A device and method for treating VOCs exhaust gas in memory bar processing

Abstract

The application relates to the technical field of waste gas treatment, and discloses a VOCs waste gas treatment device and method for memory strip processing, wherein the VOCs waste gas treatment device for memory strip processing comprises a purification tower, an input pipe arranged below the outer side of the purification tower, a clean input pipe arranged above the outer side of the purification tower, a clean output pipe arranged at the bottom of the purification tower, an adsorption assembly arranged in the purification tower, and a cleaning auxiliary assembly. The VOCs waste gas treatment device for memory strip processing is provided with the cleaning auxiliary assembly, hot air flows through the air vent first during desorption, then passes through the activated carbon plate, impurities adsorbed previously are purified, meanwhile, the open air vent slides on the surface of the activated carbon plate in sequence, full coverage of the activated carbon plate is realized, the hot air can uniformly flow through each part of the activated carbon plate, full desorption is realized, and the hot air is prevented from preferentially flowing through the part with smoother flow, so that the desorption effect of the part with serious blockage is reduced.

Description

Technical Field

[0001] This invention relates to the field of waste gas treatment technology, and in particular to a VOCs waste gas treatment device and method for memory module manufacturing. Background Technology

[0002] With the rapid development of the electronics and information industry, memory modules, as core storage components, have evolved into a precision manufacturing system encompassing PCB substrate fabrication, chip mounting, reflow soldering, and encapsulation curing. Within this system, several key processes generate volatile organic compounds (VOCs) due to material volatilization: for example, the PCB substrate cleaning process uses solvents such as isopropanol and acetone to remove surface impurities, resulting in organic waste gas; during chip reflow soldering, components like rosin acid and resin in the flux volatilize upon heating, releasing waste gas containing toluene and xylene; and the adhesives used in the encapsulation curing process slowly release small-molecule organic substances. These waste gases are characterized by low concentrations (typically 50-500 mg / m³), large volumes, and complex compositions, accompanied by small amounts of solder slag dust and sticky flux residue. Direct emission would not only damage the ecological environment but also harm the health of workshop operators with prolonged exposure; therefore, they require efficient treatment using specialized equipment.

[0003] Currently, activated carbon adsorption-desorption technology is widely used for this type of low-concentration VOCs waste gas due to its controllable cost and strong adaptability. Its core principle is to adsorb VOCs molecules through the porous structure of activated carbon, and then regenerate it through hot air or steam desorption after saturation, achieving recycling.

[0004] Problems with the above-mentioned equipment:

[0005] While the seamlessly spliced ​​activated carbon plates inside the activated carbon adsorption-desorption equipment maximize the contact area and improve the single-pass adsorption efficiency, impurities such as dust and oil mist in the exhaust gas easily accumulate on the plate surface and in the pores. Due to the uneven distribution of exhaust gas and its various substances, local areas of the activated carbon plate (such as the airflow inlet side) become rapidly blocked. These subsequent airflows are forced to detour around the unblocked areas, resulting in uneven adsorption load distribution, further increasing wind resistance, and raising equipment energy consumption.

[0006] In addition, during the cleaning or desorption process of activated carbon plates, the cleaning airflow will preferentially flow through areas that are not blocked or not severely blocked when passing through the activated carbon plates. This results in severely blocked local areas always being in the airflow "blind zone", which is not cleaned thoroughly. After long-term use, the effective adsorption area of ​​the activated carbon plates continues to shrink, and the stability of equipment operation decreases significantly. Summary of the Invention

[0007] In view of the problem that the existing technology has the problem of local blockage of activated carbon plates affecting the normal flow of air, a VOCs waste gas treatment device and method for memory module processing is proposed.

[0008] This application provides a VOCs waste gas treatment device and method for memory module processing, the purpose of which is to optimize the airflow path, ensure smooth flow, and enhance the cleaning effect on the activated carbon plate.

[0009] The technical solution of the present invention is as follows: a VOCs waste gas treatment device for memory module processing, comprising a purification tower, an input pipe disposed below the outside of the purification tower, an output pipe disposed at the top of the purification tower, a clean inlet pipe disposed above the outside of the purification tower, a clean outlet pipe disposed at the bottom of the purification tower, an adsorption component and a cleaning auxiliary component disposed inside the purification tower, wherein the adsorption component specifically includes a mounting frame disposed inside the purification tower, a mounting column disposed at the top of the mounting frame, and activated carbon plates disposed on the outside of the mounting column in a linear array.

[0010] The cleaning auxiliary component specifically includes a rotating motor disposed on the top of the mounting column, a housing disposed on the outside of the rotating motor, a turntable disposed on the bottom of the housing, and vents arranged in a ring array on the top of the turntable. The cleaning auxiliary component also includes a rotating plate.

[0011] The turntable divides the internal space of the purification tower vertically and forms an upper and lower flow channel through the air vent. The rotating plate is located inside the air vent and blocks the upper and lower flow channel. The number of rotating plates is less than the number of air vents. The turntable is attached to the top of the activated carbon plate.

[0012] Furthermore, the cleaning auxiliary component also includes a rotating groove opened at the bottom of the inner side of the housing, rotating shafts set at both ends of the rotating plate, an adjusting block set at one end of the rotating shaft near the mounting post, a rotating ring set on the outer side of the housing, a top limiting block set on the outer side of the rotating ring, and a side limiting block set on the outer side of the top limiting block.

[0013] The rotating shaft extends into the rotating groove, the adjusting block is located in the rotating groove, the top surface of the rotating shaft is in contact with the top limiting block, and the side surface of the adjusting block is in contact with the side limiting block.

[0014] Furthermore, the top limiting blocks are arranged in a ring array around the rotating ring, and the spacing between adjacent top limiting blocks is greater than the length of the adjusting block.

[0015] Furthermore, a limit key is provided on the outer side of the rotating shaft so that the maximum rotation angle of the rotating plate is ninety degrees.

[0016] Furthermore, the adsorption assembly also includes a sliding port opened on the outside of the mounting column, a rotating column disposed inside the mounting column, a control groove opened on the outside of the rotating column, an adjustment motor disposed at the bottom of the mounting frame, and a sliding assembly disposed on the inside of the activated carbon plate.

[0017] The rotating column is fixed to the adjusting motor, the control slide is spiral-shaped, the number of control slides is the same as the number of sliding components, and the sliding components pass through the sliding port and connect with the control slide.

[0018] Furthermore, the sliding component specifically includes a slot opened at the bottom inner side of the activated carbon plate, an insert block disposed inside the slot, and a control slider disposed on the side of the insert block;

[0019] The insert block passes through the sliding opening, and the control slider is slidably installed in the control groove. The thickness of the insert block is the same as the width of the sliding opening.

[0020] Furthermore, the control groove is divided into two parts: an equal-pitch groove and a variable-pitch groove. All equal-pitch grooves have the same pitch and length, and the number of turns is less than one. The pitch of the variable-pitch groove increases exponentially from top to bottom.

[0021] Furthermore, a protective cover is provided on the outside of the regulating motor.

[0022] Furthermore, the present invention also provides a method for treating VOCs waste gas in memory module manufacturing, comprising the following steps:

[0023] Step 1: The gas collection hood collects the exhaust gas containing VOCs. The exhaust gas is then transported to the pretreatment unit through pipelines, where it passes through a primary filter and a medium-efficiency oil mist filter in sequence.

[0024] Step 2: The pretreated waste gas enters the purification tower through the pipeline. At this time, the activated carbon plates are switched to a combined and spliced ​​state. The waste gas passes vertically through the activated carbon plates from below, and the porous structure of the activated carbon adsorbs the VOCs molecules.

[0025] After the activated carbon plate becomes partially saturated and clogged, the activated carbon plate is replaced with an intermittent distribution state to continuously input exhaust gas;

[0026] Step 3: After the activated carbon plate becomes saturated and clogged, the activated carbon plate is switched to a combined and spliced ​​state. First, hot air is introduced and flows evenly over the surface and pores of the activated carbon plate, causing the adsorbed VOCs to desorb and decompose, forming VOCs gas.

[0027] After a period of time, the activated carbon plates automatically switch to an intermittent distribution state to continue the desorption process;

[0028] Step 4: The VOCs gas generated by desorption is transported to the catalytic combustion furnace through pipelines. The VOCs gas generated by high-concentration VOCs desorption by catalytic combustion enters the catalytic combustion furnace.

[0029] The beneficial effects of this invention are:

[0030] 1. By setting up cleaning auxiliary components, during purification, exhaust gas flows into the purification tower from the inlet pipe, then flows upward through the activated carbon plate. The filtered exhaust gas flows out from the outlet pipe. Impurities in the exhaust gas are adsorbed by the activated carbon plate. During desorption, the desorption system introduces hot air into the purification tower from the cleaning inlet pipe. The hot air first flows through the vent, then passes through the activated carbon plate to purify the previously adsorbed impurities. At the same time, the rotating motor is started. The rotating motor drives the turntable to rotate through the shell, so that the open vents slide across the surface of the activated carbon plate in sequence, achieving full coverage of the activated carbon plate. This allows hot air to flow evenly through all parts of the activated carbon plate, achieving comprehensive desorption and preventing hot air from preferentially flowing through areas with smoother flow, which would reduce the desorption effect in severely clogged areas.

[0031] 2. By setting up adjusting blocks and top limiting blocks, during adsorption, the rotating plate rotates with the turntable, and the rotating shaft drives the adjusting block to rotate into the gap between the top limiting blocks. In this way, the adjusting block is no longer restricted, and the rotating plate is pushed by the airflow to rotate and open around the rotating shaft. The adjusting block is also adjusted from a horizontal state to a vertical state, thus ensuring the flow area of ​​the exhaust gas, so that it can fully contact the activated carbon plate and ensure processing efficiency. During desorption, the rotating plate rotates in reverse with the turntable, and the adjusting block is squeezed by the top limiting block to adjust from a vertical state to a horizontal state and move to the bottom of the top limiting block, restricting the adjusting block from rotating around the rotating shaft. In this way, the rotating plate blocks the air vents, leaving only a few air vents without rotating plates open. At the same time, the adjusting block pushes the side limiting block so that the rotating ring rotates around the mounting column together, ensuring that the adjusting block is always below the top limiting block, thus ensuring that the desorption effect is not affected.

[0032] 3. By setting up the adsorption component, during desorption, the motor drives the rotating column to rotate, causing the control slider to slide within the control groove. The equidistant groove pushes the control slider upward, and the control slider pushes the activated carbon plate upward through the insert block. The activated carbon plates are in a merged and spliced ​​state. Through the design of the protective cover, multiple activated carbon plates move upward synchronously until the activated carbon plates are attached to the bottom of the turntable. This allows hot air to flow evenly from the activated carbon plates, ensuring the cleaning effect. After a period of time, the rotating column reverses, and the equidistant groove controls the activated carbon plates to move downward synchronously and separate from the turntable. Then, the control slider enters the variable pitch groove. As the variable pitch groove goes down, the pitch decreases... The larger the volume, the farther the activated carbon plates can move, causing them to gradually separate into an intermittent distribution. This allows the airflow to flow freely, cleaning any remaining impurities on the activated carbon plates and further improving the cleaning effect. Then, the adsorption process begins again. First, the rotating column is rotated to move the control slider between the equidistant and variable-distance slots, causing the activated carbon plates to merge and maintain a distance from the turntable. This maximizes the contact area and results in a more saturated adsorption capacity. After the activated carbon plates are saturated over a large area, they are then intermittently distributed, reducing wind resistance and allowing the airflow to freely choose its path between the activated carbon plates, resulting in strong anti-clogging capabilities. Attached Figure Description

[0033] Figure 1 This is a perspective view of the present invention;

[0034] Figure 2 This is a schematic diagram of the purification tower of the present invention;

[0035] Figure 3 This is a disassembled diagram of the present invention;

[0036] Figure 4 This is a schematic diagram of the adsorption component and cleaning auxiliary component of the present invention;

[0037] Figure 5 For the present invention Figure 4 Second-person perspective illustration;

[0038] Figure 6 This is a schematic diagram of the cleaning auxiliary component of the present invention;

[0039] Figure 7 This is a schematic diagram of the rotating ring of the present invention;

[0040] Figure 8 For the present invention Figure 7 Disassembly diagram of middle component;

[0041] Figure 9 This is a top view of the purification tower of the present invention;

[0042] Figure 10 For the present invention Figure 9 Sectional view at point AA;

[0043] Figure 11For the present invention Figure 10 Enlarged view of the activated carbon plate;

[0044] Figure 12 For the present invention Figure 11 Enlarged view at point B in the middle;

[0045] Figure 13 This is a schematic diagram of the mounting column of the present invention;

[0046] Figure 14 This is a schematic diagram of the control chute of the present invention;

[0047] Figure 15 This is a schematic diagram of the bottom of the activated carbon plate of the present invention;

[0048] Figure 16 This is a diagram showing the assembled state of the activated carbon plates of the present invention.

[0049] Figure 17 This is a diagram showing the spacing distribution of the activated carbon plates in this invention.

[0050] In the picture:

[0051] 1. Purification tower; 2. Input pipe; 3. Output pipe; 4. Cleaning inlet pipe; 5. Cleaning outlet pipe; 6. Adsorption assembly; 61. Mounting frame; 62. Mounting column; 63. Activated carbon plate; 64. Sliding port; 65. Rotating column; 66. Control chute; 661. Equidistant groove; 662. Variable pitch groove; 67. Slot; 68. Insert block; 69. Control slider; 610. Adjusting motor; 611. Protective cover; 7. Cleaning auxiliary assembly; 71. Rotating motor; 72. Shell; 73. Turntable; 74. Vent; 75. Rotating plate; 76. Rotating groove; 77. Rotating shaft; 78. Adjusting block; 79. Rotating ring; 710. Top limit block; 711. Side limit block. Detailed Implementation

[0052] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0053] Example 1, referring to Figures 1-12 This is the first embodiment of the present invention, which provides a VOCs waste gas treatment device for memory module processing, including a purification tower 1, an input pipe 2 disposed on the lower outer side of the purification tower 1, an output pipe 3 disposed on the top of the purification tower 1, a cleaning inlet pipe 4 disposed on the upper outer side of the purification tower 1, a cleaning outlet pipe 5 disposed on the bottom of the purification tower 1, an adsorption component 6 and a cleaning auxiliary component 7 disposed inside the purification tower 1. The adsorption component 6 specifically includes a mounting frame 61 disposed inside the purification tower 1, a mounting column 62 disposed on the top of the mounting frame 61, and activated carbon plates 63 disposed on the outer side of the mounting column 62 in a linear array.

[0054] The cleaning auxiliary component 7 specifically includes a rotating motor 71 disposed on the top of the mounting column 62, a housing 72 disposed on the outside of the rotating motor 71, a turntable 73 disposed on the bottom of the housing 72, and vents 74 arranged in a ring array on the top of the turntable 73. The cleaning auxiliary component 7 also includes a rotating plate 75.

[0055] Specifically, the purification tower 1 is divided into upper and lower parts, and the two parts are fixed by bolts. The output pipe 3 and the clean outlet pipe 5 are vertically welded to the top and bottom of the purification tower 1, respectively. The clean inlet pipe 4 and the input pipe 2 are horizontally welded to the upper and lower parts of the outer wall of the purification tower 1. The outer side of the purification tower 1 is wrapped with a support. There are four purification towers. The input pipe 2, the output pipe 3 and the clean inlet pipe 4 are connected in series by a converging pipe. The lower end of the clean outlet pipe 5 is equipped with a sedimentation box.

[0056] The front-end equipment of purification tower 1 includes a pretreatment unit and a gas collection hood, which are connected to the input pipe 2 in sequence via pipelines. The gas collection hoods are distributed at the contamination points of the memory module production line, specifically including the PCB cleaning tank, reflow soldering station, and encapsulant coating area. The pretreatment unit is equipped with primary filter cotton and medium-efficiency oil mist removal filter to reduce the contamination of impurities to the subsequent adsorption unit. An online VOCs monitor is installed in the output pipe 3. The monitoring threshold of the online VOCs monitor does not exceed 50mg / m³. The back-end equipment of purification tower 1 includes a desorption system and a catalytic combustion furnace, which are connected to the clean inlet pipe 4 and the deposition box in sequence via pipelines. The catalytic combustion furnace contains a heat exchanger and a platinum-palladium composite catalyst bed.

[0057] The mounting frame 61 is divided into two parts: a connecting bridge and a tray. The connecting bridge fixes the tray to the inner wall of the purification tower 1. The mounting column 62 is snapped onto the top of the tray. The activated carbon plate 63 is fitted onto the outside of the mounting column 62. The rotating motor 71 is fixed to the top of the mounting column 62 by bolts. The shell 72 completely covers the rotating motor 71 and is snapped onto the output shaft of the rotating motor 71. The turntable 73 is integrally formed with the shell 72, and the whole is in the shape of an inverted "T". The turntable 73 divides the internal space of the purification tower 1 vertically and forms a vertical flow channel through the air vent 74. The rotating plate 75 is located inside the air vent 74 and blocks the vertical flow channel. The number of rotating plates 75 is less than the number of air vents 74, so that some air vents 74 are always open. The turntable 73 is attached to the top of the activated carbon plate 63.

[0058] By setting up the cleaning auxiliary component 7, during purification, the exhaust gas flows into the purification tower 1 from the input pipe 2, and then flows upward through the activated carbon plate 63. The filtered exhaust gas flows out from the output pipe 3. The impurities in the exhaust gas are adsorbed by the activated carbon plate 63. During desorption, the desorption system fills the purification tower 1 with hot air from the cleaning inlet pipe 4. The hot air first flows through the air inlet 74, and then passes through the activated carbon plate 63 to purify the previously adsorbed impurities. At the same time, the rotating motor 71 is started. The rotating motor 71 drives the turntable 73 to rotate through the housing 72, so that the open air inlet 74 slides across the surface of the activated carbon plate 63 in sequence, achieving full coverage of the activated carbon plate 63. This allows the hot air to flow evenly from all parts of the activated carbon plate 63, achieving comprehensive desorption and preventing the hot air from preferentially flowing through areas with smoother flow, which would reduce the desorption effect in severely clogged areas.

[0059] The cleaning auxiliary component 7 also includes a rotating groove 76 formed on the bottom inner side of the housing 72, a rotating shaft 77 set at both ends of the rotating plate 75, an adjusting block 78 set at one end of the rotating shaft 77 near the mounting post 62, a rotating ring 79 set on the outer side of the housing 72, a top limiting block 710 set on the outer side of the rotating ring 79, and a side limiting block 711 set on the outer side of the top limiting block 710.

[0060] Specifically, the rotating plate 75 is rotatably mounted in the vent 74 via the rotating shaft 77, which is fixed to the rotating plate 75 by bolts. The rotating shaft 77 extends into the rotating groove 76, and the adjusting block 78 is located in the rotating groove 76. The adjusting block 78 is fixedly connected to the rotating shaft 77. The rotating ring 79 is rotatably connected to the outside of the mounting column 62 and is located in the rotating groove 76. The top limiting block 710 is integrally formed with the rotating ring 79, and the side limiting block 711 is fixedly connected to the top limiting block 710 by bolts. The top surface of the rotating shaft 77 is in contact with the top limiting block 710, and the side surface of the adjusting block 78 is in contact with the side limiting block 711. The top limiting blocks 710 are arranged in a ring array around the rotating ring 79, and the spacing between adjacent top limiting blocks 710 is greater than the length of the adjusting block 78. A limiting key is provided on the outside of the rotating shaft 77 so that the maximum rotation angle of the rotating plate 75 is ninety degrees.

[0061] By setting the adjusting block 78 and the top limiting block 710, during adsorption, the rotating plate 75 rotates with the turntable 73, and the rotating shaft 77 drives the adjusting block 78 to rotate into the gap between the top limiting blocks 710. Thus, the adjusting block 78 is no longer restricted, and the rotating plate 75, pushed by the airflow, flips and opens around the rotating shaft 77. The adjusting block 78 also adjusts from a horizontal to a vertical position, ensuring the flow area of ​​the waste gas and allowing it to fully contact the activated carbon plate 63, thus ensuring processing efficiency. During desorption, the rotating plate 75 follows the turntable 73... 3. Reverse the direction. The adjusting block 78 is squeezed by the top limiting block 710 and adjusted from a vertical state to a horizontal state. It moves to the bottom of the top limiting block 710, restricting the adjusting block 78 from rotating around the rotating shaft 77. In this way, the rotating plate 75 blocks the vent 74. Only a few vents 74 without the rotating plate 75 are open. At the same time, the adjusting block 78 pushes the side limiting block 711 so that the rotating ring 79 rotates around the mounting column 62 together, ensuring that the adjusting block 78 is always below the top limiting block 710. This ensures that the desorption effect is not affected.

[0062] Example 2, refer to Figure 1-17 This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that the adsorption component 6 further includes a sliding port 64 opened on the outside of the mounting column 62, a rotating column 65 disposed inside the mounting column 62, a control groove 66 opened on the outside of the rotating column 65, an adjustment motor 610 disposed at the bottom of the mounting frame 61, and a sliding component disposed on the inside of the activated carbon plate 63.

[0063] Specifically, sliding openings 64 are distributed on both sides of mounting column 62, rotating column 65 is rotatably connected inside mounting column 62, rotating column 65 is fixed to adjusting motor 610, control slide 66 is spiral-shaped, the number of control slide 66 is the same as the number of sliding components, sliding components pass through sliding openings 64 and connect with control slide 66, and a protective cover 611 is provided on the outside of adjusting motor 610 to protect adjusting motor 610.

[0064] The control groove 66 is divided into two parts: equidistant groove 661 and variable pitch groove 662. The equidistant groove 661 is located above the variable pitch groove 662. All equidistant grooves 661 have the same pitch and length, and the number of turns is less than one. The pitch of the variable pitch groove 662 increases exponentially from top to bottom. The control groove 66 can adjust the activated carbon plate 63 to have two states: a combined splicing state, in which the plates are seamlessly connected to form an integral adsorption surface, and a spaced distribution state, in which a uniform 10cm gap is formed between the plates.

[0065] By setting the adsorption component 6, during desorption, the motor 610 drives the rotating column 65 to rotate, causing the control slider 69 to slide within the control groove 66. The equidistant groove 661 pushes the control slider 69 upward, and the control slider 69 pushes the activated carbon plate 63 upward through the insert block 68. The activated carbon plate 63 is in a merged and spliced ​​state. In this way, through the design of the protective cover 611, multiple activated carbon plates 63 move upward synchronously until the activated carbon plates 63 are attached to the bottom of the turntable 73. This allows hot air to flow down evenly from the activated carbon plate 63, ensuring the cleaning effect. After a period of time, the rotating column 65 reverses, and the equidistant groove 661 controls the activated carbon plate 63 to move down synchronously and separate from the turntable 73. Then, the control slider 69 enters the variable pitch groove 662. As the pitch of the variable pitch groove 662 increases as it goes down, the distance the activated carbon plate 63 moves also increases, causing the activated carbon plate 63 to gradually separate into an intermittent distribution state. The airflow can flow freely, cleaning the impurities remaining on the activated carbon plate 63 and further improving the cleaning effect. Then, the adsorption process is carried out again. First, the rotating column 65 is rotated to move the control slider 69 between the equidistant groove 661 and the variable pitch groove 662, so that the activated carbon plate 63 enters a merged and spliced ​​state and maintains a distance from the turntable 73. This maximizes the contact area and makes the adsorption capacity fuller. After the activated carbon plate 63 is saturated over a large area, it enters an intermittent distribution state, thus reducing wind resistance. The airflow can freely choose its route between the activated carbon plates 63, resulting in strong anti-clogging ability.

[0066] The sliding component specifically includes a slot 67 located at the bottom inner side of the activated carbon plate 63, an insert 68 located inside the slot 67, and a control slider 69 located on the side of the insert 68.

[0067] Specifically, slot 67 is connected to sliding port 64, and plug 68 is slidably inserted into slot 67 and fixed by bolts. Plug 68 passes through sliding port 64, and control slider 69 is slidably installed in control slide groove 66. The thickness of plug 68 is the same as the width of sliding port 64, which facilitates the installation of the equipment.

[0068] The remaining structure is the same as that in Example 1.

[0069] Example 3, referring to Figures 1-17 The third embodiment of the present invention provides a method for treating VOCs waste gas in memory module manufacturing, comprising the following steps:

[0070] Step 1: Collect VOC-containing waste gas (mainly composed of toluene, xylene, isopropanol, acetone, etc., with a small amount of solder slag dust and sticky flux residue) through local sealed gas collection hoods set up at each pollution point in the memory module processing workshop; the waste gas is transported to the pretreatment unit through pipelines, and passes through the primary filter cotton (intercepting dust and solder slag with a particle size ≥10μm) and the medium-efficiency oil mist filter (removing sticky flux residue) in sequence.

[0071] Step 2: The pretreated waste gas enters the purification tower 1 through the pipeline. At this time, the activated carbon plate 63 is switched to the combined splicing state. The waste gas passes vertically through the activated carbon plate 63 from below. The porous structure of the activated carbon adsorbs VOCs molecules. The purified gas is discharged through the top of the purification tower 1 in compliance with standards. The outlet concentration is monitored in real time by an online VOCs monitor. When the concentration exceeds the set threshold, an alarm is triggered.

[0072] After the activated carbon plate 63 becomes partially saturated and blocked, the activated carbon plate 63 switches to an intermittent distribution state to continuously input exhaust gas.

[0073] Step 3: After the activated carbon plate 63 is saturated and blocked by more than 70%, the activated carbon plate 63 is switched to a combined and spliced ​​state. First, hot air at 120°C is introduced. The hot air flows evenly over the surface and pores of the activated carbon plate 63, causing the adsorbed VOCs to desorb and decompose, forming a high concentration of VOCs gas with a concentration of 2000 mg / m³. The high concentration of VOCs gas generated by desorption is transported to the catalytic combustion furnace through the pipeline.

[0074] After a period of time, the activated carbon plate 63 automatically switches to an intermittent distribution state to continue the desorption process.

[0075] Step 4: The high-concentration VOCs gas generated by the catalytic combustion desorption of high-concentration VOCs enters the catalytic combustion furnace. After being preheated to 250°C by a heat exchanger, it passes through a platinum-palladium composite catalyst bed. Under the action of the catalyst, the VOCs undergo an oxidation reaction and decompose into CO2 and H2O. The high-temperature tail gas generated by the reaction exchanges heat with cold air through a heat exchanger, and the recovered heat is used for desorption preheating. The purified tail gas is emitted with a stable emission concentration below 20 mg / m³.

[0076] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A VOCs waste gas treatment device for memory module processing, comprising a purification tower (1), an input pipe (2) disposed below the outside of the purification tower (1), an output pipe (3) disposed at the top of the purification tower (1), a cleaning inlet pipe (4) disposed above the outside of the purification tower (1), a cleaning outlet pipe (5) disposed at the bottom of the purification tower (1), an adsorption assembly (6) and a cleaning auxiliary assembly (7) disposed inside the purification tower (1), characterized in that: The adsorption component (6) specifically includes an installation frame (61) installed inside the purification tower (1), an installation column (62) installed on the top of the installation frame (61), and activated carbon plates (63) arranged in a linear array on the outside of the installation column (62). The cleaning auxiliary component (7) specifically includes a rotating motor (71) set on the top of the mounting column (62), a housing (72) set on the outside of the rotating motor (71), a turntable (73) set on the bottom of the housing (72), and vents (74) arranged in a ring array on the top of the turntable (73). The cleaning auxiliary component (7) also includes a rotating plate (75). The turntable (73) divides the internal space of the purification tower (1) vertically and forms an upper and lower flow channel through the air vent (74). The rotating plate (75) is located inside the air vent (74) to block the upper and lower flow channel. The number of rotating plates (75) is less than the number of air vents (74). The turntable (73) is attached to the top of the activated carbon plate (63). The cleaning auxiliary component (7) also includes a rotating groove (76) opened at the bottom of the inner side of the housing (72), a rotating shaft (77) set at both ends of the rotating plate (75), an adjusting block (78) set at one end of the rotating shaft (77) near the mounting post (62), a rotating ring (79) set on the outer side of the housing (72), a top limiting block (710) set on the outer side of the rotating ring (79), and a side limiting block (711) set on the outer side of the top limiting block (710). The rotating shaft (77) extends into the rotating groove (76), the adjusting block (78) is located in the rotating groove (76), the top surface of the rotating shaft (77) is in contact with the top limiting block (710), and the side surface of the adjusting block (78) is in contact with the side limiting block (711). The top limiting blocks (710) are arranged in a ring array around the rotating ring (79), and the spacing between adjacent top limiting blocks (710) is greater than the length of the adjusting block (78); A limit key is provided on the outside of the rotating shaft (77) so that the maximum rotation angle of the rotating plate (75) is ninety degrees.

2. The VOCs waste gas treatment device for memory module processing according to claim 1, characterized in that: The adsorption assembly (6) also includes a sliding port (64) opened on the outside of the mounting column (62), a rotating column (65) set inside the mounting column (62), a control groove (66) opened on the outside of the rotating column (65), an adjustment motor (610) set at the bottom of the mounting frame (61), and a sliding assembly set inside the activated carbon plate (63). The rotating column (65) is fixed to the regulating motor (610), the control slide (66) is spiral, the number of control slides (66) is the same as the number of sliding components, and the sliding components pass through the sliding port (64) and connect with the control slide (66).

3. The VOCs waste gas treatment device for memory module processing according to claim 2, characterized in that: The sliding component specifically includes a slot (67) opened at the bottom of the inner side of the activated carbon plate (63), an insert (68) disposed inside the slot (67), and a control slider (69) disposed on the side of the insert (68). The insert (68) passes through the sliding opening (64), and the control slider (69) is slidably installed in the control groove (66). The thickness of the insert (68) is the same as the width of the sliding opening (64).

4. The VOCs waste gas treatment device for memory module processing according to claim 2, characterized in that: The control groove (66) is divided into two parts: equal pitch groove (661) and variable pitch groove (662). All equal pitch grooves (661) have the same pitch and length, and the number of turns is less than one. The pitch of the variable pitch groove (662) increases exponentially from top to bottom.

5. The VOCs waste gas treatment device for memory module processing according to claim 2, characterized in that: The regulating motor (610) is provided with a protective cover (611) on its outside.

6. A method for treating VOCs waste gas in memory module manufacturing, employing the VOCs waste gas treatment device for memory module manufacturing as described in claim 1, characterized in that, Includes the following steps: Step 1: The gas collection hood collects the exhaust gas containing VOCs. The exhaust gas is then transported to the pretreatment unit through pipelines, where it passes through a primary filter and a medium-efficiency oil mist filter in sequence. Step 2: The pretreated waste gas enters the purification tower (1) through the pipeline. At this time, the activated carbon plate (63) is switched to the merged splicing state; the waste gas passes vertically through the activated carbon plate (63) from below, and the VOCs molecules are adsorbed by the porous structure of activated carbon. After the activated carbon plate (63) becomes partially saturated and blocked, the activated carbon plate (63) switches to an intermittent distribution state to continuously input exhaust gas; Step 3: After the activated carbon plate (63) is saturated and blocked, the activated carbon plate (63) is switched to a combined splicing state. First, hot air is introduced. The hot air flows evenly over the surface and pores of the activated carbon plate (63) to desorb and decompose the adsorbed VOCs and form VOCs gas. Subsequently, the activated carbon plate (63) automatically switches to an intermittent distribution state to continue the desorption process; Step 4: The VOCs gas generated by desorption is transported to the catalytic combustion furnace through pipelines. The VOCs gas generated by high-concentration VOCs desorption by catalytic combustion enters the catalytic combustion furnace.

Images