Process tool for high-precision adjustment of modular detector
By using a process tooling consisting of a substrate, rods, and connectors, the five degrees of freedom of a single-module detector are controlled, solving the problems of unrestrained attitude and positional deviation during the adjustment process of modular detectors, and achieving high-precision module splicing.
Patent Information
- Application Number
- CN202511507159.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-21
- Publication Date
- 2026-02-27
AI Technical Summary
The modular detector's attitude is unrestrained during adjustment, which causes the accuracy adjustment in one direction to affect the accuracy in other directions, and the positional offset during fixing makes it difficult to guarantee the splicing accuracy.
The process tooling consists of a substrate, rods, and connectors. The five degrees of freedom of a single-module detector are controlled by a five-dimensional adjustment stage. The design of the rods and connectors ensures high-precision adjustment and fixation, avoids positional deviation, and achieves efficient splicing of the module and the substrate.
It achieves high-precision adjustment and splicing of single-module detectors, improves the controllability and efficiency of adjustment, and ensures high-precision splicing of modular detectors.
Smart Images
Figure CN121572200A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of advanced manufacturing technology, and in particular to a process tooling for high-precision adjustment of a modular detector. Background Technology
[0002] The splicing process of modular detectors needs to ensure the X&Y and tilt accuracy of the modules. Traditional manual adjustment process has the following two problems: First, the module's posture is not constrained during the adjustment process, and the accuracy adjustment in one direction makes the accuracy in other directions uncontrollable, and the adjustment process is time-consuming; Second, the fixing process between the module and the splicing substrate generally adopts a combination of screw and glue fixing. During the fixing process, the adjustment accuracy will be affected by local tightening and glue flow, which will cause positional displacement, resulting in changes in splicing accuracy and making it difficult to guarantee the module splicing accuracy.
[0003] The existing method for adjusting X&Y and tilt accuracy is difficult to achieve due to the lack of constraints in the module fixing process, resulting in high module splicing difficulty. Therefore, it is necessary to optimize the single-module adjustment process. Summary of the Invention
[0004] This application provides a process tooling for high-precision adjustment of modular detectors, used to adjust the X&Y and tilt of modular detectors, thereby achieving high-precision and efficient splicing of modular detectors.
[0005] This application provides a process tooling for high-precision adjustment of a modular detector, including: The substrate 5 has multiple fixed positions for single-module detectors 3. The single-module detectors 3 have mounting holes on their sides and back. The mounting holes on the back are used to mount the single-module detectors 3 onto the substrate 5, and a preset adjustment amount is provided after installation. Rod 1 is connected to the mounting hole on the side of the single-module detector 3, and the flatness of the first contact surface 13 between the rod 1 and the side of the single-module detector 3 meets the index requirements. Connector 2 has one end extending from the rod 1 and the other end connected to the five-dimensional adjustment platform 4. The cylindricity of the second contact surface 24 of connector 2 meets the index requirements.
[0006] Optionally, the rod 1 includes a column 12 and a connecting block, the side of the connecting block being the first contact surface 13, and the perpendicularity of the column 12 to the first contact surface 13 being better than 10 μm.
[0007] Optionally, the flatness of the side surface 32 of the single-module detector 3 is within 5μm, and during assembly, the perpendicularity of the top surface 31 of the single-module detector 3 to its side surface 32 is ensured to meet the index requirements.
[0008] Optionally, the other end of the connector 2 connected to the five-dimensional adjustment platform 4 is provided with multiple U-shaped through holes 21.
[0009] Optionally, the other end of the connector 2 is a hollow post 24 adapted to the post 12. The hollow post 24 includes an access hole, into which the post 12 can be inserted. A fastening hole 25 is provided on the side wall of the access hole, and the post 12 is fastened by the screw 8 through the fastening hole 25. The height, pitch, horizontal position, and tilt attitude of the five-dimensional adjustment platform 4 are adjusted so that the column 12 and the access hole can be coupled in length without friction.
[0010] Optionally, the material of the hollow column 24 satisfies a cylindricity better than 5 μm.
[0011] Optionally, the column 12 and the hollow column 24 are machined to fit together, with a 10μm-15μm gap on one side.
[0012] Optionally, a spacer 6 is provided between the single-module detector 3 and the substrate 5. The two mounting ends of the spacer 6 are coated with adhesive and placed at corresponding positions on the substrate 5.
[0013] The tooling in this embodiment can avoid the mutual influence between the tooling single-module detector and the Z-axis position when performing X&Y and tilt adjustments, thus meeting the process requirements for high-precision splicing of single-module detectors and improving the controllability and splicing efficiency of the single-module detector splicing process.
[0014] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description
[0015] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 A schematic diagram of the overall structure of the tooling for high-precision adjustment of modular detectors; Figure 2 A schematic diagram of the installation and adjustment of a single-module detector using a process tooling for high-precision adjustment of modular detectors. Figure 3 A schematic diagram of the rod structure for the process tooling of high-precision adjustment of modular detectors; Figure 4 A schematic diagram of the connecting parts structure of the process tooling for high-precision adjustment of modular detectors. Detailed Implementation
[0016] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
[0017] This application provides a process tooling for high-precision adjustment of a modular detector, such as... Figure 1 As shown, it includes: The substrate 5 has multiple fixed positions for single-module detectors 3. The single-module detectors 3 have mounting holes on their sides and back. The mounting holes on the back are used to mount the single-module detectors 3 onto the substrate 5, and a preset adjustment amount is provided after installation.
[0018] Rod 1 is connected to the mounting hole on the side of the single-module detector 3. The material stiffness of rod 1 is such that the flatness of the first contact surface 13 between rod 1 and the side of the single-module detector 3 meets the requirements. Connector 2 extends from the rod 1 at one end and is connected to the five-dimensional adjustment platform 4 at the other end. The material of connector 2 meets the requirement of cylindricity of its second contact surface 24 with the five-dimensional adjustment platform 4.
[0019] In some embodiments, such as Figure 2 As shown, a spacer 6 is also provided between the single-module detector 3 and the substrate 5. The two mounting end faces 61 and 62 of the spacer 6 are coated with adhesive and placed at the corresponding positions on the substrate 5. In a specific example, the single-module detector 3 is placed on top of the splicing substrate 5 via the spacer 6. The height and pitch accuracy of the top surface 31 of the single-module detector 3 relative to the reference surface 51 are achieved by the spacer 6. In subsequent process steps, the single-module detector 3 with the rod 1 can be placed on 6. The back of the single-module detector 3 has a screw hole, and the screw 7 passes through the through hole 52 to fix the single-module detector 3 to the substrate 5. The fixing method can adopt a multi-round progressive tightening method, and the through hole 52 and the screw have an adjustment range of 0.5mm.
[0020] The tooling of this application mainly includes rod 1 and connector 2. One end of the tooling is connected to the single-module detector 3, and the other end is connected to the five-dimensional adjustment platform 4. All five degrees of freedom of the single-module detector are controlled. The tooling ensures the parallelism between the top surface 31 of the single-module detector and the XY adjustment surface of the tooling through parameter and assembly process design, thereby greatly avoiding the mutual influence between the XY adjustment and Z position of the module. This makes the adjustment process of the X&Y&Z accuracy, tilt accuracy and pitch accuracy of the single-module detector controllable, and realizes the efficient and high-precision splicing of the single-module detector.
[0021] In some embodiments, the rod 1 includes a column 12 and a connecting block, the side of the connecting block being the first contact surface 13, the height of the first contact surface 13 being Dmm, and the perpendicularity of the column 12 to the first contact surface 13 being better than 10μm.
[0022] In some embodiments, the side flatness of the single-module detector 3 is within 5 μm, and during assembly, the perpendicularity of the top surface 31 of the single-module detector 3 to its side surface 32 meets the index requirements.
[0023] In a specific example, the side 32 of the single-module detector is provided with module fixing screw holes 33, such as... Figure 2 As shown, the rod 1 has a through hole 11 that matches the fixing screw hole, and the rod 1 and the single-module detector 3 are fixed with screws. During processing, the rod 1 is made of a material with good rigidity, and the flatness of the first contact surface 13 is better than 5μm, the cylindricity of the column 12 is better than 5μm, and the perpendicularity between the first contact surface 13 and the column 12 is better than 10μm. The flatness of the side surface 32 of the single-module detector is within 5μm, and during assembly, the perpendicularity between the top surface 31 of the single-module detector and the side surface 32 of the single-module detector is within aμm.
[0024] In some embodiments, such as Figure 3 As shown, the other end of the connector 2 connected to the five-dimensional adjustment platform 4 is provided with multiple U-shaped through holes 21. In some embodiments, the material of the hollow column 24 satisfies a cylindricity better than 5 μm. In a specific example, the interface platform of the five-dimensional adjustment platform 4 is provided with four mounting screw holes, and the connector 2 is provided with corresponding four U-shaped through holes 21, so that the connector 2 and the five-dimensional adjustment platform 4 are fixed with screws. The connector 2 is made of a material with good rigidity during processing, and the cylindricity of the hollow column 24 is ensured to be better than 5 μm.
[0025] In some embodiments, the other end of the connector 2 is a hollow post 24 adapted to the post 12. The hollow post 24 includes an access hole, into which the post 12 can be inserted. A fastening hole 25 is provided on the side wall of the access hole, and the post 12 is fastened by the screw 8 through the fastening hole 25. The height, pitch, horizontal position, and tilt attitude of the five-dimensional adjustment platform 4 are adjusted so that the column 12 and the access hole can be coupled in length without friction.
[0026] In a specific example, the height, pitch, horizontal position, and tilt of the five-dimensional adjustment platform are adjusted so that the column 12 and the hollow column 24 can achieve a coupling length of L without friction. Then, according to actual needs, the coupling amount between the column 12 and the hollow column 24 is adjusted, and the coupling amount exceeds the screw hole 25. Finally, the screws 8 are tightened in a multi-round progressive manner.
[0027] In some embodiments, the column 12 and the hollow column 24 are machined together, with a 10μm-15μm clearance on one side.
[0028] In a specific example, during machining, the column 12 and the hollow column 24 are machined together, with a 10μm-15μm clearance on each side. The maximum frictionless coupling between the hollow column 24 and the screw hole 25 is Lmm. Therefore, the tilt angle β of the XY adjustment surface of the tooling relative to the top surface 31 does not exceed arcsin((0.015+a) / L+0.005 / D), the horizontal adjustment of the single-module detector does not exceed 0.5mm, and the resulting change in the Z-axis height of the module does not exceed sinβ×0.5mm.
[0029] In this example, the perpendicularity between the top surface 31 and the side surface 32 of the single-module detector in the splicing module can be guaranteed to be within 10μm. The design value of L is 38mm and the design value of D is 4mm, so that the adjustment affects the module height by no more than 1μm.
[0030] Loosen screw 7 slightly and raise the module from the designed height by 0.05~0.1mm using a five-dimensional adjustment platform so that the module can move horizontally. Observe the coordinates of the chip positioning mark under high-precision measuring equipment and compare them with the designed position to calculate the deviation. Then, use the five-dimensional adjustment platform to adjust the tilt accuracy of the single module detector to meet the requirements. Subsequently, adjust the splicing accuracy of the module in the X and Y directions to meet the project requirements.
[0031] The module height is lowered to the designed position, and screw 7 is tightened in a multi-stage, progressive manner. After the single-module detector has solidified, the fixture is removed. There is an angular deviation between the focal plane of the single-module detector and the XY plane of the adjustment fixture. The height adjustment has a certain impact on the horizontal position, but this impact does not exceed 0.2μm (sinβ×0.1mm). This maximizes the independence of the three-dimensional adjustment of the single-module detector, improves adjustment efficiency, and ensures adjustment accuracy.
[0032] The tooling of this application can ensure the parallelism between the single-module detector and the XY adjustment surface of the tooling, thereby avoiding the mutual influence between the single-module detector and its Z-axis position when performing X&Y and tilt adjustments, meeting the process requirements of high-precision splicing of single-module detectors, and improving the controllability and splicing efficiency of the single-module detector splicing process.
[0033] It should be noted that, in the embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.
[0034] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.
[0035] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims. All of these forms are within the protection scope of this application.
Claims
1. A process tooling for high precision adjustment of modular detectors, characterized in that, The application relates to a substrate (5) provided with a plurality of fixed positions of single-module detectors (3), the side and back of the single-module detectors (3) are provided with mounting holes, wherein the mounting holes on the back are used for mounting the single-module detectors (3) on the substrate (5) and leaving a preset adjustment amount after mounting; a rod (1) is connected to the mounting holes on the side of the single-module detectors (3), the flatness of a first contact surface (13) of the rod (1) and the side of the single-module detectors (3) meets index requirements; a connecting piece (2) is led out from the rod (1) and connected to a five-dimensional adjustment table (4), the cylindricity of a second contact surface (24) of the connecting piece (2) and the five-dimensional adjustment table (4) meets index requirements. The rod (1) comprises a column piece (12) and a connecting block, the side of the connecting block is the first contact surface (13), and the perpendicularity of the column piece (12) and the first contact surface (13) is better than 10 mu m. The flatness of the side (32) of the single-module detector (3) is within 5 mu m, and the perpendicularity of the top surface (31) and the side (32) of the single-module detector (3) meets index requirements during assembly. The other end of the connecting piece (2) connected to the five-dimensional adjustment table (4) is provided with a plurality of U-shaped through holes (21).
2. The process tool for high precision adjustment of modular probes of claim 1, wherein, The other end of the connecting piece (2) is a hollow column (24) matched with the column piece (12), the hollow column (24) comprises an access hole, the column piece (12) can be inserted into the access hole of the hollow column (24), and a fastening hole (25) is arranged on the side wall of the access hole, and the column piece (12) is fastened based on a screw (8) passing through the fastening hole (25); 3. The process kit of claim 1, wherein, The height, pitch, horizontal position and inclined posture of the five-dimensional adjustment table (4) are adjusted, so that the column piece (12) and the access hole are frictionless, and the length of the column piece (12) is coupled.
4. The process kit of claim 2, wherein, The cylindricity of the hollow column (24) is better than 5 mu m.
5. The process kit for modular probe fine tuning, as recited in claim 4, wherein, The column piece (12) and the hollow column (24) are processed in cooperation, and a cooperation gap of 10 mu m-15 mu m is left on a single side. The single-module detector (3) and the substrate (5) are further provided with a gasket (6), two mounting end surfaces of the gasket (6) are coated with adhesive, and the gasket (6) is placed at the corresponding position of the substrate (5).
6. The process kit for modular probe fine tuning, as recited in claim 5, wherein, 7. The process kit for modular probe fine tuning, as recited in claim 5, wherein, 8. The process kit for modular probe fine tuning, as recited in claim 4, wherein,