Packaging device and electronic apparatus

Abstract

The embodiment of the invention provides a packaging device and an electronic device. The package device includes: a first substrate having a first surface; a semiconductor chip coupled to the first surface of the first substrate; the signal switching device is coupled to the first surface of the first substrate; at least a part of signals of the semiconductor chip are coupled to an external circuit through the signal switching device. A part of signals of the semiconductor chip in the packaging device are led out to the external circuit through the signal switching device, so that the number of connecting pieces on the substrate is reduced, and the product size of the packaging device is reduced.

Description

[0001] This application is a divisional application of the Chinese Invention Patent Application No. 202111205884.0, filed on October 15, 2021, entitled “Packaging Device and Electronic Device”. TECHNICAL FIELD

[0002] The present disclosure relates to a semiconductor device, in particular, to a packaging device and an electronic device. BACKGROUND

[0003] With the rapid development of modern electronic design field, in the future high-frequency high-speed high-density application scenarios, the trend of miniaturization of packaging devices will make the traditional packaging process (for example, FCBGA, flip chip ball grid array) face a series of problems. For example, as the number of signals increases, the spacing between pins cannot be infinitely reduced (minimum spacing limit), so the size of the packaging device can only be increased, but this is contrary to the requirement of device miniaturization. For another example, as the number of signals increases, if there are too many vias between the surface layer and the bottom layer of the packaging device, the integrity of the power layer will be damaged, resulting in power supply problems, and if the vias between the surface layer and the bottom layer of the packaging device are too long, and the size of the connecting member (such as BGA solder ball) for electrical connection with the external circuit on the bottom layer is too large, impedance discontinuity will be caused. SUMMARY

[0004] Therefore, the purpose of the present disclosure is to provide a packaging device and an electronic device to solve the above problems.

[0005] According to a first aspect of the embodiments of the present disclosure, a packaging device is provided, comprising: a first substrate having a first surface; a semiconductor chip coupled to the first surface of the first substrate; a signal transfer device coupled to the first surface of the first substrate; wherein at least part of the signals of the semiconductor chip are coupled to the external circuit via the signal transfer device.

[0006] Optionally, further comprising: a plurality of connecting members comprising a first end and a second end, the first end being coupled to a second surface of the first substrate opposite to the first surface, and the second end being used for coupling with the external circuit, wherein the remaining signals other than the at least part of the signals are coupled to the external circuit via the plurality of connecting members.

[0007] Optionally, the signal transfer device is arranged at an edge position of the first surface of the first substrate.

[0008] Optionally, the first surface of the first substrate is provided with a groove for accommodating the signal adapter.

[0009] Optionally, the signal adapter comprises: an adapter plate fixed on the first surface of the first substrate; a connector welded to the adapter plate, a flexible circuit board comprising a fixed end and a free end, the fixed end being fixedly connected with the connector, and the free end being used for connecting with the external circuit.

[0010] Optionally, the connector comprises a first connector and a second connector welded on opposite first surface and second surface of the adapter plate respectively, the flexible circuit board comprises a first flexible circuit board and a second flexible circuit board, the fixed end of the first flexible circuit board is fixedly connected with the first connector, the free end of the first flexible circuit board is used for connecting with the external circuit, the fixed end of the second flexible circuit board is fixedly connected with the second connector, and the free end of the second flexible circuit board is used for connecting with the external circuit.

[0011] Optionally, the position where the fixed end of the first flexible circuit board is fixedly connected with the first connector corresponds to the position where the fixed end of the second flexible circuit board is fixedly connected with the second connector, and the contact areas of the fixed connections are the same.

[0012] Optionally, the first substrate is a package substrate.

[0013] According to a second aspect of the embodiments of the present disclosure, a package device is provided, comprising: a plurality of substrates, each substrate having a first surface; a plurality of semiconductor chips, each semiconductor chip being coupled to the first surface of a substrate of the plurality of substrates; at least one signal adapter, each signal adapter being coupled to the first surface of a first substrate and a second substrate of the plurality of substrates, and being used for transmitting at least part of signals between two semiconductor chips, between a semiconductor chip coupled to the first substrate and a semiconductor chip coupled to the second substrate, the first substrate and the second substrate being any two substrates of the plurality of substrates.

[0014] Optionally, further comprising: a plurality of connector arrays corresponding to the plurality of substrates one by one, each connector array comprising a plurality of connectors, a first end of each connector in each connector array being coupled to a second surface opposite to the first surface of its corresponding substrate, and a second end of each connector being used for coupling with an external circuit, wherein remaining signals other than the at least part of signals are coupled to the external circuit via the connector arrays.

[0015] Optionally, the signal adapter comprises: Two physically separated adapter boards coupled to the first surface of the first substrate and the first surface of the second substrate respectively; Two physically separated connectors welded to the two adapter boards respectively; A flexible circuit board comprising two connectors coupled to the two connectors respectively. According to a third aspect of the embodiments of the present disclosure, an electronic device is provided, comprising: The packaging device described above; A printed circuit board serving as the external circuit.

[0016] According to a fourth aspect of the embodiments of the present disclosure, an electronic device is provided, comprising: The packaging device described above; A printed circuit board, The packaging device provided by the embodiments of the present disclosure can lead part of the electrical signals of the semiconductor chip to the external circuit through the signal adapter, and the remaining electrical signals are led to the external circuit through the connectors welded on the substrate. Therefore, the number of connectors of the substrate can be reduced. When the number of connectors of the packaging substrate is reduced, the size of the packaging device as a whole is correspondingly reduced. At the same time, the number and length of vias between the surface layer and the bottom layer of the packaging device are reduced, thereby helping to solve the power supply problem and the impedance discontinuity problem.

[0017] In the BGA packaging, the solder balls serve as the connectors, and the reduction of the number of solder balls can significantly reduce the size of the packaging device, which is more conducive to the light, thin and small trend of products. BRIEF DESCRIPTION OF DRAWINGS

[0018] The above and other objects, features and advantages of the present disclosure will become more apparent from the following description of embodiments of the present disclosure, taken in conjunction with the accompanying drawings, in which: Figure 1 is a structural diagram of a packaging device provided by an embodiment of the present disclosure; Figure 2 is a structural diagram of a packaging device provided by another embodiment of the present disclosure; Figure 3 is a structural diagram of a signal adapter provided by an embodiment of the present disclosure; Figure 4 is a plan view schematic diagram of the positional relationship between a plurality of signal adapters and a semiconductor chip; Figure 5 is a structural schematic diagram of an electronic device constructed based on the packaging device provided by an embodiment of the present disclosure; Figure 6 is a structural schematic diagram of an electronic device constructed based on the packaging device provided by another embodiment of the present disclosure; Figure 7 is a structural diagram of an electronic device provided by another embodiment of the present disclosure. DETAILED DESCRIPTION

[0019] The present disclosure is described below based on embodiments, but the present disclosure is not limited only to these embodiments. In the following detailed description of the present disclosure, some specific details are described in detail. The present disclosure can also be fully understood without the description of these details. In order to avoid confusion of the essence of the present disclosure, the well-known methods, processes, and flows are not described in detail. In addition, the drawings are not necessarily drawn to scale.

[0020] The following terms are used herein.

[0021] The term "solder ball" or "solder ball" used in the BGA packaging process refers to the pin located outside the package, which is usually spherical in shape, hence the name solder ball or solder ball. The connector proposed by the embodiments of the present disclosure is a more general electronic connection element, which includes but is not limited to a spherical shape, and can not only refer to the BGA packaging process, but also other packaging processes, so the term "connector" is defined according to its function. Other packaging processes, such as using IC sockets to mount chips to printed circuit boards, in this process, in order to avoid damage to the chip during soldering, the IC socket is first soldered to the printed circuit board, and then the chip can be inserted into the IC socket.

[0022] Figure 1 is a structural diagram of a packaged device provided by an embodiment of the present disclosure. As shown in the figure, the packaged device 100 includes a substrate 103 and a semiconductor chip 101 disposed on the substrate 103.

[0023] The substrate 103 serves as the core material of the chip package, which can protect, fix, and support the chip, enhance the heat dissipation performance of the chip, and ensure that the chip is not physically damaged. The substrate 103 is usually composed of multiple layers. According to the functions of each layer, the multiple layers can be a power layer, a signal layer, a ground layer, and an insulating layer. Moreover, each layer is generally composed of conductive material and / or insulating material, for example, the signal layer is constructed using conductive metal such as copper foil, and the ground layer is composed of insulating material. The electrical interconnection between different layers is achieved using vias. The via is a hole achieved by laser drilling and then electroplating copper to fill the hole or electroplating copper to form a bump.

[0024] The inside of the substrate 103 includes electrically connected signal leads and signal vias. The signal leads can be disposed on the signal layer and electrically connected to the external circuit through the signal vias. The external circuit can be an external PCB (Printed Circuit Board) or an external semiconductor chip (die) 101.

[0025] As shown in the figure, the upper surface of the substrate 103 is provided with connecting members 102 which are electrically connected with the semiconductor chip 101. The lower surface of the substrate 103 is provided with solder pads 105 and solder balls 104 which are electrically connected with the solder pads 105. The solder balls 104 are used to electrically connect with external circuits (such as printed circuit boards). It should be noted that the use of solder balls to connect with external circuits is based on the BGA packaging process. BGA packaging, i.e. ball grid array packaging, is a packaging process in which solder balls are made in an array on the bottom surface of a packaging substrate as terminals for interconnection with a substrate (such as a printed circuit board). However, the connection method in the present embodiment is not limited to BGA packaging, and thus other forms of connecting members can be used to electrically connect with external circuits. Such connecting members (including solder balls) can be made of a single metal, such as but not limited to copper or nickel, or an alloy material having good electrical conductivity, such as but not limited to SnAg alloy, SnCu alloy, SnCuBi alloy, etc. The shape of the connecting members is not limited to spherical, and can also be columnar, drum-shaped or cuboid.

[0026] In the present embodiment, the semiconductor chip 101 can be various chips according to the division of functions, such as a memory chip, a radio frequency chip, a processor chip, a high-speed communication chip, a microelectronic system chip, etc. In addition, it should be understood that although a single semiconductor chip is shown on the substrate in the figure, any number of chips can be coupled to the substrate 103.

[0027] Based on the device structure described above, it can be understood that electrical signals can be transmitted from the semiconductor chip 101 to the solder balls 104 via the signal conductors and signal vias in the substrate, and then to the external circuits via the solder balls 104, or electrical signals can be transmitted from the external circuits to the solder balls 104, and then to the semiconductor chip 101 via the signal conductors and signal vias in the substrate. This is the usual case of signal transmission path. In addition, power supply signals are also transmitted from an external power supply to the semiconductor device 101 via the solder balls 104 and the substrate.

[0028] In the present embodiment, the packaged device 100 further comprises a signal adapter 106 provided on the upper surface of the substrate 103. The signal adapter 106 will undertake part of the task of transmitting electrical signals between the semiconductor chip 101 and the external circuits. That is, part of the electrical signals from the semiconductor chip 101 will no longer be transmitted to the solder balls, and then to the external circuits via the solder balls, but will be transmitted to the signal adapter 106, and then to the external circuits via the signal adapter 106.

[0029] As shown in the figure, the signal adapter 106 is explicitly arranged on the corresponding position of the upper surface of the substrate 103. However, in some embodiments, a recess (not shown) can be arranged on the corresponding position of the upper surface of the substrate 103, and the recess is internally provided with electrically connected pins for accommodating and electrically connecting at least part of the signal adapter 106. In this way, the size of the packaged device can be reduced.

[0030] The signal transmission path of the signal adapter 106 and the semiconductor chip 101 can be various. In some embodiments, as shown in the figure, the signal adapter 106 receives the electrical signals from the semiconductor chip 101 from the substrate 103 and transmits the electrical signals to the external circuit. Figure 1 In other embodiments, as shown in the figure, the packaged device is different from the packaged device 100 shown in the figure in that the signal adapter 106 is directly electrically connected to the semiconductor chip 101, and thus part of the electrical signals of the semiconductor chip 101 are transmitted to the signal adapter 106 through the wire 108, and then transmitted to the external circuit by the signal adapter 106. Figure 2 Figure 1 In other embodiments, as shown in the figure, the packaged device is different from the packaged device 100 shown in the figure in that the signal adapter 106 is directly electrically connected to the semiconductor chip 101, and thus part of the electrical signals of the semiconductor chip 101 are transmitted to the signal adapter 106 through the wire 108, and then transmitted to the external circuit by the signal adapter 106.

[0031] The packaged device provided in the embodiment transmits part of the electrical signals of the semiconductor chip to the external circuit through the signal adapter, and transmits the remaining part of the electrical signals to the external circuit through the connecting members of the substrate. Therefore, the number of the connecting members of the substrate is reduced, and when the number of the connecting members of the substrate is reduced, the overall size of the packaged device is reduced. In particular, in the BGA packaging, the number of the solder balls as the connecting members is reduced, which can significantly reduce the size of the packaged device, thereby being conducive to the light, thin and small trend of the product as a whole.

[0032] It should be understood that the number of signals adapted by the signal adapter can be designed according to actual needs. For example, All the signals of the semiconductor chip are adapted to the external circuit through the signal adapter (in this case, the packaged device can omit the connecting members), or only part of the signals are adapted to the external circuit through the signal adapter.

[0033] Figure 3 The figure is a structural diagram of the signal adapter provided in an embodiment of the disclosure. As shown in the figure, the signal adapter 300 includes an adapter plate 301, a connector 302 and a flexible circuit board 303.

[0034] ​The adapter board 301 can be a PCB board or an FPC structure. The adapter board 301 includes corresponding first and second surfaces. A portion of its first surface contacts and is electrically connected to the upper surface of the substrate 103. The substrate 103 also serves to support and fix the signal adapter 300. A connector 302 is soldered onto a portion of the first surface and a corresponding portion of the second surface of the adapter board 301. Through the two connectors 302, the adapter board 301 is in fixed contact and electrically connected to two flexible circuit boards 303. For ease of explanation, the end of the flexible circuit board 303 fixed to the connector 302 is called the fixed end 3031, and the end away from the fixed end 3031 is called the free end 3032. Because the flexible circuit board 303 has bendable physical properties, the free end 3032 can be bent to facilitate electrical connection with external circuits.

[0035] In some embodiments, the position where the fixed end 3031 of the flexible circuit board is fixedly connected to the connector corresponds to the position where the fixed end of the second flexible circuit board is fixedly connected to the second connector, and the contact area of ​​the fixed connection is the same.

[0036] Based on the above embodiments, a modified embodiment can also be provided, in which a connector 302 is soldered to only one surface of the adapter plate 301, and electrically connected to a flexible circuit board 303 through the connector 302. However, two connectors can transmit more electrical signals than one connector, and with connectors provided on both opposite surfaces of the adapter plate, it is also easier to achieve a transition from high-density cabling to relatively low-density cabling when the size of the packaged device is fixed.

[0037] Based on the above embodiments, another variation can be provided, in which, based on Figure 3 As shown, connector 302 is removed, and in the area where connector 302 was originally located, flexible circuit board 303 is directly soldered to adapter board 301 by pressure welding.

[0038] Based on the above embodiments, another variation can be provided, in which only a flexible circuit board is used to construct the signal switching device. One end of the flexible circuit board can be directly fixed and electrically connected to the upper surface of the substrate by welding, and the other end is used to couple with an external circuit.

[0039] Based on the above embodiments, there can be multiple signal switching devices, and their positional relationship with the semiconductor chip is not fixed. Figure 4 It is a planar schematic diagram showing the positional relationship between multiple signal transceivers and semiconductor chips, such as... Figure 4As shown, four signal transducers 106 of arbitrary shapes are arranged around the four directions of the semiconductor chip 101. That is, the signals drawn from the semiconductor chip 101 can be provided to external circuits via the four signal transducers 106.

[0040] Figure 5 This is a schematic diagram of an electronic device constructed based on a packaged device according to an embodiment of the present disclosure. As shown in the figure, the electronic device 500 includes a packaged device and a substrate 501. The packaged device includes a substrate 503 and a substrate 514. A plurality of connectors 502 and a plurality of connectors 516 are provided on the lower surface of the substrates 503 and 514 for electrical connection with the printed circuit board 501. Connectors 504 and 513 are provided on the upper surface of the substrates 503 and 514 for electrical connection with semiconductor chip 505 and semiconductor chip 512, respectively.

[0041] In some embodiments, BGA packaging technology can be used to electrically connect substrates 502 and 516 to printed circuit board 501. In this case, the plurality of connectors 502 and the plurality of connectors 516 disposed on the lower surfaces of substrates 503 and 514 include pads and solder balls and are arranged in an array on the lower surfaces.

[0042] In some embodiments, flip-chip bonding (Filp Chip on Board) can be used to electrically connect semiconductor chips 505 and 512 to the upper surfaces of substrates 503 and 514, respectively. Filp Chip on Board involves creating various micro-sized solder bumps at corresponding points on the periphery of the chip and connecting them to pre-prepared solder joints on the top surface of the substrate. If solder bumps are deployed throughout the entire surface of the chip, this flip-chip bonding method is specifically called C4 (Controlled Collapsed Chip Connection). Wire bonding is then used to connect the solder pads on the chip to the solder pads on the substrate. Finally, a molding encapsulation process is used for encapsulation.

[0043] As shown in the figure, the signal conversion device includes an adapter plate 507, a connector 508, a flexible circuit board 509, a connector 510, and an adapter plate 511. The lower surface of the adapter plate 507 contacts and is electrically connected to the upper surface of the substrate 503. The connector 508 is soldered to the upper surface of the adapter plate 507, and is fixed and electrically connected to the flexible circuit board 509 via the connector 508. The flexible circuit board 509 is fixed and electrically connected to the adapter plate 511 via the connector 510. The upper surface of the adapter plate 511 is fixed and electrically connected to the connector 510, and the lower surface of the adapter plate 511 is fixed and electrically connected to the upper surface of the substrate 514. The substrates 503 and 514 serve to support, fix, and electrically connect the signal conversion device.

[0044] In the aforementioned electronic device, signal transmission between semiconductor chips 505 and 512 is achieved through two paths: one part of the signal travels from semiconductor chip 505 via connector 504, substrate 503, and connector 502 to printed circuit board 501, and then from printed circuit board 501 via connector 516, substrate 514, and connector 513 to semiconductor chip 512; the other part of the signal travels from semiconductor chip 505 via connector 504 and substrate 503 to adapter board 507, and then from adapter board 507 via connector 508 and flexible circuit board 509 to connector 510, and then from connector 510 via adapter board 511, substrate 514, and connector 513 to semiconductor chip 512. Of course, the signal can also be transmitted along the reverse path.

[0045] It should be understood that, although in Figure 5 The packaged device shown includes two semiconductor chips, but the scope of protection of this disclosure is not limited thereto. In some embodiments, a packaged device including two or more semiconductor chips is provided, the specific structure of which is described as follows: a plurality of substrates, each substrate having a first surface and a second surface opposite to the first surface; a plurality of semiconductor chips, respectively coupled to a plurality of first surfaces of the plurality of substrates; a plurality of connector arrays corresponding one-to-one with the plurality of substrates, each connector array including a plurality of connectors, the first end of each connector in each connector array being coupled to the second surface of its corresponding substrate and the second end of each connector being used for coupling with an external circuit; at least one signal switching device, each signal switching device being simultaneously coupled to the first surface of the first substrate and the second substrate of the plurality of substrates, and the signal switching device transmitting at least a portion of the signal between the semiconductor chip coupled to the first substrate and the semiconductor chip coupled to the second substrate, wherein the first substrate and the second substrate are any two of the plurality of substrates. In other words, in a packaged device that includes multiple (two or more) semiconductor chips, at least two semiconductor chips transmit a portion of their signals through a signal switching device instead of through connectors. This reduces the number of connectors on the substrate and consequently reduces the size of the packaged device. At the same time, the reduction in the number and length of vias from the top to the bottom layer of the packaged device helps to solve power supply and impedance discontinuity problems.

[0046] Furthermore, it should be understood that in a packaged device comprising multiple (two or more) semiconductor chips, the number of signals transferred by the signal transfer device can be designed according to actual needs. For example, all signals between two semiconductor chips can be transferred through the signal transfer device, or only a portion of the signals can be transferred. Alternatively, some semiconductor chips can use the signal transfer device to transfer signals, while others can not have the signal transfer device installed between them.

[0047] Figure 6 This is a schematic diagram of an electronic device constructed based on the above-described packaging device according to another embodiment of this disclosure. As shown in the figure, the electronic device 600 includes a printed circuit board 601, a substrate 603, and a substrate 614.

[0048] Connectors 602 and 616 are provided on the lower surfaces of substrates 603 and 614 for electrical connection with printed circuit board 601. Connectors 604 and 613 are provided on the upper surfaces of substrates 603 and 614 for electrical connection with semiconductor chip 605 and semiconductor chip 612, respectively.

[0049] and Figure 5 The difference is that this electronic device uses two separate signal conversion devices. Referring to the figure, one signal conversion device, consisting of conversion board 607, connector 608 and flexible circuit board 609, is electrically connected to printed circuit board 601, and the other signal conversion device, consisting of conversion board 611, connector 610 and flexible circuit board 617, is coupled to printed circuit board 601.

[0050] In the aforementioned electronic device, a portion of the signal transmission between semiconductor chips 605 and 612 is via two signal conversion devices and a printed circuit board 601. A portion of the signal travels from semiconductor chip 605 to printed circuit board 601 via a signal conversion device consisting of conversion board 607, connector 608, and flexible circuit board 609, and then from printed circuit board 601 to semiconductor chip 612 via a signal conversion device consisting of conversion board 611, connector 610, and flexible circuit board 617. The signal can also be transmitted along the reverse path.

[0051] In the electronic device provided in the above embodiments, a signal transducer handles a portion of the signal transmission between two semiconductor chips, thereby reducing the number of connectors between the substrate and the printed circuit board. Correspondingly, the number of vias between the top and bottom layers of the packaged device is reduced, thus avoiding damage to the integrity of the power layer in the substrate. Furthermore, due to the reduced number of connectors between the substrate and the printed circuit board, the size of the electronic device is also reduced. Especially in BGA packaging, where solder balls serve as connectors, reducing the number of solder balls can significantly reduce the size of the electronic device, thus contributing to the overall trend towards lighter, thinner, and smaller products.

[0052] Figure 7This is a structural block diagram of an electronic device provided in another embodiment of this disclosure. As shown above, the electronic device provides a motherboard 1000 on which various components are disposed. The motherboard 1000 is, for example, a printed circuit board. Various components are carried on the motherboard 1000, including, but not limited to, a processor 1002, a graphics processor 1003, a dynamic random access memory 1004, a static random access memory 1010, a flash memory 1006, a GPS chip 1008, etc. These components are physically and electrically coupled to the motherboard 1000. The motherboard 1000 provides communication functions between the various components. In a further embodiment, for example, the functions of some components may be integrated into the processor; for example, the dynamic random access memory 1004 and the static random access memory 1010 may be integrated into a system-on-a-chip and used as the processor 1002 in this embodiment.

[0053] The processor, derived from traditional computer systems, plays a crucial role in overall control and scheduling. While highly efficient in logic control, processors often lack specialization. Therefore, they are sometimes integrated with various dedicated acceleration units, such as acceleration units specifically for neural network model calculations, or graphics processors (GPUs) that are more efficient in graphics processing. In this embodiment, the processor 1002 and the graphics processor 1003 are integrated into the same electronic device via a motherboard 1000.

[0054] The communication chip enables wireless communication to facilitate the transmission of data to and from electronic device 10. The term "wireless" does not imply that the associated device does not contain any wires, although in some embodiments they may not. The communication chip can implement any of a variety of wireless standards or protocols, including but not limited to Wi-Fi (IEEE 802.11 series), WiMAX (IEEE 802.16 series), IEEE 802.20, LTE, Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, its derivatives, and any other wireless protocols designated as 3G, 4G, 5G, and above. Since there are many different communication protocols, a separate communication chip can be built based on each protocol. For example, the motherboard 1000 in the diagram contains a GPS chip 1008 and a Bluetooth chip 1007. In addition, the motherboard 1000 will also contain chips dedicated to long-range wireless communication, such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, and Ev-DO. Furthermore, other functions, such as video encoding / decoding, compass, various component drivers, etc., can also be integrated into the electronic device 10 as various components via the motherboard 1000.

[0055] Although not shown in the figure, according to the embodiments described above, some components include signal switching devices, whereby signal transmission between two components having signal switching devices is partially achieved through the motherboard 1000 and partially through the signal switching devices. This helps reduce the number of connectors between the components and the motherboard 1000, and also helps reduce signal interference.

[0056] In addition, the electronic device also includes components that are not integrated into the device 10 via the motherboard 1000, such as a sound card 1009, a keyboard 1012, a network card 1014, and a mouse 1013. These components provide input and output functions for the device 10.

[0057] Based on the above-mentioned packaging device, this disclosure also provides a method for forming such a packaging device, comprising: respectively disposing a semiconductor chip and a signal conversion device on a first surface of a substrate; coupling a portion of the signal of the semiconductor chip to the substrate; and connecting the remaining signal of the semiconductor chip to the signal conversion device.

[0058] This method allows signals from a semiconductor chip to be transmitted to a printed circuit board via a substrate and a signal transducer, thereby helping to reduce the number of connectors between the substrate and the printed circuit board, and thus helping to reduce the size of the packaged device containing the substrate and the semiconductor chip.

[0059] It should be understood that the substrate in the above embodiments may be one of a packaging substrate, a printed circuit board, and an intermediate substrate.

[0060] Commercial value of embodiments of the present disclosure The packaging device provided in this disclosure transmits a portion of the signals from a semiconductor chip to an external circuit via a signal switching device. This improvement helps reduce the product size of the packaging device, meeting the requirements for thinner and smaller products, and thus has economic and commercial value.

[0061] It should be understood that the same or similar parts between the various embodiments in this specification can be referred to mutually, and each embodiment focuses on describing the differences from other embodiments. In particular, for the method embodiments, since they are basically similar to the methods described in the apparatus and system embodiments, the description is relatively simple, and relevant parts can be referred to in the description of other embodiments.

[0062] It should be understood that the foregoing describes specific embodiments of this specification. Other embodiments are within the scope of the claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0063] It should be understood that the use of a singular form to describe an element or to show only one element in the accompanying drawings does not imply that the number of such element is limited to one. Furthermore, modules or elements described or shown as separate herein may be combined into a single module or element, and modules or elements described or shown as single herein may be broken down into multiple modules or elements.

[0064] It should also be understood that the terminology and expressions used herein are for descriptive purposes only, and one or more embodiments described herein should not be limited to these terms and expressions. The use of these terms and expressions does not exclude any illustrative and descriptive equivalent features (or parts thereof), and it should be recognized that various modifications that may exist should also be included within the scope of the claims. Other modifications, variations, and substitutions may also exist. Accordingly, the claims should be considered to cover all such equivalents.

Claims

1. A packaged device, comprising: A first substrate has a first surface; A semiconductor chip is coupled to the first surface of the first substrate; A signal switching device is coupled to the first surface of the first substrate; Wherein, at least a portion of the signals from the semiconductor chip are coupled to an external circuit via the signal conversion device; the signal conversion device includes: The adapter plate includes a first surface and a second surface that correspond to each other, and a portion of the first surface of the adapter plate is fixed to the first surface of the first substrate; Multiple connectors, wherein a portion of the first surface of the adapter plate and a portion corresponding to the second surface are respectively welded with one of the connectors; Multiple flexible circuit boards, each of the flexible circuit boards including a fixed end and a free end, the fixed end being fixedly connected to the connector, and the free end being used to connect to an external circuit.

2. The packaging device according to claim 1, wherein, Also includes: Multiple connectors, including a first end and a second end, wherein the first end is coupled to a second surface of the first substrate opposite to the first surface, and the second end is used for coupling with an external circuit. The remaining signals, excluding at least a portion of the signals, are coupled to an external circuit via the plurality of connectors.

3. The packaging device according to claim 1 or 2, wherein the signal switching device is disposed at the edge of the first surface of the first substrate.

4. The packaging device according to claim 1 or 2, wherein a groove is provided on the first surface of the first substrate for accommodating the signal switching device.

5. The packaging device according to claim 1, wherein the connector comprises a first connector and a second connector respectively soldered to opposite first and second surfaces of the adapter plate, the flexible circuit board comprises a first flexible circuit board and a second flexible circuit board, the fixed end of the first flexible circuit board is fixedly connected to the first connector, the free end of the first flexible circuit board is used for connection to an external circuit, the fixed end of the second flexible circuit board is fixedly connected to the second connector, and the free end of the second flexible circuit board is used for connection to an external circuit.

6. The packaging device according to claim 5, wherein the position where the fixed end of the first flexible circuit board is fixedly connected to the first connector corresponds to the position where the fixed end of the second flexible circuit board is fixedly connected to the second connector, and the contact area of ​​the fixed connection is the same.

7. The packaging device according to any one of claims 1 to 6, wherein, The first substrate is a packaging substrate.

8. The packaging device according to claim 1, wherein, The external circuit is a chip or a printed circuit board.

9. An electronic device comprising: The packaging device as described in any one of claims 1 to 7; as well as Printed circuit boards used as external circuits.

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