Storage device test circuit, test fixture and test method

Abstract

The invention provides a storage device test circuit, a test fixture and a test method, and relates to the technical field of storage, and the circuit comprises a control module, a pull-up module and a power conversion module. A plurality of detection pins of the control module are respectively connected with a plurality of power supply configuration identification pins of the to-be-detected storage device in a one-to-one correspondence manner, and each detection pin of the control module is also connected with the pull-up module; the power conversion module is connected with the control module and the storage device to be tested. The control module reads the level combination corresponding to the plurality of power supply configuration identification pins under the action of the pull-up module, and determines the power supply configuration parameters of the to-be-tested storage device according to the level combination. The control module sends a control signal to the power conversion module according to the power supply configuration parameters. And the power supply conversion module outputs multiple paths of power supply voltages meeting power supply configuration parameter requirements to the to-be-tested storage device according to the control signal. The circuit can automatically identify and adapt to a plurality of storage devices with different power supply requirements, and the test cost is reduced.

Description

Technical Field

[0001] This application relates to the field of storage technology, and more specifically, to a storage device test circuit, test fixture, and test method. Background Technology

[0002] Storage devices packaged as chips (such as ball grid array solid-state drives) are typically tested on test fixtures with sockets during the production testing phase. Because storage devices with different main controller chip designs have different operating voltages and power-on timing requirements, placing storage devices with the same package form but different voltage requirements on the same test fixture can easily lead to chip burnout.

[0003] To address the above situation, the common approach is to equip different types of storage devices with dedicated test fixtures and label them for differentiation, with one test fixture corresponding to one type of storage device. However, when production testing involves multiple types of storage devices, a corresponding number of test fixtures are required. This not only wastes resources but also risks chip burnout if a test fixture is misused, leading to high testing costs.

[0004] Therefore, how to effectively reduce the testing cost of storage devices is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide a storage device test circuit, test fixture, and test method to effectively reduce the testing cost of storage devices.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows: In a first aspect, this application provides a storage device test circuit for use in a test fixture, the storage device test circuit comprising: a control module, a pull-up module, and a power conversion module; The control module has multiple detection pins that are connected one-to-one with multiple power configuration identification pins of the storage device under test, and each of the detection pins of the control module is also connected to the pull-up module; the power conversion module is connected to both the control module and the storage device under test. The control module is used to read the level combinations corresponding to multiple power configuration identifier pins under the action of the pull-up module, and determine the power supply configuration parameters of the storage device under test based on the level combinations. The control module is also used to send control signals to the power conversion module according to the power supply configuration parameters; The power conversion module is used to output multiple power supply voltages that meet the power supply configuration parameter requirements to the storage device under test according to the control signal.

[0007] Furthermore, the signal connection state of the power configuration identifier pin of the storage device under test includes: ground state and floating state; The pull-up module includes multiple pull-up resistors; wherein the number of pull-up resistors equals the number of detection pins equals the number of power configuration identifier pins; Each detection pin of the control module is connected to one end of one of the pull-up resistors and a power configuration identifier pin of the storage device under test, and the other end of all the pull-up resistors is connected to a reference power supply. When the signal connection state of the power configuration identifier pin is grounded, the detection pin connected to the power configuration identifier pin is at a low level. When the signal connection state of the power configuration identifier pin is floating, the detection pin connected to the power configuration identifier pin is at a high level.

[0008] Furthermore, the power supply configuration parameters include: the target values ​​of the multiple power supply voltages corresponding to the storage device under test; The power conversion module includes: a first power converter, a second power converter, and a third power converter; The first power converter, the second power converter, and the third power converter are all connected to a reference power supply; the input pins of the first power converter, the second power converter, and the third power converter are all connected to the control module; and the output pins of the first power converter, the second power converter, and the third power converter are respectively connected to the first power supply terminal, the second power supply terminal, and the third power supply terminal of the storage device under test. The control module is used to send a first voltage conversion signal, a second voltage conversion signal, and a third voltage conversion signal to the first power converter, the second power converter, and the third power converter respectively, according to the target value of the multi-channel power supply voltage corresponding to the storage device under test. The first power converter is used to convert the reference voltage into a first supply voltage according to the first voltage conversion signal, and send it to the first power supply terminal of the storage device under test; The second power converter is used to convert the reference voltage into a second supply voltage according to the second voltage conversion signal, and send it to the second power supply terminal of the storage device under test; The third power converter is used to convert the reference voltage into a third supply voltage according to the third voltage conversion signal, and send it to the third power supply terminal of the storage device under test.

[0009] Furthermore, the power supply configuration parameters also include: the power-on timing of the multiple power supply voltages corresponding to the storage device under test; The storage device test circuit further includes: a first pull-down resistor, a second pull-down resistor, and a third pull-down resistor; The first enable control pin, the second enable control pin, and the third enable control pin of the control module are respectively connected to the enable pins of the first power converter, the second power converter, and the third power converter, and the first enable control pin, the second enable control pin, and the third enable control pin of the control module are also grounded through the first pull-down resistor, the second pull-down resistor, and the third pull-down resistor, respectively. The control module is used to control the order of its output first enable signal, second enable signal and third enable signal according to the power-on timing of the multiple power supply voltages corresponding to the storage device under test, so as to control the power-on sequence of the first power converter, the second power converter and the third power converter.

[0010] Furthermore, the power supply configuration parameters also include: the power-down timing of the multiple power supply voltages corresponding to the storage device under test; When the test of the storage device under test is completed, the control module is used to control the power-down sequence of the first power converter, the second power converter and the third power converter according to the power-down sequence of the multiple power supply voltages corresponding to the storage device under test.

[0011] Furthermore, the storage device test circuit also includes an interface expansion module; One end of the interface expansion module is connected to the output pin of the control module, and the other end of the interface expansion module is connected to the input pins of the first power converter, the second power converter, and the third power converter, respectively. The interface expansion module is used to expand one output pin of the control module into three output pins to send signals to the first power converter, the second power converter, and the third power converter, respectively.

[0012] Furthermore, the storage device test circuit also includes a foolproof pull-up resistor, and the control module includes a foolproof detection pin; The foolproof detection pin is connected to the storage device under test, and the foolproof detection pin is also connected to one end of the foolproof pull-up resistor, the other end of the foolproof pull-up resistor is connected to the reference power supply; When the storage device under test is placed incorrectly, the foolproof detection pin of the control module is connected to the floating pin of the storage device under test, the foolproof detection pin is at a high level, and the storage device test circuit stops supplying power to the storage device under test. When the storage device under test is placed correctly, the foolproof detection pin of the control module is connected to the ground pin of the storage device under test, the foolproof detection pin is at a low level, and the storage device test circuit tests the storage device under test.

[0013] Furthermore, the storage device test circuit also includes a first warning light and a second warning light; both the first warning light and the second warning light are connected to the control module. When the foolproof detection pin of the control module is at a high level, the control module controls the first warning light to illuminate; When the foolproof detection pin of the control module is at a low level, the control module controls the second warning light to illuminate.

[0014] Secondly, this application also provides a test fixture, including a storage device test circuit as described in any of the first aspects.

[0015] Thirdly, this application also provides a testing method applied to a storage device test circuit as described in any of the first aspects, the method comprising: Under the action of the pull-up module, the control module reads the level combinations corresponding to multiple power configuration identifier pins and determines the power supply configuration parameters of the storage device under test based on the level combinations. The control module sends a control signal to the power conversion module according to the power supply configuration parameters; The power conversion module outputs multiple power supply voltages that meet the power supply configuration parameters to the storage device under test according to the control signal.

[0016] Furthermore, the storage device test circuit also includes a foolproof pull-up resistor, and the control module includes a foolproof detection pin; the foolproof detection pin is connected to the storage device under test, and the foolproof detection pin is also connected to one end of the foolproof pull-up resistor, and the other end of the foolproof pull-up resistor is connected to a reference power supply; Before the step of the control module reading the level combination corresponding to the power configuration identifier pin under the action of the pull-up module, the method further includes: The control module reads the level state of the foolproof detection pin; When the foolproof detection pin is high, the storage device test circuit stops supplying power to the storage device under test; And / or, when the foolproof detection pin is low, the storage device test circuit tests the storage device under test.

[0017] Compared with the prior art, this application has the following advantages: The storage device test circuit provided in this application is applied to a test fixture. The storage device test circuit includes a control module, a pull-up module, and a power conversion module. Multiple detection pins of the control module are connected one-to-one with multiple power configuration identifier pins of the storage device under test (DUT), and each detection pin of the control module is also connected to the pull-up module. The power conversion module is connected to both the control module and the DUT. The control module, under the action of the pull-up module, reads the level combinations corresponding to the multiple power configuration identifier pins and determines the power supply configuration parameters of the DUT based on these level combinations. The control module also sends control signals to the power conversion module according to the power supply configuration parameters. The power conversion module outputs multiple power supply voltages conforming to the power supply configuration parameter requirements to the DUT according to the control signals.

[0018] This circuit, through the coordinated operation of the control module and the pull-up module, can automatically identify the type of the memory device under test and dynamically configure the output voltage of the power conversion module accordingly. This allows for power supply testing of memory devices with the same package but different voltage requirements using a single test fixture, saving resources and reducing testing costs. Compared to existing technologies, this application eliminates the need for separate test fixtures for different memory devices, reducing the number of fixtures and resource waste, and fundamentally avoiding the risk of chip burnout due to misuse of fixtures, further lowering testing costs. Attached Figure Description

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0020] Figure 1 One of the circuit diagrams of a storage device test circuit provided in an embodiment of this application; Figure 2 A second circuit diagram of a storage device test circuit provided in an embodiment of this application; Figure 3 A third schematic diagram of a storage device test circuit provided in an embodiment of this application; Figure 4A fourth schematic diagram of a storage device test circuit provided in an embodiment of this application; Figure 5 A fifth schematic diagram of a storage device test circuit provided in an embodiment of this application; Figure 6 One of the flowcharts of a testing method provided in this application embodiment; Figure 7 This is a second schematic flowchart of a testing method provided in an embodiment of this application.

[0021] Icons: 10 - Storage device test circuit; 20 - Storage device under test; 100 - Control module; 200 - Pull-up module; 300 - Power conversion module; 310 - First power converter; 320 - Second power converter; 330 - Third power converter; 400 - Interface expansion module; 500 - First warning light; 600 - Second warning light; R1 - Foolproof pull-up resistor; R2 - First pull-up resistor; R3 - Second pull-up resistor; R4 - Third pull-up resistor; R5 - Fourth pull-up resistor; R6 - Fifth pull-up resistor; R7 - First pull-down resistor; R8 - Second pull-down resistor; R9 - Third pull-down resistor. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0023] In the description of this application, it should be noted that relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0024] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0025] As described in the background section, existing testing methods for testing memory devices with the same package but different voltage requirements involve equipping different types of memory devices with dedicated test fixtures and affixing labels to these fixtures for differentiation. That is, one test fixture corresponds to one type of memory device. However, when production testing involves multiple types of memory devices, a corresponding number of test fixtures are required. This not only wastes resources but also leads to chip burnout if a test fixture is misused, resulting in high testing costs. Therefore, how to effectively reduce the testing cost of memory devices is a technical problem that urgently needs to be solved by those skilled in the art.

[0026] To resolve the above technical issues, please refer to Figure 1 This application provides a storage device test circuit 10, which is applied to a test fixture. The storage device test circuit 10 includes a control module 100, a pull-up module 200, and a power conversion module 300.

[0027] In this configuration, multiple detection pins of the control module 100 are connected one-to-one with multiple power configuration identification pins of the storage device under test 20, and each detection pin of the control module 100 is also connected to the pull-up module 200. The power conversion module 300 is connected to both the control module 100 and the storage device under test 20. Optionally, the storage device under test 20 can be a Ball Grid Array Solid-State Drive (BGA SSD).

[0028] The control module 100 is used to read the level combinations corresponding to multiple power configuration identifier pins under the action of the pull-up module 200, and determine the power supply configuration parameters of the storage device under test 20 based on the level combinations.

[0029] The control module 100 is also used to send control signals to the power conversion module 300 according to the power supply configuration parameters.

[0030] The power conversion module 300 is used to output multiple power supply voltages that meet the power supply configuration parameters to the storage device under test 20 according to the control signal.

[0031] Based on the above design, this circuit, through the coordinated operation of the control module 100 and the pull-up module 200, can automatically identify the type of the storage device under test 20 and dynamically configure the output voltage of the power conversion module 300 accordingly. This allows for power supply testing of storage devices with the same package but different voltage requirements using a single test fixture, saving resources and reducing testing costs. Compared to existing technologies, this application eliminates the need for separate test fixtures for different storage devices, reducing the number of fixtures and resource waste, and fundamentally avoiding the risk of chip burnout due to misuse of fixtures. Furthermore, the entire identification and voltage adaptation process is automatically completed by the hardware circuit without manual intervention, thereby improving testing efficiency and reliability.

[0032] In one alternative implementation, the signal connection state of the power configuration identifier pin of the storage device under test 20 includes: ground state and floating state.

[0033] The pull-up module 200 includes multiple pull-up resistors; wherein the number of pull-up resistors equals the number of detection pins equals the number of power configuration identifier pins.

[0034] Each detection pin of the control module 100 is connected to one end of a pull-up resistor and a power configuration identifier pin of the storage device under test 20, and the other end of all pull-up resistors is connected to a reference power supply.

[0035] When the signal connection state of the power configuration identifier pin is grounded, the detection pin connected to the power configuration identifier pin is pulled down to a low level.

[0036] When the signal connection state of the power configuration identifier pin is floating, the detection pin connected to the power configuration identifier pin is pulled up to a high level through a pull-up resistor.

[0037] By reading the high and low level combinations of each detection pin, the control module 100 can identify the type of the storage device under test 20, thereby determining the power supply configuration parameters corresponding to the storage device under test 20, providing an accurate basis for subsequent voltage configuration.

[0038] To better understand, the above identification method will be explained below using the storage device under test 20 as an example of a BGA SSD.

[0039] like Figure 2 As shown, assuming the storage device under test 20 is a BGA SSD, which includes 5 power configuration identification pins (PWR_ID0~PWR_ID4), the control module 100 includes 5 detection pins (IO2~IO6), and the pull-up module 200 includes a first pull-up resistor R2, a second pull-up resistor R3, a third pull-up resistor R4, a fourth pull-up resistor R5, and a fifth pull-up resistor R6.

[0040] The five detection pins IO2 to IO6 of the control module 100 are respectively connected to the five power configuration identifier pins PWR_ID0 to PWR_ID4 of the storage device under test 20. The five detection pins IO2 to IO6 of the control module 100 are also respectively connected to one end of the five pull-up resistors R2 to R6, and the other end of the five pull-up resistors R2 to R6 are all connected to the reference power supply.

[0041] According to the protocol standard, the signal connection state of the five power configuration identifier pins of a BGA SSD can be either grounded (GND) or floating (NC). By connecting the power configuration identifier pins to the detection pins and pull-up resistors respectively, their signal connection state can be converted to a high level (VCC) or a low level (0V). For example, when the signal connection states of the five power configuration identifier pins PWR_ID0~PWR_ID4 of the storage device under test 20 are GND, NC, NC, NC, NC, the logic levels of the detection pins IO2~IO6 read by the control module 100 are 0, 1, 1, 1, 1 respectively. Since the control module 100 has pre-programmed firmware containing power supply configuration parameters for various storage devices, after reading the level combination of the detection pins IO2~IO6, the control module 100 can determine the type and power supply configuration parameters of the storage device under test 20, thereby accurately controlling the power conversion module 300 to output the corresponding multiple power supply voltages, achieving automatic adaptation and safe testing of different types of storage devices.

[0042] Further, please refer to Figure 3 In one optional implementation, the power supply configuration parameters include: target values ​​for the multiple power supply voltages corresponding to the storage device under test 20.

[0043] The power conversion module 300 includes a first power converter 310, a second power converter 320, and a third power converter 330. Optionally, the first power converter 310, the second power converter 320, and the third power converter 330 are all DC / DC converters.

[0044] The first power converter 310, the second power converter 320, and the third power converter 330 are all connected to a reference power supply. The input pins of the first power converter 310, the second power converter 320, and the third power converter 330 are all connected to the control module 100, and the output pins of the first power converter 310, the second power converter 320, and the third power converter 330 are respectively connected to the first power supply terminal PWR_1, the second power supply terminal PWR_2, and the third power supply terminal PWR_3 of the storage device under test 20.

[0045] The control module 100 is used to send a first voltage conversion signal, a second voltage conversion signal, and a third voltage conversion signal to the first power converter 310, the second power converter 320, and the third power converter 330 respectively, according to the target value of the multi-channel power supply voltage corresponding to the storage device under test 20.

[0046] The first power converter 310 is used to convert the reference voltage VCC into a first supply voltage according to the first voltage conversion signal, and send it to the first power supply terminal PWR_1 of the storage device under test 20.

[0047] The second power converter 320 is used to convert the reference voltage VCC into a second supply voltage according to the second voltage conversion signal, and send it to the second power supply terminal PWR_2 of the storage device under test 20.

[0048] The third power converter 330 is used to convert the reference voltage VCC into a third supply voltage according to the third voltage conversion signal and send it to the third supply terminal PWR_3 of the storage device under test 20.

[0049] Based on the above design, the control module 100 can determine the type of the storage device under test (DUT) 20 by reading the level combinations corresponding to the more than 20 power configuration identifier pins, and obtain the target values ​​of its corresponding multi-channel power supply voltages. This allows the control module to control each power converter to convert the reference voltage into a power supply voltage that meets the corresponding voltage requirements. This multi-channel independent adjustable voltage conversion design can accurately meet the differentiated requirements of different types of storage devices for each power supply voltage, effectively avoiding the risk of device damage due to power supply voltage mismatch, thereby reducing testing costs.

[0050] Furthermore, in actual testing, the timing of multiple power supply voltages for the storage device under test (DUT) 20 is also subject to strict requirements, and the power-on / power-off timing of multiple power supply voltages for different types of DUTs 20 is not entirely the same. In view of this, this application, in addition to supporting the independent setting of the magnitude of each power supply voltage, further adds a timing control function, thereby fully adapting to the power supply testing needs of different types of DUTs 20.

[0051] In one optional implementation, the power supply configuration parameters further include the power-on timing of the multiple power supply voltages corresponding to the storage device under test 20.

[0052] The storage device test circuit 10 also includes: a first pull-down resistor R7, a second pull-down resistor R8, and a third pull-down resistor R9.

[0053] The first enable control pin IO7, the second enable control pin IO8, and the third enable control pin IO9 of the control module 100 are respectively connected to the enable pin EN1 of the first power converter 310, the enable pin EN2 of the second power converter 320, and the enable pin EN3 of the third power converter 330. The first enable control pin IO7, the second enable control pin IO8, and the third enable control pin IO9 of the control module 100 are also grounded through the first pull-down resistor R7, the second pull-down resistor R8, and the third pull-down resistor R9, respectively.

[0054] The control module 100 is used to control the order of the first enable signal, the second enable signal and the third enable signal output by the storage device under test 20 according to the power-on timing of the multiple power supply voltages corresponding to the storage device under test 20, so as to control the power-on sequence of the first power converter 310, the second power converter 320 and the third power converter 330.

[0055] Optionally, the enable pin EN1 of the first power converter 310, the enable pin EN2 of the second power converter 320, and the enable pin EN3 of the third power converter 330 are all active high. When all enable control pins (IO7~IO9) of the control module 100 do not output enable signals, the enable pin of each power converter is pulled down to ground by the corresponding pull-down resistor, and all power converters are in an inactive state, with no power supply voltage output.

[0056] Therefore, by reading the level combinations corresponding to multiple power configuration identifier pins, the control module 100 can determine the target values ​​and power-on sequence of the multiple power supply voltages required by the storage device under test 20. Subsequently, the control module 100 controls the enabling sequence of each power converter according to the power-on sequence requirements, and controls the output voltage of each power converter according to the target values ​​of the multiple power supply voltages, thereby providing the storage device under test 20 with multiple power supply voltages that meet the voltage specifications and power-on sequence requirements.

[0057] In another optional implementation, the power supply configuration parameters also include the power-down timing of the multiple power supply voltages corresponding to the storage device under test 20.

[0058] When the test of the storage device under test 20 ends, the control module 100 controls the power-down sequence of the first power converter 310, the second power converter 320 and the third power converter 330 according to the power-down sequence of the multiple power supply voltages corresponding to the storage device under test 20, thereby ensuring that the storage device under test 20 is safely powered off according to the prescribed power-down sequence, and effectively avoiding data loss or circuit damage that may be caused by improper power-down sequence.

[0059] In the aforementioned embodiments, the input pins of the first power converter 310, the second power converter 320, and the third power converter 330 are all directly connected to the control module 100. However, due to the limited available pin resources of the control module 100, it may not be able to provide enough pins to connect multiple power converters simultaneously in practical applications.

[0060] In view of this, please refer to Figure 4 In an optional embodiment, the storage device test circuit 10 further includes an interface expansion module 400. One end of the interface expansion module 400 is connected to the output pin of the control module 100, and the other end of the interface expansion module 400 is connected to the input pins of the first power converter 310, the second power converter 320, and the third power converter 330, respectively.

[0061] The interface expansion module 400 can expand a single output pin of the control module 100 into three independent output pins to send signals to the first power converter 310, the second power converter 320 and the third power converter 330 respectively, thereby effectively solving the problem of limited pin resources in the control module 100 and enhancing the expandability and adaptability of the circuit system.

[0062] Based on the above design, after the storage device under test 20 is placed in the test fixture, the control module 100, under the action of multiple pull-up resistors (i.e., pull-up module 200), reads the level combination corresponding to multiple power configuration identifier pins, determines the power supply configuration parameters of the storage device under test 20 (i.e., the target value of multiple power supply voltages and the power-on / power-off sequence) according to the level combination, and controls the power conversion module 300 to output multiple power supply voltages that meet the requirements according to the power supply configuration parameters. Thus, a single test fixture can be used to perform power supply tests on various types of storage devices under test 20, greatly reducing the testing cost of storage devices.

[0063] However, in practice, it has been found that the storage device under test 20 may not be correctly placed in the test fixture (for example, the storage device under test 20 may be rotated 180° horizontally and placed in reverse). Such misoperation can easily lead to the risk of device burnout. In view of this, embodiments of this application provide a foolproof protection design that can promptly identify when the storage device under test 20 is incorrectly placed, effectively avoiding damage caused by short circuits, overvoltage, etc.

[0064] like Figure 5 As shown, in an optional embodiment, the storage device test circuit 10 further includes a foolproof pull-up resistor R1, and the control module 100 includes a foolproof detection pin IO1.

[0065] Among them, the foolproof detection pin IO1 is connected to the storage device under test 20, and the foolproof detection pin IO1 is also connected to one end of the foolproof pull-up resistor R1, and the other end of the foolproof pull-up resistor R1 is connected to the reference power supply.

[0066] When the storage device under test 20 is placed correctly, the foolproof detection pin IO1 of the control module 100 is connected to the ground pin GND of the storage device under test 20. The foolproof detection pin IO1 is at a low level, and the storage device test circuit 10 tests the storage device under test 20.

[0067] When the storage device under test 20 is placed incorrectly, the foolproof detection pin IO1 of the control module 100 is connected to the floating pin NC of the storage device under test 20, the foolproof detection pin IO1 is at a high level, and the storage device test circuit 10 stops supplying power to the storage device under test 20.

[0068] Optionally, the positional relationship between the ground pin GND and the floating pin NC of the storage device under test 20 is as follows: when the storage device under test 20 is rotated horizontally by 180° and placed in reverse, the positions of its ground pin GND and the floating pin NC are swapped, that is, the ground pin GND is moved to the original floating pin NC position, and the floating pin NC is moved to the original ground pin GND position accordingly.

[0069] For example, when the storage device under test 20 is as follows Figure 5 When correctly placed on the test fixture, the foolproof detection pin IO1 of the control module 100 is connected to the ground pin GND of the storage device under test 20. At this time, the foolproof detection pin IO1 is pulled down to ground, which is a low level, and the storage device test circuit 10 performs subsequent tests on the storage device under test 20.

[0070] When the storage device under test 20 is rotated 180° and placed in reverse, the foolproof detection pin IO1 of the control module 100 is connected to the floating pin NC of the storage device under test 20. At this time, the foolproof detection pin IO1 is pulled up to VCC by the foolproof pull-up resistor R1, which is a high level. The storage device test circuit 10 stops supplying power to the storage device under test 20, and the test ends.

[0071] In another optional embodiment, the storage device test circuit 10 further includes a first warning light 500 and a second warning light 600. Both the first warning light 500 and the second warning light 600 are connected to the control module 100.

[0072] When the foolproof detection pin IO1 of the control module 100 is high, it indicates that the storage device under test 20 is placed incorrectly, and the control module 100 controls the first warning light 500 to illuminate. Optionally, the first warning light 500 can be a red LED light for alarm purposes.

[0073] When the foolproof detection pin IO1 of the control module 100 is low, it indicates that the storage device under test 20 is placed correctly, and the control module 100 controls the second warning light 600 to illuminate. Optionally, the second warning light 600 can be a green LED to indicate a normal status.

[0074] Optionally, embodiments of this application also provide a test fixture, which includes a storage device test circuit as described in any of the foregoing embodiments.

[0075] Optionally, please refer to Figure 6 This application also provides a testing method for a storage device test circuit as described in any of the foregoing embodiments, the testing method comprising: In step S30, under the action of the pull-up module, the control module reads the level combinations corresponding to multiple power configuration identifier pins and determines the power supply configuration parameters of the storage device under test based on the level combinations.

[0076] In step S40, the control module sends a control signal to the power conversion module according to the power supply configuration parameters.

[0077] In step S50, the power conversion module outputs multiple power supply voltages that meet the power supply configuration parameter requirements to the storage device under test according to the control signal.

[0078] Through the above steps S30 to S50, automatic identification and precise power supply of the power supply configuration of the storage device under test are achieved. It enables power supply testing of storage devices under test with the same package but different voltage and timing requirements using a single test fixture, saving resources and reducing the testing cost of storage devices.

[0079] Furthermore, to prevent damage to the storage device under test due to incorrect placement, in one optional embodiment, the storage device test circuit further includes a foolproof pull-up resistor, and the control module includes a foolproof detection pin. The foolproof detection pin is connected to the storage device under test and is also connected to one end of the foolproof pull-up resistor, the other end of which is connected to a reference power supply.

[0080] like Figure 7 As shown, before step S30, where the control module reads the level combination corresponding to the power configuration identifier pin under the action of the pull-up module, the test method provided in this application further includes: Step S10: The control module reads the level status of the foolproof detection pin.

[0081] Step S20: When the foolproof detection pin is high, the storage device test circuit stops supplying power to the storage device under test; and / or, when the foolproof detection pin is low, the storage device test circuit performs a test on the storage device under test.

[0082] In summary, this application provides a storage device test circuit, test fixture, and test method. The circuit includes a control module, a pull-up module, and a power conversion module. Multiple detection pins of the control module are connected one-to-one with multiple power configuration identifier pins of the storage device under test (SDD), and each detection pin of the control module is also connected to the pull-up module. The power conversion module is connected to both the control module and the SDD. The control module, under the action of the pull-up module, reads the level combinations corresponding to the multiple power configuration identifier pins and determines the power supply configuration parameters of the SDD based on these level combinations. The control module also sends control signals to the power conversion module according to the power supply configuration parameters. The power conversion module outputs multiple power supply voltages conforming to the power supply configuration parameter requirements to the SDD according to the control signals.

[0083] This circuit, through the coordinated operation of the control module and pull-up module, can automatically identify the type of the memory device under test (DUT) and dynamically configure the output voltage of the power conversion module accordingly. This allows for power supply testing of memory devices with the same package but different voltage requirements using a single test fixture, saving resources and reducing testing costs. Compared to existing technologies, this application eliminates the need for separate test fixtures for different memory devices, reducing the number of fixtures and resource waste, and fundamentally avoiding the risk of chip burnout due to misuse of fixtures. Furthermore, this application adds a foolproof pull-up resistor to protect the DUT from damage caused by incorrect placement, further reducing testing costs.

[0084] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0085] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A test circuit for a storage device, characterized in that, The storage device test circuit, applied to a test fixture, includes: a control module, a pull-up module, and a power conversion module; The control module has multiple detection pins that are connected one-to-one with multiple power configuration identification pins of the storage device under test, and each of the detection pins of the control module is also connected to the pull-up module; the power conversion module is connected to both the control module and the storage device under test. The control module is used to read the level combinations corresponding to multiple power configuration identifier pins under the action of the pull-up module, and determine the power supply configuration parameters of the storage device under test based on the level combinations. The control module is also used to send control signals to the power conversion module according to the power supply configuration parameters; The power conversion module is used to output multiple power supply voltages that meet the power supply configuration parameter requirements to the storage device under test according to the control signal.

2. The storage device test circuit according to claim 1, characterized in that, The signal connection status of the power configuration identifier pin of the storage device under test includes: grounded state and floating state; The pull-up module includes multiple pull-up resistors; wherein the number of pull-up resistors equals the number of detection pins equals the number of power configuration identifier pins; Each detection pin of the control module is connected to one end of one of the pull-up resistors and a power configuration identifier pin of the storage device under test, and the other end of all the pull-up resistors is connected to a reference power supply. When the signal connection state of the power configuration identifier pin is grounded, the detection pin connected to the power configuration identifier pin is at a low level. When the signal connection state of the power configuration identifier pin is floating, the detection pin connected to the power configuration identifier pin is at a high level.

3. The storage device test circuit according to claim 1, characterized in that, The power supply configuration parameters include: the target values ​​of the multiple power supply voltages corresponding to the storage device under test; The power conversion module includes: a first power converter, a second power converter, and a third power converter; The first power converter, the second power converter, and the third power converter are all connected to a reference power supply; the input pins of the first power converter, the second power converter, and the third power converter are all connected to the control module; and the output pins of the first power converter, the second power converter, and the third power converter are respectively connected to the first power supply terminal, the second power supply terminal, and the third power supply terminal of the storage device under test. The control module is used to send a first voltage conversion signal, a second voltage conversion signal, and a third voltage conversion signal to the first power converter, the second power converter, and the third power converter respectively, according to the target value of the multi-channel power supply voltage corresponding to the storage device under test. The first power converter is used to convert the reference voltage into a first supply voltage according to the first voltage conversion signal, and send it to the first power supply terminal of the storage device under test; The second power converter is used to convert the reference voltage into a second supply voltage according to the second voltage conversion signal, and send it to the second power supply terminal of the storage device under test; The third power converter is used to convert the reference voltage into a third supply voltage according to the third voltage conversion signal, and send it to the third power supply terminal of the storage device under test.

4. The storage device test circuit according to claim 3, characterized in that, The power supply configuration parameters also include: the power-on timing of the multiple power supply voltages corresponding to the storage device under test; The storage device test circuit further includes: a first pull-down resistor, a second pull-down resistor, and a third pull-down resistor; The first enable control pin, the second enable control pin, and the third enable control pin of the control module are respectively connected to the enable pins of the first power converter, the second power converter, and the third power converter, and the first enable control pin, the second enable control pin, and the third enable control pin of the control module are also grounded through the first pull-down resistor, the second pull-down resistor, and the third pull-down resistor, respectively. The control module is used to control the order of its output first enable signal, second enable signal and third enable signal according to the power-on timing of the multiple power supply voltages corresponding to the storage device under test, so as to control the power-on sequence of the first power converter, the second power converter and the third power converter.

5. The storage device test circuit according to claim 4, characterized in that, The power supply configuration parameters also include: the power-down timing of the multiple power supply voltages corresponding to the storage device under test; When the test of the storage device under test is completed, the control module is used to control the power-down sequence of the first power converter, the second power converter and the third power converter according to the power-down sequence of the multiple power supply voltages corresponding to the storage device under test.

6. The storage device test circuit according to claim 3, characterized in that, The storage device test circuit also includes an interface expansion module; One end of the interface expansion module is connected to the output pin of the control module, and the other end of the interface expansion module is connected to the input pins of the first power converter, the second power converter, and the third power converter, respectively. The interface expansion module is used to expand one output pin of the control module into three output pins to send signals to the first power converter, the second power converter, and the third power converter, respectively.

7. The storage device test circuit according to claim 1, characterized in that, The storage device test circuit also includes a foolproof pull-up resistor, and the control module includes a foolproof detection pin. The foolproof detection pin is connected to the storage device under test, and the foolproof detection pin is also connected to one end of the foolproof pull-up resistor, the other end of the foolproof pull-up resistor is connected to the reference power supply; When the storage device under test is placed incorrectly, the foolproof detection pin of the control module is connected to the floating pin of the storage device under test, the foolproof detection pin is at a high level, and the storage device test circuit stops supplying power to the storage device under test. When the storage device under test is placed correctly, the foolproof detection pin of the control module is connected to the ground pin of the storage device under test, the foolproof detection pin is at a low level, and the storage device test circuit tests the storage device under test.

8. The storage device test circuit according to claim 7, characterized in that, The storage device test circuit also includes a first warning light and a second warning light; both the first warning light and the second warning light are connected to the control module. When the foolproof detection pin of the control module is at a high level, the control module controls the first warning light to illuminate; When the foolproof detection pin of the control module is at a low level, the control module controls the second warning light to illuminate.

9. A test fixture, characterized in that, Includes the storage device test circuit as described in any one of claims 1-8.

10. A testing method, characterized in that, The method, applied to a storage device test circuit as described in any one of claims 1-8, comprises: Under the action of the pull-up module, the control module reads the level combinations corresponding to multiple power configuration identifier pins and determines the power supply configuration parameters of the storage device under test based on the level combinations. The control module sends a control signal to the power conversion module according to the power supply configuration parameters; The power conversion module outputs multiple power supply voltages that meet the power supply configuration parameters to the storage device under test according to the control signal.

11. The test method according to claim 10, characterized in that, The storage device test circuit further includes a foolproof pull-up resistor, and the control module includes a foolproof detection pin; the foolproof detection pin is connected to the storage device under test, and the foolproof detection pin is also connected to one end of the foolproof pull-up resistor, and the other end of the foolproof pull-up resistor is connected to a reference power supply; Before the step of the control module reading the level combination corresponding to the power configuration identifier pin under the action of the pull-up module, the method further includes: The control module reads the level state of the foolproof detection pin; When the foolproof detection pin is high, the storage device test circuit stops supplying power to the storage device under test; And / or, when the foolproof detection pin is low, the storage device test circuit tests the storage device under test.

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