Method, device and equipment for determining critical load of thin film, and storage medium

Abstract

This application discloses a method, apparatus, device, and storage medium for determining the critical load of a thin film. This application determines the total input energy load curve through a thin film scratch test. Based on the instantaneous normal load and total input energy in the initial stage of the scratch test, a baseline energy load curve for the entire stage is determined. Then, the failure energy load curve is determined using the energy balance method. This application performs first-order differentiation on the failure energy load curve and finds the peak value of the first-order derivative curve to determine the critical load of the thin film. This method eliminates the subjectivity of manual observation and the ambiguity of friction curves, greatly improving the repeatability of the results. Furthermore, this method eliminates the need to calculate cracking energy and peeling energy separately, avoiding the physical difficulties of directly calculating cracking energy and peeling energy. The peak value of the first-order derivative of the failure energy load curve more accurately corresponds to peeling in adhesion failure, thus the critical load can be accurately determined based on the peeling point.

Description

Technical Field

[0001] This application relates to the field of critical load determination technology, and in particular to a method, apparatus, device and storage medium for determining the critical load of a thin film. Background Technology

[0002] Currently, thin-film products are widely used in high-end manufacturing and cutting-edge technology fields, such as hard coatings like diamond-like carbon films for high-end tools, anti-reflective coatings and hardening films in optical devices, etc. These products share the common characteristic that their core functions or lifespan are highly dependent on the integrity of the surface thin film. Once the film fails, the product will be scrapped or even cause a safety accident. Critical load is a key parameter characterizing the bonding strength between the thin film and the substrate. It represents the normal load applied by the indenter when the thin film begins to experience specific failures (such as cracking or peeling). By determining the critical load of the thin film, the critical external force value at which the film buckles or peels under pressure or load can be predicted, avoiding functional failure due to instability. Therefore, accurate calculation of the critical load is crucial.

[0003] In existing methods, the critical load is mainly determined by microscopic observation and signal analysis. However, microscopic observation relies primarily on operators observing the scratch morphology using an optical microscope (OM) or scanning electron microscope (SEM) and subjectively judging the first failure point. This method is inefficient, and inconsistent judgment criteria among different operators lead to inconsistent results. Signal analysis methods include the friction coefficient mutation method and the acoustic emission signal method. However, signals such as friction coefficient or acoustic emission are mixed responses of various physical phenomena (plastic deformation, friction, cracking, and peeling). Traditional methods cannot effectively separate the signal representing failure from the substrate signal representing plastic deformation, thus failing to accurately determine the critical load.

[0004] Therefore, how to accurately and efficiently determine the critical load is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] This application provides a method, apparatus, device, and storage medium for determining the critical load of a thin film, so as to accurately and efficiently determine the critical load.

[0006] In a first aspect, this application provides a method for determining the critical load of a thin film, comprising: performing a scratch test on the thin film and collecting key data sequences during the scratch test; generating a total input power load curve based on the key data sequences; the total input power load curve representing the total input power corresponding to different instantaneous normal loads; determining the instantaneous normal load and total input power in the initial stage of the scratch test based on the total input power load curve, using the total input power in the initial stage as the baseline energy, and fitting a baseline energy load curve for the entire stage based on the instantaneous normal load and baseline energy in the initial stage; determining a failure energy load curve based on the total input power load curve and the baseline energy load curve, and performing a first-order derivative on the failure energy load curve, using the instantaneous normal load corresponding to the peak value of the first-order derivative curve as the critical load of the thin film.

[0007] Optionally, a scratch test is performed on the thin film, and key data sequences during the scratch test are collected, including: performing a scratch test on the thin film and collecting key data during the scratch test at each data acquisition point to generate key data sequences; the key data sequences include: instantaneous normal load sequence, instantaneous tangential force sequence, and indenter lateral displacement sequence.

[0008] Optionally, generating the total input power load curve based on the key data sequence includes: determining the displacement step size for data acquisition using the lateral displacement sequence of the indenter; determining the total input power at each data acquisition point based on the displacement step size and the instantaneous tangential force at each data acquisition point in the instantaneous tangential force sequence; and generating the total input power load curve based on the instantaneous normal load at each data acquisition point in the instantaneous normal load sequence and the total input power at each data acquisition point.

[0009] Optionally, the total input work of each data acquisition point is determined based on the displacement step size and the instantaneous tangential force of each data acquisition point in the instantaneous tangential force sequence, including: calculating the total input work of each data acquisition point using a discrete summation formula;

[0010] The discrete summation formula is as follows:

[0011] ;

[0012] in, This represents the total input power of the i-th data acquisition point. This represents the instantaneous tangential force at the j-th data acquisition point. Indicates the displacement step size.

[0013] Optionally, determining the instantaneous normal load and total input power in the initial stage of the scratch test based on the total input power load curve includes: determining the initial range of the normal load in the initial stage of the scratch test; and determining, based on the initial range of the normal load, each instantaneous normal load within the initial range of the normal load and the total input power corresponding to each instantaneous normal load within the initial range from the total input power load curve.

[0014] Optionally, the step of fitting the baseline energy load curve for the entire stage based on the instantaneous normal load and baseline energy of the initial stage includes: fitting the instantaneous normal load and baseline energy of the initial stage using a high-order polynomial to generate the baseline energy load function of the initial stage; and extrapolating the baseline energy load function of the initial stage to the entire load range to obtain the baseline energy load curve for the entire stage.

[0015] Optionally, determining the failure energy load curve based on the total input power load curve and the baseline energy load curve includes: subtracting the total input power load curve from the baseline energy load curve to obtain the failure energy load curve.

[0016] Secondly, this application provides a device for determining the critical load of a thin film, comprising:

[0017] The data acquisition module is used to perform scratch tests on the thin film and acquire key data sequences during the scratch test.

[0018] The total input power load curve generation module is used to generate a total input power load curve based on the key data sequence; the total input power load curve is used to represent the total input power corresponding to different instantaneous normal loads.

[0019] The data determination module is used to determine the instantaneous normal load and total input power in the initial stage of the scratch test based on the total input power load curve.

[0020] The baseline energy load curve generation module is used to take the total input work in the initial stage as the baseline energy, and fit the baseline energy load curve for the entire stage based on the instantaneous normal load and baseline energy in the initial stage.

[0021] The failure energy load curve generation module is used to determine the failure energy load curve based on the total input power load curve and the baseline energy load curve.

[0022] The critical load determination module is used to perform first-order differentiation on the failure energy load curve and take the instantaneous normal load corresponding to the peak value of the first-order derivative curve as the critical load of the thin film.

[0023] Thirdly, this application provides an electronic device, comprising:

[0024] Memory, used to store computer programs;

[0025] A processor is used to implement the steps of the above-described critical load determination method when executing the computer program.

[0026] Fourthly, this application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of the above-described critical load determination method.

[0027] Compared with the prior art, the technical solutions provided in this application have the following advantages: This application provides a method, apparatus, device, and storage medium for determining the critical load of a thin film. This solution determines the critical load of a thin film based on the energy balance method. In the initial stage before the thin film fails, the total input work equals the baseline energy. When the thin film fails, the total input work equals the sum of the baseline energy and the failure energy. Therefore, after determining the total input work load curve through a thin film scratch test, this application determines the baseline energy load curve for the entire stage based on the instantaneous normal load and total input work in the initial stage of the scratch test. Then, according to the energy balance method, the failure energy load curve can be determined through the total input work load curve and the baseline energy load curve. The critical load is the knee point where the slope of the failure energy load curve increases dramatically. Therefore, after performing the first derivative of the failure energy load curve, this application can determine the critical load of the film by finding the peak value of the first derivative curve. This method eliminates the subjectivity of manual observation and the ambiguity of the friction curve, greatly improving the repeatability of the results. Furthermore, the failure energy determined by this method is the sum of cracking energy and peeling energy, eliminating the need to calculate cracking energy and peeling energy separately, thus avoiding the physical difficulties of directly calculating cracking energy and peeling energy. The peak value of the first derivative of the failure energy load curve corresponds more accurately to the peeling point in adhesion failure, thereby accurately determining the critical load based on the peeling point. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0031] Figure 1 A schematic flowchart illustrating a method for determining the critical load of a thin film, provided in an embodiment of this application;

[0032] Figure 2 A schematic diagram of a critical load determination device for a thin film provided in an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of an electronic device structure provided in an embodiment of this application. Detailed Implementation

[0034] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0036] In the existing technology, the critical load is mainly determined by the following two methods.

[0037] 1. Traditional microscopic observation method is highly subjective: it relies on operators to observe the morphology of scratches through optical microscopes or scanning electron microscopes and subjectively judge the first failure point. It is highly subjective, inefficient and unstable.

[0038] 2. Signal analysis method, which has fuzziness, includes: coefficient of friction ( The mutation method: Traditional methods attempt to define the critical load by finding abrupt changes or inflection points on the friction coefficient-load curve. However, such mutations are usually gradual or masked by noise signals (such as plastic deformation, debris), leading to difficulties in identification. Very vague and inaccurate. Acoustic emission (AE) signal method: Similarly, the peak value of the acoustic emission signal does not always correspond one-to-one with the actual adhesion failure and may be interfered with by the cohesive failure signal of the film.

[0039] The fundamental problem with signal analysis methods lies in the fact that signals such as friction coefficients or acoustic emissions are mixed responses to various physical phenomena (plastic deformation, friction, cracking, and peeling). Traditional methods cannot effectively separate the signals representing failure from the substrate signals representing plastic deformation. Therefore, this application provides a method, apparatus, device, and storage medium for determining the critical load of a thin film. This solution is based on a more fundamental physical principle (energy conservation) to separate the energy used to generate failure (cracking, peeling) from the total energy, thereby achieving objective identification of the critical load and accurately and efficiently determining the critical load.

[0040] See Figure 1 The above is a flowchart illustrating a method for determining the critical load of a thin film according to an embodiment of this application. The method specifically includes the following steps.

[0041] S101. Perform a scratch test on the thin film and collect key data sequences during the scratch test.

[0042] In this application, to determine the critical load of the thin film, a scratch test is first performed on the film, and key data sequences during the scratch test are collected. The scratch test is a standardized mechanical property test method used to evaluate the adhesion between the thin film and the substrate. When performing a scratch test on the thin film, a standard progressive loading scratch test needs to be performed, for example, a normal load. linearly increasing from 0 to Throughout the scratching process, various key data are collected at high frequency and stored as key data sequences.

[0043] In another embodiment of this application, the process of performing a scratch test on the thin film and collecting key data sequences during the scratch test specifically includes the following: performing a scratch test on the thin film and collecting key data during the scratch test at each data acquisition point to generate a key data sequence; the key data sequence includes: instantaneous normal load sequence, instantaneous tangential force sequence, and indenter lateral displacement sequence.

[0044] In this application, the data acquisition point can be different times when key data is collected. The key data is the data used to determine the critical load, including: instantaneous normal load, instantaneous tangential force, and indenter lateral displacement. The instantaneous normal load collected by each data acquisition point is stored as an instantaneous normal load sequence, the instantaneous tangential force collected by each data acquisition point is stored as an instantaneous tangential force sequence, and the indenter lateral displacement collected by each data acquisition point is stored as an indenter lateral displacement sequence. These three sequences are the key data sequences.

[0045] S102. Generate a total input power load curve based on the key data sequence; this total input power load curve is used to represent the total input power corresponding to different instantaneous normal loads.

[0046] In this application, after obtaining the above-mentioned key data sequence, the total input work corresponding to different instantaneous normal loads can be determined based on the key data sequence, and the total input work load curve can be generated.

[0047] Specifically, this application uses energy balance analysis to determine the critical load. Therefore, this application establishes a total input work model, which is the total input work done by the indenter during the scratching process. The total input power is mainly dissipated in two parts.

[0048] 1. Baseline Energy Used for non-failure dissipation such as plastic deformation (grooving) and pure friction (heat generation).

[0049] 2. Failure Energy : Used to generate new surfaces, namely interfacial bonding energy (film peeling from substrate) and crack propagation energy (film cracking itself).

[0050] Before the film fails ( ): 0. At this point, the total input power is... All equal to baseline energy When the thin film fails ( ): 0. At this point, the total input power is... .

[0051] S103. Based on the total input power load curve, determine the instantaneous normal load and total input power in the initial stage of the scratch test. Take the total input power in the initial stage as the baseline energy. Based on the instantaneous normal load and baseline energy in the initial stage, fit the baseline energy load curve for the entire stage.

[0052] In this application, after generating the total input power load curve based on the key data sequence, the baseline energy load curve of the initial stage can be fitted by the instantaneous normal load and total input power in the initial stage of the scratch test, based on the characteristic that the failure energy is approximately zero before the film fails, and then the baseline energy load curve of the entire stage can be generated.

[0053] In another embodiment of this application, the process of determining the instantaneous normal load and total input power in the initial stage of the scratch test based on the total input power load curve specifically includes: determining the initial range of the normal load in the initial stage of the scratch test; and determining, based on the initial range of the normal load, each instantaneous normal load within the initial range of the normal load and the total input power corresponding to each instantaneous normal load within the initial range from the total input power load curve.

[0054] Specifically, this application refers to the stage before the film fails as the initial stage of the scratch test. In this initial stage, the film is in a low-load region, and the corresponding initial range of normal load can be preset. For example, the instantaneous normal load in the initial stage can be set to account for 0% to 20% of the total load; therefore, the initial range of normal load is 0% to 20%. Then, from the total input power load curve, the instantaneous normal loads within the 0% to 20% range, and the corresponding total input power, are found. Since the total input power before the film fails is entirely equal to the baseline energy, this application uses the total input power of the initial node as the baseline energy. Finally, based on the instantaneous normal load and baseline energy in the initial stage, the baseline energy load curve for the initial stage can be fitted, thereby generating the baseline energy load curve for the entire stage.

[0055] S104. Based on the total input power load curve and the baseline energy load curve, determine the failure energy load curve, and perform a first derivative on the failure energy load curve. The instantaneous normal load corresponding to the peak value of the first derivative curve is taken as the critical load of the thin film.

[0056] In this application, since the total input power is mainly dissipated as baseline energy and failure energy, after determining the total input power load curve and baseline energy load curve through the above process, the failure energy load curve can be determined based on energy conservation. In another embodiment of this application, the process of determining the failure energy load curve based on the total input power load curve and baseline energy load curve specifically includes: subtracting the baseline energy load curve from the total input power load curve to obtain the failure energy load curve.

[0057] Specifically, this application does not require separate calculation of cracking energy. and stripping energy This application allows for the direct calculation of their sum through energy balance, i.e. Through the general formula of energy balance Rearranging the terms, we get: ;in, This is the total input power load curve. To fit the extrapolated baseline energy load curve, the total input power load curve is subtracted from the baseline energy load curve to obtain a new failure energy load curve. .

[0058] The failure energy load curve determined by the above process in this application represents the total failure energy. With load A changing curve. And... (The critical load for attachment failure) is objectively defined as The knee point where the slope of the curve increases dramatically, or more precisely, its first derivative. The point on the curve where the first significant peak appears, and the instantaneous normal load corresponding to that point, is the critical load of the thin film.

[0059] Therefore, in this application, in determining the critical load... At that time, it is necessary to analyze the failure energy load curve. Taking the first derivative yields the energy dissipation rate versus load curve. The physical meaning of this derivative curve is: how much energy is used for failure for every unit increase in load.

[0060] Among them, When the derivative curve is near 0, the derivative curve is near 0. At the (cracking point), the derivative curve begins to rise slightly to a lower plateau. (At the peeling point) due to When the slope increases dramatically, a very significant peak or step will appear on the derivative curve. At this point, it is possible to... As critical load .

[0061] In summary, this application determines the critical load in this way without requiring subjective human judgment of the first failure point, thus eliminating the subjectivity of manual observation, improving computational efficiency, and greatly improving the repeatability of the results. Furthermore, the peak value of the first derivative of the failure energy load curve corresponds more precisely to the peeling point in the adhesion failure in physics, thereby accurately determining the critical load based on the peeling point and improving the accuracy of the critical load.

[0062] In another embodiment of this application, the process of generating the total input power load curve based on the key data sequence includes: determining the displacement step size of data acquisition through the lateral displacement sequence of the indenter; determining the total input power of each data acquisition point based on the displacement step size and the instantaneous tangential force of each data acquisition point in the instantaneous tangential force sequence; and generating the total input power load curve based on the instantaneous normal load of each data acquisition point in the instantaneous normal load sequence and the total input power of each data acquisition point.

[0063] Specifically, determining the total input work of each data acquisition point based on the displacement step size and the instantaneous tangential force at each data acquisition point in the instantaneous tangential force sequence includes: calculating the total input work of each data acquisition point using a discrete summation formula; the discrete summation formula is:

[0064] ;

[0065] in, This represents the total input power of the i-th data acquisition point. This represents the instantaneous tangential force at the j-th data acquisition point. Indicates the displacement step size.

[0066] In this application, the key data collected includes: instantaneous normal load. Instantaneous tangential force (friction) Lateral displacement of the pressure head (or a constant scratch speed v), where t represents time. Calculate the total input power based on the above data. First, determine the pressure head at... The work done on a small displacement is ,in, The sign is the differential. From the scratch to any normal load. The cumulative total input work done at (corresponding position x) for: In actual calculations, the discrete summation formula is used to calculate the total input work: ,in This refers to the displacement step size for data acquisition. After calculating the total input work corresponding to each instantaneous normal load, a curve of actual total work versus load can be obtained, i.e., the total input work-load curve. .

[0067] In summary, this application can accurately calculate the total input work corresponding to each instantaneous normal load by collecting instantaneous normal load, instantaneous tangential force, and indenter lateral displacement, as well as the corresponding discrete summation formula, thereby generating a total input work load curve, so as to provide a data foundation for determining the critical load in subsequent processes.

[0068] In another embodiment of this application, the process of fitting the baseline energy load curve for the entire stage based on the instantaneous normal load and baseline energy of the initial stage includes: fitting the instantaneous normal load and baseline energy of the initial stage with a high-order polynomial to generate the baseline energy load function of the initial stage; and extrapolating the baseline energy load function of the initial stage to the entire load range to obtain the baseline energy load curve for the entire stage.

[0069] In this application, due to baseline energy This refers to the energy consumed by the system (i.e., the work done by pure plastic deformation and friction) assuming no failure (cracking, peeling) occurs. Therefore, in this application, the initial stage of the scratch (low load area, e.g.) is utilized. Data from the range of 0% to 20% of the total load was used to establish... The model is based on the reasonable assumption that the thin film is intact at this stage. The specific modeling method is as follows:

[0070] 1. In In the initial stage, .

[0071] 2. Through analysis, it was found that, and This stage typically exhibits a nonlinear relationship; for example, according to Hertz's contact theory and friction law, After points may be The higher-order polynomials; therefore, this application uses polynomial fitting to establish Model. For example, this application can use a second- or third-order polynomial to fit the initial stage. data:

[0072] Where a, b, c, and d are all polynomial coefficients, and their specific values ​​are determined by fitting the polynomial coefficients.

[0073] 3. The fitted result Extrapolate the function to the entire load range (0 to 10 ... This extrapolation curve represents the energy that should be consumed under all loads in an ideal, failure-free scenario.

[0074] After determining the baseline energy load curve through the above process, the failure energy load curve can be determined by the total input power load curve and the baseline energy load curve. The first derivative of the failure energy load curve is then calculated, and the instantaneous normal load corresponding to the peak value of the first derivative curve is taken as the critical load of the thin film.

[0075] In summary, this application provides a method for objectively, accurately, and quantitatively determining the critical load of a thin film in a thin film scratch test. The new solution predicts the failure point by analyzing the energy input and dissipation relationship during the scratching process. The analysis of the technical solution above shows that, compared with traditional solutions, this solution has at least the following advantages:

[0076] 1. Objectivity and repeatability: This scheme uses... The inflection point of the curve (a clear mathematical characteristic) is used to define... This eliminates the subjectivity of manual observation and the ambiguity of friction curves, greatly improving the repeatability of the results.

[0077] 2. Clear physical meaning: This method is based on the law of conservation of energy (the first law of thermodynamics). The determination of the failure is directly linked to the physical process of failure (the generation of a new surface requires energy), which is more convincing than simple signal analysis.

[0078] 3. Solved the quantification problem: The ingenuity of this solution lies in its avoidance of direct calculation. or The physical problem is not solved by analyzing their sum. Inversely deduce the energy dissipation rate of the curve from the point of abrupt change. Furthermore, when determining the critical load, the search is not for... The starting point (which might just be a crack), but... The peak value of the first derivative, this definition more precisely corresponds to attachment failure (peeling) in physics.

[0079] The critical load determination device provided in the embodiments of this application is described below. The critical load determination device described below and the critical load determination method described above can be referred to in correspondence.

[0080] See Figure 2 , Figure 2 This application provides a schematic diagram of a device for determining the critical load of a thin film, which specifically includes:

[0081] The data acquisition module 11 is used to perform a scratch test on the thin film and acquire key data sequences during the scratch test.

[0082] The total input power load curve generation module 12 is used to generate a total input power load curve based on the key data sequence; the total input power load curve is used to represent the total input power corresponding to different instantaneous normal loads.

[0083] The data determination module 13 is used to determine the instantaneous normal load and total input power in the initial stage of the scratch test based on the total input power load curve.

[0084] The baseline energy load curve generation module 14 is used to take the total input work in the initial stage as the baseline energy, and fit the baseline energy load curve for the entire stage based on the instantaneous normal load and baseline energy in the initial stage.

[0085] The failure energy load curve generation module 15 is used to determine the failure energy load curve based on the total input power load curve and the baseline energy load curve.

[0086] The critical load determination module 16 is used to perform first-order differentiation on the failure energy load curve and take the instantaneous normal load corresponding to the peak value of the first-order derivative curve as the critical load of the thin film.

[0087] As an optional embodiment, the data acquisition module is specifically used to: perform a scratch test on the thin film, and collect key data at each data acquisition point during the scratch test to generate a key data sequence; the key data sequence includes: instantaneous normal load sequence, instantaneous tangential force sequence, and indenter lateral displacement sequence.

[0088] As an optional embodiment, the total input power load curve generation module is specifically used to: determine the displacement step size of data acquisition through the transverse displacement sequence of the pressure head; determine the total input power of each data acquisition point based on the displacement step size and the instantaneous tangential force of each data acquisition point in the instantaneous tangential force sequence; and generate the total input power load curve based on the instantaneous normal load of each data acquisition point in the instantaneous normal load sequence and the total input power of each data acquisition point.

[0089] As an optional embodiment, the total input power load curve generation module is specifically used to: calculate the total input power at each data acquisition point using a discrete summation formula; the discrete summation formula is:

[0090] ;

[0091] in, This represents the total input power of the i-th data acquisition point. This represents the instantaneous tangential force at the j-th data acquisition point. Indicates the displacement step size.

[0092] As an optional embodiment, the data determination module is specifically used to: determine the initial range of normal load in the initial stage of the scratch test; and, based on the initial range of normal load, determine each instantaneous normal load within the initial range of normal load, and the total input power corresponding to each instantaneous normal load within the initial range, from the total input power load curve.

[0093] As an optional embodiment, the baseline energy load curve generation module is specifically used to: generate the baseline energy load function of the initial stage by fitting the instantaneous normal load and baseline energy of the initial stage with a high-order polynomial; and extrapolate the baseline energy load function of the initial stage to the entire load range to obtain the baseline energy load curve of the entire stage.

[0094] As an optional embodiment, the failure energy load curve generation module is specifically used to: subtract the total input power load curve from the baseline energy load curve to obtain the failure energy load curve.

[0095] Figure 3 A structural diagram of an electronic device provided in an embodiment of the present invention, such as... Figure 3 As shown, it includes: a memory 20 for storing a computer program; and a processor 21 for executing the computer program to implement the steps of the critical load determination method as described in the above embodiment.

[0096] The electronic devices provided in this embodiment may include, but are not limited to, smartphones, tablets, laptops, or desktop computers.

[0097] The processor 21 may include one or more processing cores, such as a quad-core processor or an octa-core processor. The processor 21 may be implemented using at least one hardware form selected from Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), and Programmable Logic Array (PLA). The processor 21 may also include a main processor and a coprocessor. The main processor, also known as the Central Processing Unit (CPU), is used to process data in the wake-up state; the coprocessor is a low-power processor used to process data in the standby state. In some embodiments, the processor 21 may integrate a Graphics Processing Unit (GPU), which is responsible for rendering and drawing the content to be displayed on the screen. In some embodiments, the processor 21 may also include an Artificial Intelligence (AI) processor, which handles computational operations related to machine learning.

[0098] The memory 20 may include one or more computer-readable storage media, which may be non-transitory. The memory 20 may also include high-speed random access memory and non-volatile memory, such as one or more disk storage devices or flash memory devices. In this embodiment, the memory 20 is used to store at least the following computer program 201, which, after being loaded and executed by the processor 21, is capable of implementing the relevant steps of the critical load determination method disclosed in any of the foregoing embodiments. In addition, the resources stored in the memory 20 may also include an operating system 202 and data 203, and the storage method may be temporary storage or permanent storage. The operating system 202 may include Windows, Unix, Linux, etc.

[0099] In some embodiments, the electronic device may further include a display screen 22, an input / output interface 23, a communication interface 24, a power supply 25, and a communication bus 26.

[0100] Those skilled in the art will understand that Figure 3 The structures shown do not constitute a limitation on electronic devices and may include more or fewer components than those shown.

[0101] In another exemplary embodiment, a computer storage medium is also provided, wherein the program instructions, when executed by a processor, implement the steps of the data deduplication method described in any of the above method embodiments.

[0102] It is understood that if the critical load determination method in the above embodiments is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the current technology, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and executes all or part of the steps of the methods in the various embodiments of the present invention. The aforementioned storage medium includes: USB flash drive, mobile hard drive, read-only memory (ROM), random access memory (RAM), electrically erasable programmable ROM, register, hard disk, removable disk, CD-ROM, magnetic disk, or optical disk, and other media capable of storing program code.

[0103] Optionally, specific examples in this embodiment can refer to the examples described in the above embodiments, and will not be repeated here.

[0104] The various embodiments described in this specification are presented in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” used herein may also mean the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a specific order described or illustrated, unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0105] It should be noted that, in the optional embodiments of this application, the data related to object information, when applied to specific products or technologies, requires the permission or consent of the object. Furthermore, the collection, use, and processing of this data must comply with the relevant laws, regulations, and standards of the relevant countries and regions. In other words, if the embodiments of this application involve data related to an object, it must be obtained with the permission and consent of the object, the permission and consent of relevant departments, and in accordance with the relevant laws, regulations, and standards of the country and region. If the embodiments involve personal information, the acquisition of all personal information requires the consent of the individual. If sensitive information is involved, the separate consent of the information subject is required. The embodiments also need to be implemented with the permission and consent of the object.

[0106] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method of determining a critical load of a thin film, characterized by, include: Scratch tests were performed on the thin film, and key data sequences during the scratch tests were collected; A total input power load curve is generated based on the key data sequence; the total input power load curve is used to represent the total input power corresponding to different instantaneous normal loads; Based on the total input power load curve, the instantaneous normal load and total input power in the initial stage of the scratch test are determined. The total input power in the initial stage is used as the baseline energy. Based on the instantaneous normal load and baseline energy in the initial stage, the baseline energy load curve for the entire stage is fitted. Based on the total input power load curve and the baseline energy load curve, the failure energy load curve is determined, and the first derivative of the failure energy load curve is taken. The instantaneous normal load corresponding to the peak value of the first derivative curve is taken as the critical load of the thin film. The process includes performing a scratch test on the thin film and collecting key data sequences during the scratch test, including: performing a scratch test on the thin film and collecting key data at each data acquisition point to generate key data sequences; the key data sequences include: instantaneous normal load sequence, instantaneous tangential force sequence, and indenter lateral displacement sequence; The process of generating the total input power load curve based on the key data sequence includes: determining the displacement step size for data acquisition using the lateral displacement sequence of the pressure head; and calculating the total input power at each data acquisition point using a discrete summation formula. The discrete summation formula is as follows: ； wherein, represents the total input power at the i-th data collection point, represents the instantaneous tangential force at the j-th data collection point, represents the displacement step; Based on the instantaneous normal load at each data acquisition point in the instantaneous normal load sequence, and the total input power at each data acquisition point, a total input power load curve is generated.

2. The critical load determination method according to claim 1, characterized in that, The determination of the instantaneous normal load and total input work in the initial stage of the scratch test based on the total input work load curve includes: Determine the initial range of the normal load in the initial stage of the scratch test; Based on the initial range of the normal load, determine each instantaneous normal load within the initial range of the normal load, and the total input power corresponding to each instantaneous normal load within the initial range, from the total input power load curve.

3. The critical load determination method according to claim 2, characterized in that, The process of fitting the baseline energy-load curve for the entire process based on the instantaneous normal load and baseline energy in the initial stage includes: The baseline energy load function for the initial stage is generated by fitting the instantaneous normal load and baseline energy in the initial stage with a high-order polynomial. Extrapolate the baseline energy load function of the initial stage to the entire load range to obtain the baseline energy load curve for the entire stage.

4. The critical load determination method according to any one of claims 1 to 3, characterized in that, The step of determining the failure energy load curve based on the total input power load curve and the baseline energy load curve includes: The failure energy load curve is obtained by subtracting the total input power load curve from the baseline energy load curve.

5. A device for determining the critical load of a thin film, characterized in that, include: The data acquisition module is used to perform scratch tests on the thin film and acquire key data sequences during the scratch test. The total input power load curve generation module is used to generate a total input power load curve based on the key data sequence; the total input power load curve is used to represent the total input power corresponding to different instantaneous normal loads. The data determination module is used to determine the instantaneous normal load and total input power in the initial stage of the scratch test based on the total input power load curve. The baseline energy load curve generation module is used to take the total input work in the initial stage as the baseline energy, and fit the baseline energy load curve for the entire stage based on the instantaneous normal load and baseline energy in the initial stage. The failure energy load curve generation module is used to determine the failure energy load curve based on the total input power load curve and the baseline energy load curve. The critical load determination module is used to perform first-order differentiation on the failure energy load curve and take the instantaneous normal load corresponding to the peak value of the first-order derivative curve as the critical load of the thin film. Specifically, the data acquisition module is used to: perform a scratch test on the thin film and collect key data at each data acquisition point during the scratch test to generate a key data sequence; the key data sequence includes: instantaneous normal load sequence, instantaneous tangential force sequence, and indenter lateral displacement sequence; The total input power load curve generation module is specifically used for: determining the displacement step size of data acquisition through the lateral displacement sequence of the indenter; calculating the total input power at each data acquisition point using a discrete summation formula; the discrete summation formula is: ； in, This represents the total input power of the i-th data acquisition point. This represents the instantaneous tangential force at the j-th data acquisition point. Indicates the displacement step size; Based on the instantaneous normal load at each data acquisition point in the instantaneous normal load sequence, and the total input power at each data acquisition point, a total input power load curve is generated.

6. The critical load determination device according to claim 5, characterized in that, The data determination module is specifically used for: Determine the initial range of normal load in the initial stage of the scratch test; based on the initial range of normal load, determine each instantaneous normal load within the initial range of normal load from the total input power load curve, and the total input power corresponding to each instantaneous normal load within the initial range.

7. The critical load determining device according to claim 6, characterized in that, The baseline energy load curve generation module is specifically used to: fit the instantaneous normal load and baseline energy of the initial stage with a high-order polynomial to generate the baseline energy load function of the initial stage; and extrapolate the baseline energy load function of the initial stage to the entire load range to obtain the baseline energy load curve of the entire stage.

8. The critical load determining device according to any one of claims 5 to 7, characterized in that, The failure energy load curve generation module is specifically used to: subtract the total input power load curve from the baseline energy load curve to obtain the failure energy load curve.

9. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor, configured to implement the steps of the critical load determination method as described in any one of claims 1 to 4 when executing the computer program.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the critical load determination method as described in any one of claims 1 to 4.

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