Double-layer refrigerating and heating semiconductor temperature adjusting structure

Abstract

The invention provides a double-layer refrigerating and heating semiconductor temperature adjusting structure, and relates to the field of semiconductors, the double-layer refrigerating and heating semiconductor temperature adjusting structure comprises a heat conduction connecting piece, the heat conduction connecting piece is used for being connected with a product needing temperature adjustment, refrigerating assemblies are arranged above and below the heat conduction connecting piece, and the temperature of the refrigerating assemblies is conducted to the product through the heat conduction connecting piece; a heat conduction piece is arranged on the side, away from the heat conduction connecting piece, of the refrigeration assembly. The refrigeration assembly is further supported through the heat conduction piece, and heat conduction efficiency is improved. Through the arranged heat conduction connecting piece, connection and assembly with a product needing temperature adjustment are achieved through the heat conduction connecting piece, connection through a clamp and glue is not needed, the occupied space is reduced, the device can better adapt to use scenes, meanwhile, the overall heat resistance is reduced, the energy utilization rate is increased, and the number of parts and the maintenance cost are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor, in particular to a double-layer refrigeration and heating semiconductor temperature regulating structure. BACKGROUND

[0002] Thermoelectric Cooler (TEC) is based on Peltier effect, and realizes directional heat transfer through current, and is widely used in occasions requiring precise temperature control. The traditional thermoelectric cooler usually adopts a “sandwich” structure, i.e. ceramic substrates on both sides, and semiconductor dies in the middle, one side for refrigeration and the other side for heating.

[0003] When encountering a scene requiring double-sided refrigeration (such as PCR instrument, gene sequencing equipment, electronic device heat dissipation, etc.), the existing technology is to set a cooling piece on both sides of the product or equipment that needs to be cooled, and usually two thermoelectric coolers are fixed on both sides of the product by clips or glue, but using clips will cause complex installation, large space occupation and low adaptability; if using glue, the heat conduction efficiency will be reduced.

[0004] Therefore, we improve it and propose a double-layer refrigeration and heating semiconductor temperature regulating structure. SUMMARY

[0005] The purpose of the present application is to solve the problem of large space occupation or reduced heat conduction efficiency caused by the structure of fixing two thermoelectric coolers on both sides of the product.

[0006] In order to achieve the above-mentioned purpose and improve the above-mentioned problems, the present application provides a double-layer refrigeration and heating semiconductor temperature regulating structure, which comprises a heat conduction connecting piece, the heat conduction connecting piece is used to connect with the product needing temperature regulation, the upper and lower sides of the heat conduction connecting piece are provided with refrigeration assemblies, the temperature of the refrigeration assembly is conducted to the product through the heat conduction connecting piece, and the side, away from the heat conduction connecting piece, of the refrigeration assembly is provided with a heat conduction piece, and the refrigeration assembly further supports and improves the heat conduction efficiency through the heat conduction piece.

[0007] As a preferred technical scheme of the present application, the heat conduction connecting piece comprises a heat conduction block, and a plurality of assembly grooves are formed in the front end of the heat conduction block and used to connect with the product needing temperature regulation.

[0008] As a preferred technical scheme of the present application, the refrigeration assembly comprises a plurality of refrigeration groups, each refrigeration group comprises flow guide pieces located on the upper side and the lower side respectively, a semiconductor die is arranged between two adjacent flow guide pieces on the upper side and the lower side and forms a series connection, a plurality of groups of refrigeration groups are connected in series, and the plurality of groups of refrigeration groups form a “bow” shaped refrigeration component, and the two ends of the refrigeration component are respectively provided with positive and negative connection lines.

[0009] The positive electrode connecting wire of the upper refrigeration component is electrically connected with the positive electrode of the power supply, the positive electrode connecting wire of the lower refrigeration component is electrically connected with the positive electrode connecting wire of the upper refrigeration component, and the negative electrode connecting wire of the lower refrigeration component is electrically connected with the negative electrode of the power supply.

[0010] The inner wall of the assembly groove is provided with exhaust lines, which are used to exhaust the air between the assembly groove and the product, increase the friction and firmness of the contact with the product, and the like.

[0011] Compared with the prior art, the application has the following beneficial effects: In the scheme of the application, 1. The heat-conducting connecting piece is arranged, the heat-conducting connecting piece is connected with the product needing temperature adjustment, no clamps and glue are needed for connection, the occupied space is reduced, the use scene can be better adapted, the overall thermal resistance is reduced, the energy utilization rate is improved, the number of parts and the maintenance cost are reduced, the structure that two semiconductor refrigeration pieces are fixed on the two sides of the product in the prior art causes the problems of large occupied space or reduced heat conduction efficiency, and the like are solved; 2. The refrigeration assembly is arranged, the refrigeration assembly is used for directly conducting heat to the heat-conducting connecting piece, the integrated structure makes the assembly process simple and convenient, multiple contact surfaces are not needed, the problems of complex structure of the semiconductor, multiple contact surfaces in the heat conduction process, and large thermal resistance of the heat conduction in the prior art are solved; 3. The exhaust lines are arranged, the exhaust lines are used for exhausting the air between the product and the assembly groove, the heat conduction efficiency and the firmness of assembly are ensured, and the problems that the air between the product and the assembly groove cannot be exhausted in the prior art, the thermal resistance is increased, and the firmness of assembly is affected are solved. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 The structure schematic view of the double-layer refrigeration and heating semiconductor temperature adjustment structure is provided in the application; Figure 2 The structure schematic view of the communication hole in the double-layer refrigeration and heating semiconductor temperature adjustment structure is provided in the application; Figure 3 The structure schematic view of the refrigeration assembly in the double-layer refrigeration and heating semiconductor temperature adjustment structure is provided in the application; Figure 4 The structure schematic view of the assembly groove in the double-layer refrigeration and heating semiconductor temperature adjustment structure is provided in the application.

[0013] Indications in the figure are as follows: 1, heat-conducting block; 11, assembly groove; 12, communication hole; 13, mounting groove; 2, refrigeration assembly; 21, semiconductor crystal grain; 22, flow guide piece; 23, heat-conducting plate; 31, positive electrode connecting wire; 32, negative electrode connecting wire. DETAILED DESCRIPTION

[0014] In order to make the personnel in the technical field better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person of ordinary skill in the art without creative labor should belong to the protection scope of the present application.

[0015] In order to make the personnel in the technical field better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present application.

[0016] It should be noted that the embodiments in the present application and the features and technical solutions in the embodiments can be combined with each other without conflict.

[0017] It should be noted that: similar labels and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0018] Embodiment 1 Please refer to Figure 1 and Figure 2 A double-layer refrigeration and heating semiconductor temperature regulating structure, which comprises a heat-conducting connecting piece for connecting with a product in need of temperature regulation, realizing installation without the need of a clamp or glue, and a refrigeration assembly 2 arranged above and below the heat-conducting connecting piece, the refrigeration assembly 2 being capable of refrigerating on one side and heating on the other side after being powered on, so that the corresponding side is installed towards the heat-conducting connecting piece according to the demand, the temperature of the refrigeration assembly 2 being conducted to the product through the heat-conducting connecting piece, and a heat-conducting piece being arranged on the side of the refrigeration assembly 2 away from the heat-conducting connecting piece, the refrigeration assembly 2 further supporting and improving the heat-conducting efficiency through the heat-conducting piece, and providing a protection function at the same time.

[0019] Further, as Figure 1 , Figure 2 and Figure 4As shown in the figure, the heat-conducting connecting part includes a heat-conducting block 1. The heat-conducting block 1 can be replaced by a plate-shaped or block-shaped component made of a heat pipe or other metal materials. The heat-conducting block 1 is used to conduct the temperature of the refrigeration component 2. A plurality of assembly grooves 11 are formed at the front end of the heat-conducting block 1. The product is connected through the assembly grooves 11 without using clips and glue, reducing the processing difficulty. The product to be temperature-controlled is connected through the assembly grooves 11. The interior of the assembly grooves 11 and the product are in interference fit. The shapes of the heat-conducting block 1 and the assembly grooves 11 can be processed into various shapes according to customer requirements. For example, the assembly grooves 11 penetrate through the rear of the heat-conducting block 1, which is suitable for products such as pipes. When the assembly grooves 11 penetrate through the rear of the heat-conducting block 1 and the number is 1, it can be circular, "mouth" shaped or "U" shaped, etc. Among them, the circular shape is suitable for products such as pipes. When the assembly grooves 11 are "U" shaped, the included angle between the upper and lower end faces inside the assembly grooves 11 is 0° to 30°, that is, the upper and lower end faces are parallel or the upper and lower end faces gradually separate from the U-shaped connection to the opening, so as to facilitate the fitting of the upper and lower end faces inside the assembly grooves 11 when inserting the product. When the number is 2, it can be "day" shaped or "A" shaped; at the same time, the opened assembly grooves 11 can be selected to not completely penetrate the heat-conducting block 1 according to requirements. When the installation is unstable, bolts can be provided between the two heat-conducting plates 23 at the opening of the assembly grooves 11. By tightening the bolts, the upper and lower end faces inside the assembly grooves 11 can be made to approach the product. A communication hole 12 communicating with the interior of the assembly grooves 11 is formed on one side of the heat-conducting block 1, and an installation groove 13 is formed at the rear end of the heat-conducting block 1. The communication hole 12 and the installation groove 13 are respectively used to install different sensors, and the sensors include but are not limited to temperature sensors or humidity sensors.

[0020] Furthermore, as Figure 1 , Figure 2 and Figure 3 shown in the figure, the refrigeration component 2 includes a plurality of refrigeration groups. Each refrigeration group includes flow guide sheets 22 located on the upper and lower sides respectively. The temperature is conducted to the heat-conducting plate 23 or the heat-conducting block 1 through the flow guide sheets 22. A semiconductor crystal grain 21 is provided between two adjacent upper and lower flow guide sheets 22 and forms a series connection. A series connection is formed between several groups of refrigeration groups. Several groups of refrigeration groups form a refrigeration component in the shape of a "bow". The refrigeration component is connected to a power supply through a positive electrode wire 31 and a negative electrode wire 32. After being powered on by the power supply, one side of the refrigeration component is cooled, which is the cooling surface, and the other side generates heat, which is the heating surface. When the product needs to be warmed up or preheated, the heating surfaces of the upper and lower refrigeration components are connected to the heat conduction block 1, and when the product needs to be cooled down or heat dissipated, the refrigeration surfaces of the upper and lower refrigeration components are connected to the heat conduction block 1, and the two ends of the refrigeration components are respectively provided with positive and negative connection lines 31 and 32, and when the side of the two refrigeration components facing the heat conduction block 1 is the refrigeration surface, the heat conduction block 1 can be used as a water-cooled plate to replace the lower part; The heat conduction member includes two heat conduction plates 23, which are respectively located at the end of the refrigeration assembly 2 away from the heat conduction block 1, and the heat conduction plate 23 is fixedly connected with the closest plurality of flow guide fins 22; the heat conduction block 1 and the heat conduction plate 23 are integrated with the structure of the refrigeration assembly 2, so that the assembly process is simple and convenient, the overall thermal resistance is reduced, the energy utilization rate is improved, the number of parts is reduced, the problem of easy damage is avoided, the occupied space is reduced, and more use scenarios can be adapted; The heat conduction surface material of the heat conduction block 1 and the heat conduction plate 23 is selected from aluminum oxide, aluminum nitride, copper or aluminum, and the basic data of the four materials are compared in the following table:

[0021] The measured performance data of the four materials are as follows:

[0022] Example 2 The double-layer refrigeration and heating semiconductor temperature regulating structure provided in Example 1 is further optimized, and specifically, as shown in Figure 1 and Figure 2 The heat conduction block 1 and the adjacent flow guide fins 22 in the upper and lower refrigeration components are fixed by welding or glue.

[0023] Example 3 The double-layer refrigeration and heating semiconductor temperature regulating structure provided in Example 2 is further optimized, and as shown in Figure 1 and Figure 2 The positive connection lines 31 of the two refrigeration components are electrically connected to the positive pole of the power supply, and a switch is electrically connected between the two positive connection lines 31 and the power supply, and the power supply is controlled by the switch. The negative connection lines 32 of the two refrigeration components are electrically connected to the negative pole of the power supply, and this connection mode has the advantages of direct structure and separate control.

[0024] Example 4 The double-layer refrigeration and heating semiconductor temperature regulating structure provided in Example 2 is further optimized, and as shown in Figure 1 and Figure 2As shown, the positive electrode wire 31 above the upper refrigeration component is electrically connected to the positive electrode of the power supply, and the refrigeration component is powered by the power supply. The switch between the positive electrode wire 31 above and the power supply is electrically connected, and the switch controls the power-on. The negative electrode wire 32 above is electrically connected to the positive electrode wire 31 of the lower refrigeration component, and the negative electrode wire 32 below the lower refrigeration component is electrically connected to the negative electrode of the power supply. This connection method only needs to handle two power supply leads, one connected to the positive electrode wire 31 above, and the other connected to the negative electrode wire 32 below. The structure is simple, reduces the number of positions that need to be maintained, and at the same time, the series connection can ensure that the current of the two refrigeration components is the same, ensuring that the refrigeration power and efficiency are consistent, which is conducive to the uniformity and stability of the temperature of the entire heat conduction block 1.

[0025] Example 5 The double-layer refrigeration and heating semiconductor temperature regulating structure provided in Example 3 or Example 4 is further optimized, as shown in Figure 1 、 Figure 2 and Figure 4 As shown, the inner wall of the assembly groove 11 is provided with exhaust grooves, which are honeycomb-shaped or net-shaped, forming a network of micro exhaust channels on the surface of the inner wall of the assembly groove 11. The exhaust grooves are used to exhaust the air between the assembly groove 11 and the product, avoiding the influence of air on the temperature regulating effect and the firmness of the assembly. At the same time, the exhaust grooves provided on the inner wall of the assembly groove 11 can increase the friction and firmness of the contact with the product. When the product that needs to be temperature-regulated is pressed into the interior of the assembly groove 11, air will appear between the surface of the product and the assembly groove 11, similar to the air remaining between the screen and the film when a screen film is attached to a mobile phone. In this structure, the air between the product and the inner wall of the assembly groove 11 will affect the contact between the multiple area products and the assembly groove 11, increasing the thermal resistance and reducing the heat conduction efficiency. The exhaust grooves play a role in exhausting the air between the product and the assembly groove 11. When the product itself generates heat or the refrigeration assembly 2 generates heat, the heat will be conducted to the entire contact interface of the assembly groove 11. According to the ideal gas law (PV = nRT), when the temperature (T) of the residual air rises sharply, if its mass (n) and space (volume V is approximately constant) are basically limited, its pressure (P) will increase significantly. These heated and expanded air will try to find a way out, and if there is no way out, it will gather in a local high-pressure bubble. These bubbles will act like "shims" to separate the surfaces of the assembly groove 11 and the product that should be in close contact, not only increasing the thermal resistance, but also possibly generating stress, causing gaps between the product and the heat conduction block 1. At this time, the role of the small exhaust grooves is to provide a predetermined channel for the heated and expanded gas to exhaust, preventing the pressure from gathering and the close contact between the assembly groove 11 and the product. If the product surface or the environment has trace moisture, the moisture will be adsorbed on the surface of the assembly groove 11 or the micro gap of the product. When the interface temperature rises and the water evaporates, the liquid water will quickly vaporize to form water vapor; or there are grease, adhesive residues or other organic contaminants on the contact surface, which will volatilize and form gas after heating; these generated water vapor and gas also need to be discharged in time through the exhaust lines.

[0026] The use process of the double-layer refrigeration and heating semiconductor temperature regulating structure provided by the application is as follows: When installing the product needing temperature regulation in the assembly groove 11, the product is assembled in the assembly groove 11 with interference, and in use, the power supply is connected to the two refrigeration components through the control switch, the temperature is conducted to the heat conduction block 1 through the flow guide piece 22 at the top end and the bottom end of the heat conduction block 1, the heat conduction efficiency is improved through the heat conduction piece 41, and then the temperature is conducted to the product in the assembly groove 11.

[0027] In the application, unless otherwise clearly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, can be detachable connection, or can be integrated; can be mechanical connection, can be electrical connection or communication with each other; can be directly connected, or indirectly connected through an intermediate medium; can be the communication between two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those skilled in the art, the specific meanings of the above terms in the application can be understood according to the specific circumstances.

[0028] Obviously, the above-described embodiments are only some of the embodiments of the application, not all the embodiments, and the preferred embodiments of the application are given in the drawings, but do not limit the patent scope of the application. The application can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive. Although the application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or make equivalent replacements to some technical features. Any equivalent structure made by using the content of the specification and drawings, directly or indirectly applied to other related technical fields, is also within the patent protection scope of the application.

Claims

1. A semiconductor temperature control structure for dual-layer cooling and heating, characterized in that, It includes a heat-conducting connecting piece which is used to connect with the product that needs temperature adjustment. Refrigeration components (2) are provided both above and below the heat-conducting connecting piece. The temperature of the refrigeration components (2) is conducted to the product through the heat-conducting connecting piece. A heat-conducting piece is provided on the side of the refrigeration component (2) away from the heat-conducting connecting piece. The refrigeration component (2) is further supported and the heat-conducting efficiency is improved through the heat-conducting piece.

2. The semiconductor temperature regulation structure for double-layer cooling and heating according to claim 1, characterized in that, The heat-conducting connecting piece includes a heat-conducting block (1). A plurality of assembly grooves (11) are formed at the front end of the heat-conducting block (1), and it is connected with the product that needs temperature adjustment through the assembly grooves (11).

3. The semiconductor temperature regulation structure for double-layer cooling and heating according to claim 2, characterized in that, The refrigeration component (2) includes a plurality of refrigeration groups. Each refrigeration group includes flow guide plates (22) located on the upper and lower sides respectively. A semiconductor chip (21) is provided between two adjacent flow guide plates (22) in the up and down direction and forms a series connection. A series connection is formed between several groups of refrigeration groups, and several groups of refrigeration groups form a "bow"-shaped refrigeration member. Positive connection wires (31) and negative connection wires (32) are provided at both ends of the refrigeration member respectively.

4. The semiconductor temperature regulation structure for double-layer cooling and heating according to claim 3, characterized in that, The positive connection wire (31) of the refrigeration member located above is electrically connected to the positive pole of the power supply. The negative connection wire (32) located above is electrically connected to the positive connection wire (31) of the refrigeration member below. The negative connection wire (32) of the refrigeration member located below is electrically connected to the negative pole of the power supply.

5. The semiconductor temperature regulation structure for double-layer cooling and heating according to claim 3, characterized in that, The assembly groove (11) penetrates through the rear of the heat-conducting block (1).

6. The semiconductor temperature control structure for double-layer cooling and heating according to claim 5, characterized in that, When the number of the assembly grooves (11) is 1, it is "square" shaped.

7. The semiconductor temperature control structure for double-layer cooling and heating according to claim 5, characterized in that, When the number of the assembly grooves (11) is 1, it is "U" shaped, and the included angle between the upper and lower end faces inside the assembly groove 11 is 0 to 30°.

8. The semiconductor temperature regulation structure for double-layer cooling and heating according to claim 5, characterized in that, When the number of the assembly grooves (11) is 2, it is "day" shaped.

9. A semiconductor temperature regulation structure for double-layer cooling and heating according to claim 3, characterized in that, The assembly groove (11) does not completely penetrate the heat-conducting block (1).

10. A semiconductor temperature-regulating structure for dual-layer cooling and heating according to claim 2 or 3, characterized in that, Exhaust lines are formed on the inner wall of the assembly groove (11). The exhaust lines are used to discharge the air between the assembly groove (11) and the product, and at the same time increase the friction and firmness of contact with the product.

Images