Temperature-controllable glue supply machine

Abstract

The invention discloses a temperature-controllable glue supply machine, and particularly relates to the field of glue supply machines, the temperature-controllable glue supply machine comprises a base and a control box, the control box is arranged in the middle of the base, glue storage barrels are arranged on the two sides of the base, and temperature regulation and control assemblies for regulating and controlling the internal temperature of the glue storage barrels are arranged on the outer sides of the glue storage barrels; the temperature regulation and control assembly comprises a C-shaped plate body which sleeves the outer side of the glue storage barrel and is connected with the base, heat dissipation holes are formed in the periphery of the C-shaped plate body, and a movable plate which can slide up and down for clamping is arranged on the opening side of the C-shaped plate body; according to the invention, cooling can be realized without a traditional heat dissipation element in a narrow space through the temperature regulation and control assembly by means of the characteristics of a semiconductor chilling plate, dual regulation and control of the temperature in the glue storage barrel can be achieved by matching with an electric heating wire, and meanwhile, the top of the temperature control chamber is provided with a sealed air bag body which can deform along with the diameter of the glue storage barrel, so that heat loss and diffusion can be effectively avoided; interference of the environment on the temperature of the glue storage barrel is effectively isolated, stable glue supply quality is guaranteed, and production efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of glue supply technology, and more specifically, to a temperature-controlled glue supply machine. Background Technology

[0002] Adhesive dispensers are devices used in automated equipment to precisely deliver adhesives. Their core function is to stably deliver adhesives from storage containers to coating units through heating, pressurization, or mechanical drive to meet the coating needs of different process scenarios.

[0003] Most existing glue dispensing machines typically place the prepared glue solution along with the storage tank directly at the glue dispensing pump, and then use the pump to draw the glue solution from the storage tank to quickly achieve the purpose of glue dispensing. However, this process is greatly affected by the ambient temperature. When the working environment is hot, the glue solution in the storage tank cures faster, which is not conducive to glue dispensing. When the working environment is cold, the glue solution in the storage tank cures slower, which reduces production efficiency. It is also impossible to automatically adjust the internal temperature of the storage tank according to environmental changes to ensure production efficiency.

[0004] To address the aforementioned technical shortcomings, a solution is provided. Summary of the Invention

[0005] To overcome the above-mentioned defects of the prior art, the present invention provides a temperature-controllable glue supply machine.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A temperature-controllable glue dispensing machine includes a base and a control box. The control box is located in the middle of the base, and glue storage tanks are provided on both sides of the base. A temperature control component for regulating the internal temperature of the glue storage tanks is provided on the outside of the glue storage tanks.

[0008] The temperature control component includes an inverted plate body sleeved on the outside of the glue storage tank and connected to the base. Heat dissipation holes are provided around the four sides of the inverted plate body. A movable plate that can slide up and down and snap on the open side of the inverted plate body is provided. A temperature control chamber is formed between the inner wall of the inverted plate body, the movable plate and the outer wall of the glue storage tank. A temperature sensor is provided in the temperature control chamber. Semiconductor cooling chips are provided on the three inner walls of the inverted plate body. Several heating wires are also provided on the three inner walls of the inverted plate body.

[0009] The hot side of the semiconductor refrigeration chip faces outward, and several sets of heat dissipation fins are provided on the hot side of the semiconductor refrigeration chip, while the cold side of the semiconductor refrigeration chip faces the glue storage tank.

[0010] The top of the temperature control chamber is equipped with a sealing airbag that provides a relative seal.

[0011] Furthermore, brackets for fixing the semiconductor cooling chip and heating wire are fixedly installed on the inner walls of the three sides of the C-shaped plate.

[0012] Furthermore, the vertical distance between the heating wire and the outer wall of the glue storage tank is less than the vertical distance between the semiconductor cooling chip and the outer wall of the glue storage tank.

[0013] Furthermore, the control box includes a processor, a temperature acquisition module, and a decision control terminal; the temperature acquisition module is used to acquire the temperature value inside the temperature control chamber during the operation of the glue supply machine;

[0014] The temperature value is compared with the preset maximum temperature value in the database. When the temperature value is greater than or equal to the preset maximum temperature value, it indicates that the temperature in the temperature-controlled room is high, a cooling signal is generated, and the cooling signal is sent to the decision control terminal through the processor. After receiving the cooling signal, the decision control terminal immediately controls the semiconductor cooling chip to work.

[0015] When the temperature value is lower than the preset maximum temperature value in the database, it indicates that the temperature control room is not in a high-temperature environment, a retest signal is generated, and the retest signal is sent to the decision control terminal through the processor.

[0016] Furthermore, after receiving the re-inspection signal, the decision control terminal compares and analyzes the temperature value corresponding to the re-inspection signal with the preset minimum temperature value in the database. When the temperature value is less than or equal to the preset minimum temperature value, it indicates that the temperature in the temperature control room is low, and a heating signal is generated to immediately start the heating wire.

[0017] When the temperature value corresponding to the retest signal is greater than the preset minimum temperature value, it indicates that the indoor temperature is normal and no signal is generated.

[0018] Furthermore, telescopic electric columns are installed on both sides of the top wall of the base located on the U-shaped plate. The extended ends of the two sets of telescopic electric columns are connected to a crossbeam. A cross plate is connected above the two sets of telescopic electric columns. A tank chain is provided between the cross plate and the crossbeam.

[0019] Furthermore, a sealing plate is connected above the glue storage tank, and a pair of traction rods are fixed between the sealing plate and the crossbeam. A bearing plate is connected above the pair of traction rods. A glue supply pump is provided above the bearing plate, and the outer wall of the glue supply pump is vertically inserted into the glue storage tank. The output ends of the two glue supply pumps are connected to a manifold through glue delivery pipes.

[0020] Furthermore, two sets of roller feeders are symmetrically installed on the input side of the base.

[0021] The technical effects and advantages of this invention are as follows:

[0022] 1. This invention utilizes the characteristics of a semiconductor cooling chip to cool down in a confined space without the need for traditional heat dissipation components through a temperature control component. Combined with a heating wire, it can achieve dual temperature regulation, cooling or heating the adhesive in the storage tank according to different working environment temperatures, meeting diverse production needs. Furthermore, the heating wire fits the storage tank more closely, preventing damage to the semiconductor cooling chip during heating and ensuring stable equipment operation.

[0023] 2. This invention utilizes a sealing airbag at the top of the temperature control chamber that deforms to seal the adhesive storage tank according to its diameter, reducing heat loss. The valve core can adjust the degree of sealing. Meanwhile, the control box monitors the temperature in real time through a temperature sensor, intelligently analyzes the temperature, and issues corresponding commands to achieve automated temperature control, greatly improving production efficiency and adhesive supply quality. Attached Figure Description

[0024] Figure 1 This is a frontal perspective perspective view of the overall structure of the present invention.

[0025] Figure 2 This is a rear-view perspective view of the overall structure of the present invention.

[0026] Figure 3 This is a front view of the overall structure of the present invention.

[0027] Figure 4 for Figure 3 A magnified schematic diagram of the structure of region A in the middle.

[0028] Figure 5 This is a side view of the overall structure of the present invention.

[0029] Figure 6 This is a top view of the overall structure of the present invention.

[0030] Figure 7 This is a system flowchart of the present invention.

[0031] The attached figures are labeled as follows:

[0032] 1. Base; 2. Control box; 3. Telescopic electric column; 4. Crossbeam; 5. Traction rod; 6. Sealing plate; 7. Bearing plate; 8. Glue supply pump; 9. Glue delivery pipe; 10. Manifold; 11. Tank chain; 12. Roller delivery tank seat; 14. Temperature control chamber; 141. C-shaped plate; 142. Movable plate; 15. Semiconductor cooling chip; 16. Heat dissipation fins; 17. Heating wire; 18. Bracket; 19. Sealing airbag; 20. Glue storage tank. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example 1: Please refer to Figures 1-6 As shown, the problem that existing technologies cannot automatically adjust the internal temperature of the glue storage tank according to environmental changes can be solved by the following solution;

[0035] This embodiment of a temperature-controllable glue dispenser includes a base 1 and a control box 2. The control box 2 is located in the middle of the base 1. Glue storage tanks 20 are provided on both sides of the base 1. A temperature control component for regulating the internal temperature of the glue storage tanks 20 is provided on the outside of the glue storage tanks 20.

[0036] The temperature control component includes an inverted plate 141 sleeved on the outside of the glue storage tank 20 and connected to the base 1. Heat dissipation holes are provided around the inverted plate 141. A movable plate 142 that can slide up and down is provided on the open side of the inverted plate 141 to facilitate the handling and placement of the glue storage tank 20. A temperature control chamber 14 is formed between the inner wall of the inverted plate 141, the movable plate 142 and the outer wall of the glue storage tank 20. Semiconductor cooling chips 15 are provided on the three inner walls of the inverted plate 141. Several heating wires 17 are also provided on the three inner walls of the inverted plate 141.

[0037] The hot side of the thermoelectric cooler 15 faces outward, and several sets of heat dissipation fins 16 are provided on the hot side of the thermoelectric cooler 15. The cold side of the thermoelectric cooler 15 faces the glue storage tank 20. When the working environment temperature is high, the operator can start the thermoelectric cooler 15 through the control box 22 to cool the glue.

[0038] The vertical distance between the heating wire 17 and the outer wall of the glue storage tank 20 is smaller than the vertical distance between the thermoelectric cooler 15 and the outer wall of the glue storage tank 20; that is, the heating wire 17 fits the glue storage tank 20 more closely than the thermoelectric cooler 15; when the working environment temperature is low, the operator can start the heating wire 17 through the control box 2 to heat the glue. Since the heating temperature does not need to be too high, the thermoelectric cooler 15 will not be damaged when the heating wire 17 continues to work.

[0039] The inner walls of the three sides of the U-shaped plate 141 are all fixed with brackets 18 for fixing the semiconductor cooling chip 15 and the heating wire 17;

[0040] The top of the temperature control chamber 14 is provided with a sealing airbag 19; the sealing airbag 19 can deform according to the diameter of the glue storage tank 20, thereby forming a certain degree of seal on the top of the temperature control chamber 14 to prevent heat loss and diffusion. A valve core is provided on the sealing airbag 19 to adjust the internal gas content of the sealing airbag 19, thereby adjusting the sealing effect.

[0041] A temperature sensor is installed inside the temperature control chamber 14 to facilitate monitoring and adjustment of the temperature inside the temperature control chamber 14, so as to regulate the temperature.

[0042] The base 1 is located on the top walls of both sides of the U-shaped plate 141, and telescopic electric columns 3 are installed. The extended ends of the two sets of telescopic electric columns 3 are connected to a crossbeam 4. A cross plate is connected above the two sets of telescopic electric columns 3. A tank chain 11 is provided between the cross plate and the crossbeam 4.

[0043] A sealing plate 6 is connected to the top of the glue storage tank 20. A pair of traction rods 5 are fixed between the sealing plate 6 and the crossbeam 4. A bearing plate 7 is connected above the pair of traction rods 5. A glue supply pump 8 is installed above the bearing plate 7. The outer wall of the glue supply pump 8 is vertically inserted into the glue storage tank 20. The output ends of the two glue supply pumps 8 are connected to the manifold 10 through the glue delivery pipe 9. The base 1 is used to place the glue storage tank. The control box 2 controls the overall operation of the device. The telescopic electric column 3 drives the crossbeam 4 to move up and down, so that the traction rods 5, sealing plate 6, bearing plate 7, and glue supply pump 8 can move up and down together, making it convenient for staff to pick up and place the glue storage tank.

[0044] Two sets of roller conveyor seats 12 are symmetrically installed on the input side of the base 1 for conveying the glue storage bucket.

[0045] Example 2: Please refer to Figure 7 As shown, further explanations are provided based on Example 1;

[0046] Control box 2 includes a processor, a temperature acquisition module, and a decision control terminal; the temperature acquisition module is used to acquire the temperature value inside the temperature control chamber 14 during the operation of the glue dispenser, and the temperature value is obtained through a temperature sensor;

[0047] The temperature value is compared and analyzed with the preset maximum temperature value in the database. When the temperature value is greater than or equal to the preset maximum temperature value, it indicates that the temperature inside the temperature control chamber 14 is high, generating a cooling signal. The cooling signal is then sent to the decision control terminal through the processor. After receiving the cooling signal, the decision control terminal immediately controls the semiconductor cooling chip 15 to work. The cold side absorbs the heat from the storage tank 20 to achieve cooling. The hot side dissipates heat through the heat dissipation fins 16 and heat dissipation holes. The sealed airbag 19 deforms to seal the top, reducing the loss of cold energy.

[0048] When the temperature value is lower than the preset maximum temperature value in the database, it indicates that the temperature control chamber 14 is not in a high-temperature environment. A retest signal is generated and sent to the decision control terminal through the processor. After receiving the retest signal, the decision control terminal compares and analyzes the temperature value corresponding to the retest signal with the preset minimum temperature value in the database. When the temperature value is less than or equal to the preset minimum temperature value, it indicates that the temperature in the temperature control chamber 14 is low. A heating signal is generated and the heating wire 17 is immediately activated. The radiant heat from the heating wire 17 directly heats the glue storage tank 20 at a lower temperature to avoid damaging the semiconductor cooling chip 15 and the sealing top of the airbag body 19, thus reducing heat loss.

[0049] When the temperature value corresponding to the retest signal is greater than the preset minimum temperature value, it indicates that the temperature in the control room is normal and no signal is generated. The control box 2 remains in standby mode and the sealing airbag 19 maintains the current sealing state.

[0050] In this embodiment, the preset maximum temperature value or preset minimum temperature value is set for result comparison and analysis in order to determine whether it is good or bad. The value of the preset maximum temperature value is set and stored based on a combination of large model analysis of sample data and human experience. It can also be appropriately adjusted based on seasonal or common-sense influence conditions.

[0051] As can be seen from Embodiments 1 and 2 of the present invention:

[0052] By utilizing the characteristics of the semiconductor cooling chip 15, the temperature control component can achieve cooling in a confined space without relying on traditional heat dissipation components such as fans. In addition, it can achieve dual regulation by using the heating wire 17. A sealing airbag 19 is provided on the top of the temperature control chamber 14. It can deform according to the diameter of the glue storage tank 20, thereby forming a certain degree of seal on the top of the temperature control chamber 14 to prevent heat loss and diffusion. A valve core can be provided on the sealing airbag 19 to adjust the gas content inside the sealing airbag 19, thereby adjusting the sealing effect.

[0053] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A temperature-controllable glue supply machine, comprising a base (1) and a control box (2), the control box (2) is arranged in the middle of the base (1), and glue storage barrels (20) are arranged on both sides of the base (1), characterized in that, The temperature regulating assembly is arranged outside the glue storage barrel (20) and regulates the temperature inside the glue storage barrel (20). The temperature regulating assembly comprises a U-shaped plate body (141) arranged outside the glue storage barrel (20) and connected with the base (1), the U-shaped plate body (141) is provided with heat dissipation holes around, the opening side of the U-shaped plate body (141) is provided with a movable plate (142) capable of sliding up and down, a temperature control chamber (14) is formed between the inner wall of the U-shaped plate body (141), the movable plate (142) and the outer wall of the glue storage barrel (20), and a temperature sensor is arranged in the temperature control chamber (14), semiconductor refrigerating fins (15) are arranged on the inner walls of three sides of the U-shaped plate body (141), and a plurality of electric heating wires (17) are arranged on the inner walls of the three sides of the U-shaped plate body (141). The hot surface of the semiconductor refrigerating fin (15) is arranged outward, a plurality of groups of heat dissipation fins (16) are arranged on the hot surface of the semiconductor refrigerating fin (15), and the cold surface of the semiconductor refrigerating fin (15) faces the glue storage barrel (20). The top of the temperature control chamber (14) is provided with a sealed air bag body (19).

2. The temperature controlled glue feeder of claim 1 wherein: The inner walls of the three sides of the U-shaped plate body (141) are fixedly provided with supports (18) for fixing the semiconductor refrigerating fin (15) and the electric heating wire (17).

3. The temperature controlled glue feeder of claim 1 wherein: The vertical distance between the electric heating wire (17) and the outer wall of the glue storage barrel (20) is smaller than the vertical distance between the semiconductor refrigerating fin (15) and the outer wall of the glue storage barrel (20).

4. The temperature controlled glue dispenser of claim 1 wherein: The control box (2) comprises a processor, a temperature acquisition module and a decision control end, the temperature acquisition module is used for acquiring the temperature value in the temperature control chamber (14) during the operation of the glue supply machine, and comparing and analyzing the temperature value with the preset maximum temperature value in the database, when the temperature value is greater than or equal to the preset maximum temperature value, it indicates that the temperature in the temperature control chamber (14) is high, a refrigeration signal is generated, and the refrigeration signal is sent to the decision control end through the processor; after the decision control end obtains the refrigeration signal, the semiconductor refrigerating fin (15) is immediately controlled to work; when the temperature value is less than the preset maximum temperature value in the database, it indicates that the temperature control chamber (14) is not in a high-temperature environment, a re-inspection signal is generated, and the re-inspection signal is sent to the decision control end through the processor.

5. A temperature controlled glue feeder as claimed in claim 4, wherein: After the decision control end obtains the re-inspection signal, the temperature value corresponding to the re-inspection signal is compared and analyzed with the preset minimum temperature value in the database, when the temperature value is less than or equal to the preset minimum temperature value, it indicates that the temperature in the temperature control chamber (14) is low, a heating signal is generated, and the electric heating wire (17) is immediately started; when the temperature value corresponding to the re-inspection signal is greater than the preset minimum temperature value, it indicates that the temperature in the control chamber is normal, and no signal is generated.

6. The temperature controlled glue dispenser of claim 1, wherein: The base (1) is arranged on the two side top walls of the U-shaped plate body (141), and a telescopic electric column (3) is arranged on each side top wall, the extending ends of the two groups of telescopic electric columns (3) are jointly provided with a cross beam (4), and the upper portions of the two groups of telescopic electric columns (3) are jointly connected with a horizontal plate, and a tank chain (11) is arranged between the horizontal plate and the cross beam (4).

7. The temperature controlled glue dispenser of claim 1 wherein: The upper portion of the glue storage barrel (20) is connected with a sealing plate (6), a pair of traction rods (5) are fixedly arranged between the sealing plate (6) and the cross beam (4), the upper portions of the pair of traction rods (5) are commonly connected with a bearing plate (7), a glue supply pump (8) is arranged on the upper portion of the bearing plate (7), and the outer wall of the glue supply pump (8) is vertically inserted into the glue storage barrel (20), and the output ends of the two glue supply pumps (8) are commonly connected with a confluence chamber (10) through a glue conveying pipe (9).

8. The temperature controlled glue dispenser of claim 1, wherein: Two groups of roller barrel conveying seats (12) are symmetrically arranged on the input side of the base (1).

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