Heat exchange module and electronic equipment

Abstract

The invention discloses a heat exchange module and electronic equipment, and relates to the technical field of heat exchange.The heat exchange module comprises a shell, a working medium and a micropump, a flow channel is formed in the shell, the visible light transmittance of at least part of the area of the shell is larger than or equal to a threshold value, the flow channel is filled with the working medium, and the working medium comprises a first medium and a second medium; a liquid-liquid interface exists between the first medium and the second medium, the first medium comprises a main solvent and a surfactant, a defoaming agent and a thermochromic medium which are dissolved or dispersed in the main solvent, the mass fraction of the first medium in the working medium is 80%-90%, and the micropump is arranged in the shell, communicates with the flow channel and is used for driving the working medium in the flow channel to flow. Therefore, the liquid-liquid interface moves relative to the flow channel. The heat exchange module has the good heat dissipation performance, the working medium has the diversified flow visualization effect, and the display effect and the science and technology feeling of a product can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat exchange, in particular to a heat exchange module and an electronic device applying the same. BACKGROUND

[0002] With the development of AI technology, the power consumption of chips is increasing, and the heat dissipation efficiency has become a core bottleneck restricting the release of hardware performance. For the consumer electronics field with limited space, active heat dissipation has become the evolution direction of the next generation of heat dissipation technology, so the liquid cooling module emerges as the times require.

[0003] The working medium of the liquid cooling module is a carrier for realizing the mutual conversion of heat energy and mechanical energy. The pump can be used as a power source for the working medium to provide power for the flow of the working medium. The working medium can be used as a carrier for heat transfer during flow, so that the liquid cooling module can achieve the effect of heat dissipation.

[0004] In recent years, the flow of the working medium can be prepared to have a visual effect, and a flow display area with a sense of technology can be realized. The working medium with a visual flow state disclosed in the related art includes two liquid working media, and a liquid interface is formed between the two liquid working media. The above design can make the flow process of the working medium present a flow visualization effect. However, the visual effect presented by the above scheme is poor, and the sense of technology presented by the product is not strong. SUMMARY

[0005] The main purpose of the present application is to provide a heat exchange module and an electronic device, which aims to solve the problem of poor flow visualization effect of the working medium in the existing liquid cooling module. The heat exchange module provided by the present application not only has good heat dissipation, but also has a flow visualization effect of the working medium, which improves the appearance display effect and the sense of technology of the product.

[0006] To achieve the above purpose, the present application provides a heat exchange module, which comprises: a shell, wherein a flow channel is arranged in the shell, and the visible light transmittance of at least a partial region of the shell is greater than or equal to a threshold value; a working medium, wherein the working medium is filled in the flow channel, the working medium comprises a first medium and a second medium, a liquid-liquid interface exists between the first medium and the second medium, the first medium comprises a main solvent, a surfactant, an antifoaming agent and a thermochromic medium dissolved or dispersed in the main solvent, and the mass fraction of the first medium in the working medium is 80% to 90%; and a micropump, wherein the micropump is arranged in the shell, the micropump is in communication with the flow channel, and the micropump is used to drive the working medium in the flow channel to flow, so that the liquid-liquid interface moves relative to the flow channel.

[0007] In an embodiment, the primary solvent and the secondary medium comprise at least one of water, fluorinated liquid, alcohol, alkane, and the primary solvent and the secondary medium are different, and there is a liquid-liquid interface between the primary solvent and the secondary medium.

[0008] In an embodiment, the surfactant comprises at least one of carboxylate, sulfonate, sulfate, phosphate, quaternary ammonium salt, ammonium salt, polyoxyethylene, polyol, alkyl polyglycoside, betaine, imidazoline.

[0009] In an embodiment, the defoaming agent comprises at least one of silicone defoaming agent, non-silicone defoaming agent, inorganic defoaming agent, fluorine-modified defoaming agent, bio-based defoaming agent, and compound defoaming agent.

[0010] In an embodiment, the thermochromic medium comprises at least one of cholesteric liquid crystal and inorganic compound dispersion.

[0011] In an embodiment, the volume ratio of the defoaming agent to the surfactant is 5:1-1:5. And / or, the mass fraction of the surfactant in the first medium is 0.001%-0.1%. And / or, the mass fraction of the defoaming agent in the first medium is 0.001%-0.05%. And / or, the mass fraction of the thermochromic medium in the first medium is 1%-20%.

[0012] In an embodiment, the shell comprises an intermediate layer and cover plates arranged on opposite sides of the intermediate layer, the intermediate layer is provided with a flow channel groove, the cover plates and the flow channel groove form a flow channel, and the visible light transmittance of at least one of the cover plates is greater than or equal to a threshold value. Wherein, the cover plate is provided with a first inlet and a first outlet communicating with the flow channel, the micropump is provided with a second inlet and a second outlet, and the micropump is arranged in the shell to make the first inlet communicate with the second outlet and the first outlet communicate with the second inlet.

[0013] In an embodiment, the intermediate layer comprises a liquid cooling layer and adhesive layers arranged on both sides of the liquid cooling layer, the liquid cooling layer and the adhesive layers on both sides form a side wall of the flow channel groove, and the cover plates are sealingly connected with the liquid cooling layer through the adhesive layers. Wherein, along the thickness direction of the shell, the edge of the adhesive layer is flush with the edge of the liquid cooling layer; and / or, the adhesive layer includes at least one adhesive layer; wherein, the adhesive layer is formed by dispensing or screen printing; and / or, the adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive; and / or, the thickness of the adhesive layer ranges from 0.001 mm to 0.05 mm; and / or, the liquid cooling layer includes at least one of a polymer material layer and a metal layer.

[0014] In one embodiment, the cover plate is a single-layer structure or a multi-layer structure; And / or, the cover plate includes at least one of a polymer material layer and a metal layer, wherein the polymer material layer is made of a transparent material, and the transparent material includes at least one of: polyethylene terephthalate, polyethylene naphthalate, polypropylene, cyclic olefin copolymers, polytetramethylpentene, polyimide, polymethyl methacrylate, polyphenylene sulfide, polyetheretherketone, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer, and butadiene-styrene copolymer.

[0015] The present invention also proposes an electronic device, which includes the heat exchange module described above.

[0016] The heat exchange module of this invention provides a flow channel within the housing, thus creating a flow path / space for the working fluid. The working fluid fills the flow channel, and a micropump is connected to it, providing the flow power for the working fluid. Under the action of the micropump, the working fluid moves along the flow channel, allowing it to act as a heat transfer medium, thereby enabling the heat exchange module to dissipate heat. Furthermore, the working fluid is configured as a first medium and a second medium, with a liquid-liquid interface between them, and the first medium is designated as the main solvent. The first medium, dissolved or dispersed in the main solvent, contains surfactants, defoamers, and thermochromic media, resulting in a mass fraction of 80% to 90% in the working fluid. When the working fluid moves relative to the flow channel, the liquid-liquid interface and the thermochromic first medium move relative to the flow channel containing the working fluid, creating diverse flow visualization effects. Simultaneously, the visible light transmittance of at least a portion of the shell is greater than or equal to a threshold, allowing the flow visualization effect of the working fluid to be displayed through that area of ​​the shell. This means the heat exchange module can achieve diverse visualization effects, thereby enhancing the product's appearance and technological appeal. Furthermore, the surfactants added to the first medium improve the surface wettability of the working fluid, effectively improving its flow performance, while the defoamers reduce air bubbles in the working fluid, thereby reducing evaporation losses and further improving the heat dissipation performance of the heat exchange module 100, extending its service life. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the heat exchange module provided by the present invention; Figure 2 This is a cross-sectional schematic diagram of an embodiment of the heat exchange module provided by the present invention; Figure 3 This is an exploded view of an embodiment of the heat exchange module provided by the present invention; Figure 4 A cross-sectional schematic diagram of an embodiment of the housing provided by the present invention; Figure 5 A cross-sectional schematic diagram of another embodiment of the housing provided by the present invention; Figure 6 This is a cross-sectional schematic diagram of another embodiment of the housing provided by the present invention.

[0019] Explanation of icon numbers: 100. Heat exchange module; 1. Shell; 11. Cover plate; 111. First cover plate; 112. Second cover plate; 113. First inlet; 114. First outlet; 115. Polymer material layer; 116. Metal layer; 12. Intermediate layer; 121. Flow channel; 122. Liquid cooling layer; 123. Adhesive layer; 13. Flow channel; 2. Micro pump; 21. Second inlet; 22. Second outlet.

[0020] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0023] Meanwhile, the meaning of "and / or" or "and / or" appearing throughout the text is that it includes three options. Taking "A and / or B" as an example, it includes option A, option B, or an option that satisfies both A and B.

[0024] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0025] This invention proposes a heat exchange module 100. Please refer to the reference. Figures 1 to 6As shown, in this embodiment of the invention, the heat exchange module 100 includes a housing 1, a working fluid, and a micropump 2. The housing 1 is provided with a flow channel 13. The visible light transmittance of at least a portion of the housing 1 is greater than or equal to a threshold. The working fluid is filled in the flow channel 13. The working fluid includes a first medium and a second medium. There is a liquid-liquid interface between the first medium and the second medium. The first medium includes a main solvent and surfactants, defoamers, and thermochromic media dissolved or dispersed in the main solvent. The mass fraction of the first medium in the working fluid is 80% to 90%. The micropump 2 is disposed in the housing 1 and is connected to the flow channel 13. The micropump 2 is used to drive the flow of the working fluid in the flow channel 13 so that the liquid-liquid interface moves relative to the flow channel 13.

[0026] In this embodiment, the heat exchange module 100 is applied in an electronic device, which can remove the heat generated by the heating element inside the electronic device to achieve a cooling effect, thereby realizing the control of the temperature of the heating element. The housing 1 of the heat exchange module 100 has a flow channel 13 inside, and the working fluid is filled in the flow channel 13 of the housing 1. The working fluid can serve as a heat transfer carrier, and the flow channel 13 provides a flow path / place for the flow of the working fluid.

[0027] Understandably, the micropump 2 is connected to the flow channel 13 of the housing 1, and the micropump 2 can provide the flow power for the working fluid in the flow channel 13. Under the action of the micropump 2, the working fluid in the flow channel 13 of the housing 1 moves along the flow channel 13, so that the working fluid can act as a medium for heat transfer during the flow process, enabling the heat exchange module 100 to achieve the function of heat dissipation.

[0028] In this embodiment, by setting the visible light transmittance of at least a portion of the housing 1 to be greater than or equal to a threshold, the visualization effect of the working fluid flow can be displayed through that portion of the housing 1, meaning the heat exchange module 100 can achieve a visualization effect. It should be noted that the visible light transmittance mentioned in this embodiment is the ratio of the radiant energy projected and transmitted through an object to the total radiant energy projected onto the object. Optionally, the threshold can be 70%, 80%, 90%, etc., and is not limited here.

[0029] Understandably, the heat dissipation performance mentioned in this embodiment can be understood as the amount of heat absorbed or released by the working fluid when changing its temperature per unit. The better the heat dissipation performance of the working fluid, the more heat it absorbs or releases when changing its temperature per unit, and the more significant the temperature control effect of the working fluid.

[0030] Optionally, the micropump 2 can be a miniature piezoelectric hydraulic pump. Miniature piezoelectric hydraulic pumps have an amplitude ≤50µm and are characterized by their ultra-thin design, small size, simple structure, high pressure and low flow rate, absence of electromagnetic interference, and low operating noise. They can achieve precise fluid transport and control, making them particularly suitable for electronic devices such as mobile phones, watches, and accessories. Of course, in other embodiments, the micropump 2 can also be an electrostatic micropump; the specific structure is based on existing technology and is not limited here.

[0031] In this embodiment, the working fluid is set as a first medium and a second medium, with a liquid-liquid interface between them. The first medium is set as a main solvent and surfactants, defoamers, and thermochromic media dissolved or dispersed in the main solvent, such that the mass fraction of the first medium in the working fluid is 80% to 90%. This configuration allows the liquid-liquid interface and the thermochromic first medium to move relative to the flow channel 13 as the working fluid moves along the flow channel 13, resulting in diverse flow visualization effects. Simultaneously, the working fluid is disposed within the flow channel 13 of the housing 1, and at least a portion of the housing 1 has a visible light transmittance greater than or equal to a threshold, allowing the flow visualization effect of the working fluid to be displayed through this area. This means the heat exchange module 100 can achieve diverse visualization effects. Furthermore, during the flow process, the working fluid can act as a heat transfer medium, enabling the heat exchange module 100 to perform heat dissipation. In this embodiment, the above working fluid formulation can generate a liquid-liquid interface in the flow channel 13, and the thermochromic medium dissolved or dispersed in the main solvent in the first medium will change color when heated, thereby making the first medium colored, thus increasing the color contrast between the first medium and the second medium, so that the working fluid can have a significant flow visualization effect. In addition, the addition of surfactants to the first medium improves surface wettability, effectively improving the flow performance of the working fluid, and the addition of defoamers reduces bubbles in the working fluid, thereby reducing the evaporation loss of the working fluid, further improving the heat dissipation performance of the heat exchange module 100, and extending its service life. This can improve the appearance and display effect of the product and enhance the technological feel of the product.

[0032] Understandably, the first and second media of the working fluid have good heat dissipation performance, ensuring that the working fluid can achieve good temperature control. On the other hand, the first media needs to form a liquid-liquid interface with the second media to ensure that the working fluid can be visualized. It should be noted that there is no specific limitation on the type of the first media. Any medium with good heat dissipation performance and capable of forming a liquid-liquid interface with the second media can be used as the first media in the embodiments of this application, and no limitation is made here.

[0033] Optionally, the primary solvent of the first medium and the second medium include at least one of water, fluorinated liquid, alcohol, and alkanes. In this embodiment, the primary solvent of the first medium and the second medium are different, and a liquid-liquid interface exists between the primary solvent and the second medium.

[0034] It is understandable that water (H2O), fluorinated liquids, alcohols, and alkanes have excellent heat dissipation properties, ensuring that the working fluid can achieve optimal temperature control. In this embodiment, alcohols may optionally include at least one of methanol, ethanol, ethylene glycol, glycerol, and propylene glycol. Fluorinated liquids may optionally include at least one of perfluorocarbon compounds, perfluoropolyethers, hydrofluoroethers, and hydrofluorocarbons, and are not limited herein.

[0035] Of course, in other embodiments, the first or second medium may also include a water-soluble salt, and the solution formed by the water-soluble salt and water may be referred to as a salt solution. The salt solution may include anions and cations, both of which have strong hydrophilic properties, allowing anions to form hydrated anions with H2O and cations to form hydrated cations with H2O, meaning that H2O tends to combine with cations / anions.

[0036] In this embodiment, a liquid-liquid interface exists between the first medium and the second medium of the working fluid. For example, a liquid-liquid interface is formed between water and a fluorinated liquid or an alkane; a liquid-liquid interface is formed between an alcohol and a fluorinated liquid or an alkane; and a liquid-liquid interface can be formed between a fluorinated liquid and any one of water, an alcohol, silicone oil, or an alkane. Optionally, the first medium includes at least one of water and an alcohol, and the second medium includes at least one of silicone oil, an alkane, or a fluorinated liquid. Of course, in other embodiments, the first medium may also include at least one of silicone oil, an alkane, or a fluorinated liquid, and the second medium may include at least one of water and an alcohol; or the first medium may include a fluorinated liquid, and the second medium may include at least one of water, an alcohol, silicone oil, or an alkane; or the second medium may include a fluorinated liquid, and the first medium may include at least one of water, an alcohol, silicone oil, or an alkane, etc., and no limitation is made here.

[0037] Optionally, the number of the first medium and / or the second medium can be 1, 2, 3, etc., and is not limited herein. In this embodiment, the silicone oil may optionally include at least one of dimethyl silicone oil, methylphenyl silicone oil, and polyether-modified silicone oil, and is not limited herein. The fluorinated liquid may optionally include at least one of perfluorocarbon compound, perfluoropolyether, hydrofluoroether, and hydrofluorocarbon, and is not limited herein.

[0038] Understandably, when the working fluid is stationary, a liquid-liquid interface exists between the first and second media of the working fluid, and the surfactant, defoamer, and thermochromic medium are dissolved or dispersed in the first media. During the flow of the working fluid, the liquid-liquid interface of the working fluid and the thermochromic first medium move relative to the flow channel 13, thereby enabling the working fluid to have diverse flow visualization effects. The working fluid is placed in the flow channel 13 of the housing 1, and the visible light transmittance of at least a portion of the housing 1 is greater than or equal to a threshold, so that the flow visualization effect of the working fluid can be displayed through this area, that is, the heat exchange module 100 can achieve diverse visualization effects. In addition, during the flow of the working fluid, the working fluid can act as a medium for heat transfer, enabling the liquid cooling component to achieve heat dissipation. In this embodiment, the above working fluid formulation can generate a liquid-liquid interface in the flow channel 13, and by using thermochromic media and working fluids with different appearances, colorful display and flow visualization effects can be obtained, thereby improving the appearance and display effect of the product and enhancing the product's technological feel.

[0039] In one embodiment, the surfactant includes at least one of carboxylates, sulfonates, sulfates, phosphates, quaternary ammonium salts, ammonium salts, polyoxyethylene compounds, polyols, alkyl polyglycosides, betaines, and imidazolines.

[0040] In this embodiment, by adding a surfactant to the first medium of the working fluid, the surface wettability is improved, the flow resistance of the first medium is reduced, and the heat transferred by the working fluid per unit time is increased, thus enabling the working fluid to achieve better temperature control. It is understood that the surfactant can reduce the surface tension of the first medium, improve the wetting performance of the first medium on the inner wall of the flow channel 13, and alleviate the problem of working fluid adhering to the wall. Optionally, the mass fraction of the surfactant in the first medium is 0.001% to 0.1%.

[0041] Understandably, when the main solvent of the first medium is water and / or alcohol, the surfactant is a water-soluble surfactant. In this case, the HLB value of the water-soluble surfactant is greater than 10, which means that the water-soluble surfactant has strong molecular polarity and a high proportion of hydrophilic groups. In this embodiment, carboxylates include sodium stearate, sodium oleate, etc., with the hydrophilic group being sodium carboxylate salts; sulfonates include sodium dodecylbenzenesulfonate (LAS), sodium alkyl sulfonate, etc.; sulfates include sodium dodecyl sulfate (SDS), with the hydrophilic group being sodium sulfate salts; phosphates include potassium alkyl phosphates, with the hydrophilic phosphate salt group; quaternary ammonium salts include dodecyltrimethylammonium chloride; ammonium salts include alkylammonium hydrochloride, which can form hydrophilic groups through ionization; polyoxyethylenes include fatty alcohol polyoxyethylene ethers (AEO), where the polyoxyethylene chain is a strongly hydrophilic group, and water solubility increases with the length of the EO chain; polyols include glycerol fatty acid esters, containing multiple hydroxyl hydrophilic groups, and are soluble in water; alkyl polyglycosides (APG) are nonionic, with the glycoside group being the hydrophilic end; betaines include dodecyl dimethyl betaine, which is zwitterionic; and imidazolines include carboxymethyl imidazoline, which is zwitterionic.

[0042] When the primary solvent of the first medium is a fluorinated liquid, the surfactant molecules dissolved in the fluorinated liquid contain fluorocarbon chains or strongly polar groups, and simultaneously possess polarity matching that of the fluorinated liquid. In this embodiment, the quaternary ammonium salts are partially fluorinated modified quaternary ammonium salts, such as perfluoroalkyltrimethylammonium chloride; the betaines are fluorinated betaines, such as perfluorooctyl betaine; the polyoxyethylene salts are fluorinated polyoxyethylene ethers, where the fluorocarbon chains are affinity for the fluorinated liquid, and the polyoxyethylene chains provide solubility; and the phosphate salts are fluoroalkyl phosphate salts.

[0043] When the primary solvent of the first medium is an alkane, the surfactant has a very high proportion of lipophilic groups, resulting in a low HLB value (less than 6) and predominantly nonionic. In this embodiment, polyols include sorbitan fatty acid esters, such as the Span series (e.g., Span-80); polyoxyethylene ethers are low-EO chain fatty alcohol polyoxyethylene ethers (e.g., AEO-2, AEO-3); quaternary ammonium salts are long-chain quaternary ammonium salts (e.g., octadecyltrimethylammonium chloride), with long alkyl chains exhibiting good compatibility with alkanes; and imidazoline ethers are long-chain alkyl imidazolines with a high proportion of lipophilic groups, and their nonpolar portions are compatible with alkanes.

[0044] In one embodiment, the defoamer includes at least one of the following: silicone defoamer, non-silicone defoamer, inorganic defoamer, fluorine-modified defoamer, bio-based defoamer, and compound defoamer.

[0045] In this embodiment, by adding an antifoaming agent to the first medium of the working fluid, the number of air bubbles in the working fluid is reduced, thereby reducing the evaporation loss of the working fluid, further improving the heat dissipation performance of the heat exchange module 100, and extending its service life. Optionally, the mass fraction of the antifoaming agent in the first medium is 0.001% to 0.05%.

[0046] Understandably, when the primary solvent of the first medium is water and / or alcohols, the defoamer is a water-soluble defoamer. Water-soluble defoamers contain hydrophilic groups or carriers that can be dispersed in water. In this embodiment, non-silicone defoamers include polyethers, such as polyoxyethylene-polyoxypropylene block copolymers, higher alcohols, fatty acid esters, etc. Organosilicon defoamers are silicone oil emulsions, such as polydimethylsiloxane emulsions, dispersed into an oil-in-water system by emulsifiers; they are not truly dissolved and belong to water-soluble dispersions. Bio-based defoamers include modified vegetable oils, polyglycerol fatty acid esters, etc., containing hydrophilic groups. Compound defoamers are products compounded with polyether and organosilicon emulsions as base materials, suitable for aqueous systems. Inorganic defoamers include silica emulsions and bentonite dispersions, dispersed in water by additives.

[0047] When the primary solvent of the first medium is a fluorinated liquid, the defoamer dissolved in the fluorinated liquid contains a fluorocarbon chain structure to ensure compatibility. In this embodiment, the fluorinated defoamer is a fluorinated silicone oil or a perfluoroalkyl ether. The compound defoamer is a product combining fluorinated modified components with additives that are compatible with the fluorinated liquid. The organosilicon defoamer is a partially fluorinated modified silicone oil.

[0048] When the primary solvent of the first medium is an alkane, alkanes are suitable for defoamer substrates with low polarity and high hydrophobicity. In this embodiment, silicone-based defoamers include pure silicone oils, such as polydimethylsiloxane and silicone paste, which are directly soluble in alkanes. Non-silicone defoamers include mineral oils, synthetic hydrocarbons, and long-chain fatty acid esters. Fluorinated defoamers are non-polar types containing fluorinated carbon chains. Compound defoamers are products formulated with mineral oil and silicone oil as base materials. Bio-based defoamers are unmodified vegetable oils and animal fats, soluble in alkanes.

[0049] In one embodiment, the thermochromic medium includes at least one of cholesterol-type liquid crystal and inorganic compound dispersion.

[0050] In this embodiment, a thermochromic medium is added to the first medium of the working fluid. The thermochromic medium has high color-changing sensitivity and can achieve a continuous gradual color change with temperature. Thus, when the heat exchange module 100 cools the heating elements in the electronic device, the thermochromic medium in the first medium of the working fluid undergoes a gradual color change with temperature, making the first medium of the working fluid visible. This increases the color contrast between the first and second media, resulting in a significant flow visualization effect for the working fluid. Optionally, the mass fraction of the thermochromic medium in the first medium is between 1% and 20%.

[0051] Optionally, the inorganic compound dispersion uses inorganic materials such as VO2 (vanadium dioxide) and WO3 (tungsten trioxide) as the core.

[0052] In one embodiment, the volume ratio of defoamer to surfactant is 5:1 to 1:5. It is understood that by controlling the ratio of defoamer to surfactant, surface wettability can be improved while effectively reducing air bubbles in the working fluid, thereby reducing flow resistance, increasing flow rate, and enhancing heat dissipation. If too little defoamer is added, the defoaming effect will be insignificant; if too much defoamer is added, it can easily increase the solution viscosity, thereby increasing flow resistance and weakening the heat exchange effect.

[0053] It should be noted that, in order to further achieve diverse visualization effects of the working fluid flow within the flow channel 13, in one embodiment, the working fluid also includes a solid working fluid, and a liquid-solid interface exists between the liquid working fluid (the first medium and the second medium) and the solid working fluid. It is understood that by setting the working fluid to a liquid working fluid (the first medium and the second medium) and a solid working fluid, a liquid-solid interface exists between the liquid and solid working fluids. Thus, when the working fluid moves relative to the flow channel 13, the liquid-solid interface and the liquid-liquid interface will move relative to the flow channel 13 used to contain the working fluid, thereby enabling diverse visualization effects of the working fluid flow.

[0054] In this embodiment, the solid working fluid includes solid particles. The solid particles are nanoparticles or microparticles. Optionally, the solid particles include at least one of boron nitride, alumina, silicon carbide, fluorinated graphene, carbon nanotube heterostructures, and boron phosphide. It is understood that, to avoid smooth flow of the solid particles in the flow channel 13 and to avoid affecting the micropump 2, the size of the solid particles is optionally ≤10 μm.

[0055] To further prevent the agglomeration of solid particles in the working fluid when mixed with the liquid working fluid, resulting in clumps or larger particles that could affect the flow of the working fluid within the flow channel 13 and the micropump 2, in one embodiment, the solid particles are particles treated with a surface coupling agent.

[0056] Understandably, the solid particles of the solid working fluid in the working medium are treated with a surface coupling agent before being added into the flow channel 13 and mixed with the liquid working fluid. Particles treated with a surface coupling agent are easier to disperse when mixed with the liquid working fluid after being added into the flow channel 13, effectively preventing the solid particles from agglomerating or clumping.

[0057] Optionally, the surface coupling agent includes any one of silane coupling agents, titanate coupling agents, aluminate coupling agents, and amphoteric / ionic liquid coupling agents. In this embodiment, the silane coupling agent may be KH. 550 (γ) aminopropyltriethoxysilane), KH 570 (γ) Methacryloxypropylsilane), Si 69 (double) [3 [(triethoxysilyl)propyl] Tetrasulfide), Si 75 (sulfur-containing silanes), HC 171 / A One of 171 (vinyltrimethoxysilane), etc. The titanate coupling agent can be a conventional titanate coupling agent, such as isooctyltriethoxytitanate, n-octyltriethoxytitanate, etc. The aluminate coupling agent can be KT... 201 (aluminate coupling agent), ML 140 (powdered aluminate ester), etc. Amphoteric / ionic liquid coupling agents can be ionic liquid silane coupling agents (containing halide anions), etc., and are not limited here.

[0058] In this embodiment, the surface treatment process of the solid particles is as follows: the surface coupling agent is dissolved in the solution to form a coupling agent solution, the solid particles are added to the coupling agent solution, and the mixture is stirred at high speed (1000-3000 rpm) for 10-20 minutes. The solid particles are then filtered, dried, and crushed to form the treated solid particles.

[0059] In one embodiment, the housing 1 includes an intermediate layer 12 and cover plates 11 disposed on opposite sides of the intermediate layer 12. The intermediate layer 12 is provided with a flow channel groove 121. The cover plates 11 and the flow channel groove 121 enclose each other to form a flow channel 13. The visible light transmittance of at least one cover plate 11 is greater than or equal to a threshold.

[0060] In this embodiment, as Figures 2 to 6 As shown, the cover plate 11 of the housing 1 includes two covers, namely the first cover plate 111 and the second cover plate 112. That is, the first cover plate 111, the intermediate layer 12 and the second cover plate 112 are stacked in sequence, and the intermediate layer 12 is sandwiched between the first cover plate 111 and the second cover plate 112, so that the first cover plate 111 and the second cover plate 112 on both sides can support and protect the intermediate layer 12.

[0061] Understandably, the intermediate layer 12 has a flow channel 121. The flow channel 121 can be a groove structure, in which case the cover plate 11 covering the groove structure and the intermediate layer 12 enclose each other to form a flow channel 13; or, the flow channel 121 can also be a through-slot structure, in which case the flow channel 121 extends through the intermediate layer 12 along its thickness direction, and the two cover plates 11 (i.e., the first cover plate 111 and the second cover plate 112) and the intermediate layer 12 enclose each other to form a flow channel 13. This allows the working fluid to flow smoothly in the flow channel 13 at the flow channel 121 and to fully contact the liquid cooling layer 122, thereby achieving efficient heat conduction.

[0062] In this embodiment, the flow channel 121 is a through-slot disposed on the intermediate layer 12, which simplifies the process of creating the flow channel 121. Depending on the actual design, the shape of the flow channel 121 may include, but is not limited to, straight, serpentine, and spiral shapes to optimize the flow path of the working fluid and heat exchange efficiency. Corresponding connectors or interfaces can also be provided at the inlet and outlet of the flow channel 13 to facilitate connection with external heat exchange systems such as micropumps and radiators, forming a complete heat exchange cycle.

[0063] Of course, in other embodiments, the housing 1 may also be configured to include only two cover plates 11 (i.e., a first cover plate 111 and a second cover plate 112), with at least one of the opposing surfaces of the two cover plates 11 recessed to form a flow channel groove 121, such that the other cover plate 11 cooperates with the flow channel groove 121 or the two flow channel grooves 121 to form a flow channel 13, etc., which is not limited here. It is understood that the flow channel groove 121 can be formed by machining, mold processing or etching process, which is not limited here.

[0064] It should be noted that the structural design of the heat exchange module 100 in the above embodiments is only exemplary. In other embodiments, the structural design of the shell 1 can be diversified. As long as the working fluid scheme of the present invention is adopted, it is within the protection scope of the present invention.

[0065] In one embodiment, the cover plate 11 is provided with a first inlet 113 and a first outlet 114 that connects to the flow channel 13, and the micro pump 2 is provided with a second inlet 21 and a second outlet 22. The micro pump 2 is disposed in the housing 1 so that the first inlet 113 is connected to the second outlet 22 and the first outlet 114 is connected to the second inlet 21.

[0066] In this embodiment, as Figures 1 to 3 As shown, the micropump 2 may include a pump base and a piezoelectric component connected to the pump base. The pump base is provided with a second inlet 21 and a second outlet 22. The housing 1 is provided with a first outlet 114 and a first inlet 113. The first outlet 114 is used to communicate with the second inlet 21, and the first inlet 113 is used to communicate with the second outlet 22.

[0067] Understandably, the portion of the housing 1 surrounding the first outlet 114 and the portion of the pump base surrounding the second inlet 21 form a sealed structure to achieve communication between the first outlet 114 and the second inlet 21. The portion of the housing 1 surrounding the first inlet 113 and the portion of the pump base surrounding the second outlet 22 form a sealed structure to achieve communication between the first inlet 113 and the second outlet 22, that is, to achieve communication between the flow channel 13 of the pump base and the housing 1.

[0068] It should be noted that the first outlet 114 is used to connect with the second inlet 21, but this does not mean that the first outlet 114 and the second inlet 21 are always connected. It only indicates that under certain conditions, the working medium can flow from the first outlet 114 into the second inlet 21. The relationship between the first inlet 113 and the second outlet 22 is similar.

[0069] In this embodiment, the micropump 2 (pump base) of the heat exchange module 100 is connected to the flow channel 13 inside the housing 1. The micropump 2 can serve as a power source to provide the flow power for the working fluid in the flow channel 13 of the housing 1. During the flow process, the working fluid can serve as a medium for heat transfer, enabling the housing 1 to achieve a sustained heat dissipation effect.

[0070] It is understandable that the portion of the housing 1 around the first outlet 114 and the portion of the pump base around the second inlet 21 are integrated structures, and the portion of the housing 1 around the first inlet 113 and the portion of the pump base around the second outlet 22 are integrated structures.

[0071] Of course, in other embodiments, the partial housing 1 around the first outlet 114 and the partial pump base around the second inlet 21 are separate structures. The partial housing 1 around the first outlet 114 and the partial pump base around the second inlet 21 can be connected by methods such as high-temperature adhesive bonding, UV-cured adhesive bonding, thermocompression bonding, hot melt welding, ultrasonic welding, ultra-frequency welding, and diffusion welding. Similarly, the partial housing 1 around the first inlet 113 and the partial pump base around the second outlet 22 can be separate structures, and the partial housing 1 around the first inlet 113 and the partial pump base around the second outlet 22 can be connected by the methods described above.

[0072] In one embodiment, the intermediate layer 12 includes at least one liquid cooling layer 122. The liquid cooling layer 122 is disposed between the first cover plate 111 and the second cover plate 112 for supporting the first cover plate 111 and the second cover plate 112.

[0073] In this embodiment, the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be an integrated structure. This ensures that the flow channel 13 formed by the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 has a better sealing effect, preventing leakage (working fluid) problems. Optionally, the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can all be made of transparent materials, so that the heat exchange module 100 can achieve a visible flow effect.

[0074] Of course, in other embodiments, the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be separate structures. The first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be connected by means of high-temperature adhesive bonding, UV adhesive light-curing bonding, hot-press bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding for sealing.

[0075] In one embodiment, the intermediate layer 12 includes a liquid cooling layer 122 and adhesive layers 123 disposed on both sides of the liquid cooling layer 122. The liquid cooling layer 122 and the adhesive layers 123 on both sides together form the sidewall of the flow channel 121. The cover plate 11 is sealed to the liquid cooling layer 122 through the adhesive layers 123.

[0076] In this embodiment, as Figure 2 , Figures 4 to 6 As shown, the liquid cooling layer 122 has a first adhesive layer on one side and a second adhesive layer on the opposite side. The first adhesive layer, the liquid cooling layer 122, and the second adhesive layer together form an intermediate layer 12. During the processing of the flow channel 121, the first adhesive layer, the liquid cooling layer 122, and the second adhesive layer can be stacked to form the intermediate layer 12, and then the intermediate layer 12 can be cut to form the flow channel 121. This allows the first adhesive layer, the liquid cooling layer 122, and the second adhesive layer to jointly form the sidewall of the flow channel 121, which facilitates the formation of the flow channel 121 while also enhancing the sealing of the sidewall of the flow channel 121. This, in turn, ensures the sealing of the flow channel 13 formed on the shell 1, thereby guaranteeing the heat exchange effect.

[0077] It is understandable that the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be made of the same or different materials. However, it is necessary to ensure that at least one of the first cover plate 111 and the second cover plate 112 is made of a transparent material.

[0078] In this embodiment, the first adhesive layer and the second adhesive layer are located on both sides of the liquid cooling layer 122, and the first adhesive layer and the second adhesive layer can be made of adhesive or thin film material with good sealing and thermal conductivity. On the one hand, the adhesive layer 123 can firmly connect the cover plate 11 to the liquid cooling layer 122, thereby forming the integral structure of the shell 1; on the other hand, the adhesive layers 123 on both sides can also ensure the sealing of the flow channel groove 121 and prevent poor heat exchange effect caused by working fluid leakage.

[0079] Understandably, this allows for the formation of a five-layer stacked structure for housing 1. Depending on actual design requirements, the thickness of each layer can be adjusted to reduce the overall thickness of housing 1, thereby meeting the need for thinner and lighter electronic devices using housing 1.

[0080] During the production and assembly process, the first cover plate 111 and the second cover plate 112 are respectively sealed to the liquid cooling layer 122 through their respective adhesive layers 123, so that the first cover plate 111, the second cover plate 112, and the intermediate layer 12 form a closed flow channel 13 at the flow channel groove 121. The working fluid flows in the flow channel 13, thereby realizing the heat exchange function of the shell 1. In this way, the adhesive layer 123 can be used to achieve the bonding and sealing of the first cover plate 111, the second cover plate 112 and the liquid cooling layer 122, which simplifies the sealing process and reduces the processing difficulty of the shell 1. In particular, special treatments, such as surface roughening, can be applied to the surfaces of the first cover plate 111 and the second cover plate 112 that are in contact with the adhesive layer 123, which can enhance the bonding strength between the first cover plate 111 and the second cover plate 112 and the adhesive layer 123.

[0081] Additionally, heat dissipation fins can be provided on the first cover plate 111 and / or the second cover plate 112 to increase the heat exchange area and promote air convection, thereby further improving the heat exchange effect of the shell 1. Alternatively, a more efficient working fluid (such as a low-viscosity, high-thermal-conductivity liquid) or a phase change material can be used to further improve the heat exchange effect of the shell 1.

[0082] Optionally, the adhesive layer 123 includes at least one layer of adhesive. Specifically, depending on the actual design requirements, the adhesive layer 123 may include one, two, or even multiple layers of adhesive to achieve different bonding effects. The adhesive layer 123 may include the same type of adhesive, or it may include different types of adhesive to meet different application needs.

[0083] In this embodiment, the adhesive is applied to form the adhesive layer 123 via dispensing or screen printing. It is understood that the dispensing and screen printing processes allow for precise control of the adhesive application amount and distribution, ensuring that the adhesive layer 123 has a uniform thickness on both sides of the liquid cooling layer 122 and covers only the areas requiring bonding. This helps reduce unnecessary material waste and improves bonding strength and sealing performance. Furthermore, the adhesive application shape and spacing can be adjusted as needed to accommodate different shapes and sizes of the liquid cooling layer 122 and cover plate. This helps optimize the structure of the adhesive layer 123, increases the contact area and adhesion of the bonding interface, and thus enhances the overall bonding performance and sealing effect of the housing 1.

[0084] Optionally, the adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive. It is understood that by designing the adhesive to be any one of polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, and thermosetting adhesive, bonding and sealing between the first cover plate 111 and the liquid cooling layer 122, as well as between the second cover plate 112 and the liquid cooling layer 122, can be achieved, thereby simplifying the molding process of the housing 1 and reducing the processing difficulty of the housing 1.

[0085] In this embodiment, the adhesive can be selected as a pressure-sensitive hot melt composite adhesive film. The first cover plate 111 and the liquid cooling layer 122, as well as the second cover plate 112 and the liquid cooling layer 122, are bonded using the pressure-sensitive hot melt composite adhesive film. This can improve the reliability of the bonding and sealing, as well as its density, thereby improving the structural stability of the shell 1.

[0086] Optionally, the liquid cooling layer 122 includes at least one of a polymer material layer and a metal layer. In this embodiment, the liquid cooling layer 122 can be made of a metal material, or it can be made of a polymer material, or it can be a composite of a metal material and a polymer material, which can adapt to different application requirements.

[0087] In this embodiment, the liquid cooling layer 122 includes a metal layer. This configuration improves the strength and thermal conductivity of the liquid cooling layer 122, thereby increasing the heat exchange efficiency of the housing 1, reducing the operating temperature of the electronic device with the housing 1, and also facilitating a reduction in the thickness of the liquid cooling layer 122. Alternatively, the liquid cooling layer 122 includes a polymer material layer. This configuration meets the lightweight design requirements of the housing 1, making the electronic device with the housing 1 easier to carry and use. Alternatively, the liquid cooling layer 122 includes both a polymer material layer and a metal layer. This configuration combines the characteristics of both to improve the overall performance of the housing 1.

[0088] Optionally, the metal layer can be made of a metal material with high thermal conductivity and corrosion resistance, such as copper, aluminum, or stainless steel alloy, and there is no limitation on this. Optionally, the polymer material layer can be made of polymer materials such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), and there is no limitation on this.

[0089] In one embodiment, the thickness of the adhesive layer 123 ranges from 0.001 mm to 0.05 mm. It is understood that the thickness of the adhesive layer 123 can be precisely controlled between 0.001 mm and 0.05 mm during the dispensing or screen printing process. This allows for the connection of the liquid cooling layer 122 to the cover plates 11 on both sides using the adhesive layer 123, while simultaneously reducing the thickness of the adhesive layer 123. This reduces the overall thickness of the housing 1, thereby meeting the requirement for thinner and lighter electronic devices using the housing 1.

[0090] Understandably, when the overall thickness of the housing 1 is required to be relatively thin, the thickness of the adhesive layer 123 can be set to 0.001mm~0.02mm; when there is a high requirement for the connection strength of the housing 1, the thickness of the adhesive layer 123 can be set to 0.025mm~0.05mm.

[0091] In this embodiment, along the thickness direction of the shell 1, the edge of the adhesive layer 123 is flush with the edge of the liquid cooling layer 122. Aligning the edges of the adhesive layer 123 and the liquid cooling layer 122 reduces the resistance to the flow of the working fluid in the flow channel, thereby ensuring the heat exchange effect of the shell.

[0092] Understandably, the adhesive layer 123 has a guide portion on the side near the flow channel 121, which is used to guide the flow of the working fluid in the flow channel 13.

[0093] In this embodiment, a guide portion, such as one or more rounded corners, can also be provided on the side of the adhesive layer 123 near the flow channel 121. This smooth transition can reduce the flow resistance of the working fluid in the flow channel 13, help reduce energy loss, reduce the pressure drop in the flow channel 13, and further improve the fluidity of the working fluid, thereby ensuring the heat exchange effect of the shell 1.

[0094] Optionally, the cover plate 11 can be a single-layer structure or a multi-layer structure. In this embodiment, the first cover plate 111 is a single-layer structure or a multi-layer structure; and / or, the second cover plate 112 is a single-layer structure or a multi-layer structure.

[0095] In this embodiment, as Figures 4 to 6 As shown, the first cover plate 111 can be provided with a single layer or multiple layers of sealing layers. The first cover plate 111 forms an adhesive seal with the first side of the liquid cooling layer 122 through the adhesive layer 123. The first cover plate 111 also includes a sealing layer and a barrier layer. The barrier layer is disposed close to the flow channel groove 121. The first cover plate 111 forms an adhesive seal with the first side of the liquid cooling layer 122 through the adhesive layer 123. At the same time, the barrier layer can also block foreign objects such as water and dust.

[0096] Understandable, such as Figures 4 to 6As shown, the second cover plate 112 can be provided, including a single layer or multiple layers of sealing layers. The second cover plate 112 forms an adhesive seal with the second side of the liquid cooling layer 122 through the adhesive layer 123. The second cover plate 112 also includes a sealing layer and a barrier layer. The barrier layer is located close to the flow channel groove 121. The second cover plate 112 forms an adhesive seal with the second side of the liquid cooling layer 122 through the adhesive layer 123. At the same time, the barrier layer can also block foreign objects such as water and dust.

[0097] In one implementation, such as Figures 4 to 6 As shown, the cover plate 11 includes at least one of a polymer material layer 115 and a metal layer 116. In this embodiment, the first cover plate 111 includes at least one of a polymer material layer 115 and a metal layer 116; and / or, the second cover plate 112 includes at least one of a polymer material layer 115 and a metal layer 116.

[0098] In this embodiment, depending on actual design requirements, the first cover plate 111 may include a polymer material layer 115 and / or a metal layer 116. For example, the first cover plate 111 may include a metal layer 116, which can improve the overall strength and thermal conductivity of the housing 1, thereby ensuring the stability of the electronic device with the housing 1 in complex working environments and reducing the operating temperature of the electronic device. Alternatively, the first cover plate 111 may include a polymer material layer 115, which can meet the lightweight design requirements of the housing 1, thereby facilitating the carrying and use of the electronic device with the housing 1. Alternatively, the first cover plate 111 may include both a polymer material layer 115 and a metal layer 116, which can combine the characteristics of both to improve the overall performance of the housing.

[0099] Understandably, depending on actual design requirements, the second cover 112 can include a polymer material layer 115 and / or a metal layer 116. For example, including a metal layer 116 in the second cover 112 can improve the overall strength and thermal conductivity of the housing 1, thereby ensuring the stability of the electronic device with the housing 1 in complex working environments and reducing the operating temperature of the electronic device. Alternatively, the second cover 112 can include a polymer material layer 115 to meet the lightweight design requirements of the housing 1, thus facilitating the carrying and use of the electronic device with the housing 1. Alternatively, the second cover 112 can include both a polymer material layer 115 and a metal layer 116, combining the characteristics of both to improve the overall performance of the housing.

[0100] It should be noted that, in order to ensure that the visible light transmittance of at least a portion of the housing 1 is greater than or equal to the threshold, the first cover plate 111 and the second cover plate 112 of the cover plate 11 cannot simultaneously contain only a metal layer 116. That is, at least one of the first cover plate 111 and the second cover plate 112 includes at least a polymer material layer 115. To further ensure that the visible light transmittance of at least a portion of the housing 1 is greater than or equal to the threshold, such as... Figure 6 As shown, the cover plate 11 includes a polymer material layer 115 and a metal layer 116. The area of ​​the metal layer 116 corresponding to the flow channel 13 is processed by etching process so that the visible light transmittance of the area of ​​the cover plate 11 corresponding to the flow channel 13 is greater than or equal to a certain threshold, which is not limited here.

[0101] In this embodiment, at least a portion of the housing 1 may be made of a transparent material, so that at least a portion of the housing 1 has a high visible light transmittance, enabling the heat exchange module 100 to achieve a significant visualization effect. It should be noted that transparent material can be understood as 380nm. Materials with visible light transmittance greater than a threshold in the 760nm wavelength band.

[0102] Optionally, the polymer material layer 115 of the cover plate 11 is made of a transparent material, including: polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), cyclic olefin copolymer (COC), polytetramethylpentene (PMP), polyimide (PI), polymethyl methacrylate (PMMA), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), and styrene. Acrylonitrile copolymer (AS), acrylonitrile butadiene styrene copolymer (ABS), butadiene At least one of styrene copolymers (BS).

[0103] It is understandable that transparent materials have a high visible light transmittance, and the shell 1 formed using the aforementioned material has a high visible light transmittance. In some implementations, the visible light transmittance of the shell 1 can reach over 90%, enabling the heat exchange module 100 to achieve a significant flow visualization effect.

[0104] It should be noted that at least a portion of the housing 1 is made of the aforementioned transparent material so that the covering layer has high visible light transmittance, ensuring that the heat exchange module 100 can achieve a significant flow visualization effect. The above embodiment involving the use of a transparent material to form the housing 1 can be understood as the transparent material forming at least a portion of the housing 1 so that at least a portion of the housing 1 has high visible light transmittance.

[0105] In one embodiment, the polymer material layer 115 is processed by any one of the following processes: plasma processing, radiation modification, mechanical treatment, coating, surface grafting polymerization, chemical etching, and coupling agent processing to form a modified polymer material layer; wherein, the water vapor permeability of the modified polymer material layer is ≤0.01 g / (m²). 2 •24h).

[0106] In this embodiment, at least one cover plate 11 of the housing 1 is configured to include a modified polymer material layer, wherein the water vapor permeability of the modified polymer material layer is ≤0.01 g / (m²). 2 •24h), thereby increasing the difficulty of the working fluid escaping the flow channel 13 by using the modified polymer material layer, which reduces the evaporation loss of the working fluid, thereby improving the heat dissipation performance of the shell 1 in the heat exchange module 100 and extending its service life.

[0107] In this embodiment, the modified polymer material layer is formed by processing the polymer material layer 115 through any one of the following processes: plasma processing, radiation modification, mechanical treatment, coating, surface graft polymerization, chemical etching, and coupling agent processing. It is understood that by treating the surface of the polymer material layer 115 through any one of these processes, and by using active groups to form an active layer on the surface of the polymer material layer 115 during the treatment, a modified polymer material layer is obtained. This modified polymer material layer can effectively reduce the evaporation loss of the working fluid within the flow channel 13, thus increasing the difficulty for the working fluid to escape the flow channel 13, thereby improving heat dissipation performance and service life, and ensuring the long-term reliability of the heat exchange module 100. Optionally, the active groups can be hydroxyl, carboxyl, etc., and are not limited here.

[0108] Optionally, at least one of the first cover plate 111 and the second cover plate 112 includes a modified polymer material layer, that is, the first cover plate 111 and / or the second cover plate 112 includes a modified polymer material layer. In this embodiment, the first cover plate 111 and the second cover plate 112 may be made of the same material or different materials, and this is not limited.

[0109] In this embodiment, the visible light transmittance of the modified polymer material layer is greater than or equal to a certain threshold. Optionally, the modified polymer material layer is a transparent material. It is understood that transparent materials have a high visible light transmittance, and the shell 1 formed using the aforementioned material has a high visible light transmittance. In some implementations, the visible light transmittance of the shell 1 can reach over 90%, enabling the heat exchange module 100 to achieve a significant flow visualization effect. It should be noted that transparent material can be understood as a material with a visible light transmittance greater than a threshold in the 380nm~760nm wavelength band.

[0110] Understandably, the modified polymer material layer is obtained by surface processing of the polymer material layer 115. Optionally, the polymer material layer 115 is polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), cyclic olefin copolymer (COC), polytetramethylpentene (PMP), polyimide (PI), polymethyl methacrylate (PMMA), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), styrene, etc. Acrylonitrile copolymer (AS), acrylonitrile butadiene styrene copolymer (ABS), butadiene It is made of at least one of the following materials: styrene copolymer (BS), etc., without limitation.

[0111] Understandably, the heat exchange module 100 can be widely used in the heat exchange of electronic devices such as mobile phones, tablets, laptops, smart glasses, smartwatches, and smart head-mounted devices. It can effectively reduce the operating temperature of electronic devices and improve their operational stability and lifespan. It is thin, lightweight, has high heat exchange efficiency, and is easy to process and install, making it a promising candidate for market applications.

[0112] The present invention also proposes an electronic device comprising the aforementioned heat exchange module 100. The specific structure of the heat exchange module 100 is as described in the foregoing embodiments. Since this electronic device employs all the technical solutions of all the foregoing embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the foregoing embodiments, which will not be elaborated upon here.

[0113] Understandably, electronic devices can be small electronic devices, such as mobile phones, tablets, laptops, smart glasses, smartwatches, smart headsets, etc.

[0114] In this embodiment, the electronic device further includes a housing and electronic functional components. The housing forms a cavity for accommodating the electronic functional components, thereby protecting them.

[0115] Electronic functional components of an electronic device include, but are not limited to: processors, internal memory, charging management modules, power management modules, batteries, antennas, communication modules, cameras, audio modules, speakers, receivers, microphones, sensor modules, motors, and indicators. The electronic device may have more or fewer electronic functional components than described above. These various electronic functional components can be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application-specific integrated circuits (ASICs).

[0116] Electronic functional components release heat when they are in operation. When the internal temperature of the electronic device is too high, it will affect the working efficiency of the electronic functional components and the service life of the electronic device. Therefore, a heat exchange module 100 is required to control the temperature rise of the electronic functional components.

[0117] In this embodiment, the heat exchange module 100 is embedded in the housing to achieve temperature control of electronic functional components disposed within the housing's defined area.

[0118] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A heat exchange module, characterized in that, The heat exchange module includes: A housing having a flow channel inside, wherein the visible light transmittance of at least a portion of the housing is greater than or equal to a threshold. The working fluid, which fills the flow channel, comprises a first medium and a second medium, with a liquid-liquid interface between them. The first medium comprises a main solvent and surfactants, defoamers, and thermochromic media dissolved or dispersed in the main solvent. The mass fraction of the first medium in the working fluid is 80% to 90%. A micropump is disposed in the housing and communicates with the flow channel. The micropump is used to drive the flow of the working fluid in the flow channel so that the liquid-liquid interface moves relative to the flow channel.

2. The heat exchange module as described in claim 1, characterized in that, The main solvent and the second medium include at least one of water, fluorinated liquid, alcohol, and alkane, and the main solvent and the second medium are different, and there is a liquid-liquid interface between the main solvent and the second medium.

3. The heat exchange module as described in claim 1, characterized in that, The surfactant includes at least one of the following: carboxylates, sulfonates, sulfates, phosphates, quaternary ammonium salts, ammonium salts, polyoxyethylene compounds, polyols, alkyl polysaccharides, betaines, and imidazolines.

4. The heat exchange module as described in claim 1, characterized in that, The defoamer includes at least one of the following: silicone defoamer, non-silicone defoamer, inorganic defoamer, fluorine-modified defoamer, bio-based defoamer, and compound defoamer.

5. The heat exchange module as described in claim 1, characterized in that, The thermochromic medium includes at least one of cholesterol-type liquid crystal and inorganic compound dispersion.

6. The heat exchange module as described in claim 1, characterized in that, The volume ratio of the defoamer to the surfactant is 5:1 to 1:5; And / or, the mass fraction of the surfactant in the first medium is 0.001% to 0.1%; And / or, the mass fraction of the defoamer in the first medium is 0.001% to 0.05%; And / or, the mass fraction of the thermochromic medium in the first medium is 1% to 20%.

7. The heat exchange module as described in any one of claims 1 to 6, characterized in that, The housing includes an intermediate layer and cover plates disposed on opposite sides of the intermediate layer. The intermediate layer is provided with a flow channel groove. The cover plates and the flow channel groove enclose each other to form a flow channel. The visible light transmittance of at least one of the cover plates is greater than or equal to a threshold. The cover plate is provided with a first inlet and a first outlet that connect to the flow channel, and the micropump is provided with a second inlet and a second outlet. The micropump is located in the housing so that the first inlet is connected to the second outlet and the first outlet is connected to the second inlet.

8. The heat exchange module as described in claim 7, characterized in that, The intermediate layer includes a liquid cooling layer and adhesive layers disposed on both sides of the liquid cooling layer. The liquid cooling layer and the adhesive layers on both sides together form the sidewall of the flow channel groove. The cover plate is sealed to the liquid cooling layer through the adhesive layers. Wherein, along the thickness direction of the shell, the edge of the adhesive layer is flush with the edge of the liquid cooling layer; and / or, the adhesive layer includes at least one adhesive layer; wherein, the adhesive layer is formed by dispensing or screen printing; and / or, the adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive; and / or, the thickness of the adhesive layer ranges from 0.001 mm to 0.05 mm; and / or, the liquid cooling layer includes at least one of a polymer material layer and a metal layer.

9. The heat exchange module as described in claim 7, characterized in that, The cover plate may be a single-layer structure or a multi-layer structure; And / or, the cover plate includes at least one of a polymer material layer and a metal layer, wherein the polymer material layer is made of a transparent material, and the transparent material includes at least one of: polyethylene terephthalate, polyethylene naphthalate, polypropylene, cyclic olefin copolymers, polytetramethylpentene, polyimide, polymethyl methacrylate, polyphenylene sulfide, polyetheretherketone, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer, and butadiene-styrene copolymer.

10. An electronic device, characterized in that, The electronic device includes a heat exchange module as described in any one of claims 1 to 9.

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