Special high-temperature printing ink for microcrystalline glass and preparation method of special high-temperature printing ink

Abstract

The invention discloses special high-temperature printing ink for microcrystalline glass and a preparation method thereof, and the high-temperature printing ink comprises the following components in percentage by mass: 50-60% of glass powder, 20-30% of a coloring agent and 15-25% of an organic carrier, and the glass powder is prepared from SiO2, Bi2O3, B2O3, TiO2, Al2O3, ZrO2, Li2O and ZnO. According to the high-temperature printing ink special for the microcrystalline glass, the lead-free low-expansion glass powder with specific composition is designed, and the formula of the printing ink is optimized, so that the thermal expansion coefficient of the obtained printing ink is well matched with that of a microcrystalline glass substrate. According to the printing ink, Bi2O3-B2O3-SiO2 system glass powder is adopted, and through the synergistic effect of Li2O, ZrO2 and other components, the thermal expansion coefficient is remarkably reduced while the low melting characteristic is kept. After high-temperature sintering at about 700-800 DEG C, a glaze layer and a matrix form firm combination, the surface is compact and smooth, and the glaze has excellent adhesive force and thermal shock resistance and good acid resistance, and completely meets high-temperature sintering process requirements and long-term use reliability of a microcrystalline glass panel.

Description

Technical Field

[0001] This invention relates to the field of organic chemical synthesis technology, and more specifically, to a high-temperature ink for microcrystalline glass and its preparation method. Background Technology

[0002] The coefficient of thermal expansion of ordinary float glass is typically between 8.0 and 9.5 × 10⁻⁶. -6 The coefficient of thermal expansion of commercially available lead-free high-temperature tempered glass ink is generally 7 to 10 × 10 °C. -6 Between ℃. However, as a novel high-performance material, glass-ceramic has an extremely low coefficient of thermal expansion (3.0~4.0×10). -6 / ℃). This huge difference in the coefficient of thermal expansion leads to significant technical bottlenecks when traditional lead-free high-temperature tempered glass inks are applied to microcrystalline glass substrates: after the ink is printed on the surface of the microcrystalline glass and undergoes a high-temperature sintering process above 700℃, during the cooling process, due to the severe mismatch in the coefficients of thermal expansion between the ink and the substrate, interface failures such as film cracking and peeling inevitably occur. This not only damages the decorative effect of the product, but also seriously affects the long-term reliability of the device.

[0003] Existing Chinese invention patent application (2019106901606) discloses a high-temperature resistant ink for microcrystalline glass and its preparation method, composed of the following raw materials in parts by weight: 45-55 parts of silicone resin, 25-35 parts of anatase titanium dioxide, 15-25 parts of barium sulfate, 0.2-1 parts of defoamer, and 1-3 parts of epoxy-containing silane coupling agent. This invention uses silicone resin as a binder, anatase titanium dioxide as a pigment, and barium sulfate as a filler. With the synergistic effect of the defoamer and the epoxy-containing silane coupling agent, the ink achieves a temperature resistance of 350°C (100 hours), suitable for microcrystalline glass with a working temperature of 200-350°C. However, the upper limit of the ink's temperature resistance still cannot meet the requirements of higher-temperature (above 700°C) sintering processes, and its coefficient of thermal expansion is not well matched with that of microcrystalline glass, potentially leading to film cracking after high-temperature sintering.

[0004] Therefore, there is an urgent need to develop a special high-temperature ink with a coefficient of thermal expansion that matches that of microcrystalline glass, excellent high-temperature resistance, strong adhesion, and environmentally friendly lead-free properties. Summary of the Invention

[0005] Based on this, it is necessary to address the above-mentioned technical problems by providing a high-temperature ink for microcrystalline glass and its preparation method. By combining lead-free low-expansion glass powder with an optimized organic carrier, the ink can form a firmly bonded and crack-free decorative layer with the substrate after high-temperature sintering.

[0006] To solve the above-mentioned technical problems, the first aspect of the present invention proposes a high-temperature ink for microcrystalline glass, which comprises the following components by mass percentage: 50-60% glass powder, 20-30% colorant, and 15-25% organic carrier; wherein the glass powder is composed of SiO2, Bi2O3, B2O3, TiO2, Al2O3, ZrO2, Li2O and ZnO.

[0007] Furthermore, the mass percentages of each component in the glass powder are: 30-40% SiO2, 25-35% Bi2O3, 15-25% B2O3, 4.2-9.8% TiO2, 5-8% Al2O3, 2.6-5.8% ZrO2, 3-5% Li2O, and 1.2-4.9% ZnO.

[0008] Furthermore, the organic carrier comprises: 5-10% modified acrylic resin, 1-5% cellulose, 83%-93% solvent, 0.5-1% dispersant, 0.5-0.8% leveling agent, and 0.1-0.3% defoamer.

[0009] Furthermore, the solvent is a mixture of propylene glycol methyl ether acetate and diethylene glycol butyl ether, wherein: propylene glycol methyl ether acetate accounts for 30-53% of the total mass of the solvent, and diethylene glycol butyl ether accounts for 30-53% of the total mass of the solvent.

[0010] Furthermore, the dispersant is selected from at least one of polyurethane, polyacrylate, phosphate, or modified polysiloxane dispersants.

[0011] Furthermore, the leveling agent is selected from at least one of silicone-modified, fluorocarbon-modified, acrylate-based, or polyether-modified leveling agents.

[0012] Furthermore, the defoamer is selected from at least one of mineral oil-based, polyether-modified, fatty alcohol-based, or composite non-silicone defoamers.

[0013] Furthermore, the colorant is selected from at least one of copper chromium black, cobalt black, titanium dioxide, high-temperature resistant pearlescent powder, or high-temperature resistant pigment.

[0014] The second aspect of this invention provides a method for preparing the above-mentioned high-temperature ink for microcrystalline glass, the steps of which include:

[0015] S1. Preparation of glass powder: After dry ball milling and mixing of raw materials, melt at 1100-1300℃ for 1.5-2.5h, water quenching treatment, wet ball milling, sieving and drying;

[0016] S2. Ink preparation: Dissolve the organic carrier component by high-speed stirring at 800-1200 rpm, add glass powder and colorant, and mix by low-speed stirring at 400-600 rpm. Finally, grind the mixture with three rollers to a fineness of 1-5 μm.

[0017] The third aspect of the present invention proposes the decorative printing application of the above-mentioned high-temperature ink for microcrystalline glass on a microcrystalline glass substrate, characterized in that the application includes printing the ink onto the microcrystalline glass substrate through a 350-450 mesh screen and sintering it at 700-800°C.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] This invention proposes a high-temperature ink specifically for microcrystalline glass and its preparation method. By designing a lead-free, low-expansion glass powder with a specific composition and optimizing the ink formulation, the thermal expansion coefficient of the resulting ink is well matched with that of the microcrystalline glass substrate. The ink provided by this invention uses a Bi2O3-B2O3-SiO2 system glass powder. Through the synergistic effect of components such as Li2O and ZrO2, the thermal expansion coefficient is significantly reduced while maintaining low melting point characteristics. After high-temperature sintering at approximately 700–800℃, the glaze layer forms a strong bond with the substrate, resulting in a dense and smooth surface with excellent adhesion and thermal shock resistance. It also exhibits good acid resistance, fully meeting the high-temperature sintering process requirements and long-term reliability of microcrystalline glass panels. Detailed Implementation

[0020] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0021] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below.

[0022] Example 1

[0023] This embodiment provides a method for preparing a high-temperature ink specifically for microcrystalline glass, which includes the following steps:

[0024] 1. Preparation of glass powder:

[0025] 1.1 Ingredient Mixing: Weigh each raw material according to the proportion, and mix them by dry ball milling for 30 minutes to ensure uniform dispersion;

[0026] 1.2 High-temperature melting: The mixture is placed in a platinum crucible and melted at 1200℃ for 2 hours to form a homogeneous glass melt;

[0027] 1.3 Water quenching and cooling: The molten glass is poured into deionized water and rapidly cooled to obtain glass fragments;

[0028] 1.4 Ball milling refinement: Wet ball milling was performed using a zirconia ball mill jar until D50 = 0.8 μm (fineness ≤ 1 μm);

[0029] 1.5 Filtration and Drying: Pass through a 400-mesh sieve and dry at 120℃ to obtain lead-free, low-expansion glass powder.

[0030] Specifically, the glass powder is composed of the following raw materials in the following mass percentages:

[0031] 35% SiO2, 25% Bi2O3, 18% B2O3, 6% TiO2, 8% Al2O3, 3.8% ZrO2, 3% Li2O, 1.2% ZnO.

[0032] 2. Ink preparation:

[0033] 2.1 Mix all components of the organic carrier and stir at high speed (1000 rpm, 30 min) until completely dissolved;

[0034] 2.2 Add glass powder and colorant in sequence, and stir at low speed (500 rpm, 20 min) to initially mix;

[0035] 2.3 Grinding is performed using a three-roll mill to control the fineness to 1–5 μm;

[0036] Specifically, the ink is composed of the following components by weight percentage: 52% glass powder, 23% colorant, and 25% organic carrier;

[0037] The organic carrier is composed of the following components in mass percentage:

[0038] 8% modified acrylic resin, 3% cellulose (ethyl cellulose), 41.7% propylene glycol methyl ether acetate, 46% diethylene glycol butyl ether, 0.5% dispersant, 0.6% leveling agent, 0.2% non-silicone defoamer;

[0039] Furthermore, the dispersant is selected from at least one of the following: polyurethane dispersants such as BYK-161, BYK-111, and Disperbyk-180; polyacrylate dispersants such as EFKA-4010 and TEGO Dispers750W; phosphate ester dispersants such as BYK-110 and Solsperse 32000; and modified polysiloxane dispersants such as BYK-220S.

[0040] Furthermore, the leveling agent is selected from at least one of the following: silicone-modified leveling agents, such as BYK-306, BYK-333, and TEGO Glide 450; fluorocarbon-modified leveling agents, such as BYK-381 and EFKA-3777; acrylate leveling agents, such as BYK-354 and TEGO Flow 370; and polyether-modified leveling agents, such as BYK-3455.

[0041] Furthermore, the non-silicone defoamer is selected from at least one of the following: mineral oil-based defoamers such as BYK-055, BYK-057, and Foamex 810; polyether-modified defoamers such as BYK-1790 and TEGO Foamex800; and fatty alcohol defoamers such as BYK-1798 and Dehydran 1293.

[0042] Furthermore, the colorant is selected from at least one of the following: black colorant: copper chromate black or cobalt black; white colorant: titanium dioxide; colored crystal colorant: high-temperature resistant pearlescent powder; other colorant: high-temperature resistant pigment.

[0043] 3. The finished ink is printed onto the microcrystalline glass substrate through a 350-450 mesh screen and sintered at 700-800℃ to obtain a decorative layer with excellent adhesion and weather resistance.

[0044] Example 2

[0045] This embodiment provides another method for preparing a high-temperature ink specifically for microcrystalline glass, which includes the following steps:

[0046] 1. Preparation of glass powder:

[0047] 1.1 Ingredient mixing: Weigh each raw material according to the proportion and mix them by dry ball milling for 35 minutes;

[0048] 1.2 High-temperature melting: The mixture was placed in a platinum crucible and melted at 1300℃ for 1.5h;

[0049] 1.3 Water quenching and cooling: The molten glass is poured into deionized water for rapid cooling;

[0050] 1.4 Ball milling refinement: Wet ball milling was performed using a zirconia ball mill jar until D50 = 1.0 μm;

[0051] 1.5 Filtration and drying: Pass through a 350-mesh sieve and dry at 110℃.

[0052] Specifically, the glass powder is composed of the following raw materials in the following mass percentages:

[0053] 30% SiO2, 28% Bi2O3, 25% B2O3, 4.2% TiO2, 5% Al2O3, 2.6% ZrO2, 4% Li2O, 1.2% ZnO.

[0054] 2. Ink preparation:

[0055] 2.1 Mix all components of the organic carrier and stir at high speed (1200 rpm, 25 min) until completely dissolved;

[0056] 2.2 Add glass powder and colorant in sequence, and stir at low speed (600 rpm, 15 min) to initially mix;

[0057] 2.3 Grinding is performed using a three-roll mill to control the fineness to 1–5 μm;

[0058] Specifically, the ink is composed of the following components by weight percentage: 50% glass powder, 30% colorant, and 20% organic carrier;

[0059] The organic carrier is composed of the following components in mass percentage:

[0060] 5% modified acrylic resin, 1% cellulose, 48% propylene glycol methyl ether acetate, 44.1% diethylene glycol butyl ether, 1% dispersant, 0.8% leveling agent, 0.1% non-silicone defoamer.

[0061] 3. Application process: The finished ink is printed onto the microcrystalline glass substrate through a 350-450 mesh screen and sintered at 700-800℃ to obtain a decorative layer with excellent adhesion and weather resistance.

[0062] Example 3

[0063] This embodiment provides a method for preparing a high-temperature ink specifically for microcrystalline glass, which includes the following steps:

[0064] 1. Preparation of glass powder:

[0065] 1.1 Ingredient mixing: Weigh each raw material according to the proportion and mix them by dry ball milling for 25 minutes;

[0066] 1.2 High-temperature melting: The mixture was placed in a platinum crucible and melted at 1100℃ for 2.5h;

[0067] 1.3 Water quenching and cooling: The molten glass is poured into deionized water for rapid cooling;

[0068] 1.4 Ball milling refinement: Wet ball milling was performed using a zirconia ball mill jar until D50 = 0.6 μm;

[0069] 1.5 Filtration and drying: Pass through a 450-mesh sieve and dry at 130℃.

[0070] Specifically, the glass powder is composed of the following raw materials in the following mass percentages:

[0071] 30% SiO2, 35% Bi2O3, 15% B2O3, 4.2% TiO2, 6% Al2O3, 3.4% ZrO2, 5% Li2O, 1.4% ZnO.

[0072] 2. Ink preparation:

[0073] 2.1 Mix all components of the organic carrier and stir at high speed (800 rpm, 35 min) until completely dissolved;

[0074] 2.2 Add glass powder and colorant in sequence, and stir at low speed (400 rpm, 25 min) to initially mix;

[0075] 2.3 Grinding is performed using a three-roll mill to control the fineness to 1–5 μm;

[0076] Specifically, the ink is composed of the following components by weight percentage: 55% glass powder, 30% colorant, and 15% organic carrier;

[0077] The organic carrier is composed of the following components in mass percentage:

[0078] 10% modified acrylic resin, 5% cellulose, 35% propylene glycol methyl ether acetate, 48.7% diethylene glycol butyl ether, 0.5% dispersant, 0.5% leveling agent, and 0.3% non-silicone defoamer.

[0079] 3. Application process: The finished ink is printed onto the microcrystalline glass substrate through a 350-450 mesh screen and sintered at 700-800℃ to obtain a decorative layer with excellent adhesion and weather resistance.

[0080] Example 4

[0081] This embodiment provides a method for preparing a high-temperature ink specifically for microcrystalline glass, which differs from Embodiment 1 in that:

[0082] Glass powder is composed of the following raw materials in the following mass percentages:

[0083] 40% SiO2, 25% Bi2O3, 15% B2O3, 4.2% TiO2, 5% Al2O3, 5.8% ZrO2, 3% Li2O, 2% ZnO.

[0084] Specifically, the ink is composed of the following components by mass percentage: 60% glass powder, 20% colorant, and 20% organic carrier;

[0085] The organic carrier is composed of the following components by mass percentage: 10% modified acrylic resin, 5% cellulose, 30% propylene glycol methyl ether acetate, 53% diethylene glycol butyl ether, 0.9% dispersant, 0.8% leveling agent, and 0.3% non-silicone defoamer.

[0086] Example 5

[0087] This embodiment provides a method for preparing a high-temperature ink specifically for microcrystalline glass, which differs from Embodiment 1 in that:

[0088] The glass powder is composed of the following raw materials in the following mass percentages: 30% SiO2, 25% Bi2O3, 15% B2O3, 9.8% TiO2, 8% Al2O3, 4.1% ZrO2, 3.2% Li2O, and 4.9% ZnO.

[0089] The organic carrier in the ink is composed of the following components by weight percentage: 10% modified acrylic resin, 5% cellulose, 53% propylene glycol methyl ether acetate, 30% diethylene glycol butyl ether, 0.9% dispersant, 0.8% leveling agent, and 0.3% non-silicone defoamer.

[0090] Comparative Example 1

[0091] This comparative example provides a method for preparing a high-temperature ink for microcrystalline glass. The difference between this method and Example 1 is that Na2O is used instead of Li2O in the glass powder raw material. Specifically, the glass powder raw material is composed of the following mass percentages: 32% SiO2, 28% Bi2O3, 20% B2O3, 5% TiO2, 7% Al2O3, 4.5% ZrO2, 2.5% Na2O, and 1% ZnO.

[0092] The remaining preparation process is the same as in Example 1.

[0093] Comparative Example 2

[0094] This comparative example provides a method for preparing a high-temperature ink for microcrystalline glass. The difference between this method and Example 1 is that Li2O is removed from the glass powder raw material, and the original mass percentage of Li2O 2.5% is redistributed according to the proportion of other components to maintain the total amount of 100%.

[0095] The remaining preparation process is the same as in Example 1.

[0096] Comparative Example 3

[0097] This comparative example provides a method for preparing a high-temperature ink for microcrystalline glass. The difference between this method and Example 1 is that ZrO2 is removed from the glass powder raw material, and the original ZrO2 mass percentage of 4.5% is redistributed according to the proportion of other components to maintain the total amount of 100%.

[0098] The remaining preparation process is the same as in Example 1.

[0099] Comparative Example 4

[0100] This comparative example provides a method for preparing a high-temperature ink for microcrystalline glass, which differs from Example 1 in that propylene glycol methyl ether acetate and diethylene glycol butyl ether are replaced with terpineol. Specifically, the organic carrier consists of the following components by mass percentage: 5% modified acrylic resin, 1% cellulose, 92.1% terpineol, 1% dispersant, 0.8% leveling agent, and 0.1% non-silicone defoamer.

[0101] The remaining preparation process is the same as in Example 1.

[0102] Comparative Example 5

[0103] This comparative example provides a method for preparing a high-temperature ink for microcrystalline glass. The difference between this method and Example 1 is that the modified acrylic resin is removed from the organic carrier raw material, and the original modified acrylic resin mass percentage of 5% is redistributed according to the proportion of other components to maintain the total amount of 100%.

[0104] The remaining preparation process is the same as in Example 1.

[0105] Test case

[0106] This experiment analyzes the performance testing methods and results of the high-temperature inks for microcrystalline glass prepared in Examples 1-5 and Comparative Examples 1-5.

[0107] 1. Test methods and standards

[0108] All tests were conducted in accordance with national or enterprise standard methods, as detailed below:

[0109] (1) Thermal expansion coefficient test: According to GB / T 16920-2015 "Determination of the average linear thermal expansion coefficient of glass", the thermal expansion meter was used to measure the coefficient of thermal expansion in the range of 25 to 700℃ at a heating rate of 10℃ / min.

[0110] (2) Adhesion test: The ink was coated onto the microcrystalline glass substrate by screen printing through a 400-mesh screen. After sintering at 750℃ and cooling to room temperature, the bonding strength between the film layer and the substrate was tested by the circling method according to GB / T 1720-2020 "Determination of Adhesion of Coating Film".

[0111] (3) Water resistance test: Refer to GB / T 1733-1993 "Determination of water resistance of paint film", immerse the sintered sample completely in deionized water, soak it at 25±1℃ for 24 hours, take it out, observe the surface condition change and calculate the mass loss rate.

[0112] (4) Acid and alkali resistance test: According to GB / T 9274-1988 "Determination of resistance to liquid media of paints and varnishes", the samples were immersed in 10% HCl solution and 10% NaOH solution respectively, and soaked for 24 hours at 25±1℃. The surface condition changes were observed and the mass loss rate was calculated.

[0113] (5) Viscosity test: According to GB / T 22235-2008 "Determination of viscosity of liquid coatings", the viscosity was measured at 25±0.5℃ using a rotational viscometer;

[0114] (6) Fineness test: According to GB / T 1723-1993 "Determination of Fineness of Paint Film", the particle size of ink particles is measured using a scraper fineness meter;

[0115] (7) Transmittance test: Using a transmittance meter, the ink was printed and sintered on transparent microcrystalline glass with a thickness of 10±1μm, and the transmittance was measured at a wavelength of 550nm.

[0116] (8) Specific gravity test: According to GB / T 6750-2007 "Determination of density of paints and varnishes", the specific gravity bottle method was used to determine the density at 25±0.5℃.

[0117] 2. The test results are shown in Table 1 below. The coefficients of thermal expansion of Examples 1 to 5 are all in the low range (3.0 to 4.5 × 10⁻⁶). -6 The coefficient of thermal expansion (°C) of the film layer and the microcrystalline glass substrate showed good matching, and no cracking occurred during high-temperature sintering and cooling. Adhesion test results showed that all sample examples achieved Grade 1, indicating excellent bonding strength between the film layer and the substrate. In acid and alkali resistance tests, the sample examples exhibited low mass loss rates (acid resistance 1.0–3.0%, alkali resistance 1.0–3.0%), with intact surface conditions, demonstrating good chemical stability. Regarding viscosity, the inks in the examples were controlled between 220 and 400 dPa·s, exhibiting good printability and leveling properties; the fineness index was 4–5 μm, meeting the requirements for fine printing; and the light transmittance was between 3 and 5%, adaptable to different decorative effects.

[0118] In contrast, the comparative samples revealed significant defects in different test items. Comparative samples 1–5, due to formulation adjustments, had a higher coefficient of thermal expansion (6.0–7.5 × 10⁻⁶). -6 / ℃), resulting in slight cracks after sintering; Comparative Example 3 has poor chemical resistance and a high mass loss rate in acid and alkali tests (acid resistance 5.5%, alkali resistance 4.5%); Comparative Examples 4 and 5 have poor adhesion (level 3 and level 5, respectively), and the fineness index of the comparative examples is too large (6.5~10μm), resulting in poor printability.

[0119] In summary, this invention, by optimizing the glass powder composition and organic carrier system, successfully prepared a high-temperature ink specifically for microcrystalline glass with excellent thermal expansion matching, outstanding high-temperature resistance, and strong adhesion, fully meeting the high-temperature decoration requirements of microcrystalline glass products.

[0120] Table 1: Comparison of Performance Test Results of High-Temperature Ink for Microcrystalline Glass.

[0121]

[0122]

[0123] Obviously, the embodiments described above are merely some embodiments of this application, not all embodiments. This application can be implemented in many different forms. Rather, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this application's specification, directly or indirectly applied to other related technical fields, are similarly within the scope of patent protection of this application.

Claims

1. A high-temperature ink specifically for microcrystalline glass, characterized in that, It comprises the following components by mass percentage: 50-60% glass powder, 20-30% colorant, and 15-25% organic carrier; the glass powder is composed of SiO2, Bi2O3, B2O3, TiO2, Al2O3, ZrO2, Li2O, and ZnO.

2. The high-temperature ink for microcrystalline glass according to claim 1, characterized in that, The mass percentages of each component in the glass powder are as follows: 30-40% SiO2, 25-35% Bi2O3, 15-25% B2O3, 4.2-9.8% TiO2, 5-8% Al2O3, 2.6-5.8% ZrO2, 3-5% Li2O, and 1.2-4.9% ZnO.

3. The high-temperature ink for microcrystalline glass according to claim 1, characterized in that, The organic carrier comprises: 5-10% modified acrylic resin, 1-5% cellulose, 83%-93% solvent, 0.5-1% dispersant, 0.5-0.8% leveling agent, and 0.1-0.3% defoamer.

4. The high-temperature ink for microcrystalline glass according to claim 3, characterized in that, The solvent is a mixture of propylene glycol methyl ether acetate and diethylene glycol butyl ether, wherein propylene glycol methyl ether acetate accounts for 30-53% of the total mass of the solvent and diethylene glycol butyl ether accounts for 30-53% of the total mass of the solvent.

5. The high-temperature ink for microcrystalline glass according to claim 3, characterized in that, The dispersant is selected from at least one of polyurethane, polyacrylate, phosphate, or modified polysiloxane dispersants.

6. The high-temperature ink for microcrystalline glass according to claim 3, characterized in that, The leveling agent is selected from at least one of silicone-modified, fluorocarbon-modified, acrylate-based, or polyether-modified leveling agents.

7. The high-temperature ink for microcrystalline glass according to claim 3, characterized in that, The defoamer is selected from at least one of mineral oil-based, polyether-modified, fatty alcohol-based, or composite non-silicone defoamers.

8. The high-temperature ink for microcrystalline glass according to claim 1, characterized in that, The colorant is selected from at least one of copper chromium black, cobalt black, titanium dioxide, high-temperature resistant pearlescent powder, or high-temperature resistant pigment.

9. A method for preparing the ink according to any one of claims 1 to 8, characterized in that, include: S1. Preparation of glass powder: After dry ball milling and mixing of raw materials, melt at 1100-1300℃ for 1.5-2.5h, water quenching treatment, wet ball milling, sieving and drying; S2. Ink preparation: Dissolve the organic carrier component by high-speed stirring at 800-1200 rpm, add glass powder and colorant, and mix by low-speed stirring at 400-600 rpm. Finally, grind the mixture with three rollers to a fineness of 1-5 μm.

10. The decorative printing application of the high-temperature ink for microcrystalline glass according to any one of claims 1 to 8 on a microcrystalline glass substrate, characterized in that, The application includes printing ink onto a microcrystalline glass substrate using a 350-450 mesh screen and sintering it at 700-800°C.

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