Spline device for dissociating silicon wafer and control method thereof

Abstract

The invention relates to a spline device for dissociating a silicon wafer and a control method of the spline device, and belongs to the technical field of semiconductor manufacturing equipment.The spline device comprises a base, a cantilever frame is arranged on the base, the silicon wafer is arranged between the cantilever frame and the base, positioning columns C are arranged at the notch position of the silicon wafer and the rear end of the cantilever frame, and the positioning columns C are arranged on the base. A handle connected with the cantilever frame through a sliding block structure is arranged on the cantilever frame, and diamond scribers fixedly connected with the handle are arranged on the two sides of the cantilever frame. And the diamond scriber can move along with the handle. When the handle slides, the scriber scribes a linear scratch on the surface of the silicon wafer below the scriber. The device has the advantages of simple structure and convenient operation. The plurality of positioning columns and positioning blocks ensure the stability of the silicon wafer in the processing process and the accuracy of the scribing position. A handle with a diamond scriber slides to scribe scratches on the surface of a silicon wafer, and then the silicon wafer is broken along the scratches according to the lever principle or stress concentration, so that a required spline is obtained.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and more specifically to a spline device for separating silicon wafers and its control method. Background Technology

[0002] In semiconductor R&D and laboratory environments, it is often necessary to obtain samples of specific shapes from large-diameter silicon wafers, such as elongated samples used for etching tests to test for lattice defects. Traditional cutting methods, such as laser cutting or diamond wire sawing, while highly precise, are expensive, complex to operate, and have high maintenance costs, and are not suitable for rapid and simple sample preparation needs. Manual scribing and dissection methods, on the other hand, require highly skilled operators, have poor repeatability, are prone to sample damage or dimensional inaccuracies, and are inefficient. Summary of the Invention

[0003] This invention addresses the shortcomings of existing technologies by providing a spline device and its control method for separating silicon wafers. It features a simple structure and convenient operation. Multiple positioning posts and blocks ensure the stability of the silicon wafer and the accuracy of the scribing position during processing. A handle with a diamond scribing needle slides to create scratches on the silicon wafer surface. Then, lever principles or stress concentration are used to cause the silicon wafer to break along the scratches, thereby obtaining the desired spline.

[0004] The above-mentioned technical problems of the present invention are mainly solved by the following technical solutions: A spline device for separating silicon wafers includes a base, a suspension beam on the base, a silicon wafer placed between the suspension beam and the base, positioning posts C at the notched area of ​​the silicon wafer and the rear end of the suspension beam, a handle connected to the suspension beam via a slider structure on the suspension beam, and diamond scribers fixed to the handle on both sides of the suspension beam. The diamond scribers move with the handle. When the handle slides, the scribers draw a straight line on the surface of the silicon wafer below.

[0005] Preferably, movable positioning posts A and B are provided on both sides of the front of the cantilever beam. Upgrading from "two-point" (rear positioning post C and notch) positioning to "three-point" (A, B, C) positioning greatly enhances the stability and rigidity of the silicon wafer during processing, preventing any offset or vibration during scribing, thereby improving the scribing quality.

[0006] Preferably, the base is provided with positioning blocks on its periphery that correspond to positioning posts A, B, and C on the silicon wafer and are distributed in a 120-degree fan shape. When the operator adjusts positioning posts A, B, and C on the suspension beam, the fixed positioning blocks on the periphery of the base can be used as a reference to quickly and accurately set the position.

[0007] A control method for a spline device for separating silicon wafers includes the following operational steps: Step 1: Place the silicon wafer on the base and align it with the positioning post C using the notch.

[0008] Step 2: Lower the suspension beam so that the positioning post C at its rear end contacts the silicon wafer. At the same time, move the positioning posts A and B according to the silicon wafer specifications to limit the position and complete the precise positioning.

[0009] Step 3: The operator pushes the handle, which drives the diamond scriber to slide along the suspension beam, drawing a straight line on the silicon wafer surface.

[0010] Step 4: After scribing the silicon wafer, use your hands to break the wafer along the cleavage surface, causing the wafer to break along the scratches and leave long strips.

[0011] The present invention can achieve the following effects: This invention provides a spline device and its control method for separating silicon wafers. Compared with existing technologies, it has the advantages of simple structure and convenient operation. Multiple positioning posts and blocks ensure the stability of the silicon wafer and the accuracy of the scribing position during processing. A handle with a diamond scribing needle slides to scribe marks on the surface of the silicon wafer. Then, lever principle or stress concentration is used to cause the silicon wafer to break along the marks, thereby obtaining the desired spline.

[0012] Simple structure and low cost: This invention uses a mechanical structure throughout, eliminating the need for complex components such as motors and controllers. The manufacturing and maintenance costs are extremely low, making it ideal for laboratory and teaching applications with limited budgets.

[0013] Easy to operate and highly efficient: Users only need to adjust the position of the positioning block and the scriber, perform one scribe and one press operation to complete the dissociation of the sample strip, without the need for professional training, which greatly improves the sample preparation efficiency.

[0014] High precision and good repeatability: The depth of the scratches can be precisely controlled by the ruler and fine-tuning mechanism, as well as the fixed beam width, thereby ensuring that the width of the separated strips (about 2cm) is consistent and the yield is high.

[0015] Multi-functional and highly compatible: With adjustable positioning and scratching mechanisms, one device can perfectly adapt to both 12-inch and 8-inch mainstream silicon wafers, making it highly versatile. Attached Figure Description

[0016] Figure 1 This is a top view of the structure of the present invention.

[0017] Figure 2 This is a side view structural diagram of the present invention.

[0018] In the diagram: Positioning post A1, base 2, handle 3, diamond scribing needle 4, cantilever beam 5, positioning post B6, silicon wafer 7, positioning post C8, positioning block 9. Detailed Implementation

[0019] The technical solution of the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0020] Example: Figure 1 and Figure 2 As shown, a spline device for separating silicon wafers includes a base 2, a suspension beam 5 mounted on the base 2, a silicon wafer 7 positioned between the suspension beam 5 and the base 2, positioning posts C8 at the notched areas of the silicon wafer 7 and at the rear end of the suspension beam 5, and movable positioning posts A1 and B6 on both sides of the front of the suspension beam 5. The base 2 is surrounded by positioning blocks 9 corresponding to the positioning posts A1, B6, and C8 on the silicon wafer 7 and arranged in a 120-degree fan shape. The suspension beam 5 is equipped with a handle 3 connected to the suspension beam 5 via a slider structure, and diamond scribers 4 are fixedly connected to the handle 3 on both sides of the suspension beam 5.

[0021] A control method for a spline device for separating silicon wafers includes the following operational steps: Step 1: Place the silicon wafer 7 on the base 2 and align it with the positioning post C8 using the notch.

[0022] Step 2: Lower the suspension beam 5 so that the positioning column C8 at its rear end contacts the silicon wafer. At the same time, move the positioning columns A1 and B6 according to the silicon wafer specifications to limit the position and complete the precise positioning.

[0023] Step 3: The operator pushes the handle 3, which causes the diamond scriber 4 to slide along the suspension beam 5, drawing a straight line on the surface of the silicon wafer.

[0024] Step 4: After scratching silicon wafer 7, use your hands to break silicon wafer 7 along the separation surface, so that the silicon wafer breaks along the scratch and leaves a long strip.

[0025] In summary, the spline device and its control method for separating silicon wafers have the advantages of simple structure and convenient operation. Multiple positioning posts and blocks ensure the stability of the silicon wafer and the accuracy of the scribing position during processing. A handle with a diamond scribing needle slides to scribe marks on the surface of the silicon wafer, and then the silicon wafer breaks along the marks using the lever principle or stress concentration, thereby obtaining the desired spline.

[0026] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by those skilled in the art within the scope of the present invention are covered by the patent scope of the present invention.

Claims

1. A spline device for dissociating a silicon wafer, characterized by: The utility model relates to a silicon wafer cutting device, including base (2), the base (2) is equipped with the cantilever frame (5), the cantilever frame (5) is equipped with the silicon wafer (7) with base (2) interval, the silicon wafer (7) is equipped with the locating post C (8) at the lack slot and the rear end of cantilever frame (5) respectively, the cantilever frame (5) is equipped with the handle (3) with the slider block structure connection of cantilever frame (5), the cantilever frame (5) both sides are equipped with the fixed diamond needle (4) with handle (3) connection.

2. The spline device for dissociating a silicon wafer of claim 1, wherein: The cantilever frame (5) front both sides are equipped with movable locating post A (1) and locating post B (6).

3. The spline device for dissociating a silicon wafer of claim 2, wherein: The base (2) is equipped with the locating block (9) with the corresponding 120 degree sector distribution of locating post A (1), locating post B (6) and locating post C (8) at the silicon wafer (7) place.

4. A control method for a spline device for dissociating a silicon wafer according to claim 3, characterized in that Including following operation steps: First step: place the silicon wafer (7) on the base (2), and use its lack slot to align locating post C (8); Second step: place the cantilever frame (5) down, and the locating post C (8) of its rear end is in contact with the silicon wafer, while moving locating post A (1) and locating post B (6) to limit according to the silicon wafer specification, complete accurate positioning; Third step: operator pushes handle (3), and handle drives diamond needle (4) to slide along cantilever frame (5), and draws a straight line on the silicon wafer surface; Fourth step: after cutting the silicon wafer (7), break the silicon wafer (7) along the separation surface by hand, so that the silicon wafer is broken along the scratch and leaves a long strip.

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