Multi-system access platform

Abstract

The invention relates to a multi-system access platform. The multi-system access platform comprises a cavity, the cavity is provided with an upper layer and a lower layer, and the upper layer and the lower layer are respectively provided with a multi-frequency combiner. The cavity is further provided with at least one first signal input port and at least one coaxial cavity power division structure, the first signal input port and the coaxial cavity power division structure are correspondingly arranged, and the first signal input port achieves signal transmission with the two multi-frequency combiners through the corresponding coaxial cavity power division structure. After the coaxial cavity power division structure is adopted, the two multi-frequency combiners can be overlapped along the thickness direction of the multi-frequency combiners, so that the space can be fully utilized; besides, the overall size of the coaxial cavity power division structure is obviously smaller than that of a preceding-stage bridge, and a cable connected between the preceding-stage bridge and the multi-frequency combiner is omitted, so that the structure is simplified, the overall size is reduced, debugging is facilitated, and the cost is reduced.

Description

Technical Field

[0001] This application relates to the field of mobile communication technology, and in particular to a multi-system access platform. Background Technology

[0002] With the development of mobile communication technology, point-of-interface (POI) platforms have been widely used. POI platforms primarily aim to achieve the combining and efficient transmission of signals from multiple operators, systems, and standards. However, in various indoor distribution systems (IDS) scenarios, considering the inconsistent signal attenuation across different frequency bands, the varying requirements for signal coverage and communication capacity from different operators, and the different investments in coverage equipment by each operator, final-stage combining POI devices have emerged.

[0003] Final-stage combining POI devices in related technologies typically include a chassis, multi-frequency combiners, a bridge, and cables. Two multi-frequency combiners are used to achieve signal coverage in different areas. Signals of different bandwidths are electrically connected to the bridge via cables, and the bridge is then electrically connected to the two multi-frequency combiners via cables. The bridge and multi-frequency combiners are fixed inside the chassis using mounting hardware.

[0004] However, in the final-stage combining type POI equipment in related technologies, the chassis size is large, and the debugging of multi-stage integration is difficult and costly. Summary of the Invention

[0005] Therefore, it is necessary to provide a multi-system access platform that addresses the shortcomings of existing technologies, which can simplify the structure, reduce the size, facilitate debugging, and lower costs.

[0006] This application provides a multi-system access platform, including a cavity, the cavity having an upper layer and a lower layer, each of the upper and lower layers being provided with a multi-frequency combiner; the cavity also has at least one first signal input port and at least one coaxial cavity power divider structure, the first signal input port being correspondingly arranged with the coaxial cavity power divider structure, and the first signal input port realizing signal transmission with the two multi-frequency combiners through the corresponding coaxial cavity power divider structure.

[0007] In one embodiment, the coaxial cavity power divider structure includes two first resonant cavities symmetrically distributed on the upper and lower layers, with a window between the two first resonant cavities and communication through the window. The two first resonant cavities are connected to the two multi-frequency combiners in a one-to-one correspondence. The first resonant cavity includes a first cavity wall and a first resonant pillar provided by the cavity body, with the first resonant pillar connected to the first cavity wall.

[0008] In one embodiment, the first signal input port is provided with a signal transmission structure for connecting the two first resonant pillars.

[0009] In one embodiment, a coupling hole is provided between the two first resonant pillars, and the signal transmission structure is a coupling rod passing through the coupling hole.

[0010] In one embodiment, the first cavity wall includes a first bottom wall and a first side wall, the first side wall is connected to the first bottom wall, the first bottom walls of the two first resonant cavities are connected as one unit, and the window passes through the two first bottom walls.

[0011] In one embodiment, an insertion hole is provided between the two first cavity walls, and both the insertion hole and the coupling hole are connected to the window.

[0012] In one embodiment, the coaxial cavity power divider structure further includes two tuning elements; the first resonant cavity further includes a cover body connected to the wall of the first cavity body; each of the tuning elements is correspondingly disposed on each of the covers body, and the position of the tuning element is adjustable along the thickness direction of the cover body; each of the two first resonant pillars has a tuning hole at one end facing away from each other, and the positions of each of the tuning elements and each of the tuning holes are correspondingly disposed.

[0013] In one embodiment, each of the multi-frequency combiners includes a second resonant cavity, with two second resonant cavities symmetrically distributed on the upper and lower layers of the cavity. The second resonant cavity includes a second cavity wall and a second resonant post provided by the cavity, with the second resonant post connected to the second cavity wall.

[0014] In one embodiment, at least two coaxial cavity power dividers are provided, and at least two first signal input ports are provided, with each first signal input port corresponding to each coaxial cavity power divider.

[0015] In one embodiment, the cavity further includes at least two second signal input ports, one of which is connected to at least one of the second signal input ports, and the other is connected to the remaining second signal input ports.

[0016] In one embodiment, the cavity further includes two signal output ports, and the two multi-frequency combiners are connected to the two signal output ports in a one-to-one correspondence.

[0017] In the aforementioned multi-system access platform, the bandwidth signal from the first signal input port is transmitted to the coaxial cavity power divider structure. From there, it is transmitted to two multi-frequency combiners, effectively splitting the bandwidth signal into two. This allows the multi-system access platform to achieve the same combining effect and coverage, thus replacing passive components such as the pre-stage bridge or a separate power divider in related technologies. Furthermore, by using the coaxial cavity power divider structure, the two multi-frequency combiners are arranged on the upper and lower layers of the cavity, respectively, stacked along their thickness, maximizing space utilization. Additionally, the overall size of the coaxial cavity power divider structure is significantly smaller than that of the pre-stage bridge, eliminating the need for cables connecting the pre-stage bridge and the multi-frequency combiners. This simplifies the structure, reduces the overall size, facilitates debugging, and lowers costs. Attached Figure Description

[0018] Figure 1 This is a structural diagram of a coaxial cavity power divider structure according to an embodiment of this application.

[0019] Figure 2 for Figure 1 The cross-sectional structure of the coaxial cavity power distribution structure shown Figure 1 .

[0020] Figure 3 for Figure 1 The cross-sectional structure of the coaxial cavity power distribution structure shown Figure 2 .

[0021] Figure 4 This is a top view of a multi-system access platform according to an embodiment of this application.

[0022] Figure 5 for Figure 4 The diagram shows a simplified structure of the multi-system access platform.

[0023] 10. Multi-frequency combiner; 11. Second resonant cavity; 20. Coaxial cavity power divider structure; 21. First resonant cavity; 2101. First chamber; 211. First bottom wall; 2111. Window; 2112. Coupling hole; 212. First side wall; 2121. Insertion hole; 213. Resonant pillar; 2131. Tuning hole; 214. Insertion channel; 22. Tuning element; 30. First signal input port; 31. Signal transmission structure; 40. Second signal input port; 50. Signal output port; Z, thickness direction. Detailed Implementation

[0024] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0025] As described in the background section, the final-stage combining POI equipment in the related technology has the problems of large chassis size, high difficulty in multi-stage commissioning, and high cost. The reason for this problem is that the size of the bridge and the multi-frequency combiner in the related technology are both large. When the number of connected ports is large, the number of cables used also increases, resulting in a large chassis size and a complex overall structure, which makes multi-stage commissioning difficult and costly.

[0026] For the reasons mentioned above, this application provides a multi-system access platform that simplifies the structure, reduces the size, facilitates debugging, and lowers costs.

[0027] It should be noted that in some embodiments, the multi-system access platform provided in this application is specifically a final-stage combining POI device, but this is not to be construed as a limitation of this application. It is understood that the multi-system access platform of this application can also be a general POI such as a backbone POI (deployed on the base station side) or an extended POI (deployed in the distribution system). Among them, since the multi-system access platform is specifically a final-stage combining POI device, the size is significantly reduced, the structure is significantly simplified, and the debugging is significantly optimized. Therefore, this application specifically uses a final-stage combining POI device as an example.

[0028] The following will combine Figures 1 to 5 This application provides a detailed description of the multi-system access platform.

[0029] Please see Figure 4 and Figure 5 , Figure 4 A top view of a multi-system access platform according to an embodiment of this application is shown. Figure 5 It shows Figure 4 The diagram shows a simplified structure of a multi-system access platform. For example, the multi-system access platform includes a cavity. The cavity has an upper layer and a lower layer. Each of the upper and lower layers is equipped with a multi-frequency combiner 10. That is, the multi-system access platform has two multi-frequency combiners 10. Each of the two multi-frequency combiners 10 can combine and output at least two bandwidth signals, and the two multi-frequency combiners 10 transmit the combined multi-bandwidth signals to two different areas respectively, achieving signal coverage in the two different areas.

[0030] Please see Figure 4 and Figure 5 For example, the cavity also has at least one first signal input port 30 and at least one coaxial cavity power divider structure 20. The first signal input port 30 is correspondingly arranged with the coaxial cavity power divider structure 20, and the signal is split and transmitted through the coaxial cavity power divider structure 20. In this embodiment, the first signal input port 30 transmits signals with the two multi-frequency combiners 10 through the corresponding coaxial cavity power divider structure 20. Thus, the two multi-frequency combiners 10 share the same first signal input port 30 through the coaxial cavity power divider structure 20.

[0031] In the aforementioned multi-system access platform, the bandwidth signal from the first signal input port 30, after being transmitted to the coaxial cavity power divider structure 20, can be transmitted to the two multi-frequency combiners 10 respectively via the coaxial cavity power divider structure 20. This effectively splits the bandwidth signal into two, allowing the multi-system access platform to achieve the same combining effect and coverage function, thus replacing passive components such as the pre-stage bridge or a separate two-way power divider in related technologies. Furthermore, by using the coaxial cavity power divider structure 20, the two multi-frequency combiners 10 are arranged on the upper and lower layers of the cavity, respectively, i.e., the two multi-frequency combiners 10 are stacked along their own thickness direction Z, which makes full use of space. In addition, the overall size of the coaxial cavity power divider structure 20 is significantly smaller than that of the pre-stage bridge, and the cable connecting the pre-stage bridge and the multi-frequency combiners 10 is omitted, thereby simplifying the structure, reducing the overall size, facilitating debugging, and reducing costs.

[0032] Please see Figure 1 , Figure 4 and Figure 5 For example, the coaxial cavity power divider structure 20 includes two first resonant cavities 21 symmetrically distributed in the upper and lower layers. Optionally, the first resonant cavity 21 may be, but is not limited to, a metal component, specifically made of various metal materials such as copper, aluminum, iron, or stainless steel. Of course, the first resonant cavity 21 may also include a dielectric material, and for example, a metal layer may be provided on both the inner and outer walls of the dielectric material.

[0033] For example, a window 2111 is formed between the two first resonant cavities 21, and the two first resonant cavities 21 are connected through the window 2111, forming a common cavity structure. The two first resonant cavities 21 are connected one-to-one with the two multi-frequency combiners 10, and signal transmission is achieved between the first resonant cavity 21 and the corresponding connected multi-frequency signal combiner. Specifically, the first resonant cavity 21 includes a first cavity wall provided by the cavity body and a first resonant post 213, the first resonant post 213 being connected to the first cavity wall.

[0034] Please see Figures 1 to 3 Each of the first cavity walls includes a first bottom wall 211 and a first side wall 212. The first side wall 212 is connected to the first bottom wall 211. The first resonant column 213 is connected to the first bottom wall 211, specifically, for example, connected to the middle portion of the first bottom wall 211. The first bottom walls 211 of the two first resonant cavities 21 are stacked and connected to each other to form an integrated structure, with a window 2111 penetrating both first bottom walls 211. The first side walls 212 of the two first resonant cavities 21 are located on opposite sides of the first bottom wall 211 along the thickness direction Z. That is, the two first resonant cavities 21 are stacked along the thickness direction Z of the first bottom wall 211, and their arrangement directions are opposite.

[0035] An insertion hole 2121 is provided between the two first cavity walls. Both the insertion hole 2121 and the coupling hole 2112 are connected to the window 2111. The shape of the window 2111 is not limited to polygons, circles, or other regular and irregular shapes. There are no restrictions here. The specific shape and size of the opening can be determined according to the frequency band and bandwidth requirements of the bandwidth signal transmitted by the coaxial cavity power divider structure 20.

[0036] A window 2111 is located on the first bottom wall 211 in the region between the insertion hole 2121 and the first resonant post 213. That is, the window 2111 extends from the insertion hole 2121 to the portion of the first bottom wall 211 where the first resonant post 213 is mounted. In other words, the window 2111 communicates with the insertion hole 2121, and the projection of the first resonant post 213 along the thickness direction Z of the first bottom wall 211 is adjacent to the window 2111. Optionally, the portion of the first bottom wall 211 facing away from the insertion hole 2121 is not perforated, to ensure that the first resonant post 213 is connected to the first side wall 212 through the first bottom wall 211.

[0037] For example, the first signal input port 30 is provided with a signal transmission structure 31 for connecting the two first resonant pillars 213. The signal transmission structure 31 can be any one of a coupling rod, coupling disk, coupling ring, or tap, and can be set according to actual needs.

[0038] Among them, a coupling hole 2112 is provided between the two first resonant pillars 213, and the signal transmission structure 31 is a coupling rod passing through the coupling hole 2112.

[0039] For example, window 2111 communicates with insertion hole 2121 and cooperates to form insertion channel 214. Insertion channel 214 can insert signal transmission structure 31. Alternatively, signal transmission structure 31 can be understood as being able to be inserted into window 2111 via insertion hole 2121. After signal transmission structure 31 is inserted into insertion channel 214, both first resonant pillars 213 are connected to signal transmission structure 31 to achieve signal transmission. The two first resonant cavities 21 are connected one-to-one with the two multi-frequency combiners 10. After the bandwidth signal from the first signal input port 30 is transmitted to the two first resonant pillars 213, it can be transmitted to the two multi-frequency combiners 10 via the two first resonant cavities 21, effectively splitting the bandwidth signal into two, allowing the multi-system access platform to achieve the same combining effect and coverage function, thereby replacing passive devices such as pre-amplifier bridges or separate power dividers in related technologies.

[0040] The coaxial cavity power divider structure 20 described above has a significantly smaller overall size than the pre-amplifier bridge and omits the cable connecting the pre-amplifier bridge and the multi-frequency combiner 10, which simplifies the structure, greatly reduces the size, facilitates debugging, and lowers costs.

[0041] For example, the cavity also includes two signal output ports 50. Two multi-frequency combiners 10 are connected to the two signal output ports 50 in a one-to-one correspondence.

[0042] For example, similar to the first signal input port 30, the signal output port 50 is also equipped with any one of the following: a coupling rod, a coupling disk, a coupling ring, or a tap. The specific configuration can be determined according to actual needs.

[0043] In this embodiment, a coupling rod is provided inside the first signal input port 30. The first bottom wall 211 is provided with a coupling hole 2112 positioned opposite to the insertion hole 2121, and the coupling hole 2112 communicates with the window 2111. The coupling rod can extend into the coupling hole 2112 to be electrically coupled to the two first resonant pillars 213.

[0044] It should be noted that in this embodiment, direct electrical connection between the two components refers to the two components being in direct physical electrical contact or connected as a single unit, thereby enabling direct conductivity. In other words, there is no insulating gap between the two components. Specifically, the two components may be connected by welding or by using conductive connectors to achieve direct electrical connection. In this embodiment, coupled electrical connection between the two components refers to the two components not being in direct physical electrical contact, but having a physical gap, thereby achieving coupled power supply.

[0045] Optionally, the outer periphery of the first sidewall 212 and the first bottom wall 211 are connected and cooperate to form a first chamber 2101. The two first chambers 2101 are connected through a window 2111. This facilitates processing. Furthermore, a coupling disk or tap can be provided in the first signal input port 30 to connect with the sidewalls of the two first resonant pillars 213.

[0046] In one specific embodiment, the coaxial cavity power divider structure 20 and the two multi-frequency combiners 10 are integrated into one structure. In other words, the second resonant cavity 11 of both multi-frequency combiners 10 is integrated with the first resonant cavity 21, specifically using a one-piece molding. Alternatively, the first resonant cavity 21 of the coaxial cavity power divider structure 20 can be understood as the first resonant cavity of the multi-frequency combiner 10. Thus, the overall size of the multi-system access platform is smaller, and the chassis and cables can be omitted. Each of the two multi-frequency combiners 10 can combine multiple bandwidth signals and output them externally through the signal output port 50, achieving signal coverage in two different areas.

[0047] Based on the aforementioned embodiments, the coaxial cavity power divider structure 20 is integrally formed with two multi-frequency combiners 10.

[0048] For example, the two first resonant cavities 21 are symmetrical to each other. In this way, the bandwidth signals transmitted to the two multi-frequency combiners 10 via the coaxial cavity power divider structure 20 are kept consistent.

[0049] Of course, in some alternative solutions, the shape and size of the two first resonant cavities 21 can also be different. The specific settings can be flexibly adjusted and set according to actual needs, and no restrictions are imposed here.

[0050] Please see Figures 1 to 3 For example, the first resonant pillar 213, the first bottom wall 211, and the first side wall 212 are integrally formed. This reduces losses and improves performance. Of course, as some alternative solutions, the first resonant pillar 213 can also be connected to the first bottom wall 211 by fasteners such as screws, or by welding, etc., without limitation.

[0051] For example, the coaxial cavity power divider structure 20 also includes two tuning elements 22. The tuning elements 22 are, but are not limited to, made of metal materials such as copper, aluminum, or iron. The first resonant cavity 21 also includes a cover (not shown in the figure), which is connected to the cavity wall, specifically to the first side wall 212. Each tuning element 22 is correspondingly disposed on each cover, and the position of the tuning element 22 is adjustable along the thickness direction Z of the cover. Each of the two first resonant pillars 213 has a tuning hole 2131 at one end facing away from each other, and each tuning element 22 is correspondingly disposed with respect to each tuning hole 2131. The tuning element 22 can extend into the tuning hole 2131 and adjust its position axially to perform a tuning function and improve performance.

[0052] Optionally, the tuning element 22 is configured as a tuning screw, and the tuning hole 2131 is a tuning screw hole corresponding to the tuning element 22.

[0053] For example, each multi-frequency combiner 10 includes a second resonant cavity 11. The second resonant cavity 11 includes a second cavity wall provided by the cavity body and a second resonant post 213, the second resonant post 213 being connected to the second cavity wall. Specifically, the second cavity wall includes a second bottom wall and a second side wall. The second bottom wall and the second side wall are connected and cooperate to form a second chamber. For each multi-frequency combiner 10, the number of second chambers may be, for example, two, three, four, six or more, and is not limited here. It can be flexibly adjusted and set according to actual needs.

[0054] The second bottom walls of the two second resonant cavities 11 are stacked and connected to form an integrated structure, and the second side walls of the two second resonant cavities 11 are located on opposite sides of the second bottom wall along the thickness direction Z. That is, the two second resonant cavities 11 are stacked along the thickness direction Z of the second bottom wall, and their arrangement directions are opposite. The first bottom wall 211 and the second bottom wall are on the same plane and connected to each other to form an integrated structure. In this way, the two multi-frequency combiners 10 and the coaxial cavity power divider structure 20 of the multi-system access platform are both arranged in a stacked manner, which can reduce the size.

[0055] Optionally, the two second resonant cavities 11 are symmetrical to each other.

[0056] Please see Figure 4 and Figure 5 In some embodiments, at least two coaxial cavity power dividers 20 are provided. At least two first signal input ports 30 are provided, with each first signal input port 30 corresponding to each coaxial cavity power divider 20. The number of coaxial cavity power dividers 20 can be, for example, two, three, four, five, or various other quantities, and is not limited here. In this embodiment, the coaxial cavity power dividers 20 are arranged as follows: Figure 4 and Figure 5 The four examples shown are for illustrative purposes only and are not intended to be limiting. Accordingly, there are four first signal input ports 30. The bandwidth signals input to each first signal input port 30 are different from each other. The number of filtered passbands of the bandwidth signals input to each first signal input port 30 is unlimited, for example, one, two, three, or four, etc.

[0057] Please refer to the following: Figure 4 and Figure 5In some embodiments, the cavity further includes at least two second signal input ports 40. One multi-frequency combiner 10 is connected to at least one second signal input port 40, and the other multi-frequency combiner 10 is connected to the remaining second signal input ports 4010. The number of second signal input ports 40 connected to each multi-frequency combiner 10 can be flexibly adjusted and set according to actual needs, for example, one, two, three, or any other arbitrary number, and can be the same or different, without limitation. The second signal input ports 40 can directly transmit bandwidth signals to the corresponding connected multi-frequency combiner 10, thus eliminating the need for the coaxial cavity power divider structure 20 in the above embodiments.

[0058] Optionally, to ensure consistent signal coverage in two different areas, the number of second signal input ports 40 corresponding to each of the two multi-frequency combiners 10 is the same. Furthermore, the bandwidth signals input to the second signal input ports 40 corresponding to each of the two multi-frequency combiners 10 are consistent.

[0059] In this embodiment, the second signal input port 40 is as follows: Figure 4 and Figure 5 The four examples shown are for illustrative purposes only and are not intended to be limiting. Therefore, each multi-frequency combiner 10 is connected to two second signal input ports 40. Furthermore, when there are four first signal input ports 30, each multi-frequency combiner 10 is configured as a six-in-one combiner, meaning that each multi-frequency combiner 10 combines the bandwidth signals from the four first signal input ports 30 and the bandwidth signals from the two second signal input ports 40, and then outputs the signals through the signal output port 50.

[0060] Optionally, the bandwidth signals input to each second signal input port 40 of each multi-frequency combiner 10 are different from each other. The number of filtered passbands of the bandwidth signals input to each second signal input port 40 is not limited, for example, one, two, three or four, etc., and can be flexibly adjusted and set according to actual needs.

[0061] Please see Figure 4 and Figure 5 The first signal input port 30 is installed on the first sidewall 212 of the first resonant cavity 21. The first signal input port 30 is electrically connected to an external radio frequency device to access the operator's bandwidth signal. The second signal input port 40 is installed on the second sidewall of the second resonant cavity 11. The second connector is used for electrical connection to an external radio frequency device to access the operator's bandwidth signal. The signal output port 50 is installed on the second sidewall of the second resonant cavity 11 to output the bandwidth signal combined by the multi-frequency combiner 10.

[0062] It should be noted that the terms "input" and "output" in the first signal input port 30, the second signal input port 40, and the signal output port 50 are only used to distinguish them and do not limit the signal transmission to one direction. It can be understood that the first signal input port 30 can simultaneously input a signal and output it in reverse. The second signal input port 40 can simultaneously input a signal and output it in reverse. The signal output port 50 can simultaneously output a signal and input it in reverse to the multi-system access platform.

[0063] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0064] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0065] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0066] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0067] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0068] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A multi-system access platform, characterized in that, The device includes a cavity, which has an upper layer and a lower layer, each of which is provided with a multi-frequency combiner. The cavity also has at least one first signal input port and at least one coaxial cavity power divider structure. The first signal input port is correspondingly arranged with the coaxial cavity power divider structure, and the first signal input port realizes signal transmission with the two multi-frequency combiners through the corresponding coaxial cavity power divider structure.

2. The multi-system access platform according to claim 1, characterized in that, The coaxial cavity power divider structure includes two first resonant cavities symmetrically distributed in the upper and lower layers. A window is opened between the two first resonant cavities and they are connected through the window. The two first resonant cavities are connected to the two multi-frequency combiners one-to-one. The first resonant cavity includes a first cavity wall and a first resonant pillar provided by the cavity body. The first resonant pillar is connected to the first cavity wall.

3. The multi-system access platform according to claim 2, characterized in that, The first signal input port is provided with a signal transmission structure for connecting the two first resonant pillars.

4. The multi-system access platform according to claim 3, characterized in that, A coupling hole is provided between the two first resonant pillars, and the signal transmission structure is a coupling rod passing through the coupling hole.

5. The multi-system access platform according to any one of claims 2 to 4, characterized in that, The first cavity wall includes a first bottom wall and a first side wall. The first side wall is connected to the first bottom wall. The first bottom walls of the two first resonant cavities are connected as one unit, and the window passes through the two first bottom walls.

6. The multi-system access platform according to claim 4, characterized in that, An insertion hole is provided between the two walls of the first cavity, and both the insertion hole and the coupling hole are connected to the window.

7. The multi-system access platform according to claim 2, characterized in that, The coaxial cavity power divider structure further includes two tuning elements; the first resonant cavity further includes a cover body, which is connected to the wall of the first cavity body; each of the tuning elements is correspondingly disposed on each of the covers body, and the position of the tuning element is adjustable along the thickness direction of the cover body; Each of the two first resonant pillars has a tuning hole at one end facing away from each other, and each tuning element is positioned corresponding to each tuning hole.

8. The multi-system access platform according to claim 1, characterized in that, Each of the multi-frequency combiners includes a second resonant cavity. Two second resonant cavities are symmetrically distributed on the upper and lower layers of the cavity. The second resonant cavity includes a second cavity wall and a second resonant post provided by the cavity. The second resonant post is connected to the second cavity wall.

9. The multi-system access platform according to claim 1, characterized in that, The coaxial cavity power divider structure is configured to have at least two components, and the first signal input port is configured to have at least two components, with each first signal input port corresponding to each coaxial cavity power divider structure.

10. The multi-system access platform according to claim 1, characterized in that, The cavity further includes at least two second signal input ports, one of which is connected to at least one of the second signal input ports, and the other is connected to the remaining second signal input ports.

11. The multi-system access platform according to any one of claims 1 to 4 and 7 to 10, characterized in that, The cavity also includes two signal output ports, and the two multi-frequency combiners are connected to the two signal output ports in a one-to-one correspondence.

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