Pressing device and process for precision circuit board processing

Abstract

The invention discloses a press-fit device and process for precision circuit board processing, and relates to the field of circuit board processing, the press-fit device comprises a main body structure, a press-fit table is fixedly arranged on one side of the main body structure, a press-fit box body is fixedly arranged on the press-fit table, a limiting frame body is arranged at the top opening end of the press-fit box body, and a press plate is slidably embedded in the limiting frame body; the pressing plate is fixed to the driving end of the lifting part through a lifting rod. The two sides of the pressing box body are respectively provided with a through groove used for embedding a multilayer circuit board. The two conveying modules are alternately used for conveying the multi-layer circuit board to be laminated into the laminating box body from the through groove and outputting the laminated multi-layer circuit board from the through groove; according to the invention, in the input and output processes of the multilayer circuit board in the pressing box body, the effect of closing the through groove is realized through sliding fit between the multilayer circuit board and the groove wall of the through groove, so that the leakage phenomenon of the pressing box body is avoided.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing, and in particular to a pressing device and process for precision circuit board processing. Background Technology

[0002] The lamination process of multilayer printed circuit boards is a core step in their manufacturing, and its quality directly determines the reliability, performance, and yield of the product. In existing technologies, vacuum lamination has become the standard process for producing high-quality multilayer circuit boards. Vacuum presses effectively remove air and volatiles between the laminating materials by creating a vacuum in the working chamber, thus preventing defects such as bubbles and delamination after lamination and ensuring interlayer bonding strength and dielectric properties.

[0003] Currently, mainstream vacuum lamination equipment typically employs a single-chamber structure. Its typical workflow is as follows: The laminated circuit board material is fed into the lamination chamber → the chamber is closed and a vacuum is evacuated to the required level → high temperature and pressure are applied to cause the prepreg to flow and solidify → cooling → the vacuum is released and the chamber is opened → the laminated circuit board is removed.

[0004] However, the inventors of this application have discovered through long-term production practice and research that this single-chamber vacuum pressing equipment has a significant technical drawback: its vacuum environment establishment and maintenance efficiency is low, resulting in long production cycles and high energy consumption.

[0005] Specifically, the drawback manifests itself in the following ways: Because the chamber must be opened for loading and unloading after each set of circuit boards is laminated, the vacuum environment inside the chamber is completely destroyed. Before laminating the next set of circuit boards, the vacuum pump unit must be restarted to evacuate the huge chamber from atmospheric pressure back to the required high vacuum level. This process typically takes several minutes to tens of minutes, accounting for a significant portion of the entire lamination cycle and severely limiting the equipment's production efficiency and capacity.

[0006] Frequent vacuuming of large cavities requires the vacuum pump unit to operate under continuous high load, consuming a large amount of electrical energy. At the same time, each vacuuming process also means that the energy used to heat and cool the air inside the cavity is wasted. This not only increases the company's production costs but also contradicts the energy-saving and environmentally friendly concept of green manufacturing.

[0007] Repeated vacuuming and devastating cycles may cause fatigue or reduced sealing performance of some components in the chamber due to frequent pressure fluctuations, increasing the frequency of equipment maintenance and the risk of failure. Summary of the Invention

[0008] This invention provides a pressing device and process for precision circuit board processing, which can solve the following problems existing in the prior art: 1) Repeated vacuuming results in a lengthy cycle; 2) Significant energy waste and high costs; 3) Potential risks to process stability.

[0009] A pressing device for precision circuit board processing includes a main structure, a pressing table fixedly arranged on one side of the main structure, a pressing box fixedly arranged on the pressing table, a limiting frame provided on the top opening end of the pressing box, and a pressure plate slidably embedded in the limiting frame; the pressure plate is fixed to the driving end of the lifting part through a lifting shaft. The pressing box has through slots on both sides for embedding multi-layer circuit boards. It also includes two sets of conveying modules, which are used alternately to convey the multilayer circuit board to be pressed from the through slot to the pressing box and to output the pressed multilayer circuit board from the through slot.

[0010] Preferably, one set of conveying modules includes a first positioning plate and a second positioning plate arranged in parallel and symmetrical arrangement, and another set of conveying modules includes a third positioning plate and a fourth positioning plate arranged in parallel and symmetrical arrangement. Conveying grooves for embedding multilayer circuit boards are formed between the first positioning plate and the second positioning plate and between the third positioning plate and the fourth positioning plate, respectively. The bottom of the pressing table is fixedly equipped with a translation mechanism. The ends of the first positioning plate and the fourth positioning plate that are far apart from each other are fixedly connected with push rods. The push rods on both sides are fixed to the drive end of the translation mechanism through a push frame.

[0011] Preferably, multiple guide grooves are formed on the inner wall of the pressing box.

[0012] Preferably, a heating chamber is formed in the wall of the pressing box. The heating chamber in one side of the box wall is connected to the oil pump through an oil inlet pipe, and the other end of the oil pump is connected to the oil storage tank. The heating chamber in the other side of the box wall is connected to the return oil pump through a circulating oil pipe, and the other end of the return oil pump is connected to the oil storage tank.

[0013] Preferably, the two sides of the pressing box are symmetrically provided with a first cooling section and a second cooling section, the first cooling section and the second cooling section respectively include a first cooling plate and a second cooling plate, and cooling cavities are opened in the first cooling plate and the second cooling plate. The cooling cavity of the first cooling plate is connected to the water inlet pump through the water inlet pipe, and the other end of the water inlet pump is connected to the cooling water tank. The cooling cavity of the second cooling plate is connected to the water outlet pump through the water outlet pipe.

[0014] Preferably, a heat insulation plate is fixedly arranged between the second positioning plate and the third positioning plate.

[0015] Preferably, a support plate is slidably embedded between the first positioning plate and the second positioning plate, and between the third positioning plate and the fourth positioning plate, and the support plate is connected to a lifting mechanism that drives its lifting and lowering.

[0016] Preferably, the lifting mechanism includes a lifting rod fixed to the bottom of the bearing plate, a guide groove is provided on the pressing table, the bottom end of the lifting rod extends through the guide groove to the bottom of the pressing table, the end of the lifting rod away from the bearing plate is slidably inserted into the limiting plate, and baffles are fixedly arranged at both ends of the bottom of the limiting plate, and the two baffles are slidably sleeved on the guide rod respectively. Among them, the ends of the guide rods on both sides that are close to each other are fixed to the wedge-shaped seats, and the ends that are far apart from each other are rotatably arranged with guide wheels. The sides of the wedge-shaped seats that are close to each other are provided with first inclined guide surfaces. The bottom end of the lifting rod passes through the limiting plate and is fixed to the support plate. The two ends of the support plate are symmetrically arranged with guide rollers that roll and abut against the first inclined guide surfaces on both sides. The guide rod is provided with a first spring.

[0017] Preferably, the bottom of the pressing table is symmetrically and fixedly provided with two sets of guide plates, and guide wheels are rolled on the guide plates. A cone is integrally provided on the side of the guide wheels facing away from each other. Limiting frames are arranged in parallel on the guide plates, and a stop is fixedly provided on the limiting frames. The distance between the stop and the guide plate is smaller than the distance between the limiting frame and the guide plate. A second inclined guide surface is provided on the stop to slide against the cone. The guide plate is also fixedly provided with support rods at both ends, and a sliding plate fixedly connected to the limiting frame is slidably sleeved on the support rods. A second spring is provided on the support rods. Two sets of guide rails are also fixedly arranged symmetrically on the guide plate, and a third inclined guide surface is opened on the side of the two sets of guide rails that are close to each other.

[0018] A lamination process for precision circuit board manufacturing includes the following steps: After the layers of the multilayer circuit board are stacked, they are transported from the through slot to the pressing box. While one set of conveying modules transports the multilayer circuit board to be pressed to the pressing chamber for pressing, another set of conveying modules is located outside the pressing chamber to support the multilayer circuit board to be pressed. After the multi-layer circuit board in the pressing chamber is pressed, the conveying module outputs it for cooling and then moves it to the next processing step. During this process, the conveying module located outside the pressing chamber transports the multi-layer circuit board into the pressing chamber, and so on.

[0019] This invention provides a pressing device and process for precision circuit board processing, which has the following beneficial effects: 1) After the multilayer circuit board of the present invention is stacked, it is transported to the pressing box through the through slot. During the input process, each side of the multilayer circuit board slides against the slot wall, thereby ensuring the sealing between the multilayer circuit board and the through slot. Correspondingly, after the multilayer circuit board is pressed, it is output through the through slot on the other side. Similarly, during the output process, each side of the pressed multilayer circuit board still slides against the slot wall. In the present invention, the multilayer circuit board achieves the sealing effect of the through slot by sliding against the slot wall during the input and output process in the pressing box, so as to avoid leakage in the pressing box. 2) In the initial state, the guide wheel rolls on the guide plate. When the multilayer circuit board is pressed into the pressing box, the pressure plate can press the support plate down. The support plate synchronously drives the support plate down through the lifting rod. During the descent of the support plate, the guide roller drives the two guide wheels away from each other by rolling and abutting against the first inclined guide surface. Since the cone of the guide wheel abuts against the second inclined guide surface, as the cone squeezes the second inclined guide surface, it can drive the limit frame to rise. When the limit frame rises, it can stretch the second spring through the sliding plate and generate elastic force. As the guide wheel moves past the stop, the second spring can drive the limit frame and the stop to reset. The limit frame and the stop can limit the guide wheel to prevent it from resetting. Therefore, when driving the multilayer circuit board... When the circuit board is removed from the pressing chamber, the guide wheel can rise along the third inclined guide surface to the guide rail, thereby synchronously driving the lifting rod and the support plate to rise. This ensures that the upper surface of the pressed multilayer circuit board remains in sliding contact with the upper wall of the through slot to prevent leakage. Correspondingly, when the multilayer circuit board moves to the point of disengagement from the through slot, the guide wheel also moves to the point of disengagement from the guide rail. Under the elastic force of the second spring and the first spring, the components are driven to automatically reset. Therefore, this invention does not require additional servo drive equipment to adjust the height of the support plate. As the conveying module drives the multilayer circuit board to move horizontally, the height of the support plate can be automatically adjusted, which not only improves synchronization and stability but also reduces the control process and lowers production costs. Attached Figure Description

[0020] Figure 1 A three-dimensional structural schematic diagram of a pressing device for precision circuit board processing provided by the present invention; Figure 2 This is a front view structural schematic diagram of a pressing device for precision circuit board processing provided by the present invention; Figure 3 A schematic diagram of the pressing table in a pressing device for precision circuit board processing provided by the present invention; Figure 4 A three-dimensional structural diagram of the pressing table in a pressing device for precision circuit board processing provided by the present invention; Figure 5This is a front view structural diagram of the pressing table in a pressing device for precision circuit board processing provided by the present invention. Figure 6 A schematic diagram of the guide plate in a pressing device for precision circuit board processing provided by the present invention; Figure 7 A schematic diagram of the wedge-shaped seat in a pressing device for precision circuit board processing provided by the present invention; Figure 8 A schematic diagram of the third inclined guide surface in a pressing device for precision circuit board processing provided by the present invention; Figure 9 This is a schematic diagram of the guide groove in a pressing device for precision circuit board processing provided by the present invention.

[0021] Explanation of reference numerals in the attached figures: 1. Main structure; 2. Pressing table; 3. First cooling section; 4. Translation mechanism; 5. First positioning plate; 6. Multilayer circuit board; 7. Guide plate; 101. Lifting section; 102. Lifting shaft; 103. Pressure plate; 104. Negative pressure pipe; 105. Limiting frame; 106. Adsorption port; 201. Pressing box; 202. Through groove; 203. Sealing plate; 204. Oil inlet pipe; 205. Circulating oil pipe; 206. Guide groove; 301. Second cooling section; 302. First cooling plate; 303. Water inlet pipe; 304. Second cooling plate; 401. Push rod; 402. Push frame; 501. Second positioning plate; 502, heat insulation plate; 503, third positioning plate; 504, fourth positioning plate; 505, bearing plate; 506, support plate; 507, limiting plate; 601, first spring; 602, lifting rod; 603, cone; 604, guide roller; 605, wedge seat; 606, first inclined guide surface; 607, guide rod; 608, baffle; 609, guide wheel; 701, limiting frame; 702, sliding plate; 703, support rod; 704, second spring; 705, baffle; 706, second inclined guide surface; 707, guide rail; 708, third inclined guide surface; 709, guide wheel. Detailed Implementation

[0022] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments. Example

[0023] like Figures 1 to 2 as well as Figures 4-5As shown in the figure, an embodiment of the present invention provides a pressing device for precision circuit board processing, including a main structure 1, a pressing table 2 fixedly arranged on one side of the main structure 1, a pressing box 201 fixedly arranged on the pressing table 2, an open end provided at the top of the pressing box 201, a limiting frame 105 fixedly arranged on the open end, and a pressing plate 103 for pressing a multilayer circuit board 6 slidably embedded in the limiting frame 105; wherein, the pressing plate 103 is fixed to the driving end of the lifting part 101 fixed on the main structure 1 via a lifting shaft 102; it should be noted that, after the pressing plate 103 is embedded in the limiting frame 105 in this embodiment, its outer edge surface slides against the side wall of the limiting frame 105 to achieve a sealing effect. When pressing the multilayer circuit board 6, the lifting part 101 can drive the pressing plate 103 to rise and fall in the vertical direction via the lifting shaft 102 for subsequent pressing of the multilayer circuit board 6; Furthermore, the lifting unit 101 in this embodiment can be an electric cylinder or a hydraulic cylinder. This embodiment does not limit its specific model and structure, and adopts existing technology to meet the actual application requirements.

[0024] As one embodiment of this invention, the multilayer circuit board 6 specifically includes an upper steel plate, kraft paper / buffer pad, separator film, outer copper foil, prepreg (PP), inner core board one, prepreg (PP), inner core board two, prepreg (PP), outer copper foil, separator film, kraft paper / buffer pad, and lower steel plate arranged in a stacked manner. Accordingly, this embodiment does not limit the specific arrangement structure of the multilayer circuit board 6, as long as it meets the actual application requirements.

[0025] In this embodiment, please refer to Figures 1-4 The pressing chamber 201 has through slots 202 on both sides for embedding the multilayer circuit board 6. Specifically, after the multilayer circuit board 6 is stacked, it is conveyed to the pressing chamber 201 through the through slots 202. During the input process, the sides of the multilayer circuit board 6 slide against the wall of the through slot 202, thereby ensuring the sealing between the multilayer circuit board 6 and the through slot 202. Correspondingly, after the multilayer circuit board 6 is pressed, it is output through the through slot 202 on the other side. Similarly, during the output process, the sides of the pressed multilayer circuit board 6 still slide against the wall of the through slot 202. In this embodiment, the multilayer circuit board 6 achieves the sealing effect of the through slot 202 by sliding against the wall of the through slot 202 during the input and output process in the pressing chamber 201, so as to avoid leakage in the pressing chamber 201. It also includes two sets of conveying modules, which are used alternately to convey the multilayer circuit board 6 to be pressed from the through slot 202 to the pressing box 201 and to output the pressed multilayer circuit board 6 from the through slot 202. It should be noted that this embodiment uses two sets of conveying modules. When one set of conveying modules conveys the multilayer circuit board 6 to be pressed to the pressing chamber 201 for pressing, the other set of conveying modules is located outside the pressing chamber 201 to receive the multilayer circuit board 6 to be pressed. After the multilayer circuit board 6 in the pressing chamber 201 is pressed, it can be output and cooled by the conveying modules and then moved to the next processing step. During this process, the conveying module located outside the pressing chamber 201 conveys the received multilayer circuit board 6 into the pressing chamber 201. This process is repeated, so that the multilayer circuit board 6 to be pressed can be continuously conveyed into the pressing chamber 201 for pressing by the two sets of conveying modules. During the pressing process, the multilayer circuit board 6 located outside the pressing chamber 201 can be cooled simultaneously. The two processes do not interfere with each other and can be carried out simultaneously, which further improves the pressing efficiency of the multilayer circuit board 6.

[0026] Furthermore, in this embodiment, the conveying module can be moved using a suction cup robot when receiving and pressing the multilayer circuit board 6 and when removing the pressed multilayer circuit board 6, resulting in a higher degree of automation. Example

[0027] Based on Example 1, please refer to Figures 3-6 One set of conveying modules includes a first positioning plate 5 and a second positioning plate 501 arranged in parallel and symmetrical arrangement, and another set of conveying modules includes a third positioning plate 503 and a fourth positioning plate 504 arranged in parallel and symmetrical arrangement. The first positioning plate 5, the second positioning plate 501, the third positioning plate 503, and the fourth positioning plate 504 are all slidably disposed on the pressing table 2. Conveying grooves for embedding multilayer circuit boards 6 are formed between the first positioning plate 5 and the second positioning plate 501 and between the third positioning plate 503 and the fourth positioning plate 504, respectively. A translation mechanism 4 is fixedly arranged at the bottom of the pressing table 2. Push rods 401 are fixedly connected to the ends of the first positioning plate 5 and the fourth positioning plate 504 that are far apart from each other. The push rods 401 on both sides are respectively connected to push frames 402. The multilayer circuit board 6 is fixed to the driving end of the translation mechanism 4. It can be explained that in this embodiment, during the process of inputting or outputting the multilayer circuit board 6 to the pressing box 201, the multilayer circuit board 6 to be transported is first placed between the first positioning plate 5 and the second positioning plate 501 or between the third positioning plate 503 and the fourth positioning plate 504. Then, the translation mechanism 4 is activated. The translation mechanism 4 can drive the first positioning plate 5 and the fourth positioning plate 504 to translate through the push frame 402 and the push rod 401, thereby achieving the effect of synchronously driving the multilayer circuit board 6 to translate on the pressing table 2. When the multilayer circuit board 6 is translated into the pressing box 201, the positioning plates on both sides of the multilayer circuit board 6 are just embedded in the through groove 202 to achieve the effect of further sealing the through groove 202.

[0028] Specifically, the translation mechanism 4 in this embodiment can be a synchronous belt drive mechanism or a screw and nut drive mechanism. This embodiment does not specify the specific model and structure, as long as it meets the actual application requirements.

[0029] Please refer to Figures 4-6 In order to perform vacuum treatment inside the pressing chamber 201, in this embodiment, a negative pressure cavity is opened in the pressing plate 103, and several sets of adsorption ports 106 communicating with the negative pressure cavity are evenly opened at the bottom of the pressing plate 103. A negative pressure pipe 104 communicating with the negative pressure cavity is fixedly arranged on the pressing plate 103, and the other end of the negative pressure pipe 104 is connected to the negative pressure device. It can be noted that in the initial state, the pressing plate 103 is embedded in the limiting frame 105. In this embodiment, by starting the negative pressure device, the negative pressure device generates negative pressure in the negative pressure cavity through the negative pressure pipe 104, and simultaneously performs vacuum treatment inside the pressing chamber 201 through the adsorption ports 106. This allows air and volatiles between the laminated materials to be effectively removed during the pressing process, thereby preventing defects such as bubbles and delamination from appearing in the pressed product, and ensuring the interlayer bonding force and dielectric properties.

[0030] Furthermore, the negative pressure device in this embodiment also adopts existing technology, and its specific model and structure are not limited, as long as they meet the actual application requirements.

[0031] For further information, please refer to Figure 9 In the process of laminating the multilayer circuit board 6, in order to allow the air bubbles between the layers of material to be discharged stably, multiple guide grooves 206 are opened on the inner wall of the laminating box 201. Specifically, when laminating the multilayer circuit board 6, the gas can be discharged along the edge of each layer of material to the guide groove 206, and then discharged from the guide groove 206 into the laminating box 201. It should also be noted that, compared to the prior art of directly opening the pressing equipment for loading and unloading, the air bubbles in this embodiment have a smaller impact on the vacuum degree of the pressing chamber 201. By setting a pressure sensor in the pressing chamber 201 for real-time monitoring, when the discharged air bubbles affect the vacuum degree, the negative pressure equipment can be turned on to extract the gas. Since the content of this gas is small, the vacuuming efficiency is high, and higher pressing efficiency and pressing quality can still be guaranteed.

[0032] In this embodiment, a certain high temperature needs to be maintained during the pressing process. Therefore, please refer to [reference needed]. Figures 3-4A heating chamber is formed inside the wall of the pressing chamber 201. The heating chamber on one side of the chamber wall is connected to the oil pump through the oil inlet pipe 204. The other end of the oil pump is connected to the oil storage tank. The heating chamber on the other side of the chamber wall is connected to the return oil pump through the circulating oil pipe 205. The other end of the return oil pump is connected to the oil storage tank. Specifically, the oil storage tank in this embodiment can be heated by a heater. After being heated to a preset temperature, the oil pump inputs the heat transfer oil in the oil storage tank into the heating chamber of the pressing chamber 201 through the oil inlet pipe 204. Since the multilayer circuit board 6 is provided with copper foil and steel plate structure, heat can be conducted to heat the prepreg. During this process, the pressing plate 103 is used for pressing to ensure the pressing effect of the multilayer circuit board 6.

[0033] Accordingly, after the laminated multilayer circuit board 6 is output from the lamination chamber 201, it can be cooled by referring to [the relevant documentation / reference]. Figures 1-3 The pressing chamber 201 has a first cooling section 3 and a second cooling section 301 symmetrically arranged on both sides. The first cooling section 3 and the second cooling section 301 each include a first cooling plate 302 and a second cooling plate 304, respectively. The first cooling plate 302 and the second cooling plate 304 are arranged parallel and symmetrically on both sides of the through groove 202 and fixedly connected to the pressing table 2. Cooling chambers are formed in the first cooling plate 302 and the second cooling plate 304. The cooling chamber of the first cooling plate 302 is connected to a water pump via an inlet pipe 303, and the other end of the water pump is connected to a cooling water tank. The cooling chamber of the second cooling plate 304 is connected to an outlet pump via an outlet pipe, and the other end of the outlet pump is also connected to a cooling water tank. The pressing table 2 has a section for connecting the first cooling plate 302 and the second cooling plate 304. The circulating water tank is synchronously connected to the cooling chambers of the first cooling plate 302 and the second cooling plate 304. It can be explained that in this embodiment, after the multilayer circuit board 6 is output from the through slot 202, the outer edge of the multilayer circuit board 6 can slide and fit against the first cooling plate 302 and the second cooling plate 304. In this embodiment, the low temperature water in the cooling water tank is transported to the cooling chamber of the first cooling plate 302 through the inlet pipe 303 by the inlet water pump, and then transported to the cooling chamber of the second cooling plate 304 through the circulating water tank. The multilayer circuit board 6 achieves the effect of heat exchange and cooling by contacting the first cooling plate 302 and the second cooling plate 304. The heated water can be recirculated and transported to the cooling water tank for cooling through the outlet pipe and the outlet pump, so as to realize water recycling.

[0034] It should also be noted that during the input or output process of the multilayer circuit board 6 into the pressing box 201 in this embodiment, the multilayer circuit board 6 can always maintain sliding contact with the first cooling plate 302 and the second cooling plate 304, which can further improve the sealing performance of the multilayer circuit board 6 during the input and output process.

[0035] Furthermore, to avoid heat conduction between the multilayer circuit board 6 during the heating process and the multilayer circuit board 6 during the cooling process, in this embodiment, please refer to... Figures 4-5 A heat insulation plate 502 is fixedly arranged between the second positioning plate 501 and the third positioning plate 503. Specifically, in this embodiment, the specific material of the heat insulation plate 502 is not limited, as long as it meets the actual heat insulation requirements.

[0036] As a further aspect of this embodiment, the thickness of the multilayer circuit board 6 decreases after lamination. Therefore, leakage may still occur during the process of outputting the multilayer circuit board 6 through the through slot 202. (See reference...) Figures 4-5 A support plate 505 is slidably embedded between the first positioning plate 5 and the second positioning plate 501, and between the third positioning plate 503 and the fourth positioning plate 504. The support plate 505 is connected to a lifting mechanism that drives its lifting and lowering. It can be explained that in this embodiment, the multilayer circuit board 6 to be pressed can be placed on the support plate 505 for support. Before pressing, the top of the multilayer circuit board 6 is flush with the top of the positioning plate. Therefore, when the multilayer circuit board 6 is driven to be conveyed into the pressing box 201 along the through groove 202, the upper surface of the multilayer circuit board 6 can slide against the upper side wall of the through groove 202 to achieve a sealing effect. When the multilayer circuit board 6 is pressed, its thickness decreases. When it is output from the through groove 202, in order to ensure that the upper surface of the multilayer circuit board 6 slides against the through groove 202 again, the support plate 505 can be driven to rise a preset distance by the lifting mechanism so that the upper surface of the multilayer circuit board 6 after pressing can still slide against the upper side wall of the through groove 202.

[0037] For details, please refer to Figures 4-8The lifting mechanism includes a lifting rod 602 fixed to the bottom of the bearing plate 505. A guide groove 206 is provided on the pressing table 2. The bottom end of the lifting rod 602 extends through the guide groove 206 to the bottom of the pressing table 2. The end of the lifting rod 602 away from the bearing plate 505 is slidably inserted into the limiting plate 507. Baffles 608 are fixedly arranged at both ends of the bottom of the limiting plate 507. The two side baffles 608 are slidably sleeved on the guide rod 607 respectively. The ends of the two side guide rods 607 that are close to each other are connected to the wedge-shaped seat. 605 is fixed, and guide wheels 609 are rotatably arranged at the opposite ends of the wedge-shaped seats 605. First inclined guide surfaces 606 are provided on the sides of the wedge-shaped seats 605 that are close to each other. The bottom end of the lifting rod 602 passes through the limiting plate 507 and is fixed to the support plate 506. Guide rollers 604 are symmetrically arranged at both ends of the support plate 506, rolling against the first inclined guide surfaces 606 on both sides. A first spring 601 is provided on the guide rod 607. One end of the first spring 601 is fixed to the wedge-shaped seat 605, and the other end... The end is fixed to the baffle 608; wherein, two sets of guide plates 7 are symmetrically fixedly arranged at the bottom of the pressing table 2, and guide wheels 609 are rolled on the guide plates 7. A cone 603 is integrally provided on the side of the guide wheels 609 facing away from each other. Limiting frames 701 are arranged in parallel on the guide plates 7, and a stop frame 705 is fixedly arranged on the limiting frame 701. The distance between the stop frame 705 and the guide plate 7 is smaller than the distance between the limiting frame 701 and the guide plate 7. The stop frame 705 has a sliding opening that slides with the cone 603. The guide plate 7 has a second inclined guide surface 706 that abuts against it. Support rods 703 are also fixedly arranged at both ends of the guide plate 7. A sliding plate 702 that is fixedly connected to the limit frame 701 is slidably sleeved on the support rod 703. A second spring 704 is provided on the support rod 703. One end of the second spring 704 is fixed to the sliding plate 702, and the other end is fixed to the end of the support rod 703. Two sets of guide rails 707 are also symmetrically fixedly arranged on the guide plate 7. A third inclined guide surface 708 is opened on the side of the two sets of guide rails 707 that are close to each other. It can be explained that, in the initial state, the guide wheel 609 rolls on the guide plate 7. When the multilayer circuit board 6 is pressed in the pressing box 201, the pressure plate 103 can press the bearing plate 505 down. The bearing plate 505 drives the support plate 506 down synchronously through the lifting rod 602. During the descent of the support plate 506, the guide roller 604 drives the two guide wheels 609 to move away from each other by rolling and abutting against the first inclined guide surface 606. Since the cone 603 of the guide wheel 609 abuts against the second inclined guide surface 706, as the cone 603 squeezes the second inclined guide surface 706, it can drive the limiting frame 701 to rise. When the limiting frame 701 rises, it can stretch the second spring 704 through the sliding plate 702 and generate elastic force. As the guide wheel 609 moves past the stop 705, the second spring 704 can drive the limiting frame 701 and the stop 705 to reset. The limiting frame 701 and the stop 705 can limit the guide wheel 609. To prevent the guide wheel 609 from resetting, when the multilayer circuit board 6 is moved out of the pressing box 201, the guide wheel 609 can rise along the third inclined guide surface 708 to the guide rail 707, thereby synchronously driving the lifting rod 602 and the support plate 505 to rise, so that the upper surface of the pressed multilayer circuit board 6 still slides and fits against the upper groove wall of the through groove 202 to avoid leakage. Correspondingly, when the multilayer circuit board 6 moves to the point of disengaging from the through groove 202, the guide wheel 609 also moves to the guide rail 707 to disengage. Under the elastic force of the second spring 704 and the first spring 601, the components are driven to automatically reset. Therefore, this embodiment does not require other servo drive equipment to adjust the height of the support plate 505. As the conveying module drives the multilayer circuit board 6 to translate, the height of the support plate 505 can be automatically adjusted, which not only improves the synchronization and stability, but also reduces the control process and production costs.

[0038] The support plate 505 remains below the guide groove 206 after it rises, so as to prevent external gas from entering the pressing box 201 through the guide groove 206.

[0039] In addition, a sealing plate 203 is fixedly installed above the side of the two through slots 202 that are far apart from each other; specifically, when the bearing plate 505 drives the multi-layer circuit board 6 to rise after pressing, the multi-layer circuit board 6 is still in a translational state. In order to ensure sealing stability, the sealing plate 203 is set to prevent external gas from entering the pressing box 201 when the multi-layer circuit board 6 rises to the preset position.

[0040] A lamination process for precision circuit board manufacturing includes the following steps: Please see Figures 1-4 After the layers of the multilayer circuit board 6 are stacked, they are conveyed to the pressing box 201 through the through slot 202. S2. When one set of conveying modules conveys the multilayer circuit board 6 to be pressed to the pressing box 201 for pressing, another set of conveying modules is located outside the pressing box 201 to support the multilayer circuit board 6 to be pressed. S3. After the multilayer circuit board 6 located in the pressing box 201 is pressed, the conveying module outputs it for cooling and then moves it to the next processing step. During this process, the conveying module located outside the pressing box 201 conveys the multilayer circuit board 6 into the pressing box 201, and so on.

[0041] The above-disclosed embodiments are merely a few specific examples of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A pressing device for precision circuit board processing, comprising a main structure (1), characterized in that, A pressing platform (2) is fixedly arranged on one side of the main structure (1), and a pressing box (201) is fixedly arranged on the pressing platform (2). A limiting frame (105) is provided on the top opening end of the pressing box (201), and a pressure plate (103) is slidably embedded in the limiting frame (105). The pressure plate (103) is fixed to the driving end of the lifting part (101) through the lifting shaft (102). The pressing box (201) has through slots (202) on both sides for embedding multilayer circuit boards (6). It also includes two sets of conveying modules, which are used alternately to convey the multilayer circuit board (6) to be pressed through the through slot (202) to the pressing box (201) and to output the pressed multilayer circuit board (6) through the through slot (202).

2. The pressing device for precision circuit board processing as described in claim 1, characterized in that, One set of conveying modules includes a first positioning plate (5) and a second positioning plate (501) arranged in parallel and symmetrical arrangement, and another set of conveying modules includes a third positioning plate (503) and a fourth positioning plate (504) arranged in parallel and symmetrical arrangement. Conveying grooves for embedding multilayer circuit boards (6) are formed between the first positioning plate (5) and the second positioning plate (501) and between the third positioning plate (503) and the fourth positioning plate (504). The bottom of the pressing table (2) is fixedly provided with a translation mechanism (4), and the ends of the first positioning plate (5) and the fourth positioning plate (504) that are far apart from each other are fixedly connected with push rods (401). The push rods (401) on both sides are fixed to the driving end of the translation mechanism (4) through the push frame (402).

3. The pressing device for precision circuit board processing as described in claim 1, characterized in that, Multiple guide grooves (206) are provided on the inner wall of the pressing box (201).

4. The pressing device for precision circuit board processing as described in claim 1, characterized in that, The pressing box (201) has a heating chamber in its box wall. The heating chamber in one side of the box wall is connected to the oil pump through the oil inlet pipe (204). The other end of the oil pump is connected to the oil storage tank. The heating chamber in the other side of the box wall is connected to the return oil pump through the circulating oil pipe (205). The other end of the return oil pump is connected to the oil storage tank.

5. The pressing device for precision circuit board processing as described in claim 1, characterized in that, The pressing box (201) is symmetrically provided with a first cooling section (3) and a second cooling section (301) on both sides. The first cooling section (3) and the second cooling section (301) include a first cooling plate (302) and a second cooling plate (304) respectively. Cooling chambers are opened in the first cooling plate (302) and the second cooling plate (304). The cooling chamber of the first cooling plate (302) is connected to the water pump through the water inlet pipe (303). The other end of the water pump is connected to the cooling water tank. The cooling chamber of the second cooling plate (304) is connected to the water outlet pump through the water outlet pipe.

6. The pressing device for precision circuit board processing as described in claim 2, characterized in that, A heat insulation plate (502) is fixedly arranged between the second positioning plate (501) and the third positioning plate (503).

7. The pressing device for precision circuit board processing as described in claim 2, characterized in that, A support plate (505) is slidably embedded between the first positioning plate (5) and the second positioning plate (501) and between the third positioning plate (503) and the fourth positioning plate (504). The support plate (505) is connected to the lifting mechanism that drives it to rise and fall.

8. The pressing device for precision circuit board processing as described in claim 7, characterized in that, The lifting mechanism includes a lifting rod (602) fixed to the bottom of the bearing plate (505). A guide groove (206) is provided on the pressing table (2). The bottom end of the lifting rod (602) extends through the guide groove (206) to the bottom of the pressing table (2). The end of the lifting rod (602) away from the bearing plate (505) is slidably inserted into the limiting plate (507). Baffles (608) are fixedly arranged at both ends of the bottom of the limiting plate (507). The baffles (608) on both sides are slidably sleeved on the guide rod (607). Among them, the ends of the guide rods (607) on both sides that are close to each other are fixed to the wedge-shaped seat (605), and the ends that are far apart from each other are rotatably arranged with guide wheels (609). The first inclined guide surface (606) is opened on the side of the wedge-shaped seat (605) on both sides that are close to each other. The bottom end of the lifting rod (602) passes through the limiting plate (507) and is fixed to the support plate (506). The two ends of the support plate (506) are symmetrically arranged with guide rollers (604) that roll against the first inclined guide surfaces (606) on both sides. The guide rod (607) is provided with a first spring (601).

9. The pressing device for precision circuit board processing as described in claim 8, characterized in that, The bottom of the pressing table (2) is symmetrically and fixedly provided with two sets of guide plates (7). The guide wheels (609) are rolled on the guide plates (7). The two guide wheels (609) are integrated with a truncated cone (603) on the side away from each other. The guide plates (7) are provided with parallel limit frames (701). The limit frames (701) are fixedly provided with a stop frame (705). The distance between the stop frame (705) and the guide plate (7) is smaller than the distance between the limit frame (701) and the guide plate (7). The stop frame (705) is provided with a second inclined guide surface (706) that slides against the truncated cone. Among them, the guide plate (7) is also fixedly provided with support rods (703) at both ends, and a sliding plate (702) fixedly connected to the limit frame (701) is slidably sleeved on the support rods (703). A second spring (704) is provided on the support rods (703). Two sets of guide rails (707) are also fixedly arranged symmetrically on the guide plate (7). A third inclined guide surface (708) is opened on the side of the two sets of guide rails (707) that are close to each other.

10. A pressing process for a pressing apparatus for precision circuit board processing as described in any one of claims 1-9, characterized in that, Includes the following steps: After the layers of the multilayer circuit board (6) are stacked, they are transported to the pressing box (201) through the through slot (202); When one set of conveying modules conveys the multilayer circuit board (6) to be pressed to the pressing box (201) for pressing, another set of conveying modules is located outside the pressing box (201) to support the multilayer circuit board (6) to be pressed. After the multilayer circuit board (6) located in the pressing box (201) is pressed, the conveying module outputs it for cooling and then moves it to the next processing step. During this process, the conveying module located outside the pressing box (201) conveys the multilayer circuit board (6) into the pressing box (201), and so on.

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