Cutting method, cutting equipment, electronic equipment, medium and computer program product

Abstract

The invention provides a cutting method, cutting equipment, electronic equipment, a medium and a computer program product, the method is applied to an electronic control system in the cutting equipment, the cutting equipment further comprises a cutting system, the cutting system comprises a pay-off area, a cutting area and a take-up area, and the cutting method comprises the steps that the original wire arrangement distance of the cutting system is obtained, the original flat cable spacing is a preset flat cable spacing default value before cutting; according to the original wire arrangement space, the actual wire arrangement space of the cutting system is obtained through calculation, and the actual wire arrangement space represents the gap value of cutting wires wound around a wire wheel in the cutting system; and according to the actual wire arrangement distance, the cutting system is controlled to cut the hard materials according to a preset paying-off rule, and according to the preset paying-off rule, reciprocating periodic paying-off is sequentially conducted from the paying-off area to the cutting area to the take-up area. According to the cutting method, the situation that the cutting wire is obliquely pulled due to the fact that re-winding operation is canceled in a reverse cutting mode is improved, and the problem that the wire is broken due to fluctuation of tension difference is solved.

Description

Technical Field

[0001] This application relates to the field of cutting technology for hard and brittle materials, and more specifically, to a cutting method and cutting equipment, apparatus, electronic equipment, storage medium, and computer program product. Background Technology

[0002] A photovoltaic diamond wire slicing machine is a specialized device that uses diamond wire as a cutting tool to cut monocrystalline silicon rods into silicon wafers of a specific thickness. In the fields of photovoltaic crystalline silicon and semiconductor cutting, photovoltaic diamond wire slicing machines with single-wire or multi-wire diamond wires are commonly used to cut, squared, and slice silicon materials to obtain the corresponding silicon wafers or silicon materials.

[0003] Currently, photovoltaic diamond wire slicing machines generally employ a reverse cutting method. This involves performing a rewinding operation before cutting, i.e., unidirectional wire running, to transfer the new diamond wire needed for the next slicing task from the feed roller in the feed area to the take-up roller in the take-up area. During cutting, a reciprocating periodic feed is used, with the feed direction from the take-up area to the cutting area and then back to the feed area. During the cutting process, the rewinding diamond wire is returned to the feed area, and this process continues until the silicon wafer is cut.

[0004] In the reverse cutting method, if the rewinding operation is cancelled, the diamond wire will be pulled at an angle when it is released. Furthermore, when the old and new wires are released alternately using the diamond wire, the tension lever will swing abnormally due to the tension difference, causing tension fluctuations and resulting in abnormal wire breakage. Summary of the Invention

[0005] The purpose of this application is to provide a cutting method, cutting equipment, electronic equipment, medium, and computer program product, which improves the problem of wire breakage caused by tension fluctuation due to tension difference caused by the removal of the rewinding wire before cutting, and improves the cutting efficiency.

[0006] In a first aspect, this application provides a cutting method applied to a cutting device, the cutting device including a cutting system and an electrical control system, the cutting system including a wire feeding area, a cutting area and a wire take-up area, the electrical control system being used to execute the cutting method, the cutting method including: obtaining the original wire spacing of the cutting system, the original wire spacing being a preset default value of the wire spacing before cutting; calculating the actual wire spacing of the cutting system based on the original wire spacing, the actual wire spacing representing the gap value of the cutting wire wound on the wire reel in the cutting system; and controlling the cutting system to cut hard materials according to a preset wire feeding rule based on the actual wire spacing, wherein the preset wire feeding rule is to periodically feed wire from the wire feeding area to the cutting area and then to the wire take-up area in a reciprocating manner.

[0007] In the above technical solution, by calculating the original wire spacing of the cutting system, the actual wire spacing of the cutting system is obtained. The electrical control system controls the cutting system to reciprocate and periodically release wire according to the actual wire spacing to cut the hard material. This can effectively improve the problem of wire slant during the cutting process caused by canceling the rewinding before cutting, as well as the problem of wire breakage caused by tension fluctuation due to the difference in cutting tension, thus improving the cutting efficiency.

[0008] In one embodiment, calculating the actual wire spacing of the cutting system based on the original wire spacing includes: controlling the wire laying area to lay the cutting wire according to the original wire spacing, and calculating the diagonal pull amount of the cutting wire after laying a preset length; determining the actual wire spacing of the cutting system based on the original wire spacing and the diagonal pull amount.

[0009] In the above technical solution, by correcting the slant of the diamond wire on the pay-off roller to the original wire spacing, the cutting system runs the wire according to the corrected actual wire spacing to cut the hard material, which can effectively improve the slant of the diamond wire.

[0010] In one embodiment, the wire feeding area includes a wire feeding roller and a wire tracing wheel, with the cutting wire wound around the wire feeding roller and the wire tracing wheel. Controlling the wire feeding area to feed the cutting wire according to the original wire tracing spacing, and calculating the angled pull of the cutting wire after feeding a preset length, includes: controlling the wire feeding roller to feed the cutting wire of a preset length sequentially from the cutting area to the take-up area according to the original wire tracing spacing; obtaining a first stroke of the wire tracing wheel after feeding the preset length of cutting wire; controlling the wire tracing wheel to move so that the cutting wire is perpendicular to the main shaft of the wire feeding roller, and obtaining a second stroke of the wire tracing wheel; determining the angled pull of the cutting wire after feeding the preset length based on the first stroke and the second stroke.

[0011] In the above technical solution, by recording the travel distance of the wire feeding wheel during the wire feeding process, the overall diagonal pull of the diamond wire after the preset length is fed can be accurately calculated.

[0012] In one embodiment, before controlling the feed roller to sequentially feed a preset length of the cutting wire from the cutting area to the take-up area according to the original wire spacing, the method further includes: controlling the wire feeding wheel to move so that the cutting wire is perpendicular to the main shaft of the feed roller.

[0013] In the above technical solution, the wire feeding wheel is driven by the driving component of the wire feeding wheel to move in the direction of the main shaft of the wire feeding roller, so as to adjust the state of the diamond wire and make the diamond wire in a state perpendicular to the main shaft of the wire feeding roller without oblique tension, so that there is no oblique tension accumulation of the diamond wire before feeding, thereby obtaining a more accurate actual wire feeding distance of the cutting system.

[0014] In one embodiment, before controlling the movement of the wire feeding wheel to make the cutting line perpendicular to the main shaft of the wire feeding roller, the method further includes: controlling the wire feeding roller to release the cutting line so that all the cutting lines in the wire feeding area, the cutting area, and the take-up area are uncut new lines.

[0015] In the above technical solution, by controlling that all the cutting lines in the pay-off area, cutting area and take-up area are uncut new lines, the cumulative error of diamond wire slant pulling can be further reduced.

[0016] In one embodiment, the wire feeding area further includes: a tension wheel for adjusting the tension of the cutting wire, and a rocker arm connected to the tension wheel; the method further includes: obtaining the deflection angle of the rocker arm; determining the speed compensation value of the wire feeding roller based on the deflection angle of the rocker arm; and compensating the speed compensation value into the speed loop control circuit of the motor of the wire feeding roller so that the tension of the cutting wire is maintained within a preset range.

[0017] In the above technical solution, by adjusting the speed of the motor of the wire feeding roller, the swing amplitude of the tension swing arm is reduced, and the speed compensation value of the wire feeding roller is compensated into the speed loop control circuit of the motor of the wire feeding roller, so that the tension fluctuation of the diamond wire is maintained within the preset range, and the swing arm quickly returns to the center position without oscillation, thereby reducing the tension fluctuation amplitude and time of the diamond wire, and thus reducing the wire breakage rate on the wire feeding roller side and improving the cutting quality.

[0018] In one embodiment, before obtaining the deflection angle of the pendulum, the method further includes: obtaining the periodic wire feeding amount and the wire storage amount of the cutting system; controlling the wire feeding from the feeding area to the cutting area and then to the take-up area in sequence according to the periodic wire feeding amount and the wire storage amount, and calculating the start and end positions of the new cutting wire feeding.

[0019] In the above technical solution, by calculating the amount of wire fed and stored in the cutting process cycle of the cutting system, the starting and ending positions of the new diamond wire on the feeding roller can be identified, thereby accurately identifying the stage of feeding new wire on the feeding roller and thus determining that the diamond wire is in the switching stage between old and new wire.

[0020] In one embodiment, after obtaining the deflection angle of the pendulum, the method further includes: determining the starting position for laying out a new cutting line based on the deflection angle of the pendulum.

[0021] In the above technical solution, the change in the deflection angle of the pendulum rod can be used to determine that there is a sudden change in the tension of the diamond wire, thereby identifying that the diamond wire is in the switching stage between the old and new wires.

[0022] In one embodiment, determining the starting position of the new cutting line based on the deflection angle of the swing arm includes: when the deflection angle of the swing arm exceeds a preset threshold, determining the current position of the line laying from the line laying area to the cutting area and then to the line take-up area as the starting position of the new cutting line.

[0023] In the above technical solution, the new line release stage can be effectively identified by comparing the deflection angle of the pendulum rod with the preset threshold.

[0024] In one embodiment, after the step of compensating the speed compensation value into the speed loop control circuit of the motor of the wire feeding roller to keep the tension fluctuation of the cutting wire within a preset range, the method further includes: canceling the compensation of the speed compensation value in the speed loop control circuit of the motor of the wire feeding roller when the speed of the motor of the wire feeding roller decreases to zero.

[0025] In the above technical solution, the running status of the diamond wire on the feeding roller can be accurately determined based on the rotation speed of the motor of the feeding roller and the swing amplitude of the swing arm. When the rotation speed of the motor of the feeding roller is zero, it means that after the diamond wire stops running, the swing arm can still swing slightly; or, after the diamond wire stops running, the swing arm no longer swings.

[0026] In one embodiment, the reciprocating periodic wire feeding includes: a first period of wire feeding, a first period of wire return, a second period of wire feeding, and a second period of wire return; controlling the cutting system to cut hard materials according to a preset wire feeding rule includes: in the first period of wire feeding stage, controlling the wire feeding from the feeding area to the cutting area and then to the take-up area sequentially, and controlling the linear speed of the cutting wire to accelerate from a first speed to a second uniform speed, and then decelerate from the second uniform speed to a third speed, so as to achieve cutting of hard materials; in the first period of wire return stage, controlling the wire feeding from the take-up area to the cutting area and then to the feeding area sequentially, and controlling the linear speed of the cutting wire to accelerate from the first speed... The wire is moved to the second uniform speed, and then decelerated from the second uniform speed to the third speed to achieve cutting of hard materials. In the second cycle wire feeding stage, the wire is fed sequentially from the feeding area to the cutting area and then to the take-up area, and the linear speed of the cutting wire is controlled to accelerate from the first speed to the second uniform speed, and then decelerated from the second uniform speed to the third speed to achieve cutting of hard materials. In the second cycle wire return stage, the wire is fed sequentially from the take-up area to the cutting area and then to the feeding area, and the linear speed of the cutting wire is controlled to accelerate from the first speed to the second uniform speed, and then decelerated from the second uniform speed to the third speed to achieve cutting of hard materials.

[0027] In the above technical solution, the wire running direction of the cutting equipment is from the wire feeding area to the cutting area and then to the wire take-up area. The positive cutting method eliminates the rewinding operation in the negative cutting method, which can effectively improve the slant pulling of diamond wire.

[0028] Secondly, this application provides a cutting device, comprising: a cutting system for cutting hard materials; and an electrical control system electrically connected to the cutting system for executing the cutting method described in any embodiment of the first aspect of this application.

[0029] In the above technical solution, by calculating the wire spacing of the cutting system, the electrical control system controls the cutting system to reciprocate and periodically release wires according to the wire spacing to cut hard materials, which can effectively improve the oblique pulling of diamond wire during the cutting process and improve the cutting quality.

[0030] In one embodiment, the cutting device further includes: a feed system electrically connected to the electronic control system, the feed system being used to apply pressure to hard materials to press them into the cutting system; and a hydraulic system electrically connected to the electronic control system, the hydraulic system being used to cool the cutting system and recycle waste liquid.

[0031] In the above technical solution, the feed system can be used to lift and press hard materials in; the hydraulic system can be used to cool the cutting process and recycle waste liquid in a timely manner.

[0032] Thirdly, this application provides a cutting device, including an acquisition module for acquiring the wire spacing of the cutting system, the wire spacing representing the gap value of the cutting wire wound on the wire reel in the cutting system; and an execution module for controlling the cutting system to cut hard materials according to a preset wire feeding rule based on the wire spacing, wherein the preset wire feeding rule is to periodically feed wire from the wire feeding area to the cutting area and then to the wire take-up area.

[0033] Fourthly, this application provides an electronic device, the electronic device comprising: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to execute the cutting method described in any embodiment of the first aspect of this application.

[0034] Fifthly, this application provides a computer-readable storage medium storing a computer program, which, when executed by a processor, performs the cutting method described in any embodiment of the first aspect of this application.

[0035] Sixthly, this application provides a computer program product, which includes a computer program that, when executed by a processor, implements the cutting method described in any embodiment of the first aspect of this application. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly described below.

[0037] Figure 1 This is a schematic diagram of the overall structure of a cutting device provided in an embodiment of this application;

[0038] Figure 2 This is a schematic diagram of the structure of a cutting system provided in one embodiment of this application;

[0039] Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0040] Figure 4 This is a schematic diagram of the structure of an existing cutting system provided in an embodiment of this application;

[0041] Figure 5(a) is a schematic diagram of the running speed change of the diamond wire during the wire feeding stage of cycle 1 according to an embodiment of this application;

[0042] Figure 5(b) is a schematic diagram of the running speed change of diamond wire in the cycle 1 loop stage provided in an embodiment of this application;

[0043] Figure 5(c) is a schematic diagram of the running speed change of the diamond wire during the period 2 wire laying stage provided in an embodiment of this application;

[0044] Figure 5(d) is a schematic diagram of the running speed change of diamond wire in the two-cycle stage provided in an embodiment of this application;

[0045] Figure 6(a) is a schematic diagram of the change in the running speed of the diamond wire during the first cycle of wire feeding stage provided in an embodiment of this application;

[0046] Figure 6(b) is a schematic diagram of the running speed change of the diamond wire during the first cycle return stage provided in an embodiment of this application;

[0047] Figure 6(c) is a schematic diagram of the change in the running speed of the diamond wire during the second cycle of wire feeding stage provided in an embodiment of this application;

[0048] Figure 6(d) is a schematic diagram of the running speed change of the diamond wire during the second cycle return stage provided in an embodiment of this application;

[0049] Figure 7 This is a schematic diagram of the structure of the wire laying area provided in an embodiment of this application;

[0050] Figure 8 A schematic flowchart of a cutting method provided in an embodiment of this application;

[0051] Figure 9 A schematic diagram of the travel stroke of the cable guide roller provided in an embodiment of this application;

[0052] Figure 10 A block diagram of a cutting apparatus provided in an embodiment of this application.

[0053] Figure label:

[0054] 1-Cutting equipment; 10-Cutting system; 101-Feeding area; 1011-Feeding roller; 1012-Wire feeding wheel; 1013-Tension wheel; 1014-Reversing wheel; 1015-Swing arm; 1016-Motor of the feeding roller; 1017-Motor of the tension wheel; 102-Cutting area; 1021-Main roller; 1022-Cutting wire mesh; 103-Take-up area; 1031-Take-up roller; 1032-Passing wheel; 20-Electrical control system; 30-Infeed system; 40-Hydraulic system; 2-Electrical equipment; 21-Bus; 22-Processor; 23-Memory. Detailed Implementation

[0055] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0056] Similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0057] Please refer to Figure 1 This application provides a cutting device 1, which may include a cutting system 10 and an electrical control system 20; the electrical control system 20 is electrically connected to the cutting system 10. The cutting system 10 is used to cut hard materials. The hard materials may be photovoltaic silicon rods, crystalline silicon, semiconductors, gemstones, magnetic materials, etc.

[0058] In some embodiments, the cutting device 1 may further include: a feed system 30 and a hydraulic system 40; the feed system 30 is electrically connected to the electronic control system 20 and is used to raise or lower the hard material during the cutting process, and to apply pressure to the hard material to force it into the cutting system 10. The hydraulic system 40 is electrically connected to the electronic control system 20 and is used to cool the cutting system 10 and to recycle waste liquid.

[0059] In this embodiment, the rigid material is taken as a photovoltaic silicon rod. The photovoltaic silicon rod is the main raw material of the solar panel. The silicon rod needs to be cut into silicon wafers by the cutting process of the cutting system 10.

[0060] For further details, please refer to Figure 2 The cutting system 10 includes: a wire feeding area 101, a cutting area 102, and a wire take-up area 103. The wire feeding area 101 includes: a wire feeding roller 1011, a wire guide roller 1012, a tension roller 1013, and a reversing roller 1014. The wire feeding roller 1011 is a roller for winding the cutting wire and is driven to rotate by a motor. The wire guide roller 1012 is a wire guide roller for guiding the cutting wire. A tension sensor is installed on the wire guide roller 1012 to detect the tension value on the cutting wire. It is also driven by a drive component to reciprocate along the main axis of the wire feeding roller 1011. The function of the wire guide roller 1012 is to guide the cutting wire out or into the wire guide roller and to move with the rotation of the wire guide roller, so that the entry and exit points of the cutting wire are perpendicular to the main axis of the wire feeding roller 1011. The tension roller 1013 is a wire guide roller used to adjust the tension of the cutting wire on the wire guide roller 1012. Typically, the number of tension rollers 1013 is ≥1. The reversing wheel 1014 is a thread wheel used for multi-directional rotation adjustment of the cutting wire.

[0061] The cutting wire is wound around the feed roller 1011 and then onto the upper guide roller 1012. The guide roller 1012 is installed between the feed roller 1011 and the tension roller 1013, and is used to guide the cutting wire on the feed roller 1011 at a certain pitch. The cutting wire is guided by the guide roller 1012 and wound onto the tension roller 1013. After being guided by the tension roller 1013, it is directed to the reversing roller 1014, and then rotated and guided into the cutting area 102 by the reversing roller 1014. In some other embodiments, the cutting wire can be directly guided into the cutting area 102 by the guide roller 1012 and the tension roller 1013. For example, the cutting wire can be diamond wire, which includes high-carbon steel wire and tungsten wire.

[0062] The cutting zone 102 includes at least two parallel main rollers 1021. Each main roller 1021 is a reel used to wind diamond wire to form a cutting wire mesh 1022. Typically, the number of main rollers 1021 is ≥2. The diamond wire is adjusted, transmitted, and guided from the pay-off zone 101 through the pay-off roller 1011, the wire feeding reel 1012, the tension reel 1013, and the reversing reel 1014 onto the main rollers 1021, and is repeatedly wound multiple times on the two parallel main rollers 1021. To prevent the diamond wire from deviating during winding on the main rollers 1021, multiple grooves are typically provided on the main rollers 1021 to accommodate the diamond wire and limit its position. After rewinding, a diamond wire cutting mesh 1022 for cutting is formed on the two main rollers 1021. The end of the diamond wire after winding on the main rollers 1021 then passes through the take-up zone 103.

[0063] The take-up zone 103 includes a take-up roller 1031 and multiple guide rollers 1032. The configuration of the take-up zone 103 can be the same as that of the unwinding zone 101. The take-up roller 1031 is a reel used to wind used diamond wire, and the tension roller and reversing roller can be collectively referred to as guide rollers 1032. The guide rollers 1032 are located between the main roller 1021 and the take-up roller 1031 to change the direction of the diamond wire so that the diamond wire can be smoothly wound onto the take-up roller 1031. Typically, the number of guide rollers 1032 is ≥1.

[0064] In the cutting system 10 of this embodiment, the cutting wire is wound around the feed roller 1011, the feed wheel 1012, the tension wheel 1013, and the reversing wheel 1014, and then wound multiple times around the main roller 1021 to form a cutting wire mesh 1022. Finally, it is wound around the take-up roller 1031 via the guide wheel 1032. According to the diamond wire cutting principle, when the cutting wires on all the wheels in the cutting system 10 are running at high speed, the feed system 30 controls the silicon rod to be lowered and applies pressure to press the silicon to be crystallized into the diamond wire cutting mesh 1022. The diamond wire is pressed into the bottom surface of the silicon to cut the silicon rod and form a silicon wafer.

[0065] Please refer to Figure 3The electronic device 2 includes at least one processor 22 and a memory 23, taking one processor 22 as an example. The processor 22 and the memory 23 are connected via a bus 21. The memory 23 stores instructions that can be executed by the processor 22. The instructions are executed by the processor 22 to enable the electronic device 2 to perform all or part of the silicon wafer dicing method described in the following embodiments. In one embodiment, the electronic device 2 may be the electrical control system 20 of the dicing equipment 1, or it may be another device independent of the dicing equipment 1. The electronic device 2 can control the dicing equipment.

[0066] The memory 23 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable red-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk or optical disk.

[0067] Please refer to Figure 4 Currently, the most common cutting method used by existing cutting equipment for silicon rods is reverse cutting. The changeover process for reverse cutting is as follows: Load the silicon rod to be processed → confirm the cutting zero point and silicon rod position using the tool feed system → adjust the cutting wire mesh → perform rewinding operation → warm up the machine → begin cutting. Specifically:

[0068] Before cutting: Perform the rewinding operation, that is, adopt a unidirectional wire running method to run the new diamond wire required for the next slicing task from the wire feeding roller 1011 of the wire feeding area 101 to the wire taking-up roller 1031 of the wire taking-up area 103 to complete the transfer of diamond wire. The wire feeding direction is wire feeding area 101 → cutting area 102 → wire taking-up area 103 throughout the rewinding process.

[0069] During cutting: Cutting employs a reciprocating, periodic wire feeding method, such as... Figure 4 As shown, the wire feeding direction is from the take-up area 103 → cutting area 102 → feeding area 101. During the cutting process, the diamond wire of the rewound wire is gradually fed back into the feeding area 101. The specific wire feeding method is as follows:

[0070] During the first pay-off phase of cycle 1, the diamond wire runs in the following direction: take-up roller 1031 → guide roller 1032 → main roller 1021 → reversing roller 1014 → tension roller 1013 → wire feeding roller 1012 → pay-off roller 1011. During the pay-off process in cycle 1, the diamond wire's linear velocity changes as follows: from initial V1 = 0 → unidirectional acceleration (gradually accelerating from take-up zone 103 to pay-off zone 101) → running at a constant speed V2 → unidirectional deceleration (gradually decelerating from take-up zone 103 to pay-off zone 101). A schematic diagram of the diamond wire's running velocity changes during the pay-off phase of cycle 1 is shown in Figure 5(a).

[0071] During the first cycle of the winding process, the diamond wire runs in the following direction: pay-off roller 1011 → wire feeding roller 1012 → tension roller 1013 → reversing roller 1014 → main roller 1021 → guide roller 1032 → take-up roller 1031. During the first cycle of the winding process, the diamond wire speed changes as follows: from initial V1 = 0 → unidirectional acceleration (gradually accelerating from pay-off zone 101 to take-up zone 103) → running at a constant speed V2 → unidirectional deceleration (gradually decelerating from pay-off zone 101 to take-up zone 103). A schematic diagram of the diamond wire speed change during the first cycle of the winding process is shown in Figure 5(b).

[0072] During the pay-off phase of cycle 2, the diamond wire runs in the following direction: take-up roller 1031 → guide roller 1032 → main roller 1021 → reversing roller 1014 → tension roller 1013 → wire feeding roller 1012 → pay-off roller 1011. During the pay-off process in cycle 2, the diamond wire's linear velocity changes as follows: from initial V1 = 0 → unidirectional acceleration (gradually accelerating from take-up zone 103 to pay-off zone 101) → running at a constant speed V2 → unidirectional deceleration (gradually decelerating from take-up zone 103 to pay-off zone 101). A schematic diagram of the diamond wire's running velocity changes during the pay-off phase of cycle 2 is shown in Figure 5(c).

[0073] During the second cycle of the winding process, the diamond wire runs in the following direction: pay-off roller 1011 → wire feeding roller 1012 → tension roller 1013 → reversing roller 1014 → main roller 1021 → guide roller 1032 → take-up roller 1031. During the second cycle, the diamond wire speed changes as follows: from initial V1 = 0 → unidirectional acceleration (gradually accelerating from pay-off zone 101 to take-up zone 103) → running at a constant speed V2 → unidirectional deceleration (gradually decelerating from pay-off zone 101 to take-up zone 103). A schematic diagram of the diamond wire speed change during the second cycle is shown in Figure 5(d).

[0074] Continue with the above four processes until the silicon wafer is cut.

[0075] This application provides a method for cutting silicon wafers, applicable to, for example... Figure 1The cutting equipment 1 shown contains an electrical control system 20. Unlike the reverse cutting method commonly used in existing cutting equipment for silicon rods, the cutting equipment 1 of this application adopts a forward cutting method. The forward cutting method production changeover process is as follows: load the silicon rod to be processed → confirm the cutting zero point and silicon rod position with the tool setting system → adjust the cutting wire mesh → warm up the machine → start cutting. Specifically, it is manifested as follows:

[0076] Before cutting: Compared to the reverse cutting method, the forward cutting method eliminates the rewinding operation.

[0077] During cutting: The cutting process uses a reciprocating periodic wire feeding method, which differs from the reverse cutting method in that the wire feeding direction in the forward cutting method is from the wire feeding area 101 → cutting area 102 → take-up area 103. During the cutting process, the new diamond wire on the wire feeding roller 1011 is gradually fed onto the take-up roller 1031. The specific wire feeding method is as follows:

[0078] In the first cycle of wire feeding, the wire is fed sequentially from the feeding zone 101 to the cutting zone 102 and then to the take-up zone 103. Specifically, the direction of the diamond wire's movement is as follows: feeding roller 1011 → wire feeding wheel 1012 → tension wheel 1013 → reversing wheel 1014 → main roller 1021 → guide wheel 1032 → take-up roller 1031. During the first cycle of wire feeding, the linear speed of the diamond wire is controlled to accelerate from a first speed to a second constant speed, and then decelerate from the second constant speed to a third speed to achieve cutting of hard materials. The first speed V1 = 0, the second constant speed is V2, and the third speed is V3. Therefore, the change in the linear speed of the diamond wire is as follows: from the initial first speed V1 = 0 → unidirectional acceleration (gradually accelerating from the feeding zone 101 to the take-up zone 103) → constant speed movement at the second speed V2 → unidirectional deceleration at the third speed V3 (gradually decelerating from the feeding zone 101 to the take-up zone 103). Figure 6(d) shows a schematic diagram of the change in the running speed of the diamond wire during the first cycle of wire laying.

[0079] In the first cycle of wire return, the wire is sequentially released from the take-up zone 103 to the cutting zone 102 and then to the release zone 101. Specifically, the wire running direction is as follows: take-up roller 1031 → guide roller 1032 → main roller 1021 → reversing roller 1014 → tension roller 1013 → wire feeding roller 1012 → release roller 1011. During the first cycle of wire return, the wire speed is controlled to accelerate from a first speed to a second constant speed, and then decelerate from the second constant speed to a third speed to achieve cutting of hard materials. In the first cycle of wire return, the first speed V1, the second constant speed V2, and the third speed V3 are the same as those in the first cycle of wire release. Therefore, the wire speed changes as follows: from the initial first speed V1 = 0 → unidirectional acceleration (gradually accelerating from the take-up zone 103 to the release zone 101) → constant speed running at the second speed V2 → unidirectional deceleration at the third speed V3 (gradually decelerating from the take-up zone 103 to the release zone 101). Figure 6(b) shows a schematic diagram of the running speed change of the diamond wire during the first cycle return phase.

[0080] In the second cycle of wire feeding, the wire is fed sequentially from the feeding zone 101 to the cutting zone 102 and then to the take-up zone 103. Specifically, the direction of the diamond wire's movement is as follows: feeding roller 1011 → wire feeding wheel 1012 → tension wheel 1013 → reversing wheel 1014 → main roller 1021 → guide wheel 1032 → take-up roller 1031. During the second cycle of wire feeding, the linear speed of the diamond wire is controlled to accelerate from a first speed to a second constant speed, and then decelerate from the second constant speed to a third speed to achieve cutting of hard materials. Similarly, the first speed V1 = 0, the second constant speed is V2, and the third speed is V3. Therefore, the change in the linear speed of the diamond wire is as follows: from the initial first speed V1 = 0 → unidirectional acceleration (gradually accelerating from the feeding zone 101 to the take-up zone 103) → constant speed V2 → unidirectional deceleration V3 (gradually decelerating from the feeding zone 101 to the take-up zone 103). Figure 6(c) shows a schematic diagram of the change in the running speed of the diamond wire during the second cycle of wire laying.

[0081] In the second cycle of wire return, the wire is sequentially released from the take-up zone 103 to the cutting zone 102 and then to the release zone 101. Specifically, the wire running direction is as follows: take-up roller 1031 → guide roller 1032 → main roller 1021 → reversing roller 1014 → tension roller 1013 → wire guide roller 1012 → release roller 1011. During the second cycle of wire return, the wire speed is controlled to accelerate from a first speed to a second constant speed, and then decelerate from the second constant speed to a third speed to achieve cutting of hard materials. Similarly, the first speed V1 = 0, the second constant speed is V2, and the third speed is V3. Therefore, the wire speed changes as follows: from the initial first speed V1 = 0 → unidirectional acceleration (gradually accelerating from the take-up zone 103 to the release zone 101) → running at a constant speed of the second speed V2 → unidirectional deceleration of the third speed V3 (gradually decelerating from the take-up zone 103 to the release zone 101). Figure 6(d) shows a schematic diagram of the change in the running speed of the diamond wire during the second cycle return phase.

[0082] Continue the above-described running process until the silicon wafer is cut.

[0083] Due to the different wire running methods of reverse cutting and forward cutting, the cutting method of this application adopts the forward cutting method, thus eliminating the rewinding operation in the reverse cutting method during production changeover. However, eliminating the rewinding operation will cause the diamond wire to be pulled at an angle during the unwinding process, and tension fluctuations due to the tension difference of the diamond wire, resulting in diamond wire breakage.

[0084] Please refer to Figure 7 The phenomenon of oblique pull during wire feeding specifically refers to the first section of diamond wire fed out from the wire feeding roller 1011, i.e. Figure 7 The section of diamond wire from the feed roller 1011 to the wire guide roller 1012 is tilted, deviating from the axial direction perpendicular to the feed roller 1011. One reason for this tilting problem is that the actual wire spacing on the feed roller 1011 does not match the theoretical wire spacing of the cutting system 10. If this tilting is not corrected in time, it will lead to abnormal wear of the diamond wire, making it prone to abnormal wire breakage during the cutting process.

[0085] It should be noted that the "perpendicular" mentioned in this application is a description of the state relationship between the spindle axis of the spool and the running direction of the diamond wire, and is not a perpendicular relationship as described in plane, space or geometric relationships.

[0086] To address the issue of angled wire laying caused by eliminating the rewinding operation, please refer to... Figure 8 The cutting method provided in this application may specifically include steps S610-S630.

[0087] Step S610: Obtain the original wiring spacing of the cutting system 10. The original wiring spacing is the default value of the wiring spacing preset before cutting.

[0088] Before the cutting system 10 performs the wire feeding and cutting, the user may not be able to determine the actual wire spacing. Therefore, a default wire spacing value is usually preset, which represents the original wire spacing. Typically, the default wire spacing value ranges from 0.1 to 0.3 mm. For example, in this step, the preset default wire spacing value is 0.3 mm. This default wire spacing value can be stored in the memory 23 and retrieved by the electronic control system 20.

[0089] Step S620: Calculate the actual wire spacing of the cutting system 10 based on the original wire spacing. The actual wire spacing represents the gap value of the cutting wires wound on the wire wheel in the cutting system 10.

[0090] In theory, if the actual wire spacing of the diamond wire on the wire feeding roller 1011 matches the original wire spacing of the cutting system 10, that is, there is no error between the two, then when the electronic control system 20 controls the cutting system 10 to feed the wire according to the original wire spacing, the actual wire spacing on the wire feeding roller 1011 should be consistent with the original wire spacing. When the electronic control system 20 controls the wire feeding roller 1011 to feed the wire, the diamond wire will not be pulled at an angle on the wire feeding roller 1011.

[0091] However, due to objective factors such as the material of the diamond wire, the rotation speed of the feed roller 1011, and the equipment parameters of the cutting system 10, there is a certain error between the actual wire spacing on the feed roller 1011 and the original wire spacing of the cutting system 10. During the feed process, if the original wire spacing of the cutting system 10 is not corrected in time to minimize the difference between the actual and original wire spacing, the error between the actual wire spacing on the feed roller 1011 and the original wire spacing of the cutting system 10 will gradually accumulate and increase as the diamond wire travels further, leading to a more severe skewness of the diamond wire. Therefore, in order to reduce the accumulated wire spacing parameter error during the cutting process, this embodiment of the application sets the actual wire spacing of the diamond wire wound on the wire reel in the cutting system 10 more accurately before the diamond wire is run.

[0092] The actual wiring spacing is usually stored in the aforementioned memory 23. Before the cutting system 10 starts cutting, the electronic control system 20 retrieves the calculated actual wiring spacing from the memory 23. After the electronic control system 20 obtains the actual wiring spacing, it controls the cutting system 10 to run the wires according to the actual wiring spacing.

[0093] It is understandable that the actual ribbon cable spacing stored in memory 23 is the actual ribbon cable spacing with the smallest error compared to the original ribbon cable spacing, obtained after calculation and correction of the original ribbon cable spacing.

[0094] Step S630: According to the actual wire spacing, control the cutting system 10 to cut the hard material according to the preset wire laying rules, wherein the preset wire laying rules are to reciprocate periodically from the wire laying area 101 to the cutting area 102 and then to the wire take-up area 103.

[0095] In this step, after the electronic control system 20 retrieves the actual wiring spacing, the electronic control system 20 controls the cutting system 10 to continuously perform reciprocating periodic wiring according to the first cycle wiring stage, the first cycle return wiring stage, the second cycle wiring stage, and the second cycle return wiring stage in the specific wiring pattern of the aforementioned positive tangent method, so as to calculate and correct the actual wiring spacing until the silicon wafer cutting is completed.

[0096] In steps S610-S630 above, based on the error between the actual wire spacing of the cutting wires on the feed roller 1011 and the original wire spacing of the cutting system 10, the processor 22 corrects and calculates the original wire spacing of the cutting system 10 to obtain the actual wire spacing of the cutting wires on the feed roller 1011. By correcting the original wire spacing, the error between the actual wire spacing and the original wire spacing is minimized. This actual wire spacing is stored in the memory 23. When the electronic control system 20 retrieves this actual wire spacing again, the electronic control system 20 controls the cutting system 10 to perform reciprocating periodic wire feeding according to this actual wire spacing. This effectively improves the slant pulling of the diamond wire during the cutting process and the tension fluctuation caused by the tension difference of the diamond wire, thus preventing wire breakage and improving cutting efficiency.

[0097] In some embodiments, step S620 may specifically include: steps S621-S622:

[0098] Step S621: Control the wire laying area 101 to lay the cutting line according to the original wire spacing, and calculate the diagonal pull amount of the cutting line after laying the preset length.

[0099] The original wire spacing value is retrieved by the electronic control system 20. The electronic control system 20 controls the wire feeding roller 1011 of the wire feeding area 101 to feed wire onto the wire feeding wheel 1012, tension wheel 1013, reversing wheel 1014, the two main rollers 1021 of the cutting area 102, the guide roller 1032 of the take-up area 103, and the take-up roller 1031 of the wire feeding area 101, according to the original wire spacing of 0.3mm. The servo stroke value can be read by the encoder installed in the motor 1016 of the wire feeding roller. This servo stroke value is equivalent to the running length of the diamond wire. For example, the preset length of diamond wire fed on the wire feeding roller 1011 of the wire feeding area 101 is x, which is generally x > 2km.

[0100] The slant pull here refers to the total slant pull of the diamond wire after the wire feeding roller 1011 in the wire feeding area 101, controlled by the electronic control system 20, feeds the wire feeding roller 1011 in the wire feeding area 101 to the wire feeding wheel 1012, tension wheel 1013, reversing wheel 1014, the two main rollers 1021 in the cutting area 102, the guide roller 1032 in the take-up area 103, and the take-up roller 1031 in the wire feeding area 101, with a length of x km.

[0101] In some embodiments, the specific steps for calculating the stay amount in step S621 may include steps S6211-S6214: Please refer to Figure 9 As shown.

[0102] Step S6211: Control the wire feeding roller 1011 to feed the preset length of cutting wire from the cutting area 102 to the take-up area 103 according to the original wire feeding spacing;

[0103] The electronic control system 20 retrieves the original wire spacing of 0.3m from the memory 23. The electronic control system 20 controls the wire feeding roller 1011 of the wire feeding area 101 to feed wire to the wire feeding wheel 1012, tension wheel 1013, reversing wheel 1014, two main rollers 1021 of the cutting area 102, the guide roller 1032 of the take-up area 103, and the take-up roller 1031 of the wire feeding area 101 in sequence according to the original wire spacing of 0.3mm. The encoder of the drive motor of the wire feeding wheel 1012 records the wire feeding length xkm of the wire feeding roller 1011.

[0104] Step S6212: After obtaining the cutting line of the preset length, the first stroke of the wire guide wheel 1012 moves;

[0105] The wire guide wheel 1012 can be driven by a drive unit to reciprocate along the main shaft direction of the wire feeding roller 1011. The servo stroke value of the wire guide wheel 1012 reciprocating along the main shaft direction of the wire feeding roller 1011 after the diamond wire is fed xkm is read by an encoder set on the drive unit and recorded as the first stroke P1.

[0106] It should be noted that the reason for the reciprocating movement of the wire guide roller 1012 along the main shaft of the wire feed roller 1011 is as follows: the diamond wire is wound around the wire feed roller 1011 from left to right along the length of the main shaft. After the first layer of diamond wire is wound around the main shaft of the wire feed roller 1011, the diamond wire continues to be wound in the opposite direction from right to left, and so on. When the electronic control system 20 controls the wire feed roller 1011 to feed the wire, following the unidirectional wire feeding method, after the diamond wire on the outermost side of the main shaft of the wire feed roller 1011 has finished running from left to right, it will continue to run the next layer of diamond wire from right to left. As the direction of wire feeding changes back and forth, the wire guide roller 1012 needs to change its movement direction accordingly to prevent the diamond wire from falling off the main shaft when it reaches the edge of the main shaft of the wire feed roller 1011. Therefore, regardless of whether the wire feeding wheel 1012 moves from left to right or from right to left, the servo stroke value read by the encoder on the drive unit is always the total stroke of the wire feeding wheel 1012 reciprocating along the main shaft direction of the wire feeding roller 1011.

[0107] Step S6213: Control the wire feeding wheel 1012 to move so that the cutting wire is perpendicular to the main shaft of the wire feeding roller 1011, and obtain the second stroke of the wire feeding wheel 1012;

[0108] In step S6212, after the pay-off roller 1011 pays off a diamond wire of a preset length x km, the amount of tension on the pay-off roller 1011 continuously accumulates, resulting in a situation where the diamond wire is not perpendicular to the pay-off roller 1011, such as... Figure 7 As shown. At this time, the wire guide wheel 1012 can be driven by the drive unit to move in the direction of the main shaft of the wire feed roller 1011, so that the cutting line on the wire guide wheel 1012 is perpendicular to the main shaft of the wire feed roller 1011. At this time, the encoder on the drive unit reads the total stroke of the wire guide wheel 1012 when it moves from the inclined state to the state perpendicular to the main shaft of the wire feed roller 1011, and records it as the second stroke P2.

[0109] Step S6214: Determine the diagonal pull amount of the cutting line after the preset length is released based on the first stroke and the second stroke.

[0110] It is understandable that in step S6213, the second stroke P2 includes two parts of the stroke: one part is the total stroke P1 of the wire feeding wheel 1012 reciprocating along the main axis of the wire feeding roller 1011 after the diamond wire has been fed x km in step S6212; the other part is the stroke moved by the wire feeding wheel in step S6212 when adjusting the diamond wire on the wire feeding roller 1011 from the inclined state to the state perpendicular to the main axis of the wire feeding roller 1011. This part of the stroke can be represented by ΔP. It can be seen that ΔP = P2 - P1. Therefore, ΔP can be represented as the total inclined amount of the diamond wire after the wire has been fed x km.

[0111] According to step S610, the original wire spacing of 0.3mm is obtained. According to step S6214, the diagonal pull amount P2-P1 of the diamond wire after the wire is laid out for xkm is obtained. Based on the correction calculation formula, the actual wire spacing after correction can be calculated as the actual wire spacing of the cutting system 10.

[0112] The correction calculation formula is shown in equation (1):

[0113]

[0114] 'a' represents the original cable spacing, which is 0.3mm by default.

[0115] D is the diameter of the pay-off roller 1011.

[0116] In the correction calculation formula (1), it is assumed that the pay-off roller 1011 is a standard circular roller, and the length of one turn of diamond wire wound on the pay-off roller 1011 should theoretically be the circumference of the pay-off roller 1011, i.e., πD. After paying off a diamond wire of a preset length x km, the number of turns of diamond wire wound on the pay-off roller 1011 can be calculated as follows: According to step S6214, the total diagonal pull of the diamond wire after a length of x km is P2-P1. This diagonal pull should include the wire wound on the pay-off roller 1011. The total diagonal pull of the diamond wire in each turn; therefore, the unit diagonal pull of the diamond wire per turn wound on the pay-off roller 1011 should be: Therefore, the actual wire spacing on the wire feeding roller 1011 should be [missing information].

[0117] Step S622: Determine the actual wiring spacing of the cutting system based on the original wiring spacing and diagonal pull amount.

[0118] In this step, the slant pull of the diamond wire wound on the single loop on the pay-off roller 1011 is corrected to the original wire spacing, thereby obtaining the corrected actual wire spacing, i.e., the actual wire spacing b of the cutting system 10. The actual wire spacing b is then stored in the memory 23 so that the power control system 20 can retrieve the actual wire spacing b. When the power control system 20 retrieves the actual wire spacing b value again, the power control system 20 controls the pay-off roller 1011 of the pay-off area 101 to pay off the wire in sequence according to the actual wire spacing b to the wire feeding wheel 1012, tension wheel 1013, reversing wheel 1014, the two main rollers 1021 of the cutting area 102, the guide wheel 1032 of the take-up area 103, and the take-up roller 1031 of the pay-off area 101. During the pay-off process, the slant of the diamond wire can be effectively improved.

[0119] It should be noted that the correction process can be handled by the processor 22. The correction calculation formula can be pre-input into the memory 23. The electronic control system 20 retrieves the correction calculation formula, and the processor 22 performs calculations based on the correction calculation formula. Finally, the actual wire spacing of the cutting system 10 is output and stored in the memory 23, and then retrieved by the electronic control system 20.

[0120] To further improve the oblique pull of the diamond wire during the cutting process, in some embodiments, the method further includes step S6210 before step S6211;

[0121] Step S6210: Control the wire feeding wheel 1012 to move so that the cutting line is perpendicular to the main shaft of the wire feeding roller 1011.

[0122] Before the wire feeding process, controlled by the electronic control system 20, the wire feeding roller 1011 feeds the wire sequentially to the wire feeding wheel 1012, tension wheel 1013, reversing wheel 1014, the two main rollers 1021 of the cutting area 102, the guide roller 1032 of the take-up area 103, and the take-up roller 1031 in the wire feeding area 1011 according to the original wire feeding spacing of 0.3mm. The wire feeding wheel 1012 can be driven by the drive component to move in the direction of the main axis of the wire feeding roller 1011 to adjust the state of the diamond wire. This ensures that the diamond wire is perpendicular to the main axis of the wire feeding roller 1011 without any oblique tension, so that there is no oblique tension accumulation of the diamond wire before feeding, thereby obtaining a more accurate actual wire feeding spacing of the cutting system 10.

[0123] In some embodiments, before step S6210, the method further includes step S62101: controlling the feed roller 1011 to feed the cutting wire so that all the cutting wires in the feed area 101, the cutting area 102, and the take-up area 103 are uncut new wires.

[0124] The wire on the feed roller 1011 can consist of two parts: new wire that has not been cut and old wire that has been cut and was retrieved from the previous running cycle. The tension of the new wire is the winding tension from the roller manufacturer, which is generally less than the cutting tension. After the old wire has been rewound by the cutting system 10, the wire arrangement characteristics of the diamond wire (such as the actual wire spacing and tension) will change. New wire that has not been rewound is used to supplement and correct the actual wire spacing. After correction, to ensure that the actual wire spacing of the cutting equipment 1 matches the original wire spacing of the diamond wire, and to reduce the cumulative error of the diamond wire's skewed pulling, the actual wire spacing b corrected in step S622 is used for continuous reciprocating cycle feeding during subsequent cutting processes.

[0125] Within the pay-off zone 101, during a new pay-off cycle, when the old line retrieved in the previous cycle is finished and the pay-off zone 101 begins to release new line, the tension on the new line and the old line changes abruptly, causing the tension wheel 1013 to swing significantly, resulting in tension fluctuations and problems such as abnormal line breakage.

[0126] The cutting system 10 of this application can realize the tension compensation function, thereby improving the tension fluctuation. Please continue to refer to Figure 5. The tension wheel 1013 is connected to one end of the swing arm 1015 and can be rotatably installed on the top of the swing arm 1015. The other end of the swing arm 1015 is connected to the power output end of the motor 1017 of the tension wheel. The motor 1017 of the tension wheel drives the swing arm 1015 to swing, thereby causing the tension wheel 1013 to generate displacement to adjust the cutting tension of the diamond wire guided on the tension wheel 1013 by the wire feeding roller 1011, ensuring that the entire diamond wire is stretched and tightened during operation.

[0127] During the pay-off cycle of the pay-off roller 1011, in order to ensure the stability of the rocker arm 1015 connected between the tension wheel 1013 and the motor 1017 of the tension wheel and prevent large-amplitude swings, the rotational speed of the motor driving the pay-off roller 1011 needs to match the cutting speed of the diamond wire in the cutting system 10, i.e., the motor speed of the pay-off roller 1011 = diamond wire speed / pay-off roller diameter. When the old wire retrieved in the previous cycle is finished on the pay-off roller 1011 in a new pay-off cycle and the new wire that has not yet participated in the cutting begins to be released, the sudden change in tension on the diamond wire between the old and new wires will cause the tension wheel 1013 to swing significantly, resulting in tension fluctuations and causing abnormal wire breakage.

[0128] To solve this problem, the speed of the motor of the pay-off roller 1011 is adjusted, thereby reducing the speed of the pay-off roller 1011. This reduces the tension of the diamond wire guided by the pay-off roller 1011 onto the tension wheel 1013, thereby reducing the swing amplitude of the swing arm 1015 and thus reducing the wire breakage rate on the pay-off roller 1011 side.

[0129] Therefore, the silicon wafer cutting method provided in this application further includes: steps S640-S660:

[0130] Step S640: Obtain the 1015 deflection angle of the pendulum.

[0131] Step S650: Determine the speed compensation value of the pay-off roller 1011 based on the deflection angle of the swing arm 1015.

[0132] Step S660: The speed compensation value is compensated to the speed loop control circuit of the wire feeding roller motor so that the tension fluctuation of the cutting wire is maintained within the preset range.

[0133] Normally, the tension of diamond wire is obtained by setting a tension sensor at the diamond wire. However, since the diamond wire is running at high speed when the cutting system 10 is working, the tension fluctuation or the stability of the tension sensor may affect the judgment of the new wire release time due to the acceleration, deceleration or high speed of the diamond wire. Therefore, the change of the deflection angle of the swing arm 1015 can be used to determine whether the tension changes abruptly.

[0134] In this step, the swing arm 1015 is driven to rotate by the motor 1017 of the tension wheel. An encoder is installed on the motor 1017 of the tension wheel, which records the deflection angle of the swing arm 1015. When the deflection angle of the swing arm 1015 increases, the tension difference of the diamond wire increases abruptly. Therefore, the change in the deflection angle of the swing arm 1015 is used to determine whether there is a fluctuation in the tension of the diamond wire. Because the diamond wire is in the transition phase between old and new wires, the tension of the diamond wire on the pay-off roller 1011, as well as the diamond wire on the adjacent wire feeding roller 1012, tension wheel 1013, and reversing wheel 1014, will fluctuate. This causes the tension wheel 1013 to swing, simultaneously causing a significant change in the deflection angle of the swing arm 1015.

[0135] The deflection angle θ of the pendulum 1015 refers to the angle between the current position and the initial position of the pendulum 1015, such as... Figure 7 In the diagram, the current position of the pendulum 1015 is when it deflects towards the cutting area 102; the initial position of the pendulum 1015 is when it has not deflected. The deflection angle θ is defined as positive when the pendulum 1015 swings towards the cutting area 102, and negative when it swings away from the cutting area 102.

[0136] The motor 1016 of the pay-off roller has the following characteristics: under a certain operating voltage, the output torque of the motor 1016 of the pay-off roller increases with the increase of load. For example, when the motor 1016 of the pay-off roller drives the pay-off roller 1011 to rotate, the diamond wire wound on the pay-off roller 1011 runs from the pay-off area 101 to the take-up area 103 in one direction. As the pitch of the diamond wire wound on the pay-off roller 1011 decreases, the wire guide wheel 1012 moves away from the cutting area 102 in order to keep the diamond wire perpendicular to the main shaft of the pay-off roller 1011. In order to keep the diamond wire taut during the cutting process, the tension wheel 1013's motor 1017 drives the swing arm 1015 to move away from the cutting area 102. The deflection angle of the swing arm 1015 is negative.

[0137] The higher the driving speed of the motor 1016 of the pay-off roller, the faster the diamond wire runs on the pay-off roller 1011, and the faster the moving speed of the guide roller 1012 needs to be. This results in a larger deflection angle of the swing arm 1015 on the tension roller 1013. To reduce the deflection angle of the swing arm 1015, the speed of the motor of the pay-off roller can be reduced (i.e., ΔV1 < 0), thus reducing the output torque of the motor 1016. Consequently, the motor speed of the pay-off roller slows down. As the rotation of the pay-off roller 1011 slows down, the movement of the guide roller 1012 also slows down, ensuring that the diamond wire inlet and outlet are perpendicular to the main axis of the pay-off roller 1011. This reduces the deflection angle of the swing arm 1015, and may even make the swing amplitude of the swing arm 1015 very small.

[0138] The change in the rotational speed of the motor 1016 of the wire feeding roller is used to compensate for the excessive swing amplitude of the swing arm 1015 caused by large tension fluctuations.

[0139] Furthermore, by compensating the obtained speed compensation value of the pay-off roller 1011 into the speed loop control circuit of the motor of the pay-off roller 1011, the tension fluctuation of the diamond wire is maintained within the preset range, so that the swing arm 1015 quickly returns to the center position, and the swing arm 1015 does not swing or swings only slightly, thereby reducing the tension fluctuation amplitude and time of the diamond wire, and thus reducing the wire breakage rate on the pay-off roller 1011 side.

[0140] In some embodiments, after step S660, the method further includes step S670: when the rotational speed of the motor of the wire feeding roller decreases to zero, canceling the compensation of the rotational speed compensation value in the speed loop control circuit of the motor of the wire feeding roller.

[0141] Understandably, when the speed of the motor of the pay-off roller 1011 decreases to zero, it is equivalent to the speed of the pay-off roller 1011 decreasing to zero. The pay-off roller 1011 has stopped running the wire, and the diamond wire no longer runs at high speed on the wire feeding wheel 1012, tension wheel 1013, and reversing wheel 1014. The swing arm 1015 can swing slightly, or the swing arm 1015 can stop swinging. Therefore, there is no need to compensate the speed of the pay-off roller 1011 into the speed loop control circuit of the pay-off roller motor.

[0142] In steps S640-S660, the change in the deflection angle of the pendulum 1015 is monitored to determine whether there is a sudden change in the tension of the diamond wire. The change in the deflection angle of the pendulum 1015 indicates that the diamond wire is currently in a switching phase between old and new wires. Therefore, in some embodiments, before step S640, the method further includes steps S6401-S6402:

[0143] Step S6401: Obtain the cycle wire feeding amount and wire storage amount of the cutting system 10;

[0144] Step S6402: Based on the periodic wire feeding amount and the wire storage amount, control the wire feeding from the wire feeding area 101 to the cutting area 102 and then to the wire take-up area 103 in sequence, and calculate and obtain the start and end wire feeding positions of the new cutting wire.

[0145] There are two ways to identify the stage of new wire feeding on the wire feeding roller 1011. In one embodiment, the starting and ending positions of new diamond wire feeding on the wire feeding roller 1011 are calculated by obtaining the wire feeding amount and the wire storage amount of the cutting process cycle of the cutting system 10.

[0146] The wire feeding amount in the cutting process cycle includes the wire feeding amount from the feeding area 101 to the cutting area 102 and then to the take-up area 103, and the wire feeding amount from the take-up area 103 to the cutting area 102 and then back to the feeding area 101. Assuming that in the previous first cycle return phase, the take-up amount on the feeding roller 1011 was 'a', and in the current second cycle feeding phase of the cutting process, the wire feeding amount from the feeding area 101 to the cutting area 102 and then to the take-up area 103 was 'b', and in the previous first cycle return phase, the wire feeding amount after the take-up cycle of the feeding roller 1011 was 'c', then when the wire storage amount on the feeding roller 1011 is 'ca', new wire feeding begins. The position where the wire storage amount on the feeding roller 1011 is 'ca' is recorded as the starting position for new diamond wire feeding; when the wire storage amount on the feeding roller 1011 is 'cab', it indicates the end of new wire feeding, and the position where the wire storage amount on the feeding roller 1011 is 'cab' is recorded as the ending position for new diamond wire feeding.

[0147] In another embodiment, the starting position for feeding new diamond wire is determined based on the deflection angle of the swing arm 1015. That is, the stage of feeding new wire onto the feed roller 1011, the wire feeding wheel 1012, and the tension wheel 1013 is confirmed by obtaining the swing angle of the swing arm 1015.

[0148] Specifically, when the deflection angle of the lever 1015 exceeds the preset threshold, the current line-laying position when the line is laid out sequentially from the line-laying area 101 to the cutting area 102 and then to the line-receiving area 103 is determined as the starting line-laying position of the new cutting line.

[0149] For example, the preset threshold is set to 0.5°. When the swing angle of the swing arm 1015 is detected to be ≥0.5°, the current wire feeding position during the sequential wire feeding from the wire feeding area 101 to the cutting area 102 and then to the take-up area 103 can be identified as the starting position for feeding a new diamond wire, which is the new wire feeding stage. Optionally, the swing angle of the swing arm 1015 can be detected by an angle sensor.

[0150] Based on the start and end positions of the new wire feeding line, the change in the deflection angle of the swing arm 1015 is detected by an angle sensor to determine the speed compensation value of the motor 1016 of the wire feeding roller. This speed compensation value is then applied to the speed loop control circuit of the motor 1016 of the wire feeding roller to adjust the swing amplitude of the swing arm. If the speed compensation value of the motor 1016 of the wire feeding roller is negative, this compensation value can be corrected based on the condition of the swing arm 1015 during the alternation of old and new wire in the previous cycle.

[0151] Therefore, through steps S6401-S6402, the start and end positions of the new diamond wire on the pay-off roller 1011 can be identified, thereby accurately identifying the stage of new wire feeding on the pay-off roller 1011. Furthermore, the deflection angle of the swing arm 1015 can be detected by an angle sensor; when the deflection angle of the swing arm 1015 exceeds a preset threshold, the new wire feeding stage is effectively identified.

[0152] In summary, the cutting method of this application, by calculating the wire spacing of the cutting system and controlling the cutting system to reciprocate periodically according to the actual wire spacing b, can effectively improve the oblique tension of the diamond wire during the cutting process.

[0153] Secondly, the cutting system 10 of this application has a certain tension compensation function. By adjusting the speed of the motor of the wire feeding roller, the swing amplitude of the tension swing arm is reduced, and the speed compensation value of the wire feeding roller 1011 is compensated to the speed loop control circuit of the motor of the wire feeding roller 1011, so that the tension fluctuation of the diamond wire is maintained within the preset range, and the swing arm 1015 quickly returns to the center position, reducing the tension fluctuation amplitude and time of the diamond wire, thereby reducing the wire breakage rate on the side of the wire feeding roller 1011.

[0154] Please refer to Figure 10 A block diagram of a cutting device provided in one embodiment of this application is shown. The cutting device includes: an acquisition module 710, a calculation module 720, and an execution module 730.

[0155] The acquisition module 710 is used to acquire the original wiring spacing of the cutting system. The original wiring spacing is the default value of the wiring spacing preset before cutting.

[0156] The calculation module 720 is used to calculate the actual wire spacing of the cutting system based on the original wire spacing. The actual wire spacing represents the gap value of the cutting wires wound on the wire wheel in the cutting system.

[0157] The execution module 730 is used to control the cutting system to cut hard materials according to the actual wire spacing and the preset wire laying rules. The preset wire laying rules are to reciprocate the wire laying from the wire laying area to the cutting area and then to the wire take-up area 103 in a cyclical manner.

[0158] The calculation module 720 may include: a first calculation unit and a second calculation unit.

[0159] The first calculation unit is used to control the laying area to lay out the cutting line according to the original laying spacing, and to calculate the diagonal pull of the cutting line after laying out the preset length.

[0160] The second calculation unit is used to determine the wire spacing of the cutting system based on the original wire spacing and the diagonal pull amount.

[0161] The first calculation unit is also used to control the wire feeding roller to feed the preset length of cutting wire sequentially from the cutting area to the take-up area according to the original wire feeding spacing.

[0162] The first calculation unit is also used to obtain the first stroke of the wire guide wheel after the preset length of the cutting line is placed.

[0163] The first calculation unit is also used to control the movement of the wire feeding wheel so that the cutting line is perpendicular to the main shaft of the wire feeding roller, and to obtain the second stroke of the wire feeding wheel movement.

[0164] The first calculation unit is also used for the first and second strokes to determine the diagonal pull of the cutting line after the preset length is placed.

[0165] The first calculation unit is also used to control the pay-off roller to pay off the cutting line so that all the cutting lines in the pay-off area, the cutting area and the take-up area are new, uncut lines.

[0166] The first calculation unit is also used to control the feeding roller to feed the cutting line so that all the cutting lines in the feeding area, cutting area and take-up area are new uncut lines.

[0167] The execution module 730 can also be used in the first cycle of wire feeding stage to control the wire feeding from the feeding area to the cutting area and then to the take-up area in sequence, and control the linear speed of the cutting wire to accelerate from the first speed to the second uniform speed, and then decelerate from the second uniform speed to the third speed, so as to achieve cutting of hard materials.

[0168] The execution module 730 can also be used in the first cycle return phase to control the wire to be released sequentially from the take-up area to the cutting area and then to the release area, and control the linear speed of the cutting wire to accelerate from the first speed to the second uniform speed, and then decelerate from the second uniform speed to the third speed, so as to achieve cutting of hard materials.

[0169] The execution module 730 can also be used in the second cycle wire feeding stage to control the wire feeding from the feeding area to the cutting area and then to the take-up area in sequence, and control the linear speed of the cutting wire to accelerate from the first speed to the second uniform speed, and then decelerate from the second uniform speed to the third speed, so as to achieve cutting of hard materials.

[0170] The execution module 730 can also be used in the second cycle return phase to control the wire to be released sequentially from the take-up area to the cutting area and then to the release area, and control the linear speed of the cutting wire to accelerate from the first speed to the second uniform speed, and then decelerate from the second uniform speed to the third speed, so as to achieve cutting of hard materials.

[0171] The cutting device may further include: a processing module 740, which is used to acquire the deflection angle of the swing arm; determine the speed compensation value of the feeding roller based on the deflection angle of the swing arm; and compensate the speed compensation value into the speed loop control circuit of the feeding roller motor so that the tension fluctuation of the cutting wire is maintained within a preset range.

[0172] The processing module 740 can also be used to obtain the periodic wire feeding amount and the wire storage amount of the cutting system; according to the periodic wire feeding amount and the wire storage amount, control the wire feeding from the feeding area to the cutting area and then to the take-up area in sequence, and calculate the start and end wire feeding positions of the new cutting wire.

[0173] The processing module 740 can also be used to determine the starting position for laying out a new cutting line based on the deflection angle of the lever.

[0174] The processing module 740 can also be used to determine the current line-laying position when the line is laid out sequentially from the line-laying area to the cutting area and then to the line-receiving area when the deflection angle of the swing arm exceeds a preset threshold, as the starting line-laying position of the new cutting line.

[0175] The processing module 740 can also be used to cancel the speed compensation value in the speed loop control circuit of the wire feeding roller motor when the speed of the motor of the wire feeding roller decreases to zero.

[0176] The specific implementation process of the functions and roles of each module in the above device is detailed in the implementation process of the corresponding steps mentioned above, and will not be repeated here.

[0177] This application also provides a computer-readable storage medium storing a computer program that can be executed by a processor to perform the cutting method provided in this application.

[0178] This application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the cutting method provided in this application.

[0179] The apparatuses and methods disclosed in the several embodiments provided in this application can also be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatuses, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code, which contains one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0180] In addition, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0181] If a function is implemented as a software module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application.

Claims

1. A cutting method, characterized in that, An electronic control system applied in a cutting device, the cutting device further comprising a cutting system, the cutting system including a wire feeding area, a cutting area, and a wire take-up area, the cutting method comprising: Obtain the original wiring spacing of the cutting system, wherein the original wiring spacing is the default value of the wiring spacing preset before cutting; Based on the original wire spacing, the actual wire spacing of the cutting system is calculated, and the actual wire spacing represents the gap value of the cutting wires wound on the wire reel in the cutting system. Based on the actual wire spacing, the cutting system is controlled to cut hard materials according to a preset wire laying rule, wherein the preset wire laying rule is to reciprocate periodically from the wire laying area to the cutting area and then to the wire take-up area.

2. The cutting method according to claim 1, characterized in that, The step of calculating the actual cable spacing of the cutting system based on the original cable spacing includes: The wire laying area is controlled to lay out the cutting line according to the original wire spacing, and the diagonal pull of the cutting line after laying out the preset length is calculated. The actual wire spacing of the cutting system is determined based on the original wire spacing and the diagonal pull amount.

3. The cutting method according to claim 2, characterized in that, The wire feeding area includes a wire feeding roller and a wire laying wheel, and the cutting wire is wound around the wire feeding roller and the wire laying wheel; controlling the wire feeding area to feed the cutting wire according to the original wire laying spacing, and calculating the diagonal pull of the cutting wire after feeding a preset length, includes: The wire feeding roller is controlled to feed the cutting wire of a preset length sequentially from the cutting area to the take-up area according to the original wire feeding spacing; After obtaining the cutting line of a preset length, the wire guide wheel moves for the first stroke; Control the movement of the wire feeding wheel to make the cutting line perpendicular to the main shaft of the wire feeding roller, and obtain the second stroke of the wire feeding wheel movement; Based on the first stroke and the second stroke, determine the diagonal pull amount of the cutting line after the preset length is released.

4. The cutting method according to claim 3, characterized in that, Before controlling the feed roller to feed the cutting wire of a preset length sequentially from the cutting area to the take-up area according to the original wire spacing, the method further includes: Control the movement of the wire feeding wheel so that the cutting line is perpendicular to the main shaft of the wire feeding roller.

5. The cutting method according to claim 4, characterized in that, Before controlling the movement of the wire feeding wheel to make the cutting wire perpendicular to the main shaft of the wire feeding roller, the method further includes: The wire feeding roller is controlled to feed the cutting wire so that all the cutting wires in the wire feeding area, the cutting area, and the take-up area are new, uncut wires.

6. The cutting method according to claim 3, characterized in that, The wire feeding area further includes: a tension wheel, which is used to adjust the tension of the cutting wire on the wire feeding wheel, and a rocker arm is connected to the tension wheel; the method further includes: Obtain the deflection angle of the swing arm; The rotational speed compensation value of the wire feeding roller is determined based on the deflection angle of the swing arm. The speed compensation value is applied to the speed loop control circuit of the motor of the wire feeding roller to keep the tension fluctuation of the cutting wire within a preset range.

7. The cutting method according to claim 6, characterized in that, Before obtaining the deflection angle of the pendulum, the method further includes: Obtain the periodic wire feeding amount and wire storage amount of the cutting system; Based on the periodic wire feeding amount and the wire storage amount, the wire is fed sequentially from the feeding area to the cutting area and then to the take-up area, and the start and end positions of the new cutting wire are calculated.

8. The cutting method according to claim 6, characterized in that, After obtaining the deflection angle of the pendulum, the method further includes: The starting position for laying out the new cutting line is determined based on the deflection angle of the swing arm.

9. The cutting method according to claim 8, characterized in that, The step of determining the starting position for laying out the new cutting line based on the deflection angle of the swing arm includes: When the deflection angle of the swing arm exceeds a preset threshold, the current line-laying position when the line is laid sequentially from the line-laying area to the cutting area and then to the line-retrieving area is determined as the starting line-laying position of the new cutting line.

10. The cutting method according to claim 6, characterized in that, After the rotational speed compensation value is compensated into the speed loop control circuit of the motor of the wire feeding roller to maintain the tension fluctuation of the cutting wire within a preset range, the method further includes: When the speed of the motor of the wire feeding roller decreases to zero, the compensation of the speed compensation value in the speed loop control circuit of the motor of the wire feeding roller is cancelled.

11. The cutting method according to any one of claims 1-6, characterized in that, The reciprocating periodic wire feeding includes: a first period of wire feeding, a first period of wire return, a second period of wire feeding, and a second period of wire return; controlling the cutting system to cut hard materials according to preset wire feeding rules includes: During the first cycle of wire feeding, the wire is fed sequentially from the feeding area to the cutting area and then to the take-up area. The linear speed of the cutting wire is controlled to accelerate from a first speed to a second constant speed and then decelerate from the second constant speed to a third speed to achieve cutting of hard materials. During the first cycle return phase, the wire is sequentially released from the take-up area to the cutting area and then to the release area. The linear speed of the cutting wire is controlled to accelerate from the first speed to the second uniform speed, and then decelerate from the second uniform speed to the third speed, so as to achieve cutting of hard materials. In the second cycle of wire feeding stage, the wire is fed sequentially from the feeding area to the cutting area and then to the take-up area, and the linear speed of the cutting wire is controlled to accelerate from the first speed to the second uniform speed, and then decelerate from the second uniform speed to the third speed, so as to achieve cutting of hard materials. During the second cycle return phase, the wire is sequentially released from the take-up area to the cutting area and then to the release area. The linear speed of the cutting wire is controlled to accelerate from the first speed to the second uniform speed, and then decelerate from the second uniform speed to the third speed, so as to achieve cutting of hard materials.

12. A cutting device, characterized in that, include: A cutting system for cutting hard materials; An electronic control system is electrically connected to the cutting system, the electronic control system being used to perform the cutting method according to any one of claims 1 to 11.

13. The cutting device according to claim 12, characterized in that, The cutting equipment also includes: The feed system is electrically connected to the electronic control system, and the feed system is used to apply pressure to hard materials to press them into the cutting system; The hydraulic system is electrically connected to the electronic control system and is used to cool the cutting system and recycle waste liquid.

14. A cutting device, characterized in that, include: The acquisition module is used to acquire the wire spacing of the cutting system, wherein the wire spacing represents the gap value of the cutting wires wound on the wire reel in the cutting system; The execution module is used to control the cutting system to cut hard materials according to a preset wire laying rule based on the wire spacing, wherein the preset wire laying rule is to reciprocate periodically from the wire laying area to the cutting area and then to the wire take-up area.

15. An electronic device, characterized in that, The electronic device includes: processor; Memory used to store processor-executable instructions; The processor is configured to perform the cutting method according to any one of claims 1 to 11.

16. A computer-readable storage medium, characterized in that, The storage medium stores a computer program, which, when executed by a processor, performs the cutting method according to any one of claims 1 to 11.

17. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements the cutting method according to any one of claims 1 to 11.

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