Mobile trolley device for semiconductor appearance inspection and operation method

Abstract

The invention provides a moving trolley device for semiconductor appearance inspection and an operation method, and belongs to the technical field of semiconductor appearance inspection. Comprising a bottom frame, moving wheels and telescopic sleeves, the moving wheels are arranged at the bottom of the bottom frame, and the tops of the moving wheels are fixedly connected with the telescopic sleeves. By arranging the appearance residue detection module, when debris or metal particles or other sundries exist on the appearance surface of a semiconductor, the debris or metal particles or other sundries on the semiconductor can be directly sucked away by the appearance residue detection module according to the negative pressure suction principle; whether sundries exist on the appearance surface of the semiconductor or not can be judged by detecting the air inflow during air suction, and manual observation with human eyes is not needed in the whole process, so that the possibility of eyestrain caused by long-term observation with the eyes of workers is reduced to a certain extent; and the fatigue and the body discomfort of the worker caused by sitting beside the visual observation instrument for working for a long time are reduced to a certain extent.

Description

Technical Field

[0001] This invention relates to the field of semiconductor appearance inspection technology, and in particular to a mobile cart device and operating method for semiconductor appearance inspection. Background Technology

[0002] A mobile trolley for semiconductor appearance inspection is a device used to assist in the appearance inspection of semiconductor products, which can improve the convenience and reliability of inspection.

[0003] A semiconductor appearance inspection fixture disclosed in Chinese Invention Patent Application Publication No. CN115494081A, although using a U-shaped track to avoid pin positions and allow the product to slide smoothly along the track, with a stop at the tail end to block the product and allow for minor position adjustments, only detects missing pins and markings, neglecting the detection of residues on the semiconductor appearance. Factories need to use existing inspection instruments, which are professional visual inspection instruments. These instruments require workers to sit beside them for long periods and observe the images fed back by the instruments, which not only easily causes eye fatigue but also increases worker fatigue and physical discomfort. Furthermore, the aforementioned device neglects the inspection of semiconductor appearance dimensions, and factories still need to use existing inspection methods. The current method of inspecting semiconductor appearance dimensions mostly involves workers measuring each semiconductor with professional calipers, which requires manual measurement of each semiconductor. This not only affects semiconductor inspection efficiency but also extends the semiconductor delivery time to some extent. Therefore, this application provides a mobile cart device and operating method for semiconductor appearance inspection to meet the needs. Summary of the Invention

[0004] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a mobile cart device and operating method for semiconductor appearance inspection, which solves the problems of existing devices easily increasing worker eye fatigue, exhaustion, and physical discomfort, and easily affecting inspection efficiency and extending product delivery time.

[0005] (II) Technical Solution To solve the above-mentioned technical problems, the present invention provides the following technical solution: A mobile cart device and operating method for semiconductor appearance inspection includes a bottom frame, with a movable wheel at the bottom of the bottom frame, a telescopic sleeve fixedly connected to the top of the movable wheel, a first pin hole on one side of the telescopic sleeve, a first pin inside the first pin hole, a telescopic plate mounted on the telescopic sleeve via the first pin, an inclined plate fixedly connected to the top of the telescopic plate, and a size detection module and an appearance residue detection module arranged sequentially from left to right on the top of the inclined plate.

[0006] Preferably, the size detection module includes a longitudinal block, and the front of the longitudinal block has a first threaded hole and a second threaded hole sequentially formed from left to right. The first threaded hole is internally threaded with a first long screw, and the second threaded hole is internally threaded with a second long screw. One end of the first long screw and the second long screw is provided with a rotating shaft base.

[0007] Preferably, the front side of the rotating shaft base is provided with a rotating shaft hole, the rotating shaft hole is provided with a rotating shaft, the rotating shaft and the first long screw are adapted to each other, the rotating shaft and the second long screw are adapted to each other, and a push plate is fixedly connected to the back side of the rotating shaft base.

[0008] Preferably, the back of the push plate is provided with an elliptical spring, a light-emitting buzzer host and a counter from left to right, the front of the light-emitting buzzer host is provided with a first trigger button, and the top of the light-emitting buzzer host is provided with a buzzer and a light from left to right.

[0009] Preferably, a first battery block is fixedly connected to one side of the light-up buzzer host, a second trigger button is provided on the front of the counter, a baffle is fixedly connected to one end of the elliptical spring, and a rectangular soft rubber is provided on the back of the baffle.

[0010] Preferably, the appearance residue detection module includes a vertical plate, an upper sealing plate is fixedly connected to the top of the vertical plate, a round tube adapter hole is opened on the top of the upper sealing plate, a side sealing strip is fixedly connected to one side of the vertical plate, and push rod grooves are opened on both the front and back of the vertical plate, with a push rod inside the push rod groove.

[0011] Preferably, an inverted L-shaped plate is fixedly connected to the back of the push rod, a second pin hole is provided on one side of the push rod, a second pin is provided inside the second pin hole, a vertical plate is installed on the push rod through the second pin, a suction machine is fixedly connected to the top of the upper sealing plate, a round tube is provided at one end of the suction machine, and the suction machine is threadedly connected to the round tube through a round tube bolt.

[0012] Preferably, one end of the circular tube is provided with an annular connecting plate, and the circular tube is threadedly connected to the annular connecting plate by bolts. A transparent circular tube is fixedly connected to the bottom of the annular connecting plate, and a transverse plate is fixedly connected to the inner wall of the transparent circular tube. The surface of the transparent circular tube is provided with qualified scale lines.

[0013] Preferably, a telescopic tube is fixedly connected to the bottom of the transverse plate, a laser is fixedly connected to the bottom of the telescopic tube, a laser battery block and a laser emitting lamp are arranged sequentially from top to bottom on the surface of the laser, a threaded connection end is fixedly connected to the bottom of the transparent round tube, and a dense screen plate is threadedly connected to the bottom of the threaded connection end.

[0014] A method for operating a mobile cart device for semiconductor appearance inspection includes the following steps: Step 1: The entire device is moved by the casters. The height of the tilting plate, the size detection module, and the appearance residue detection module is adjusted by the telescopic plate moving up and down inside the telescopic sleeve. The telescopic plate is fixed to the telescopic sleeve by the first pin, thus fixing the height. The device detects the semiconductor appearance size by the size detection module and detects whether there is residue on the semiconductor appearance surface by the appearance residue detection module. Step 2: The semiconductor's appearance size is first detected by the size detection module. The size detection module adjusts the positions of the push plate, baffle, and rectangular soft rubber at their respective ends through the first and second long screws, so that there is a space between the rectangular soft rubbers that matches the appearance size of the semiconductor. After the semiconductor is placed between the rectangular soft rubbers, the semiconductor squeezes the rectangular soft rubber, causing the baffle to move towards the push plate. This causes the baffle to hit the first and second trigger buttons, thereby activating the buzzer and light of the lighting and buzzing host, and starting the counter. If the semiconductor's appearance size is not in place, the buzzer and light of the lighting and buzzing host will not emit sound or light up, and the counter will not count. Step 3: After the semiconductor's appearance dimensions are inspected by the size inspection module, it needs to be inspected by the appearance residue inspection module. The position of the inverted L-shaped plate is moved by pushing and pulling the push rod, so that the space between the inverted L-shaped plates can be adapted to the semiconductor. The suction machine is started, and the negative pressure suction force will suck the debris and other residues on the semiconductor's appearance surface to the dense screen plate. Air will enter the suction machine through the transparent round tube and the round tube to circulate. The laser is started, so that the laser emission lamp emits a laser. The laser shines on the transparent round tube, and the strong negative pressure makes the laser move upward. By observing whether the laser is on the qualified scale line, it is judged whether the negative pressure suction force is qualified, and then it is determined whether there are debris and other residues on the semiconductor's appearance surface.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects: In the above solution, the size detection module reduces the time required for the device to detect whether the appearance size of the semiconductor meets the production standard. Compared with traditional methods for detecting the appearance size of semiconductors, this device does not require manual measurement with professional calipers during the detection process, which can improve the semiconductor detection efficiency to a certain extent and shorten the semiconductor delivery time to a certain extent.

[0016] By setting up an appearance residue detection module, when there are debris or metal particles on the surface of the semiconductor, the appearance residue detection module can directly suck away the debris or metal particles on the semiconductor using the principle of "negative pressure" suction. Then, by detecting the air intake during suction, it can be determined whether there are debris on the surface of the semiconductor. The entire process does not require manual observation by human eyes. This reduces the possibility of eye fatigue caused by long-term visual observation by workers, and also reduces the fatigue and physical discomfort of workers who sit in front of visual observation instruments for a long time.

[0017] In summary, the present invention has the advantages of reducing eye fatigue, tiredness and physical discomfort among workers, improving testing efficiency and reducing product delivery time. Attached Figure Description

[0018] Figure 1 A schematic diagram of a mobile cart device and its operation method for semiconductor appearance inspection; Figure 2 A schematic diagram of a mobile base assembly for a mobile cart device and operating method used for semiconductor appearance inspection; Figure 3 A schematic diagram of a telescopic plate assembly for a mobile cart device and operating method used for semiconductor appearance inspection; Figure 4 for Figure 3 Enlarged schematic diagram of a local part of the structure; Figure 5 A schematic diagram of a mobile cart device and its operation method for semiconductor appearance inspection, including a dimension detection module. Figure 6 A schematic diagram of a long rod bolt assembly for a dimensional inspection module in a mobile cart device and operating method for semiconductor appearance inspection; Figure 7 A schematic diagram of a push plate assembly for a dimensional inspection module used in semiconductor appearance inspection and its operating method. Figure 8 for Figure 7 Enlarged schematic diagram of a local part of the structure; Figure 9 A schematic diagram of a size detection module baffle assembly for a mobile cart device and operating method used for semiconductor appearance inspection; Figure 10 A schematic diagram of a mobile cart device and its operation method for semiconductor appearance inspection, including an appearance residue detection module. Figure 11 A schematic diagram of the frame assembly of the appearance residue detection module for a mobile cart device and operating method used for semiconductor appearance inspection; Figure 12 for Figure 11 Enlarged schematic diagram of a local part of the structure; Figure 13 A schematic diagram of a mobile cart device and its operation method for semiconductor appearance inspection, showing the appearance residue detection module suction machine assembly. Figure 14 A schematic diagram of a mobile cart device and its operation method for semiconductor appearance inspection, including a laser inspection assembly for appearance residue detection module; Figure 15 for Figure 14 Enlarged schematic diagram of a local part of the structure.

[0019] [Figure Labels] 1. Bottom frame; 2. Casters; 3. Telescopic sleeve; 4. First pin; 5. Telescopic plate; 6. Inclined plate; 7. Dimension detection module; 701. Longitudinal block; 702. First long screw; 703. Second long screw; 704. Rotary shaft base; 705. Rotary shaft; 706. Push plate; 707. Elliptical spring; 708. Light and buzzer main unit; 709. Counter; 710. First trigger button; 711. Buzzer; 712. Light; 713. First battery block; 714. Second trigger button; 715. Baffle; 716. Rectangular soft rubber; 8. Appearance residue detection module; 801. Vertical plate; 802. Top sealing plate; 803. Side sealing strip; 804. Push rod; 805. Inverted L-shaped plate; 806. Second pin; 807. Suction machine; 808. Round tube; 809. Circular connecting plate; 810. Transparent round tube; 811. Horizontal plate; 812. Qualified scale line; 813. Telescopic tube; 814. Laser; 815. Laser battery block; 816. Laser emitting lamp; 817. Threaded connection end; 818. Dense sieve plate.

[0020] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of the present invention. However, this is only for illustrative purposes and is not intended to limit the present invention to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0021] The following is a detailed description of a mobile cart device and operating method for semiconductor appearance inspection provided by the present invention, with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0022] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0023] like Figures 1 to 4 As shown, an embodiment of the present invention provides a mobile trolley device and operating method for semiconductor appearance inspection, including a bottom frame 1, a movable wheel 2 at the bottom of the bottom frame 1, a telescopic sleeve 3 fixedly connected to the top of the movable wheel 2, a first pin hole on one side of the telescopic sleeve 3, a first pin 4 inside the first pin hole, a telescopic plate 5 installed on the telescopic sleeve 3 through the first pin 4, an inclined plate 6 fixedly connected to the top of the telescopic plate 5, and a size detection module 7 and an appearance residue detection module 8 arranged sequentially from left to right on the top of the inclined plate 6.

[0024] The movable wheel 2 is installed at the bottom of the bottom frame 1, the telescopic sleeve 3 is welded to the top of the bottom frame 1, the telescopic plate 5 is installed inside the telescopic sleeve 3, the first pin 4 is passed through the telescopic sleeve 3 and inserted into the telescopic plate 5, the inclined plate 6 is welded to the top of the telescopic plate 5, and the size detection module 7 and the appearance residue detection module 8 are welded to the top of the inclined plate 6.

[0025] The entire device is moved by the casters 2. The height of the tilting plate 6, the size detection module 7 and the appearance residue detection module 8 are adjusted by the telescopic plate 5 moving up and down within the telescopic sleeve 3. The telescopic plate 5 is fixed to the telescopic sleeve 3 by the first pin 4, thereby fixing the height. The device detects the appearance size of the semiconductor by the size detection module 7 and detects whether there are residues on the surface of the semiconductor by the appearance residue detection module 8.

[0026] like Figures 5 to 9 As shown, in this embodiment, the size detection module 7 includes a longitudinal block 701. The front of the longitudinal block 701 is provided with a first threaded hole and a second threaded hole from left to right. The first threaded hole is internally threaded with a first long screw 702, and the second threaded hole is internally threaded with a second long screw 703. One end of the first long screw 702 and the second long screw 703 is provided with a rotating shaft base 704.

[0027] The rotating base 704 has a rotating hole on its front side, and a rotating shaft 705 is provided inside the rotating hole. The rotating shaft 705 and the first long screw 702 are adapted to each other, and the rotating shaft 705 and the second long screw 703 are adapted to each other. A push plate 706 is fixedly connected to the back side of the rotating base 704.

[0028] The back of the push plate 706 is provided with an elliptical spring 707, a light-up buzzer host 708 and a counter 709 from left to right. The front of the light-up buzzer host 708 is provided with a first trigger button 710. The top of the light-up buzzer host 708 is provided with a buzzer 711 and a light 712 from left to right.

[0029] The first battery block 713 is fixedly connected to one side of the light-up and buzzer host 708. The counter 709 has a second trigger button 714 on its front. One end of the elliptical spring 707 is fixedly connected to a baffle 715. The back of the baffle 715 has a rectangular soft rubber 716.

[0030] The longitudinal block 701 is welded to the top of the inclined plate 6. The first long screw 702 and the second long screw 703 are screwed into the first threaded hole and the second threaded hole of the longitudinal block 701, respectively. The rotating shaft base 704 is welded to the push plate 706. The rotating shaft 705 is installed into the rotating shaft hole of the rotating shaft base 704. The assembled rotating shaft 705 is fitted onto the ends of the first long screw 702 and the second long screw 703. The elliptical spring 707 is welded between the push plate 706 and the baffle 715. The light-up buzzer host 708 and the counter 709 are bolted onto the push plate 706. The first trigger button 710, the buzzer 711, the light 712, the first battery block 713 and the light-up buzzer host 708 are connected as a whole. The second trigger button 714 and the counter 709 are connected as a whole. The rectangular soft glue 716 is pasted onto the baffle 715.

[0031] By rotating the first long screw 702 and the second long screw 703, the push plates 706 at their respective ends move toward the opposing longitudinal block 701. When there is a space between the rectangular soft rubbers 716 in the two directions that can accommodate the size of the semiconductor, the rotation of the first long screw 702 and the second long screw 703 is paused. Then, the worker needs to put the semiconductor between the two rectangular soft rubbers 716. The inserted semiconductor will be squeezed toward the rectangular soft rubbers 716 on both sides. After the rectangular soft rubbers 716 are squeezed, the baffle 715 will move toward the push plate 706. At this time, the elliptical spring 707 is compressed and deformed, so that the baffle 715 can continue to move, thereby causing the baffle 715 to strike the first trigger button 710 on the light-up buzzer host 708 and the second trigger button 714 on the counter 709. At this time, the main unit 708 starts, which causes the buzzer 711 to emit sound, the light 712 to emit light, and the counter 709 to start counting. If the semiconductor's appearance dimensions do not meet the standards, the baffle 715 will not strike the first trigger button 710 and the second trigger button 714. At this time, no sound or light will be emitted, and the counter 709 will not count. The worker needs to remove the semiconductor.

[0032] By incorporating the dimension detection module 7, the time required for the device to detect whether the semiconductor's appearance dimensions meet production standards is reduced. Compared to traditional methods for detecting semiconductor appearance dimensions, this device eliminates the need for manual measurement with professional calipers during the detection process. This can improve semiconductor detection efficiency to some extent and shorten the semiconductor's delivery time to some extent.

[0033] like Figures 10 to 15 As shown, in this embodiment, the appearance residue detection module 8 includes a vertical plate 801, an upper sealing plate 802 is fixedly connected to the top of the vertical plate 801, a round tube adapter hole is opened on the top of the upper sealing plate 802, a side sealing strip 803 is fixedly connected to one side of the vertical plate 801, and push rod grooves are opened on both the front and back of the vertical plate 801, and a push rod 804 is provided inside the push rod groove.

[0034] An inverted L-shaped plate 805 is fixedly connected to the back of the push rod 804. A second pin hole is provided on one side of the push rod 804. A second pin 806 is provided inside the second pin hole. A vertical plate 801 is installed on the push rod 804 through the second pin 806. A suction machine 807 is fixedly connected to the top of the upper sealing plate 802. A round tube 808 is provided at one end of the suction machine 807. The round tube 808 is threadedly connected to the suction machine 807 through a round tube bolt.

[0035] One end of the round tube 808 is provided with a circular connecting plate 809. The circular connecting plate 809 is connected to the round tube 808 by a bolt thread. A transparent round tube 810 is fixedly connected to the bottom of the circular connecting plate 809. A transverse plate 811 is fixedly connected to the inner wall of the transparent round tube 810. The surface of the transparent round tube 810 is provided with a qualified scale line 812.

[0036] A telescopic tube 813 is fixedly connected to the bottom of the horizontal plate 811. A laser 814 is fixedly connected to the bottom of the telescopic tube 813. A laser battery block 815 and a laser emitting lamp 816 are arranged sequentially from top to bottom on the surface of the laser 814. A threaded connection end 817 is fixedly connected to the bottom of the transparent round tube 810. A dense screen plate 818 is threadedly connected to the bottom of the threaded connection end 817.

[0037] The vertical plate 801 is welded to the top of the inclined plate 6. The upper sealing plate 802 is welded to the top of the vertical plate 801. The side sealing strip 803 is pasted to the side of the vertical plate 801. The push rod 804 is placed into the push rod groove of the vertical plate 801. The inverted L-shaped plate 805 is welded to the push rod 804. The second pin 806 is passed through the vertical plate 801 and inserted into the push rod 804. The suction machine 807 is welded to the top of the upper sealing plate 802. The round tube 808 is installed on the suction machine 807 using round tube bolts. The annular connecting plate 809 is connected via... The annular connecting plate is bolted onto the circular tube 808. The transparent circular tube 810 and the annular connecting plate 809 are integrally connected. The transverse plate 811 is welded onto the inner wall of the transparent circular tube 810. The qualified scale line 812 is integrally connected to the transparent circular tube 810. The telescopic tube 813 is welded between the transverse plate 811 and the laser 814. The photocell block 815 and the laser 814 are integrally connected. The threaded connection end 817 is integrally connected to the transparent circular tube 810. The dense screen plate 818 is screwed onto the threaded connection end 817.

[0038] By having workers push and pull push rod 804, the inverted L-shaped plate 805 moves towards the opposite inverted L-shaped plate 805, thereby allowing the space between the inverted L-shaped plates 805 to adapt to the external dimensions of the semiconductor. Then, the vertical plate 801 and the inverted L-shaped plate 805 are fixed together using the second pin 806. The suction machine 807 is started, and the generated negative pressure suction will draw debris and other residues from the semiconductor's surface onto the dense sieve plate 818. The residues will clog the dense sieve plate 818. During negative pressure suction, only a small portion of the outside air can enter. Inside the transparent round tubes 810 and 808, air enters the suction machine 807 through the transparent round tubes 810 and 808 in rotation. The laser 814 is activated, causing the laser emitting lamp 816 to emit a laser. The laser shines on the transparent round tube 810, and the strong negative pressure causes the laser 814 to move upward. The amount of air sucked up determines how much the laser 814 can rise. Then, by observing whether the laser is on the qualified scale line 812, it is determined whether the negative pressure suction is qualified, and then it is determined whether there are debris or other residues on the surface of the semiconductor.

[0039] By setting up the appearance residue detection module 8, when there are debris or metal particles on the surface of the semiconductor, the appearance residue detection module 8 can directly suck away the debris or metal particles on the semiconductor using the principle of "negative pressure" suction. Then, by detecting the air intake during suction, it can be determined whether there are debris on the surface of the semiconductor. The whole process does not require manual observation by human eyes. This reduces the possibility of eye fatigue caused by long-term visual observation by workers to a certain extent, and also reduces the fatigue and physical discomfort of workers who sit in front of visual observation instruments for a long time.

[0040] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0041] A method of operating a mobile cart device for semiconductor appearance inspection includes the following steps during use; Step 1: The entire device is moved by the moving wheels 2. The height of the tilting plate 6, the size detection module 7 and the appearance residue detection module 8 are adjusted by the telescopic plate 5 moving up and down in the telescopic sleeve 3. The telescopic plate 5 is fixed to the telescopic sleeve 3 by the first pin 4, thereby fixing the height. The device detects the appearance size of the semiconductor by the size detection module 7 and detects whether there is residue on the surface of the semiconductor by the appearance residue detection module 8. Step 2: The semiconductor's appearance size is first detected by the size detection module 7. The size detection module 7 first adjusts the positions of the push plate 706, baffle 715 and rectangular soft rubber 716 at their respective ends through the first long screw 702 and the second long screw 703, so that there is a space for the semiconductor's appearance size between the rectangular soft rubber 716. After the semiconductor is placed between the rectangular soft rubber 716, the semiconductor squeezes the rectangular soft rubber 716, causing the baffle 715 to move towards the push plate 706, so that the baffle 715 hits the first trigger button 710 and the second trigger button 714, thereby making the buzzer 711 and the light 712 of the light-up buzzer host 708 work, and the counter 709 starts counting. If the semiconductor's appearance size is not in place, the buzzer 711 and the light 712 of the light-up buzzer host 708 will not make a sound or light up, and the counter 709 will not count. Step 3: After the semiconductor's appearance dimensions are inspected by the size inspection module 7, it needs to be inspected by the appearance residue inspection module 8. The position of the inverted L-shaped plate 805 is moved by the push-pull push rod 804, so that the space between the inverted L-shaped plates 805 can be adapted to the semiconductor. The suction machine 807 is started, and the negative pressure suction force will suck the debris and other residues on the semiconductor's appearance surface onto the dense screen plate 818. Air will enter the suction machine 807 through the transparent round tube 810 and the round tube 808 in rotation. The laser 814 is started, so that the laser emitting lamp 816 emits a laser. The laser shines on the transparent round tube 810. The strong negative pressure causes the laser 814 to move upward. By observing whether the laser is on the qualified scale line 812, it is determined whether the negative pressure suction force is qualified, and then it is determined whether there are debris and other residues on the semiconductor's appearance surface.

[0042] The technical solution provided by this invention: The entire device is moved by the moving wheels 2. The height of the tilting plate 6, the size detection module 7, and the appearance residue detection module 8 are adjusted by the up-and-down movement of the telescopic plate 5 within the telescopic sleeve 3. The telescopic plate 5 is fixed to the telescopic sleeve 3 by the first pin 4, thereby fixing the height. The device detects the appearance size of the semiconductor through the size detection module 7 and detects whether there is residue on the surface of the semiconductor through the appearance residue detection module 8. By rotating the first long screw 702 and the second long screw 703, the push plates 706 at their respective ends move towards the opposing vertical block 701. There is a space between the rectangular soft rubber 716 in the two directions that can accommodate the semiconductor. When the size is determined, the rotation of the first long screw 702 and the second long screw 703 is paused. Then, the worker needs to place the semiconductor between the two rectangular soft rubbers 716. The placed semiconductor will be squeezed towards the rectangular soft rubbers 716 on both sides. After the rectangular soft rubbers 716 are squeezed, the baffle 715 will move towards the push plate 706. At this time, the elliptical spring 707 is compressed and deformed, allowing the baffle 715 to continue to move. This causes the baffle 715 to strike the first trigger button 710 on the light-up buzzer host 708 and the second trigger button 714 on the counter 709. At this time, the light-up buzzer host 708 is activated, which causes the buzzer 711 to sound and the light 712 to illuminate. The counter... The counter 709 can start counting. If the semiconductor's dimensions do not meet the requirements, the baffle 715 will not strike the first trigger button 710 and the second trigger button 714. At this time, no sound or light will be emitted, and the counter 709 will not count. The worker needs to remove the semiconductor by pushing and pulling the push rod 804, which moves the inverted L-shaped plate 805 towards the opposite inverted L-shaped plate 805, so that the space between the inverted L-shaped plates 805 can fit the semiconductor's dimensions. Then, the second pin 806 is used to fix the vertical plate 801 and the inverted L-shaped plate 805 together. The suction machine 807 is started, and the negative pressure suction force removes debris and other residues from the semiconductor's surface. The residue will be sucked onto the dense sieve plate 818 and will clog the dense sieve plate 818. During negative pressure suction, only a small portion of the outside air can enter the transparent round tube 810 and round tube 808. The air will enter the suction machine 807 through the transparent round tube 810 and round tube 808 and rotate. The laser 814 is activated, causing the laser emitting lamp 816 to emit a laser. The laser shines on the transparent round tube 810. The strong negative pressure causes the laser 814 to move upward. The amount of air sucked will determine how much the laser 814 can rise. Then, by observing whether the laser is on the qualified scale line 812, it is determined whether the negative pressure suction is qualified. Then, it is determined whether there are debris or other residues on the surface of the semiconductor.

[0043] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0044] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A mobile cart device for semiconductor appearance inspection, characterized in that, Includes a bottom frame (1), the bottom of the bottom frame (1) is provided with a movable wheel (2), the top of the movable wheel (2) is fixedly connected with a telescopic sleeve (3), a first pin hole is provided on one side of the telescopic sleeve (3), a first pin (4) is provided inside the first pin hole, a telescopic plate (5) is installed on the telescopic sleeve (3) through the first pin (4), an inclined plate (6) is fixedly connected to the top of the telescopic plate (5), and a size detection module (7) and an appearance residue detection module (8) are provided on the top of the inclined plate (6) from left to right.

2. The mobile cart device for semiconductor appearance inspection according to claim 1, characterized in that, The size detection module (7) includes a longitudinal block (701). The front of the longitudinal block (701) is provided with a first threaded hole and a second threaded hole from left to right. The first threaded hole is connected to a first long screw (702) by internal thread. The second threaded hole is connected to a second long screw (703) by internal thread. One end of the first long screw (702) and the second long screw (703) is provided with a rotating shaft base (704).

3. The mobile cart device for semiconductor appearance inspection according to claim 2, characterized in that, The rotating base (704) has a rotating hole on its front side, and a rotating shaft (705) is provided inside the rotating hole. The rotating shaft (705) and the first long screw (702) are adapted to each other, and the rotating shaft (705) and the second long screw (703) are adapted to each other. A push plate (706) is fixedly connected to the back side of the rotating base (704).

4. The mobile cart device for semiconductor appearance inspection according to claim 3, characterized in that, The back of the push plate (706) is provided with an elliptical spring (707), a light-up buzzer host (708) and a counter (709) from left to right. The front of the light-up buzzer host (708) is provided with a first trigger button (710). The top of the light-up buzzer host (708) is provided with a buzzer (711) and a light (712) from left to right.

5. The mobile cart device for semiconductor appearance inspection according to claim 4, characterized in that, The first battery block (713) is fixedly connected to one side of the light-up buzzer host (708), the second trigger button (714) is provided on the front of the counter (709), and a baffle (715) is fixedly connected to one end of the elliptical spring (707). A rectangular soft rubber (716) is provided on the back of the baffle (715).

6. The mobile cart device for semiconductor appearance inspection according to claim 1, characterized in that, The appearance residue detection module (8) includes a vertical plate (801), an upper sealing plate (802) is fixedly connected to the top of the vertical plate (801), a round tube adapter hole is opened on the top of the upper sealing plate (802), a side sealing strip (803) is fixedly connected to one side of the vertical plate (801), and push rod grooves are opened on both the front and back of the vertical plate (801), and a push rod (804) is provided inside the push rod groove.

7. The mobile cart device for semiconductor appearance inspection according to claim 6, characterized in that, An inverted L-shaped plate (805) is fixedly connected to the back of the push rod (804). A second pin hole is provided on one side of the push rod (804), and a second pin (806) is provided inside the second pin hole. A vertical plate (801) is installed on the push rod (804) through the second pin (806). A suction machine (807) is fixedly connected to the top of the upper sealing plate (802). A round tube (808) is provided at one end of the suction machine (807), and the suction machine (807) is threadedly connected to the round tube (808) through a round tube bolt.

8. The mobile cart device for semiconductor appearance inspection according to claim 7, characterized in that, One end of the circular tube (808) is provided with an annular connecting plate (809), and the circular tube (808) is connected to the annular connecting plate (809) by a bolt thread. A transparent circular tube (810) is fixedly connected to the bottom of the annular connecting plate (809), and a transverse plate (811) is fixedly connected to the inner wall of the transparent circular tube (810). The surface of the transparent circular tube (810) is provided with qualified scale lines (812).

9. The mobile cart device for semiconductor appearance inspection according to claim 8, characterized in that, The bottom of the horizontal plate (811) is fixedly connected to a telescopic tube (813), the bottom of the telescopic tube (813) is fixedly connected to a laser (814), and the surface of the laser (814) is provided with a laser battery block (815) and a laser emitting lamp (816) from top to bottom. The bottom of the transparent round tube (810) is fixedly connected to a threaded connection end (817), and the bottom of the threaded connection end (817) is threadedly connected to a dense screen plate (818).

10. The method of operating the mobile cart device for semiconductor appearance inspection according to claims 1-9, characterized in that, Includes the following steps: Step 1: The entire device is moved by the moving wheels (2). The height of the tilting plate (6), the size detection module (7), and the appearance residue detection module (8) are adjusted by the telescopic plate (5) moving up and down in the telescopic sleeve (3). The telescopic plate (5) is fixed on the telescopic sleeve (3) by the first pin (4) to fix the height. The device detects the appearance size of the semiconductor by the size detection module (7) and detects whether there is residue on the surface of the semiconductor by the appearance residue detection module (8). Step 2: The semiconductor's appearance dimensions are first detected by the size detection module (7). The size detection module (7) first adjusts the positions of the push plate (706), baffle (715), and rectangular soft rubber (716) at their respective ends through the first long screw (702) and the second long screw (703), so that there is a space for the semiconductor's appearance dimensions between the rectangular soft rubber (716). After the semiconductor is placed between the rectangular soft rubber (716), the semiconductor squeezes the rectangular soft rubber (716) to make the baffle... The plate (715) moves towards the push plate (706), causing the baffle (715) to strike the first trigger button (710) and the second trigger button (714), thereby causing the buzzer (711) and the light (712) of the light-up buzzer host (708) to work, and the counter (709) to start counting. However, if the semiconductor appearance size is not in place, the buzzer (711) and the light (712) of the light-up buzzer host (708) will not make a sound or light up, and the counter (709) will not count. Step 3: After the semiconductor is inspected in the size detection module (7), it needs to be inspected in the appearance residue detection module (8). The position of the inverted L-shaped plate (805) is moved by pushing and pulling the push rod (804), so that the space between the inverted L-shaped plates (805) can be adapted to the semiconductor. The suction machine (807) is started, and the negative pressure suction force will suck the debris and other residues on the semiconductor appearance surface to the dense screen plate (818). Air will enter the suction machine (807) through the transparent round tube (810) and the round tube (808) for rotation. The laser (814) is started, so that the laser emitting lamp (816) emits laser light. The laser shines on the transparent round tube (810). The strong negative pressure causes the laser (814) to move upward. By observing whether the laser is on the qualified scale line (812), it is determined whether the negative pressure suction force is qualified, and then it is determined whether there are debris and other residues on the semiconductor appearance surface.

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