Chip test equipment and assembly thereof

Abstract

The invention discloses chip testing equipment and an assembly thereof, and relates to the technical field of chip testing. The testing assembly comprises a shaft sleeve and a shaft rod. The shaft sleeve and the shaft rod are in sliding connection in the first direction. The heat conduction pressure head is arranged on the shaft rod; and the elastic piece is arranged between the shaft sleeve and the shaft rod. Through the arrangement of the shaft sleeve, the shaft rod and the elastic piece, a buffer structure in which the heat conduction pressure head can elastically stretch out and draw back in the first direction (namely the thickness direction of the chip) is constructed. When the driving assembly drives the testing assembly to approach the chip and the heat conduction pressure head and the chip are converted from contact to contact, if the chip generates a reverse acting force (namely, contact pressure in the background technology) due to buckling deformation or thermal expansion, the reverse acting force can push the shaft rod to slide along the first direction relative to the shaft sleeve; and the elastic piece is compressed to store the elastic force.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, specifically to a chip testing device and its components. Background Technology

[0002] To ensure the temperature stability of the chip during aging tests, such as Figure 1 As shown, existing technologies use thermally conductive pressure heads to keep the chip temperature relatively constant during testing (see detailed implementation steps). However, in aging tests of large-size Artificial Intelligence (AI) chips using Chip-on-Wafer-on-Substrate (CoWoS) or 2.5D packaging technologies, the significant differences in the coefficients of thermal expansion of different materials within the large-size AI chip (e.g., silicon wafer, substrate, and heat sink) make the AI ​​chip extremely prone to significant warping deformation, specifically manifested as upturned corners or a central arch. Furthermore, during aging tests, the AI ​​chip also experiences warping along the thickness direction (i.e., as shown in the detailed implementation steps). Figure 1 Thermal expansion in the direction G shown. Existing thermal pressure heads are usually rigidly attached to the chip. If the AI ​​chip warps violently or expands violently along the thickness direction during the aging test, the local contact pressure between the thermal pressure head and the AI ​​chip will increase dramatically in an instant, which can easily crush the fragile bare chip in the AI ​​chip or damage the test equipment. Summary of the Invention

[0003] The purpose of this application is to provide a chip testing device and its components to solve the technical problem that the local contact pressure between the thermal pressure head and the chip can easily increase dramatically during chip aging tests.

[0004] To achieve the above objectives, this application provides the following technical solution:

[0005] In a first aspect, this application proposes a technical solution for a chip testing component, which is applied to a chip testing equipment. The chip testing equipment includes a driving component, which is at least used to drive the testing component to reciprocate along a first direction, the first direction being parallel to the thickness direction of the chip during chip testing. The testing component includes:

[0006] A bushing and a shaft; a sliding connection is formed between the bushing and the shaft along a first direction;

[0007] A heat-conducting pressure head is disposed on the shaft;

[0008] An elastic member is arranged between the shaft sleeve and the shaft rod; in use, the driving assembly drives the testing assembly to move towards the chip in the first direction, so that the elastic force stored in the elastic member gradually increases in the process of changing from contact to abutment between the heat-conducting pressure head and the chip; the elastic force has a tendency to make the heat-conducting pressure head move away from the shaft sleeve in the first direction.

[0009] As a specific solution in the technical scheme of the present application, the heat-conducting pressure head is fixedly connected with the shaft rod; or, the testing assembly further comprises a universal joint; the heat-conducting pressure head and the shaft rod are connected through the universal joint.

[0010] As a specific solution in the technical scheme of the present application, the testing assembly further comprises a measuring structure, which is used to measure at least the amplitude of the thermal deformation of the chip.

[0011] As a specific solution in the technical scheme of the present application, the measuring structure comprises a distance sensor, which is arranged on the shaft sleeve or the shaft rod; or, the measuring structure comprises a gyroscope sensor, which is arranged on the heat-conducting pressure head.

[0012] As a specific solution in the technical scheme of the present application, the measuring structure comprises:

[0013] A laser emitter and a laser receiver; in use, the laser emitter is used to emit laser, and the laser receiver is used to receive laser;

[0014] A mirror, which is used to reflect the laser emitted by the laser emitter to the laser receiver.

[0015] As a specific solution in the technical scheme of the present application, the laser receiver is an electronic receiver; or, the laser receiver is an observation scale disc.

[0016] As a specific solution in the technical scheme of the present application, the observation scale disc comprises a safe area and a dangerous area, and a calibration point is arranged at the center of the safe area.

[0017] As a specific solution in the technical scheme of the present application, the heat-conducting pressure head is further provided with a flexible heat-conducting layer, which is arranged between the heat-conducting pressure head and the chip in use.

[0018] As a specific solution in the technical scheme of the present application, the heat-conducting pressure head is internally provided with a cooling cavity, and the heat-conducting pressure head further comprises a liquid inlet pipe and a liquid outlet pipe; the liquid inlet pipe and the liquid outlet pipe are both in communication with the cooling cavity.

[0019] As a specific solution in the technical scheme of the present application, the height of the liquid inlet pipe in the direction of gravity is lower than that of the liquid outlet pipe.

[0020] As a specific solution in the technical scheme of the present application, the cooling cavity is internally provided with a plurality of partition plates; the partition plates are used to increase the contact area of the fluid in the cooling cavity with the heat-conducting pressure head and / or to prolong the flow path of the fluid in the cooling cavity.

[0021] As a specific solution in the technical scheme of the present application, the first surface of the heat-conducting pressure head is further provided with an annular groove, the first surface being the surface of the heat-conducting pressure head facing the chip during use; the heat-conducting pressure head further comprises an air inlet pipe, which is in communication with the annular groove.

[0022] In a second aspect, the present application provides a technical scheme of a chip testing device, which comprises the chip testing assembly according to any one of the first aspect.

[0023] Compared with the prior art, the present application has the following beneficial effects:

[0024] The present application sets up a buffer structure through the arrangement of the shaft sleeve, the shaft rod and the elastic member, so that the heat-conducting pressure head can elastically stretch and contract in the first direction (i.e. the thickness direction of the chip). When the driving assembly drives the testing assembly to approach the chip, and the heat-conducting pressure head is in contact with the chip, if the chip generates a reverse force (i.e. the contact pressure in the background art) due to warping deformation or thermal expansion, the reverse force can push the shaft rod to slide relative to the shaft sleeve in the first direction, so as to compress the elastic member to store elastic force. The elastic force generated by the elastic member can buffer the instantaneous increase of the reverse force, not only avoiding the sharp increase of the contact pressure between the heat-conducting pressure head and the chip in the first direction, but also providing a buffer deformation space for the expansion deformation of the chip. That is to say, the present application can not only guarantee the continuity of the heat conduction path between the heat-conducting pressure head and the chip, but also prevent the problems such as the crushing of the bare chip or the damage of the testing device caused by the excessive contact pressure between the heat-conducting pressure head and the chip, so as to improve the safety and stability of the chip which is easy to warp or easy to expand during testing. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 A structural schematic view of the contact between the heat-conducting pressure head and the chip in the prior art;

[0026] Figure 2 A three-dimensional schematic view of a chip testing assembly according to an embodiment of the present application;

[0027] Figure 3 A sectional view schematic view of a chip testing assembly according to an embodiment of the present application;

[0028] Figure 4A cross-sectional view of a heat conduction pressure head according to an embodiment of the present application;

[0029] Figure 5 A cross-sectional view of a heat conduction pressure head according to another embodiment of the present application;

[0030] Figure 6 A schematic diagram of a measurement structure according to an embodiment of the present application;

[0031] Figure 7 A schematic diagram of a scale observation structure according to an embodiment of the present application;

[0032] Figure 8 A schematic diagram of a scale observation structure according to another embodiment of the present application;

[0033] Figure 9 A cross-sectional view of a heat conduction pressure head according to yet another embodiment of the present application.

[0034] In the figure: 1, heat conduction pressure head; 11, cooling cavity; 12, liquid inlet pipe; 13, liquid outlet pipe; 14, partition plate; 15, air inlet pipe; 16, annular groove; 2, shaft sleeve; 3, shaft rod; 4, elastic member; 51, mirror; 52, laser emitter; 53, laser receiver; 54, distance sensor; 531, danger zone; 532, safe zone; 6, universal joint; 7, flexible heat conduction layer; 8, chip. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0036] It should be noted that in the description of the present application, the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0037] In addition, it should be understood that, for the convenience of description, the sizes of the various components shown in the drawings are not drawn in accordance with the actual proportional relationship, for example, the thickness or width of certain layers can be exaggerated relative to other layers.

[0038] It should be noted that like reference numerals and characters refer to like items throughout the drawings, and once an item is defined or described in one drawing, further discussion and description of that item in the description of subsequent drawings can not be necessary.

[0039] It should be noted that the prior art cools the chip 8 by the heat conduction head 1 to make the temperature of the chip 8 tend to be constant, and the steps are as follows: first, the heat conduction head 1 is controlled by the chip testing device to approach the chip 8 along the first direction (i.e. the thickness direction of the chip 8 (generally also the direction of gravity), direction G in FIG. Figure 1 ), until the heat conduction head 1 is in close contact with the chip 8; then, the heat conduction head 1 and the chip 8 in close contact can form a heat conduction path, the heat of the chip 8 can be transferred to the heat conduction head 1, further, the heat conduction head 1 transfers the heat to the heat dissipation module (not shown in the figure, the heat dissipation module is a mature technology, for example: the chip cooler in the computer, etc.) connected thereto, and finally the heat dissipation module dissipates the heat to the external environment to realize the constant temperature of the chip 8.

[0040] In order to solve the technical problem that the local contact pressure between the heat conduction head and the chip easily increases dramatically in the testing of the chip, the present application provides a chip testing assembly, which is applied to a chip testing device, and the chip testing device comprises a driving assembly, which is used at least to drive the testing assembly to reciprocate along a first direction, and the first direction is parallel to the thickness direction of the chip 8 during the testing of the chip 8 (i.e. the direction G in FIG. Figure 1 and Figure 4 ).

[0041] In the embodiment, the driving assembly is not limited, as long as the driving assembly can drive the testing assembly to reciprocate along the first direction, for example, the driving assembly can be an electric push rod or a hydraulic push rod, etc.

[0042] In the embodiment, the testing assembly comprises the heat conduction head 1, the shaft sleeve 2, the shaft rod 3 and the elastic member 4. The shaft sleeve 2 and the shaft rod 3 are connected in sliding along the first direction. As shown in FIG. Figure 2 , the heat conduction head 1 is arranged at one end of the shaft rod 3, and the elastic member 4 is arranged between the shaft sleeve 2 and the shaft rod 3. In use, if the driving assembly drives the testing assembly to approach the chip 8 along the first direction, so that the heat conduction head 1 and the chip 8 change from contact to abutment, the elastic force stored by the elastic member 4 gradually increases (i.e. the overall height H of the shaft sleeve 2 and the shaft rod 3 gradually decreases as shown in FIG. Figure 3 ). The elastic force has a tendency to make the heat conduction head 1 move away from the shaft sleeve 2 along the first direction.

[0043] The buffer structure that the heat conduction pressure head 1 can elastically stretch in the first direction (i.e. the thickness direction of the chip 8) is constructed by the setting of the shaft sleeve 2, the shaft rod 3 and the elastic member 4. When the driving assembly drives the test assembly to approach the chip 8, and the heat conduction pressure head 1 changes from contact to resistance with the chip 8, if the chip 8 generates a reverse force (i.e. the contact pressure in the background art) due to the warping deformation or thermal expansion, the reverse force can push the shaft rod 3 to slide relative to the shaft sleeve 2 in the first direction, and then compress the elastic member 4 to store elastic force. The elastic force generated by the elastic member 4 can buffer the instant increase of the reverse force, not only can avoid the contact pressure between the heat conduction pressure head 1 and the chip 8 in the first direction to rise sharply, but also can provide a buffer deformation space for the expansion deformation of the chip. That is to say, the embodiment can not only guarantee the continuity of the heat conduction path between the heat conduction pressure head 1 and the chip 8, but also can prevent the problems such as the bare chip being crushed or the test equipment being damaged due to the excessive contact pressure between the heat conduction pressure head 1 and the chip 8, and can improve the safety and stability of the chip which is easy to warp or easy to expand in the test.

[0044] In the embodiment of the present application, the test of the chip refers to any test that needs to adjust the chip 8 to make the temperature of the chip 8 tend to be constant. That is to say, in the embodiment, the test of the chip is not limited to the aging test of the chip, but also can be the high temperature performance verification test of the chip, the long-term stability test of the chip, the thermal cycle reliability test of the chip, the power load durability test of the chip, etc. In these test scenarios, the chip 8 will generate heat due to power consumption during operation, resulting in temperature rise, which needs to reduce the temperature fluctuation of the chip 8 through the heat conduction pressure head 1 cooperating with the related cooling structure (for example, the structure formed by the cooling cavity 11, the liquid inlet pipe 12 and the liquid outlet pipe 13 in the following) to ensure the accuracy of the test results, and at the same time to avoid the chip 8 from being damaged due to excessive temperature or thermal stress concentration. The test assembly proposed in the present application can adapt to the warping and thermal expansion problems that may occur in the chip 8 in the above-mentioned various test scenarios through the buffer cooperation of the elastic member 4, the shaft sleeve 2 and the shaft rod 3, and can guarantee the safety and stability of the test process.

[0045] In the embodiment, the shape and structure of the shaft sleeve 2 and the shaft rod 3 are not limited, as long as the shaft rod 3 and the shaft sleeve 2 can stretch in the first direction. For example, the shaft sleeve 2 can be a circular sleeve, and the shaft rod 3 can be a cylindrical rod; or in order to avoid the relative rotation of the shaft sleeve 2 and the shaft rod 3 around the axis of the shaft sleeve 2, the shaft sleeve 2 can be a square sleeve, and the shaft rod 3 can be a square rod.

[0046] In the embodiment, the shape and structure of the elastic member 4 are not limited, as long as the elastic member 4 can generate an elastic force that makes the heat conduction pressure head 1 tend to move away from the shaft sleeve 2 in the first direction. For example, the elastic member 4 can be a metal elastic sheet or a spring, etc. Figure 2and Figure 3 The spring shown is an example.

[0047] In this embodiment, the placement of the elastic element 4 is not limited, as long as the elastic element 4 can generate an elastic force that causes the heat-conducting pressure head 1 to move away from the bushing 2 along the first direction. For example, if the elastic element 4 is a spring, it can be as follows: Figure 2 As shown, the elastic element 4 is sleeved on the outside of the shaft 3. In use, one end of the elastic element 4 abuts against the bushing 2, and the other end abuts against the heat-conducting pressure head 1; or, it can be as follows: Figure 3 As shown, the elastic element 4 is located inside the bushing 2. When in use, one end of the elastic element 4 abuts against the bushing 2, and the other end abuts against the shaft 3.

[0048] In this embodiment, there are no restrictions on the connection method between the heat-conducting pressure head 1 and the shaft 3. For example, the heat-conducting pressure head 1 and the shaft 3 can be an integrally formed structure; or, the heat-conducting pressure head 1 and the shaft 3 can be welded or screwed together.

[0049] It is important to note that during testing, large-size AI chips may experience warping or thermal expansion in multiple directions. If the thermally conductive pressure head 1 and the shaft 3 are fixedly connected, it can only buffer the contact pressure between the thermally conductive pressure head 1 and the chip 8 along the first direction (i.e., the thickness direction of the chip 8), and is insufficient to address the problem of a surge in local contact pressure caused by deformation of the chip 8 in other directions. To buffer the surge in local contact pressure of the chip 8 in other directions, in one embodiment of this application, the testing assembly also includes a universal joint 6. Figure 3 As shown, the heat-conducting pressure head 1 and the shaft 3 are connected by a universal joint 6.

[0050] In this embodiment, the universal joint 6 enables the heat-conducting pressure head 1 to achieve multi-directional angle adjustment relative to the shaft 3. If the chip 8 experiences warping deformation in a direction other than thickness (e.g., corner warping or local tilting), the heat-conducting pressure head 1 can adaptively adjust the fitting deformation angle through the universal joint 6 to avoid concentrated local contact pressure. Combined with the buffering effect of the elastic element 4, a dual protection structure of multi-directional angle adaptation and elastic buffering along the first direction can be formed.

[0051] In this embodiment, the type of universal joint 6 is not limited. For example, universal joint 6 can be a cross-type universal joint, a ball-cage type universal joint, or other types of universal joints. Figure 3 As shown, the universal joint 6 can achieve multi-angle rotation of the heat-conducting pressure head 1 relative to the shaft 3 without affecting the thermal conductivity and stability of the overall structure.

[0052] It should be noted that, in order to ensure the heat dissipation of chip 8, such as Figure 4As shown, the general heat-conducting press head 1 needs to completely cover the surface of the chip 8. If the heat-conducting press head 1 completely covers the surface of the chip 8, the operator cannot directly observe whether the chip 8 below the heat-conducting press head 1 is abnormally deformed (for example, abnormal deformation caused by poor cooling effect or abnormal deformation caused by unqualified chip 8 itself, etc.) during the test process. If the chip 8 is abnormally deformed, the test fails, or the chip 8 is damaged and scrapped, which greatly increases the test cost. In order to monitor the thermal expansion state and deformation of the chip 8 in real time during the test process, timely discover abnormalities and take intervention measures, and avoid loss expansion, in an embodiment of the present application, the chip test assembly further comprises a measurement structure, which is used to measure at least the magnitude of the thermal deformation of the chip 8.

[0053] In the embodiment, the measurement structure can be any part or combination of parts that can measure the magnitude of the thermal deformation of the chip 8. For example, the measurement structure can include a gyroscope sensor, which can be arranged on the heat-conducting press head 1 (not shown in the figure). The gyroscope sensor is a sensor for measuring the angular velocity (rotation speed and direction) of an object (i.e. the heat-conducting press head 1), and its core function is to detect the rotational motion (for example, yaw, pitch or roll, etc.) of the object and convert the rotational information into an electrical signal output, thereby determining the attitude change of the object. That is, in the embodiment, the attitude change of the heat-conducting press head 1 can be monitored in real time by the gyroscope sensor to determine the magnitude of the thermal deformation of the chip 8. Alternatively, the measurement structure can include a distance sensor 54, as shown in the figure. Figure 3 As shown, the distance sensor 54 can be arranged on the shaft sleeve 2, and the distance sensor 54 is used to measure the distance between itself and the heat-conducting press head 1. In use, if the distance between the distance sensor 54 and the heat-conducting press head 1 decreases, it indicates that the magnitude of the thermal deformation of the chip 8 increases; if the distance between the distance sensor 54 and the heat-conducting press head 1 increases, it indicates that the magnitude of the thermal deformation of the chip 8 decreases.

[0054] It should be noted that in the embodiments of the present application, the arrangement position of some parts (for example, the distance sensor 54 mentioned above, the laser emitter 52 and the laser receiver 53 mentioned below, etc.) is not limited, as long as the arrangement position does not hinder the realization of the basic function. For example, in the embodiment, the distance sensor 54 can also be arranged on the heat-conducting press head 1 or the shaft rod 3. If the distance sensor 54 is arranged on the heat-conducting press head 1 or the shaft rod 3, the distance sensor 54 can be used to measure the distance between itself and the shaft sleeve 2 to represent the magnitude of the thermal deformation of the chip 8.

[0055] It should be noted that since the magnitude of the deformation of the chip 8 when heated can be relatively small, it is difficult to achieve high-precision capture of the magnitude of the deformation of the chip 8 by means of components such as sensors (for example, the gyro sensor or the distance sensor 54 mentioned above, etc.), and it is easy to misjudge the deformation state of the chip 8 due to measurement errors. Moreover, when a sensor or the like is used as the measurement structure, signal transmission lines and power supply lines need to be additionally configured, which not only can interfere with the overall layout of the test components, but also the sensor itself has a high procurement and maintenance cost, which is not conducive to the large-scale application and cost control of the test equipment. In order to solve the above problems, in an embodiment of the present application, the measurement structure can include a mirror 51, a laser emitter 52, and a laser receiver 53. As shown in Figure 6 , the laser emitter 52 is used to emit laser light, and the laser receiver 53 is used to receive laser light. The mirror 51 is used to reflect the laser light emitted by the laser emitter 52 to the laser receiver 53.

[0056] In the present embodiment, Figure 6 the solid line in the middle represents the posture of the thermal compression head 1 when the chip 8 has not been deformed (hereinafter referred to as the first posture); Figure 6 the dotted line in the middle represents the posture of the thermal compression head 1 when the chip 8 has been deformed (hereinafter referred to as the second posture). As shown in Figure 6 , when the thermal compression head 1 is in the first posture, the laser path generated by the laser emitter 52 is shown by the red solid line in Figure 6 , and after reflection by the mirror 51, the final landing point in the laser receiver 53 is the D1 point; when the thermal compression head 1 is in the second posture, the laser path generated by the laser emitter 52 is shown by the blue dotted line in Figure 6 , and after reflection by the mirror 51, the final landing point in the laser receiver 53 is the D2 point. As can be seen from Figure 6 , in the present embodiment, even if the posture of the thermal compression head 1 changes slightly, the landing point of the laser in the laser receiver 53 will change greatly,

[0057] The embodiment converts the slight deformation of the chip 8 into obvious displacement of the laser landing point by using the high directivity and high precision characteristics of the laser, and realizes high-precision capture of the deformation amplitude of the chip 8. When the chip 8 is warped or thermally expanded, the posture of the heat conduction pressure head 1 will change (for example, axial movement in the first direction, or angular inclination, etc.), and the position of the reflector 51 fixed to the heat conduction pressure head 1 will change synchronously, causing the laser emitted by the laser emitter 52 to be reflected by the reflector 51 and the landing point on the laser receiver 53 to be significantly offset. Compared with the traditional sensor, this structure does not require complex signal transmission and power supply lines, simplifies the overall layout of the test assembly, reduces the procurement and maintenance costs, and can effectively avoid misjudgment caused by measurement errors by amplifying the observation effect of slight deformation, providing reliable protection for timely detection of abnormal deformation of the chip 8 during the test process and taking intervention measures, improving the safety and accuracy of chip testing, and facilitating the large-scale application of test equipment.

[0058] In the embodiment, the laser emitter 52 is not limited as long as it can emit laser. For example, the laser emitter 52 can be a semiconductor laser emitter, a solid-state laser emitter, or a gas laser emitter, etc., and the installation position can be adapted to the overall layout of the test assembly, as long as the laser emitted by the laser emitter 52 can be accurately projected onto the reflector 51, without additional limitation on the power and wavelength of the laser emitter 52, as long as the detection accuracy of the slight deformation of the chip 8 in the test scene is met.

[0059] In the embodiment, the laser receiver 53 is not limited as long as it can feed back to the operator whether the deformation of the chip 8 is abnormal (i.e., whether the deformation amplitude of the chip 8 exceeds the normal deformation range). For example, the laser receiver 53 can be an electronic receiver, which converts the laser landing point position into an electrical signal through a built-in signal processing module (for example, a high-precision ADC analog-to-digital conversion chip and an FPGA field programmable logic gate array, etc.), and transmits (for example, through RS485 bus, Ethernet interface or wireless Bluetooth communication module) to the control system of the test equipment in real time. When the landing point offset exceeds the preset threshold, the system automatically sends an alarm signal; or the laser receiver 53 can be an observation scale disc, which is clearly divided into a dangerous area 531 and a safe area 532, and the center of the safe area 532 is provided with a calibration point (for example, a red dot). When the landing point is in the safe area 532, the operator can continue to test the chip 8; when the landing point is in the dangerous area 531, the operator needs to stop testing the chip 8 immediately. Figure 7 and Figure 8As shown in point D3, before testing, the laser landing point is calibrated to this calibration point. During the test, the operator can quickly determine whether the deformation of chip 8 is within the allowable range by directly observing whether the laser landing point is within the safe area 532. If the landing point enters the danger area 531, it indicates that the deformation of chip 8 is abnormal and the test needs to be stopped in time for processing.

[0060] In the embodiments of this application, there are no restrictions on the shape and structure of the observation dial, as long as it can assist in displaying the position of the laser's landing point during use. For example, the observation dial can be as follows: Figure 7 The diagram shows a long strip shape, with the safe zone 532 in the middle and the danger zones 531 at both ends; alternatively, the observation dial can be as follows: Figure 8 The diagram is disc-shaped, with the inner circle being the safe zone 532 and the outer circle being the danger zone 531.

[0061] It should be noted that any reasonable method can be used to calibrate the laser landing point to the calibration point before testing (e.g., ...). Figure 7 and Figure 8 (Point D3 shown), for example: in one embodiment of this application, the observation dial is movable, and when the heat-conducting pressure head 1 is in the first posture by moving the observation dial, the laser landing point coincides with the calibration point in the observation dial; similarly, in another embodiment of this application, the laser emitter 52 is movable, and when the heat-conducting pressure head 1 is in the first posture by moving the laser emitter 52, the laser landing point coincides with the calibration point in the observation dial.

[0062] In this embodiment, the shape and structure of the heat-conducting pressure head 1 are not limited. For example, the heat-conducting pressure head 1 can be cylindrical, prismatic, or similar. Figure 2 The frustum shape shown or as Figure 9 The right-angled trapezoidal frustum shape shown is an example.

[0063] It should be noted that if the heat-conducting pressure head 1 is cylindrical or prismatic, the mirror 51 disposed on the heat-conducting pressure head 1 generally has its surface parallel to the first direction. If the mirror surface of the mirror 51 is parallel to the first direction, and the thermal deformation direction of the chip 8 is in the first direction, the path offset of the laser after reflection by the mirror will be extremely weak (that is, the laser landing point formed by the laser receiver 53 basically coincides). In other words, if the mirror surface of the mirror 51 is parallel to the first direction, it is difficult for the laser receiver 53 to capture the small thermal expansion change of the chip 8 along the first direction, resulting in the inability to accurately determine the thermal deformation amplitude of the chip 8 along the first direction. To solve this problem, in one embodiment of this application, the heat-conducting pressure head 1 has an inclined surface, which is used to set the mirror 51 so that the plane on which the mirror surface of the mirror 51 is located intersects the straight line parallel to the first direction at one and only one point.

[0064] In the embodiments of this application, if chip 8 undergoes thermal expansion along the first direction, the chip 8 will cause the thermally conductive pressure head 1 to move along the first direction. At this time, the position of the reflector 51 will move synchronously along the first direction along with the thermally conductive pressure head 1. This embodiment, through the design of tilting the reflector 51 (that is, the plane on which the reflector 51 is located has one and only one intersection with the straight line parallel to the first direction), if the reflector 51 moves along the first direction, the laser emitted by the laser emitter 52 will be reflected by the reflector 51, and the landing point on the laser receiver 53 will have a significant displacement. Even if the thermal expansion amplitude of chip 8 along the first direction is small, it can be clearly presented by the displacement of the laser landing point. This can solve the problem that it is difficult to capture the small thermal expansion changes of chip 8 along the first direction when the reflector 51 is parallel to the first direction. It can realize comprehensive and high-precision monitoring of the deformation amplitude of chip 8 in multiple directions (including thermal expansion in the thickness direction and warping in the non-thickness direction), improve the accuracy and reliability of deformation detection during chip testing, and provide more comprehensive protection for timely detection of abnormal deformation of chip 8.

[0065] It is important to note that the contact and adhesion between the thermally conductive pressure head 1 and the chip 8 directly affects the smoothness of the heat conduction path, thus determining the temperature control accuracy of the chip 8. During testing, even with adaptive angle adjustment of the thermally conductive pressure head 1 achieved through the universal joint 6, minor unevenness or warping may still exist on the surface of the chip 8 or the surface of the thermally conductive pressure head 1. These minor unevenness or warping can still lead to small gaps between the thermally conductive pressure head 1 and the chip 8. These small gaps increase contact thermal resistance, hinder heat transfer, and reduce heat dissipation efficiency. Furthermore, when the rigid thermally conductive pressure head 1 is in direct contact with the chip 8, if the chip 8 undergoes sudden deformation or is subjected to external force disturbance, localized pressure concentration may cause scratches or mechanical damage to the surface of the chip 8. This risk is particularly pronounced in the fragile bare chip areas of large-size AI chips. To address this issue and prevent damage to the chip 8 from rigid contact while ensuring efficient heat conduction, in one embodiment of this application, such as... Figure 4 As shown, the thermally conductive pressure head 1 is also provided with a flexible thermally conductive layer 7. In use, the flexible thermally conductive layer 7 is located between the thermally conductive pressure head 1 and the chip 8.

[0066] In this embodiment, the material of the flexible thermal conductive layer 7 is not limited, as long as it has good thermal conductivity and flexibility. For example, the flexible thermal conductive layer 7 can be thermal grease or a flexible thermal pad. The thermal grease has extremely low thermal resistance and excellent filling properties, which can quickly fill the tiny gap between the thermal pressure head 1 and the chip 8, eliminate the thermal resistance caused by the contact air layer, achieve efficient heat conduction, and ensure the temperature stability of the chip 8. The flexible thermal pad has good mechanical strength and thickness stability, can maintain structural integrity during long-term testing, adapt to thermal expansion and contraction under different temperature environments, and always maintain a stable contact state.

[0067] In this embodiment, the flexible thermal conductive layer 7 serves two purposes. First, its flexibility allows it to closely adhere to the contact surface between the thermal conductive head 1 and the chip 8, automatically filling the gaps caused by the slight warping or surface unevenness of the chip 8. This reduces contact thermal resistance, ensures smooth heat conduction, and guarantees that the heat generated by the chip 8 can be efficiently transferred to the thermal conductive head 1, improving temperature control accuracy. Second, the flexible thermal conductive layer 7 can buffer the rigid contact between the thermal conductive head 1 and the chip 8. When the chip 8 undergoes sudden deformation or is disturbed by external forces, it can disperse local pressure, preventing the thermal conductive head 1 from directly scratching or damaging the surface of the chip 8. This is especially effective in protecting the fragile bare chip area in large-size AI chips, further enhancing the safety and stability of the chip testing process.

[0068] It is important to note that precise temperature control of chip 8 is crucial for ensuring test accuracy and safety during the thermal aging test. Especially for large-size AI chips and other devices that generate significant heat during testing, passive heat conduction solely by the thermally conductive head 1 is often insufficient to quickly dissipate heat, potentially leading to excessively high chip 8 temperatures or large temperature fluctuations, affecting the reliability of test results and even causing thermal damage to chip 8. To achieve precise temperature control of chip 8 and improve its heat dissipation efficiency and temperature stability, in one embodiment of this application, a cooling chamber 11 is provided inside the thermally conductive head 1. The thermally conductive head 1 also includes an inlet pipe 12 and an outlet pipe 13, both of which are connected to the cooling chamber 11.

[0069] In use, cooling fluid (e.g., cooling oil or water) can be continuously introduced into the cooling chamber 11 through the inlet pipe 12. The cooling fluid makes full contact with the thermally conductive pressure head 1 within the cooling chamber 11, efficiently absorbing the heat conducted from the chip 8 by the thermally conductive pressure head 1. Subsequently, the cooling fluid, having absorbed the heat, is discharged through the outlet pipe 13, completing the rapid transfer of heat. This active cooling method can significantly improve the heat dissipation capacity of the thermally conductive pressure head 1, preventing heat accumulation between the thermally conductive pressure head 1 and the chip 8, thereby achieving precise temperature control of the chip 8. This ensures that the chip 8 remains within the set constant temperature range during testing, providing strong assurance for the accuracy of test results, and further reducing the risk of chip 8 being damaged due to excessive temperature.

[0070] To further optimize the cooling effect and ensure that the cooling fluid fully absorbs the heat conducted by the heat-conducting pressure head 1 within the cooling chamber 11 before being discharged, such as... Figure 4 As shown, Figure 4 The direction of gravity in the middle is parallel to the first direction (that is, as shown in the image). Figure 4As shown in direction G), in one embodiment of this application, the height of the inlet pipe 12 of the heat-conducting pressure head 1 along the direction of gravity can be lower than that of the outlet pipe 13. If the height of the inlet pipe 12 along the direction of gravity is lower than that of the outlet pipe 13, the cooling fluid can form a stable and sufficient flow state in the cooling chamber 11 under the combined action of gravity and flow pressure difference, avoiding the cooling fluid from flowing out quickly without fully contacting the internal area of ​​the heat-conducting pressure head 1, thereby maximizing the heat exchange efficiency and ensuring the temperature stability of the chip 8 during the testing process.

[0071] To further optimize the cooling effect, improve the heat exchange efficiency between the cooling fluid and the heat-conducting pressure head 1, and ensure that the chip 8 can be maintained within the target temperature range (e.g., 25°C to 30°C; or 40°C to 60°C, etc.) during testing, in one embodiment of this application, a plurality of partition plates 14 may be provided inside the cooling cavity 11. The partition plates 14 are used to increase the contact area between the fluid (i.e., the cooling fluid) in the cooling cavity 11 and the heat-conducting pressure head 1 and / or to extend the flow path of the fluid in the cooling cavity 11.

[0072] In this embodiment, the shape and structure of the partition plate 14 are not limited, as long as the partition plate 14 can increase the contact area between the fluid in the cooling chamber 11 and the heat-conducting pressure head 1 and / or extend the flow path of the fluid in the cooling chamber 11. For example, the partition plate 14 can be finned (not shown in the figure), which can increase the contact area between the cooling fluid and the heat-conducting pressure head 1, thereby optimizing the cooling effect; or, the partition plate 14 can be as follows: Figure 5 As shown, it is sheet-like and alternately arranged on the inner walls of both sides of the cooling chamber 11 to extend the flow path of the cooling fluid in the cooling chamber 11 (the flow path of the cooling fluid in the cooling chamber 11 without the addition of the partition plate 14 is as follows). Figure 4 As shown in path A, the flow path of the cooling fluid in the cooling chamber 11 with the added partition plate 14 is as follows. Figure 5 (as shown in path B in the diagram), thereby optimizing the cooling effect.

[0073] This embodiment increases the contact area between the fluid in the cooling chamber 11 and the heat-conducting pressure head 1 and / or extends the flow path of the fluid in the cooling chamber 11 by using multiple partition plates 14. This allows the cooling fluid to come into more full contact with the heat-conducting pressure head 1 in the cooling chamber 11, avoiding the problem of insufficient heat absorption caused by rapid fluid flow, thereby maximizing cooling efficiency and providing a more reliable guarantee for precise temperature control in chip testing.

[0074] It is important to understand that when using the thermally conductive pressure head 1 to perform low-temperature testing or rapid cooling of the chip 8, the surface temperature of the thermally conductive pressure head 1 may be much lower than the ambient dew point temperature due to the low temperature of the cooling fluid. If the surface temperature of the thermally conductive pressure head 1 is much lower than the ambient dew point temperature, water droplets are very likely to condense on its surface. If the water droplets condensed on the thermally conductive pressure head 1 accumulate and drip onto the chip 8, it may cause the chip 8 to short-circuit and burn out. To solve this problem, in one embodiment of this application, the first side of the thermally conductive pressure head 1 is also provided with an annular groove 16, and the first side is the side of the thermally conductive pressure head 1 facing the chip 8 during use. The thermally conductive pressure head 1 also includes an air inlet pipe 15, which is connected to the annular groove 16.

[0075] In use, dry gas (e.g., air or nitrogen) is introduced into the annular groove 16 through the inlet pipe 15 via an external device (e.g., a gas compressor or gas tank). The dry gas is then ejected from the annular groove 16 (the gas flow path is as follows). Figure 9 As shown in path C, a stable air curtain is formed, with chip 8 located inside the space isolated by the air curtain. The air curtain can isolate moisture from the environment, thus preventing water droplets from condensing on the first surface of the heat-conducting pressure head 1. If water droplets cannot condense on the first surface of the heat-conducting pressure head 1, the probability of water droplets condensing on the first surface of the heat-conducting pressure head 1 and dripping onto chip 8 is greatly reduced. Since chip 8 is located inside the space isolated by the air curtain, even if water droplets condense on other surfaces of the heat-conducting pressure head 1 (i.e., surfaces other than the first surface of the heat-conducting pressure head 1), these water droplets are unlikely to pass through the air curtain and drip onto chip 8. Furthermore, dry air can carry away a large amount of moisture around the heat-conducting pressure head 1, further reducing the possibility of water droplets condensing on the surface of the heat-conducting pressure head 1.

[0076] In this embodiment, the air inlet pipe 15 and the annular groove 16 are configured to deliver dry gas to the first surface of the heat-conducting pressure head 1 towards the chip 8, forming an air curtain barrier surrounding the chip 8. This air curtain effectively isolates moisture from the environment from contact with the first surface of the heat-conducting pressure head 1, preventing condensation of water droplets due to the temperature of the first surface of the heat-conducting pressure head 1 being lower than the ambient dew point. Simultaneously, the air curtain prevents water droplets that may condense on other surfaces of the heat-conducting pressure head 1 from dripping onto the chip 8. The dry gas also carries away moisture around the heat-conducting pressure head 1, reducing local humidity and further reducing the risk of water droplet condensation on the surface of the heat-conducting pressure head 1. In other words, this embodiment reduces the risk of water droplets causing short circuits and burnout of the chip 8, ensuring temperature control accuracy during low-temperature testing or rapid cooling of the chip 8 while further improving the safety and reliability of the test.

[0077] The chip testing component embodiment proposed in this application constructs a buffer structure through the arrangement of a bushing, a shaft, and an elastic element, enabling the thermally conductive pressure head to elastically expand and contract along a first direction (i.e., the thickness direction of the chip). When the driving component moves the testing component close to the chip, and the thermally conductive pressure head changes from contact to abutment with the chip, if the chip experiences a reverse force due to warping or thermal expansion (i.e., contact pressure in the prior art), this reverse force can push the shaft relative to the bushing to slide along the first direction, thereby compressing the elastic element to store elastic force. The elastic force generated by the elastic element can buffer the instantaneous increase of the aforementioned reverse force, not only preventing a sharp increase in the contact pressure between the thermally conductive pressure head and the chip along the first direction, but also providing buffer deformation space for the chip's expansion and deformation. In other words, this application can both ensure the continuity of the thermal conduction path between the thermally conductive pressure head and the chip and prevent problems such as the bare chip being crushed or the testing equipment being damaged due to excessive contact pressure between the thermally conductive pressure head and the chip, thereby improving the safety and stability of easily warped or easily expanded chips during testing.

[0078] Having introduced the chip testing components proposed in the embodiments of this application, the following describes an embodiment of a chip testing device proposed in this application, which includes the chip testing components as described in any of the embodiments above.

[0079] The embodiment of the chip testing equipment proposed in this application constructs a buffer structure through the arrangement of a bushing, a shaft, and an elastic element, allowing the thermally conductive pressure head to elastically expand and contract along a first direction (i.e., the thickness direction of the chip). When the driving component moves the testing component closer to the chip, and the thermally conductive pressure head changes from contact to abutment with the chip, if the chip experiences a reverse force due to warping or thermal expansion (i.e., contact pressure in the prior art), this reverse force can push the shaft relative to the bushing to slide along the first direction, thereby compressing the elastic element to store elastic force. The elastic force generated by the elastic element can buffer the instantaneous increase of the aforementioned reverse force, not only preventing a sharp increase in the contact pressure between the thermally conductive pressure head and the chip along the first direction, but also providing buffer deformation space for the chip's expansion and deformation. In other words, this application can both ensure the continuity of the thermal conduction path between the thermally conductive pressure head and the chip and prevent problems such as the bare chip being crushed or the testing equipment being damaged due to excessive contact pressure between the thermally conductive pressure head and the chip, thereby improving the safety and stability of easily warped or easily expanded chips during testing.

[0080] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip testing component, applied to a chip testing device, the chip testing device including a driving component, the driving component being at least used to drive the testing component to reciprocate along a first direction, the first direction being parallel to the thickness direction of the chip (8) during chip (8) testing; characterized in that, The test components include: A bushing (2) and a shaft (3); a sliding connection is formed between the bushing (2) and the shaft (3) along a first direction; A heat-conducting pressure head (1) is disposed on the shaft (3); An elastic element (4) is disposed between the bushing (2) and the shaft (3). In use, the driving component drives the test component to approach the chip (8) along a first direction, so that during the process of the heat-conducting pressure head (1) and the chip (8) changing from contact to abutment, the elastic force stored in the elastic element (4) gradually increases; the elastic force has a tendency to make the heat-conducting pressure head (1) move away from the bushing (2) along the first direction.

2. The chip testing component according to claim 1, characterized in that, The heat-conducting pressure head (1) is fixedly connected to the shaft (3); or, the test assembly further includes a universal joint (6); the heat-conducting pressure head (1) and the shaft (3) are connected by the universal joint (6).

3. The chip testing component according to claim 2, characterized in that, It also includes a measuring structure, which is at least used to measure the magnitude of the thermal deformation of the chip (8).

4. The chip testing component according to claim 3, characterized in that, The measuring structure includes a distance sensor (54), which is disposed on the bushing (2) or the shaft (3); or, the measuring structure includes a gyroscope sensor, which is disposed on the heat-conducting pressure head (1).

5. The chip testing component according to claim 3, characterized in that, The measurement structure includes: A laser emitter (52) and a laser receiver (53); in use, the laser emitter (52) is used to emit laser light, and the laser receiver (53) is used to receive laser light. A reflector (51) is used to reflect the laser emitted by the laser emitter (52) to the laser receiver (53).

6. The chip testing assembly according to claim 5, characterized in that, The laser receiver (53) is an electronic receiver; or the laser receiver (53) is an observation dial.

7. The chip testing component according to claim 6, characterized in that, The observation dial includes a safe zone (532) and a danger zone (531), with a calibration point located at the center of the safe zone (532).

8. The chip testing assembly according to any one of claims 1 to 7, characterized in that, The heat-conducting pressure head (1) is also provided with a flexible heat-conducting layer (7). When in use, the flexible heat-conducting layer (7) is located between the heat-conducting pressure head (1) and the chip (8).

9. The chip testing assembly according to any one of claims 1 to 7, characterized in that, The heat-conducting pressure head (1) is provided with a cooling chamber (11). The heat-conducting pressure head (1) also includes an inlet pipe (12) and an outlet pipe (13). The inlet pipe (12) and the outlet pipe (13) are both connected to the cooling chamber (11).

10. A chip testing device, characterized in that, Includes the chip testing component as described in any one of claims 1 to 9.

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