Detection device

Abstract

The invention discloses a detection device which comprises a carrier plate, an input electrode, a metal layer and a contact electrode. The input electrode is arranged on the carrier plate. The metal layer includes a fixed portion and an extending portion. The fixing part is arranged on the carrier plate, one end of the fixing part is electrically connected with the input electrode, and the other end of the fixing part extends in the direction away from the carrier plate. The extension part is electrically connected with the other end of the fixing part, and the extension part and the carrier plate are spaced by a distance to form a buffer space. The contact electrode is arranged on the extension part of the metal layer and electrically connected with the extension part of the metal layer, and the contact electrode is provided with a concave surface which is opposite to the carrier plate.

Description

Technical Field

[0001] This invention relates to a detection device, and more particularly to a detection device having a concave sensing surface. Background Technology

[0002] In the development of the semiconductor industry, in order to ensure that integrated circuits meet specifications and quality requirements, the functions and performance of integrated circuits are often tested, including testing the voltage, current, resistance and capacitance of semiconductor components in integrated circuits. Probe cards are commonly used tools for testing.

[0003] The components in the probe card that come into contact with the semiconductor device are called probes. The probes can make electrical contact with the device under test to input electrical energy and output the measured signal to the test equipment.

[0004] Probe cards have become an indispensable tool in the semiconductor component manufacturing process. They can be used to reject non-compliant components, thereby preventing them from entering subsequent manufacturing processes. Summary of the Invention

[0005] In view of this, the present invention provides a detection device comprising a carrier plate, an input electrode, a metal layer, and a contact electrode. The input electrode is disposed on the carrier plate. The metal layer includes a fixing portion and an extension portion. The fixing portion is disposed on the carrier plate, with one end electrically connected to the input electrode, and the other end extending away from the carrier plate. The extension portion is electrically connected to the other end of the fixing portion, and a buffer space is formed between the extension portion and the carrier plate by a gap. The contact electrode is disposed on and electrically connected to the extension portion of the metal layer, and the contact electrode has a concave surface facing away from the carrier plate. Attached Figure Description

[0006] Figure 1 This is a cross-sectional view of a detection device according to an embodiment;

[0007] Figure 2 This is a schematic diagram of a detection device used in measurement according to one embodiment;

[0008] Figure 3 This is a schematic diagram illustrating the use of a detection device with a protrusion in one embodiment;

[0009] Figures 4-9 This is a flowchart illustrating the manufacturing process of a detection device according to one embodiment;

[0010] Figure 10 This is a cross-sectional view of a detection device according to another embodiment;

[0011] Figure 11 This is a cross-sectional view of a detection device according to another embodiment;

[0012] Figure 12 yes Figure 11 A cross-sectional view of line segment AA in the middle;

[0013] Figure 13 This is a cross-sectional view of a detection device according to an embodiment;

[0014] Figure 14 This is a cross-sectional view of a detection device according to an embodiment;

[0015] Figure 15 This is a cross-sectional view of a detection device according to another embodiment;

[0016] Figure 16 yes Figure 15 A cross-sectional view indicating the location of BB;

[0017] Figure 17 yes Figure 15 A cross-sectional view of line segment CC;

[0018] Figure 18 This is a cross-sectional view of a detection device according to another embodiment;

[0019] Figure 19 yes Figure 18 A cross-sectional view of line segment DD in the middle;

[0020] Figure 20 This is a cross-sectional view of a detection device according to an embodiment.

[0021] Symbol explanation:

[0022] 10, 20, 30, 50, 60, 70: Detection device

[0023] 11: Carrier board

[0024] 111: First Surface

[0025] 113: Second Surface

[0026] 12: Input electrode

[0027] 13: Metal layer

[0028] 131: Fixing part

[0029] 133: Extension

[0030] 135: First end

[0031] 137: Second End

[0032] 14: Contact Electrode

[0033] 141: Concave surface

[0034] 143: Supporting surface

[0035] 145: Exposed parts

[0036] 147:convex part

[0037] 151, 153: Conductive paths

[0038] 16: Insulation layer

[0039] 161: Depression area

[0040] 162: Etching Space

[0041] 163: First insulating layer

[0042] 163a: Perforated layer 163a

[0043] 163b: Electrode layer 163b

[0044] 165: Second insulating layer

[0045] 167: Third Insulation Layer

[0046] 168: Openwork section

[0047] 169: Support section

[0048] 18: Sacrifice Layer

[0049] 20: Micro LED

[0050] 26:Substrate

[0051] 30: Testing equipment

[0052] 12', 32: Connection ends

[0053] 40: Electrode to be tested

[0054] 45: Camera

[0055] 55: Flexible Circuit Board

[0056] d: Spacing

[0057] S: Buffer space Detailed Implementation

[0058] refer to Figure 1 , Figure 1This is a cross-sectional view of a detection apparatus according to one embodiment. The detection apparatus 10 includes a carrier plate 11, an input electrode 12, a metal layer 13, and a contact electrode 14. The input electrode 12 is disposed on a first surface 111 of the carrier plate 11. The metal layer 13 includes a fixing portion 131 and an extension portion 133. The fixing portion 131 is disposed on the first surface 111 and has a first end 135 and a second end 137 opposite to each other. The first end 135 is electrically connected to the input electrode 12, and the second end 137 extends in a direction away from the carrier plate 11, for example, extending upwards. The extension portion 133 is electrically connected to the second end 137 of the fixing portion 131, and the extension portion 133 is spaced apart from the carrier plate 11 by a distance d, forming a buffer space S.

[0059] Contact electrode 14 is disposed on and electrically connected to extension 133. Input electrode 12 can be electrically connected to contact electrode 14 via metal layer 13. Contact electrode 14 has a concave surface 141 facing away from carrier plate 11. If an electronic component is placed in concave surface 141, contact electrode 14 can be used to provide electrical power to the electronic component under test. In one embodiment, contact electrode 14 has an exposed portion 145 connected to the outer periphery of concave surface 141. In another embodiment, contact electrode 14 has a protrusion 147 protruding from concave surface 141 (see reference). Figure 3 ).

[0060] In one embodiment, the detection device 10 can be paired with external equipment to detect the characteristics of electronic components, thereby eliminating non-compliant electronic components and improving the production yield of the manufacturing process.

[0061] Figure 2 This is a schematic diagram illustrating the application of a detection device according to one embodiment in measurement. For example... Figure 2 As shown, the detection device 10 is used to detect light-emitting diodes (LEDs) 20. Several LEDs 20 are mounted on a substrate 26. Each LED 20 has a test electrode 40, which faces the concave surface 141 of the contact electrode 14. The input electrode 12 can be electrically connected to an external power supply device (not shown) to transmit electrical energy to the LEDs 20 through the metal layer 13 and the contact electrode 14. Upon receiving electrical energy, the LEDs 20 generate light or electrical signals.

[0062] In one embodiment, the test electrode 40 of the light-emitting diode 20 has a convex surface, which is shaped as a portion of a sphere, a hemisphere, a portion of a parabola, a portion of a hyperboloid, or other curved surface. The concave surface 141 of the contact electrode 14 can align with the convex surface of the test electrode 40, wherein the maximum depth of the concave surface 141 is equal to or less than the maximum height of the convex surface, and the maximum width of the concave surface 141 is equal to or greater than the maximum width of the convex surface.

[0063] Compared to planar contact electrodes (not shown), contact electrode 14 can confine the convex surface of the electrode under test 40 within the concave surface 141. This not only increases the contact area between contact electrode 14 and the electrode under test 40 (or reduces the contact resistance), but also prevents contact electrode 14 from sliding on the electrode under test 40 and extends the service life of the detection device 10.

[0064] refer to Figure 2 In one embodiment, a buffer space S is provided between the extension 133 and the carrier plate 11. When the contact electrode 14 contacts the electrode under test 40, the concave surface 141 will bear a force, and the extension 133 will be pushed by the force and bend downward, thus reducing the buffer space S. If the micro LED 20 under test has multiple heights, the extension 133 can bend according to the height change of the micro LED 20 through the buffer space S, thereby avoiding excessive pressure between the micro LED 20 and the contact electrode 14, which would cause damage to the contact electrode 14 and / or the electrode under test 40.

[0065] In one embodiment, the concave surface 141 of the contact electrode 14 and the convex surface of the electrode 40 have similar contours. For example, the concave surface 141 is the inner surface of a particular object, and the convex surface is the outer surface of the same object. Specifically, the contours of the concave surface 141 of the contact electrode 14 and the convex surface of the electrode 40 are a portion of a sphere, a hemisphere, a portion of a parabola, a portion of a hyperboloid, or other curved surfaces. In one embodiment, the maximum diameter of the concave surface of the contact electrode 14 is slightly larger than the maximum diameter of the convex surface of the electrode under test 40 so that the electrode under test 40 can be placed in the contact electrode 14 without easily slipping out. For example, the maximum diameter of the electrode under test 40 is 250 micrometers, and the diameter of the concave surface of the contact electrode 14 is 251 to 260 micrometers.

[0066] refer to Figure 1 and Figure 2 In one embodiment, the contact electrode 14 has an exposed portion 145 connected to the periphery of the concave surface 141. If the maximum diameter of the electrode under test 40 is greater than the maximum diameter of the concave surface 141, the electrode under test 40 cannot reach the lowest point of the concave surface 141, but can reach the exposed portion 145.

[0067] refer to Figure 3 In one embodiment, the contact electrode 14 has a protrusion 147 protruding from the concave surface 141. The protrusion 147 is a metal block formed on the extension 133 of the metal layer 13 and extending upward in a direction away from the carrier plate 11. If the electrodes under test 40, 40' contact the protrusion 147, the input electrode 12 can transmit the electrical energy provided by the external power supply device to the micro light-emitting diode 20 through the protrusion 147, thereby causing the micro light-emitting diode 20 to generate optical and electrical signals.

[0068] In one embodiment, the detection device 10 has multiple contact electrodes 14 capable of simultaneously measuring two test electrodes 40, 40' belonging to a micro-LED 20 (e.g., ...). Figure 3 (as shown) or two electrodes 40, 40' belonging to two micro LEDs 20 (not shown).

[0069] In one embodiment, the protrusion 147 may be made of a flexible metal material. When the protrusion 147 of the contact electrode 14 comes into contact with the higher electrode 40' under test, the flexible protrusion 147 can be more firmly fixed on the outer convex surface of the electrode 40 under test and is less likely to form scratches on the outer convex surface of the electrode 40 under test. The diameter of the protrusion 147, the curvature of the tip of the protrusion 147, etc., can be adjusted according to requirements.

[0070] refer to Figure 1 In one embodiment, the detection device 10 includes an insulating layer 16 covering a metal layer 13. The insulating layer 16 has a recessed area 161 to accommodate a contact electrode 14. The side of the contact electrode 14 opposite to the recessed area 141 is a contact surface 143, and the contact electrode 14 abuts against the insulating layer 16 with the contact surface 143. In one embodiment, the insulating layer 16 has a conductive passage 151, one end of which is connected to the contact electrode 14, and the other end is connected to an extension 133 of the metal layer 13. The conductive passage 151 may be filled with metal and / or other conductive materials to electrically connect the contact electrode 14 and the extension 133.

[0071] In one embodiment, the insulating layer 16 includes a first insulating layer 163 and a second insulating layer 165. The first insulating layer 163 covers the upper and side surfaces of the extension 133 of the metal layer 13, and the second insulating layer 165 covers the lower surface of the extension 133 of the metal layer 13. The extension 133 is separated from the carrier plate 11 by a distance d, forming a buffer space S. The second insulating layer 165 is located within the buffer space S, and the distance between the lower surface of the second insulating layer 165 and the carrier plate 11 is less than the distance d and greater than 0. The extension 133, sandwiched between the first insulating layer 163 and the second insulating layer 165, can be bent toward the carrier plate 11.

[0072] In one embodiment, the first insulating layer 163 and the second insulating layer 165 can be made of different materials, and the Young's modulus of the material of the second insulating layer 165 can be greater than that of the material of the first insulating layer 163. For example, the Young's modulus of the material of the first insulating layer 163 can be 10 GPa or less, while the Young's modulus of the material of the second insulating layer 165 is greater than that of the material of the first insulating layer 163. When the contact electrode 14 is subjected to downward pressure, the second insulating layer 165 can support the extension 133 of the metal layer 13, preventing the extension 133 from breaking due to excessive force.

[0073] In one embodiment, the material of the insulating layer 16 may be poly(methylmethacrylate) (PMMA), acrylonitrile butadiene styrene (ABS), polyamide (PA), polycarbonate (PC), polyethylene (PE), polyoxymethylene (POM), polypropylene (PP), polystyrene (PS), epoxy resin (EPO), silicone, or a combination of the above molding materials.

[0074] Figures 4 to 9 for Figure 1 The flowchart for manufacturing the detection device 10 shown is as follows. First, as... Figure 4 As shown, a sacrificial layer 18 is disposed on the carrier plate 11. The material of the sacrificial layer 18 can be an oxide such as silicon oxide or silicon oxynitride, or a patternable photosensitive dielectric (PID). (Reference) Figure 5 A second insulating layer 165 is formed above the sacrificial layer 18. The second insulating layer 165 is also made of a patternable photosensitive dielectric material. In one embodiment, the second insulating layer 165 can be formed by metal-organic chemical vapor deposition (MOCVD), physical vapor deposition (PVD), or other methods.

[0075] refer to Figure 6 An input electrode 12 and a metal layer 13 are disposed on a carrier plate 11 and a second insulating layer 165. The input electrode 12 may be located on the carrier plate 11 and connected to the metal layer 13. The fixing portion 131 of the metal layer 13 has two ends, one end of which is connected to the input electrode 12, and the other end extends away from the carrier plate 11 and is electrically connected to an extension portion 133. The extension portion 133 is disposed on the second insulating layer 165. The fixing portion 131 of the metal layer 13 is located between the second insulating layer 165 and the input electrode 12. In one embodiment, the metal layer 13 may be formed of copper, aluminum, tantalum, tungsten, hafnium, beryllium, or other metals or alloys thereof, and may be formed on the carrier plate 11 and the second insulating layer 165 by means of metal-organic chemical vapor deposition (MOCVD), physical vapor deposition (PVD), etc.

[0076] In one embodiment, the input electrode 12 may also be located on the side of the carrier plate 11 or below the carrier plate 11 (visible in...). Figure 10 and Figure 20 ). refer to Figure 10 If the input electrode 12 is located under the carrier plate 11, the electrode 12 and the fixing part 131 are electrically connected through the conductive path 153.

[0077] refer to Figure 7 A first insulating layer 163 is formed on the metal layer 13. The first insulating layer 163 includes a through-hole layer 163a and an electrode layer 163b. The through-hole layer 163a is located on the extension 133, and a conductive path 151 is formed in the through-hole layer 163a. ​​The electrode layer 163b is formed on the through-hole layer 163a, and a recessed region 161 (as shown by the dotted line in the figure) is formed in the electrode layer 163b at the position corresponding to the conductive path 151. The first insulating layer 163 and the second insulating layer 165 completely cover the metal layer 13. The first insulating layer 163 is a patternable photosensitive dielectric material. The recessed region 161 can be formed by etching, gray-scale masks, laser writing, nanoimprinting, etc.

[0078] refer to Figure 8 A recessed region 161 is formed within the photoresist 170. In one embodiment, the photoresist 170 is formed on the first insulating layer 163 (electrode layer 163b), and an etch space 162 is formed within the photoresist 170. The etch space 162 has an opening and a bottom surface, with the projected area of ​​the bottom surface being larger than the projected area of ​​the opening, forming a space that is narrower at the top and wider at the bottom. The etch space 162 forms the recessed region 161 after being etched by the etching solution. In another embodiment, the recessed region 161 is formed in the first insulating layer 163 using grayscale lithography.

[0079] refer to Figure 9 Contact electrode 14 is formed on recessed region 161. Contact electrode 14 may be made of metal and is formed only on recessed region 161. Contact electrode 14 and recessed region 161 have similar contours. Finally, sacrificial layer 18 under first insulating layer 163 is removed to form buffer space S between first insulating layer 163 and carrier plate 11, see reference. Figure 1 .

[0080] Figure 10This is a cross-sectional view of the detection device 20 according to another embodiment. In the detection device 20, the insulating layer 16 includes a third insulating layer 167. One side of the third insulating layer 167 contacts the second insulating layer 165, and the other side contacts the carrier plate 11. In other words, the second insulating layer 165 and the third insulating layer 167 completely fill the buffer space S. The third insulating layer 167 and the first insulating layer 163 can be made of the same or different materials. If the third insulating layer 167 and the first insulating layer 163 are made of different materials, the Young's modulus of the third insulating layer 167 can be less than the Young's modulus of the material of the second insulating layer 165. For example, the third insulating layer 167 and the first insulating layer 163 can both be made of materials with a Young's modulus less than or equal to 10 GPa.

[0081] like Figure 10 As shown, when the buffer space S is completely filled with the second insulating layer 165 and the third insulating layer 167, the second insulating layer 165 and the third insulating layer 167 can provide better support for the extension 133 to withstand the force applied to the contact electrode 14. If the third insulating layer 167 has a smaller Young's modulus than the second insulating layer 165, when subjected to the force from the contact electrode 14, the third insulating layer 167 is more likely to deform with the bending of the extension 133, and when the force disappears, the third insulating layer 167 can return to its original shape and assist in pushing the extension 133 back to its pre-bending position. In one embodiment, the first insulating layer 163, the second insulating layer 165, and the third insulating layer 167 have the same Young's modulus, for example, a Young's modulus less than or equal to 10 GPa.

[0082] Figure 11 This is a cross-sectional view of a detection device 30 with perforated portions in an insulating layer according to another embodiment. In one embodiment, the third insulating layer 167 includes a plurality of perforated portions 168 and a plurality of support portions 169 that are staggered with each other. In some embodiments, the height of the perforated portions 168 is less than the spacing d and equal to the distance between the lower surface of the third insulating layer 167 and the upper surface of the carrier plate 11. The two ends of the support portions 169 are respectively connected to the carrier plate 11 and the second insulating layer 165. Generally, the more perforated portions 168 there are, the easier it is for the third insulating layer 167 to be deformed under force. Therefore, by adjusting the configuration of the perforated portions 168 and the support portions 169, for example, the ratio of the number of perforated portions 168 to the area ratio of the support portions 169, the displacement of the contact electrode 14 under force can be changed.

[0083] Figures 11 to 19 This illustrates an embodiment of a detection device for a third insulating layer 167 having different shaped cutouts 168. The third insulating layer 167 may have one or more cutouts 168, and the multiple cutouts 168 are independent of each other and not connected. Figure 12 yes Figure 11 A cross-sectional view of the midline segment AA, as shown below. Figure 12As shown, both the hollowed-out portion 168 and the support portion 169 are elongated. The three support portions 169 have the same width, while the four hollowed-out portions 168 have different widths. However, the present invention is not limited to this.

[0084] like Figure 13 As shown, the support portion 169 is configured in a tree-like shape, and multiple hollow portions 168 are separated by a single support portion 169. Figure 14 As shown, several support parts 169 are distributed in an island-like pattern and are separated by a single hollow part 168.

[0085] Figure 15 The display shows a cross-sectional view of the stepped detection device 50 with support 169. Figure 16 for Figure 15 A cross-sectional view of the midline segment BB. Figure 17 for Figure 15 A sectional view of the center line segment CC. (e.g.) Figure 16 and Figure 17 As shown, the two support portions 169 are separated by a single openwork portion 168. The width of the single support portion 169 gradually decreases from top to bottom, while the width of the openwork portion 168 gradually increases from top to bottom. Figure 18 The display shows a cross-sectional view of the stepped detection device 60 with support 169. Figure 19 Then it is Figure 18 A cross-sectional view of the midline segment DD. (e.g.) Figure 18 and Figure 19 As shown, the three support parts 169 are separated by two hollow parts 168. The width of a single support part 169 gradually decreases from top to bottom, while the width of a single hollow part 168 gradually increases from top to bottom.

[0086] Reference Figure 2 In one embodiment, both the carrier plate 11 and the insulating layer 16 are made of materials that are permeable to visible light. The carrier plate 11 is made of a light-transmitting material such as sapphire, glass, or quartz; the insulating layer 16 is made of an oxide such as silicon oxide or silicon oxynitride, or a patternable, light-transmitting photosensitive dielectric material. This allows the user to view the micro-LED 20 from below the carrier plate 11. For example, a camera 45 can be placed below the carrier plate 11 to identify the micro-LED 20. This configuration ensures that the electrode 40 and the micro-LED 20 are aligned during measurement. In another embodiment, the light emitted by the micro-LED 20 can pass through the carrier plate 11 and the insulating layer 16 and be received by a light-receiving device, such as the camera 45, located below the carrier plate 11.

[0087] Reference Figure 3In one embodiment, multiple detection modules 100 can be disposed on a carrier plate 11. The input electrode 12 of each detection module 100 is disposed on the carrier plate 11. One end of the fixing portion 131 of the metal layer 13 is electrically connected to the input electrode 12, and the extension portion 133 is spaced apart from the carrier plate 11 by a distance d, forming a buffer space S. A contact electrode 14 is disposed on the extension portion 133 of the metal layer 13 and has a concave surface 141. Figure 3 As shown, the micro-LED 20 is a horizontal micro-LED 20 with two test electrodes 40, 40' located on the same side, which can respectively contact the two contact electrodes 14. The gap between the contact electrodes 14 is not provided with an insulating layer 16 or a light-transmitting material, allowing the micro-LED 20 to be seen. With this configuration, the position of the micro-LED 20 (the test object) can be identified through the gap during measurement, enabling more accurate alignment of the micro-LED 20 with the test electrodes 40, 40'. In another embodiment, the light emitted by the micro-LED 20 can pass through the gap and be received by the camera 45.

[0088] Figure 20 This is a cross-sectional view showing a detection device 70 according to another embodiment. The carrier plate 11 has a first surface 111 facing the contact electrode 14 and a second surface 113 facing downwards. The input electrode 12 can be located on the side of the carrier plate 11, above the upper surface 111 (as shown on the right) or below the lower surface 113 (as shown on the left). In both configurations, the input electrode 12 includes a lower surface. The lower surface of the input electrode 12 can be connected to a flexible-printed circuit board 55. Furthermore, as... Figure 20 As shown, the left contact electrode 14 and the right contact electrode 14 represent two different embodiments, which can be implemented individually or in combination. The left contact electrode 14 has a concave surface 141, while the right contact electrode 14 has both a concave surface 141 and a convex portion 147.

[0089] In one embodiment, the lower surface of the input electrode 12 is connected to the upper surface of the connection terminal 32 of the flexible circuit board 55 by solder (not shown). In another embodiment, the lower surface of the input electrode 12 is connected to the upper surface of the connection terminal 32 of the flexible circuit board 55 by a tin-containing layer (not shown), wherein the tin-containing layer is first formed on the lower surface of the input electrode 12 and / or the upper surface of the connection terminal 32 of the flexible circuit board 55, and can be laser-heated to connect the input electrode 12 and the connection terminal 32. Furthermore, the tin-containing layer can be covered with an insulating material to protect the tin-containing layer or to increase the bonding strength between the electrode 12 and the connection terminal 32 of the flexible circuit board 55.

[0090] In summary, using concave contact electrodes to measure semiconductor components can reduce damage to the components, as well as decrease the frequency of contact electrode replacement and measurement costs.

Claims

1. A detection device, comprising: Carrier plate; The input electrode is disposed on the carrier plate; Metal layer, comprising: A fixing part is disposed on the carrier plate, and one end of the fixing part is electrically connected to the input electrode, and the other end of the fixing part extends away from the carrier plate; as well as An extension is electrically connected to the other end of the fixing part, and the extension is spaced apart from the carrier plate to form a buffer space; as well as A contact electrode is disposed on the extension of the metal layer and electrically connected to the extension of the metal layer. The contact electrode has a concave surface facing away from the carrier plate.

2. The detection device as claimed in claim 1 further comprises an insulating layer covering the metal layer, and the contact electrode abutting the insulating layer.

3. The detection device as claimed in claim 2, wherein the insulating layer comprises a first insulating layer and a second insulating layer, the first insulating layer covers the extension of the metal layer on the side facing away from the carrier plate, the second insulating layer covers the extension of the metal layer on the side facing the carrier plate, and the Young's modulus of the second insulating layer is greater than that of the first insulating layer.

4. The detection device as claimed in claim 3, wherein the insulating layer comprises a third insulating layer in contact with the second insulating layer and the carrier plate, and the Young's modulus of the second insulating layer is greater than the Young's modulus of the first insulating layer and the third insulating layer.

5. The detection device as claimed in claim 3, wherein the Young's modulus of the first insulating layer is less than or equal to 10 GPa, and the Young's modulus of the second insulating layer is greater than the Young's modulus of the first insulating layer.

6. The detection device as claimed in claim 4, wherein the third insulating layer comprises a plurality of perforations.

7. The detection device as claimed in claim 6, wherein the height of each of the hollow portions along the direction perpendicular to the carrier plate is less than the spacing.

8. The detection device as claimed in claim 2, wherein the insulating layer fills the buffer space.

9. The detection device as described in claim 2, wherein, The carrier plate and the insulating layer can be penetrated by visible light.

10. The detection device according to any one of claims 1 to 9, wherein the contact electrode has a protrusion that protrudes from the concave surface.

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