Clamp assembly, use method thereof and color combination prism

Abstract

The invention discloses a clamp assembly, a use method thereof and a color combination prism, the clamp assembly comprises a color combination prism clamp, and the color combination prism clamp comprises a prism supporting base; the prism limiting piece is located on the surface of the top of the prism supporting base and used for limiting a color combination prism; one or more display chip clamps, each display chip clamp comprising: a panel clamp base; the panel clamp back plate is movably arranged on the panel clamp base, and the panel clamp back plate is movably arranged on the panel clamp base; and the panel limiting piece is positioned on the surface of the panel clamp back plate and is used for limiting a display chip. According to the invention, the stacking cross color condition can be improved.

Description

Technical Field

[0001] This invention relates to the field of micro LED manufacturing technology, and in particular to a clamping assembly and its method of use, and a color-combining prism. Background Technology

[0002] In an existing micro LED display technology, a synthesized color image can be projected onto a projection plane using an optomechanical system. Specifically, the optomechanical system can output a pattern from a micro LED display chip that has multiple colors of light (such as the three primary colors of light: red, green, and blue), and then synthesize the pattern into a color image using a color combining prism, and finally project the synthesized color image onto the projection plane.

[0003] Among them, the color combining prism is an important optical component in projection equipment. Its function is to combine multiple colors of light (such as the three primary colors of light red, green and blue) incident on the color combining prism from multiple micro LED display chips from different directions into a single channel of full-color light (such as white light) and project it onto the projection plane.

[0004] However, in the existing manufacturing process of micro LED optical engines, slight displacement can easily occur between the color combining prism and each micro LED display chip, leading to multicolor stacking and cross-color problems.

[0005] There is an urgent need for a component structure that can improve the reliability of multi-color regular arrangement during the manufacturing process. Summary of the Invention

[0006] The technical problem solved by this invention is to provide a clamping component and its usage method, as well as a color-combining prism, which can enhance the controllability of maintaining a regular arrangement between the display chip and the color-combining prism after the adhesive has cured, thereby effectively improving the situation of color mixing during stacking.

[0007] To address the aforementioned technical problems, this invention provides a fixture assembly, comprising: a color-combining prism fixture, the color-combining prism fixture including: a prism support base; a prism limiting member located on the top surface of the prism support base for limiting the color-combining prism; one or more display chip fixtures, each display chip fixture including: a panel fixture base; a panel fixture back plate movably disposed on the panel fixture base; and a panel limiting member located on the surface of the panel fixture back plate for limiting the display chip; wherein the color-combining prism fixture and each display chip fixture are relatively movable.

[0008] Optionally, the prism limiting component includes: a prism vacuum adsorption component, the adsorption hole of which is located on the top surface of the prism support base; and / or, a pair of prism clamping knobs located on the top surface of the prism support base; wherein each pair of prism clamping knobs is arranged opposite to each other and can be moved together or apart in opposite directions.

[0009] Optionally, the top surface of the prism support base includes a first central region and a first edge region, the first edge region surrounding the first central region; the adsorption hole of the prism vacuum adsorption component is located in the first central region; and / or, the prism clamping knob is located in the first edge region.

[0010] Optionally, the panel limiting component includes: a panel vacuum adsorption component, wherein the adsorption hole of the panel vacuum adsorption component is located on the surface of the panel clamp back plate; and / or, a pair of panel clamping knobs located on the surface of the panel clamp back plate; wherein each pair of panel clamping knobs is arranged opposite to each other and can move together or apart in the opposite direction.

[0011] Optionally, the surface of the panel clamp back plate includes a second central region and a second edge region, the second edge region surrounding the second central region; the adsorption hole of the panel vacuum adsorption component is located in the second central region; and / or, the panel clamping knob is located in the second edge region.

[0012] Optionally, the display chip is a micro LED display chip, which includes a substrate and a micro LED array.

[0013] Optionally, the thickness of the panel clamping knob is less than or equal to the thickness of the substrate.

[0014] Optionally, the panel fixture backplate includes a heating module for heating the display chip through the surface of the panel fixture backplate.

[0015] Optionally, each display chip fixture further includes an XYZ axis moving component, one end of which is connected to the panel fixture base, and the other end of which is connected to the panel fixture back plate; wherein the XYZ axis moving component can drive the panel fixture back plate to move relative to the panel fixture base along the X-axis, Y-axis and Z-axis directions of the panel fixture base, respectively.

[0016] Optionally, each display chip fixture further includes an XYZ axis rotator, which is capable of rotating the panel fixture backplate around the X-axis, Y-axis and Z-axis of the panel fixture backplate, respectively.

[0017] Optionally, the Z-axis of the panel clamp back plate is perpendicular to the direction of the panel clamp back plate; and / or, the Z-axis of the panel clamp back plate passes through the center point of the panel clamp back plate.

[0018] Optionally, the area of ​​the top surface of the prism support base is less than or equal to the area of ​​the opaque surface of the color-combining prism.

[0019] The display chip fixture consists of three parts, which respectively hold a red light display chip, a green light display chip, and a blue light display chip. The color-combining prism fixture and the three display chip fixtures are movable relative to each other, so that the three light-incident surfaces of the color-combining prism can be aligned with the display surfaces of the corresponding display chips. The movement of the back plate of the panel fixture allows the light-incident surfaces of the color-combining prism to be fitted with the display surfaces of the corresponding display chips.

[0020] Optionally, the clamping assembly further includes a color-combining prism: wherein the color-combining prism includes: a prism body, the prism body comprising a light-transmitting surface and at least one opaque surface, the light-transmitting surface comprising a light-emitting surface and at least one light-incident surface; a protrusion, the protrusion being located on the opaque surface and fixedly connected to the prism body; wherein the prism limiting member limits the color-combining prism through the protrusion.

[0021] Optionally, the protrusion and the prism body are integrally formed.

[0022] Optionally, the protrusion is a cuboid.

[0023] Optionally, the prism limiting component includes: a pair of prism clamping knobs located on the top surface of the prism support base, wherein each pair of prism clamping knobs is arranged opposite to each other and can move along the extension direction of the opposite direction; the thickness of the protrusion is greater than or equal to the thickness of the prism clamping knob.

[0024] Optionally, the prism limiting component includes: a pair of prism clamping knobs located on the top surface of the prism support base, wherein each pair of prism clamping knobs is arranged opposite to each other and can move along the extension direction of the opposite direction; in the opposite direction of each pair of prism clamping knobs, the following formula is satisfied: L≥D1+D2+K; wherein L is used to represent the length of the top surface of the prism support base, D1 is used to represent the width of one of the pair of prism clamping knobs, D2 is used to represent the width of the other of the pair of prism clamping knobs, and K is used to represent the side length of the longest side of the protrusion of the color-combining prism.

[0025] To solve the above-mentioned technical problems, embodiments of the present invention provide a color-combining prism, comprising: a prism body, the prism body including a light-transmitting surface and at least one light-blocking surface, the light-transmitting surface including a light-emitting surface and at least one light-incident surface; a protrusion, the protrusion being located on the light-blocking surface and fixedly connected to the prism body; wherein, the prism limiting member limits the color-combining prism through the protrusion.

[0026] Optionally, the protrusion satisfies one or more of the following: the protrusion and the prism body are integrally formed; the protrusion and the prism body are fixedly connected by adhesive; the protrusion and the prism body are fixedly connected by adsorption.

[0027] Optionally, the protrusion is a cuboid.

[0028] To solve the above-mentioned technical problems, embodiments of the present invention provide a method for using the above-described clamping assembly. The method includes: detachably fixing the color-combining prism with the prism limiting member, and detachably fixing the display chip with the panel limiting member; moving each panel clamp base according to the bonding position of the display surface of each display chip on the corresponding light-incident surface of the color-combining prism, so that the display surface of each display chip is opposite to the corresponding light-incident surface; moving each panel clamp backplate respectively, so that the display surface of each display chip is parallel to the corresponding light-incident surface, and there is a non-zero gap between the display surface of each display chip and the corresponding light-incident surface; forming an adhesive layer on each light-incident surface; moving each display chip clamp separately or simultaneously, so that the display surface of each display chip is adhered to the bonding position on the light-incident surface through the adhesive layer; and curing the adhesive layer while keeping the relative positions of the panel clamp backplate and each display chip clamp unchanged.

[0029] Optionally, the adhesive layer may be cured by means of ultraviolet irradiation and / or low-temperature baking.

[0030] Optionally, the method further includes: removing the prism limiting member from the color combining prism and removing the panel limiting member from the display chip.

[0031] Optionally, according to the bonding position of the display surface of each display chip on the corresponding light-incident surface of the color-combining prism, the panel clamp bases are moved, including: moving the panel clamp base of the first display chip so that the display surface of the first display chip is opposite to the corresponding light-incident surface; moving the panel clamp back plate of the first display chip so that the display surface of the first display chip is bonded to the corresponding light-incident surface; illuminating the first display chip to project a first alignment mark image; determining the bonding position of the display surfaces of other display chips on their respective corresponding light-incident surfaces according to the coordinates of the first alignment mark image; moving the panel clamp bases and / or panel clamp back plates of other display chips so that the display surface of each display chip is opposite to the corresponding light-incident surface.

[0032] To address the aforementioned technical problems, embodiments of the present invention provide a method for assembling a micro LED display chip and a color-combining prism. The method includes: moving each display chip separately such that the display surface of each display chip is parallel to and opposite to its corresponding light-incident surface, and that there is a non-zero gap between the display surface of each display chip and its corresponding light-incident surface; forming an adhesive layer on each light-incident surface; moving each display chip separately or simultaneously such that the display surface of each display chip is adhered to a bonding position on the light-incident surface through the adhesive layer; and curing the adhesive layer while maintaining the relative positions of the panel fixture backplate and each display chip fixture unchanged.

[0033] Optionally, the adhesive layer may be cured by means of ultraviolet irradiation and / or low-temperature baking.

[0034] Optionally, the step of moving each display chip separately includes: moving the first display chip so that the display surface of the first display chip is opposite to the corresponding light-incident surface; moving the first display chip so that the display surface of the first display chip is in contact with the corresponding light-incident surface; illuminating the first display chip to project a first alignment mark image; determining the contact position of the display surfaces of the other display chips on their respective corresponding light-incident surfaces based on the coordinates of the first alignment mark image; and moving the other display chips so that the display surface of each display chip is opposite to the corresponding light-incident surface.

[0035] Compared with the prior art, the technical solution of the embodiments of the present invention has the following beneficial effects:

[0036] In this embodiment of the invention, by employing a clamping assembly comprising a color-combining prism clamp and one or more display chip clamps, a prism limiting member can be used to limit the color-combining prism, and a panel limiting member can be used to limit the display chip. Since the color-combining prism clamp and each display chip clamp can move relative to each other, when the clamping assembly is applied, each light-incident surface of the color-combining prism can be aligned with the display surface of the corresponding display chip, and the movement of the back plate of the panel clamp can make the light-incident surface of the color-combining prism fit into place with the display surface of the corresponding display chip. Furthermore, since the clamping assembly can be used to form an adhesive layer on each light-incident surface of the color-combining prism, and then move each display chip clamp separately or simultaneously, so that the display surface of each display chip is adhered to the bonding position on the light-incident surface through the adhesive layer, and then the adhesive layer is cured, it is possible to re-fix the objects bonded by the adhesive (i.e., the color-combining prism and one or more display chips) through the hardware device of the clamping assembly. During the adhesive curing process, the displacement caused by adhesive shrinkage is effectively limited, enhancing the controllability of maintaining a regular arrangement between the display chips and the color-combining prism after the adhesive is cured, thereby effectively improving the situation of stacked color mixing.

[0037] Furthermore, by setting prism limiting components including prism vacuum adsorption components and / or pairs of prism clamping knobs, the color-combining prism fixture can detachably limit and fix the color-combining prism, thereby improving the limiting of the color-combining prism and avoiding the impact on the optical engine during the subsequent removal of the color-combining prism fixture.

[0038] Furthermore, by setting panel limiting components including panel vacuum adsorption components and / or pairs of panel clamping knobs, the display chip fixture can detachably limit and fix the display chip, thereby improving the limiting of the display chip and avoiding the impact on the optomechanic during the subsequent removal of the display chip fixture.

[0039] Furthermore, the display chip is a micro LED display chip, which includes a substrate and a micro LED array. The thickness of the panel clamping knob is less than or equal to the thickness of the substrate. Therefore, in the process of manufacturing a micro LED optical engine using a micro LED display chip, by setting a thinner panel clamping knob, the impact on the micro LED display chip during the clamping process can be reduced.

[0040] Furthermore, the area of ​​the top surface of the prism support base is less than or equal to the area of ​​the opaque surface of the color-combining prism. This allows for the use of a thinner prism support base to support the color-combining prism. During the subsequent process of using a display chip fixture to control the display chip to approach the color-combining prism, the possibility of collision between the display chip fixture and the prism support base is reduced, further improving the movement flexibility of the display chip fixture and reducing its design complexity. In addition, during the manufacturing of micro-LED optical engines using micro-LED display chips, due to the small size and high density of micro-LEDs, using a thinner prism support base to support the color-combining prism further reduces contact between the color-combining prism fixture and the micro-LED display chip (and its fixture), minimizing the impact on the micro-LED display chip.

[0041] Furthermore, by providing a protrusion that is fixedly connected to the prism body, the prism clamping knob can more conveniently clamp the color-combining prism, and the protrusion, located on the opaque surface, can avoid affecting the incoming and outgoing light. Using this solution, the protrusion can be formed at a very low manufacturing cost, effectively improving the controllability and stability of the color-combining prism clamp on the prism.

[0042] Furthermore, the thickness of the protrusion is greater than or equal to the thickness of the prism clamping knob. This allows for full consideration of the small size and weak pressure resistance of the color-combining prism during the manufacturing of the micro-LED optical engine using micro-LED display chips. By setting a thinner prism clamping knob, the impact on the color-combining prism is reduced during the clamping process of the protrusion of the color-combining prism.

[0043] Furthermore, in the relative directions of each pair of prism clamping knobs, the following formula is satisfied: L≥D1+D2+K; thus, by setting the sum of the longest side length of the protrusion and the width of the pair of prism clamping knobs to still be less than the top surface length of the prism support base, the possibility of collision between the prism clamping knobs and the display chip fixture is reduced during the subsequent process of using the display chip fixture to control the display chip to approach the color combining prism, thereby further improving the movement flexibility of the display chip fixture and reducing the design complexity of the display chip fixture.

[0044] Furthermore, during the process of fixing the color-combining prism and display chip in the clamping assembly, the display surface of the display chip is first aligned with the corresponding light-incident surface according to the bonding position. Then, the back plates of each panel clamp are moved so that the display surface of each display chip is parallel to the corresponding light-incident surface, and there is a non-zero gap between the display surface of each display chip and the corresponding light-incident surface. By first bringing them close and then moving them parallel apart, accurate positioning of each display chip can be achieved before applying adhesive. After applying adhesive, by moving each display chip clamp separately or simultaneously, more accurate bonding can be achieved on the basis of accurate positioning. Then, while keeping the relative positions of the panel clamp back plate and each display chip clamp unchanged, in other words, while fixing the color-combining prism and display chip in the clamping assembly, the adhesive layer is cured. During the adhesive curing process, the displacement caused by adhesive shrinkage can be effectively limited, enhancing the controllability of the regular arrangement between the display chip and the color-combining prism after adhesive curing, thereby effectively improving the stacking color crosstalk situation.

[0045] Further, the panel fixture base of the first display chip is moved so that the display surface of the first display chip is opposite to the corresponding light-incident surface; the panel fixture backplate of the first display chip is moved so that the display surface of the first display chip is in contact with the corresponding light-incident surface; the first display chip is lit up to project a first alignment mark image; the contact position of the display surfaces of the other display chips on their respective corresponding light-incident surfaces is determined according to the coordinates of the first alignment mark image; the panel fixture bases and / or panel fixture backplates of the other display chips are moved so that the display surface of each display chip is opposite to the corresponding light-incident surface. By adopting the above solution, the display surface of the display chip can be bonded to the corresponding light-incident surface by moving the panel fixture base and the panel fixture back plate. Compared with relying solely on adhesive for bonding, hardware fixation can effectively improve the reliability and stability of bonding. Furthermore, based on the coordinates of the first alignment mark image, the bonding position of the display surface of other display chips on their respective corresponding light-incident surfaces can be determined, and the panel fixture base and / or panel fixture back plate of other display chips can be moved. Compared with directly moving the display chips, the controllability of the movement can be improved. Especially in the process of manufacturing micro-LED optical engines using micro-LED display chips, due to the small size and high density of micro-LEDs, moving the panel fixture base and / or panel fixture back plate can further reduce contact with the micro-LED display chips and color-combining prisms, reducing the impact on the micro-LED display chips. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of the light emission effect of a color-combining prism and a display chip in the prior art;

[0047] Figure 2This is a schematic diagram of the structure of a color-combining prism clamp according to an embodiment of the present invention;

[0048] Figure 3 This is a schematic diagram of the structure of a display chip fixture according to an embodiment of the present invention;

[0049] Figure 4 This is a schematic diagram of the structure of a color-combining prism in an embodiment of the present invention;

[0050] Figure 5 This is a schematic diagram of a working scenario in which a color-combining prism is fixed using a color-combining prism clamp according to an embodiment of the present invention;

[0051] Figure 6 This is a flowchart illustrating a method of using a clamping assembly according to an embodiment of the present invention;

[0052] Figure 7 This is a schematic diagram of a working scenario in which a color-combining prism and a display chip are fixed using a color-combining prism fixture and a display chip fixture, according to an embodiment of the present invention.

[0053] Figure 8 This is an embodiment of the present invention, which describes a method for assembling a micro LED display chip and a color-combining prism.

[0054] Explanation of reference numerals in the attached figures:

[0055] Color-matching prism clamp 1, prism support base 11, prism limiting component 12, prism vacuum adsorption component 121, prism clamping knob 122, display chip clamp 2, panel clamp base 21, panel limiting component 22, panel vacuum adsorption component 221, panel clamping knob 222, panel clamp back plate 23, XYZ axis moving component 24, XYZ axis rotating component 25, prism body 31, protrusion 32. Detailed Implementation

[0056] As mentioned earlier, in the existing manufacturing process of micro LED optical engines, slight displacement can easily occur between the color combining prism and each micro LED display chip, leading to multicolor stacking and color mixing problems.

[0057] Research has revealed that in existing technologies, the color-combining prism and each micro-LED display chip need to be bonded together with adhesive. However, during the adhesive curing process, slight displacement can easily occur between the color-combining prism and each micro-LED display chip due to adhesive shrinkage, leading to multi-color stacking and color mixing problems.

[0058] Reference Figure 1 , Figure 1 This is a schematic diagram of the light emission effect of a color-combining prism and a display chip in the prior art.

[0059] It should be pointed out that, Figure 1The illustrated display chip uses an RGB three-color chip as an example. In practice, the three-color chips can be manufactured separately, and then glued onto the color-combining prism.

[0060] A color combining prism can include four right-angle prisms. Red, green, and blue incident light enter the color combining prism from three different sides, respectively. After being combined inside the color combining prism, the light is emitted as full-color light through another side.

[0061] Each right-angle prism can have its own reflective film formed on its right-angled facet. For example, the red light reflective film can reflect incident light in the red light band and transmit light of other colors, while the blue light reflective film can reflect incident light in the blue light band and transmit light of other colors.

[0062] Further research revealed that in existing technologies, adhesives require curing processes, such as ultraviolet (UV) curing or low-temperature curing. During the curing process, the adhesive shrinks, and because the amount of adhesive applied to each plane of the color-matching prism is difficult to be completely uniform, the pressure distribution is inconsistent. As a result, the adhesive tends to have differences in thickness and width after being subjected to force, which further leads to uncontrollable shrinkage direction of the cured adhesive.

[0063] Specifically, due to adhesive shrinkage, slight displacement may occur between the color-matching prism and the individual micro-LED display chips, such as... Figure 1 The red light reflective film plane (shown as dotted lines) and the blue light reflective film plane (shown as dashed lines) shown may both shift, resulting in... Figure 1 The problem of uneven alignment marks in the tri-color light image is shown.

[0064] In this embodiment of the invention, by employing a clamping assembly comprising a color-combining prism clamp and one or more display chip clamps, a prism limiting member can be used to limit the color-combining prism, and a panel limiting member can be used to limit the display chip. Since the color-combining prism clamp and each display chip clamp can move relative to each other, when the clamping assembly is applied, each light-incident surface of the color-combining prism can be aligned with the display surface of the corresponding display chip, and the movement of the back plate of the panel clamp can make the light-incident surface of the color-combining prism fit into place with the display surface of the corresponding display chip. Furthermore, since the clamping assembly can be used to form an adhesive layer on each light-incident surface of the color-combining prism, and then move each display chip clamp separately or simultaneously, so that the display surface of each display chip is adhered to the bonding position on the light-incident surface through the adhesive layer, and then the adhesive layer is cured, it is possible to re-fix the objects bonded by the adhesive (i.e., the color-combining prism and one or more display chips) through the hardware device of the clamping assembly. During the adhesive curing process, the displacement caused by adhesive shrinkage is effectively limited, enhancing the controllability of maintaining a regular arrangement between the display chips and the color-combining prism after the adhesive is cured, thereby effectively improving the situation of stacked color mixing.

[0065] To make the above-mentioned objectives, features and beneficial effects of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0066] Combined with reference Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the structure of a color-combining prism clamp according to an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of a display chip fixture according to an embodiment of the present invention.

[0067] In an embodiment of the present invention, a clamping assembly is disclosed, which may include a color-combining prism clamp 1 and one or more display chip clamps 2.

[0068] The color-combining prism fixture 1 may include: a prism support base 11 and a prism limiting member 12.

[0069] The prism limiting member 12 can be located on the top surface of the prism support base 11 and is used to limit the opaque surface of the color-combining prism.

[0070] Furthermore, the prism limiting member 12 may include: a prism vacuum adsorption component 121 and / or a pair of prism clamping knobs 122.

[0071] The adsorption holes of the prism vacuum adsorption component 121 can be located on the top surface of the prism support base 11.

[0072] The prism clamping knob 122 can be located on the top surface of the prism support base 11, wherein each pair of prism clamping knobs 122 can be arranged opposite to each other and can be moved together or apart in opposite directions.

[0073] Specifically, such as Figure 2 The two pairs of prism clamping knobs 122 shown are marked with bidirectional arrows, illustrating the directions in which the prism clamping knobs 122 can move.

[0074] In this embodiment of the invention, by setting the prism limiting component 12 including the prism vacuum adsorption component 121 and / or a pair of prism clamping knobs 122, the color-combining prism clamp 1 can be detachably limited and fixed to the color-combining prism. While improving the limitation of the color-combining prism, it avoids the impact on the optical engine during the subsequent removal of the color-combining prism clamp 1.

[0075] Furthermore, the top surface of the prism support base 11 may include a first central region and a first edge region, with the first edge region surrounding the first central region; the adsorption hole of the prism vacuum adsorption component 121 may be located in the first central region; and / or, the prism clamping knob 122 may be located in the first edge region.

[0076] In specific implementation, by setting the adsorption hole of the prism vacuum adsorption component 121 to be located in the first central region, the vacuum suction force on the color-matching prism can be increased, and the stability can be improved; by setting the prism clamping knob 122 to be located in the first edge region, the color-matching prism can be clamped from the outside of the color-matching prism, thereby increasing the reliability of the limiting position of the color-matching prism.

[0077] Furthermore, the area of ​​the top surface of the prism support base 11 can be less than or equal to the area of ​​the opaque surface of the color-combining prism.

[0078] In this embodiment of the invention, the area of ​​the top surface of the prism support base 11 is less than or equal to the area of ​​the opaque surface of the color-combining prism. This allows for the use of a thinner prism support base 11 to support the color-combining prism. During the subsequent process of using the display chip fixture 2 to control the display chip to approach the color-combining prism, the possibility of collision between the display chip fixture 2 and the prism support base 11 is reduced, further improving the mobility of the display chip fixture 2 and reducing its design complexity. Furthermore, in the process of manufacturing a micro-LED optical engine using micro-LED display chips, due to the small size and high density of micro-LEDs, using a thinner prism support base 11 to support the color-combining prism further reduces contact between the color-combining prism fixture 1 and the micro-LED display chip (and its display chip fixture 2), minimizing the impact on the micro-LED display chip.

[0079] like Figure 3 As shown, each display chip fixture 2 may include: a panel fixture base 21, a panel limiting member 22, and a panel fixture back plate 23.

[0080] The panel clamp back plate 23 is movably mounted on the panel clamp base 21.

[0081] The panel limiting member 22 can be located on the surface of the panel clamp back plate 23 and is used to limit the display chip from the non-display surface of the display chip.

[0082] Furthermore, the panel limiting member 22 may include: a panel vacuum adsorption component 221 and / or a pair of panel clamping knobs 222.

[0083] The adsorption holes of the panel vacuum adsorption component 221 can be located on the surface of the panel clamp back plate 23.

[0084] The panel clamping knob 222 can be located on the top surface of the panel clamp back plate 23. Each pair of panel clamping knobs 222 can be arranged opposite to each other and can move together or apart in opposite directions.

[0085] Specifically, such as Figure 3 The two pairs of panel clamping knobs 222 shown are marked with bidirectional arrows, illustrating the directions in which the panel clamping knobs 222 can move.

[0086] In this embodiment of the invention, by setting the panel limiting member 22 to include the panel vacuum adsorption component 221 and / or a pair of panel clamping knobs 222, the display chip fixture 2 can detachably limit and fix the display chip, thereby improving the limiting of the display chip and avoiding the impact on the optomechanic during the subsequent removal of the display chip fixture 2.

[0087] Furthermore, the surface of the panel clamp back plate 2 may include a second central region and a second edge region, with the second edge region surrounding the second central region; the adsorption hole of the panel vacuum adsorption component 221 may be located in the second central region; and / or, the panel clamping knob 222 may be located in the second edge region.

[0088] In specific implementation, by setting the adsorption hole of the panel vacuum adsorption component 221 to be located in the second central region, the vacuum suction force on the display chip can be increased, and the stability can be improved; by setting the panel clamping knob 222 to be located in the second edge region, the display chip can be clamped from the outside of the display chip, increasing the reliability of the limit position of the display chip.

[0089] In some embodiments, the display chip may be a micro LED display chip, which may include a substrate and a micro LED array.

[0090] In this embodiment of the invention, the fixture assembly can be further improved to take into account the small size and high density of the micro-LEDs in the micro-LED display chip, and the small size and weak pressure resistance of the color combining prism in the micro-LED optical engine.

[0091] Furthermore, the thickness of the panel clamping knob 222 can be less than or equal to the thickness of the substrate.

[0092] In this embodiment of the invention, the display chip is a micro-LED display chip, which includes a substrate and a micro-LED array. The thickness of the panel clamping knob 222 is less than or equal to the thickness of the substrate. Therefore, by setting a thinner panel clamping knob 222 during the manufacturing of a micro-LED optical engine using the micro-LED display chip, the impact on the micro-LED display chip during clamping is reduced. Furthermore, when the panel limiting component includes a panel vacuum adsorption component, the thickness of the panel clamping knob 222 being less than or equal to the thickness of the substrate can also prevent an excessively large distance between the display chip and the adsorption holes of the panel vacuum adsorption component, thus avoiding affecting the vacuum adsorption effect of the panel vacuum adsorption component.

[0093] Furthermore, the panel fixture backplate 23 may include a heating module (not shown) for heating the display chip through the surface of the panel fixture backplate 23.

[0094] In practice, heating the display chip can effectively increase the curing rate of the adhesive, further reducing the possibility of slight displacement between the color-combining prism and each display chip due to adhesive shrinkage.

[0095] Furthermore, each display chip fixture 2 may also include an XYZ axis moving element 24.

[0096] One end of the XYZ axis moving component 24 can be connected to the panel clamp base 21, and the other end of the XYZ axis moving component 25 can be connected to the panel clamp back plate 23; wherein, the XYZ axis moving component 24 can drive the panel clamp back plate 23 to move relative to the panel clamp base 21 along the X-axis, Y-axis and Z-axis directions of the panel clamp base 21 respectively.

[0097] In specific implementations, appropriate methods can be used to achieve relative movement. For example, a slide rail can be set, and a movable slider can be set in the slide rail to enable the panel clamp back plate 23 to move relative to the panel clamp base 21 along the X-axis, Y-axis and Z-axis directions respectively. Alternatively, a rotatable bolt can be set to enable the panel clamp back plate 23 to move relative to the panel clamp base 21 along the X-axis, Y-axis and Z-axis directions respectively through the shearing force of the thread.

[0098] In this embodiment of the invention, the specific working principle and working steps of the XYZ axis moving component 24 are not limited.

[0099] Furthermore, each display chip fixture 2 may also include an XYZ axis rotator 25.

[0100] The XYZ axis rotatable component 25 can rotate the panel clamp back plate 23 around the X-axis, Y-axis and Z-axis of the panel clamp back plate 23, respectively.

[0101] In specific implementation, rotation can be achieved in an appropriate manner. For example, a rotatable bolt can be set to rotate the panel clamp back plate 23 through the shearing force of the thread; a slide rail can also be set, and a movable slider can be set in the slide rail to achieve rotation of the panel clamp back plate 23.

[0102] In this embodiment of the invention, the specific working principle and working steps of the XYZ axis rotating component 25 are not limited.

[0103] Furthermore, the Z-axis of the panel clamp back plate 23 may be perpendicular to the direction of the panel clamp back plate 23; and / or, the Z-axis of the panel clamp back plate 23 may pass through the center point of the panel clamp back plate 23.

[0104] In specific implementation, by setting the Z-axis of the panel clamp back plate 23 to be perpendicular to the direction of the panel clamp back plate 23, the panel clamp back plate 23 can be rotated smoothly; by setting the Z-axis of the panel clamp back plate 23 to pass through the center point of the panel clamp back plate 23, the panel clamp back plate 23 can be rotated around the central axis, further reducing the impact on the display chip during rotation.

[0105] Especially in the process of manufacturing micro-LED optical engines using micro-LED display chips, the quality of micro-LED optical engines can be improved by rotating them smoothly and around a central axis, due to the characteristics of micro-LEDs being small in size and high in density.

[0106] In a specific implementation, the color-combining prism fixture 1 and each display chip fixture 2 can move relative to each other so that each light-incident surface of the color-combining prism can be opposite to the display surface of the corresponding display chip, and the light-incident surface of the color-combining prism can be fitted with the display surface of the corresponding display chip by moving the back plate 23 of the panel fixture.

[0107] Specifically, the relative movement between the color-combining prism fixture 1 and each display chip fixture 2 can be mainly achieved through the movement between the prism support base 11 and the panel fixture base 21. The degree of contact between the color-combining prism and the display chip can also be adjusted through the panel fixture back plate 23.

[0108] In this embodiment of the invention, by employing a clamping assembly comprising a color-combining prism clamp 1 and one or more display chip clamps 2, a prism limiting member 12 can limit the color-combining prism from its opaque surface, and a panel limiting member 22 can limit the display chip from its non-display surface. Since the color-combining prism clamp 1 and each display chip clamp 2 are relatively movable, when using this clamping assembly, each light-incident surface of the color-combining prism can be aligned with the display surface of the corresponding display chip, and the movement of the panel clamp back plate 23 can make the light-incident surface of the color-combining prism fit into place with the display surface of the corresponding display chip. Furthermore, since the clamping assembly can be used to form an adhesive layer on each light-incident surface of the color-combining prism, after the individual display chip clamps 2 are moved separately or simultaneously, the display surface of each display chip is adhered to the bonding position on the light-incident surface by the adhesive layer, and then the adhesive layer is cured, the objects bonded by the adhesive (i.e., the color-combining prism and one or more display chips) can be re-fixed by the clamping assembly as a hardware device. During the adhesive curing process, the displacement caused by adhesive shrinkage is effectively limited, enhancing the controllability of the regular arrangement between the display chips and the color-combining prism after the adhesive is cured, thereby effectively improving the stacking color mixing situation.

[0109] In some embodiments, the number of display chip clamps 2 can be three, which respectively clamp red light display chip, green light display chip and blue light display chip; wherein, the color combining prism clamp 1 and the three display chip clamps 2 can move relative to each other so that the three light-incident surfaces of the color combining prism can be aligned with the display surfaces of the corresponding display chips, and the movement of the panel clamp back plate 23 can make the light-incident surfaces of the color combining prisms fit with the display surfaces of the corresponding display chips.

[0110] In practical implementation, by setting an appropriate number of display chip fixtures 2, red light display chips, green light display chips and blue light display chips can be used to achieve the color light output effect after light combination, thus achieving a better balance between the smaller size of the micro LED optical engine and the better light output effect.

[0111] In this embodiment of the invention, a color-combining prism based on the above-described clamping assembly is also disclosed.

[0112] Specifically, the color-combining prism may include: a prism body, the prism body comprising a light-transmitting surface and at least one opaque surface, the light-transmitting surface comprising a light-emitting surface and at least one light-incident surface; a protrusion, the protrusion being located on the opaque surface and fixedly connected to the prism body; wherein, the prism limiting member limits the color-combining prism through the protrusion.

[0113] Reference Figure 4 , Figure 4 This is a schematic diagram of the structure of a color-combining prism in an embodiment of the present invention.

[0114] Specifically, the color-combining prism may include a prism body 31 and a protrusion 32.

[0115] The prism body 31 may include a light-transmitting surface and at least one opaque surface, wherein the light-transmitting surface includes a light-emitting surface and at least one light-incident surface.

[0116] In some embodiments, the prism body 31 may include a plurality of (e.g., two, four) sub-prisms.

[0117] Taking four equal-length right-angled prisms as an example, each right-angled prism can include an inclined plane opposite to the right angle and two right-angled faces that intersect each other perpendicularly and also intersect the inclined plane. The right-angled faces of each right-angled prism can form an optical reflective film, creating a light-reflecting surface for selectively reflecting or transmitting light of specific wavelengths. The right-angled faces of the four right-angled prisms can be glued together to form a square color-combining prism structure. The inclined planes of the four right-angled prisms form the side surfaces of the color-combining prism, which are the incident or exit surfaces of the light, and the light-reflecting surfaces of the four right-angled prisms are aligned with each other.

[0118] In a practical implementation, three light-incident surfaces can be set, each corresponding to a display chip. The display panels of each display chip emit red, green, and blue light respectively, so as to obtain richer colors after color combining. The prism body 31 combines the light emitted by the three monochrome display panels and transmits it to the light-emitting surface.

[0119] like Figure 4 The color-combining prism shown can be a cube structure, with the top and bottom surfaces being opaque and the other four sides being translucent.

[0120] The protrusion 32 can be located on the opaque surface and fixedly connected to the prism body 31, wherein the prism limiting member 12 can limit the color-combining prism through the protrusion 32.

[0121] In this embodiment of the invention, by providing a protrusion 32 that is fixedly connected to the prism body 31, the prism clamping knob 122 can more conveniently clamp the color-combining prism, and the protrusion 32, located on the opaque surface, can avoid affecting the incoming and outgoing light. Using the above solution, the protrusion 32 can be formed at a very low manufacturing cost, effectively improving the controllability and stability of the color-combining prism clamp 1 on the color-combining prism.

[0122] Furthermore, the protrusion 32 satisfies one or more of the following: the protrusion 32 and the prism body 31 are integrally formed; the protrusion 32 and the prism body 31 are fixedly connected by adhesive; the protrusion 32 and the prism body 31 are fixedly connected by adsorption.

[0123] In specific implementation, by setting the protrusion 32 and the prism body 31 as an integrally formed structure, the stability of the prism body 31 after the protrusion 32 is clamped can be further improved.

[0124] Furthermore, in the method of using the color-combining prism based on the embodiments of the present invention, it may also include: removing the protrusion 32.

[0125] It should be noted that the step of removing the protrusion 32 can be performed after the limiting operation of the color-combining prism is completed, for example: after removing the prism limiting member from the color-combining prism, the protrusion 32 is removed.

[0126] Furthermore, the protrusion 32 can be removed by laser cutting.

[0127] It is understandable that after the protrusion 32 is removed by laser cutting, the color-combining prism may retain traces of the cutting.

[0128] In other embodiments, the protrusion 32 is fixedly connected to the prism body 31 by adhesive. The protrusion 32 can be removed by unadhesive operation.

[0129] It is understandable that adhesive residue may remain on the color-matching prism after the protrusion 32 is removed by the de-adhesion operation.

[0130] In some other embodiments, the protrusion 32 is fixedly connected to the prism body 31 by adsorption. The protrusion 32 can be removed by a de-adsorption operation.

[0131] It is understandable that after the protrusion 32 is removed by the de-adsorption operation, adsorption marks may remain on the color-combining prism.

[0132] In some embodiments, the protrusion 32 can be a variety of suitable shapes, such as one or more of the following: sphere, ellipsoid, frustum, cone, truncated cone, cuboid, cube, etc.

[0133] Furthermore, the protrusion 32 can be a cuboid.

[0134] In practical implementation, by setting the protrusion 32 to be a cuboid, the feasibility of clamping operation can be further improved, the clamping effect can be enhanced, and the research and development complexity and production cost of the protrusion 32 can be reduced.

[0135] Reference Figure 5 , Figure 5 This is a schematic diagram of a working scenario in which a color-combining prism is fixed using a color-combining prism clamp according to an embodiment of the present invention.

[0136] Furthermore, the prism limiting member 12 may include: a pair of prism clamping knobs 122 located on the top surface of the prism support base 11, wherein each pair of prism clamping knobs 122 is arranged opposite to each other and can move along the extension direction of the opposite direction; the thickness of the protrusion 32 is greater than or equal to the thickness of the prism clamping knob 122.

[0137] The thickness direction can be perpendicular to the top surface of the prism support base 11.

[0138] In this embodiment of the invention, the thickness of the protrusion 32 is greater than or equal to the thickness of the prism clamping knob 122. This allows for full consideration of the small size and weak pressure resistance of the color-combining prism during the manufacturing of the micro-LED optical engine using micro-LED display chips. By setting a thinner prism clamping knob, the impact on the color-combining prism during clamping of the protrusion is reduced. Furthermore, when the prism limiting component includes a prism vacuum adsorption component, it also avoids an excessively large distance between the protrusion of the color-combining prism and the adsorption hole of the prism vacuum adsorption component, which could affect the vacuum adsorption effect.

[0139] Further, the prism limiting member 12 may include: a pair of prism clamping knobs 122 located on the top surface of the prism support base 11, wherein each pair of prism clamping knobs 122 is arranged opposite to each other and is movable along the extension direction of the opposite direction; in the opposite direction of each pair of prism clamping knobs 122, the following formula is satisfied:

[0140] L≥D1+D2+K;

[0141] Wherein, L represents the length of the top surface of the prism support base 11, D1 represents the width of one of the pair of prism clamping knobs 122, D2 represents the width of the other of the pair of prism clamping knobs 122, and K represents the length of the longest side of the protrusion of the color-combining prism.

[0142] The direction of the length of the top surface can be used to indicate the extension direction of the longest side of the top surface of the prism support base 11. For example, if the top surface of the prism support base 11 is rectangular, the length direction can be used to indicate the extension direction of the long side; if the top surface of the prism support base 11 is square, the length direction can be used to indicate the extension direction of any side length.

[0143] The width of the prism clamping knob 122 can be used to indicate the relative direction of the prism clamping knobs 122 that are set up opposite each other, such as the direction of convergence movement or the direction of dispersion movement.

[0144] In this embodiment of the invention, the following formula is satisfied in the relative direction of each pair of prism clamping knobs 122: L≥D1+D2+K; thus, by setting the sum of the longest side length of the protrusion and the width of the pair of prism clamping knobs 122 to still be less than the top surface length of the prism support base 11, the possibility of collision between the prism clamping knobs 122 and the display chip clamping fixture 1 is reduced during the subsequent process of using the display chip clamping fixture 2 to control the display chip to approach the color combining prism, thereby further improving the movement flexibility of the display chip clamping fixture 1 and reducing the design complexity of the display chip clamping fixture 1.

[0145] It should be noted that the clamping assembly of the embodiments of the present invention is not limited to... Figures 4 to 5 The color-combining prism with protrusions shown can also be further modified in specific implementations by setting sub-components, such as protrusions. By fixing (adsorbing or sticking) the sub-components to a conventional color-combining prism, the prism limiting component can also limit the color-combining prism through the sub-components.

[0146] Combined with reference Figure 6 and Figure 7 , Figure 6 This is a flowchart illustrating a method of using a clamping assembly according to an embodiment of the present invention; Figure 7 This is a schematic diagram of a working scenario in which a color-combining prism and a display chip are fixed using a color-combining prism fixture and a display chip fixture, according to an embodiment of the present invention. The method of using the fixture assembly may include steps S61 to S66, which are described below.

[0147] In step S61, the prism limiting member is used to detachably limit and fix the color combining prism, and the panel limiting member is used to detachably limit and fix the display chip.

[0148] Specifically, a prism vacuum adsorption component and / or a pair of prism clamping knobs can be used to detachably limit and fix the color-combining prism; and a panel vacuum adsorption component and / or a pair of panel clamping knobs can be used to detachably limit and fix the display chip.

[0149] In step S62, according to the bonding position of the display surface of each display chip on the corresponding light-incident surface of the color-combining prism, each panel fixture base is moved so that the display surface of each display chip is opposite to the corresponding light-incident surface.

[0150] Furthermore, the step of moving each panel fixture base according to the bonding position of the display surface of each display chip on the corresponding light-incident surface of the color-combining prism may include: moving the panel fixture base of the first display chip so that the display surface of the first display chip is opposite to the corresponding light-incident surface; moving the panel fixture backplate of the first display chip so that the display surface of the first display chip is bonded to the corresponding light-incident surface; illuminating the first display chip to project a first alignment mark image; determining the bonding position of the display surfaces of other display chips on their respective corresponding light-incident surfaces according to the coordinates of the first alignment mark image; and moving the panel fixture bases and / or panel fixture backplates of other display chips so that the display surface of each display chip is opposite to the corresponding light-incident surface.

[0151] In practice, three-color chips can be produced separately, such as producing red (R) chip, blue (B) chip and green (G) chip separately. Then, the first display chip is aligned with the color combining prism so that the display surface of the first display chip is attached to the corresponding light incident surface.

[0152] The alignment process can be achieved by moving the panel fixture base and panel fixture backplate of the first display chip.

[0153] More specifically, the panel fixture backplate of the first display chip can be moved relative to the panel fixture base along the X, Y, and Z axes of the panel fixture base, respectively, by the XYZ axis moving component; and the panel fixture backplate can be rotated around the X, Y, and Z axes of the panel fixture backplate by the XYZ axis rotating component.

[0154] Then, power is applied to illuminate the first display chip (such as the green light chip), projecting an alignment mark image onto the whiteboard. The fixed positions of the other two chips (such as the red light chip and the blue light chip) are then determined. The other two chips are then aligned with the color combining prism, so that the display surface of each display chip is aligned with the corresponding incident light surface, resulting in a neat and regular arrangement of the projected three-color alignment marks without overlapping or color mixing.

[0155] It should be noted that, in order to enable the display chip to be powered on, the optical engine (such as a micro LED optical engine) in this embodiment of the invention may also include a module for achieving the power-on effect, such as a flexible external board (also known as a flexible external circuit board) containing a circuit structure. The flexible external board may be integrated into or externally connected to the display chip.

[0156] In this embodiment of the invention, by moving the panel fixture base of the first display chip and the panel fixture backplate of the first display chip, the first display chip is illuminated, and the bonding positions of the display surfaces of other display chips on their respective light-incident surfaces are determined. Moving the panel fixture bases and / or panel fixture backplates of other display chips can achieve bonding between the display surfaces of the display chips and their corresponding light-incident surfaces. Compared to relying solely on adhesive for bonding, this dual bonding method of "adhesive bonding" plus "hardware re-fixing" effectively improves the reliability and stability of bonding.

[0157] Furthermore, based on the coordinates of the first alignment mark image, the bonding positions of the display surfaces of other display chips on their respective incident light surfaces are determined, and the panel fixture bases and / or panel fixture backplates of other display chips are moved. Compared to directly moving the display chips, the controllability of the movement can be improved. Especially in the process of manufacturing micro-LED optical engines using micro-LED display chips, since micro-LEDs have the characteristics of small size and high density, by moving the panel fixture bases and / or panel fixture backplates, the contact with micro-LED display chips and color-combining prisms can be further reduced, thus reducing the impact on micro-LED display chips.

[0158] In step S63, each panel fixture backplate is moved so that the display surface of each display chip is parallel to the corresponding light-incident surface, and there is a non-zero gap between the display surface of each display chip and the corresponding light-incident surface.

[0159] In practice, by moving the backplates of each panel fixture, parallel alignment can be achieved, so that the display surface of each display chip is parallel to the corresponding light-incident surface.

[0160] In one specific embodiment, the individual display chips can be accurately positioned before applying adhesive by first bringing them close together and then moving them parallel to each other.

[0161] In step S64, an adhesive layer is formed on each incident light surface.

[0162] Specifically, the adhesive layer material may include one or more of the following combinations: silicone rubber, acrylic resin (also known as acrylic resin), and epoxy resin.

[0163] In step S65, each display chip fixture is moved individually or simultaneously so that the display surface of each display chip is adhered to the bonding position on the light incident surface by the adhesive layer.

[0164] In one specific embodiment, the display surface of each display chip can be bonded to the light-incident surface by moving the various panel clamp bases.

[0165] Specifically, since the display surface of each display chip is parallel to and spaced apart from the corresponding light-incident surface, the adhesive application can be performed based on the spacing, thus eliminating the need to adjust the back plate of the panel fixture. Simply moving the base of each panel fixture is sufficient to achieve translation and bonding.

[0166] In another specific embodiment, each display chip fixture further includes an XYZ axis moving component, one end of which is connected to the panel fixture base, and the other end of which is connected to the panel fixture back plate. The XYZ axis moving component can drive the panel fixture back plate to move relative to the panel fixture base along the X, Y, and Z axes, respectively. The XYZ axis moving components of each display chip fixture can drive the panel fixture back plate to move along the Y-axis of the panel fixture base, thereby achieving the bonding position of the display surface of each display chip to the light-incident surface via the adhesive layer.

[0167] Specifically, since the display surface of each display chip is parallel to and spaced apart from the corresponding light-incident surface, the adhesive application can be performed based on the spacing, thus eliminating the need to adjust the panel fixture base. Simply moving the back plates of each panel fixture in parallel is sufficient to achieve translation and bonding.

[0168] In step S66, the adhesive layer is cured while keeping the relative positions of the panel fixture back plate and each display chip fixture unchanged.

[0169] Furthermore, the step of curing the adhesive layer may include curing the adhesive layer by ultraviolet irradiation and / or low-temperature baking.

[0170] In this embodiment of the invention, during the process of fixing the color-combining prism and the display chip by the clamping assembly, the display surface of the display chip is first aligned with the corresponding light-incident surface according to the bonding position. Then, the back plates of each panel clamp are moved so that the display surface of each display chip is parallel to the corresponding light-incident surface, and there is a non-zero gap between the display surface of each display chip and the corresponding light-incident surface. This allows for accurate positioning of each display chip before applying adhesive. After applying adhesive, by moving each display chip clamp separately or simultaneously, higher accuracy of bonding can be achieved based on accurate positioning. Furthermore, based on the clamping assembly fixing the color-combining prism and the display chip, the adhesive layer is cured. This effectively limits the displacement caused by adhesive shrinkage during the adhesive curing process, enhances the controllability of maintaining a regular arrangement between the cured display chip and the color-combining prism, and thus effectively improves the situation of stacked color mixing.

[0171] Furthermore, the method may further include: removing the prism limiting member from the color combining prism, and removing the panel limiting member from the display chip.

[0172] Furthermore, during the process of removing the prism limiting member from the color-combining prism, parallel movement can be achieved by moving the bases of each panel clamp without adjusting the back plate of the panel clamp, thereby reducing the impact on the color-combining prism.

[0173] In practice, after the adhesive layer is cured using the clamping assembly, the clamping assembly can be removed to facilitate subsequent processes.

[0174] It should be pointed out that, in Figure 7 In the color-combining prism shown, the three color blocks are for illustrative purposes only, used to represent the light-incident and light-exit surfaces for bonding with the display chip. In other words, the three color blocks are not actually three-color stickers.

[0175] It should be noted that, in the embodiments of the present invention, a color-combining prism (see reference) is also disclosed. Figure 5 The prism body 31 includes a light-transmitting surface and at least one opaque surface, the light-transmitting surface including a light-emitting surface and at least one light-incident surface; a protrusion 32 located on the opaque surface and fixedly connected to the prism body 31; wherein the prism limiting member 12 limits the color-combining prism through the protrusion 32.

[0176] It is understandable that after the protrusion 32 is removed by the de-adsorption operation, adsorption marks may remain on the color-combining prism.

[0177] Furthermore, the protrusion satisfies one or more of the following: the protrusion and the prism body are integrally formed; the protrusion and the prism body are fixedly connected by adhesive; the protrusion and the prism body are fixedly connected by adsorption.

[0178] Furthermore, the protrusion is a cuboid.

[0179] Reference Figure 8 , Figure 8 This invention relates to an assembly method for a micro LED display chip and a color-combining prism. The method may include steps S81 to S84, and each step is described below.

[0180] Step S81: Move each display chip separately so that the display surface of each display chip is parallel to the corresponding light-incident surface, and there is a non-zero gap between the display surface of each display chip and the corresponding light-incident surface.

[0181] In specific implementation, please refer to the preceding text and... Figure 6 The execution of the specific content of S63 shown can also be carried out by other appropriate methods (such as using a robotic arm) to move each display chip so that the display surface of each display chip is parallel to the corresponding light-incident surface, and there is a non-zero interval between the display surface of each display chip and the corresponding light-incident surface.

[0182] Step S82: Form an adhesive layer on each incident light surface.

[0183] In specific implementation, please refer to the preceding text and... Figure 6 The specific implementation of S64 shown can also be performed by other appropriate methods (such as other brush coating, spin coating, etc.) to form an adhesive layer on each incident light surface.

[0184] Step S83: Move each display chip individually or simultaneously so that the display surface of each display chip is adhered to the bonding position on the light incident surface by the adhesive layer.

[0185] In specific implementation, please refer to the preceding text and... Figure 6 In addition to the specific execution of S65 shown, other appropriate methods (such as using a robotic arm) can be used to move each display chip individually or simultaneously, so that the display surface of each display chip is adhered to the bonding position on the light-incident surface by the adhesive layer.

[0186] Step S84: While keeping the relative positions of the panel fixture backplate and each display chip fixture unchanged, cure the adhesive layer.

[0187] In specific implementation, please refer to the preceding text and... Figure 6In addition to the specific execution of S66 shown, other appropriate methods can also be used to cure the adhesive layer while keeping the relative positions of the panel fixture backplate and each display chip fixture unchanged.

[0188] It should be understood that the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this document indicates that the preceding and following related objects are in an "or" relationship. As used herein, unless explicitly stated otherwise, the term "or" covers all possible combinations unless impractical. For example, if a component is declared to include A or B, then unless explicitly stated otherwise or impractical, the component can include A, or B, or A and B. As a second example, if a component is declared to include A, B, or C, then unless explicitly stated otherwise or impractical, the component can include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C.

[0189] In the embodiments of this application, "multiple" refers to two or more.

[0190] Relational terms appearing in the embodiments of this application, such as "first," "second," etc., are used only to distinguish an entity or operation from another entity or operation, without requiring or implying any actual relationship or order between these entities or operations. Furthermore, the words "comprising," "having," and "including," as well as other similar forms, are intended to be equivalent in meaning and are open-ended; one or more items following any of these words do not imply an exhaustive list of such items or that they are limited to only the listed items.

[0191] It should be noted that the sequence number of each step in this embodiment does not represent a limitation on the execution order of each step.

[0192] In the foregoing specification, numerous specific details have been described with reference to embodiments, which may vary depending on the implementation. Certain modifications and alterations may be made to the described embodiments. Other embodiments will be apparent to those skilled in the art in light of the specification and practice disclosed herein. The specification and examples are intended to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims. The sequence of steps shown in the accompanying drawings is also intended for illustrative purposes only and is not intended to limit one to any particular sequence of steps. Therefore, those skilled in the art will understand that these steps may be performed in different orders while achieving the same method.

[0193] Exemplary embodiments have been disclosed in the accompanying drawings and description. However, many variations and modifications can be made to these embodiments. Therefore, although specific terminology has been used, it is used in a general and descriptive sense only and not for limiting purposes.

[0194] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A clamp assembly, characterized by The utility model relates to a kind of display chip clamp and prism clamp, including: A prism support base; Prism limiting piece, which is located on the top surface of the prism support base, is used to limit the prism; One or more display chip clamps, each display chip clamp includes: Panel clamp base; Panel clamp backboard, which is movably arranged on the panel clamp base; Panel limiting piece, which is located on the surface of the panel clamp backboard, is used to limit the display chip; Wherein, the prism clamp and each display chip clamp can be relatively moved. The prism limiting piece includes:

2. The clamp assembly of claim 1, wherein, Prism vacuum adsorption component, the adsorption hole of the prism vacuum adsorption component is located on the top surface of the prism support base;And / or, A pair of prism clamping knobs are located on the top surface of the prism support base; Wherein, each pair of prism clamping knobs is oppositely arranged, and can be moved together or dispersed in opposite directions. The top surface of the prism support base includes a first central region and a first edge region, and the first edge region surrounds the first central region; 3. The clamp assembly of claim 2, wherein, The adsorption hole of the prism vacuum adsorption component is located in the first central region;And / or, the prism clamping knob is located in the first edge region. The panel limiting piece includes:

4. The clamp assembly of claim 1, wherein, Panel vacuum adsorption component, the adsorption hole of the panel vacuum adsorption component is located on the surface of the panel clamp backboard;And / or, A pair of panel clamping knobs are located on the surface of the panel clamp backboard; Wherein, each pair of panel clamping knobs is oppositely arranged, and can be moved together or dispersed in opposite directions. The surface of the panel clamp backboard includes a second central region and a second edge region, and the second edge region surrounds the second central region; 5. The clamp assembly of claim 4, wherein, The adsorption hole of the panel vacuum adsorption component is located in the second central region;And / or, the panel clamping knob is located in the second edge region. The display chip is a micro-LED display chip, and the micro-LED display chip includes a substrate and a micro-LED array.

6. The clamp assembly of claim 1 or 4, wherein, The thickness of the panel clamping knob is less than or equal to the thickness of the substrate.

7. The clamp assembly of claim 6, wherein, The panel clamp backboard includes a heating module for heating the display chip through the surface of the panel clamp backboard.

8. The clamp assembly of claim 1, wherein, Each display chip clamp further includes:

9. The clamp assembly of claim 1, wherein, XYZ-axis moving piece, one end of the XYZ-axis moving piece is connected with the panel clamp base, and the other end of the XYZ-axis moving piece is connected with the panel clamp backboard; Wherein, the XYZ-axis moving piece can drive the panel clamp backboard to move relative to the panel clamp base along the X-axis, Y-axis and Z-axis directions of the panel clamp base, respectively. Each display chip clamp further includes:

10. The clamp assembly of claim 9, wherein, XYZ-axis rotating piece, which can rotate the panel clamp backboard around the X-axis, Y-axis and Z-axis of the panel clamp backboard, respectively.

11. The clamp assembly of claim 10, wherein: The Z-axis of the panel clamp backboard is perpendicular to the direction of the panel clamp backboard;And / or, the Z-axis of the panel clamp backboard passes through the center point of the panel clamp backboard. ​ 12. The clamp assembly of claim 1, wherein, An area of a top surface of the prism supporting base is less than or equal to an area of the light-tight surface of the color-combining prism.

13. The clamp assembly of claim 1, wherein, The number of the display chip clamps is three, and the three display chip clamps clamp red light display chips, green light display chips and blue light display chips respectively. The color-combining prism clamp and the three display chip clamps are relatively movable, so that the three light-in surfaces of the color-combining prism and the display surfaces of the corresponding display chips can be relatively positioned, and the light-in surfaces of the color-combining prism and the display surfaces of the corresponding display chips can be attached by moving the back plate of the panel clamp.

14. The clamp assembly of claim 1, wherein, The color-combining prism further comprises: The color-combining prism comprises: A prism body comprising a light-transmitting surface and at least one light-tight surface, the light-transmitting surface comprising a light-out surface and at least one light-in surface; A protruding part located on the light-tight surface and fixedly connected with the prism body; The prism limiting part limits the color-combining prism through the protruding part.

15. The clamp assembly of claim 14, wherein, The protruding part satisfies one or more of the following conditions: The protruding part and the prism body are integrally formed; The protruding part and the prism body are fixedly connected by pasting; The protruding part and the prism body are fixedly connected by adsorption.

16. The clamp assembly of claim 14, wherein, The protruding part is a cuboid.

17. The clamp assembly of claim 14, wherein, The prism limiting part comprises a pair of prism clamping knobs located on the top surface of the prism supporting base, wherein each pair of prism clamping knobs is oppositely arranged and can move along the extension direction of the opposite direction. The thickness of the protruding part is greater than or equal to the thickness of the prism clamping knob.

18. The clamp assembly of claim 14, wherein, The prism limiting part comprises a pair of prism clamping knobs located on the top surface of the prism supporting base, wherein each pair of prism clamping knobs is oppositely arranged and can move along the extension direction of the opposite direction. In the opposite direction of each pair of prism clamping knobs, the following formula is satisfied: L≥D1+D2+K; Wherein L represents the length of the top surface of the prism supporting base, D1 represents the width of one of the pair of prism clamping knobs, D2 represents the width of the other of the pair of prism clamping knobs, and K represents the length of the longest side of the protruding part of the color-combining prism.

19. A color combining prism characterized in that, The color-combining prism further comprises: A prism body comprising a light-transmitting surface and at least one light-tight surface, the light-transmitting surface comprising a light-out surface and at least one light-in surface; A protruding part located on the light-tight surface and fixedly connected with the prism body; The prism limiting part limits the color-combining prism through the protruding part.

20. The co-prism of claim 19, wherein, The protruding part satisfies one or more of the following conditions: The protruding part and the prism body are integrally formed; The protruding part and the prism body are fixedly connected by pasting; The protruding part and the prism body are fixedly connected by adsorption.

21. The co-prism of claim 19, wherein, The protruding part is a cuboid.

22. A method of using a clamp assembly according to any one of claims 1 to 18, characterised in that, The method comprises: The color-combining prism is detachably fixed by the prism limiting part, and the display chip is detachably fixed by the panel limiting part. moving each panel jig base according to the fitting position of the display surface of each display chip on the corresponding light-incident surface of the color-combining prism, so that the display surface of each display chip is opposite to the corresponding light-incident surface; moving each panel jig backboard respectively, so that the display surface of each display chip is opposite to the corresponding light-incident surface in parallel, and there is a non-zero interval between the display surface of each display chip and the corresponding light-incident surface; forming a glue layer on each light-incident surface; moving each display chip jig respectively or simultaneously, so that the display surface of each display chip is pasted on the fitting position on the light-incident surface through the glue layer; solidifying the glue layer while keeping the relative positions of the panel jig backboard and each display chip jig unchanged.

23. The method of claim 22, wherein, The solidifying the glue layer comprises: solidifying the glue layer by ultraviolet irradiation and / or low-temperature baking.

24. The method of claim 22, wherein, The method further comprises: moving the prism limiting member away from the color-combining prism, and moving the panel limiting member away from the display chip.

25. The method of claim 22, wherein, moving each panel jig base according to the fitting position of the display surface of each display chip on the corresponding light-incident surface of the color-combining prism, so that the display surface of each display chip is opposite to the corresponding light-incident surface; moving the panel jig base of the first display chip, so that the display surface of the first display chip is opposite to the corresponding light-incident surface; moving the panel jig backboard of the first display chip, so that the display surface of the first display chip is fitted on the corresponding light-incident surface; lighting up the first display chip to project a first alignment mark image; determining the fitting position of the display surface of each other display chip on the corresponding light-incident surface according to the coordinates of the first alignment mark image; moving the panel jig base and / or the panel jig backboard of each other display chip, so that the display surface of each display chip is opposite to the corresponding light-incident surface. 26.A method for assembling a micro LED display chip and a color combiner, the method comprising: The method comprises: moving each display chip respectively, so that the display surface of each display chip is opposite to the corresponding light-incident surface in parallel, and there is a non-zero interval between the display surface of each display chip and the corresponding light-incident surface; forming a glue layer on each light-incident surface; moving each display chip respectively or simultaneously, so that the display surface of each display chip is pasted on the fitting position on the light-incident surface through the glue layer; solidifying the glue layer while keeping the relative positions of the panel jig backboard and each display chip jig unchanged.

27. The method of claim 26, wherein, The solidifying the glue layer comprises: solidifying the glue layer by ultraviolet irradiation and / or low-temperature baking.

28. The method of claim 26, wherein, The moving each display chip respectively comprises: moving the first display chip, so that the display surface of the first display chip is opposite to the corresponding light-incident surface; moving the first display chip, so that the display surface of the first display chip is fitted on the corresponding light-incident surface; lighting up the first display chip to project a first alignment mark image; determining the fitting position of the display surface of each other display chip on the corresponding light-incident surface according to the coordinates of the first alignment mark image; moving each other display chip, so that the display surface of each display chip is opposite to the corresponding light-incident surface.

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