Semiconductor precision part transfer box fixing structure

Abstract

The embodiment of the invention provides a semiconductor precision part transfer box fixing structure, a transfer box comprises an upper box body and a lower box body which can be separated, the upper box body and the lower box body are matched with each other to form a containing space used for containing a precision part, and the fixing structure is installed in the box body through a supporting piece and used for positioning and fixing the precision part. The fixing structure comprises a supporting plate, the precision component is placed on the supporting plate, the peripheral edge of the supporting plate extends outwards to form a plurality of protruding parts, fixing parts are arranged on the protruding parts, and the fixing parts abut against the outer wall of the precision component. According to the precise part fixing structure, the precise part is positioned and fixed in multiple directions through the multiple fixing parts, the shaking amplitude of the precise part in the transferring process can be greatly reduced, collision and friction caused by shaking are effectively avoided, and the surface quality and structural integrity of the precise part are protected; and the fixing effect is reliable due to the abutting mode of the fixing part and the outer wall of the precise part.

Description

Technical Field

[0001] This specification relates to the field of semiconductor technology, specifically to a semiconductor precision component transfer box fixing structure. Background Technology

[0002] In the field of semiconductor manufacturing and processing, precision semiconductor components, such as wafers, chips, and optical elements, play a crucial role. These components not only have extremely high technical value, but their material properties are also extremely fragile and sensitive to external environmental conditions. Strict protective measures must be taken during transportation to ensure that their performance and quality are not compromised.

[0003] Currently, the industry widely uses transfer boxes as the main protective device during the transport of precision semiconductor components. However, with the continuous development of semiconductor technology and increasingly stringent requirements for product quality, traditional transfer boxes have gradually revealed many prominent problems that urgently need to be solved in practical applications. Among these, the most critical and far-reaching is their severely insufficient protection for precision semiconductor components.

[0004] Traditional transport boxes have significant structural design flaws. Their design philosophy fails to adequately consider the various complex operating conditions that precision semiconductor components may encounter during transport, and lacks scientifically sound buffering and securing mechanisms. Specifically, when the transport box is affected by external vibrations, bumps, or other dynamic factors during transportation, or when it experiences severe shaking due to improper operation by personnel, the lack of an effective buffer structure to absorb and disperse vibration energy, and the absence of reliable securing devices to ensure component stability, makes it highly susceptible to significant shaking within the box.

[0005] This shaking phenomenon can lead to a series of serious consequences. On the one hand, the precision semiconductor components will frequently collide and rub against the inner wall of the transport box during the shaking process. Because these components are usually made of relatively fragile materials and require extremely high surface precision, even slight collisions and friction can cause scratches, wear, and other damage to their surfaces, thereby affecting their key indicators such as optical and electrical performance. On the other hand, long-term repeated shaking can cause irreversible damage to the structural integrity of the precision semiconductor components. Summary of the Invention

[0006] In view of this, embodiments of this specification provide a semiconductor precision component transfer box fixing structure.

[0007] This specification provides the following technical solution in its embodiments: a semiconductor precision component transfer box fixing structure, the transfer box including a separable upper box body and a lower box body, the upper box body and the lower box body cooperating to form a receiving space for placing precision components, the fixing structure being installed in the box body by a support member for positioning and fixing the precision components, the fixing structure including a support plate, the precision components being placed on the support plate, the outer peripheral edge of the support plate extending outward to form a plurality of protrusions, each of the plurality of protrusions being provided with a fixing part, the fixing part abutting against the outer wall of the precision component.

[0008] Preferably, the fixing part includes fixing blocks, and multiple fixing blocks cooperate with each other to clamp and fix the precision component. Fixing plates are extended on opposite sides of the fixing blocks, and the fixing blocks are mounted on the protrusion through the fixing plates.

[0009] Preferably, the protrusion includes a protruding plate, the top of which has an upwardly protruding mounting ear corresponding to the fixing plate, and the fixing plate is mounted on the mounting ear by fasteners.

[0010] Preferably, the distance between the two mounting ears is greater than the length of the fixing block, so that the fixing block can pass between the two mounting ears.

[0011] Preferably, the fixing block is provided with an elastic pad on the side near the precision component, and the elastic pad is in close contact with the outer wall of the precision component.

[0012] Preferably, the fixing structure further includes a protective plate, which is disposed between the support plate and the precision component. The protective plate has the same size as the support plate, and the upper part of the protective plate has a notch to avoid the fixing part.

[0013] Preferably, the top of the protective plate extends upward to form a positioning protrusion, which mates with a through groove on the precision component.

[0014] Preferably, the through groove is an arc-shaped groove, so that the precision component can rotate within a certain angle relative to the protective plate.

[0015] Preferably, the support member is provided in three sets, with one end of the support member connected to the bottom wall of the lower box and the other end connected to the support plate.

[0016] Preferably, the protrusions are provided in four groups, and the four groups of protrusions are evenly distributed in a circle.

[0017] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least: The fixing structure uses multiple fixing parts to position and fix precision components in multiple directions, which can greatly reduce the shaking amplitude of precision components during transportation, or even make them almost shaking. This effectively avoids collisions and friction caused by shaking, and protects the surface quality and structural integrity of precision components. The fixing structure is firmly installed in the box through the support, and the abutment method between the fixing parts and the outer wall of the precision components makes the fixing effect reliable. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the semiconductor precision component transport box provided in this application; Figure 2 This is a schematic diagram of the internal structure of the lower box of the semiconductor precision component transport box provided in this application; Figure 3 This is a first-view structural schematic diagram of the semiconductor precision component transfer box fixing structure provided in this application; Figure 4 This is a second-view structural schematic diagram of the semiconductor precision component transfer box fixing structure provided in this application.

[0020] In the diagram, 1. Upper box body; 2. Lower box body; 3. Precision component; 4. Fixing part; 5. Support plate; 6. Fixing block; 7. Fixing plate; 8. Mounting ear; 9. Elastic pad; 10. Protruding plate; 11. Protective plate; 12. Protrusion; 13. Support component. Detailed Implementation

[0021] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0022] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0024] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0025] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0026] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0027] like Figures 1-4 As shown, a semiconductor precision component transfer box fixing structure is disclosed. The transfer box includes a separable upper box body 1 and a lower box body 2. The upper box body 1 and the lower box body 2 cooperate to form a receiving space for placing a precision component 3. The fixing structure is installed in the box body by a support member 13 for positioning and fixing the precision component 3. The fixing structure includes a support plate 5. The precision component 3 is placed on the support plate 5. Multiple protrusions extend outward from the outer periphery of the support plate 5. Each of the multiple protrusions is provided with a fixing part 4, which abuts against the outer wall of the precision component 3.

[0028] The semiconductor precision component 3 transfer box consists of a separable upper box 1 and a lower box 2. In use, the upper box 1 and the lower box 2 are assembled together to form a closed or semi-closed containment space. This containment space is specifically used to place the semiconductor precision component 3, providing it with a relatively independent environment.

[0029] The fixing structure is installed inside the transfer box via the support member 13. The support member 13 serves to stably support and position the fixing structure within the box, ensuring that the fixing structure will not move arbitrarily during transfer, thereby guaranteeing the stability of fixing the precision component 3.

[0030] A precision semiconductor component 3 is placed on a support plate 5 with a fixed structure. The support plate 5 provides a flat and stable platform for the precision component 3, capable of bearing its weight and maintaining a relatively stable position in the horizontal direction. Multiple protrusions extend outward from the outer periphery of the support plate 5, each with a fixing part 4. When the precision component 3 is placed on the support plate 5, these fixing parts 4 abut against the outer wall of the precision component 3. By applying force to the outer wall of the precision component 3 from different directions through the multiple fixing parts 4, the precision component 3 is firmly fixed to the support plate 5, restricting its movement in all directions, including horizontal translation and rotation, thereby achieving precise positioning and fixation of the precision component 3.

[0031] During transport, the transport box is inevitably affected by external vibrations, bumps, or improper operation. Traditional transport boxes lack effective fixing mechanisms, making it easy for the precision component 3 to wobble inside, colliding and rubbing against the inner wall, leading to damage. This fixing structure, however, uses multiple fixing parts 4 to position and fix the precision component 3 in multiple directions, greatly reducing the amplitude of wobble during transport, even eliminating it completely. This effectively avoids collisions and friction caused by wobble, protecting the surface quality and structural integrity of the precision component 3. The fixing structure is securely installed inside the box by the support member 13, and the contact method between the fixing parts 4 and the outer wall of the precision component 3 ensures reliable fixing. During long-term transport, even with severe vibrations or bumps, the precision component 3 remains firmly fixed to the support plate 5, without loosening or shifting, greatly enhancing the stability and reliability of the transport process.

[0032] like Figures 2-4 As shown, in some embodiments, the fixing part 4 includes a fixing block 6, and multiple fixing blocks 6 cooperate with each other to clamp and fix the precision component 3. Fixing plates 7 are formed on opposite sides of the fixing blocks 6, and the fixing blocks 6 are mounted on the protrusion through the fixing plates 7.

[0033] After the semiconductor precision component 3 is placed on the support plate 5, multiple fixing blocks 6 surround the precision component 3 from different directions. Since each fixing block 6 has a certain rigidity and specific shape, they cooperate with each other to apply an inward clamping force to the precision component 3. These clamping forces are balanced in all directions, firmly fixing the precision component 3 to a predetermined position on the support plate 5, restricting the horizontal translation and rotational freedom of the precision component 3, and preventing it from moving during transport. The fixing plates 7 extending from the sides of the fixing blocks 6 serve a connecting and fixing function. During installation, the fixing plates 7 are mated with the protrusions, and the fixing plates 7 are securely installed on the protrusions using appropriate connection methods, such as bolt connections or snap-fit ​​connections.

[0034] Multiple fixing blocks 6 work together to clamp the precision component 3 from different directions, providing a more comprehensive and stable fixing force compared to a single-direction fixing method. This multi-directional clamping effectively disperses various external forces generated during transportation, such as vibration and impact, ensuring that the precision component 3 is uniformly constrained in all directions. This significantly reduces the possibility of the precision component 3 shaking, shifting, or even falling off, thus improving the reliability of the fixing. The fixing blocks 6 are designed to be precisely manufactured according to the shape and size of the precision component 3, allowing them to fit tightly against the outer wall of the precision component 3 during clamping. This precise fit ensures that the precision component 3 is accurately fixed in the predetermined position on the support plate 5, reducing positioning errors.

[0035] The number, position, and shape of the fixing blocks 6 can be flexibly adjusted according to the different shapes and sizes of the precision semiconductor components 3. For example, for irregularly shaped precision components 3, the number of fixing blocks 6 can be increased to clamp them from more directions; for larger precision components 3, the distance between the fixing blocks 6 can be adjusted to accommodate their size variations. This adjustability makes the fixing structure highly versatile and can meet the fixing requirements of various types of precision semiconductor components 3.

[0036] like Figures 3-4 As shown, in some embodiments, the protrusion includes a protruding plate 10, the top of which is formed with a mounting ear 8 corresponding to the fixing plate 7, and the fixing plate 7 is mounted on the mounting ear 8 by fasteners.

[0037] A protruding plate 10 is provided on the outer periphery of the support plate 5 of the transfer box as the main structure of the protrusion. The top of the protruding plate 10 extends upward to form mounting ears 8. The position and shape of these mounting ears 8 are pre-designed and correspond to the fixing plate 7. When it is necessary to fix the precision semiconductor component 3, the fixing plate 7 with the fixing block 6 is placed in the position corresponding to the mounting ear 8, so that the mounting holes on the fixing plate 7 are aligned with the mounting holes on the mounting ear 8, achieving initial positioning. Fasteners, such as bolts, nuts, screws, etc., are passed through the aligned mounting holes on the fixing plate 7 and the mounting ear 8. By tightening the fasteners, the preload generated by the fasteners is used to firmly press the fixing plate 7 onto the mounting ear 8. In this way, the fixing plate 7 and the mounting ear 8 establish a stable mechanical connection, thereby connecting the fixing block 6 to the protruding plate 10 (protrusion) through the fixing plate 7, and finally fixing the fixing block 6 stably on the periphery of the support plate 5 for fixing the precision component 3 placed on the support plate 5.

[0038] The fixing plate 7 is mounted on the mounting ear 8 using fasteners, providing a strong and reliable fastening force. Compared to some simple snap-fit ​​or adhesive connections, fastener connections can withstand greater external forces and are less prone to loosening or falling off during transportation when encountering vibrations or impacts. This ensures that the fixing block 6 is always firmly fixed to the protrusion, thereby guaranteeing a stable and reliable fixation effect on the precision component 3. The corresponding design of the mounting ear 8 and the fixing plate 7 allows for easy and accurate placement of the fixing plate 7 onto the mounting ear 8 during installation, and precise positioning is achieved through the alignment of the mounting holes.

[0039] like Figures 3-4 As shown, in some embodiments, the distance between the two mounting ears 8 is greater than the length of the fixing block 6, so that the fixing block 6 can pass between the two mounting ears 8.

[0040] In the design of the transfer box fixing structure, the distance between the two mounting ears 8 is set to be greater than the length of the fixing block 6. This ensures sufficient space between the fixing block 6 and the area where the mounting ears 8 are located in the initial state, providing a convenient passage for the installation of the fixing block 6. When the fixing block 6 needs to be installed, because there is enough space between the two mounting ears 8, the operator can directly pass the fixing block 6 through the gap between the two mounting ears 8 in a direction perpendicular to the plane where the mounting ears 8 are located, allowing the fixing block 6 to reach the vicinity of the predetermined installation position. Then, the fixing plates 7 on both sides of the fixing block 6 are aligned with the mounting ears 8, and the fixing plates 7 are installed on the mounting ears 8 using fasteners, completing the installation and fixing of the fixing block 6.

[0041] This design makes the installation of the fixing block 6 very simple and straightforward. Operators do not need to perform complex flipping, rotating, or adjusting operations; they simply pass it through the gap between the two mounting ears 8. This significantly reduces the time and effort required for installation and improves installation efficiency.

[0042] like Figures 3-4 As shown, in some embodiments, the fixing block 6 is provided with an elastic pad 9 on the side near the precision component 3, and the elastic pad 9 is in close contact with the outer wall of the precision component 3.

[0043] The elastic pad 9 fits tightly against the outer wall of the precision component 3, increasing the friction between the fixing block 6 and the precision component 3. This increased friction effectively prevents the precision component 3 from loosening or shifting within the fixing block 6 during transport due to vibration, shaking, or inertia, ensuring that the precision component 3 remains stably fixed in the predetermined position. For irregularly shaped semiconductor precision components 3, the elastic deformation capability of the elastic pad 9 allows it to better adapt to the component's shape. Regardless of whether the surface of the precision component 3 is raised 12, recessed, or has an irregular curve, the elastic pad 9 can fit tightly, providing uniform fixing force and ensuring that the fixing effect is not affected by the shape of the component.

[0044] During transport, the transport box will inevitably be subjected to various external impacts and vibrations. The elastic pad 9 has good cushioning properties, which can absorb and disperse these impact energies, reducing the direct impact of vibration on the precision component 3. The surface of the elastic pad 9 is usually soft and smooth, and when it comes into contact with the outer wall of the precision component 3, it will not cause scratches or wear to the surface of the precision component 3 like hard materials.

[0045] like Figures 3-4 As shown, in some embodiments, the fixing structure further includes a protective plate 11, which is disposed between the support plate 5 and the precision component 3. The protective plate 11 has the same size as the support plate 5, and the protective plate 11 has a notch to avoid the fixing part 4.

[0046] A protective plate 11 is placed between the support plate 5 and the precision component 3. Its dimensions are the same as the support plate 5, and the protective plate 11 completely covers the surface of the support plate 5, forming a complete isolation layer. Simultaneously, the protective plate 11 has notches to avoid the fixing part 4. The shape and position of these notches are designed according to the specific structure of the fixing part 4, ensuring that the fixing part 4 can pass through the notches and normally perform its fixing function for the precision component 3 without being obstructed by the protective plate 11. The protective plate 11 utilizes its material properties to establish a physical barrier between the support plate 5 and the precision component 3. When external factors that may adversely affect the precision component 3 (such as impurities, sharp objects, liquids, etc. on the support plate 5) appear, the protective plate 11 can prevent these factors from directly contacting the precision component 3, thereby protecting the precision component 3.

[0047] During transport, the transport box may be subjected to various external forces, such as vibration and impact. These external forces are transmitted to the precision component 3 through the support plate 5. The presence of the protective plate 11 can disperse some of the stress, making the stress more evenly distributed on the precision component 3 and reducing the damage caused by stress concentration to the precision component 3. Since the protective plate 11 and the support plate 5 are the same size, the protective plate 11 can be easily and accurately placed on the support plate 5 during installation, serving a positioning function.

[0048] like Figures 3-4 As shown, in some embodiments, the top of the protective plate 11 extends upward to form a positioning protrusion 12, which engages with a through groove on the precision component 3. The through groove is an arc-shaped groove, allowing the precision component 3 to rotate relative to the protective plate 11 within a certain angle.

[0049] The positioning protrusion 12, extending upward from the top of the protective plate 11, is specifically designed in shape and size according to the specifications of the through groove on the precision component 3. When the precision component 3 is placed on the protective plate 11, the positioning protrusion 12 embeds into the through groove of the precision component 3, forming a mating relationship. Through the interlocking of the protrusion 12 and the through groove, the precision component 3 is initially positioned on the protective plate 11. Since the through groove on the precision component 3 is designed as an arc groove, when the positioning protrusion 12 is embedded in the arc groove, the precision component 3 can rotate relative to the protective plate 11 along the trajectory of the arc groove when subjected to external force. The radius of curvature and length of the arc groove determine the range of rotation angle of the precision component 3. As long as the external force does not exceed a certain limit, the precision component 3 can rotate within the angle allowed by the arc groove. The precision component 3 needs to be angled according to the actual installation situation. The design of the arc groove allows the precision component 3 to rotate relative to the protective plate 11 within a certain angle range, thereby meeting different installation angle requirements.

[0050] like Figure 4As shown, in some embodiments, the support member 13 is provided in three sets. One end of the support member 13 is connected to the inner bottom wall of the lower box 2, and the other end is connected to the support plate 5. The three sets of support members 13 form a stable support frame. The three sets of support members 13 are similar to three support points, which can provide a relatively stable planar support for the support plate 5. The layout of the three sets of support members 13 allows the load on the support plate 5 to be distributed more evenly to the inner bottom wall of the lower box 2.

[0051] like Figures 2-4 As shown, in some embodiments, four sets of protrusions are provided, and the four sets of protrusions are evenly distributed circumferentially. The four sets of evenly distributed circumferential protrusions provide a high-precision positioning reference for the placement of the precision component 3, allowing the operator to quickly and accurately place the precision component 3 in the designated position during the assembly process.

[0052] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description since they correspond to the system, and relevant parts can be referred to the descriptions in the system embodiments.

[0053] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A semiconductor precision component transfer box fixing structure, the transfer box comprising a separable upper box body and a lower box body, the upper box body and the lower box body cooperating to form a receiving space for placing precision components, the fixing structure being installed in the box body by a support member for positioning and fixing the precision components, characterized in that, The fixing structure includes a support plate, on which the precision component is placed. The outer periphery of the support plate extends outward to form multiple protrusions, each of which is provided with a fixing part, which abuts against the outer wall of the precision component.

2. The semiconductor precision component transfer box fixing structure according to claim 1, characterized in that, The fixing part includes fixing blocks, and multiple fixing blocks cooperate with each other to clamp and fix the precision parts. Fixing plates are extended on opposite sides of the fixing blocks, and the fixing blocks are mounted on the protrusions through the fixing plates.

3. The semiconductor precision component transfer box fixing structure according to claim 2, characterized in that, The protrusion includes a protruding plate, the top of which has an upwardly protruding mounting ear corresponding to the fixing plate, and the fixing plate is mounted on the mounting ear by fasteners.

4. The semiconductor precision component transfer box fixing structure according to claim 3, characterized in that, The distance between the two mounting ears is greater than the length of the fixing block, so that the fixing block can pass between the two mounting ears.

5. The semiconductor precision component transfer box fixing structure according to claim 2, characterized in that, An elastic pad is provided on the side of the fixing block near the precision component, and the elastic pad is in close contact with the outer wall of the precision component.

6. The semiconductor precision component transfer box fixing structure according to any one of claims 1-5, characterized in that, The fixing structure also includes a protective plate, which is disposed between the support plate and the precision component. The protective plate is the same size as the support plate, and the upper part of the protective plate has a notch to avoid the fixing part.

7. The semiconductor precision component transfer box fixing structure according to claim 6, characterized in that, The top of the protective plate extends upward to form a positioning protrusion, which mates with a through groove on a precision component.

8. The semiconductor precision component transfer box fixing structure according to claim 7, characterized in that, The through groove is an arc-shaped groove, so that the precision component can rotate within a certain angle relative to the protective plate.

9. The semiconductor precision component transfer box fixing structure according to claim 1, characterized in that, The support is provided in three sets. One end of the support is connected to the bottom wall of the lower box, and the other end is connected to the support plate.

10. The semiconductor precision component transfer box fixing structure according to claim 1, characterized in that, The protrusions are provided in four groups, and the four groups of protrusions are evenly distributed in a circle.

Images