Vacuum adsorption type ceramic finger and manufacturing method thereof

Abstract

The invention relates to the technical field of wafer transmission, in particular to a vacuum adsorption type ceramic finger and a manufacturing method thereof.The vacuum adsorption type ceramic finger comprises a ceramic base body, a vacuum air channel is formed in the ceramic base body, and an arc-shaped air opening for adsorbing a wafer body is formed in the front face of the ceramic base body; the radian of the arc-shaped air port is matched with the edge of the wafer body; the ceramic substrate is provided with a positioning rod group capable of relatively displacing, the height of the positioning rod group is higher than that of the arc-shaped air port, the edge of the wafer body is aligned with the arc-shaped air port through the positioning rod group before the wafer body is adsorbed, and the positioning rod group comprises a pair of positioning rods I and a pair of positioning rods II; inclined grooves are formed in the four sides of the ceramic base body in a penetrating mode, the first positioning rod and the second positioning rod penetrate through the inclined grooves and move along the inclined grooves, a sliding rod is arranged on the back face of the ceramic base body in a sliding fit mode, and broadening openings are formed in the two ends of the sliding rod.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer transmission, and in particular to a vacuum adsorption type ceramic finger and a manufacturing method thereof. BACKGROUND

[0002] The semiconductor equipment manipulator ceramic finger is a core component of the wafer automatic production line, and the most traditional and most widely used one is the vacuum adsorption type finger. The built-in vacuum air path design adsorbs the wafer through the adsorption point adsorption element. Under the action of vacuum adsorption, the wafer will not produce sliding defects during transmission.

[0003] However, when the adsorption force of the vacuum adsorption type ceramic finger is too strong, the wafer will be deformed due to the high hardness of the ceramic matrix, causing the service life to be shortened and other derived defects. In addition, this type of finger relies on the overall displacement accuracy of the manipulator to realize wafer positioning, and the finger body has no independent positioning structure. Once the displacement accuracy of the manipulator fluctuates, it is easy to cause the wafer and the adsorption air port to be misaligned, affecting the adsorption stability, and causing the wafer to have the risk of falling or being damaged.

[0004] Therefore, it is necessary to provide a vacuum adsorption type ceramic finger and a manufacturing method thereof, which can achieve the effect of automatic centering and positioning. SUMMARY

[0005] The present application aims to provide a vacuum adsorption type ceramic finger and a manufacturing method thereof to solve the problems in the background art.

[0006] In order to solve the above technical problems, the present application provides the following technical scheme: a vacuum adsorption type ceramic finger, comprising a ceramic matrix, The ceramic matrix is internally provided with a vacuum air duct, and the front surface of the ceramic matrix is provided with an arc-shaped air port for adsorbing the wafer body, wherein the arc of the arc-shaped air port is matched with the edge of the wafer body. The ceramic matrix is provided with a relatively displaceable positioning rod group, and the height of the positioning rod group is higher than that of the arc-shaped air port. The wafer body before being adsorbed aligns the edge thereof with the arc-shaped air port through the positioning rod group.

[0007] In one embodiment, the positioning rod group includes a pair of positioning rods one and a pair of positioning rods two, and the four sides of the ceramic matrix are provided with inclined grooves, and the positioning rods one and two are inserted into the inclined grooves and move along the inclined grooves.

[0008] In one embodiment, the back surface of the ceramic matrix is slidably fitted with a slide rod, the two ends of the slide rod are provided with widened openings, the widened openings are slidably fitted with slide pieces, and the lower end of the positioning rod one extends into the widened opening and is connected with the slide piece.

[0009] In one embodiment, the back of the ceramic base is rotatably connected with a rotating piece, the center of the rotating piece is provided with a rotating shaft, the rotating shaft penetrates the ceramic base and is rotatably connected with the ceramic base, the two sides of the rotating piece are provided with widened openings, and sliding pieces are slidably connected in the widened openings.

[0010] In one embodiment, the ceramic base is provided with a pair of long expansion holes, the upper end of the long expansion hole is slidably connected with a connecting block, the lower end of the connecting block is rotatably connected with a pair of vertical rods, the vertical rods penetrate the long expansion hole and extend into the widened opening of the other end of the rotating piece.

[0011] In one embodiment, one end of the ceramic base is fixedly connected with a connecting handle, the connecting handle is provided with a pair of parallel openings, the parallel openings are slidably connected with concave blocks, one end of the concave block is fixedly connected with a strip-shaped rod, one end of the strip-shaped rod is connected with the center of the sliding rod, the upper end of the concave block penetrates the parallel opening and is fixedly connected with a moving rod, one end of the moving rod is connected with the connecting block.

[0012] In one embodiment, the upper end of the arc-shaped air port is provided with a convex pad, and the convex pad is made of PEI material.

[0013] In one embodiment, the arc-shaped air port comprises a main air port and a pair of branch air ports, the vacuum air duct is provided as a cross-shaped air path and is arranged on the back of the ceramic base, three side ends of the cross-shaped air path are respectively provided with air holes, and the air holes are respectively and continuously provided with the main air port and the branch air ports.

[0014] In one embodiment, a mounting stepped groove is arranged in the cross-shaped air path, and a cross-shaped cover plate is arranged on the cross-shaped air path.

[0015] The application also provides a manufacturing method of the vacuum adsorption type ceramic finger, which is used for manufacturing the vacuum adsorption type ceramic finger and comprises the following steps: S1, first, alumina ceramic powder is selected, and the powder and polyvinyl alcohol binder are mixed in a mass ratio of 95:5 to form a uniform paste; S2, the mixture prepared in S1 is pressed into a ceramic base blank by using a dry pressing forming process, and the blank is placed into a sintering furnace to obtain a ceramic base roughcast; S3, the front and back surfaces and four side contours of the ceramic base roughcast are processed by using a ceramic processing equipment, and the front surface is polished by using a surface grinder to provide a reference for processing the arc-shaped air port; S4, adopt CNC engraving machine to process arc-shaped air port, then use ultrasonic polishing air port inner wall and remove burrs, then mill out cross air path and corresponding installation step groove, drill out air hole through arc-shaped air port, continue to process oblique groove and a pair of long hole, finally process assembly hole of connecting handle, and mill parallel port on connecting handle; S5, process and install related positioning components, debug each part, and ensure that positioning rod group smoothly displaces along oblique groove; S6, coat high-temperature-resistant sealant in installation step groove of cross air path, paste cross cover plate and compact; coat adhesive on upper end of arc-shaped air port, and install convex pad block; S7, connect vacuum pump to form negative pressure in air channel, and if there is no leakage after pressure maintaining, the sealing property is qualified, place standard wafer body on positioning rod group, detect alignment error of wafer edge and arc-shaped air port, detect repeated positioning precision of moving part, and if all are qualified, the manufacturing is completed.

[0016] Compared with the prior art, the beneficial effects achieved by the present application are as follows: in the present application, the arc-shaped air port and the edge of the wafer body correspond to each other, and only the edge position of the wafer body is contacted, compared with the traditional several circular air holes that adsorb the local position of the inner side of the wafer body, the local adsorption force is avoided to be concentrated, the wafer deformation in the adsorption process is further reduced, and the service life is avoided to be shortened and other derivative adverse conditions are avoided to occur; and through the positioning rod group, the positioning of the wafer body does not completely depend on the positioning precision of the mechanical hand itself displacement, the wafer body is centrally positioned before being adsorbed, and the edge position is further made to correspond to the arc-shaped air port, the influence of the mechanical hand displacement fluctuation on the wafer positioning precision is reduced, and the precision of the adsorbed edge position is improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] The technical scheme and other beneficial effects of the present application will be apparent through the following detailed description of the specific embodiments of the present application in combination with the accompanying drawings.

[0018] In the drawings: Figure 1 is a schematic diagram of the overall structure of the present application; Figure 2 is a schematic diagram of the ceramic base of the present application; Figure 3 is a schematic diagram of the back of the ceramic base of the present application; Figure 4 is a schematic diagram of the concave block of the present application; Figure 5 is a schematic diagram of the vacuum air channel of the present application; In the drawings: 1, ceramic base; 101, long hole; 102, connecting block; 103, vertical rod; 104, strip-shaped rod; 105, parallel port; 106, concave block; 107, moving rod piece; 2, positioning rod one; 201, sliding rod; 202, sliding sheet; 3, positioning rod two; 301, rotating sheet; 302, rotating shaft; 4, fixed clamping seat; 5, wafer body; 6, connecting handle; 7, main gas port; 701, branch gas port; 8, protruding pad; 9, cross-shaped air path; 901, cross-shaped cover plate; 902, air hole. DETAILED DESCRIPTION

[0019] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0020] Please refer to Figures 1-5 The present application provides a technical solution: a vacuum adsorption type ceramic finger, comprising a ceramic base 1, The ceramic base 1 is internally provided with a vacuum air duct, and the front surface of the ceramic base 1 is provided with an arc-shaped air port for adsorbing the wafer body 5, and the curvature of the arc-shaped air port is matched with the edge of the wafer body 5; The ceramic base 1 is provided with a relatively displaceable positioning rod group, and the height of the positioning rod group is higher than that of the arc-shaped air port. The wafer body 5 before being adsorbed is aligned with the arc-shaped air port at the edge thereof by the positioning rod group.

[0021] Further, when the wafer body 5 needs to be adsorbed, the ceramic base 1 is displaced to the upper side or the lower side of the wafer body 5 by the mechanical hand. Before the wafer body 5 is adsorbed by the arc-shaped air port, the positioning rod group is relatively displaced to contact the edge of the wafer body 5 and center the wafer body 5, so that the edge of the wafer body 5 is accurately aligned with the arc-shaped air port. Then the positioning rod group is reset away from the edge of the wafer body 5, and finally the edge of the wafer body 5 is adsorbed by the arc-shaped air port on the surface of the ceramic base 1, and the transmission work can be performed; In the embodiment, the arc-shaped air port corresponds to the edge of the wafer body 5, and only the edge of the wafer body 5 is contacted during adsorption. Compared with the traditional adsorption of the inner side of the wafer body 5 by a plurality of circular air holes, the local adsorption force is avoided, the wafer deformation during adsorption is further reduced, and the service life is avoided to be shortened and other derivative bad conditions are avoided to occur. The wafer body 5 is centrally positioned before adsorption, the edge is correspondingly arranged with the arc-shaped air port, the influence of the wafer positioning accuracy caused by the displacement fluctuation of the mechanical hand is reduced, and the adsorption accuracy of the edge is improved.

[0022] On the basis of the above embodiment, the positioning rod group includes a pair of positioning rods one 2 and a pair of positioning rods two 3, and the four sides of the ceramic base 1 are provided with inclined grooves, and the positioning rods one 2 and the positioning rods two 3 are penetrated in the inclined grooves and move along the inclined grooves.

[0023] Further, the inclined grooves of the pair of positioning rods one 2 and the pair of positioning rods two 3 are symmetrically distributed and inclined to the center of the wafer body 5, so that the positioning rods one 2 and the positioning rods two 3 are displaced from the radial direction inclined to the wafer body 5, thereby centrally positioning the wafer body 5. When the wafer body 5 has a large initial state deviation, the disc angle can be gradually adjusted, the impact on the edge is softer, the deviation correction adaptability is good, and the contact damage to the wafer body 5 is further reduced.

[0024] On the basis of the above embodiment, the back of the ceramic base 1 is slidably connected with a slide rod 201, the two ends of the slide rod 201 are provided with widened openings, the widened openings are slidably connected with slide pieces 202, and the lower end of the positioning rod one 2 extends into the widened opening and is connected with the slide piece 202.

[0025] Further, when a pair of positioning rods one 2 need to be driven to be synchronously inclined, a slide rod 201 is provided, the two ends of the slide rod 201 are provided with widened openings, when the slide rod 201 is horizontally displaced, the slide pieces 202 are limited to horizontally displace by the widened openings, and the positioning rods one 2 are limited by the inclined grooves, so that the pair of positioning rods one 2 are synchronously inclined. In the embodiment, a single slide rod 201 drives a pair of positioning rods one 2, and the slide pieces 202 are limited by the widened openings, so that the displacement of the positioning rods one 2 is accurately controlled, the force on both sides of the wafer body 5 is symmetrical, and the central positioning accuracy is improved. Preferably, the slide piece 202 is rectangular and arc-shaped at both ends, and is matched with the shape of the widened opening, and the lower end of the positioning rod one 2 is connected with the slide piece 202 by interference fit, so as to avoid relative looseness of the two. Preferably, the surface of the sliding piece 202 can be mirror polished to reduce the sliding friction with the inner wall of the widened opening and ensure smooth sliding of the sliding piece 202.

[0026] On the basis of the above embodiment, the back of the ceramic base 1 is rotationally connected with a rotating piece 301, the center of the rotating piece 301 is provided with a rotating shaft 302, the rotating shaft 302 penetrates the ceramic base 1 and is rotationally connected therewith, and the two sides of the rotating piece 301 are provided with widened openings penetratingly formed therein, and the widened openings are slidably connected with sliding pieces 202, and the lower end of the positioning rod two 3 extends into the widened opening and is connected with the sliding piece 202.

[0027] Further, when a pair of positioning rod two 3 needs to be driven to be synchronously displaced obliquely, the rotating piece 301 is provided, when the rotating piece 301 rotates (the rotating direction is shown as Figure 3 ), the sliding piece 202 slides through the widened opening, and under the limiting action of the oblique groove, the sliding piece 202 drives the positioning rod two 3 to be displaced while sliding, so as to center and align the wafer body 5; In the embodiment, the rotating movement of the rotating piece 301 is converted into the oblique displacement of the positioning rod two 3 through the sliding piece 202, and the displacement of the widened opening and the oblique groove two is limited, so as to reduce the displacement error of the positioning rod two 3 and improve the centering and positioning precision of the wafer body 5; Preferably, the rotating piece 301 can be made of titanium alloy TC4 material, which is light in weight and high in strength, and the surface is treated with nitriding to further improve the rotating wear resistance.

[0028] On the basis of the above embodiment, the ceramic base 1 is provided with a pair of long expansion holes 101 penetratingly formed therein, the upper end of the long expansion hole 101 is slidably connected with a connecting block 102, the lower end of the connecting block 102 is rotationally connected with a pair of vertical rods 103, and the vertical rods 103 penetrate the long expansion hole 101 and extend into the widened opening at the other end of the rotating piece 301.

[0029] Further, by providing the connecting block 102 and the pair of vertical rods 103, the displacement of the two positioning rod two 3 is synchronously controlled, and the sliding piece 202 is connected at one end of the vertical rod 103, when the connecting block 102 is horizontally displaced (the moving direction is shown as Figure 3 ), a pair of rotating pieces 301 are rotated respectively with the rotating shaft 302 as the center by the pair of vertical rods 103 and the sliding piece 202, so as to drive the positioning rod two 3 at the other end to be displaced, that is, the synchronous displacement of the pair of positioning rod two 3 can be realized. In the embodiment, the single connecting block 102 is horizontally displaced for transmission, so as to drive the positioning rod two 3 to be synchronously displaced obliquely, reduce the synchronous displacement error, and realize high-precision positioning of the semiconductor wafer body 5.

[0030] Based on the above embodiment, a connecting handle 6 is fixedly connected to one end of the ceramic substrate 1. The connecting handle 6 has a pair of parallel openings 105. A concave block 106 is slidably fitted inside the parallel openings 105. A strip rod 104 is fixedly connected to one end of the concave block 106. One end of the strip rod 104 is connected to the center of the slide rod 201. The upper end of the concave block 106 passes through the parallel openings 105 and is fixedly connected to a movable rod 107. One end of the movable rod 107 is connected to the connecting block 102.

[0031] Furthermore, by setting a concave block 106, a strip rod 104, and a movable rod 107, the connecting block 102 and the slide rod 201 are connected. When the movable rod 107 moves, it simultaneously drives the connecting block 102 and the slide rod 201 to move, thereby simultaneously controlling the positioning rod 1 2 and the positioning rod 2 3. In this embodiment, only the displacement of the driving moving rod 107 needs to be controlled to achieve synchronous control of the two sets of positioning rods, reducing the structural volume and making it suitable for the compact spatial structure requirements of ceramic fingers. Preferably, a fixing seat 4 is provided at one end of the connecting handle 6. The connecting handle 6 and the ceramic substrate 1 are installed on the robot arm through the fixing seat 4, and the moving rod 107 passes through the fixing seat 4 and extends into the robot arm. Preferably, the moving rod 107 is driven by a cylinder mechanism in the robotic arm assembly, and no particles fall off during use, which meets semiconductor manufacturing standards.

[0032] Based on the above embodiment, a raised pad 8 is provided at the upper end of the arc-shaped air vent, and the raised pad 8 is made of PEI material.

[0033] Furthermore, the arc-shaped air vent that contacts the wafer body 5 is changed from the ceramic substrate 1 to a raised pad 8 made of PEI material. This avoids direct contact between the ceramic and the wafer, preventing scratches, while improving durability and extending product life. In addition, the PEI material has a certain deformation capacity, which can buffer the deformation of the wafer during adsorption.

[0034] Based on the above embodiments, the arc-shaped air inlet includes a main air inlet 7 and a pair of branch air inlets 701. The vacuum channel is configured as a cross air passage 9 and is opened on the back side of the ceramic substrate 1. Air holes 902 are opened at the three ends of the cross air passage 9, and the air holes 902 are respectively connected to the main air inlet 7 and the branch air inlets 701.

[0035] Traditional air inlet solutions concentrate the adsorption force at a single point, which can easily lead to wafer deformation. In this embodiment, the adsorption point is expanded by the main air inlet 7 and the symmetrical branch air inlets 701, and the cross air path 9 evenly distributes the airflow, reducing the fluctuation of adsorption force on the contact surface of the wafer body 5. Furthermore, the adsorption force application points are triangularly distributed, effectively dispersing the force on the wafer body 5. Preferably, the opening edges of the main air port 7 and the branch air port 701 are flush with the side surface of the protruding pad 8 to avoid the protruding pad 8 from blocking the air port and affecting the adsorption efficiency. Preferably, the cross-shaped air path 9 is integrally milled with the ceramic base 1 to reduce the roughness of the inner wall of the air path, reduce the air flow resistance, and avoid dust accumulation caused by the roughness of the inner wall.

[0036] On the basis of the above embodiment, a mounting stepped groove is arranged in the cross-shaped air path 9, and a cross-shaped cover plate 901 is arranged on the cross-shaped air path 9.

[0037] Further, the cross-shaped cover plate 901 is sealed in the mounting stepped groove by using glue to seal the entire cross-shaped air path 9, ensure the cross-shaped cover plate 901 closely fits the stepped surface, and improve the sealing performance.

[0038] The embodiment also provides a manufacturing method of the vacuum adsorption type ceramic finger, which is used for manufacturing the vacuum adsorption type ceramic finger and includes the following steps. Firstly, the ceramic raw material preparation is performed: firstly, the alumina ceramic powder is selected, the powder and the polyvinyl alcohol binder are mixed in a mass ratio of 95:5, and the mixture is stirred into a uniform paste; Secondly, the ceramic base is formed and sintered: the mixture prepared above is pressed into a ceramic base 1 blank by using a dry pressing forming process, the size of the blank is 5%-8% larger than the design size, so as to reserve a machining allowance, and the blank is placed into a sintering furnace and naturally cooled after heat preservation, so as to obtain a ceramic base 1 blank with a density of ≥95%; Thirdly, the ceramic base is roughly machined: the front and back surfaces and four side contours of the ceramic base 1 blank are machined by using a ceramic machining device, and the front surface is polished by using a surface grinder, so as to ensure that the surface roughness Ra≤0.8 μm and provide a reference for the arc-shaped air port machining; Fourthly, the hole and groove machining is performed: the arc-shaped air port is machined by using a CNC engraving machine, the inner wall of the air port is polished by using an ultrasonic wave, and burrs are removed; then, the cross-shaped air path 9 and the corresponding mounting stepped groove are milled, the air hole 902 is drilled through the arc-shaped air port, the oblique groove and a pair of long holes 101 are continuously machined through, and the assembly hole of the connecting handle 6 is machined, and the parallel port 105 is milled on the connecting handle 6; Fifthly, the related positioning components are machined and installed, and the components are debugged to ensure that the positioning rod group smoothly moves along the oblique groove; Sixthly, the glue sealing is performed: the high-temperature resistant sealing glue is applied to the mounting stepped groove of the cross-shaped air path 9, the cross-shaped cover plate 901 is attached, and is compacted; the adhesive is applied to the upper end of the arc-shaped air port, and the protruding pad 8 is installed; Seventhly, the detection is performed: the air path is connected to a vacuum pump to form a negative pressure, and the sealing performance is qualified if there is no leakage after pressure maintaining; the standard wafer body 5 is placed on the positioning rod group to detect the alignment error of the wafer edge and the arc-shaped air port; the repeated positioning accuracy of the moving components is detected, and the manufacturing is completed if all the components are qualified.

[0039] The method selects alumina ceramic, and is matched with dry pressing and high-temperature sintering process, so as to ensure wear resistance and structural strength of the ceramic finger, is suitable for precise work of wafer adsorption, and through synchronous movement design of the positioning rod group, ensures accurate positioning of the wafer, avoids adsorption deviation, and the cross gas path 9 is sealed with the cross cover plate 901, so as to improve stability of gas path transmission.

[0040] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixed connection, can be detachable connection, or integral connection; can be mechanical connection, or electrical connection or can communicate with each other; can be directly connected, can be internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] The above provides a kind of vacuum adsorption type ceramic finger and its manufacturing method provided by the embodiment of the present application, specific examples are applied in this paper, the principle and implementation mode of the present application are described, the above embodiment is only used to help understand the technical scheme of the present application and its core idea;Ordinary skilled in the art should understand that: it can still modify the technical scheme recorded in the foregoing embodiments, or equivalent replacement is carried out to part of technical features;And these modifications or replacements do not make the essence of corresponding technical scheme deviate from the scope of the technical scheme of the embodiments of the present application.

Claims

1. A vacuum adsorption type ceramic finger comprising a ceramic base (1), characterized in that: a vacuum air duct is formed in the ceramic base (1), and an arc-shaped air port of an adsorption wafer body (5) is formed on the front surface of the ceramic base (1), the curvature of the arc-shaped air port being matched with the edge of the wafer body (5); a positionable positioning rod set is arranged on the ceramic base (1), the height of the positioning rod set being higher than that of the arc-shaped air port, and the wafer body (5) is aligned with the arc-shaped air port at the edge thereof by the positioning rod set before being adsorbed. The positioning rod set comprises a pair of positioning rod one (2) and a pair of positioning rod two (3), and oblique grooves are formed in the four sides of the ceramic base (1), the positioning rod one (2) and the positioning rod two (3) penetrating the oblique grooves and moving along the oblique grooves.

2. The vacuum suction type ceramic finger according to claim 1, wherein: A slide rod (201) is slidably connected to the back surface of the ceramic base (1), widened openings are formed at the two ends of the slide rod (201), slide pieces (202) are slidably connected in the widened openings, and the lower end of the positioning rod one (2) extends into the widened openings and is connected with the slide pieces (202).

3. A vacuum suction type ceramic finger according to claim 2, wherein: A rotating piece (301) is rotatably connected to the back surface of the ceramic base (1), a rotating shaft (302) is arranged at the center of the rotating piece (301), the rotating shaft (302) penetrating the ceramic base (1) and being rotatably connected thereto, widened openings are formed at the two sides of the rotating piece (301), slide pieces (202) are slidably connected in the widened openings, and the lower end of the positioning rod two (3) extends into the widened openings and is connected with the slide pieces (202).

4. A vacuum suction type ceramic finger according to claim 3, wherein: A pair of long expansion holes (101) are formed in the ceramic base (1), a connecting block (102) is slidably connected to the upper end of the long expansion holes (101), a pair of vertical rods (103) are rotatably connected to the lower end of the connecting block (102), the vertical rods (103) penetrating the long expansion holes (101) and extending into the widened openings at the other end of the rotating piece (301).

5. A vacuum suction type ceramic finger according to claim 4, wherein: One end of the ceramic base (1) is fixedly connected with a connecting handle (6), a pair of parallel openings (105) are formed in the connecting handle (6), concave blocks (106) are slidably connected in the parallel openings (105), one end of the concave blocks (106) is fixedly connected with a strip-shaped rod (104), one end of the strip-shaped rod (104) is connected with the center of the slide rod (201), the upper end of the concave blocks (106) passes through the parallel openings (105) and is fixedly connected with a moving rod (107), one end of the moving rod (107) is connected with the connecting block (102).

6. A vacuum suction type ceramic finger according to claim 5, wherein: A protruding pad (8) is arranged at the upper end of the arc-shaped air port, and the protruding pad (8) is made of PEI material.

7. The vacuum suction type ceramic finger according to claim 1, wherein: The arc-shaped air port comprises a main air port (7) and a pair of branch air ports (701), the vacuum air duct is a cross-shaped air path (9) formed in the back surface of the ceramic base (1), and three side ends of the cross-shaped air path (9) are respectively provided with air holes (902), the air holes (902) are respectively and continuously provided with the main air port (7) and the branch air ports (701).

8. The vacuum suction type ceramic finger according to claim 1 or 7, wherein: ​ 9. A vacuum suction type ceramic finger according to claim 8, wherein: The cross-shaped air passage (9) is provided with a mounting stepped groove, and the cross-shaped air passage (9) is provided with a cross-shaped cover plate (901).

10. A method for manufacturing a vacuum-suction-type ceramic finger for manufacturing the vacuum-suction-type ceramic finger according to any one of claims 1 to 9, characterized by, The method comprises the following steps: S1, first select alumina ceramic powder, mix the powder with polyvinyl alcohol binder in a mass ratio of 95 to 5, and stir until a uniform paste is obtained; S2, the mixture prepared in S1 is pressed into a ceramic matrix (1) blank by dry pressing process, and the blank is put into a sintering furnace to obtain a ceramic matrix (1) blank; S3, the front and back surfaces and four sides of the ceramic matrix (1) blank are processed by ceramic processing equipment, and the front surface is polished by a surface grinder to provide a reference for arc-shaped air port processing; S4, the CNC engraving machine is used to process the arc-shaped air port, and the ultrasonic polishing machine is used to polish the inner wall of the air port and remove burrs, then the cross-shaped air passage (9) and the corresponding mounting stepped groove are milled, the gas hole (902) is drilled through the arc-shaped air port, the inclined groove and a pair of long holes (101) are continuously processed, finally the assembly hole of the connecting handle (6) is processed, and the parallel port (105) is milled on the connecting handle (6); S5, process and install related positioning components, debug each part, and ensure smooth displacement of the positioning rod group along the inclined groove; S6, apply high-temperature resistant sealant to the mounting stepped groove of the cross-shaped air passage (9), attach the cross-shaped cover plate (901) and compact it, apply adhesive to the upper end of the arc-shaped air port, and install the convex pad block (8); S7, connect the vacuum pump to form negative pressure in the air passage, and after pressure preservation, if there is no leakage, the sealing performance is qualified, the standard wafer body (5) is placed in the positioning rod group, the alignment error of the wafer edge and the arc-shaped air port is detected, the repeated positioning accuracy of the moving parts is detected, and if all are qualified, the manufacturing is completed.

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