Low-viscosity high-toughness semi-hyperbranched acrylate resin as well as preparation method and application thereof

Abstract

The invention relates to the technical field of photocuring materials, in particular to low-viscosity high-toughness semi-hyperbranched acrylate resin as well as a preparation method and application thereof, and belongs to the technical field. The preparation method of the low-viscosity high-toughness semi-hyperbranched acrylate resin comprises the following steps: S1, carrying out esterification reaction on trimellitic anhydride and polyethylene glycol to enable an anhydride group to react with a terminal hydroxyl group in the polyethylene glycol, and grafting the polyethylene glycol to a benzene ring group; s2, continuously performing esterification reaction on the product in the step S1 and trimellitic anhydride to obtain a six-functional carboxyl compound; and S3, carrying out nucleophilic catalytic esterification reaction on the product obtained in the step S2 and glycidyl acrylate to obtain a target product of the viscosity high-toughness semi-hyperbranched acrylate resin. The semi-hyperbranched acrylate resin has the advantages that the viscosity is low, the flexibility can be regulated and controlled, and the surface of a cured product is dry and comfortable, and has a very good application effect in a photocuring adhesive.

Description

Technical Field

[0001] This invention relates to a low-viscosity, high-toughness semi-hyperbranched acrylate resin, its preparation method, and its application, belonging to the field of photocurable materials technology. Background Technology

[0002] Acrylic UV-curable adhesives, often referred to as UV-curable adhesives or shadowless adhesives, are a type of one-component adhesive that polymerizes under ultraviolet (UV) or visible light irradiation, transforming from a liquid to a solid state within a short time to achieve bonding, sealing, or fixing. Acrylic UV-curable adhesives are suitable for bonding glass, plastics, or metals. They offer numerous advantages, including good transparency of the cured product, fast curing speed, suitability for automated production lines, and high productivity, making them widely used in the electronics and electrical appliance industries. For example, patent application CN115685677A discloses an integrated black photoresist for automotive applications and its preparation method; patent application CN109355003A discloses a surface treatment process for hardware bottle caps; and patent application CN105239069A discloses a surface treatment process for automotive wheel hubs. These disclosed technologies all utilize acrylic UV-curable adhesives.

[0003] Currently, there are many patent applications related to acrylic photocurable adhesives. For example, patent applications with publication numbers CN119119419A, CN117304856A, CN112126401A, and CN118360023A all disclose technical solutions related to acrylic photocurable adhesives.

[0004] However, acrylic light-curing adhesives also have their unavoidable drawbacks, such as poor surface drying due to oxygen inhibition after curing, and poor flexibility of the cured adhesive layer. Summary of the Invention

[0005] This invention addresses the shortcomings of existing technologies by providing a low-viscosity, high-toughness semi-hyperbranched acrylate resin, its preparation method, and its applications. The semi-hyperbranched acrylate resin prepared by this invention has the advantages of low viscosity, adjustable flexibility, and a dry cured surface, and can be applied to photocurable adhesives, solving current industry pain points.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a low-viscosity, high-toughness semi-hyperbranched acrylate resin, wherein the structural formula of the semi-hyperbranched acrylate resin is as follows: ; Where n is 1-10; The structure of M is * indicates a connection point.

[0007] This invention also discloses a method for preparing a low-viscosity, high-toughness semi-hyperbranched acrylate resin, wherein the preparation method is as follows: S1. Trimeric triglyceride is esterified with polyethylene glycol, so that the anhydride group reacts with a terminal hydroxyl group in polyethylene glycol, and polyethylene glycol is grafted onto the benzene ring group. S2. The product of step S1 is further esterified with trimellitic anhydride to obtain a hexafunctional carboxylic compound. S3. The product of step S2 is subjected to a nucleophilic catalytic esterification reaction with glycidyl acrylate to obtain the target product of the high viscosity and toughness semi-hyperbranched acrylate resin.

[0008] Furthermore, in step S1, the molar ratio of trimellitic anhydride to polyethylene glycol is 1:(1-1.2). The reaction temperature in step S1 is 100℃-120℃, and the reaction time is 2-4h.

[0009] Furthermore, in step S2, the molar ratio of the product from step S1 to trimellitic anhydride is 1:(3-3.3). The reaction temperature in step S2 is 100℃-140℃, and the reaction time is 2-4h.

[0010] Furthermore, in step S2, the solvent used is N,N-dimethylformamide, and 2%-5% xylene by mass of the solvent is added to the system, along with p-toluenesulfonic acid as a catalyst.

[0011] Furthermore, in step S3, the molar ratio of the product from step S2 to glycidyl acrylate is 1:(6-6.8). The reaction temperature in step S3 is 80℃-110℃, and the reaction time is 3-6h.

[0012] Furthermore, in step S3, a catalyst and a free radical polymerization inhibitor are added to the reaction system; The catalyst is at least one of triphenylphosphine, tetramethylammonium bromide, and triethylamine; The free radical polymerization inhibitor is at least one of hydroquinone, p-hydroxyanisole, and p-benzoquinone.

[0013] Furthermore, in step S3, the amount of catalyst added is 0.1%-0.5% of the total mass of the product from step S2 and glycidyl acrylate; The amount of the free radical polymerization inhibitor added is 0.001%-0.01% of the total mass of the product of step S2 and glycidyl acrylate.

[0014] Furthermore, the solvent used in the reaction system in steps S1 to S2 is N,N-dimethylformamide.

[0015] The present invention also discloses the application of a low-viscosity, high-toughness semi-hyperbranched acrylate resin, wherein the semi-hyperbranched acrylate resin is used in a light-curing adhesive.

[0016] The beneficial effects of this invention are: The semi-hyperbranched acrylate resin described in this invention not only improves the toughness of acrylate UV-cured adhesives after curing, but also improves surface drying performance. UV-cured products prepared using this invention exhibit good surface drying without stickiness, a storage modulus below 1000 MPa at room temperature (25°C), and a Tg point above 100°C.

[0017] More specifically, the present invention synthesizes a high-molecular-weight semi-hyperbranched acrylate resin through a three-step method. The main characteristics of the semi-hyperbranched acrylate resin are: each branch of the molecule contains six highly reactive double bonds; the semi-hyperbranched acrylate resin can be cured by free radical initiation; the structure of the semi-hyperbranched acrylate resin has high functionality and the length of the branch chains is adjustable, which makes the semi-hyperbranched acrylate resin have the advantages of low viscosity, adjustable flexibility, and dry surface of cured product. Detailed Implementation

[0018] The specific embodiments of the present invention will be described in detail below. The present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used is for describing particular embodiments only and is not intended to limit the invention.

[0020] A low-viscosity, high-toughness semi-hyperbranched acrylate resin, wherein the structural formula of the semi-hyperbranched acrylate resin is as follows: ; Where n is 1-10; The structure of M is * indicates a connection point.

[0021] Preferably, n is 2, 3 or 4.

[0022] A method for preparing a low-viscosity, high-toughness semi-hyperbranched acrylate resin, wherein the preparation method comprises: S1. Trimeric triglyceride is esterified with polyethylene glycol, so that the anhydride group reacts with a terminal hydroxyl group in polyethylene glycol, and polyethylene glycol is grafted onto the benzene ring group. S2. The product of step S1 is further esterified with trimellitic anhydride to obtain a hexafunctional carboxylic compound. S3. The product of step S2 is subjected to a nucleophilic catalytic esterification reaction with glycidyl acrylate to obtain the target product of the high viscosity and toughness semi-hyperbranched acrylate resin.

[0023] Specifically, in step S1, the molar ratio of trimellitic anhydride to polyethylene glycol is 1:(1-1.2). The reaction temperature in step S1 is 100℃-120℃, the reaction time is 2-4h, and the solvent used in the reaction is N,N-dimethylformamide.

[0024] After the reaction in step S1 is completed, the solvent is removed by vacuum distillation, the separated product is washed with deionized water and dried for later use.

[0025] Specifically, in step S2, the molar ratio of the product from step S1 to trimellitic anhydride is 1:(3-3.3). The reaction temperature in step S2 is 100℃-140℃, and the reaction time is 2-4h. After the reaction is completed, the solvent is removed by vacuum distillation to obtain the hexafunctional carboxyl compound.

[0026] Specifically, in step S2, the solvent used is N,N-dimethylformamide, and 2%-5% xylene (by mass of the solvent) is added to the system, along with p-toluenesulfonic acid as a catalyst. The amount of p-toluenesulfonic acid added is 0.1%-0.5% of the total mass of the product from step S1 and trimellitic anhydride. The main function of adding xylene and p-toluenesulfonic acid is to improve reaction efficiency. P-toluenesulfonic acid can catalyze the esterification reaction, while the addition of xylene helps to condense and reflux the product water, thus facilitating the forward reaction. In this embodiment of the invention, p-xylene is used.

[0027] Specifically, in step S3, the molar ratio of the product from step S2 to glycidyl acrylate is 1:(6-6.8). The reaction temperature in step S3 is 80℃-110℃, and the reaction time is 3-6 hours. After the reaction, the solvent is removed by vacuum distillation to obtain the final low-viscosity, high-toughness semi-hyperbranched acrylate resin target product.

[0028] Specifically, in step S3, a catalyst and a free radical polymerization inhibitor are added to the reaction system; The catalyst is at least one of triphenylphosphine, tetramethylammonium bromide, and triethylamine; The free radical polymerization inhibitor is at least one of hydroquinone, p-hydroxyanisole, and p-benzoquinone.

[0029] Specifically, in step S3, the amount of catalyst added is 0.1%-0.5% of the total mass of the product from step S2 and glycidyl acrylate; The amount of the free radical polymerization inhibitor added is 0.001%-0.01% of the total mass of the product from step S2 and glycidyl acrylate. The purpose of adding the polymerization inhibitor is to protect the double bonds in the glycidyl acrylate and prevent self-polymerization.

[0030] Specifically, the solvent used in the reaction system in steps S1 to S2 is N,N-dimethylformamide.

[0031] Application of a low-viscosity, high-toughness semi-hyperbranched acrylate resin, wherein the semi-hyperbranched acrylate resin is used in a light-curing adhesive.

[0032] More specifically, the photocurable adhesive includes semi-hyperbranched acrylate resin, isooctyl acrylate, isobornyl acrylate, fumed silica, photoinitiator, antioxidant, and p-hydroxyphenyl ether. Example

[0033] The preparation of a low-viscosity, high-toughness semi-hyperbranched acrylate resin (when n=2) includes the following steps: S1. Add 96g trimellitic anhydride, 60g diethylene glycol, and 250g N,N-dimethylformamide to a three-necked flask equipped with a stirrer, thermometer, and reflux condenser. Start stirring and, after the trimellitic anhydride has completely dissolved, gradually raise the temperature to 115℃ and react for 2.5h. After the reaction, remove the solvent by vacuum distillation, then wash the separated product with deionized water and dry it for later use.

[0034] S2. Take 142g of the product from step S1 and 28g of trimellitic anhydride, and add them sequentially to a three-necked flask equipped with a stirrer, thermometer and reflux condenser. Add 250g of N,N-dimethylformamide, 0.5g of p-toluenesulfonic acid and 6g of xylene. After all the materials are dissolved, gradually raise the temperature to 130℃ and react for 3 hours. After the reaction, remove the solvent by vacuum distillation to obtain the hexafunctional carboxyl compound.

[0035] S3. Take 32g of the product from step S2 and 80g of glycidyl acrylate, and add them sequentially to a three-necked flask equipped with a stirrer, thermometer and reflux condenser. Add 250g of N,N-dimethylformamide, 0.4g of triphenylphosphine and 0.01g of hydroquinone. After all the materials are dissolved, gradually raise the temperature to 90℃ and react for 3 hours. After the reaction, remove the solvent by vacuum distillation to obtain the final low-viscosity, high-toughness semi-hyperbranched acrylate resin product. Example

[0036] The preparation of a low-viscosity, high-toughness semi-hyperbranched acrylate resin (when n=3) includes the following steps: S1. Add 96g trimellitic anhydride, 75g triethylene glycol, and 250g N,N-dimethylformamide to a three-necked flask equipped with a stirrer, thermometer, and reflux condenser. Start stirring and, after the trimellitic anhydride has completely dissolved, gradually raise the temperature to 115℃ and react for 2.5h. After the reaction, remove the solvent by vacuum distillation, wash the separated product with deionized water, and dry it for later use.

[0037] S2. Take 158g of the product from step S1 and 28g of trimellitic anhydride, and add them sequentially to a three-necked flask equipped with a stirrer, thermometer and reflux condenser. Add 250g of N,N-dimethylformamide, 0.5g of p-toluenesulfonic acid and 5g of xylene. After all the materials are dissolved, gradually raise the temperature to 130℃ and react for 3 hours. After the reaction, remove the solvent by vacuum distillation to obtain the hexafunctional carboxyl compound.

[0038] S3. Take 36g of the product from step S2 and 83g of glycidyl acrylate, and add them sequentially to a three-necked flask equipped with a stirrer, thermometer, and reflux condenser. Add 250g of N,N-dimethylformamide, 0.45g of triphenylphosphine, and 0.012g of p-hydroxyanisole. After all the materials are dissolved, gradually raise the temperature to 95℃ and react for 3 hours. After the reaction, remove the solvent by vacuum distillation to obtain the final low-viscosity, high-toughness, semi-hyperbranched acrylate resin product. Example

[0039] The preparation of a low-viscosity, high-toughness semi-hyperbranched acrylate resin (when n=4) includes the following steps: S1. Add 96g trimellitic anhydride, 95g tetraethylene glycol, and 250g N,N-dimethylformamide to a three-necked flask equipped with a stirrer, thermometer, and reflux condenser. Start stirring and, after the trimellitic anhydride has completely dissolved, gradually raise the temperature to 115℃ and react for 2.5h. After the reaction, remove the solvent by vacuum distillation, then wash the separated product with deionized water and dry it for later use.

[0040] S2. Take 185g of the product from step S1 and 28g of trimellitic anhydride, and add them sequentially to a three-necked flask equipped with a stirrer, thermometer and reflux condenser. Add 250g of N,N-dimethylformamide, 0.5g of p-toluenesulfonic acid and 5g of xylene. After all the materials are dissolved, gradually raise the temperature to 130℃ and react for 3 hours. After the reaction, remove the solvent by vacuum distillation to obtain the hexafunctional carboxyl compound.

[0041] S3. Take 42g of the product from step S2 and 85g of glycidyl acrylate, and add them sequentially to a three-necked flask equipped with a stirrer, thermometer, and reflux condenser. Add 250g of N,N-dimethylformamide, 0.3g of triphenylphosphine, 0.25g of tetramethylammonium bromide, and 0.012g of p-benzoquinone. After all the materials are dissolved, gradually raise the temperature to 100℃ and react for 3 hours. After the reaction, remove the solvent by vacuum distillation to obtain the final low-viscosity, high-toughness semi-hyperbranched acrylate resin product. Example

[0042] The preparation of a low-viscosity, high-toughness semi-hyperbranched acrylate resin (when n=2) includes the following steps: S1. Add 96g trimellitic anhydride, 63g diethylene glycol, and 250g N,N-dimethylformamide to a three-necked flask equipped with a stirrer, thermometer, and reflux condenser. Start stirring and gradually raise the temperature to 120℃ after the trimellitic anhydride has completely dissolved. React for 2 hours. After the reaction, remove the solvent by vacuum distillation, wash the separated product with deionized water, and dry it for later use.

[0043] S2. Take 142g of the product from step S1 and 28g of trimellitic anhydride, and add them sequentially to a three-necked flask equipped with a stirrer, thermometer, and reflux condenser. Add 250g of N,N-dimethylformamide, 0.85g of p-toluenesulfonic acid, and 12.5g of xylene. After all the materials have dissolved, gradually raise the temperature to 140℃ and react for 2 hours. After the reaction, remove the solvent by vacuum distillation to obtain the hexafunctional carboxyl compound.

[0044] S3. Take 32g of the product from step S2 and 80g of glycidyl acrylate, and add them sequentially to a three-necked flask equipped with a stirrer, thermometer and reflux condenser. Add 250g of N,N-dimethylformamide, 0.56g of tetramethylammonium bromide and 0.005g of p-hydroxyanisole. After all the materials are dissolved, gradually raise the temperature to 80℃ and react for 6 hours. After the reaction, remove the solvent by vacuum distillation to obtain the final low-viscosity, high-toughness semi-hyperbranched acrylate resin product. Example

[0045] The preparation of a low-viscosity, high-toughness semi-hyperbranched acrylate resin (when n=3) includes the following steps: S1. Add 96g trimellitic anhydride, 90g triethylene glycol, and 250g N,N-dimethylformamide to a three-necked flask equipped with a stirrer, thermometer, and reflux condenser. Start stirring and gradually raise the temperature to 110℃ after the trimellitic anhydride has completely dissolved. React for 4 hours. After the reaction, remove the solvent by vacuum distillation, wash the separated product with deionized water, and dry it for later use.

[0046] S2. Take 158g of the product from step S1 and 28g of trimellitic anhydride, and add them sequentially to a three-necked flask equipped with a stirrer, thermometer and reflux condenser. Add 250g of N,N-dimethylformamide, 0.19g of p-toluenesulfonic acid and 7.5g of xylene. After all the materials are dissolved, gradually raise the temperature to 100℃ and react for 4 hours. After the reaction, remove the solvent by vacuum distillation to obtain the hexafunctional carboxyl compound.

[0047] S3. Take 42g of the product from step S2 and 85g of glycidyl acrylate, and add them sequentially to a three-necked flask equipped with a stirrer, thermometer, and reflux condenser. Add 250g of N,N-dimethylformamide, 0.1g of triethylamine, 0.03g of tetramethylammonium bromide, and 0.003g of p-benzoquinone. After all the materials are dissolved, gradually raise the temperature to 110℃ and react for 3 hours. After the reaction, remove the solvent by vacuum distillation to obtain the final low-viscosity, high-toughness semi-hyperbranched acrylate resin product.

[0048] The light-curing adhesive was formulated according to the composition shown in Table 1 below, and its application performance was tested. The acrylic resin in Table 1 is the semi-hyperbranched acrylate resin obtained in the above examples or other conventional acrylic resins.

[0049] In the examples 1-5, the semi-hyperbranched acrylate resins prepared in the above examples 1-5 were used respectively, while in the comparative example 1, a commercially available conventional acrylate resin (specifically, the CN704 acrylate resin produced by Sartoma) was used. Comparative Example 2 uses allyloxymethacrylate, with the following specific structural formula: .

[0050] Table 1. Composition of UV-curable adhesive formulations Raw material name Amount to be added (parts by weight) Acrylic resin 40 copies Isooctyl acrylate 15 copies Isoborneol acrylate 38.95 copies AEROSIL200 fumed silica 1.5 copies Photoinitiator TMO 1.5 copies Omnirad 651 3 copies p-Hydroxyphenyl ether 0.05 copies In the verification application example, the performance test results of the light-curing adhesive are shown in Table 2 below, and the test methods involved are as follows.

[0051] (1) Viscosity test conditions: Hacker RV viscometer C35 / 2 rotor speed 20 rpm, test temperature 25℃.

[0052] (2) Test for surface dryness of cured material: A 365nm wavelength LED light source (2000mW / cm²) was selected. 2Expose to light for 5 seconds. After 2 minutes, check the surface curing. Use a cotton ball with a diameter of about 1 cm to drop freely from a height of 30 cm onto the coating surface. Blow compressed air (pressure 0.2 MPa) at a 45° angle from a distance of 15 cm. If the cotton ball can be blown away and there are fewer than 5 cotton fibers remaining, it is considered dry; if there are 5 to 20 cotton fibers remaining (inclusive), it is considered to be surface dry and sticky; if there are more than 20 cotton fibers remaining, it is considered to be surface dry and sticky.

[0053] (3) Modulus test: The modulus test was performed using the DMA-Q800 equipment from TA Instruments in the United States. A 365nm wavelength LED light source was selected to fully cure the sample. The sample size was: length * width * thickness = 15 * 4 * 0.5 (mm).

[0054] Table 2 Performance test results of UV-curable adhesives Acrylic resin source Viscosity test (mPa.s) Surface dryness of cured material Modulus at 25℃ (MPa) Application Example 1 Example 1 2750 good 1150 Application Example 2 Example 2 2930 dry 980 Application Example 3 Example 3 3120 dry 860 Application Example 4 Example 4 2780 dry 1120 Application Example 5 Example 5 3010 dry 960 Comparative Example 1 Ordinary acrylic resin 5570 sticky 2720 Comparative Example 2 allyloxymethacrylate 4870 sticky 2350 As can be seen from the data in Table 2 above, the photocurable adhesives prepared using the low-viscosity, high-toughness semi-hyperbranched acrylate resin described in Application Examples 1-5 have the characteristics of low viscosity, low modulus, and good flexibility. Furthermore, the cured products exhibit good surface drying and do not become sticky. They can be widely used in the electronics assembly industry.

[0055] The low-viscosity, high-toughness, semi-hyperbranched acrylate resin described in this invention exhibits significantly better performance in UV-curable adhesives than conventional acrylate resins available on the market.

[0056] Furthermore, the low-viscosity, high-toughness semi-hyperbranched acrylate resin described in this invention exhibits significantly better performance in UV-curable adhesives than allyloxymethacrylate. In the structure of the semi-hyperbranched acrylate resin described in this invention, each branch contains six highly reactive double bonds. This semi-hyperbranched acrylate resin can be cured via free radical initiation. Because the length of the branches is adjustable, the flexibility of the semi-hyperbranched acrylate resin can be controlled.

[0057] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are exhaustively listed. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] For those skilled in the art, various modifications and improvements can be made without departing from the concept of the present invention, and these modifications and improvements are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the appended claims.

Claims

1. A low-viscosity, high-toughness semi-hyperbranched acrylate resin, characterized in that, The structural formula of the semi-hyperbranched acrylate resin is as follows: ； Where n is 1-10; The structure of M is * indicates a connection point.

2. A method for preparing a low-viscosity, high-toughness semi-hyperbranched acrylate resin according to claim 1, characterized in that, The preparation method is as follows: S1. Trimeric triglyceride is esterified with polyethylene glycol, so that the anhydride group reacts with a terminal hydroxyl group in polyethylene glycol, and polyethylene glycol is grafted onto the benzene ring group. S2. The product of step S1 is further esterified with trimellitic anhydride to obtain a hexafunctional carboxylic compound. S3. The product of step S2 is subjected to a nucleophilic catalytic esterification reaction with glycidyl acrylate to obtain the target product of the high viscosity and toughness semi-hyperbranched acrylate resin.

3. The method for preparing a low-viscosity, high-toughness semi-hyperbranched acrylate resin according to claim 2, characterized in that, In step S1, the molar ratio of trimellitic anhydride to polyethylene glycol is 1:(1-1.2). The reaction temperature in step S1 is 100℃-120℃, and the reaction time is 2-4h.

4. The method for preparing a low-viscosity, high-toughness semi-hyperbranched acrylate resin according to claim 2, characterized in that, In step S2, the molar ratio of the product from step S1 to trimellitic anhydride is 1:(3-3.3). The reaction temperature in step S2 is 100℃-140℃, and the reaction time is 2-4h.

5. The method for preparing a low-viscosity, high-toughness semi-hyperbranched acrylate resin according to claim 2, characterized in that, In step S2, the solvent used is N,N-dimethylformamide, and 2%-5% xylene by mass of the solvent is added to the system, along with p-toluenesulfonic acid as a catalyst.

6. The method for preparing a low-viscosity, high-toughness semi-hyperbranched acrylate resin according to claim 2, characterized in that, In step S3, the molar ratio of the product from step S2 to glycidyl acrylate is 1:(6-6.8). The reaction temperature in step S3 is 80℃-110℃, and the reaction time is 3-6h.

7. The method for preparing a low-viscosity, high-toughness semi-hyperbranched acrylate resin according to claim 2, characterized in that, In step S3, a catalyst and a free radical polymerization inhibitor are added to the reaction system; The catalyst is at least one of triphenylphosphine, tetramethylammonium bromide, and triethylamine; The free radical polymerization inhibitor is at least one of hydroquinone, p-hydroxyanisole, and p-benzoquinone.

8. The method for preparing a low-viscosity, high-toughness semi-hyperbranched acrylate resin according to claim 7, characterized in that, In step S3, the amount of catalyst added is 0.1%-0.5% of the total mass of the product from step S2 and glycidyl acrylate. The amount of the free radical polymerization inhibitor added is 0.001%-0.01% of the total mass of the product of step S2 and glycidyl acrylate.

9. The method for preparing a low-viscosity, high-toughness semi-hyperbranched acrylate resin according to claim 2, characterized in that, The solvent used in the reaction system in steps S1 to S2 is N,N-dimethylformamide.

10. An application of the low-viscosity, high-toughness semi-hyperbranched acrylate resin according to claim 1, characterized in that, The semi-hyperbranched acrylate resin is used in UV-curable adhesives.

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