Device for detecting optical performance of packaged LED semiconductor chip
By utilizing automated equipment and employing light-shielding design, the problems of cumbersome LED semiconductor chip testing processes and inaccurate results have been solved, enabling efficient and accurate optical performance testing.
Patent Information
- Application Number
- CN202511711315.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-20
- Publication Date
- 2026-02-17
AI Technical Summary
Existing LED semiconductor chip testing equipment suffers from cumbersome testing procedures and inaccurate test results, mainly due to frequent chip replacements during manual operation, ambient light interference, and insecure chip mounting.
By employing the coordinated operation of automated material storage modules, chip delivery modules, and robotic arms, along with a light shield, chip power supply module, and light flux detection module, automated flow, precise fixation, and stable detection are achieved.
It enables efficient and accurate optical performance testing of LED semiconductor chips, simplifies the testing process, improves the stability and reliability of test results, and meets the needs of modern production lines.
Smart Images
Figure CN121540388A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of LED semiconductor chip optical detection technology, specifically to an optical performance testing device for LED semiconductor chips after packaging. Background Technology
[0002] LED semiconductor chips, as the "heart" of light-emitting diodes (LEDs), are solid-state semiconductor devices that directly convert electrical energy into light energy. After packaging, LED semiconductor chips undergo optical performance testing, which mainly tests the luminous flux, luminous intensity, chromaticity parameters, luminous efficacy, and light decay of the LED semiconductor chip. Among these, luminous flux is a key indicator for measuring the total amount of light emitted by the LED chip, which directly affects the lighting effect and application range of LED products.
[0003] Currently, some equipment has the following drawbacks when testing LED semiconductor chips: 1. The testing process is carried out manually, which requires changing the chip being tested or adjusting its position multiple times, making the testing process cumbersome and difficult to meet the high-efficiency testing requirements of modern production lines. 2. Ambient light interference and chip insecure fixing during the testing process can also cause significant deviations in the test results, affecting the accurate evaluation of the optical performance of the LED chip. Summary of the Invention
[0004] To address the shortcomings of existing technologies, this invention provides an optical performance testing device for LED semiconductor chips after packaging. The main purpose is to solve the problems of manual testing, which requires multiple replacements or adjustments to the chip's position, resulting in a cumbersome testing process that fails to meet the high-efficiency testing requirements of modern production lines. Furthermore, factors such as ambient light interference and unstable chip mounting during testing can lead to significant deviations in test results, affecting the accurate evaluation of the LED chip's optical performance.
[0005] To achieve the above objectives, the present invention provides the following technical solution: An optical performance testing device for packaged LED semiconductor chips includes a base and a feeding rack for holding LED semiconductor chips. The top of the base is equipped with a storage module for holding multiple feeding racks. One side of the storage module is equipped with a chip conveying module mounted on the base, used to move the feeding racks and fix the LED semiconductor chips during movement. The other side of the chip conveying module is equipped with a robotic arm mounted on the base for transferring the feeding racks. Light flux detection modules are mounted on the base on both sides of the middle area of the chip conveying module, used to detect and mark the light flux of the LED semiconductor chips on the feeding racks. Chip power supply modules are mounted on the base on both sides of the chip conveying module, used to supply power to the LED semiconductor chips during testing. A light shield is provided on the top of the base, with the chip power supply module and the light flux detection module both located inside the light shield, and both ends of the chip conveying module passing through the light shield.
[0006] Furthermore, the chip conveying module includes two conveyor belts set on the top of the base, with a gap between the conveyor belts, and the two ends of the feeding rack are respectively located above the conveyor belts. The top of the feeding rack is provided with a positioning groove, and the pins of the LED semiconductor chip are located in the positioning groove. The top of the feeding rack is slidably connected to two symmetrically distributed slides. A tension spring is provided between the slides and the feeding rack to pull the slides away from the LED semiconductor chip. The slides cooperate with the chip power supply module to fix the LED semiconductor chip.
[0007] Based on the aforementioned solution, the chip power supply module includes two upright frames fixed to the top of the base. Each upright frame has a conductive strip connected to an external circuit on its opposite sides. There is a potential difference between the two conductive strips. The feeding rack has grooves on both sides to avoid the conductive strips. A clearance groove is formed on one inner wall of the groove. A conductive plate for conducting electricity is provided on one inner wall of the clearance groove. A carbon brush is provided at one end of the conductive plate. A contact point connected to the conductive plate is provided at the bottom of the positioning groove of the feeding rack. An arc-shaped elastic plate is fixed to one inner wall of the clearance groove by bolts, and one end of the arc-shaped elastic plate is in contact with the conductive plate.
[0008] As a further embodiment of the present invention, the top ends of both sides of the feeding rack are downward pressing slopes, and the downward pressing slopes are provided with multiple mounting grooves. Rolling balls roll in the mounting grooves. Inclined pressure strips are welded to the opposite sides of the two vertical plate frames, and the inclination angle of the pressure strips is the same as the inclination angle of the downward pressing slopes.
[0009] Furthermore, extrusion plates are welded to opposite sides of both upright frames, with one end of the extrusion plate being an inclined surface for extruding the slide to move on the feeding rack.
[0010] Based on the aforementioned scheme, the luminous flux detection module includes two dual-axis linear modules. The movable end of the dual-axis linear module is fixed with a mounting bracket by bolts. The luminous flux detection probe is fixed with bolts on the top inner wall of the mounting bracket. The tops of the two upright brackets on opposite sides are both clearance slopes. One side of the mounting bracket is provided with a marking component for marking defective LED semiconductor chips.
[0011] As a further embodiment of the present invention, the marking component includes a wax outlet tube fixed to the mounting frame, and a placement hole is provided on the top of the feeding frame. Molten wax drips from the wax outlet tube into the placement hole. An ejection component for ejecting solidified wax is provided in the placement hole. An arc-shaped baffle concentric with the placement hole is welded to the top of the feeding frame, and the inner diameter of the arc-shaped baffle is the same as the diameter of the placement hole.
[0012] Furthermore, the ejection assembly includes an L-shaped rod fixed to the bottom of the feeding rack and a support column inserted into the placement hole. A limit ring is welded to one side of the support column, and the limit ring is sleeved on the outside of the L-shaped rod.
[0013] Based on the aforementioned solution, the storage module includes a storage rack fixed to the top of the base, multiple feeding racks placed inside the storage rack, and through slots opened on multiple sides of the storage rack. A drive motor is fixed to one side of the storage rack by bolts, and a lead screw is fixed to the output shaft of the drive motor by a coupling. A lifting plate is slidably connected inside the storage rack, and the end of the lifting plate extending beyond the storage rack cooperates with the lead screw to move up and down.
[0014] As a further embodiment of the present invention, the bottom of the feeding rack is integrally formed with an extended protrusion, the length of which is the same as the distance between two adjacent conveyor belts.
[0015] Compared with the prior art, the present invention provides an optical performance testing device for LED semiconductor chips after packaging, which has the following beneficial effects: 1. This invention achieves continuous automated flow of multiple feeding racks through the coordinated operation of the material storage module, chip conveying module and robotic arm. It eliminates the need for frequent manual replacement of the tested chips or adjustment of chip positions, greatly simplifies the testing process and meets the needs of modern production lines for efficient testing.
[0016] 2. By incorporating a light shield, this invention effectively blocks interference from external ambient light, ensuring that the light flux detection module operates in a stable dark environment and improving the accuracy of the detection results.
[0017] 3. The present invention, through the combination of a pressing plate, a sliding frame, and a tension spring, not only achieves precise fixation of LED semiconductor chips during the testing stage, but also automatically releases the fixation during non-testing stages without the need for manual intervention and adjustment, further optimizing the smoothness of the overall testing process.
[0018] 4. This invention features a chip power supply module, eliminating the need for manual wiring. Automatic connection and power disconnection are achieved through the movement of the feeding rack, ensuring the automation and stability of the power supply process. It also avoids wiring contact problems that may occur during manual operation, further improving the reliability and safety of the testing equipment.
[0019] 5. This invention increases the positive pressure by combining the pressure bar and the downward pressure slope, and combined with the drag reduction design of the ball bearings, which significantly improves the friction between the feeding rack and the conveyor belt, avoids slippage of the feeding rack during movement, ensures the accuracy of workstation transfer, and does not affect the normal conveying speed of the feeding rack due to excessive friction, thus further optimizing the operational stability and reliability of the equipment.
[0020] 6. This invention achieves automatic and precise fixation of LED semiconductor chips during the power supply and testing stages by guiding the movement of the slide carriage through the inclined surface of the extrusion plate. The fixation process is smooth and impact-free, effectively protecting the structural integrity of the LED semiconductor chip.
[0021] 7. The present invention provides a marking component to facilitate the identification of solid wax by workers or automated equipment, thereby removing the feed rack currently containing defective chips. Attached Figure Description
[0022] Figure 1 This is a three-dimensional structural diagram of an optical performance testing device for LED semiconductor chips after packaging, as proposed in this invention. Figure 2 This is a schematic diagram of the internal structure of the light shield of an optical performance testing device for LED semiconductor chips after packaging, as proposed in this invention. Figure 3 This is an enlarged structural diagram of the chip delivery module of an LED semiconductor chip optical performance testing device proposed in this invention; Figure 4 This is an enlarged schematic diagram of the upper side of the feeding rack of an LED semiconductor chip optical performance testing device after packaging, as proposed in this invention. Figure 5 This is an enlarged schematic diagram of the lower side of the feeding rack of an LED semiconductor chip optical performance testing device after packaging, as proposed in this invention. Figure 6 This is an exploded view of the loading rack structure of an LED semiconductor chip post-packaging optical performance testing equipment proposed in this invention; Figure 7 This invention proposes an optical performance testing device for LED semiconductor chips after packaging. Figure 6 A partial sectional view of the feeding rack; Figure 8This is a magnified schematic diagram of the chip power supply module of an optical performance testing device for LED semiconductor chips after packaging, as proposed in this invention. Figure 9 This is a partially enlarged schematic diagram of the extrusion plate of an LED semiconductor chip optical performance testing device proposed in this invention. Figure 10 This is a magnified schematic diagram of the luminous flux detection module of an optical performance testing device for LED semiconductor chips after packaging, as proposed in this invention. Figure 11 This is a magnified schematic diagram of the storage module of an optical performance testing device for LED semiconductor chips after packaging, as proposed in this invention.
[0023] In the diagram: 1. Base; 2. Light shield; 3. Chip delivery module; 4. Chip power supply module; 5. Luminous flux detection module; 6. Material storage module; 7. Robotic arm; 301. Conveyor belt; 302. Feed rack; 303. Groove; 304. Downward pressure slope; 305. Ball bearing; 306. Mounting groove; 307. Slide carriage; 308. Positioning groove; 309. Arc-shaped baffle; 310. Placement hole; 311. Support column; 312. Extension protrusion; 313. Limiting ring; 314. L-shaped rod; 315. Contact point; 316. Tension spring; 317. Alternating groove; 318. Arc-shaped elastic plate; 319. Conductive plate; 320. Carbon brush; 401. Upright plate frame; 402. Pressure strip; 403. Extrusion plate; 404. Conductive strip; 405. Alignment slope; 501. Dual-axis linear module; 502. Mounting bracket; 503. Luminous flux detection probe; 504. Wax ejection tube; 601. Storage rack; 602. Through slot; 603. Lifting plate; 604. Lead screw; 605. Drive motor. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
[0025] The component designations used in this document, such as "first" and "second," are merely for distinguishing the described objects and do not have any sequential or technical meaning. The terms "connection" and "linkage" used in this invention, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.
[0026] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0027] Please see Figures 1-11 As shown, an optical performance testing device for LED semiconductor chips after packaging includes a base 1 and a feeding rack 302 on which LED semiconductor chips are placed. The top of the base 1 is provided with a storage module 6 for placing multiple feeding racks 302. A chip conveying module 3 is provided on one side of the storage module 6 and is mounted on the base 1 to drive the feeding rack 302 to move and fix the LED semiconductor chips during the movement. A robotic arm 7 is provided on the base 1 for transferring the feeding rack 302. Light flux detection modules 5 are provided on both sides of the middle area of the chip conveying module 3 and are mounted on the base 1 to perform light flux detection and marking on the LED semiconductor chips on the feeding rack 302. Chip power supply modules 4 are provided on both sides of the chip conveying module 3 and are mounted on the base 1 to supply power to the LED semiconductor chips during testing. A light shield 2 is provided on the top of the base 1. The chip power supply module 4 and the light flux detection module 5 are both located inside the light shield 2, and both ends of the chip conveying module 3 pass through the light shield 2. In use, LED semiconductor chips are placed in and assembled in the feeding rack 302. The assembled feeding racks 302 are then placed in the storage module 6. The robotic arm 7 transfers the feeding racks 302 in the storage module 6 to the chip conveying module 3. The chip conveying module 3 moves the feeding racks 302 to the subsequent processing station. During the transfer, the chip power supply module 4 supplies power to the LED semiconductor chips, causing them to light up for a period of time before entering the station of the luminous flux detection module 5. The luminous flux detection module 5 performs luminous flux detection on the LED semiconductor chips. If a defective LED semiconductor chip is detected, the current feeding rack 302 is marked for easy identification by the staff. After the detection is completed, the chip conveying module 3 continues to move the feeding racks 302 until they are conveyed to the designated position outside the light shield 2, so that the marked defective chips can be processed by the staff. Throughout the process, the light shield 2 effectively blocks the interference of external ambient light, ensuring that the light flux detection module 5 works in a stable dark environment. Meanwhile, the chip delivery module 3's design for fixing the LED semiconductor chip when moving the feeding rack 302 prevents the chip from shifting during the detection process, significantly improving the stability and accuracy of the detection results. Meanwhile, through the coordinated operation of the storage module 6, the chip conveying module 3 and the robotic arm 7, the continuous automated flow of multiple feeding racks 302 is realized, eliminating the need for frequent manual replacement of the tested chips or adjustment of chip positions, greatly simplifying the testing process and meeting the needs of modern production lines for efficient testing.
[0028] It should be noted that: the robotic arm 7 is a common multi-degree-of-freedom industrial robotic arm in the prior art, and its end is equipped with a clamping structure adapted to the feeding rack 302, which can accurately grab the feeding rack 302 from the storage module 6 and place it stably on the chip conveying module 3; the specific structure of the feeding rack 302 can be customized according to the size and shape of the LED semiconductor chip; the light shield 2 is made of multi-layer composite light shielding material, and the inner wall is also provided with a light-absorbing coating, which can absorb internal stray light to the maximum extent; in addition, the base 1 integrates a PLC control system, and the whole equipment realizes the collaborative work between the modules through the PLC control system. The operator only needs to set the relevant detection parameters through the touch screen to start the entire automated detection process, which greatly reduces manual intervention and improves detection efficiency and the reliability of results.
[0029] In order to realize the station transfer of the feeding rack 302; The chip delivery module 3 includes two conveyor belts 301 disposed on the top of the base 1, with a gap between the conveyor belts 301. The two ends of the feeding rack 302 are respectively located above the conveyor belts 301. The top of the feeding rack 302 is provided with a positioning groove 308. The pins of the LED semiconductor chip are located in the positioning groove 308, and the top of the pins of the LED semiconductor chip is flush with the top of the positioning groove 308. The top of the feeding rack 302 is slidably connected with two symmetrically distributed slides 307. A tension spring 316 is provided between the slides 307 and the feeding rack 302 to pull the slides 307 away from the LED semiconductor chip. The slides 307 cooperate with the chip power supply module 4 to fix the LED semiconductor chip. When it is necessary to move the feeding rack 302 to a different workstation, the two conveyor belts 301 are started at the same time, so that the two conveyor belts 301 run synchronously, thereby moving the feeding rack 302 placed on the two conveyor belts 301. As the feeding rack 302 moves smoothly on the conveyor belts 301, the positioning groove 308 on its top forms a preliminary limit on the pins of the LED semiconductor chip, so that the LED semiconductor chip will not fall off during the movement. When the feeding rack 302 moves to the corresponding position of the chip power supply module 4, the contact part of the chip power supply module 4 will contact the slide 307, pushing the slide 307 to slide towards the LED semiconductor chip against the tension of the tension spring 316, thereby tightly clamping the LED semiconductor chip in the positioning groove 308, realizing the firm fixation of the chip, and avoiding the impact of position displacement on the detection accuracy during the detection process. When the feeding rack 302 leaves the effective range of the chip power supply module 4, the tension spring 316 will pull the slide 307 to reset, releasing the clamping of the LED semiconductor chip, so that the robotic arm 7 can then transfer the feeding rack 302, improving the continuity and automation of the equipment operation. This design, which uses the chip power supply module 4 in conjunction with the slide 307 and tension spring 316, not only achieves precise fixation of the LED semiconductor chip during the testing phase, but also automatically releases the fixation during non-testing phases without manual intervention, further optimizing the smoothness of the overall testing process.
[0030] The conveyor belt 301 is a synchronous belt structure, and its surface is covered with a layer of wear-resistant rubber material, which can increase the friction with the bottom of the feeding rack 302 and prevent the feeding rack 302 from slipping during the conveying process. The two ends of the conveyor belt 301 are tensioned by drive wheels and driven wheels, respectively. The drive wheels are driven by servo motors, and the running speed of the conveyor belt 301 can be precisely adjusted by the PLC control system.
[0031] In order to supply power to the LED semiconductor chip; The chip power supply module 4 includes two upright brackets 401 fixed on the top of the base 1. Each upright bracket 401 has a conductive strip 404 connected to an external circuit on its opposite side. There is a potential difference between the two conductive strips 404. The feeding rack 302 has grooves 303 on both sides to avoid the conductive strips 404. A clearance groove 317 is provided on one inner wall of the groove 303. A conductive plate 319 for conducting electricity is provided on one inner wall of the clearance groove 317. A carbon brush 320 is provided at one end of the conductive plate 319. A contact 315 connected to the conductive plate 319 is provided at the bottom of the positioning groove 308 of the feeding rack 302. An arc-shaped elastic plate 318 is fixed to one inner wall of the clearance groove 317 by bolts, and one end of the arc-shaped elastic plate 318 is in contact with the conductive plate 319. When the feeding rack 302 moves to the area of the chip power supply module 4 under the drive of the conveyor belt 301, the conductive strip 404 will contact the carbon brush 320 in the groove 303, and the arc-shaped elastic plate 318 will apply elastic pressure to the conductive plate 319 to ensure that the carbon brush 320 and the conductive strip 404 always maintain close contact and avoid power interruption due to poor contact. At this time, the external circuit transmits current to the contact 315 in the positioning groove 308 through the conductive strip 404, carbon brush 320 and conductive plate 319. The contact 315 contacts the pins of the LED semiconductor chip, thereby providing a stable operating voltage to the LED semiconductor chip so that it can emit light normally for subsequent luminous flux detection. This power supply method eliminates the need for manual wiring connections. Automatic connection and power disconnection are achieved through the movement of the feeding rack 302, ensuring the automation and stability of the power supply process. It also avoids wiring contact problems that may occur during manual operation, further improving the reliability and safety of the testing equipment. Furthermore, the height of the conductive strip 404 is less than the height of the groove 303, and the conductive strip 404, contact 315, conductive plate 319 and arc-shaped elastic plate 318 are all made of high-elasticity beryllium copper material, which has strong elastic deformation capability and excellent conductivity. This ensures stable pressure between the carbon brush 320 and the conductive strip 404, reduces contact resistance, reduces power loss during power transmission, and ensures that the LED semiconductor chip receives a precise power supply voltage, providing a stable power guarantee for the accuracy of luminous flux detection.
[0032] To increase the friction between the feeding rack 302 and the conveyor belt 301; The top of both sides of the feeding rack 302 is a downward pressing slope 304. The downward pressing slope 304 has multiple mounting grooves 306. Rolling balls 305 roll in the mounting grooves 306. The opposite sides of the two upright plates 401 are welded with inclined pressure strips 402. The inclination angle of the pressure strips 402 is the same as the inclination angle of the downward pressing slope 304. As the feeding rack 302 moves on the conveyor belt 301, the pressure bar 402 will come into contact with the ball bearings 305 on the downward pressure slope 304, thereby generating downward pressure on the downward pressure slope 304, which increases the positive pressure between the bottom of the feeding rack 302 and the conveyor belt 301. Meanwhile, the ball bearings 305 in the mounting groove 306 roll into contact with the pressure strip 402, converting sliding friction into rolling friction, effectively reducing the resistance when the feeding rack 302 moves, and ensuring that it can still move smoothly under pressure. By increasing the positive pressure through the cooperation of the pressure strip 402 and the downward pressure slope 304, and combined with the drag reduction design of the ball bearing 305, the friction between the feeding rack 302 and the conveyor belt 301 is significantly improved, avoiding slippage of the feeding rack 302 during movement and ensuring the accuracy of the workstation transfer. At the same time, the normal conveying speed of the feeding rack 302 will not be affected by excessive friction, further optimizing the operational stability and reliability of the equipment. Meanwhile, the design that the height of the conductive strip 404 is less than the height of the groove 303 also provides sufficient space for the pressure strip 402 to apply downward pressure to the feeding rack 302, preventing the conductive strip 404 from interfering with the inner wall of the groove 303. This ensures that the feeding rack 302 can still pass smoothly through the chip power supply module 4 area under pressure, avoiding equipment operation obstruction or component damage due to structural collisions. From a spatial layout perspective, this further ensures the continuity and stability of the entire testing process.
[0033] In order to fix and press down the LED semiconductor chip during the testing process, so that the LED semiconductor chip and the contact 315 remain in contact at all times; Extrusion plates 403 are welded to opposite sides of the two upright frames 401. One end of the extrusion plate 403 is inclined and used to extrude the slide 307 to move on the feeding frame 302. The extrusion plate 403 is a contact component of the chip power supply module 4. During the movement of the extrusion plate 403, when the feeding rack 302 moves to the area of the chip power supply module 4 along with the conveyor belt 301, the end of the slide 307 will first contact the inclined surface of the extrusion plate 403. As the feeding rack 302 continues to move, the inclined surface of the extrusion plate 403 will generate a horizontal pushing force on the slide 307, forcing the slide 307 to overcome the tension of the tension spring 316 and slide along the top of the feeding rack 302 towards the LED semiconductor chip. During this process, the inner side of the slide 307 will gradually contact the top of the LED semiconductor chip and apply clamping force to it, so as to firmly fix the LED semiconductor chip in the positioning groove 308, ensuring that the pins of the chip and the contact 315 at the bottom of the positioning groove 308 always maintain stable contact, avoiding power interruption or poor contact due to chip loosening or displacement, thereby ensuring that the LED semiconductor chip can emit light stably during subsequent light flux detection. When the feeding rack 302 moves to the flat section of the extrusion plate 403, the clamping force of the slide 307 on the LED semiconductor chip reaches its maximum and remains stable until the feeding rack 302 completely passes through the chip power supply module 4 area. After the slide 307 is released from the constraint of the extrusion plate 403, it resets under the action of the tension spring 316, releasing the clamping force on the LED semiconductor chip. This design, which guides the movement of the carriage 307 through the inclined surface of the extrusion plate 403, enables automatic and precise fixation of the LED semiconductor chip during the power supply and testing stages. The fixation process is smooth and shock-free, effectively protecting the structural integrity of the LED semiconductor chip.
[0034] To measure the luminous flux of LED semiconductor chips; The luminous flux detection module 5 includes two dual-axis linear modules 501. The movable end of the dual-axis linear module 501 is fixed with a mounting bracket 502 by bolts. The luminous flux detection probe 503 is fixed with bolts on the top inner wall of the mounting bracket 502. The top of the two upright brackets 401 on opposite sides are both clearance slopes 405. A marking component for marking defective LED semiconductor chips is provided on one side of the mounting bracket 502. The two dual-axis linear modules 501 are symmetrically positioned and staggered to follow the feeding rack 302 on the conveyor belt 301 to move horizontally, providing time for the luminous flux detection probe 503 to reset. During the testing process, when the feeding rack 302 carries the LED semiconductor chip to the area of the light flux detection module 5, the dual-axis linear module 501 will drive the mounting frame 502 to move the light flux detection probe 503 in a precise two-dimensional motion according to the real-time position signal of the feeding rack 302, so as to ensure that the light flux detection probe 503 can accurately align with each LED semiconductor chip on the feeding rack 302. The design of the clearance slope 405 at the top of the upright frame 401 can provide sufficient space for the light flux detection probe 503 to move during the movement process, effectively avoiding structural interference between the light flux detection probe 503 and the upright frame 401, and ensuring the smooth progress of the detection process. When the luminous flux detection probe 503 receives the light emitted by the LED semiconductor chip, it converts the light signal into an electrical signal and transmits it to the control system of the device. The system analyzes and processes the electrical signal to obtain the luminous flux parameters of the LED semiconductor chip. If the luminous flux parameter of a certain LED semiconductor chip is detected to be inconsistent with the preset standard, the marking component on one side of the mounting bracket 502 will be activated immediately to accurately mark the location of the non-conforming chip so that subsequent staff can quickly identify and sort it. Because the two dual-axis linear modules 501 are symmetrically distributed and move horizontally in an alternating manner following the feeding rack 302, when the optical flux detection probe 503 on one of the dual-axis linear modules 501 has completed the detection of some chips on the current feeding rack 302 and needs to be reset, the optical flux detection probe 503 on the other dual-axis linear module 501 can continue to detect the remaining chips on the feeding rack 302. This staggered working mode makes full use of time, significantly improves the overall detection efficiency, and ensures that the equipment can meet the high-speed detection requirements of modern production lines.
[0035] It should be noted that the dual-axis linear module 501 is a commonly used precision transmission module in the prior art, composed of X-axis and Z-axis linear guides. Its drive method adopts a servo motor in conjunction with a ball screw, which has the characteristics of high positioning accuracy, smooth operation, and fast response speed. It can accurately control the movement trajectory of the luminous flux detection probe 503 in the two-dimensional plane, ensuring the accurate detection position of each LED semiconductor chip. The luminous flux detection probe 503 adopts a TES-133 luminous flux meter, which has a high-precision illuminance measurement function. Its structure and principle can be learned by those skilled in the art through the technical manual, and it can also be replaced according to actual needs, which will not be elaborated here.
[0036] In order to mark defective LED semiconductor chips; The marking assembly includes a wax outlet tube 504 fixed to the mounting frame 502. The wax outlet tube 504 is connected to an external wax supply tube. A heating wire is integrated inside the wax outlet tube 504 to melt the wax inside the wax outlet tube 504. A placement hole 310 is provided on the top of the feeding rack 302. The melted wax drips from the wax outlet tube 504 into the placement hole 310. An ejection assembly for ejecting solidified wax is provided in the placement hole 310. An arc-shaped baffle 309 concentric with the placement hole 310 is welded to the top of the feeding rack 302. The inner diameter of the arc-shaped baffle 309 is the same as the diameter of the placement hole 310. When the luminous flux detection module 5 determines that the LED semiconductor chip is defective, the PLC control system will immediately send an instruction to the marking component to start the wax outlet tube 504 and the heating wire in the wax supply tube to heat the solid wax and make it melt into liquid wax quickly. At this time, the external wax supply tube delivers the molten wax to the wax outlet tube 504 under pressure. Under the action of gravity, the wax drips precisely into the placement hole 310 at the top of the feeding rack 302 corresponding to the defective chip position. The arc-shaped baffle 309 around the placement hole 310 can effectively block the wax splashing during the dripping process, preventing the wax from contaminating other areas of the feeding rack 302 or adjacent LED semiconductor chips, ensuring the accuracy of the marking position and the cleanliness of the equipment. When the wax liquid is dripped into the placement hole 310, it will quickly solidify into a solid mark in a short time due to the removal of the heating environment. This mark has high adhesion and can remain stable during subsequent transportation and transfer, and is not easy to fall off or become blurred. When it is necessary to sort out defective chips, staff or automated equipment can identify solid wax and remove the rack 302 that currently contains defective chips. The ejection component inside the placement hole 310 facilitates the subsequent restoration of the feeding rack 302. When the feeding rack 302 has completed all the testing processes and needs to be reused, the solidified wax block inside the placement hole 310 can be ejected by an external drive device or manually triggered, so that the placement hole 310 returns to its initial state, so that defective chips can be marked again. This realizes the recycling of the feeding rack 302 and reduces the consumable cost of the equipment.
[0037] In order to push out the solidified wax block inside the placement hole 310; The ejection assembly includes an L-shaped rod 314 fixed to the bottom of the feeding rack 302 and a support column 311 inserted into the placement hole 310. A limit ring 313 is welded to one side of the support column 311 and the limit ring 313 is sleeved on the outside of the L-shaped rod 314. When it is necessary to eject solidified wax, the bottom end of the support column 311 can be pushed upward by an external pushing device or manually, which will cause the support column 311 to move upward along the placement hole 310. At this time, the top end of the support column 311 will push the solidified wax block out from the placement hole 310. When the external jacking device releases pressure or the support column 311 is released by hand, the support column 311 will be pushed downwards and reset to its initial state under the action of gravity, so that it can be used for marking next time; This ejector assembly has a simple design and is easy to operate. It can quickly and effectively remove solidified wax blocks from the placement hole 310, ensuring the recycling efficiency of the feeding rack 302.
[0038] In order to uniformly feed materials onto multiple feeding racks 302; The storage module 6 includes a storage rack 601 fixed to the top of the base 1, multiple feeding racks 302 placed inside the storage rack 601, and through slots 602 opened on multiple sides of the storage rack 601. A drive motor 605 is fixed to one side of the storage rack 601 by bolts. The output shaft of the drive motor 605 is fixed to a lead screw 604 by a coupling. A lifting plate 603 is slidably connected inside the storage rack 601. The end of the lifting plate 603 that extends beyond the storage rack 601 cooperates with the lead screw 604 to move up and down. When feeding multiple feeding racks 302 at the same time, the staff can neatly stack multiple feeding racks 302 loaded with LED semiconductor chips in the storage rack 601. The through slots 602 on multiple sides of the storage rack 601 make it easy to observe the remaining quantity of the feeding racks 302 inside, so as to replenish them in time. When the equipment starts the feeding program, the drive motor 605 will drive the lead screw 604 to rotate. Since the end of the lifting plate 603 that extends beyond the storage rack 601 is threaded with the lead screw 604, the rotation of the lead screw 604 will drive the lifting plate 603 to slide upward along the inner wall of the storage rack 601. During the upward process, the lifting plate 603 will lift the bottommost discharge rack 302 in the storage rack 601, so that it gradually moves upward until the discharge rack 302 is pushed to a position flush with the conveyor belt 301. At this time, the robotic arm 7 will smoothly transfer the lifted discharge rack 302 onto the conveyor belt 301 to complete the feeding operation of a single discharge rack 302. By repeating this process, all discharge racks 302 can be completely transferred. After the material rack 302 in the storage rack 601 has been transferred, the drive motor 605 drives the lead screw 604 to rotate in the opposite direction, causing the lifting plate 603 to descend and reset, ready to lift and load the next set of material racks 302. Through the cyclic lifting and lowering motion of the lifting plate 603, the automated, continuous and unified loading of multiple material racks 302 is realized, which effectively reduces the workload of manual loading and improves the overall operating efficiency of the equipment. At the same time, the design of the through slot 602 also provides structural clearance for the lifting and lowering of the lifting plate 603, avoiding motion interference between components.
[0039] It should be noted that the drive motor 605 is a servo motor, which has high-precision position control capabilities. It can precisely adjust the rotation angle and speed of the lead screw 604 through the PLC control system (controlling the number of rotations of the drive motor 605 when driving the lead screw 604 to lift the lifting plate 603), thereby achieving smooth and precise lifting and lowering of the lifting plate 603 within the storage rack 601. This ensures that the unloading rack 302 is pushed to a position completely flush with the conveyor belt 301 each time, providing a reliable positional reference for the stable gripping and transfer of the robotic arm 7. Simultaneously, the servo motor has a fast response speed and can adjust the lifting speed in real time according to the actual stacking height of the unloading rack 302 within the storage rack 601, ensuring efficient material loading. Under the premise of efficiency, to avoid the material feeding rack 302 shaking or tipping due to excessive speed, the safety and stability of the feeding process are further improved. In addition, the lifting plate 603, in conjunction with the slotted photoelectric switch, can monitor the highest and lowest positions of the lifting plate 603. When the lifting plate 603 moves to the target height, the slotted photoelectric switch will send a position signal to the PLC control system, and the system will then control the drive motor 605 to stop running, to prevent the lifting plate 603 from shifting the position of the material feeding rack 302 due to overshoot, and to ensure the consistency of the feeding position. In addition, the lead screw 604 and the drive motor 605 are combined to form a ball screw module, which has high transmission efficiency, high motion accuracy and reverse self-locking function, which will not be described in detail here.
[0040] In order to limit the left and right movement of the feeding rack 302 on the conveyor belt 301; The bottom of the feeding rack 302 is integrally formed with an extension protrusion 312. The length of the extension protrusion 312 is the same as the distance between two adjacent conveyor belts 301 and it contacts the side of the conveyor belt 301. When the feeding rack 302 is placed on the conveyor belt 301, the extension protrusion 312 will be embedded in the gap between the two adjacent conveyor belts 301, and its two sides will be in close contact with the side of the conveyor belt 301, forming a lateral limiting constraint, which effectively prevents the feeding rack 302 from shifting left or right due to inertia or vibration during the high-speed operation of the conveyor belt 301. This design of the extended protrusion 312, which is adapted to the structure of the conveyor belt 301, can achieve stable positioning of the feeding rack 302 by means of the layout of the conveyor belt 301 itself without the need for additional complex limiting mechanisms. This simplifies the equipment structure and ensures that the feeding rack 302 maintains the correct posture and position throughout the entire conveying path, providing a reliable positional basis for the precise operation of LED semiconductor chips by subsequent modules.
[0041] The present invention is used in the following steps: S1: The staff can neatly stack multiple feeding racks 302 loaded with LED semiconductor chips in the storage rack 601 until the feeding rack 302 is pushed to be flush with the conveyor belt 301. The robotic arm 7 will drive the uppermost feeding rack 302 to be smoothly transferred onto the conveyor belt 301. The extended protrusion 312 will be embedded in the gap between two adjacent conveyor belts 301, and its two sides will be in close contact with the belt side of the conveyor belt 301 to form a lateral limiting constraint, thus completing the feeding operation of a single feeding rack 302. S2: Simultaneously start the two conveyor belts 301, so that the two conveyor belts 301 run synchronously, thereby driving the feeding rack 302 placed on the two conveyor belts 301 to move and be pressed down by the pressure bar 402. As the feeding rack 302 moves smoothly on the conveyor belt 301. S3: When the feeding rack 302 moves to the corresponding position of the chip power supply module 4, the end of the slide 307 will first contact the inclined surface of the extrusion plate 403. As the feeding rack 302 continues to move, the inclined surface of the extrusion plate 403 will generate a horizontal pushing force on the slide 307, forcing the slide 307 to overcome the tension of the tension spring 316 and slide along the top of the feeding rack 302 towards the LED semiconductor chip, gradually contacting the top of the LED semiconductor chip and applying a clamping force to it, tightly fixing the LED semiconductor chip in the positioning groove 308, ensuring that the pins of the chip and the contact 315 at the bottom of the positioning groove 308 always maintain stable contact. S4: When the feeding rack 302 carries the LED semiconductor chip to the area of the light flux detection module 5, the dual-axis linear module 501 will drive the mounting bracket 502 to move the light flux detection probe 503 in a precise two-dimensional motion according to the real-time position signal of the feeding rack 302, so as to ensure that the light flux detection probe 503 can accurately align with each LED semiconductor chip on the feeding rack 302. S5: If the luminous flux parameter of a certain LED semiconductor chip is detected to be inconsistent with the preset standard, the PLC control system will immediately send an instruction to the marking component to start the heating wire in the wax outlet tube 504 and the wax supply tube to heat the solid wax, so that it quickly melts into liquid wax. The external wax supply tube delivers the melted wax to the wax outlet tube 504 under pressure. The wax drips accurately into the placement hole 310 at the top of the feeding rack 302 corresponding to the position of the defective chip under the action of gravity. When the wax drips into the placement hole 310, it will quickly solidify in a short time to form a solid mark due to being removed from the heating environment. Then it is conveyed by the conveyor belt 301 to the outside of the light shield 2, where the unqualified chip is processed by the staff. S6: Throughout the process, the light shield 2 effectively blocks the interference of external ambient light, ensuring that the light flux detection module 5 works in a stable dark environment. At the same time, it realizes the continuous automated flow of multiple feeding racks 302, eliminating the need for frequent manual replacement of the tested chip or adjustment of the chip position, greatly simplifying the detection process and meeting the needs of modern production lines for efficient detection.
[0042] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0043] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.
Claims
1. An LED semiconductor chip packaging post-optical performance detection equipment, comprising a base (1) and a placing rack (302) for placing an LED semiconductor chip, characterized in that, The top of the base (1) is provided with a storage module (6) for placing a plurality of feeding racks (302), one side of the storage module (6) is provided with a chip conveying module (3) arranged on the base (1), which is used to drive the feeding rack (302) to move and fix the LED semiconductor chip during movement, the other side of the chip conveying module (3) is provided with a mechanical arm (7) arranged on the base (1) for transferring the feeding rack (302), both sides of the middle region of the chip conveying module (3) are provided with a light flux detection module (5) arranged on the base (1), which is used for light flux detection and marking of the LED semiconductor chip on the feeding rack (302), both sides of the chip conveying module (3) are provided with a chip power supply module (4) arranged on the base (1), which is used for power supply during LED semiconductor chip detection, the top of the base (1) is provided with a light shield (2), the chip power supply module (4) and the light flux detection module (5) are located in the light shield (2), and both ends of the chip conveying module (3) pass through the light shield (2).
2. The LED semiconductor chip package post-optical performance detection equipment according to claim 1, characterized in that, The chip conveying module (3) comprises two conveying belts (301) arranged on the top of the base (1), there is a gap between the conveying belts (301), and both ends of the feeding rack (302) are located above the conveying belts (301), the top of the feeding rack (302) is provided with a positioning groove (308), the pin of the LED semiconductor chip is located in the positioning groove (308), and the top of the feeding rack (302) is slidably connected with two symmetrically distributed sliding racks (307), a tension spring (316) for pulling the sliding rack (307) away from the LED semiconductor chip is arranged between the sliding rack (307) and the feeding rack (302), and the sliding rack (307) cooperates with the chip power supply module (4) to fix the LED semiconductor chip.
3. The LED semiconductor chip package post-optical performance detection device according to claim 2, characterized in that, The chip power supply module (4) comprises two vertical plate frames (401) fixed on the top of the base (1), the opposite sides of the two vertical plate frames (401) are provided with conductive strips (404) in communication with external circuits, there is a potential difference between the two conductive strips (404), both sides of the feeding rack (302) are provided with recesses (303) for avoiding the conductive strips (404), a side inner wall of the recess (303) is provided with an avoidance groove (317), a side inner wall of the avoidance groove (317) is provided with a conductive plate (319) for conduction, one end of the conductive plate (319) is provided with a carbon brush (320), a bottom of the positioning groove (308) of the feeding rack (302) is provided with a contact (315) connected with the conductive plate (319), and an arc-shaped elastic plate (318) is fixed on the side inner wall of the avoidance groove (317) through bolts, and one end of the arc-shaped elastic plate (318) is in contact with the conductive plate (319).
4. The LED semiconductor chip package post-optical performance detection device according to claim 3, characterized in that, The top end of the both sides of the feeding rack (302) is a downward inclined surface (304), the downward inclined surface (304) is provided with a plurality of mounting grooves (306), the mounting grooves (306) are provided with rolling balls (305), the opposite sides of the two vertical plate racks (401) are welded with inclined pressing strips (402), and the inclination angles of the pressing strips (402) are the same as the inclination angle of the downward inclined surface (304).
5. The LED semiconductor chip package post-optical performance detection device according to claim 4, characterized in that, The opposite sides of the two vertical plate racks (401) are welded with extrusion plates (403), one end of the extrusion plate (403) is an inclined surface, and the extrusion plate (403) is used for extruding the movement of the sliding frame (307) on the feeding rack (302).
6. The LED semiconductor chip package post-optical performance detection device according to claim 3, wherein, The light flux detection module (5) comprises two double-shaft linear modules (501), the movable end of the double-shaft linear module (501) is fixed with a mounting frame (502) through bolts, the top inner wall of the mounting frame (502) is fixed with a light flux detection probe (503) through bolts, the top end of the opposite sides of the two vertical plate racks (401) is an avoiding inclined surface (405), and one side of the mounting frame (502) is provided with a marking assembly for marking the poor LED semiconductor chip.
7. The LED semiconductor chip package post-optical performance detection device according to claim 6, characterized in that, The marking assembly comprises a wax outlet pipe (504) fixed to the mounting frame (502), the top of the feeding rack (302) is provided with a placing hole (310), the melted wax liquid drops from the wax outlet pipe (504) into the placing hole (310), the placing hole (310) is provided with an ejection assembly for ejecting the solidified wax, the top of the feeding rack (302) is welded with an arc-shaped baffle (309) concentric with the placing hole (310), and the inner diameter of the arc-shaped baffle (309) is the same as the diameter of the placing hole (310).
8. The LED semiconductor chip package post-optical performance detection device according to claim 7, characterized in that, The ejection assembly comprises an L-shaped rod (314) fixed to the bottom of the feeding rack (302) and a support column (311) inserted into the placing hole (310), one side of the support column (311) is welded with a limiting ring (313), and the limiting ring (313) is sleeved outside the L-shaped rod (314).
9. The LED semiconductor chip package post-optical performance detection device according to claim 1, wherein, The storage module (6) comprises a storage rack (601) fixed to the top of the base (1), a plurality of feeding racks (302) are placed in the storage rack (601), a plurality of sides of the storage rack (601) are provided with through grooves (602), one side of the storage rack (601) is fixed with a driving motor (605) through bolts, the output shaft of the driving motor (605) is fixed with a lead screw (604) through a shaft coupling, and the inner side of the storage rack (601) is slidably connected with a lifting plate (603).
10. The LED semiconductor chip package post-optical performance detection device according to claim 2, wherein, The bottom of the feeding rack (302) is integrally formed with an extension protrusion (312), and the length of the extension protrusion (312) is the same as the distance between two adjacent conveying belts (301).