Laminated coil component

Abstract

The laminated coil component is provided with: a laminated body in which a plurality of insulating layers are laminated in the longitudinal direction and in which a coil is incorporated; and first and second external electrodes electrically connected to the coil, the coil being formed by electrically connecting a plurality of coil conductors stacked in the longitudinal direction together with the insulating layer, the stacked body having: first and second end surfaces facing each other in the longitudinal direction; first and second main surfaces facing each other in the height direction; the first and second side surfaces face each other in the width direction, the lamination direction of the laminated body and the coil axial direction of the coil are parallel to the first main surface, the first main surface is a mounting surface, the dimensions of the laminated body in the width direction, the height direction and the length direction are respectively set as BW, BT and BL, the laminated body satisfies BW < = 200 [mu] m, BL < = 400 [mu] m and 200 [mu] m < = BT, or BT < = 200 [mu] m, BL < = 400 [mu] m and 200 [mu] m < = BW, and BL < = 400 [mu] m and 200 [mu] m < = BL. The inner diameter area of the coil is 7500 [mu] m2 or more.

Description

Technical Field

[0001] This invention relates to laminated coil components. Background Technology

[0002] As a laminated coil component, for example, a laminated coil component with a size of 0603 is disclosed in Patent Document 1.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2023-82190

[0004] In recent years, the miniaturization of electrical equipment has led to a demand for miniaturized stacked coil components. However, for example, if the stacked coil component described in Patent Document 1 is simply miniaturized to a size of 0402, there is a risk that the low-frequency characteristics, specifically the transmittance coefficient S21 (S21 characteristic) in the low-frequency band, will become insufficient. Summary of the Invention

[0005] The present invention was made to solve the above-mentioned problems, and its purpose is to provide a stacked coil component that can be miniaturized and has excellent low-frequency characteristics.

[0006] The laminated coil component of the present invention is characterized by comprising: a laminated body formed by stacking multiple insulating layers in a length direction and having a coil internally therein; and a first external electrode and a second external electrode electrically connected to the coil, wherein the coil is formed by electrically connecting multiple coil conductors stacked together with the insulating layers in the length direction, and the laminated body having: a first end face and a second end face facing each other in the length direction; a first main face and a second main face facing each other in a height direction orthogonal to the length direction; and a first side face and a second side face facing each other in a height direction orthogonal to the length direction. The stacked structure and the coil axis are parallel to the first main surface, which is a mounting surface. The dimensions of the stacked structure in the width, height, and length directions are set as B_W, B_T, and B_L, respectively. The stacked structure satisfies B_W≤200μm, B_L≤400μm, and 200μm≤B_T, or B_T≤200μm, B_L≤400μm, and 200μm≤B_W. The inner diameter area of ​​the coil is 7500μm. 2 above.

[0007] According to the present invention, a stacked coil component that can be miniaturized and has excellent low-frequency characteristics can be provided. Attached Figure Description

[0008] Figure 1 This is a perspective view schematically illustrating an example of a stacked coil component according to Embodiment 1.

[0009] Figure 2A yes Figure 1 The side view of the stacked coil component shown.

[0010] Figure 2B yes Figure 1 The front view of the stacked coil component shown.

[0011] Figure 2C yes Figure 1 The bottom view of the stacked coil component shown.

[0012] Figure 3 This is a cross-sectional view schematically illustrating an example of a stacked coil component according to Embodiment 1.

[0013] Figure 4 It is a schematic representation of the composition. Figure 3 An exploded three-dimensional schematic diagram showing the state of the insulation layer of the stacked coil component.

[0014] Figure 5 It is a schematic representation of the composition. Figure 3 An exploded top view of the state of the insulation layer of the stacked coil component shown.

[0015] Figure 6 It is a schematic representation of the composition. Figure 3 A top view of another example of the repeating shape of the coil conductor in the stacked coil component shown.

[0016] Figure 7 It is a schematic representation of the composition. Figure 3 A top view of another example of the repeating shape of the coil conductor in the stacked coil component shown.

[0017] Figure 8 It is a schematic representation of the composition. Figure 3 A top view of another example of the repeating shape of the coil conductor in the stacked coil component shown.

[0018] Figure 9 It is a schematic representation of the composition. Figure 3 A top view of the repeating shape of the coil conductors in the stacked coil component shown.

[0019] Figure 10 This is a perspective view schematically illustrating an example of a stacked coil component according to Embodiment 2.

[0020] Figure 11A yes Figure 10 The side view of the stacked coil component shown.

[0021] Figure 11B yes Figure 10 The front view of the stacked coil component shown.

[0022] Figure 11C yes Figure 10 The bottom view of the stacked coil component shown.

[0023] Figure 12 This is a cross-sectional view schematically illustrating an example of a stacked coil component according to Embodiment 2.

[0024] Figure 13 It is a schematic representation of the composition. Figure 12 An exploded top view of the state of the insulation layer of the stacked coil component shown.

[0025] Figure 14 This is a diagram schematically illustrating the method for measuring the transmittance coefficient S21.

[0026] Figure 15 This is a chart showing the transmittance coefficient S21 of samples 1 to 4.

[0027] Figure 16 This is a chart showing the transmittance coefficient S21 of samples 4 to 7.

[0028] Figure 17 This is a graph showing the relationship between the transmittance S21 at 1 GHz and the inner diameter area of ​​the coil in each sample.

[0029] Explanation of reference numerals in the attached drawings: 1, 1A...Layered coil component; 10...Layer body; 11...First end face; 12...Second end face; 13...First main face; 14...Second main face; 15...First side face; 16...Second side face; 21...First external electrode; 22...Second external electrode; 30...Coil; 31, 31a, 31b, 31c, 31d, 35a, 35a1, 35a2, 35a3, 35a4, 35b, 35b1, 35b2, 35b3, 35b4...Insulating layer; 32, 32a, 32b, 32c, 32d...Coil conductor; 33a, 33b, 33c, 33d, 33p, 33q...Conducting hole conductor Body; 36a, 36b, 36c, 36d... Line section; 37a, 37b, 37c, 37d... Pad section; 41... First connecting conductor; 42... Second connecting conductor; 60... Measuring fixture; 61... Signal path; 62... Grounding conductor; 63... Network analyzer; A... Coil axis; B_W (BW)... Dimension of the laminate in the width direction; B_T (BT)... Dimension of the laminate in the height direction; B_L (BL)... Dimension of the laminate in the length direction; W... Dimension of the laminated coil component in the width direction; T... Dimension of the laminated coil component in the height direction; L... Dimension of the laminated coil component in the length direction; W C ...width of the line portion; G_W1(GW1)...width spacing between the coil and the first side surface; G_W2(GW2)...width spacing between the coil and the second side surface; G_T1(GT1)...width spacing between the coil and the first main surface; G_T2(GT2)...width spacing between the coil and the second main surface. Detailed Implementation

[0030] The laminated coil component of the present invention will be described below.

[0031] However, the present invention is not limited to the embodiments described below, and can be appropriately modified without changing the spirit of the invention. Furthermore, structures obtained by combining two or more of the preferred structures described below are also part of the present invention.

[0032] The accompanying drawings are schematic diagrams, and their dimensions, aspect ratios, and scales may sometimes differ from the actual product. The same reference numerals are used for identical or comparable parts in the drawings. Furthermore, the same reference numerals are used for the same elements across different drawings, omitting redundant descriptions.

[0033] In this specification, terms indicating relationships between elements (e.g., "parallel", "orthogonal", etc.) and terms indicating the shape of elements do not mean only a strict, textual approach, but also imply a substantially equivalent range, such as a range that includes a few percent of the difference.

[0034] The embodiments shown below are illustrative, and of course, parts of the structure shown in different embodiments can be replaced or combined. In the second embodiment and thereafter, descriptions of matters common to the first embodiment are omitted, and only the differences are described. In particular, the same effects based on the same structure are not mentioned sequentially in each embodiment.

[0035] (Implementation Method 1)

[0036] Figure 1 This is a perspective view schematically illustrating an example of a stacked coil component according to Embodiment 1.

[0037] Figure 2A yes Figure 1 The side view of the stacked coil component shown. Figure 2B yes Figure 1 The front view of the stacked coil component is shown. Figure 2C yes Figure 1 The bottom view of the stacked coil component shown.

[0038] Figure 1 , Figure 2A , Figure 2B as well as Figure 2C The stacked coil component 1 shown includes a stacked body 10, a first external electrode 21, and a second external electrode 22. The stacked body 10 is a generally rectangular parallelepiped shape with six faces. The structure of the stacked body 10 will be described later, but it is formed by stacking multiple insulating layers in the longitudinal direction, with a coil built inside. The first external electrode 21 and the second external electrode 22 are electrically connected to the coil, respectively.

[0039] In the stacked coil component and the stacked body of the present invention, the length direction, height direction, and width direction are set as Figure 1 The x, y, and z directions are defined in the diagram. Here, the length direction (x-direction), height direction (y-direction), and width direction (z-direction) are orthogonal to each other.

[0040] like Figure 1 , Figure 2A , Figure 2B as well as Figure 2CAs shown, the laminate 10 has: a first end face 11 and a second end face 12 opposite each other in the length direction (x direction), a first main face 13 and a second main face 14 opposite each other in the height direction (y direction) orthogonal to the length direction, and a first side face 15 and a second side face 16 opposite each other in the width direction (z direction) orthogonal to the length direction and the height direction.

[0041] Although Figure 1 Not shown, but preferably the laminate 10 has rounded corners at the corners and edges. The corners are the parts where three sides of the laminate intersect, and the edges are the parts where two sides of the laminate intersect.

[0042] like Figure 1 , Figure 2A , Figure 2B as well as Figure 2C As shown, the first external electrode 21 covers the entire first end face 11 of the laminate 10, and extends from the first end face 11 to cover a portion of the first main face 13, a portion of the second main face 14, a portion of the first side face 15, and a portion of the second side face 16.

[0043] In addition, the second external electrode 22 covers the entire second end face 12 of the laminate 10, and extends from the second end face 12 to cover a portion of the first main face 13, a portion of the second main face 14, a portion of the first side face 15, and a portion of the second side face 16.

[0044] Since the first external electrode 21 and the second external electrode 22 are configured as described above, when the stacked coil component 1 is mounted on the substrate, any one of the first main surface 13, the second main surface 14, the first side surface 15, and the second side surface 16 of the stacked body 10 can be used as the mounting surface. However, in this embodiment, the first main surface 13 is used as the mounting surface.

[0045] However, the first external electrode 21 can extend from at least a portion of the first end face 11 of the laminate 10 to the mounting surface of the laminate 10.

[0046] Similarly, the second external electrode 22 can extend from at least a portion of the second end face 12 of the laminate 10 to the mounting surface of the laminate 10.

[0047] The dimensions of the stacked coil component of the present invention are not particularly limited, but are preferably 0402 size or similar.

[0048] More specifically, if the dimensions of the stacked body in the width direction (z-direction), height direction (y-direction), and length direction (x-direction) are respectively set as B_W (in... Figure 2C In the middle, the length indicated by the double-headed arrow B_W), B_T ( Figure 2BIn the middle, the length indicated by the double-headed arrow B_T) and B_L (in Figure 2A In the diagram, if the length indicated by the double-headed arrow B_L is specified, then the laminate satisfies B_W ≤ 200 μm, B_L ≤ 400 μm, and 200 μm ≤ B_T. Furthermore, in this disclosure, when referring to the laminate 10 alone, the first external electrode 21 and the second external electrode 22 are not included in the laminate 10. Therefore, B_W, B_L, and B_T all represent dimensions excluding the first external electrode 21 and the second external electrode 22.

[0049] The laminate preferably satisfies 160μm ≤ B_W ≤ 200μm, more preferably 170μm ≤ B_W ≤ 190μm. Furthermore, the laminate preferably satisfies 340μm ≤ B_L ≤ 380μm, more preferably 350μm ≤ B_L ≤ 370μm. Further, the laminate preferably satisfies 210μm ≤ B_T ≤ 300μm, more preferably 260μm ≤ B_T ≤ 300μm.

[0050] Furthermore, if the dimensions of the stacked coil components in the width direction (z-direction), height direction (y-direction), and length direction (x-direction) are respectively set as W (in... Figure 2C In the middle, the length indicated by the double-headed arrow W), T (in Figure 2B In the middle, the length indicated by the double-headed arrow T) and L (in Figure 2A In the context of the double-headed arrow L (where L represents the length), the laminated coil component preferably satisfies 180μm≤W≤220μm, more preferably 190μm≤W≤210μm. Furthermore, the laminated coil component preferably satisfies 380μm≤L≤420μm, more preferably 390μm≤L≤410μm. Further, the laminated coil component preferably satisfies 230μm≤T≤320μm, more preferably 270μm≤T≤310μm.

[0051] Thus, the stacked coil component of the present invention corresponds to miniaturization in the sense of reducing the mounting area.

[0052] The coils built into the laminate that constitute the laminated coil component of the present invention will be described.

[0053] A coil is formed by electrically connecting multiple coil conductors that are stacked together in the longitudinal direction along with an insulating layer.

[0054] Figure 3 This is a cross-sectional view schematically illustrating an example of a stacked coil component according to Embodiment 1. Figure 4 It is a schematic representation of the composition. Figure 3 The diagram shows an exploded three-dimensional view of the state of the insulation layer of the stacked coil component. Figure 5 It is a schematic representation of the composition. Figure 3An exploded top view of the state of the insulation layer of the stacked coil component shown.

[0055] Figure 3 This schematically represents the stacking direction of the insulating layer, coil conductors, connecting conductors, and laminates, and does not strictly represent the actual shape and connections. For example, the coil conductors are connected via through-hole conductors.

[0056] like Figure 3 As shown, the stacked coil component 1 includes: a stacked body 10, a built-in coil 30 formed by electrically connecting a plurality of coil conductors 32 stacked together with an insulating layer 31; and a first external electrode 21 and a second external electrode 22 electrically connected to the coil 30.

[0057] The laminate 10 contains regions where coil conductors 32 are disposed and regions where connecting conductors 41 or 42 are disposed. The lamination direction of the laminate 10 and the axial direction of the coils (in...) Figure 3 In the middle, it is indicated that the coil axis A) is parallel to the first main surface 13.

[0058] Furthermore, in this specification, the direction in which the multiple insulating layers constituting the laminate are stacked is referred to as the stacking direction.

[0059] In addition, such as Figure 3 As shown, the boundary cannot be visually confirmed between actually adjacent insulating layers 31.

[0060] like Figure 4 as well as Figure 5 As shown, the laminate 10 has insulating layers 31a, 31b, 31c, and 31d as... Figure 3 The insulating layer 31 is in the middle. The laminate 10 has insulating layers 35a1, 35a2, 35a3, and 35a4 as insulating layers. Figure 3 The insulating layer 35a is included. The laminate 10 has insulating layers 35b1, 35b2, 35b3, and 35b4 as insulating layers. Figure 3 The insulating layer 35b in the middle.

[0061] As the constituent materials of each insulating layer, magnetic materials such as ferrite materials are used, among which a mixture of ferrite material and a non-magnetic material with a lower dielectric constant than ferrite material is preferred. This improves the high-frequency characteristics of the laminated coil component of the present invention.

[0062] Examples of ferrite materials include Ni-Zn-Cu ferrite materials.

[0063] Examples of non-magnetic materials with lower dielectric constants than ferrite materials include glass ceramics and zinc silicate.

[0064] Coil 30 has coil conductors 32a, 32b, 32c, and 32d as... Figure 3 The coil conductor 32 in the middle.

[0065] Coil conductors 32a, 32b, 32c, and 32d are respectively disposed on the main surfaces of insulating layers 31a, 31b, 31c, and 31d.

[0066] The lengths of coil conductors 32a, 32b, 32c, and 32d are each 3 / 4 of the length of a turn of coil 30. That is, the number of layers of coil conductors used to form the 3 turns of coil 30 is 4. In the laminate 10, coil conductors 32a, 32b, 32c, and 32d are repeatedly laminated as a unit (3 turns).

[0067] Coil conductor 32a has a wire portion 36a and a pad portion 37a disposed at the end of the wire portion 36a. Coil conductor 32b has a wire portion 36b and a pad portion 37b disposed at the end of the wire portion 36b. Coil conductor 32c has a wire portion 36c and a pad portion 37c disposed at the end of the wire portion 36c. Coil conductor 32d has a wire portion 36d and a pad portion 37d disposed at the end of the wire portion 36d. Hereinafter, wire portions 36a, 36b, 36c, and 36d will be collectively referred to as wire portion 36.

[0068] The through-hole conductors 33a, 33b, 33c, and 33d are configured to penetrate the insulating layers 31a, 31b, 31c, and 31d respectively in the stacking direction.

[0069] Insulating layer 31a with coil conductor 32a and via conductor 33a, insulating layer 31b with coil conductor 32b and via conductor 33b, insulating layer 31c with coil conductor 32c and via conductor 33c, and insulating layer 31d with coil conductor 32d and via conductor 33d are repeatedly stacked as a unit. Thus, the pad portions 37a, 37b, 37c, and 37d of coil conductor 32a, coil conductor 32b, coil conductor 32c, and coil conductor 32d are connected via via conductors 33a, 33b, 33, and 33d. That is, the pad portions of adjacent coil conductors in the stacking direction are connected to each other via via conductors.

[0070] Based on the above, a solenoid-shaped coil 30 is formed and built into the laminate 10.

[0071] Materials used to construct the coil conductors and the through-hole conductors include, for example, Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals.

[0072] When viewing multiple (or all) coil conductors 32 from a perspective view along the stacking direction, their shapes are not particularly limited; they can be squares, but rectangles are preferred. In this case, each coil conductor 32 can also be a square with a partially open side, but a rectangle with a partially open side is more preferred. This effectively expands the inner diameter area of ​​the coil 30 and ensures a side gap.

[0073] Thus, in this specification, "rectangle" means a quadrilateral with all four angles equal, but not a square. Additionally, "rectangle" includes a square, referring to a quadrilateral with all four angles equal.

[0074] Preferably, when viewed from above in the stacking direction, such as Figure 5 As shown, the diameters of pad portions 37a, 37b, 37c, and 37d are larger than the line widths of line portions 36a, 36b, 36c, and 36d, respectively.

[0075] When viewed from the stacking direction, pad portion 37a, pad portion 37b, pad portion 37c, and pad portion 37d can be respectively... Figure 5 The circular shape shown can also be polygonal.

[0076] The via conductor 33p is configured to penetrate the insulating layers 35a1, 35a2, 35a3, and 35a4 in the stacking direction. Alternatively, pads connected to the via conductor 33p may be provided on the main surfaces of the insulating layers 35a1, 35a2, 35a3, and 35a4.

[0077] Insulating layers 35a1, 35a2, 35a3, and 35a4 with through-hole conductors 33p are stacked and overlap with an insulating layer 31a containing a coil conductor 32a and through-hole conductors 33a. Thus, the through-hole conductors 33p are interconnected to form a first connecting conductor 41, which is exposed at the first end face 11. As a result, the first external electrode 21 and the coil 30 are interconnected via the first connecting conductor 41.

[0078] Preferably, the first connecting conductor 41 connects the first external electrode 21 and the coil 30 in a straight line, as described above. The fact that the first connecting conductor 41 connects the first external electrode 21 and the coil 30 in a straight line means that, when viewed from the stacking direction, the via conductors 33p constituting the first connecting conductor 41 overlap each other, and the via conductors 33p may not be strictly arranged in a straight line.

[0079] The via conductor 33p is configured to penetrate the insulating layers 35b1, 35b2, 35b3, and 35b4 in the stacking direction. Alternatively, pads connected to the via conductor 33p may be provided on the main surfaces of the insulating layers 35b1, 35b2, 35b3, and 35b4.

[0080] Insulating layers 35b1, 35b2, 35b3, and 35b4 with through-hole conductors 33p are stacked and overlap with an insulating layer 31d containing a coil conductor 32d and through-hole conductors 33d. Thus, the through-hole conductors 33p are interconnected to form a second connecting conductor 42, which is exposed at the second end face 12. As a result, the second external electrode 22 and the coil 30 (coil conductor 32d) are interconnected via the second connecting conductor 42.

[0081] Preferably, the second connecting conductor 42 connects the second external electrode 22 and the coil 30 in a straight line, as described above. The fact that the second connecting conductor 42 connects the second external electrode 22 and the coil 30 in a straight line means that, when viewed from the stacking direction, the via conductors 33p constituting the second connecting conductor 42 overlap each other, and the via conductors 33p may not be strictly arranged in a straight line.

[0082] exist Figure 4 as well as Figure 5 The example illustrates a case where the number of layers of the 3-turn coil conductor used to form the coil 30 is 4, i.e., a repeating shape of 3 / 4 turns. However, the number of layers of the 1-turn coil conductor used to form the coil is not particularly limited.

[0083] For example, the number of layers of the coil conductor used to form one turn of the coil can be 2, that is, the repeating shape is a 1 / 2 turn shape.

[0084] Furthermore, the number of turns (winding number) of the coil 30 is not particularly limited, but from the viewpoint of improving low-frequency characteristics, it is preferably 10 turns or more, more preferably 15 turns or more, and even more preferably 20 turns or more. In addition, the number of turns of the coil 30 is preferably 35 turns or less, more preferably 30 turns or less, and even more preferably 25 turns or less.

[0085] Preferably, when viewed from the stacking direction, the coil conductors constituting the coil overlap each other. Furthermore, it is preferable that the shape of the coil (coil conductor) is rectangular (more preferably rectangular) when viewed from the stacking direction. Additionally, if the coil includes a pad portion, the shape other than the pad portion (i.e., the shape of the line portion) is set to the shape of the coil (coil conductor).

[0086] Figures 6-8 These are schematic representations of the components. Figure 3 A top view of another example of the repeating shape of the coil conductors in the stacked coil component shown. Furthermore, Figures 6-8 This is equivalent to viewing (through-view) the stacked body along the coil axis.

[0087] Figure 4 The coil conductor shown is in the shape of a repeating rectangular pattern, but it can also be in the shape of a repeating circle (see reference). Figure 6 ), oval (refer to) Figure 7 ) or track shape (refer to) Figure 8 The coil conductor is like that. The track shape refers to the shape formed by expanding a pair of opposite sides of a rectangle into semicircles. In addition, when the shape of the coil conductor, such as a rectangle, ellipse, or track shape, has a long side direction and a short side direction, it is preferable that each coil conductor is arranged so that the long side direction is parallel to the height direction.

[0088] In addition, the repeating shape of the coil conductor can also be 1 / 2 turn instead of 3 / 4 turn.

[0089] Figure 9 It is a schematic representation of the composition. Figure 3 A top view of the repeating shape of the coil conductors in the stacked coil component shown. Furthermore, Figure 9 This is equivalent to viewing (through-view) the stacked body along the coil axis.

[0090] Figure 9 The repeating shape of the coil 30 (coil conductor 32) shown is rectangular, in particular, rectangular.

[0091] Furthermore, the inner diameter area of ​​coil 30 is larger than the specified area, specifically 7500 μm. 2 That's all. Therefore, the impedance on the low-frequency side increases, thus improving low-frequency characteristics and increasing the transmittance S21 in the low-frequency band. The transmittance S21 is calculated based on the ratio of the power of the transmitted signal to the power of the input signal. For example, a network analyzer can be used to calculate the transmittance S21 for each frequency. The transmittance S21 is essentially dimensionless and is usually expressed as a common logarithm in dB.

[0092] From the perspective of improving low-frequency characteristics, the inner diameter area of ​​coil 30 is preferably 10000 μm. 2The above, more preferably 13000μm 2 The above is further preferred to be 15000μm. 2 above.

[0093] There is no particular upper limit to the inner diameter area of ​​coil 30, but it is preferably 25000 μm. 2 Below, 20000μm is more preferred. 2 Hereinafter, 18000μm is further preferred. 2 the following.

[0094] Here, "inner diameter area of ​​the coil" means the area enclosed by the coil when viewing the laminate along the coil's axis. For example, in the case where each coil conductor is rectangular in shape, such as... Figure 9 As shown, if the dimension of the laminate 10 in the width direction is set to B_W, the dimension of the laminate 10 in the height direction is set to B_T, and the width of the wire portion 26 constituting the coil conductor 32 is set to W... C If the width distance between coil 30 and the first side surface 15 is set as the side gap G_W1, the width distance between coil 30 and the second side surface 16 is set as the side gap G_W2, the height distance between coil 30 and the first main surface 13 is set as the side gap G_T1, and the height distance between coil 30 and the second main surface 14 is set as the side gap G_T2, then the inner diameter area of ​​the coil can be calculated according to the following formula.

[0095] The inner diameter area of ​​the coil = (B_W - G_W1 - G_W2 - W) C ×2)×(B_T-G_T1-G_T2-W C ×2)

[0096] Additionally, for example, when each coil conductor is circular, the inner diameter area of ​​the coil can be calculated using the following formula.

[0097] The inner diameter area of ​​the coil = (inner diameter of the coil ÷ 2) 2 ×π

[0098] Additionally, for example, when the shape of each coil conductor is elliptical, the inner diameter area of ​​the coil can be calculated according to the following formula.

[0099] The inner diameter area of ​​the coil = the inner diameter of the coil along the major axis × the inner diameter of the coil along the minor axis × π

[0100] Furthermore, when the shape of each coil conductor is that of a track, the inner diameter area of ​​the coil can also be calculated mathematically.

[0101] Furthermore, in this specification, the "inner diameter area of ​​the coil" is a value obtained by calculating the inner diameter area of ​​the coil at the three middle points when the laminate is divided into four equal parts along its length, or at the location of the coil conductor closest to each of the three points, and taking the arithmetic mean of the calculated inner diameter areas.

[0102] In addition, other dimensions such as the width of the wire, the side gap, the inner diameter of the coil, and the thickness of the coil conductor are also calculated by taking the arithmetic mean of the dimensions at the three middle points when the laminate is divided into four equal parts along the length direction, or at the location of the coil conductor closest to each of the three points.

[0103] The transmissivity S21 of the stacked coil component of the present invention is preferably -1.0dB or more at 1GHz, more preferably -0.8dB or more at 1GHz, even more preferably -0.6dB or more at 1GHz, and particularly preferably -0.4dB or more at 1GHz.

[0104] like Figure 9 As shown, when viewing the laminate 10 along the direction of coil axis A, if the width-direction interval between coil 30 and the first side surface 15 is defined as side gap G_W1, the width-direction interval between coil 30 and the second side surface 16 is defined as side gap G_W2, the height-direction interval between coil 30 and the first main surface 13 is defined as side gap G_T1, and the height-direction interval between coil 30 and the second main surface 14 is defined as side gap G_T2, then preferably the laminate 10 satisfies G_W1≥10μm, G_W2≥10μm, G_T1≥10μm, and G_T2≥10μm. If at least one of these side gaps is less than 10μm, there is a risk of manufacturing defects, such as the coil conductor 32 being exposed from the laminate 10.

[0105] G_W1, G_W2, G_T1 and G_T2 are more preferably 15μm or more and 30μm or less, and even more preferably 20μm or more and 25μm or less.

[0106] like Figure 9 As shown, the width W of the wire portion constituting the coil conductor 32 C There are no particular limitations, but it is preferred to be 15μm or more and 30μm or less, and more preferably 20μm or more and 25μm or less.

[0107] In the stacked coil component of the present invention, the number of stacked coil conductors is not particularly limited, but is preferably 10 or more and 50 or less, more preferably 20 or more and 40 or less, and even more preferably 25 or more and 35 or less.

[0108] (Implementation Method 2)

[0109] Figure 10 This is a perspective view schematically illustrating an example of a stacked coil component according to Embodiment 2.

[0110] Figure 11A yes Figure 10 The side view of the stacked coil component shown. Figure 11B yes Figure 10 The front view of the stacked coil component is shown. Figure 11C yes Figure 10 The bottom view of the stacked coil component shown.

[0111] Figure 10 , Figure 11A , Figure 11B as well as Figure 11C The stacked coil component 1A shown corresponds to miniaturization in the sense of reducing the height while meeting height restrictions.

[0112] More specifically, if the dimensions of the stacked body in the width direction (z-direction), height direction (y-direction), and length direction (x-direction) are respectively set as B_W (in... Figure 11C In the middle, the length indicated by the double-headed arrow B_W), B_T (in Figure 11B In the middle, the length indicated by the double-headed arrow B_T) and B_L (in Figure 11A If the length indicated by the double-headed arrow B_L is given, then the stacked volume satisfies B_T≤200μm, B_L≤400μm, and 200μm≤B_W.

[0113] The laminate preferably satisfies 210μm ≤ B_W ≤ 300μm, more preferably 260μm ≤ B_W ≤ 300μm. Furthermore, the laminate preferably satisfies 340μm ≤ B_L ≤ 380μm, more preferably 350μm ≤ B_L ≤ 370μm. Moreover, the laminate preferably satisfies 160μm ≤ B_T ≤ 200μm, more preferably 170μm ≤ B_T ≤ 190μm.

[0114] Furthermore, if the dimensions of the stacked coil components in the width direction (z-direction), height direction (y-direction), and length direction (x-direction) are respectively set as W (in... Figure 11C In the middle, the length indicated by the double-headed arrow W), T (in Figure 11B In the middle, the length indicated by the double-headed arrow T) and L (in Figure 11AIn the context of the double-headed arrow L (where L represents the length), the laminated coil component preferably satisfies 230μm≤W≤320μm, more preferably 270μm≤W≤310μm. Furthermore, the laminated coil component preferably satisfies 380μm≤L≤420μm, more preferably 390μm≤L≤410μm. Moreover, the laminated coil component preferably satisfies 180μm≤T≤220μm, more preferably 190μm≤T≤210μm.

[0115] In this embodiment, similar to the case in embodiment 1, any one of the first main surface 13, the second main surface 14, the first side surface 15, and the second side surface 16 of the laminate 10 can be a mounting surface, but the first main surface 13 is set as the mounting surface.

[0116] Figure 12 This is a cross-sectional view schematically illustrating an example of a stacked coil component according to Embodiment 2. Figure 13 It is a schematic representation of the composition. Figure 12 An exploded top view of the state of the insulation layer of the stacked coil component shown.

[0117] Figure 12 This schematically illustrates the stacking direction of the insulating layer, coil conductors, connecting conductors, and laminates, without strictly representing the actual shapes and connections. For example, the coil conductors are connected via through-hole conductors.

[0118] like Figure 12 as well as Figure 13 As shown, the stacked coil component 1A is similar to the stacked coil component 1 of Embodiment 1, and includes: a stacked body 10, a built-in coil 30, which is formed by electrically connecting a plurality of coil conductors 32 stacked together with the insulating layer 31; and a first external electrode 21 and a second external electrode 22, which are electrically connected to the coil 30.

[0119] Furthermore, in the stacked coil component 1A, similar to the stacked coil component 1 of Embodiment 1, since the inner diameter area of ​​the coil 30 is larger than the specified area, the transmittance coefficient S21 in the low frequency band can be improved.

[0120] That is, the inner diameter area of ​​coil 30 is 7500 μm. 2 The above, preferably 10000μm 2 The above, more preferably 13000μm 2 The above is further preferred to be 15000μm. 2 above.

[0121] In addition, the inner diameter area of ​​coil 30 is preferably 25000 μm. 2 Below, 20000μm is more preferred. 2Hereinafter, 18000μm is further preferred. 2 the following.

[0122] In this embodiment, the shape of each coil conductor 32 when viewed from the stacking direction is not particularly limited. However, when the shape of the coil conductor 32 is a shape with a long side direction and a short side direction, such as a rectangle, an ellipse, or a track shape, it is preferable that each coil conductor 32 is arranged so that the long side direction is parallel to the width direction.

[0123] [Manufacturing method for laminated coil components]

[0124] An example of a method for manufacturing the stacked coil component of the present invention will be described.

[0125] Initially, ceramic green sheets are produced to become the insulating layer. For example, firstly, organic binders such as polyvinyl butyral resin, organic solvents such as ethanol and toluene, and dispersants are added to a ferrite material and mixed to form a slurry. Then, ceramic green sheets with a thickness of about 10 to 25 μm are produced using methods such as the doctor blade method.

[0126] As a ferrite material, for example, a material prepared using the following method is listed. First, oxide raw materials of iron, nickel, zinc, and copper are mixed and pre-fired at 800°C for 1 hour. Then, the pre-fired material is pulverized using a ball mill and dried to produce a Ni-Zn-Cu ferrite material (oxide mixed powder) with an average particle size of about 2 μm.

[0127] When using ferrite materials to fabricate ceramic green sheets, in order to obtain high inductance, the preferred composition of the ferrite material is Fe2O3: 40 mol% or more and 49.5 mol% or less, ZnO: 5 mol% or more and 35 mol% or less, CuO: 4 mol% or more and 12 mol% or less, with the remainder being NiO and trace additives (including unavoidable impurities).

[0128] In addition to magnetic materials such as ferrite materials mentioned above, other materials used as ceramic green sheets include glass ceramic materials, non-magnetic materials such as zinc silicate, magnetic materials, and mixtures of non-magnetic materials.

[0129] Next, a conductor pattern that will later become the coil conductor and the via conductor is formed on the ceramic green sheet. For example, first, a via is formed by laser processing the ceramic green sheet. Then, a conductive paste such as silver paste is filled into the via to form a conductor pattern for the via conductor. Further, a conductor pattern for the coil conductor is printed on the main surface of the ceramic green sheet using a conductive paste such as silver paste, by methods such as screen printing. For example, a conductor pattern equivalent to... Figure 4 as well as Figure 5 The conductor pattern of the coil conductor is shown.

[0130] At this point, the shape of the conductor pattern used for the coil conductor is such that the inner diameter area of ​​the resulting coil is 7500 μm. 2 The shapes described above.

[0131] Then, by drying, a coil sheet is obtained, which has a structure in which conductor patterns for coil conductors and conductor patterns for through-hole conductors are formed on a ceramic green sheet. In the coil sheet, the conductor patterns for coil conductors and the conductor patterns for through-hole conductors are interconnected.

[0132] In addition, a via sheet is fabricated independently of the coil sheet. This via sheet has a structure in which a conductor pattern for a via conductor is formed on a ceramic green sheet. The conductor pattern for a via conductor of the via sheet becomes the conductor pattern of the via conductor that subsequently constitutes the connecting conductor.

[0133] Next, coil sheets are stacked in a prescribed order so that a coil with a coil axis parallel to the mounting surface is formed inside the stack after monolithization and firing.

[0134] Furthermore, through-hole sheets are stacked on the upper and lower layers of the coil sheet stack.

[0135] Next, after hot-pressing the laminate of the coil sheet and the via sheet to obtain a weldment body, it is cut to the specified chip size to obtain a monolithic chip. Alternatively, the monolithic chip can be rounded at the corners and edges by, for example, tumbling.

[0136] Next, the monolithic chip is subjected to a debonding process and firing at a specified temperature and time to form a laminate (fired body) with an internally integrated coil. At this time, the conductor patterns for the coil conductors and the conductor patterns for the via conductors become the coil conductors and via conductors, respectively, after firing. The coil is formed by connecting the coil conductors to each other via the via conductors. Furthermore, the lamination direction of the laminate and the coil axis are parallel to the mounting surface.

[0137] Next, by vertically impregnating the laminate with a conductive paste such as silver paste to a specified thickness and sintering it, a base electrode layer for the external electrode is formed on five sides (end face, two main faces, and two end faces) of the laminate.

[0138] In addition, by obliquely impregnating the laminate with a conductive paste such as silver paste stretched to a specified thickness and then sintering it, it is possible to form the base electrode of the external electrode on the four sides (main surface, end surface, and two side surfaces) of the laminate.

[0139] Next, a nickel coating and a tin coating of a specified thickness are sequentially formed on the substrate electrode layer by plating. As a result, an external electrode is formed.

[0140] Based on the above, the stacked coil component of the present invention is manufactured.

[0141]

Example

[0142] The following describes embodiments of the stacked coil component of the present invention in more detail. However, the present invention is not limited to these embodiments.

[0143] [Preparation of Samples]

[0144] (Sample 1)

[0145] (1) Prepare ferrite materials (pre-fired powder) with specified composition and glass ceramic materials with specified composition.

[0146] (2) The above materials, organic binder (polyvinyl butyral resin), organic solvent (ethanol and toluene) and PSZ balls are put into a can mill and wet-mixed and pulverized to make a magnetic slurry containing non-magnetic materials.

[0147] (3) The magnetic slurry is formed into a sheet by scraping, and then stamped into a rectangle to produce multiple ceramic raw sheets.

[0148] (4) Prepare a conductive paste for the internal conductor containing Ag powder and an organic carrier.

[0149] (5) Fabrication of via plates

[0150] Through-holes are formed by irradiating designated areas of a ceramic green sheet with a laser. Conductive paste is then filled into the through-holes to form conductive vias, and conductive paste is screen-printed around them using a circular screen to form solder pads.

[0151] (6) Fabrication of coil sheets

[0152] After forming through holes in designated areas of the ceramic green sheet, filling them with conductive paste to form conductive through holes, and then printing coil conductors consisting of pads and lines, a coil sheet is obtained.

[0153] (7) In order to sort these pieces Figure 4 as well as Figure 5 After the coil conductors are stacked in the order shown, with 28 layers, they are heated and pressurized, and then cut into single pieces using a cutter, thereby creating a laminated molded body.

[0154] (8) The laminate is produced by placing the laminated body into a firing furnace, removing the binder at 500°C in an atmospheric atmosphere, and then firing it at 900°C.

[0155] After measuring the dimensions of 30 laminates using a micrometer and calculating the average values, B_L = 360 μm, B_W = 180 μm, and B_T = 280 μm.

[0156] (9) A conductive paste containing Ag powder and glass microflakes for the external electrode is poured into a coating forming tank to form a coating of a specified thickness. In this coating, the portion of the laminate used to form the external electrode is impregnated.

[0157] (10) The base electrode of the external electrode is formed by sintering at a temperature of about 800°C after impregnation.

[0158] (11) By means of electroplating, a Ni film and a Sn film are sequentially formed on the base electrode to form an external electrode.

[0159] Based on the above, make a product with Figure 1 , Figure 2A , Figure 2B as well as Figure 2C The external electrode of the shape shown, and Figure 3 , Figure 4 as well as Figure 5 The internal structure of the stacked coil component shown is a stacked coil component (sample 1).

[0160] After measuring the dimensions of 30 stacked coil components using a micrometer and calculating the average values, L = 400 μm, W = 200 μm, and T = 300 μm.

[0161] In sample 1, the number of turns of the coil was set to 21, the number of layers of the coil conductor was set to 28, and the width W of the wire portion constituting the coil conductor was set to... C The thickness of the coil conductor is set to 5 μm and the side gaps G_W1 and G_W2 are set to 22 μm and G_T1 and G_T2 are set to 92 μm. Furthermore, the distance between adjacent coil conductors in the stacking direction (hereinafter, the distance between electrodes) is set to 5 μm, the coil length is set to 275 μm, the inner diameter R_W in the width direction is set to 84 μm, the inner diameter R_T in the height direction is set to 94 μm, the inner diameter ratio is set to 1.12, and the outer layer thickness is set to 40 μm. Additionally, the inner diameter area of ​​the coil is set to 7896 μm. 2 .

[0162] The coil length is calculated according to the following formula.

[0163] Coil length = Number of coil conductor layers × Coil conductor thickness + (Number of coil conductor layers - 1) × Electrode distance

[0164] The inner diameter ratio of the coil is calculated according to the following formula.

[0165] The ratio of the inner diameter of the coil to its height (R_T) ÷ the ratio of the inner diameter of the coil to its width (R_W)

[0166] The outer layer thickness is the length calculated according to the following formula.

[0167] Outer layer thickness = (Dimension of blank in length direction B_L - Coil length) ÷ 2

[0168] (Samples 2-4)

[0169] Except for changing various parameters as shown in Table 1, the stacked coil components (samples 2-4) were manufactured in the same order as sample 1.

[0170] Table 1

[0171]

[0172] (Samples 5-7)

[0173] Except for changing various parameters as shown in Table 2, the stacked coil components (samples 5-7) were fabricated in the same order as sample 1.

[0174] Table 2

[0175]

[0176] (Measured through coefficient S21)

[0177] Figure 14 This is a diagram schematically illustrating the method for measuring the transmittance coefficient S21.

[0178] like Figure 14 As shown, the sample (layered coil component 1) is soldered to a measuring fixture 60 provided with a signal path 61 and a grounding conductor 62. The first external electrode 21 of the layered coil component 1 is connected to the signal path 61, and the second external electrode 22 is connected to the grounding conductor 62.

[0179] Using a network analyzer 63, the power of the input signal and the transmitted signal to the sample is determined, and the transmittance coefficient S21 is measured by changing the frequency. One end of the signal path 61 is connected to the network analyzer 63.

[0180] exist Figure 15 as well as Figure 16 The measurement results are shown in the figure. Figure 15 This is a chart showing the transmittance coefficient S21 of samples 1 to 4. Figure 16 This is a graph showing the transmittance S21 for samples 4-7. Furthermore, the transmittance S21 indicates that the closer it is to 0 dB, the less the loss. Additionally, Figure 17 This is a graph showing the relationship between the transmittance S21 at 1 GHz and the inner diameter area of ​​the coil in each sample.

[0181] It can be said that, according to Figures 15-17 A strong correlation exists between the transmittance S21 at 1 GHz and the inner diameter area of ​​the coil. Furthermore, it is evident that among samples 1-4, 6, and 7, which increase the inner diameter area of ​​the coil while maintaining a reduced mounting area, sample 5, which also has a smaller dimension in the height direction, exhibits a higher transmittance S21 at 1 GHz and superior low-frequency characteristics compared to sample 5. Specifically, it is found that by setting the inner diameter area of ​​the coil to 7500 μm... 2 The above achieves a transmittance S21 of -1.0dB or higher at 1GHz by setting the inner diameter area of ​​the coil to 10000μm. 2 The above achieves a transmittance S21 of -0.8dB or higher at 1GHz by setting the inner diameter area of ​​the coil to 13000μm. 2 The above achieves a transmittance S21 of -0.6dB or higher at 1GHz by setting the inner diameter area of ​​the coil to 15000μm. 2 The transmittance S21 at 1 GHz can be set to -0.4 dB or higher.

[0182] The following information is disclosed in this specification.

[0183] <1>

[0184] A stacked coil component, characterized in that it comprises:

[0185] A laminate, consisting of multiple insulating layers stacked along its length, with a coil built inside; and

[0186] The first external electrode and the second external electrode are electrically connected to the aforementioned coil.

[0187] The aforementioned coil is formed by electrically connecting multiple coil conductors stacked together with the aforementioned insulating layer along the aforementioned length direction.

[0188] The aforementioned laminate includes: a first end face and a second end face, facing each other in the aforementioned length direction; a first main face and a second main face, facing each other in a height direction orthogonal to the aforementioned length direction; and a first side face and a second side face, facing each other in a width direction orthogonal to the aforementioned length direction and the aforementioned height direction.

[0189] The stacking direction of the aforementioned laminate and the coil axis of the aforementioned coil are parallel to the aforementioned first main surface.

[0190] The first main surface mentioned above is the mounting surface.

[0191] Let the dimensions of the laminated body in the width direction, the height direction, and the length direction be B_W, B_T, and B_L, respectively.

[0192] The above-mentioned laminates satisfy B_W≤200μm, B_L≤400μm, and 200μm≤B_T, or satisfy B_T≤200μm, B_L≤400μm, and 200μm≤B_W.

[0193] The inner diameter area of ​​the above coil is 7500 μm. 2 above.

[0194] <2>

[0195] According to the laminated coil component described in <1>, it is characterized in that,

[0196] The inner diameter area of ​​the above coil is 10000 μm. 2 above.

[0197] <3>

[0198] According to the laminated coil component described in <2>, it is characterized in that,

[0199] The inner diameter area of ​​the above coil is 13000 μm. 2 above.

[0200] <4>

[0201] According to the laminated coil component described in <3>, it is characterized in that,

[0202] The inner diameter area of ​​the above coil is 15000 μm. 2 above.

[0203] <5>

[0204] According to any one of <1> to <4>, the laminated coil component is characterized in that,

[0205] The aforementioned laminate is composed of a mixture of ferrite material and a non-magnetic material with a lower dielectric constant than the aforementioned ferrite material.

[0206] <6>

[0207] According to any one of <1> to <5>, the laminated coil component is characterized in that,

[0208] The width-direction interval between the coil and the first side surface is defined as the side gap G_W1; the width-direction interval between the coil and the second side surface is defined as the side gap G_W2; the height-direction interval between the coil and the first main surface is defined as the side gap G_T1; and the height-direction interval between the coil and the second main surface is defined as the side gap G_T2.

[0209] The above-mentioned stacked bodies satisfy G_W1≥10μm, G_W2≥10μm, G_T1≥10μm and G_T2≥10μm.

[0210] <7>

[0211] According to any one of <1> to <6>, the laminated coil component is characterized in that,

[0212] When viewed from the perspective of the aforementioned stacked directions, the multiple coil conductors appear rectangular in shape.

[0213] <8>

[0214] According to any one of <1> to <7>, the stacked coil component is characterized in that the number of turns of the coil is 10 or more.

Claims

1. A stacked coil component, characterized in that, have: A laminate, consisting of multiple insulating layers stacked along its length, with a coil built inside; and The first external electrode and the second external electrode are electrically connected to the coil. The coil is formed by multiple coil conductors that are electrically connected together along the length direction, together with the insulating layer. The laminate has: a first end face and a second end face, facing each other in the length direction; a first main face and a second main face, facing each other in a height direction orthogonal to the length direction; and a first side face and a second side face, facing each other in a width direction orthogonal to both the length direction and the height direction. The stacking direction of the laminate and the coil axis of the coil are parallel to the first main surface. The first main surface is the mounting surface. Let the dimensions of the laminate in the width direction, the height direction, and the length direction be BW, BT, and BL, respectively. The laminate satisfies BW≤200μm, BL≤400μm, and 200μm≤BT, or satisfies BT≤200μm, BL≤400μm, and 200μm≤BW. The inner diameter area of ​​the coil is 7500 μm. 2 above.

2. The laminated coil component according to claim 1, characterized in that, The inner diameter area of ​​the coil is 10000 μm. 2 above.

3. The laminated coil component according to claim 2, characterized in that, The inner diameter area of ​​the coil is 13000 μm. 2 above.

4. The laminated coil component according to claim 3, characterized in that, The inner diameter area of ​​the coil is 15000 μm. 2 above.

5. The laminated coil component according to any one of claims 1 to 4, characterized in that, The laminate is composed of a mixture of ferrite material and a non-magnetic material with a lower dielectric constant than the ferrite material.

6. The laminated coil component according to any one of claims 1 to 5, characterized in that, The width-direction interval between the coil and the first side surface is defined as side gap GW1; the width-direction interval between the coil and the second side surface is defined as side gap GW2; the height-direction interval between the coil and the first main surface is defined as side gap GT1; and the height-direction interval between the coil and the second main surface is defined as side gap GT2. The laminate satisfies GW1≥10μm, GW2≥10μm, GT1≥10μm and GT2≥10μm.

7. The laminated coil component according to any one of claims 1 to 6, characterized in that, The shape of the plurality of coil conductors when viewed from the perspective of overlapping layers is rectangular.

8. The laminated coil component according to any one of claims 1 to 7, characterized in that, The coil has 10 or more turns.

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