Rogowski coil circuit board

Abstract

The invention discloses a Rogowski coil circuit board, and belongs to the technical field of Rogowski coils. The Rogowski coil circuit board comprises a first circuit board body and a second circuit board body, the first circuit board body and the second circuit board body are formed in a split mode, the first circuit board body and the second circuit board body are arranged in a stacked mode in the thickness direction, and the first surface and the third surface are both clamped between the first circuit board body and the second circuit board body. In a plane perpendicular to the thickness direction, the projections of the first winding holes and the projections of the second winding holes are mutually overlapped, and the projections of the third winding holes and the projections of the fourth winding holes are mutually overlapped; the first ends of the plurality of first winding holes are welded and conducted with the first ends of the plurality of second winding holes in a one-to-one correspondence manner, the first ends of the plurality of third winding holes are welded and conducted with the first ends of the plurality of fourth winding holes in a one-to-one correspondence manner, so that one turn of the first Rogowski coil is formed, and the output end of the first Rogowski coil is used for being connected with an integrating circuit.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of Rogowski coils, and particularly relates to a Rogowski coil circuit board. BACKGROUND

[0002] The Rogowski coil is widely applied to the fields of power detection, industrial automation and measurement due to its good linearity and wide measurement range.

[0003] In detail, the Rogowski coil is a hollow annular coil which can be directly sleeved on a conductor to be measured to measure an alternating current. When the measured current passes through the center of the Rogowski coil along an axis, a corresponding varying magnetic field is generated in a volume surrounded by the annular winding, and the size of the alternating current can be determined by measuring a differential signal output by the Rogowski coil. However, the measurement precision of the current Rogowski coil is relatively low. SUMMARY

[0004] The Rogowski coil circuit board provided by the application can solve the problem of low measurement precision of the current Rogowski coil.

[0005] In a first aspect, the application provides a Rogowski coil circuit board, which comprises a first circuit board and a second circuit board, the first circuit board and the second circuit board are separately formed, wherein, The first circuit board is provided with a first conductive layer, a plurality of first winding holes and a plurality of third winding holes, the first conductive layer comprises a plurality of first conductive wires, and the first end of each of the first winding holes and the third winding holes extends to the first surface of the first circuit board; The second circuit board is provided with a second conductive layer, a plurality of second winding holes and a plurality of fourth winding holes, the second conductive layer comprises a plurality of second conductive wires, and the first end of each of the second winding holes and the fourth winding holes extends to the third surface of the second circuit board; The first circuit board and the second circuit board are stacked in the thickness direction, and the first surface and the third surface are clamped between the first circuit board and the second circuit board; in a plane perpendicular to the thickness direction, the projection of the plurality of first winding holes and the projection of the plurality of second winding holes overlap each other, and the projection of the plurality of third winding holes and the projection of the plurality of fourth winding holes overlap each other; The first end of each of the plurality of first winding holes and the first end of each of the plurality of second winding holes are welded in correspondence, and the first end of each of the plurality of third winding holes and the first end of each of the plurality of fourth winding holes are welded in correspondence; In this configuration, the second end of a first conductive wire is connected to the first end of a second conductive wire through a set of interconnected first and second winding holes, and the second end of the second conductive wire is connected to the first end of another first conductive wire through a set of interconnected fourth and third winding holes, thereby forming one turn of a first Rogowski coil, and the output terminal of the first Rogowski coil is used to connect to an integrating circuit.

[0006] Secondly, embodiments of this application provide a Rogowski coil circuit board, which includes a first circuit board and a second circuit board. The first circuit board and the second circuit board are separately formed, and a first Rogowski coil is formed on both the first circuit board and the second circuit board.

[0007] Thirdly, embodiments of this application provide a current detection circuit, which includes an integrating circuit and the aforementioned Rogowski coil circuit board, wherein the output terminal of the first Rogowski coil circuit board is connected to the input terminal of the integrating circuit.

[0008] This application discloses a Rogowski coil circuit board, in which a first Rogowski coil is simultaneously formed on a first circuit board and a second circuit board, thereby increasing the single-turn area of ​​the first Rogowski coil. At the same time, since the first circuit board and the second circuit board are formed separately, the thickness of the first circuit board and the second circuit board is relatively small, thereby significantly improving the measurement accuracy of the Rogowski coil circuit board while significantly reducing the overall processing cost of the Rogowski coil circuit board. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the structure of the Rogowski coil circuit board disclosed in the embodiments of this application; Figure 2 This is a top view of the Rogowski coil circuit board disclosed in the embodiments of this application; Figure 3 yes Figure 2 A partially enlarged view of the structure shown; Figure 4 This is a schematic diagram of the winding principle of the first Rogowski coil in the Rogowski coil circuit board disclosed in the embodiments of this application; Figure 5 This is a schematic diagram of the winding principle of the first coil in the Rogowski coil circuit board disclosed in the embodiments of this application; Figure 6 This is a schematic diagram of the winding principle of the second Rogowski coil in the Rogowski coil circuit board disclosed in the embodiments of this application; Figure 7 This is a schematic diagram of the winding principle of the second coil in the Rogowski coil circuit board disclosed in the embodiments of this application; Figure 8This is a schematic diagram showing the location of the positive output terminal in the Rogowski coil circuit board disclosed in the embodiments of this application; Figure 9 This is a schematic diagram showing the location of the negative output terminal in the Rogowski coil circuit board disclosed in the embodiments of this application; Figure 10 This is a circuit diagram of the current detection circuit disclosed in the embodiments of this application.

[0010] The attached diagram is described as follows: 100 - First circuit board, 101 - First winding hole, 103 - Third winding hole, 105 - Fifth winding hole, 107 - Seventh winding hole, 109 - Ninth winding hole, 111 - Eleventh winding hole, 113 - Thirteenth winding hole, 115 - Fifteenth winding hole 121-First grounding hole, 131 - First conductive line, 133 - Third conductive line, 135 - Fifth conductive line, 137 - Seventh conductive line 200 - Second circuit board, 232 - Second conductive line, 234 - Fourth conductive line, 236 - Sixth conductive line, 238 - Eighth conductive line 300 - Third circuit board. Detailed Implementation

[0011] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0012] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0013] like Figures 1-10 As shown in the embodiment of this application, a Rogowski coil circuit board with relatively high measurement accuracy is disclosed.

[0014] As stated above, the inventors of this application have discovered that the measurement accuracy of Rogowski coils in related technologies is relatively low. Therefore, the applicant proposes that the measurement accuracy of Rogowski coils can be improved by increasing the mutual inductance of the Rogowski coils.

[0015] To increase the mutual inductance of the Rogowski coil, the inventors proposed increasing the single-turn area of ​​the Rogowski coil. In the technical solution of forming the Rogowski coil using a printed circuit board, metallized vias are generally used to provide connections between printed lines of different layers. To this end, the inventors first proposed that the single-turn area of ​​the Rogowski coil could be increased by increasing the length of the printed lines. However, the inventors further discovered that as the length of the printed lines increases, the maximum distance between the printed lines and the center of the Rogowski coil increases accordingly. This has a negative impact on the measurement accuracy of the Rogowski coil. Therefore, increasing the size of the printed lines may not improve the measurement accuracy of the Rogowski coil.

[0016] To address the above situation, the inventors further proposed increasing the area of ​​a single-turn coil by increasing the depth of the metallized vias, that is, by increasing the dimensions of the printed lines between the different layers in the thickness direction of the circuit board. Here, the aforementioned thickness direction refers to the stacking direction of the printed lines between the different layers.

[0017] Furthermore, in order to increase the depth of the metallized vias, the inventors proposed that the thickness of the circuit board could be increased, which would more directly increase the thickness spacing between the different interlayer printed lines connected to the metallized vias at their respective ends.

[0018] However, regarding the above-mentioned technical solution, the inventors further discovered that in order to obtain the required measurement accuracy, the thickness of the circuit board usually needs to be increased significantly beyond the conventional thickness, sometimes even more than three times the conventional thickness. Since the greater the thickness of the circuit board, the greater the processing difficulty, and the more difficult it is to process metallized holes on a thicker circuit board, and the processing difficulty and cost increase exponentially rather than linearly with increasing circuit board thickness, increasing the single-turn area of ​​the Rogowski coil to improve its measurement accuracy results in extremely high processing costs for the Rogowski coil. This leads to a disproportionate benefit (i.e., increased measurement accuracy) compared to the expenditure (i.e., the overall processing cost of the circuit board). Furthermore, significantly increasing the circuit board thickness also leads to an increase in the yield and failure rate of the circuit board, which further increases the processing cost of the Rogowski coil.

[0019] It's worth noting that the standard thickness of circuit boards is 1.6mm. This thickness is the most common type of circuit board, with the most mature manufacturing process, the highest processing efficiency, and almost all board manufacturers have the corresponding production lines and processing capabilities, resulting in the lowest processing cost for 1.6mm circuit boards. Furthermore, the strength of a 1.6mm circuit board can basically meet most conventional requirements, making it the most widely used and accepted type.

[0020] Therefore, after further research, the inventors creatively proposed the following technical solutions for which protection is sought in this application. Among them, as... Figure 1 As shown, the Rogowski coil circuit board disclosed in this application includes a first circuit board and a second circuit board 200.

[0021] Furthermore, in this embodiment, the first circuit board and the second circuit board 200 are formed separately. That is, in this application, the first circuit board and the second circuit board 200 included in the Rogowski coil circuit board are processed separately. This ensures that the total thickness of the Rogowski coil circuit board is relatively large, while making the processing difficulty of each circuit board (including the first circuit board and the second circuit board 200) relatively low. Correspondingly, since the thickness of each circuit board is relatively small, the processing cost of each circuit board can be greatly reduced, and the processing accuracy and yield of each circuit board are relatively high.

[0022] Based on the above structure, in order to form a Rogowski coil on the first circuit board and the second circuit board 200, it is necessary to form corresponding metal lines and interlayer metallization holes on the first circuit board and the second circuit board 200. By connecting the metal lines and metallization holes end to end in a predetermined rule, a spirally wound first Rogowski coil can be formed. That is, in the Rogowski coil circuit board disclosed in the embodiments of this application, the first Rogowski coil is formed on both the first circuit board and the second circuit board 200.

[0023] In detail, in this application, the first circuit board is provided with a first conductive layer, a plurality of first winding holes 101 and a plurality of third winding holes 103, and the second circuit board 200 is provided with a second conductive layer, a plurality of second winding holes and a plurality of fourth winding holes. The first conductive layer includes a plurality of first conductive lines 131, and the second conductive layer includes a plurality of second conductive lines 232. The first and second conductive layers are the metal wires that need to be interconnected between different layers. Correspondingly, the first winding holes 101, second winding holes, third winding holes 103, and fourth winding holes are all metallized holes used to connect the metal wires between different layers. Of course, the relative positions of the two ends of each of the multiple conductive lines (including the first conductive lines 131 and second conductive lines 232, etc.) and the setting position of each winding hole (including the first winding hole 101, second winding hole, third winding hole 103, and fourth winding hole, etc.) need to be determined according to the actual winding rules to ensure that a Rogowski coil can be formed when winding according to the scheme described in this application.

[0024] As described above, the first conductive layer is located on the first circuit board, and the second conductive layer is located on the second circuit board 200. Since the first circuit board and the second circuit board 200 are two independent and separate devices, to ensure that the first conductive layer can be interconnected with the second conductive layer, in this application, the first ends of each first winding hole 101 and each third winding hole 103 extend to the first surface of the first circuit board, and the first ends of each second winding hole and each fourth winding hole extend to the third surface of the second circuit board 200. The first surface is either the front or back of the first circuit board. Correspondingly, the first circuit board also includes a second surface opposite to the first surface; similarly, the second circuit board 200 also includes a fourth surface opposite to the third surface.

[0025] Based on this, during the assembly of the Rogowski coil circuit board disclosed in the embodiments of this application, the first circuit board and the second circuit board 200 can be stacked in the thickness direction, and the first surface and the third surface are sandwiched between the first circuit board and the second circuit board 200.

[0026] Meanwhile, by designing and restricting the positions of the first winding hole 101 and the third winding hole 103 on the first circuit board, and the second winding hole and the fourth winding hole on the second circuit board 200, the projections of the multiple first winding holes 101 overlap with the projections of the multiple second winding holes in a plane perpendicular to the thickness direction, and the projections of the multiple third winding holes 103 overlap with the projections of the multiple fourth winding holes.

[0027] More intuitively, in the embodiments of this application, the first winding hole 101 on the first circuit board and the second winding hole on the second circuit board 200 correspond one-to-one in number and position. Correspondingly, the third winding hole 103 on the first circuit board and the fourth winding hole on the second circuit board 200 correspond one-to-one in number and position.

[0028] Therefore, in this application, the structure and size of the first circuit board and the second circuit board 200 can be considered to be the same. In other words, in this application, the second circuit board 200 is the first circuit board. The difference in their names is only for the convenience of describing this application. In practical applications, taking the aforementioned thickness direction as the vertical direction as an example, the circuit board located in the upper half of the Rogowski coil circuit board can be called either the first circuit board or the second circuit board 200. Correspondingly, the circuit board located in the lower half of the Rogowski coil circuit board can be called either the second circuit board 200 or the first circuit board.

[0029] Based on the structure disclosed in this application, during the assembly of the first circuit board and the second circuit board 200, since the first surface of the first circuit board and the third surface of the second circuit board 200 face each other and are close to each other, the first ends of the plurality of first winding holes 101 can be welded to the first ends of the plurality of second winding holes in a one-to-one correspondence, and the first ends of the plurality of third winding holes 103 can be welded to the first ends of the plurality of fourth winding holes in a one-to-one correspondence, thereby enabling the plurality of first winding holes 101 and the plurality of second winding holes to form a plurality of hole groups. Each of the aforementioned hole groups includes one first winding hole 101 and one second winding hole, and the two correspond one-to-one and are interconnected. Correspondingly, the plurality of third winding holes 103 and the plurality of fourth winding holes can form a plurality of hole groups. Each of the aforementioned hole groups includes one third winding hole 103 and one fourth winding hole, and the two correspond one-to-one and are interconnected.

[0030] Based on the above scheme, the first conductive wire 131 in the separately formed first circuit board can form a conductive relationship with the corresponding second conductive wire 232 in the second circuit board 200 through the first winding hole 101 and the corresponding second winding hole. At the same time, the other end of the aforementioned second conductive wire 232 in the second circuit board 200 can also form a conductive relationship with another first conductive wire 131 in the first circuit board through the fourth winding hole and the corresponding third winding hole 103. This can serve as a single turn of a Rogowski coil. Similarly, each first conductive wire 131, the corresponding first winding hole 101 and second winding hole, the corresponding second conductive wire 232, and the corresponding first conductive wire 131 through the fourth winding hole and third winding hole 103 can form a single turn of a Rogowski coil, thereby ultimately forming a spirally extended and wound Rogowski coil.

[0031] Of course, in order to ensure that the Rogowski coil can output a signal and determine the magnitude of the current based on the aforementioned signal, one of the two ends of the Rogowski coil needs to be used as an output terminal, and the output terminal can be connected to an integrating circuit or the like to determine the magnitude of the current. At the same time, in order to ensure that the measurement can be performed normally, the other end of the Rogowski coil also needs to provide a reference. In a specific embodiment of this application, the end of the Rogowski coil furthest from the output terminal can be grounded.

[0032] That is, in the Rogowski coil circuit board disclosed in the embodiments of this application, the second end of a first conductive wire 131 is connected to the first end of a second conductive wire 232 through a set of interconnected first winding holes 101 and second winding holes, and the second end of a second conductive wire 232 is connected to the first end of another first conductive wire 131 through a set of interconnected fourth winding holes and third winding holes 103, so as to form one turn of the first Rogowski coil, and the output end of the first Rogowski coil is used to connect to the integrating circuit.

[0033] This application discloses a Rogowski coil circuit board, in which a first Rogowski coil is simultaneously formed on a first circuit board and a second circuit board 200, thereby increasing the single-turn area of ​​the first Rogowski coil. At the same time, since the first circuit board and the second circuit board 200 are formed separately, the thickness of the first circuit board and the second circuit board 200 is relatively small, thereby significantly improving the measurement accuracy of the Rogowski coil circuit board while significantly reducing the overall processing cost of the Rogowski coil circuit board.

[0034] As described above, the thickness of both the first circuit board and the second circuit board 200 in this application is relatively small, thereby significantly reducing processing costs. In a specific embodiment of this application, the thickness of both the first circuit board and the second circuit board 200 is 1.6 mm, that is, in this application, both the first circuit board and the second circuit board 200 are conventional thickness circuit boards, which can significantly reduce the processing difficulty of the entire Rogowski coil circuit board.

[0035] Furthermore, it should be noted that although the processing of the Rogowski coil circuit board disclosed in this application includes a welding connection process between the first winding hole 101 and the second winding hole, as well as between the third winding hole 103 and the fourth winding hole, the increased thickness of the circuit board leads to an exponential increase in the processing cost of the metallized holes. Therefore, the cost of the aforementioned welding connection process between the winding holes in this application is far less than the increase in processing cost of the metallized holes in a circuit board with an unconventional thickness twice that of the first circuit board. Thus, even though the manufacturing process of the Rogowski coil circuit board disclosed in this application includes a welding process between the winding holes, it is still possible to significantly improve measurement accuracy while significantly reducing processing costs.

[0036] Of course, in order to further improve the measurement accuracy of the Rogowski coil circuit board disclosed in the embodiments of this application, the thickness of the first circuit board and the second circuit board 200 in the Rogowski coil circuit board disclosed in the embodiments of this application can also be greater than the conventional thickness, i.e., 1.6mm. In this case, the measurement accuracy of the Rogowski coil circuit board can be increased, and compared with the single-board method, i.e., the thickness of a circuit board is equal to the sum of the thicknesses of the first circuit board and the second circuit board 200 in this application (or the spacing between the first conductive layer and the second conductive layer in the thickness direction), the cost of the technical solution disclosed in the embodiments of this application is still relatively low.

[0037] In order to reduce the processing cost of the Rogowski coil circuit board as much as possible, in a further embodiment of this application, the Rogowski coil circuit board may include at least one third circuit board 300, so as to further increase the spacing between the first conductive layer and the second conductive layer in the thickness direction by utilizing the third circuit board 300, thereby further increasing the single-turn area of ​​the first Rogowski coil and achieving the purpose of improving its measurement accuracy.

[0038] Furthermore, in this embodiment, the third circuit board 300 is formed separately from the first circuit board and the second circuit board 200. That is, in this application, the first circuit board, the second circuit board 200, and the third circuit board 300 are all independent and separately processed structures. This allows each of the three to have a relatively small thickness, while ensuring that the total thickness of the Rogowski coil circuit board including the aforementioned three is relatively large, thereby significantly reducing the processing cost of the entire Rogowski coil circuit board. Therefore, if the required total thickness of the Rogowski coil circuit board is greater than 3.2mm (i.e., the sum of the thicknesses of the conventionally thick first circuit board and the conventionally thick second circuit board 200), in this embodiment, the third circuit board 300 can be added to ensure that the total thickness of the formed Rogowski coil circuit board is greater than 3.2mm while the first circuit board and the second circuit board 200 still use conventional thicknesses.

[0039] It should be noted that in this application, the thickness of the circuit board is used to refer to the single-turn area of ​​the Rogowski coil. However, objectively, when the first conductive layer and the second conductive layer are located on the second surface of the first circuit board and the fourth surface of the second circuit board 200, respectively, the total thickness of the Rogowski coil circuit board has the ability to represent the single-turn area of ​​the Rogowski coil. However, when the first conductive layer and the second conductive layer are located inside the first circuit board and the second circuit board 200, respectively, the actual distance between the first conductive layer and the second conductive layer in the thickness direction is smaller than the total thickness of the Rogowski coil circuit board. This makes it impossible for the total thickness of the Rogowski coil circuit board to objectively represent the single-turn area of ​​the Rogowski coil. Therefore, for the sake of simplicity in describing this application, unless otherwise specified, the thickness of the Rogowski coil circuit board is considered to represent the single-turn area of ​​the Rogowski coil.

[0040] In the case of a third circuit board 300, in order to ensure that the first conductive line 131 can still form a conductive relationship with the corresponding second conductive line 232 through the first winding hole 101 and the second winding hole (as well as the third winding hole 103 and the fourth winding hole), in this embodiment of the application, the third circuit board 300 can be provided with a plurality of first connecting holes and a plurality of second connecting holes. The first end of each first connecting hole and each second connecting hole extends to the fifth surface of the third circuit board 300, and the second end of each first connecting hole and each second connecting hole extends to the sixth surface of the third circuit board 300. In this application, the fifth surface and the sixth surface are two opposite surfaces of the third circuit board 300, namely the front and back surfaces of the third circuit board 300.

[0041] Meanwhile, in the thickness direction, by sandwiching the third circuit board 300 between the first circuit board and the second circuit board 200, and sandwiching the fifth surface between the first surface and the sixth surface, the third circuit board 300 is guaranteed to provide a bridging function for the first winding hole 101 and the second winding hole, as well as the third winding hole 103 and the fourth winding hole.

[0042] Of course, in the process of designing and manufacturing the third circuit board 300, it is also necessary to make the projections of the multiple first winding holes 101 overlap with the projections of the multiple first connecting holes in a plane perpendicular to the thickness direction, and to make the projections of the multiple third winding holes 103 overlap with the projections of the multiple second connecting holes.

[0043] In this case, by welding the first ends of the plurality of first winding holes 101 to the first ends of the plurality of first connecting holes one-to-one, and by welding the second ends of the plurality of first connecting holes to the first ends of the plurality of second winding holes one-to-one, it can be ensured that the first winding holes 101 can still be connected to the second winding holes one-to-one. Correspondingly, by welding the first ends of the plurality of third winding holes 103 to the first ends of the plurality of second connecting holes one-to-one, and by welding the second ends of the plurality of first connecting holes to the first ends of the plurality of fourth winding holes one-to-one, it can be ensured that the third winding holes 103 can still be connected to the fourth winding holes one-to-one.

[0044] As described above, by adding a third circuit board 300, the total thickness of the entire Rogowski coil circuit board can be greater than 3.2mm while the thickness of the first circuit board and the second circuit board 200 remains at the conventional thickness (i.e., 1.6mm). This increases the dimensions of the first conductive layer and the second conductive layer in the thickness direction, thereby achieving the goal of increasing the single-turn area of ​​the Rogowski coil.

[0045] Therefore, in one specific embodiment of this application, the thickness of the third circuit board 300 can be 1.6 mm, which makes the processing cost of the third circuit board 300 relatively low. In order to further increase the single-turn area of ​​the Rogowski coil, the thickness of the third circuit board 300 can also be greater than 1.6 mm. Considering that the third circuit board 300 does not need to be provided with printed lines or other metal conductive layers, even if the thickness of the third circuit board 300 exceeds the conventional thickness, the cost of the third circuit board 300 will not increase exponentially.

[0046] However, the inventors of this application further propose that the number of third circuit boards 300 can be multiple. In this case, even if the thickness of each third circuit board 300 is a conventional thickness, the spacing between the first conductive layer and the second conductive layer in the thickness direction can be increased by increasing the number of third circuit boards 300, thereby achieving the purpose of increasing the single-turn area of ​​the Rogowski coil.

[0047] Furthermore, when the thickness of each of the multiple stacked third circuit boards 300 is a conventional thickness, compared to a third circuit board 300 with the same total thickness but using an unconventional thickness, even with the addition of soldering processes between adjacent third circuit boards 300, the total processing cost of the third circuit board 300 can be significantly reduced, thereby reducing the processing cost of the Rogowski coil circuit board.

[0048] As described above, when there are multiple third circuit boards 300, which are stacked and sandwiched between the first and second circuit boards 200, it is necessary to make the multiple third circuit boards 300 interconnected. Therefore, in the embodiments of this application, the multiple first connecting holes of each of the multiple third circuit boards 300 are soldered to each other in a corresponding manner, and the multiple second connecting holes of each of the multiple third circuit boards 300 are soldered to each other in a corresponding manner.

[0049] In order to reduce the interference of the external magnetic field on the first Rogowski coil, which would adversely affect the measurement accuracy of the Rogowski coil circuit board disclosed in the embodiments of this application, in a specific embodiment of this application, at least one of the first circuit board and the second circuit board 200 may be provided with a first loop coil, and the winding direction of the first loop coil is opposite to the winding direction of the first Rogowski coil. At the same time, one end of the first loop coil is connected to the other end of the first Rogowski coil away from its output end.

[0050] Specifically, the first coil can be formed using copper wire or copper foil. Furthermore, the first coil can be coplanar with the first conductive layer, and by wrapping the first coil around the outer periphery of each of the first conductive lines 131 in the first conductive layer, it can be ensured that the first coil does not obstruct the connection paths between the multiple first conductive lines 131 and the first winding hole 101 and the third winding hole 103. Similarly, the first coil can also be coplanar with the second conductive layer.

[0051] In order to further improve the anti-interference performance of the first loop coil and thus improve the measurement accuracy of the entire Rogowski coil circuit board, in a specific embodiment of this application, similar to the first Rogowski coil, the first loop coil can also be a multi-turn structure, and the first loop coil is also formed on the first circuit board and the second circuit board 200 at the same time.

[0052] In detail, in the embodiments of this application, the first circuit board may be provided with a third conductive layer, a plurality of fifth winding holes 105 and a seventh winding hole 107, and the second circuit board 200 may be provided with a fourth conductive layer, a plurality of sixth winding holes and an eighth winding hole.

[0053] The third conductive layer includes multiple third conductive lines 133, the fourth conductive layer includes multiple fourth conductive lines 234, the first ends of each fifth winding hole 105 and each seventh winding hole 107 extend to the first surface of the first circuit board, and the first ends of each sixth winding hole and each eighth winding hole extend to the third surface of the second circuit board 200, so as to ensure that the third conductive lines 133 can be interconnected with the corresponding fourth conductive lines 234.

[0054] Simultaneously, during the design and fabrication of the aforementioned structure, it is also necessary to ensure that the fifth winding hole 105 corresponds to the sixth winding hole, and that the seventh winding hole 107 corresponds to the eighth winding hole. Specifically, in a plane perpendicular to the thickness direction, the projections of the plurality of fifth winding holes 105 overlap with the projections of the plurality of sixth winding holes, and the projections of the plurality of seventh winding holes 107 overlap with the projections of the plurality of eighth winding holes.

[0055] Furthermore, by welding the first ends of the plurality of fifth winding holes 105 to the first ends of the plurality of sixth winding holes one by one, and by welding the first ends of the plurality of seventh winding holes 107 to the first ends of the plurality of eighth winding holes one by one, it can be ensured that the third conductive wire 133 can be connected to the corresponding fourth conductive wire 234 through the fifth winding holes 105 and the sixth winding holes. At the same time, it can be ensured that the fourth conductive wire 234 can be connected to another third conductive wire 133 through another sixth winding hole and the fifth winding hole 105, thereby forming a single-turn structure of the first loop coil.

[0056] Therefore, in this application, the second end of a third conductive wire 133 is connected to the first end of a fourth conductive wire 234 through a set of interconnected fifth winding holes 105 and sixth winding holes, and the second end of a fourth conductive wire 234 is connected to the first end of another third conductive wire 133 through a set of interconnected seventh winding holes 107 and eighth winding holes, so as to form one turn of the first loop.

[0057] In the above embodiments, the first circuit board is provided with a first conductive layer and a third conductive layer, and the second circuit board 200 is provided with a second conductive layer and a fourth conductive layer. To reduce the processing difficulty of the first Rogowski coil and the first loop coil, in a specific embodiment of this application, the third conductive layer and the fourth conductive layer can both be located between the first conductive layer and the second conductive layer. That is, the third conductive layer is located on the side of the first conductive layer closer to the second circuit board 200, and the fourth conductive layer is located on the side of the second conductive layer closer to the first circuit board. Of course, the third conductive layer is located inside the first circuit board, and the fourth conductive layer is located inside the second circuit board 200. As for the specific placement of the third and fourth conductive layers in the thickness direction, it can be flexibly selected according to the actual situation. More specifically, when the process allows, along the thickness direction, the spacing between the third conductive layer and the first conductive layer can be minimized, and the spacing between the fourth conductive layer and the second conductive layer can be minimized, so that the single-turn area of ​​the first loop coil is as close as possible to or even equal to the single-turn area of ​​the first Rogowski coil, thereby further improving the anti-interference capability of the first loop coil.

[0058] Based on the above embodiments, optionally, the first conductive layer is located on the second surface of the first circuit board, and the second conductive layer is located on the fourth surface of the second circuit board 200.

[0059] In another embodiment of this application, the first conductive layer can be located inside the first circuit board, that is, the first conductive layer is located between the first surface and the second surface of the first circuit board, and the second conductive layer is located between the third surface and the fourth surface of the second circuit board 200, so that the second conductive layer is also located inside the second circuit board 200. By adopting the above technical solution, the protection effect on the first Rogowski coil can be improved, thereby increasing the service life of the Rogowski coil circuit board.

[0060] In order to further reduce the winding difficulty of the first Rogowski coil and the first loop coil and improve the processing efficiency, in a specific embodiment of this application, a plurality of first winding holes 101 can be distributed at intervals along the circumferential direction, a plurality of third winding holes 103 can be distributed at intervals along the circumferential direction, a plurality of fifth winding holes 105 can be distributed at intervals along the circumferential direction, and a plurality of seventh winding holes 107 can be distributed at intervals along the circumferential direction.

[0061] Optionally, in the radial direction, the first winding hole 101, the third winding hole 103, the fifth winding hole 105, and the seventh winding hole 107 can be sequentially distributed from the outside to the inside. In another embodiment of this application, in order to improve the scalability of the Rogowski coil circuit board, the first winding hole 101, the fifth winding hole 105, the third winding hole 103, and the seventh winding hole 107 can be arranged from the outside to the inside. In this case, other winding hole structures can be further added between the fifth winding hole 105 and the third winding hole 103, and correspondingly added to the inside of the seventh winding hole 107, thereby greatly improving the scalability of the Rogowski coil circuit board and significantly reducing the winding difficulty and processing cost.

[0062] As described above, by adding a third circuit board 300, the total thickness of the Rogowski coil circuit board can be further increased while the first and second circuit boards 200 use conventional thickness dimensions. Therefore, when the Rogowski coil circuit board includes a first coil, a third circuit board 300 can be further included, and the spacing between the third conductive line 133 and the fourth conductive line 234 in the thickness direction can be further increased, thereby increasing the single-turn area of ​​the first coil and improving its anti-interference effect.

[0063] In detail, the Rogowski coil circuit board also includes a third circuit board 300, which has a plurality of third connecting holes and a plurality of fourth connecting holes. The first end of each third connecting hole and each fourth connecting hole extends to the fifth surface of the third circuit board 300, and the second end of each third connecting hole and each fourth connecting hole extends to the sixth surface of the third circuit board 300.

[0064] In the thickness direction, the third circuit board 300 is sandwiched between the first circuit board and the second circuit board 200, and the fifth surface is sandwiched between the first surface and the sixth surface; in a plane perpendicular to the thickness direction, the projections of the plurality of fifth winding holes 105 overlap with the projections of the plurality of third connecting holes, and the projections of the plurality of seventh winding holes 107 overlap with the projections of the plurality of fourth connecting holes.

[0065] The first ends of the plurality of fifth winding holes 105 are welded to the first ends of the plurality of third connecting holes in a one-to-one correspondence, and the second ends of the plurality of third connecting holes are welded to the first ends of the plurality of sixth winding holes in a one-to-one correspondence.

[0066] The first ends of the plurality of seventh winding holes 107 are welded to the first ends of the plurality of fourth connecting holes in a one-to-one correspondence, and the second ends of the plurality of fourth connecting holes are welded to the first ends of the plurality of eighth winding holes in a one-to-one correspondence.

[0067] As described above, by further adding a third connecting hole and a fourth connecting hole to the third circuit board 300, the third circuit board 300 can use the third connecting hole to provide bridging and conduction for the fifth winding hole 105 and the sixth winding hole, and the third circuit board 300 can use the fourth connecting hole to provide bridging and conduction for the seventh winding hole 107 and the eighth winding hole, ensuring that the third conductive line 133 and the fourth conductive line 234 can be connected accordingly, and increasing the single-turn area of ​​the first loop coil.

[0068] In the above embodiments, the inventors proposed methods to increase the single-turn area of ​​the first Rogowski coil and to add a first loop coil, respectively, to improve the measurement accuracy of the Rogowski coil circuit board.

[0069] To further improve measurement accuracy, the inventors of this application further propose that the accuracy of the differential signal output by the Rogowski coil circuit board can be further reduced by decreasing common-mode interference. Specifically, in the embodiments of this application, the inventors propose that a dual-ended or multi-ended output method can be used to reduce the impact of common-mode interference on the accuracy of the output signal, thereby improving the current detection accuracy of the Rogowski coil. That is, in the embodiments of this application, the Rogowski coil circuit board may include a second Rogowski coil, and even a third or fourth Rogowski coil, in addition to the aforementioned first Rogowski coil. By connecting the aforementioned multiple parallel Rogowski coils to the integrating circuit, the adverse effects of common-mode interference on measurement accuracy can be significantly reduced, thereby greatly improving the detection accuracy.

[0070] More specifically, in this embodiment, the first circuit board further comprises a fifth conductive layer, a plurality of ninth winding holes 109 and a plurality of eleventh winding holes 111, and the second circuit board 200 further comprises a sixth conductive layer, a plurality of tenth winding holes and a plurality of twelfth winding holes. The fifth conductive layer includes a plurality of fifth conductive lines 135, and the sixth conductive layer includes a plurality of sixth conductive lines 236. The first ends of each ninth winding hole 109 and the plurality of eleventh winding holes 111 extend to the first surface of the first circuit board, and the first ends of each tenth winding hole and the plurality of twelfth winding holes extend to the third surface of the second circuit board 200.

[0071] Furthermore, in a plane perpendicular to the thickness direction, the projections of multiple ninth winding holes 109 overlap with the projections of multiple tenth winding holes, and the projections of multiple eleventh winding holes 111 overlap with the projections of multiple twelfth winding holes; the first ends of multiple ninth winding holes 109 are welded to the first ends of multiple tenth winding holes one by one, and the first ends of multiple eleventh winding holes 111 are welded to the first ends of multiple twelfth winding holes one by one.

[0072] In this circuit, the second end of a fifth conductive wire 135 is connected to the first end of a sixth conductive wire 236 through a set of interconnected ninth and tenth winding holes, and the second end of a sixth conductive wire 236 is connected to the first end of another fifth conductive wire 135 through a set of interconnected eleventh and twelfth winding holes, to form one turn of a second Rogowski coil. The output end of the second Rogowski coil is used to connect to an integrating circuit, and the second Rogowski coil is connected in parallel with the first Rogowski coil.

[0073] Of course, in the above technical solution, the ends of the first and second Rogowski coils furthest from the output terminals are both used as reference terminals. More specifically, these reference terminals can be grounded. Furthermore, when the Rogowski coil circuit board is connected to the integrating circuit, the output terminals of the first and second Rogowski coils can be connected to the two input terminals of the integrating circuit, with the first Rogowski coil as the positive terminal and the second Rogowski coil as the negative terminal. Simultaneously, the reference terminals of both the first and second Rogowski coils are the center terminals of the Rogowski coils, which are grounded and connected to the ground terminal of the integrating circuit, thereby further improving the measurement accuracy of the Rogowski coil circuit board.

[0074] Furthermore, similar to the first Rogowski coil, the single-turn area of ​​the second Rogowski coil can also be increased by adding a third circuit board 300.

[0075] In detail, in the embodiments of this application, the Rogowski coil circuit board may further include a third circuit board 300. The third circuit board 300 is provided with a plurality of fifth connecting holes and a plurality of sixth connecting holes. The first end of each fifth connecting hole and each sixth connecting hole extends to the fifth surface of the third circuit board 300, and the second end of each fifth connecting hole and each sixth connecting hole extends to the sixth surface of the third circuit board 300.

[0076] In the thickness direction, the third circuit board 300 is sandwiched between the first circuit board and the second circuit board 200, and the fifth surface is sandwiched between the first surface and the sixth surface; in a plane perpendicular to the thickness direction, the projections of multiple ninth winding holes 109 overlap with the projections of multiple fifth connecting holes, and the projections of multiple eleventh winding holes 111 overlap with the projections of multiple sixth connecting holes.

[0077] The first ends of multiple ninth winding holes 109 are welded to the first ends of multiple fifth connecting holes in a one-to-one correspondence, and the second ends of multiple fifth connecting holes are welded to the first ends of multiple tenth winding holes in a one-to-one correspondence; the first ends of multiple eleventh winding holes 111 are welded to the first ends of multiple sixth connecting holes in a one-to-one correspondence, and the second ends of multiple sixth connecting holes are welded to the first ends of multiple twelfth winding holes in a one-to-one correspondence.

[0078] In the case where the Rogowski coil circuit board includes a second Rogowski coil, in order to reduce the overall processing difficulty and cost of the Rogowski coil circuit board, the fifth conductive layer and the sixth conductive layer can optionally be located between the first conductive layer and the second conductive layer. Of course, the fifth conductive layer and the sixth conductive layer are located inside the first circuit board and the second circuit board 200, respectively, and the spacing between the fifth conductive layer and the first conductive layer and the second conductive layer in the thickness direction is not limited in this paper.

[0079] In addition, in the above embodiments, the first circuit board is further provided with a third conductive layer, and the second circuit board 200 is further provided with a fourth conductive layer. Based on this, in order to reduce the difficulty of grounding the reference terminals of the first Rogowski coil and the second Rogowski coil, the third conductive layer and the fourth conductive layer can be located between the first conductive layer and the second conductive layer, and the fifth conductive layer and the sixth conductive layer can be located between the third conductive layer and the fourth conductive layer.

[0080] Correspondingly, multiple first winding holes 101, multiple third winding holes 103, multiple ninth winding holes 109, and multiple eleventh winding holes 111 can be spaced apart along the circumferential direction. Meanwhile, to improve the scalability of the Rogowski coil circuit board and minimize the difficulty of forming the first and second Rogowski coils, in this embodiment, the first winding hole 101, the ninth winding hole 109, the third winding hole 103, and the eleventh winding hole 111 can be respectively located radially from the outside to the inside.

[0081] In addition, when including the fifth winding hole 105 and the seventh winding hole 107, the winding holes from the outside to the inside can be the first winding hole 101, the fifth winding hole 105, the ninth winding hole 109, the third winding hole 103, the seventh winding hole 107 and the eleventh winding hole 111 in sequence.

[0082] Similarly, in order to reduce the interference of external magnetic fields on the second Rogowski coil and further improve the overall measurement accuracy of the Rogowski coil circuit board, in this embodiment of the application, at least one of the first circuit board and the second circuit board 200 is provided with a second loop coil, and the winding direction of the second loop coil is opposite to the winding direction of the second Rogowski coil, and one end of the second loop coil is connected to the other end of the second Rogowski coil away from its output end.

[0083] Specifically, the second coil can also be formed on one side using copper wire or copper foil. In another embodiment of this application, the second coil can also be formed on the first circuit board and the second circuit board 200 in a spiral manner.

[0084] In detail, the first circuit board has a seventh conductive layer, a plurality of thirteenth winding holes 113 and fifteenth winding holes 115, and the second circuit board 200 has an eighth conductive layer, a plurality of fourteenth winding holes and sixteenth winding holes. The seventh conductive layer includes a plurality of seventh conductive lines 137, and the eighth conductive layer includes a plurality of eighth conductive lines 238.

[0085] The first ends of each thirteenth winding hole 113 and each fifteenth winding hole 115 extend to the first surface of the first circuit board, and the first ends of each fourteenth winding hole and each sixteenth winding hole extend to the third surface of the second circuit board 200.

[0086] In a plane perpendicular to the thickness direction, the projections of multiple thirteenth winding holes 113 overlap with the projections of multiple fourteenth winding holes, and the projections of multiple fifteenth winding holes 115 overlap with the projections of multiple sixteenth winding holes; the first ends of multiple thirteenth winding holes 113 are welded to the first ends of multiple fourteenth winding holes one by one, and the first ends of multiple fifteenth winding holes 115 are welded to the first ends of multiple sixteenth winding holes one by one.

[0087] In this circuit, the second end of a seventh conductive wire 137 is connected to the first end of an eighth conductive wire 238 through a set of interconnected thirteenth and fourteenth winding holes, and the second end of an eighth conductive wire 238 is connected to the first end of another seventh conductive wire 137 through a set of interconnected fifteenth and sixteenth winding holes, so as to form one turn of the second coil.

[0088] Based on the above embodiments, in order to further reduce the overall processing difficulty of the Rogowski coil circuit board, the seventh and eighth conductive layers can both be located between the fifth and sixth conductive layers, and the fifth and sixth conductive layers can be located between the first and second conductive layers. Additionally, multiple first winding holes 101 can be spaced apart along the circumferential direction, multiple third winding holes 103 can be spaced apart along the circumferential direction, multiple thirteenth winding holes 113 can be spaced apart along the circumferential direction, and multiple fifteenth winding holes 115 can be spaced apart along the circumferential direction, and from the outside in, they are respectively the first winding hole 101, the thirteenth winding hole 113, the third winding hole 103, and the fifteenth winding hole 115. Furthermore, from the outside in, they can be respectively the first winding hole 101, the fifth winding hole 105, the ninth winding hole 109, the thirteenth winding hole 113, the third winding hole 103, the seventh winding hole 107, the eleventh winding hole 111, and the fifteenth winding hole 115.

[0089] Alternatively, the single-turn area of ​​the second coil in the above structure can be increased by adding a third circuit board 300. In this case, the third circuit board 300 is also provided with multiple seventh connecting holes and multiple eighth connecting holes. The design and connection method of the two can be referred to the third connecting hole and the fourth connecting hole mentioned above, and will not be repeated here.

[0090] To more clearly illustrate the connection method between the winding holes in the Rogowski coil circuit board disclosed in the above embodiments of this application, such as Figures 2-9 As shown in the diagrams above, all are first circuit boards, and each winding hole has 90 holes as an example: The winding holes marked 1, 3, 5...179 are the first winding hole 101; The winding holes marked 2, 4, 6...180 are the third winding hole 103; The winding holes marked 183, 181...359, 357 are the fifth winding hole 105; The winding holes marked 184, 182...360, 358 are the seventh winding hole 107; The winding holes marked 363, 361...539, 537 are the ninth winding hole 109; The winding holes marked 364, 362...540, 538 are the eleventh winding hole 111; The winding holes marked 717, 719...541, 543 are the thirteenth winding hole 113; The winding holes marked 718, 720...542, 544 are the fifteenth winding hole, 115.

[0091] Accordingly, such as Figures 4-7 As shown, the specific connection method of each conductive wire in the process of forming the first Rogowski coil, the first loop, the second Rogowski coil, and the second loop is illustrated in the figure. Additionally, as... Figure 8 and Figure 9 As shown, the position marked 1 on the first surface of the first circuit board can be used as the positive output terminal, and the position marked 1 on the third surface of the second circuit board 200 can be used as the negative output terminal. At the same time, the position marked 361 can be used as the reference terminal, center terminal and ground terminal of the first Rogowski coil and the second Rogowski coil respectively.

[0092] Based on the Rogowski coil circuit board disclosed in the above embodiments, both the first and second circuit boards 200 can have four layers internally. Including their front and back sides, both the first and second circuit boards 200 can be six-layer single-board structures. For this type of circuit board, a thickness of 1.6mm provides good strength performance, and the processing difficulty of a six-layer board is relatively low, resulting in extremely low cost. Meanwhile, the third circuit board 300 is a type of double-sided board, and since its front and back sides do not have printed lines, its processing difficulty and cost are also extremely low. Therefore, the Rogowski coil circuit board disclosed in this application can greatly improve measurement accuracy without significantly increasing costs, which is beneficial for commercialization.

[0093] To further enhance the anti-interference capability of the Rogowski coil circuit board disclosed in this application embodiment, the first circuit board can include a plurality of first grounding holes 121, and the second circuit board 200 can also include a plurality of second grounding holes. The plurality of first grounding holes 121 are arranged around the first conductive layer, and all of the plurality of first grounding holes 121 are grounded; simultaneously, the plurality of second grounding holes are arranged around the second conductive layer, and all of the plurality of second grounding holes are grounded. Furthermore, as described above, in this application embodiment, the end of the first Rogowski coil furthest from the output terminal is grounded. This allows the plurality of first grounding holes 121 and the plurality of second grounding holes to form a shielding network, encircling the first Rogowski coil formed by the first conductive layer and the second conductive layer, which can significantly reduce the adverse effects of external magnetic fields and other interference factors on the measurement accuracy of the first Rogowski coil. Of course, the aforementioned first grounding holes 121 and second grounding holes can also provide shielding for the second Rogowski coil, the first loop coil, and the second loop coil.

[0094] In addition, in the above embodiments, the corresponding winding holes (such as the first winding hole 101 and the second winding hole) on the first circuit board and the second circuit board 200 correspond to each other and overlap each other. Based on this, in order to further increase the assembly difficulty of the Rogowski coil circuit board, the size of the winding hole can also be limited in the specific embodiments of this application.

[0095] Meanwhile, in order to reduce the overall area of ​​the Rogowski coil circuit board, in a specific embodiment of this application, the first winding hole 101, the second winding hole, the third winding hole 103, and the fourth winding hole can all be formed using a pad-in-pad process. That is, the first winding hole 101, the second winding hole, the third winding hole 103, and the fourth winding hole are respectively formed on the pads at corresponding positions. Thus, without the need for connecting wires, the conductive lines between different layers can be connected, thereby significantly reducing the area of ​​the first circuit board and the second circuit board 200 without changing the total number of winding holes. Similarly, the fifth winding hole 105 to the sixteenth winding hole can all be formed using a pad-in-pad process.

[0096] Based on the above embodiments, in this application, the diameter of the pad can be 24 mils, and the diameter of the wire-wrap hole can be 12 mils. That is, the hole in the pad of this application adopts G24R12 package. This can ensure that the strength of the hole meets the requirements while minimizing the required area of ​​the first circuit board and the second circuit board 200. Wherein, 1 mil = 0.0254 mm, and thus, the diameter of the pad is approximately 0.6096 mm, and the diameter of the wire-wrap hole is approximately 0.3048 mm.

[0097] Based on the Rogowski coil circuit board disclosed in any of the above embodiments of this application, this application also provides a current detection circuit, which includes an integrating circuit and any of the above-described Rogowski coil circuit boards, wherein the output terminal of the first Rogowski coil circuit board is connected to the input terminal of the integrating circuit. Of course, in the case where the Rogowski coil circuit board includes a second Rogowski coil, such as... Figure 10 As shown, the output terminal of the second Rogowski coil is also connected to the integrating circuit, and the second Rogowski coil is connected in parallel with the first Rogowski coil.

[0098] Furthermore, the current detection circuit may also include a filter circuit, and the output terminal of the integrator circuit is connected to the input terminal of the filter circuit. The filter circuit can improve the accuracy of the output signal. Correspondingly, when the Rogowski coil circuit board includes a first Rogowski coil and a second Rogowski coil, the integrator circuit also includes two output terminals. Therefore, both output terminals of the integrator circuit are connected to the filter circuit to realize differential conversion and noise filtering of the induced voltage signal, and finally output a high-precision current detection signal.

[0099] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0100] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the above-described embodiments. The above-described embodiments are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A Rogowski coil circuit board, characterized in that, It includes a first circuit board (100) and a second circuit board (200), which are separately formed, wherein, The first circuit board (100) is provided with a first conductive layer, a plurality of first winding holes (101) and a plurality of third winding holes (103). The first conductive layer includes a plurality of first conductive lines (131), and the first ends of each of the first winding holes (101) and each of the third winding holes (103) extend to the first surface of the first circuit board (100). The second circuit board (200) is provided with a second conductive layer, a plurality of second winding holes and a plurality of fourth winding holes. The second conductive layer includes a plurality of second conductive lines (232), and the first end of each of the second winding holes and each of the fourth winding holes extends to the third surface of the second circuit board (200). The first circuit board (100) and the second circuit board (200) are stacked in the thickness direction, and the first surface and the third surface are sandwiched between the first circuit board (100) and the second circuit board (200); in a plane perpendicular to the thickness direction, the projections of the plurality of first winding holes (101) overlap with the projections of the plurality of second winding holes, and the projections of the plurality of third winding holes (103) overlap with the projections of the plurality of fourth winding holes; The first ends of the plurality of first winding holes (101) are welded to the first ends of the plurality of second winding holes in a one-to-one correspondence, and the first ends of the plurality of third winding holes (103) are welded to the first ends of the plurality of fourth winding holes in a one-to-one correspondence. In this circuit, the second end of a first conductive wire (131) is connected to the first end of a second conductive wire (232) through a set of interconnected first winding holes (101) and second winding holes, and the second end of the second conductive wire (232) is connected to the first end of another first conductive wire (131) through a set of interconnected fourth winding holes and third winding holes (103) to form one turn of a first Rogowski coil, and the output end of the first Rogowski coil is used to connect to an integrating circuit.

2. The Rogowski coil circuit board according to claim 1, characterized in that, The Rogowski coil circuit board further includes at least one third circuit board (300), and the third circuit board (300) is separately formed from the first circuit board (100) and the second circuit board (200); The third circuit board (300) is provided with a plurality of first connecting holes and a plurality of second connecting holes, the first end of each of the first connecting holes and each of the second connecting holes extends to the fifth surface of the third circuit board (300), and the second end of each of the first connecting holes and each of the second connecting holes extends to the sixth surface of the third circuit board (300). In the thickness direction, the third circuit board (300) is sandwiched between the first circuit board (100) and the second circuit board (200), and the fifth surface is sandwiched between the first surface and the sixth surface; in a plane perpendicular to the thickness direction, the projections of the plurality of first winding holes (101) overlap with the projections of the plurality of first connecting holes, and the projections of the plurality of third winding holes (103) overlap with the projections of the plurality of second connecting holes; The first ends of the plurality of first winding holes (101) are welded to the first ends of the plurality of first connecting holes in a one-to-one correspondence, and the second ends of the plurality of first connecting holes are welded to the first ends of the plurality of second winding holes in a one-to-one correspondence. The first ends of the plurality of third winding holes (103) are welded to the first ends of the plurality of second connecting holes in a one-to-one correspondence, and the second ends of the plurality of first connecting holes are welded to the first ends of the plurality of fourth winding holes in a one-to-one correspondence.

3. The Rogowski coil circuit board according to claim 1, characterized in that, At least one of the first circuit board (100) and the second circuit board (200) is provided with a first loop coil, and the winding direction of the first loop coil is opposite to the winding direction of the first Rogowski coil, and one end of the first loop coil is connected to the other end of the first Rogowski coil away from its output end.

4. The Rogowski coil circuit board according to claim 3, characterized in that, The first circuit board (100) is provided with a third conductive layer, a plurality of fifth winding holes (105) and a seventh winding hole (107). The third conductive layer includes a plurality of third conductive lines (133), and the first ends of each of the fifth winding holes (105) and each of the seventh winding holes (107) extend to the first surface of the first circuit board (100). The second circuit board (200) is provided with a fourth conductive layer, a plurality of sixth winding holes and an eighth winding hole. The fourth conductive layer includes a plurality of fourth conductive lines (234), and the first end of each of the sixth winding holes and each of the eighth winding holes extends to the third surface of the second circuit board (200). In a plane perpendicular to the thickness direction, the projections of the plurality of fifth winding holes (105) overlap with the projections of the plurality of sixth winding holes, and the projections of the plurality of seventh winding holes (107) overlap with the projections of the plurality of eighth winding holes. The first ends of the plurality of fifth winding holes (105) are welded to the first ends of the plurality of sixth winding holes in a one-to-one correspondence, and the first ends of the plurality of seventh winding holes (107) are welded to the first ends of the plurality of eighth winding holes in a one-to-one correspondence. In this circuit, the second end of a third conductive wire (133) is connected to the first end of a fourth conductive wire (234) through a set of interconnected fifth winding holes (105) and sixth winding holes, and the second end of the fourth conductive wire (234) is connected to the first end of another third conductive wire (133) through a set of interconnected seventh winding holes (107) and eighth winding holes, so as to form one turn of the first loop.

5. The Rogowski coil circuit board according to claim 4, characterized in that, The Rogowski coil circuit board also includes a third circuit board (300), which is provided with a plurality of third connecting holes and a plurality of fourth connecting holes. The first end of each of the third connecting holes and the fourth connecting holes extends to the fifth surface of the third circuit board (300), and the second end of each of the third connecting holes and the fourth connecting holes extends to the sixth surface of the third circuit board (300). In the thickness direction, the third circuit board (300) is sandwiched between the first circuit board (100) and the second circuit board (200), and the fifth surface is sandwiched between the first surface and the sixth surface; in a plane perpendicular to the thickness direction, the projections of the plurality of fifth winding holes (105) overlap with the projections of the plurality of third connecting holes, and the projections of the plurality of seventh winding holes (107) overlap with the projections of the plurality of fourth connecting holes; The first ends of the plurality of fifth winding holes (105) are welded to the first ends of the plurality of third connecting holes in a one-to-one correspondence, and the second ends of the plurality of third connecting holes are welded to the first ends of the plurality of sixth winding holes in a one-to-one correspondence. The first ends of the plurality of seventh winding holes (107) are welded to the first ends of the plurality of fourth connecting holes in a one-to-one correspondence, and the second ends of the plurality of fourth connecting holes are welded to the first ends of the plurality of eighth winding holes in a one-to-one correspondence.

6. The Rogowski coil circuit board according to claim 1, characterized in that, The first circuit board (100) is further provided with a fifth conductive layer, a plurality of ninth winding holes (109) and a plurality of eleventh winding holes (111). The fifth conductive layer includes a plurality of fifth conductive lines (135), and the first ends of each of the ninth winding holes (109) and the plurality of eleventh winding holes (111) extend to the first surface of the first circuit board (100). The second circuit board (200) is further provided with a sixth conductive layer, a plurality of tenth winding holes and a plurality of twelfth winding holes. The sixth conductive layer includes a plurality of sixth conductive lines (236), and the first ends of each of the tenth winding holes and the plurality of twelfth winding holes extend to the third surface of the second circuit board (200). In a plane perpendicular to the thickness direction, the projections of the plurality of ninth winding holes (109) overlap with the projections of the plurality of tenth winding holes, and the projections of the plurality of eleventh winding holes (111) overlap with the projections of the plurality of twelfth winding holes. The first ends of the plurality of ninth winding holes (109) are welded to the first ends of the plurality of tenth winding holes in a one-to-one correspondence, and the first ends of the plurality of eleventh winding holes (111) are welded to the first ends of the plurality of twelfth winding holes in a one-to-one correspondence. In this circuit, the second end of a fifth conductive wire (135) is connected to the first end of a sixth conductive wire (236) through a set of interconnected ninth winding holes (109) and tenth winding holes, and the second end of the sixth conductive wire (236) is connected to the first end of another fifth conductive wire (135) through a set of interconnected eleventh winding holes (111) and twelfth winding holes to form one turn of a second Rogowski coil, and the output end of the second Rogowski coil is used to connect to the integrating circuit, and the second Rogowski coil is connected in parallel with the first Rogowski coil.

7. The Rogowski coil circuit board according to claim 6, characterized in that, The Rogowski coil circuit board also includes a third circuit board (300), which is provided with a plurality of fifth connecting holes and a plurality of sixth connecting holes. The first end of each fifth connecting hole and each sixth connecting hole extends to the fifth surface of the third circuit board (300), and the second end of each fifth connecting hole and each sixth connecting hole extends to the sixth surface of the third circuit board (300). In the thickness direction, the third circuit board (300) is sandwiched between the first circuit board (100) and the second circuit board (200), and the fifth surface is sandwiched between the first surface and the sixth surface; in a plane perpendicular to the thickness direction, the projections of the plurality of ninth winding holes (109) overlap with the projections of the plurality of fifth connecting holes, and the projections of the plurality of eleventh winding holes (111) overlap with the projections of the plurality of sixth connecting holes; The first ends of the plurality of ninth winding holes (109) are welded to the first ends of the plurality of fifth connecting holes in a one-to-one correspondence, and the second ends of the plurality of fifth connecting holes are welded to the first ends of the plurality of tenth winding holes in a one-to-one correspondence. The first ends of the plurality of eleventh winding holes (111) are welded to the first ends of the plurality of sixth connecting holes in a one-to-one correspondence, and the second ends of the plurality of sixth connecting holes are welded to the first ends of the plurality of twelfth winding holes in a one-to-one correspondence.

8. The Rogowski coil circuit board according to claim 7, characterized in that, At least one of the first circuit board (100) and the second circuit board (200) is provided with a second coil, and the winding direction of the second coil is opposite to the winding direction of the second Rogowski coil, and one end of the second coil is connected to the other end of the second Rogowski coil away from its output end.

9. The Rogowski coil circuit board according to claim 8, characterized in that, The first circuit board (100) is provided with a seventh conductive layer, a plurality of thirteenth winding holes (113) and a fifteenth winding hole (115). The seventh conductive layer includes a plurality of seventh conductive lines (137), and the first ends of each of the thirteenth winding holes (113) and each of the fifteenth winding holes (115) extend to the first surface of the first circuit board (100). The second circuit board (200) is provided with an eighth conductive layer, a plurality of fourteenth winding holes and a sixteenth winding hole. The eighth conductive layer includes a plurality of eighth conductive lines (238), and the first end of each of the fourteenth winding holes and each of the sixteenth winding holes extends to the third surface of the second circuit board (200). In a plane perpendicular to the thickness direction, the projections of the plurality of the thirteenth winding holes (113) overlap with the projections of the plurality of the fourteenth winding holes, and the projections of the plurality of the fifteenth winding holes (115) overlap with the projections of the plurality of the sixteenth winding holes. The first ends of the plurality of thirteenth winding holes (113) are welded to the first ends of the plurality of fourteenth winding holes in a one-to-one correspondence, and the first ends of the plurality of fifteenth winding holes (115) are welded to the first ends of the plurality of sixteenth winding holes in a one-to-one correspondence. In this circuit, the second end of a seventh conductive wire (137) is connected to the first end of an eighth conductive wire (238) through a set of interconnected thirteenth winding holes (113) and fourteenth winding holes, and the second end of the eighth conductive wire (238) is connected to the first end of another seventh conductive wire (137) through a set of interconnected fifteenth winding holes (115) and sixteenth winding holes, so as to form one turn of the second coil.

10. The Rogowski coil circuit board according to claim 1, characterized in that, The first circuit board (100) further includes a plurality of first grounding holes (121), which are arranged around the first conductive layer and are all grounded; the second circuit board (200) further includes a plurality of second grounding holes, which are arranged around the second conductive layer and are all grounded; the end of the first Rogowski coil away from the output terminal is grounded; And / or, the first winding hole (101), the second winding hole, the third winding hole (103) and the fourth winding hole are all formed using a hole-in-disk process.

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