Semiconductor production wafer cleaning machine

Abstract

The invention discloses a semiconductor production wafer cleaning machine, and relates to the technical field of semiconductor manufacturing, the semiconductor production wafer cleaning machine comprises a machine body, a cleaning basket used for placing a to-be-cleaned wafer is arranged in the machine body, two groups of clamping and supporting pieces are symmetrically arranged on the inner wall of the cleaning basket, and each clamping and supporting piece at least comprises a supporting shaft rotatably arranged in the cleaning basket, the axis of the support shaft is vertical to the front and rear end faces of the cleaning basket; in the invention, in an initial state, the lower clamping and supporting part supports the wafer, the upper clamping and supporting part is far away from the wafer, the wafer can be conveniently put in by the mechanical arm, after the water level reaches a specific position, the supporting shaft is rotated to enable the upper clamping and supporting part to be close to the wafer and abut against and support the wafer, the upper clamping and supporting part is close to horizontal protruding areas on two sides of the wafer, the anti-toppling force arm is longer, and the wafer is more stable; when the lower clamping support part is initially supported, the water flow flushes the subsequent contact area of the wafer and the upper clamping support part; and after the support is switched, the lower clamping support part leaves, and a contact area between the lower clamping support part and the wafer is exposed for cleaning.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, specifically to a semiconductor wafer cleaning machine. Background Technology

[0002] Wafer cleaning is a process that uses chemical cleaning methods to remove dirt from an entire batch or a single wafer by immersing or spraying chemicals. Its main purpose is to remove contaminants such as dust particles, organic matter, inorganic matter, and metal ions from the wafer surface.

[0003] Currently, wafer cleaning machines mainly use robotic arms to lift multiple wafers at once and place them into wafer cleaning baskets in the cleaning tank. The wafer grippers on the robotic arm and the cleaning baskets are equipped with multiple spaced slots. After the wafers are placed, they are individually inserted into the corresponding slots, ensuring that the wafers are spaced apart and that the water flow can smoothly enter the gaps between the wafers during rinsing. The cleaning process involves multiple cleaning tanks. The operation procedure for each cleaning tank is as follows: first, water is added to the tank through the nozzle. After the water completely covers the wafers, sonic cleaning is activated. After cleaning, the water is drained and then refilled. This process needs to be repeated two to three times for each cleaning tank.

[0004] There are two key problems in this process. First, the contact surface between the wafer cleaning basket and the wafer remains in contact at all times. This contact area will form a cleaning blind spot, which will prevent the wafer from being thoroughly cleaned.

[0005] Secondly, in the current technology, in order to avoid friction between the wafer and the slot wall when the wafer is placed in the slot, the width of the slot is designed to be greater than the thickness of the wafer. Moreover, the robotic arm lifts the wafer for transportation through the brackets on both sides. Due to the constraint of the brackets, the support point supporting the wafer in the cleaning basket will be closer to the bottom of the wafer. The support range is small, and the wafer will be in an unbalanced state of "top-heavy" with the center of gravity much higher than the support surface.

[0006] The wafer, which is already in a state of easy tilting and instability, is further disturbed by the ultrasonic cleaning, making it very easy for the wafer to shake in the slot, thus increasing the risk of wafer damage. Summary of the Invention

[0007] The purpose of this invention is to provide a semiconductor wafer cleaning machine to solve the problems mentioned in the background art.

[0008] To solve the above-mentioned technical problems, the present invention provides a semiconductor wafer cleaning machine, comprising: a machine body, wherein a cleaning basket for placing wafers to be cleaned is provided inside the cleaning basket, and two sets of card holders are symmetrically arranged on the inner wall of the cleaning basket, the card holders comprising at least:

[0009] A support shaft is rotatably disposed inside the cleaning basket. The axis of the support shaft is perpendicular to the front and rear end faces of the cleaning basket and is used to provide a support position for placing the wafer to be cleaned. The support position is located below the center of the wafer to be cleaned.

[0010] The card holder is disposed on the support shaft. The card holder protrudes outward from the outer peripheral wall of the support shaft to form an upper card holder and a lower card holder. As the liquid level in the cleaning basket changes, the support shaft rotates, which is used to transition the lower card holder to limit the wafer, and then to the upper card holder to limit the wafer.

[0011] Furthermore, a driving component is disposed on the end face of the cleaning basket, and its driving shaft is connected to the support shaft for driving the support shaft to rotate;

[0012] A liquid level sensor is installed on the inner wall of the cleaning basket. The liquid level sensor is installed at a height that is at least higher than the support shaft. The liquid level sensor is electrically connected to the drive component and is used to activate the drive component when the liquid level exceeds the support shaft.

[0013] Furthermore, the lower card holder includes lower card holder grooves arranged at axial intervals along the support shaft;

[0014] The lower card slot has an inclined plate on the corresponding surface of the wafer. The inclined end of the inclined plate abuts against the bottom wall of the lower card slot. The two adjacent inclined plates have the same inclined direction. After the inclined plate abuts against the wafer, the wafer tilts towards the initial inclined direction of the inclined plate, so that the two adjacent wafers tilt towards each other or away from each other. The wafers tilted towards each other form a narrow slit, and the wafers tilted away from each other form a wide slit.

[0015] The upper card holder includes upper card holder grooves arranged at intervals along the axial direction of the support shaft. A rotating component is provided in the upper card holder groove, and a trigger component is provided on the teeth. After the wafer contacts the trigger component, the rotating component is triggered to rotate, causing the wafers on both sides of the wide slot to swing relative to each other.

[0016] Furthermore, the upper cassette portion also includes,

[0017] The first upper carding teeth are arranged at intervals along the axial direction of the support shaft and are used to insert into the wide slot. The first upper carding teeth form a first upper carding groove corresponding to the narrow slot. The rotating part is rotatably connected in the first upper carding groove.

[0018] The second upper card holder teeth are arranged at intervals along the axial direction of the support shaft, and a second upper card holder groove corresponding to the wafer is formed between each tooth. The trigger element is installed in the second upper card holder groove, and the trigger end of the trigger element protrudes from the surface of the second upper card holder groove.

[0019] Furthermore, a connecting plate is connected between the first upper card holder tooth and the second upper card holder tooth, and a cavity is formed inside the connecting plate;

[0020] The rotating component includes two relatively inclined arc-shaped rods, with a support rod connected to the outer wall of the arc-shaped rods. The end of the support rod away from the arc-shaped rod extends into the cavity.

[0021] The triggering element includes a gear mounted on the outer wall of the support rod, the gear being located inside the cavity, the gear being meshed with a rack, the bottom end of the rack being connected to a mounting plate, both the rack and the mounting plate being slidably connected to the inner wall of the cavity, and the mounting plate having a through groove, the groove being near the bottom end of the mounting plate;

[0022] The trigger end includes a slide plate, and a sliding cavity is provided in the second upper card holder tooth. The slide plate is slidably connected in the sliding cavity. One end of the slide plate extending into the sliding cavity is connected to a rod and a spring. The end of the spring away from the slide plate is connected to the inner wall of the sliding cavity. The end of the rod away from the slide plate is provided with a ramp, which extends into the sliding groove and is slidably connected to the sliding groove.

[0023] Furthermore, the connecting plate has a rotating rod on the side away from the wafer, and the top of the card holder has a vertical surface. The vertical surface is connected to the outer wall of the rotating rod, and the outer wall of the connecting plate is rotatably connected to the outer wall of the rotating rod.

[0024] Furthermore, a shaft is rotatably connected between the lower card slot and the inclined plate. The inner wall of the lower card slot and the outer wall of the inclined plate are both rotatably connected to the outer wall of the shaft, and the shaft is located in the middle of the inner wall of the lower card slot.

[0025] Furthermore, a rotating ring is provided at the junction of the card holder and the support shaft. The inner ring wall of the rotating ring is connected to the outer wall of the support shaft, and the card holder is connected to the outer ring wall of the rotating ring. An embedded groove is provided on the outer ring wall of the rotating ring. The inner end of the embedded groove extends toward the inner ring wall of the rotating ring, so that when the support shaft rotates, the two sides of the port of the embedded groove alternately press against the wafer.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] 1. In the initial state of this invention, the lower tray supports the wafer, while the upper tray is away from the wafer, making it easier for the robotic arm to place the wafer. After the water level reaches a specific position, the support shaft is rotated to bring the upper tray closer to the wafer and make contact with the support. The upper tray is located near the horizontally protruding areas on both sides of the wafer, and the anti-tipping lever arm is longer, making the wafer more stable. When the lower tray is initially supporting the wafer, the water flow will wash the contact area between the wafer and the upper tray. After switching the support, the lower tray moves away, exposing its contact area with the wafer for cleaning.

[0028] 2. In this invention, when the wafer is placed in the slot of the lower tray, it contacts the tilting plate. Because one end of the tilting plate is biased and tilted in the same direction, it causes the wafer to tilt in the same direction as well, so that adjacent wafers tilt relative to each other or away from each other, forming an alternating arrangement of narrow and wide slots. When the liquid level exceeds a certain position, the upper tray approaches the wafer, triggering the component to drive the rotating component to rotate, pushing the adjacent tilted wafers to adjust, the narrow slots become wider and the wide slots become narrower, so that the wafer returns to the upright position. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the appearance of the present invention;

[0030] Figure 2 This is a schematic diagram of the connection structure between the cleaning basket and the wafer in this invention;

[0031] Figure 3 This is a schematic diagram of the connection structure between the transfer ring and the embedded groove in this invention;

[0032] Figure 4 This is a schematic diagram of the connection structure between the rotating ring and the support shaft in this invention;

[0033] Figure 5 This is a schematic diagram of the connection structure between the support shaft and the card holder in this invention;

[0034] Figure 6 This is a schematic diagram of the connection structure between the card holder portion and the upper card holder portion in this invention;

[0035] Figure 7 This is a schematic diagram of the connection structure between the lower card slot and the inclined plate in this invention;

[0036] Figure 8 for Figure 7 Enlarged view of the structure at point A in the middle;

[0037] Figure 9 This is a schematic diagram of the connection structure between the first upper card slot and the rotating component in this invention;

[0038] Figure 10 This is a schematic diagram of the connection structure between the arc-shaped rod and the wafer in this invention;

[0039] Figure 11 This is a schematic diagram of the internal structure of the connecting plate in this invention;

[0040] Figure 12 This is a schematic diagram of the connection structure between the card holder and the connecting plate in this invention;

[0041] Figure 13 This is a schematic diagram of the connection structure between the gear and the rack in this invention.

[0042] In the image: 1. Body;

[0043] 2. Cleaning tank; 3. Cleaning basket; 4. Wafer;

[0044] 5. Card holder; 51. Card holder part; 52. Support shaft; 53. Rotary ring; 54. Inner groove; 55. Vertical surface;

[0045] 6. Upper card slot section;

[0046] 61. Upper card tray; 611. First upper card tray; 612. Second upper card tray;

[0047] 62. Rotating component; 621. Arc-shaped rod; 622. Support rod;

[0048] 63. Trigger; 631. Gear; 632. Rack; 633. Mounting plate; 634. Slide; 635. Slide plate; 636. Slide cavity; 637. Insert rod; 638. Spring; 639. Ramp;

[0049] 64. First upper clasp tooth; 65. Second upper clasp tooth;

[0050] 66. Connecting plate; 661. Chamber;

[0051] 67. Rotating rod;

[0052] 7. Lower card holder; 71. Lower card holder groove; 72. Inclined plate; 73. Shaft. Detailed Implementation

[0053] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0054] This invention provides a technical solution:

[0055] See Figures 1-13 As shown, a semiconductor wafer cleaning machine includes,

[0056] The machine body 1 has a cleaning basket 3 inside for placing the wafers 4 to be cleaned. Two sets of card holders 5 are symmetrically arranged on the inner wall of the cleaning basket 3. The card holders 5 include at least the following components:

[0057] The support shaft 52 is rotatably disposed inside the cleaning basket 3. The axis of the support shaft 52 is perpendicular to the front and rear end faces of the cleaning basket 3. It is used to provide a support position for placing the wafer 4 to be cleaned. The support position is located below the center of the wafer 4 to be cleaned.

[0058] Card holder 51 is disposed on support shaft 52. Card holder 51 protrudes outward from the outer peripheral wall of support shaft 52 to form upper card holder 6 and lower card holder 7. As the liquid level in the cleaning basket 3 changes, support shaft 52 rotates, and the lower card holder 7 is used to limit the wafer 4, which is then used to limit the wafer 4 to the upper card holder 6.

[0059] First, the robotic arm on the machine body 1 lifts a row of wafers 4 through the bracket and transports them to the top of the cleaning tank 2. The cleaning basket 3 is fixed in the cleaning tank 2. Then the robotic arm moves down and puts the wafers 4 into the cleaning basket 3. The bracket is located on both sides of the wafers 4. The card holder 5 is fixed in the cleaning basket 3. When the wafers 4 touch the card holder 5, the bracket first opens to both sides and moves away from the wafers 4. Then it is lifted by the robotic arm and leaves the area above the cleaning tank 2.

[0060] The two ends of the support shaft 52 are rotatably connected to the inner walls of both sides of the washing basket 3, please see. Figure 3 or Figure 4 Two support shafts 52 are located on the left and right sides of the wafer 4 to support the wafer 4. The card holder 51 can be a fixed support rod and fixed on the support shaft 52. By rotating the support shaft 52 alternately in the clockwise or counterclockwise direction, the lower card holder 7 and the upper card holder 6 can alternately approach the wafer 4.

[0061] Before cleaning, in the initial state, the bottom end of the card holder 51 is close to the direction of the wafer 4, while the top end of the card holder 51 is tilted away from the wafer 4, so that the lower card holder 7 is in contact with the lower surface of the outer peripheral wall of the wafer 4.

[0062] At this time, the upper tray 6 is away from the wafer 4, which makes it easier for the bracket on the robotic arm to place the wafer 4 between the two trays 5, ensuring that the bracket does not touch the upper tray 6. When the cleaning operation begins, the nozzle above the cleaning tank 2 starts to inject water into the cleaning tank 2, and the water level in the cleaning tank 2 continues to rise. When the water overflows the specific position on the cleaning basket 3, the support shaft 52 is rotated so that the top of the tray 51 moves towards the wafer 4. At the same time, the top of the tray 51 will drive the upper tray 6 to contact the outer peripheral wall of the wafer 4.

[0063] After the upper bracket 6 contacts the wafer 4, it provides new support for the wafer 4. The upper bracket 6 is located close to the most outwardly protruding areas on both sides of the wafer 4, making the anti-tipping lever arm longer and the wafer 4 more stable.

[0064] In the initial state, the wafer 4 is mainly supported by the lower bracket 7. Then, the cleaning fluid falls from above the wafer 4 and is poured onto the wafer 4. During this process, the water will wash the area of ​​the wafer 4 that is in contact with the upper bracket 6. Then, when the water level reaches a specific position, the upper brackets 6 on both sides support the wafer 4, and the lower bracket 7 leaves the wafer 4 to expose the area of ​​the wafer 4 in contact with the lower bracket 7, so that this area can be cleaned.

[0065] After the cleaning fluid completely covers the wafer 4, the sonic cleaning is started. After the cleaning is finished, the cleaning fluid is discharged from the bottom of the cleaning tank 2. When the cleaning fluid is discharged, when its water level is lower than a certain position, the support shaft 52 is rotated to make the lower bracket 7 support the wafer 4 again, and then the upper bracket 6 moves away from the wafer 4, waiting for the nozzle to add water again.

[0066] The support shaft 52 can be rotated manually or by using a motor to drive it; there is no limitation on the method of driving the support shaft 52.

[0067] See Figures 3-5 The driving component is located on the end face of the cleaning basket 3, and its driving shaft is connected to the support shaft 52 to drive the support shaft 52 to rotate.

[0068] A liquid level sensor is installed on the inner wall of the cleaning basket 3. The liquid level sensor is installed at a height that is at least higher than the support shaft 52. The liquid level sensor is electrically connected to the drive component and is used to activate the drive component when the liquid level exceeds the support shaft 52.

[0069] The drive unit can be a motor, which is mounted on the machine body 1 and not placed in the cleaning tank 2. The drive end of the motor is connected to the drive shaft, and then the drive shaft is fixedly connected to one end of the support shaft 52. The drive shaft extends through the cleaning tank 2 to the motor inside the machine body 1 and is fixedly connected to the drive end of the motor. The intersection of the drive shaft and the cleaning tank 2 is sealed and waterproofed to prevent the cleaning liquid in the cleaning tank 2 from leaking.

[0070] The liquid level sensor is fixedly installed on the inner wall of the cleaning basket 3. When the liquid level of the cleaning liquid in the cleaning tank 2 exceeds the support shaft 52, the liquid level sensor sends an electrical signal to the motor. Then the motor drives the support shaft 52 to rotate until the upper bracket 6 touches the wafer 4 and stops. When the liquid level is lower than the support shaft 52, the liquid level sensor sends an electrical signal to the motor again. The motor drives the support shaft 52 to rotate in the opposite direction, so that the lower bracket 7 touches the wafer 4.

[0071] See Figures 6-9 The lower card holder 7 includes lower card holder grooves 71 arranged at intervals along the axial direction of the support shaft 52;

[0072] The lower card slot 71 is provided with an inclined plate 72 on the corresponding surface of the wafer 4. The inclined end of the inclined plate 72 abuts against the inner bottom wall of the lower card slot 71. The two adjacent inclined plates 72 have the same inclined direction. After the inclined plate 72 abuts against the wafer 4, the wafer 4 tilts towards the initial inclined direction of the inclined plate 72, so that the two adjacent wafers 4 tilt towards each other or away from each other. The wafers 4 tilted towards each other form a narrow slit, and the wafers 4 tilted away from each other form a wide slit.

[0073] The upper card holder 6 includes upper card holder grooves 61 arranged at intervals along the axial direction of the support shaft 52. A rotating member 62 is provided in the upper card holder groove 61, and a trigger member 63 is provided on the teeth. After the wafer 4 contacts the trigger member 63, the rotating member 62 is triggered to rotate, causing the wafers 4 on both sides of the wide slot to swing relative to each other.

[0074] Because the width of the card slot is greater than the thickness of wafer 4, wafer 4 will randomly tilt in one direction after being placed in the card slot. The tilted end face of wafer 4 will contact the side wall of the card slot, which will cause more of the wafer 4 to be blocked, affecting the cleaning effect.

[0075] The lower card tray 7 also includes a support plate, and a lower card tray slot 71 is formed on the support plate. The bottom end of the card tray 51 is fixedly connected to the back of the support plate. The lower card tray slot 71 corresponds to the direction of the wafer 4. When the robotic arm lowers the wafer 4, the wafer 4 will first enter the lower card tray slot 71. Please pay attention to this. Figure 7 and Figure 8 Then, the outer ring wall of wafer 4 contacts the inclined plate 72, and the width of the lower card slot 71 is greater than the thickness of wafer 4, further preventing wafer 4 from rubbing against it when it enters the lower card slot 71.

[0076] The inclined plate 72 has a fulcrum at the middle of the side corresponding to the lower card slot 71. Through the fulcrum, the inclined plate 72 can swing on the inner bottom wall of the lower card slot 71. Please see... Figure 8 The weight of one end of two adjacent tilting plates 72 is greater than that of the other end, so they tilt in the same direction. After the outer ring wall of the wafer 4 comes into contact with the tilting plate 72, the wafer 4 will tilt in the same direction as the tilting direction of the tilting plate 72.

[0077] The effect is that every two adjacent wafers 4 are tilted in opposite directions, and the two sets of relatively tilted wafers 4 will be tilted in opposite directions. The gap between two relatively tilted wafers 4 is relatively narrow, and the gap between two wafers 4 tilted in opposite directions is relatively wide. Then a row of wafers 4 will form a situation where narrow gaps and wide gaps are arranged alternately.

[0078] look Figure 6 Once the liquid level exceeds the set height of the liquid level sensor, the support shaft 52 rotates, causing the upper tray 6 to approach the wafer 4. The upper tray groove 61 gradually approaches the wafer 4 until the rotating member 62 touches the wafer 4, and then the trigger member 63 touches the wafer 4. As it continues to approach the wafer 4, the wafer 4 squeezes and triggers the trigger member 63. Subsequently, the trigger member 63 drives the rotating member 62 to rotate. The rotating member 62 rotates and swings two adjacent relatively tilted wafers 4 in opposite directions. The narrow gaps between multiple wafers 4 gradually widen, while the wide gaps gradually narrow, causing the wafers 4 to return to the upright position.

[0079] See Figures 6-10 The upper cassette 6 also includes,

[0080] The first upper card holder teeth 64 are arranged at intervals along the axial direction of the support shaft 52 for insertion into the wide slot. The first upper card holder grooves 611 corresponding to the narrow slots are formed between each of the first upper card holder teeth 64. The rotating member 62 is rotatably connected in the first upper card holder grooves 611.

[0081] The second upper card holder teeth 65 are arranged at intervals along the axial direction of the support shaft 52, and the teeth form a second upper card holder groove 612 corresponding to the wafer 4. The trigger 63 is installed in the second upper card holder groove 612, and the trigger end of the trigger 63 protrudes from the surface of the second upper card holder groove 612.

[0082] Please see Figure 9 The first upper card holder tooth 64 is located above the second upper card holder tooth 65. When the upper card holder part 6 is close to the wafer 4, the first upper card holder tooth 64 will first insert into the gap between multiple wafers 4. The first upper card holder tooth 64 corresponds to the wide gap between multiple wafers 4. After approaching the wafer 4, the first upper card holder tooth 64 directly inserts into the wide gap, so that the two wafers 4 that are close to each other in opposite directions abut against the rotating part 62 respectively. This makes it convenient for the rotating part 62 to rotate and directly push the wafer 4 towards the direction of the first upper card holder tooth 64, so that the wafer 4 abuts against the first upper card holder tooth 64.

[0083] After the wafer 4 contacts the rotating member 62, as the upper card holder 6 gradually approaches, the wafer 4 enters the second upper card holder groove 612 and abuts against the trigger member 63. As the trigger member 63 is continuously squeezed, the rotating member 62 rotates synchronously, pushing the wafer 4 back to the center.

[0084] See Figures 6-13 A connecting plate 66 is fixedly connected between the first upper card holder tooth 64 and the second upper card holder tooth 65, and a cavity 661 is opened in the connecting plate 66.

[0085] The rotating component 62 includes two relatively inclined arc-shaped rods 621. A support rod 622 is fixedly connected to the outer wall of the arc-shaped rods 621. The end of the support rod 622 away from the arc-shaped rods 621 extends into the chamber 661.

[0086] The trigger 63 includes a gear 631 fixedly installed on the outer wall of the support rod 622. The gear 631 is located inside the chamber 661. The gear 631 is meshed with a rack 632. The bottom end of the rack 632 is fixedly connected to a mounting plate 633. Both the rack 632 and the mounting plate 633 are slidably connected to the inner wall of the chamber 661. The mounting plate 633 has a through groove 634, which is close to the bottom end of the mounting plate 633.

[0087] The trigger end includes a slide plate 635. A sliding cavity 636 is formed in the second upper card holder tooth 65. The slide plate 635 is slidably connected in the sliding cavity 636. One end of the slide plate 635 extending into the sliding cavity 636 is fixedly connected to a rod 637 and a spring 638. The end of the spring 638 away from the slide plate 635 is fixedly connected to the inner wall of the sliding cavity 636. The end of the rod 637 away from the slide plate 635 is provided with a ramp 639. The ramp 639 extends into the sliding groove 634 and is slidably connected to the sliding groove 634.

[0088] exist Figure 9 and Figure 10 As can be seen, the two arc-shaped rods 621 in each first upper card slot 611 are initially inclined relative to each other, corresponding to two adjacent relatively inclined wafers 4. One end of the arc-shaped rod 621 is inserted into the narrow gap between multiple wafers 4. As the upper card slot 6 approaches the wafer 4, the wafer 4 enters the first upper card slot 611 and then abuts against the arc-shaped rod 621. The support rod 622 is rotatably connected to the first upper card slot tooth 64 and the connecting plate 66.

[0089] Please pay close attention. Figure 11 and Figure 12 Subsequently, wafer 4 enters the second upper card slot 612 and presses the slide plate 635. The slide plate 635 slides along the slide cavity 636 and presses the spring 638. When the slide plate 635 slides, it pushes the insertion rod 637 to move into the slide groove 634. The ramp 639 corresponds to the inner top wall of the slide groove 634. As the insertion rod 637 moves, the ramp 639 gradually goes deeper into the slide groove 634. Under the pressure of the ramp 639, the mounting plate 633 and the rack 632 begin to slide upward. While the rack 632 moves, it drives the gear 631 to rotate. The rotation of the gear 631 drives the support rod 622 to rotate, which in turn drives the arc rod 621 to rotate.

[0090] The inner wall of the chamber 661 is provided with a guide groove. One side of the rack 632 and the mounting plate 633 extends into the guide groove and slides in the guide groove. The guide groove limits the sliding direction of the rack 632 and the mounting plate 633, ensuring that the rack 632 can drive the gear 631 to rotate when it moves. After the upper bracket 6 moves away from the wafer 4, the spring 638 pushes the slide plate 635 back to its original position. Although the ramp 639 retracts to the left, the rightmost end remains in the slide groove 634. After the ramp 639 retracts, the mounting plate 633 and the rack 632 will also slide back to their original positions due to gravity.

[0091] After wafer 4 leaves the first upper card slot 611, the arc rod 621 has no resistance. Therefore, rack 632 and mounting plate 633 can be easily moved down and gear 631 can be rotated. Note that even if slide plate 635 moves back to its initial position, it will not completely disengage from slide cavity 636.

[0092] After wafer 4 is pushed back flat, the contact area between wafer 4 and upper tray 6 caused by the tilt is reduced;

[0093] Please see Figure 13 Since the inclined surfaces of the two opposing arc-shaped rods 621 are opposite, their rotation directions are also different. The two opposing racks 632 are positioned opposite each other, one on the right side of the gear 631 and the other on the left side of the other gear 631. Thus, when the left rack 632 moves upward, the left arc-shaped rod 621 will rotate counterclockwise. Conversely, when the right rack 632 moves upward, the right arc-shaped rod 621 will rotate clockwise.

[0094] See Figures 11-12 A rotating rod 67 is provided on the side of the connecting plate 66 away from the wafer 4. A vertical surface 55 is provided at the top of the card holder 51. The vertical surface 55 is fixedly connected to the outer wall of the rotating rod 67. The outer wall of the connecting plate 66 is rotatably connected to the outer wall of the rotating rod 67.

[0095] The upper card holder 6 is rotatably connected to the top of the card holder 51 via the rotating rod 67. Due to gravity, the right side wall of the connecting plate 66 will be close to the vertical plane 55. Since the first upper card holder tooth 64 is closer to the most protruding edge of the outer peripheral surface of the wafer 4, it is ensured that the rotating member 62 will contact the wafer 4 first. Then, as the upper card holder 6 continues to approach the wafer 4, the wafer 4 will contact the trigger member 63.

[0096] See Figure 8 A shaft 73 is rotatably connected between the lower card slot 71 and the inclined plate 72. The inner wall of the lower card slot 71 and the outer wall of the inclined plate 72 are rotatably connected to the outer wall of the shaft 73. The shaft 73 is located in the middle of the inner wall of the lower card slot 71.

[0097] The tilting plate 72 and the lower card slot 71 are oscillatingly connected via a shaft 73. After the wafer 4 is straightened, the tilting plate 72 will return to its original position along with the contact surface with the wafer 4. Moreover, when the wafer 4 just contacts the tilting plate 72 and tilts, Figure 8 From the perspective of the wafer 4 on the left, the left side of the wafer 4 will tilt to the right and the left side of the lower card slot 71 will move closer to the left side wall. After the wafer 4 is flattened, the left end of the wafer 4 will be closer to the left side inner wall of the lower card slot 71, so that the wafer 4 will not easily tilt back to the right.

[0098] See Figures 3-6 A rotating ring 53 is provided at the junction of the card holder 51 and the support shaft 52. The inner ring wall of the rotating ring 53 is fixedly connected to the outer wall of the support shaft 52. The card holder 51 is fixedly connected to the outer ring wall of the rotating ring 53. An embedded groove 54 is provided on the outer ring wall of the rotating ring 53. The inner end of the embedded groove 54 extends toward the inner ring wall of the rotating ring 53, so that when the support shaft 52 rotates, the two sides of the port of the embedded groove 54 alternately press against the wafer 4.

[0099] Please pay close attention. Figure 3 and Figure 4 The rotating ring 53 continuously contacts the outer peripheral wall of the wafer 4. When the support shaft 52 rotates and the card holder 51 swings, the rotating ring 53 rotates together with the support shaft 52. The card holder 51 is fixedly connected to the outer wall of the rotating ring 53. Figure 3 The middle position is when the upper card holder 6 touches the wafer 4, at which point the inset slot 54 is rotated downwards. Figure 4 The middle position is when the lower card holder 7 touches the wafer 4. At this time, the inset groove 54 rotates to face upwards, and the rotation of the rotating ring 53 changes the contact surface between itself and the wafer 4, so that every surface on the wafer 4 can be cleaned.

Claims

1. A semiconductor wafer cleaning machine, characterized in that, include, The machine body (1) has a cleaning basket (3) inside for placing the wafer (4) to be cleaned. Two sets of card holders (5) are symmetrically arranged on the inner wall of the cleaning basket (3). The card holders (5) include at least the following: A support shaft (52) is rotatably disposed inside the cleaning basket (3). The axis of the support shaft (52) is perpendicular to the front and rear end faces of the cleaning basket (3) and is used to provide a support position for placing the wafer (4) to be cleaned. The support position is located below the center of the wafer (4) to be cleaned. Card holder (51) is provided on support shaft (52). Card holder (51) protrudes outward from the outer peripheral wall of support shaft (52) to form upper card holder (6) and lower card holder (7). As the liquid level in the cleaning basket (3) changes, support shaft (52) rotates, and the lower card holder (7) limits the wafer (4) to the upper card holder (6) limits the wafer (4).

2. The semiconductor wafer cleaning machine as described in claim 1, characterized in that: The driving component is set on the end face of the cleaning basket (3), and its driving shaft is connected to the support shaft (52) for driving the support shaft (52) to rotate; A liquid level sensor is installed on the inner wall of the cleaning basket (3). The liquid level sensor is installed at a height that is at least higher than the support shaft (52). The liquid level sensor is electrically connected to the drive unit and is used to start the drive unit when the liquid level exceeds the support shaft (52).

3. A semiconductor wafer cleaning machine as described in claim 2, characterized in that: The lower card holder (7) includes lower card holder grooves (71) arranged axially at intervals along the support shaft (52); The lower card slot (71) and the corresponding surface of the wafer (4) are provided with an inclined plate (72). The inclined end of the inclined plate (72) abuts against the inner bottom wall of the lower card slot (71). The two adjacent inclined plates (72) have the same inclined direction. After the inclined plate (72) abuts against the wafer (4), the wafer (4) tilts towards the initial inclined direction of the inclined plate (72), so that the two adjacent wafers (4) tilt relative to each other or opposite to each other. The wafers (4) tilted relative to each other form a narrow slit, and the wafers (4) tilted opposite to each other form a wide slit. The upper card holder (6) includes upper card holder grooves (61) arranged axially along the support shaft (52). A rotating member (62) is provided in the upper card holder groove (61), and a trigger member (63) is provided on the teeth. After the wafer (4) abuts against the trigger member (63), the rotating member (62) is triggered to rotate, causing the wafers (4) on both sides of the wide slot to swing relative to each other.

4. A semiconductor wafer cleaning machine as described in claim 3, characterized in that: The upper card holder (6) also includes, The first upper card holder teeth (64) are arranged at intervals along the axial direction of the support shaft (52) for insertion into the wide slot. The first upper card holder groove (611) corresponding to the narrow slot is formed between each first upper card holder tooth (64). The rotating part (62) is rotatably connected in the first upper card holder groove (611). The second upper card holder teeth (65) are arranged at intervals along the axial direction of the support shaft (52), and a second upper card holder groove (612) corresponding to the wafer (4) is formed between each tooth. The trigger (63) is installed in the second upper card holder groove (612), and the trigger end of the trigger (63) protrudes from the surface of the second upper card holder groove (612).

5. A semiconductor wafer cleaning machine as described in claim 4, characterized in that: A connecting plate (66) is connected between the first upper card holder tooth (64) and the second upper card holder tooth (65), and a cavity (661) is opened in the connecting plate (66); The rotating component (62) includes two relatively inclined arc-shaped rods (621), and a support rod (622) is connected to the outer wall of the arc-shaped rods (621). The end of the support rod (622) away from the arc-shaped rods (621) extends into the chamber (661). The trigger (63) includes a gear (631) mounted on the outer wall of the support rod (622). The gear (631) is located in the chamber (661). The gear (631) is meshed with a rack (632). The bottom end of the rack (632) is connected to a mounting plate (633). Both the rack (632) and the mounting plate (633) are slidably connected to the inner wall of the chamber (661). The mounting plate (633) has a through groove (634) that is close to the bottom end of the mounting plate (633). The trigger end includes a slide plate (635), and a sliding cavity (636) is provided in the second upper card tooth (65). The slide plate (635) is slidably connected in the sliding cavity (636). One end of the slide plate (635) extending into the sliding cavity (636) is connected to a rod (637) and a spring (638). The end of the spring (638) away from the slide plate (635) is connected to the inner wall of the sliding cavity (636). The end of the rod (637) away from the slide plate (635) is provided with a ramp (639). The ramp (639) extends into the slide groove (634) and is slidably connected to the slide groove (634).

6. A semiconductor wafer cleaning machine as described in claim 5, characterized in that: The connecting plate (66) has a rotating rod (67) on the side away from the wafer (4), and the top of the card holder (51) has a vertical surface (55). The vertical surface (55) is connected to the outer wall of the rotating rod (67), and the outer wall of the connecting plate (66) is rotatably connected to the outer wall of the rotating rod (67).

7. A semiconductor wafer cleaning machine as described in claim 6, characterized in that: A shaft (73) is rotatably connected between the lower card slot (71) and the inclined plate (72). The inner wall of the lower card slot (71) and the outer wall of the inclined plate (72) are rotatably connected to the outer wall of the shaft (73). The shaft (73) is located in the middle of the inner wall of the lower card slot (71).

8. A semiconductor wafer cleaning machine as described in claim 7, characterized in that: A rotating ring (53) is provided at the junction of the card holder (51) and the support shaft (52). The inner ring wall of the rotating ring (53) is connected to the outer wall of the support shaft (52), and the card holder (51) is connected to the outer ring wall of the rotating ring (53). An embedded groove (54) is provided on the outer ring wall of the rotating ring (53). The inner end of the embedded groove (54) extends toward the inner ring wall of the rotating ring (53) so that when the support shaft (52) rotates, the two sides of the port of the embedded groove (54) alternately press against the wafer (4).

Images