Electronic device

Abstract

An electronic device capable of improving the cooling capacity of a heating element built in the electronic device arranged in various postures. The heat pipe (50) includes a heat dissipation portion (51) connected to the heat sink (61, 62) and an outer surface (53) in contact with the heat transfer member (70), and includes a pipe lower portion (52) located below the heat transfer member (51) and extending in a direction intersecting the vertical direction when the device body (11) is in the vertical posture. The tube lower portion (52) includes an extension (55) extending outside an outer edge of the heat transfer member (70).

Description

Technical Field

[0001] This disclosure relates to electronic devices. Background Technology

[0002] Electronic devices are sometimes used in multiple orientations. For example, the electronic device described in Patent Document 1 below can be used in both a vertical and a horizontal orientation. Furthermore, a heat dissipation device including heat pipes and heat sinks is used to cool heating elements such as IC chips built into the electronic device.

[0003] Citation List

[0004] Patent documents

[0005] Patent Document 1: JP 2021-158287 A Summary of the Invention

[0006] The problem the invention aims to solve

[0007] In recent years, even for electronic devices with various orientations, there is a need for structures with higher cooling performance.

[0008] The purpose of this disclosure is to provide an electronic device and a heat dissipation device that can improve the cooling capacity of heating elements built into electronic devices arranged in various orientations.

[0009] Problem-solving methods

[0010] The electronic device according to this disclosure may include: a plate on which a heating element is mounted; a housing that houses the plate; a heat pipe housed in the housing and extending along the plate; a heat sink housed in the housing, and which is positioned above the heating element when the housing is in a first position; and a heat transfer member positioned between the heating element and the heat pipe and in contact with both the heating element and the heat pipe. The heat pipe may include: a heat dissipation portion connected to the heat sink; and a lower portion including an outer surface in contact with the heat transfer member, located below the heat dissipation portion when the housing is in the first position, and extending in a direction intersecting the vertical direction. The lower portion may include a tapered portion and an extension portion, the tapered portion including the tip of the heat pipe and tapering towards the tip, and the extension portion located outside the outer edge of the heat transfer member and extending to the tapered portion. Alternatively, space may be provided on the side opposite to the heat transfer member, separated by the lower portion, to expose the outer surface of the extension portion. Accordingly, the cooling capacity of the heating element built into an electronic device configured in multiple positions can be improved.

[0011] Furthermore, the electronic device according to this disclosure may include: a plate on which a heating element is mounted; a housing that houses the plate; a heat pipe housed in the housing and extending along the plate; a radiator housed in the housing and positioned above the heating element when the housing is in a first position; and a heat transfer member positioned between the heating element and the heat pipe and in contact with both the heating element and the heat pipe. The heat pipe may include: a heat dissipation portion connected to the radiator; and a lower portion including an outer surface in contact with the heat transfer member, located below the heat dissipation portion when the housing is in the first position, and extending in a direction intersecting the vertical direction. The lower portion may include a heat receiving portion including an outer surface in contact with the heat transfer member and located inside the outer edge of the heat transfer member, and an extension located between the heat receiving portion and the heat dissipation portion and located below the heat receiving portion when the housing is in the first position. This improves the cooling capacity of heating elements integrated into electronic devices configured in multiple positions. Attached Figure Description

[0012] [ Figure 1A ] Figure 1A This is a perspective view showing an example of an electronic device in a vertical orientation.

[0013] [ Figure 1B ] Figure 1B This is a perspective view showing an example of an electronic device in a horizontal orientation.

[0014] [ Figure 2 ] Figure 2 It is an exploded perspective view showing some of the components of the main body of the device.

[0015] [ Figure 3A ] Figure 3A This is a plan view of the heat dissipation device.

[0016] [ Figure 3B ] Figure 3B This is a rear view of the heat dissipation device.

[0017] [ Figure 4 ] Figure 4 It is a cross-sectional view of the circuit board, heat dissipation device, and power supply device.

[0018] [ Figure 5A ] Figure 5A yes Figure 4 Enlarged view of the heat pipes and heat transfer components in the cross-sectional view.

[0019] [ Figure 5B ] Figure 5B It is along Figure 3BThe cross-sectional view of the heat pipe taken from line VB-VB in the diagram.

[0020] [ Figure 6 [This is a cross-sectional view of a heat pipe incorporated into an electronic device according to other embodiments.]

[0021] [ Figure 7 ] Figure 7 This is a plan view showing a portion of a heat dissipation device incorporated in an electronic device according to another embodiment. Detailed Implementation

[0022] Hereinafter, electronic device 10, which is an example of an electronic device proposed in this disclosure, will be described with reference to the accompanying drawings. Figure 1A This is a perspective view showing the electronic device 10 in a vertical position (first position). Figure 1B This is a perspective view showing the electronic device 10 in a horizontal posture (second posture). In the following description, the arrow G in each figure indicates the direction of gravity, referred to as "gravity direction G".

[0023] [1. Overview of Electronic Devices]

[0024] Electronic device 10 may be a computer, such as a gaming device, a personal computer, or a server computer. Figure 1A and Figure 1B As shown, the electronic device 10 may have a device body 11 and a first cover 12 and a second cover 13 covering the device body 11. For example... Figure 1A and Figure 1B As shown, the dimensions of the first cover 12 and the second cover 13 can be designed to cover the entire device body 11, or they can be designed to cover only a part of the device body 11.

[0025] Figure 2 This is an exploded perspective view showing some components of the main body 11 of the device. In the following description, [the following will be described as follows]. Figure 2 The X1 direction of the X-axis, as shown, is defined as the right direction, and the X2 direction is defined as the left direction. Furthermore, the Y1 and Y2 directions of the Y-axis, which are perpendicular to the X-axis, are defined as the front-back directions, respectively. And the Z1 and Z2 directions of the Z-axis, which are perpendicular to the X and Y axes, are defined as the up-down directions, respectively. However, these directions are defined to describe the shape and relative position of the various components (parts, components, parts) of the electronic device 10, and do not limit the orientation of the electronic device 10 relative to a surface such as a table or floor.

[0026] The device body 11 may be a box-shaped housing. The device body 11 may have a first outer shell 14 forming the outer surface of the housing (in...). Figure 2 (as shown in the image) and a second outer shell (not shown), which also forms part of the outer surface. Furthermore, as... Figure 2As shown, the main body 11 of the device may include a circuit board 20, a heat dissipation device 30, and a power supply device 40. The circuit board 20, the heat dissipation device 30, and the power supply device 40 may be housed within a box-shaped housing formed by a first outer shell 14 and a second outer shell.

[0027] Electronic device 10 can be as follows Figure 1A The vertical posture shown (first posture) or as shown Figure 1B The horizontal orientation (second orientation) shown is relative to a mounting surface such as a table or floor. A vertical orientation, for example, refers to the orientation in which the circuit board 20 housed inside the device body 11 is upright relative to the mounting surface. A horizontal orientation, for example, refers to the orientation in which the circuit board 20 housed inside the device body 11 is arranged along the mounting surface. When the electronic device 10 is in... Figure 1A When the electronic device 10 is in the vertical orientation shown, the circuit board 20 can be positioned along the direction of gravity G. Figure 1A In the vertical posture shown, Figure 2 The direction of the X-axis, as shown, can be aligned with the direction of gravity G. Therefore, Figure 2 The X1 and X2 directions shown in the other accompanying figures can also be referred to as the up direction and the down direction.

[0028] like Figure 2 As shown, electronic components used as heating elements can be mounted on circuit board 20. For example, IC chip 21 can be mounted on circuit board 20 as a heating element. IC chip 21 can be a flat semiconductor such as silicon, referred to as a die. IC chip 21 can be a chip such as a SoC that integrates a central processing unit (CPU), a graphics processing unit (GPU), and I / O functions. IC chip 21 can also include memory functions such as read-only memory (ROM) and random access memory (RAM).

[0029] The heat dissipation device 30 is used to cool the IC chip 21, which acts as a heating element, and can contact the IC chip 21. For example... Figure 2 As shown, the heat dissipation device 30 can be located above the IC chip 21 (in... Figure 2 (In the direction indicated by Z1).

[0030] The circuit board 20 can be housed within a circuit board shield (not shown) made of a conductive material such as iron or aluminum. An opening can be formed in the circuit board shield to expose the IC chip 21, and a heat dissipation device 30 can be connected to the IC chip 21 within this opening. Figure 2 In the example shown, the circuit board shield has a shielding plate 80 with an opening H1 formed in a part of the circuit board shield, and the heat dissipation device 30 can contact the IC chip 21 within the opening H1.

[0031] The power supply unit 40 can also use current supplied from an external power source to supply drive power to various components such as the IC chip 21 included in the main body 11. The power supply unit 40 may have a housing 41. A circuit board 42 including a transformer, rectifier circuit, etc. (see reference) Figure 4 It can be housed inside the outer casing 41. For example... Figure 2 As shown, the power supply device 40 can be located above the IC chip 21 and multiple heat pipes 50 (described later). Figure 2 (In the direction indicated by Z1).

[0032] [2. Overview of the heat dissipation device]

[0033] Figure 3A This is a top view of the heat dissipation device 30. Figure 3B This is a side view of the heat dissipation device 30, from... Figure 3A Observe the diagram of heat dissipation device 30 in the direction of arrow L. Figure 4 This is a cross-sectional view of the circuit board 20, the heat dissipation device 30, and the power supply device 40. Figure 4 It is merged Figure 3A The cross-sectional view of the electronic device 10 of the heat dissipation device 30 shown illustrates that it includes... Figure 3A The cross-section of the cut surface of line IV-IV.

[0034] like Figure 3A As shown, the heat dissipation device 30 may include a plurality of rod-shaped heat pipes 50 (50A to 50E), radiators 61 and 62, and heat transfer components 70. These components may be made of a metal with high thermal conductivity, such as aluminum or copper, or may be made of iron.

[0035] Multiple heat pipes 50 and heat transfer components 70 can be used to transfer heat from the IC chip 21, which acts as a heating element, to heat sinks 61 and 62. For example... Figure 4 As shown, the heat transfer member 70 can be located between the IC chip 21 and the heat pipe 50, and can be in contact with both the IC chip 21 and the heat pipe 50. Furthermore, the heat pipe 50 can be connected to one or both of the heat sinks 61 and 62. Thus, heat from the IC chip 21 can be transferred to the heat sinks 61 and 62 via the heat transfer member 70 and the heat pipe 50.

[0036] Heat sinks 61 and 62 can be thermally connected to the IC chip 21, which serves as a heating element, via heat transfer member 70 and heat pipe 50. Heat sinks 61 and 62 may include multiple heat sink fins. This allows for efficient dissipation of heat from the IC chip 21 transferred via heat transfer member 70 and heat pipe 50 to the outside of the electronic device 10. Figure 3A As shown, when the main body 11 (casing) of the device is in a vertical position (first position), the heat sinks 61 and 62 can be located on the IC chip 21, which serves as a heating element (see Figure 1). Figure 4) and above the heat transfer component 70 that is in contact with the IC chip (in Figure 3A (in the direction represented by X1).

[0037] [3. Heat pipe structure]

[0038] like Figure 2 As shown, each of the plurality of heat pipes 50 (50A to 50E) can extend along the circuit board 20. Figure 3A As shown, each heat pipe 50 may have a heat dissipation section 51 connected to a heat sink 61 or 62. The outer surface of the heat dissipation section 51 may contact the fins of the heat sink 61 or 62. The heat dissipation section 51 may be located between the fins positioned at one end of the heat sink 61 (or heat sink 62) and the fins positioned at the other end.

[0039] Each heat pipe 50 may have a lower portion 52. When the main body 11, which serves as the housing, is in a vertical position (first position), the lower portion 52 may be located below the heat dissipation section 51 (in...). Figure 3A (in the direction indicated by X2), and can be in the direction intersecting the vertical direction (in) Figure 3A It extends along the direction indicated by the X-axis. For example... Figure 4 As shown, the lower part 52 of each heat pipe 50 may have an outer surface 53 that contacts the heat transfer member 70.

[0040] Figure 5A yes Figure 4 Heat pipe 50 in cross-sectional view ( Figure 3A An enlarged view of the lower part 52 of the heat pipe 50C and the heat transfer component 70 shown. Figure 5B It is along Figure 3B VB-VB line heat pipe 50 ( Figure 3A The diagram shows a cross-sectional view of the lower part 52 of the heat pipe 50C. Figure 5A The main body 11 of the device is shown in a horizontal position. Figure 5B The main body 11 of the device is shown in a vertical position.

[0041] like Figure 4 , Figure 5A and Figure 5B As shown, the lower portion 52 of each heat pipe 50 may include a tapered portion 54, which includes the tip E of the heat pipe 50 and tapers gradually toward the tip E. The lower portion 52 of each heat pipe 50 may have an extension 55, which is positioned outside the outer edge of the heat transfer member 70 and extends to the tapered portion 54. The cross-sectional area of ​​the extension 55 (the area of ​​the section perpendicular to the extension 55) may be substantially uniform.

[0042] In addition, such as Figure 4 , 5AAs shown in Figure 5B, the lower portion 52 of each heat pipe 50 may include an outer surface 53 that contacts the heat transfer member 70, and has a heat receiving portion 56 located inside the outer edge of the heat transfer member 70. When the device body 11 is in a vertical position (first position), the extension 55 of each heat pipe 50 can be in the vertical direction ( Figure 3A and Figure 5B Located at the same position as or below the heat receiver 56 in the direction indicated on the X-axis (as shown in the diagram). Figure 3A and Figure 5B In the example shown, the extension 55 is located at the same position as the heat receiving part 56 in the vertical direction.

[0043] Furthermore, when the main body 11 of the device is in a vertical position, the heat receiving part 56 of each heat pipe 50 can be positioned in the direction indicated by the Y-axis in each figure (as opposed to the direction indicated by the Y-axis in each figure). Figure 5B The extension 55 of each heat pipe 50 may extend from the heat receiving portion 56 in the front-to-back direction (the first direction in which the vertical directions intersect, indicated by the X-axis). Figure 5B The portion extending in the left-right direction, or the portion extending in the front-back direction and the lower diagonal direction. Figure 5B In the example shown, the entire extension 55 extends forward from the heat receiver 56 (in the Y2 direction, or towards) Figure 5B (Extends to the left in the middle).

[0044] In addition, such as Figure 4 As shown, a space S is ensured on the side opposite the heat transfer member 70, at the lower part 52 of each heat pipe 50, in which the outer surface of the extension 55 of the heat pipe 50 is exposed. Figure 3A and Figure 4 In the example shown, extension 55 does not contact heat sinks 61 and 62. Figure 4 In the example shown, the power supply unit 40 is disposed inside the device body 11, which serves as a housing, and a space S is ensured between the power supply unit 40 and the extension 55. Figure 4 In the example shown, the extension 55 does not contact the power supply unit 40. The extension 55 can be disposed away from all components and parts housed in the device body 11 and can avoid contact with these components and parts. Therefore, it is possible to prevent the heat pipe 50 from being pressed by components or parts such as the power supply unit 40 from the side opposite to the circuit board 20, thereby preventing external forces from being applied to the circuit board 20.

[0045] like Figure 5A and Figure 5BAs shown, each heat pipe 50 may have a sintered body layer 58 formed by sintering powder such as metal, which is stacked on the inner wall surface of the pipe 50a, including the outer surface 53. The sintered body layer 58 may be formed in a cylindrical shape inside the pipe 50a, and a cavity 59 may be formed inside the sintered body layer 58. A working fluid may be sealed inside the pipe 50a. The working fluid may be appropriately selected according to the material of the pipe 50a, and may be, for example, water.

[0046] The sintered body layer 58 may contain a number of voids corresponding to the shape and particle size of the sintered metal or other powder. The working fluid can be absorbed into the voids in the sintered body layer 58 and can move through the sintered body layer 58 due to capillary forces. The working fluid present in the sintered body layer 58 can be heated and evaporated by receiving heat from the heat transfer member 70. Thus, the working fluid vaporizes in the heat receiving portion 56 in contact with the heat transfer member 70 of each heat pipe 50, thereby absorbing heat from the heat transfer member 70 and cooling the IC chip 21 in contact with the heat transfer member 70.

[0047] The vaporized working fluid can also move within the cavity 59. Due to the heat dissipation effect of the radiator 61 and / or radiator 62, the vapor of the working fluid present in the cavity 59 can condense and liquefy. The liquefied working fluid can then move through the sintered body layer 58, receive heat from the heat transfer member 70 in the heat receiving section 56, be heated, and evaporate. By circulating the working fluid inside each heat pipe 50 in this way, heat from the heat transfer member 70 can be absorbed efficiently, and the IC chip 21 in contact with the heat transfer member 70 can be cooled.

[0048] When the main body 11 of the device is in a horizontal position, such as Figure 2 As shown, because each heat pipe 50 extends along the circuit board 20, the working fluid penetrates into a relatively wide area of ​​the sintered body layer 58. That is, the working fluid diffuses substantially uniformly along the entire length of each heat pipe 50. Conversely, when the device body 11 is in a vertical position, as... Figure 3A As shown, since the lower part 52 of each heat pipe 50 is located below the heat dissipation part 51 that contacts the radiator 61 or radiator 62, the amount of working fluid accumulated in the lower part 52 increases. Therefore, the water level of the working fluid in the lower part 52 when the main body 11 of the device is in a vertical position (refer to...) Figure 5B The water level of the working fluid in the lower part 52 of the pipe when the main body 11 of the device is in a horizontal position (refer to W2) is higher than that of the working fluid in the lower part 52 of the pipe. Figure 5A W1) is high.

[0049] To ensure the vaporization of the working fluid within the heat receiving section 56 of each heat pipe 50, it is preferable that the water level of the working fluid within the heat receiving section 56 does not exceed the height of the sintered body layer 58 (i.e., the water level of the working fluid does not reach the cavity 59). To lower the position of the working fluid level in the lower tube portion 52 when the device body 11 is in a vertical position, as described above, the lower tube portion 52 may be formed with an extension 55 extending from the heat receiving section 56 in contact with the heat transfer member 70 to the tapered portion 54. By forming the extension 55 in this way, when the device body 11 is in a vertical position, the volume of working fluid accumulating in the sintered body layer 58 of the lower tube portion 52 can be ensured, and the water level W2 of the working fluid in the heat receiving section 56 can be reduced (see...). Figure 5B The position of the heat pipe 50 is such that even when the main body 11 of the device is in a vertical position, the working fluid inside each heat pipe 50 can be efficiently vaporized, and the heating element, i.e., the IC chip 21, mounted on the circuit board 20 can be efficiently cooled.

[0050] In addition, such as Figure 4 As shown, a space S can also be provided where the outer surface of the lower part 52 (more specifically, the outer surface of the extension 55) of the heat pipe 50 is exposed on the side opposite to the heat transfer member 70 (more specifically, between the power supply device 40 and the extension 55 of the heat pipe 50). As described above, by providing a space S between the heat pipe 50 and components such as the power supply device 40, it is possible to prevent the heat pipe 50 from being pushed from the side opposite to the circuit board 20, thereby preventing external forces from being applied to the circuit board 20.

[0051] [4. Variations]

[0052] Note that the present invention is not limited to the embodiments described above.

[0053] (1) Figure 6 This is a cross-sectional view of the lower portion 52 of the heat pipe 50 incorporated into an electronic device according to other embodiments. Figure 6 The diagram shows the main body 11 of the device in a vertical position (first position). Figure 6 As shown, when the main body 11 of the device is in a vertical position, the extension 55 of the heat pipe 50 can be in the vertical direction (by... Figure 6 Located below the heat receiver 56 on the X-axis (in the direction indicated by the X-axis) (in the direction indicated by the X-axis). Figure 6 (In the direction indicated by X2 in the diagram). Furthermore, as... Figure 6 As shown, when the main body 11 of the device is in a vertical position, the heat receiving part 56 of the heat pipe 50 can be positioned in the front-back direction (first direction, by...). Figure 6 The extension 55 extends in the direction indicated by the Y-axis and may include portions extending in the front-back direction and the lower diagonal direction.

[0054] This arrangement also ensures that the sintered body layer 58 in the lower part 52 has sufficient capacity to accumulate working fluid when the main body 11 of the device is in a vertical position, and can lower the water level W3 of the working fluid in the heat receiving part 56 (reference). Figure 6 Therefore, even when the main body 11 of the device is in a vertical position, the working fluid inside the heat receiving section 56 can be efficiently vaporized, thereby efficiently cooling the IC chip 21.

[0055] (2) Figure 7 This is a plan view showing a portion of a heat dissipation device 30 built into an electronic device according to another embodiment. Figure 7 In the illustrated heat dissipation device 30, the heat pipe 50 has an extension 57 located between the heat receiving portion 56 and the heat dissipation portion 51. For example... Figure 7 As shown, when the main body 11 of the device is in a vertical position (first position), the extension 57 can be located below the heat receiving part 56 (in...). Figure 7 (In the direction indicated by X2). That is, the bottom surface of the extension 57 (the surface facing the X2 direction) may be lower than the bottom surface of the heat receiving part 56. Figure 7 As shown in the diagram, when the main body 11 of the device is in a vertical position, the heat receiving part 56 can be positioned in the front-back direction (first direction, by...). Figure 7 It extends in the direction indicated by the Y-axis. In addition, the extension 57 may include a portion that extends obliquely downward from the heat receiving portion 56 in the front-rear direction.

[0056] This construction also ensures that the sintered body layer 58 within the extension 57 has sufficient capacity to accumulate the working fluid when the device body 11 is in a vertical position. Therefore, the water level of the working fluid in the heat receiver 56 can be lowered, allowing the working fluid inside the heat receiver 56 to evaporate effectively. As a result, the IC chip 21 can be cooled efficiently.

[0057] [5. Summary] (1)

[0059] As described above, the electronic device described in this disclosure may include: a plate on which a heating element is mounted; a housing that houses the plate; a heat pipe housed within the housing and extending along the plate; a radiator housed within the housing and positioned above the heating element when the housing is in a first orientation; and a heat transfer member located between the heating element and the heat pipe and in contact with both the heating element and the heat pipe. The heat pipe may include: a heat dissipation portion connected to the radiator; and a lower portion including an outer surface in contact with the heat transfer member and located below the heat dissipation portion when the housing is in the first orientation, extending in a direction intersecting the vertical direction. The lower portion may include a tapered portion and an extension portion, the tapered portion including the tip of the heat pipe and tapering towards the tip, and the extension portion located outside the outer edge of the heat transfer member and extending to the tapered portion. Space is provided across the lower portion, on the side opposite the heat transfer member, to expose the outer surface of the extension portion. Accordingly, the cooling capacity of the heating element built into an electronic device configured in multiple orientations can be improved. (4)

[0061] Furthermore, the electronic device according to this disclosure may include: a plate on which a heating element is mounted; a housing that houses the plate; a heat pipe housed within the housing and extending along the plate; a heat sink housed within the housing and positioned above the heating element when the housing is in a first orientation; and a heat transfer member located between the heating element and the heat pipe and in contact with both the heating element and the heat pipe. The heat pipe may include: a heat dissipation portion connected to the heat sink; and a lower portion including an outer surface in contact with the heat transfer member, located below the heat dissipation portion when the housing is in the first orientation, and extending in a direction intersecting the vertical direction. The lower portion may include a heat receiving portion including an outer surface in contact with the heat transfer member and located inside the outer edge of the heat transfer member, and an extension located between the heat receiving portion and the heat dissipation portion and located below the heat receiving portion when the housing is in the first orientation. This improves the cooling capacity of heating elements integrated into electronic devices configured in multiple orientations. (2)

[0063] In the electronic device described in (1) or (4) above, the lower part of the tube may include an outer surface that contacts the heat transfer member, and may include a heat receiving portion located inside the outer edge of the heat transfer member. When the housing is in the first posture, the extension may be positioned vertically at the same location as the heat receiving portion or positioned below the heat receiving portion. (3)

[0065] In the electronic device described in (2) above, when the housing is in a first posture, the heat receiving part may extend in a first direction intersecting the vertical direction, and the extension may include a portion extending from the heat receiving part in the first direction or in both the first direction and the lower diagonal direction. (5)

[0067] In any one of the above (2) to (4) electronic devices, when the housing is in a first posture, the heat receiving part may extend in a first direction intersecting the vertical direction, and the extension may include portions extending from the heat receiving part in the first direction and the lower diagonal direction.

Claims

1.An electronic device comprising: a board on which a heating element is mounted; a housing which accommodates the board; a heat pipe which is accommodated in the housing and extends along the board; a heat spreader which is accommodated in the housing and is disposed above the heating element when the housing is in a first attitude; and a heat transfer member which is positioned between and in contact with both the heating element and the heat pipe, wherein the heat pipe comprises: a heat radiating portion connected to the heat spreader, and a pipe lower portion including an outer surface in contact with the heat transfer member, the pipe lower portion being positioned below the heat radiating portion and extending in a direction intersecting the vertical direction when the housing is in the first attitude, the pipe lower portion comprises: a tapered portion including a tip of the heat pipe and tapering toward the tip, and an extension portion located outside an outer edge of the heat transfer member and extending to the tapered portion, and a space in which an outer surface of the extension portion is exposed is secured on a side opposite the heat transfer member across the pipe lower portion. the pipe lower portion includes an outer surface in contact with the heat transfer member and includes a heat receiving portion located inside an outer edge of the heat transfer member, and 2.The electronic device of claim 1, wherein, the extension portion is positioned at the same position as the heat receiving portion or below the heat receiving portion in the vertical direction when the housing is in the first attitude. the heat receiving portion extends in a first direction intersecting the vertical direction when the housing is in the first attitude, and the extension portion includes a portion extending from the heat receiving portion in the first direction or in both the first direction and a downward diagonal direction. 3.The electronic device of claim 2, wherein, 4.An electronic device comprising: a board on which a heating element is mounted; a housing which accommodates the board; a heat pipe which is accommodated in the housing and extends along the board; a heat spreader which is accommodated in the housing and is disposed above the heating element when the housing is in a first attitude; and a heat transfer member which is positioned between and in contact with both the heating element and the heat pipe, wherein the heat pipe comprises: a heat radiating portion connected to the heat spreader, and a pipe lower portion including an outer surface in contact with the heat transfer member, the pipe lower portion being positioned below the heat radiating portion and extending in a direction intersecting the vertical direction when the housing is in the first attitude; and the pipe lower portion comprises: a heat receiving portion including an outer surface in contact with the heat transfer member and located inside an outer edge of the heat transfer member, and an extension portion positioned between the heat receiving portion and the heat radiating portion and positioned below the heat receiving portion when the housing is in the first attitude. the heat receiving portion extends in a first direction intersecting the vertical direction when the housing is in the first attitude, and the extension portion includes a portion extending from the heat receiving portion in the first direction and in a downward diagonal direction. ​ 5.The electronic device of claim 4, wherein ​

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