Heating film pasting system, film pasting method and battery device

Abstract

The invention discloses a heating film pasting system, a film pasting method and a battery device. The heating film pasting system comprises a gluing device, a film pasting device and a light curing device. The gluing device is used for coating a substrate or a heating film with light curing glue to form a light curing glue layer, the film pasting device is used for attaching the heating film to the substrate, the heating film is fixed to the substrate through the light curing glue layer, the light curing device comprises a device support and at least one light curing lamp, and the light curing lamp is installed on the device support and used for irradiating the light curing glue layer. And curing the photo-curing adhesive layer. According to the heating film pasting system, the film pasting efficiency of the heating film is high, and the bonding strength between the heating film and the substrate can be high.

Description

Technical Field

[0001] This invention relates to the field of batteries, and in particular to a heating film bonding system, a bonding method, and a battery device. Background Technology

[0002] In related technologies, heating films are typically used to heat the battery to ensure it can operate normally in low-temperature environments. To prevent the heating film from drying out and causing performance degradation or insulation failure, at least one side of the heating film must be adhered to a heat-conducting component. For example, in a battery device, the heating film is attached to a cold plate. The heating film is generally attached manually. This method suffers from weak adhesion and low efficiency.

[0003] In related technologies, to improve the adhesion strength between the heating film and the cold plate, the heating film is hot-pressed onto the cold plate. While this method improves the adhesion strength, the hot-pressing equipment is complex, bulky, and time-consuming, resulting in low film application efficiency. Therefore, improvements are needed. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of the present invention is to provide a heating film bonding system that uses a photocuring device to cure the adhesive layer. The photocuring device is simpler and smaller in size than a hot-pressing device, has higher bonding efficiency for the heating film, and can achieve higher adhesion strength between the heating film and the substrate.

[0005] The present invention also proposes a method for applying the above-mentioned heating film bonding system.

[0006] The present invention also proposes a battery device.

[0007] According to a first aspect of the present invention, a heating film bonding system includes: an adhesive coating device for coating a substrate or the heating film with a photocurable adhesive to form a photocurable adhesive layer; a film bonding device for attaching the heating film to the substrate, wherein the heating film is fixed to the substrate by the photocurable adhesive layer; and a photocuring device including a device support and at least one photocuring lamp, wherein the photocuring lamp is mounted on the device support and is used to irradiate the photocurable adhesive layer to cure the photocurable adhesive layer.

[0008] According to the heating film bonding system of the present invention, a coating device can be used to coat a light-curing adhesive onto a substrate or a heating film. A film-applying device can be used to pre-apply the heating film onto the substrate. A light-curing device can be used to light-cur the light-curing adhesive layer, thereby bonding the heating film onto the substrate. The light-curing device is used to cure the adhesive layer. The light-curing device is simpler and smaller in size than the hot-pressing device, and it can make the bonding strength between the heating film and the substrate higher. Furthermore, since the light-curing time is shorter than the hot-pressing time of the hot-pressing device used in the related art, the film bonding efficiency can be significantly improved.

[0009] According to some embodiments of the present invention, the irradiation angle of the light-curing lamp is adjustable, and the adjustable range of the irradiation angle of the light-curing lamp is 0 to 30°; and / or, the irradiation intensity of the light-curing lamp is adjustable, and the irradiation intensity of the light-curing lamp is not less than 3000 mJ / cm². 2 .

[0010] According to some embodiments of the present invention, the distance between the light curing lamp and the light curing adhesive layer is adjustable, and the adjustable range of the distance between the light curing lamp and the light curing adhesive layer is 10cm to 20cm.

[0011] According to some embodiments of the present invention, there are multiple light-curing lamps arranged at intervals; wherein, the array of multiple light-curing lamps is arranged and / or at least some of the light-curing lamps are independently controlled.

[0012] According to some embodiments of the present invention, the light spots formed by two adjacent light-curing lamps on the heating film or the light-curing adhesive layer have overlapping portions.

[0013] According to some embodiments of the present invention, the adhesive coating device includes an adhesive coating body and an adhesive coating robotic arm. One end of the adhesive coating robotic arm is connected to the adhesive coating body, and the other end of the adhesive coating robotic arm is provided with an adhesive coating component, which is used to coat the substrate or the heating film with a light-curing adhesive.

[0014] According to some embodiments of the present invention, the film-applying device includes a film-applying machine body and a film-applying robotic arm. One end of the film-applying robotic arm is connected to the film-applying machine body, and the other end of the film-applying robotic arm is provided with a gripper mechanism. The gripper mechanism is used to grip the heating film and place the heating film at a preset position on the substrate.

[0015] According to some embodiments of the present invention, the film-applying device further includes a pressing mechanism, the pressing mechanism including a pressing drive mechanism and a pressing member, the pressing member being used to contact the heating film, and the pressing drive mechanism being connected to the pressing member to drive the pressing member to apply pressure toward the substrate to the heating film.

[0016] According to some embodiments of the present invention, the pressing component includes a roller and a connecting arm, one end of the connecting arm is connected to the pressing drive mechanism, and the roller is rotatably connected to the other end of the connecting arm. The roller is used to press the heating film.

[0017] According to some embodiments of the present invention, the heating film bonding system further includes a film bonding positioning plate, which is detachably connected to the substrate. At least one positioning hole is formed on the film bonding positioning plate, which penetrates the film bonding positioning plate along the thickness direction and defines a film bonding area within the positioning hole.

[0018] According to some embodiments of the present invention, the heating film bonding system includes a mobile trolley for carrying and transporting the substrate; or, the heating film bonding system includes a conveyor line for carrying and transporting the substrate.

[0019] According to some embodiments of the present invention, the adhesive coating device, the photocuring device, and the film-applying device are arranged sequentially along the conveying direction of the substrate.

[0020] A method for applying a heating film according to a second aspect of the present invention includes: applying a photocurable adhesive onto a substrate using the adhesive applicator to form the photocurable adhesive layer; irradiating the photocurable adhesive layer with the photocuring applicator for a preset time to excite the photocurable adhesive layer; applying the heating film onto the photocurable adhesive layer on the substrate using the film application device; and waiting for the photocurable adhesive layer to fully cure.

[0021] According to the heating film bonding system of the present invention, after applying a photocurable adhesive to a substrate, the photocurable adhesive layer is first irradiated with a photocuring device for a preset time to activate it. Then, the heating film is attached to the photocurable adhesive layer. This method attaches the heating film to the photocurable adhesive layer before it begins to gradually cure but has not yet rapidly cured. This not only allows the heating film to be fixed to the substrate by the photocurable adhesive layer, but also makes full use of the time spent in the early, slow curing stage of the photocurable layer, shortening the bonding time and improving bonding efficiency. Furthermore, irradiating the photocurable adhesive layer before attaching the film reduces restrictions on the selection of heating film materials, allowing for greater flexibility in material selection.

[0022] According to a third aspect of the present invention, a battery device includes: a housing; a battery cell disposed within the housing; and a thermal management unit disposed within the housing and including at least one heat exchange component, the heat exchange component including a heat exchange plate and a heating film, the heating film being fixed to the heat exchange plate by a photocurable adhesive layer, and the heating film being thermally connected to the battery cell.

[0023] According to the battery device of the present invention, by using a light-curing adhesive layer to bond and fix the heating film and the heat exchange plate, the bonding strength between the heating film and the heat exchange plate can be high. Furthermore, since the light-curing adhesive layer is cured by light irradiation, the curing time is short, which is beneficial to improving the efficiency of bonding the heating film to the heat exchange plate.

[0024] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0025] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of a heating film bonding system according to some embodiments of the present invention; Figure 2 This is a schematic diagram of a heating film bonding system according to other embodiments of the present invention; Figure 3 This is a schematic diagram of an adhesive coating device according to some embodiments of the present invention spraying adhesive onto a substrate; Figure 4 This is a schematic diagram of a pressing component of a pressing mechanism according to some embodiments of the present invention rolling a heating film pre-attached on a substrate; Figure 5 This is a schematic diagram of multiple photocuring lamps of a photocuring apparatus according to some embodiments of the present invention irradiating a heating film attached to a substrate; Figure 6 This is another schematic diagram of a photocuring apparatus according to some embodiments of the present invention irradiating a heating film attached to a substrate with multiple photocuring lamps.

[0026] Figure label: 100. Heating film bonding system; 10. Glue application device; 11. Glue application machine body; 12. Glue application robotic arm; 13. Glue application components; 131. Spray pipe; 132. Spray nozzle; 20. Film applicator; 21. Film applicator body; 22. Film applicator robotic arm; 24. Pressing component; 241. Connecting arm; 242. Roller; 30. Film positioning plate; 40. UV curing device; 41. Device support; 42. UV curing lamp; 50. Conveyor line; 61. Substrate; 62. Heating film; 63. Photocurable adhesive layer. Detailed Implementation

[0027] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0028] The following is for reference. Figures 1-5 A heating film bonding system 100 according to an embodiment of the present invention is described. The heating film bonding system 100 of the present invention can bond a heating film 62 to a substrate 61, wherein the substrate 61 can be a heat exchange plate in a battery device.

[0029] Reference Figures 1-2 According to a first aspect of the present invention, a heating film pasting system 100 includes: an adhesive applicator 10, a film pasting device 20, and a photocuring device 40.

[0030] The adhesive coating apparatus 10 is used to coat a photocurable adhesive onto a substrate 61 or a heating film 62 to form a photocurable adhesive layer 63. For example, the adhesive coating apparatus 10 can coat the photocurable adhesive at a predetermined position on the substrate 61 to form the photocurable adhesive layer 63; or, the adhesive coating apparatus 10 can also coat the photocurable adhesive onto the heating film 62 to form the photocurable adhesive layer 63. The photocurable adhesive can be an ultraviolet (UV) photocurable adhesive.

[0031] The film-applying device 20 is used to attach the heating film 62 to the substrate 61. The heating film 62 is fixed to the substrate 61 by a photocurable adhesive layer 63. For example, when the adhesive applicator 10 applies photocurable adhesive to a predetermined position on the substrate 61 to form a photocurable adhesive layer 63, the film-applying device 20 can grasp the heating film 62 and pre-apply it to the position on the substrate 61 where the photocurable adhesive layer 63 is applied, so that the heating film 62 is pre-applied to the substrate 61 by the photocurable adhesive layer 63. As another example, when the adhesive applicator 10 applies photocurable adhesive to the heating film 62 to form a photocurable adhesive layer 63, the film-applying device 20 can grasp the heating film 62 coated with the photocurable adhesive layer 63, with the side of the heating film 62 coated with the photocurable adhesive layer 63 facing the substrate 61, and pre-apply it to a predetermined position on the substrate 61, so that the heating film 62 is pre-applied to the substrate 61 by the photocurable adhesive layer 63.

[0032] The photocuring device 40 includes a device support 41 and at least one photocuring lamp 42. The photocuring lamp 42 is mounted on the device support 41, and the irradiation surface of the photocuring lamp 42 can face downwards. For example, there can be one photocuring lamp 42, or there can be multiple photocuring lamps 42. When there are multiple photocuring lamps 42, the multiple photocuring lamps 42 are arranged at intervals, and the multiple photocuring lamps 42 can be arranged along the length direction of the heating film 62, or the multiple photocuring lamps 42 can be arranged in an array.

[0033] Optionally, the light curing lamp 42 can be a UV curing lamp that emits UV light, and the light curing adhesive layer 63 can be a UV light curing adhesive layer 63.

[0034] The UV curing lamp 42 is used to irradiate the UV curing adhesive layer 63 to cure the UV curing adhesive layer 63. For example, the substrate 61 coated with the UV curing adhesive layer 63 can be transported to the UV curing device 40 by a moving trolley or conveyor line 50. The moving trolley can be located below the UV curing lamp 42, and the UV curing lamp 42 irradiates the UV curing adhesive layer 63 downwards.

[0035] It should be noted that the heating film 62 is made of a material that can be penetrated by light emitted by the light curing lamp 42.

[0036] The photocuring lamp 42 of the photocuring device 40 irradiates the photocurable adhesive layer 63, which allows the photocurable adhesive layer 63 between the heating film 62 and the substrate 61 to cure rapidly. The photocuring time is relatively short compared to the hot pressing time, which greatly shortens the bonding and fixing time of the heating film 62 and can significantly improve the film bonding efficiency. Furthermore, it can make the adhesion strength between the heating film 62 and the substrate 61 higher.

[0037] According to the heating film bonding system 100 of the present invention, the adhesive coating device 10 can coat the light-curing adhesive onto the substrate 61 or the heating film 62, the film bonding device 20 can pre-bond the heating film 62 onto the substrate 61, and the light curing device 40 can light-cur the light-curing adhesive layer 63, thereby bonding the heating film 62 onto the substrate 61. The light curing device 40 is used to achieve adhesive layer curing. The light curing device 40 is simpler and smaller in size than the hot pressing device, and can make the bonding strength between the heating film 62 and the substrate 61 higher. Furthermore, since the light curing time is much shorter than the hot pressing time of the hot pressing device used in the related technology, for example, the light curing time is usually a few seconds to a few minutes, while the hot pressing time requires more than 30 minutes, the film bonding efficiency can be significantly improved.

[0038] According to some embodiments of the present invention, with reference to Figure 1 , Figure 5 and Figure 6 Along the conveying direction of the substrate 61, the adhesive coating device 10, the film laminating device 20, and the photocuring device 40 are arranged sequentially. Figure 5 In this case, h represents the distance between the light curing lamp 42 and the heating film 62 on the substrate 61. At this time, the distance between the light curing lamp 42 and the light curing layer 63 on the substrate 61 is h plus the thickness of the heating film 62.

[0039] In the process of attaching the heating film 62 to the substrate 61 using the heating film bonding system 100, the substrate 61 sequentially flows through the adhesive coating device 10, the film bonding device 20, and the photocuring device 40. The adhesive coating device 10 coats the substrate 61 with photocurable adhesive to form a photocurable adhesive layer 63. The substrate 61 coated with the photocurable adhesive layer 63 is then conveyed to the film bonding device 20, where the heating film 62 is pre-attached to the photocurable adhesive layer 63 on the substrate 61. The substrate 61 with the heating film 62 attached is then conveyed to the photocuring device 40, where the photocuring lamp 42 irradiates and passes through the heating film 62, allowing the light from the lamp to enter the photocurable adhesive layer 63, causing a cross-linking reaction and curing the adhesive layer 63 into a solid state, thereby fixing the heating film 62 to the substrate 61.

[0040] According to some embodiments of the present invention, with reference to Figure 2 Along the conveying direction of the substrate 61, the adhesive coating device 10, the photocuring device 40, and the film application device 20 are arranged in sequence.

[0041] In the process of attaching the heating film 62 to the substrate 61 using the heating film bonding system 100, the substrate 61 sequentially flows through the adhesive coating device 10, the photocuring device 40, and the film bonding device 20. The adhesive coating device 10 coats the substrate 61 with photocurable adhesive to form a photocurable adhesive layer 63. The substrate 61 coated with the photocurable adhesive layer 63 is then transported to the photocuring device 40, where the photocuring lamp 42 irradiates the photocurable adhesive layer 63, activating it, for example, by activating an initiator within the photocurable layer 63. The substrate with the heating film 62 attached is then transported to the photocuring device 40, and subsequently to the film bonding device 20, where the heating film 62 is attached to the photocurable adhesive layer 63 on the substrate 61. At this point, the photocurable adhesive layer 63 is only activated and is in a stage where it is not yet cured or is in the early, slow-curing stage. After the heating film 62 is attached to the photocurable adhesive layer 63 on the substrate 61, the photocurable adhesive layer 63 cures rapidly, causing the photocurable adhesive layer 63 to undergo a cross-linking reaction and solidify into a solid state, thereby fixing the heating film 62 on the substrate 61.

[0042] After the photocurable adhesive is coated onto the substrate 61, the photocurable adhesive layer 63 is first irradiated by the photocuring device 40 for a preset time to activate the photocurable adhesive layer 63. Then, the heating film 62 is attached to the photocurable adhesive layer 63. In this way, the heating film 62 is attached to the photocurable adhesive layer 63 before the photocurable adhesive layer 63 on the substrate 61 begins to gradually cure but has not yet cured rapidly. This not only allows the heating film 62 to be fixed to the substrate 61 by the photocurable adhesive layer 63, but also makes full use of the time spent in the early slow curing stage of the photocurable layer 63, which can shorten the film application time and improve the film application efficiency.

[0043] In addition, by first irradiating the UV-curing adhesive layer 63 and then applying the film, there are fewer restrictions on the material selection of the heating film 62. For example, it is not necessary to consider whether the heating film 62 can pass through the light emitted by the UV curing lamp 42. For example, when the UV curing lamp 42 is an ultraviolet lamp, the material of the heating film 62 does not have to be limited to a material that passes through ultraviolet light, making the material selection of the heating film 62 more flexible.

[0044] According to some embodiments of the present invention, the position of the photocuring lamp 42 is adjustable. For example, the photocuring device 40 may include a moving mechanism disposed on the device support 41. The moving mechanism may be connected to the photocuring lamp 42 to drive the photocuring lamp 42 to move, for example, it may drive the photocuring lamp 42 to move in the horizontal direction, thereby adjusting the irradiation position of the photocuring lamp 42. For example, the moving mechanism may include a linear motor, a linear cylinder, or a linear hydraulic cylinder. By making the position of the photocuring lamp 42 adjustable, the position of the photocuring lamp 42 can be adjusted as needed, so that each part of the photocurable adhesive layer 63 can be better covered by the light irradiated by the photocuring lamp 42, ensuring the curing quality of the photocurable adhesive layer 63, thereby ensuring the bonding strength between the heating film 62 and the substrate 61.

[0045] Optionally, when there are multiple light curing lamps 42, at least some of the light curing lamps 42 are position-adjustable. Each position-adjustable light curing lamp 42 can be equipped with an individual moving mechanism, so that the position adjustment of each position-adjustable light curing lamp 42 is relatively independent of each other, thereby making the adjustment of multiple light curing lamps 42 more flexible and convenient.

[0046] In addition, when there are multiple light curing lamps 42, the positions of at least some of the light curing lamps 42 are adjustable, and the spacing between two adjacent light curing lamps 42 can be easily adjusted.

[0047] According to some embodiments of the present invention, with reference to Figure 4 and Figure 5 The irradiation angle of the UV curing lamp 42 is adjustable. For example, the UV curing device 40 may include a swing mechanism mounted on the device support 41. The swing mechanism can be connected to the UV curing lamp 42 to drive the UV curing lamp 42 to swing, thereby adjusting the irradiation angle of the UV curing lamp 42. For example, the swing mechanism may include a rotary motor, a rotary cylinder, or a rotary hydraulic cylinder. By making the irradiation angle of the UV curing lamp 42 adjustable, the irradiation angle of the UV curing lamp 42 on the UV curing adhesive layer 63 can be adjusted as needed, thereby adjusting the irradiation range so that each part of the UV curing adhesive layer 63 can be better covered by the light irradiated by the UV curing lamp 42, ensuring the curing quality of the UV curing adhesive layer 63, and thus ensuring the bonding strength between the heating film 62 and the substrate 61.

[0048] The illumination angle of the light curing lamp 42 refers to the angle between the central axis of the light curing lamp 42 and the vertical direction.

[0049] Optionally, when there are multiple light curing lamps 42, the irradiation angle of at least some of the light curing lamps 42 is adjustable. Each light curing lamp 42 with an adjustable irradiation angle can be equipped with an individual swing mechanism, so that the irradiation angle adjustment of each light curing lamp 42 with an adjustable irradiation angle is relatively independent of each other, thereby making the adjustment of multiple light curing lamps 42 more flexible and convenient.

[0050] According to some embodiments of the present invention, the irradiation angle of the UV curing lamp 42 is adjustable from 0 to 30°. By setting the adjustable range of the irradiation angle of the UV curing lamp 42 to 0 to 30°, the angle and range of the UV curing lamp 42 irradiating the UV curing adhesive layer 63 can be easily adjusted. Furthermore, ensuring that the irradiation angle of the UV curing lamp 42 is no greater than 30° avoids the irradiation energy or intensity on the UV curing adhesive layer 63 being affected by an excessively large irradiation angle. Thus, while making the irradiation angle of the UV curing lamp 42 adjustable, allowing for more flexible use of the UV curing lamp 42, the irradiation intensity of the UV curing lamp 42 on the UV curing adhesive layer 63 can be guaranteed, which is beneficial for shortening the curing time and improving the film application efficiency.

[0051] According to some embodiments of the present invention, the position of the photocuring lamp 42 is adjustable and the irradiation angle of the photocuring lamp 42 is adjustable. For example, the photocuring device 40 may include a moving mechanism, a first connecting bracket, and a swinging mechanism. The moving mechanism is mounted on the device bracket 41, and the swinging mechanism is mounted on the first connecting bracket. The moving mechanism is connected to the first connecting bracket to drive the swinging mechanism to move. The swinging mechanism and the photocuring lamp 42 are used to drive the photocuring lamp 42 to swing. When the moving mechanism drives the swinging mechanism to move, the photocuring lamp 42 can move together with the swinging mechanism. This allows adjustment of the irradiation angle and irradiation range of the photocuring lamp 42, as well as the irradiation position of the photocuring lamp 42, so that each part of the photocurable adhesive layer 63 can be better covered by the light irradiated by the photocuring lamp 42, ensuring the curing quality of the photocurable adhesive layer 63, thereby ensuring the bonding strength between the heating film 62 and the substrate 61.

[0052] Optionally, when there are multiple light curing lamps 42, at least some of the light curing lamps 42 have adjustable irradiation angles and adjustable positions. Each light curing lamp 42 with adjustable irradiation angles and adjustable positions can be equipped with an individual moving mechanism and a swinging mechanism, thereby making the adjustment of multiple light curing lamps 42 more flexible and convenient.

[0053] According to some embodiments of the present invention, the distance between the light-curing lamp 42 and the light-curing adhesive layer 63 is adjustable. For example, the light-curing device 40 may include a telescopic mechanism disposed on the device support 41. The telescopic mechanism may be connected to the light-curing lamp 42 to drive the light-curing lamp 42 to move and change the distance between the light-curing lamp and the light-curing adhesive layer 63. For example, the telescopic mechanism may drive the light-curing lamp 42 to move in the vertical direction, thereby adjusting the distance between the light-curing lamp 42 and the light-curing adhesive layer 63. For example, the telescopic mechanism may include a linear motor, a linear cylinder, or a linear hydraulic cylinder. By making the distance between the light-curing lamp 42 and the light-curing adhesive layer 63 adjustable, the irradiation intensity and the size of the irradiation spot of the light-curing lamp 42 on the light-curing adhesive layer 63 can be easily adjusted, so that each part of the light-curing adhesive layer 63 can be better covered by the light irradiated by the light-curing lamp 42, ensuring the curing quality of the light-curing adhesive layer 63, thereby ensuring the bonding strength between the heating film 62 and the substrate 61.

[0054] Optionally, when there are multiple light curing lamps 42, the distance between at least some of the light curing lamps 42 and the heating film 62 is adjustable. Each light curing lamp 42 with an adjustable distance from the heating film 62 can be equipped with an individual telescopic mechanism, so that the adjustment of each light curing lamp 42 with an adjustable distance from the heating film 62 is relatively independent of each other, thereby making the adjustment of multiple light curing lamps 42 more flexible and convenient.

[0055] According to some embodiments of the present invention, the distance between the UV-curing lamp 42 and the UV-curing adhesive layer 63 is adjustable within a range of 10cm to 20cm. This allows the distance between the UV-curing lamp 42 and the UV-curing adhesive layer 63 to be adjusted as needed. By making the distance between the UV-curing lamp 42 and the UV-curing adhesive layer 63 adjustable within a range of 10cm to 20cm, it is possible to... According to some embodiments of the present invention, the distance between the UV-curing lamp 42 and the UV-curing adhesive layer 63 is adjustable, the position of the UV-curing lamp 42 is adjustable, and the irradiation angle of the UV-curing lamp 42 is adjustable. For example, the UV-curing device 40 may include a moving mechanism, a first connecting bracket, a telescopic mechanism, a second connecting bracket, and a swinging mechanism. The moving mechanism is mounted on the device bracket 41, the telescopic mechanism is mounted on the second connecting bracket, and the moving mechanism is connected to the second connecting bracket to drive the telescopic mechanism to move horizontally. The swinging mechanism is mounted on the first connecting bracket, and the telescopic mechanism is connected to the first connecting bracket to drive the swinging mechanism to move vertically. The swinging mechanism and the UV-curing lamp 42 are used to drive the UV-curing lamp 42 to swing. When the moving mechanism drives the telescopic mechanism to move horizontally, the UV-curing lamp 42 can move horizontally together with the swinging mechanism and the telescopic mechanism. When the telescopic mechanism drives the swinging mechanism to move vertically, the UV-curing lamp 42 can move vertically together with the swinging mechanism.

[0056] This allows for adjustment of the irradiation angle and range of the light curing lamp 42, as well as the irradiation position of the light curing lamp 42 and the distance between the light curing lamp 42 and the light curing adhesive layer 63. This ensures that each part of the light curing adhesive layer 63 is better covered by the light irradiated by the light curing lamp 42, guaranteeing the curing quality of the light curing adhesive layer 63 and thus ensuring the bonding strength between the heating film 62 and the substrate 61.

[0057] Optionally, when there are multiple light curing lamps 42, at least some of the light curing lamps 42 are adjustable. Each adjustable light curing lamp 42 can be equipped with a separate moving mechanism, telescopic mechanism and swing mechanism, so that the adjustment of multiple light curing lamps 42 is more flexible and convenient.

[0058] According to some embodiments of the present invention, the irradiation intensity of the UV curing lamp 42 is adjustable. For example, the power of the UV curing lamp 42 can be adjusted to multiple levels, each with different power levels. The power of the UV curing lamp 42 can be adjusted to a suitable level as needed. By making the power of the UV curing lamp 42 adjustable, the power of the UV curing lamp 42 can be adjusted according to the thickness, area, etc. of the UV-curable layer, thereby adjusting the irradiation intensity. This allows for better and faster UV curing of the UV-curable adhesive layer 63, ensuring curing quality and shortening the curing time.

[0059] The irradiation intensity of the UV curing lamp 42 refers to the irradiation intensity of the UV curing lamp 42 on the UV curing adhesive layer 63, and the unit can be mJ / cm. 2 .

[0060] For example, the irradiation intensity of the UV curing lamp 42 is not less than 3000 mJ / cm. 2 This allows the UV curing lamp 42 to have a higher irradiation intensity, which helps to speed up the curing time and improve the film application efficiency.

[0061] According to some embodiments of the present invention, multiple light-curing lamps 42 are arranged at intervals. By arranging multiple light-curing lamps 42 at intervals, the irradiation area of ​​the light-curing device 40 per unit time can be increased, thereby improving the curing efficiency of the light-curing adhesive layer 63.

[0062] According to some embodiments of the present invention, a plurality of UV-curing lamps 42 are arranged in an array. By arranging the plurality of UV-curing lamps 42 in an array, the irradiation range of the plurality of UV-curing lamps 42 can be large and can be irradiated more uniformly onto the UV-curable adhesive layer 63, which is beneficial to improving the curing quality and shortening the curing time.

[0063] According to some embodiments of the present invention, at least some of the UV curing lamps 42 are independently controlled. For example, some of the UV curing lamps 42 may be independently controlled, or each UV curing lamp 42 may be independently controlled. The independent control of the UV curing lamps 42 includes at least one of switching the UV curing lamps 42 on and off and adjusting the power of the UV curing lamps 42. By making at least some of the UV curing lamps 42 independently controlled, when the UV curing device 40 is used to cure the UV-curable adhesive layer 63, some of the UV curing lamps 42 can be turned on or off as needed, and the power of at least some of the UV curing lamps 42 can be adjusted as needed. This makes the adjustment of curing conditions more flexible and precise, and allows for better matching of heating films 62 of different specifications.

[0064] According to some embodiments of the present invention, with reference to Figure 5 and Figure 6 The light spots formed by two adjacent UV-curing lamps 42 on the heating film 62 or the UV-curable adhesive layer 63 overlap. By ensuring that the light spots formed by two adjacent UV-curing lamps 42 on the heating film 62 or the UV-curable adhesive layer 63 overlap, the portion of the UV-curable adhesive layer 63 not irradiated by the UV-curing lamps 42 can be reduced or avoided. This allows each part of the UV-curable adhesive layer 63 to be better covered by the light irradiated by the UV-curing lamps 42, ensuring the curing quality of the UV-curable adhesive layer 63, and thus ensuring the bonding strength between the heating film 62 and the substrate 61.

[0065] According to some embodiments of the present invention, with reference to Figures 1-3 The adhesive coating device 10 includes an adhesive coating body 11 and an adhesive coating robotic arm 12. One end of the adhesive coating robotic arm 12 is connected to the adhesive coating body 11, and the other end of the adhesive coating robotic arm 12 is provided with an adhesive coating component 13. The adhesive coating component 13 is used to coat the substrate 61 or the heating film 62 with photocurable adhesive. For example, the adhesive coating robotic arm 12 is movably connected to the adhesive coating body 11, which allows the adhesive coating robotic arm 12 to move relative to the adhesive coating body 11. Through the movement of the adhesive coating robotic arm 12, the adhesive coating component 13 is driven to coat the photocurable adhesive at a preset position on the substrate 61 or the heating film 62.

[0066] For example, in Figure 2 In the example, the adhesive application component 13 includes a nozzle 131 and a nozzle 132. Adhesive is delivered through the nozzle 131 to the nozzle 132 and then sprayed from the nozzle 132 onto the substrate 61 or the heating film 62.

[0067] According to some embodiments of the present invention, with reference to Figure 1 and Figure 2The film application device 20 includes a film application machine body 21 and a film application robotic arm 22. One end of the film application robotic arm 22 is connected to the film application machine body 21, and the other end of the film application robotic arm 22 is provided with a gripper mechanism. The gripper mechanism is used to grip the heating film 62 and place the heating film 62 at a preset position on the substrate 61. For example, the film application robotic arm 22 is movably connected to the film application machine body 21, which allows the film application robotic arm 22 to move relative to the film application machine body 21. Through the movement of the film application robotic arm 22, the gripper mechanism is driven to move to the position of gripping the heating film 62. After the gripper mechanism grips the heating film 62, it places the heating film 62 at a preset position on the substrate 61. In this way, the heating film 62 can be initially pre-attached to the substrate 61 under the pre-fixation effect of the uncured light-cured adhesive layer 63.

[0068] According to some embodiments of the present invention, with reference to Figure 4 The film-applying device 20 may further include a pressing mechanism, which includes a pressing drive mechanism and a pressing component 24. For example, the pressing drive mechanism can be a motor, a cylinder, or a hydraulic cylinder. The pressing component 24 is used to contact the heating film 62. The pressing drive mechanism is connected to the pressing component 24 to drive the pressing component 24 to apply pressure toward the substrate 61 to the heating film 62. By applying pressure toward the substrate 61 to the heating film 62 by the pressing component 24, the heating film 62 can be more smoothly attached to the substrate 61, and air bubbles between the heating film 62 and the substrate 61 can be further reduced, thereby further improving the adhesion strength between the heating film 62 and the substrate 61.

[0069] For example, in some embodiments of the present invention, reference is made to Figure 4 The pressing component 24 may include a roller 242 and a connecting arm 241. One end of the connecting arm 241 is connected to the pressing drive mechanism, and the roller 242 is rotatably connected to the other end of the connecting arm 241. The roller 242 is used to roll the heating film 62. The pressing drive mechanism can drive the roller 242 to move from one end of the heating film 62 to the other end of the heating film 62, and the roller 242 rolls the heating film 62, thereby making the heating film 62 adhere more smoothly to the substrate 61, and further reducing air bubbles between the heating film 62 and the substrate 61, and further improving the adhesion strength between the heating film 62 and the substrate 61.

[0070] According to some embodiments of the present invention, with reference to Figure 1 and Figure 2The heating film bonding system 100 also includes a film positioning plate 30, which is detachably connected to the substrate 61. For example, the film positioning plate 30 and the substrate 61 can be connected by a snap-fit ​​connection, or they can be connected by a positioning hole and a positioning post. At least one positioning opening is formed on the film positioning plate 30, extending through the film positioning plate 30 along its thickness direction, and defining a film bonding area within the positioning opening. For example, multiple positioning openings arranged side-by-side can be formed on the film positioning plate 30, each defining a film bonding area. The film bonding area is used to accommodate the heating film 62.

[0071] For example, after applying photocurable adhesive to substrate 61, film-mounting positioning plate 30 can be installed on substrate 61 and on the side of substrate 61 coated with photocurable adhesive. The positioning port of film-mounting positioning plate 30 defines the film-mounting area. Heating film 62 is attached to the film-mounting area. After the heating film 62 is attached, film-mounting positioning plate 30 is removed from substrate 61.

[0072] According to some embodiments of the present invention, with reference to Figure 1 and Figure 2 The heating film bonding system 100 includes a conveyor line 50 for carrying and conveying the substrate 61. For example, the aforementioned adhesive applicator 10, film application device 20, and photocuring device 40 can be arranged sequentially at intervals along the conveying direction of the conveyor line 50. By including the conveyor line 50 in the heating film bonding system 100, the transfer of the substrate 61 at different workstations is facilitated.

[0073] According to some embodiments of the present invention, the heating film bonding system 100 includes a mobile carriage for carrying and transporting a substrate 61. For example, the mobile carriage can transfer the substrate 61 between the adhesive coating device 10, the film application device 20, and the photocuring device 40. By including the mobile carriage in the heating film bonding system 100, the transfer of the substrate 61 at different workstations is facilitated.

[0074] A film application method for a heating film application system 100 according to a second aspect embodiment of the present invention includes: A photocurable adhesive is applied to the substrate 61 using the adhesive application apparatus 10 to form a photocurable adhesive layer 63; The substrate 61 coated with the photocurable adhesive layer 63 is transported to the photocuring device 40. The photocurable adhesive layer 63 is irradiated by the photocuring device 40 for a preset time to activate the photocurable adhesive layer 63. For example, the initiator in the photocurable adhesive layer 63 can be activated. At this time, the photocurable adhesive layer 63 is only activated and is in the stage of not yet cured or slow early curing. For example, the preset time can be 10s-30s. The substrate 61 coated with the photocurable adhesive layer 63 is transported to the film-applying device 20, and the heating film 62 is applied to the photocurable adhesive layer 63 on the substrate 61 using the film-applying device 20. For example, the film-applying device 20 applies the heating film 62 to the photocurable adhesive layer 63 for a period of several minutes, such as 3-8 minutes. After the photocurable adhesive layer 63 is fully cured, for example, the curing time of the photocurable adhesive layer 63 can be from a few minutes to more than ten minutes, for example, the curing time of the photocurable adhesive layer 63 is 5-15 minutes, after the heating film 62 is attached to the photocurable adhesive layer 63 on the substrate 61, the photocurable adhesive layer 63 cures rapidly, causing the photocurable adhesive layer 63 to undergo a cross-linking reaction and solidify into a solid state, thereby fixing the heating film 62 on the substrate 61.

[0075] According to the heating film bonding system of the present invention, after the photocurable adhesive is coated on the substrate 61, the photocurable adhesive layer 63 is first irradiated by the photocuring device 40 for a preset time to activate the photocurable adhesive layer 63. Then, the heating film 62 is attached to the photocurable adhesive layer 63. In this way, the heating film 62 is attached to the photocurable adhesive layer 63 before the photocurable adhesive layer 63 on the substrate 61 begins to gradually cure but has not yet cured rapidly. This not only allows the heating film 62 to be fixed to the substrate 61 by the photocurable adhesive layer 63, but also makes full use of the time experienced by the slow curing stage of the photocurable layer 63 in the early stage, which can shorten the bonding time and improve the bonding efficiency.

[0076] In addition, by first irradiating the UV-curing adhesive layer 63 and then applying the film, there are fewer restrictions on the material selection of the heating film 62. For example, it is not necessary to consider whether the heating film 62 can pass through the light emitted by the UV curing lamp 42. For example, when the UV curing lamp 42 is an ultraviolet lamp, the material of the heating film 62 does not have to be limited to a material that passes through ultraviolet light, making the material selection of the heating film 62 more flexible.

[0077] According to a third aspect of the present invention, a battery device includes: a housing, battery cells, and a thermal management unit, wherein the battery cells are disposed within the housing. Multiple battery cells may be grouped together to form at least one battery module. The thermal management unit is disposed within the housing and includes at least one heat exchange component. The heat exchange component includes a heat exchange plate and a heating film 62. The heating film 62 is fixed to the heat exchange plate by a photocurable adhesive layer 63 and is thermally connected to the battery cells. When the battery cells require heating, the heating film 62 can be energized, thereby heating the battery cells.

[0078] The heating film 62 can be bonded and fixed to the heat exchange plate using the heating film bonding system 100 described above.

[0079] The heat exchange plate is a heat-conducting plate, and a heat exchange channel can be set inside the heat exchange plate. When the battery cell needs to be cooled, the heat dissipation medium, such as refrigerant, can flow through the heat exchange channel to remove the heat generated by the battery cell.

[0080] The heat exchange components can be installed between battery modules, inside battery modules, or between battery modules and the housing. When the heat exchange components are installed between the battery modules and the housing, they can be fixed to the housing, and the heat exchange plates can be integrally formed with the housing.

[0081] According to the battery device of the present invention, by using a light-curing adhesive layer 63 to bond and fix the heating film 62 to the heat exchange plate, the bonding strength between the heating film 62 and the heat exchange plate can be high. Furthermore, since the light-curing adhesive layer 63 is cured by light irradiation, the curing time is short, which is beneficial to improving the efficiency of bonding the heating film 62 to the heat exchange plate.

[0082] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0083] In the description of this invention, "first feature" and "second feature" may include one or more of the features.

[0084] In the description of this invention, "a plurality of" means two or more.

[0085] In the description of this invention, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or it may include the first and second features not being in direct contact but being in contact through another feature between them.

[0086] In the description of this invention, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature.

[0087] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0088] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A heating film bonding system, characterized in that, include: An adhesive coating apparatus is used to coat a substrate or the heating film with a photocurable adhesive to form a photocurable adhesive layer. A film-applying device is used to apply the heating film to the substrate, wherein the heating film is fixed to the substrate by the photocurable adhesive layer. A photocuring apparatus, comprising an apparatus support and at least one photocuring lamp, wherein the photocuring lamp is mounted on the apparatus support and is used to irradiate the photocurable adhesive layer to cure the photocurable adhesive layer.

2. The heating film bonding system according to claim 1, characterized in that, The irradiation angle of the light-curing lamp is adjustable, and the adjustable range of the irradiation angle is 0 to 30°; and / or, the irradiation intensity of the light-curing lamp is adjustable, and the irradiation intensity of the light-curing lamp is not less than 3000 mJ / cm². 2 .

3. The heating film bonding system according to claim 1, characterized in that, The distance between the light-curing lamp and the light-curing adhesive layer is adjustable, and the adjustable range of the distance between the light-curing lamp and the light-curing adhesive layer is 10cm to 20cm.

4. The heating film bonding system according to claim 1, characterized in that, The light curing lamps are multiple lamps arranged at intervals; The array of multiple light-curing lamps is arranged and / or at least some of the light-curing lamps are independently controlled.

5. The heating film bonding system according to claim 1, characterized in that, The light spots formed by two adjacent light-curing lamps on the heating film or the light-curing adhesive layer have an overlapping portion.

6. The heating film bonding system according to claim 1, characterized in that, The adhesive coating device includes an adhesive coating machine body and an adhesive coating robotic arm. One end of the adhesive coating robotic arm is connected to the adhesive coating machine body, and the other end of the adhesive coating robotic arm is provided with an adhesive coating component. The adhesive coating component is used to coat the substrate or the heating film with a light-curing adhesive.

7. The heating film bonding system according to claim 1, characterized in that, The film application device includes a film application machine body and a film application robotic arm. One end of the film application robotic arm is connected to the film application machine body, and the other end of the film application robotic arm is provided with a gripper mechanism. The gripper mechanism is used to hold the heating film and place the heating film at a preset position on the substrate.

8. The heating film bonding system according to claim 7, characterized in that, The film-applying device further includes a pressing mechanism, which includes a pressing drive mechanism and a pressing component. The pressing component is used to contact the heating film, and the pressing drive mechanism is connected to the pressing component to drive the pressing component to apply pressure toward the substrate to the heating film.

9. The heating film bonding system according to claim 8, characterized in that, The pressing component includes a roller and a connecting arm. One end of the connecting arm is connected to the pressing drive mechanism, and the roller is rotatably connected to the other end of the connecting arm. The roller is used to press the heating film.

10. The heating film bonding system according to any one of claims 1-9, characterized in that, It also includes a film-applying positioning plate, which is detachably connected to the substrate. At least one positioning hole is formed on the film-applying positioning plate, which penetrates the film-applying positioning plate along the thickness direction and defines a film-applying area within the positioning hole.

11. The heating film bonding system according to any one of claims 1-9, characterized in that, The heating film bonding system includes a mobile trolley for carrying and transporting the substrate; or, the heating film bonding system includes a conveyor line for carrying and transporting the substrate.

12. The heating film bonding system according to any one of claims 1-9, characterized in that, Along the transport direction of the substrate, the adhesive coating device, the photocuring device, and the film-applying device are arranged in sequence.

13. A method for applying a heating film to a heating film bonding system according to any one of claims 1-12, characterized in that, include: The photocurable adhesive is applied to the substrate using the coating apparatus to form the photocurable adhesive layer; The photocurable adhesive layer is irradiated with the photocuring device for a preset time to excite the photocurable adhesive layer; The heating film is attached to the photocurable adhesive layer on the substrate using the film-applying device. Wait for the photocurable adhesive layer to fully cure.

14. A battery device, characterized in that, include: Box; The battery cell is housed within the casing. A thermal management unit is disposed inside the housing and includes at least one heat exchange component. The heat exchange component includes a heat exchange plate and a heating film. The heating film is fixed to the heat exchange plate by a photocurable adhesive layer and is thermally connected to the battery cell.

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