DIP packaging device forming tool

Abstract

The invention discloses a DIP packaging device forming tool. The DIP packaging device forming tool comprises a tool base, modular forming units and a material pipe fixing frame. Wherein the modular forming unit is mounted in the middle of the top surface of the tool base; the material pipe fixing frame is detachably installed on the edge of the top face of the tool base. According to the DIP packaging device forming tool, through the integrated design of the modular forming units and the material pipe fixing frame, rapid model changing and accurate forming of DIP packaging devices of multiple specifications can be achieved, and the machining efficiency and adaptability are improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electronic component processing auxiliary equipment, and particularly relates to a DIP packaged device forming tool. BACKGROUND

[0002] Before being welded to a printed board, a DIP packaged device needs to be manually formed, because most DIP packaged device pins and bodies are not in a vertical state, but are outwardly inclined by 10-15 degrees, and cannot be normally installed into a printed board welding hole, manual forming cannot guarantee one-time forming in place, and is poor in consistency, has the risk of damaging the pins, and to some extent, affects welding quality and production efficiency. SUMMARY

[0003] The application overcomes the shortcomings of the prior art, and provides a DIP packaged device forming tool, which can realize rapid changeover and precise forming of multiple specifications of DIP packaged devices through integrated design of a modular forming unit and a material pipe fixing frame, and improves processing efficiency and adaptability.

[0004] In order to solve the above technical problems, the application discloses a DIP packaged device forming tool, which comprises a tool base, a modular forming unit and a material pipe fixing frame.

[0005] In the DIP packaged device forming tool, the modular forming unit comprises a positioning base, a forming block and an adjusting screw rod, the positioning base is a cross-shaped structure, two forming blocks are symmetrically installed at the transverse ends of the positioning base, and two adjusting screw rods are symmetrically installed at the transverse ends of the positioning base and are respectively in transmission connection with the corresponding forming blocks.

[0006] In the DIP packaged device forming tool, the position of the forming block at the transverse end of the positioning base is adjustable, and when the position of the forming block at the transverse end of the positioning base is adjusted in place, the adjusting screw rod is locked and fixed.

[0007] In the DIP packaged device forming tool, the forming surface of the forming block is an arc-shaped groove matched with the bending radius of the DIP packaged device pin.

[0008] In the DIP packaged device forming tool, four limiting support columns are respectively arranged at the four corners of the bottom of the tool base.

[0009] In the DIP packaged device forming tool, a positioning hole for installing a DIP packaged device material pipe is arranged at the edge of the top surface of the tool base.

[0010] In the DIP packaged device forming tool, the material pipe fixing frame is detachably connected with the tool base through a positioning pin.

[0011] In the DIP packaging device forming tool, the material pipe fixing frame is provided with fixing holes matched with the outer shell of the DIP packaging device material pipe, so as to fix the DIP packaging device material pipe and prevent the material pipe from moving during the forming of the DIP packaging device.

[0012] The present application has the following advantages: (1) The present application discloses a DIP packaging device forming tool, which realizes rapid positioning, accurate forming and convenient changing of the pins of DIP packaging devices of multiple specifications through the integrated design of the modular forming unit and the material pipe fixing frame, solves the problems of complicated changing and insufficient forming precision of traditional tools, and significantly improves the processing efficiency and adaptability in batch production.

[0013] (2) The present application discloses a DIP packaging device forming tool, the longitudinal strip-shaped support of the positioning base in the modular forming unit can perfectly fit the DIP packaging device, so that it will not tilt or deviate during movement; the arc-shaped groove forming surface of the forming block is matched with the bending radius of the pins of the DIP packaging device, so that the formed pins are not damaged and have good consistency; the positioning holes on the tool base can fix the material pipe, facilitate the taking and placing of the material pipe, avoid secondary damage caused by material stacking, and the formed DIP packaging device can be vertically inserted into the printed board hole without damage, avoiding stress on the pins. BRIEF DESCRIPTION OF DRAWINGS

[0014] Fig. 1 is a right view of a DIP packaging device forming tool in an embodiment of the present application; Fig. 2 is a top view of a DIP packaging device forming tool in an embodiment of the present application. DETAILED DESCRIPTION

[0015] To make the purpose, technical scheme and advantages of the present application clearer, the embodiments disclosed by the present application will be described in further detail below with reference to the drawings.

[0016] Referring to Figs. 1-2 In the present embodiment, the DIP packaging device forming tool comprises a tool base 1, a modular forming unit 2 and a material pipe fixing frame 3. The modular forming unit 2 is installed on the top surface of the tool base 1; the material pipe fixing frame 3 is detachably installed on the edge of the top surface of the tool base 1.

[0017] In the present embodiment, the tool base 1 is processed and formed by using a hard material, the top surface is provided with a processing reference surface, and the edge is uniformly distributed with positioning holes 5 for installing the DIP packaging device material pipe; four limiting support columns 4 are arranged at the bottom corners of the tool base 1, so as to ensure the stability of the DIP packaging device forming tool on the workbench surface.

[0018] In this embodiment, the modular molding unit 2 mainly includes: a positioning base 21, molding blocks 22, and adjusting screws 23. The positioning base 21 has a cross-shaped structure; two molding blocks 22 are symmetrically installed at both ends of the positioning base 21; two adjusting screws 23 are symmetrically installed at both ends of the positioning base 21 and are respectively connected to the corresponding molding blocks 22. The molding blocks 22 are made of hard alloy, and the molding surface is an arc-shaped groove matching the bending curvature of the DIP packaged device pins. The arc-shaped grooves of the two molding blocks 22 are mirror-distributed, forming a pin molding gap. By rotating the adjusting screws 23, the distance between the two molding blocks 22 can be finely adjusted to accommodate DIP packaged devices with different pin pitches from 0.8mm to 2.54mm. The position of the molding blocks 22 at the lateral end of the positioning base 21 is adjustable; after the position of the molding blocks 22 at the lateral end of the positioning base 21 is adjusted to the correct position, it is locked and fixed by the adjusting screws 23.

[0019] In this embodiment, the material tube holder 3 is detachably connected to the tooling base 1 via a positioning pin, enabling quick connection / disconnection between the material tube holder 3 and the tooling base 1. Furthermore, the material tube holder 3 is provided with a fixing hole 31 that matches the outer shell of the DIP packaged device's material tube, used to fix the DIP packaged device's material tube and prevent displacement of the material tube during the DIP packaged device molding process.

[0020] In this embodiment, the method of using the DIP package device molding fixture is as follows: Tooling assembly: Install the modular molding unit in the middle of the top surface of the tooling base; adjust the spacing between the two molding blocks by adjusting the screw according to the specifications of the DIP packaged device to be processed; install the material tube fixing bracket on the edge of the top surface of the tooling base by positioning pin, and insert the material tube of the DIP packaged device to be processed into the fixing hole on the tooling base.

[0021] Device positioning: The DIP packaged device to be processed is placed in the longitudinal strip bracket of the positioning base, and the root of the pin of the DIP packaged device to be processed is in contact with the outer wall of the longitudinal strip bracket to achieve initial positioning.

[0022] Lead forming: The symmetrically arranged forming blocks are pushed by external force (or in conjunction with an external power mechanism) to bend the leads of the DIP packaged device to be processed. The arc-shaped groove forming surface of the forming blocks ensures the consistency of the lead bending angle.

[0023] Changeover operation: When it is necessary to change to a DIP packaged device of a different specification, the longitudinal strip bracket can be removed by pulling out the positioning pin. After adjusting the distance between the two molding blocks by adjusting the screw, the longitudinal strip bracket of the corresponding specification can be replaced.

[0024] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

[0025] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. A molding fixture for DIP packaged devices, characterized in that, include: Tooling base (1), modular molding unit (2) and material pipe fixing bracket (3); wherein, the modular molding unit (2) is installed in the middle of the top surface of the tooling base (1); the material pipe fixing bracket (3) is detachably installed on the edge of the top surface of the tooling base (1).

2. The DIP packaged device forming fixture according to claim 1, characterized in that, The modular molding unit (2) includes: a positioning base (21), molding blocks (22) and adjusting screws (23); wherein, the positioning base (21) has a cross-shaped structure; two molding blocks (22) are symmetrically installed at the two transverse ends of the positioning base (21); two adjusting screws (23) are symmetrically installed at the two transverse ends of the positioning base (21) and are respectively connected to the corresponding molding blocks (22) in a transmission manner.

3. The DIP packaged device forming fixture according to claim 2, characterized in that, The position of the molding block (22) at the lateral end of the positioning base (21) is adjustable; after the position of the molding block (22) at the lateral end of the positioning base (21) is adjusted to the correct position, it is locked and fixed by adjusting the screw (23).

4. The DIP packaged device forming fixture according to claim 2, characterized in that, The molding surface of the molding block (22) is an arc-shaped groove that matches the bending curvature of the DIP package device pins.

5. The DIP packaged device forming fixture according to claim 1, characterized in that, The tooling base (1) has four limit support columns (4) at the four corners of its bottom.

6. The DIP packaged device forming fixture according to claim 1, characterized in that, The tooling base (1) has positioning holes (5) on the top edge for mounting DIP packaged device material tubes.

7. The DIP packaged device forming fixture according to claim 1, characterized in that, The material pipe fixing bracket (3) is detachably connected to the tooling base (1) via a positioning pin.

8. The DIP packaged device forming fixture according to claim 1, characterized in that, The material tube holder (3) is provided with a fixing hole (31) that matches the outer shell of the material tube of the DIP packaged device, which is used to fix the material tube of the DIP packaged device and prevent the material tube from shifting during the molding process of the DIP packaged device.

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