Surface structure recombination treatment method and laser processing equipment

Abstract

The invention provides a processing method for surface structure recombination. The processing method comprises the following steps: providing a processing object; and executing a structure recombination step: scanning at least one part of the surface of the processed object by femtosecond laser, so that at least one part of the surface is subjected to structure recombination. The invention further provides laser processing equipment which can be used for carrying out structure recombination on the processed object.

Description

Technical Field

[0001] This application relates to a surface treatment technology, and more particularly to a method for reorganizing the structure of a workpiece using femtosecond laser technology. Background Technology

[0002] Traditional methods for altering the microstructure and further changing the properties of materials involve heat treatment within furnace tubes. However, such heat treatment is often limited by the size of the furnace tube space, and as the workpieces become increasingly thinner, they are prone to deformation or breakage during heat treatment within the furnace tube.

[0003] Therefore, how to overcome the above-mentioned defects by reorganizing the structure of processed objects through process design and expanding the application fields of processed objects has become one of the important issues that this project aims to solve. Summary of the Invention

[0004] The technical problem to be solved by this application is to provide a surface structure reconstruction method that addresses the shortcomings of existing technologies. The method includes: providing a workpiece for processing; and performing a structure reconstruction step by scanning at least a portion of the surface of the workpiece with a femtosecond laser to reconstruct the structure of at least a portion of the surface.

[0005] According to a feasible implementation plan, a preheating step is performed before structural remodeling, in which at least a portion of the surface of the workpiece is scanned using a non-femtosecond laser.

[0006] According to a feasible implementation, the preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot scanning method. The structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot line scanning method.

[0007] According to a feasible implementation, the preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot line scan. The structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot surface scan.

[0008] According to a feasible implementation scheme, the wavelength of the femtosecond laser is 300 to 2000 nm, the pulse width of the femtosecond laser is 50 to 500 fs, and the pulse energy of the femtosecond laser is 10 nJ to 1000 μJ.

[0009] This application also provides a laser processing apparatus suitable for structural reconstruction of the surface of a workpiece. The laser processing apparatus includes a stage, a control device, and a laser device. The stage is used to support the workpiece. The laser device is electrically connected to the control device and includes a laser source module and a galvanometer module. The laser device scans at least a portion of the surface of the workpiece with a femtosecond laser, thereby reconstructing the structure of at least a portion of the surface. The wavelength of the femtosecond laser is 300 to 2000 nm, the pulse width is 50 to 500 fs, and the pulse energy is 10 nJ to 1000 μJ.

[0010] According to a feasible implementation scheme, before performing the structural reconstruction step, the laser device also performs a preheating step, scanning at least a portion of the surface of the workpiece in a non-femtosecond laser manner.

[0011] According to a feasible implementation scheme, the preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot surface scanning method. The structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot line scanning method.

[0012] According to a feasible implementation scheme, the preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot line scan. The structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot surface scan.

[0013] According to a feasible implementation scheme, the processed object is a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate.

[0014] According to a feasible implementation scheme, the laser processing equipment also includes a spectral imager, including a photosensitive component. The spectral imager is electrically connected to a control device, receives reflected light from the processed object, and transmits a photosensitive signal to the control device accordingly. The control device then generates a spectral image.

[0015] One of the beneficial effects of this application is that the surface structure remodeling method provided by this application can remodel the surface of the workpiece in a short time by using a femtosecond laser scanning method to remodel at least a portion of the surface. In some technical fields, the workpiece is a silicon carbide substrate. By using femtosecond laser scanning, the resistance of the silicon carbide substrate can be changed without destroying its shape, thereby improving its electrical properties.

[0016] Furthermore, in one embodiment, a preheating step is performed before structural reconstruction, by scanning at least a portion of the surface of the workpiece using a non-femtosecond laser. This secondary scanning, followed by preheating, results in better structural reconstruction of the workpiece surface.

[0017] Furthermore, according to one embodiment, the laser processing equipment also includes a spectral imager, including a photosensitive component. The spectral imager is electrically connected to a control device, receives reflected light from the workpiece, and transmits a photosensitive signal to the control device accordingly. The control device then generates a spectral image. This allows for real-time monitoring of the surface structure remodeling of the workpiece, assessing whether the desired effect (such as the contour of the microstructure on the workpiece surface) is achieved, and adjusting the femtosecond laser conditions accordingly.

[0018] The other effects and embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the process of a surface structure reconstruction method according to an embodiment of this application;

[0021] Figure 2 This is a schematic diagram of the process of a surface structure reconstruction method according to an embodiment of this application;

[0022] Figure 3 This is a schematic diagram of the architecture of a laser processing device according to an embodiment of this application. Detailed Implementation

[0023] The following specific embodiments illustrate the implementation of the "Surface Structure Reconstruction Processing Method and Laser Processing Equipment" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings of this application are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0024] Please see Figure 1This is a schematic diagram illustrating the process steps of a surface structure remodeling method according to an embodiment of this application. The surface structure remodeling method 100 includes steps S1 to S2. Step S1 involves providing a workpiece. According to some embodiments, the workpiece may be a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate. Step S2 involves performing a structure remodeling step by scanning at least a portion of the surface of the workpiece with a femtosecond laser, thereby remodeling the structure of at least a portion of the surface. In other words, the surface structure remodeling method of this application can perform partial or complete structure remodeling on the surface of the workpiece, generating multiple microstructures.

[0025] Please see Figure 2 This is a schematic diagram of the process steps of a surface structure reconstruction method 200 according to an embodiment of this application. According to this embodiment, before performing step S2, a preheating step S11 is also performed, in which at least a portion of the surface of the workpiece is scanned using a non-femtosecond laser. Through this second scanning and preheating, the surface structure reconstruction effect of the workpiece is improved.

[0026] According to some embodiments, the preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot surface scanning method. The structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot line scanning method.

[0027] According to some embodiments, the preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot line scan. The structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot surface scan.

[0028] The aforementioned "at least a portion" refers to the area processed by laser. This can be partial processing or processing of the entire surface.

[0029] According to some embodiments, the structural reconstruction step is performed under the following femtosecond laser conditions: the wavelength of the femtosecond laser is 300 to 2000 nm (inclusive of any positive integer from 300 to 2000 nm), the pulse width of the femtosecond laser is 50 to 500 fs (inclusive of any positive integer from 50 to 500 fs), and the pulse energy of the femtosecond laser is 10 nJ to 1000 μJ (inclusive of any positive integer from 10 nJ to 1000 μJ).

[0030] Please see Figure 3This is a schematic diagram of the architecture of a laser processing apparatus according to an embodiment of this application. The laser processing apparatus is suitable for structural reconstruction of the surface of a workpiece. The laser processing apparatus includes a stage, a control device, and a laser device. The stage is used to support the workpiece. The laser device is electrically connected to the control device and includes a laser source module and a galvanometer module. The laser device scans at least a portion of the surface of the workpiece with a femtosecond laser, thereby reconstructing the structure of at least a portion of the surface. Specifically, the femtosecond laser is used with a wavelength of 300 to 2000 nm (inclusive), a pulse width of 50 to 500 fs (inclusive), and a pulse energy of 10 nJ to 1000 μJ (inclusive) to reconstruct the surface structure of the workpiece.

[0031] The control device is, for example, a computer. According to some embodiments, the workpiece processed by the laser processing equipment can be a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate.

[0032] According to some embodiments, before performing the structural reconstruction step, the laser device also performs a preheating step, which involves scanning at least a portion of the surface of the workpiece using a non-femtosecond laser. This secondary scanning, followed by preheating, results in better structural reconstruction of the workpiece surface.

[0033] According to some embodiments, the preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot scanning method. The structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot line scanning method. However, this application is not limited to this; according to other embodiments, the preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot line scanning method. The structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot surface scanning method.

[0034] Please refer to the following: Figure 3 According to this embodiment, the laser processing equipment further includes a spectral imager, including a photosensitive component. The spectral imager is electrically connected to a control device, receives reflected light from the workpiece, and correspondingly transmits a photosensitive signal to the control device. The control device then generates a spectral image. The photosensitive component is, for example, a charge-coupled device (CCD). According to some embodiments, the light source for the reflected light from the workpiece is a laser beam. According to other embodiments, the spectral imager includes another light source module, such as a light-emitting diode, which illuminates the workpiece with white light, and the photosensitive component receives the reflected light. In other words, according to some embodiments, the optical axis of the laser device may be coaxial with the optical axis of the spectral imager. According to other embodiments, the optical axis of the laser device may be coaxial with the optical axis of the spectral imager; this application is not limiting.

[0035] According to some embodiments, the spectral imager is a hyperspectral imaging (HSI) instrument. By observing the hyperspectral image, the status of surface structure remodeling of the processed object can be monitored in real time. For example, structural remodeling is the formation of microstructures on the surface. The hyperspectral image can be used to determine whether the shape of the microstructures is the preset shape, and the processing conditions of the femtosecond laser can be further adjusted.

[0036] "Beneficial effects of the embodiments"

[0037] One of the beneficial effects of this application is that the surface structure remodeling method provided by this application can remodel the surface of the workpiece in a short time by using a femtosecond laser scanning method to remodel at least a portion of the surface. In some technical fields, the workpiece is a silicon carbide substrate. By using femtosecond laser scanning, the resistance of the silicon carbide substrate can be changed without destroying its shape, thereby improving its electrical properties.

[0038] Furthermore, in one embodiment, a preheating step is performed before structural reconstruction, by scanning at least a portion of the surface of the workpiece using a non-femtosecond laser. This secondary scanning, followed by preheating, results in better structural reconstruction of the workpiece surface.

[0039] Furthermore, according to one embodiment, the laser processing equipment also includes an optical sensor electrically connected to a control device. This sensor receives reflected light from the workpiece and transmits a photosensitive signal to the control device, which then generates a spectral image. In this way, the surface structure remodeling of the workpiece can be monitored in real time, allowing for adjustments to the femtosecond laser conditions accordingly.

[0040] The embodiments and / or implementation methods described above are merely preferred embodiments and / or implementation methods for implementing the technology of this application, and are not intended to limit the implementation methods of the technology of this application in any way. Any person skilled in the art may make some modifications or alterations to other equivalent embodiments without departing from the scope of the technical means disclosed in this application, but these should still be regarded as the technology or embodiments that are substantially the same as those of this application.

Claims

1. A method for surface structure reconstruction, characterized in that, The surface structure reconstruction process includes: Provide a workpiece for processing; and A structural remodeling step is performed by scanning at least a portion of the surface of the workpiece with a femtosecond laser, thereby remodeling the at least a portion of the surface.

2. The surface structure reconstruction method according to claim 1, characterized in that, Before performing the structural reconstruction step, a preheating step is also performed, in which at least a portion of the surface of the workpiece is scanned using a non-femtosecond laser.

3. The surface structure reconstruction method according to claim 2, characterized in that, The preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot scanning method; the structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot line scanning method.

4. The surface structure reconstruction method according to claim 2, characterized in that, The preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot line scan; the structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot surface scan.

5. The surface structure reconstruction method according to claim 1, characterized in that, The processed object is a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate.

6. The surface structure reconstruction method according to claim 1, characterized in that, The femtosecond laser has a wavelength of 300 to 2000 nm, a pulse width of 50 to 500 fs, and a pulse energy of 10 nJ to 1000 μJ.

7. A laser processing device suitable for structural remodeling of the surface of a workpiece, characterized in that, The laser processing equipment includes: A platform for supporting the workpiece being processed; A control device; and A laser device electrically connected to the control device, the laser device including a laser source module and a galvanometer module, the laser device scanning at least a portion of the surface of the workpiece with a femtosecond laser, causing the at least a portion of the surface to undergo structural reorganization; The femtosecond laser has a wavelength of 300 to 2000 nm, a pulse width of 50 to 500 fs, and a pulse energy of 10 nJ to 1000 μJ.

8. The laser processing equipment according to claim 7, characterized in that, Before performing the structural reconstruction step, the laser device also performs a preheating step, scanning at least a portion of the surface of the workpiece using a non-femtosecond laser.

9. The laser processing equipment according to claim 8, characterized in that, The preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot scanning method; the structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot line scanning method.

10. The laser processing equipment according to claim 8, characterized in that, The preheating step involves scanning at least a portion of the surface of the workpiece using a laser spot line scan; the structural reconstruction step involves scanning at least a portion of the surface of the workpiece using a laser spot surface scan.

11. The laser processing equipment according to claim 7, characterized in that, The processed object is a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate.

12. The laser processing equipment according to claim 7, characterized in that, The laser processing equipment also includes a spectral imager, which includes a photosensitive component. The spectral imager is electrically connected to the control device, receives reflected light reflected by the workpiece, and transmits a photosensitive signal to the control device accordingly. The control device then generates a spectral image.

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