Inductance device and manufacturing method thereof, inductance device assembly and electronic equipment

Abstract

The invention relates to an inductance device and a manufacturing method thereof, an inductance device assembly and electronic equipment. The inductance device comprises a main body which is of a magnetic structure; the coil structure is arranged in the main body, the coil structure comprises multiple electrode coil layers, the multiple electrode coil layers are sequentially stacked in the first direction, and the adjacent electrode coil layers are electrically connected with each other; and the connecting hanging lug is arranged in the main body, the connecting hanging lug is connected to the coil structure, the connecting end, deviating from the coil structure, of the connecting hanging lug is exposed out of the side surface of the main body, and the connecting end is configured to be correspondingly connected with the connecting ends of the connecting hanging lugs of other inductor devices. According to the inductance device, the manufacturing method thereof, the inductance device assembly and the electronic equipment, the electrical performance of the inductance device can be improved.

Description

Technical Field

[0001] This application relates to the field of inductor technology, and in particular to an inductor device and its manufacturing method, an inductor device assembly and an electronic device. Background Technology

[0002] An inductor (also known as a choke, reactor, or dynamic reactor) is a component that converts electrical energy into magnetic energy and stores it. It is commonly used in power circuits or electronic devices. Thin-film power inductors, a common type of power inductor, are generally fabricated using the FPC (Flexible Printed Circuit) process. Specifically, the fabrication process involves first forming single-piece samples containing multiple coil metals. These single-piece samples are then stacked together, and the areas not covered by the coil metal on each sample are removed using a laser, forming multiple coil structures. These multiple coil structures are then pressed together into a single plate structure using a magnetic material. Finally, the plate structure is diced according to a predetermined path to form a single inductor device. However, single-piece inductor devices fabricated using this method are prone to poor electrical performance. Summary of the Invention

[0003] The purpose of this application is to provide an inductor device and its manufacturing method, an inductor device assembly, and an electronic device, which can improve the electrical performance of the inductor device.

[0004] To achieve the above objectives, in a first aspect, this application provides an inductor device, comprising: The main body is a magnetic structure; A coil structure, disposed within a main body, comprises multiple layers of electrode coils, which are stacked sequentially along a first direction, and adjacent electrode coil layers are electrically connected to each other; and A connecting lug is provided in the main body. The connecting lug is connected to the coil structure, and the connecting end of the connecting lug that is away from the coil structure is exposed on the side surface of the main body. The connecting end is configured to be able to connect to the connecting end of the connecting lug of other inductor devices.

[0005] As an optional implementation, the connecting lug is constructed as a strip-shaped structure.

[0006] As an alternative implementation, the connecting lug extends along the second direction; or the extending direction of the connecting lug forms an acute angle with the second direction. The second direction is perpendicular to the first direction.

[0007] As an optional implementation, the connecting ear is connected to at least one electrode coil layer, and the connecting ear and the corresponding electrode coil layer are located on the same layer along the first direction.

[0008] As an optional implementation, the single-layer electrode coil layer includes multiple structural layers, which are stacked sequentially along a first direction; The connecting lug is connected to at least one electrode coil layer, and the connecting lug is configured to connect to at least a portion of the structural layer in the correspondingly connected electrode coil layer.

[0009] As an optional implementation, the multiple structural layers of the single-layer electrode coil layer include a dielectric layer and two conductive layers. The two conductive layers are disposed on opposite sides of the dielectric layer along a first direction and are electrically connected to each other. The connecting lug is connected to at least one of the dielectric layer and the two conductive layers in the corresponding electrode coil layer.

[0010] As an optional implementation, the connecting loop includes a single functional layer, which is connected to the dielectric layer of the corresponding electrode coil layer.

[0011] As an optional implementation, the thickness of the connecting lug along the first direction is greater than or equal to 12.5 micrometers.

[0012] As an optional implementation, there are multiple connecting ears, and at least one connecting ear is connected to each side of the coil structure along the second direction, which is perpendicular to the first direction. The connecting lug includes two functional layers stacked on top of each other along a first direction, and the two functional layers are respectively connected to the dielectric layer and the conductive layer of the corresponding electrode coil layer.

[0013] As an optional implementation, the conductive layers located on two opposite side surfaces of the dielectric layer along the first direction are defined as a first conductive layer and a second conductive layer, respectively. The connecting lugs located on opposite sides of the same electrode coil layer along the second direction are both connected to the dielectric layer and the first conductive layer, or both are connected to the dielectric layer and the second conductive layer; or One of the connecting lugs located on opposite sides of the electrode coil layer along the second direction is connected to the dielectric layer and the first conductive layer, and the other is connected to the dielectric layer and the second conductive layer.

[0014] As an optional implementation, the connecting ear includes three functional layers stacked sequentially along a first direction, and the three functional layers are respectively connected to the dielectric layer of the corresponding single-layer electrode coil layer and two conductive layers.

[0015] As an optional implementation, the multiple structural layers include a dielectric layer and two conductive layers. The two conductive layers are disposed on opposite sides of the dielectric layer along a first direction, and the opposing conductive layers of adjacent electrode coil layers are electrically connected through a solder layer. Connect the connecting ear to the two electrode coil layers, and define the two electrode coil layers as the first electrode coil layer and the second electrode coil layer, respectively. The connecting lug includes five functional layers stacked on top of each other along a first direction. The five functional layers are integrally formed with the dielectric layer of the first electrode coil layer, the dielectric layer of the second electrode coil layer, two conductive layers located between the dielectric layers of the first electrode coil layer and the second electrode coil layer, and a solder layer.

[0016] As an optional implementation, there are multiple connecting ears, and at least one connecting ear is connected to each of the opposite sides of the coil structure along the second direction, which is perpendicular to the first direction.

[0017] As an optional implementation, the projections of the connecting lugs located on the same side of the coil structure along the second direction along the first direction overlap each other; and / or The connecting lugs located on opposite sides of the coil structure along the second direction are aligned with or staggered from each other along the first direction; and / or; The connecting lugs located on opposite sides of the coil structure along the second direction are aligned along the third direction; wherein the second direction and the third direction are perpendicular to the first direction.

[0018] As an optional implementation, the inductor also includes two external electrodes, which are disposed on opposite sides of the body along a third direction. The two electrode coil layers located at the top and bottom of the first direction are provided with lead-out structures; one lead-out structure extends to one side of the third direction to connect with one of the external electrodes, and the other lead-out structure extends to the other side of the third direction to connect with another external electrode, wherein the second direction and the third direction are perpendicular to the first direction.

[0019] As an optional implementation, at least one electrode coil layer located at the top and bottom of the first direction is connected with a connecting lug.

[0020] As an optional implementation, the electrode coil layer includes a dielectric layer and two conductive layers. The dielectric layer has through-hole metal, and the two conductive layers are disposed on opposite sides of the dielectric layer along a first direction. The conductive layers include sub-coil segments circumferentially wound around the coil structure, and the sub-coil segments include a first end and a second end. In the two conductive layers, the second end of one conductive layer is electrically connected to the first end of the other conductive layer through a through-hole metal connection.

[0021] As an optional implementation, the first end and the second end are located on one side of the coil structure along the second direction; the connecting lug located on the same side as the first end and the second end is connected to the first end or the second end.

[0022] As an optional implementation, the metal with the through hole corresponding to the first end of the connecting lug is located at the junction of the first end and the metal with the through hole; or The metal with the through hole corresponding to the second end of the connecting lug is located at the junction of the second end and the metal with the through hole.

[0023] As an optional implementation, the end face of the connector is constructed as a cross-section, and the end face of the connector is flush with the side surface of the main body.

[0024] Secondly, this application also discloses an inductor device assembly, comprising: an inductor device, wherein the inductor device is the aforementioned inductor device; The main bodies of at least two inductors are integrally formed, and the connecting lugs of at least some adjacent inductors are connected in a one-to-one correspondence.

[0025] As an optional implementation, in each coil structure, the two electrode coil layers located at the top and bottom in the first direction are provided with lead-out structures, which are used to electrically connect with the external electrodes of the inductor. The inductors are arranged in an array, with both the row and column directions of the array perpendicular to the first direction. In the inductors located in the same column, the connecting lugs of adjacent inductors are connected one-to-one; In the inductors located in the same row, adjacent inductors are connected in pairs through lead-out structures.

[0026] Thirdly, this application also discloses an electronic device including the aforementioned inductor.

[0027] Fourthly, this application also discloses a method for manufacturing an inductor, comprising: An intermediate structure is provided, which includes multiple coil structures and multiple connecting lugs. The coil structure includes multiple layers of electrode coils stacked on top of each other. Each coil structure is provided with at least one connecting lug. At least some of the coil structures are connected to each other as a whole through the corresponding connecting lugs. The intermediate structure is pressed together using magnetic materials to press the coil structure and connecting lugs into a magnetic body formed by the magnetic materials. A magnetic material is divided to form a single inductor device. The inductor device includes a body, a coil structure and a corresponding connecting lug inside the body, and the connecting end of the connecting lug facing away from the corresponding coil structure is exposed on the side surface of the body.

[0028] As an optional implementation, the step of providing an intermediate structure specifically includes: Multiple monolithic structures are formed, each monolithic structure including a dielectric material layer. Both surfaces of the dielectric material layer in the thickness direction are provided with several conductive layers and a frame metal. Some monolithic structures are provided with lead-out structures. The dielectric material layer includes a metal-covered area covered by the conductive layers and the frame metal. The dielectric material layer of some monolithic structures also includes at least one of a latch forming area and a lead-out structure forming area. The latch forming area is the region on the dielectric material layer where a connecting latch will be formed, and the lead-out structure forming area is the region on the dielectric material layer where a lead-out structure will be formed. The lead-out structure is used for electrical connection with the external electrodes of the inductor. In sequence, the regions in the first region of each dielectric material layer, except for the ear forming region and the lead-out structure forming region of that dielectric material layer, are removed through. The first region is the region that is directly opposite to the ear forming region and the lead-out structure forming region in all dielectric material layers when multiple monolithic structures are stacked together along the first direction. Multiple monolithic structures are stacked on top of each other along a first direction, and the corresponding conductive layers of adjacent monolithic structures are welded together. The second region of each dielectric material layer is removed through to form a connecting lug and coil structure. The second region is the region in the dielectric material layer other than the first region and the metal covering region.

[0029] As an optional implementation, the loop forming area and the lead-out structure forming area are each covered with loop metal and lead-out structure; or The ear-forming area is composed of a dielectric material layer, and the lead-out structure forming area is covered with the lead-out structure.

[0030] As an optional implementation, in the step of dividing the magnetic material to form a single inductor device: The division is performed according to the preset slicing lines, wherein multiple coil structures are arranged in an array, and each connecting lug extends along the column direction of the array arrangement. The slicing lines include multiple first slicing lines and multiple second slicing lines. The first cleaving line extends along the column direction of the array arrangement, and multiple first cleaving lines are located between two adjacent columns of coil structures; The second cleaving line extends along the row direction of the array arrangement, and multiple second cleaving lines are located between two adjacent rows of coil structures to separate the corresponding connecting lugs of adjacent coil structures.

[0031] Compared with the prior art, the beneficial effects of this application are: In this application, by setting a connecting lug in the main body, the connecting lug is connected to the coil structure. For the coil structure, because there is a connecting lug, the connecting lug can play a certain role in strengthening the coil structure. During the coil structure pressing process, it can improve the stability of the coil structure, thereby avoiding the coil structure from shaking or tilting to a certain extent.

[0032] Furthermore, the connecting lugs include connecting ends configured to connect with the connecting ends of other inductor devices. This allows adjacent coil structures to be connected as a whole through the connection of these connecting ends. When multiple coil structures are pressed together, the interconnected connecting lugs support adjacent coil structures, significantly improving the stability of the coil structure array and preventing wobbling or skewing during pressing. Ultimately, this ensures that the coil structure in a single, diced inductor device remains skewing, guaranteeing optimal electrical performance such as inductance, saturation current, and temperature rise current.

[0033] On the other hand, since the coil structure array has good support stability during the pressing process, the magnetic material is pressed more thoroughly and tightly. Therefore, the cutting rate can be increased during the cutting process, which can improve the flatness of the cut surface after cutting and ensure that the final inductor has high dimensional accuracy. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of the inductor provided in the embodiments of this application; Figure 2 yes Figure 1 A top-down view; Figure 3 yes Figure 2 A cross-sectional view along section AA. Figure 4 This is a top view of the inductor device provided in the embodiments of this application; Figure 5 yes Figure 2 A cross-sectional view along section BB. Figure 6 This is a cross-sectional schematic diagram of another structure of the inductor device provided in the embodiments of this application; Figure 7 This is a cross-sectional schematic diagram of another structure of the inductor device provided in the embodiments of this application; Figure 8 This is a cross-sectional schematic diagram of another structure of the inductor device provided in the embodiments of this application; Figure 9 This is a cross-sectional schematic diagram of another structure of the inductor device provided in the embodiments of this application; Figure 10 This is a cross-sectional schematic diagram of another structure of the inductor device provided in the embodiments of this application; Figure 11 This is a schematic diagram of the structure of a single conductive layer of an inductor device provided in this application embodiment, which is in a connected state with adjacent inductor devices before being cut into the final product; Figure 12 This is a schematic diagram of another structure of a single conductive layer of an inductor device provided in this application embodiment, which is in a connected state with an adjacent inductor device before being cut into a final product; Figure 13 This is a schematic diagram of the structure of the inductor device assembly provided in the embodiments of this application; Figure 14 This is a schematic flowchart of the method for manufacturing an inductor device provided in an embodiment of this application; Figure 15 This is a schematic diagram of the intermediate structure in the method for manufacturing an inductor provided in the embodiments of this application; Figure 16 This is a schematic diagram of the structure in the method for manufacturing an inductor device provided in the embodiments of this application, in which multiple monolithic structures are stacked together. Figure 17 This is a schematic diagram of the topmost monolithic structure in the method for manufacturing an inductor provided in this application embodiment; Figure 18 This is a schematic diagram of the structure in which the various coil structures are connected as a whole in the manufacturing method of the inductor device provided in the embodiments of this application.

[0036] Explanation of reference numerals in the attached figures: 100. Inductor; 10. Main body; 20. Coil structure; 30. Electrode coil layer; 300. Structural layer; 301. First electrode coil layer; 302. Second electrode coil layer; 31. Dielectric layer; 32. Conductive layer; 320. Sub-coil segment; 3201. First end; 3202. Second end; 321. First conductive layer; 322. Second conductive layer; 33. Solder layer; 40. External electrode; 50. Connecting lug; 500. Functional layer; 51. Connecting end; 52. Lug metal; 60. Lead-out structure ; 61, First lead-out structure; 62, Second lead-out structure; 70, Through-hole metal; 80, Intermediate structure; 81, Frame metal; 810, Frame body; 811, Calibration metal; 90, Monolithic structure; 91, Dielectric material layer; 910, First region; 911, Lug forming region; 912, Lead-out structure forming region; 913, Metal covering region; 200, Inductor device assembly; 201, Structure; F, First direction; S, Second direction; T, Third direction; H1, First cleaved line; H2, Second cleaved line. Detailed Implementation

[0037] The following description, in conjunction with the accompanying drawings, will illustrate the inductor device, its fabrication method, inductor device assembly, and electronic equipment of this application.

[0038] Figure 1 This is a schematic diagram of the structure of the inductor 100 provided in the embodiments of this application. Figure 2 yes Figure 1 A top-down view. Please refer to the diagram. Figure 1 and Figure 2 It is important to note that, in Figure 1 , Figure 2 In this process, the main body 10 is made transparent to facilitate observation of the specific details of the coil structure 20 inside the main body 10.

[0039] This application provides an inductor 100, which includes a main body 10, a coil structure 20, and a connecting lug 50.

[0040] The main body 10 has a magnetic structure. A coil structure 20 is disposed within the main body 10. The coil structure 20 includes multiple layers of electrode coils 30, which are stacked sequentially along a first direction F, and adjacent electrode coil layers 30 are electrically connected to each other. A connecting lug 50 is disposed within the main body 10 and connected to the coil structure 20. The connecting end 51 of the connecting lug 50, facing away from the coil structure 20, protrudes from the side surface of the main body 10. The connecting end 51 is configured to connect correspondingly to the connecting end 51 of the connecting lug 50 of other inductor devices 100.

[0041] In this application, by providing a connecting lug 50 in the main body 10, and connecting the connecting lug 50 to the coil structure 20, the coil structure 20 is strengthened by the connecting lug 50. During the pressing process of the coil structure 20, the stability of the coil structure 20 is improved, thereby preventing the coil structure 20 from shaking or tilting to a certain extent. Furthermore, due to the setting of the connecting lug 50, identifiable structural retention features can be formed in a single inductor device 100, which can prevent duplication.

[0042] Furthermore, the connecting lug 50 includes a connecting end 51, which is configured to connect to the connecting ends 51 of other connecting lugs 50 of inductor devices 100. This allows adjacent coil structures 20 to be connected as a whole through the connection of connecting ends 51. When multiple coil structures 20 are pressed together, the interconnected connecting lugs 50 can support adjacent coil structures 20, significantly improving the support stability of the coil structure 20 array and preventing wobbling or skewing of the coil structures 20 during pressing. Ultimately, this ensures that the coil structures 20 in the cut single inductor device 100 do not skew. This guarantees better electrical performance of the inductor device 100, including inductance, saturation current, and temperature rise current.

[0043] On the other hand, since the coil structure 20 array has good support stability during the pressing process, the magnetic material is pressed more thoroughly and tightly. Therefore, the cutting rate can be increased during the cutting process, which can improve the flatness of the cut surface after cutting and ensure that the final inductor device 100 has high dimensional accuracy.

[0044] In this application, for ease of explanation, a first direction F, a second direction S, and a third direction T that are mutually perpendicular are defined in the inductor device 100. The first direction F can be, for example, the height direction of the inductor device 100, and the third direction T can be, for example, the relative direction of the two external electrodes 40 in the inductor device 100. It is understood that the mutual perpendicularity defined here means that the first direction F, the second direction S, and the third direction T are approximately mutually perpendicular. In actual manufacturing processes, due to process deviations and other reasons, a small angular offset of the first direction F, the second direction S, and the third direction T is allowed, for example, an offset of about ±5°.

[0045] The main body 10 is a structure formed by pressing together magnetic powder or magnetic slurry. The iron content in the main body 10 needs to be greater than or equal to 85% to give it high magnetic permeability. The coil structure 20, comprising multiple electrode coil layers 30 stacked sequentially along the first direction F, means that the multiple electrode coil layers 30 are stacked together as a whole along the first direction F. After adjacent electrode coil layers 30 are electrically connected to each other, all the electrode coil layers 30 can be constructed as a coil structure 20 extending in the first direction F. The electrical connection between adjacent electrode coil layers 30 can be achieved, for example, by welding or through through-hole metal 70.

[0046] The connection lug 50 is connected to the coil structure 20, meaning that the end of the connection lug 50 is in direct contact and connected to the coil structure 20. For example, the connection lug 50 can be connected to the circumferential outer surface of the coil structure 20, and the connection position can be any position along the first direction F of the coil structure 20. The connection end 51 of the connection lug 50 facing away from the coil structure 20 is exposed on the side surface of the body 10. The side surface refers to the circumferential side of the outer surface of the body 10 surrounding the coil structure 20. In specific implementation, for example, one end of the two ends of the connection lug 50 can be connected to the coil structure 20, and the other end can be exposed to the outside of the side surface of the body 10. The fact that the connection end 51 of the connection lug 50 is exposed to the outside of the side surface of the body 10 is actually due to the structure formed when the connection end 51 is connected to the connection end 51 of other inductor devices 100. Before being separated from each other, the two inductor devices 100 are formed into a whole structure by the connection of their connection lugs 50.

[0047] Furthermore, the end face of the connecting end 51 can be constructed as a cut surface. Thus, the end face of the connecting end 51 is actually a cut surface formed by cutting during the final dicing process. That is, the dicing path passes through the connection positions of the two corresponding connecting lugs 50, thereby separating the two connected connecting lugs 50. In the final inductor device 100, one end of the connecting lug 50 is connected to the coil structure 20, while the other end extends to the side surface of the main body 10, remaining suspended and not participating in the electrical connection of the coil structure 20, thus not affecting the electrical performance of the coil structure 20. The end face of the connecting end 51 is flush with the side surface of the main body 10, making the appearance of the inductor device 100 more aesthetically pleasing and forming a recognizable structural feature.

[0048] In this embodiment, the structure of the connecting lug 50 can be configured according to actual needs, as long as the connecting end 51 can protrude from the surface of the main body 10. For example, the connecting lug 50 can be constructed as a strip structure, such as a strip structure extending from the corresponding electrode coil layer 30 in a direction away from the main body 10. This configuration facilitates the etching process and also occupies less space within the main body 10. Preferably, the connecting lug 50 extends along a direction perpendicular to the first direction F, which allows for the connection of two adjacent inductor devices 100 while minimizing the length of the connecting lug 50. To facilitate the connection of the connecting lugs 50 of two adjacent inductor devices 100, the connecting lugs 50 of two adjacent inductor devices 100 can be arranged correspondingly, and the connecting ends 51 of the two connecting lugs 50 can be positioned so that the two connecting ends 51 can be connected to each other.

[0049] exist Figure 1 and Figure 2In the example, the connecting lug 50 is formed as a strip structure extending along the second direction S. However, this application is not limited to this. The extension direction of the connecting lug 50 may also have an acute angle with the second direction S. For example, the extension direction of the connecting lug 50 may be located in the plane containing the second direction S and the third direction T, and has an acute angle with the second direction S. Or, the extension direction of the connecting lug 50 may be located in the plane containing the first direction F and the second direction S, and has an acute angle with the second direction S, etc.

[0050] The structural shape of the connecting lug 50 is not limited to a strip shape. In some other embodiments, the extension trend of the connecting lug 50 can be curved, such as an arc, a wave, or other irregular shapes. The posture within the main body 10 can be set according to actual needs, as long as the connecting ends 51 of the connecting lugs 50 of adjacent inductor devices 100 can be connected to each other.

[0051] In this embodiment, the connecting lug 50 can be connected to at least one electrode coil layer 30 and is located on the same layer as the corresponding electrode coil layer 30 along the first direction F. This allows the connecting lug 50 to have the shortest length along the direction perpendicular to the first direction F, reducing the space occupied by the connecting lug 50. Here, the connecting lug 50 can be connected to one, two, or more electrode coil layers 30, but this application is not limited to this. The number of electrode coil layers 30 to which the connecting lug 50 is connected can be set according to actual needs.

[0052] Furthermore, in the embodiments of this application, the inductor 100 can be a cuboid structure, the height dimension of the inductor 100 along the first direction F can be 1.0 mm, the width dimension of the inductor 100 along the second direction S can be 1.6 mm, and the length dimension of the inductor 100 along the third direction T can be 2.0 mm.

[0053] Figure 3 yes Figure 2 Schematic diagram along section AA. Figure 4 This is a top view of the inductor 100 provided in an embodiment of this application. Figure 5 yes Figure 2 A cross-sectional view along section BB is shown above. It should be noted that, for ease of observation, only the coil structure 20 and the connecting lug 50 are shown in cross-section in the above cross-sectional view, while the main body 10 and the external electrode 40 are only indicated by outlines.

[0054] Please see Figure 3 , Figure 4 and Figure 5In this embodiment, the single-layer electrode coil layer 30 may include multiple structural layers 300, which are stacked sequentially along a first direction F. A connecting lug 50 is connected to at least one electrode coil layer 30, and the connecting lug 50 is configured to connect to at least a portion of the structural layers 300 in the corresponding electrode coil layer 30. This configuration allows the connecting lug 50 to be integrally formed with the portion of the structural layer 300 it is connected to, meaning the connecting lug 50 can be formed synchronously with the corresponding structural layer 300, thereby saving on the number of processes and reducing costs.

[0055] In a specific implementation, for example, a single-layer electrode coil layer 30 may consist of multiple structural layers 300, including a dielectric layer 31 and two conductive layers 32. The two conductive layers 32 are disposed on opposite sides of the dielectric layer 31 along the first direction F and are electrically connected to each other. The connecting lug 50 is connected to at least one of the dielectric layer 31 and the two conductive layers 32 in the corresponding electrode coil layer 30. Here, the single-layer electrode coil layer 30 may be fabricated using a flexible printed circuit board (FPC). In this case, the dielectric layer 31 may be made of polyimide (PI), and the two conductive layers 32 may be made of copper, for example. The two conductive layers 32 may be electrically connected through a through-hole metal 70, etc.

[0056] The electrode coil layer 30 connected to the connecting lug 50 can be one or more. In the following examples of this application, the case where the number of electrode coil layers 30 connected to a single connecting lug 50 is one or two will be described. In a single-layer electrode coil layer 30, the connecting lug 50 can be connected to at least one of the dielectric layer 31 and the two conductive layers 32. For example, the connecting lug 50 can be connected to the dielectric layer 31, the connecting lug 50 can be connected to the dielectric layer 31 and one of the conductive layers 32, the connecting lug 50 can be connected to both the dielectric layer 31 and the two conductive layers 32 of the same electrode coil layer 30, the connecting lug 50 can be connected to two or more electrode coil layers 30, and so on.

[0057] Next, the various embodiments described above will be explained one by one. It should be noted that the following examples illustrate a case where the number of electrode coil layers 30 in the coil structure 20 is three, and at least one connecting lug 50 is connected to each opposite side of the coil structure 20 along the second direction S. The connecting lugs 50 are located on at least one of the topmost and bottommost electrode coil layers 30 of the inductor device 100, or on the bottom two electrode coil layers 30. The same principle applies to cases where the number of electrode coil layers 30 is different, and the number and position of the connecting lugs 50 are also different, and will not be repeated here. Furthermore, the following examples illustrate a case where the connection method of the connecting lugs 50 in a single inductor device 100 is of a single type. This application is not limited to this; in other examples, the following may also apply. Figures 5-10 Any combination of these methods shown.

[0058] Furthermore, in the following example, if at least one connecting lug 50 is connected to both sides of the coil structure 20 along the second direction S, the connecting lugs 50 located on opposite sides of the same coil structure 20 along the second direction S can be arranged correspondingly to each other, for example, they can be arranged in a mirror image. This facilitates the connection lugs 50 of adjacent inductor devices 100 to be connected to each other.

[0059] For the case of connecting the lug 50 to the dielectric layer 31, please refer to [reference needed]. Figure 5 The connecting lug 50 may include a single-layer functional layer 500, which is connected to the dielectric layer 31 of the corresponding electrode coil layer 30. For example, the functional layer 500 and the dielectric layer 31 of the corresponding electrode coil layer 30 may be integrally formed. In this way, during the formation of the single-layer electrode coil layer 30 using a monolithic FPC, the area in the dielectric layer of the FPC where the connecting lug 50 will be formed can be left unremoved during the laser removal process, thus easily forming the connecting lug 50. The structure of the connecting lug 50 is relatively simple, and the formation process is also relatively easy.

[0060] for Figure 5 The inductor 100 shown has a minimum width of 50 micrometers along the third direction T and a minimum thickness of 6 micrometers along the first direction F. Preferably, the thickness of the connecting lug 50 along the first direction F is greater than or equal to 12.5 micrometers. This ensures sufficient connection strength even if the connecting lug 50 is formed of a single-layer dielectric layer 31.

[0061] In the cross section along the second direction S, the area of ​​the smallest cross section is 300 square micrometers.

[0062] In the case where the connecting lug 50 is connected to the dielectric layer 31 and one of the conductive layers 32, the connecting lug 50 may include two functional layers 500. The two functional layers 500 may be stacked on top of each other along the first direction F. In specific implementation, the two functional layers 500 are respectively connected to the dielectric layer 31 and the conductive layer 32 of the corresponding electrode coil layer 30. For example, the two functional layers 500 may be integrally formed with the dielectric layer 31 and the conductive layer 32 of the corresponding electrode coil layer 30.

[0063] For specific implementation details, please refer to [link / reference]. Figure 6 , Figure 7 and Figure 8 The conductive layers 32 located on the two opposite side surfaces of the dielectric layer 31 along the first direction F can be defined as the first conductive layer 321 and the second conductive layer 322, respectively. In this way, in two adjacent electrode coil layers 30, the first conductive layer 321 of one and the second conductive layer 322 of the other are electrically connected.

[0064] Please see Figure 6 The connecting lugs 50 located on opposite sides of the same electrode coil layer 30 along the second direction S are both connected to (for example, integrally formed on) the dielectric layer 31 and the first conductive layer 321. Thus, for Figure 6 Any of the two functional layers 500 in the connecting lug 50 on the left side of the figure are connected to the dielectric layer 31 and the first conductive layer 321, respectively. Figure 6 The two functional layers 500 in any of the connecting lugs 50 on the right side of the figure are connected to the dielectric layer 31 and the first conductive layer 321, respectively.

[0065] Please see Figure 7 The connecting lugs 50 located on opposite sides of the same electrode coil layer 30 along the second direction S are both connected to (for example, integrally formed on) the dielectric layer 31 and the second conductive layer 322, thus, for Figure 7 On the left side of the diagram, any of the two functional layers 500 in the connecting lug 50 are connected to the dielectric layer 31 and the second conductive layer 322, respectively. Figure 7 The two functional layers 500 in any of the connecting lugs 50 on the right side of the figure are connected to the dielectric layer 31 and the second conductive layer 322, respectively.

[0066] Please see Figure 8 One of the connecting lugs 50 located on opposite sides of the electrode coil layer 30 along the second direction S is connected to (for example, integrally formed on) the dielectric layer 31 and the first conductive layer 321, and the other is connected to the dielectric layer 31 and the second conductive layer 322. Thus, for Figure 8 On the left side of the diagram, any of the two functional layers 500 in the connecting lug 50 are connected to the dielectric layer 31 and the second conductive layer 322, respectively. Figure 8 The two functional layers 500 in any of the connecting lugs 50 on the right side of the figure are respectively connected to the dielectric layer 31 and the first conductive layer 321. That is, the connecting lugs 50 located on opposite sides of the electrode coil layer 30 along the second direction S are respectively connected to different conductive layers 32 of the same electrode coil layer 30.

[0067] for Figure 6 , Figure 7 and Figure 8 The inductor 100 has a minimum width of 25 micrometers along the third direction T, a minimum thickness of 12 micrometers along the first direction F, and a minimum cross-sectional area of ​​300 square micrometers in the cross-section along the second direction S.

[0068] For the case where the connecting lug 50 is connected to both the dielectric layer 31 and the two conductive layers 32, for example, refer to... Figure 9The connecting loop 50 includes three functional layers 500 stacked sequentially along the first direction F. Each of the three functional layers 500 is connected (e.g., integrally formed) to the dielectric layer 31 and two conductive layers 32 of the corresponding single-layer electrode coil layer 30. Specifically, for Figure 9 The three functional layers 500 in any of the connecting lugs 50 on the left side of the diagram are integrally formed with the first conductive layer 321, the dielectric layer 31, and the second conductive layer 322 of the same electrode coil layer 30. For Figure 9 The three functional layers 500 in any of the connecting lugs 50 on the right side of the diagram can also be integrally formed with the first conductive layer 321, the dielectric layer 31 and the second conductive layer 322, respectively.

[0069] For the case where the connecting loop 50 is connected to the two electrode coil layers 30, for example, refer to Figure 10 The opposing conductive layers 32 of adjacent electrode coil layers 30 are electrically connected via a solder layer 33. As previously described, the connecting lug 50 is connected to the two electrode coil layers 30, which are defined as the first electrode coil layer 301 and the second electrode coil layer 302, respectively. Figure 10 In this example, we will use the two adjacent electrode coil layers 30 at the bottom as an example. The case where the connecting lug 50 is connected to other electrode coil layers 30 is similar and will not be described again here.

[0070] The connecting lug 50 includes five functional layers 500 stacked on top of each other along the first direction F. The five functional layers 500 are integrally formed with the dielectric layer 31 of the first electrode coil layer 301, the dielectric layer 31 of the second electrode coil layer 302, two conductive layers 32 located between the dielectric layer 31 of the first electrode coil layer 301 and the dielectric layer 31 of the second electrode coil layer 302, and a solder layer 33.

[0071] Specifically, for Figure 10 The five functional layers 500 in the connecting lug 50 on the left side of the diagram, from bottom to top, are connected to the dielectric layer 31 of the first electrode coil layer 301, the conductive layer 32 of the first electrode coil layer 301 facing the second electrode coil layer 302, the solder layer 33, the conductive layer 32 of the second electrode coil layer facing the first electrode coil layer 301, and the dielectric layer 31 of the second electrode coil layer 302. For Figure 10The five functional layers 500 in the connecting lug 50 on the right side of the figure are connected, from bottom to top, to the dielectric layer 31 of the first electrode coil layer 30, the conductive layer 32 of the first electrode coil layer 301 facing the second electrode coil layer 302, the solder layer 33, the conductive layer 32 of the second electrode coil layer 302 facing the first electrode coil layer 30, and the dielectric layer 31 of the second electrode coil layer 302. By configuring the connecting lug 50 as five interconnected functional layers 500, the connection strength between adjacent coil structures 20 is higher, and the array support for the coil structures 20 is better.

[0072] for Figure 10 The inductor 100 shown has a minimum width of 25 micrometers along the third direction T of the connecting lug 50, a minimum thickness of 26 micrometers along the first direction F, and a minimum cross-sectional area of ​​650 square micrometers in the cross-section along the second direction S.

[0073] In the embodiments of this application, the foregoing examples all illustrate the case where at least one connecting lug 50 is connected to both opposite sides of the coil structure 20 along the second direction S. The number of connecting lugs 50 connected on the same side of the coil structure 20 along the second direction S can be set to two, three, or more as needed. The connection position of the connecting lugs 50 on the same side of the coil structure 20 along the second direction S can be any layer of electrode coil 30.

[0074] Furthermore, please combine Figure 1 and Figure 2 Referring to the diagram, the projections of the connecting lugs 50 located on the same side of the coil structure 20 along the second direction S overlap with each other along the first direction F. With this configuration, when a single-layer electrode coil layer 30 is formed using a single-layer FPC, and multiple single-layer electrode coil layers 30 are stacked to form the inductor device 100, compared to the case where the projections of the connecting lugs 50 on the same side do not overlap along the first direction F, it is possible to uniformly remove common areas without connecting lugs 50 after stacking, resulting in higher removal efficiency and thus cost savings.

[0075] Furthermore, the connecting lugs 50 located on opposite sides of the coil structure 20 along the second direction S are aligned or staggered along the first direction F. If aligned, the connection positions of any two adjacent coil structures 20 are at the same height in the first direction F, facilitating better internal stability during coil structure 20 array pressing. If the connecting lugs 50 located on opposite sides of the coil structure 20 along the second direction S are staggered along the first direction F, the connection positions of two adjacent coil structures 20 in different groups may be at different heights in the first direction F. This results in a greater distribution of the connecting lugs 50 in the first direction F, i.e., the height direction of the coil structure 20, allowing each electrode coil layer 30 in the first direction F to have a stress-dispersing effect, leading to a better pressing effect.

[0076] Figure 11 This is a schematic diagram of the structure of a single conductive layer of an inductor device provided in this application, in which the device is connected to an adjacent inductor device before being cut into the final product. Figure 12 This is a schematic diagram of another structure of the single-layer conductive layer of the inductor provided in this application embodiment, which is in a connected state with the adjacent inductor before being cut into the final product.

[0077] Furthermore, please combine Figure 11 and Figure 12 Referring to the diagram, the connecting lugs 50 located on opposite sides of the coil structure 20 along the second direction S are aligned along the third direction T. This arrangement facilitates the connection of any two adjacent coil structures 20 in the coil structure 20 array at approximately corresponding positions along the third direction T.

[0078] In the embodiments of this application, please refer to Figure 1 , Figure 2 , Figure 4 Referring to the reference, the inductor 100 also includes two external electrodes 40, which are located on opposite sides of the main body 10 along the third direction T. Both the top and bottom electrode coil layers 30 in the first direction F are provided with lead-out structures 60. One lead-out structure 60 extends towards one side of the third direction T to connect with one of the external electrodes 40, and the other lead-out structure 60 extends towards the other side of the third direction T to connect with the other external electrode 40. With this arrangement, since the connecting lugs 50 are located on both sides of the coil structure 20 along the second direction S, and the two external electrodes 40 are located on both sides of the main body 10 along the third direction T, with the second direction S and the third direction T being perpendicular, short circuits caused by contact between the connecting lugs 50 and the external electrodes 40 can be avoided.

[0079] It is understandable that by placing the connecting lugs 50 on opposite sides of the coil structure 20 along the second direction S, and placing the lead-out structures 60 on both sides of the coil structure 20 along the third direction T, in the state before the inductor 100 is cut, for example, as described later... Figure 13 Adjacent coil structures 20 can be connected as a whole along the second direction S by connecting the connecting ends 51. Similarly, adjacent coil structures 20 can be connected as a whole along the third direction T by connecting the lead-out structures 60. Furthermore, the opposing conductive layers 32 of adjacent electrode coil layers 30 are electrically connected by the solder layer 33. Therefore, through the connecting lugs 50, lead-out structures 60, and solder layer 33, each coil structure 20 has excellent connection strength in the first direction F, the second direction S, and the third direction T. When pressing multiple coil structures 20 together, the support stability of the coil structure 20 array can be significantly improved, preventing the coil structures 20 from shaking or tilting during the pressing process.

[0080] When the main body 10 of the inductor device 100 is roughly a cuboid, the second direction S is the width direction of the cuboid, and the third direction T can be, for example, the length direction of the cuboid.

[0081] In this embodiment, at least one of the topmost and bottommost electrode coil layers 30 located in the first direction F is connected to a connecting lug 50. This prevents the electrode coil layers 30 located between the topmost and bottommost electrode coil layers 30 from swaying or tilting.

[0082] In the embodiments of this application, please refer to Figure 3 , Figure 11 and Figure 12 Referring to the above, a through-hole metal 70 is provided through the dielectric layer 31. Two conductive layers 32 are disposed on opposite sides of the dielectric layer 31 along the first direction F. Each conductive layer 32 includes a sub-coil segment 320 circumferentially wound around the coil structure 20. The sub-coil segment 320 includes a first end 3201 and a second end 3202, which are spaced apart from each other. In the two conductive layers 32, the second end 3202 of one conductive layer 32 is electrically connected to the first end 3201 of the other conductive layer 32 through the through-hole metal 70. The sub-coil segment 320 can be wound in a generally rectangular trajectory.

[0083] Furthermore, such as Figure 11 As shown, the first end 3201 and the second end 3202 are located on one side of the coil structure 20 along the second direction S. A connecting lug 50 located on the same side as the first end 3201 and the second end 3202 is connected to the first end 3201 or the second end 3202.

[0084] Furthermore, the through-hole metal 70 corresponding to the first end 3201 connected to the connecting lug 50 is located at the junction of the first end 3201 and the through-hole metal 70. This configuration effectively extends the outer contour of the first end 3201 outwards, compared to a solution without the connecting lug 50. This allows the outer contour of the first end 3201 to have a larger area. With sufficient strength, the cross-sectional area of ​​the through-hole metal 70 can be set larger, thus improving the electrical connection stability of adjacent conductive layers 32, reducing DCR, and improving the quality factor Q. Specifically, the through-hole metal 70 acts as an electrical connection bridge between the two conductive layers 32. A larger cross-sectional area increases the mechanical connection strength between the two conductive layers 32. Furthermore, the increased contact area between the through-hole metal 70 and the two conductive layers 32 increases the "effective conductive area," further enhancing electrical connection stability. On the other hand, when the cross-sectional area of ​​the through-hole metal 70 increases, the resistance at the location of the through-hole metal 70 can be reduced, thereby reducing the DCR and thus reducing the power loss of the inductor, which improves the quality factor.

[0085] In other embodiments, the metal 70 with the through hole corresponding to the second end 3202 of the connecting lug 50 may be located at the junction of the second end 3202 and the through hole metal 70. This configuration can also improve the electrical connection stability of adjacent conductive layers 32, reduce DCR, and improve the quality factor Q. The detailed technical effects are similar to those described above and will not be repeated here.

[0086] Or, it can be like Figure 12 As shown, the first end 3201 and the second end 3202 are located on one side of the coil structure 20 along the third direction T. At this time, the connecting lug 50 can be connected to the metal patterns on both sides of the coil segment 320 along the second direction S.

[0087] Figure 13 This is a schematic diagram of the structure of the inductor device assembly 200 provided in an embodiment of this application. Please refer to... Figure 13 This application also discloses an inductor device assembly 200, which includes the aforementioned inductor device 100.

[0088] It is understood that the inductor assembly 200 having the inductor 100 described above can bring the same or similar beneficial effects as the inductor 100, as can be seen from the description of the foregoing embodiments, which will not be repeated here.

[0089] The inductor assembly 200 provided in this embodiment, after being diced, can be formed into the inductor 100 as described above. Additionally, in Figure 13In the example, the inductor assembly 200 is also provided with a frame metal (not shown), which surrounds the outer side of the setting area of ​​the coil structure 20 and is used to calibrate the cutting position.

[0090] In this embodiment, the inductor assembly 200 is essentially equivalent to integrally forming the main bodies 10 of at least two inductors 100, with at least some adjacent inductors 100 connected one-to-one by their connecting tabs 50. That is, in the inductor assembly 200, the coil structures 20 connected in pairs via the connecting tabs 50 can be partial or complete, for example, in... Figure 13 In the illustrated structure, coil structures 20 located in the same column can be connected to each other through corresponding connecting lugs 50.

[0091] In a specific implementation, the inductors 100 can be arranged in an array, with both the row and column directions perpendicular to the first direction F. Here, the row direction can be, for example, a third direction T, and the column direction can be, for example, a second direction S. Inductors 100 located in the same column are connected one-to-one with their connecting lugs 50. In this way, the coil structures 20 located in the same column can be connected as a whole through the connecting lugs 50. During pressing, at least the degree of wobbling and skewing of the coil structures 20 located in the same column in the second direction S will be reduced.

[0092] Furthermore, among the inductors 100 located in the same row, adjacent inductors 100 are connected in pairs via lead-out structures 60. This allows coil structures 20 located in different columns to also be interconnected. Figure 13 In the example, for the coil structures 20 included in the inductor 100 located in the same row, any two adjacent coil structures 20 are connected by the lead-out structure 60.

[0093] by Figure 13 Taking the three adjacent coil structures 20 from the left in the last row of the diagram as an example, in coil structure 20, the lead-out structure 60 of the topmost electrode coil layer 30 is defined as the first lead-out structure 61, and the lead-out structure 60 of the bottommost electrode coil layer 30 is defined as the second lead-out structure 62. For example, for... Figure 13In the last row, for the first coil structure 20 and the second coil structure 20 from the left, the topmost first lead-out structure 61 of the first coil structure 20 is not connected to the first lead-out structure 61 of other coil structures 20, and the bottommost second lead-out structure 62 of the first coil structure 20 is connected to the second lead-out structure 62 of the adjacent second coil structure 20 (e.g., formed as one piece). For the second coil structure 20 and the third coil structure 20 from the left, the first lead-out structure 61 of the second coil structure 20 is connected to the first lead-out structure 61 of the third coil structure 20, and the second lead-out structure 62 of the third coil structure 20 is connected to the second lead-out structure 62 of the fourth coil structure 20, and so on. Two adjacent coil structures 20 in the same row are connected to each other through lead-out structures 60, so that several coil structures 20 in the same row can be connected to each other in a string. For the entire coil structure 20 array, coil structures 20 located in the same row are connected to each other through lead-out structures 60, and coil structures 20 located in the same column are connected to each other through connecting lugs 50. In this way, the entire coil structure 20 can be formed into a grid-like connected whole. In addition, within each coil structure 20, the opposing conductive layers 32 of adjacent electrode coil layers 30 are electrically connected through soldering layers 33. Thus, through connecting lugs 50, lead-out structures 60, and soldering layers 33, each coil structure 20 has better stability in the first direction F, the second direction S, and the third direction T.

[0094] Furthermore, this application also discloses an electronic device including the aforementioned inductor 100. It is understood that an electronic device having the foregoing inductor 100 can bring the same or similar beneficial effects as the inductor 100, as specifically described in the foregoing embodiments, which will not be repeated here.

[0095] Figure 14 This is a schematic flowchart illustrating the fabrication method of the inductor device provided in the embodiments of this application. Figure 15 This is a schematic diagram of the intermediate structure 80 in the method for manufacturing an inductor provided in the embodiments of this application.

[0096] Please combine Figure 14 , Figure 15 Referring to the embodiments of this application, a method for manufacturing an inductor device is also provided, which can be used to manufacture the aforementioned inductor device 100. The method includes: S10. An intermediate structure 80 is provided, which includes multiple coil structures 20 and multiple connecting lugs 50. The coil structure 20 includes multiple layers of electrode coil layers 30 stacked on top of each other. Each coil structure 20 is provided with at least one connecting lug 50. At least some of the coil structures 20 are connected to each other as a whole through the corresponding connecting lugs 50.

[0097] S11. The intermediate structure 80 is pressed together using a magnetic material to press the coil structure 20 and the connecting lug 50 into a magnetic body formed by the magnetic material.

[0098] S12. The magnetic material is divided to form a single inductor device 100, wherein the inductor device 100 includes a main body 10, a coil structure 20 and a corresponding connecting lug 50 are provided in the main body 10, and the connecting end 51 of the connecting lug 50 facing away from the corresponding coil structure 20 is exposed on the side surface of the main body 10.

[0099] In this application, each of the multiple coil structures 20 in the intermediate structure 80 is provided with at least one connecting lug 50. At least some of the coil structures 20 are connected to each other as a whole through the corresponding connecting lug 50. For a single coil structure 20, because it is connected with the connecting lug 50, the connecting lug 50 can play a certain role in strengthening the coil structure 20. During the pressing process of the coil structure 20, it can improve the stability of the coil structure 20, thereby avoiding the coil structure 20 from shaking or tilting to a certain extent.

[0100] Furthermore, at least some of the coil structures 20 are connected to each other as a whole through corresponding connecting lugs 50. Thus, adjacent coil structures 20 within this portion of the coil structure 20 can be connected as a whole through the connecting lugs 50. When multiple coil structures 20 are pressed together, the interconnected connecting lugs 50 can support adjacent coil structures 20, significantly improving the support stability of the coil structure 20 array and preventing wobbling or skewing of the coil structures 20 during the pressing process. Ultimately, this ensures that the coil structures 20 in the cut single inductor device 100 will not be skewed. This guarantees better electrical performance of the inductor device 100, including inductance, saturation current, and temperature rise current.

[0101] On the other hand, since the coil structure 20 array has good support stability during the pressing process, the magnetic material is pressed more thoroughly and tightly. Therefore, the cutting rate can be increased during the cutting process, which can improve the flatness of the cut surface after cutting and ensure that the final inductor device 100 has high dimensional accuracy.

[0102] In this embodiment, as described above, the connecting end 51 of the connecting lug 50, which is opposite to the corresponding coil structure 20, is exposed on the side surface of the main body 10. The end face of the connecting end 51 is actually a cut surface formed by cutting during the final dicing process. That is, the dicing path passes through the connecting lug 50, thereby separating the two connected connecting lugs 50. In the final inductor device 100, one end of the connecting lug 50 is connected to the coil structure 20, and the other end extends to the side surface of the main body 10, remaining suspended and not participating in the electrical connection of the coil structure 20, thus not affecting the electrical performance of the coil structure 20. The end face of the connecting end 51 is flush with the side surface of the main body 10, making the appearance of the inductor device 100 more aesthetically pleasing.

[0103] Please refer to the embodiments in this application. Figure 14 The intermediate structure 80 also includes a border metal 81, which may include a frame-shaped border body 810 and a calibration metal 811 connected to the outer edge of the border body 810. The calibration metal 811 is constructed as a block pattern extending outward from the border body 810. Multiple calibration metals 811 may be connected to one side of the border body 810, and the calibration metals 811 may be spaced apart. The calibration metals 811 are used to calibrate tangent lines.

[0104] For example, two opposite sides of the frame body 810 may extend along a second direction S, and the other two opposite sides of the frame body 810 may extend along a third direction T. The calibration metal 811 connected to the side of the frame body 810 extending along the second direction S can be used to calibrate a scribe line extending along the third direction T. The calibration metal 811 connected to the side of the frame body 810 extending along the third direction T can be used to calibrate a scribe line extending along the second direction S.

[0105] Figure 16 This is a schematic diagram of the structure in which multiple monolithic structures 90 are stacked together in the method for manufacturing an inductor provided in the embodiments of this application. Figure 17 This is a schematic diagram of the top-level monolithic structure 90 in the fabrication method of the inductor device provided in this application embodiment. Figure 16 , Figure 17 In this example, we will use the coil structure 20, which includes three rows and three columns, in the monolithic structure 90 as an example for explanation.

[0106] Please combine Figure 15 and Figure 16 Referring to the embodiments of this application, step S10, which involves providing an intermediate structure 80, specifically includes: Multiple monolithic structures 90 are formed, each monolithic structure 90 including a dielectric material layer 91. Both surfaces of the dielectric material layer 91 in the thickness direction are provided with several conductive layers 32 and a frame metal 81. Some monolithic structures 90 are provided with lug metal 52 and lead-out structures 60. The dielectric material layer 91 includes a metal-covered area 913 covered by the conductive layers 32 and the frame metal 81. The dielectric material layer 91 of some monolithic structures 90 also includes at least one of a lug forming area 911 and a lead-out structure forming area 912. The lug forming area 911 is the area on the dielectric material layer 91 where the connecting lug 50 will be formed; it may be an area on the dielectric material layer 91 covered by the lug metal 52, or a portion of the dielectric material layer 91 not covered by the lug metal. The lead-out structure forming area 912 is the area on the dielectric material layer 91 where the lead-out structure 60 will be formed. The lead-out structure 60 is used for electrical connection with the external electrode 40 of the inductor device 100.

[0107] In sequence, the areas of the first region 910 of each dielectric material layer 91, except for the ear-forming region 911 and the lead-out structure forming region 912 of that dielectric material layer 91, are removed through. (See also...) Figure 16 The first region 910 is the region that is directly opposite to the ear-forming region 911 and the lead-out structure forming region 912 in all the dielectric material layers 91 when multiple monolithic structures 90 are stacked together along the first direction F.

[0108] Multiple monolithic structures 90 are stacked on top of each other along the first direction F, and the corresponding conductive layers 32 of adjacent monolithic structures 90 are welded together. The second region of each dielectric material layer 91 is removed through to form the connecting lug 50 and coil structure 20. The second region is the region in the dielectric material layer other than the first region 910 and the metal covering region 913.

[0109] exist Figure 16 The example shown is a top view of each monolithic structure 90 after stacking, with the topmost monolithic structure 90 shown in solid lines. The shaded area 910 is the first lead-out structure 61 in the topmost monolithic structure 90. The area on the dielectric material layer 91 covered by the first lead-out structure 61 is also the lead-out structure forming area 912 in that monolithic structure 90. The area shown in dashed lines in the dielectric material layer 91 is the second lead-out structure 62 in the bottommost monolithic structure 90. The area in the bottommost monolithic structure 90 covered by the second lead-out structure 62 is also the lead-out structure forming area 912 in that monolithic structure 90. The topmost monolithic structure 90, the second lead-out structure 62, and the area directly opposite all connecting lugs 50 form the first area 910 in the topmost dielectric material layer 91.

[0110] In the embodiments of this application, as described above, in Figures 6-10 In the illustrated inductor 100, the lug forming region 911 and the lead-out structure forming region 912 are each covered with lug metal 52 and lead-out structure 60, respectively.

[0111] Reference Figure 5 The inductor 100 with the structure shown has a connecting lug 50 that includes only a functional layer 500, which is also connected to the dielectric layer 31. Therefore, the lug forming area 911 on the dielectric material layer 91 is actually composed of the dielectric material layer 91 and does not cover the lug metal 52, while the lead-out structure forming area 912 is covered by the lead-out structure 60.

[0112] Please refer to the embodiments in this application. Figure 16 and Figure 17 In step S30, the magnetic material is divided to form individual inductor devices 100: The segmentation is performed according to preset slicing lines. Multiple coil structures 20 are arranged in an array, with each connecting lug 50 extending along the column direction of the array. The slicing lines include multiple first slicing lines H1 and multiple second slicing lines H2. The first slicing lines H1 extend along the column direction of the array, and multiple first slicing lines H1 are located between adjacent columns of coil structures 20. The second slicing lines H2 extend along the row direction of the array, and multiple second slicing lines H2 are located between adjacent rows of coil structures 20, thus separating the corresponding connecting lugs 50 of adjacent coil structures 20.

[0113] For easier observation, the first tangent line H1 and the second tangent line H2 are placed on... Figure 17 The example is illustrated using a single-dot dashed line. It can be understood that, in addition to cutting the adjacent inductor components 100 degrees apart, the first and second dicing lines also cut away the frame metal 81.

[0114] The following is combined Figure 3 , Figure 15 , Figure 16 , Figure 17 To illustrate the fabrication method of the inductor device of this application, a specific example will be given. Here, we can take as an example that each coil structure 20 includes four connecting lugs 50, of which two connecting lugs 50 are disposed on the topmost electrode coil layer 30 (monolithic structure 90), and the other two connecting lugs 50 are disposed on the bottommost electrode coil layer 30 (monolithic structure 90).

[0115] Step 1: Provide an FPC substrate. The intermediate layer of the FPC substrate is a dielectric layer 31 (e.g., PI material, glass fiber material). Both surfaces of the dielectric layer 31 are entirely covered with a metal layer, such as a copper metal layer. The thickness of the dielectric layer 31 is approximately 12.5 micrometers, and the thickness of the metal layer is approximately 18 micrometers. Drill holes in the FPC substrate; the hole diameter can be 0.1 micrometers, 0.15 micrometers, 0.2 micrometers, or 0.25 micrometers.

[0116] Step Two: The holes drilled in Step One are activated by depositing a conductive material on the hole walls. Then, using this conductive material and the metal layers covering both sides of the dielectric layer 31 as seed layers, the entire FPC board is electroplated. The electroplated metal formed in the holes is called hole copper, and the electroplated metal formed on both sides of the dielectric layer 31 in the thickness direction is called surface copper. The thickness of the surface copper is approximately 45-50 micrometers, and the thickness of the hole copper is approximately 15-20 micrometers.

[0117] Step 3: The structure formed in Step 2 is subjected to processes such as film drying, exposure, development, etching, and film stripping to form a structure like... Figure 16 The monolithic structure shown is 90. In Figure 16 In the monolithic structure 90 shown, each dielectric material layer 91 is still a whole structure and has not been etched or engraved.

[0118] Step 4: Perform laser engraving on each of the single-layer monolithic structures 90. Specifically, sequentially remove all areas of the first region 910 of each dielectric material layer 91 except for the ear-forming area 911 and the lead-out structure forming area 912 of that dielectric material layer 91. The first region 910 is the area that is directly opposite the ear-forming area 911 and the lead-out structure forming area 912 in all dielectric material layers 91 when multiple monolithic structures 90 are stacked together along the first direction F. Then, stack the monolithic structures 90 after material removal along the first direction F and weld the corresponding conductive layers 32 of adjacent monolithic structures 90.

[0119] For example, combining Figure 5 , Figure 6 , Figure 16 and Figure 17 For the topmost monolithic structure 90, since the topmost monolithic structure 90 includes a first lead-out structure 61 and a hook metal 52 for forming a connecting lug 50, in the dielectric material layer 91 of the topmost monolithic structure 90, the area covered by the first lead-out structure 61 is also the lead-out structure forming area 912, and the area corresponding to the hook metal 52 is also the hook forming area 911. The area in the first region 910 other than the lead-out structure forming area 912 and the hook forming area 911 (that is, the area directly opposite the second lead-out structure 62) is removed by laser.

[0120] For the bottom monolithic structure 90, since the bottom monolithic structure 90 includes a second lead-out structure 62 and a hook metal 52 for forming a connecting hook 50, in the dielectric material layer 91 of the bottom monolithic structure 90, the area covered by the second lead-out structure 62 is also the lead-out structure forming area 912, and the area corresponding to the hook metal 52 is also the hook forming area 911. For the dielectric material layer 91 of the bottom monolithic structure 90, the area in the first region 910 other than the lead-out structure forming area 912 and the hook forming area 911 (that is, the area directly opposite the first lead-out structure 61) is removed by laser.

[0121] For the monolithic structure 90 located between the top and bottom monolithic structures 90, since no connecting lugs 50 or lead-out structures 60 are provided on it, the first region 910 of the dielectric material layer 91 of these monolithic structures 90 is removed sequentially.

[0122] Step 5: In the structure formed in step 4, the second region of each dielectric material layer 91 is removed through to form the connecting lug 50 and the coil structure 20. The second region is the region in the dielectric material layer 91 other than the first region 910 and the metal covering region 913.

[0123] Step Six: Press the structure 201 formed in Step Five using a magnetic material to press the coil structure 20 and the connecting lug 50 into the magnetic body formed by the magnetic material. Then, divide the magnetic body to form... Figure 1 , Figure 2 The single inductor device 100 is shown. The magnetic material can be powder, raw tape, or a mixture of powder and resin.

[0124] The inventors of this application measured the height difference of the cut surface of the inductor 100 formed after the dicing step. The height difference of the inductor 100 with the structure of this embodiment was reduced from 110 micrometers to 55 micrometers at the diced cut surface. Therefore, it can be seen that the manufacturing method of the inductor and the inductor 100 of this embodiment improve the flatness of the diced cut surface.

[0125] Figure 18 This is a schematic diagram of the structure in which the various coil structures are connected as a whole in the manufacturing method of the inductor device provided in the embodiments of this application.

[0126] The following combination Figure 1 and Figure 18In this embodiment of the application, a mechanical analysis is performed on the structure 201 formed by connecting the individual coil structures 20 together before pressing (the structure 201 after step five is completed). It should be noted that the following description takes as an example that the structure 201 includes 49 rows (the row direction is the second direction S) of coil structures 20, and each coil structure 20 includes 5 layers of electrode coil layers 30. The same applies to other cases where the number of rows of coil structures 20 included in the structure 201 and the number of electrode coil layers 30 included in a single coil structure 20 are not repeated here.

[0127] First, calculate the overall weight of structure 201: The dimensions of structure 201 along both the second direction S and the third direction T are 125 mm, and the mass of structure 201 is 29.5 grams. Therefore, the total weight of structure 201 can be calculated as follows: W = 0.0295 × 9.8 ≈ 0.2891 N.

[0128] Secondly, the force model analysis of the connecting lug 50 is as follows: Strength verification was performed on the aforementioned structure 201 under a conservative model. When the entire structure 201 is clamped or suspended by the connecting lugs 50 at the edge of the second direction S, for the coil structure 20 located at the outermost edge of the second direction S, the connecting lugs 50 need to bear not only the weight of their own row, but also the load transferred to the edge by the entire weight of the structure 201 through the mesh formed by the connecting lugs 50. The edge of the structure 201 in the second direction S, for example... Figure 18 In the left side of the diagram, among the 49 connecting lugs 50, each connecting lug 50 forms a unified "load-bearing band" with the connecting lugs 50 in the same row. Thus, the overall weight of the structure 201 is transferred to the connecting lugs 50 located on the left and right sides through the internal mesh structure. At this time, the load transfer path in the structure 201 is as follows: the self-weight of each small coil structure 20 is transferred upwards, downwards, leftwards, and rightwards along the mesh through the lead-out structures 60 around it and the connecting lugs 50.

[0129] Furthermore, the weight of the single-row coil structure 20 is calculated: The entire structure 201 comprises 49 rows of coil structures 20, with each row of coil structures 20 connected in series via connecting lugs 50, thus forming 49 "load-bearing bands" along the second direction S. The structure 201 also includes a frame metal (not shown) located in the edge region. The connecting lugs 50 at the outermost edge are connected to the frame metal. The frame metal and other structures in the edge region account for approximately 17% of the total weight of the entire structure 201. Therefore, the weight Wrow of a single row of coil structures 20 in the structure 201 is: ; Furthermore, the design load Fdesign of the single-row coil structure 20 is calculated: Considering the impacts such as acceleration and vibration during the production and transportation process, a dynamic load factor Kd=2 is introduced; therefore, the design load Fdesign of the single-row coil structure 20 is: ; In other words, in the worst case, the single-row coil structure 20 needs to be able to withstand a tensile force of about 0.0098N.

[0130] Furthermore, the allowable stress of the material is determined. 】: The connecting lug 50 is made of copper. During the manufacturing process, it undergoes reflow soldering, and the yield strength of copper decreases to approximately 20-25 MPa at high temperatures (250°C). To ensure safety, a lower value is adopted, and a safety margin is included, setting the allowable stress of the material to 10 MPa.

[0131] Furthermore, calculate the theoretical minimum cross-sectional area Amin required for connecting lug 50: According to the tensile strength formula in mechanics of materials: F / A ≤ [ We know that A ≥ F / [ 】; Therefore, the theoretical minimum cross-sectional area Amin required to connect the lug 50 is:

[0132] In other words, under the most stringent assumption that "the single-row coil structure 20 bears weight only in the second direction S", the theoretical minimum cross-sectional area of ​​the connecting lug required to meet the strength requirements is approximately 0.00098 square millimeters.

[0133] Furthermore, the actual cross-sectional area Asingle of a single connecting lug 50 is: ; Where w is the width of the connecting lug 50 along the third direction T, and t is the thickness of the connecting lug 50 along the first direction F, and the example is given with w=0.35mm and t=0.05mm.

[0134] Finally, calculate the "strength safety factor" n: ; As can be seen from the above derivation process, the actual cross-sectional area Asingle of a single connecting lug is 17.8 times the theoretical minimum required value Amin. This means that even without any other assistance, the single-row coil structure 20 has a tensile strength safety margin of nearly 18 times.

[0135] Therefore, in this embodiment of the application, the connection lugs can significantly improve the support stability of the coil structure array and prevent the coil structure from shaking or tilting during the pressing process.

Claims

1. An inductive device, characterized by The inductor device (100) comprises: a main body (10), which is a magnetic structure; a coil structure (20) arranged in the main body (10), the coil structure (20) comprising a plurality of electrode coil layers (30) stacked along a first direction (F), and adjacent electrode coil layers (30) are electrically connected to each other; and a connecting lug (50) arranged in the main body (10), the connecting lug (50) being connected to the coil structure (20), and a connecting end (51) of the connecting lug (50) facing away from the coil structure (20) is exposed on a side surface of the main body (10), and the connecting end (51) is configured to be connected to the connecting end (51) of the connecting lug (50) of another inductor device (100).

2. The inductive device of claim 1, wherein, The connecting lug (50) is configured as a strip structure.

3. The inductive device of claim 2, wherein, The connecting lug (50) extends along a second direction (S), or the extension direction of the connecting lug (50) has an acute angle with the second direction (S). The second direction (S) is perpendicular to the first direction (F).

4. The inductive device of claim 2, wherein, The connecting lug (50) is connected to at least one electrode coil layer (30), and the connecting lug (50) is located at the same layer as the corresponding electrode coil layer (30) along the first direction (F).

5. The inductive device according to any one of claims 1-4, wherein, The single electrode coil layer (30) comprises a plurality of structure layers (300) stacked along the first direction (F). The connecting lug (50) is connected to at least one electrode coil layer (30), and the connecting lug (50) is configured to be connected to at least part of the structure layers (300) in the corresponding electrode coil layer (30). Preferably, the plurality of structure layers (300) of the single electrode coil layer (30) comprise a dielectric layer (31) and two conductive layers (32) arranged on opposite side surfaces of the dielectric layer (31) along the first direction (F), and the two conductive layers (32) are electrically connected to each other, and the connecting lug (50) is connected to at least one of the dielectric layer (31) and the two conductive layers (32) in the corresponding electrode coil layer (30). Preferably, the connecting lug (50) comprises a single functional layer (500), and the functional layer (500) is connected to the dielectric layer (31) of the corresponding electrode coil layer (30). Preferably, the thickness of the connecting lug (50) along the first direction (F) is greater than or equal to 12.5 microns. Preferably, the number of the connecting lug (50) is a plurality, and at least one connecting lug (50) is connected to the coil structure (20) on opposite sides along the second direction (S), and the second direction (S) is perpendicular to the first direction (F). The connecting lug (50) comprises two functional layers (500) stacked along the first direction (F), and the two functional layers (500) are connected with the dielectric layer (31) and the conductive layer (32) of the corresponding electrode coil layer (30) respectively; Preferably, the conductive layer (32) defining the two opposite side surfaces of the dielectric layer (31) along the first direction (F) is a first conductive layer (321) and a second conductive layer (322) respectively; The connecting lug (50) located on the opposite sides of the same electrode coil layer (30) along the second direction (S) is connected with the dielectric layer (31) and the first conductive layer (321), or is connected with the dielectric layer (31) and the second conductive layer (322); or The connecting lug (50) located on the opposite sides of the electrode coil layer (30) along the second direction (S) is connected with the dielectric layer (31) and the first conductive layer (321) on one side, and is connected with the dielectric layer (31) and the second conductive layer (322) on the other side; Preferably, the connecting lug (50) comprises three functional layers (500) stacked along the first direction (F) in sequence, and the three functional layers (500) are connected with the dielectric layer (31) and two conductive layers (32) of the corresponding single electrode coil layer (30) respectively; Preferably, the plurality of structure layers (300) comprise a dielectric layer (31) and two conductive layers (32), the two conductive layers (32) are arranged on the opposite side surfaces of the dielectric layer (31) along the first direction (F), and the conductive layers (32) of the adjacent electrode coil layers (30) facing each other are electrically connected through a welding layer (33); The connecting lug (50) is connected with two electrode coil layers (30), and the two electrode coil layers (30) are defined as a first electrode coil layer (301) and a second electrode coil layer (302) respectively; The connecting lug (50) comprises five functional layers (500) stacked along the first direction (F) in sequence, and the five functional layers (500) are integrally formed with the dielectric layer (31) of the first electrode coil layer (301), the dielectric layer (31) of the second electrode coil layer (302), two conductive layers (32) located between the dielectric layer (31) of the first electrode coil layer (301) and the dielectric layer (31) of the second electrode coil layer (302), and the welding layer (33) respectively; Preferably, the number of the connecting lug (50) is multiple, and at least one connecting lug (50) is connected on the opposite sides of the coil structure (20) along the second direction (S), and the second direction (S) is perpendicular to the first direction (F); Preferably, the projections of the connecting lug (50) located on the same side of the coil structure (20) along the first direction (F) overlap with each other along the second direction (S); and / or The positions of the connecting lugs (50) located on opposite sides of the coil structure (20) along the second direction (S) are aligned with each other or staggered with each other along the first direction (F); and / or The connecting lugs (50) located on opposite sides of the coil structure (20) along the second direction (S) are arranged in alignment along a third direction (T); wherein the second direction (S) and the third direction (T) are perpendicular to each other and to the first direction (F); Preferably, the inductive device (100) further comprises two external electrodes (40), the two external electrodes (40) being arranged on opposite sides of the main body (10) along a third direction (T); The electrode coil layers (30) located at the topmost and bottommost positions along the first direction (F) are each provided with a lead-out structure (60); one of the lead-out structures (60) extends to one side of the third direction (T) to be connected to one of the external electrodes (40), and the other lead-out structure (60) extends to the other side of the third direction (T) to be connected to the other external electrode (40), wherein the second direction (S) and the third direction (T) are perpendicular to each other and to the first direction (F); Preferably, at least one of the electrode coil layers (30) located at the topmost and bottommost positions along the first direction (F) is connected with the connecting lug (50); Preferably, the electrode coil layer (30) comprises a dielectric layer (31) and two conductive layers (32), the dielectric layer (31) being provided with a through-hole metal (70) therethrough, and the two conductive layers (32) being arranged on opposite sides of the dielectric layer (31) along the first direction (F), the conductive layer (32) comprising sub-coil segments (320) wound around the circumference of the coil structure (20), the sub-coil segments (320) comprising first end portions (3201) and second end portions (3202) spaced apart from each other; In the two conductive layers (32), the second end portion (3202) of one of the conductive layers (32) is electrically connected to the first end portion (3201) of the other conductive layer (32) through the through-hole metal (70); Preferably, the first end portion (3201) and the second end portion (3202) are arranged on one side of the coil structure (20) along the second direction (S); the connecting lug (50) located on the same side as the first end portion (3201) and the second end portion (3202) is connected to the first end portion (3201) or the second end portion (3202); Preferably, the through-hole metal (70) corresponding to the first end portion (3201) to which the connecting lug (50) is connected is located at the junction of the first end portion (3201) and the through-hole metal (70); or The through-hole metal (70) corresponding to the second end portion (3202) to which the connecting lug (50) is connected is located at the junction of the second end portion (3202) and the through-hole metal (70). Preferably, the end surface of the connecting lug (51) is configured as a cutting surface, and the end surface of the connecting lug (51) is flush with the side surface of the main body (10).

6. An inductive device assembly, comprising: The inductor device (100) comprises: at least two inductor devices (100), the inductor device (100) being the inductor device (100) of any one of claims 1-5; the main bodies (10) of the at least two inductor devices (100) are integrally formed, and the connecting lugs (50) of at least partially adjacent inductor devices (100) are connected one by one.

7. The inductive device assembly of claim 6, wherein, In each of the coil structures (20), the two electrode coil layers (30) located at the top and bottom of the first direction (F) are each provided with a lead-out structure (60) for electrical connection with an external electrode (40) of the inductor device (100); The array arrangement of the inductor devices (100) is arranged in a row direction and a column direction perpendicular to the first direction (F); In the inductor devices (100) located in the same column, the connecting lugs (50) of adjacent inductor devices (100) are connected one by one; In the inductor devices (100) located in the same row, adjacent inductor devices (100) are connected two by two through the lead-out structures (60).

8. An electronic device, comprising: The inductor device (100) comprises: The inductor device (100) comprises:

9. A method of fabricating an inductive device, comprising: An intermediate structure is provided, the intermediate structure comprising a plurality of coil structures and a plurality of connecting lugs, each of the coil structures comprising a plurality of electrode coil layers stacked on each other, and each of the coil structures being provided with at least one connecting lug corresponding thereto, and at least some of the coil structures being connected to each other as a whole through the corresponding connecting lugs; The intermediate structure is compressed with a magnetic material to compress the coil structures and the connecting lugs into a magnetic body formed by the magnetic material; The magnetic body is segmented to form a single inductor device, wherein the inductor device comprises a main body, the main body being provided with the coil structures and the corresponding connecting lugs, and the connecting lug having a connecting end facing away from the corresponding coil structure exposed on the side surface of the main body. The step of providing an intermediate structure specifically comprises:

10. The method of claim 9, wherein the step of forming the inductive device further comprises the step of: A plurality of single-piece structures are formed, each of the single-piece structures comprising a dielectric material layer, both surfaces of the dielectric material layer in the thickness direction being provided with a plurality of conductive layers and a frame metal, and some of the single-piece structures being provided with a lead-out structure; the dielectric material layer comprises a metal-covered area covered by the conductive layers and the frame metal; the dielectric material layer of some of the single-piece structures further comprises at least one of a lug forming area and a lead-out structure forming area, wherein the lug forming area is an area on the dielectric material layer where a connecting lug is to be formed, and the lead-out structure forming area is an area on the dielectric material layer where the lead-out structure is to be formed, the lead-out structure being used for electrical connection with an external electrode of the inductor device; ​ ​ The first region of each of the dielectric material layers is removed through, except for the lug forming area and the lead-out structure forming area of the dielectric material layer, wherein the first region is the region opposite to the lug forming area and the lead-out structure forming area of all the dielectric material layers when the plurality of single-piece structures are stacked in the first direction; The plurality of single-piece structures are stacked in the first direction, and the opposite conductive layers of adjacent single-piece structures are correspondingly welded; The second region of each of the dielectric material layers is removed through to form the connecting lug and the coil structure, wherein the second region is the region of the dielectric material layer except for the first region and the metal covering area; Preferably, the lug forming area and the lead-out structure forming area are each covered with a lug metal and the lead-out structure; or The lug forming area is composed of the dielectric material layer, and the lead-out structure forming area is covered with the lead-out structure; Preferably, in the step of dividing the magnetic body to form single inductor devices: The division is performed according to a preset cutting line, wherein the plurality of coil structures are arranged in an array, each of the connecting lugs extends along the column direction of the array arrangement, and the cutting line includes a plurality of first cutting lines and a plurality of second cutting lines; The first cutting lines extend along the column direction of the array arrangement, and the plurality of first cutting lines are located between adjacent two columns of the coil structures; The second cutting lines extend along the row direction of the array arrangement, and the plurality of second cutting lines are located between adjacent two rows of the coil structures to cut open the corresponding connecting lugs of adjacent coil structures.

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