Device and system for testing resistance and capacitance of semiconductor device without manual feeding

Abstract

The invention relates to the technical field of semiconductor testing, in particular to a semiconductor device resistance and capacitance testing device and system free of manual feeding, and the device comprises a base rack, and a U-shaped track plate and a feeding inclined tube which are fixedly arranged on the base rack, and an upper moving table and a lower moving table are arranged in the U-shaped track plate in a limiting and sliding manner; the upper moving table and the lower moving table can move close to each other or separate from each other; according to the semiconductor device resistance and capacitance testing device free of manual feeding, semiconductor devices such as MOS tubes and the like can be automatically tested without manual intervention, and qualified products and unqualified products can be output from the two ends of the shunting groove hopper through cooperation of the arranged distribution assembly and the shunting groove hopper and are automatically sorted.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, specifically to a device and system for testing the resistance and capacitance of semiconductor devices without manual input. Background Technology

[0002] Semiconductor devices, such as MOSFETs, require gate resistance and capacitance testing during production quality control. This is achieved by applying a high-frequency AC signal to the gate of the device under test and sampling the voltage and current passing through the device to calculate the capacitance and resistance. A test support device for energy-saving MOSFETs, published in CN120352658B, states that "during the production of MOSFETs, after a large batch of MOSFETs is packaged, each one needs to be tested individually." It further notes that "most current support devices use a plug-in type, which not only presents the problem of difficult plugging and unplugging but also easily leads to pin bending, causing damage and affecting testing efficiency." The paper proposes a test support device to improve testing efficiency.

[0003] MOSFETs typically have a rectangular package with three pins at the bottom. Currently, for resistance and capacitance testing of MOSFETs, the industry mostly relies on manual insertion of the MOSFET pins into the test socket. After the testing system completes the test and outputs the results, defective products are manually sorted out. As described in the cited patent literature, manual insertion and removal can easily lead to pin bending, increasing the number of scrapped products. More importantly, in actual production, due to the large number of MOSFETs tested daily, the internal contacts of the test socket can become loose after repeated insertion and removal, leading to poor contact, increased contact resistance, and other problems, resulting in unstable control over the accuracy of the test results. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor device resistance and capacitance testing apparatus and system that eliminates the need for manual input, in order to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor device resistance and capacitance testing device that requires no manual feeding, comprising a base frame and a U-shaped track plate and a feeding inclined tube fixedly mounted on the base frame. The U-shaped track plate has an upper moving platform and a lower moving platform that are slidably positioned and can move towards or away from each other. A test contact is mounted on the upper moving platform, and a ceramic clamp is mounted on the lower moving platform. The feeding inclined tube is tilted at a certain angle. The semiconductor device slides towards the lower end of the feeding inclined tube due to gravity. A flow divider is connected to the lower end of the feeding inclined tube. When the semiconductor device moves into the flow divider, the upper and lower moving platforms move towards each other, at which point the test contact and the ceramic clamp clamp the leads of the semiconductor device for testing. A splitting groove is formed through the bottom of the flow divider, and a splitting assembly is provided below the splitting groove. The splitting assembly causes the semiconductor device to move towards either end of the flow divider according to the test results.

[0006] The sorting assembly includes a sorting pin, a telescopic controller, and a translation controller. The translation controller is fixedly mounted on the base frame, and the telescopic controller is mounted on the translation controller. The translation controller can drive the telescopic controller to move along the length direction of the sorting slot. The telescopic controller is used to control the telescopic movement of the sorting pin. When the sorting pin extends, it can pass through the sorting slot and be inserted into the semiconductor device. Then, the translation controller drives the telescopic controller to move the semiconductor device.

[0007] A split platform is provided on one side of the upper moving platform, and the test contact is installed on the split platform; an oscillation shaft is fixedly installed on the split platform, and the oscillation shaft passes through the upper moving platform.

[0008] A shaft end back plate is fixedly installed at the end of the oscillating shaft. A support spring is installed between the shaft end back plate and the upper moving platform. An electromagnet module is fixedly installed on the upper moving platform. When the electromagnet module is energized, it can generate magnetic force and attract the shaft end back plate to move. When the electromagnet module is supplied with a pulsed current, the shaft end back plate reciprocates in cooperation with the support spring, and the split platform reciprocates synchronously.

[0009] The ceramic clamp is provided with a fixed spacer and a movable spacer, which are positioned correspondingly. When the test contact and the ceramic clamp clamp the pins of the semiconductor device, the pins of the semiconductor device are separated from each other by the fixed spacer and the movable spacer.

[0010] The bottom of the movable spacer is fixedly provided with a spacer substrate, and a limit groove is formed on the ceramic clamp. The spacer substrate is slidably limited in the limit groove, and the movable spacer can be driven to move through the spacer substrate. When the test contact and the ceramic clamp clamp the pin of the semiconductor device, the movable spacer moves away from the fixed spacer.

[0011] The bottom of the limiting slide groove is provided with a control bottom groove, and the bottom of the partition plate is fixedly provided with a drooping part, which is disposed in the control bottom groove.

[0012] The lowering stage is internally equipped with a lead screw and a moving block. The lead screw passes through the moving block and is screwed into it. When the lead screw rotates, it can drive the moving block to move. An upper insertion shaft is fixedly installed on the upper part of the moving block. The upper insertion shaft is inserted into the lower part and drives the lower part to move synchronously. A lead screw motor for driving the lead screw to rotate is installed at the end of the lead screw.

[0013] The upper part of the diversion trough is fixedly provided with an upper cover plate, which can limit the semiconductor device that moves out of the feed inclined tube. A pin passage slit is opened between the upper cover plate and the diversion trough. When the semiconductor device in the feed inclined tube moves down into the diversion trough, the pin of the semiconductor device will pass through the pin passage slit and extend between the test contact and the ceramic holder.

[0014] A semiconductor device resistance and capacitance testing system that requires no manual input includes a semiconductor device resistance and capacitance testing device, an industrial computer, a high-frequency signal generation module, a sampling and measurement unit, and a DC bias power supply module. The industrial computer is connected to the high-frequency signal generation module, the sampling and measurement unit, and the DC bias power supply module via a control bus for issuing commands and receiving status information. The high-frequency signal generation module, the sampling and measurement unit, and the DC bias power supply module are all connected to the test contacts via wires.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention provides a semiconductor device resistance and capacitance testing device that eliminates the need for manual feeding. It can automatically test semiconductor devices such as MOSFETs without any human intervention. Furthermore, through the combination of a sorting component and a shunt hopper, it can automatically sort qualified and unqualified products from both ends of the shunt hopper. This invention uses test contacts and ceramic clamps to hold and test the pins of semiconductor devices, avoiding problems such as loosening of traditional test sockets, ensuring consistent contact resistance, and improving the accuracy of test results.

[0016] 2. By combining the split stage, shaft end back plate, and electromagnet module, this invention can drive the test contact to oscillate and move relative to the pin for a period of time after the test contact is engaged with the ceramic holder to hold the pin, before the test begins. This removes the oxide layer on the pin surface, further reduces the contact resistance, and makes the test results closer to the real data of the semiconductor device.

[0017] 3. The present invention, through the combination of fixed spacers, movable spacers and movable blocks, can drive the movable spacers away from the fixed spacers after the test contact and the ceramic holder clamp the pins, before the test begins. This allows the movable spacers to definitively separate the pins of the semiconductor device, avoiding contact between the pins of the semiconductor device and preventing short circuits during testing, which could damage the test system. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 This is a schematic diagram of the structure at the upper moving platform of the present invention.

[0020] Figure 3 This is a front view of the overall structure of the present invention.

[0021] Figure 4 This is a three-dimensional half-sectional view of the overall structure of the present invention.

[0022] Figure 5 This is a partial three-dimensional cross-sectional view of the present invention.

[0023] Figure 6 This is a three-dimensional half-sectional view of the dispensing groove of the present invention.

[0024] Figure 7 This is a schematic diagram of the inclined tube structure of the present invention.

[0025] Figure 8 This is a schematic diagram of the removal of the feed in the inclined tube and the diversion trough of the present invention.

[0026] Figure 9 This is a schematic diagram of the structure at the lower moving platform of the present invention.

[0027] Figure 10 This is a three-dimensional half-sectional view of the lower moving platform of the present invention.

[0028] In the diagram: 1. Base frame; 2. U-shaped track plate; 3. Upper moving stage; 4. Lower moving stage; 5. Test contact; 6. Ceramic clamp; 7. Feed inclined tube; 8. Diverting slot; 9. Diverting trough; 801. Diverting pin; 802. Telescopic controller; 803. Translation controller; 301. Split stage; 302. Oscillating shaft; 303. Shaft end back plate; 304. Support spring; 305. Electromagnet module; 601. Fixing partition; 602 603. Movable partition; 604. Partition base plate; 605. Limiting groove; 606. Control bottom groove; 607. Drooping part; 608. Lead screw shaft; 609. Movable block; 6000. Upper insertion shaft; 610. Lead screw motor; 901. Top cover plate; 902. Lead through slot; 101. Mounting side plate; 201. Symmetrical threaded shaft; 202. Gear part; 501. Insulating ceramic block; 701. Expansion inlet; 702. Side wing fixing plate. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figures 1 to 10 This invention provides a technical solution: a semiconductor device resistance and capacitance testing device that requires no manual input, comprising a base frame 1, a U-shaped track plate 2 fixedly mounted on the base frame 1, and an input inclined tube 7, as shown below. Figure 1 As shown, an installation side plate 101 is integrally formed at the bottom of the base frame 1. The testing device of the present invention is fixedly installed on the workbench through the installation side plate 101. An upper moving platform 3 and a lower moving platform 4 are provided in the U-shaped track plate 2 for limiting sliding. The upper moving platform 3 and the lower moving platform 4 can move closer to each other or separate. Vertical grooves are provided at both ends of the upper moving platform 3 and the lower moving platform 4. Vertical protrusions are provided on the inner wall of the U-shaped track plate 2. Through the cooperation of the vertical grooves and the vertical protrusions, the upper moving platform 3 and the lower moving platform 4 can slide up and down in the U-shaped track plate 2, while being limited in other directions.

[0031] like Figure 5As shown, a symmetrical threaded shaft 201 is rotatably mounted in the U-shaped track plate 2. The symmetrical threaded shaft 201 passes through the upper moving platform 3 and the lower moving platform 4, and is helically engaged with the upper moving platform 3 and the lower moving platform 4. The helical directions of the threads at both ends of the symmetrical threaded shaft 201 are opposite, so that when the symmetrical threaded shaft 201 rotates, it can drive the upper moving platform 3 and the lower moving platform 4 to move closer to each other or further apart. A gear part 202 is fixedly mounted at the end of the symmetrical threaded shaft 201. The drive gear can drive the symmetrical threaded shaft 201 to rotate by meshing with the gear part 202. Alternatively, a motor can be directly connected to the end of the symmetrical threaded shaft 201 to drive and control the symmetrical threaded shaft 201.

[0032] The upper stage 3 is equipped with test contacts 5. The number of pins on the test contacts 5 is determined by the number of pins on the semiconductor device. For example, a MOSFET has three pins, so the test contacts 5 include three conductor contacts. The lower stage 4 is equipped with a ceramic clamp 6. The feed tube 7 is tilted at a certain angle. The semiconductor device slides towards the lower end of the feed tube 7 due to gravity. Figure 7 As shown, an expansion inlet 701 is provided at the higher end of the feed tube 7. The expansion inlet 701 serves as a guide, allowing semiconductor devices such as MOSFETs from the previous production line to flow into the feed tube 7. A side wing fixing plate 702 is welded to the outer surface of the feed tube 7, and the feed tube 7 is detachably fixed to the base frame 1 through the side wing fixing plate 702.

[0033] The lower end of the feed slant tube 7 is connected to a shunt hopper 9. When the semiconductor device moves into the shunt hopper 9, the upper moving stage 3 and the lower moving stage 4 move closer to each other. At this time, the test contact 5 and the ceramic clamp 6 clamp the pins of the semiconductor device for testing. The semiconductor device can be a MOSFET, IGBT, transistor, etc. The feed slant tube 7 and the shunt hopper 9 of the corresponding size can be replaced according to the model of the semiconductor device.

[0034] A dividing slot 8 is formed through the bottom of the dividing trough 9. A dividing assembly is located below the dividing slot 8. The dividing assembly causes the semiconductor device to move towards both ends of the dividing trough 9 according to the test results. The dividing assembly includes a dividing pin 801, a telescopic controller 802, and a translation controller 803. The translation controller 803 is fixedly mounted on the base frame 1, and the telescopic controller 802 is mounted on the translation controller 803. The translation controller 803 can drive the telescopic controller 802 to move along the length of the dividing trough 9. The translation controller 803 can be an electrically controlled track movement mechanism, such as a gear and rack mechanism, which can drive the telescopic controller 802 to move.

[0035] The telescopic controller 802 is used to control the telescopic movement of the dispensing pin 801. The telescopic controller 802 uses an electromagnet and a spring to drive the telescopic movement of the dispensing pin 801. When the dispensing pin 801 extends, it can pass through the dispensing slot 8 and be inserted into the semiconductor device. Then, the telescopic controller 802 is driven by the translation controller 803 to move the semiconductor device.

[0036] A split stage 301 is provided on one side of the upper stage 3, and the test contact 5 is installed on the split stage 301; for example Figure 2 As shown, the test contact 5 is externally wrapped with an insulating ceramic block 501. The insulating ceramic block 501 is made of insulating material, preferably ceramic material. The insulating ceramic block 501 can fix and support the test contact 5 and provide insulation. The insulating ceramic block 501 is installed in the split platform 301 and fixed by screws.

[0037] An oscillating shaft 302 is fixedly mounted on the split stage 301, and the oscillating shaft 302 passes through the upper moving stage 3. A shaft end back plate 303 is fixedly mounted at the end of the oscillating shaft 302, and a support spring 304 is provided between the shaft end back plate 303 and the upper moving stage 3. An electromagnet module 305 is fixedly mounted on the upper moving stage 3. When the electromagnet module 305 is energized, it can generate magnetic force and attract the shaft end back plate 303 to move. When a pulsed current is applied to the electromagnet module 305, the shaft end back plate 303 reciprocates in conjunction with the support spring 304, and the split stage 301 reciprocates synchronously.

[0038] The ceramic clamp 6 is equipped with a fixed spacer 601 and a movable spacer 602, which are positioned correspondingly. When the test contact 5 and the ceramic clamp 6 clamp the pins of the semiconductor device, the pins of the semiconductor device are separated from each other by the fixed spacer 601 and the movable spacer 602. The ceramic clamp 6, the fixed spacer 601, and the movable spacer 602 are all made of ceramic.

[0039] A spacer substrate 603 is fixedly disposed at the bottom of the movable spacer 602. A limiting groove 604 is formed on the ceramic clamp 6. The spacer substrate 603 is slidably limited in the limiting groove 604, and the movable spacer 602 can be moved by the spacer substrate 603. When the test contact 5 and the ceramic clamp 6 clamp the pin of the semiconductor device, the movable spacer 602 moves away from the fixed spacer 601. A control bottom groove 605 is formed through the bottom of the limiting groove 604. A drooping part 606 is fixedly disposed at the bottom of the spacer substrate 603, and the drooping part 606 is disposed in the control bottom groove 605.

[0040] The lowering stage 4 is internally equipped with a lead screw shaft 607 and a moving block 608. The lead screw shaft 607 passes through the moving block 608 and is screwed into it. When the lead screw shaft 607 rotates, it can drive the moving block 608 to move. An upper insertion shaft 609 is fixedly installed on the upper part of the moving block 608. The upper insertion shaft 609 is inserted into the lower part 606, which drives the lower part 606 to move synchronously. A lead screw motor 610 for driving the lead screw shaft 607 to rotate is provided at the end of the lead screw shaft 607.

[0041] A top cover plate 901 is fixedly installed on the upper part of the flow divider hopper 9. The top cover plate 901 can limit the semiconductor device that moves out of the feed inclined tube 7. A lead through slot 902 is opened between the top cover plate 901 and the flow divider hopper 9. When the semiconductor device in the feed inclined tube 7 moves down into the flow divider hopper 9, the lead of the semiconductor device will pass through the lead through slot 902 and extend between the test contact 5 and the ceramic clamp 6.

[0042] This is a semiconductor device resistance and capacitance testing system that requires no manual input. The system includes a semiconductor device resistance and capacitance testing device, an industrial computer, a high-frequency signal generation module, a sampling and measurement unit, and a DC bias power supply module. The industrial computer runs the test software and coordinates the work of each module. The high-frequency signal generation module generates high-precision, highly stable high-frequency AC test signals. The sampling and measurement unit includes a high-precision analog-to-digital converter that acquires the voltage and current response signals of the device under test, converting analog signals into digital signals for calculation. The DC bias power supply module provides an adjustable DC bias voltage to simulate the device's operating conditions.

[0043] An industrial computer is connected to the high-frequency signal generation module, sampling and measurement unit, and DC bias power supply module via a control bus for issuing commands and receiving status information. The high-frequency signal generation module, sampling and measurement unit, and DC bias power supply module are all connected to test contact 5 via wires. During testing, an AC voltage signal of known frequency and amplitude is applied to the gate and source circuits of the semiconductor device. The AC current signal in the high-precision sampling circuit is then measured using Ohm's law R = ... The gate resistance is calculated. The capacitance is the sum of the gate-source capacitance and the gate-drain capacitance, expressed as C = ... .

[0044] In use, the testing device of this invention tilts the inclined tube 7 at an angle, causing the semiconductor device inside the inclined tube 7 to slide towards the distribution tank 9. When the semiconductor device slides into the distribution tank 9, the upper moving platform 3 and the lower moving platform 4 move closer together by controlling the rotation of the symmetrical threaded shaft 201. Figure 5As shown, the test contact 5 and the ceramic clamp 6 cooperate to clamp and fix the pins of the semiconductor device. The ceramic clamp 6 is placed under the pins, and the test contact 5 is pressed on top of the pins. When the test contact 5 and the ceramic clamp 6 move closer together by rotating the symmetrical threaded shaft 201 driven by the motor, the rotational resistance of the symmetrical threaded shaft 201 will increase after the test contact 5 and the ceramic clamp 6 clamp the pins of the semiconductor device, which will increase the motor operating current. Based on the change in the motor operating current, it is determined whether the test contact 5 and the ceramic clamp 6 are clamped in place and whether the clamping force is consistent. This is the prior art in this field and will not be described in detail. The high-frequency AC signal is applied to the corresponding pins of the semiconductor device by the test contact 5, and the voltage and current passing through the semiconductor device are sampled to calculate the capacitance and gate resistance.

[0045] like Figure 5 and Figure 6 As shown, semiconductor devices are sorted according to test results. First, the test contact 5 and the ceramic clamp 6 are separated and reset. Next, the telescopic controller 802 controls the extension of the sorting pin 801, allowing it to be inserted into the heat dissipation substrate hole of the semiconductor device through the sorting slot 8. Then, the translation controller 803 controls the telescopic controller 802 to move, selecting and pushing the semiconductor device to the corresponding end of the flow divider hopper 9 based on whether it is qualified or not. This invention's testing device inputs the semiconductor device to be tested through the input inclined tube 7 and outputs qualified and unqualified semiconductor devices through the two ends of the flow divider hopper 9, achieving efficient and automated testing.

[0046] After the diversion trough 9 is moved away from the semiconductor device at the outlet of the feed slant tube 7, the semiconductor device in the feed slant tube 7 naturally slides down to replenish it. Under the control of the telescopic controller 802 and the translation controller 803, the diversion pin 801 retracts and resets, and the next cycle test is performed.

[0047] In the above process, after the test contact 5 and the ceramic clamp 6 clamp the pin, before the test begins, a pulsed current is input to the electromagnet module 305, causing the electromagnet module 305 to generate intermittent magnetic force. When the electromagnet module 305 generates magnetic force, it attracts the shaft end back plate 303 to move towards the electromagnet module 305. At this time, the support spring 304 is elastically compressed, and the split stage 301 moves away from the upper moving stage 3. When the magnetic force of the electromagnet module 305 disappears, the support spring 304 supports the shaft end back plate 303 to reset, causing the split stage 301 to move towards the upper moving stage 3. Finally, the split stage 301 oscillates along the axis of the oscillation shaft 302, causing the test contact 5 to oscillate for a period of time, preferably between 0.5 seconds and 1 second. Through the relative movement between the test contact 5 and the pin, the oxide layer on the pin surface is removed, further reducing the contact resistance, making the test results closer to the real data of the semiconductor device.

[0048] Synchronously, after the test contact 5 and the ceramic holder 6 are engaged to hold the pin, before starting the test, such as... Figure 10 As shown, the lead screw motor 610 is energized, causing the lead screw shaft 607 to rotate, driving the moving block 608 towards... Figure 10 As shown in the diagram, the leftward movement of the moving block 608 causes the spacer substrate 603 and the moving spacer 602 to move to the left. For semiconductor device pins, they are mainly divided into two parts: the connection end and the insertion end. The connection end is the end closer to the MOSFET package shell, with a larger diameter, serving a mechanical fixing and heat dissipation function; while the insertion end is the end farther from the MOSFET package shell, used for insertion into the solder holes of the circuit board for soldering, and has a smaller diameter. Therefore, the connection end is less prone to deformation and bending, while the insertion end is more easily deformed and bent under force. When the test contact 5 and the ceramic clamp 6 are engaged, the fixed spacer 601 and the moving spacer 602 are positioned between the pin's connection end. When the moving block 608 causes the spacer substrate 603 and the moving spacer 602 to move to the left, the moving spacer 602 separates from the fixed spacer 601, allowing the moving spacer 602 to move to the pin's insertion end. If there is a deformation or short-circuit contact problem at the pin's insertion end, the moving spacer 602 can definitively separate the pin when it moves to the insertion end. This avoids the problem of pins of semiconductor devices coming into contact with each other, and avoids the risk of short circuits during testing, which could damage the test system.

[0049] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device resistance and capacitance testing device that requires no manual input, comprising a base frame and a U-shaped track plate and an input inclined tube fixedly mounted on the base frame, characterized in that: The U-shaped track plate is equipped with an upper sliding platform and a lower sliding platform, which can move closer to each other or separate from each other. Test contacts are provided on the upper moving platform, and ceramic clamps are provided on the lower moving platform. The feed tube is tilted at a certain angle. The semiconductor device slides towards the lower end of the feed tube by gravity. The lower end of the feed tube is connected to a flow divider. When the semiconductor device moves into the flow divider, the upper and lower moving platforms move closer to each other. At this time, the test contacts and ceramic clamps clamp the pins of the semiconductor device for testing. The bottom of the diversion trough is provided with a diversion slot, and a diversion component is provided below the diversion slot. The diversion component enables the semiconductor device to move towards both ends of the diversion trough according to the test results.

2. The semiconductor device resistance and capacitance testing device without manual input according to claim 1, characterized in that: The sorting assembly includes a sorting plug, a telescopic controller, and a translation controller. The translation controller is fixedly installed on the base frame, and the telescopic controller is installed on the translation controller. The translation controller can drive the telescopic controller to move along the length direction of the diversion trough. The telescopic controller is used to control the telescopic movement of the dispensing pin. When the dispensing pin extends, it can pass through the dispensing slot and be inserted into the semiconductor device. Then, the telescopic controller is driven by the translation controller to move the semiconductor device.

3. The semiconductor device resistance and capacitance testing device without manual input according to claim 1, characterized in that: A split platform is provided on one side of the upper moving platform, and the test contact is installed on the split platform; An oscillating shaft is fixedly installed on the split platform, and the oscillating shaft passes through the upper moving platform.

4. The semiconductor device resistance and capacitance testing device without manual input according to claim 3, characterized in that: A shaft end back plate is fixedly installed at the end of the oscillating shaft. A support spring is installed between the shaft end back plate and the upper moving platform. An electromagnet module is fixedly installed on the upper moving platform. When the electromagnet module is energized, it can generate magnetic force and attract the shaft end back plate to move. When the electromagnet module is supplied with a pulsed current, the shaft end back plate reciprocates in cooperation with the support spring, and the split platform reciprocates synchronously.

5. The semiconductor device resistance and capacitance testing device without manual input according to claim 1, characterized in that: The ceramic clamp is provided with a fixed spacer and a movable spacer, which are positioned correspondingly. When the test contact and the ceramic clamp clamp the pins of the semiconductor device, the pins of the semiconductor device are separated from each other by the fixed spacer and the movable spacer.

6. The semiconductor device resistance and capacitance testing device without manual input according to claim 5, characterized in that: The bottom of the movable partition is fixedly provided with a partition base plate, and a limit groove is provided on the ceramic clamp. The partition base plate is slidably limited in the limit groove, and the movable partition plate can be driven to move through the partition base plate. After the test contact and ceramic holder clamp the pin of the semiconductor device, the movable spacer moves away from the fixed spacer.

7. The semiconductor device resistance and capacitance testing device without manual input according to claim 6, characterized in that: The bottom of the limiting slide groove is provided with a control bottom groove, and the bottom of the partition plate is fixedly provided with a drooping part, which is disposed in the control bottom groove.

8. The semiconductor device resistance and capacitance testing device without manual input according to claim 7, characterized in that: The lowering stage is internally equipped with a lead screw and a moving block. The lead screw passes through the moving block and is screwed to the moving block. When the lead screw rotates, it can drive the moving block to move. The upper part of the movable block is fixedly provided with an upper insertion shaft, which is inserted into the lower part and drives the lower part to move synchronously. The end of the lead screw shaft is equipped with a lead screw motor for driving the lead screw shaft to rotate.

9. The semiconductor device resistance and capacitance testing device without manual input according to claim 1, characterized in that: The upper part of the diversion trough is fixedly provided with an upper cover plate, which can limit the semiconductor device that moves out of the feed inclined tube. A pin passage slit is opened between the upper cover plate and the diversion trough. When the semiconductor device in the feed inclined tube moves down into the diversion trough, the pin of the semiconductor device will pass through the pin passage slit and extend between the test contact and the ceramic holder.

10. A semiconductor device resistance and capacitance testing system that requires no manual input, characterized in that, The system includes a semiconductor device resistance and capacitance testing device that requires no manual input as described in any one of claims 1-9, an industrial computer, a high-frequency signal generation module, a sampling and measurement unit, and a DC bias power supply module; The industrial computer is connected to the high-frequency signal generation module, the sampling and measurement unit, and the DC bias power supply module via a control bus, and is used to issue commands and receive status information. The high-frequency signal generation module, sampling and measurement unit, and DC bias power supply module are all connected to the test contacts via wires.

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