Temperature-resistant interpenetrating network anticorrosive paint and preparation method thereof

Abstract

The invention discloses a coating capable of being used in the fields of energy, transportation, ocean engineering and the like, and particularly relates to an anti-corrosion and temperature-resistant coating. The invention aims to provide the temperature-resistant interpenetrating network anticorrosive paint which still keeps excellent performances such as corrosion resistance, adhesive force and impact resistance in a high-temperature environment and is stable, and the preparation method of the temperature-resistant interpenetrating network anticorrosive paint. The component A comprises 100 parts of acrylate modified epoxy resin, epoxy resin, novolac epoxy resin, high chlorinated polyethylene resin, a solvent, an anti-settling aid and the like, and the component B is an organosilicon cardanol modified amine curing agent; according to the present invention, the component A and the component B are mixed according to a weight ratio of 5-8: 1 to form the coating, and the coating has characteristics of excellent physical and chemical properties at a high temperature, coating adhesion (pull-off method) of 8 MPa after the heat resistance test for 360 h at a temperature of 205 DEG C, and no blistering, no shedding and no rust after the salt fog resistance for 1400 h.

Description

Technical Field

[0001] This invention relates to a coating that can be used in fields such as energy, transportation, and marine engineering, and particularly to a corrosion-resistant and temperature-resistant coating. Background Technology

[0002] Epoxy resin, a common film-forming substance in anti-corrosion coatings, possesses excellent mechanical properties and chemical stability due to the highly cross-linked network formed by the reaction of active epoxy groups in its molecular structure with the curing agent. For example, CN201510839470.1, entitled "An Epoxy Anti-corrosion Coating," describes an epoxy anti-corrosion coating prepared using modified epoxy resin, exhibiting excellent adhesion, abrasion resistance, and impact resistance. Patent CN202310766665.2, entitled "A Container, Epoxy Anti-corrosion Coating and its Preparation Method," describes a method that blends epoxy resin with a small amount of polyurethane resin, improving the cross-linking strength and stability between the polyurethane and epoxy resins to form a good, stable, and homogeneous system, thereby effectively improving the stability of the epoxy anti-corrosion coating.

[0003] In certain high-temperature environments, such as in petrochemical pipelines, the coatings mentioned in the above patents can cause pyrolysis of the ether bonds and benzene ring structures in the epoxy resin molecular chain when the temperature of the medium transported in the pipeline exceeds 150°C. This leads to the destruction of the cross-linking network, a decrease in the mechanical strength of the coating, and a decrease in its corrosion resistance. Therefore, current epoxy resin coatings can no longer meet the requirements of complex environments. Summary of the Invention

[0004] The purpose of this invention is to provide a temperature-resistant interpenetrating network anti-corrosion coating that maintains excellent and stable properties such as corrosion resistance, adhesion and impact resistance even under high-temperature environments.

[0005] A temperature-resistant interpenetrating network anti-corrosion coating, comprising, by weight: Group A: Acrylic modified epoxy resin 5-15 servings Epoxy resin 30-50 servings Phenolic epoxy resin 15-20 servings High-chlorinated polyethylene resin 5-10 servings solvent 1-15 points Anti-settling additives 0.3-1.0 portions Leveling agent 0.1-0.3 portions dispersant 1-3 servings pigment 1-10 servings filler 3-15 servings Group A consists of 100 portions by weight. Group B is an organosilicon cashew phenol modified amine curing agent; it is mixed according to the weight ratio of Group A to Group B, which is 5-8:1.

[0006] Preferably, the solvent is composed of aromatic solvent S-100, propylene glycol methyl ether, and ethylene glycol butyl ether in a weight ratio of 1:0.5:0.3. Preferably, the anti-settling agent is one or more of organic bentonite powder, polyamide wax, and attapulgite.

[0007] Preferably, the leveling agent is one or more of BYK-392, BYK-388, and BYK-379; Preferably, the dispersant BYK-182, BYK-183, and BYK-170 are one or more of these; Preferably, the pigment is one or more of iron oxide yellow, iron oxide red, and titanium dioxide; Preferably, the filler is one or more of mica powder, precipitated barium sulfate, zinc phosphate, aluminum tripolyphosphate, and aluminum polyphosphate.

[0008] The acrylate-modified epoxy resin mentioned above is obtained by the following method: Add 20-35 parts xylene and 0.5-1.0 parts mercaptoethanol to a reaction vessel and heat to 120-130℃. Add dropwise a mixture consisting of 5-10 parts tert-butyl carbonate, 5-8 parts methacrylic acid, 2-8 parts methyl methacrylate, 3-10 parts butyl methacrylate, and 1.0-2 parts tert-butyl benzoate. Maintain this temperature for 2 hours, keeping the viscosity at (2-5) s (23℃, Giethore tube). Cool to 100-105℃ and add... After holding 0.05-0.1 parts of benzoyl peroxide at a constant temperature for 30 minutes, 0.5-3.5 parts of 50% tri(2-hydroxyethyl) isocyanate triacrylate solution are added dropwise over 1.5-2.5 hours. After the addition is complete, the reaction is held at a constant temperature for 1 hour. The temperature is then lowered to 50-70°C, and 0.05-0.15 parts of hexadecyltrimethylammonium bromide and 45-55 parts of 618 epoxy resin are added. The mixture is held at a constant temperature for 2-2.5 hours, then cooled and discharged to obtain acrylate-modified epoxy resin.

[0009] Preferably, the 50% tri(2-hydroxyethyl) isocyanate solution is composed of tri(2-hydroxyethyl) isocyanate and xylene in a mass ratio of 1:1.

[0010] The organosilicon cashew phenol modified amine curing agent mentioned above has the following characteristics and preparation method: Add 30-35 parts of cashew nut phenol and 12-16 parts of 2-methylpentanediamine to a reactor, heat to 50℃±5℃, add a mixture of 3-5 parts of paraformaldehyde and 5-12 parts of deionized water, then heat to about 90±5℃ and keep warm for 4-8 hours. Remove moisture and free amine by vacuuming, cool to 60-80℃, add 25-32 parts of xylene, 8-10 parts of double-terminated monohydroxy organosilicon prepolymer and 0.03-0.05 parts of tetraisopropyl titanate, with each of the above substances weighing 100 parts. React for 2-3 hours to obtain organosilicon cashew nut phenol modified amine curing agent.

[0011] Preparation of Group A: First, high-chlorinated polyethylene resin and solvent are added to a disperser and dispersed evenly. Then, acrylate-modified epoxy resin, epoxy resin, phenolic epoxy resin and dispersant are added and dispersed evenly. Next, leveling agent, pigment, filler and dust-proofing agent are added to the disperser in sequence and dispersed evenly. Then, the mixture is transferred to a sand mill and sand-milled until the fineness is <30μm to obtain the Group A mixture, which can then be discharged.

[0012] Then, during use, the mixture of component A and the organosilicon cashew phenol modified amine curing agent are mixed evenly in proportion to obtain a heat-resistant interpenetrating network anti-corrosion coating.

[0013] The core part of this invention is: I. Modification and Blending of Film-Forming Resins. Acrylate-modified epoxy resins were prepared by branching ethylene tert-carbonate, methacrylic acid, methyl methacrylate, butyl methacrylate, and a suitable amount of trifunctional tri(2-hydroxyethyl) isocyanate to prepare an acrylate prepolymer, which was then ring-opened with epoxy resin to prepare the acrylate-modified epoxy resin. The steric hindrance effect of the tert-carbon in ethylene tert-carbonate improved the acid and alkali resistance of the coating film. Tri(2-hydroxyethyl) isocyanate increased the branching degree of the epoxy resin end chains, allowing it to form a highly cross-linked framework structure after curing with the amine curing agent. This facilitates the entanglement of other resins, compensating for insufficient cross-linking due to insufficient epoxy groups, and forming a denser three-dimensional network structure, further improving the high-temperature resistance of the coating. Simultaneously, phenolic epoxy resin, epoxy resin, acrylate-modified epoxy resin, and high-chlorinated polyethylene resin were dried to form an interpenetrating network coating. The network interlocking mechanism improved the coating density, thereby enhancing the coating's stability at high temperatures.

[0014] II. Preparation of Organosilicon / Cashewol Modified Amine Curing Agent. 2-Methylpentanediamine was used. This amine has a longer molecular chain, which further improves the flexibility of the coating. Simultaneously, the steric hindrance formed by the branched chains effectively inhibits excessive reaction, resulting in a synthesized amine curing agent with lower viscosity and better compatibility with the organosilicon prepolymer. A double-terminated monohydroxyl organosilicon prepolymer was introduced. The hydroxyl groups in this prepolymer undergo a condensation reaction with the phenolic hydroxyl groups in the amine curing agent. By controlling the amount of organosilicon prepolymer used, one end of the prepolymer retains a hydroxyl group, maintaining compatibility with resins such as epoxy. The introduced Si-O bonds further improve the coating's temperature resistance, acid and alkali resistance, and corrosion resistance.

[0015] Beneficial effects of the technical solution of this invention I. The synthesized acrylate-modified epoxy resin, along with phenolic epoxy resin and epoxy resin, serves as the main film-forming material, supplemented with 5%-10% HCPE resin. Utilizing the highly branched structure of the acrylate-modified epoxy resin and the rapid construction of a cross-linked framework after curing with the curing agent, the epoxy resin and phenolic epoxy resin subsequently interweave and entangle in the gaps between the framework, forming a gradient curing network. A composite solvent system using aromatic solvent S-100 and propylene glycol methyl ether and propylene glycol butyl ether (1:0.5:0.3) is employed. The high boiling point of this solvent delays the drying of the HCPE resin, promotes resin penetration, and ultimately forms an interpenetrating network structure, thereby improving the coating's heat resistance, salt water resistance, acid and alkali resistance, and salt spray resistance.

[0016] II. A silicone / cashew phenol modified amine curing agent was synthesized. The curing agent made by using 2-methylpentanediamine with branched and long chains has good flexibility. At the same time, a double-terminated monohydroxyl silicone prepolymer was introduced. The introduced Si-O bond further improved the coating's temperature resistance, acid and alkali resistance and corrosion resistance, while the hydroxyl group at one end was retained to enhance the compatibility with the film-forming resin, ensuring that it can be fully cured with different resins.

[0017] Third, the acrylate-modified epoxy resin synthesized in this invention not only has good compatibility with epoxy resin and phenolic epoxy resin, but also forms a compatible interface with high-chlorinated polyethylene resin by adjusting the polarity of the resin using monomers such as ethylene tert-carbonate. The prepared coating has excellent storage stability (50±2℃ / 30d, no stratification). The obtained coating still maintains excellent physicochemical properties at high temperatures. After a heat resistance test at 205℃ for 360h, the coating adhesion (pull-off method) can reach 8MPa. The salt spray resistance is still non-foaming, non-peeling, and non-rusting after 1400h. Detailed Implementation

[0018] Example 1 Synthesis of acrylate-modified epoxy resin: Add 32.2 parts xylene and 0.8 parts mercaptoethanol to a reactor and heat to 120-130℃. Add a mixture of 5 parts tert-butyl carbonate, 8 parts methacrylic acid, 2 parts methyl methacrylate, 3 parts butyl methacrylate, and 1.4 parts tert-butyl benzoate dropwise. Keep the mixture at this temperature for 2 hours to obtain a resin with a viscosity of 3.5s (23℃, Giethogel tube). Cool the mixture to 100-105℃, add 0.05 parts benzoyl peroxide, and keep the mixture at this temperature for 30 minutes. Then, add 2.5 parts of 50% tri(2-hydroxyethyl) isocyanate triacrylate solution dropwise over 1.5-2.5 hours. After the addition is complete, keep the mixture at this temperature for 1 hour. Cool the mixture to 50-70℃ and add 0.05 parts cetyltrimethylammonium bromide and 45 parts 618 epoxy resin. Keep the mixture at this temperature for 2-2.5 hours, then cool the mixture and discharge it to obtain acrylate-modified epoxy resin.

[0019] Synthesis of organosilicon cashew phenol modified amine curing agent: Add 31.5 parts of cashew nut shell powder and 15.5 parts of 2-methylpentanediamine to a reactor, heat to 50℃±5℃, add a mixture of 3.47 parts of paraformaldehyde and 9 parts of deionized water, heat to about 90±5℃, keep warm for (4-8h), remove moisture and free amine by vacuuming, cool to (60-80)℃, add 30.5 parts of xylene, 10 parts of double-terminated monohydroxy organosilicon prepolymer and 0.03 parts of tetraisopropyl titanate, react for (2-3)h to obtain organosilicon / cashew nut shell powder modified amine curing agent.

[0020] Acrylic modified epoxy resin 5 copies Epoxy resin 50 copies Phenolic epoxy resin 20 copies High-chlorinated polyethylene resin 5 copies solvent 1.7 points Anti-settling additives 1.0 copy Leveling agent 0.3 copies dispersant 2 copies pigment 5 copies filler 10 copies Preparation of Group A: First, high-chlorinated polyethylene resin and solvent are added to a disperser and dispersed evenly. Then, acrylate-modified epoxy resin, epoxy resin, phenolic epoxy resin and dispersant are added and dispersed evenly. Next, leveling agent, pigment, filler and dust-proofing agent are added to the disperser in sequence and dispersed evenly. Then, the mixture is transferred to a sand mill and sand-milled until the fineness is <30μm to obtain the Group A mixture, which can then be discharged.

[0021] Then, the mixture of component A and the organosilicon cashew phenol modified amine curing agent are mixed evenly at a ratio of 5:1 to obtain the temperature-resistant interpenetrating network anti-corrosion coating created in this invention.

[0022] Example 2 Synthesis of acrylate-modified epoxy resin: Add 20.1 parts xylene and 0.5 parts mercaptoethanol to a reaction vessel and heat to (120-130) °C. Add dropwise a mixture of 10 parts tert-butyl carbonate, 5 parts methacrylic acid, 4 parts methyl methacrylate, 10 parts butyl methacrylate, and 1.0 part tert-butyl benzoate. Maintain the temperature for 2 hours to obtain a resin with a viscosity of 2.3 s (23 °C, Giethore tube). Cool to (100-105) °C and add 0 parts xylene, 5 parts methacrylic acid, 4 parts methyl methacrylate, 10 parts butyl methacrylate, and 1.0 part tert-butyl benzoate. After keeping 0.05 parts of benzoyl peroxide at a constant temperature for 30 min, 0.5 parts of 50% tri(2-hydroxyethyl) isocyanate solution were added dropwise over (1.5-2.5) h. After the addition was complete, the reaction was kept at a constant temperature for 1 h. The temperature was then lowered to (50-70) ℃, and 0.05 parts of hexadecyltrimethylammonium bromide and 48.8 parts of 618 epoxy resin were added. After keeping the temperature at a constant temperature for (2-2.5) h, the mixture was cooled and discharged to obtain acrylate-modified epoxy resin.

[0023] Synthesis of organosilicon cashew phenol modified amine curing agent: Add 30 parts of cashew nut shell powder and 16 parts of 2-methylpentanediamine to a reactor, heat to 50℃±5℃, add a mixture of 3.47 parts of paraformaldehyde and 9 parts of deionized water, then heat to about 90±5℃ and keep warm for 4-8 hours. Remove moisture and free amine by vacuuming, cool to 60-80℃, add 30.5 parts of xylene, 9 parts of double-terminated monohydroxy organosilicon prepolymer and 0.03 parts of tetraisopropyl titanate, and react for 2-3 hours to obtain organosilicon / cashew nut shell powder modified amine curing agent.

[0024] Acrylic modified epoxy resin 15 copies Epoxy resin 30 copies Phenolic epoxy resin 15 copies High-chlorinated polyethylene resin 10 copies solvent 10 points Anti-settling additives 0.3 copies Leveling agent 0.1 copies dispersant 1 copy pigment 3.6 copies filler 15 copies First, highly chlorinated polyethylene resin and solvent are uniformly dispersed in a disperser. Then, acrylate-modified epoxy resin, epoxy resin, phenolic epoxy resin, and dispersant are added and dispersed evenly. Next, leveling agent, pigment, filler, and dust-proofing agent are added to the disperser and dispersed evenly. The mixture is then transferred to a sand mill and ground until the fineness is <30μm to obtain component A, which is then discharged. Component A mixture is then uniformly mixed with organosilicon cashew phenol-modified amine curing agent at a ratio of 8:1 to obtain a temperature-resistant interpenetrating network anti-corrosion coating.

[0025] Example 3 Synthesis of acrylate-modified epoxy resin: Add 25 parts xylene and 1 part mercaptoethanol to a reactor and heat to (120-130)℃. Add dropwise a mixture of 5 parts tert-butyl carbonate, 6 parts methacrylic acid, 3 parts methyl methacrylate, 3 parts butyl methacrylate and 1.4 parts tert-butyl benzoate. Keep the mixture at this temperature for 2 hours to obtain a resin with a viscosity of 2.1s (23℃, Giethogel tube). Cool the mixture to (100-105)℃, add 0.05 parts benzoyl peroxide and keep the mixture at this temperature for 30 minutes. Then, add 1.5 parts of 50% tri(2-hydroxyethyl) isocyanate triacrylate solution dropwise over (1.5-2.5) hours. After the addition is complete, keep the mixture at this temperature for 1 hour. Cool the mixture to (50-70)℃ and add 0.05 parts hexadecyltrimethylammonium bromide and 55 parts 618 epoxy resin. Keep the mixture at this temperature for (2-2.5) hours and then cool it down to obtain acrylate-modified epoxy resin.

[0026] Synthesis of organosilicon cashew phenol modified amine curing agent: Add 35 parts of cashew nut phenol and 13.07 parts of 2-methylpentanediamine to a reactor, heat to 50℃±5℃, add a mixture of 5 parts of paraformaldehyde and 9 parts of deionized water, heat to about 90±5℃, keep warm for (4-8)h, remove moisture and free amine by vacuuming, cool to (60-80)℃, add 29.9 parts of xylene, 8 parts of double-terminated monohydroxy organosilicon prepolymer and 0.03 parts of tetraisopropyl titanate, react for (2-3)h to obtain organosilicon / cashew nut phenol modified amine curing agent.

[0027] Group A by weight ratio: Acrylic modified epoxy resin 10 copies Epoxy resin 50 copies Phenolic epoxy resin 20 copies High-chlorinated polyethylene resin 8 copies solvent 1 point Anti-settling additives 0.3 copies Leveling agent 0.3 copies dispersant 3 copies pigment 1 copy filler 6.4 copies First, highly chlorinated polyethylene resin and solvent are uniformly dispersed in a disperser. Then, acrylate-modified epoxy resin, epoxy resin, phenolic epoxy resin, and dispersant are added and dispersed evenly. Next, leveling agent, pigment, filler, and dust-proofing agent are added to the disperser and dispersed evenly. The mixture is then transferred to a sand mill and ground until the fineness is <30μm to obtain component A, which is then discharged. Component A mixture is then uniformly mixed with organosilicon cashew phenol-modified amine curing agent at a ratio of 6:1 to obtain a temperature-resistant interpenetrating network anti-corrosion coating.

[0028] Comparative Example 1: Synthesis of acrylate-modified epoxy resin: Add 25 parts xylene and 1 part mercaptoethanol to a reactor and heat to (120-130)℃. Add dropwise a mixture of 5.5 parts tert-butyl carbonate, 6 parts methacrylic acid, 3 parts methyl methacrylate, 3 parts butyl methacrylate and 1.4 parts tert-butyl benzoate. Keep the mixture at this temperature for 2 hours to obtain a resin with a viscosity of 2.1s (23℃, Giethore tube). Cool the mixture to (100-105)℃, add 0.05 parts benzoyl peroxide and keep the mixture at this temperature for 30 minutes. Cool the mixture to (50-70)℃ and add 0.05 parts cetyltrimethylammonium bromide and 53 parts 618 epoxy resin. Keep the mixture at this temperature for (2-2.5) hours and then cool it down to obtain acrylate-modified epoxy resin.

[0029] Synthesis of organosilicon cashew phenol modified amine curing agent: Add 35 parts of cashew nut phenol and 13.07 parts of 2-methylpentanediamine to a reactor, heat to 50℃±5℃, add a mixture of 5 parts of paraformaldehyde and 9 parts of deionized water, heat to about 90±5℃, keep warm for (4-8)h, remove moisture and free amine by vacuuming, cool to (60-80)℃, add 29.9 parts of xylene, 8 parts of double-terminated monohydroxy organosilicon prepolymer and 0.03 parts of tetraisopropyl titanate, react for (2-3)h to obtain organosilicon / cashew nut phenol modified amine curing agent.

[0030] Comparative Example 2: Synthesis of acrylate-modified epoxy resin: Add 25 parts xylene and 1 part mercaptoethanol to a reactor and heat to (120-130)℃. Add dropwise a mixture of 5 parts tert-butyl carbonate, 6 parts methacrylic acid, 3 parts methyl methacrylate, 3 parts butyl methacrylate and 1.4 parts tert-butyl benzoate. Keep the mixture at this temperature for 2 hours to obtain a resin with a viscosity of 2.1s (23℃, Giethogel tube). Cool the mixture to (100-105)℃ and add 0.05 parts benzoyl peroxide. Keep the mixture at this temperature for 30 minutes. Then, add 2.5 parts of 50% tri(2-hydroxyethyl) isocyanate triacrylate solution dropwise over (1.5-2.5) hours. After the addition is complete, keep the mixture at this temperature for 1 hour. Cool the mixture to (50-70)℃ and add 0.05 parts hexadecyltrimethylammonium bromide and 53 parts 618 epoxy resin. Keep the mixture at this temperature for (2-2.5) hours and then cool it down to obtain acrylate-modified epoxy resin.

[0031] Synthesis of cashew phenol modified amine curing agent: Add 35 parts of cashew phenol and 13 parts of 2-methylpentanediamine to a reaction vessel, heat to 50℃±5℃, add a mixture of 5 parts of paraformaldehyde and 9 parts of deionized water, heat to about 90±5℃, keep warm for 4-8h, remove moisture and free amine by vacuuming, cool to (60-80)℃ and add 38 parts of xylene, react for (2-3)h to obtain cashew phenol modified amine curing agent.

[0032] Test plates were prepared using Examples 1-3 and Comparative Examples 1-2. After the test plates were completely dry, performance tests were conducted, and the results are as follows.

[0033]

Claims

1. A temperature-resistant interpenetrating network anti-corrosion coating, characterized in that: Included by weight: Group A: Group A consists of 100 portions by weight. Group B is an organosilicon cashew phenol modified amine curing agent; it is mixed according to the weight ratio of Group A to Group B, which is 5-8:

1.

2. The temperature-resistant interpenetrating network anti-corrosion coating according to claim 1, characterized in that: The solvent is a combination of aromatic solvent S-100, propylene glycol methyl ether, and ethylene glycol butyl ether, in a weight ratio of 1:0.5:0.

3.

3. The temperature-resistant interpenetrating network anti-corrosion coating according to any one of claims 1 and 2, characterized in that: The acrylate-modified epoxy resin mentioned above is obtained by the following method: Add 20-35 parts xylene and 0.5-1.0 parts mercaptoethanol to a reaction vessel and heat to 120-130℃. Add dropwise a mixture consisting of 5-10 parts tert-butyl carbonate, 5-8 parts methacrylic acid, 2-8 parts methyl methacrylate, 3-10 parts butyl methacrylate, and 1.0-2 parts tert-butyl benzoate. Maintain this temperature for 2 hours, keeping the viscosity at (2-5) s (23℃, Giethore tube). Cool to 100-105℃ and add... After holding 0.05-0.1 parts of benzoyl peroxide at a constant temperature for 30 minutes, 0.5-3.5 parts of 50% tri(2-hydroxyethyl) isocyanate triacrylate solution are added dropwise over 1.5-2.5 hours. After the addition is complete, the reaction is held at a constant temperature for 1 hour. The temperature is then lowered to 50-70°C, and 0.05-0.15 parts of hexadecyltrimethylammonium bromide and 45-55 parts of 618 epoxy resin are added. The mixture is held at a constant temperature for 2-2.5 hours, then cooled and discharged to obtain acrylate-modified epoxy resin.

4. The temperature-resistant interpenetrating network anti-corrosion coating according to claim 3, characterized in that: The 50% tri(2-hydroxyethyl) isocyanate triacrylate solution is composed of tri(2-hydroxyethyl) isocyanate triacrylate and xylene in a mass ratio of 1:

1.

5. A temperature-resistant interpenetrating network anti-corrosion coating as described in any one of claims 1 and 2, characterized in that: The organosilicon cashew phenol modified amine curing agent is prepared by adding 30-35 parts of cashew phenol and 12-16 parts of 2-methylpentanediamine into a reaction vessel, heating to 50℃±5℃, adding a mixture of 3-5 parts of paraformaldehyde and 5-12 parts of deionized water, heating to about 90±5℃, maintaining the temperature for 4-8 hours, removing moisture and free amine by vacuuming, cooling to 60-80℃, adding 25-32 parts of xylene, 8-10 parts of double-terminated monohydroxy organosilicon prepolymer and 0.03-0.05 parts of tetraisopropyl titanate, with each of the above substances weighing 100 parts, and reacting for 2-3 hours to obtain the organosilicon cashew phenol modified amine curing agent.

6. The temperature-resistant interpenetrating network anti-corrosion coating according to claim 3, characterized in that: The organosilicon cashew phenol modified amine curing agent is prepared by adding 30-35 parts of cashew phenol and 12-16 parts of 2-methylpentanediamine into a reaction vessel, heating to 50℃±5℃, adding a mixture of 3-5 parts of paraformaldehyde and 5-12 parts of deionized water, heating to about 90±5℃, maintaining the temperature for 4-8 hours, removing moisture and free amine by vacuuming, cooling to 60-80℃, adding 25-32 parts of xylene, 8-10 parts of double-terminated monohydroxy organosilicon prepolymer and 0.03-0.05 parts of tetraisopropyl titanate, with each of the above substances weighing 100 parts, and reacting for 2-3 hours to obtain the organosilicon cashew phenol modified amine curing agent.

7. The temperature-resistant interpenetrating network anti-corrosion coating according to claim 4, characterized in that: The organosilicon cashew phenol modified amine curing agent is prepared by adding 30-35 parts of cashew phenol and 12-16 parts of 2-methylpentanediamine into a reaction vessel, heating to 50℃±5℃, adding a mixture of 3-5 parts of paraformaldehyde and 5-12 parts of deionized water, heating to about 90±5℃, maintaining the temperature for 4-8 hours, removing moisture and free amine by vacuuming, cooling to 60-80℃, adding 25-32 parts of xylene, 8-10 parts of double-terminated monohydroxy organosilicon prepolymer and 0.03-0.05 parts of tetraisopropyl titanate, with each of the above substances weighing 100 parts, and reacting for 2-3 hours to obtain the organosilicon cashew phenol modified amine curing agent.

8. A method for preparing a temperature-resistant interpenetrating network anti-corrosion coating, characterized in that: First, high-chlorinated polyethylene resin and solvent are uniformly dispersed in a disperser. Then, acrylate-modified epoxy resin, epoxy resin, phenolic epoxy resin, and dispersant are added and dispersed evenly. Next, leveling agent, pigment, filler, and dust-proofing agent are added to the disperser and dispersed evenly. The mixture is then transferred to a sand mill and ground to a fineness of <30μm to obtain a mixture of components A, with each component of component A comprising 100 parts by weight. Finally, the mixture of components A and organosilicon cashew phenol-modified amine curing agent are uniformly mixed in the above proportions to obtain a heat-resistant interpenetrating network anti-corrosion coating.

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