Interlock system, substrate processing apparatus, interlock display method, semiconductor device manufacturing method, and program

Abstract

Provided is a technique whereby it is possible to easily identify a part that has become a main cause of interlocking or a part that is to become a main cause of interlocking. The present invention is provided with: detection units which are respectively provided in a plurality of modules constituting a substrate processing apparatus, respectively detect the physical state of the substrate processing apparatus, and output the detected physical state as a detection signal; an interlock determination unit that stores, for each of a plurality of interlocks, a preset interlock establishment condition, and determines, on the basis of a detection signal from the detection unit, whether or not the plurality of interlocks are established; and a display control unit that, when any one of the plurality of interlocking units is established, can graphically display, on a display unit, a module corresponding to one main cause for establishing the interlocking unit so as to be recognizable in an image indicating the configuration of the substrate processing apparatus. When the physical state satisfies a condition or when an interlock occurs when the physical state satisfies a condition, a module corresponding to one main cause obstructing the establishment of the interlock can be graphically displayed on a display unit in a manner that the module can be recognized in an image representing the structure of the substrate processing apparatus.

Description

Technical Field

[0001] This disclosure relates to interlocking systems, substrate processing apparatus, interlocking display methods, and manufacturing methods and procedures for semiconductor devices. Background Technology

[0002] In the manufacturing process of semiconductor devices, when a gas sensor detects a leaking gas, processing is sometimes performed to execute a corresponding interlocking action (for example, see Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-52110 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] This disclosure provides a technique for easily identifying the location that has become the primary cause of an interlock or is likely to become the primary cause of an interlock.

[0008] Methods for solving problems

[0009] According to one aspect of this disclosure, a technology is provided comprising: a detection unit, which is respectively disposed in a plurality of modules constituting a substrate processing apparatus, and detects the physical state of the substrate processing apparatus and outputs a detection signal; an interlock determination unit, which stores a pre-set condition for the establishment of an interlock for each of the plurality of interlocks, and determines whether the plurality of interlocks are established based on the detection signal from the detection unit; and a display control unit, which, when any one of the plurality of interlocks is established, can graphically display a module corresponding to a main reason for the establishment of the interlock on a display unit in a manner that can be identified in an image representing the structure of the substrate processing apparatus, or when an interlock is generated when the physical state meets the condition, can graphically display a module corresponding to a main reason for preventing the establishment of the interlock on the display unit in a manner that can be identified in an image representing the structure of the substrate processing apparatus.

[0010] Invention Effects

[0011] According to this disclosure, it is easy to identify the parts that have become the main cause of interlocking or the parts that are likely to become the main cause of interlocking. Attached Figure Description

[0012] Figure 1 This is a perspective view illustrating an example of a substrate processing apparatus according to one aspect of the present invention.

[0013] Figure 2This is a perspective view of a substrate processing apparatus according to one aspect of the present invention, viewed from the rear side.

[0014] Figure 3 This is a block diagram illustrating an example of the control structure of a substrate processing apparatus according to one aspect of the present disclosure.

[0015] Figure 4 This is an example of an interlocking condition table stored in a storage device according to one method of this disclosure.

[0016] Figure 5 This is an example of an interlocking display position table stored in a storage device according to one aspect of this disclosure.

[0017] Figure 6 This is a flowchart illustrating the interlocking display process of a substrate processing apparatus according to one aspect of the present invention.

[0018] Figure 7 This is a diagram illustrating an example of a display screen of a display unit according to one aspect of this disclosure.

[0019] Figure 8 This is a diagram illustrating an example of a display screen of a display unit according to one aspect of this disclosure.

[0020] Figure 9 This is a diagram illustrating a modified example of the display screen of a display unit according to one embodiment of the present disclosure. Detailed Implementation

[0021] The following is mainly based on Figures 1-8 One aspect of this disclosure will be described. Furthermore, the drawings used in the following description are schematic, and the dimensional relationships and ratios of the elements shown may not necessarily correspond to reality. Additionally, the dimensional relationships and ratios of elements in multiple drawings may not be consistent with each other. Moreover, this disclosure is not limited in any way and can be implemented with appropriate modifications within the scope of this disclosure.

[0022] Furthermore, in the following description, "operator" refers to a person who uses a substrate processing apparatus or a person who uses a substrate processing apparatus to process a substrate.

[0023] First, refer to Figure 1 and Figure 2 The general outline of the substrate processing apparatus 1 of this method will be described.

[0024] Figure 1 This is a perspective view showing an example of the substrate processing apparatus 1 according to this method. Additionally, Figure 2 This is a perspective view of the substrate processing apparatus 1 of this method viewed from the back side. Figure 1 and Figure 2The image shows a vertical substrate processing apparatus 1, which is an example of a substrate processing apparatus.

[0025] like Figure 1 and Figure 2 As shown, the substrate processing apparatus 1 has a housing 2, and an opening for maintenance is provided on the lower part of the front wall 3 of the housing 2. The opening is opened and closed by a front maintenance door 5.

[0026] A wafer cassette loading / unloading outlet is provided on the front wall 3 of the housing 2 to connect the inside and outside of the housing 2. The wafer cassette loading / unloading outlet is opened and closed by a front gate 7, which serves as the loading / unloading outlet opening and closing mechanism. A loading port 8, which serves as a substrate transport container transfer platform, is provided on the front side of the wafer cassette loading / unloading outlet. The loading port 8 is configured to align the placed wafer cassette 9.

[0027] The wafer box 9 is a sealed substrate transport container that is moved into the loading port 8 by the in-process transport device and removed from the loading port 8.

[0028] A rotating wafer cassette holder 11, which serves as a substrate transport container, is provided at the upper part of the approximately central part of the housing 2 in the front-to-back direction. The rotating wafer cassette holder 11 is configured to store multiple wafer cassettes 9.

[0029] Below the rotary wafer cassette holder 11 is a wafer cassette opener 14, which serves as a substrate transport container cover opening and closing mechanism. The wafer cassette opener 14 holds the wafer cassette 9 and has a structure that enables the cover of the wafer cassette 9 to be opened and closed.

[0030] A wafer cassette transport mechanism 15, serving as a container transport unit, is provided between the loading port 8, the rotary wafer cassette holder 11, and the wafer cassette opener 14. The wafer cassette transport mechanism 15 can maintain the wafer cassette 9 in a lifting and lowering manner and can move forward and backward in a horizontal direction. It is configured to transport the wafer cassette 9 between the loading port 8, the rotary wafer cassette holder 11, and the wafer cassette opener 14.

[0031] A sub-shell 16 is provided at the lower part of the approximately central part in the front-rear direction inside the shell 2, extending all the way to the rear end. On the front wall 17 of the sub-shell 16, a pair of substrate loading and unloading outlets, namely wafer loading and unloading outlets, are arranged vertically in two layers for moving wafers 18, which serve as substrates, into and out of the sub-shell 16. Wafer cassette openers 14 are provided opposite to the upper and lower wafer loading and unloading outlets.

[0032] The wafer cassette opener 14 includes a mounting stage 21 for holding a wafer cassette 9 and an opening / closing mechanism 22 for opening and closing the cover of the wafer cassette 9. The wafer cassette opener 14 is configured to open and close the cover of the wafer cassette 9 placed on the mounting stage 21 by means of the opening / closing mechanism 22, thereby opening and closing the wafer loading / unloading outlet of the wafer cassette 9.

[0033] The sub-casing 16 forms an airtight transfer chamber 23 relative to the space (wafer cassette transfer space) where the wafer cassette transport mechanism 15 and the rotary wafer cassette holder 11 are located. A wafer transfer mechanism 24, which serves as a transfer machine, is provided in the front region of the transfer chamber 23. The wafer transfer mechanism 24 is configured to load and unload wafers 18 onto the wafer boat 26, which serves as a substrate holder.

[0034] A standby section 27 is formed in the rear region of the transfer chamber 23 to house the wafer boat 26 and keep it in standby mode. A vertical processing furnace 28 is provided above the standby section 27. The processing furnace 28 forms a processing chamber 29 inside, and the lower end of the processing chamber 29 becomes a furnace opening, which is opened and closed by a furnace opening gate. Furthermore, the processing furnace 28 is an example of a processing container for processing the wafer 18.

[0035] Below the processing furnace 28 is a substrate holding lifting mechanism, namely a crystal boat lift 32, for raising and lowering the crystal boat 26. A sealing cover 34, which serves as a cover, is horizontally mounted on the crystal boat lift 32. The sealing cover 34 vertically supports the crystal boat 26 and can airtightly seal the furnace opening when the crystal boat 26 is loaded into the processing chamber 29.

[0036] The wafer boat 26 is configured to hold multiple wafers 18 (e.g., 50 to 125) in a horizontal, multi-layered configuration with their centers aligned. Furthermore, the expression "50 to 125 wafers" in this specification refers to the inclusion of both the lower and upper limits within that range. Therefore, for example, "50 to 125 wafers" means "more than 50 wafers and less than 125 wafers." The same applies to other numerical ranges.

[0037] A cleaning unit 35 is provided at a position opposite to the crystal boat elevator 32. The cleaning unit 35 consists of a supply fan and a dust filter to supply cleaned air or clean air as an inactive gas.

[0038] A utility section 42 and an exhaust section 43 are provided on the back wall 41 of the housing 2, each continuous with one side of the back wall 41. The utility section 42 and the exhaust section 43 are arranged opposite to each other. A maintenance and repair space (maintenance space) 44 is formed between the utility section 42 and the exhaust section 43. The maintenance and repair space 44 is a space for the operator to perform maintenance and repair on the substrate processing apparatus 1. The utility section 42 serves as a utility part of the substrate processing apparatus 1. The exhaust section 43 can accommodate an exhaust mechanism or the like for exhausting the atmosphere inside the housing 2.

[0039] The utility unit 42 is divided into three layers in the height direction. The upper layer of the utility unit 42 is used as a gas box 47, the middle layer is used as a control box 48, and the lower layer is used as a gas box 49.

[0040] The control box 48 is equipped with a process control unit 205 for controlling the substrate processing apparatus 1 and a sub-operation panel 50 for operation by the operator. The sub-operation panel 50 serves as a display unit 204 for displaying the physical status of the substrate processing apparatus 1 and an operation unit 203 for operating the substrate processing apparatus 1.

[0041] The gas chamber 47 is divided into two parts, left and right, and is constructed as modules 47a and 47b, which are divided from the rear wall 41 side. Modules 47a and 47b are respectively provided with doors 51a and 51b that can be opened and closed on the front side. Doors 51a and 51b are configured to open and close freely with connecting parts 46, such as hinges, provided on the outer side as axes. Modules 47a and 47b can accommodate gas units such as gas raw materials and carrier gases, as well as their gas flow control units 208, piping, valves, etc.

[0042] Furthermore, the gas chamber 49 is divided into two parts, left and right, and is constructed as modules 49a and 49b from the rear wall 41 side. Modules 49a and 49b are respectively provided with doors 52a and 52b on their front sides. Doors 52a and 52b are configured to open and close freely around connecting members 46 located on their outer sides. Modules 49a and 49b can accommodate, for example, tanks containing liquid raw materials, vaporizers, and their gas flow control units 208, piping, valves, etc.

[0043] That is, the utility unit 42 consists of multiple modules 47a, 47b, 49a, 49b divided into multiple partitions, and a control box 48. The operator can open the doors 51a, 51b, 52a, 52b in each module 47a, 47b, 49a, 49b to maintain the gas supply system, including the gas raw materials, the carrier gas unit, the liquid raw material tanks, the vaporizers, and their gas flow control units 208, piping, valves, etc.

[0044] The rear wall 41 of the housing 2 is divided into upper and lower parts, configured as modules 54 and 55 from the upper side. Maintenance and inspection ports are provided in modules 54 and 55, and doors 56 and 57 are provided in each maintenance and inspection port. Doors 56 and 57 are respectively configured to be located on the practical part 42 side of the rear wall 41 (…). Figure 2 The connecting part 46 (on the right side of the middle section) is a shaft that can be freely opened and closed.

[0045] Sensors 53a to 53f, serving as detection units, are respectively installed inside the doors 51a, 51b, 52a, 52b, 56, and 57 of each module 47a, 47b, 49a, 49b, 54, and 55. These sensors 53a to 53f detect the opening and closing states of doors 51a, 51b, 52a, 52b, 56, and 57 and output them as detection signals. In addition, in each module 47a, 47b, 49a, 49b, 54, and 55, besides sensors 53a to 53f, a first sensor group is also provided to detect the opening and closing states of valves in each module 47a, 47b, 49a, 49b, 54, and 55, as well as the physical state of the substrate processing device 1, including pressure sensors, temperature sensors, flow sensors, and leakage sensors, and output them as detection signals.

[0046] In the substrate processing apparatus 1, various chemical substances are used when processing the wafer 18. These chemical substances are classified as flammable, combustible, toxic, corrosive, etc., and permissible exposure concentrations are determined for each substance. Therefore, the gas supply system, including piping, is housed in gas chambers 47 and 49, and gas leaks are detected by first sensor groups installed in each module 47a, 47b, 49a, and 49b, triggering interlocking actions.

[0047] Here, interlock (hereinafter referred to as ILK) refers to a safety mechanism composed of ladder programs of PLC (Programmable Logic Controller) to prevent missetting or misoperation of devices such as board processing devices.

[0048] In this method, the ILK (Inertial Locking) is activated by detecting the opening and closing states of doors 51a, 51b, 52a, 52b, 56, and 57, the opening and closing states of valves on modules 47a, 47b, 49a, 49b, 54, and 55, and physical conditions such as pressure, temperature, flow rate, and leakage, using first sensor groups installed on modules 47a, 47b, 49a, 49b, 54, and 55. Furthermore, modules 47a, 47b, 49a, 49b, 54, and 55 are divided into modules where the sensors that are the primary cause of ILK activation and the components that are the substantial primary cause of ILK activation (described in detail later) are configured in the same module.

[0049] For example, the ILK is set to activate based on the opening and closing status of the valve to prevent the valves containing gases that could cause an unexpected reaction if mixed from opening simultaneously. Additionally, sensors installed in modules 54 and 55 are monitored, and the ILK is activated when the furnace 28 is at a high temperature, during wafer 18 processing within the furnace 28, and during wafer 18 transfer in the transfer chamber 23 to prevent doors 56 and 57 from opening erroneously.

[0050] Next, the operation of the substrate processing apparatus 1 will be explained.

[0051] When wafer cassette 9 is supplied to loading port 8, the wafer cassette inlet / outlet is opened by front gate 7. The wafer cassette 9 on loading port 8 is moved into the housing 2 by wafer cassette conveying mechanism 15 and placed on rotary wafer cassette rack 11. After being temporarily held by rotary wafer cassette rack 11, wafer cassette 9 is moved by wafer cassette conveying mechanism 15 to either wafer cassette opener 14 and transferred to mounting stage 21, or directly transferred from loading port 8 to mounting stage 21.

[0052] At this time, the wafer inlet and outlet are closed by the opening and closing mechanism 22, and clean air circulates in and fills the transfer chamber 23.

[0053] The wafer cassette 9, placed on the mounting stage 21, has its opening side face pressed against the front wall 17 of the sub-cassette 16. The wafer is then moved into the edge of the loading port, and the cover is removed by the opening and closing mechanism 22, opening the wafer loading port.

[0054] When the wafer cassette 9 is opened by the wafer cassette opener 14, the wafer 18 is taken out of the wafer cassette 9 by the wafer transfer mechanism 24. After the wafer 18 is integrated using the slot alignment device, the wafer transfer mechanism 24 moves the wafer 18 into the standby section 27 located behind the transfer chamber 23 and charges it into the wafer boat 26.

[0055] The wafer transfer mechanism 24, which has handed over wafer 18 to the crystal boat 26, returns to the wafer box 9 and loads the next wafer 18 into the crystal boat 26.

[0056] During the loading operation of wafer 18 onto wafer boat 26 using the wafer transfer mechanism 24 in the wafer cassette opener 14 of one side (upper or lower layer), the wafer cassette conveying mechanism 15 transports and transfers other wafer cassettes 9 from the rotary wafer cassette rack 11 to the wafer cassette opener 14 of the other side (lower or upper layer), while simultaneously performing the operation of opening the wafer cassette 9 using the wafer cassette opener 14 of the other side.

[0057] When a pre-specified number of wafers 18 are loaded into the wafer boat 26, the furnace opening of the processing furnace 28, which is closed by the furnace gate, is opened. Then, the wafer boat 26 is raised by the wafer boat elevator 32 and moved (loaded) into the processing chamber 29.

[0058] After loading, the furnace opening is sealed airtightly using the sealing cap 34. In addition, this method includes a purging process (pre-purging process) at which the processing chamber 29 is replaced with an inactive gas at that moment (after loading).

[0059] Vacuum exhaust is performed by the exhaust control unit 210 to bring the processing chamber 29 to the desired pressure (vacuum level). In addition, the processing chamber 29 is heated to a predetermined temperature by the temperature control unit 207 to achieve the desired temperature distribution.

[0060] Furthermore, a processing gas, controlled at a predetermined flow rate, is supplied via a gas supply mechanism. As the processing gas flows through the processing chamber 29, it comes into contact with the surface of the wafer 18, performing a predetermined processing on the surface of the wafer 18. The processed gas after the reaction is discharged from the processing chamber 29 via an exhaust mechanism. In this disclosure, "processing gas" refers to the gas supplied into the processing chamber 29. This is also true in the following description.

[0061] After a preset processing time has elapsed, an inert gas is supplied via a gas supply mechanism, displacing the processing chamber 29 with the inert gas, and the pressure in the processing chamber 29 returns to atmospheric pressure (post-purging process). Then, the crystal boat 26 is lowered via the crystal boat lift 32 and the sealing cover 34. The processing time in this disclosure refers to the time during which the processing continues. This also applies in the following description.

[0062] Regarding the removal of the processed wafer 18, the wafer 18 and wafer cassette 9 are removed from the outside of the housing 2 in the reverse order described above. The unprocessed wafer 18 is further loaded into the wafer boat 26 for batch processing of the wafer 18 at least once.

[0063] Here, as Figure 1 and Figure 2 As shown, the substrate processing apparatus 1 includes a control unit 100, which controls the substrate processing apparatus 1. The control unit 100 may be built into the substrate processing apparatus 1, or it may be configured to be accessible from outside the substrate processing apparatus 1. Hereinafter, the case where the control unit 100 of this configuration is applied to the substrate processing apparatus 1 will be described, but the control unit 100 may also control devices other than the substrate processing apparatus 1.

[0064] Next, refer to Figure 3 The structure of the control system of the substrate processing apparatus 1 of this method will be described. Figure 3 This is a block diagram illustrating an example of the functional structure of the substrate processing apparatus 1 according to this method.

[0065] like Figure 3 As shown, the substrate processing apparatus 1 includes a control unit 100 as a main controller, an external communication unit 201, an external storage unit 202, an operation unit 203, a display unit 204, a process control unit 205, and a transport control unit 206.

[0066] The control unit 100 is configured as a computer equipped with a CPU (Central Processing Unit) 102, a memory 103, a storage device 104 as a storage unit, and an I / O port (hereinafter referred to as I / O) 105. Furthermore, as an example, the control unit 100 connects to networks such as the Internet, LAN (Local Area Network), and WAN (Wide Area Network) via an external communication unit 201, enabling communication with external devices through the network.

[0067] The process control unit 205 and the transport control unit 206 are connected to the control unit 100 via I / O 105.

[0068] Furthermore, an external host computer is connected to the control unit 100 via the external communication unit 201. Therefore, even if the board processing device 1 is installed in a cleanroom, the host computer can be installed in an office or similar location outside the cleanroom. Additionally, an external storage unit 202, serving as a mounting unit, is connected to the control unit 100. The external storage unit 202 is used for inserting and removing USB (Universal Serial Bus) memory devices, which are examples of recording media.

[0069] The display unit 204 is a display device such as a liquid crystal display panel, used to display images. The operation unit 203 uses an input device such as a keyboard for inputting operation data. Furthermore, the operation unit 203 and the display unit 204 can be integrated, for example, in the case of a touch panel. In this embodiment, the sub-operation panel 50 is used as both the operation unit 203 and the display unit 204.

[0070] Display unit 204 displays a screen for confirming the status of the substrate process system controlled by process control unit 205 and the substrate transport system controlled by transport control unit 206. Additionally, display unit 204 can also display operation buttons on the screen as inputs for inputting action instructions to the substrate process system and the substrate transport system.

[0071] The process control unit 205 is connected to a temperature control unit 207, a gas flow control unit 208, a pressure control unit 209, an exhaust control unit 210, a rotation unit 211, a crystal boat lift 32, a first sensor group and valve 212, a first safety PLC 213, and an alarm 214, which are part of the substrate processing apparatus 1. The first sensor group and valve 212 includes sensors 53a-53f, as well as sensors and valves installed in gas chambers 47 and 49, the processing furnace 28, and the standby unit 27. The process control unit 205 is configured to control the temperature control unit 207, the gas flow control unit 208, the pressure control unit 209, the exhaust control unit 210, the rotation unit 211, the crystal boat lift 32, and the alarm 214. The alarm 214 may be, for example, a buzzer that emits a warning sound or a rotating light. Furthermore, the process control unit 205 is configured to send detection signals from the first sensor group and valve 212 to the CPU 102 via I / O 105. In addition, the temperature control unit 207, gas flow control unit 208, pressure control unit 209, exhaust control unit 210, and first safety PLC 213 each constitute a secondary controller, which is electrically connected to the process control unit 205. Furthermore, the process control unit 205 and each secondary controller (temperature control unit 207, gas flow control unit 208, pressure control unit 209, exhaust control unit 210, and first safety PLC 213) can be configured separately or as an integrated structure. A power circuit breaker 215 is connected to the first safety PLC 213.

[0072] The transfer control unit 206 is connected to a wafer cassette transfer mechanism 15, a wafer transfer mechanism 24, a second sensor group and valve 216, and a second safety PLC 217, which are part of the substrate transfer system of the substrate processing apparatus 1. The second sensor group and valve 216 includes sensors and valves located in the transfer chamber 23, excluding the gas chamber 47, gas chamber 49, processing furnace 28, and standby unit 27. The transfer control unit 206 is configured to control the wafer cassette transfer mechanism 15 and the wafer transfer mechanism 24, which are equipped with multiple servo motors. Furthermore, the transfer control unit 206 is configured to send detection signals from the second sensor group and valve 216 to the CPU 102 via I / O 105. The second safety PLC 217 serves as a secondary controller and is electrically connected to the transfer control unit 206. The transfer control unit 206 and the second safety PLC 217 can be configured separately or as an integrated unit. A power circuit breaker 218 is connected to the second safety PLC 217.

[0073] The first safety PLC 213 and the second safety PLC 217 are sequencers conforming to standards such as ISO 13849-1 and IEC 61508, and are used as safety interlock devices equipped with logic capable of determining whether multiple ILK conditions are met. The first safety PLC 213 is configured to output the calculation results of each definition to the alarm 214, display unit 204, power circuit breaker 215, etc., of the board processing device 1 based on detection signals from the first sensor group and valve 212. The second safety PLC 217 is configured to output the calculation results of each definition to the display unit 204, power circuit breaker 218, wafer cassette transport mechanism 15, wafer transfer mechanism 24, etc., based on detection signals from the second sensor group and valve 216. The first safety PLC 213, the second safety PLC 217, and the control unit 100 are installed using independent hardware. Furthermore, the first safety PLC 213 and the second safety PLC 217 can be interconnected or combined into a single PLC. Furthermore, ladder diagrams are used to describe the first safety PLC213 and the second safety PLC217.

[0074] That is, the control unit 100 is configured to receive detection signals from the first sensor group and valve 212 or the second sensor group and valve 216 via the process control unit 205 or the transfer control unit 206 and I / O 105 respectively, and determine whether multiple ILKs are established respectively, and perform the same determination as the first safety PLC 213 and the second safety PLC 217. Therefore, even if the control unit 100, the first safety PLC 213 or the second safety PLC 217 malfunctions, the ILK can still operate.

[0075] Furthermore, the control unit 100, process control unit 205, and transport control unit 206 of this method can be implemented using a conventional computer system without relying on a dedicated system. For example, by installing a program stored on a recording medium (CD-ROM, USB, etc.) for performing the above-mentioned processing onto a general-purpose computer, each controller that performs the predetermined processing can be configured.

[0076] Furthermore, the unit used to supply these programs is arbitrary. In addition to being supplied via a predetermined recording medium as described above, it can also be supplied via, for example, a communication network.

[0077] Process documents containing processing conditions for substrate processing, such as the manufacturing process, can be obtained from other devices via the external communication unit 201, or from recording media such as USB via the external storage unit 202.

[0078] Storage device 104 is, for example, an auxiliary storage device such as an HDD (Hard Disk Drive), an SSD (Solid State Drive), or flash memory. Storage device 104 stores recording media for recording the operation program executed by CPU 102 and recording media for recording process files. The operation program stored in storage device 104 is, for example, transferred to memory 103 of control unit 100 and executed when board processing apparatus 1 is started.

[0079] Furthermore, the storage device 104 stores a display processing program for performing the display of the generation of ILK according to this method. The display processing program is, for example, pre-installed on the substrate processing device 1. The display processing program can also be implemented by recording on a non-volatile recording medium or by distributing it via a network and appropriately installing it on the substrate processing device 1. Examples of non-volatile recording media include CD-ROMs, optical disks, HDDs, DVD-ROMs, flash memory, memory cards, USB, etc.

[0080] Furthermore, the storage device 104 stores an interlocking condition table that establishes corresponding conditions for the pre-set ILKs and each of the plurality of ILKs. Additionally, the storage device 104 stores image data representing the structure of the substrate processing apparatus 1 and image data representing information about the plurality of ILKs.

[0081] Figure 4 This is a diagram illustrating an example of an interlock condition table stored in storage device 104. For example... Figure 4 As shown, the storage device 104 stores pre-set conditions for each of the plurality of ILKs. Specifically, it stores the identification number (ID) representing the content of the ILK, the alarm ID identifying the alarm content, a main reason for or against the establishment of the ILK, the location where the ILK is generated, and the output content of the ILK. The location where the ILK is generated is based on the detection signal from the first sensor group or valve 212, or the second sensor group or valve 216, which is a main reason for or against the establishment of the ILK. In addition, when there are multiple main reasons for the establishment of the ILK, it is defined by a combination of Boolean algebra and timer processing. Furthermore, the conditions for the establishment of the ILK sometimes correspond to the state of the substrate processing device 1, that is, switching between any one of the states such as substrate processing, cleaning processing, idling, and maintenance.

[0082] As outputs of ILK (In-Process Control), when the primary cause of ILK is in the substrate processing system, it includes, for example, power control system ILK such as setting a buzzer, displaying on the display unit 204, cutting off power supply to the entire device, or cutting off power supply to each unit connected to the process control unit 205. Additionally, when the primary cause of ILK is in the substrate transport system, it includes transport system ILK such as setting a buzzer, displaying on the display unit 204, and cutting off power supply to each unit connected to the transport control unit 206. Furthermore, when the primary cause of ILK is gas leakage, it includes gas system ILK such as setting a buzzer, displaying on the display unit 204, and closing corresponding valves or all valves.

[0083] Furthermore, the storage device 104 stores an interlocking display position table, which maintains image data representing the structure of the substrate processing apparatus 1, and positions in the image representing the structure of the substrate processing apparatus 1 corresponding to modules corresponding to the main causes that enable an ILK, or modules corresponding to the main causes that prevent an ILK from being enabled. Moreover, instead of storing the direct main causes of an ILK, the interlocking display position table stores substantial main causes (also called essential main causes) that are fundamental main causes, associating them with IDs, etc. That is, the interlocking display position table can also be referred to as a substantial main cause table that, for each of a plurality of ILKs, maintains the substantial main cause that enables that ILK as a main cause that enables that ILK.

[0084] Here, as a substantial cause, manual valves, etc., that are not detected by the first sensor group and valve 212 or the second sensor group and valve 216 are also included. That is, even if the part that is not detected by the first sensor group and valve 212 or the second sensor group and valve 216 becomes the cause of ILK, the part that is the cause of ILK can be identified.

[0085] Figure 5 This represents an example of an interlock display position table stored in storage device 104. For example... Figure 5As shown, the storage device 104 stores an interlock display position table, which maintains the positions in the image representing the structure of the substrate processing apparatus 1 corresponding to the modules corresponding to the main causes of ILK establishment or the modules corresponding to the main causes of ILK establishment. Specifically, the table stores the ID, alarm ID, graphic number of the image data representing the structure of the substrate processing apparatus 1 used when displayed on the display unit 204, module ID for identifying the module corresponding to the main cause of ILK establishment or the module corresponding to the main cause of ILK establishment, the substantial main cause of ILK, the display coordinates representing the information of ILK, and the coordinates of the shaded area representing the module corresponding to the main cause of ILK establishment or the module corresponding to the main cause of ILK establishment.

[0086] Here, as an image representing the structure of the substrate processing apparatus 1, in addition to images obtained by projecting or viewing a three-dimensional model of the substrate processing apparatus 1 from a predetermined viewpoint, images such as photographs obtained by taking pictures of an apparatus with substantially the same structure as the substrate processing apparatus 1 can also be used.

[0087] Furthermore, under the control of the control unit 100, the display unit 204 can display the module corresponding to a major cause of the establishment of the ILK in an image showing the structure of the substrate processing apparatus 1 in a recognizable graphic manner when any one of the multiple ILKs is established, or when an ILK is generated when the conditions of the next physical state are met, the display unit 204 can display the module corresponding to a major cause that prevents the establishment of the ILK in an recognizable graphic manner in an image showing the structure of the substrate processing apparatus 1.

[0088] Furthermore, under the control of the control unit 100, the display unit 204 can overlay information representing ILK, including at least one of the following: ILK generation, ILK generation location, ID, ILK phenomenon, and main causes of ILK, on ​​an image representing the structure of the substrate processing apparatus 1 at positions corresponding to the modules corresponding to each main cause. Here, image data can be used as information representing ILK.

[0089] In this embodiment, the control unit 100 functions as a display control unit capable of controlling the display unit 204. Furthermore, the control unit 100 functions as an interlock determination unit, which stores pre-set conditions for the establishment of each of the plurality of ILKs and determines whether each of the plurality of ILKs is established based on detection signals from the first sensor group and valve 212, and the second sensor group and valve 216. Additionally, the control unit 100 functions as a pre-detection unit, which detects modules corresponding to a primary cause preventing the establishment of an ILK when an ILK is generated due to the fulfillment of a physical condition among the plurality of ILKs. In other words, the control unit 100 can also be referred to as an interlocking system, which determines ILKs based on detection signals from sensors, etc., and can display modules corresponding to a primary cause for the establishment of an ILK, or modules corresponding to a primary cause preventing the establishment of an ILK, in a recognizable graphic format on the display unit 204 in an image representing the structure of the substrate processing apparatus 1.

[0090] Next, use Figures 6-8 This section explains the ILK display processing during the operation of the substrate processing apparatus 1 described above.

[0091] In step S101, the control unit 100 detects ILK in the pre-determination process using either the first sensor group and valve 212 or the second sensor group and valve 216. Then, if the control unit 100 determines, according to the interlock condition table stored in the storage device 104, that ILK will operate when another physical state condition is met (yes in step S101), in step S102, it determines the module corresponding to a main reason that prevents ILK from being established.

[0092] Specifically, the first sensor group and valve 212, or the second sensor group and valve 216, respectively detect the physical state of the substrate processing apparatus 1 and output them as detection signals to the CPU 102 via the process control unit 205 or the transport control unit 206 and I / O 105. When the control unit 100 determines, based on the detection signals from these first sensor groups and valve 212, or the second sensor groups and valve 216, that ILK will operate when another physical state condition is met, in step S102, it determines, based on the detection signals, a module corresponding to a primary cause that prevents ILK from being established.

[0093] Then, in step S103, the control unit 100 graphically displays the module corresponding to a major cause preventing the establishment of the detected incomplete ILK on the display unit 204 in a manner recognizable in an image showing the structure of the substrate processing apparatus 1. That is, the control unit 100 graphically displays the module determined in step S102 in a manner recognizable in an image showing the structure of the substrate processing apparatus 1. This allows the operator to identify the operation that would cause the ILK to operate before it is performed, preventing erroneous ILK operations from occurring.

[0094] Specifically, for example, if ILK performs an action when doors 56 and 57 are opened, such as... Figure 7 As shown, in the display unit 204, an image showing the structure of the back side of the substrate processing apparatus 1 is displayed in a state that allows identification of the location where an interlocking knock (ILK) occurs. For example, based on the interlocking display position table stored in the storage device 104, the doors 56 and 57 on the back side of the substrate processing apparatus 1 are displayed in shadow, and information indicating ILK, such as "interlocking action when the door is opened," is overlaid. In this way, a warning display (also called an attention alert display) is performed to prevent ILK action before it occurs, so that the door is not accidentally opened and ILK action is not performed.

[0095] Then, in step S104, the control unit 100 determines whether each of the multiple ILKs is valid based on the interlock condition table stored in the storage device 104. If any one of the multiple ILKs is valid (yes in step S104), in step S106, the module corresponding to a primary cause that makes that ILK valid is determined. Furthermore, at this time, the control unit 100, based on the interlock condition table, performs an output based on the primary cause via the process control unit 205 or the transport control unit 206. Specifically, this includes sounding a buzzer, cutting off power supply to each unit or the entire device, and closing the corresponding valve or all valves.

[0096] Furthermore, if the control unit 100 determines that none of the multiple ILKs are valid (no in step S104), in step S105, the display in step S103 is cleared and the process returns to step S101.

[0097] Then, in step S107, the control unit 100 graphically displays the modules determined in step S106 in a manner that can be recognized in an image representing the structure of the substrate processing apparatus 1.

[0098] Specifically, for example, when a leak is detected by a leak sensor, the ID, alarm ID, and location of the leak (ILK) are determined according to the interlock condition table stored in the storage device 104. A buzzer sounds, and the corresponding valve closes as part of the ILK action. Furthermore, based on the determined ID or alarm ID, the substantial cause of the leak is determined according to the interlock display position table stored in the storage device 104. The display coordinates of the vaporizer, the display coordinates of the ILK information, and the coordinates of the shaded area of ​​the module corresponding to the main cause of the ILK are also determined. Furthermore, as... Figure 8 As shown, based on the determined display coordinates of the ILK and the coordinates representing the shaded area, the module of the utility unit 42 corresponding to the main cause of the ILK is shaded. Furthermore, information representing the ILK, such as the generation of the ILK, its ID, the substantial main cause of the ILK (also called the cause), and the phenomenon of the ILK, is overlaid on the image of the shaded module of the utility unit 42.

[0099] In this way, by displaying the pattern of the ILK generation site on an image showing the structure of the substrate processing apparatus 1, and overlaying information representing ILK, such as the generation of ILK, the cause of ILK, and the phenomenon of ILK, on ​​top of it, it is possible to easily determine the generation site of ILK and the substantial cause of ILK, thereby shortening the time when the apparatus is unable to operate. Furthermore, in Figure 8 The image simply shows the internal structure of the utility unit 42. However, in addition to images obtained by projecting or viewing a three-dimensional model of the utility unit 42 from a predetermined viewpoint, images obtained by photographing a device with a substantially identical structure to the utility unit 42 can also be used to represent the structure of the utility unit 42.

[0100] Then, in step S108, the control unit 100 determines whether the ILK has been released. That is, after the replacement of the part that is the main cause of the ILK has been completed, the operator releases the ILK by pressing the reset switch. In step S108, if the control unit 100 determines that the ILK has not been released, it returns to the processing in step S107.

[0101] In step S108, if the control unit 100 determines that an ILK release operation has been accepted and the ILK has been released, in step S109, the display of the released ILK is cleared and the process ends. The ILK release operation can be performed from the screen displaying the list of IDs and alarm IDs, or by clicking on a module displaying ILK information that is overlaid on an image showing the structure of the board processing apparatus 1 displayed on the display unit 204.

[0102] As described above, by displaying the locations where ILKs have occurred or are about to occur on an image showing the structure of the device, the operator can easily identify these locations. Furthermore, by further displaying information indicating the ILKs, the cause of the ILKs can be easily traced, reducing the time the device is unable to operate. Moreover, in the case of multiple ILKs, the operator can infer the commonality of the underlying causes based on the proximity of the ILK locations.

[0103] Figure 9 This is a diagram showing a modified example of the display screen of ILK in display unit 204.

[0104] exist Figure 9 The diagram shows a case where multiple ILKs are generated in the same module of the substrate processing apparatus 1.

[0105] If another ILK to be displayed is established before the previously displayed ILK is deactivated, the display unit 204, under the control of the control unit 100, overlays information representing each of the previous and subsequent ILKs at the positions corresponding to the modules corresponding to their respective main functions. That is, when the positions corresponding to the modules corresponding to their respective main functions in the image representing the structure of the substrate processing apparatus 1 are close, the control unit 100 performs overlay display in a manner where the display of one is obscured by the display of the other.

[0106] In this modified example, the same effect as described above can be obtained. Furthermore, in this modified example, the operator can infer the commonality of the main causes of the substantial ILK based on the distance of the ILK generation location displayed on the display unit 204. Moreover, due to the overlapping display, the display is concentrated and easy to observe, allowing the operator to easily determine the generation location of the ILK.

[0107] The structure of the substrate processing apparatus 1 and the display control in the display unit 204 described in the above-described manner and variations are examples, and can be changed according to the situation without departing from the main idea.

[0108] In the above method, the following example is provided: the utility unit 42 is divided into multiple modules, and the modules corresponding to a major cause of ILK establishment or a major cause of ILK establishment are graphically displayed on the display unit 204 in a manner that can be identified in an image showing the structure of the substrate processing apparatus 1. This disclosure is not limited to this; the exhaust unit 43 or other structures constituting the substrate processing apparatus 1 can be divided into multiple modules, and the modules corresponding to a major cause of ILK establishment or a major cause of ILK establishment or a major cause of ILK establishment can be graphically displayed on the display unit 204 in a manner that can be identified in an image showing the structure of the substrate processing apparatus 1.

[0109] Furthermore, the above description uses the case where the control unit 100 is used as both an interlock determination unit and a display control unit as an example. This disclosure is not limited to this; the interlock determination unit and display control unit can also be housed in a host computer shared by multiple devices. In this case, the host computer can perform the following control: receive sensor information and information indicating ILK from the board processing device 1, determine whether ILK is established, and display it on the display unit. Additionally, a portable terminal such as a tablet computer can be used as the display unit 204.

[0110] Furthermore, in the above method, the following example is provided: a module corresponding to a major cause of ILK establishment, or a module corresponding to a major cause of ILK establishment, is graphically displayed on the display unit 204 in a manner that allows it to be recognized in an image showing the structure of the substrate processing apparatus 1. This disclosure is not limited to this; an augmented reality device that displays an image representing ILK overlaid on a displayed image of the substrate processing apparatus 1 and is recognized by human vision may also be used.

[0111] In addition, the processing flow described above is just one example. Unnecessary steps can be deleted, new steps can be added, or the processing order can be changed without deviating from the main point.

[0112] Furthermore, the above description illustrates the scenario where the processing described above is achieved using a computer through a software structure by executing a program, but it is not limited to this. The above method can also be implemented, for example, through a hardware structure or a combination of hardware and software structures.

[0113] This disclosure can be applied not only to substrate manufacturing apparatuses for semiconductor manufacturing, but also to apparatuses for processing glass substrates, such as LCD (Liquid Crystal Display) manufacturing apparatuses, and other substrate manufacturing apparatuses. The substrate processing includes not only film formation processes such as forming CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), epitaxial growth films, oxide films, nitride films, and metal-containing films, but also annealing, oxidation, diffusion, etching, exposure, photolithography, coating, molding, development, dicing, wire bonding, and inspection processes.

[0114] In the above-described method, an example of processing substrates using a vertical (also known as a batch) substrate processing apparatus that processes multiple substrates at a time has been described. This disclosure is not limited to the above-described method; for example, it can also be appropriately applied to cases where substrates are processed using a monolithic substrate processing apparatus that processes one or several substrates at a time. Furthermore, in the above-described method, an example of processing substrates using a substrate processing apparatus with a hot-wall type furnace has been described. This disclosure is not limited to the above-described method; it can also be appropriately applied to cases where substrates are processed using a substrate processing apparatus with a cold-wall type furnace.

[0115] When using these substrate processing apparatuses, each processing step and processing condition can be performed in the same manner and in the same way as described above and in the modified examples, and the same effect as described above and in the modified examples can be obtained.

[0116] The methods and variations described above can be used in appropriate combinations. The processing order and conditions can, for example, be set to be the same as those in the methods and variations described above.

[0117] Explanation of reference numerals in the attached figures

[0118] 1. Substrate processing apparatus

[0119] Modules 45a, 45b, 47a, 47b, 54, and 55

[0120] 53a~53f sensors (detection department)

[0121] 100 Control Department

[0122] 204 Display Section.

Claims

1. An interlocking system, characterized in that, The interlocking system has the following features: The detection unit is respectively installed in multiple modules constituting the substrate processing device, and detects the physical state of the substrate processing device and outputs it as a detection signal. The interlock determination unit stores pre-set conditions for the interlock to be established for each of the multiple interlocks, and determines whether the multiple interlocks are established based on the detection signals from the detection unit. as well as The display control unit is capable of graphically displaying, in a manner recognizable in an image representing the structure of the substrate processing apparatus, a module corresponding to a primary cause of the interlock being established when any one of the plurality of interlocks is established; or, when an interlock is generated when a physical condition is met, graphically displaying, in a manner recognizable in an image representing the structure of the substrate processing apparatus, a module corresponding to a primary cause of the interlock being prevented from being established.

2. The interlocking system according to claim 1, characterized in that, The interlocking system also includes a storage unit that stores image data representing an image of the structure of the substrate processing device and a display position table. The display position table maintains the positions in the image representing the structure of the substrate processing device corresponding to modules that constitute the interlock or modules that prevent the interlock from being established. The display control unit controls the display to display interlocking information superimposed on the positions corresponding to the modules corresponding to the respective main causes in an image showing the structure of the substrate processing device.

3. The interlocking system according to claim 2, characterized in that, The information indicating the interlock is image data.

4. The interlocking system according to claim 2, characterized in that, The storage unit also stores a substantial principal cause table, which, for each of the plurality of interlocks, maintains the substantial principal cause that enables the interlock as a principal cause that enables the interlock.

5. The interlocking system according to claim 1, characterized in that, The interlocking system also includes a pre-detection unit, which detects a module corresponding to a major cause that prevents the interlock from being established when another physical state meets the conditions for interlocking in the plurality of interlocks. For any non-established interlocks detected by the pre-detection unit, the display control unit graphically displays the module corresponding to a major cause that prevents the establishment of the interlock on the display unit in a manner that can be identified in an image representing the structure of the substrate processing device.

6. The interlocking system according to claim 1, characterized in that, The plurality of modules are modules obtained by dividing at least one of the utility section and the exhaust section of the substrate processing apparatus into a plurality of partitions.

7. The interlocking system according to claim 1, characterized in that, The image representing the structure of the substrate processing apparatus includes at least one of the following: an image obtained by projecting or viewing a three-dimensional model of the substrate processing apparatus from a predetermined viewpoint, and an image obtained by photographing an apparatus with substantially the same structure as the substrate processing apparatus.

8. The interlocking system according to claim 1, characterized in that, The display unit is an augmented reality device that displays the image by overlaying an image representing an interlocking image onto the real image of the substrate processing device and recognizing it through human vision.

9. The interlocking system according to claim 1, characterized in that, The interlocking system also includes a safety interlocking device, which is equipped with logic capable of determining whether the conditions of the multiple interlocks are met. Based on the detection signal from the detection unit, the device outputs the calculation results of each definition to at least one of the following: a warning sound from the board processing device, the display control unit, the power circuit breaker, the container conveying unit, the transfer machine, and the valve. The interlock determination unit is installed by a control unit that performs the same determination as the safety interlock device.

10. The interlocking system according to claim 1, characterized in that, The display control unit controls the display to such that, if another interlock to be displayed is established before the previously displayed interlock is released, the information representing each of the previous and subsequent interlocks is overlapped at the position corresponding to the module corresponding to each of the main causes. If the positions corresponding to the modules corresponding to each of the main causes in the image representing the structure of the substrate processing device are close, the display of one side is overlapped in such a way that the display of the other side is obscured.

11. The interlocking system according to claim 9, characterized in that, The safety interlock device and the control unit are installed using independent hardware.

12. A substrate processing apparatus, characterized in that, The substrate processing device has multiple modules and an interlocking system. The interlocking system has the following features: The detection unit is disposed in each of the plurality of modules, and detects the physical state of the device and outputs it as a detection signal; The interlock determination unit stores pre-set conditions for the interlock to be established for each of the multiple interlocks, and determines whether the multiple interlocks are established based on the detection signals from the detection unit. as well as The display control unit is capable of graphically displaying, in a manner recognizable in an image representing the structure of the device, a module corresponding to a primary cause of the interlock being established when any one of the plurality of interlocks is established; or, when an interlock is generated when a physical condition is met, graphically displaying, in a manner recognizable in an image representing the structure of the device, a module corresponding to a primary cause of the interlock being prevented from being established.

13. A method for displaying interlocking mechanisms, characterized in that, It has the following processes: The physical state of the substrate processing apparatus is detected by detection units provided in multiple modules constituting the substrate processing apparatus and output as detection signals. For each of the multiple interlocks, pre-set conditions for the interlock to be established are stored, and based on the detection signal from the detection unit, it is determined whether the multiple interlocks are established. as well as When any one of the plurality of interlocks is established, the module corresponding to a major cause of the interlock being established is graphically displayed on the display unit in a manner that can be identified in an image representing the structure of the substrate processing apparatus. Alternatively, when an interlock is generated when a physical condition is met, the module corresponding to a major cause that prevents the establishment of the interlock is graphically displayed on the display unit in a manner that can be identified in an image representing the structure of the substrate processing apparatus.

14. A method for manufacturing a semiconductor device, characterized in that, It has the following processes: Processing substrate; The physical state of the device is detected by detection units installed in multiple modules constituting the device, and the detected state is output as a detection signal. For each of the multiple interlocks, pre-set conditions for the interlock to be established are stored, and based on the detection signal from the detection unit, it is determined whether the multiple interlocks are established. as well as When any one of the multiple interlocks is established, the module corresponding to a major cause that makes the interlock established will be graphically displayed on the display unit in a manner that can be identified in an image representing the structure of the device. Or, when an interlock is generated when the physical state meets the conditions, the module corresponding to a major cause that prevents the establishment of the interlock will be graphically displayed on the display unit in a manner that can be identified in an image representing the structure of the device.

15. A program, characterized in that, The substrate processing apparatus performs the following steps: The physical state of the substrate processing apparatus is detected by detection units provided in multiple modules constituting the substrate processing apparatus and output as detection signals. For each of the multiple interlocks, pre-set conditions for the interlock to be established are stored, and based on the detection signal from the detection unit, it is determined whether the multiple interlocks are established. as well as When any one of the plurality of interlocks is established, the module corresponding to a major cause of the interlock being established is graphically displayed on the display unit in a manner that can be identified in an image representing the structure of the substrate processing apparatus. Alternatively, when an interlock is generated when a physical condition is met, the module corresponding to a major cause that prevents the establishment of the interlock is graphically displayed on the display unit in a manner that can be identified in an image representing the structure of the substrate processing apparatus.

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