Apparatus and system for alkali metal deposition

Abstract

Embodiments of the present disclosure generally relate to apparatuses and systems for alkali metal deposition. In one embodiment, a vapor deposition assembly includes: a first heater region including a plurality of first heaters; an evaporator body, where at least a portion of the evaporator body is positioned within the first heater region, where the evaporator body includes a top surface having a plurality of linear arrays of nozzles; and a second heater region including one or more second heaters. The vapor deposition assembly further includes a crucible positioned within the second heater region, the crucible including a crucible body fluidly coupled with the evaporator body, where the crucible body: defines an interior region for holding material to be vapor deposited; the evaporation chamber is provided with an opening, and an evaporated material can escape through the opening; and having a length dimension and a width dimension defining a vapor deposition surface area.

Description

Technical Field

[0001] The embodiments of this disclosure generally relate to apparatus and systems for alkali metal deposition. Background Technology

[0002] The tools used to form the electrode structures include roll-to-roll (reel-to-reel) systems for transporting substrates through various processing chambers, including those for depositing alkali metal films onto the substrate. This alkali metal deposition is performed under vacuum conditions. Within the vacuum chamber, the alkali metal feedstock is fed into a crucible positioned within an evaporator. The evaporator is placed at a certain vertical distance from the substrate. The crucible is heated to achieve the evaporation and deposition of the alkali metal onto the substrate. Currently, the run length, i.e., the period during which deposition occurs without breaking the vacuum, is limited by the volume of the evaporator (and crucible) and therefore the amount of alkali metal in the evaporator. As the amount of alkali metal decreases during evaporation, an additional amount of lithium is supplied to the evaporator in situ and under vacuum. However, transferring this new alkali metal to the heated evaporator introduces additional problems due to the temperature difference between the lithium in the evaporator and the lithium supplied to the evaporator. Conventional techniques have not yet resolved these and other problems.

[0003] There is a need for novel and improved devices and systems for alkali metal deposition. Summary of the Invention

[0004] The embodiments of this disclosure generally relate to apparatus and systems for alkali metal deposition.

[0005] In one embodiment, a vapor deposition assembly for alkali metal deposition is provided. The vapor deposition assembly includes: a first heater region including a plurality of first heaters; a vapor deposition unit body, at least a portion of which is positioned within the first heater region, wherein: the vapor deposition unit body has a top surface having a plurality of linear arrays of nozzles. The vapor deposition assembly further includes: a second heater region including one or more second heaters; and a crucible positioned within the second heater region, the crucible including a crucible body fluidly coupled to the vapor deposition unit body, wherein: the crucible body defines an internal region for holding material to be vapor-deposited; the crucible body has an opening through which the vapor-deposited material can escape; and the crucible body has a length dimension and a width dimension defining a vapor deposition surface area.

[0006] The implementation may include one or more of the following: Each nozzle of the vapor deposition assembly may have an opening defined by a diameter, the total area of ​​the openings defining the nozzle opening surface area, and / or the vapor deposition surface area of ​​the crucible body is greater than the nozzle opening surface area. The vapor deposition body may further include a bottom surface corresponding to an opening in the crucible body. The vapor deposition body may further include a first pair of opposing sidewalls extending downward from a top surface, defining a length dimension of the vapor deposition body, and / or the vapor deposition body may further include a second pair of opposing sidewalls extending downward, defining a width dimension of the vapor deposition body. A plurality of first heaters in a first heater region may extend the length dimension of the vapor deposition body. The first heater region may further include: a first conductive member positioned between a first heater in a plurality of heaters and a first sidewall in a first pair of opposing sidewalls; and / or a second conductive member positioned between a second heater in a plurality of heaters and a second sidewall in a first pair of opposing sidewalls. A third heater in a plurality of heaters may be positioned between a first heater and a second heater in a plurality of heaters. Multiple first heaters are tubular heaters; and / or one or more second heaters are tubular heaters. The vapor deposition assembly may further include an alkali metal delivery line. The alkali metal delivery line may include: a first section located outside the vapor deposition assembly; a second section located in an internal region of the vapor deposition assembly, the second section traversing the interior of the vapor deposition unit and the crucible body; a third section located in the internal region of the vapor deposition assembly and below an opening in the crucible body; and / or multiple openings through which the alkali metal enters the crucible. The crucible of the vapor deposition assembly may be compartmentless, and / or the vapor deposition assembly may be free of external heaters that radiatively heat the crucible. The vapor deposition assembly may further include a heated delivery line coupled to an internal region of the crucible body for supplying the alkali metal to be deposited to the crucible body.

[0007] In another embodiment, a vapor deposition assembly for alkali metal deposition is provided. The vapor deposition assembly includes: a first heater region including a plurality of first heaters; and a second heater region including one or more second heaters. The vapor deposition assembly further includes a vapor depositor body, at least a portion of which is located within the first heater region and the second heater region, wherein: the vapor depositor body includes: a top surface having a plurality of linear arrays of nozzles; a first pair of opposing sidewalls extending outward from the top surface, the first pair of opposing sidewalls defining a length dimension of the vapor depositor body; and a second pair of opposing sidewalls extending outward from the top surface, the second pair of opposing sidewalls defining a width dimension of the vapor depositor body; and the plurality of first heaters in the first heater region extend the length dimension of the vapor depositor body. The vapor deposition assembly further includes: a third heater region including one or more third heaters; and a crucible positioned within the third heater region, the crucible being further positioned outside the first heater region and the second heater region, the crucible including a crucible body fluidly coupled to the vapor deposition unit body, wherein: the crucible body defines an internal region for holding the material to be vapor-deposited; the crucible body has an opening through which the vapor-deposited material can escape; and the crucible body has a length dimension and a width dimension defining the vapor deposition surface area; and the second heater region is positioned above the opening of the crucible body.

[0008] The implementation may include one or more of the following: The first heater region may further include: a first conductive member positioned between the first heater in the first plurality of heaters and a first sidewall in the first pair of opposing sidewalls; and / or a second conductive member positioned between the second heater in the first plurality of heaters and a second sidewall in the first pair of opposing sidewalls. One or more second heaters in the second heater region may extend the length dimension of the vapor deposition unit body. Each nozzle may have an opening defined by a diameter, the total area of ​​the openings defining the nozzle opening surface area, and / or the vapor deposition surface area of ​​the crucible body may be greater than the nozzle opening surface area. The vapor deposition unit body may further include: a bottom surface corresponding to an opening in the crucible body; and / or a side surface corresponding to a side surface of the crucible. The vapor deposition assembly may further include an alkali metal delivery line. The alkali metal delivery line may include: a first section located outside the vapor deposition assembly; a second section located within the vapor deposition assembly, traversing the interior of the vapor deposition unit and the crucible body; a third section located within the vapor deposition assembly and below an opening in the crucible body; and / or multiple openings through which the alkali metal enters the crucible. The crucible of the vapor deposition assembly may be compartmentless, and / or the vapor deposition assembly may be free of an external heater for radiatively heating the crucible. The vapor deposition assembly may further include a heated delivery line coupled to the interior of the crucible body for supplying the alkali metal to be deposited to the crucible body.

[0009] In another embodiment, a processing chamber for depositing alkali metals is provided. The processing chamber includes a coating roller and a plurality of vapor deposition assemblies described above, the plurality of vapor deposition assemblies being arranged radially around the coating roller.

[0010] The implementation may include one or more of the following: A first vapor deposition component among a plurality of vapor deposition components may have a first tilt angle; and / or a second vapor deposition component among a plurality of vapor deposition components may have a second tilt angle different from the first tilt angle. The second vapor deposition component may be the same as or different from the first vapor deposition component. The first tilt angle may be about 20 degrees to about 25 degrees; and / or the second tilt angle may be about 65 degrees to about 70 degrees. Attached Figure Description

[0011] To gain a more detailed understanding of the features described above in this disclosure, a more specific description of the disclosure, which has been briefly summarized above, can be obtained with reference to the embodiments illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments of this disclosure and should therefore not be construed as limiting the scope of this disclosure, and other equally effective embodiments are appreciated.

[0012] Figure 1A A schematic front view of an example processing chamber having a vapor deposition assembly according to one or more embodiments of the present disclosure is shown.

[0013] Figure 1B A schematic front view of a portion of an example processing chamber of a vapor deposition assembly having one or more embodiments of the present disclosure is shown.

[0014] Figure 2A A first perspective view of an example vapor deposition assembly, such as a thermal vapor deposition apparatus, according to at least one embodiment of the present disclosure is shown.

[0015] Figure 2B At least one embodiment according to this disclosure is shown. Figure 2A A cross-sectional side view of an example vapor deposition assembly.

[0016] Figure 2C At least one embodiment according to this disclosure is shown. Figure 2A The second cross-sectional perspective view of an example vapor deposition assembly, with one side removed.

[0017] Figure 2D At least one embodiment according to this disclosure is shown. Figure 2A The second side view of an example vapor deposition assembly, with one side removed.

[0018] Figure 3AA perspective view of an example vapor deposition assembly, such as a thermal vapor deposition unit, according to at least one embodiment of the present disclosure is shown.

[0019] Figure 3B At least one embodiment according to this disclosure is shown. Figure 3A A side view of an example vapor deposition assembly.

[0020] Figure 4 An example nozzle assembly according to at least one embodiment of the present disclosure is shown.

[0021] Figure 5A An example heat shield assembly according to at least one embodiment of the present disclosure is shown.

[0022] Figure 5B At least one embodiment according to this disclosure is shown. Figure 5A Example mounting mechanism for example heat shield component.

[0023] Figure 5C The image shows a frame and coating roller positioned between the processing chamber according to at least one embodiment of the present disclosure. Figure 5A Example thermal shielding components.

[0024] For ease of understanding, common elements in the figures have been designated using the same element symbols where possible. It is contemplated that elements and features of one embodiment may be beneficially incorporated into other embodiments without further description. Detailed Implementation

[0025] Reference will now be made in detail to various implementations of this disclosure, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same element symbols refer to the same parts. Generally, only differences relative to individual implementations are described. Each example is provided in a manner that interprets this disclosure and is not intended to be a limitation thereof. Furthermore, features illustrated or described as one implementation may be used on or in combination with other implementations to obtain further implementations. Such modifications and variations are intended to be included in the description.

[0026] The numerous details, dimensions, angles, and other features shown in the accompanying drawings are merely illustrative of specific implementations. Therefore, other implementations may have different details, components, dimensions, angles, and features without departing from the spirit or scope of this disclosure. Furthermore, further implementations of this disclosure may be practiced without some of the details described below.

[0027] According to some implementations, vapor deposition processes and apparatuses for performing layer deposition on a substrate (e.g., on a flexible substrate) are provided. Therefore, a flexible substrate can be considered as a film, foil, roll, strip, etc., comprising plastic materials, metals, or other materials. Typically, the terms "roll," "foil," "strip," "substrate," etc., are used synonymously. According to some implementations, components, apparatus, and vapor deposition processes for vapor deposition processes according to the implementations described herein can be provided for use on the flexible substrates described above. However, they can also be provided in conjunction with non-flexible substrates (such as glass substrates) subjected to reactive deposition processes from a vapor deposition source.

[0028] Vacuum roll coating for anode pre-lithiation and solid metal anode protection involves the deposition of thick (three to twenty micrometers) metal (e.g., lithium) onto double-sided coated and rolled alloy-type graphite anodes and current collectors, such as six-micrometer or thicker copper, nickel, or metallized plastic rolls. One technique used for deposition is thermal evaporation. Thermal evaporation can be easily performed when the source material is heated in an open crucible within a vacuum chamber, provided that a sufficient vapor flux from the source is available for condensation on a cooler substrate. The source material can be indirectly heated by heating the crucible, or directly heated by a high-current electron beam directed into the source material confined by the crucible.

[0029] The thermal evaporator described herein may include a crucible design that provides an increased surface area for evaporation compared to conventional designs. This increased surface area means that more vapor can be generated of the material to be evaporated, which increases the pressure within the evaporator body, causing the evaporated material to flow out of the nozzle. The crucible may be attached to the evaporator body of the thermal evaporator. Alternatively, the crucible may be integrated within the evaporator body. The evaporator body may include multiple longitudinal grooves, further increasing the surface area of ​​the evaporator body.

[0030] In one implementation that can be combined with other implementations, a vapor deposition assembly is provided. The vapor deposition assembly includes a crucible for holding a material to be vapor-deposited. The crucible includes a rectangular body defining an internal region for holding the material to be vapor-deposited. The rectangular body includes an opening through which the vapor-deposited material can escape. The rectangular body has a length dimension and a width dimension that define a vapor deposition surface area. A vapor deposition unit body is fluidly coupled to the rectangular body.

[0031] The vapor deposition apparatus body has a top surface comprising a linear array of nozzles. Each nozzle has an opening defined by a diameter, and the total area of ​​the nozzle openings defines the nozzle opening surface area, with the vapor deposition surface area being greater than the nozzle opening surface area. The nozzle opening surface area can be calculated using the formula n*πr², where "n" represents the total number of nozzles and "r" represents the radius of the nozzle opening. The vapor deposition surface area of ​​the crucible can be calculated by multiplying the crucible's length dimension "I" by its width "w".

[0032] The headings are used for convenience only and are not intended to limit the scope of this disclosure. The embodiments described herein may be combined with other embodiments.

[0033] Processing chamber

[0034] Figure 1A A schematic front view of a processing chamber 100 comprising one or more vapor deposition assemblies 140a to 140d (collectively referred to as 140) (e.g., a thermal vapor deposition unit) and a coating roller 110, according to one or more implementations of this disclosure, is illustrated. The processing chamber 100 may be a roll-to-roll system adapted for depositing coatings on roll materials, for example, for depositing metal-containing film stacks according to the implementations described herein. As shown, a first vapor deposition assembly 140a is located at a first position (A), a second vapor deposition assembly 140b is located at a second position (B), a third vapor deposition assembly 140c is located at a third position (C), and a fourth vapor deposition assembly 140d is located at a fourth position (D). The vapor deposition assembly 140 described herein may be made of any suitable material, such as stainless steel, graphite, boron nitride, pyrolytic boron nitride, molybdenum, tungsten, titanium, tantalum, nickel, alloys thereof, or combinations thereof.

[0035] The tilt angle of the first vapor deposition assembly 140a and the second vapor deposition assembly 140b on the coating roller 110 of the processing chamber 100 can be from about 20 degrees to about 25 degrees, such as from about 21 degrees to about 24 degrees, such as from about 22 degrees to about 23 degrees, such as about 22.5 degrees, but other tilt angles are also contemplated. Any of the foregoing values ​​can be used individually to describe an open area or in combination to describe a closed area. The tilt angle is relative to the base plate 180 of the processing chambers 100, 150 (the horizontal plane indicated by the dashed line 145 on the page).

[0036] The tilt angle of the third vapor deposition assembly 140c and the fourth vapor deposition assembly 140d on the coating roller 110 of the processing chamber 100 can be from about 65 degrees to about 70 degrees, such as from about 66 degrees to about 69 degrees, such as from about 67 degrees to about 68 degrees, such as about 67.5 degrees, but other tilt angles are also contemplated. Any of the foregoing values ​​can be used individually to describe an open area or in combination to describe a closed area. The tilt angle is relative to the base plate 180 of the processing chambers 100, 150 (the horizontal plane of the page indicated by the dashed line 145).

[0037] In one example, the processing chamber 100 can be used to deposit metals or metal alloys. For example, the processing chamber 100 and the evaporation assembly 140 can be used to deposit metals or metal alloys. Examples of metals and metal alloys include, but are not limited to, alkali metals (e.g., lithium or sodium), selenium, magnesium, zinc, cadmium, aluminum, gallium, indium, thallium, tin, lead, antimony, bismuth and tellurium, alkaline earth metals, silver, or combinations thereof. These metals or metal alloys can be used to fabricate energy storage devices and specifically for film stacks containing lithium anode structures. Although embodiments are described herein with reference to alkali metals, it should be understood that other metals and metal alloys may be used in conjunction with embodiments of this disclosure, such as those described above.

[0038] The processing chamber 100 includes a chamber body 102 defining a common processing environment 104 within which some or all of the processing actions for depositing a coating on a roll material can be performed. In one example, the common processing environment 104 can be operated as a vacuum environment. In another example, the common processing environment 104 can be operated as an inert gas environment. In some examples, the common processing environment 104 can be maintained at 1 × 10⁻⁶. -3 At processing pressures of mbar or lower, for example, 1×10 -4 mbar or lower.

[0039] The processing chamber 100 is configured as a roll-to-roll system, comprising an unwinding reel 106 for supplying a continuous flexible substrate 108 or roll material, a coating roller 110 on which the continuous flexible substrate 108 is processed, and a take-up reel 112 for collecting the continuous flexible substrate 108 after processing. The coating roller 110 includes a deposition surface 111 over which the continuous flexible substrate 108 travels as material is deposited onto it. The processing chamber 100 may further include one or more auxiliary transport reels 114, 116 positioned between the unwinding reel 106, the coating roller 110, and the take-up reel 112. According to one aspect, at least one of the one or more auxiliary transport reels 114, 116, the unwinding reel 106, the coating roller 110, and the take-up reel 112 may be driven and rotated by a motor. In one example, the motor is a stepper motor. Although the unwinding reel 106, coating roller 110, and take-up reel 112 are shown positioned within a common processing environment 104, it should be understood that the unwinding reel 106 and take-up reel 112 may be positioned in separate chambers or modules. For example, at least one of the unwinding reels 106 may be positioned in an unwinding module, the coating roller 110 may be positioned in a processing module, and the take-up reel 112 may be positioned in an unwinding module.

[0040] The unwinding roll 106, coating roller 110, and take-up roll 112 can be individually temperature-controlled. For example, the unwinding roll 106, coating roller 110, and take-up roll 112 can be individually heated using an internal or external heat source located within each roll.

[0041] In one implementation that can be combined with other implementations, one or more vapor deposition components 140, such as thermal vapor deposition units, may be removably coupled to a vapor deposition shield (not shown). In another implementation that can be combined with other implementations, one or more vapor deposition components 140 may be spaced apart from a coating roller 110. One or more thermal vapor deposition components 140 are positioned to deliver vapor-deposited material onto the continuous flexible substrate 108 as the continuous flexible substrate 108 travels past the deposition surface 111 of the coating roller 110.

[0042] The deposition volume 120 is defined between one or more thermal evaporation components 140 and the deposition surface 111 of the coating roller 110. In some implementations, the deposition volume 120 provides an isolated processing space within the common processing environment 104 of the chamber body 102. The deposition volume 120 can be minimized and defined as a laminated roll, such as a continuous flexible substrate 108 wound on a cylindrical cooling roller (e.g., coating roller 110), a planar cooling plate, or a continuous flexible substrate 108 with a free span orientation.

[0043] One or more vapor deposition units 140 will be described in more detail below with reference to Figures 2 and 3. One or more vapor deposition units 140 are positioned to perform one or more processing operations on the continuous flexible substrate 108 or roll material. In one example, such as Figure 1A As depicted, one or more thermal evaporation assemblies 140 are arranged radially around the coating roller 110. Other arrangements besides radial are also contemplated. In one implementation that can be combined with other implementations, the one or more thermal evaporation assemblies 140 include a lithium (Li) source. Additionally, the one or more thermal evaporation assemblies 140 may also include an alloy source of two or more metals. The material to be deposited can be vapor-deposited, for example, using thermal evaporation technology.

[0044] In operation, one or more thermal evaporation components 140 emit a plume 122 of the material to be deposited, which is directed toward a continuous flexible substrate 108, on which a film of the deposited material is formed.

[0045] In addition, although Figure 1A Four thermal evaporation assemblies 140a to 140d are shown; it should be understood that any number of evaporation assemblies can be used. Additionally, the processing chamber 100 may further include one or more additional deposition sources. For example, one or more deposition sources described herein include electron beam sources and additional sources, selectable from chemical vapor deposition sources, plasma-enhanced chemical vapor deposition sources, and various physical vapor deposition sources. Exemplary physical vapor deposition sources include sputtering sources, electron beam evaporation sources, and thermal evaporation sources. Furthermore, these additional deposition sources may be radially positioned relative to the deposition surface 111 of the coating roller 110.

[0046] In one embodiment of this disclosure that can be combined with other embodiments, the processing chamber 100 is configured to process both sides of the continuous flexible substrate 108. For example, additional vapor deposition components similar to one or more thermal vapor deposition components 140 may be positioned to process opposite sides of the continuous flexible substrate 108. Although the processing chamber 100 is configured to process the horizontally oriented continuous flexible substrate 108, the processing chamber 100 may be configured to process substrates positioned at different orientations, for example, the continuous flexible substrate 108 may be vertically oriented. In one embodiment of this disclosure that can be combined with other embodiments, the continuous flexible substrate 108 is a flexible conductive substrate. In one embodiment of this disclosure that can be combined with other embodiments, the continuous flexible substrate 108 includes a conductive substrate on which one or more layers are formed. In one embodiment of this disclosure that can be combined with other embodiments, the conductive substrate is a copper substrate.

[0047] Processing chamber 100 further includes a gas panel 130. Gas panel 130 utilizes one or more conduits (not shown) to deliver processing gases to processing chamber 100. Gas panel 130 may include a mass flow controller and a shut-off valve to control the gas pressure and flow rate of each individual gas supplied to processing chamber 100. Examples of gases that may be delivered by gas panel 130 include, but are not limited to, inert gases (e.g., argon) for pressure control, etching chemicals (including, but not limited to, diketones for in-situ cleaning of processing chamber 100), and deposition chemicals (including, but not limited to, 1,1,1,2-tetrafluoroethane or other hydrofluorocarbons and trimethylaluminum, titanium tetrachloride, or other organometallic precursors used for in-situ modification of reactive lithium hybrid conductor surfaces tens of nanometers thick).

[0048] Processing chamber 100 further includes a system controller 170 operable to control various aspects of processing chamber 100. System controller 170 assists in the control and automation of processing chamber 100 and may include a central processing unit (CPU), memory, and support circuitry (or input / output interfaces). Software instructions and data may be encoded and stored in the memory to instruct the CPU. System controller 170 may communicate with one or more components of processing chamber 100 via, for example, a system bus. A program (or computer instructions) readable by system controller 170 determines which tasks can be performed on the substrate. In some aspects, this program is software readable by system controller 170, which may include code for monitoring chamber conditions, including independent temperature control of one or more vapor deposition assemblies 140. Although only a single system controller, system controller 170, is shown, it should be understood that multiple system controllers may be used in conjunction with the aspects described herein.

[0049] Figure 1B A schematic front view illustrating a portion of a processing chamber 150 having vapor deposition assemblies according to one or more embodiments of the present disclosure is shown. Each of the vapor deposition assemblies 140a to 140d is positioned within a corresponding frame 160a to 160d (collectively referred to as 160) of the processing chamber 150. The frame 160 supports the vapor deposition assembly 140. Each vapor deposition assembly 140 is coupled to a coating roller 110 of the processing chamber 150 via a corresponding heat shield assembly 152. Embodiments of the heat shield assembly 152 will be described below. Figures 5A to 5C The following description is provided. A porous material (not shown) may be disposed between the coating roller 110 and the heat shield assembly 152. The porous material may be porous stainless steel, but other materials are also contemplated.

[0050] The vapor deposition assembly 140 includes a vapor depositor body 158. The vapor depositor body 158 can be attached to a crucible 156. The crucible 156 is designed to hold the material to be vapor deposited, such as a metal or metal alloy. The vapor deposition assembly 140 further includes an alkali metal delivery line 162. (Opening (not in...) Figure 1B (As shown in the diagram) This allows the alkali metal delivery line 162 to be positioned within a portion of the crucible 156. The alkali metal delivery line 162 extends a portion into the crucible 156. The vapor deposition assembly 140 further includes a plurality of heaters 164. In one implementation that can be combined with other implementations, the heaters 164 are tubular heaters, such as heating rods.

[0051] Evaporation assembly for first positioning (A) and second positioning (B)

[0052] Figure 2A A first perspective view of a vapor deposition assembly 200 (e.g., a thermal vapor deposition device) according to at least one embodiment of the present disclosure is shown. Figure 2B A cross-sectional side view of a vapor deposition assembly 200 according to at least one embodiment of the present disclosure is shown. Figure 2C A second cross-sectional perspective view of a vapor deposition assembly 200 with one side removed according to at least one embodiment of the present disclosure is shown. Figure 2D A second side view of a vapor deposition assembly 200 with one side removed, according to at least one embodiment of the present disclosure, is shown. For clarity, Figure 2D relative to Figures 2A to 2C Some components have been removed. Additionally, Figure 2D The orientation of the components in the structure can be related to... Figures 2A to 2C The difference is shown to more clearly illustrate the delivery line 262.

[0053] The vapor deposition assembly 200 may replace the first vapor deposition assembly 140a located at the first position (A), replace the second vapor deposition assembly 140b located at the second position (B), or replace both.

[0054] The vapor deposition assembly 200 includes a crucible 256 attached to a vapor deposition unit body 258. The crucible 256 is designed to hold the material to be vapor-deposited, such as a metal or metal alloy. The crucible 256 includes a crucible body 214 having a length dimension “L1” and a width dimension “W1”. Although the crucible body 214 is shown as a rectangular body, other suitable shapes for the crucible body 214 are contemplated. The crucible body 214 includes a top surface 212b having an opening 216 through which the vapor-deposited material can escape. The crucible body 214 further includes a bottom surface 212a opposite to the top surface 212b. The crucible body 214 further includes a first pair of opposing sidewalls 220a, 220b (collectively referred to as 220) extending upward from and perpendicular to the bottom surface 212a. The first pair of opposing sidewalls 220a, 220b define the length dimension “L1” of the crucible body 214. The crucible body 214 further includes a second pair of opposing sidewalls 222a, 222b (collectively referred to as 222) extending upward from and perpendicular to the bottom surface 212a. The second pair of opposing sidewalls 222 defines the width dimension “W1” of the crucible body 214. L1 and W1 may also define certain dimensions of the vapor deposition assembly 200.

[0055] The opening 216 of the crucible body 214 may also have length and width dimensions, such as L1 and W1, that define the vapor deposition surface area. For example, the top surface 212b of the crucible body 214 may be the same as the opening 216 of the crucible body 214.

[0056] The bottom surface 212a, the first pair of opposing sidewalls 220, and the second pair of opposing sidewalls 222 define an internal region 226a (e.g., Figure 2C (As shown). At least a portion of the internal region 226a is operable to hold the material to be evaporated / deposited in a molten and / or liquid state. That is, at least a portion of the internal region 226a constitutes the crucible body 214. The material to be evaporated / deposited can be transported via a delivery line 262 (e.g., Figure 2C (As shown) from external source 261 (such as) Figure 2D (As shown) It supplies to the internal region 226a of the crucible 256. The delivery line 262 will be discussed further below.

[0057] The vapor deposition unit 258 is attached to the crucible 256. The crucible 256 can be attached to the vapor deposition unit 258 using any suitable attachment technique. For example, the crucible 256 can be welded to the vapor deposition unit 258; the crucible 256 can be bolted to the vapor deposition unit 258; or the crucible 256 can be removably attached to the vapor deposition unit 258. In another implementation that can be combined with other implementations, the vapor deposition unit 258 and the crucible 256 are machined from a single piece of material. In yet another implementation that can be combined with other implementations, the crucible 256 can be integrated within the vapor deposition unit 258.

[0058] The crucible 256 and / or the vapor deposition unit 258 can be made of any suitable material, including those with high thermal conductivity. Examples of suitable materials include, but are not limited to, stainless steel, graphite, boron nitride, pyrolytic boron nitride, molybdenum, tungsten, titanium, tantalum, nickel, alloys thereof, or combinations thereof. In at least one embodiment, the crucible 256 and / or the vapor deposition unit 258 are made of pyrolytic boron nitride. For example, pyrolytic boron nitride is generally inert, can withstand high temperatures, is generally clean and does not introduce undesirable impurities into a vacuum environment, is generally transparent to infrared radiation of a specific wavelength, and can be manufactured into complex shapes.

[0059] The vapor deposition unit 258 is also fluidly coupled to the crucible 256, allowing the vaporized material from the crucible 256 to enter the vapor deposition unit 258. Although the vapor deposition unit 258 is shown as a polygonal body, other suitable shapes for the vapor deposition unit 258 are also contemplated.

[0060] The vapor deposition unit 258 includes a bottom surface 234a with an opening 236 through which the vapor-deposited material can enter the vapor deposition unit 258 from an opening 216 in the crucible 256. The opening 216 in the top surface 212b of the crucible 256 is aligned with the opening 236 in the bottom surface 234a of the vapor deposition unit 258. In one implementation that can be combined with other implementations, the opening 216 of the crucible 256 is the same size as the opening 236 of the vapor deposition unit 258. In another implementation that can be combined with other implementations, the opening 216 of the crucible 256 is different in size from the opening 236 of the vapor deposition unit 258.

[0061] The vapor deposition unit 258 further includes a top surface 234b opposite to the bottom surface 234a. In some embodiments, the top surface 234b may be an opening on which a nozzle assembly is placed directly or indirectly. In some embodiments, the top surface 234b is a nozzle assembly including a plurality of linear array nozzles 235a to 235g (collectively referred to as 235). Each nozzle 235 has an opening defined by a diameter, and the total area of ​​the nozzle openings defines a nozzle opening surface area, and the vapor deposition surface area is greater than the nozzle opening surface area.

[0062] The vapor deposition apparatus body 258 further includes a first pair of opposing sidewalls 240a, 240b (collectively referred to as 240) extending upward from and perpendicular to the bottom surface 234a. The sidewalls 240 extend downward from and may be perpendicular to the top surface 234b. The first pair of opposing sidewalls 240 of the vapor deposition apparatus body 258 defines the length dimension (L2) of the top surface 234b. L2 may also define the length dimension of the vapor deposition apparatus body 258.

[0063] The vapor deposition unit 258 further includes a second pair of sidewalls 242a, 242b (collectively referred to as 242) extending upward from the bottom surface 234a. The sidewalls 242b may be perpendicular to the bottom surface 234a.

[0064] The vapor deposition apparatus body 258 further includes a third pair of sidewalls 244a, 244b (collectively referred to as 244) extending upward from the sidewall 242. The sidewalls 244 extend downward from the top surface 234b and may be perpendicular to the top surface 234b. The third pair of opposing sidewalls 244 of the vapor deposition apparatus body 258 defines the width dimension (W2) of the top surface 234b. W2 may also define the width dimension of the vapor deposition apparatus body 258.

[0065] Bottom surface 234a, top surface 234b, first pair of opposing sidewalls 240, second pair of sidewalls 242 and third pair of sidewalls 244 define an internal region 226b for storing the vapor-deposited material.

[0066] In some embodiments, the sidewall 242b of the vapor deposition apparatus body 258 and the sidewall 220b of the crucible 256 may share the same sidewall, for example, when the vapor deposition apparatus body 258 and the crucible 256 are machined from a single piece of material. In at least one embodiment, the sidewall 240a of the vapor deposition apparatus body 258 and the sidewall 222a of the crucible 256 may share the same sidewall, and the sidewall 240b of the vapor deposition apparatus body 258 and the sidewall 222b of the crucible 256 may share the same sidewall. This occurs when the vapor deposition apparatus body 258 and the crucible 256 are machined from a single piece of material.

[0067] In at least one embodiment that can be combined with other embodiments, the top surface 234b of the vapor deposition unit 258 is a planar surface. In some embodiments, and as described below... Figure 4 Further described, the top surface 234b may include a plurality of longitudinal grooves or a zigzag pattern defining the plurality of longitudinal grooves.

[0068] The tilt angle of the top surface 234b of the vapor deposition unit 258 on the coating roller 110 can be approximately 20 to approximately 25 degrees, such as approximately 21 to approximately 24 degrees, such as approximately 22 to approximately 23 degrees, such as approximately 22.5 degrees, but other tilt angles are also contemplated. Any of the foregoing values ​​can be used individually to describe an open area or in combination to describe a closed area. This tilt angle is relative to the bottom plate 180 of the processing chambers 100, 150 (the horizontal plane indicated by the dashed line 145 on the page).

[0069] The vapor deposition assembly 200 further includes a first heater region 260a and a second heater region 260b. At least a portion of the vapor deposition unit 258 is located within the first heater region 260a. The crucible 256 (and / or the crucible body 214) is located within the second heater region 260b.

[0070] A first heater region 260a is located between sidewalls 244a and 244b and extends the length dimension (L2) of the vapor depositor body 258. The first heater region 260a includes multiple heaters (e.g., heaters 270a, 270b, 270c). The heaters 270a to 270c of the first heater region may be positioned / used to maintain and / or keep the vapor-deposited material in the gas phase. The heaters 270a, 270b, and 270c of the first heater region 260a may extend transversely across the length dimension (L2) of the vapor depositor body 258. The first heater region 260a may further include a first member 272 (e.g., a plate), a second member 274 (e.g., a plate), or both. The first member 272 may be located between heater 270c and sidewall 244b and may extend the length of sidewall 244b. The first member 272 may be made of a conductive material to prevent (or at least mitigate) radiative heat loss between heater 270c and sidewall 244b. The second component 274 may be located between the heater 270a and the sidewall 244a, and may extend the length of the sidewall 244a. The second component 274 may be made of a conductive material to prevent (or at least mitigate) radiative heat loss between the heater 270a and the sidewall 244a. Although the first component 272 and the second component 274 are not... Figure 2A and Figure 2D As shown, but it should be understood that such components are part of the vapor deposition assembly 200.

[0071] The second heater region 260b is located between the first pair of opposing sidewalls 220, the second pair of opposing sidewalls 222, the top surface 212b, and the bottom surface 212a. The second heater region 260b extends the length (L1) of the crucible 256. The second heater region 260b includes multiple heaters (e.g., heaters 270d, 270e). The heaters 270d and 270e of the second heater region 260b can be positioned / used to heat the material to be vaporized. The heaters 270d and 270e of the second heater region 260b extend the length (L1) of the crucible 256.

[0072] In at least one implementation of this disclosure that can be combined with other implementations, the heaters 270a to 270e may be tubular heaters, such as heating rods.

[0073] Unlike conventional vapor deposition units that include an external crucible heater, the vapor deposition assembly 200 described herein may not include such an external crucible heater. Removing the external crucible heater reduces the heat load spacing between heaters 270a to 270e (e.g., heating rods). Additionally, conventional vapor deposition assemblies may suffer from radiative heat loss between the internal regions of the vapor deposition unit and the sidewalls. In contrast, the embodiments described herein include components 272, 274 to mitigate (or prevent) radiative heat loss. Furthermore, the positioning of the heaters 270a to 270e in the embodiments described herein differs from that of conventional vapor deposition assemblies.

[0074] In addition to external heaters, conventional vapor deposition assemblies include only a single heater region, which is positioned above the crucible and within the vapor deposition unit body. That is, all heaters are located at a position above the crucible. In contrast, and as described above, embodiments of this disclosure may include two or more heater regions. For example, a second heater region 260b may be used to heat the material to be vapor-deposited, and a first heater region may be used to keep the vapor-deposited material in a gaseous phase. The positioning of heater regions 260a, 260b, heaters 270a to 270e, and components 272, 274 achieves significantly less radiative heat loss compared to that observed in conventional vapor deposition assemblies. Furthermore, the positioning of heater regions 260a, 260b, heaters 270a to 270e, and components 272, 274 mitigates (or prevents) condensation of the metal / metal alloy on the vapor deposition unit body 258.

[0075] In some embodiments, the dimensions W1×L1 of the opening 216 of the crucible body 214 may be from about 150 mm × 370 mm to about 200 mm × 450 mm, such as from about 160 mm × 380 mm to about 190 mm × 440 mm, such as from about 170 mm × 400 mm to about 180 mm × 420 mm, or about 170 mm × 420 mm, but other dimensions are also contemplated. Any of the foregoing values ​​may be used individually to describe the open area or in combination to describe the closed area.

[0076] In some embodiments, the area of ​​the opening 216 of the crucible body 214 may be approximately 50,000 mm. 2 To approximately 100,000 mm 2 Such as approximately 60,000 mm 2 To approximately 90,000 mm 2 Such as approximately 70,000 mm 2 To approximately 80,000 mm 2 Such as approximately 70,000 mm 2 To approximately 75,000 mm 2However, other areas have also been envisioned. Any of the aforementioned values ​​can be used individually to describe open areas or in combination to describe closed areas.

[0077] The dimensions W1×L1 of the opening 216 in the crucible body 214 and the area of ​​the opening 216 are significantly larger than those of conventional crucibles. For example, some conventional crucibles (such as cylindrical crucibles) have a diameter of approximately 45 mm and an opening area of ​​approximately 135 mm². 2 Other conventional crucibles (e.g., crucibles with compartments) have an opening of approximately 145 mm × 320 mm, and an opening area of ​​approximately 47,000 mm². 2 .

[0078] The volumetric capacity of the crucible described herein (e.g., crucible 256) is significantly larger than that of conventional crucibles. For example, a conventional crucible has a volumetric capacity of 2.8 liters (L) or less, while the volumetric capacity of the crucible described herein (e.g., crucible 256) can be from about 4.5 L to about 5.5 L, such as from about 4.8 L to about 5.2 L, but other values ​​are also contemplated. Any of the foregoing values ​​can be used individually to describe an open range or in combination to describe a closed range. The increased volumetric capacity of crucible 256 enables longer operating times.

[0079] In some embodiments, the area of ​​the top surface 234b of the vapor deposition unit 258 may be approximately 90,000 mm². 2 Approximately 120,000 mm 2 Such as approximately 95,000 mm 2 Approximately 115,000 mm 2 Such as approximately 100,000 mm 2 To approximately 110,000 mm 2 Such as approximately 100,000 mm 2 Approximately 105,000 mm 2 However, other areas are also envisioned. Any of the aforementioned values ​​can be used individually to describe the open area or in combination to describe the closed area. The area of ​​the top surface 234b of the vapor deposition unit 258 can be referred to as the vapor deposition unit opening area. In contrast, the vapor deposition unit top surface area of ​​a conventional vapor deposition assembly is less than 90,000 mm². 2 .

[0080] As further described below, the vapor deposition assembly described herein (e.g., vapor deposition assembly 200) may include a nozzle assembly having more than 50 nozzles (e.g., Figure 4The nozzle assembly shown is 400, while the number of nozzles in a conventional vapor deposition assembly is typically this number. For example, the nozzle assembly described herein may include about 50 or more nozzles, such as about 60 or more nozzles, such as about 70 or more nozzles, or other suitable number of nozzles. Any of the foregoing values ​​may be used individually to describe the open range or in combination to describe the closed range. When the vapor deposition assembly described herein operates at the same temperature as a conventional vapor deposition assembly, increasing the number of nozzles can achieve a higher deposition rate than a conventional vapor deposition assembly. When the vapor deposition assembly described herein operates at a lower temperature than a conventional vapor deposition assembly, increasing the number of nozzles can achieve a deposition rate similar to that of a conventional vapor deposition assembly.

[0081] In some embodiments, the total nozzle opening area of ​​the vapor deposition assembly (e.g., vapor deposition assembly 200) used for the first positioning (A) and / or the second positioning (B) may be greater than about 1,000 mm. 2 Such as approximately 1,000 mm 2 Approximately 1500 mm 2 Such as approximately 1100mm 2 Approximately 1450 mm 2 Such as approximately 1300 mm 2 Approximately 1400 mm 2 Such as approximately 1350 mm 2 Approximately 1400 mm 2 However, other values ​​have also been considered. Any of the aforementioned values ​​can be used individually to describe the open area or in combination to describe the closed area. The total nozzle opening area is derived by multiplying the total number of nozzles by πr², where r is the radius of the nozzle opening (approximately 2.5 mm). The total nozzle opening area of ​​a conventional vapor deposition unit is less than 1,000 mm². 2 .

[0082] In some embodiments, for the vapor deposition assembly 200, the area ratio of (a) the vapor depositor opening area (area of ​​the top surface 234b) to (b) the total nozzle opening area is approximately 50:1 to approximately 85:1, such as approximately 55:1 to approximately 80:1, such as approximately 60:1 to approximately 75:1, such as approximately 65:1 to approximately 75:1, such as approximately 70:1 to approximately 75:1. Any of the foregoing values ​​may be used individually to describe the open range or in combination to describe the closed range. The vapor depositor opening area (area of ​​the top surface 234b) and the total nozzle opening area are calculated as described above. This ratio is then calculated by dividing the vapor depositor opening area (area of ​​the top surface 234b) by the total nozzle opening area. In contrast, the area ratio of the vapor depositor opening area to the total nozzle opening area in a conventional vapor depositor assembly is greater than 85:1.

[0083] The vapor deposition assembly described herein (e.g., vapor deposition assembly 200) comprises a crucible with a body larger than that of a conventional crucible. The larger body allows for the utilization of a larger volume of alkali metal (in some examples, about 4.5 L or more, such as about 5 L or more), thus enabling longer run-to-run operations. Unlike conventional apparatuses utilizing cylindrical crucibles, the vapor deposition assembly described herein can be rectangular in shape. The rectangular shape allows for the deposition of a uniform surface of alkali metal from it.

[0084] The rectangular shape of the vapor deposition assembly also minimizes the alkali metal depletion effect observed in conventional crucibles. This depletion effect is observed in prior art vapor deposition units with crucibles having various compartments. When one or more compartments become depleted of alkali metal during operation (with vacuum on), the liquid-gas interface contracts. In contrast, the embodiment of the vapor deposition assembly described herein keeps the liquid-gas interface substantially constant throughout operation, thereby preventing (or at least minimizing) the depletion effect observed in conventional vapor deposition units. Furthermore, the crucible described herein is compartmentless. By eliminating compartments, the crucible described herein avoids overfilling of other parts of the vapor deposition unit body with alkali metal.

[0085] Unlike conventional vapor deposition assemblies that use external heaters to heat the crucible via radiation, the vapor deposition assemblies described herein (e.g., vapor deposition assembly 200) do not include external heaters. Instead, the vapor deposition assemblies described herein (e.g., vapor deposition assembly 200) include a heating region (e.g., heater region 260b) located inside the crucible. The heater region enables conductive heating, rather than the radiative heating observed in conventional techniques. Many other differences from conventional vapor deposition assemblies are also described herein, including the configuration and placement of the delivery line 262 (described below).

[0086] Pipeline 262 (e.g., alkali metal pipeline) such as Figure 2D As shown. The delivery line 262 may have a clamshell-like profile. The delivery line 262 may be a heating line, so that the delivery line 262 can help maintain the material to be vaporized in a liquid (or molten) state.

[0087] Delivery line 262 couples an external source 261 to an internal region 226a of crucible 256. External source 261 holds the material to be evaporated / deposited (e.g., alkali metal). The material to be evaporated / deposited can be supplied from external source 261 to internal region 226a of crucible 256 via delivery line 262.

[0088] The delivery line 262 comprises multiple sections: a first section 263 (also referred to as the outer portion), a second section 264 (also referred to as the first inner portion), and a third section 265 (also referred to as the second inner portion). Sections 263, 264, and 265 can be attached to each other using any suitable technique. The crucible 256 can be attached to the vapor deposition unit 258 using any suitable attachment technique. For example, sections 263, 264, and 265 can be welded to each other; sections 263, 264, and 265 can be bolted to each other; sections 263, 264, and 265 can be removably attached to each other. In another implementation that can be combined with other implementations, sections 263, 264, and 265 are machined from a single piece of material.

[0089] The outer portion 263 of the delivery line 262 is located outside the vapor deposition assembly 200. The outer portion 263 of the delivery line 262 includes a first end 263a and a second end 263b. The first end 263a can be coupled to the interior of an external source 261. Therefore, the first end 263a can serve as an inlet for the material to be vaporized / deposited into the delivery line 262. In some embodiments, the length of the outer portion 263 of the delivery line 262 (from the first end 263a to the second end 263b) is about 500 mm to about 600 mm, such as about 525 mm to about 575 mm, such as about 540 mm to about 550 mm, but other lengths are also contemplated. Any of the foregoing values ​​may be used individually to describe an open range or in combination to describe a closed range.

[0090] The first internal portion 264 and the second internal portion 265 of the delivery line 262 are located inside the vapor deposition assembly 200. One or both of the first internal portion 264 and the second internal portion 265 of the delivery line 262 may traverse the vapor deposition unit body 258 and the crucible 256. Figure 2D In the embodiment shown, the first internal portion 264 of the delivery line 262 traverses the vapor deposition unit body 258 and the crucible 256.

[0091] The first internal portion 264 of the delivery line 262 includes a first end 264a and a second end 264b. The second internal portion 265 of the delivery line 262 includes a first end 265a and a second end 265b. The first end 264a of the first internal portion 264 is attached to the second end 263b of the external portion 263. The second end 264b of the first internal portion 264 is attached to the first end 265a of the second internal portion 265. The second end 265b of the second internal portion 265 (which also represents an end of the delivery line 262) may be a closed end. The first internal portion 264 of the delivery line 262 extends from an opening 266 in the sidewall 242a of the vapor deposition apparatus body 258 to the internal region 226a of the crucible 256, and extends below the top surface 212b of the crucible body 214.

[0092] In some embodiments, the length of the second inner portion 265 of the delivery line 262 (from the first end 265a to the second end 265b) is about 200 mm to about 600 mm, such as about 225 mm to about 325 mm, such as about 250 mm to about 300 mm, but other lengths are also contemplated. Any of the foregoing values ​​may be used individually to describe an open range or in combination to describe a closed range.

[0093] The delivery line 262 further includes a plurality of openings 266a to 266c (collectively referred to as 266) through which alkali metal can exit the delivery line 262 and enter the crucible 256. The openings are located on a second inner portion 265 of the delivery line 262. The openings 266a to 266c can be of any suitable size, such as a diameter of about 1 mm to about 5 mm, such as about 2 mm to about 4 mm, such as about 3 mm. Any of the foregoing values ​​can be used individually to describe an open range or in combination to describe a closed range. In some embodiments, the length from 265a to one of the openings 266 is about 250 mm to about 300 mm, such as about 260 mm to about 275 mm, but other lengths are also contemplated. Any of the foregoing values ​​can be used individually to describe an open range or in combination to describe a closed range.

[0094] During operation, the top surface 212b can represent the maximum fill line of the crucible. Additionally, during operation, the second inner portion 265 of the delivery line 262 is immersed in the material to be evaporated / deposited (e.g., an alkali metal bath). This configuration achieves improved temperature uniformity during alkali metal delivery at processing temperatures. In other words, the delivery line 262 achieves better temperature uniformity for the alkali metal to be evaporated / deposited. For example, the temperature difference between the first end 265a and the second end 265b of the second inner portion 265 of the delivery line 262 can be only 1 degree Celsius.

[0095] The delivery line described herein offers advantages over existing technologies. Conventional vapor deposition systems include a delivery line with a series of openings that allow alkali metal to be delivered into the compartments of a crucible. During use, the conventional delivery line is not immersed in the alkali metal pool. For example, referring to Figure 2, the conventional delivery line includes an outlet through which the alkali metal is delivered to the crucible. This outlet of the conventional crucible is located along section 264 near the first end 264a, such that the outlet is positioned above the crucible. Because the outlet is positioned above the crucible, the alkali metal is splashed as it is delivered to the crucible.

[0096] In contrast, the delivery line described herein (e.g., delivery line 262) can be longer, positioned deeper into the vapor deposition assembly, and immersed in the alkali metal pool during operation, thereby avoiding splashing. For example, the length of the horizontal portion of the delivery line located within the crucible can be approximately 305 mm. The alkali metal delivery line described herein can include any suitable number of openings through which the alkali metal exits the alkali metal delivery line and enters the crucible. The alkali metal delivery line can be positioned within the vapor deposition assembly such that it is immersed in the alkali metal pool within the crucible during operation. This configuration achieves improved temperature uniformity during alkali metal delivery at processing temperatures. That is, the alkali metal delivery line achieves better temperature uniformity of the alkali metal within the vapor deposition unit. For example, the temperature difference between the first end 265a and the second end 265b (closed end) of the horizontal portion (e.g., the third section 265) of the delivery line 262 located within the vapor deposition unit can be only 1 degree. In addition, since the delivery line 262 is submerged during operation, alkali metals can be added during operation without splashing.

[0097] Evaporation assembly for third positioning (C) and fourth positioning (D)

[0098] Figure 3A A perspective view of a vapor deposition assembly 300 according to at least one embodiment of the present disclosure is shown, for example, a perspective view of a thermal vapor deposition unit. Figure 3B A side view of a vapor deposition assembly 300 according to at least one embodiment of the present disclosure is shown. The vapor deposition assembly 300 may be used to replace a third vapor deposition assembly 140c located at a first position (C), a fourth vapor deposition assembly 140d located at a second position (D), or a combination thereof.

[0099] The vapor deposition assembly 300 includes a crucible 356 attached to a vapor deposition unit body 358. The crucible 356 is designed to hold the material to be vapor-deposited, such as a metal or metal alloy. The crucible 356 includes a crucible body 314 having a length dimension “L3” and a width dimension “W3”. Although the crucible body 314 is shown as a rectangular body, other suitable shapes for the crucible body 314 are contemplated. The crucible body 314 includes a top surface 312b having an opening 316 through which the vapor-deposited material can escape. The crucible body 314 further includes a bottom surface 312a opposite to the top surface 312b. The crucible body 314 further includes a first pair of opposing sidewalls 320a, 320b (collectively referred to as 320) extending upward from and perpendicular to the bottom surface 312a. The first pair of opposing sidewalls 320a, 320b define the length dimension “L3” of the crucible body 314. The crucible body 214 further includes a second pair of opposing sidewalls 322a, 322b (collectively referred to as 322) extending upward from and perpendicular to the bottom surface 312a. The second pair of opposing sidewalls 322 defines the width dimension “W3” of the crucible body 214. L3 and W3 may also define certain dimensions of the vapor deposition assembly 300.

[0100] The opening 316 of the crucible body 314 may also have a length dimension and width that define the vapor deposition surface area, such as L3 and W3. For example, the top surface 312b of the crucible body 314 may be the same as the opening 316 of the crucible body 314.

[0101] A bottom surface 312a, a first pair of opposing sidewalls 320, and a second pair of opposing sidewalls 322 define an internal region (not shown; similar to internal region 226a) of crucible 356. At least a portion of the internal region of the crucible is operable to hold molten and / or liquid material / deposit to be vaporized. That is, at least a portion of the internal region includes the crucible body 314. The material / deposit to be vaporized can be supplied to the internal region of crucible 356 from an external source (not shown; similar to external source 261) via a delivery line 362. The delivery line 362 may be the same as or similar to the delivery line 262 described above.

[0102] The vapor deposition unit body 358 is attached to the crucible 356. Any suitable attachment technique can be used to attach the crucible 356 to the vapor deposition unit body 358. For example, the crucible 356 may be welded to the vapor deposition unit body 358. The crucible 356 may be bolted to the vapor deposition unit body 358. The crucible 356 may be removably attached to the vapor deposition unit body 358. In another implementation that can be combined with other implementations, the vapor deposition unit body 358 and the crucible 356 are machined from a single piece of material. In another implementation that can be combined with other implementations, the crucible 356 may be integrated within the vapor deposition unit body 358.

[0103] The crucible 356 and / or the vapor deposition unit 358 can be formed of any suitable material, including those with high thermal conductivity. Examples of suitable materials include, but are not limited to, stainless steel, graphite, boron nitride, pyrolytic boron nitride, molybdenum, tungsten, titanium, tantalum, nickel, alloys thereof, or combinations thereof. In at least one embodiment, the crucible 356 and / or the vapor deposition unit 358 are made of pyrolytic boron nitride. For example, pyrolytic boron nitride is generally inert, can withstand high temperatures, is generally clean and does not introduce undesirable impurities into a vacuum environment, is generally transparent to certain wavelengths of infrared radiation, and can be manufactured into complex shapes.

[0104] The vapor deposition unit 358 is also fluidly coupled to the crucible 356, allowing the vaporized material from the crucible 356 to travel into the vapor deposition unit 358. Although the vapor deposition unit 358 is shown as a polygonal body, other suitable shapes for the vapor deposition unit 358 are also contemplated.

[0105] The vapor deposition apparatus body 358 includes a bottom surface 334a with an opening 336 through which the vapor-deposited material can enter the vapor deposition apparatus body 358 from the opening 316 of the crucible 356. The opening 316 in the top surface 312b of the crucible 356 is aligned with the opening 336 in the bottom surface 334a of the vapor deposition apparatus body 358. In one implementation that can be combined with other implementations, the opening 316 of the crucible 356 and the opening 336 of the vapor deposition apparatus body 358 have the same size. In another implementation that can be combined with other implementations, the opening 316 of the crucible 356 and the opening 336 of the vapor deposition apparatus body 358 have different sizes.

[0106] The vapor deposition unit body 358 further includes a top surface 334b ​​opposite to the bottom surface 334a. In some embodiments, the top surface 334b ​​may be an opening over which a nozzle assembly is placed (directly or indirectly). In some embodiments, the top surface 334b ​​is a nozzle assembly (not shown; similar to a plurality of linear arrays of nozzles 235a to 235g). Each nozzle has an opening defined by a diameter. The total area of ​​the nozzle openings defines a nozzle opening surface area, and the vapor deposition surface area is greater than the nozzle opening surface area.

[0107] The vapor deposition apparatus body 358 further includes a first pair of opposing sidewalls 340a, 340b (collectively referred to as 340) extending upward from and perpendicular to the bottom surface 334a. The sidewalls 340 extend outward from the top surface 334b ​​and may be perpendicular to the top surface 334b. The sidewalls 340 also extend outward from sidewall 343. The first pair of opposing sidewalls 340 of the vapor deposition apparatus body 358 defines the length dimension (L4) of the top surface 334b. L4 may also define the length dimension of the vapor deposition apparatus body 358.

[0108] The vapor deposition apparatus body 358 further includes a second pair of opposing sidewalls 344a, 344b (collectively referred to as 344) extending outward from and perpendicular to the top surface 334b. The second pair of opposing sidewalls 344 of the vapor deposition apparatus body 358 defines the width dimension (W4) of the top surface 334b. W4 may also define the width dimension of the vapor deposition apparatus body 358.

[0109] The vapor deposition apparatus body 358 further includes a sidewall 343 extending downward from and perpendicular to the bottom surface 334a. The sidewall 343 of the vapor deposition apparatus body 358 corresponds to the sidewall 320a of the crucible. The vapor deposition apparatus body 358 further includes a sidewall 342a extending outward from and perpendicular to the sidewall 343. The sidewall 342a also extends outward from the sidewall 344a. The sidewall 342a is parallel to the bottom surface 334a. The vapor deposition apparatus body further includes a sidewall 342b extending outward from the bottom surface 334a, the sidewall 344b, and the sidewall 340b. The sidewall 342b and the bottom surface 334a are joined at an angle less than a right angle.

[0110] Bottom surface 334a, top surface 334b, first pair of opposing sidewalls 340, second pair of sidewalls 344, sidewalls 342a, 342b and 343 define an internal region (not shown; similar to internal region 226b) for storing the vapor-deposited material.

[0111] In some embodiments, the sidewall 342b of the vapor deposition apparatus body 358 and the sidewall 320b of the crucible 356 may be manufactured to share the same sidewall, for example, when the vapor deposition apparatus body 358 and the crucible 356 are machined from a single piece of material. In at least one embodiment, the sidewall 340a of the vapor deposition apparatus body 358 and the sidewall 322a of the crucible 356 may be manufactured to share the same sidewall, and the sidewall 340b of the vapor deposition apparatus body 358 and the sidewall 322b of the crucible 356 may be manufactured to share the same sidewall. This can occur when the vapor deposition apparatus body 358 and the crucible 356 are machined from a single piece of material.

[0112] In at least one embodiment that can be combined with other embodiments, the top surface 334b ​​of the vapor deposition unit 358 is a planar surface. In some embodiments, and as for Figure 4 As further described below, the top surface 334b ​​may include a plurality of longitudinal grooves or a zigzag pattern defining the plurality of longitudinal grooves.

[0113] The top surface 334b ​​of the vapor deposition unit 358 may have an angle of inclination of about 65 degrees to about 70 degrees on the coating roller 110, such as about 66 degrees to about 69 degrees, such as about 67 degrees to about 68 degrees, such as about 67.5 degrees, but other angles are also contemplated. Any of the foregoing values ​​may be used individually to describe an open area or in combination to describe a closed area. This angle of inclination is relative to the bottom plate 180 of the processing chambers 100, 150 (the horizontal plane of the page indicated by the dashed line 145).

[0114] The vapor deposition assembly 300 further includes a first heater region 360a, a second heater region 360b, and a third heater region 360c. At least a first portion of the vapor deposition unit 358 is located in the first heater region 360a. At least a second portion of the vapor deposition unit 358 is located in the second heater region 360b. The crucible 356 (and crucible body 314) is positioned within the third heater region 360c and outside the first heater regions 360a and 360b.

[0115] A first heater region 360a is positioned between sidewalls 344a and 344b and extends the length dimension (L4) of the vapor depositor body. The first heater region 360a includes multiple heaters (e.g., heaters 370a, 370b, 370c). The heaters 370a to 370c of the first heater region 360a can be used to maintain the vaporized material in the vapor phase and / or keep the vaporized material in the vapor phase. The heaters 370a, 370b, and 370c of the first heater region 360a can extend transversely through the length dimension (L4) of the vapor depositor body 358. The first heater region 360a may further include a first member 372 (e.g., a plate), a second member 374 (e.g., a plate), or both. The first member 372 may be positioned between heater 370c and sidewall 344b and can extend the length of sidewall 344b. The first member 372 may be made of a conductive material to prevent (or at least mitigate) radiative heat loss between heater 370c and sidewall 344b. The second member 374 may be positioned between the heater 370a and the sidewall 344a, and may extend the length of the sidewall 344a. The second member 374 may be made of a conductive material to prevent (or at least mitigate) radiative heat loss between the heater 370a and the sidewall 344a.

[0116] The second heater region 360b is positioned between the bottom surface 334a and the sidewall 342b of the vapor depositor body 358 and extends the length dimension (L4) of the vapor depositor body 358. The second heater region 360b includes a heater 370d, but more than one heater is also contemplated. The heater 370d of the second heater region 360b can be used to maintain the vaporized material in the vapor phase and / or keep the vaporized material in the vapor phase. Although not shown, the second heater region may further include a member (e.g., a plate) positioned between the heater 370d and the sidewall 342b, and this member may extend the length of the sidewall 342b. The member may be similar to the first member 372 or the second member 374 of the first heater region 360a and can be used to prevent (or at least mitigate) radiative heat loss between the heater 370d and the sidewall 342b.

[0117] The third heater region 360c is positioned between the first pair of opposing sidewalls 320, the second pair of opposing sidewalls 322, the top surface 312b, and the bottom surface 312a. The third heater region 360c extends the length dimension (L3) of the crucible 356. The third heater region 360c includes a heater 370e, but more than one heater is also envisioned. The heater 370e of the third heater region 360c can be positioned / utilized to heat the material to be vaporized.

[0118] In at least one implementation of this disclosure that can be combined with other implementations, the heaters 370a to 370e may be tubular heaters, such as heating rods.

[0119] Compared to conventional vapor deposition units that include external crucible heaters, the vapor deposition assembly 300 described herein may be without such external crucible heaters. Here, the removal of the external crucible heater reduces the heat load spacing between heaters 370a to 370e (e.g., heating rods). Additionally, conventional vapor deposition assemblies are susceptible to radiative heat loss between the internal region and sidewalls of the vapor deposition unit. In contrast, the embodiments described herein include components 372, 374 to mitigate (or prevent) radiative heat loss. Furthermore, the positioning of heaters 370a to 370e in the embodiments described herein differs from that of conventional vapor deposition assemblies.

[0120] Aside from the external heater, a conventional vapor deposition assembly includes only a single heater region positioned above the crucible and within the vapor deposition unit body. All heaters in a conventional assembly are located above the crucible and near the nozzle assembly. In contrast, and as described above, a vapor deposition assembly may include three or more heater regions.

[0121] For example, the third heater region 360c can be used to heat the material to be vaporized, while the first heater region 360a and the second heater region 360b can be used to maintain the material being vaporized in the vapor phase. The positioning of heater regions 360a to 360c, heaters 370a to 370e, and components 372 and 374 achieves significantly less radiative heat loss compared to that observed in conventional vapor deposition assemblies. Furthermore, the positioning of heater regions 360a to 360c, heaters 370a to 370e, and components 372 and 374 mitigates (or prevents) the condensation of metal / metal alloys on the vapor deposition unit body 358.

[0122] The size of the opening 316 of the crucible body 314 for the vapor deposition assembly 300 may be the same as or different from the size of the opening 216 of the crucible body 214 for the vapor deposition assembly 200. In at least one embodiment, the size of the opening 316 of the crucible body 314 for the vapor deposition assembly 300 may be smaller than the size of the opening 316 of the crucible body 314 for the vapor deposition assembly 300.

[0123] The dimensions of the top surface 334b ​​of the vapor depositor body 358 for the vapor depositor assembly 300 may be the same as or different from the dimensions of the top surface 234b of the vapor depositor body 258 for the vapor depositor assembly 200. In at least one embodiment, the dimensions of the top surface 334b ​​of the vapor depositor body 358 for the vapor depositor assembly 300 are the same as (or substantially the same as) the dimensions of the top surface 234b of the vapor depositor body 258 for the vapor depositor assembly 200.

[0124] In some embodiments, the dimensions W3×L3 of the opening 316 of the crucible body 314 may be from about 145 mm × 350 mm to about 200 mm × 450 mm, such as from about 150 mm × 360 mm to about 190 mm × 440 mm, such as from about 160 mm × 400 mm to about 180 mm × 420 mm, or from about 160 mm × 400 mm to about 170 mm × 420 mm, but other dimensions are also contemplated. Any of the foregoing values ​​may be used individually to describe the open area or in combination to describe the closed area.

[0125] In some embodiments, the opening 316 of the crucible body 314 may have an opening of approximately 45,000 mm. 2 To approximately 100,000 mm 2 The area, such as approximately 50,000 mm 2 To approximately 90,000 mm 2 Such as approximately 60,000 mm 2 To approximately 80,000 mm 2 Such as approximately 65,000 mm 2To approximately 70,000 mm 2 However, other areas have also been envisioned. Any of the aforementioned values ​​can be used individually to describe open areas or in combination to describe closed areas.

[0126] The dimensions of the opening 316 of the crucible body 314 (W3×L3) and the area of ​​the opening 316 are significantly larger than those of conventional crucibles. For example, some cylindrical crucibles have a diameter of approximately 45 mm and an area of ​​approximately 135 mm. 2 The crucible opening area. Other conventional crucibles (e.g., those with compartments) have a crucible opening of approximately 145 mm × 320 mm and an opening area of ​​approximately 47,000 mm. 2 The area of ​​the crucible opening.

[0127] The crucible described herein (e.g., crucible 356) has a significantly larger volumetric capacity than conventional crucibles. For example, while conventional crucibles have a volumetric capacity of 2.8 L or less, crucible 356 may have a volumetric capacity of approximately 4.3 L to approximately 5.3 L, such as approximately 4.5 L to approximately 5 L, although other values ​​are also envisioned. Any of the foregoing values ​​may be used individually to describe an open range or in combination to describe a closed range. The increased volumetric capacity of crucible 356 enables, for example, longer operating times.

[0128] In some embodiments, the top surface 334b ​​of the vapor deposition unit 358 may have approximately 90,000 mm. 2 Approximately 120,000 mm 2 The area, such as approximately 95,000 mm 2 Approximately 115,000 mm 2 Such as approximately 100,000 mm 2 To approximately 110,000 mm 2 Such as approximately 100,000 mm 2 Approximately 105,000 mm 2 However, other areas have also been envisioned. Any of the aforementioned values ​​can be used individually to describe the open area or in combination to describe the closed area. The area of ​​the top surface 334b ​​can be referred to as the vapor depositor opening area. In contrast, conventional vapor depositing assemblies have an area of ​​less than 90,000 mm². 2 The top surface of the vapor deposition unit.

[0129] As further described below, the vapor deposition assembly described herein may include a nozzle assembly having more than 50 nozzles (e.g., Figure 4The nozzle assembly 400 shown herein, with 50 nozzles, is a typical number of nozzles for a conventional vapor deposition assembly. For example, the nozzle assembly described herein may include about 50 or more nozzles, such as about 60 or more, such as about 70 or more nozzles, or other suitable numbers of nozzles. Any of the foregoing values ​​may be used individually to describe an open range or in combination to describe a closed range. When the vapor deposition assembly described herein operates at the same temperature as a conventional vapor deposition assembly, increasing the number of nozzles allows for a higher deposition rate than a conventional vapor deposition assembly. When the vapor deposition assembly described herein operates at a lower temperature than a conventional vapor deposition assembly, increasing the number of nozzles allows for a deposition rate similar to that of a conventional vapor deposition assembly.

[0130] In some embodiments, the total nozzle opening area of ​​the vapor deposition assembly (e.g., vapor deposition assembly 300) used for the third positioning (C) and / or the fourth positioning (D) may be greater than about 1,000 mm. 2 Such as approximately 1,000 mm 2 Approximately 1,500 mm 2 Such as approximately 1,100 mm 2 Approximately 1,450 mm 2 Such as approximately 1,300 mm 2 Approximately mm 2 Such as approximately 1,350 mm 2 Approximately 1,400 mm 2 However, other values ​​have also been considered. Any of the aforementioned values ​​can be used individually to describe the open area or in combination to describe the closed area. The total nozzle opening area is derived by multiplying the total number of nozzles by πr², where r is the radius of the nozzle opening (approximately 2.5 mm). The total nozzle opening area of ​​a conventional vapor deposition unit is less than 1,000 mm². 2 .

[0131] In some embodiments, and for the vapor deposition assembly 300, the area ratio of (a) the vapor depositor opening area (area of ​​the top surface 334b) to (b) the total nozzle opening area is approximately 50:1 to approximately 85:1, such as approximately 55:1 to approximately 80:1, such as approximately 60:1 to approximately 75:1, such as approximately 65:1 to approximately 75:1, such as approximately 70:1 to approximately 75:1. Any of the foregoing values ​​may be used individually to describe an open range or in combination to describe a closed range. The calculation of the vapor depositor opening area (area of ​​the top surface 334b) and the total nozzle opening area is as described above. This area ratio is then calculated by dividing the vapor depositor opening area (area of ​​the top surface 334b) by the total nozzle opening area. In contrast, the area ratio of the vapor depositor opening area to the total nozzle opening area in a conventional vapor depositor assembly is greater than 85:1.

[0132] The vapor deposition assembly described herein (e.g., vapor deposition assembly 300) comprises a crucible with a body larger than that of a conventional crucible. The larger body allows for the utilization of a larger volume of alkali metal (in some examples, about 4.3 L or more, such as about 4.8 L or more), and thus enables longer periods of continuous operation. Any of the foregoing values ​​may be used individually to describe an open range or in combination to describe a closed range. Unlike conventional apparatuses utilizing cylindrical crucibles, the vapor deposition assembly described herein may have a rectangular shape. A rectangular shape allows for, for example, the deposition of a uniform surface of alkali metal therefrom.

[0133] The rectangular shape of the vapor deposition assembly also minimizes the alkali metal depletion effect observed in conventional crucibles. This depletion effect is observed in prior art vapor deposition equipment with crucibles having various compartments. When the alkali metal in a compartment becomes depleted during operation (when a vacuum is turned on), the liquid-gas interface contracts. In contrast, the embodiment of the vapor deposition assembly described herein allows the liquid-gas interface to remain substantially constant throughout operation, and thus prevents (or at least minimizes) the depletion effect observed in conventional vapor deposition equipment. Furthermore, the crucible described herein is compartmentless. By omitting compartments, the crucible described herein avoids overfilling of alkali metal into other parts of the vapor deposition equipment body.

[0134] Further differing from conventional vapor deposition assemblies that utilize external heaters to heat the crucible via radiation, the vapor deposition assemblies described herein (e.g., vapor deposition assembly 300) do not include external heaters. Instead, the vapor deposition assemblies described herein (e.g., vapor deposition assembly 300) include heating regions (e.g., a third heater region 360c) that are not located outside the crucible. These heater regions enable conductive heating, rather than the radiative heating observed in conventional techniques. Many other differences from conventional vapor deposition assemblies are also described herein, including the configuration and placement of the delivery lines 262 (as described above).

[0135] Nozzle assembly

[0136] Figure 4 A nozzle assembly 400 according to at least one embodiment of the present disclosure is shown. The nozzle assembly 400 can be used in any suitable vapor deposition assembly (e.g., vapor deposition assembly 200 and / or vapor deposition assembly 300). For example, the nozzle assembly 400 can be used to replace top surface 234b or top surface 334b.

[0137] In one embodiment that can be combined with other embodiments, the top surface 401 of the nozzle assembly 400 is a planar surface. In another embodiment that can be combined with other embodiments, the top surface 401 includes a plurality of longitudinal grooves 402a to 402f (collectively referred to as 402) or a zigzag pattern defining the plurality of longitudinal grooves. The longitudinal grooves 402 separate a plurality of longitudinal peaks 407a to 407g (collectively referred to as 407). Although six longitudinal grooves 402a to 402f are shown, the number of longitudinal grooves may be increased or decreased depending on the desired surface area of ​​the vapor depositor body (e.g., vapor depositor body 258 or vapor depositor body 358). Similarly, although seven longitudinal peaks 407a to 407g are shown, the number of longitudinal peaks may be increased or decreased depending on the desired surface area of ​​the vapor depositor body (e.g., vapor depositor body 258 or vapor depositor body 358).

[0138] When positioned on the vapor depositor body, the grooved design of the top surface 401 increases the surface area of ​​the vapor depositor body 258 (or vapor depositor body 358), which reduces the amount of radiant heat exposed to the roll substrate. This increased surface area of ​​the top surface 234b (or top surface 334b) helps to achieve higher vapor pressures at lower temperatures.

[0139] Each longitudinal peak 407a to 407g supports a linear array of nozzles 405, which are configured to deliver the vapor-deposited material toward the surface of the roll. Figure 4 As shown, the nozzle assembly includes seven longitudinal peaks 407a to 407g, and each longitudinal peak supports 10 nozzles 405, totaling 70 nozzles 405. The pitch (“P”) between each nozzle 405 can be from about 30 mm to about 40 mm, such as from about 32 mm to about 38 mm, such as about 35 mm. Any of the foregoing values ​​can be used individually to describe the open range or in combination to describe the closed range.

[0140] Each nozzle 405 includes an opening defined by a diameter. The nozzle opening can be of any diameter sufficient to deliver the vapor-deposited material at a desired vapor pressure. In one implementation that can be combined with other implementations, each nozzle 405 has an opening defined by a diameter of about 1 mm to about 10 mm, for example, 3 mm to about 7 mm, such as about 4.5 mm to about 5.5 mm, such as about 5 mm. Any of the foregoing values ​​can be used individually to describe the open range or in combination to describe the closed range.

[0141] The height of nozzle 405 is variable. In one implementation that can be combined with other implementations, the height of nozzle 405 can be from about 10 mm to about 20 mm, such as from about 10 mm to about 15 mm, from about 15 mm to about 20 mm, or about 15 mm. Any of the foregoing values ​​can be used alone to describe the open range or in combination to describe the closed range.

[0142] As described above, conventional nozzle assemblies comprise only 50 nozzles (five rows, each with 10 nozzles), while the embodiments described herein include more than about 50 nozzles, such as about 60 nozzles or more, such as about 70 nozzles or more (e.g., seven longitudinal peaks 407 (or seven rows), each longitudinal peak 407 (or each row) having 10 nozzles 405). Any of the foregoing values ​​can be used individually to describe an open range or in combination to describe a closed range. Here, the inventors have found that, for example, a reduced pitch between the nozzles can accommodate two additional rows of nozzles. Increasing the number of nozzles can provide a higher deposition rate, or even a similar rate at lower temperatures.

[0143] Increasing the number of nozzles is not obvious or straightforward. For example, given a certain area (i.e., the vapor depositor opening area (the area of ​​top surfaces 234b, 334b)), a high deposition rate cannot be achieved by randomly changing the number of nozzles. First, to allow alkali metal to pass through more nozzles, a higher temperature must be used to achieve the same throughput. Second, even with a larger number of nozzles, the substrate 108 is negatively affected during processing. Here, increasing the number of nozzles can lead to film inhomogeneity and an increased condensation heat load, which can damage the foil due to the higher pressure and temperature required to force the alkali metal out of the nozzles. These and other considerations make the nozzle assembly described herein a less obvious design choice. Based at least on the vapor depositor opening area and nozzle area of ​​the embodiments described herein, the nozzle assembly of this disclosure can achieve a uniform film and minimal or no condensation during the processing of the substrate 108.

[0144] Heat shielding components

[0145] Figures 5A to 5C A heat shield assembly 500 according to one or more implementations of this disclosure is shown. Specifically, Figure 5A A heat shield assembly 500 is shown. Figure 5B A mounting mechanism 510b for the heat shield 501 is shown, and Figure 5C A heat shield assembly positioned between frame 160 and coating roller 110 is shown. Heat shield assembly 500 can be used to replace heat shield assembly 152.

[0146] The heat shield assembly 500 includes a heat shield 501. The heat shield 501 is used to maintain the alkali metal in a molten or vapor phase during deposition on a continuous flexible substrate 108. The heat shield 501 has a first pair of opposing sidewalls 501a, 501b. Sidewall 501a may be concave to adapt to a coating roller 110. During use, sidewall 501a is positioned closer to the coating roller 110, while sidewall 501b is positioned closer to the frame 160 supporting the vapor deposition assembly (e.g., vapor deposition assemblies 140, 200, 300).

[0147] The heat shield 501 further includes a second pair of opposing sidewalls 506a, 506b (collectively referred to as 506). The distance between the second pair of opposing sidewalls 506 is greater than, for example, the length dimension (L2) of the top surface 234b or the length dimension (L4) of the top surface 334b.

[0148] The heat shield 501 further includes a pair of members 507a and 507b (collectively referred to as 507) extending outward from and perpendicular to the sidewall 506. Members 507 also extend outward from the sidewall 501b. Here, member 507a extends outward from the sidewalls 501b and 506a, and member 507b extends outward from the sidewalls 501b and 506a. Members 507a and 507b may be welded to, screwed to, or removably attached to the heat shield 501. Alternatively, members 507a and 507b and the heat shield 501 may be machined from a single part.

[0149] Each opposing sidewall 506 is coupled to a corresponding plate 503a, 503b (collectively referred to as 503) of the heat shield assembly 500. Plate 503 may be made of a thermally conductive material, such as copper or other suitable material. A first plurality of heaters 504a to 504c (collectively referred to as 504) and a second plurality of heaters 505a to 505c (collectively referred to as 505) are coupled to plates 503a and 503b, respectively. The heat shield 501 includes a plurality of grooves in each opposing sidewall 506 such that heaters 504, 505 can be fitted into the grooves of the heat shield 501.

[0150] The heat shield assembly 500 further includes a pair of frames 502a and 502b (collectively referred to as 502). Frame 502 may be a copper frame. Frame 502a is positioned on the surface of plate 503a opposite to the surface of plate 503a that is coupled to the sidewall 506a of the heat shield 501. Frame 502b is positioned on the surface of plate 503b opposite to the surface of plate 503b that is coupled to the sidewall 506b of the heat shield 501.

[0151] The heat shield assembly 500 further includes a pair of mounting mechanisms 510a, 510b (collectively referred to as 510) for mounting the heat shield 501 to a pair of frames 502a, 502b of the heat shield assembly 501 via members 507a, 507b. The mounting mechanisms 510 can be removably secured to the members 507, for example, by bolts 514a, 514b and washers 512a, 512b.

[0152] Compared to conventional heat shield assemblies, mounting mechanism 510 is horizontally flipped away from the heat shield (and has an increased offset). This configuration allows the larger heat shield described herein (adapted to assemble the larger vapor deposition unit described herein) to be mounted onto frame 502.

[0153] Unlike conventional heat shields that accommodate 50 nozzles, the heat shields described herein are larger, accommodating 70 nozzles. The width of the heat shield can also be greater to accommodate a wider vapor depositor. A wider heat shield also reduces the direct path of radiant heat. Furthermore, compared to conventional heat shields, the heat shield assembly 500 described herein includes a plate 503 between the frame 502 and the heat shield 501. Regardless of whether conventional techniques include a plate, an open space exists between the heat shield and the frame to which it is mounted (e.g., frame 502), resulting in radiant heat loss. In contrast, the embodiments of the heat shield assembly described herein do not have an open space between the heat shield and the frame.

[0154] like Figure 5C (It may be part of processing chambers 100, 150) As shown, a heat shield assembly 500 is coupled to a top tray 550, which is used to confine the alkali metal during deposition. The top tray 550 is coupled via a top surface 234b (or top surface 334b) of the vaporizer body 258 (or vaporizer body 358) to a vapor deposition assembly (e.g., vapor deposition assemblies 200, 300) supported by a frame 160. As described above, the top surfaces 234b / 334b may be nozzle assemblies. As shown, the nozzles 405 of the nozzle assembly traverse at least a portion of the top tray 550.

[0155] The following examples are provided to give those skilled in the art a complete disclosure and description of how embodiments of this disclosure can be made and used, without intending to limit the scope of embodiments of this disclosure. Efforts have been made to ensure the accuracy of the figures used, but some experimental errors and biases should be taken into account.

[0156] Example

[0157] Table 1 shows the properties of the example vapor deposition unit assembly and the comparative example vapor deposition unit assembly. Comparative Example 1 (C.Ex.1) is a cylindrical crucible. Comparative Example 2 (C.Ex.2) is a conventional crucible. Example 1 (Ex.1) is a non-limiting example of selected portions of a vapor deposition unit assembly that can be used at the first position (A) and the second position (B). Example 2 (Ex.2) is a non-limiting example of selected portions of a vapor deposition unit assembly that can be used at the third position (C) and the fourth position (D).

[0158] Table 1

[0159]

[0160] The crucible openings in Ex.1 and Ex.2 refer to the dimensions W1×L1 of opening 216 in crucible body 214 and W3×L3 of opening 316 in crucible body 314, respectively. The crucible opening area is calculated as πr², where r is 21.55 (half the diameter of 43.1 mm). The crucible opening areas in Ex.2, Ex.1, and Ex.2 are calculated based on the width × length dimension of the crucible opening.

[0161] The vapor depositor opening areas of Ex.1 and Ex.2 are calculated based on the dimensions W2×L2 of the top surface 234b of the vapor depositor body 258 and the dimensions W4×L4 of the top surface 334b ​​of the vapor depositor body 358.

[0162] The total nozzle opening area based on a 5mm diameter is calculated by multiplying the total number of nozzles by πr², where r is the radius of the nozzle opening (radius = 2.5mm).

[0163] The nozzle:evaporator:crucible area ratio is calculated based on the following ratio: (based on the total nozzle opening area of ​​5mm diameter, mm) 2 ):((Vapor opening area, mm) 2 ) / (Based on the total nozzle opening area of ​​5mm diameter, mm 2 ):((cruise box opening area, mm) 2 ) / (Based on the total nozzle opening area of ​​5mm diameter, mm 2 )).

[0164] For example, the nozzle:evaporator:crucible area ratio of C.Ex.1 is 981:(88,200 / 981):(1,459 / 981)=1:89.8:1.48. As another example, the nozzle:evaporator:crucible area ratio of Ex.1 is 1374:(100,380 / 1374):(71,896 / 1374)=1:73:52.32. As yet another example, the nozzle:evaporator:crucible area ratio of Ex.2 is 981:(100,380 / 1374):(67,716 / 1374)=1:73:49.28.

[0165] Volumetric capacity is the amount of alkali metal that can be placed in the crucible of the vapor deposition unit. For Ex.1 and Ex.2, volumetric capacity is the volume of the crucible body 214 up to the top surface 212b and the volume of the crucible body 314 up to the top surface 312b.

[0166] The implementations and all functional operations described herein can be implemented in digital electronic circuit systems or in computer software, firmware, or hardware, including the structural means disclosed herein, their structural equivalents, or combinations thereof. The implementations described herein can be implemented as one or more non-transitory computer program products, i.e., one or more computer programs tangibly embodied in a machine-readable storage device for execution by or control of a data processing apparatus (e.g., a programmable processor, a computer, or multiple processors or computers).

[0167] The processes and logic flows described in this specification can be implemented by one or more programmable processors that execute one or more computer programs to perform functions by manipulating input data and generating outputs. These processes and logic flows can also be implemented by special-purpose logic circuit systems (e.g., FPGAs (Field-Programmable Gate Arrays) or ASICs (Application-Specific Integrated Circuits)), and the device can also be implemented as such a special-purpose logic circuit system.

[0168] As is clear from the foregoing general description and specific aspects, while various forms of these aspects have been illustrated and described, various modifications may be made without departing from the spirit and scope of this disclosure. Therefore, it is not intended to limit the scope of this disclosure. Similarly, the term "comprising" is considered synonymous with the term "including." Likewise, whenever the transitional phrase "comprising" precedes a composition, a process operation, multiple process operations, an element, or a group of elements, it should be understood that the composition, a process operation, multiple process operations, an element, or multiple elements are also envisioned to be described by the transitional phrases "substantially composed of," "composed of," "selected from," or "is," and vice versa, terms such as "comprising," "substantially composed of," and "composed of" also include products of combinations of elements listed with these terms.

[0169] For the purposes of this disclosure, and unless otherwise specified, all numerical values ​​in the specific embodiments and claims herein are modified with "about" or "approximately" to indicate values, and take into account experimental errors and variations that would be expected by one of ordinary skill in the art. For brevity, only certain ranges are explicitly disclosed herein. However, a range from any lower limit may be combined with any upper limit to state a range not explicitly stated, and a range from any lower limit may be combined with any other lower limit to state a range not explicitly stated, and in the same manner, a range from any upper limit may be combined with any other upper limit to state a range not explicitly stated. For example, stating a numerical range of 1 to 5 includes subranges 1 to 4, 1.5 to 4.5, 1 to 2, etc. As another example, stating a numerical range of 1 to 5 such as 2 to 4 includes other subranges such as 1 to 4 and 2 to 5. Additionally, each point or individual value between the endpoints of the range is included within the range, even if not explicitly stated. For example, stating a numerical range of 1 to 5 includes the numbers 1, 1.5, 2, 2.75, 3, 3.80, 4, 5, and other numbers. Therefore, each point or individual value can be combined with any other point or individual value or any other lower or upper limit to be used as its own lower or upper limit to state a range that is not explicitly stated.

[0170] As used herein, the indefinite articles “a” or “an” shall mean “at least one” unless the contrary is indicated or the context clearly indicates otherwise. For example, an aspect including “vapor depositor assembly” includes an aspect including one, two or more vapor depositor assemblies, unless the contrary is indicated or the context clearly indicates that only one vapor depositor assembly is included.

[0171] While the foregoing addresses various aspects of this disclosure, other and further aspects of this disclosure may be conceived without departing from its essential scope, which is defined by the appended claims.

Claims

1. A vapor deposition assembly for alkali metal deposition, the vapor deposition assembly comprising: The first heater region includes multiple first heaters; A vapor deposition apparatus body, wherein at least a portion of the vapor deposition apparatus body is located within the first heater region, wherein: The vapor deposition unit body includes a top surface having a multiple linear array of nozzles; The second heater region includes one or more second heaters; and A crucible, positioned within the second heater region, the crucible comprising a crucible body fluidly coupled to the vapor deposition unit body, wherein: The crucible body defines an internal area for storing the material to be vaporized; The crucible body has an opening through which the vapor-deposited material can escape; and The crucible body has a length dimension and a width dimension that define the vapor deposition surface area.

2. The vapor deposition assembly as described in claim 1, wherein: Each nozzle has an opening defined by its diameter; The total area of ​​the openings defines the nozzle opening surface area; and The vapor deposition surface area of ​​the crucible body is greater than the nozzle opening surface area.

3. The vapor deposition assembly of claim 1, wherein the vapor deposition unit further includes a bottom surface corresponding to the opening in the crucible body.

4. The vapor deposition assembly as described in claim 1, wherein: The vapor deposition apparatus body further includes a first pair of opposing sidewalls extending downward from the top surface, the first pair of opposing sidewalls defining the length dimension of the vapor deposition apparatus body; The vapor deposition unit body further includes a second pair of opposing sidewalls extending downward from the top surface, the second pair of opposing sidewalls defining the width dimension of the vapor deposition unit body; and The plurality of first heaters in the first heater region extend the length dimension of the vapor deposition unit.

5. The vapor deposition assembly of claim 4, wherein the first heater region further comprises: A first conductive member is positioned between a first heater in the plurality of heaters and a first sidewall in the first pair of opposing sidewalls; as well as The second conductive member is positioned between the second heater in the first plurality of heaters and the second sidewall in the first pair of opposing sidewalls.

6. The vapor deposition assembly of claim 5, wherein the third heater of the first plurality of heaters is positioned between the first heater and the second heater of the first plurality of heaters.

7. The vapor deposition assembly as claimed in claim 1, wherein: The plurality of first heaters are tubular heaters; and The one or more second heaters are tubular heaters.

8. The vapor deposition assembly of claim 1, further comprising an alkali metal delivery line, the alkali metal delivery line comprising: The first section is located outside the vapor deposition assembly; The second section is located in the internal region of the vapor deposition assembly, and the second section traverses the interior of the vapor deposition unit and the crucible body; The third section is located in the internal region of the vapor deposition assembly and below the opening of the crucible body; as well as Multiple openings allow alkali metals to enter the crucible through which they enter.

9. The vapor deposition assembly as claimed in claim 1, wherein: The crucible does not contain a compartment; The vapor deposition assembly does not contain an external heater that radiatively heats the crucible; or Their combination.

10. The vapor deposition assembly of claim 1, further comprising a heated delivery line coupled to the interior region of the crucible body, the heated delivery line being used to supply the alkali metal to be deposited to the crucible body.

11. A vapor deposition assembly for alkali metal deposition, the vapor deposition assembly comprising: The first heater region includes multiple first heaters; The second heater region includes one or more second heaters; A vapor deposition apparatus body, wherein at least a portion of the vapor deposition apparatus body is located within the first heater region and the second heater region, wherein: The vapor deposition unit body includes: The top surface has a linear array of nozzles; A first pair of opposing sidewalls extends outward from the top surface, defining the length dimension of the vapor deposition unit body; and A second pair of opposing sidewalls extends outward from the top surface, defining the width dimension of the vapor deposition unit body; and The plurality of first heaters in the first heater region extend the length dimension of the vapor deposition unit body; The third heater region includes one or more third heaters; and A crucible, positioned within the third heater region, further positioned outside the first and second heater regions, the crucible comprising a crucible body fluidly coupled to the vapor deposition unit body, wherein: The crucible body defines an internal area for storing the material to be vaporized; The crucible body has an opening through which the vapor-deposited material can escape; and The crucible body has a length and width dimension that define the vapor deposition surface area; and The second heater region is located above the opening in the crucible body.

12. The vapor deposition assembly of claim 11, wherein the first heater region further comprises: A first conductive member is positioned between a first heater in the plurality of heaters and a first sidewall in the first pair of opposing sidewalls; as well as The second conductive member is positioned between the second heater in the first plurality of heaters and the second sidewall in the first pair of opposing sidewalls.

13. The vapor deposition assembly of claim 11, wherein the one or more second heaters in the second heater region extend the length dimension of the vapor deposition unit body.

14. The vapor deposition assembly as claimed in claim 11, wherein: Each nozzle has an opening defined by its diameter; The total area of ​​the openings defines the nozzle opening surface area; and The vapor deposition surface area of ​​the crucible body is greater than the nozzle opening surface area.

15. The vapor deposition assembly of claim 11, wherein the vapor deposition unit further comprises: The bottom surface corresponds to the opening in the crucible body; as well as The side surface corresponds to the side surface of the crucible.

16. The vapor deposition assembly as claimed in claim 11, wherein: The crucible does not contain a compartment; and The vapor deposition assembly does not contain an external heater that radiates heat to the crucible.

17. The vapor deposition assembly of claim 11, further comprising an alkali metal delivery line, the alkali metal delivery line comprising: The first section is located outside the vapor deposition assembly; The second section is located in the internal region of the vapor deposition assembly, and the second section traverses the interior of the vapor deposition unit and the crucible body; The third section is located in the internal region of the vapor deposition assembly and below the opening of the crucible body; as well as Multiple openings allow alkali metals to enter the crucible through these openings.

18. A processing chamber for depositing alkali metals, the processing chamber comprising: Coating rollers; Multiple vapor deposition components are arranged radially around the coating roller, wherein: The first vapor deposition component among the plurality of vapor deposition components has a first tilt angle, and the first vapor deposition component includes: The first heater region includes multiple first heaters; A vapor deposition apparatus body, wherein at least a portion of the vapor deposition apparatus body is located within the first heater region, wherein: The vapor deposition unit body includes a top surface having a multiple linear array of nozzles; The second heater region includes one or more second heaters; and The crucible is positioned within the second heater region, the crucible comprising a crucible body fluidly coupled to the vapor deposition unit body, wherein the crucible body defines an internal region for holding the material to be vapor-deposited, the crucible body has an opening through which the vapor-deposited material can escape, and the crucible body has a length dimension and a width dimension defining the vapor deposition surface area; and The second vapor deposition component among the plurality of vapor deposition components has a second tilt angle that is different from the first tilt angle.

19. The processing chamber of claim 18, wherein the second vapor deposition assembly comprises: The first heater region includes multiple first heaters; The second heater region includes one or more second heaters; A vapor deposition apparatus body, wherein at least a portion of the vapor deposition apparatus body is located within the first heater region and the second heater region, wherein: The vapor deposition unit body includes: The top surface has a linear array of nozzles; A first pair of opposing sidewalls extends outward from the top surface, defining the length dimension of the vapor deposition unit body; and A second pair of opposing sidewalls extends outward from the top surface, defining the width dimension of the vapor deposition unit body; and The plurality of first heaters in the first heater region extend the length dimension of the vapor deposition unit body; The third heater region includes one or more third heaters; A crucible, positioned within the third heater region and further positioned outside the first and second heater regions, comprising a crucible body fluidly coupled to the vapor deposition unit body, wherein: The crucible body defines an internal area for storing the material to be vaporized; The crucible body has an opening through which the vapor-deposited material can escape; and The crucible body has a length and width dimension that define the vapor deposition surface area; and The second heater region is located above the opening in the crucible body.

20. The processing chamber of claim 19, wherein: The first tilt angle is approximately 20 degrees to approximately 25 degrees; and The second tilt angle is approximately 65 degrees to approximately 70 degrees.

Images