Resin composition and application thereof

Abstract

The embodiment of the invention provides a resin composition and application thereof, the resin composition comprises an acrylate compound, an acrylate monomer, a photoinitiator and an additive, the acrylate compound comprises an acrylate compound containing a fluorene structure, and the acrylate compound containing the fluorene structure is shown as a formula 1, r is selected from alkoxy with the carbon chain length of 1-8. The refractive index, heat resistance and bending resistance of the resin layer can be improved, and the curing shrinkage rate of the resin layer can be reduced.

Description

Technical Field

[0001] This application relates to the field of electronic component packaging materials, and more particularly to a resin composition and its application. Background Technology

[0002] To prevent electronic components (such as organic light-emitting diodes (OLEDs)) from being corroded by oxygen and moisture in the air, which would lead to a decrease in the lifespan of the structural components, it is usually necessary to encapsulate and protect the surface of the electronic components.

[0003] Currently, an inorganic barrier layer (such as silicon nitride SiN) can be deposited on the surface of electronic components by chemical vapor deposition (CVD) to provide excellent water and oxygen barrier properties; then an organic encapsulation layer is sprayed or coated on the surface of the inorganic layer to enhance the toughness of the overall encapsulation layer and buffer stress.

[0004] However, existing organic encapsulation layers generally suffer from problems such as high curing shrinkage, low refractive index, insufficient heat resistance, and insufficient bending resistance, which urgently need to be addressed. Summary of the Invention

[0005] This application provides a resin composition and its application, which can improve the refractive index, heat resistance and bending resistance of the resin layer, and reduce the curing shrinkage rate of the resin layer.

[0006] In a first aspect, embodiments of this application provide a resin composition comprising an acrylate compound, an acrylate monomer, a photoinitiator, and additives, wherein the acrylate compound comprises an acrylate compound containing a fluorene structure, and the acrylate compound containing a fluorene structure is shown in Formula 1:

[0007] Formula 1,

[0008] R is selected from alkoxy groups with a carbon chain length of 1 to 8.

[0009] In one possible implementation, the fluorene-containing acrylate compound includes one or more of Formula 2-1 and Formula 2-2.

[0010] Equation 2-1,

[0011] Equation 2-2.

[0012] In one possible embodiment, the fluorene-containing acrylate compound accounts for 20% to 70% of the resin composition by mass; and / or, the acrylate monomer accounts for 20% to 70% of the resin composition by mass; and / or, the photoinitiator accounts for 0.1% to 5% of the resin composition by mass; and / or, the additive accounts for 0.1% to 5% of the resin composition by mass.

[0013] In one possible implementation, the acrylate monomer includes one or more of difunctional acrylate monomers, trifunctional acrylate monomers, and polyfunctional acrylate monomers with a functionality greater than 3.

[0014] In one possible implementation, the bifunctional acrylate monomer includes one or more of dipropylene glycol diacrylate, butanediol diacrylate, hexanediol diacrylate, diethylene glycol dimethacrylate, polyethylene glycol diacrylate, bisphenol A diacrylate, tetraethylene glycol diacrylate, dodecanediol dimethacrylate, tripropylene glycol diacrylate, and neopentyl glycol diacrylate.

[0015] In one possible implementation, the trifunctional acrylate monomer includes one or more of the following: trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, pentaerythritol triacrylate, propoxylated propanetriol triacrylate, tri(2-hydroxyethyl)isocyanurate triacrylate, and cyanurate triacrylate.

[0016] In one possible implementation, the polyfunctional acrylate monomer with a functionality greater than 3 includes one or more of trimethylolpropane tetraacrylate, pentaerythritol tetraacrylate, pentaerythritol tetraacrylate alkyl oxyalkylene tetraacrylate, and dipentaerythritol pentaacrylate.

[0017] In one possible implementation, the photoinitiator includes one or more of alkyl phenyl ketones, acyl phosphorus oxides, benzophenones, xenothioanthrones, and diacetic titanium compounds;

[0018] And / or, the additives include one or more of the following: leveling agents, defoamers, coupling agents, wetting and dispersing agents, adhesion promoters, and matting agents.

[0019] Secondly, embodiments of this application provide a structural component, including an electronic component and a resin layer encapsulating the electronic component, the resin layer being formed by curing the aforementioned resin composition.

[0020] Thirdly, embodiments of this application provide a method for preparing the above-mentioned structural component, comprising the following steps: coating the resin composition onto the area to be packaged of the electronic component, and then curing it to form the resin layer to obtain the structural component.

[0021] This application provides a resin composition and its application. The resin composition includes an acrylate compound, an acrylate monomer, a photoinitiator, and additives. The acrylate compound includes an acrylate compound containing a fluorene structure, as shown in Formula 1. After curing, the unique stereoconformation of the fluorene structure in the acrylate compound containing the fluorene structure can significantly improve the refractive index and heat resistance of the resin layer. At the same time, the fluorene structure has a large free volume, which can improve the bending resistance of the resin layer and give it a low curing shrinkage rate. This can improve the refractive index, heat resistance, and bending resistance of the resin layer, and reduce the curing shrinkage rate of the resin layer. Detailed Implementation

[0022] To enable those skilled in the art to better understand the solutions of this invention, the following provides a more detailed description of this application. The specific embodiments listed below are merely descriptions of the principles and features of this invention; the examples are only for explaining the invention and are not intended to limit its scope. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this invention.

[0023] This invention provides a resin composition comprising an acrylate compound, an acrylate monomer, a photoinitiator, and additives. The acrylate compound includes an acrylate compound containing a fluorene structure, as shown in Formula 1.

[0024] Formula 1,

[0025] R is selected from alkoxy groups with a carbon chain length of 1 to 8.

[0026] According to the inventors' research, a resin composition satisfying the above-mentioned composition can improve the refractive index, heat resistance, and flexural strength of the resin layer, while reducing the curing shrinkage rate of the resin layer. The reason for this is that after the resin composition cures to form a resin layer, the unique stereoconformation and rigid aromatic structure of the fluorene-containing acrylate compound significantly improves the refractive index and heat resistance of the resin layer. Simultaneously, the fluorene structure has a large free volume, thereby improving the flexural strength of the resin layer and imparting a lower curing shrinkage rate. The crosslinking network of the acrylate monomers enhances the mechanical strength of the resin composition while, through reasonable control of the crosslinking density, imparting a certain degree of flexibility and improving its flexural strength.

[0027] According to further research by the inventors, photoinitiators can promote the photocuring of resin compositions and improve the curing efficiency of resin compositions. In addition, additives can optimize the substrate adhesion and surface uniformity of resin compositions.

[0028] In some embodiments, the fluorene-containing acrylate compound includes one or more of Formula 2-1 and Formula 2-2, which is more beneficial for improving the refractive index, heat resistance, and flexural strength of the resin layer, and reducing the curing shrinkage of the resin layer.

[0029] Equation 2-1,

[0030] Equation 2-2.

[0031] In some embodiments, the fluorene-containing acrylate compound accounts for 20% to 70% of the resin composition by mass, for example, 20%, 30%, 40%, 50%, 60%, 70%, or any combination thereof. A fluorene-containing acrylate compound accounting for no less than 20% of the resin composition is more beneficial for improving the refractive index, heat resistance, and flexural strength of the resin layer, and reducing its curing shrinkage. A fluorene-containing acrylate compound accounting for no more than 70% of the resin composition is more beneficial for reducing the brittleness of the resin layer. Therefore, a fluorene-containing acrylate compound accounting for 20% to 70% of the resin composition is more beneficial for improving the refractive index, heat resistance, and flexural strength of the resin layer formed after curing, and reducing curing shrinkage and brittleness.

[0032] In some embodiments, the acrylate monomer accounts for 20% to 70% of the resin composition by mass, for example, it can be 20%, 30%, 40%, 50%, 60%, 70%, or any combination thereof. When the acrylate monomer accounts for not less than 20% of the resin composition by mass, it can further improve the crosslinking density and flexibility of the resin composition. When the acrylate monomer accounts for not more than 70% of the resin composition by mass, it is more conducive to improving the refractive index, heat resistance, and bending resistance of the resin layer, and reducing the curing shrinkage rate of the resin layer. Therefore, when the acrylate monomer accounts for 20% to 70% of the resin composition by mass, it is more conducive to improving the refractive index, heat resistance, bending resistance, crosslinking density, and flexibility of the resin layer, and reducing the curing shrinkage rate of the resin layer.

[0033] In some embodiments, the photoinitiator accounts for 0.1% to 5% of the resin composition by mass, for example, 0.1%, 0.5%, 1%, 2%, 3%, 4%, 5%, or any combination thereof. The photoinitiator accounts for not less than 0.1% of the resin composition by mass. The photoinitiator generates free radicals under ultraviolet light irradiation, which is more conducive to initiating the polymerization reaction of acrylate monomers and improving the curing efficiency of the resin composition. The photoinitiator accounts for not more than 5% of the resin composition by mass, which can further avoid excessive photoinitiator leading to excessively high free radical concentration, coupling termination between free radicals, and reduced polymerization rate. At the same time, it can also avoid excess photoinitiator remaining in the resin layer and deteriorating the performance of the resin layer. Therefore, the photoinitiator accounts for 0.1% to 5% of the resin composition by mass, which can improve the curing efficiency of the resin composition and improve the basic properties of the resin layer.

[0034] In some embodiments, the additive may account for 0.1% to 5% of the resin composition by mass, for example, 0.1%, 0.5%, 1%, 2%, 3%, 4%, 5%, or any combination thereof. When the additive accounts for not less than 0.1% of the resin composition by mass, it can further optimize the adhesion and surface uniformity of the resin composition. When the additive accounts for not more than 5% of the resin composition by mass, it is more conducive to avoiding the deterioration of the encapsulation effect of the resin composition. Therefore, when the additive accounts for 0.1% to 5% of the resin composition by mass, it is more helpful to improve the adhesion, surface uniformity, and encapsulation effect of the resin composition.

[0035] In some embodiments, the acrylate monomer includes one or more of difunctional acrylate monomers, trifunctional acrylate monomers, and polyfunctional acrylate monomers with a functionality greater than 3, which is more conducive to improving the crosslinking density of the resin composition and balancing the hardness and flexibility of the resin composition.

[0036] In some embodiments, the bifunctional acrylate monomer is as shown in Formula 3:

[0037] Formula 3,

[0038] Wherein, Y includes one or more of hydrogen atoms, substituted or unsubstituted alkyl groups with a carbon chain length of 1 to 30, and substituted or unsubstituted alkoxy groups with a carbon chain length of 1 to 30; Q includes one or more of substituted or unsubstituted alkyl groups with a carbon chain length of 1 to 30, and alkoxy groups with a carbon chain length of 1 to 30.

[0039] In some embodiments, the bifunctional acrylate monomers include one or more of dipropylene glycol diacrylate, butanediol diacrylate, hexanediol diacrylate, diethylene glycol dimethacrylate, polyethylene glycol diacrylate, bisphenol A diacrylate, tetraethylene glycol diacrylate, dodecanediol dimethacrylate, tripropylene glycol diacrylate, and neopentyl glycol diacrylate, which is more conducive to balancing the mechanical properties and flexibility of the resin layer formed after the resin composition is cured, and improving the polymerization efficiency of the resin composition.

[0040] In some embodiments, the trifunctional acrylate monomer is as shown in Formula 4:

[0041] Equation 4,

[0042] Wherein, K includes one or more of hydrogen atoms, substituted or unsubstituted alkyl groups with a carbon chain length of 1 to 30, and substituted or unsubstituted alkoxy groups with a carbon chain length of 1 to 30; G includes one or more of substituted or unsubstituted alkyl groups with a carbon chain length of 1 to 30, and alkoxy groups with a carbon chain length of 1 to 30.

[0043] In some embodiments, the trifunctional acrylate monomers include one or more of trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, pentaerythritol triacrylate, propoxylated glycerol triacrylate, tri(2-hydroxyethyl)isocyanurate triacrylate, and cyanurate triacrylate, which further contribute to improving the crosslinking density and curing rate of the resin composition.

[0044] In some embodiments, the functionality of the unsaturated double bonds in the polyfunctional acrylate monomer with a functionality greater than 3 is 4 to 10, for example, it can be a range of 4, 5, 6, 7, 8, 9, 10 or any two of them, which is more conducive to avoiding embrittlement caused by excessive cross-linking and to reducing the brittleness of the resin layer.

[0045] In some embodiments, the multifunctional acrylate monomer with a functionality greater than 3 includes one or more of trimethylolpropane tetraacrylate, pentaerythritol tetraacrylate, pentaerythritol tetraacrylate alkyl oxyalkylene tetraacrylate, and dipentaerythritol pentaacrylate.

[0046] In some embodiments, the photoinitiator may include one or more of alkyl phenyl ketones, acyl phosphorus oxides, benzophenones, anthrathiones, and diacetic ketones.

[0047] The alkyl benzophenones may include one or more of Omnirad 1173 (IGM, Japan) and Omnirad 184 (IGM, Japan); the acyl phosphorus oxides may include one or more of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO), phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide, and ethyl 2,4,6-trimethylbenzoylphenylphosphonate; the benzophenones may include 4-phenylbenzophenone; the xanthraphenones may include one or more of Omnirad ITX (IGM, Japan) and Omnirad DETX (IGM, Japan); and the diacene oxides may include Omnirad 784 (IGM, Japan).

[0048] In some embodiments, the additive may include one or more of the following: leveling agent, defoamer, coupling agent, wetting and dispersing agent, adhesion promoter, and matting agent.

[0049] The leveling agent may include one or more of BYK-300 (Shin-Etsu, Japan), BYK-310 (BYK, Germany), BYK-307 (BYK, Germany), BYK-333 (BYK, Germany), and BYK-370 (BYK, Germany); the defoamer may include one of KS-66 (Shin-Etsu, Japan), KS-69 (Shin-Etsu, Japan), KS-108 (Shin-Etsu, Japan), BYK-070 (BYK, Germany), BYK-011 (BYK, Germany), BYK-012 (BYK, Germany), and BYK-057 (BYK, Germany). One or more coupling agents may be included; the coupling agent may include one or more of KBM-403 (Shin-Etsu, Japan), KBM-503 (Shin-Etsu, Japan), and KBM-603 (Shin-Etsu, Japan); the wetting and dispersing agent may include one or more of BYK-111 (BYK, Germany), BYK-142 (BYK, Germany), and BYK-145 (BYK, Germany); the adhesion promoter may include one or more of BYK-4511 (BYK, Germany), BYK-4510 (BYK, Germany), BYK-4509 (BYK, Germany), and BYK-4512 (BYK, Germany); and the matting agent may include ACEMATT. One or more of the following: 3400 (Evonik, Germany), ACEMATT 3600 (Evonik, Germany), and ACEMATT OK607 (Evonik, Germany).

[0050] In some embodiments, the preparation process of the resin composition may include the following steps: mixing a fluorene-containing acrylate compound, an acrylate monomer, a photoinitiator, and an additive uniformly, filtering, and then preparing the resin composition.

[0051] Under normal circumstances, the resin composition exhibits a fluid liquid state at room temperature (25℃±5℃).

[0052] Among them, fluorene-containing acrylate compounds, acrylate monomers, photoinitiators and additives can be mixed in a reaction vessel.

[0053] The present invention also provides a structural component, including an electronic component and a resin layer for encapsulating the electronic component, wherein the resin layer is formed by curing the above-described resin composition.

[0054] Specifically, the electronic component may include an organic light-emitting diode (OLED), and the OLED light-emitting layer may be encapsulated using a resin layer formed by curing the above-described resin composition.

[0055] The present invention also provides a method for preparing the above-mentioned structural component, comprising the following steps: coating a resin composition onto the area to be packaged of an electronic component, and then curing it to form a resin layer to obtain the structural component.

[0056] The present invention will be further described below through specific embodiments.

[0057] Example 1:

[0058] (1) Preparation of resin composition:

[0059] The fluorene-containing acrylate compound (Jiangsu Yongxing Chemical Co., Ltd.) shown in Formula 2-1 accounts for 40% of the mass percentage of the resin composition (i.e., the mass part of the fluorene-containing acrylate compound shown in Formula 2-1 is 40%), trimethylolpropane triacrylate (CAS 15625-89-5) accounts for 20% of the mass percentage of the resin composition (i.e., the mass part of trimethylolpropane triacrylate is 20%), bisphenol A diacrylate ethoxylate (CAS 64401-02-1) accounts for 20% of the mass percentage of the resin composition (i.e., the mass part of bisphenol A diacrylate ethoxylate is 20%), and dipentaerythritol pentaacrylate (CAS 15625-89-5) accounts for 20% of the mass percentage of the resin composition. The resin composition is composed of 10% by mass of 60506-81-2 (i.e., 10 parts by mass of dipentaerythritol pentaacrylate), 5 parts by mass of TPO, 1% by mass of BYK-307, 2% by mass of KBM-403, and 2% by mass of BYK-4511. These are added to a reaction vessel and stirred at room temperature for 5 hours. The resin composition is then obtained after filtration.

[0060] (2) Preparation of resin layer:

[0061] The resin composition prepared above was used to print a 20 μm thick coating on ordinary glass using inkjet printing. The coating was then further cured in a UV curing chamber at 1500 mJ / cm². 2 Under certain conditions, ultraviolet light is used for curing to form a resin layer (organic film).

[0062] Example 2: The difference from Example 1 is that the fluorene-containing acrylate compound is the fluorene-containing acrylate compound shown in Formula 2-2 (Jiangsu Yongxing Chemical Co., Ltd.). Other conditions and steps are the same as in Example 1, as shown in Tables 1-1 and 1-2.

[0063] Example 3: The difference from Example 1 is that the mass fraction of the fluorene-containing acrylate compound shown in Formula 2-1 is 20, the mass fraction of trimethylolpropane triacrylate is 30, and the mass fraction of bisphenol A diacrylate is 30. Other conditions and steps are the same as in Example 1, as shown in Tables 1-1 and 1-2.

[0064] Example 4: The difference from Example 1 is that the mass fraction of the fluorene-containing acrylate compound shown in Formula 2-1 is 70, the mass fraction of trimethylolpropane triacrylate is 10, and bisphenol A diacrylate ethoxylate is not added. Other conditions and steps are the same as in Example 1, as detailed in Tables 1-1 and 1-2.

[0065] Example 5: The difference from Example 1 is that the mass fraction of the fluorene-containing acrylate compound shown in Formula 2-1 is 30, without the addition of trimethylolpropane triacrylate and bisphenol A diacrylate, and the mass fraction of dipentaerythritol pentaacrylate is 50. In addition, 10 parts by mass of pentaerythritol triacrylate (CAS 3524-68-3) are added. Other conditions and steps are the same as in Example 1, as detailed in Tables 1-1 and 1-2.

[0066] Example 6: The difference from Example 1 is that the mass fraction of the fluorene-containing acrylate compound shown in Formula 2-1 is 20, without the addition of trimethylolpropane triacrylate and bisphenol A diacrylate, and the mass fraction of dipentaerythritol pentaacrylate is 20. In addition, the mass fraction of the fluorene-containing acrylate compound shown in Formula 2-2 is added in the following ways: 20 parts by mass (i.e., the mass percentage of the fluorene-containing acrylate compound shown in Formula 2-2 is 20%), 10 parts by mass of pentaerythritol triacrylate, and 20 parts by mass of pentaerythritol tetraacrylate (CAS 4986-89-4). Other conditions and steps are the same as in Example 1, as detailed in Tables 1-1 and 1-2.

[0067] Example 7: The difference from Example 1 is that the mass fraction of the fluorene-containing acrylate compound shown in Formula 2-1 is 10, no trimethylolpropane triacrylate is added, the mass fraction of bisphenol A diacrylate is 40, the mass fraction of dipentaerythritol pentaacrylate is 40, and other conditions and steps are the same as in Example 1, as detailed in Tables 1-1 and 1-2.

[0068] Example 8: The difference from Example 1 is that the mass fraction of the fluorene-containing acrylate compound shown in Formula 2-1 is 80, no trimethylolpropane triacrylate is added, the mass fraction of bisphenol A diacrylate is 5, the mass fraction of dipentaerythritol pentaacrylate is 5, and the other conditions and steps are the same as in Example 1, as detailed in Tables 1-1 and 1-2.

[0069] Examples 9-12 differ from Example 1 in that the mass percentage of photoinitiator in the resin composition and the mass percentage of additives in the resin composition are different, as detailed in Table 2. Other conditions and steps are the same as in Example 1.

[0070] Examples 13-16 differ from Example 1 in that the types of photoinitiators are different, as detailed in Table 2. Other conditions and steps are the same as in Example 1.

[0071] Comparative Example 1: Unlike Example 1, no fluorene-structured acrylate compound was added. The mass fraction of trimethylolpropane triacrylate was 10, the mass fraction of dipentaerythritol pentaacrylate was 20, and 40 parts by mass of pentaerythritol triacrylate were added. Other conditions and steps were the same as in Example 1, as detailed in Tables 1-1 and 1-2.

[0072] Comparative Example 2: Unlike Example 1, no fluorene-structured acrylate compound and trimethylolpropane triacrylate were added. The mass fraction of bisphenol A diacrylate was 40, the mass fraction of pentaerythritol pentaacrylate was 30, and 20 parts by mass of pentaerythritol triacrylate were added. Other conditions and steps were the same as in Example 1, as detailed in Tables 1-1 and 1-2.

[0073] Comparative Example 3: Unlike Example 1, no fluorene-structured acrylate compound and trimethylolpropane triacrylate were added. The mass fraction of bisphenol A diacrylate was 30, the mass fraction of pentaerythritol pentaacrylate was 30, and pentaerythritol triacrylate was added in addition to the mass fraction of 30. Other conditions and steps were the same as in Example 1, as detailed in Tables 1-1 and 1-2.

[0074] The resin layers prepared in the embodiments and comparative examples of the present invention can be tested for performance under the following conditions, and the results are shown in Table 3.

[0075] (1) C=C group conversion rate: The resin composition and resin layer prepared above were tested by Fourier transform infrared spectroscopy before and after photocuring at 1635 cm⁻¹. -1 The peak intensity of the stretching vibration of C=C at the position represents the conversion rate of the C=C group. The specific calculation method is shown in formula (a):

[0076] C=(V1-V2) / V1 (a)

[0077] Wherein, C: C=C group conversion rate; V1: V1 (resin composition) before curing at 1635 cm⁻¹ -1 The peak intensity of the corrected stretching vibration peak; V2: after curing (resin layer) at 1635 cm⁻¹ -1 The peak intensity of the corrected stretching vibration peak;

[0078] The conversion rate of the C=C group was calculated.

[0079] (2) Refractive index test of resin layer: Take the resin layer prepared above and characterize the refractive index of the organic film by HORIBA elliptic polarization spectrometer.

[0080] (3) Flexural strength test of the resin layer: Take the resin composition prepared above and print it on a 50 μm thick polyimide film with a printing thickness of 10 μm. The flexural strength test is conducted at 1500 mJ / cm. 2 The cumulative exposure was used for photocuring, followed by bending resistance testing using a ZJD3002 bending tester (Shanghai Zhujin Analytical Instrument Co., Ltd.). The bending radius was set to 0.38 mm, the load to 200 g, the bending speed to 60 times / min, and the bending angle to ±90°. ° The number of bends at which the resin layer cracked was observed and recorded as the number of bend resistance cycles. The higher the number of bend resistance cycles, the better the bend resistance performance.

[0081] (4) Heat resistance test of resin layer: Take the resin layer prepared above and test the glass transition temperature Tg of the resin layer using a TA DMA850 (TA Instrument) dynamic mechanical analyzer. Cut the resin layer into rectangular strips with a length of 50 mm and a width of 5 mm, fix them on a tensile fixture, and test them at a heating rate of 1 Hz, 125% amplitude, and 10 °C / min. Take the temperature corresponding to the peak value of the ratio of loss modulus to storage modulus (Tanδ) as Tg (unit °C). The higher the Tg, the better the heat resistance.

[0082] (5) Curing shrinkage rate test of resin layer: Take the resin composition and resin layer prepared above, test the density of the resin composition by using a specific gravity bottle and record it as P1, and then test the density of the resin layer by using an analytical balance and record it as P2. The curing shrinkage rate K can be calculated by formula (b):

[0083] K = (1 - P1 / P2) × 100% (b)

[0084] The curing shrinkage rate of the resin layer was calculated.

[0085] Table 1-1 Composition of the resin composition

[0086]

[0087] Table 1-2 Composition of Resin Compositions

[0088]

[0089] Table 2 Composition of the resin composition

[0090]

[0091] Table 3 Properties of Resin Compositions and Resin Layers

[0092]

[0093] Compared to Comparative Examples 1-3, the resin compositions in Examples 1-16 include acrylate compounds, acrylate monomers, photoinitiators, and additives. The acrylate compounds include fluorene-containing acrylate compounds, as shown in Formula 1, which can improve the refractive index, heat resistance, and flexural strength of the resin layer and reduce the curing shrinkage of the resin layer.

[0094] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to what has been described above. Various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A resin composition, characterized in that, The product comprises acrylate compounds, acrylate monomers, photoinitiators, and additives, wherein the acrylate compounds include acrylate compounds containing fluorene structures, as shown in Formula 1: Formula 1, R is selected from alkoxy groups with a carbon chain length of 1 to 8.

2. The resin composition according to claim 1, characterized in that, The fluorene-containing acrylate compounds include one or more of Formula 2-1 and Formula 2-2. Equation 2-1, Equation 2-2.

3. The resin composition according to claim 1 or 2, characterized in that, The fluorene-containing acrylate compound accounts for 20% to 70% of the mass percentage of the resin composition; And / or, the acrylate monomer accounts for 20% to 70% of the mass percentage of the resin composition; And / or, the photoinitiator accounts for 0.1% to 5% of the resin composition by mass; And / or, the additive accounts for 0.1% to 5% of the mass percentage of the resin composition.

4. The resin composition according to any one of claims 1-3, characterized in that, The acrylate monomers include one or more of the following: difunctional acrylate monomers, trifunctional acrylate monomers, and polyfunctional acrylate monomers with a functionality greater than 3.

5. The resin composition according to claim 4, characterized in that, The bifunctional acrylate monomers include one or more of the following: dipropylene glycol diacrylate, butanediol diacrylate, hexanediol diacrylate, diethylene glycol dimethacrylate, polyethylene glycol diacrylate, bisphenol A diacrylate, tetraethylene glycol diacrylate, dodecanediol dimethacrylate, tripropylene glycol diacrylate, and neopentyl glycol diacrylate.

6. The resin composition according to claim 4, characterized in that, The trifunctional acrylate monomers include one or more of the following: trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, pentaerythritol triacrylate, propoxylated propanetriol triacrylate, tri(2-hydroxyethyl)isocyanurate triacrylate, and cyanurate triacrylate.

7. The resin composition according to claim 4, characterized in that, The polyfunctional acrylate monomers with a functionality greater than 3 include one or more of trimethylolpropane tetraacrylate, pentaerythritol tetraacrylate, pentaerythritol tetraacrylate alkyl oxyalkylene tetraacrylate, and dipentaerythritol pentaacrylate.

8. The resin composition according to any one of claims 1-7, characterized in that, The photoinitiator includes one or more of the following: alkyl phenyl ketones, acyl phosphorus oxides, benzophenones, xenothioanthrones, and diocenes. And / or, the additives include one or more of the following: leveling agents, defoamers, coupling agents, wetting and dispersing agents, adhesion promoters, and matting agents.

9. A structural component, characterized in that, It includes electronic components and a resin layer for encapsulating said electronic components, said resin layer being cured from the resin composition of any one of claims 1-8.

10. A method for manufacturing the structural component according to claim 9, characterized in that, Includes the following steps: The resin composition is coated onto the area of ​​the electronic component to be packaged, and then cured to form the resin layer, thereby obtaining the structural component.

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