Acrylic resin composition and application thereof in non-curing flame-retardant caulking compound
By using a combination of dynamic disulfide epoxy resin and flexible butyl acrylate in building sealant, the problems of insufficient flame retardancy and creep resistance are solved, and a self-healing sealant is achieved, meeting the needs of modern building waterproofing construction.
Patent Information
- Application Number
- CN202511934388.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-20
- Publication Date
- 2026-02-17
AI Technical Summary
Existing building sealant materials have problems such as poor flame retardancy, poor creep resistance, and inability to self-repair, making it difficult to meet the needs of modern building waterproofing construction.
The combination of epoxy resin with dynamic disulfide bonds and flexible butyl acrylate achieves self-healing through the reversible exchange reaction of dynamic disulfide bonds, and enhances flame retardancy and creep resistance by combining the skeleton structure of styrene and epoxy resin.
It achieves high flame retardancy, excellent creep resistance, and room temperature workability, and has self-healing capabilities as a non-curing flame retardant sealant, meeting the requirements of building waterproofing construction.
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Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of waterproof materials, in particular to an acrylic resin composition and application thereof in non-curing flame-retardant caulking glue. BACKGROUND
[0002] Building caulking material is a functional material that ensures the integrity, waterproof sealing, safety and durability of building structure. The building caulking materials on the current market are mainly solvent-based and hot-melt caulking glue, but the above-mentioned building caulking materials have problems such as environmental pollution, harm to the health of construction personnel, high energy consumption or inconvenience in construction, and cannot meet the increasingly stringent construction environment. The water-based acrylic resin system has gradually become a research hotspot in the industry due to its advantages of non-toxicity and environmental protection; however, the existing water-based acrylic-based caulking glue always has problems such as poor flame retardancy, poor anti-creeper property and inability to self-repair after damage, which seriously restricts its wide application.
[0003] In recent years, personnel in the industry have tried various ways to solve the above-mentioned problems, but there are still obvious defects. For example: the polyurethane-based caulking glue proposed by the related technology has a flammable polyurethane molecular chain, which has a fire hazard, and the ester bond and urethane bond in its molecular structure are easily hydrolyzed and yellowed under outdoor ultraviolet light and hot and humid environment, resulting in insufficient weather resistance. The silicone sealant reported in the literature has good weather resistance and high and low temperature resistance, but its adhesion strength to the substrate (especially concrete and paint surface) is low, and it is a physical crosslinking network after curing, which cannot be self-repaired once cracking or peeling occurs, and has a risk of leakage. In addition, researchers have also compounded intumescent flame retardants in traditional acrylic emulsions to improve the flame retardant grade, which can improve the flame retardancy to some extent, but the introduction of a large amount of flame retardant fillers seriously damages the continuity of the polymer matrix and the molecular chain movement ability, thereby causing the creep performance of the material to deteriorate significantly, and the creep recovery rate to decrease significantly, which is difficult to meet the long-term sealing requirements.
[0004] Therefore, it is of great significance for building waterproof construction to develop a caulking glue material that can simultaneously meet the requirements of high flame retardancy, excellent anti-creep performance, construction at room temperature, and self-repairing ability after damage. SUMMARY
[0005] In order to overcome the problem that the existing caulking glue material cannot simultaneously meet the requirements of flame retardancy, anti-creep performance and self-repairing ability, the present application provides an acrylic resin composition and application thereof in non-curing flame-retardant caulking glue.
[0006] In a first aspect, the present application provides an acrylic resin composition, which adopts the following technical solution: An acrylic resin composition comprising the following components in parts by weight: butyl acrylate 25.3-30 parts, styrene 12.7-15 parts, crosslinking agent 2.4-3 parts, emulsifier 3-4 parts, initiator 1-1.5 parts, epoxy resin 15-80 parts, and water 20-30 parts; the epoxy resin is selected from one or more of bis[(2-oxiranylmethoxy)phenyl]disulfide, 4,4'-diglycidyloxydiphenyl disulfide, and bis(2,3-epoxypropyl)disulfide diethyl ether.
[0007] The present application can obtain an acrylic resin material with high flame retardancy, excellent creep resistance, workability at room temperature, and self-repairing ability by selecting one or more of bis[(2-oxiranylmethoxy)phenyl]disulfide, 4,4'-diglycidyloxydiphenyl disulfide, and bis(2,3-epoxypropyl)disulfide diethyl ether as the epoxy resin, and combining it with flexible butyl acrylate and the like. Specifically: butyl acrylate, styrene, and epoxy resin as a rigid skeleton can inhibit the sliding and plastic deformation of the polymer molecular chain, ensure that the material still maintains excellent dimensional stability and long-lasting mechanical strength in harsh environments, and achieve good creep resistance. And when micro-cracks occur in the material, the dynamic disulfide bond in the epoxy resin can undergo a reversible exchange reaction, causing the crack interface molecular chain to reconnect and the network to reorganize, thereby achieving self-repairing of the crack, restoring its mechanical integrity and extending its service life; in addition, when the polymer burns, the C-S bond and S-S bond in the epoxy resin will break at the beginning of combustion, generating sulfur-containing free radicals, which can be fixed on the polymer chain in the form of a covalent bond, on the one hand to prevent the polymer from burning; on the other hand to maintain the network structure of the polymer, avoid the migration and precipitation of small molecule flame retardants, and achieve the effect of flame retardation. And the aromatic ring structure in the styrene and epoxy resin skeleton can also effectively promote the formation of a dense carbon layer at high temperatures, serving as an efficient carbonization agent to achieve the effect of flame retardation. In summary, the acrylic resin composition provided by the present application can achieve multiple performance through the functional complementation and synergistic effect of multiple components, and can be used to prepare a non-cured flame-retardant caulking glue that is easy to apply, has good flame retardancy, good creep resistance, excellent self-repairing performance, and is environmentally friendly.
[0008] Optionally, the epoxy resin is a mixture of bis[(2-oxiranylmethoxy)phenyl]disulfide and bis(2,3-epoxypropyl)disulfide diethyl ether.
[0009] Optionally, the weight ratio of bis[(2-oxiranylmethoxy)phenyl]disulfide and bis(2,3-epoxypropyl)disulfide diethyl ether is 1:(1.5-3).
[0010] In some embodiments, the weight ratio of the bis[(2-oxiranylmethoxy)phenyl]disulfide and bis(2,3-epoxypropyl)disulfide can be 1:(1.5-2), 1:(1.5-2.5), 1:(1.5-3), 1:(2-2.5), 1:(2-3), or 1:(2.5-3).
[0011] In a specific embodiment, the weight ratio of the bis[(2-oxiranylmethoxy)phenyl]disulfide and bis(2,3-epoxypropyl)disulfide can also be 1:1.5, 1:2, 1:2.5, or 1:3.
[0012] Optionally, the acrylic resin composition further comprises a thiol catalyst or an organic base catalyst.
[0013] The acrylic resin composition in the present application is a disulfide bond-based self-repairing epoxy resin system. By further adding a thiol catalyst or an organic base catalyst, the dynamic exchange reaction of disulfide bonds can be accelerated, so that the system can also be quickly repaired at room temperature. Specifically, the thiol catalyst can directly provide thiol groups to catalyze the exchange of disulfide bonds and achieve rapid rearrangement of the disulfide bond network; the organic base catalyst can capture trace amounts of thiol end groups generated when the epoxy network is broken to generate highly active thiol anions, thereby starting the catalytic cycle and achieving self-repairing.
[0014] Optionally, the thiol catalyst is selected from one or more of aliphatic thiol, aromatic thiol, and 2-(dibutylamino)ethanethiol; and the organic base catalyst is selected from one or more of 1,8-diazabicyclo[5.4.0]undec-7-ene, triethylamine, and tetrabutylammonium hydroxide.
[0015] In a specific embodiment, the catalyst is 2-mercaptobenzimidazole or 1,8-diazabicyclo[5.4.0]undec-7-ene.
[0016] Optionally, the crosslinking agent is an isocyanate crosslinking agent; the emulsifier is an anionic emulsifier and a non-ionic emulsifier; and the initiator is ammonium persulfate / sodium bisulfite.
[0017] In a second aspect, the present application provides an aqueous acrylic resin, which is characterized in that it is made of the acrylic resin composition.
[0018] In a third aspect, the present application provides a preparation method of an aqueous acrylic resin, which comprises the following steps: (1) adding water, part of the emulsifier, butyl acrylate, styrene, epoxy resin, and crosslinking agent into an emulsifying device, stirring and emulsifying for 30-40 min to obtain an emulsion; (2) Dissolve part of the initiator in water and put it into the oxidant tank to obtain an initiator solution; (3) Dissolve the remaining emulsifier in water, put it into the reaction vessel, and heat it to 85-88℃; add the remaining initiator and then add the emulsion dropwise to react with the initiator solution. The dropwise addition is completed in 3.5-4.0h, and the temperature is maintained for 60-80min after the dropwise addition is completed. (4) Cool the system to 60-75℃ and then perform post-elimination treatment; then cool it to 40-50℃, adjust the pH to 7.8-8.5 with sodium hydroxide solution, stir evenly, filter, and obtain water-based acrylic resin.
[0019] Fourthly, this application provides the use of an acrylic resin composition or an aqueous acrylic resin in a sealant.
[0020] Fifthly, this application provides a non-curing flame-retardant sealant comprising the following components in parts by weight: 40-50 parts of water-based acrylic resin, 3-4 parts of flame retardant, 2-4 parts of dispersant, 0.5-2.5 parts of defoamer, and 5-12 parts of chlorinated rubber powder.
[0021] In summary, this application has the following beneficial effects: 1. This application uses one or more of the following epoxy resins with dynamic disulfide bonds: bis[(2-epoxyethylene methoxy)phenyl] disulfide, 4,4'-diglycidyl ether diphenyl disulfide, and bis(2,3-epoxypropyl)dithiodiethyl ether. These are then combined with flexible butyl acrylate and other materials to produce a waterborne acrylic resin with excellent performance. When used as a caulking material for building waterproofing, it exhibits excellent flame retardancy, creep resistance, room-temperature workability, and self-healing ability, meeting the waterproofing requirements of building materials.
[0022] 2. The non-curing flame-retardant sealant obtained in this application has a flame retardant rating of UL94 V-0, a creep recovery rate of 83.2-96.8%, a 24-hour self-healing efficiency of 74.8-95.1% for 0.5mm cracks, an adhesion before tension of 0.66-0.73MPa, and an adhesion at a constant elongation after immersion in water of 0.65-0.72MPa. Detailed Implementation
[0023] This application provides an acrylic resin composition comprising the following components in parts by weight: 25.3-30 parts butyl acrylate, 12.7-15 parts styrene, 2.4-3 parts crosslinking agent, 3-4 parts emulsifier, 1-1.5 parts initiator, 15-80 parts epoxy resin, and 20-30 parts water; further, the acrylic resin composition further comprises a thiol catalyst or an organic base catalyst; even further, the thiol catalyst is selected from one or more of aliphatic thiols, aromatic thiols, and 2-(dibutylamino)ethanethiol; the organic base catalyst is selected from one or more of 1,8-diazabicyclo[5.4.0]undec-7-ene, triethylamine, and tetrabutylammonium hydroxide.
[0024] The epoxy resin is selected from one or more of bis[(2-epoxyethylene methoxy)phenyl] disulfide, 4,4'-diglycidyl ether diphenyl disulfide, and bis(2,3-epoxypropyl)dithiodiethyl ether. Further, the epoxy resin is a mixture of bis[(2-epoxyethylene methoxy)phenyl] disulfide and bis(2,3-epoxypropyl)dithiodiethyl ether; even further, the weight ratio of bis[(2-epoxyethylene methoxy)phenyl] disulfide to bis(2,3-epoxypropyl)dithiodiethyl ether is 1:(1.5-3).
[0025] This application provides a water-based acrylic resin, the preparation method of which includes the following steps: (1) Add water, part of the emulsifier, butyl acrylate, styrene, epoxy resin and crosslinking agent to the emulsification equipment, stir and emulsify for 30-40 minutes to obtain an emulsion; (2) Dissolve part of the initiator in water and put it into the oxidant tank to obtain an initiator solution; (3) Dissolve the remaining emulsifier in water, put it into the reaction vessel, and heat it to 85-88℃; add the remaining initiator and then add the emulsion dropwise to react with the initiator solution. The dropwise addition is completed in 3.5-4.0h, and the temperature is maintained for 60-80min after the dropwise addition is completed. (4) Cool the system to 60-75℃ and then perform post-elimination treatment; then cool it to 40-50℃, adjust the pH to 7.8-8.5 with sodium hydroxide solution, stir evenly, filter with 120 mesh filter cloth to obtain water-based acrylic resin.
[0026] This application provides a non-curing flame-retardant caulking adhesive, comprising the following components in parts by weight: 40-50 parts of water-based acrylic resin, 3-4 parts of flame retardant, 2-4 parts of dispersant, 0.5-2.5 parts of defoamer, and 5-12 parts of chlorinated rubber powder; The preparation method of the non-curing flame-retardant caulking compound provided in this application includes the following steps: under stirring, flame retardant, dispersant, defoamer and chlorinated rubber powder are added sequentially to water-based acrylic resin, and after stirring and mixing evenly, a non-curing flame-retardant caulking compound is obtained.
[0027] In the embodiments of this application, the crosslinking agent is an isocyanate crosslinking agent, model number [missing information]. XP 2655; the emulsifier is an anionic emulsifier, alkyl polyoxyethylene ether sulfate; the initiator is ammonium persulfate / sodium bisulfite; the flame retardant is zinc borate; the dispersant is dispersant BYK191; the defoamer is defoamer BYK-012; the raw materials, reagents, solvents, etc. used in this application are all commercially available.
[0028] The following describes this application in further detail with reference to preparation examples, embodiments, and performance testing.
[0029] Preparation Example 1 Preparation Example 1 provides a bis[(2-epoxyethylene methoxy)phenyl] disulfide.
[0030] The preparation method of the above-mentioned bis[(2-epoxyethylene methoxy)phenyl] disulfide is as follows: (1) 2-hydroxythiophenol (27.5 g, 0.22 mol), anhydrous potassium carbonate (34.5 g, 0.25 mol), and 150 mL of anhydrous DMF were added to a 250 mL three-necked flask equipped with a mechanical stirrer, a reflux condenser, and a constant pressure dropping funnel. The mixture was stirred until completely dispersed under a nitrogen atmosphere. Then, epichlorohydrin (22.3 mL, 0.24 mol) was added to the dropping funnel and slowly added to the reaction system. During the addition, the temperature of the system rose to 45 °C. After the addition was completed, the temperature was raised to 60 °C and the reaction was stirred for 6 h. After the reaction was completed, the system was cooled to room temperature and poured into 500 mL of ice water. The pH was adjusted to neutral with 1 mol / L hydrochloric acid. The mixture was then extracted with ethyl acetate, washed with saturated brine, dried overnight with anhydrous sodium sulfate, filtered, and distilled under reduced pressure to obtain a pale yellow oily liquid, 2-(epoxyethylene methoxy)thiophenol.
[0031] (2) In a 250 mL single-necked flask, add 2-(epoxyethylene methoxy)phenylthiophenol obtained in step (1) and 50 mL of anhydrous DMF. After dissolving with magnetic stirring, place the flask in an ice-water bath to cool to 0-5 °C. Slowly add 14.4 mL of 30% hydrogen peroxide solution, controlling the system temperature to not exceed 10 °C during the addition. After the addition is complete, continue stirring the reaction at room temperature for 4 h. After the reaction is complete, pour the system into 300 mL of ice water, extract with ethyl acetate, wash with saturated brine, dry with anhydrous sodium sulfate, distill under reduced pressure, and recrystallize with petroleum ether / ethyl acetate to obtain white crystalline bis[(2-epoxyethylene methoxy)phenyl]disulfide.
[0032] Preparation Example 2 Preparation Example 2 provides a 4,4'-diglycidyl ether diphenyl disulfide.
[0033] The preparation method of the above-mentioned 4,4'-diglycidyl ether diphenyl disulfide is as follows: (1) Add 218.3 g (1.0 mol) of 4,4'-dihydroxydiphenyl disulfide and 740 g (8.0 mol) of epichlorohydrin to a 2 L four-necked flask equipped with a mechanical stirrer, thermometer, reflux condenser, and constant-pressure dropping funnel; start stirring and add 2.2 g of phase transfer catalyst TBAB; heat in a water bath to 55 ± 5 °C. Slowly add 100 mL of 40 wt% sodium hydroxide solution dropwise to the reaction flask through the constant-pressure dropping funnel, completing the addition in about 1 hour. After the addition is complete, continue to maintain the temperature for 4 hours.
[0034] (2) Cool the reaction system to about 40°C, and then slowly add 50g of solid sodium hydroxide in batches. This process will be highly exothermic, so the temperature and feeding rate must be strictly controlled to keep the internal temperature below 55°C. After all the sodium hydroxide has been added, continue stirring the reaction at 50-55°C for 5 hours. After the reaction is complete, stop heating and cool the reaction solution to room temperature. Then filter the reaction mixture and wash the filter cake with a small amount of epichlorohydrin. The filtrate is then subjected to vacuum distillation, toluene extraction, washing, and drying to obtain 4,4'-diglycidyl ether diphenyl disulfide.
[0035] Preparation Example 3 Preparation Example 3 provides a bis(2,3-epoxypropyl)dithiodiethyl ether.
[0036] The preparation method of the above-mentioned bis(2,3-epoxypropyl)dithiodiethyl ether includes the following steps: (1) Add 7.51g of dithiodiethanol, 0.81g of tetrabutylammonium bromide and 50mL of anhydrous ethanol to a 250mL three-necked flask and stir magnetically until completely dissolved; install a reflux condenser and a constant pressure dropping funnel, and place the flask in an ice-water bath to cool to 0-5℃. (2) Dissolve 4.0 g of sodium hydroxide in 10 mL of deionized water to prepare an alkaline solution, and slowly add it dropwise to the reaction flask while keeping the temperature ≤5℃ during the dropwise addition. After the dropwise addition is complete, continue stirring for 15 min, and then slowly add 13.95 mL of epichlorohydrin through a constant pressure dropping funnel. The dropwise addition time is controlled at about 30 min. After the dropwise addition is complete, remove the ice-water bath. Heat the reaction system to 40℃ and stir at a constant temperature for 6 h. After the reaction is complete, cool the reaction solution to room temperature, filter, wash, and distill under reduced pressure to obtain the crude product. Add 50 mL of dichloromethane to the crude product to dissolve it, transfer it to a separatory funnel, and wash the organic phase three times with 30 mL of deionized water to remove residual salt and unreacted base. Dry the organic phase with anhydrous magnesium sulfate, filter, and distill under reduced pressure again to remove dichloromethane to obtain a pale yellow transparent liquid bis(2,3-epoxypropyl)dithiodiethyl ether.
[0037] Example 1 Example 1 provides an aqueous acrylic resin.
[0038] The preparation method of the above-mentioned waterborne acrylic resin includes the following steps: (1) Add 1.5g emulsifier, 28.5g butyl acrylate, 14.5g styrene, 30g bis[(2-epoxyethylene methoxy)phenyl] disulfide and 2.5g crosslinking agent to 10g water, stir and emulsify for 30min to obtain an emulsion; dissolve 1.3g initiator in 5g water to obtain an initiator solution; (2) Dissolve 1g of emulsifier in 10g of water and heat to 85℃; then add the emulsion dropwise to react with the initiator solution. The addition is completed in 4 hours, and the temperature is maintained for 80 minutes after the addition is finished. (3) Finally, the system is cooled to 70°C, and then an appropriate amount of oxidant and reducing agent are added for post-elimination treatment; then the temperature is cooled to 40°C, the pH is adjusted to 8.0 with sodium hydroxide solution, the mixture is mixed evenly, and filtered through a 120-mesh filter cloth to obtain water-based acrylic resin.
[0039] Examples 2-9 Examples 2-9 each provide a water-based acrylic resin.
[0040] The difference between the above embodiments and Embodiment 1 is that the type of epoxy resin is as shown in Table 1 below.
[0041] Table 1. Types of epoxy resins used in the waterborne acrylic resins of Examples 2-9. Example 10 Example 10 provides an aqueous acrylic resin.
[0042] The difference between the above embodiment and embodiment 6 is that 3.5g of 2-mercaptobenzimidazole was added to the emulsion in step (1).
[0043] Example 11 Example 11 provides an aqueous acrylic resin.
[0044] The difference between the above embodiment and Example 10 is that 2-mercaptobenzimidazole is replaced with 1,8-diazabicyclo[5.4.0]undec-7-ene.
[0045] Comparative Example 1 Comparative Example 1 provides an aqueous acrylic resin.
[0046] The difference between the above comparative example and Example 1 is that bis[(2-epoxyethylene methoxy)phenyl] disulfide is replaced with epoxy resin E51.
[0047] Application Example 1-11 Application Examples 1-11 provide a non-curing flame-retardant sealant.
[0048] The difference between the above application examples is that the waterborne acrylic resins used in application examples 1-11 are derived from examples 1-11 respectively.
[0049] The preparation method of the non-curing flame-retardant caulking compound provided in Application Example 1-11 includes the following steps: under stirring, 3.5g of flame retardant, 3g of dispersant, 2g of defoamer and 10g of chlorinated rubber powder are added sequentially to 45g of water-based acrylic resin. After stirring and mixing evenly at a speed of 400r / min, the non-curing flame-retardant caulking compound is obtained.
[0050] Comparative Application Example 1 Comparative Application Example 1 provides a non-curing flame-retardant sealant.
[0051] The difference between the above comparative application example and application example 1 is that the water-based acrylic resin used in comparative application example 1 is derived from comparative example 1.
[0052] Performance testing For example 1-11, the non-curing flame-retardant sealant obtained in comparison application example 1 was subjected to various performance tests, and the results are shown in Table 2 below.
[0053] Table 2 shows the performance test results of the non-curing flame-retardant sealant corresponding to Case 1-11 and Comparative Application Example 1. According to the test results in Table 2, the non-curing flame-retardant sealant obtained in Application Examples 1-11 has a flame retardancy rating of UL94 V-0, a creep recovery rate of 83.2-96.8%, a 24-hour self-healing efficiency of 74.8-95.1% for a 0.5mm crack, an adhesion strength before tension of 0.66-0.73 MPa, and a fixed-elongation adhesion strength after water immersion of 0.65-0.72 MPa. In contrast, the non-curing flame-retardant sealant in Application Example 1 has a creep recovery rate of only 81.8%, a 24-hour self-healing efficiency of only 32.2% for a 0.5mm crack, an adhesion strength before tension of 0.65 MPa, and a fixed-elongation adhesion strength after water immersion of only 0.54 MPa. Therefore, it is demonstrated that the sealant made using the water-based acrylic resin provided in this application has excellent flame retardancy, creep resistance, and self-healing properties, and can fully meet the requirements of modern building waterproofing construction.
[0054] Although this application has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, such modifications or improvements made without departing from the spirit of this application are all within the scope of protection claimed in this application.
Claims
1. An acrylic resin composition, characterized in that, It comprises the following components in parts by weight: 25.3-30 parts butyl acrylate, 12.7-15 parts styrene, 2.4-3 parts crosslinking agent, 3-4 parts emulsifier, 1-1.5 parts initiator, 15-80 parts epoxy resin, and 20-30 parts water; The epoxy resin is selected from one or more of bis[(2-epoxyethylene methoxy)phenyl] disulfide, 4,4'-diglycidyl ether diphenyl disulfide, and bis(2,3-epoxypropyl)dithiodiethyl ether.
2. The acrylic resin composition according to claim 1, characterized in that, The epoxy resin is a mixture of bis[(2-epoxyethylene methoxy)phenyl] disulfide and bis(2,3-epoxypropyl)dithiodiethyl ether.
3. The acrylic resin composition according to claim 1, characterized in that, The weight ratio of the bis[(2-epoxyethylene methoxy)phenyl] disulfide and the bis(2,3-epoxypropyl) dithiodiethyl ether is 1:(1.5-3).
4. The acrylic resin composition according to any one of claims 1-3, characterized in that, The acrylic resin composition also includes a thiol catalyst or an organic base catalyst.
5. The acrylic resin composition according to claim 4, characterized in that, The thiol catalyst is selected from one or more of aliphatic thiols, aromatic thiols and 2-(dibutylamino)ethanethiol; the organic base catalyst is selected from one or more of 1,8-diazabicyclo[5.4.0]undec-7-ene, triethylamine and tetrabutylammonium hydroxide.
6. The acrylic resin composition according to any one of claims 1-3, characterized in that, The crosslinking agent is an isocyanate crosslinking agent; the emulsifier is an anionic emulsifier or a nonionic emulsifier; and the initiator is ammonium persulfate / sodium bisulfite.
7. A water-based acrylic resin, characterized in that, It is made using the acrylic resin composition according to any one of claims 1-6.
8. The method for preparing the waterborne acrylic resin as described in claim 7, characterized in that, Includes the following steps: (1) Add water, part of the emulsifier, butyl acrylate, styrene, epoxy resin and crosslinking agent to the emulsification equipment, stir and emulsify for 30-40 minutes to obtain an emulsion; (2) Dissolve part of the initiator in water and put it into the oxidant tank to obtain an initiator solution; (3) Dissolve the remaining emulsifier in water, put it into the reactor, and heat it to 85-88℃; add the remaining initiator and then add the emulsion and initiator solution dropwise to react. The addition is completed in 3.5-4.0h, and the temperature is maintained for 60-80min after the addition is completed. (4) Cool the system to 60-75℃ and then perform post-elimination treatment; then cool it to 40-50℃, adjust the pH to 7.8-8.5 with sodium hydroxide solution, stir evenly, filter, and obtain water-based acrylic resin.
9. The use of the acrylic resin composition according to any one of claims 1-6 or the waterborne acrylic resin according to claim 7 in caulking adhesives.
10. A non-curing flame-retardant sealant, characterized in that, It includes the following components in parts by weight: 40-50 parts of water-based acrylic resin, 3-4 parts of flame retardant, 2-4 parts of dispersant, 0.5-2.5 parts of defoamer, and 5-12 parts of chlorinated rubber powder.