion 130-1 from being etched by etching gases such as CF4 during the etching process, thus preserving the size or shape of the first protrusion 130-1. Consequently, the opening depth or opening gap of the undercut structure 151 of the connection structure 105A remains unchanged, eliminating the characteristic differences of the organic light-emitting elements based on each sub-pixel SPr, SPg, and preventing image quality defects.

[0167] On the other hand, the bridging structure 105C may include a black resin layer 151. The black resin layer 151 may be disposed on the bridging electrode 150. The black resin layer 151 may be disposed on the second bridging electrode 150-2.

[0168] The black resin layer 151 can be used as a black matrix (layer). Typically, the black matrix (layer) is positioned between sub-pixels to prevent color mixing. Therefore, the black matrix (layer) is positioned separately between sub-pixels.

[0169] However, according to the embodiment, the black resin layer 151 is used as a black matrix (layer), so there is no need to form an additional black matrix, which can save material costs, simplify the process, and reduce the product thickness.

[0170] The sides of the second bridging electrode 150-2 and the sides of the black resin layer 151 can be located on the same vertical line or diagonal line. The black resin layer 151 can be used as a mask for forming the second bridging electrode 150-2. For example, the second bridging electrode 150-2 and the black resin layer 151 are formed, and the black resin layer 151 is used as a mask. The second bridging electrode 150-2 is etched, thereby the sides of the second bridging electrode 150-2 and the sides of the black resin layer 151 can be located on the same vertical line or diagonal line. Then, the black resin layer 151 is not removed, so the black resin layer 151 can be used as a black matrix (layer).

[0171] On the other hand, a water penetration blocking structure can be formed by the bridging electrode 150 and the black resin layer 151. That is, water penetration through the side of the first protrusion 130-1 is blocked by the bridging electrode 150 and the black resin layer 151, thereby preventing image quality degradation and achieving a long lifespan.

[0172] Figure 6 A cross-sectional view of the organic light-emitting display device according to the second embodiment is shown. Although Figure 5 Show Figures 4a to 4c The first dike 111-1 and the first protrusion 130-1, but the second dike 111-2 can also have and Figure 5 It has the same structure or shape as the first dike 111-1 shown. Figure 5 Other constituent elements not shown in the diagram may also be combined with Figures 4a to 4c The corresponding constituent elements shown are similarly shown in Figure 5 .

[0173] Except for omitting the red color filter layer 140r and the green color filter layer 140g, and the second encapsulation layer 141 including multiple insulating layers 141-1 to 141-3, the second embodiment is similar to the first embodiment. In the second embodiment, the same reference numerals are given to the constituent elements having the same shape, structure and / or function as in the first embodiment, and detailed descriptions are omitted.

[0174] Reference Figure 6 The organic light-emitting display device according to the second embodiment may include a first dam 111-1, a first protrusion 130-1, a red organic light-emitting element 120r, a green organic light-emitting element 120g, a blocking structure 105B, a first encapsulation layer 135, and a second encapsulation layer 141, etc.

[0175] The first dike 111-1, the blocking structure 105B, and the first encapsulation layer 135 have been... Figures 4a to 4c The explanation is in the text, therefore detailed instructions are omitted.

[0176] The first protrusion 130-1 may include a connecting structure 105A, a bridging structure 105C, etc. The connecting structure 105A and the bridging structure 105C have been described in the first embodiment (…). Figure 5 The details are omitted as they are explained in the document.

[0177] The second encapsulation layer 141 may include a plurality of insulating layers 141-1 to 141-3. For example, the second encapsulation layer 141 may include a second-1 insulating layer 141-1, a second-2 insulating layer 141-2, and a second-3 insulating layer 141-3.

[0178] The second-first insulating layer 141-1 can be disposed on the first encapsulation layer 135. That is, after the first encapsulation layer 135 is formed, the second-first insulating layer 141-1 can be formed on the first encapsulation layer 135. For example, the second-first insulating layer 141-1 may contain inorganic materials.

[0179] The second-first insulating layer 141-1 can be disposed on the red organic light-emitting element 120r and the green organic light-emitting element 120g. The second-first insulating layer 141-1 can be formed inside the undercut structure 151 of the connection structure 105A. The second-first insulating layer 141-1 can be disposed on the first bridging electrode 150-1 of the bridging electrode 150.

[0180] The second-first insulating layer 141-1 can be configured to be spaced apart from each other on the first bridging electrode 150-1, thereby exposing the upper side of the first bridging electrode 150-1. Thus, the second bridging electrode 150-2 can be electrically connected to the upper side of the first bridging electrode 150-1 through the second-first insulating layer 141-1.

[0181] The second-2 insulating layer 141-2 can be disposed on the second-1 insulating layer 141-1. The second-2 insulating layer 141-2 can contain resin material or organic material. The second-2 insulating layer 141-2 can be formed on the second-1 insulating layer 141-1 by performing a sputtering process using resin material.

[0182] The second-second insulating layer 141-2 can be formed after the second bridging electrode 150-2 and the black resin layer 151 are formed. Thus, the second bridging electrode 150-2 and the black resin layer 151 can be disposed between the second-first insulating layer 141-1 and the second-second insulating layer 141-2.

[0183] The second-2 insulating layer 141-2 can be used as a planarization layer. For example, the second-2 insulating layer 141-2 can be formed using a thicker resin material, so that the upper surface of the second-2 insulating layer 141-2 has a planar surface.

[0184] The second-third insulating layer 141-3 can be disposed on the second-second insulating layer 141-2. The second-third insulating layer 141-3 can contain inorganic materials such as SiNx. For example, the second-third insulating layer 141-3 can be formed on the second-second insulating layer 141-2 by performing a PECVD process utilizing inorganic materials.

[0185] Therefore, by making the second encapsulation layer 141 include a plurality of insulating layers 141-1 to 141-3, the moisture penetration blocking performance can be enhanced.

[0186] Figure 7 A cross-sectional view of the organic light-emitting display device according to the third embodiment is shown. Although Figure 5 Show Figures 4a to 4c The first dike 111-1 and the first protrusion 130-1, but the second dike 111-2 can also have and Figure 5 It has the same structure or shape as the first dike 111-1 shown. Figure 5 Other constituent elements not shown in the diagram may also be combined with Figures 4a to 4c The corresponding constituent elements shown are similarly shown in Figure 5 .

[0187] Except for the bridging structure 105C including the sensing element 153, the third embodiment can be combined with the first embodiment ( Figure 5 The same applies to the first embodiment. In the third embodiment, the same reference numerals are given to constituent elements having the same shape, structure, and / or function as in the first embodiment, and detailed descriptions are omitted. The sensing element 153 of the third embodiment can also be applied to the second embodiment. Figure 6 ).

[0188] Reference Figure 7 The organic light-emitting display device according to the third embodiment may include a first dam 111-1, a first protrusion 130-1, a red organic light-emitting element 120r, a green organic light-emitting element 120g, a blocking structure 105B, an encapsulation layer 135, a red color filter layer 140r, a red encapsulation layer 141r, a green color filter layer 140g, and a green encapsulation layer 141g, etc.

[0189] The first protrusion 130-1 may include a connecting structure 105A, a bridging structure 105C, etc.

[0190] The first protrusion 130-1 may include a first layer 131, a second layer 132, a third layer 133, and a fourth layer 134, etc. The first layer 131, the second layer 132, and the third layer 133 may have different etch selectivity ratios. For example, the etch rate of the first layer 131 may be greater than that of the second layer 132 or the third layer 133. Therefore, the undercut structure 151 can be formed by etching the side portion of the first layer 131 faster than the side portion of the second layer 132 or the side portion of the third layer 133.

[0191] On the other hand, the third layer 133 can be used as an auxiliary electrode AC for electrical connection with the cathode electrodes 123r and 123g. For this purpose, the third layer 133 can contain a metal with low etch rate and excellent conductivity.

[0192] The first layer 131 can serve to block the electrical connection between the third layer 133 and the sensing element 153. Therefore, the first layer 131 has a high etch rate and may contain insulating materials. For example, the first layer 131 may contain silicon nitride-based SiNx, silicon oxide-based SiOx, silicon oxynitride-based SiON, etc.

[0193] The second layer 132 may contain metal or insulating material. The fourth layer 134 may be used as an etching prevention layer.

[0194] On the other hand, the bridging structure 105C can be configured on the connecting structure 105A or the auxiliary electrode AC.

[0195] The bridging structure 105C may include a sensing element 153 for sensing touch. The sensing element 153 may be disposed on the connection structure 105A or the auxiliary electrode AC. As previously described, since the first layer 131 of the first protrusion 130-1 contains insulating material, the sensing element 153 is not electrically connected to the first layer 131, which serves as the auxiliary electrode AC.

[0196] The sensing element 153 may include a first sensing electrode 153-1, a second sensing electrode 153-2, and a dielectric layer 153-3.

[0197] The first sensing electrode 153-1 may be disposed on the second layer 132 of the first protrusion 130-1. The second sensing electrode 153-2 may be disposed on the first sensing electrode 153-1. The dielectric layer 153-3 may have a set dielectric constant and may be disposed between the first sensing electrode 153-1 and the second sensing electrode 153-2.

[0198] The dielectric layer 153-3 can be a portion of the red encapsulation layer 141r. For example, the red encapsulation layer 141r can be disposed on the red sub-pixel SPr, the green sub-pixel SPg, and the first sensing electrode 153-1. The red encapsulation layer 141r can be disposed on the red color filter layer 140r at the red sub-pixel SPr, and can be disposed on the green encapsulation layer 141g at the green sub-pixel SPg. The red encapsulation layer 141r can be disposed on the connection structure 105A between the first sensing electrode 153-1 and the second sensing electrode 153-2. The red encapsulation layer 141r disposed between the first sensing electrode 153-1 and the second sensing electrode 153-2 can be used as the dielectric layer 153-3.

[0199] The red encapsulation layer 141r can have a set dielectric constant. When a large capacitance is required, the red encapsulation layer 141r can contain a material with a high dielectric constant. Therefore, the red encapsulation layer 141r disposed between the first sensing electrode 153-1 and the second sensing electrode 153-2 can be used as the dielectric layer 153-3.

[0200] To detect touch, one of the first sensing electrode 153-1 and the second sensing electrode 153-2 can provide a drive signal, and the other can output a sensing signal corresponding to the drive signal. The output sensing signal is processed by a touch IC (integrated circuit) to obtain whether a touch is being performed or the touch coordinates. Touch commands can be executed based on the touch coordinates or changes in the touch coordinates.

[0201] When viewed from above, the first sensing electrode 153-1 or the second sensing electrode 153-2 at the sensing element 153 may have a diamond shape, but this is not a limitation.

[0202] For example, the first sensing electrode 153-1 can be Figure 5 and Figure 6 The first bridging electrode 150-1 shown herein, and the second sensing electrode 153-2 can be the second bridging electrode 150-2. The first sensing electrode 153-1 and the first bridging electrode 150-1 can be formed of the same material and have the same shape or structure. The second sensing electrode 153-2 and the second bridging electrode 150-2 can be formed of the same material and have the same shape or structure.

[0203] Example 1 ( Figure 5 ) and the second embodiment ( Figure 6 In the ), the bridging electrode 150, which is composed of the first bridging electrode 150-1 and the second bridging electrode 150-2, can reduce the resistance between the cathode electrodes 123r, 123g and the first power line PL1.

[0204] In contrast, the third embodiment ( Figure 7 In this design, the sensing element 153 is not electrically connected to the cathode electrodes 123r and 123g via the first layer 131 of the first protrusion 130-1. Instead, it senses touch based on the difference in capacitance caused by a human finger or pressure applied by a stylus. The capacitance of the sensing element 153 is determined by the dielectric constant of the dielectric layer 153-3. A difference in capacitance occurs when a human finger or stylus is in contact with, near, or otherwise connected to the substrate; therefore, the presence or absence of a touch can be determined based on this difference in capacitance.

[0205] In the embodiments, the sensing element 153 can be implemented using either self-capacitance or mutual-capacitance. The sensing element 153 can be referred to as a touch sensor, touch unit, or touch node, etc.

[0206] Although not shown, the sensing elements 153 can be arranged in a matrix. That is, multiple sensing elements 153 can be disposed on the auxiliary electrode AC of the first protrusion 130-1 between adjacent sub-pixels. For this purpose, one of the first sensing electrode 153-1 and the second sensing electrode 153-2 can be electrically connected to a first sensing line arranged along the first direction X, and the other can be electrically disposed to a second sensing line arranged along the second direction Y. Therefore, the multiple sensing elements 153 are located at multiple intersection points (or regions) where the multiple first sensing lines arranged along the first direction X and the multiple second sensing lines arranged along the second direction Y intersect each other, thereby the multiple sensing elements 153 can be arranged in a matrix.

[0207] Although not shown, the sensing element 153 may be individually provided in... Figure 6 The second encapsulation layer 141 is shown in the figure. In this case, the first layer 131 is also used as an auxiliary electrode AC, so that the first layer 131, the second layer 132 and the bridging electrode 150 can be electrically connected.

Claims

1. An organic light-emitting display device, comprising: The dikes between sub-pixels on the substrate; The anode electrode at the sub-pixel; The anode electrode and the organic light-emitting layer on the embankment; The cathode electrode on the organic light-emitting layer; as well as The protrusions are spaced apart on the upper side of the embankment and the organic light-emitting layer. The protrusion includes: A connection structure, which includes an auxiliary electrode connected to the cathode electrode; as well as A bridging electrode, disposed on the connection structure, is used for electrical connection with the auxiliary electrode.

2. The organic light-emitting display device according to claim 1, wherein, The protrusion includes: The first layer on the dike; The second layer above the first layer; and The third layer below the first layer, The side portion of the third layer and the side portion of the second layer are located on the same line or diagonally, or extend from the side portion of the second layer toward the sub-pixel. The side of the first layer is recessed from the side of the second layer toward the inside of the protrusion.

3. The organic light-emitting display device according to claim 2, wherein, The bridging electrode includes: The first bridging electrode on the second layer; and A second bridging electrode is disposed on the first bridging electrode for electrical connection with the first bridging electrode.

4. The organic light-emitting display device according to claim 3, wherein, The first bridging electrode is a connecting electrode used to connect the auxiliary electrode to the second bridging electrode.

5. The organic light-emitting display device according to claim 4, wherein, The protrusion also includes: The fourth layer between the second layer and the first bridging electrode.

6. The organic light-emitting display device according to claim 5, wherein, The first bridging electrode is located via the side of the fourth layer and is disposed on the lower side of the second layer.

7. The organic light-emitting display device according to claim 5, wherein, At least one of the first bridging electrode or the fourth layer includes an etch-prevention layer.

8. The organic light-emitting display device according to claim 2, wherein, At least one of the first layer, the second layer, or the third layer is the auxiliary electrode.

9. The organic light-emitting display device according to claim 2, wherein, The protrusion includes a sensing element disposed on the connection structure for sensing touch.

10. The organic light-emitting display device according to claim 9, wherein, The sensing element includes: The first sensing electrode on the second layer; The second sensing electrode on the first sensing electrode; and A dielectric layer with a set dielectric constant is provided between the first sensing electrode and the second sensing electrode.

11. The organic light-emitting display device according to claim 10, wherein, One of the first sensing electrode and the second sensing electrode provides a driving signal, and the other outputs a sensing signal corresponding to the driving signal.

12. The organic light-emitting display device according to claim 1, wherein, Also includes: The black resin layer on the bridging electrode.

13. The organic light-emitting display device according to claim 1, wherein, The auxiliary electrode and the bridging electrode are both connected to the power line.

14. The organic light-emitting display device according to claim 1, wherein, It also includes: a blocking structure that guides the hole injection layer of the organic light-emitting layer to be disconnected at the dike.

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