Packaging structure of light-emitting module

Abstract

The invention provides a packaging structure of a light-emitting module. The packaging structure comprises a light-emitting device; the light-emitting device comprises a light-emitting device, a driving circuit chip and a substrate, a first conductive structure and a second conductive structure are arranged on the substrate, a driving signal bonding pad of the driving circuit chip is electrically connected with a first end of the light-emitting device through the first conductive structure, and a second end of the light-emitting device is connected to a first pin of the substrate through the second conductive structure. Compared with a traditional wire bonding process, physical connection points are reduced, meanwhile, the problems of metal wire suspension, breakage and the like are effectively avoided through electric connection of the conductive structure, and the reliability of the overall structure of the light-emitting module is remarkably improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, more particularly, to a packaging structure of a light emitting module. BACKGROUND

[0002] With the development of technology, light emitting devices are widely used in the field of lighting or display, such as LED devices. The packaging of the existing conventional LED devices is usually connected by a wire bonding process. However, such a connection has the following problems. First, the conventional wire bonding process relies on metal connecting wires (such as gold wires or aluminum wires). These metal connecting wires are not only complex to internally wire, but also prone to breakage in a high-low temperature cycle environment or when external vibration occurs, thereby reducing reliability. Second, the LED device needs to be transparent, and the metal connecting wires are in a suspended state during wire bonding, which reduces the reliability of the chip in operation. SUMMARY

[0003] Therefore, the present application aims to provide a packaging structure of a light emitting module to solve the problems in the prior art.

[0004] According to a first aspect of the present application, a packaging structure of an LED module is provided, comprising:

[0005] a substrate,

[0006] a metal conductive structure disposed on the upper surface of the substrate, comprising a first conductive structure and a second conductive structure;

[0007] a light emitting device disposed on the substrate; and

[0008] a driving circuit chip disposed on the substrate, comprising a driving signal pad corresponding to the light emitting device;

[0009] wherein the driving signal pad is electrically connected to a first end of the light emitting device through the first conductive structure, and a second end of the light emitting device is electrically connected to a first pin of the substrate through the second conductive structure.

[0010] Preferably, the driving circuit chip comprises a plurality of pads arranged in two rows in the lateral physical position.

[0011] Preferably, the driving circuit chip comprises a plurality of pads arranged in three rows in the lateral physical position.

[0012] Preferably, the driving circuit chip is disposed on the substrate by flip-chip, and the plurality of pads of the driving circuit chip correspond to the respective conductive structures.

[0013] Preferably, the first conductive structure extends from one end of the light-emitting device to a corresponding drive signal pad, and the second conductive structure extends from the first pin along a first direction to the second end of the light-emitting device, and along a second direction to the first pad of the drive circuit chip.

[0014] Preferably, the first conductive structure is electrically connected to the drive signal pad and the light-emitting device by soldering, and the second conductive structure is electrically connected to the light-emitting device and the first pin by soldering.

[0015] Preferably, the first pin is connected to the power supply potential of the external circuit or PCB board.

[0016] Preferably, the driving circuit chip further includes:

[0017] The second pad is electrically connected to the second pin of the substrate;

[0018] The third pad is electrically connected to the third pin of the substrate; and

[0019] The fourth pad is electrically connected to the fourth pin of the substrate, wherein the second, third and fourth pads are electrically connected to the second, third and fourth pins respectively through the third conductive structure of the metal conductive structure.

[0020] Preferably, the second and third conductive structures are shaped based on the positional relationship between the corresponding pads and pins.

[0021] Preferably, the metal conductive structure uses a metal wire as a carrier.

[0022] Preferably, the substrate is configured as a PCB-like structure that combines the substrate and the metal conductive structure together.

[0023] Preferably, the drive signal pad and the metal conductive structure are electrically connected through a welding process.

[0024] This invention provides a packaging structure for a light-emitting module, comprising: a light-emitting device; a driving circuit chip; and a substrate. The substrate has a first conductive structure and a second conductive structure. The driving signal pad of the driving circuit chip is electrically connected to a first end of the light-emitting device through the first conductive structure, and the second end of the light-emitting device is connected to a first pin of the substrate through the second conductive structure. This allows the light-emitting device and the driving circuit chip to be integrated on the same side of the substrate. Compared to traditional wire bonding processes, this reduces the number of physical connection points. Furthermore, the electrical connection via the conductive structure effectively avoids problems such as suspended or broken metal wires, significantly improving the overall reliability of the light-emitting module. Attached Figure Description

[0025] The above and other objects, features and advantages of the present invention will become more apparent from the following description of embodiments of the invention with reference to the accompanying drawings, in which:

[0026] Figure 1 A schematic diagram showing the packaging structure of the light-emitting module according to the first embodiment of the present invention;

[0027] Figure 2 This diagram illustrates the packaging of the driving circuit chip in the light-emitting module according to an embodiment of the present invention.

[0028] Figure 3 A schematic diagram of the packaging structure of the light-emitting module according to the second embodiment of the present invention is shown. Detailed Implementation

[0029] The invention will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are indicated by similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Furthermore, some well-known parts may not be shown. For simplicity, the semiconductor structure obtained after several steps can be depicted in a single figure.

[0030] It should be understood that when describing the structure of a device, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above another layer or region, or that there are other layers or regions between it and another layer or region. Furthermore, if the device is flipped, that layer or region will be located "below" or "under" another layer or region.

[0031] To describe a situation where A is directly above another layer or region, this document will use the expressions "A is directly above B" or "A is above and adjacent to B". In this application, "A is directly located in B" means that A is located in B and A is directly adjacent to B, rather than A being located in a doped region formed in B.

[0032] Many specific details of the invention, such as the structure, materials, dimensions, processing methods, and techniques of the devices, are described below to provide a clearer understanding of the invention. However, as those skilled in the art will understand, the invention may be implemented without following these specific details.

[0033] Figure 1 This is a schematic diagram of the packaging structure of the light-emitting module according to the first embodiment of the present invention. Figure 1As shown, the packaging structure of the light-emitting module includes a substrate 1, a light-emitting device, a driving circuit chip 2, and a metal conductive structure, wherein the metal conductive structure is disposed on the upper surface of the substrate 1. The light-emitting device can be one or more LED beads that emit red, green, and blue light. This embodiment of the invention uses tri-color LED beads R, G, and B that emit red, green, and blue light as an example. The driving circuit chip 2 is used to drive the light-emitting device, providing a certain current to the corresponding light-emitting device. To clearly see the connection method, Figure 1 The bare die is not shown; only the pads of the driver circuit chip are displayed. In this embodiment, the metal conductive structure includes a first conductive structure 11 and a second conductive structure 12. The driver circuit chip 2 is electrically connected to the first end of the corresponding LED bead through the first conductive structure 11, and the second end of the LED bead is electrically connected to the first pin 111 on the substrate through the second conductive structure 12. Since the light-emitting device in this embodiment is a tri-color LED bead, the first conductive structure 11 is configured as three conductive paths connecting the corresponding LED bead and the driver signal pad. The first ends of the LED beads R, G, and B are electrically connected to the corresponding driver signal pads PR, PG, and PB of the driver circuit chip through the three conductive paths, respectively, and their second ends are interconnected and connected to the first pin 111 through the second conductive structure 12. In this embodiment, the driver circuit chip 2 and the R, G, and B LED beads are integrated on the same side of the substrate, reducing physical connection points compared to traditional wire bonding processes. In this embodiment, the driver signal pads and the metal conductive structure are electrically connected through a welding process, effectively avoiding problems such as suspended and broken metal wires, significantly improving the overall reliability of the light-emitting module.

[0034] In this embodiment, substrate 1 is generally a PCB-like board or carrier board in the art, and generally includes a substrate body. The shape of the substrate body is not strictly limited and can be square, circular, or irregular. The substrate body can be made of rigid or flexible material. In some examples, corresponding circuits can be integrated into or on the substrate body according to application requirements, such as circuits connected to LED beads and driving circuits.

[0035] In this embodiment, the substrate 1 combines the base and the metal conductive structure through a PCB-like structure. The upper surface of the substrate 1 includes the metal conductive structure, which acts as a wire. The substrate 1 also includes at least pins distributed on opposite sides, wherein the pins include a first pin 111, a second pin 112, a third pin 113, and a fourth pin 114.

[0036] In one embodiment, the metal conductive structure is formed on a substrate using a semiconductor etching process, thereby creating a high-density conductive line on the substrate to fix the circuit connection. This not only eliminates the need for traditional metal connecting wires but also improves circuit reliability. In another implementation, the metal conductive structure uses metal wires as a carrier to complete the circuit connection.

[0037] In one embodiment, the driver circuit chip 2 is disposed on the substrate in a flip-chip manner, that is, the driver circuit chip 2 has a pad structure on the side facing the substrate 1, and the driver circuit chip 2 is electrically connected to the metal conductive structure through the pad structure. Multiple pads of the driver circuit chip 2 correspond to corresponding conductive structures, and are electrically connected to the corresponding conductive structures through a soldering process. This eliminates the need for traditional wire bonding, resulting in shorter interconnect paths and lower parasitic parameters.

[0038] In one implementation, wave soldering is used to connect the pads of the driver circuit chip 2 to the LED beads, as well as to the conductive structure and pins, for batch soldering. Solder paste is first applied to the pads and LED beads, and then heated during wave soldering to connect the pads and LED beads to the metal conductive structure. For example, a soldering machine applies solder balls to the pads of the driver circuit chip 2, and then a flip-chip mounter is used to flip-chip the driver circuit chip 2 onto the corresponding first conductive structure. Machine vision positioning aligns one end of the conductive structure with the pad dots. Similarly, the soldering machine applies solder balls to the first ends of the R, G, and B LED beads, and then the R, G, and B LED beads are mounted onto the substrate. Machine vision positioning aligns the first ends with the other end of the first conductive structure, thereby achieving electrical connection between the driver circuit chip and the light-emitting device.

[0039] In one embodiment, the second conductive structure 12 extends from the first pin 111 along a first direction to the second end of the corresponding light-emitting device, and along a second direction to the first pad of the driving circuit chip, wherein the first direction is perpendicular to the second direction and parallel to the upper side of the substrate. In this embodiment, the light-emitting device is described using a common anode connection as an example, and the first pad is configured as a power pad VDD.

[0040] In one embodiment, the driver circuit chip includes driver signal pads PR, PG, and PB, a first pad, a second pad, a third pad, and a fourth pad. The first pad is electrically connected to a first pin 111 via a second conductive structure. The second, third, and fourth pads are electrically connected to second pins 112, third pins 113, and fourth pins 114 via third conductive structures of metal conductive structures, respectively. In this embodiment, the first, second, third, and fourth pads are respectively the power supply pad VDD, the ground pad GND, the data input pad DI, and the data output pad DO.

[0041] In this embodiment, the pads of the driver circuit chip 2 are arranged in two rows horizontally. The drive signal pads PR, PG, and PB, the power supply pad VDD, and the ground pad GND, data input pad DI, and data output pad DO are arranged in one row. The common anode connection of the light-emitting device is used as an example. The first terminals of the LED beads R, G, and B, for example, the cathode, are respectively connected to... Figure 1 The three drive signal pads PR, PG, and PB on the driver circuit chip have their second ends, such as the anode, connected to the first pin 111 on the substrate. In this embodiment, the first pin 111 is a power supply potential pin, connected to the power supply potential of the external circuit or PCB board. The power supply pad VDD is electrically connected to the first pin 111 through the second conductive structure 12. The ground pad GND, the data input pad DI, and the data output pad DO are electrically connected to the second pin 112, the third pin 113, and the fourth pin 114 through the third conductive structure, respectively. When the first pin 111 is powered on, the driver circuit chip 2 can control whether the three drive signal pads PR, PG, and PB are grounded based on the input signal of the data input pin DI. For example, if the drive signal pad PR is grounded, the corresponding LED R emits red light.

[0042] Figure 2 This is a schematic diagram of the packaged driver circuit chip in the light-emitting module according to an embodiment of the present invention. (Reference) Figure 2 The driver circuit chip 2 is mounted on the substrate 1 via a flip-chip configuration, meaning that the driver circuit chip 2 has a pad structure on the side facing the substrate 1. In this embodiment, the driver circuit chip 2 includes multiple pads. Since the cross-sectional view cannot show all pads, only the drive signal pads PR, PG, and PB, the power pad VDD, the ground pad GND, the data input pad DI, and the data output pad DO are shown. Figure 2 The first conductive structure 11 extends from one end of the corresponding light-emitting device to the corresponding drive signal pad, and the second conductive structure 12 extends from the first pin to the power pad VDD of the drive circuit chip 2. In this embodiment, to facilitate connection with the metal conductive structure, the drive circuit chip 2 is flip-chip mounted on the substrate and then wave-soldered. This method replaces wire bonding and avoids wire breakage due to oscillation or rapid temperature changes.

[0043] Figure 3This is a schematic diagram of the packaging structure of the light-emitting module according to the second embodiment of the present invention. Compared with the packaging structure of the light-emitting module in the first embodiment, the pad positions of the driver circuit chip 2 in this embodiment are different. In this embodiment, the pads of the driver circuit chip 2 are arranged in three rows in a horizontal physical position: the driver signal pads PR, PG, and PB are arranged in one row; the data output pad DO and the power pad VDD are arranged in one row; and the ground pad GND and the data input pad DI are arranged in one row. The driver signal pads PR, PG, and PB are electrically connected to the corresponding LED chips R, G, and B through the first conductive structure 11. The power pad VDD is electrically connected to the first pin 111 through the second conductive structure 12. The ground pad GND, the data input pad DI, and the data output pad DO are electrically connected to the second pin 112, the third pin 113, and the fourth pin 114, respectively, through the third conductive structure.

[0044] The packaging structure of the light-emitting module in this embodiment of the invention encapsulates the driving circuit chip and the light-emitting device on the same substrate, reducing the size of the light-emitting module. In addition, the driving circuit chip and the light-emitting device, as well as the pads of the driving circuit chip and the pins on the substrate, are electrically connected through conductive structures. These conductive structures can fix the circuit connection lines, effectively avoiding the complexity and unreliability of traditional wire bonding processes, and solving problems such as broken metal connection wires, poor soldering, and detachment, thus significantly improving the overall reliability of the light-emitting module.

[0045] As described above, these embodiments of the present invention do not exhaustively cover all details, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to effectively utilize the invention and its modifications. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A packaging structure for a light-emitting module, characterized in that, include: substrate, A metallic conductive structure is disposed on the upper surface of the substrate, including a first conductive structure and a second conductive structure; A light-emitting device is disposed on the substrate; as well as A driving circuit chip is disposed on the substrate and includes driving signal pads corresponding to the light-emitting device; The driving signal pad is electrically connected to the first end of the light-emitting device through the first conductive structure, and the second end of the light-emitting device is electrically connected to the first pin of the substrate through the second conductive structure.

2. The packaging structure of the light-emitting module according to claim 1, characterized in that, The driving circuit chip includes multiple pads arranged in two rows in a horizontal physical position.

3. The packaging structure of the light-emitting module according to claim 1, characterized in that, The driving circuit chip includes multiple pads arranged in three rows in a horizontal physical position.

4. The packaging structure of the light-emitting module according to claim 1, characterized in that, The driving circuit chip is mounted on the substrate using a flip-chip method.

5. The packaging structure of the light-emitting module according to claim 4, characterized in that, The first conductive structure extends from one end of the light-emitting device to the corresponding drive signal pad, and the second conductive structure extends from the first pin along a first direction to the second end of the light-emitting device, and along a second direction to the first pad of the drive circuit chip.

6. The packaging structure of the light-emitting module according to claim 4, characterized in that, The first conductive structure is electrically connected to the drive signal pad and the light-emitting device by soldering, and the second conductive structure is electrically connected to the light-emitting device and the first pin by soldering.

7. The packaging structure according to claim 1, characterized in that, The first pin is connected to the power supply potential of the external circuit or PCB board.

8. The packaging structure of the light-emitting module according to claim 1, characterized in that, The driving circuit chip also includes: The second pad is electrically connected to the second pin of the substrate; The third pad is electrically connected to the third pin of the substrate; and The fourth pad is electrically connected to the fourth pin of the substrate, wherein the second, third and fourth pads are electrically connected to the second, third and fourth pins respectively through the third conductive structure of the metal conductive structure.

9. The packaging structure of the light-emitting module according to claim 8, characterized in that, The second and third conductive structures are shaped based on the positional relationship between the corresponding pads and pins.

10. The packaging structure of the light-emitting module according to claim 1, characterized in that, The metallic conductive structure uses a metallic wire as a carrier.

11. The packaging structure of the light-emitting module according to claim 1, characterized in that, The substrate is configured as a PCB-like structure that combines the substrate and the metal conductive structure together.

12. The packaging structure of the light-emitting module according to claim 1, characterized in that, The drive signal pads are electrically connected to the metal conductive structure through a welding process.

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