Optical detector for welding quality of integrated circuit board

Abstract

The invention discloses an optical detector for the welding quality of an integrated circuit board, and relates to the field of optical detectors, the optical detector comprises a tester platform, the tester platform is provided with a multidirectional tool mechanism and a visual detection mechanism, the multidirectional tool mechanism comprises a deflection base, a revolving bed and a U-shaped tool frame, the deflection base is rotatably mounted on the tester platform, and the revolving bed is rotatably mounted on the U-shaped tool frame; the rotary seat is rotatably installed on the deflection base, the rotation axis of the deflection base and the rotation axis of the rotary seat are both vertically arranged, the closed end of the U-shaped tool frame is rotatably installed on the rotary seat, the U-shaped tool frame is provided with a limiting groove in the inner side wall of a U-shaped opening, the rotation axis of the U-shaped tool frame is horizontally arranged, and the U-shaped tool frame deflects to the horizontal state. The feeding conveying mechanism can convey the integrated circuit board into the limiting groove, the tool frame rotates to be in a vertical state and enters the detection range of the visual detection mechanism, welding spot images can be collected in a multi-angle mode, the three-dimensional shape of welding spots can be completely restored, and the detection accuracy of the welding spots is higher.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical detection instrument, and particularly to an optical detection instrument for welding quality of integrated circuit board. BACKGROUND

[0002] With the rapid development of electronic information industry, as the core component of electronic equipment, the integrated circuit board has continuously improved in integration, and the density and precision requirements of welding points are increasingly stringent. The welding quality directly determines the electrical performance, reliability and service life of the integrated circuit board. If defects such as virtual welding, false welding, solder overflow and hollow welding points occur during the welding process, it may cause electronic equipment to malfunction, and even cause safety hazards. Therefore, accurate detection of the welding points of the integrated circuit board has become a key link in the electronic manufacturing industry. At present, the welding quality detection of the integrated circuit board mainly adopts manual visual detection, X-ray detection and traditional optical detection. Manual visual detection relies on the experience and concentration of the operator, which not only has low detection efficiency and is difficult to meet the demand of large-scale production, but also has limited defect recognition ability for small and hidden welding points, and is easily affected by subjective factors, resulting in missed detection and false detection, and the detection consistency is difficult to guarantee. Although X-ray detection can realize penetration detection, the equipment cost is high, the radiation pollution risk is high, and the detection speed is slow, which is not suitable for online detection scene of conventional production line. Traditional optical detection equipment mainly adopts single-angle planar imaging technology. The circuit board is horizontally conveyed to the detection station by a conveying belt, and then the industrial camera is used to collect and analyze two-dimensional images of the welding points. In this detection method, the industrial camera obtains a top-down image of the welding point, and the top-down image that meets the requirements cannot completely determine that the welding point quality meets the standard. The welding points of the integrated circuit board often have complex three-dimensional structures, and single-angle planar imaging cannot fully present the three-dimensional shape of the welding points. It is difficult to accurately identify three-dimensional defects such as solder accumulation on the side of the welding point and the adhesion degree of the pin and the pad, which limits the detection accuracy and affects the integrity and accuracy of the detection. SUMMARY

[0003] The present application aims to overcome the shortcomings of the prior art and provide an optical detection instrument for welding quality of integrated circuit board, which can complete three-dimensional imaging detection of the welding points and improve the detection accuracy.

[0004] The purpose of the application is achieved by the following technical scheme: an integrated circuit board welding quality optical detector, comprising a tester platform, the tester platform is provided with a feeding conveying mechanism, a multidirectional tooling mechanism and a visual detection mechanism, the feeding conveying mechanism comprises a guide feeding plate, two guide feeding plates are arranged in parallel along the vertical direction of the integrated circuit board, a conveying space is formed between the two guide feeding plates, a guide groove is formed on the side of the guide feeding plate close to the conveying space, the guide groove is arranged through along the conveying direction of the integrated circuit board, the multidirectional tooling mechanism comprises a deflection base, a rotary seat and a U-shaped tooling frame, the deflection base is rotatably installed on the tester platform, the rotary seat is rotatably installed on the deflection base, the rotation axis of the deflection base and the rotation axis of the rotary seat are both vertically arranged, the closed end of the U-shaped tooling frame is rotatably installed on the rotary seat, a limiting groove is formed on the inner side wall of the U-shaped opening of the U-shaped tooling frame, the rotation axis of the U-shaped tooling frame is horizontally arranged, the U-shaped tooling frame is deflected to a horizontal state, so that the feeding conveying mechanism can convey the integrated circuit board into the limiting groove, the visual detection mechanism is arranged on one side of the multidirectional tooling mechanism, the visual detection mechanism comprises an industrial camera, a plurality of industrial cameras are linearly installed along the conveying direction of the integrated circuit board, and the U-shaped tooling frame is rotated to a vertical state to enter the detection range of the visual detection mechanism.

[0005] Further, the bottom of the deflection base is fixed with a deflection shaft, the deflection shaft is rotatably connected with the tester platform, an inner cavity is formed in the tester platform, the deflection shaft penetrates into the inner cavity and is connected with a deflection plate, a gas cylinder is arranged in the inner cavity, the cylinder body of the gas cylinder is hinged to the tester platform, and the telescopic shaft of the gas cylinder is hinged to the deflection plate.

[0006] Further, the bottom of the rotary seat is coaxially fixed with a rotary shaft, the rotary shaft is rotatably connected with the deflection base, the top surface of the deflection base is provided with a motor groove, a motor is installed in the motor groove, the output shaft of the motor is connected with a driving gear, a driven gear is sleeved on the rotary shaft, and the driven gear meshes with the driving gear.

[0007] Further, the top of the rotary seat is fixed with two bearing seats, a swing arm shaft is arranged between the two bearing seats, a swing arm is fixedly sleeved on the swing arm shaft, and the swing arm is fixed to the closed end of the U-shaped tooling frame; one of the bearing seats is installed with a stepping motor, and the output shaft of the stepping motor is drivingly connected with the swing arm shaft through a shaft coupling.

[0008] Further, a jacking mechanism is arranged in each of the two limiting grooves of the U-shaped tooling frame, the jacking mechanism comprises a jacking plate, the jacking plate is slidably arranged in the limiting groove, the jacking plate has the freedom of moving along the length direction of the limiting groove, and the jacking plate is used for gradually jacking the integrated circuit board into the detection range of the visual detection mechanism.

[0009] Further, the U-shaped tool holder is provided with a jacking cavity on one side of the limiting groove, a linear groove is formed in the inner wall of the limiting groove and communicates with the jacking cavity, a sliding rail is fixed in the jacking cavity, a lifting block is slidably fitted on the sliding rail, a lifting rod is connected to the jacking plate, the lifting rod passes through the linear groove and is connected to the lifting block, a fixed pulley is rotatably arranged in the jacking cavity, the fixed pulley is close to the U-shaped opening end of the U-shaped tool holder, a driving cavity is arranged below the jacking cavity in the U-shaped tool holder, both jacking cavities communicate with the driving cavity, a driving shaft is rotatably arranged in the driving cavity, each lifting block is provided with a first wire reel, the first wire reel is fixedly sleeved on the driving shaft, a first pull wire is wound on the first wire reel, the first pull wire passes through the fixed pulley and is connected to the top of the lifting block, a winding motor is installed on the U-shaped tool holder, and the output shaft of the winding motor is drivingly connected to the driving shaft.

[0010] Further, each lifting block is provided with a second wire reel, the second wire reel is fixedly sleeved on the driving shaft, a second pull wire is wound on the second wire reel, the second pull wire is connected to the bottom of the lifting block, and the winding direction of the second pull wire on the second wire reel is opposite to that of the first pull wire on the first wire reel.

[0011] Further, the two ends of the tester platform are respectively provided with an inboard conveying belt and an outboard conveying belt, a combined cleaning mechanism is arranged on the tester platform, the combined cleaning mechanism is located below the inboard conveying mechanism, the combined cleaning mechanism comprises a U-shaped seat, a cleaning cam is arranged in the U-shaped opening of the U-shaped seat, cleaning shafts are fixed at both ends of the cleaning cam, the cleaning shafts are rotatably connected to the U-shaped seat, a wiping sponge is wrapped around the far end of the cleaning cam, a cleaning brush is fixed at the near end of the cleaning cam, a cleaning motor is installed on the U-shaped seat, and the output shaft of the cleaning motor is drivingly connected to the cleaning shafts.

[0012] Further, the cleaning cam is provided with a liquid inlet cavity, a plurality of liquid outlet holes are formed in the far end of the cleaning cam and communicate with the liquid inlet cavity, one of the cleaning shafts is hollow and communicates with the liquid inlet cavity, and the end of the cleaning shaft away from the cleaning cam is connected to a liquid inlet pipe through a rotary joint, the liquid inlet pipe is connected to an alcohol tank, and a water pump is connected to the liquid inlet pipe.

[0013] Further, the test instrument platform is fixed with a rack, both ends of the feeding conveying mechanism are horizontally provided with bidirectional screw rods, the bidirectional screw rods are perpendicular to the guide feeding plates, the bidirectional screw rods are rotationally installed on the rack, two screw rod sliders are threadedly sleeved on the bidirectional screw rods, the screw rod sliders are opposite in screw rotation direction, the two guide feeding plates are respectively installed on the two screw rod sliders, and the bidirectional screw rods are sleeved with pulleys, and the pulleys on the two bidirectional screw rods are connected through a synchronous belt transmission.

[0014] The beneficial effects of the present application are: 1, the U-shaped tool holder is close to the feeding conveying mechanism and is deflected to a horizontal state, so that the integrated circuit board is conveyed into the U-shaped tool holder, then the integrated circuit board is deflected to a vertical state through the U-shaped tool holder, so that the welding hole position at the bottom of the circuit board is completely exposed, the deflection of the rotary seat is matched, so that the welding hole position of the circuit board is located in the visual detection range of the visual detection mechanism, the top surface imaging of the welding hole position is completed, the circuit board is deflected left and right through the deflection base, the left and right side imaging of the welding hole position is completed, the circuit board is deflected up and down through the U-shaped tool holder, and the up and down side imaging of the welding hole position is completed, so that the welding point image can be collected from multiple angles, the three-dimensional form of the welding point is completely restored, and the misjudgment problem of "looking down on the qualified but actually existing three-dimensional defects" is completely solved.

[0015] 2, the multiple industrial cameras arranged linearly cover the length range of the integrated circuit board, the circuit board is moved from bottom to top through the jacking plate, so that the height range of the circuit board is gradually moved into the imaging range of the visual detection mechanism, and three-dimensional imaging is performed once for each height, so that full coverage detection of the welding hole position of the circuit board is realized, and the problem of missed detection is avoided.

[0016] 3, the combined cleaning mechanism realizes double cleaning of "cleaning brush removes impurities + alcohol-soaked sponge wipes" through rotation of the cleaning cam: the cleaning brush removes solid impurities such as welding slag and dust on the surface of the circuit board, and the wiping sponge wipes the oil stains, so that the double cleaning can remove more than 98% of the impurities on the surface of the circuit board, avoids the interference of the impurities on the optical imaging, and improves the image recognition accuracy by 25%. The cleaning mechanism and the feeding conveying mechanism are arranged above and below, so that the circuit board conveying rhythm is not affected, and the cleaning effect and the detection efficiency are considered. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 The structure diagram of the optical detection instrument for the welding quality of the integrated circuit board Figure One ; Figure 2 The structure diagram of the optical detection instrument for the welding quality of the integrated circuit board Figure Two ; Figure 3 The structure diagram of the optical detection instrument for the welding quality of the integrated circuit board Figure 2Enlarged view at point B in the middle; Figure 4 This is a schematic diagram of the internal structure of the U-shaped fixture in an optical inspection instrument for the welding quality of integrated circuit boards according to the present invention. Figure 5 for Figure 4 Enlarged view at point D; Figure 6 This is a schematic diagram of the structure of an optical inspection instrument for the welding quality of integrated circuit boards according to the present invention. Figure Three ; Figure 7 for Figure 6 Enlarged view at point C; Figure 8 This is a schematic diagram of the structure of an optical inspection instrument for the welding quality of integrated circuit boards according to the present invention. Figure Four ; Figure 9 This is a schematic diagram of the structure of an optical inspection instrument for the welding quality of integrated circuit boards according to the present invention. Figure Five ; Figure 10 This is a schematic diagram of the internal structure of the cleaning cam in an optical inspection instrument for the welding quality of integrated circuit boards according to the present invention. Figure 11 for Figure 2 Enlarged view at point E in the middle; Figure 12 This is a schematic diagram of the structure of an optical inspection instrument for the welding quality of integrated circuit boards according to the present invention. Figure Six ; Figure 13 This is a front view of the testing platform in an optical inspection instrument for the welding quality of integrated circuit boards according to the present invention. Figure 14 for Figure 13 Sectional view along line AA; In the figure, 1-tester platform, 2-guiding feeding plate, 3-guiding groove, 4-deflection base, 5-rotary seat, 6-U-shaped tool holder, 7-limiting groove, 8-industrial camera, 9-deflection shaft, 10-inner cavity, 11-deflection plate, 12-air cylinder, 13-rotary shaft, 14-motor groove, 15-motor, 16-driving gear, 17-driven gear, 18-bearing seat, 19-swinging arm shaft, 20-swinging arm, 21-stepping motor, 22-lifting plate, 23-lifting cavity, 24-linear groove, 25-slideway, 26-lifting block, 27-lifting rod, 28-fixed pulley, 29-driving cavity, 30-driving shaft, 31-first wire wheel, 32-first pull wire, 33-winding motor, 34-second wire wheel, 35-second pull wire, 36-feeding plate conveyor belt, 37-out plate conveyor belt, 38-U-shaped seat, 39-cleaning cam, 40-cleaning shaft, 41-wiping sponge, 42-cleaning brush, 43-cleaning motor, 44-liquid inlet cavity, 45-liquid outlet hole, 46-liquid inlet pipe, 47-alcohol tank, 48-rack, 49-bi-directional screw rod, 50-screw rod sliding block, 51-belt wheel, 52-synchronous belt, 53-camera mounting beam, 54-first linear driving module, 55-second linear driving module, 56-conveying bottom plate, 57-conveying clamping plate, 58-supporting column, 59-clamping groove. DETAILED DESCRIPTION

[0018] The technical solutions of the present application will be described in further detail below in combination with the drawings, but the protection scope of the present application is not limited to the following description.

[0019] Example One As Figures 1 to 14As shown, an optical detector for integrated circuit board welding quality, including tester platform 1, the tester platform 1 is provided with feeding conveying mechanism, multidirectional tooling mechanism and visual detection mechanism, feeding conveying mechanism includes guide feeding plate 2, two guide feeding plates 2 are arranged in parallel along the direction perpendicular to the conveying direction of integrated circuit board, the conveying space is formed between the two guide feeding plates 2, the side of guide feeding plate 2 close to conveying space is provided with guide groove 3, guide groove 3 is arranged through along the conveying direction of integrated circuit board, multidirectional tooling mechanism includes deflection base 4, rotary seat 5 and U-shaped tooling frame 6, deflection base 4 is rotatably installed on tester platform 1, rotary seat 5 is rotatably installed on deflection base 4, the rotation axis of deflection base 4 and the rotation axis of rotary seat 5 are both vertically arranged, the closed end of U-shaped tooling frame 6 is rotatably installed on rotary seat 5, limit slot 7 is formed on the inner side wall of U-shaped opening of U-shaped tooling frame 6, the rotation axis of U-shaped tooling frame 6 is horizontally arranged, U-shaped tooling frame 6 is deflected to horizontal state, so that feeding conveying mechanism can convey integrated circuit board into limit slot 7, visual detection mechanism is arranged on one side of multidirectional tooling mechanism, visual detection mechanism includes industrial camera 8, a plurality of industrial cameras 8 are linearly installed along the conveying direction of integrated circuit board, U-shaped tooling frame 6 is rotated to vertical state and enters the detection range of visual detection mechanism, the integrated circuit board to be detected for welding point is conveyed to tester platform 1, the two sides of integrated circuit board are respectively located in the guide groove 3 of two guide feeding plates 2, so that integrated circuit board is guided and conveyed, so that integrated circuit board can be accurately conveyed to the tooling position of multidirectional tooling mechanism, the interval of two guide feeding plates 2 makes the middle part of integrated circuit board in exposed state, avoids that components on integrated circuit board are affected in the process of conveying, integrated circuit board is conveyed in the posture that components face upward, the U-shaped opening of U-shaped tooling frame 6 is deflected to horizontal state towards guide feeding plate 2, so that guide groove 3 is flush and communicated with limit slot 7, so that integrated circuit board can be smoothly conveyed onto U-shaped tooling frame 6, then U-shaped tooling frame 6 is deflected to vertical state, so that the welding hole position of the bottom surface of integrated circuit board is completely exposed, then U-shaped tooling frame 6 is deflected towards visual detection mechanism by rotary seat 5, so that the bottom surface of integrated circuit board is in vertical state and faces visual detection mechanism, the length coverage of integrated circuit board is completed by a plurality of industrial cameras 8 linearly arranged in visual detection mechanism, the top imaging of welding hole position is completed, the left and right side imaging of welding hole position is completed by deflection base 4 driving circuit board left and right deflection, the upper and lower side imaging of welding hole position is completed by U-shaped tooling frame 6 driving circuit board up and down deflection, can multi-angle collect welding point image, completely restore the three-dimensional form of welding point. Traditional plane detection cannot capture defects such as welding tin accumulation on welding point side, pin and pad adhesion, welding point edge gap, etc., so that the detection accuracy is improved by more than 40% compared with traditional equipment, the missed detection rate is controlled within 0.3%, and the misjudgment problem of "looking down on qualified but actually existing three-dimensional defects" is completely solved.

[0020] Example Two On the basis of example one, as shown in Figures 1 to 12 The rack 48 is fixed on the tester platform 1, both ends of the feeding conveying mechanism are provided with a bidirectional screw rod 49, the bidirectional screw rod 49 is perpendicular to the guide feeding plate 2, the bidirectional screw rod 49 is rotationally installed on the rack 48, two screw rod sliders 50 are threadedly sleeved on the bidirectional screw rod 49, the screw rod sliders 50 are opposite in screw direction, two guide feeding plates 2 are installed on the screw rod sliders 50, a belt wheel 51 is sleeved on the bidirectional screw rod 49, the belt wheels 51 on the two bidirectional screw rods 49 are drivingly connected through a synchronous belt 52, one of the bidirectional screw rods 49 is connected with a hand wheel, rotating the hand wheel drives one of the bidirectional screw rods 49 to rotate, the bidirectional screw rod 49 drives the belt wheel 51 thereon to rotate, the belt wheel 51 drives the other bidirectional screw rod 49 to rotate through the synchronous belt 52, so that the two bidirectional screw rods 49 rotate synchronously, since the screw rod sliders 50 are opposite in screw direction, the moving directions of the screw rod sliders 50 are opposite, so as to adjust the distance between the two guide feeding plates 2, so as to adapt to integrated circuit boards of different sizes.

[0021] Further, the visual detection mechanism further comprises a camera mounting beam 53, the camera mounting beam 53 is horizontally fixed on the rack 48 of the tester platform 1, the industrial camera 8 is installed on the camera mounting beam 53, a corresponding number of industrial cameras 8 are installed according to the length of the circuit board, so as to complete the length coverage of the integrated circuit board.

[0022] Example Three On the basis of example two, as shown in Figures 1 to 10As shown, the two ends of the tester platform 1 are respectively provided with an incoming plate conveying belt 36 and an outgoing plate conveying belt 37, and the tester platform 1 is provided with a combined cleaning mechanism, which is located below the incoming conveying mechanism, and the combined cleaning mechanism comprises a U-shaped seat 38, a cleaning cam 39 is arranged in the U-shaped opening of the U-shaped seat 38, cleaning shafts 40 are fixed at the two ends of the cleaning cam 39, the cleaning shafts 40 are rotatably connected to the U-shaped seat 38, a wiping sponge 41 is wrapped around the distal end of the cleaning cam 39, a cleaning brush 42 is fixed at the proximal end of the cleaning cam 39, a cleaning motor 43 is installed on the U-shaped seat 38, and the output shaft of the cleaning motor 43 is drivingly connected to the cleaning shafts 40. The integrated circuit board is conveyed into the guide groove 3 of the guide incoming plate 2 through the incoming plate conveying belt 36, the incoming plate conveying belt 36 comprises two incoming lateral conveying belts arranged at intervals, and the two sides of the integrated circuit board are respectively located on the incoming lateral conveying belts, so that the components on the integrated circuit board can be conveyed into the guide incoming plate 2 without being blocked. The integrated circuit board in the guide incoming plate 2 is located within the working range of the combined cleaning mechanism, the cleaning motor 43 drives the cleaning cam 39 to rotate through the cleaning shafts 40, the cleaning brush 42 needs to rely on its own deformation to contact the circuit board to achieve the cleaning effect, and the wiping sponge 41 needs to contact the circuit board to complete the wiping and cleaning. In order to integrate the wiping action and the cleaning action together and drive them through the same power source, the cleaning cam 39 is arranged, the wiping sponge 41 is installed on the distal end of the cleaning cam 39, when the distal end of the cleaning cam 39 carrying the wiping sponge 41 contacts the welding bottom surface of the circuit board, there is enough space between the proximal end of the cleaning cam 39 and the circuit board to install the cleaning brush 42, so that the cleaning brush 42 removes the solid impurities such as welding slag and dust on the surface of the circuit board first, and then the wiping sponge 41 wipes the oil stains, the double cleaning can remove more than 98% of the impurities on the surface of the circuit board, avoids the interference of the impurities on the optical imaging, and improves the image recognition accuracy by 25%.

[0023] Further, the cleaning cam 39 is provided with a liquid inlet cavity 44, a plurality of liquid outlet holes 45 are formed in the distal end of the cleaning cam 39, the liquid outlet holes 45 are communicated with the liquid inlet cavity 44, one of the cleaning shafts 40 is hollow and communicated with the liquid inlet cavity 44, one end of the cleaning shaft 40 away from the cleaning cam 39 is connected with a liquid inlet pipe 46 through a rotary joint, the liquid inlet pipe 46 is connected with an alcohol tank 47, the liquid inlet pipe 46 is connected with a water pump, alcohol in the alcohol tank 47 is pumped into the liquid inlet cavity 44 through the water pump, and then the alcohol is immersed into the wiping sponge 41 through the liquid outlet holes 45, so that the wiping sponge 41 can clean the bottom surface of the circuit board through alcohol.

[0024] Example Four Based on example three, as Figures 1 to 9As shown, the tester platform 1 is also provided with a circuit board clamping and conveying mechanism, which comprises a first linear drive module 54, a second linear drive module 55, a conveying bottom plate 56 and a conveying clamping plate 57. The first linear drive module 54 is installed below the feeding conveying mechanism and is parallel to the guide feeding plate 2. The conveying bottom plate 56 is installed on the slide seat of the first linear drive module 54, and two second linear drive modules 55 are installed on the conveying bottom plate 56 and are perpendicular to the first linear drive module 54. A support column 58 is fixed on the slide seat of the second linear drive module 55, and the conveying clamping plate 57 is fixedly connected to the top of the support column 58. The guide feeding plate 2 is located between the two conveying clamping plates 57, and a clamping groove 59 is formed in the end face of the guide feeding plate 2 close to the conveying clamping plate 57. The clamping groove 59 is communicated with the guide groove 3 and penetrates through the guide feeding plate 2 close to one end of the multi-direction tooling mechanism. The clamping groove 59 is located on the moving path of the conveying clamping plate 57. When the integrated circuit board needs to be conveyed forward, the two second linear drive modules 55 drive the conveying clamping plates 57 on them to move close to the guide feeding plate 2, so that the conveying clamping plates 57 extend into the guide groove 3 through the clamping groove 59 to contact the side surface of the integrated circuit board. The clamping of the circuit board is completed through the joint action of the two conveying clamping plates 57, so that all the integrated circuit boards in the guide feeding plate 2 are clamped at the same time. Then, the conveying clamping plates 57 are driven by the first linear drive module 54 to move close to the multi-direction tooling mechanism, so that the integrated circuit board in the frontmost position is conveyed into the U-shaped tooling frame 6, and the integrated circuit board in the rear position is conveyed to the front by one position. Then, the first linear drive module 54 and the second linear drive module 55 are reset to wait for the next conveying action, so that the integrated circuit boards can be conveyed one by one to the U-shaped tooling frame 6 to realize the automatic conveying of the integrated circuit boards.

[0025] Example Five On the basis of example four, as Figures 1 to 12As shown, the bottom of the deflection base 4 is fixed with a deflection shaft 9, the deflection shaft 9 is rotatably connected with the tester platform 1, the tester platform 1 is formed with an inner cavity 10, the deflection shaft 9 penetrates into the inner cavity 10 and is connected with a deflection plate 11, the inner cavity 10 is provided with a gas cylinder 12, the cylinder body of the gas cylinder 12 is hinged on the tester platform 1, the telescopic shaft of the gas cylinder 12 is hinged on the deflection plate 11, the bottom of the rotary seat 5 is coaxially fixed with a rotary shaft 13, the rotary shaft 13 is rotatably connected with the deflection base 4, the top surface of the deflection base 4 is provided with a motor slot 14, the motor slot 14 is installed with a motor 15, the output shaft of the motor 15 is connected with a driving gear 16, the rotary shaft 13 is sleeved with a driven gear 17, the driven gear 17 engages with the driving gear 16, the top of the rotary seat 5 is fixed with two bearing seats 18, the two bearing seats 18 are provided with a swing arm shaft 19, the swing arm shaft 19 is fixedly sleeved with a swing arm 20, the swing arm 20 is fixed on the closed end of the U-shaped tool holder 6, one of the bearing seats 18 is installed with a stepping motor 21, the output shaft of the stepping motor 21 is drivingly connected with the swing arm shaft 19 through a shaft coupling, the stepping motor 21 drives the swing arm shaft 19 to rotate, the swing arm shaft 19 drives the U-shaped tool holder 6 to rotate through the swing arm 20, first make the U-shaped tool holder 6 deflect to a horizontal state, and the U-shaped opening of the U-shaped tool holder 6 corresponds to the guide feeding plate 2, so that the integrated circuit board in the guide feeding plate 2 can smoothly enter the U-shaped tool holder 6, then the U-shaped tool holder 6 deflects to a vertical state, then the driving gear 16 is driven to rotate by the motor 15, the rotary shaft 13 is driven to rotate by the driven gear 17, the rotary seat 5 is deflected by 90° by the rotary shaft 13, so that the bottom surface of the integrated circuit board is vertically oriented towards the industrial camera 8, then the welding quality of the welding position is detected, during the detection, the deflection plate 11 is deflected left and right by the telescopic shaft of the gas cylinder 12, the deflection plate 11 drives the deflection shaft 9 to deflect left and right, the integrated circuit board is deflected left and right, the left and right side imaging of the welding hole position is completed, the U-shaped tool holder 6 drives the circuit board to deflect up and down by the up and down deflection of the swing arm shaft 19, the up and down side imaging of the welding hole position is completed, the welding spot image can be collected at multiple angles, the three-dimensional shape of the welding spot is completely restored, and the misjudgment problem of "qualified in the top view but actually existing three-dimensional defects" is completely solved, when the detection is completed, the rotary seat 13 continues to drive the integrated circuit board to deflect by 90°, so that the welding bottom surface of the integrated circuit board faces the outboard conveying belt 37, the structure of the outboard conveying belt 37 is the same as that of the inboard conveying belt 36, then the U-shaped tool holder 6 is deflected by 90° by the swing arm shaft 19 to approach the outboard conveying belt 36, so that the U-shaped tool holder 6 is in a horizontal state, and the opening of the U-shaped tool holder 6 faces the outboard conveying belt 36, so that the circuit board on the U-shaped tool holder 6 can be conveyed to the outboard conveying belt 36, then the U-shaped tool holder 6 is reset to receive the next integrated circuit board, then the above detection process is repeated, and the three-dimensional imaging detection work of the integrated circuit board batch welding position is completed.

[0026] Example six On the basis of example five,Figures 1 to 7As shown, the two limiting grooves 7 of the U-shaped tool holder 6 are provided with jacking mechanisms, the jacking mechanism comprises a jacking plate 22, the jacking plate 22 is slidingly arranged in the limiting groove 7, the jacking plate 22 has the freedom of moving along the length direction of the limiting groove 7, the jacking plate 22 is used for gradually jacking the integrated circuit board into the detection range of the visual detection mechanism, the U-shaped tool holder 6 is provided with a jacking cavity 23 on one side of the limiting groove 7, the inner wall of the limiting groove 7 is provided with a linear groove 24 communicating with the jacking cavity 23, the jacking cavity 23 is fixedly provided with a sliding rail 25, the sliding rail 25 is slidingly matched with a lifting block 26, the jacking plate 22 is connected with a lifting rod 27, the lifting rod 27 penetrates through the linear groove 24 and connects the lifting block 26, the jacking cavity 23 is rotationally provided with a fixed pulley 28, the fixed pulley 28 is close to the U-shaped opening end of the U-shaped tool holder 6, the U-shaped tool holder 6 is provided with a driving cavity 29 below the jacking cavity 23, the two jacking cavities 23 are communicated with the driving cavity 29, the driving cavity 29 is rotationally provided with a driving shaft 30, each lifting block 26 is provided with a first wire wheel 31, the first wire wheel 31 is fixedly sleeved on the driving shaft 30, a first pull wire 32 is wound on the first wire wheel 31, the first pull wire 32 passes through the fixed pulley 28 and is connected to the top of the lifting block 26, a winding motor 33 is installed on the U-shaped tool holder 6, the output shaft of the winding motor 33 is drivingly connected with the driving shaft 30, a plurality of linearly arranged industrial cameras 8 can only complete the coverage in the length direction of the circuit board, and cannot complete the coverage in the height direction of the circuit board, if a plurality of industrial cameras 8 are arranged in a rectangular array to cover the entire bottom surface of the circuit board, but when the circuit board is deflected, the welding points on the outside will block the welding points on the inside, and the detection coverage cannot be realized without shielding, therefore, the plurality of industrial cameras 8 are linearly arranged, the jacking plate 22 drives the circuit board to move upward, the height area of the circuit board is gradually exposed in the detection range of the industrial camera 8, so that the linear area at the height is detected each time, the mutual shielding of the welding points can be effectively avoided, the detection area of the circuit board is differentiated and detected by the plurality of industrial cameras 8, the detection range of each industrial camera 8 is reduced, the mutual shielding of the welding points is further avoided, and each welding point can be greatly exposed, and the detection quality is improved.The specific lifting process of the integrated circuit board is as follows: Initially, the lifting plate 22 is at its lowest position. The integrated circuit board is transported into the U-shaped fixture 6 and contacts the lifting plate 22. When the bottom surface of the integrated circuit board is vertically facing the industrial camera 8, the winding motor 33 drives the drive shaft 30 to rotate, causing the first pulley 31 on the drive shaft 30 to wind the first pull wire 32. The first pull wire 32 lifts the lifting block 26 under the action of the fixed pulley 28, so that the lifting block 26 drives the lifting plate 22 to move upward through the lifting rod 27. The lifting plate 22 pushes the integrated circuit board on it to move upward. The lifting plate 22 intermittently pushes the integrated circuit board upward, so that the height area of ​​the integrated circuit board is gradually exposed within the detection range of the industrial camera 8, achieving full coverage of the integrated circuit board. After the detection is completed, the integrated circuit board is pushed onto the output conveyor belt 37 through the lifting plate 22 to achieve automatic output of the integrated circuit board. When the U-shaped fixture 6 is reset, the winding motor 33 drives the drive shaft 30 to reverse, releasing the first pull wire 32 to reset the lifting plate 22.

[0027] Example 7 In Example 6, as Figures 1 to 7 As shown, when the drive shaft 30 reverses and releases the first pull cable 32, the lifting plate 22 moves downward to reset under its own weight. However, due to friction, the lifting plate 22 cannot reset precisely, which can easily lead to reset failure. Therefore, based on embodiment six, each lifting block 26 is equipped with a second pulley 34. The second pulley 34 is fixedly mounted on the drive shaft 30, and a second pull cable 35 is wound on the second pulley 34. The second pull cable 35 is connected to the bottom of the lifting block 26. The winding direction of the second pull cable 35 on the second pulley 34 is the same as that of the first pull cable 32 on the first pulley 31. The winding directions are opposite, so that when the drive shaft 30 winds up the first pull wire 32, it simultaneously releases the second pull wire 35, and when the drive shaft 30 releases the first pull wire 32, it simultaneously winds up the second pull wire 35. When the lifting plate 22 moves upward, the first pull wire 32 pulls the lifting plate 22 upward, and the second pull wire 34 releases the second pull wire 35 to adapt to the movement of the lifting plate 22. When the lifting plate 22 moves downward to reset, the second pull wire 35 pulls the lifting plate 22 downward, and the first pull wire 31 releases the first pull wire 32 to adapt to the movement of the lifting plate 22, so that the lifting plate 22 can be accurately reset.

Claims

1. An optical inspection instrument for the welding quality of integrated circuit boards, comprising a testing platform (1), characterized in that, The testing platform (1) is equipped with a feeding conveying mechanism, a multi-directional tooling mechanism, and a visual inspection mechanism. The feeding conveying mechanism includes a guide feeding plate (2). Two guide feeding plates (2) are arranged parallel to each other along the conveying direction perpendicular to the integrated circuit board, forming a conveying space between the two guide feeding plates (2). A guide groove (3) is opened on the side of the guide feeding plate (2) near the conveying space. The guide groove (3) is arranged through the integrated circuit board along the conveying direction. The multi-directional tooling mechanism includes a deflection base (4), a rotary seat (5), and a U-shaped tooling frame (6). The deflection base (4) is rotatably mounted on the testing platform (1), and the rotary seat (5) is rotatably mounted on the deflection base (4). The rotation axis of the seat (4) and the rotation axis of the rotary seat (5) are both set vertically. The closed end of the U-shaped tooling frame (6) is rotatably mounted on the rotary seat (5). The U-shaped tooling frame (6) has a limiting groove (7) on the inner side wall of the U-shaped opening. The rotation axis of the U-shaped tooling frame (6) is set horizontally. The U-shaped tooling frame (6) is deflected to a horizontal state so that the feeding conveying mechanism can convey the integrated circuit board into the limiting groove (7). The vision inspection mechanism is arranged on one side of the multi-directional tooling mechanism. The vision inspection mechanism includes an industrial camera (8). Multiple industrial cameras (8) are linearly installed along the conveying direction of the integrated circuit board. The U-shaped tooling frame (6) is rotated to a vertical state and enters the detection range of the vision inspection mechanism.

2. The optical inspection instrument for the welding quality of integrated circuit boards according to claim 1, characterized in that, The bottom of the deflection base (4) is fixed with a deflection shaft (9), which is rotatably connected to the tester platform (1). An inner cavity (10) is formed inside the tester platform (1). The deflection shaft (9) passes through the inner cavity (10) and is connected to a deflection plate (11). A cylinder (12) is provided inside the inner cavity (10). The cylinder body of the cylinder (12) is hinged to the tester platform (1), and the telescopic shaft of the cylinder (12) is hinged to the deflection plate (11).

3. The optical inspection instrument for the welding quality of integrated circuit boards according to claim 1, characterized in that, The bottom of the rotary seat (5) is coaxially fixed with a rotary shaft (13), which is rotatably connected to the deflection base (4). The top surface of the deflection base (4) is provided with a motor slot (14), and a motor (15) is installed in the motor slot (14). The output shaft of the motor (15) is connected to a drive gear (16), and a driven gear (17) is fitted on the rotary shaft (13). The driven gear (17) meshes with the drive gear (16).

4. The optical inspection instrument for the welding quality of integrated circuit boards according to claim 1, characterized in that, Two bearing seats (18) are fixed on the top of the rotary seat (5). A swing arm shaft (19) is provided between the two bearing seats (18). A swing arm (20) is fixedly sleeved on the swing arm shaft (19). The swing arm (20) is fixed to the closed end of the U-shaped tooling frame (6). A stepper motor (21) is installed on one of the bearing seats (18). The output shaft of the stepper motor (21) is connected to the swing arm shaft (19) through a coupling.

5. The optical inspection instrument for the welding quality of integrated circuit boards according to claim 1, characterized in that, The U-shaped fixture (6) is provided with a lifting mechanism in each of the two limiting grooves (7). The lifting mechanism includes a lifting plate (22), which is slidably disposed in the limiting groove (7). The lifting plate (22) has the freedom to move along the length of the limiting groove (7). The lifting plate (22) is used to gradually push the integrated circuit board into the detection range of the visual inspection mechanism.

6. The optical inspection instrument for the welding quality of integrated circuit boards according to claim 5, characterized in that, The U-shaped fixture (6) has a lifting cavity (23) on one side of the limiting groove (7). The inner wall of the limiting groove (7) has a linear groove (24) that connects to the lifting cavity (23). A slide rail (25) is fixed inside the lifting cavity (23). A lifting block (26) is slidably fitted on the slide rail (25). A lifting rod (27) is connected to the lifting plate (22). The lifting rod (27) passes through the linear groove (24) and connects to the lifting block (26). A fixed pulley (28) is rotatably installed inside the lifting cavity (23). The fixed pulley (28) is close to the U-shaped opening end of the U-shaped fixture (6). The U-shaped fixture (6) is lifted inside the lifting cavity. Below the cavity (23) is a drive cavity (29), and both lifting cavities (23) are connected to the drive cavity (29). A drive shaft (30) is rotatably installed inside the drive cavity (29). Each lifting block (26) is equipped with a first thread wheel (31). The first thread wheel (31) is fixedly mounted on the drive shaft (30). A first pull wire (32) is wound on the first thread wheel (31). The first pull wire (32) passes around the fixed pulley (28) and is connected to the top of the lifting block (26). A winding motor (33) is installed on the U-shaped tooling frame (6). The output shaft of the winding motor (33) is connected to the drive shaft (30).

7. The optical inspection instrument for the welding quality of integrated circuit boards according to claim 6, characterized in that, Each of the lifting blocks (26) is equipped with a second spool (34), which is fixedly mounted on the drive shaft (30). A second pull wire (35) is wound on the second spool (34), and the second pull wire (35) is connected to the bottom of the lifting block (26). The winding direction of the second pull wire (35) on the second spool (34) is opposite to the winding direction of the first pull wire (32) on the first spool (31).

8. The optical inspection instrument for the welding quality of integrated circuit boards according to claim 1, characterized in that, The tester platform (1) is provided with an infeed conveyor belt (36) and an outfeed conveyor belt (37) at both ends. The tester platform (1) is provided with a combined cleaning mechanism located below the feeding conveyor mechanism. The combined cleaning mechanism includes a U-shaped seat (38). A cleaning cam (39) is provided in the U-shaped opening of the U-shaped seat (38). A cleaning shaft (40) is fixed at both ends of the cleaning cam (39). The cleaning shaft (40) is rotatably connected to the U-shaped seat (38). A wiping sponge (41) is wrapped around the distal end of the cleaning cam (39). A cleaning brush (42) is fixed at the proximal end of the cleaning cam (39). A cleaning motor (43) is installed on the U-shaped seat (38). The output shaft of the cleaning motor (43) is connected to the cleaning shaft (40).

9. An optical inspection instrument for the welding quality of integrated circuit boards according to claim 8, characterized in that, The cleaning cam (39) is provided with a liquid inlet chamber (44). The distal end of the cleaning cam (39) is provided with a plurality of liquid outlet holes (45). The liquid outlet holes (45) are connected to the liquid inlet chamber (44). One of the cleaning shafts (40) is hollow and connected to the liquid inlet chamber (44). The end of the cleaning shaft (40) away from the cleaning cam (39) is connected to the liquid inlet pipe (46) through a rotary joint. The liquid inlet pipe (46) is connected to the alcohol tank (47). The liquid inlet pipe (46) is connected to a water pump.

10. An optical inspection instrument for the welding quality of integrated circuit boards according to claim 1, characterized in that, The tester platform (1) is fixed with a frame (48). Both ends of the feeding conveying mechanism are horizontally provided with bidirectional threaded screws (49). The bidirectional threaded screws (49) are perpendicular to the guide feed plate (2). The bidirectional threaded screws (49) are rotatably mounted on the frame (48). Two screw sliders (50) are threadedly fitted on the bidirectional threaded screws (49). The threads of the two screw sliders (50) are opposite. The two guide feed plates (2) are respectively mounted on the two screw sliders (50). A pulley (51) is fitted on the bidirectional threaded screws (49). The pulleys (51) on the two bidirectional threaded screws (49) are connected by a synchronous belt (52).

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