Electronic equipment

Abstract

An embodiment of the invention discloses an electronic device which comprises a shell, a metal connecting piece, a main control board, a fixing support, a conductive layer and a flexible circuit board, the metal connecting piece is connected in an installation groove in the shell, the fixing support and the main control board are arranged in the shell, the conductive layer is formed on the fixing support, and the flexible circuit board is arranged on the conductive layer. The metal connecting piece is electrically connected with the conductive layer through conductive adhesive bonding, one end of the flexible circuit board is electrically connected with the conductive layer, and the other end of the flexible circuit board is electrically connected with the main control board, so that static electricity generated on the metal connecting piece is discharged and conducted to a grounding point of the main control board through the flexible circuit board. The grounding mode of the metal connecting piece in the electronic equipment is simple, the number of parts is small, the assembly process is simplified, and the electrostatic protection effect is achieved.

Description

[0001] This application is a divisional application of Chinese patent application No. 202411869577.6, filed on December 17, 2024, entitled "An Electronic Device". Technical Field

[0002] This invention relates to the field of electronic product technology, and more specifically to an electronic device. Background Technology

[0003] Currently, many electronic products use metal connectors on their plastic casings for decoration in pursuit of aesthetics and high quality. However, they neglect the fact that these metal connectors need to be grounded. This can easily lead to static electricity in the metal connectors, damaging internal electronic components and causing serious problems such as system crashes or even complete damage. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide an electronic device with a simple grounding method, a small number of parts, simplified assembly process, and electrostatic protection.

[0005] This invention provides an electronic device, which includes: The housing has an internal cavity and an external mounting groove that communicates with the cavity. Metal connectors are used to connect to the mounting slot; The main control board is located inside the cavity; A fixed bracket is installed inside the cavity and is fixedly connected to the corresponding position of the housing and the metal connector. A conductive layer is mounted on a fixed bracket, and the conductive layer is bonded to the metal connector with conductive adhesive. The flexible circuit board is installed on one side of the inner side of the fixed bracket. One end of the flexible circuit board is electrically connected to the conductive layer, and the other end of the flexible circuit board is electrically connected to the main control board.

[0006] Optionally, the fixed bracket is provided with a first printing and forming area, a second printing and forming area and an arc-shaped printing and forming area. The first printing and forming area is located on the top surface of the fixed bracket and near the edge. The second printing and forming area is located on the outer surface of the fixed bracket. The arc-shaped printing and forming area is located on the connecting surface of the fixed bracket and connects the first printing and forming area and the second printing and forming area.

[0007] Optionally, the conductive layer includes a first conductive portion, a second conductive portion, and a connecting conductive portion. The first conductive portion is formed in a first printed circuit area, the second conductive portion is disposed in a second printed circuit area, the connecting conductive portion is formed in an arc-shaped printed circuit area and its two ends are electrically connected to the first conductive portion and the second conductive portion, respectively, and the first conductive portion is electrically connected to the flexible circuit board.

[0008] Optionally, the inner side of the fixed bracket is provided with a receiving groove, a first clearance groove and a second clearance groove. The first clearance groove and the second clearance groove are respectively provided on the upper and lower sides of the receiving groove. The first clearance groove connects the receiving groove and the first printing and forming area, and the second clearance groove connects the receiving groove and the cavity.

[0009] Optionally, the flexible circuit board includes: The first flexible part is fixed in the receiving groove, and a microphone and electronic components are connected to the first flexible part. The second flexible part is bent and connected to one side of the first flexible part, and extends through the first clearance groove into the first printing molding area. The exposed copper area of ​​the second flexible part is connected above the first conductive part by conductive adhesive. The third flexible part is connected to the other side of the first flexible part, and the third flexible part extends into the cavity through the second clearance groove and is electrically connected to the main control board.

[0010] Optionally, the second flexible portion and the first conductive portion have a contoured structure, and the area of ​​the conductive adhesive is the same as the area of ​​the exposed copper region of the second flexible portion.

[0011] Optionally, multiple limiting blocks are provided on the inner side of the housing, and the multiple limiting blocks are engaged with the outer side of the fixed bracket.

[0012] Optionally, the mounting slot is located within the area enclosed by multiple limiting blocks.

[0013] Optionally, one side of the fixed bracket is also connected to an abutment bracket extending toward the inside of the cavity, and the outer side of the abutment bracket is provided with a snap-fit ​​part. The inner side of the housing is also provided with an annular limiting boss, which has a slot. The abutment bracket is installed on the annular limiting boss, and the snap-fit ​​part is inserted into the slot. A sound receiving channel communicating with the cavity is formed between the abutment bracket and the housing.

[0014] Optionally, an annular limiting boss is provided on one side of the multiple limiting blocks near the bottom of the cavity, and an annular baffle is provided on the outer periphery of the annular limiting boss, which surrounds the circumferential outer side of the abutting bracket.

[0015] Optionally, the outer side of the fixed bracket also includes a first pickup hole and a second pickup hole, with a connecting through hole provided between the first pickup hole and the receiving groove, and the second pickup hole communicating with the sound receiving channel.

[0016] Optionally, the housing also includes a first through hole and a second through hole communicating with the mounting groove, the first pickup hole being configured to communicate with the first through hole, and the second pickup hole being configured to communicate with the second through hole.

[0017] Optionally, the second pickup hole includes a horizontal pickup hole and a vertical pickup hole that are interconnected. The horizontal pickup hole is connected to the second through hole, and the vertical pickup hole is connected to the sound receiving channel.

[0018] Optionally, the second conductive portion is located above the first pickup hole, and one end of the second conductive portion extends upward to connect with the connecting conductive portion, while the other end of the second conductive portion extends downward to the space between the first pickup hole and the second pickup hole.

[0019] Optionally, the outer surface of the mounting bracket is configured as a curved surface that mimics the inner surface of the housing.

[0020] Optionally, the angle between the first printing area and the second printing area is an acute angle.

[0021] Optionally, the housing and mounting bracket can be made of plastic or rubber.

[0022] Alternatively, the conductive layer may be formed on the mounting bracket using either Printing Directly Structured (PDS) or Laser Direct Structuring (LDS) technology.

[0023] The electronic device of this invention includes a housing, a metal connector, a main control board, a mounting bracket, a conductive layer, and a flexible circuit board. The metal connector is connected to a mounting groove on the housing. The mounting bracket and the main control board are disposed within the housing. The conductive layer is formed on the mounting bracket. The metal connector and the conductive layer are electrically connected by bonding with conductive adhesive. One end of the flexible circuit board is electrically connected to the conductive layer, and the other end of the flexible circuit board is electrically connected to the main control board. This allows static electricity generated on the metal connector to be discharged and conducted to the grounding point of the main control board through the flexible circuit board. This electronic device features a simple grounding method for the metal connector, a small number of parts, simplified assembly, and provides electrostatic discharge protection. Attached Figure Description

[0024] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the invention with reference to the accompanying drawings, in which: Figure 1 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present invention; Figure 2 This is an exploded view of an electronic device according to an embodiment of the present invention; Figure 3 This is a first-view structural schematic diagram of the fixed bracket and the abutment bracket according to an embodiment of the present invention; Figure 4 This is a structural schematic diagram of the fixed bracket and the abutment bracket from a second perspective according to an embodiment of the present invention; Figure 5This is a schematic diagram of the shell structure according to an embodiment of the present invention; Figure 6 This is a cross-sectional view of an electronic device according to an embodiment of the present invention; Figure 7 This is a partial schematic diagram of the housing according to an embodiment of the present invention.

[0025] Figure label: 1-Shell; 11-Cavity; 12-Mounting groove; 13-First mounting through hole; 14-Limiting block; 15-Annular limiting boss; 151-Slot; 152-Annular baffle; 16-First through hole; 17-Second through hole; 18-Third through hole; 2-Metal connector; 4-Fixing bracket; 41-Arc-shaped printing area; 42-Accommodation groove; 43-First clearance groove; 44-Second clearance groove; 45-First pickup hole; 46-Second pickup hole; 461-Horizontal 462 - Longitudinal pickup hole; 47 - Connecting through hole; 48 - Third pickup hole; 49 - Connecting surface; 5 - Conductive layer; 51 - First conductive part; 52 - Second conductive part; 53 - Connecting conductive part; 6 - Flexible circuit board; 61 - First flexible part; 611 - Microphone; 612 - Electronic component; 62 - Second flexible part; 63 - Third flexible part; 7 - Elastic conductive connector; 8 - Abutment bracket; 81 - Snap-fit ​​part; 82 - Sound receiving channel. Detailed Implementation

[0026] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0027] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0028] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0030] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0031] Figure 1 and Figure 2 This is a schematic diagram of the electronic device in this embodiment. The electronic device can be a 3C consumer electronics product such as headphones, watches, over-ear headphones, TWS earphones, and wristbands. The electronic device includes a housing 1, a metal connector 2, a mounting bracket 4, a conductive layer 5, a flexible circuit board 6, and a main control board, such as... Figure 1 and Figure 2 As shown. The housing 1 has a cavity 11 inside, which is used to house the fixing bracket 4, the conductive layer 5, the flexible circuit board 6, and the main control board, etc.

[0032] like Figure 5 As shown, the outer side of the housing 1 is provided with a mounting groove 12, which can communicate with the interior of the cavity 11. The metal connector 2 is connected in the mounting groove 12, which can improve the aesthetics of the electronic device and meet other quality requirements, such as acoustic performance. When the electronic device is an earphone, the mounting groove 12 can be a sound vent, and the metal connector 2 can be a dustproof mesh. In this case, the mounting groove 12 is used to connect the cavity 11 with the external environment, facilitating the inflow and outflow of external air, balancing the internal pressure of the earphone, bringing a better listening effect, and improving the acoustic performance of the earphone. The metal connector 2, as a dustproof mesh, can isolate impurities in the external environment outside the dustproof mesh, preventing impurities from entering the cavity and affecting the acoustic performance of the earphone.

[0033] like Figure 1 As shown, the fixing bracket 4 is disposed within the cavity 11, and is fixedly connected to the housing 1 at the corresponding positions of the metal connector 2. Optionally, the outer surface of the fixing bracket 4 is configured as a curved surface that conforms to the inner surface of the housing 1, so that the fixing bracket 4 can be fitted and fixedly connected to the housing 1, thereby improving the stability of the connection.

[0034] like Figure 3 and Figure 4As shown, the fixed bracket 4 is provided with a first printed area, a second printed area, and an arc-shaped printed area 41. The first printed area is located on the top surface of the fixed bracket 4 near its edge, the second printed area is located on the outer surface of the fixed bracket 4, and the arc-shaped printed area 41 is located on the connecting surface 49. The connecting surface 49 connects the top surface and the outer surface of the fixed bracket 4. The arc-shaped printed area 41 connects the first printed area and the second printed area. The outer surface of the fixed bracket 4 refers to the surface that contacts the housing 1. The first printed area, the second printed area, and the arc-shaped printed area 41 are areas printed using Printed Directly Structured (PDS) technology. The arc-shaped printed area 41 connects the top surface and the outer surface, avoiding the stress caused by the right-angle bend of the printed structure. The first printed area is located on the top surface of the fixed bracket 4 near its edge, so that the conductive layer 5 connected to the printed structure thereon is located at the edge of the cavity 11, avoiding impact on the internal components of the electronic device and reducing the size of the electronic device. In this embodiment, the included angle between the first printing area and the second printing area is an acute angle, meaning that the included angle after the planes on which they are located is an acute angle. The planes on which the first printing area and the second printing area are located are connected by an arc-shaped printing area 41, which improves the conductivity of the conductive layer 5 after it is formed thereon.

[0035] The conductive layer 5 is formed using Printed Directly Structured (PDS) technology within the first PDS printing area, the second PDS printing area, and the curved PDS printing area 41 of the fixed bracket 4. For example... Figure 1 and Figure 2 As shown, the flexible circuit board 6 is disposed on one side of the inner surface of the fixed bracket 4. One end of the flexible circuit board 6 is electrically connected to the conductive layer 5 located in the first printed circuit area (i.e., the top surface of the fixed bracket 4), and the other end of the flexible circuit board 6 is electrically connected to the main control board. The conductive layer 5 located in the second printed circuit area (i.e., the outer surface of the fixed bracket 4) is electrically connected to the metal connector 2. When the electronic device is in use or under test, the static electricity generated by the metal connector 2 is discharged and conducted to the grounding point of the main control board through the conductive layer 5 and the flexible circuit board 6, thereby conducting it to the ground and preventing damage to other electronic components inside the electronic device, thus improving the safety of the electronic device.

[0036] like Figure 3As shown, the conductive layer 5 includes a first conductive portion 51, a second conductive portion 52, and a connecting conductive portion 53. The first conductive portion 51 is formed within a first printed circuit area (i.e., the top surface of the fixing bracket 4 and near its edge) for electrical connection with the flexible circuit board 6. The second conductive portion 52 is disposed within a second printed circuit area (i.e., the outer surface of the fixing bracket 4) for electrical connection with the metal connector 2. The connecting conductive portion 53 is formed within an arc-shaped printed circuit area 41, with both ends electrically connected to the first conductive portion 51 and the second conductive portion 52, respectively. The connecting conductive portion 53 being formed within the arc-shaped printed circuit area 41 avoids sharp corners at the connection point of the first conductive portion 51 and the second conductive portion 52, improving the overall conductivity of the conductive layer 5. Sharp corners in the conductive layer 5 are prone to wear and reduced conductivity.

[0037] The electronic device provided in this application uses PDS process to form a conductive layer on the fixed bracket, which makes the connection between the conductive layer and the fixed bracket more stable and less likely to fall off. At the same time, it does not occupy the internal space of the electronic device, which is conducive to the miniaturization of the electronic device.

[0038] In other alternative embodiments, the conductive layer 5 can also be formed on the fixing bracket 4 using laser direct forming (LDS) technology.

[0039] Furthermore, the housing 1 is provided with a first mounting through hole 13, such as Figure 2 and Figure 5 As shown. The first mounting through hole 13 is located within the area surrounded by the mounting groove 12, and the first mounting through hole 13 can connect the mounting groove 12 and the cavity 11. The electronic device also includes a flexible conductive connector 7, such as... Figure 2 As shown, the elastic conductive connector 7 is installed in the first mounting through hole 13. The position of the first mounting through hole 13 is opposite to the second conductive part 52 on the fixed bracket 4 fixed inside the housing 1, so that the two ends of the elastic conductive connector 7 installed in the first mounting through hole 13 can be electrically connected to the metal connector 2 and the conductive layer 5 (i.e., the second conductive part 52) ​​respectively, thereby realizing the discharge of the metal connector 2.

[0040] Preferably, the length of the elastic conductive connector 7 is not less than that of the first mounting through hole 13. Specifically, in this embodiment, the length of the elastic conductive connector 7 is slightly longer than the depth of the first mounting through hole 13, so that after the fixing bracket 4, the metal connector 2, and the housing 1 are fixedly connected, they can press down on both ends of the elastic conductive connector 7 to compress it, thereby ensuring that the elastic conductive connector 7, the metal connector 2, and the conductive layer 5 always maintain electrical connection. The material of the elastic conductive connector 7 is conductive silicone or conductive rubber. Conductive silicone and conductive rubber are made by uniformly distributing conductive particles such as silver-plated glass, silver-plated aluminum, and silver in silicone or rubber, and applying pressure to make the conductive particles contact each other to achieve good conductivity. In other implementations, the connection between the metal connector 2 and the conductive layer 5 can also be achieved by other electrical connection methods, such as conductive adhesive bonding.

[0041] In this embodiment, the first mounting through hole 13 is located near the center of the mounting groove 12. The second conductive portion 52 extends on the outer surface of the fixing bracket 4 according to the position of the first mounting through hole 13, such that the end of the second conductive portion 52 is directly opposite the first mounting through hole 13, thereby enabling the elastic conductive connector 7 to be electrically connected to the second conductive portion 52.

[0042] like Figure 1 and Figure 2 As shown, the flexible circuit board 6 includes a first flexible portion 61, a second flexible portion 62, and a third flexible portion 63 that are interconnected. The second flexible portion 62 and the third flexible portion 63 are respectively connected to the upper and lower sides of the first flexible portion 61. The second flexible portion 62 is bent and connected to one side of the first flexible portion 61, extending above the top surface of the fixed bracket 4. The first flexible portion 61 is fixed to the inner side of the fixed bracket 4. The second flexible portion 62 is electrically connected to the first conductive portion 51. The third flexible portion 63 extends along the bottom surface of the cavity 11 and is electrically connected to the main control board. This achieves the electrical connection between the conductive layer 5 and the main control board, thereby conducting static electricity on the metal connector 2 to the grounding point of the main control board, improving the safety performance of the electronic device. The arrangement of the first flexible portion 61, the second flexible portion 62, and the third flexible portion 63 does not affect the arrangement of other electronic components within the electronic device.

[0043] like Figure 2As shown, the inner side of the fixed bracket 4 is provided with a receiving groove 42, a first clearance groove 43, and a second clearance groove 44. The receiving groove 42 is located near the first printed circuit area, while the first clearance groove 43 and the second clearance groove 44 are respectively located on the upper and lower sides of the receiving groove 42. The first clearance groove 43 connects the receiving groove 42 and the first printed circuit area, and the second clearance groove 44 connects the receiving groove 42 and the cavity 11. The first flexible portion 61 is fixed within the receiving groove 42, and the second flexible portion 62 extends through the first clearance groove 43 into the first printed circuit area. The exposed copper area of ​​the second flexible portion 62 is electrically connected above the first conductive portion 51. The third flexible portion 63 extends through the second clearance groove 44 into the cavity 11 and is electrically connected to the main control board. The first clearance groove 43 and the second clearance groove 44 ensure that when the flexible circuit board 6 is integrally connected inside the housing 1, it can maintain a flat or rounded transition during installation, avoiding problems such as stress concentration. The first flexible portion 61 can be adhered to the receiving groove 42 using adhesive or pressure-sensitive adhesive. The exposed copper area of ​​the second flexible portion 62 can be connected above the first conductive portion 51 by laser welding or conductive adhesive bonding. The third flexible portion 63 can be adhered to the cavity 11 using adhesive or pressure-sensitive adhesive.

[0044] The shape of the receiving groove 42 is adapted to the shape of the first flexible portion 61 to better fix the first flexible portion 61. In this embodiment, the receiving groove 42 and the first flexible portion 61 are rectangular structures. A microphone 611 and electronic components 612 are connected to the first flexible portion 61 to realize specific electronic functions, such as collecting and processing sound in devices like telephones and watches for voice command recognition and calls. The second flexible portion 62 and the first conductive portion 51 have a contoured structure, and the area of ​​the conductive adhesive is the same as the area of ​​the exposed copper region of the second flexible portion 62, thereby improving the dual stability of the physical and electrical connection between the second flexible portion 62 and the first conductive portion 51. Optionally, the second flexible portion 62 and the first conductive portion 51 are rectangular.

[0045] like Figure 2 As shown, multiple limiting blocks 14 are provided on the inner side of the housing 1. These limiting blocks 14 engage with the outer side of the fixing bracket 4, thereby fixing the fixing bracket 4 to the housing 1. The mounting groove 12 is located within the area enclosed by the multiple limiting blocks 14, allowing the metal connector 2 to be electrically connected to the conductive layer 5 on the fixing bracket 4. In this embodiment, the multiple limiting blocks 14 are distributed on the four outer sides of the fixing bracket 4 to clamp and fix the fixing bracket 4 from four directions. The shape and size of the limiting blocks 14 are not limited, as long as they satisfy the clamping and engaging requirements.

[0046] One side of the fixed bracket 4 is also connected to an abutment bracket 8 extending toward the inside of the cavity 11. The abutment bracket 8 has a protruding locking part 81, such as... Figure 3 and Figure 4As shown. The inner side of the housing 1 is also provided with an annular limiting boss 15, and the annular limiting boss 15 is provided with a slot 151, as shown. Figure 2 As shown. The annular limiting boss 15 is located on one side of the limiting block 14, specifically on the side of the multiple limiting blocks 14 near the bottom of the cavity 11. The fixing bracket 4 is fixed by the limiting block 14, and the abutting bracket 8 is installed on the annular limiting boss 15, with the snap-fit ​​part 81 inserted into the snap-fit ​​groove 151, thereby further improving the stability of the connection of the fixing bracket 4.

[0047] like Figure 7 As shown, an annular limiting boss 15 has an annular baffle 152 protruding upward from its outer periphery. The annular baffle 152 surrounds the outer circumference of the abutment bracket 8, thereby further improving the stability of the connection of the fixed bracket 4. Wherein, as... Figure 6 As shown, a sound receiving channel 82 is formed between the abutment bracket 8 and the housing 1. The sound receiving channel 82 is connected to the cavity 11, which ensures the communication quality and reliability of the electronic device.

[0048] like Figure 5 As shown, the housing 1 also includes a first through hole 16 and a second through hole 17. The first through hole 16 and the second through hole 17 are disposed in the area enclosed by the mounting groove 12. Both the first through hole 16 and the second through hole 17 can connect the mounting groove 12 and the cavity 11, thereby enabling the electronic device to communicate with the inside and outside.

[0049] like Figure 3 and Figure 4 As shown, the outer side of the fixed bracket 4 also includes a first pickup hole 45 and a second pickup hole 46. The first pickup hole 45 is connected to the receiving groove 42 through a connecting through hole 47, and the first pickup hole 45 is opposite to and connected to the first through hole 16, so that the microphone 611 can pick up sound or air through the receiving groove 42, the first pickup hole 45, and the first through hole 16. Among them, the first pickup hole 45 has an elongated structure, which can increase the sound pickup area and improve the sound pickup effect. The second pickup hole 46 is connected to the sound receiving channel 82, and the second pickup hole 46 is opposite to and connected to the second through hole 17, which facilitates the inflow and outflow of external air and balances the internal pressure of the electronic device.

[0050] In this embodiment, the second pickup hole 46 includes a transverse pickup hole 461 and a longitudinal pickup hole 462 that are interconnected, such as... Figure 6 As shown, the horizontal pickup hole 461 is connected to the second through hole 17, and the vertical pickup hole 462 is connected to the sound receiving channel 82, thus facilitating the inflow and outflow of external air and balancing the internal pressure of the electronic device. The arrangement of the second pickup hole 46 allows the pressure near the center of the electronic device to be quickly balanced, improving the stability of the electronic device.

[0051] The fixed bracket 4 can be equipped with a through third pickup hole 48 as needed. A third through hole 18 is provided in the housing 1 at the position corresponding to the third pickup hole 48, which can further improve the inflow and outflow of air and balance the internal pressure of the electronic device.

[0052] In this embodiment, the first mounting through hole 13 is disposed between the first through hole 16 and the second through hole 17, so that both ends of the elastic conductive connector 7 abut against the middle positions of the fixed bracket 4 and the metal connector 2, respectively, to avoid uneven stress and warping, which would affect the installation effect and the stability of the electrical connection. The second conductive part 52 is located above the first pickup hole 45, and one end of the second conductive part 52 extends upward to connect with the connecting conductive part 53, while the other end of the second conductive part 52 extends downward to the space between the first pickup hole 45 and the second pickup hole 46 to connect with the elastic conductive connector 7.

[0053] To further improve the safety performance of electronic devices, the housing 1 and the mounting bracket 4 of the electronic device can be made of insulating materials such as plastic and rubber.

[0054] The electronic device of this embodiment includes a housing, a metal connector, a main control board, a mounting bracket, a conductive layer, an elastic conductive connector, and a flexible circuit board. The metal connector is connected to a mounting groove on the housing. The mounting bracket and the main control board are disposed inside the housing. The conductive layer is formed on the top surface, connecting surface, and outer surface of the mounting bracket using PDS technology. The two ends of the elastic conductive connector are electrically connected to the metal connector and the conductive layer, respectively. One end of the flexible circuit board is electrically connected to the conductive layer, and the other end of the flexible circuit board is electrically connected to the main control board, thereby discharging and conducting the static electricity generated on the metal connector to the grounding point of the main control board through the flexible circuit board. The grounding method of the metal connector in this electronic device is simple, the number of parts is small, the assembly process is simplified, and the function of electrostatic protection is achieved.

[0055] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electronic device, comprising: The electronic device comprises: a shell with a cavity inside, an installation slot on the outside of the shell, the installation slot being in communication with the cavity; a metal connecting piece connected in the installation slot; a main control board arranged in the cavity; a fixed support arranged in the cavity, the fixed support being fixedly connected at a position corresponding to the metal connecting piece on the shell; a conductive layer arranged on the fixed support, the conductive layer being bonded with the metal connecting piece through conductive adhesive; a flexible circuit board arranged on one side of the inner side surface of the fixed support, one end of the flexible circuit board being electrically connected with the conductive layer, and the other end of the flexible circuit board being electrically connected with the main control board.

2. The electronic device of claim 1, wherein, The fixed support is provided with a first printed forming area, a second printed forming area and an arc-shaped printed forming area, the first printed forming area being arranged on the top surface of the fixed support and close to the edge position, the second printed forming area being arranged on the outer side surface of the fixed support, and the arc-shaped printed forming area being arranged on the connecting surface of the fixed support, the arc-shaped printed forming area connecting the first printed forming area and the second printed forming area.

3. The electronic device of claim 2, wherein, The conductive layer comprises a first conductive part, a second conductive part and a connecting conductive part, the first conductive part being formed in the first printed forming area, the second conductive part being arranged in the second printed forming area, and the connecting conductive part being formed in the arc-shaped printed forming area and electrically connected with the first conductive part and the second conductive part at two ends respectively, the first conductive part being electrically connected with the flexible circuit board.

4. The electronic device of claim 3, wherein, The inner side surface of the fixed support is provided with a containing slot, a first avoiding slot and a second avoiding slot, the first avoiding slot and the second avoiding slot being arranged on the upper and lower sides of the containing slot respectively, the first avoiding slot being in communication with the containing slot and the first printed forming area, and the second avoiding slot being in communication with the containing slot and the cavity.

5. The electronic device of claim 4, wherein, The flexible circuit board comprises: a first flexible part fixed in the containing slot, a microphone and electronic components being connected on the first flexible part; a second flexible part bent and connected with one side of the first flexible part, the second flexible part extending to the first printed forming area through the first avoiding slot, and a copper exposed area of the second flexible part being connected above the first conductive part through conductive glue; a third flexible part connected with the other side of the first flexible part, the third flexible part extending to the cavity through the second avoiding slot and being electrically connected with the main control board.

6. The electronic device of claim 5, wherein, The second flexible part and the first conductive part are in a profiled structure, and the area of the conductive glue is the same as the area of the copper exposed area of the second flexible part.

7. The electronic device of claim 4, wherein, The shell is provided with a plurality of limiting blocks on the inside, and the plurality of limiting blocks are clamped on the outside of the fixed support.

8. The electronic device of claim 7, wherein, The installation slot is located in an area surrounded by the plurality of limiting blocks.

9. The electronic device of claim 7, wherein, One side of the fixed support is further connected with an abutting support extending towards the inside of the cavity, and the outer side surface of the abutting support is provided with a clamping part. The inner side of the shell is further provided with a ring-shaped limiting boss, which is provided with a clamping groove, the abutting support is installed on the ring-shaped limiting boss, the clamping part is inserted into the clamping groove, and the abutting support and the shell form a sound collecting channel which is communicated with the cavity.

10. The electronic device of claim 9, wherein, The ring-shaped limiting boss is arranged on one side of the plurality of limiting blocks close to the bottom of the cavity, and an annular baffle is protruded upward on the outer periphery of the ring-shaped limiting boss, and the annular baffle is surrounded on the outer periphery of the abutting support.

11. The electronic device of claim 9, wherein, The outer side of the fixed support further comprises a first sound pickup hole and a second sound pickup hole, a connecting through hole is arranged between the first sound pickup hole and the accommodating groove, and the second sound pickup hole is communicated with the sound collecting channel.

12. The electronic device of claim 11, wherein, The shell further comprises a first through hole and a second through hole which are communicated with the mounting groove, the first sound pickup hole is arranged opposite to the first through hole in communication, and the second sound pickup hole is arranged opposite to the second through hole in communication.

13. The electronic device of claim 12, wherein, The second sound pickup hole comprises a transverse sound pickup hole and a longitudinal sound pickup hole which are communicated with each other, the transverse sound pickup hole is arranged opposite to the second through hole in communication, and the longitudinal sound pickup hole is communicated with the sound collecting channel.

14. The electronic device of claim 12, wherein, The second conductive part is located above the first sound pickup hole, one end of the second conductive part is extended upward to be connected with the connecting conductive part, and the other end of the second conductive part is extended downward between the first sound pickup hole and the second sound pickup hole.

15. The electronic device of any of claims 1-14, wherein, The outer side of the fixed support is arranged as a curved surface which is profiled with the inner side of the shell.

16. The electronic device of claim 2, wherein, The included angle between the first printed forming area and the second printed forming area is an acute angle.

17. The electronic device of any of claims 1-14, wherein, The material of the shell and the fixed support is plastic or rubber.

18. The electronic device of any of claims 1-14, wherein, The conductive layer is formed on the fixed support by using a printing directly structured (PDS) technology or a laser direct structuring (LDS) technology.

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