Electrolytic adhesive double-sided sticker based on printing process and preparation method thereof

Abstract

The invention discloses an electrolytic sticking double-sided sticker based on a printing process and a preparation method and a sticking structure thereof. The invention relates to an electrolytic double-sided adhesive tape, which comprises a composite base material, a conductive layer, an adhesive layer and a protective layer, and is characterized in that the composite base material comprises an insulating base material layer and a conductive layer arranged on the surface of the insulating base material layer; the adhesive layer is arranged on the other surface of the insulating base material layer; the insulating ink layer is formed in the insulating region on the surface of the conductive layer through a printing process; and the electrolytic adhesive layer is formed in the bonding area on the surface of the conductive layer through a printing process. The insulating layer and the electrolytic adhesive layer are directly formed by adopting a silk-screen printing technology, a traditional die cutting process is abandoned, leftover materials are eliminated from the source, and the material utilization rate is close to 100%. Meanwhile, the use of auxiliary materials such as release films is reduced, and the production cost can be reduced. The traditional multi-step process is simplified into two-step printing and curing, so that the production flow is shortened, the production efficiency is greatly improved, and the yield loss caused by inaccurate alignment is reduced.

Description

Technical Field

[0001] This invention relates to the field of electronic component processing and assembly, and in particular to a double-sided adhesive product that can be peeled off without damage by applying electricity. Specifically, it is an electrolytic double-sided adhesive based on printing technology, its preparation method, and its bonding structure. Background Technology

[0002] In the manufacturing process of precision electronic products such as smartphones, tablets, and wearable devices, double-sided tape is widely used to fix internal components such as batteries, screens, and camera modules. To facilitate repair and recycling, electrolytic double-sided tape (or electrolytic release tape) has emerged. It has strong adhesion before being energized, but the adhesion decreases sharply after being energized, thus achieving non-destructive separation of the adhered components.

[0003] Existing technologies (such as CN120775510A and CN120775511A) disclose electrolytic double-sided adhesives, which typically employ a die-cutting process to cut pre-made electrolytic adhesive films and insulating films into specific shapes, and then assemble them onto a conductive substrate through a bonding process. This "die-cutting-bonding" process has inherent drawbacks: First, the die-cutting process generates a large amount of electrolytic adhesive and insulating film scraps, resulting in low material utilization and high costs; second, the bonding process requires auxiliary materials such as release films and involves multiple alignment and bonding steps, making the process complex, inefficient, and prone to misalignment. Furthermore, the die-cutting process struggles to quickly and economically produce complex and intricate graphics, limiting the freedom of customized product design.

[0004] Therefore, there is an urgent need for a new method for preparing electrolytically adhesive double-sided tapes that can fundamentally reduce material waste, simplify production processes, lower costs, and improve design flexibility. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the defects of existing electrolytic double-sided adhesive production, such as large material waste, numerous processes, high cost and poor design flexibility, and to provide an electrolytic double-sided adhesive based on printing process, its preparation method and bonding structure.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: In a first aspect, the present invention provides an electrolytically adhesive double-sided sticker, comprising: A composite substrate includes an insulating substrate layer and a conductive layer disposed on the surface of the insulating substrate layer; an adhesive layer disposed on the other surface of the insulating substrate layer; an insulating ink layer formed directly on the insulating area of ​​the conductive layer surface by a printing process; and an electrolytic adhesive layer formed directly on the bonding area of ​​the conductive layer surface by a printing process.

[0007] As a further improvement to the present invention, the edge portion of the electrolytic adhesive layer covers the edge of the insulating ink layer, so that the conductive layer is completely covered and not exposed.

[0008] Secondly, the present invention provides a method for preparing the above-mentioned electrolytically adhesive double-sided sticker, comprising the following steps: S1: Provide a composite substrate, wherein an adhesive layer has been provided on the surface of the insulating substrate layer of the composite substrate; S2: An insulating ink layer is formed in the insulating area on the surface of the conductive layer of the composite substrate by screen printing and curing insulating ink. S3: In the bonding area on the conductive layer surface of the composite substrate, an electrolytic adhesive layer is formed by screen printing electrolytic adhesive and vacuum curing. Vacuum curing eliminates air bubbles in the electrolytic adhesive, improving the bonding strength and durability of the electrolytic adhesive layer.

[0009] As a further improvement to the present invention, the pattern of the electrolytic adhesive printed in step S3 is configured such that the edge portion of the electrolytic adhesive layer formed after curing covers the edge of the insulating ink layer.

[0010] Thirdly, the present invention provides a bonding structure, including a first substrate, a second substrate, and the aforementioned electrolytic double-sided adhesive. The adhesive layer is bonded to the first substrate, and the electrolytic adhesive layer is bonded to the conductive area of ​​the second substrate.

[0011] The beneficial effects of this invention are: 1. Zero material waste and significantly reduced costs: The functional layers (insulating layer and electrolytic adhesive layer) are directly formed using screen printing technology, eliminating the need for traditional die-cutting processes and removing scraps at the source, resulting in a material utilization rate of nearly 100%. At the same time, the use of auxiliary materials such as release film is reduced, which can lower production costs.

[0012] 2. The process is extremely simplified and the efficiency is greatly improved: The traditional multi-step die-cutting, bonding and alignment process is simplified to two steps of printing and curing. The production process is shortened, which greatly improves the production efficiency and reduces the loss of yield due to misalignment.

[0013] 3. Flexible design and high degree of customization: Screen printing technology can flexibly and accurately print various complex functional layer patterns (such as winding insulation lines and bonding areas of specific shapes) according to the shape of the object to be bonded (such as irregularly shaped batteries, FPCs, etc.) and its local insulation / conductivity requirements by changing the screen, which can meet highly customized application scenarios. This is something that traditional die-cutting processes cannot achieve.

[0014] 4. Integrated structure, enhanced reliability: The functional layer is directly printed on the conductive substrate, resulting in strong interlayer adhesion, low and uniform interfacial contact resistance. This facilitates stable current distribution during energization, achieving rapid and consistent electrolytic peeling. In particular, the design of covering the edge of the electrolytic adhesive layer with the edge of the insulating ink layer ensures complete coverage of the conductive layer, preventing direct contact with any second substrate and fundamentally avoiding short-circuit risks. This also provides excellent protection for the conductive layer.

[0015] 5. Wide range of applications: The presence of the insulating layer effectively protects voltage-sensitive objects, prevents short circuits, and avoids picking up tiny components during peeling. It is suitable for various scenarios that require temporary fixation and protection of high-value components. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a top view of the first embodiment.

[0018] Figure 2 for Figure 1 Cross-sectional view of AA.

[0019] Figure 3 This is a schematic diagram of the preparation method of the second embodiment.

[0020] Figure 4 This is a cross-sectional view of the third embodiment.

[0021] In the figure, 10-composite substrate; 11-insulating substrate layer; 12-conductive layer; 20-adhesive layer; 30-insulating ink layer; 40-electrolytic adhesive layer; 50-conductive protrusion; 60-first substrate; 70-second substrate; 71-conductive area. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] like Figure 1 and 2As shown, the present invention provides a first embodiment of an electrolytically adhesive double-sided adhesive, comprising a composite substrate 10, an adhesive layer 20, an insulating ink layer 30, and an electrolytic adhesive layer 40.

[0024] The composite substrate 10 is composed of an insulating substrate layer 11 and a conductive layer 12. The insulating substrate layer 11 is a PET, PP, or PI film, and the conductive layer 12 is an aluminum-plated layer, a copper-plated layer, a silver-plated layer, or copper foil. An adhesive layer 20 is disposed on the other surface of the insulating substrate layer 11. The other surface of the conductive layer 12 is directly formed with two functional areas through a printing process: an insulating ink layer 30 composed of insulating ink and an electrolytic adhesive layer 40 composed of electrolytic adhesive.

[0025] The edge of the electrolytic adhesive layer 40 overlaps the edge of the insulating ink layer 30, completely covering the conductive layer 12 without exposing it. This "overlapping coverage" design ensures that the conductive layer 12 is completely covered and not exposed in the area covered by the electrolytic adhesive layer 40 and the insulating ink layer 30. This effectively prevents the conductive layer 12 from directly contacting the second substrate (not shown) during use, completely avoiding any potential short circuits or electrochemical corrosion, and greatly improving the reliability and safety of the product.

[0026] The composite substrate 10 is further provided with a conductive protrusion 50, which extends beyond the edge of the insulating ink layer 30 and the electrolytic adhesive layer 40.

[0027] In the first embodiment, the composite substrate 10 is an aluminized PET film. The insulating ink layer 30 is preferably formed by screen printing a thermosetting epoxy insulating ink using a 180-mesh screen and baking it at 80-120°C, with a thickness of approximately 8-15 μm. The electrolytic adhesive layer 40 is preferably formed by screen printing an acrylic adhesive containing defoamer, conductive filler, and electrolyte using an 80-mesh screen and curing it under vacuum at a medium temperature (e.g., 60-80°C) or UV, with a thickness of approximately 20-30 μm. The insulating ink layer 30 is printed and cured first, followed by the electrolytic adhesive layer 40, ensuring that the pattern design of the electrolytic adhesive layer 40 allows its edges to cover the insulating ink layer 30.

[0028] Among them, defoamers and vacuum curing can eliminate air bubbles in electrolytic adhesive water, and improve the bonding strength and durability of electrolytic adhesive layers.

[0029] like Figure 3 As shown, the present invention provides a second embodiment, the preparation method of the electrolytically adhesive double-sided tape described in the first embodiment includes the following steps: Step S1: Material preparation. Provide a metallized PET roll that has been coated with an adhesive layer 20 on the PET side and covered with a protective release film (not shown in the figure).

[0030] Step S2: Printing the insulating layer. The aluminum-plated surface is subjected to online corona treatment to enhance adhesion, and then insulating ink is precisely printed on the preset insulating area using a 180-mesh screen, followed by complete curing in a curing oven.

[0031] Step S3: Printing the electrolytic adhesive layer. Using an 80-mesh screen, electrolytic adhesive is printed on the preset bonding area. Through precise screen printing pattern design, it is ensured that the printed electrolytic adhesive layer 40 can partially cover the edge of the cured insulating ink layer 30, and then cured under curing conditions.

[0032] The final product can be directly slit or simply die-cut according to customer requirements before shipment.

[0033] like Figure 4 As shown, the present invention provides a third embodiment, a bonding structure including a first substrate 60, a second substrate 70, and the electrolytic double-sided adhesive described in the first embodiment. The adhesive layer 20 is bonded to the first substrate 60, and the electrolytic adhesive layer 40 is bonded to the conductive region 71 of the second substrate 70.

[0034] In use, peel off the release film from one side of the adhesive layer 20 and attach it to the first substrate 60; then attach one side of the electrolytic adhesive layer 40 to the conductive area 71 of the second substrate 70. When separation is required, connect the positive and negative terminals of an external power source to the conductive protrusion 50 and the conductive area 71 of the second substrate 70, respectively. After applying power for a few seconds, the electrolytic adhesive layer 40 loses its stickiness, and the second substrate 70 can be easily removed. Because the conductive layer 12 is completely covered, the entire process is safe and reliable.

[0035] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. An electrolytically adhesive double-sided tape, characterized in that, include: A composite substrate, the composite substrate comprising an insulating substrate layer and a conductive layer disposed on the surface of the insulating substrate layer; An adhesive layer is disposed on the other surface of the insulating substrate layer; An insulating ink layer is formed in the insulating region on the surface of the conductive layer by a printing process; An electrolytic adhesive layer is formed in the bonding area on the surface of the conductive layer through a printing process.

2. The electrolytically adhesive double-sided tape according to claim 1, characterized in that, The edge portion of the electrolytic adhesive layer covers the edge of the insulating ink layer, so that the conductive layer is completely covered and not exposed.

3. The electrolytically adhesive double-sided tape according to claim 1 or 2, characterized in that, The insulating ink layer is formed by screen printing with a mesh size of 180 to 220, and the electrolytic adhesive layer is formed by screen printing with a mesh size of 70 to 90.

4. The electrolytically adhesive double-sided tape according to claim 1 or 2, characterized in that, The composite substrate is an aluminized PET film, an aluminized PP film, or an aluminized PI film.

5. The electrolytically adhesive double-sided tape according to claim 1 or 2, characterized in that, The composite substrate is provided with conductive protrusions extending beyond the edges of the insulating ink layer and the electrolytic adhesive layer.

6. A method for preparing the electrolytically adhesive double-sided tape as described in any one of claims 1-5, characterized in that, Includes the following steps: S1: Provide a composite substrate, wherein an adhesive layer has been provided on the surface of the insulating substrate layer of the composite substrate; S2: An insulating ink layer is formed in the insulating area on the surface of the conductive layer of the composite substrate by screen printing and curing insulating ink. S3: In the bonding area on the conductive layer surface of the composite substrate, an electrolytic adhesive layer is formed by screen printing electrolytic adhesive and vacuum curing.

7. The method according to claim 6, characterized in that, In step S3, the pattern of the printed electrolytic adhesive is set such that the edge of the electrolytic adhesive layer formed after curing covers the edge of the insulating ink layer.

8. The method according to claim 6 or 7, characterized in that, In step S2, printing is performed using a 180-220 mesh screen; in step S3, printing is performed using a 70-90 mesh screen.

9. The method according to claim 6 or 7, characterized in that, In step S2, the insulating ink layer is printed and cured first, and then step S3 is performed to print the electrolytic adhesive layer.

10. A bonding structure, characterized in that, include: The first item to be pasted on; The second item to be pasted; Electrolytically adhesive double-sided tape as described in any one of claims 1-5; The adhesive layer is bonded to the first object to be bonded, and the electrolytic adhesive layer is bonded to the conductive area of ​​the second object to be bonded.

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