Laser trigger switch and manufacturing method thereof

Abstract

The invention provides a laser trigger switch and a manufacturing method thereof, and relates to the technical field of switches. The laser trigger switch comprises a body, and a closed cavity is formed in the body. A cathode and an anode are arranged on the body, and each of the cathode and the anode comprises a first composition part and a second composition part; the first component part is located in the cavity, and the second component part is located outside the cavity; and the first composition part and the second composition part are formed on the corresponding surfaces of the body through a photoetching coating process. The laser trigger switch adopts an advanced manufacturing process, so that the size of the switch can be greatly reduced; the photoetching coating process is suitable for batch processing of wafer-level devices, the production efficiency can be greatly improved, and the manufacturing cost of a single device can be reduced; due to the fact that the precision of photoetching, optical coating and other processes is controllable, key performance parameters of the manufactured laser trigger switch have excellent uniformity and consistency, and therefore the stability and reliability of the laser trigger switch can be remarkably improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of switch, in particular to a laser triggered switch and a manufacturing method thereof. BACKGROUND

[0002] At present, modern pulse power technology develops rapidly in the field of national defense and civil use. The research on advanced kinetic energy weapons such as electromagnetic gun, high-power microwave weapon, electrothermal chemical gun and electric rocket promotes the development and progress of high-power laser, high-energy long-pulse accelerator and other high-precision instruments. Switch is a key component in pulse power technology, which determines the main performance of the pulse power system to some extent. The gas spark switch is most commonly used in the pulse power system.

[0003] The laser triggered switch generally refers to a gas spark switch triggered by laser. When the laser pulse is focused on the trigger gap, the insulating gas at the focal point and its vicinity is immediately ionized to form a local plasma. Under the action of the external electric field, the plasma rapidly develops into a spark discharge channel to close the switch. As a kind of closed switch, the laser triggered switch has the advantages of small trigger delay and jitter, low pre-breakdown probability, variable delay under low jitter, simple structure, stable and reliable operation, remote control, suitable for repeated operation and multi-gap and multi-channel operation.

[0004] At present, the production and assembly of components of the laser triggered switch all rely on traditional mechanical processing methods. For example, the processing of the electrode needs to go through turning, grinding, polishing and other processes. In order to ensure the accuracy of processing, fine grinding and other processes are also needed. However, the structure and processing method of the existing laser triggered switch are difficult to realize the miniaturization of the finished product.

[0005] In addition, the precision mechanical processing itself and the complex assembly process result in high manufacturing cost, and also cause the problem of poor uniformity of different batches or even the same batch of switches, thereby affecting the reliability of the device and the consistency of the system performance. SUMMARY

[0006] The present application aims to overcome the defects of the prior art, and provides a laser triggered switch and a manufacturing method thereof to solve the problems in the prior art.

[0007] To solve the above problems, the first aspect of the embodiment of the present application provides a laser triggered switch, comprising a body, wherein a closed cavity is arranged in the interior of the body; A cathode and an anode are arranged on the body, and the cathode and the anode each comprise a first component and a second component, wherein the first component of the cathode is electrically connected with the second component of the cathode, and the first component of the anode is electrically connected with the second component of the anode; The first component is located in the cavity, and the second component is located outside the cavity; wherein the first component and the second component are formed on the corresponding surfaces of the body by a process of photoetching and film plating.

[0008] In a possible implementation, the body comprises a substrate, a main body portion, and a cover body. The cavity is arranged inside the main body portion, and the cavity is formed with a first opening and a second opening on the opposite two end surfaces of the main body portion; The substrate and the cover body are sealingly connected to the main body portion, wherein the first opening is closed by the substrate, and the second opening is closed by the cover body. The cathode and the anode are arranged on the substrate; wherein the first component of the cathode is arranged on a first surface of the substrate, and the first component of the anode is arranged on a second surface of the substrate, and the first surface and the second surface of the substrate are located on the two sides in the thickness direction of the substrate.

[0009] In a possible implementation, the substrate is provided with a first through hole and a second through hole, the first through hole corresponds to the cathode, and the second through hole corresponds to the anode. The first through hole and the second through hole are both provided with a conductive member. The first component of the cathode and the second component of the cathode are electrically connected by the conductive member in the first through hole; and the first component of the anode and the second component of the anode are electrically connected by the conductive member in the second through hole.

[0010] In a possible implementation, the cover body is provided with a laser, and the laser is used to emit laser to the first component of the cathode or the first component of the anode. The laser is arranged outside the cavity, or the laser is arranged inside the cavity. Preferably, the laser comprises a vertical cavity surface emitting laser.

[0011] In a possible implementation, the surface of the main body portion is provided with a protective layer for shielding laser.

[0012] In a possible implementation, the thickness of the substrate is 1-5000 µm; the wall thickness of the main body portion is 0.1-500 mm; and the thickness of the cover body is 0.1-500 mm.

[0013] In a possible implementation, the distance between the first component of the cathode and the first component of the anode is 0.01-8mm; the distance between the second component of the cathode and the second component of the anode is 0.01-8mm. The thickness of the first component is 0.1-3000µm, and the thickness of the second component is 0.1-3000µm.

[0014] The second aspect of the embodiments of the present application provides a manufacturing method of the laser trigger switch, for manufacturing the laser trigger switch as described above, and the manufacturing method comprises: Photolithography film plating: forming the first component of the cathode and the first component of the anode on the first surface of the substrate by photolithography film plating, and forming the second component of the cathode and the second component of the anode on the second surface of the substrate by photolithography film plating; Final assembly: the substrate and the main body are sealed and fixedly connected by laser bonding, and the cover and the main body are sealed and fixedly connected by laser bonding.

[0015] In a possible implementation, before the photolithography film plating, the following steps are performed: machining a first through hole and a second through hole on the substrate; and arranging a conductive member in the first through hole and the second through hole; When the photolithography film plating is performed: the first component of the cathode covers one end of the first through hole, and the second component of the cathode covers the other end of the first through hole; the first component of the anode covers one end of the second through hole, and the second component of the anode covers the other end of the second through hole.

[0016] In a possible implementation, before the final assembly is completed, a laser is installed on the cover, wherein the laser is located outside or inside the cavity of the laser trigger switch; or, After the final assembly is completed, the laser is installed on the cover, wherein the laser is located outside the cavity.

[0017] The beneficial effects of the present application at least include: The laser trigger switch provided by the present application comprises a body, and a closed cavity is arranged in the body, wherein the first component and the second component of the cathode and the anode are formed on the corresponding surface of the body by the process of photolithography film plating.

[0018] The laser trigger switch adopts an advanced manufacturing process (photoetching plating process), which can greatly reduce the size of the switch and meet the development trend of miniaturization of electronic devices. Secondly, the photoetching plating process is suitable for batch processing of wafer-level devices, which means that a large number of completely consistent devices can be manufactured simultaneously on a single wafer, thereby greatly improving production efficiency and effectively reducing the manufacturing cost of individual devices. In addition, thanks to the controllable precision of photoetching, optical plating and other processes, the key performance parameters (such as the shape, size and other parameters of the cathode and anode) of the laser trigger switches manufactured in the same batch or even different batches have excellent uniformity and consistency, thereby significantly improving the stability and reliability of the laser trigger switch. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0020] Figure 1 A cross-sectional view of a laser trigger switch is shown; Figure 2 A schematic view of a main body is shown; Figure 3 A cross-sectional view of a main body is shown; Figure 4 A cross-sectional view of a substrate without punching is shown; Figure 5 A cross-sectional view of a punched substrate is shown; Figure 6 A cross-sectional view of a substrate provided with a cathode and an anode is shown; Figure 7 A manufacturing flowchart of the laser trigger switch in Example Two is shown; Figure 8 A cross-sectional view of the laser trigger switch in Example Three is shown; Figure 9 A manufacturing flowchart of the laser trigger switch in Example Three is shown; Figure 10 A cross-sectional view of the laser trigger switch in Example Four is shown; Figure 11 A manufacturing flowchart of the laser trigger switch in Example Four is shown; Figure 12 A circuit diagram of a working circuit is shown; Figure 13 A working flowchart of a laser trigger switch is shown; Figure 14 A waveform chart of an oscilloscope is shown.

[0021] Main element symbol explanation: 1 - laser trigger switch; 2 - current transformer; 3 - oscilloscope; 4 - DC power supply; 5 - protection resistor; 6 - charging capacitor; 100 - body; 110 - cavity; 210 - cathode; 220 - anode; 231 - first component part; 232 - second component part; 310 - substrate; 311 - first surface; 312 - second surface; 313 - first through hole; 314 - second through hole; 315 - conductive piece; 320 - main body part; 321 - first opening; 322 - second opening; 330 - cover; 400 - laser. DETAILED DESCRIPTION

[0022] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the technical solutions of the present application will be described in detail below with reference to the drawings and specific embodiments. It should be pointed out that the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0023] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0024] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0025] In the description of the present application, the serial numbers of components, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meaning. In addition, the present application said "connection", "coupling" and the like, unless otherwise specified, includes direct and indirect connections (couplings) and the like.

[0026] The core breakthrough of the laser trigger switch proposed in the application is to realize the integration of a vertical cavity surface emitting laser (VCSEL) and a laser trigger switch, which lays a foundation for miniaturization of the device and simplification of the system. The manufacturing of the laser trigger switch abandons the traditional mechanical processing route and instead adopts an advanced micro-electro-mechanical system (MEMS) manufacturing process, greatly reducing the physical size and overall volume of the switch to meet the demand for compact space of modern electronic equipment. Secondly, the related devices of the laser trigger switch are naturally suitable for wafer-level batch processing, which means that a large number of completely consistent devices can be manufactured simultaneously on a single wafer, thereby greatly improving production efficiency and effectively reducing the manufacturing cost of individual devices.

[0027] Compared with traditional laser trigger switches, the laser trigger switch proposed in the application exhibits excellent characteristics: 1. Due to the precise controllability of processes such as photolithography, etching, and optical coating, the key performance parameters of devices in the same batch or even different batches have excellent uniformity and consistency; 2. The structure of the laser trigger switch has higher mechanical stability and environmental robustness, significantly improving the reliability and stability of the switch during long-term operation; 3. The planarized and standardized devices (including substrates, covers, etc.) provide natural compatibility and scalability for future implementation of more complex multifunctional systems, which is a key element for promoting the development of laser trigger switches and even the entire power electronic system towards high integration and intelligence. Embodiment one

[0028] Reference Figure 1 In this embodiment, a laser trigger switch is proposed, which includes a body 100, and a closed chamber 110 is arranged inside the body 100.

[0029] Two electrodes are arranged on the body 100, which are a cathode 210 and an anode 220. The cathode 210 and the anode 220 each include a first component 231 and a second component 232, wherein the first component 231 of the cathode 210 is electrically connected to the second component 232 of the cathode 210, and the first component 231 of the anode 220 is electrically connected to the second component 232 of the anode 220.

[0030] The first component 231 is located inside the chamber 110, and the second component 232 is located outside the chamber 110. The first component 231 and the second component 232 are each formed on the corresponding surface of the body 100 through a photolithography coating process. The second component 232 is used to be connected to a conductive structure such as a wire, so that the laser trigger switch is connected to the corresponding circuit.

[0031] The material of the first component 231 and the second component 232 includes but is not limited to gold, silver, copper, titanium, platinum, or metal alloy, etc.

[0032] When a high voltage is applied to the second component 232 of the cathode 210 and the second component 232 of the anode 220 of the laser trigger switch, a laser beam with a specific wavelength and energy is irradiated on the first component 231 of the cathode 210 or the anode 220 (usually the first component 231 of the cathode 210). Laser energy interacts with the metal electrode surface, and the initial plasma seed is induced mainly through the following three mechanisms: 1. Photoionization: Laser photons directly transfer energy to the electrons of the electrode material or surface adsorbents, allowing them to overcome the work function binding and escape, forming free electrons; 2. Thermal ionization: Intense energy deposition at the laser focus causes the temperature of the local region of the electrode to rise sharply, causing the material to melt, evaporate, and even ionize, producing high-temperature plasma; 3. Collision ionization: The initial free electrons generated by photoionization or thermal ionization gain a large kinetic energy under the acceleration of the strong electric field between the electrodes, and when they collide with neutral gas molecules or atoms, if the energy is high enough, they can ionize the latter, thereby multiplying the number of free electrons and forming an avalanche effect.

[0033] In addition, during the transmission of the laser pulse through the working gas filled in the chamber 110 to the electrode, its high-intensity light field can also directly or indirectly cause the ionization of gas molecules in the chamber 110. This process is mainly achieved through multiphoton absorption or cascade ionization, producing additional free electrons and ions, further enriching the initial carrier source.

[0034] With the continuous progress of the above ionization process, a small group of high-density initial plasma is formed near the laser irradiation point in the gap between the cathode 210 and the anode 220. Under the driving of the strong electric field between the electrodes, the charged particles (electrons and ions) in these plasmas are accelerated and spread rapidly to both ends of the gap and the surrounding space. Free electrons migrate at high speed to the anode 220, while positive ions move to the cathode 210. This diffusion process rapidly fills the entire insulating channel between the electrodes, and in a very short time (usually in the order of nanoseconds to microseconds), a low-impedance, high-conductivity plasma channel is established. Once the conductive channel completely penetrates the electrode gap, the switch is declared to be effectively closed, and the current between the high-voltage electrodes can be conducted through the plasma channel.

[0035] As shown in Figure 1 The body 100 includes a substrate 310, a main body 320, and a cover 330. The substrate 310, the main body 320, and the cover 330 can all be made of glass.

[0036] AsFigure 2 and Figure 3 As shown in

[0037] The surface of the main body 320 is polished first, and then the chamber 110 is processed in the main body 320 by laser cutting, thereby ensuring the flatness of the bonding interface.

[0038] The substrate 310 and the cover 330 are sealingly connected with the main body 320, wherein the first opening 321 is closed by the substrate 310, and the second opening 322 is closed by the cover 330. The cross-sectional area of the substrate 310 is greater than the area of the first opening 321, and the cross-sectional area of the cover 330 is greater than the area of the second opening 322.

[0039] The part of the substrate 310 in contact with the main body 320 is sealed by laser bonding, thereby realizing the fixed connection between the substrate 310 and the main body 320; the part of the cover 330 in contact with the main body 320 is sealed by laser bonding, thereby realizing the fixed connection between the cover 330 and the main body 320.

[0040] The cathode 210 and the anode 220 are both arranged on the substrate 310.

[0041] As shown in Figure 4 , Figure 5 and Figure 6 The first component 231 is arranged on the first surface 311 of the substrate 310, and the second component 232 is arranged on the second surface 312 of the substrate 310. The first surface 311 and the second surface 312 of the substrate 310 are located on both sides in the thickness direction of the substrate 310. Before forming the first component 231 and the second component 232 on the substrate 310, the surface of the substrate 310 needs to be processed to ensure the flatness of the first surface 311 and the second surface 312.

[0042] As shown in Figure 5 and Figure 6 The substrate 310 is provided with a first through hole 313 and a second through hole 314, wherein the first through hole 313 corresponds to the cathode 210, and the second through hole 314 corresponds to the anode 220.

[0043] The first through hole 313 and the second through hole 314 are both provided with a conductive part 315.

[0044] The first component 231 of the cathode 210 is electrically connected to the second component 232 of the cathode 210 through the conductive member 315 in the first through hole 313; and the first component 231 of the anode 220 is electrically connected to the second component 232 of the anode 220 through the conductive member 315 in the second through hole 314.

[0045] In some embodiments, the cap 330 is provided with a laser, which is used to emit laser to the first component 231 of the cathode 210 or the first component 231 of the anode 220.

[0046] The laser is arranged outside the cavity, or the laser is arranged inside the cavity.

[0047] Preferably, the laser comprises a vertical cavity surface emitting laser.

[0048] The surface of the cap 330 can be polished to obtain good flatness. Before assembling the cap 330 and the laser, positioning marks can be provided on the cap 330 in advance, and the laser is positioned by the positioning marks. When all components are assembled, the laser emitted by the laser is perpendicular to the first component 231 of the cathode 210 or the first component 231 of the anode 220.

[0049] When the cap 330 and the laser are assembled, the cleanliness and flatness of the surfaces of the cap 330 and the laser combined with each other need to be ensured. The cap 330 and the laser can be connected by laser bonding.

[0050] The cap 330 can be installed on a mechanical displacement platform. After the cap 330 and the laser are assembled, the position of the laser is adjusted by the mechanical displacement platform to ensure that the laser emitted by the laser is perpendicular to the corresponding first component 231 on the substrate 310.

[0051] In other embodiments, the laser can be installed at other positions instead of the laser trigger switch, and it is only necessary to ensure that the laser emitted by the laser can irradiate the first component 231 of the cathode 210 or the first component 231 of the anode 220.

[0052] When the laser is arranged outside the cavity, the cap 330 should also have good cleanliness to ensure the light transmission ability.

[0053] The surface of the main body 320 is provided with a protective layer for shielding the laser to prevent high-energy laser from being emitted from the main body 320 to cause harm to the human body. The protective layer can be a light-proof film layer or a plating layer.

[0054] In some embodiments, the thickness of the substrate 310 is 1-5000 pm. For example, the thickness of the substrate 310 can be set to 1 pm, 50 pm, 400 pm, 800 pm, 1250 pm, 2000 pm, 3500 pm, 4000 pm, 5000 pm, and the like.

[0055] In some embodiments, the wall thickness of the main body 320 is 0.1-500 mm. For example, the wall thickness of the main body 320 can be set to 0.1 mm, 10 mm, 150 mm, 300 mm, 500 mm, and the like.

[0056] In some embodiments, the thickness of the cover 330 is 0.1-500 mm. For example, the thickness of the cover 330 can be set to 0.1 mm, 15 mm, 170 mm, 200 mm, 500 mm, and the like.

[0057] In some embodiments, the distance between the first constituent part 231 of the cathode 210 and the anode 220 is 0.01-8 mm, for example, the distance can be 0.01 mm, 0.1 mm, 1 mm, 5 mm, 8 mm, and the like.

[0058] In some embodiments, the distance between the second constituent part 232 of the cathode 210 and the anode 220 is 0.01-8 mm, for example, the distance can be 0.01 mm, 0.2 mm, 1 mm, 3.5 mm, 6 mm, 8 mm, and the like.

[0059] In some embodiments, the shape of the first constituent part 231 and the second constituent part 232 can be set as needed, including but not limited to cylindrical, conical, prismatic, pyramidal. The cross-sectional shape of the first constituent part 231 and the second constituent part 232 can be circular, elliptical, triangular, trapezoidal, rectangular, square, and the like.

[0060] In some embodiments, the thickness of the first constituent part 231 is 0.1-3000 pm. For example, the thickness of the first constituent part 231 can be set to 0.1 pm, 12 pm, 600 pm, 1000 pm, 2800 pm, 3000 pm, and the like.

[0061] In some embodiments, the thickness of the second constituent part 232 is 0.1-3000 pm. For example, the thickness of the second constituent part 232 can be set to 0.1 pm, 18 pm, 460 pm, 1500 pm, 2000 pm, 3000 pm, and the like.

[0062] Compared with the commercially available laser triggered switch, the laser triggered gas switch has a smaller volume, and can be mass-produced with lower cost. In addition, the laser triggered gas switch can realize the integration of the laser and the body 100, realize the integration of the laser and the laser triggered switch, and is more convenient to use.

[0063] Embodiment two

[0064] In this embodiment, a manufacturing method of a laser triggered switch is proposed for manufacturing the laser triggered switch mentioned above. In the manufacturing method, the laser triggered switch is manufactured by using an external laser, i.e., the laser exists independently of the laser triggered switch.

[0065] As shown in Figure 1 and Figure 7 , the manufacturing method comprises the following steps: S11, punching: processing the first through hole 313 and the second through hole 314 on the substrate 310, wherein the conductive part 315 is arranged in the first through hole 313 and the second through hole 314; S12, photoetching and film plating: forming the first component 231 of the cathode 210 and the first component 231 of the anode 220 on the first surface 311 of the substrate 310 by photoetching and film plating, and forming the second component 232 of the cathode 210 and the second component 232 of the anode 220 on the second surface 312 of the substrate 310 by photoetching and film plating; S13, assembly: the substrate 310 and the main body 320 are sealed and fixedly connected by laser bonding, and the cover 330 and the main body 320 are sealed and fixedly connected by laser bonding.

[0066] In some embodiments, the step S11 comprises: (1) selecting a suitable glass material as the substrate 310, wherein the substrate 310 needs to have good dimensional stability, thermal expansion coefficient matching and electrical properties, and also needs to ensure the cleanliness and flatness of the surface of the substrate 310; (2) processing the first through hole 313 and the second through hole 314 on the substrate 310 by laser processing, chemical etching or mechanical processing, wherein the diameter of the first through hole 313 and the second through hole 314 can be millimeter or micrometer level; (3) A conductive member 315 is arranged in the first through hole 313 and the second through hole 314. Specifically, the conductive member 315 is made of a metal material, such as copper, silver, gold, or other material with good conductivity. The conductive member 315 filled in the first through hole 313 and the second through hole 314 is polished by grinding, polishing, or other process, so that the end of the conductive member 315 is flush with the surface of the substrate 310, to ensure the reliability of signal transmission and the flatness of the package. In addition, the surface of the conductive member 315 can be electroplated to increase the conductivity of the conductive member 315, and the electroplated layer also has the effect of protecting the conductive member 315.

[0067] In some embodiments, step S12 comprises: (1) Substrate 310 pretreatment: removing contaminants on the surface of the substrate 310, removing particles, reducing pinholes, and eliminating other defects to improve the adhesion of the photoresist.

[0068] For example, first ultrasonic cleaning in acetone for 1-10 min, then ultrasonic cleaning in ethanol for 1-10 min, and then ultrasonic cleaning in pure water for 1-10 min, wherein the frequency of ultrasonic is 10-100 kHz and the temperature of medium is 10-40°C; after completing the ultrasonic cleaning, pre-baking the substrate 310 to 100-200°C can help to enhance the adhesion of the photoresist to the substrate 310; then spin-coating an adhesion promoter (spin-coating speed is 1000-5000 rpm) on the substrate 310 and pre-baking by a hot plate at 10-100°C for 1-5 min to convert the hydrophilic glass surface to hydrophobic to improve the adhesion of the photoresist.

[0069] (2) Coating photoresist: using spin-coating method to coat photoresist on the corresponding surface of the substrate 310, the spin-coating speed is 100-5000 rpm, the time is 10-100 s, and the thickness of the coated photoresist layer is 0.5-2 µm.

[0070] (3) Pre-baking: baking on a hot plate at 50-200°C for 1-30 min to remove solvents in the photoresist, enhance adhesion, release stress in the photoresist film, and prevent the photoresist from contaminating the equipment; (4) Exposure: aligning by alignment marks and exposing using a UV light source with a wavelength of 300-400 nm, wherein the exposure energy is 100-500 mJ / cm 2 .

[0071] (5) Post-baking: baking by a hot plate at a temperature of 100-2000°C for 1-10 min.

[0072] (6) Development: using tetramethylammonium hydroxide (TMAH) as the developing solution, the standard equivalent concentration is 0.1-0.5, the temperature is 10-300°C, and the developing time is 10-200 s in the spraying mode.

[0073] (7) Hardening: heat the hot plate to 100-2000℃, bake for 1-10 min, so that the adhesive film is more firmly adhered to the surface of the wafer (substrate 310), and the etching resistance of the adhesive layer can be increased.

[0074] (8) Coating: coating is carried out under the conditions of working pressure 0.1-10 Pa, substrate temperature 150-300℃, deposition rate 10-50 nm / min, and film thickness 0.1-500 µm, so that the first component 231 and the second component 232 are respectively formed on the corresponding surface of the substrate 310.

[0075] (9) Stripping: after pattern transfer, ultrasonic cleaning in acetone for 10-30 min at a frequency of 10-50 kHz, and then soaking in a stripping solution at a temperature of 30-100℃ for 10-50 min, so that the photoresist is completely removed.

[0076] When performing photoetching and coating, the first component 231 of the cathode 210 covers one end of the first through hole 313, and the second component 232 of the cathode 210 covers the other end of the first through hole 313, so that the first component 231 and the second component 232 of the cathode 210 are electrically connected with the conductive member 315 in the first through hole 313; the first component 231 of the anode 220 covers one end of the second through hole 314, and the second component 232 of the anode 220 covers the other end of the second through hole 314, so that the first component 231 and the second component 232 of the anode 220 are electrically connected with the conductive member 315 in the second through hole 314.

[0077] Example Three

[0078] In this embodiment, a manufacturing method of a laser trigger switch is proposed. The main difference from the second embodiment is that the laser trigger switch manufactured in this embodiment includes a laser, wherein the laser is mounted on the cover 330, and the laser is located outside the chamber 110 of the laser trigger switch.

[0079] Referring to Figure 8 and Figure 9 , the manufacturing method comprises: S21, Drilling: drilling the first through hole 313 and the second through hole 314 on the substrate 310, wherein a conductive member 315 is arranged in each of the first through hole 313 and the second through hole 314; S22, Photoetching and Coating: forming the first component 231 of the cathode 210 and the first component 231 of the anode 220 on the first surface 311 of the substrate 310 by photoetching and coating, and forming the second component 232 of the cathode 210 and the second component 232 of the anode 220 on the second surface 312 of the substrate 310 by photoetching and coating. S23, total assembly: the substrate 310 and the main body 320 are sealed and fixedly connected by laser bonding, and the cover 330 and the main body 320 are sealed and fixedly connected by laser bonding; S24, installing the laser 400: the laser 400 is installed on the upper surface of the cover 330.

[0080] In step S24, a positioning mark is provided on the upper surface of the cover 330 in advance, and the installation of the laser 400 is positioned by the positioning mark, so that the laser emission port of the laser 400 is aligned with the first component 231 of the cathode 210 or the first component 231 of the anode 220 on the substrate 310. Wherein, the laser 400 can be fixed on the cover 330 by adhesion.

[0081] In other embodiments, step S24 is performed before step S23, that is, the laser 400 is installed on the upper surface of the cover 330 first, and then the total assembly is performed.

[0082] Embodiment four

[0083] In this embodiment, a manufacturing method of a laser trigger switch is provided. The main difference from the embodiment two is that the laser trigger switch manufactured in this embodiment includes a laser, wherein the laser is installed on the cover 330, and the laser is located inside the chamber 110 of the laser trigger switch.

[0084] Reference Figure 10 and Figure 11 The manufacturing method includes: S31, punching: the first through hole 313 and the second through hole 314 are processed on the substrate 310, wherein the conductive part 315 is arranged in the first through hole 313 and the second through hole 314; S32, photoetching and film plating: the first component 231 of the cathode 210 and the first component 231 of the anode 220 are formed on the first surface 311 of the substrate 310 by photoetching and film plating, and the second component 232 of the cathode 210 and the second component 232 of the anode 220 are formed on the second surface 312 of the substrate 310 by photoetching and film plating; S33, assembling the substrate 310 and the main body 320: the substrate 310 and the main body 320 are sealed and fixedly connected by laser bonding; S34, assembling the laser 400 and the cover 330: the laser 400 and the lower surface of the cover 330 are fixedly connected by laser bonding; S35, assembling the cover 330 and the main body 320: the cover 330 and the main body 320 are sealed and fixedly connected by laser bonding.

[0085] In step S34, a positioning mark is provided in advance on the lower surface of the cover 330, and the positioning mark is used to position the laser 400, so that the laser emitting port of the laser 400 can be aligned with the first component 231 of the cathode 210 or the first component 231 of the anode 220 on the substrate 310 after the assembly is completed.

[0086] In some other embodiments, the step S33 and the step S34 can be performed simultaneously, or the step S34 can be performed before the step S33.

[0087] Embodiment five As Figure 12 shown in the embodiment, a working circuit is provided. The working circuit includes a laser triggered switch 1, a current transformer 2, an oscilloscope 3, a direct current power supply 4, a protection resistor 5 and a charging capacitor 6.

[0088] As Figure 13 shown, a flow chart for using the laser triggered switch is provided. The flow chart includes: S41, connecting the circuit: connecting the electrical devices according to the circuit diagram; S42, power supply voltage: turning on the direct current power supply 4 and adjusting the voltage to be within the range of 20%-99% of the self-breakdown voltage of the laser triggered switch; S43, capacitor charging: waiting for the capacitor to be fully charged; S44, starting the laser: providing voltage to the laser to make it work, and the laser emitted by the laser is irradiated on the first component 231 of the cathode 210 or the anode 220; S45, switch closing: the laser interacts with the electrode irradiated by the laser, and under the action of photoionization, thermal ionization and collision ionization, initial plasma is generated.

[0089] With the progress of the discharge, the initial plasma diffuses to the entire chamber 110 under the action of the electric field. Among them, the discharge current is detected by the current transformer 2, and the current transformer 2 converts the current signal into a voltage signal and transmits it to the oscilloscope 3, so that the current signal of the loop can be read by the oscilloscope 3.

[0090] As Figure 14 shown, the trigger is performed under the condition that the external laser source power is 6W, the working voltage is 1.2kV, and the capacitor value is 0.0033uF. After the loop generates current, the current signal is converted into a voltage signal by the current transformer 2, and is transmitted to the oscilloscope 3 for reading. The abscissa represents time, and the ordinate represents voltage.

[0091] The current value decays by 100 times, so the actual current peak value measured is 140A, the peak power exceeds 100kW, and the current rise is about 200ns. The laser triggered switch can be repeatedly switched, with good repeatability.

[0092] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Also, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. Furthermore, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples, without contradiction.

[0093] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and the person skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application.

Claims

1. A laser-triggered switch, characterized in that, Includes a body, the interior of which is provided with a closed chamber; The body is provided with a cathode and an anode. The cathode and the anode each include a first component and a second component. The first component of the cathode is electrically connected to the second component of the cathode, and the first component of the anode is electrically connected to the second component of the anode. The first component is located inside the cavity, and the second component is located outside the cavity; wherein, both the first component and the second component are formed on the corresponding surface of the body by photolithography deposition process.

2. The laser trigger switch according to claim 1, characterized in that, The body includes a substrate, a main body, and a cover. The chamber is disposed inside the main body, and the chamber has a first opening and a second opening respectively formed on two opposite end faces of the main body; Both the substrate and the cover are sealed to the main body, wherein the first opening is closed by the substrate and the second opening is closed by the cover; Both the cathode and the anode are disposed on the substrate; wherein the first component is disposed on the first surface of the substrate, the second component is disposed on the second surface of the substrate, and the first surface and the second surface of the substrate are respectively located on both sides of the substrate thickness direction.

3. The laser trigger switch according to claim 2, characterized in that, The substrate is provided with a first through hole and a second through hole, the first through hole corresponding to the cathode and the second through hole corresponding to the anode; Conductive elements are provided in both the first through hole and the second through hole; The first component of the cathode and the second component of the cathode are electrically connected through a conductive element in the first through hole; the first component of the anode and the second component of the anode are electrically connected through a conductive element in the second through hole.

4. The laser trigger switch according to claim 2, characterized in that, A laser is provided on the cover, and the laser is used to emit laser light toward the first component of the cathode or the first component of the anode; The laser is disposed outside the cavity, or the laser is disposed inside the cavity; Preferably, the laser comprises a vertical cavity surface-emitting laser.

5. The laser trigger switch according to claim 4, characterized in that, The surface of the main body is provided with a protective layer, which is used to block the laser.

6. The laser trigger switch according to claim 2, characterized in that, The thickness of the substrate is 1~5000µm; the wall thickness of the main body is 0.1~500mm; and the thickness of the cover is 0.1~500mm.

7. The laser trigger switch according to claim 1, characterized in that, The distance between the first components of the cathode and the anode is 0.01~8mm; the distance between the second components of the cathode and the anode is 0.01~8mm; The thickness of the first component is 0.1~3000µm, and the thickness of the second component is 0.1~3000µm.

8. A method for manufacturing a laser-triggered switch, used to manufacture the laser-triggered switch as described in any one of claims 2-8, characterized in that, The manufacturing method includes: Photolithography: A first component of a cathode and a first component of an anode are formed on a first surface of a substrate by photolithography, and a second component of a cathode and a second component of an anode are formed on a second surface of a substrate by photolithography. Assembly: The substrate and the main body are sealed and fixedly connected by laser bonding, and the cover is sealed and fixedly connected to the main body by laser bonding.

9. The method for manufacturing a laser-triggered switch according to claim 8, characterized in that, Before the photolithography coating, the following steps are performed: a first through-hole and a second through-hole are processed on the substrate; conductive elements are disposed in both the first through-hole and the second through-hole; During the photolithography coating process: the first component of the cathode covers one end of the first through hole, and the second component of the cathode covers the other end of the first through hole; the first component of the anode covers one end of the second through hole, and the second component of the anode covers the other end of the second through hole.

10. The method for manufacturing a laser-triggered switch according to claim 8, characterized in that, Before completing the final assembly, the laser is mounted on the cover, wherein the laser is located outside or inside the chamber of the laser trigger switch; or, After the assembly is completed, the laser is installed on the cover, wherein the laser is located outside the cavity.

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