Miniature thermoelectric device integrated with manifold micro-channel heat exchange structure
By integrating manifold microchannel structures into micro thermoelectric devices, the shortcomings of traditional heat dissipation structures are solved, improving the temperature difference between hot and cold ends and performance. This makes the devices suitable for miniaturization and mass production, and can be extended to chip-level thermal management and wearable devices.
Patent Information
- Application Number
- CN202511722074.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-21
- Publication Date
- 2026-02-27
AI Technical Summary
Existing technologies lack mature solutions for effectively integrating manifold microchannel structures into the interior of micro thermoelectric devices, resulting in limited heat dissipation capacity of traditional parallel channel finned heat sinks, making it difficult to meet the needs of high heat flux density devices, maintain an effective temperature difference, and affect output performance.
The manifold microchannel heat exchange structure is coupled with the thermoelectric functional unit, including the manifold distributor and multiple microchannels, for uniform distribution of the cooling working fluid and enhanced heat transfer, maintaining the end-face temperature difference of the thermoelectric functional unit and improving device performance.
It significantly improves the temperature difference between the hot and cold ends, enhances power generation and cooling performance, has a compact structure, is suitable for miniaturization and integration, is suitable for large-scale manufacturing, and can be extended to chip-level thermal management and wearable energy applications.
Smart Images
Figure CN121586384A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of thermoelectric devices, and particularly relates to a micro thermoelectric device integrated with a manifold micro-channel heat exchange structure. BACKGROUND
[0002] Thermoelectric devices are widely used in consumer electronics, communications, medical detection, automobiles, industrial control, aerospace and defense, and oil and gas exploration due to their compact structure, no moving parts, high reliability, etc. and show great application potential in emerging directions such as wearable devices, self-powered sensors and microelectronic heat dissipation. Thermoelectric devices can not only realize thermoelectric generation, but also can be used for thermoelectric refrigeration. Regardless of which working mode, its performance is highly dependent on the efficient heat sink heat dissipation structure. With the rapid development of electronic information technology, thermoelectric devices are constantly evolving towards miniaturization and micro-miniaturization. However, the traditional parallel channel fin heat sink has limited heat dissipation capacity and cannot meet the needs of high heat flux devices, so it is urgent to develop more efficient heat exchange structures.
[0003] In a micro thermoelectric device, it is more difficult to maintain an effective temperature difference, which limits its output performance. The manifold micro-channel structure has significant heat transfer and fluid performance advantages as a new and efficient heat exchange technology. However, the manifold micro-channel structure is currently used as an independent passive heat dissipation structure, and there is still a lack of mature solutions to effectively integrate it into the internal micro thermoelectric device. SUMMARY
[0004] In order to solve the technical problem that the existing technology lacks a mature solution to effectively integrate the manifold micro-channel structure into the internal micro thermoelectric device, the present application provides a micro thermoelectric device integrated with a manifold micro-channel heat exchange structure.
[0005] The technical scheme provided by the embodiments of the present application is as follows: The micro thermoelectric device integrated with a manifold micro-channel heat exchange structure provided by the embodiments of the present application comprises at least one thermoelectric functional unit and a manifold micro-channel heat exchange structure. The thermoelectric functional unit is used to realize the core function of thermoelectric power generation or thermoelectric refrigeration, has a cold end and a hot end when used in a power generation scene, and has a refrigeration end and a heat dissipation end when used in a refrigeration scene. The manifold micro-channel heat exchange structure is coupled with the cold end or the heat dissipation end, and the manifold micro-channel heat exchange structure comprises a manifold distributor and a plurality of micro-channels. The manifold distributor is used to uniformly distribute the cooling working medium to the plurality of micro-channels. The plurality of micro-channels are used to carry the cooling working medium flow and enhance heat transfer. The manifold microchannel heat exchange structure is coupled to the thermoelectric functional unit to maintain the end-face temperature difference of the thermoelectric functional unit and improve the power generation or cooling performance of the micro thermoelectric device.
[0006] The beneficial effects of the technical solutions provided in the embodiments of the present invention include at least the following: In this invention, the manifold microchannel structure is effectively integrated into the interior of a micro thermoelectric device, which can significantly improve the temperature difference between the hot and cold ends, improve power generation and cooling performance, and has a compact structure that is suitable for miniaturization and integration, as well as large-scale fabrication, and can be extended to chip-level thermal management and wearable energy applications. Attached Figure Description
[0007] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0008] Figure 1 This is a schematic diagram of a micro thermoelectric device with an integrated manifold microchannel heat exchange structure provided in an embodiment of the present invention.
[0009] Figure 2 This is a schematic diagram of a stepped manifold microchannel heat exchange structure provided in an embodiment of the present invention.
[0010] Figure 3 This is a schematic diagram of a layered manifold microchannel heat exchange structure provided in an embodiment of the present invention.
[0011] Figure 4 This is a temperature difference comparison diagram between the two ends of a thermoelectric functional unit composed of different micro thermoelectric devices and different thermoelectric materials under a power generation mode, provided as an embodiment of the present invention.
[0012] Figure 5 A method provided by an embodiment of the present invention n Type and p A schematic diagram of the thermoelectric properties of bismuth telluride-based thermoelectric materials as a function of temperature.
[0013] Figure 6 This is a comparison chart of the power generation performance of a bismuth telluride-based micro thermoelectric device with different heat exchange structures in a power generation scenario, as provided in an embodiment of the present invention.
[0014] Figure 7 A method provided by an embodiment of the present invention n Type and p A schematic diagram of the thermoelectric properties of magnesium antimonide-based thermoelectric materials as a function of temperature.
[0015] Figure 8 This is a schematic diagram illustrating the power generation performance of a magnesium antimonide-based micro thermoelectric device with an integrated manifold microchannel heat exchange structure in a power generation scenario, as provided in an embodiment of the present invention.
[0016] Figure 9 A method provided by an embodiment of the present invention n Type and p A schematic diagram of the thermoelectric properties of tin selenide-based thermoelectric materials as a function of temperature.
[0017] Figure 10 A schematic diagram illustrating the power generation performance of a tin selenide-based micro thermoelectric device with an integrated manifold microchannel heat exchange structure in a power generation scenario, as provided in an embodiment of the present invention.
[0018] Figure 11 This is a comparison chart of the cooling performance of bismuth telluride-based micro thermoelectric devices with different heat exchange structures in a cooling scenario, as provided in an embodiment of the present invention.
[0019] Reference numerals: 1. Thermoelectric functional unit; 2. Manifold microchannel heat exchange structure; 21. Manifold distributor; 22. Microchannel.
[0020] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of the present invention. However, this is only for illustrative purposes and is not intended to limit the present invention to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation
[0021] The technical solutions of the present invention will now be described with reference to the accompanying drawings. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some well-known technologies. Furthermore, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.
[0022] like Figures 1 to 11 As shown, an embodiment of the present invention provides a micro thermoelectric device with an integrated manifold microchannel heat exchange structure, comprising: at least one thermoelectric functional unit 1 and a manifold microchannel heat exchange structure 2.
[0023] The thermoelectric functional unit 1 is used to realize the core functions of thermoelectric power generation or thermoelectric cooling. When used in the power generation scenario, it has a cold end and a hot end, and when used in the cooling scenario, it has a cooling end and a heat dissipation end.
[0024] The manifold microchannel heat exchange structure 2 is coupled to the cold end or the heat dissipation end. The manifold microchannel heat exchange structure 2 includes a manifold distributor 21 and multiple microchannels 22.
[0025] The manifold distributor 21 is used to evenly distribute the cooling working fluid to multiple microchannels 22.
[0026] The multiple microchannels 22 are used to carry the flow of cooling working fluid and enhance heat transfer.
[0027] The manifold microchannel heat exchange structure 2 is coupled to the thermoelectric functional unit 1 to maintain the end face temperature difference of the thermoelectric functional unit 1 and improve the power generation or cooling performance of the micro thermoelectric device.
[0028] In this invention, the manifold microchannel structure is effectively integrated into the interior of a micro thermoelectric device, which can significantly improve the temperature difference between the hot and cold ends, improve power generation and cooling performance, and has a compact structure that is suitable for miniaturization and integration, as well as large-scale fabrication, and can be extended to chip-level thermal management and wearable energy applications.
[0029] In one possible implementation, the manifold microchannel heat exchange structure 2 is a stepped distribution structure or a layered distribution structure. For example... Figure 2 A schematic diagram of a stepped manifold microchannel heat exchange structure is shown. Figure 3 A schematic diagram of a layered manifold microchannel heat exchange structure is shown.
[0030] In one possible implementation, the microchannel 22 has a width of 10 to 1000 μm and a depth of 20 to 2000 μm.
[0031] In one possible implementation, the manifold distributor 21 is a stepped or layered distribution structure.
[0032] In one possible implementation, a highly thermally conductive interface material is bonded between the manifold microchannel heat exchange structure 2 and the thermoelectric functional unit 1.
[0033] In one possible implementation, a high thermal conductivity interface material is welded between the manifold microchannel heat exchange structure 2 and the thermoelectric functional unit 1.
[0034] In one possible implementation, the core thermoelectric material of the thermoelectric functional unit 1 has length and width dimensions of 10 to 500 μm and height of 100 to 2000 μm.
[0035] In one possible implementation, the core thermoelectric material of the thermoelectric functional unit 1 is B. T Thermoelectric materials based on BiSb, Mg3Sb2, SnSe, or Ag2Se. Figure 4The diagram illustrates the temperature difference between the two ends of different micro-thermoelectric device structures and thermoelectric functional units composed of different thermoelectric materials under power generation modes. (a) Schematic diagram of a thermoelectric microdevice without a heat sink; (b) Schematic diagram of a thermoelectric microdevice integrated with parallel microchannels; (c) Schematic diagram of a thermoelectric microdevice integrated with manifold microchannels; (d) Temperature difference comparison at both ends of the thermoelectric functional unit; free: thermoelectric device without a heat sink; SPMC: thermoelectric microdevice integrated with parallel microchannels; MMC: thermoelectric microdevice integrated with manifold microchannels; HH: semi-Hasler alloy; Bi2Te3: bismuth telluride material; Mg3Sb2: magnesium antimonide material; SnSe: tin selenide material; Ag2Se: silver selenide material.
[0036] In one possible implementation, the manifold microchannel heat exchange structure 2 is made of silicon, metal or ceramic materials through micro-nano processing or 3D printing.
[0037] In one possible implementation, the cooling medium is air, water, or nanofluid.
[0038] Example 1
[0039] This embodiment employs 3D printing to fabricate a stepped manifold microchannel heat exchange structure, which is then soldered onto a bismuth telluride-based thermoelectric functional unit. The cooling medium in the manifold microchannel heat exchange structure is air, with a flow rate of 0.86 m / s and an air temperature of 300 K. The hot-junction temperature of the micro-thermoelectric device is 350 K. n Type and p A schematic diagram of the performance of the thermoelectric material is shown below. Figure 5 As shown, (a) the absolute value of Seebeck's coefficient (| α |)-Temperature( T (b) Electrical conductivity σ )- T (c) Thermal conductivity ( κ )- T (d) Thermoelectric figure of merit ( ZT )- T The thermoelectric device contains 16 pairs of thermoelectric arms. n boom and pThe dimensions of the thermoelectric arms are 300 μm, 300 μm, and 800 μm, respectively. The gap between the thermoelectric arms is 50 μm. The thickness of the conductive sheet is 30 μm, and the thickness of the aluminum nitride ceramic sheet is 125 μm. The overall dimensions of the thermoelectric device are 1.7 mm, 3.18 mm, and 1.11 mm, respectively. The substrate thickness of the manifold microchannel heat exchange structure is 530 μm. The thickness of the first channel layer is 250 μm, the gap width of the first channel layer is 250 μm, and there are 8 channels in the first layer. The thickness of the second layer is 250 μm, the gap width of the second channel layer is 200 μm, and there are 8 channels in the second layer. A comparison of the power generation performance of bismuth telluride-based microthermoelectric devices with different heat exchange structures in a power generation scenario is shown in the figure below. Figure 6 As shown, (a) voltage ( U )-current( I (b) Output power density P d (c) Cold end heat flow Q c )- I (d) Efficiency η )- I Its open-circuit voltage reaches 75.14mV, and its peak power density reaches 43.53μW / mm². 2 Compared to Comparative Examples 1 and 2, its open-circuit voltage increased by 7.37 times and 2.57 times, respectively, and its peak power density increased by 62.30 times and 7.36 times, respectively.
[0040] Example 2
[0041] This embodiment utilizes 3D printing to fabricate a stepped manifold microchannel heat exchange structure made of 6061 aluminum alloy. The structure is then bonded to a magnesium antimonide-based thermoelectric functional unit using thermally conductive silicone grease. The cooling medium in the manifold microchannel heat exchange structure is air, with a flow rate of 1.5 m / s and an air temperature of 280 K. The hot-junction temperature of the micro-thermoelectric device is 330 K. n Type and p A schematic diagram of the thermoelectric properties of magnesium antimonide-based thermoelectric materials as a function of temperature is shown below. Figure 7 As shown, (a)| α |- T (b) σ - T (c) κ - T (d) ZT - T The thermoelectric device contains 32 pairs of thermoelectric arms. n boom and pThe dimensions of the thermoelectric arms are 250μm (length), 250μm (width), and 1000μm (height), respectively. The gap between the thermoelectric arms is 100μm. The thickness of the conductive sheet is 50μm, and the thickness of the aluminum nitride ceramic sheet is 250μm. The substrate thickness of the manifold microchannel heat exchange structure is 530μm. The thickness of the first layer channel is 500μm, the gap width of the first layer channel is 115μm, and the number of channels in the first layer is 16. The thickness of the second layer is 500μm, the gap width of the second layer channel is 237μm, and the number of channels in the second layer is 8. A schematic diagram of the power generation performance of the integrated manifold microchannel heat exchange structure magnesium antimony-based microthermoelectric device in a power generation scenario is shown below. Figure 8 As shown, (a) U - I (b) P d - I (c) Q c - I (d) η - I Its open-circuit voltage reaches 67mV, and its peak power density can reach 29μW / mm². 2 Compared to micro thermoelectric devices without heat exchange structures, its open-circuit voltage and peak power density are increased by 7.12 times and 56.52 times, respectively.
[0042] Example 3
[0043] This embodiment employs micro-nano fabrication techniques to fabricate a layered manifold microchannel heat exchange structure made of single-crystal silicon. The manifold microchannel is then bonded to a tin selenide-based thermoelectric functional unit. The cooling medium in the manifold microchannel heat exchange structure is water, with a flow rate of 0.5 m / s and a temperature of 300 K. The hot-junction temperature of the micro-thermoelectric device is 350 K. n Type and p A schematic diagram of the thermoelectric properties of tin selenide-based thermoelectric materials as a function of temperature is shown below. Figure 9 As shown, (a)| α |- T (b) σ - T (c) κ - T (d) ZT - T The thermoelectric device contains 16 pairs of thermoelectric arms. n boom and pThe dimensions of the thermoelectric arms are 300μm, 300μm, and 800μm, respectively. The gap between the thermoelectric arms is 50μm. The thickness of the conductive sheet is 30μm, and the thickness of the aluminum nitride ceramic sheet is 125μm. The overall dimensions of the thermoelectric device are 1.7mm, 3.18mm, and 1.11mm, respectively. The substrate thickness of the manifold microchannel heat exchange structure is 530μm. The thickness of the first layer channel is 250μm, the gap width of the first layer channel is 250μm, and there are 8 channels in the first layer. The thickness of the second layer is 250μm, the gap width of the second layer channel is 200μm, and there are 8 channels in the second layer. A schematic diagram of the power generation performance of the tin selenide-based microthermoelectric device with integrated manifold microchannel heat exchange structure in a power generation scenario is shown below. Figure 10 As shown, (a) U - I (b) P d - I (c) Q c - I (d) η - I Its open-circuit voltage reaches 79.55mV, and its peak power density reaches 31.07μW / mm². 2 Compared to micro thermoelectric devices without heat exchange structures, its open-circuit voltage and peak power density are increased by 7.16 times and 57.69 times, respectively.
[0044] Example 4
[0045] In this embodiment, a layered manifold microchannel heat exchange structure was fabricated using 3D printing technology. The heat exchange structure was made of pure copper and was then bonded to a bismuth telluride thermoelectric functional unit using thermally conductive silicone grease. The resulting micro-thermoelectric device has the following morphology. Figure 1 As shown, the specific dimensions are the same as in Example 1, but the cooling medium in the heat exchange structure is water, and the micro thermoelectric device is in cooling mode. The comparison of cooling performance of bismuth telluride-based micro thermoelectric devices with different heat exchange structures in a cooling scenario is shown in the figure below, with the cooling end controlled at 350K and the heat dissipation end at 273K. Figure 11 As shown, (a) U - I (b) Input power density P d )- I (c) Cooling power density Q cd )- I (d) Cooling efficiency ( COP )- I As can be seen from the figure, the peak cooling density of the micro-thermoelectric device integrating the manifold microchannel heat exchange structure reaches 113.9 mW / mm². 2Compared to Comparative Examples 1 and 2, its peak cooling density increased by 16.66 times and 1.44 times, respectively.
[0046] Comparative Example 1
[0047] The comparative example was cut using wire cutting technology. n Type and p A thermoelectric arm was constructed, and solder paste was applied to both ends of the arm using screen printing. A reflow soldering process was then used to solder a thermoelectric microdevice without any heat exchange structure. All material properties and device dimensions were consistent with Example 1. The hot end of the device was at 350K, and the cold end was at 300K air with an air velocity of 0.86 m / s. In this comparative example, the power generation performance of the microdevice is as follows: Figure 6 As shown in the figure, the voltage and output power generated by the miniature thermoelectric device are extremely small when no additional heat exchange structure is integrated. Its open-circuit output voltage is only 4mV, and its maximum output power density is only 0.1μW / mm². 2 The core reason is that the effective temperature difference established is extremely small, only 0.6K.
[0048] Comparative Example 2
[0049] This comparative example uses 3D printing to fabricate a parallel microchannel heat exchange structure, which is then soldered onto a bismuth telluride-based thermoelectric functional unit. The cooling medium in the manifold microchannel heat exchange structure is air, with a flow rate of 0.86 m / s and a temperature of 300 K. The hot-junction temperature of the micro-thermoelectric device is 350 K. Within the thermoelectric functional unit… n Type and p The performance and thermoelectric arm dimensions of the parallel microchannel thermoelectric material are the same as those in Example 1. The substrate thickness of the parallel microchannel is 530 μm, the thickness of the first channel layer is 500 μm, the gap width of the first channel layer is 100 μm, and the number of channels is 8. The overall size is the same as that of the micro-thermoelectric device in Example 1. The power generation performance of the parallel microchannel thermoelectric device... Figure 6 As shown in the figure, even with the integration of a classic parallel microchannel heat exchange structure, the voltage and output power generated by the micro thermoelectric device are still relatively small. Its open-circuit output voltage is 30mV, and its maximum output power density is only 42μW / mm². 2 The core reason is that the effective temperature difference established is extremely small, only 4.7K.
[0050] Comparative Example 3
[0051] This comparative example was cut using wire cutting technology. n Type and pA thermoelectric arm was constructed, and solder paste was applied to both ends of the arm using screen printing. A reflow soldering process was then used to solder the thermoelectric microdevice without any heat exchange structure. The thermoelectric material properties and arm dimensions were the same as in Example 4, but without the heat exchange structure. When the cooling end was controlled at 350K and the heat dissipation end was air at 273K, its cooling performance was as follows: Figure 11 As shown in the figure, the micro-device, lacking any heat exchange structure, exhibits extremely low cooling performance, with a peak cooling capacity of only 6.8 mW / mm². 2 It is almost negligible.
[0052] Comparative Example 4
[0053] This comparative example uses 3D printing to fabricate a parallel microchannel heat exchange structure made of pure copper. This manifold microchannel heat exchange structure is attached to a bismuth telluride thermoelectric functional unit using thermally conductive silicone grease. The material properties and component dimensions are the same as in Example 4, but the cooling medium in the heat exchange structure is air. When the cooling end is controlled at 350K and the heat dissipation end is air at 273K, its cooling performance is as follows: Figure 11 As shown in the figure, the microdevice with the integrated parallel microchannel heat exchange structure exhibits improved cooling performance compared to Comparative Example 3, but still lags significantly behind Example 4, with a peak cooling capacity of 79.1 mW / mm². 2 .
[0054] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the preferred embodiments, while those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.
[0055] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.
Claims
1. A micro thermoelectric device with an integrated manifold microchannel heat exchange structure, characterized in that, include: At least one thermoelectric functional unit (1) and a manifold microchannel heat exchange structure (2); The thermoelectric functional unit (1) is used to realize the core functions of thermoelectric power generation or thermoelectric cooling. When used in the power generation scenario, it has a cold end and a hot end. When used in the cooling scenario, it has a cooling end and a heat dissipation end. The manifold microchannel heat exchange structure (2) is coupled to the cold end or the heat dissipation end. The manifold microchannel heat exchange structure (2) includes: a manifold distributor (21) and multiple microchannels (22). The manifold distributor (21) is used to uniformly distribute the cooling working fluid to multiple microchannels (22). Multiple microchannels (22) are used to carry the flow of cooling working fluid and enhance heat transfer; The manifold microchannel heat exchange structure (2) is coupled to the thermoelectric functional unit (1) to maintain the end face temperature difference of the thermoelectric functional unit (1) and improve the power generation or cooling performance of the micro thermoelectric device.
2. The micro thermoelectric device with an integrated manifold microchannel heat exchange structure according to claim 1, characterized in that, The manifold microchannel heat exchange structure (2) is a stepped distribution structure or a layered distribution structure.
3. The micro thermoelectric device with an integrated manifold microchannel heat exchange structure according to claim 1, characterized in that, The microchannel (22) has a width of 10 to 1000 μm and a depth of 20 to 2000 μm.
4. The micro thermoelectric device with an integrated manifold microchannel heat exchange structure according to claim 1, characterized in that, The manifold distributor (21) has a stepped or layered distribution structure.
5. The micro thermoelectric device with an integrated manifold microchannel heat exchange structure according to claim 1, characterized in that, A highly thermally conductive interface material is bonded between the manifold microchannel heat exchange structure (2) and the thermoelectric functional unit (1).
6. The micro thermoelectric device with an integrated manifold microchannel heat exchange structure according to claim 1, characterized in that, A high thermal conductivity interface material is welded between the manifold microchannel heat exchange structure (2) and the thermoelectric functional unit (1).
7. The micro thermoelectric device with an integrated manifold microchannel heat exchange structure according to claim 1, characterized in that, The core thermoelectric material of the thermoelectric functional unit (1) has a length and width of 10 to 500 μm and a height of 100 to 2000 μm.
8. The micro thermoelectric device with an integrated manifold microchannel heat exchange structure according to claim 1, characterized in that, The core thermoelectric material of the thermoelectric functional unit (1) is B. T Thermoelectric materials based on BiSb, Mg3Sb2, SnSe, or Ag2Se.
9. The micro thermoelectric device with an integrated manifold microchannel heat exchange structure according to claim 1, characterized in that, The manifold microchannel heat exchange structure (2) is made of silicon, metal or ceramic materials by micro-nano processing or 3D printing.
10. The micro thermoelectric device with an integrated manifold microchannel heat exchange structure according to claim 1, characterized in that, The cooling medium is air, water, or nanofluid.