Failure positioning method, device and equipment for electroplating copper, storage medium and program product

Abstract

The invention relates to an electrocoppering failure positioning method and device, equipment, a storage medium and a program product. The method comprises the following steps: acquiring a to-be-detected invalid electroplating copper sample, a first infrared surface distribution image of a first structural layer on the to-be-detected invalid electroplating copper sample, and a plurality of first amplitude images under a plurality of phase angles; positioning a fault point according to the first infrared surface distribution image to obtain two-dimensional coordinate information of the fault point on the invalid electroplating copper sample; acquiring a second infrared surface distribution image of each second structure layer on the reference test board and a plurality of second amplitude images under a plurality of phase angles; determining depth information of the fault point according to the plurality of first amplitude images and the plurality of second amplitude images; determining three-dimensional coordinate information of the fault point according to the depth information of the fault point and the two-dimensional coordinate information of the fault point; according to the method, the three-dimensional position information of the fault point is determined on the premise that the structure of the failed electroplating copper sample is not damaged, and the failure analysis efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electroplating copper, and in particular to a failure positioning method, device, equipment, storage medium and program product for electroplating copper. BACKGROUND

[0002] High-end electroplating copper technology is one of the key technologies in the manufacturing of high-density interconnect printed circuit boards (HDI PCBs), substrate-like PCBs (SLP), integrated circuit substrates (ICS), panel-level packaging (PLP), etc., and is used to realize high-density and fine interconnection between different levels of printed circuit boards (PCB). Electroplated through holes are typical electroplated copper structures that penetrate through the entire substrate and connect the upper and lower structures of the electronic substrate. Defects in the plated copper layer will directly affect the realization and reliability of the electronic substrate, device and even the entire system. Therefore, effective fault detection of the electroplated copper layer is needed. However, in the prior art, the electroplated copper layer is generally manually disassembled or decomposed, and then based on maintenance experience, the structure of the electroplated copper layer is analyzed and judged to determine the fault location and fault type.

[0003] However, the above method of manually disassembling or decomposing the electroplated copper layer requires destroying the structure of the electroplated copper layer, resulting in high detection costs. SUMMARY

[0004] Therefore, it is necessary to provide a failure positioning method, device, equipment, storage medium and program product for electroplating copper to solve the above technical problems.

[0005] In a first aspect, the present application provides a failure positioning method for electroplating copper, comprising:

[0006] obtaining a failure electroplated copper sample to be detected and a first infrared surface distribution image of a first structure layer on the failure electroplated copper sample, and a plurality of first amplitude images corresponding to a plurality of phase angles of the first structure layer; the first infrared surface distribution image represents the distribution of a plurality of hot spots;

[0007] locating the fault point according to the first infrared surface distribution image to obtain two-dimensional coordinate information of the fault point on the failure electroplated copper sample;

[0008] acquire a second infrared surface distribution image of each second structure layer on the reference test board and a plurality of second amplitude images of the plurality of second structure layers under a plurality of phase angles corresponding to the second structure layers; the second infrared surface distribution image represents the distribution of the plurality of hot spots;

[0009] determine the depth information of the fault point according to the plurality of first amplitude images and the plurality of second amplitude images;

[0010] determine the three-dimensional coordinate information of the fault point according to the depth information of the fault point and the two-dimensional coordinate information of the fault point.

[0011] In one embodiment, the depth information of the fault point is determined according to the plurality of first amplitude images and the plurality of second amplitude images, comprising:

[0012] numerical comparison is performed on the first characteristic phase in the plurality of first amplitude images and the plurality of second characteristic phases in the plurality of second amplitude images to determine a target second characteristic phase of the plurality of second amplitude images;

[0013] determine the depth information of the fault point according to the layer information corresponding to the second infrared surface image where the target second characteristic phase is located.

[0014] In one embodiment, numerical comparison is performed on the first characteristic phase in the plurality of first amplitude images and the plurality of second characteristic phases in the plurality of second amplitude images to determine a target second characteristic phase of the plurality of second amplitude images, comprising:

[0015] determine the phase difference between the plurality of first amplitude images to obtain the first characteristic phase;

[0016] determine the phase difference between the plurality of second amplitude images to obtain the plurality of second characteristic phases;

[0017] numerical comparison is performed on the plurality of second characteristic phases and the first characteristic phase to determine the target second characteristic phase in the plurality of second amplitude images.

[0018] In one embodiment, the two-dimensional coordinate information of the fault point on the failed electroplated copper sample is determined according to the first infrared surface distribution image, comprising:

[0019] determine the hot spot on the first infrared surface distribution image that meets the preset hot spot condition;

[0020] determine the two-dimensional coordinate information of the fault point according to the image region where the hot spot meeting the preset hot spot condition is located.

[0021] In one embodiment, the two-dimensional coordinate information of the fault point is determined according to the image region where the hot spot meeting the preset hot spot condition is located, comprising:

[0022] A center pixel point of the image region is determined, and two-dimensional coordinate information of the fault point is determined according to a pixel coordinate of the center pixel point on the first infrared surface distribution image.

[0023] In one of the embodiments, the first amplitude images corresponding to the plurality of phase angles of the first structure layer on the failed electroplated copper sample are acquired, including:

[0024] The excitation frequency of the lock-in thermography device is changed, and the image data of the first structure layer is collected at the plurality of phase angles respectively; the plurality of phase angles include to with an interval of ;

[0025] According to the image data of the first structure layer collected at each phase angle, a plurality of first amplitude images at each phase angle are constructed.

[0026] In one of the embodiments, the failed electroplated copper sample to be detected and the failed electroplated copper sample are acquired, including:

[0027] A plurality of experimental substrates are acquired, and the thermal reliability verification and the fault excitation test are performed on each experimental substrate by using the environmental test chamber, so that the plurality of experimental substrates form a plurality of failed electroplated copper samples with failure; the experimental conditions of the thermal reliability verification include a preset temperature range; and the excitation number corresponding to the fault excitation test is a preset excitation number.

[0028] One of the failed electroplated copper samples with failure is selected from the plurality of failed electroplated copper samples with failure as the failed electroplated copper sample to be detected.

[0029] In one of the embodiments, according to the depth information of the fault point and the two-dimensional coordinate information of the fault point, the three-dimensional coordinate information of the fault point is determined, including:

[0030] According to the three-dimensional coordinate information of the fault point, the failed electroplated copper sample to be detected is micro-sectioned to obtain a microscopic image corresponding to the fault point;

[0031] The microscopic image of the fault point is analyzed to obtain the failure mechanism and the failure cause of the fault point.

[0032] In a second aspect, the present application also provides a failed electroplated copper positioning device, including:

[0033] The first structure layer module is configured to acquire a first infrared surface distribution image of a first structure layer on a failed electroplated copper sample to be detected and a failed electroplated copper sample, and a plurality of first amplitude images corresponding to a plurality of phase angles of the first structure layer; the first infrared surface distribution image represents the distribution of a plurality of hot spots.

[0034] A two-dimensional coordinate information module is configured to locate the fault points according to the first infrared surface distribution image, and obtain two-dimensional coordinate information of the fault points on the failed electroplated copper sample.

[0035] A second structure layer module is configured to obtain second infrared surface distribution images of each second structure layer on the reference test board and a plurality of second amplitude images of the second structure layer under a plurality of phase angles corresponding to the second structure layer; the second infrared surface distribution image represents the distribution of the plurality of hot spots.

[0036] A depth information module is configured to determine the depth information of the fault points according to the plurality of first amplitude images and the plurality of second amplitude images.

[0037] A three-dimensional coordinate information module is configured to determine the three-dimensional coordinate information of the fault points according to the depth information of the fault points and the two-dimensional coordinate information of the fault points.

[0038] In a third aspect, the present application further provides a computer device, comprising a memory and a processor, the memory stores a computer program, and the processor realizes the following steps when executing the computer program:

[0039] Obtaining a failed electroplated copper sample to be detected and a first infrared surface distribution image of a first structure layer on the failed electroplated copper sample, and a plurality of first amplitude images of the first structure layer under a plurality of phase angles corresponding to the first structure layer; the first infrared surface distribution image represents the distribution of the plurality of hot spots.

[0040] Locating the fault points according to the first infrared surface distribution image, and obtaining two-dimensional coordinate information of the fault points on the failed electroplated copper sample.

[0041] Obtaining second infrared surface distribution images of each second structure layer on the reference test board and a plurality of second amplitude images of each second structure layer under a plurality of phase angles corresponding to the second structure layer; the second infrared surface distribution image represents the distribution of the plurality of hot spots.

[0042] Determining the depth information of the fault points according to the plurality of first amplitude images and the plurality of second amplitude images.

[0043] Determining the three-dimensional coordinate information of the fault points according to the depth information of the fault points and the two-dimensional coordinate information of the fault points.

[0044] In a fourth aspect, the present application further provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to realize the following steps:

[0045] Obtaining a failed electroplated copper sample to be detected and a first infrared surface distribution image of a first structure layer on the failed electroplated copper sample, and a plurality of first amplitude images of the first structure layer under a plurality of phase angles corresponding to the first structure layer; the first infrared surface distribution image represents the distribution of the plurality of hot spots.

[0046] According to the first infrared surface distribution image, fault point positioning is performed to obtain two-dimensional coordinate information of the fault point on the failed electroplated copper sample;

[0047] The second infrared surface distribution image of each second structure layer on the reference test board and a plurality of second amplitude images corresponding to a plurality of phase angles of each second structure layer are obtained; the second infrared surface distribution image represents the distribution of the plurality of hot spots;

[0048] According to the plurality of first amplitude images and the plurality of second amplitude images, the depth information of the fault point is determined;

[0049] According to the depth information of the fault point and the two-dimensional coordinate information of the fault point, the three-dimensional coordinate information of the fault point is determined.

[0050] In a fifth aspect, the present application further provides a computer program product comprising a computer program which, when executed by a processor, implements the following steps:

[0051] The first infrared surface distribution image of the failed electroplated copper sample to be detected and the first structure layer on the failed electroplated copper sample, and a plurality of first amplitude images corresponding to a plurality of phase angles of the first structure layer are obtained; the first infrared surface distribution image represents the distribution of the plurality of hot spots;

[0052] According to the first infrared surface distribution image, fault point positioning is performed to obtain two-dimensional coordinate information of the fault point on the failed electroplated copper sample;

[0053] The second infrared surface distribution image of each second structure layer on the reference test board and a plurality of second amplitude images corresponding to a plurality of phase angles of each second structure layer are obtained; the second infrared surface distribution image represents the distribution of the plurality of hot spots;

[0054] According to the plurality of first amplitude images and the plurality of second amplitude images, the depth information of the fault point is determined;

[0055] According to the depth information of the fault point and the two-dimensional coordinate information of the fault point, the three-dimensional coordinate information of the fault point is determined.

[0056] The failure positioning method, device, equipment, readable storage medium and program product of electroplated copper provided by the application, by acquiring the first infrared surface distribution image of the first structure layer on the failure electroplated copper sample to be detected and the first amplitude image of the first structure layer corresponding to multiple phase angles, the first infrared surface distribution image representing the distribution of multiple hot spots, positioning the fault point according to the first infrared surface distribution image to obtain the two-dimensional coordinate information of the fault point on the failure electroplated copper sample, acquiring the second infrared surface distribution image of each second structure layer on the reference test board and the second amplitude image of each second structure layer corresponding to multiple phase angles, the second infrared surface distribution image representing the distribution of multiple hot spots, determining the depth information of the fault point according to the first amplitude image and the second amplitude image, and determining the three-dimensional coordinate information of the fault point according to the depth information of the fault point and the two-dimensional coordinate information of the fault point, the method realizes accurate positioning of the fault point in the failure electroplated copper sample to be detected, the horizontal two-dimensional coordinate of the fault point is determined by using the first infrared surface distribution image of the failure electroplated copper sample, the depth information of the fault point is obtained by using the amplitude image of the failure electroplated copper sample and the amplitude image of the reference test board, the three-dimensional coordinate information of the fault point is determined by combining the horizontal two-dimensional coordinate and the depth information, so that the three-dimensional position information of the fault point can be determined without damaging the structure of the failure electroplated copper sample, and the efficiency of failure analysis is improved. BRIEF DESCRIPTION OF DRAWINGS

[0057] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the description of the embodiments of the present application or the related art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other related drawings can be obtained by those skilled in the art without creating any inventive labor.

[0058] Figure 1 The application environment diagram of the failure positioning method of electroplated copper in an embodiment;

[0059] Figure 2 The flowchart of the failure positioning method of electroplated copper in an embodiment;

[0060] Figure 3 The reference test board structure diagram of the failure positioning method of electroplated copper in an embodiment;

[0061] Figure 4 The flowchart of the failure positioning method of electroplated copper in an embodiment;

[0062] Figure 5 The flowchart of the failure positioning method of electroplated copper in an embodiment;

[0063] Figure 6 Figure 4 is a flowchart of a failure location method for electroplating copper in an embodiment;

[0064] Figure 7 Figure 5 is a flowchart of a failure location method for electroplating copper in an embodiment;

[0065] Figure 8 Figure 6 is a flowchart of a failure location method for electroplating copper in an embodiment;

[0066] Figure 9 Figure 7 is a flowchart of a failure location method for electroplating copper in an embodiment;

[0067] Figure 10 Figure 8 is a flowchart of a failure location method for electroplating copper in an embodiment;

[0068] Figure 11 Figure 9 is a flowchart of a failure location method for electroplating copper in an embodiment;

[0069] Figure 12 Figure 10 is a block diagram of a failure location device for electroplating copper in an embodiment;

[0070] Figure 13 Figure 11 is a block diagram of a failure location device for electroplating copper in an embodiment;

[0071] Figure 14 Figure 12 is a block diagram of a failure location device for electroplating copper in an embodiment. DETAILED DESCRIPTION

[0072] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0073] It should be noted that the terms "first", "second", and the like used herein can be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from the second element. The terms "include" and "have" and any variations thereof used herein are intended to cover non-exclusive inclusion. The term "multiple" used herein refers to two or more. The term "and / or" used herein refers to one of the options or any combination of multiple options.

[0074] High-end electroplating copper technology is one of the key technologies in the manufacture of high-density interconnect printed circuit board (HDI PCB), substrate-like PCB (SLP), integrated circuit substrate (ICS), panel-level packaging (PLP) and the like for high-density fine circuit patterns between different levels of printed circuit board (PCB) to realize high-reliability interconnection. Electroplated via is a typical electroplated copper structure that penetrates through the entire substrate to connect the upper and lower structures of the electronic substrate. The plated copper layer defect will directly affect the realization and reliability application of the electronic substrate, device and even the entire system function. Therefore, effective fault detection needs to be performed on the electroplated copper layer. However, in the prior art, the electroplated copper layer plate is generally manually disassembled or decomposed, and based on the maintenance experience, the structure of the electroplated copper layer plate is analyzed and judged to determine the fault position and fault type.

[0075] However, the above method of manually disassembling or decomposing the electroplated copper layer plate needs to destroy the structure of the electroplated copper layer plate, resulting in high detection cost.

[0076] In view of the above technical problems, the embodiments of the present application provide a failure positioning method of electroplated copper. The following embodiments will specifically illustrate the failure positioning method of electroplated copper.

[0077] The failure positioning method of electroplated copper provided by the embodiments of the present application can be applied to a failure positioning system as shown in Figure 1 The infrared camera 103 is used to collect the infrared surface distribution images of the failed electroplated copper sample 101 and the reference test plate 102, and transmit the obtained infrared surface distribution images of the failed electroplated copper sample 101 and the reference test plate 102 to the failure positioning system 104. The failure positioning system 104 analyzes and processes the data contained in the images to determine the defect position of the failed electroplated copper sample.

[0078] Those skilled in the art can understand that Figure 1 The structure shown in the figure is only a block diagram of part of the structure related to the scheme of the present application, and does not constitute a limitation on the failure positioning system of electroplated copper to which the scheme of the present application is applied. The specific failure positioning system can include more or fewer components than those shown in the figure, or combine certain components, or have a different component arrangement.

[0079] In an exemplary embodiment, as Figure 2As shown, a failure location method for electroplated copper is provided, and the method is applied to Figure 1 a failure location system for electroplated copper in the art, including:

[0080] S201, obtaining a failure electroplated copper sample to be detected and a first infrared surface distribution image of a first structure layer on the failure electroplated copper sample, and a plurality of first amplitude images of the first structure layer under a plurality of phase angles; the first infrared surface distribution image represents the distribution of a plurality of hot spots.

[0081] Wherein, the first structure layer refers to the structure layer of the failure electroplated copper sample; the infrared surface distribution image refers to the thermal amplitude distribution map, which is a two-dimensional temperature distribution map formed by the infrared camera capturing the infrared energy signal radiated from the surface of the electroplated copper structure after heating, which represents the change in thermal radiation intensity caused by defects; the first amplitude image refers to a two-dimensional image obtained by lock-in thermal technology, which can reflect the internal thermal wave transmission delay characteristics of the failure electroplated copper sample, and represents the thermal wave phase delay caused by defects; the hot spot refers to the temperature abnormal point of the electroplated copper structure during reliability testing, which is caused by local defects (such as hole copper fracture and inner layer separation) leading to abnormal resistance increase, and the temperature of the region with local defects is significantly higher than that of the surrounding normal region after joule heating effect.

[0082] In the embodiments of the present application, the electroplated copper samples are first screened, and the electroplated copper samples with structures such as electroplated through holes, electroplated blind holes, and buried holes are selected, and all electroplated copper samples need to adopt a daisy chain topology (internal or external interconnection), that is, a plurality of interconnection structures are connected in series through a continuous conductive path to form a loop that can be powered on. The electroplated copper sample is placed in a test environment to simulate extreme temperature changes in actual applications to stimulate potential failure factors (such as hole copper fracture and inner layer separation). Then, the electroplated copper sample with potential defects is screened to obtain the failure electroplated copper sample to be detected, and the failure electroplated copper sample is powered on and heated. The infrared camera is used to collect the infrared surface distribution image of the structure layer of the failure electroplated copper sample, that is, the first infrared surface distribution image, wherein the first infrared surface distribution image can represent the distribution of a plurality of hot spots; and the thermal radiation amplitude image sequence under different phase angles (such as to , interval ) is collected, that is, a plurality of first amplitude images.

[0083] S202, locating the fault point according to the first infrared surface distribution image to obtain the two-dimensional coordinate information of the fault point on the failure electroplated copper sample.

[0084] In the embodiment of the present application, the failure positioning system of electroplated copper uses an infrared camera to collect the infrared surface distribution image of the structure layer of the failed electroplated copper sample, i.e., the first infrared surface distribution image, and outputs the original infrared surface distribution image from the infrared camera to represent temperature differences in color or gray scale gradient, for example, red represents high temperature and blue represents low temperature. The abnormal high temperature area can be directly shown as a bright spot or a high-contrast area in the image. The failure positioning system of electroplated copper can determine the specific coordinates of the hot spot center on the surface of the failed electroplated copper sample according to the spatial resolution and pixel coordinates of the surface thermal distribution image, i.e., obtain the two-dimensional coordinate information of the fault point on the failed electroplated copper sample.

[0085] S203, acquiring a second infrared surface distribution image of each second structure layer on the reference test board and a plurality of second amplitude images corresponding to a plurality of phase angles of each second structure layer; the second infrared surface distribution image represents the distribution of a plurality of hot spots.

[0086] In the embodiment of the present application, the second structure layer refers to the structure layer of the reference test board; the infrared surface distribution image refers to a thermal amplitude distribution map, which is a two-dimensional temperature distribution map formed by capturing the infrared energy signal radiated from the surface of the electroplated copper reference test board after being powered and heated by an infrared camera; and the second amplitude image refers to a two-dimensional image obtained by a phase-locked thermal technology, which can reflect the internal thermal wave transmission delay characteristics of the electroplated copper reference test board.

[0087] In the embodiment of the present application, the structure of the reference test board adopts a multi-layer structure (≥3 layers), each layer of test circuit needs to be electrically isolated, without interconnection, i.e., independent of each other, and the top layer structure is designed to have independent test ports, each layer of port is connected to only a single layer of test circuit, to ensure independent acquisition of each layer of signal. For example, three layers of structure need to be configured with three independent test reference boards, and each layer needs to be internally embedded with an array of holes to form a standard resistance structure. The resistance value of the array of holes needs to be close to the resistance of the actual failed electroplated copper sample to be detected, so that the reference test structure is closer to the structure of the actual failed electroplated copper sample to be detected, as shown in Figure 3 The aperture range of the array of holes is , and the height (thickness) is (Covering typical PCB layer thickness range); and the trace width of the horizontal connecting metal lines on the reference test board needs to be greater than or equal to twice the diameter of the buried via to avoid resistance interference, and the center of the buried via must be strictly aligned with the center of the horizontal line to ensure consistent heat conduction path. A probe of a phase-locked loop thermal imaging device is connected to an independent port of the top target layer of the reference test board, and a periodic alternating current is applied to form a test loop (testing only one layer at a time). Infrared surface distribution images of each structural layer on the reference test board are obtained, i.e., the second infrared surface distribution images of each second structural layer on the reference test board are obtained. For example, if the reference test board has three layers, three infrared surface distribution images of the reference test board are generated. Then, for each layer, multiple phase angles are set at a fixed phase-locked frequency to collect thermal radiation data. For example, according to... arrive ,interval Collect thermal radiation data; collect one thermal amplitude distribution map for each phase angle (a total of 12 images, i.e., 12 second amplitude images).

[0088] S204, Determine the depth information of the fault point based on multiple first-value images and multiple second-value images.

[0089] In this embodiment, the failure location system for electroplated copper utilizes a phase-locked loop thermal imaging device to obtain infrared surface distribution images of each structural layer on a reference test board, specifically, to acquire second infrared surface distribution images of each second structural layer on the reference test board. For example, if the reference test board has three layers, then three infrared surface distribution images of the reference test board are generated. Furthermore, thermal radiation data is acquired by combining multiple phase angles, for example, according to... arrive ,interval The system collects thermal radiation data; one amplitude image is acquired for each phase angle (a total of 12 amplitude images). Multiple infrared surface distribution images, multiple thermal amplitude distribution maps corresponding to multiple phase angles, and phase difference information of the reference test board obtained by analyzing multiple thermal amplitude maps are used to identify characteristic phases. These are stored independently according to the test layer to construct a phase difference layered database. The failure location system for electroplated copper also acquires multiple surface thermal distribution images of the failed electroplated copper sample at the same phase angle as the reference test board. For example, the reference test board is arranged according to... arrive ,interval Thermal radiation data was collected; one amplitude image was acquired for each phase angle (a total of 12 amplitude images). The failed electroplated copper samples were also collected according to this method. arrive ,interval Thermal radiation data was collected; one amplitude image was collected for each phase angle (a total of 12 amplitude images), and the phase information was compared sequentially to obtain the depth information of the fault point.

[0090] S205, determine three-dimensional coordinate information of the fault point according to the depth information of the fault point and the two-dimensional coordinate information of the fault point.

[0091] In the embodiments of the present application, the failure positioning system of electroplated copper obtains the horizontal position of the fault point by using the surface thermal distribution image of the structure layer of the failed electroplated copper sample, and then obtains the depth information of the fault point by comparing the phase difference between the failed electroplated copper sample and the reference test board. The three-dimensional coordinate information of the fault point can be determined by combining the horizontal position and the depth information of the fault point.

[0092] The above-mentioned failure positioning method, device, equipment, readable storage medium and program product of electroplated copper, by obtaining the first infrared surface distribution image of the first structure layer of the failed electroplated copper sample to be detected and the failed electroplated copper sample, and a plurality of first amplitude images corresponding to a plurality of phase angles of the first structure layer; the first infrared surface distribution image represents the distribution of a plurality of hot spots; the fault point positioning is performed according to the first infrared surface distribution image, and the two-dimensional coordinate information of the fault point on the failed electroplated copper sample is obtained; the second infrared surface distribution image of each second structure layer on the reference test board and a plurality of second amplitude images corresponding to a plurality of phase angles of each second structure layer are obtained; the second infrared surface distribution image represents the distribution of a plurality of hot spots; the depth information of the fault point is determined according to the plurality of first amplitude images and the plurality of second amplitude images; the three-dimensional coordinate information of the fault point is determined according to the depth information of the fault point and the two-dimensional coordinate information of the fault point; the above-mentioned method realizes the accurate positioning of the fault point in the failed electroplated copper sample to be detected, determines the horizontal two-dimensional coordinate of the fault point by using the first infrared surface distribution image of the failed electroplated copper sample, obtains the depth information of the fault point by using the amplitude image of the failed electroplated copper sample and the amplitude image of the reference test board, and determines the three-dimensional coordinate information of the fault point by combining the horizontal two-dimensional coordinate and the depth information. Therefore, the determination of the three-dimensional position information of the fault point can be completed without damaging the structure of the failed electroplated copper sample, and the efficiency of failure analysis is improved.

[0093] In an exemplary embodiment, the "plurality of first amplitude images and plurality of second amplitude images, determine the depth information of the fault point" in S204 includes: Figure 4

[0094] S301, compare the first characteristic phase in the plurality of first amplitude images with the second characteristic phase in the plurality of second amplitude images, and determine the target second characteristic phase of the plurality of second amplitude images.

[0095] In the embodiments of the present application, the failure positioning system of electroplated copper passes current through the failed electroplated copper sample, captures the temperature change of the surface of the failed electroplated copper sample by using an infrared camera, and collects the temperature change of the surface of the failed electroplated copper sample at different phase angles (such as to​ , interval ) to obtain a plurality of amplitude images, i.e., a plurality of first amplitude images, and perform processing and analysis on the plurality of first amplitude images, and take the phase with the most obvious feature information in the plurality of first amplitude images as a first feature phase. The failure positioning system of electroplated copper also collects a plurality of amplitude images, i.e., a plurality of second amplitude images, at the same phase angle (such as to to , interval ) of each feature layer of the reference test board, and performs processing and analysis on the plurality of second amplitude images to obtain a plurality of second feature phases corresponding to the most obvious feature information of each feature layer. The first feature phase is compared with the plurality of second feature phases by a phase difference threshold value, and the second feature phase with the closest difference in comparison result value is taken as a target second feature phase, i.e., the target second feature phase of the plurality of second amplitude images is determined. For example, taking the reference test board with three layers as an example, the plurality of first amplitude images are processed and analyzed, and the phase with the most obvious feature information is , the first feature phase is , the plurality of second amplitude images are processed and analyzed, and the phase with the most obvious feature information of the first layer of the reference test board is , the phase with the most obvious feature information of the second layer is , and the phase with the most obvious feature information of the third layer is . The first feature phase is compared with the plurality of second feature phases , and in turn, the first feature phase is closest to in the plurality of second feature phases of the reference test board, and the target second feature phase of the plurality of second amplitude images is determined to be .

[0096] S302, according to the level information corresponding to the second infrared surface image where the target second feature phase is located, the depth information of the fault point is determined.

[0097] In the embodiments of the present application, the failure positioning system of electroplated copper compares the first feature phase with the plurality of second feature phases by a phase difference threshold value, takes the second feature phase with the closest difference in comparison result value as a target second feature phase, i.e., the target second feature phase of the plurality of second amplitude images is determined, and according to the level information corresponding to the second infrared surface image where the target second feature phase is located, the depth information of the fault point is determined. For example, if the first feature phase at the position of the fault point is close to the standard value of the second layer of the reference board (such as a phase difference ), it is determined that the defect is located in the second layer; if the first feature phase at the position of the fault point is significantly greater than the surface layer (such as a phase difference ), it is determined that the defect corresponds to the third layer. Optionally, in this process, the phase difference value can be directly converted into the Z-axis depth in combination with the phase-depth calibration curve of the reference test plate. For example, for every increase of 100 in the depth, the phase delay increases by about .

[0098] In an exemplary embodiment, the "numerical comparison of the first feature phase in the plurality of first amplitude images and the plurality of second feature phases in the plurality of second amplitude images to determine the target second feature phase of the plurality of second amplitude images" in S301 described above, as shown in FIG. 3, includes: Figure 5

[0099] S401, determine the phase difference between the plurality of first amplitude images to obtain the first feature phase.

[0100] In the embodiments of the present application, the failure positioning system of electroplated copper applies the same current excitation parameters (frequency, current intensity) as the reference test plate to the failed electroplated copper sample, and uses a high-sensitivity infrared camera to collect the surface thermal amplitude distribution of the failed electroplated copper sample, i.e., the infrared surface image, and the amplitude image. From the plurality of amplitude images of the failed electroplated copper sample, the thermal amplitude abnormal region (such as a high-temperature region or a low-temperature region) is located, the phase delay value and the amplitude attenuation curve of the region at each phase angle are extracted, the phase difference information of the feature most obvious in the abnormal region is determined, and the first feature phase is obtained.

[0101] S402, determine the phase difference between the plurality of second amplitude images to obtain the plurality of second feature phases.

[0102] In the embodiments of the present application, the failure positioning system of electroplated copper applies periodic current excitation to the reference plate under a fixed phase-locked thermal imaging frequency, collects thermal amplitude images at different phase angles (from to , with an interval of ) by an infrared camera, and records the thermal wave transmission characteristics of each layer at different phase angles to form a phase-depth mapping model (such as a small phase delay for a surface defect and a large phase delay for a deep defect), and obtains a plurality of phase differences, i.e., a plurality of second phase differences. Optionally, the collected phase difference information (phase delay amount, amplitude attenuation rate) is associated with the known layer structure (X-Y plane position, Z-axis depth) to form a standardized waveform library.

[0103] S403, according to the numerical comparison of the plurality of second feature phases and the first feature phase, determine the target second feature phase in the plurality of second amplitude images.

[0104] ​In the embodiments of the present application, the electroplated copper failure positioning system compares the characteristic phase of the failed electroplated copper sample with the plurality of characteristic phases of the reference test plate, and determines the target second characteristic phase closest to the value of the first characteristic phase from the plurality of second characteristic phases, for example, taking the reference test plate with three layers as an example, the first amplitude image is processed and analyzed, and the phase with the most obvious characteristic information is , and the first characteristic phase is , the second amplitude image is processed and analyzed, and the phase with the most obvious characteristic information of the first layer of the reference test plate is , the phase with the most obvious characteristic information of the second layer is , and the phase with the most obvious characteristic information of the third layer is , the first characteristic phase is compared with the plurality of second characteristic phases , and of the reference test plate in sequence, the first characteristic phase is closest to in the plurality of second characteristic phases of the reference test plate, and the target second characteristic phase of the plurality of second amplitude images is determined as .

[0105] In an exemplary embodiment, the "locating the failure point according to the first infrared surface distribution image to obtain the two-dimensional coordinate information of the failure point on the failed electroplated copper sample" in S202 includes, as shown in Figure 6 , including:

[0106] S501, determining a hot spot on the first infrared surface distribution image that meets a preset hot spot condition.

[0107] In the embodiments of the present application, the electroplated copper failure positioning system applies a constant current to the daisy chain structure of the failed electroplated copper sample, the defect area generates local Joule heat due to abnormal resistance, that is, temperature anomaly points, and a high-sensitivity infrared camera is used to capture surface thermal radiation to generate a sequence of images changing over time. The electroplated copper failure positioning system analyzes and processes the sequence of images, eliminates noise interference, filters out environmental thermal noise such as background radiation, and enhances the defect signal-to-noise ratio, highlights the micro temperature changes caused by defects, and generates a color amplitude image, thereby obtaining a hot spot that meets the preset hot spot condition.

[0108] S502, determining the two-dimensional coordinate information of the failure point according to the image area where the hot spot that meets the preset hot spot condition is located.

[0109] In the embodiment of the present application, the failure location system of electroplated copper directly identifies the high temperature area, i.e. the preset hot spot condition, by using pseudo-color or gray scale gradient, locates the accurate coordinates of the failure point on the plane, and determines the two-dimensional coordinate information of the failure point.

[0110] In an exemplary embodiment, Figure 6 The specific implementation of S402 "determining the two-dimensional coordinate information of the failure point according to the image area where the hot spot meeting the preset hot spot condition is located" in the scheme of the embodiment is shown in the following. Figure 7 The specific implementation of S402 "determining the two-dimensional coordinate information of the failure point according to the image area where the hot spot meeting the preset hot spot condition is located" in the scheme of the embodiment is shown in the following.

[0111] In the embodiment of the present application, the defects existing in the failure electroplated copper sample are reflected in the first infrared surface distribution image as a region containing multiple pixel points, and the two-dimensional coordinate information of the failure point is determined according to the coordinate position of the center pixel point of the multiple pixel points.

[0112] In an exemplary embodiment, the "obtaining multiple first amplitude images of the first structure layer of the failure electroplated copper sample under multiple phase angles" in S201 is shown in the following. Figure 8 The specific implementation of S201 "obtaining multiple first amplitude images of the first structure layer of the failure electroplated copper sample under multiple phase angles" in the scheme of the embodiment is shown in the following.

[0113] S601, changing the excitation frequency of the lock-in thermal imaging device, and collecting image data of the first structure layer under multiple phase angles; the multiple phase angles include to , with an interval of .

[0114] In the embodiment of the present application, the failure location system of electroplated copper changes the working frequency of the lock-in thermal imaging, and sequentially collects the thermal amplitude distribution images of the failure electroplated copper sample under multiple phase angles, obtains a series of amplitude images of the failure electroplated copper sample, and the interval number of the phase angles of the failure electroplated copper sample should be consistent with the interval number of the phase angles of the reference test board. For example, the reference test board collects thermal radiation data according to to , with an interval of , and collects one thermal amplitude distribution image (a total of 12 images) for each phase angle. Therefore, the failure electroplated copper sample also collects thermal radiation data according to to , with an interval of , and collects one thermal amplitude distribution image (a total of 12 images) for each phase angle.

[0115] S602, constructing multiple first amplitude images under multiple phase angles according to the image data of the first structure layer collected under each phase angle.

[0116] In the embodiment of the present application, the electroplated copper failure positioning system fixes the working frequency of the lock-in thermography, and sequentially acquires the amplitude images of the failure electroplated copper sample at multiple phase angles. The number of intervals of the phase angle of the failure electroplated copper sample should be consistent with the number of intervals of the phase angle of the reference test board. At each phase point (for example ), the camera captures an amplitude image. By sequentially acquiring the amplitude images of the failure electroplated copper sample at multiple phase angles, multiple amplitude images of the failure electroplated copper sample, i.e., multiple first amplitude images, are constructed.

[0117] In an exemplary embodiment, the "obtaining a failure electroplated copper sample to be detected and a failure electroplated copper sample" in S201 described above includes: Figure 9 as shown in the following table.

[0118] S701, obtaining multiple experimental substrates, and performing thermal reliability verification and fault excitation test on each experimental substrate by using an environmental test chamber, so that the multiple experimental substrates form multiple failure electroplated copper samples with faults; the experimental conditions of the thermal reliability verification include a preset temperature range; and the excitation number corresponding to the fault excitation test is a preset excitation number.

[0119] In the embodiment of the present application, the electroplated copper failure positioning system screens the electroplated copper samples, selects the electroplated copper samples with structures such as electroplated through holes, electroplated blind holes, and buried holes, and all the electroplated copper samples need to adopt a daisy chain topology (internal or external interconnection), i.e., multiple interconnection structures are connected in series through a continuous conductive path to form a loop that can be powered on. The electroplated copper sample is placed in a test environment to simulate extreme temperature changes in actual applications to excite potential failure factors (such as hole copper fracture and inner layer separation). The preset temperature range includes but is not limited to , and the preset excitation number includes but is not limited to 10 times, 100 times, 500 times, 1000 times, etc.

[0120] S702, selecting one failure electroplated copper sample from the multiple failure electroplated copper samples with faults as the failure electroplated copper sample to be detected.

[0121] In the embodiment of the present application, after the electroplated copper failure positioning system completes the excitation test of the potential failure factors of the electroplated copper sample, the resistance value of the daisy chain of the electroplated copper sample is measured, the resistance value change before and after the test is compared, for example, a threshold value of 5%, 10%, etc., the failure electroplated copper sample is screened out, and one failure electroplated copper sample is randomly selected from the failure electroplated copper samples as the failure electroplated copper sample to be detected.

[0122] In an exemplary embodiment, the "determining three-dimensional coordinate information of the fault point according to the depth information of the fault point and the two-dimensional coordinate information of the fault point" in S205 above, as shown in Figure 10

[0123] S801, according to the three-dimensional coordinate information of the fault point, the micro-sectioning of the failure electroplated copper sample to be detected is performed to obtain a micro image corresponding to the fault point.

[0124] In the embodiments of the present application, the electroplated copper failure positioning system performs local micro-sectioning on the located fault point according to the three-dimensional coordinate information of the fault point, and uses an optical / electron microscope to obtain a micro image corresponding to the fault point.

[0125] S802, micro-morphology analysis is performed on the fault point in the micro image to obtain the failure mechanism and failure cause of the fault point.

[0126] In the embodiments of the present application, the electroplated copper failure positioning system performs micro-morphology analysis, such as crack, delamination, etc., on the obtained micro image corresponding to the fault point to analyze the failure cause and failure cause (such as process defects), and can be fed back to the production end to optimize the process.

[0127] In combination with all the above embodiments, the test steps of the electroplated copper failure positioning system are as shown in Figure 11 The test boards with electroplated copper structures are obtained, and the thermal reliability test is performed on the test boards with electroplated copper structures. The fault failure sample is obtained by using a preset resistance threshold. The reference test plate phase difference waveform library is established by combining the lock-in thermal imaging device and the reference test plate. The lock-in thermal imaging analysis is performed on the electroplated copper fault failure sample by using the reference test plate phase difference waveform library. The fault point is determined and the failure mechanism is analyzed.

[0128] In combination with all the above embodiments, an electroplated copper failure positioning method is also provided, as shown in Figure 12 The method comprises the following steps:

[0129] S901, obtaining a plurality of experimental substrates, and performing thermal reliability verification and fault excitation test on each experimental substrate by using an environmental test chamber, so that the plurality of experimental substrates form a plurality of fault failure electroplated copper samples; the experimental conditions of the thermal reliability verification include a preset temperature range; and the excitation number corresponding to the fault excitation test is a preset excitation number;

[0130] S902, selecting one of the plurality of fault failure electroplated copper samples as a failure electroplated copper sample to be detected;

[0131] S903, changing the excitation frequency of the lock-in thermal imaging device, and collecting image data of the first structure layer at a plurality of phase angles; the plurality of phase angles include​ to , the interval ;

[0132] S904, constructing a plurality of first amplitude images under each phase angle according to the image data of the first structure layer acquired under each phase angle;

[0133] S905, determining a hot spot on the first infrared surface distribution image that meets a preset hot spot condition;

[0134] S906, determining a center pixel point of the image region, and determining two-dimensional coordinate information of the fault point according to a pixel coordinate of the center pixel point on the first infrared surface distribution image;

[0135] S907, acquiring a second infrared surface distribution image of each second structure layer on the reference test plate and a plurality of second amplitude images under a plurality of phase angles corresponding to each second structure layer; the second infrared surface distribution image represents the distribution of a plurality of hot spots;

[0136] S908, determining a phase difference between the plurality of first amplitude images to obtain a first characteristic phase;

[0137] S909, determining a phase difference between the plurality of second amplitude images to obtain a plurality of second characteristic phases;

[0138] S910, comparing the plurality of second characteristic phases with the first characteristic phase to determine a target second characteristic phase in the plurality of second amplitude images;

[0139] S911, determining depth information of the fault point according to layer information corresponding to the second infrared surface image where the target second characteristic phase is located;

[0140] S912, performing microscopic sectioning on the failed electroplated copper sample to be detected according to the three-dimensional coordinate information of the fault point to obtain a microscopic image corresponding to the fault point;

[0141] S913, performing microscopic morphology analysis on the fault point in the microscopic image to obtain a failure mechanism and a failure cause of the fault point.

[0142] The method described in each of the above steps is described in the foregoing embodiments, and the details are described in the foregoing description, which will not be repeated here.

[0143] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are shown in sequence according to the arrows, the steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, the execution of the steps is not strictly limited in sequence, and the steps can be executed in other orders. Moreover, at least some of the steps in the flowcharts involved in the above-described embodiments can include multiple steps or multiple stages, which are not necessarily executed at the same time but can be executed at different times, and the execution of the steps or stages is not necessarily sequential but can be executed alternately or in rotation with at least some of the other steps or the steps or stages in the other steps. It can be understood that the steps in different embodiments can be freely combined as needed, and various non-contradictory schemes formed by the combination are within the scope of protection of the present application.

[0144] Based on the same inventive concept, the embodiments of the present application also provide a device for implementing the above-mentioned failure positioning of electroplated copper. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more embodiments of the device for failure positioning of electroplated copper provided below can refer to the limitations of the method for failure positioning of electroplated copper described above, which will not be repeated here.

[0145] In one exemplary embodiment, as shown in Figure 13 a device for failure positioning of electroplated copper is provided, comprising:

[0146] A first structure layer module 1001 is configured to obtain a first infrared surface distribution image of a first structure layer on a failure electroplated copper sample to be detected and a plurality of first amplitude images of the first structure layer corresponding to a plurality of phase angles; the first infrared surface distribution image represents the distribution of a plurality of hot spots;

[0147] A two-dimensional coordinate information module 1002 is configured to locate a fault point based on the first infrared surface distribution image to obtain two-dimensional coordinate information of the fault point on the failure electroplated copper sample;

[0148] A second structure layer module 1003 is configured to obtain a second infrared surface distribution image of each second structure layer on a reference test board and a plurality of second amplitude images of each second structure layer corresponding to a plurality of phase angles; the second infrared surface distribution image represents the distribution of a plurality of hot spots;

[0149] A depth information module 1004 is configured to determine depth information of the fault point based on the plurality of first amplitude images and the plurality of second amplitude images;

[0150] The three-dimensional coordinate information module 1005 is configured to determine three-dimensional coordinate information of the fault point according to the depth information of the fault point and two-dimensional coordinate information of the fault point.

[0151] In an embodiment, the depth information module 1004 includes:

[0152] The target second amplitude image unit is configured to perform numerical comparison between the first characteristic phase in the plurality of first amplitude images and the plurality of second characteristic phases in the plurality of second amplitude images, to determine a target second characteristic phase of the plurality of second amplitude images.

[0153] The hierarchical information unit is configured to determine the depth information of the fault point according to hierarchical information corresponding to the second infrared surface image pair in which the target second characteristic phase is located.

[0154] In an embodiment, the target second amplitude image unit includes:

[0155] The first phase difference sub-unit is configured to determine phase differences between the plurality of first amplitude images to obtain the first characteristic phase.

[0156] The second phase difference sub-unit is configured to determine phase differences between the plurality of second amplitude images to obtain the plurality of second characteristic phases.

[0157] The screening sub-unit is configured to perform numerical comparison between the plurality of second characteristic phases and the first characteristic phase to determine the target second characteristic phase in the plurality of second amplitude images.

[0158] In an embodiment, the two-dimensional coordinate information module 1002 includes:

[0159] The preset hot spot unit is configured to determine a hot spot on the first infrared surface distribution image that meets a preset hot spot condition.

[0160] The fault point unit is configured to determine two-dimensional coordinate information of the fault point according to an image region in which the hot spot meeting the preset hot spot condition is located.

[0161] In an embodiment, the fault point unit is specifically configured to determine a center pixel point of the image region, and determine the two-dimensional coordinate information of the fault point according to a pixel coordinate of the center pixel point on the first infrared surface distribution image.

[0162] In an embodiment, the first structure layer module 1001 includes:

[0163] The image data unit is configured to change an excitation frequency of the lock-in thermal imaging device, and collect image data of the first structure layer at a plurality of phase angles, respectively. The plurality of phase angles include to with an interval of ;

[0164] a plurality of first amplitude image units, configured to construct a plurality of first amplitude images under each phase angle according to image data of the first structure layer acquired under each phase angle.

[0165] In an embodiment, the first structure layer module 1001 further includes:

[0166] an experiment unit, configured to obtain a plurality of experimental substrates, and perform thermal reliability verification and fault excitation test on each experimental substrate by using an environmental test chamber, so that the plurality of experimental substrates form a plurality of fault failure failure electroplated copper samples; the experimental conditions of the thermal reliability verification include a preset temperature range; and the corresponding excitation number of the fault excitation test is a preset excitation number.

[0167] a failure electroplated copper sample unit, configured to select one failure electroplated copper sample from the plurality of fault failure failure electroplated copper samples as a failure electroplated copper sample to be detected.

[0168] In an embodiment, the three-dimensional coordinate information module 1005 includes:

[0169] a microscopic image unit, configured to perform microscopic sectioning on the failure electroplated copper sample to be detected according to the three-dimensional coordinate information of the fault point, and obtain a microscopic image corresponding to the fault point.

[0170] a failure mechanism unit, configured to perform microscopic morphology analysis on the fault point in the microscopic image, and obtain a failure mechanism and a failure cause of the fault point.

[0171] The above-mentioned various modules in the electroplated copper failure positioning device can be realized by software, hardware, and combinations thereof, in whole or in part. The above-mentioned various modules can be embedded in or independent of a processor in a computer device in hardware form, or can be stored in a memory in a computer device in software form, so as to be called and executed by a processor to perform the operations corresponding to the above-mentioned various modules.

[0172] In an exemplary embodiment, a computer device is provided, which can be a terminal, and an internal structure diagram thereof can be as shown in Figure 14 .

[0173] The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit and an input device. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface, the display unit and the input device are connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operating system and the computer program in the non-volatile storage medium to run. The input / output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used to communicate with external terminals in a wired or wireless manner. The wireless manner can be achieved through WIFI, mobile cellular network, near field communication (NFC) or other technologies. The computer program is executed by the processor to implement a failure positioning method for electroplated copper. The display unit of the computer device is used to form a visually visible picture, which can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the output device of the computer device can be a touch layer overlaid on the display screen.

[0174] In one exemplary embodiment, a computer device is provided, including a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the following steps:

[0175] obtaining a first infrared surface distribution image of a failure electroplated copper sample to be detected and a first structure layer on the failure electroplated copper sample, and a plurality of first amplitude images of the first structure layer corresponding to a plurality of phase angles; the first infrared surface distribution image represents the distribution of a plurality of hot spots;

[0176] locating a fault point according to the first infrared surface distribution image to obtain two-dimensional coordinate information of the fault point on the failure electroplated copper sample;

[0177] obtaining a second infrared surface distribution image of each second structure layer on a reference test board and a plurality of second amplitude images of each second structure layer corresponding to a plurality of phase angles; the second infrared surface distribution image represents the distribution of a plurality of hot spots;

[0178] determining depth information of the fault point according to the plurality of first amplitude images and the plurality of second amplitude images;

[0179] determining three-dimensional coordinate information of the fault point according to the depth information of the fault point and the two-dimensional coordinate information of the fault point.

[0180] In one embodiment, the processor executing the computer program further implements the following steps:

[0181] numerical comparison is performed between the first feature phase and the plurality of second feature phases, and a target second feature phase in the plurality of second amplitude images is determined;

[0182] According to the hierarchical information corresponding to the second infrared surface image where the target second feature phase is located, depth information of the fault point is determined.

[0183] In one embodiment, the processor executing the computer program also implements the following steps:

[0184] The phase difference between the plurality of first amplitude images is determined to obtain the first feature phase;

[0185] The phase difference between the plurality of second amplitude images is determined to obtain the plurality of second feature phases;

[0186] Numerical comparison is performed between the plurality of second feature phases and the first feature phase, and a target second feature phase in the plurality of second amplitude images is determined.

[0187] In one embodiment, the processor executing the computer program also implements the following steps:

[0188] A hot spot satisfying a preset hot spot condition on the first infrared surface distribution image is determined;

[0189] According to the image region where the hot spot satisfying the preset hot spot condition is located, two-dimensional coordinate information of the fault point is determined.

[0190] In one embodiment, the processor executing the computer program also implements the following steps:

[0191] A center pixel point of the image region is determined, and the two-dimensional coordinate information of the fault point is determined according to the pixel coordinates of the center pixel point on the first infrared surface distribution image.

[0192] In one embodiment, the processor executing the computer program also implements the following steps:

[0193] The excitation frequency of the phase-locked thermal imaging device is changed, and image data of the first structure layer is collected at a plurality of phase angles respectively; the plurality of phase angles include to , interval ;

[0194] According to the image data of the first structure layer collected at each phase angle, a plurality of first amplitude images at each phase angle are constructed.

[0195] In one embodiment, the processor executing the computer program also implements the following steps:

[0196] A plurality of experimental substrates are obtained, and a thermal reliability verification and a fault excitation test are performed on each experimental substrate by using an environmental test chamber, so that the plurality of experimental substrates form a plurality of failure copper electroplating samples with faults; the experimental conditions of the thermal reliability verification include a preset temperature range; and the corresponding excitation number of the fault excitation test is a preset excitation number.

[0197] One of the plurality of failure copper electroplating samples with faults is selected as a failure copper electroplating sample to be detected.

[0198] In one embodiment, the processor further implements the following steps when executing the computer program:

[0199] A microscopic sectioning is performed on the failure copper electroplating sample to be detected according to the three-dimensional coordinate information of the fault point, so as to obtain a microscopic image corresponding to the fault point.

[0200] A microscopic morphology analysis is performed on the fault point in the microscopic image, so as to obtain a failure mechanism and a failure cause of the fault point.

[0201] In one embodiment, a computer readable storage medium is provided, and the computer readable storage medium stores a computer program. The computer program is executed by a processor to implement the following steps:

[0202] A first infrared surface distribution image of a first structure layer on the failure copper electroplating sample to be detected and a plurality of first amplitude images of the first structure layer corresponding to a plurality of phase angles are obtained; the first infrared surface distribution image represents a distribution of a plurality of hot spots.

[0203] A fault point positioning is performed according to the first infrared surface distribution image, so as to obtain two-dimensional coordinate information of the fault point on the failure copper electroplating sample.

[0204] A second infrared surface distribution image of each second structure layer on a reference test board and a plurality of second amplitude images of each second structure layer corresponding to a plurality of phase angles are obtained; the second infrared surface distribution image represents a distribution of a plurality of hot spots.

[0205] The depth information of the fault point is determined according to the plurality of first amplitude images and the plurality of second amplitude images.

[0206] The three-dimensional coordinate information of the fault point is determined according to the depth information of the fault point and the two-dimensional coordinate information of the fault point.

[0207] In one embodiment, the processor further implements the following steps when executing the computer program:

[0208] A numerical comparison is performed on a first characteristic phase in the plurality of first amplitude images and a plurality of second characteristic phases in the plurality of second amplitude images, so as to determine a target second characteristic phase of the plurality of second amplitude images.

[0209] According to the level information corresponding to the second infrared surface image where the target second feature phase is located, depth information of the fault point is determined.

[0210] In one embodiment, the processor, when executing the computer program, also implements the following steps:

[0211] Determine the phase difference between the plurality of first amplitude images to obtain a first feature phase;

[0212] Determine the phase difference between the plurality of second amplitude images to obtain a plurality of second feature phases;

[0213] According to the numerical comparison of the plurality of second feature phases and the first feature phase, a target second feature phase in the plurality of second amplitude images is determined.

[0214] In one embodiment, the processor, when executing the computer program, also implements the following steps:

[0215] Determine a hot spot on the first infrared surface distribution image that satisfies a preset hot spot condition;

[0216] According to the image region where the hot spot satisfying the preset hot spot condition is located, two-dimensional coordinate information of the fault point is determined.

[0217] In one embodiment, the processor, when executing the computer program, also implements the following steps:

[0218] Determine the center pixel point of the image region, and determine the two-dimensional coordinate information of the fault point according to the pixel coordinates of the center pixel point on the first infrared surface distribution image.

[0219] In one embodiment, the processor, when executing the computer program, also implements the following steps:

[0220] Change the excitation frequency of the phase-locked thermal imaging device, and acquire image data of the first structure layer at a plurality of phase angles; the plurality of phase angles include to , interval ;

[0221] According to the image data of the first structure layer acquired at each phase angle, a plurality of first amplitude images at each phase angle are constructed.

[0222] In one embodiment, the processor, when executing the computer program, also implements the following steps:

[0223] Obtain a plurality of experimental substrates, and use an environmental test chamber to perform thermal reliability verification and fault excitation test on each experimental substrate, so that the plurality of experimental substrates form a plurality of failure samples of failed electroplated copper; the experimental conditions of the thermal reliability verification include a preset temperature range; the excitation number corresponding to the fault excitation test is a preset excitation number;

[0224] One of the failure electroplated copper samples from the plurality of failure electroplated copper samples is selected as a failure electroplated copper sample to be detected.

[0225] In one embodiment, the processor, when executing the computer program, also implements the following steps:

[0226] Microscopic sectioning is performed on the failure electroplated copper sample to be detected according to the three-dimensional coordinate information of the fault point, to obtain a microscopic image corresponding to the fault point;

[0227] Microscopic morphology analysis is performed on the fault point in the microscopic image, to obtain the failure mechanism and failure cause of the fault point.

[0228] In one embodiment, a computer program product is provided, comprising a computer program which, when executed by a processor, implements the following steps:

[0229] A first infrared surface distribution image of a first structure layer on the failure electroplated copper sample to be detected and the failure electroplated copper sample, and a plurality of first amplitude images of the first structure layer corresponding to a plurality of phase angles are obtained; the first infrared surface distribution image represents the distribution of a plurality of hot spots;

[0230] Fault point positioning is performed according to the first infrared surface distribution image, to obtain two-dimensional coordinate information of the fault point on the failure electroplated copper sample;

[0231] Second infrared surface distribution images of each second structure layer on a reference test board and a plurality of second amplitude images of each second structure layer corresponding to a plurality of phase angles are obtained; the second infrared surface distribution image represents the distribution of a plurality of hot spots;

[0232] The depth information of the fault point is determined according to the plurality of first amplitude images and the plurality of second amplitude images;

[0233] The three-dimensional coordinate information of the fault point is determined according to the depth information of the fault point and the two-dimensional coordinate information of the fault point.

[0234] In one embodiment, the processor, when executing the computer program, also implements the following steps:

[0235] Numerical comparison is performed on a first characteristic phase in the plurality of first amplitude images and a plurality of second characteristic phases in the plurality of second amplitude images, to determine a target second characteristic phase of the plurality of second amplitude images;

[0236] The depth information of the fault point is determined according to the level information corresponding to the second infrared surface image where the target second characteristic phase is located.

[0237] In one embodiment, the processor, when executing the computer program, also implements the following steps:

[0238] determining phase differences between the plurality of first amplitude images to obtain a first characteristic phase;

[0239] determining phase differences between the plurality of second amplitude images to obtain a plurality of second characteristic phases;

[0240] performing numerical comparison between the plurality of second characteristic phases and the first characteristic phase to determine a target second characteristic phase in the plurality of second amplitude images.

[0241] In one embodiment, the processor, when executing the computer program, further implements the following steps:

[0242] determining a hot spot on the first infrared surface distribution image that satisfies a preset hot spot condition;

[0243] determining two-dimensional coordinate information of the fault point according to an image region where the hot spot satisfying the preset hot spot condition is located.

[0244] In one embodiment, the processor, when executing the computer program, further implements the following steps:

[0245] determining a center pixel point of the image region, and determining two-dimensional coordinate information of the fault point according to a pixel coordinate of the center pixel point on the first infrared surface distribution image.

[0246] In one embodiment, the processor, when executing the computer program, further implements the following steps:

[0247] changing an excitation frequency of the phase-locked thermal imaging device to acquire image data of the first structure layer at a plurality of phase angles; the plurality of phase angles include to , with an interval of ;

[0248] constructing a plurality of first amplitude images at the plurality of phase angles according to the image data of the first structure layer acquired at the plurality of phase angles.

[0249] In one embodiment, the processor, when executing the computer program, further implements the following steps:

[0250] obtaining a plurality of experimental substrates, and performing thermal reliability verification and fault excitation test on each experimental substrate by using an environmental test box, so that the plurality of experimental substrates form a plurality of failure electroplated copper samples with faults; the experimental conditions of the thermal reliability verification include a preset temperature range; and the excitation number corresponding to the fault excitation test is a preset excitation number;

[0251] selecting one failure electroplated copper sample from the plurality of failure electroplated copper samples with faults as a failure electroplated copper sample to be detected.

[0252] In one embodiment, the processor, when executing the computer program, further implements the following steps:

[0253] According to the three-dimensional coordinate information of the fault point, microscopic sectioning is performed on the failure electroplated copper sample to be detected, and a microscopic image corresponding to the fault point is obtained;

[0254] Microscopic morphology analysis is performed on the fault point in the microscopic image, and a failure mechanism and failure cause of the fault point are obtained.

[0255] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer readable storage medium. When the computer program is executed, it can include the processes of the above-mentioned embodiments. Any reference to a memory, database or other medium used in the embodiments provided by the present application can include at least one of a non-volatile memory and a volatile memory. The non-volatile memory can include a read-only memory (ROM), a magnetic tape, a floppy disk, a flash memory, an optical memory, a high-density embedded non-volatile memory, a resistive random access memory (ReRAM), a magnetoresistive random access memory (MRAM), a ferroelectric random access memory (FRAM), a phase change memory (PCM), a graphene memory, etc. The volatile memory can include a random access memory (RAM) or an external cache memory, etc. As an illustration but not limitation, the RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The database involved in the embodiments provided by the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., without being limited thereto. The processor involved in the embodiments provided by the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., without being limited thereto.

[0256] Any technical features in the above embodiments can be combined, and for the sake of brevity, not all possible combinations are described above, however, any combination of these technical features is deemed to be within the scope of the present application.

[0257] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A method for locating failures in electroplated copper, characterized in that, The method includes: Acquire the first infrared surface distribution image of the failed electroplated copper sample to be tested and the first structural layer on the failed electroplated copper sample, as well as multiple first amplitude images of the first structural layer at multiple phase angles; the first infrared surface distribution image represents the distribution of multiple hot spots; Based on the first infrared surface distribution image, the fault point is located to obtain the two-dimensional coordinate information of the fault point on the failed electroplated copper sample. Acquire the second infrared surface distribution image of each second structural layer on the reference test board and multiple second amplitude images at multiple phase angles corresponding to each second structural layer; the second infrared surface distribution image represents the distribution of multiple hot spots; The depth information of the fault point is determined based on the plurality of first amplitude images and the plurality of second amplitude images; Based on the depth information and two-dimensional coordinate information of the fault point, the three-dimensional coordinate information of the fault point is determined.

2. The method according to claim 1, characterized in that, Determining the depth information of the fault point based on the plurality of first amplitude images and the plurality of second amplitude images includes: A numerical comparison is performed between the first feature phase in the plurality of first amplitude images and the plurality of second feature phases in the plurality of second amplitude images to determine the target second feature phase of the plurality of second amplitude images; The depth information of the fault point is determined based on the hierarchical information corresponding to the second infrared surface image of the target's second characteristic phase.

3. The method according to claim 2, characterized in that, The step of comparing the first feature phase in the plurality of first amplitude images with the plurality of second feature phases in the plurality of second amplitude images to determine the target second feature phase of the plurality of second amplitude images includes: Determine the phase difference between the plurality of first amplitude images to obtain the first characteristic phase; Determine the phase difference between the plurality of second amplitude images to obtain a plurality of second feature phases; The target second feature phase in the plurality of second amplitude images is determined by comparing the numerical values ​​of the plurality of second feature phases with the first feature phase.

4. The method according to any one of claims 1-3, characterized in that, The step of locating the fault point based on the first infrared surface distribution image to obtain the two-dimensional coordinate information of the fault point on the failed electroplated copper sample includes: Identify hotspots on the first infrared surface distribution image that meet preset hotspot conditions; The two-dimensional coordinate information of the fault point is determined based on the image region where the hotspot meets the preset hotspot conditions.

5. The method according to claim 4, characterized in that, The step of determining the two-dimensional coordinate information of the fault point based on the image region where the hotspot meets the preset hotspot conditions includes: The center pixel of the image region is determined, and the two-dimensional coordinate information of the fault point is determined based on the pixel coordinates of the center pixel on the first infrared surface distribution image.

6. The method according to any one of claims 1-3, characterized in that, Acquiring multiple first amplitude images of the first structural layer on the failed electroplated copper sample at multiple phase angles, including: By changing the excitation frequency of the phase-locked thermal imaging device, image data of the first structural layer are acquired at the plurality of phase angles; the plurality of phase angles include arrive ,interval ; Based on the image data of the first structural layer acquired at each phase angle, multiple first amplitude images at each phase angle are constructed.

7. The method according to any one of claims 1-3, characterized in that, The method further includes: Multiple experimental substrates were obtained, and each experimental substrate was subjected to thermal reliability verification and fault excitation tests using an environmental test chamber, so that the multiple experimental substrates formed multiple failed electroplated copper samples with faults; the experimental conditions for thermal reliability verification included a preset temperature range; the number of excitations corresponding to the fault excitation tests was a preset number of excitations. Select one failed electroplated copper sample from the plurality of failed electroplated copper samples as the failed electroplated copper sample to be tested.

8. The method according to any one of claims 1-3, characterized in that, The method further includes: The failed electroplated copper sample to be tested is microscopically sectioned based on the three-dimensional coordinate information of the fault point to obtain a microscopic image corresponding to the fault point. Microscopic morphology analysis of the fault points in the microscopic images is performed to obtain the failure mechanism and cause of the failure points.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 8.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 8.

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