Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a capacitance forming portion including dielectric layers and internal electrodes alternately arranged in a first direction, and a cover portion disposed on the capacitance forming portion in the first direction, the main body comprises a first surface, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; an external electrode disposed on the third surface and the fourth surface; a side edge portion disposed on the fifth surface and the sixth surface, and wherein the side edge portion includes a first extension portion disposed to extend to a portion of the first surface and a portion of the second surface, and wherein at least a partial region of the first extension portion has a curvature, when an average thickness of the side edge portion is WM0 and a radius of curvature of the at least partial region of the first extension portion is R, WM0 and R may satisfy 1.1 lt; r / WM0lt; 2.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0113811, filed on August 23, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various electronic products, such as image display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, to charge or discharge them.

[0004] Multilayer ceramic capacitors are used as components in a variety of electronic devices due to their small size, guaranteed high capacitance, and ease of installation. As various electronic devices, such as computers and mobile devices, miniaturize and achieve high output power, the demand for miniaturized and high-capacitance multilayer ceramic capacitors continues to increase.

[0005] To miniaturize multilayer ceramic capacitors and increase their capacitance, it is necessary to maximize the effective electrode area (increasing the effective volume fraction required to achieve the capacitance). When manufacturing multilayer ceramic capacitors to achieve small and high capacitance, the inner electrodes can be manufactured to expose in the width direction of the body, thereby maximizing the width dimension of the inner electrodes through a borderless design. In this case, a method is applied where ceramic green sheets for the side edges are individually attached to the exposed surfaces of the inner electrodes in the width direction, and then the ceramic green sheets are sintered to prevent the inner electrodes from being exposed to the outside in the width direction.

[0006] Side edges can be formed by attaching ceramic green sheets separately to improve the capacitance per unit volume of multilayer ceramic capacitors. However, during the plating process, problems such as shortened sheet life or defects may occur due to external moisture penetration or plating solution penetration at the joint interface between the body and the side edges.

[0007] Therefore, research has been actively conducted on preventing moisture-proof reliability degradation in ultra-small and high-capacitance products. Summary of the Invention

[0008] One aspect of this disclosure is to provide a multilayer electronic assembly that has improved moisture resistance by enhancing the interface structure between the body and the side edges to prevent external moisture penetration.

[0009] One aspect of this disclosure is to provide an ultra-miniature multilayer electronic component by forming a thin and uniform external electrode.

[0010] However, the aspects of this disclosure are not limited to the foregoing and can be more readily understood in the process of describing specific embodiments of this disclosure.

[0011] A multilayer electronic component may include: a body comprising a capacitor forming portion and a cover portion, the capacitor forming portion including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, the cover portion being disposed on two surfaces of the capacitor forming portion in the first direction, and the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and opposite to each other in a third direction; external electrodes disposed on the third surface and the fourth surface; and side edge portions disposed on the fifth surface and the sixth surface, wherein the side edge portions may include a first extension portion, the first extension portion being configured to extend to a portion of the first surface and a portion of the second surface, and wherein at least a portion of the first extension portion has curvature, and WM0 and R satisfy 1.1 when the average thickness of the side edge portion is WM0 and the radius of curvature of the at least a portion of the first extension portion is R. <R / WM0<2。

[0012] A multilayer electronic component according to some example embodiments may include: a body including a capacitor forming portion and a cover portion, the capacitor forming portion including a dielectric layer and an inner electrode arranged alternately with the dielectric layer in a first direction, the cover portion being disposed on two surfaces of the capacitor forming portion in the first direction, and the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and opposite to each other in a third direction; an outer electrode disposed on the third surface and the fourth surface; and a side edge portion disposed on the fifth surface and the sixth surface, and the side edge portion may include a first extension portion configured to extend to a portion of the first surface and a portion of the second surface, and wherein at least a portion of the first extension portion has curvature, and the outer electrode extends to a portion of the first surface and a portion of the second surface, and the outer electrode may include a first electrode layer configured to cover the first extension portion, and the average thickness of the first electrode layer is greater than or equal to 1 μm and less than or equal to 8 μm.

[0013] One of the various effects of this disclosure is to improve the moisture resistance of multilayer electronic components by enhancing the interface structure between the body and the side edges to prevent external moisture penetration.

[0014] One of the various effects of this disclosure is to enable the miniaturization of multilayer electronic components by forming the external electrodes as thin and uniform.

[0015] However, the various beneficial advantages and effects are not limited to those described above, and can be more readily understood in the process of describing specific embodiments of this disclosure. Attached Figure Description

[0016] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an exemplary embodiment of the present disclosure; Figure 2 schematically shown Figure 1 A three-dimensional view of a multilayer electronic component excluding external electrodes; Figure 3 schematically shown Figure 1 A three-dimensional view of a multilayer electronic assembly excluding external electrodes and side edges; Figure 4 It is along Figure 1 A schematic cross-sectional view of line I-I'; Figure 5 yes Figure 2 A schematic plan view (viewed from above in the first direction); Figure 6 yes Figure 2 Side view (viewed from the left in the second direction); Figure 7 It is along Figure 1 A schematic cross-sectional view taken from line II-II'; Figure 8 yes Figure 7 A magnified view of region M; Figure 9A The thickness of each region of the first electrode layer is shown in different colors, and a histogram is used to show the percentage of each thickness. Figure 9B The thickness of each region of the first electrode layer in the embodiment of the invention is shown in different colors, and a histogram is used to show the percentage of each thickness; and Figure 10A This is a graph showing the evaluation of the moisture-proof reliability of the comparative examples. Figure 10B This is a graph showing the evaluation of the moisture-proof reliability of the invention example. Detailed Implementation

[0017] In the following description, exemplary embodiments of the present disclosure will be illustrated with reference to specific example embodiments and accompanying drawings. However, exemplary embodiments of the present disclosure may be exemplified in many different forms and should not be construed as limited to the specific embodiments set forth herein. The exemplary embodiments disclosed herein are provided to those skilled in the art to better explain the present disclosure. Therefore, in the accompanying drawings, the shape and size of elements may be exaggerated for clarity, and the same reference numerals will always be used to denote the same elements.

[0018] Furthermore, for the sake of clear description of this disclosure in the accompanying drawings, content unrelated to the description has been omitted, and since the dimensions (e.g., thickness) of each component shown in the drawings are arbitrarily illustrated for ease of description, this disclosure is not limited thereto. Additionally, components with the same concept and function are described using the same reference numerals. Throughout the specification, when a part "comprises" or "includes" a component, it indicates, unless otherwise stated, that other components are not excluded and may be further included.

[0019] In the accompanying drawings, the first direction can be the thickness direction, the second direction can be the length direction, and the third direction can be the width direction.

[0020] Multilayer electronic components Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an exemplary embodiment of the present disclosure.

[0021] Figure 2 schematically shown Figure 1 A three-dimensional view of a multilayer electronic component excluding external electrodes.

[0022] Figure 3 schematically shown Figure 1 A three-dimensional view of a multilayer electronic assembly excluding external electrodes and side edges.

[0023] Figure 4 It is along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0024] Figure 5 yes Figure 2 A schematic plan view (viewed from above in the first direction).

[0025] Figure 6 yes Figure 2 A side view (viewed from the left in the second direction).

[0026] Figure 7 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0027] Figure 8 yes Figure 7 A magnified view of region M.

[0028] In the following text, reference will be made to Figures 1 to 8 A multilayer electronic component according to some example embodiments of the present disclosure is described in detail. However, while a multilayer ceramic capacitor is described as an example of a multilayer electronic component, the multilayer electronic components of the present disclosure can also be applied to various electronic products using dielectric compositions, such as inductors, piezoelectric elements, varistors, or thermistors.

[0029] According to some example embodiments of this disclosure, a multilayer electronic component 100 may include: a body 110 including a capacitor forming portion Ac and cover portions 112 and 113, the capacitor forming portion Ac including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, the cover portions 112 and 113 being disposed on two surfaces of the capacitor forming portion Ac in the first direction, and the body 110 including a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and surfaces connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in the third direction. The fifth surface 5 and the sixth surface 6; external electrodes 131 and 132, disposed on the third surface 3 and the fourth surface 4; and side edge portions 114 and 115, disposed on the fifth surface 5 and the sixth surface 6, wherein the side edge portions 114 and 115 may include first extension portions 114-1, 114-2, 115-1, and 115-2 configured to extend into a portion of the first surface 1 and a portion of the second surface 2, wherein at least a portion of the first extension portion has curvature, and WM0 and R satisfy 1.1 when the average thickness of the side edge portions 114 and 115 is WM0 and the radius of curvature of the at least a portion of the first extension portions 114-1, 114-2, 115-1, and 115-2 is R. <R / WM0<2。

[0030] In the body 110, dielectric layer 111 and internal electrodes 121 and 122 may be stacked alternately.

[0031] More specifically, the body 110 may include a capacitor forming portion Ac for forming a capacitor, the capacitor forming portion Ac being disposed inside the body 110 and including a first inner electrode 121 and a second inner electrode 122 alternately arranged facing each other, and a dielectric layer 111 being disposed between the first inner electrode 121 and the second inner electrode 122.

[0032] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic powder particles included in the main body 110 during the sintering process, the main body 110 may not have a hexahedral shape with completely straight lines, but may have a substantially hexahedral shape.

[0033] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction.

[0034] In a state where the plurality of dielectric layers 111 included in the main body 110 are sintered, the adjacent dielectric layers 111 may be integrated, so that it is difficult to distinguish the boundary between the adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0035] The material for forming the dielectric layer 111 is not limited as long as sufficient electrostatic capacitance can be obtained. Generally, perovskite (ABO3)-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based materials may include BaTiO3-based ceramic particles. Examples of BaTiO3-based ceramic particles include BaTiO3 and (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0036] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to particles such as barium titanate (BaTiO3) as materials included in the dielectric layer 111 according to the purpose of the present disclosure.

[0037] The thickness td of the dielectric layer 111 does not need to be particularly limited.

[0038] To ensure the reliability of the multilayer electronic component 100 under high-voltage environments, the thickness td of the dielectric layer 111 can be less than or equal to 10.0 μm. Furthermore, to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness td of the dielectric layer 111 can be less than or equal to 3.0 μm. And to more easily achieve ultra-miniaturization and high capacitance, the thickness td of the dielectric layer 111 can be less than or equal to 1.0 μm, and preferably less than or equal to 0.6 μm, and more preferably less than or equal to 0.4 μm.

[0039] In this case, the thickness td of dielectric layer 111 can be a concept that includes the thickness of at least one of a plurality of dielectric layers, or it can be a concept that includes the thickness of each of all dielectric layers.

[0040] Here, the thickness td of the dielectric layer 111 can represent the thickness td of the dielectric layer 111 disposed between the first inner electrode 121 and the second inner electrode 122.

[0041] Furthermore, the thickness td of the dielectric layer 111 can represent the dimension of the dielectric layer 111 in the first direction. Additionally, the thickness td of the dielectric layer 111 can represent the average thickness td of the dielectric layer 111, and can also represent the average dimension of the dielectric layer 111 in the first direction.

[0042] The average dimension of the dielectric layer 111 in the first direction can be measured by scanning images of the first and second cross-sections of the body 110 at 10,000x magnification using a scanning electron microscope (SEM). More specifically, the average dimension of a dielectric layer 111 in the first direction can refer to the average value calculated in the scanned image by measuring the dimension in the first direction at 10 points equidistant from each other in the second direction of the dielectric layer 111. The 10 equidistant points can be specified in the capacitance forming section Ac. Furthermore, the average thickness of the dielectric layer 111 in the first direction can be further generalized by extending the average value measurement to 10 dielectric layers 111 to measure the thickness value.

[0043] The inner electrodes 121 and 122 may be stacked alternately with the dielectric layer 111. The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be alternately arranged to face each other, and the dielectric layer 111 is located between the first inner electrode 121 and the second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0044] More specifically, the first inner electrode 121 is spaced apart from the fourth surface 4 and can be exposed through the third surface 3, and the second inner electrode 122 is spaced apart from the third surface 3 and can be exposed through the fourth surface 4. The first outer electrode 131 can be disposed on the third surface 3 of the body 110 and can be connected to the first inner electrode 121, and the second outer electrode 132 can be disposed on the fourth surface 4 of the body 110 and can be connected to the second inner electrode 122.

[0045] That is, the first inner electrode 121 can be connected to the first outer electrode 131 but not to the second outer electrode 132, and the second inner electrode 122 can be connected to the second outer electrode 132 but not to the first outer electrode 131. In this case, the first inner electrode 121 and the second inner electrode 122 can be electrically isolated from each other by a dielectric layer 111 disposed between them.

[0046] Alternatively, the main body 110 can be formed by alternately stacking a first ceramic green sheet on which a paste for a first internal electrode is printed and a second ceramic green sheet on which a paste for a second internal electrode is printed, and then sintering the first ceramic green sheet and the second ceramic green sheet.

[0047] There are no particular limitations on the materials used to form the internal electrodes 121 and 122, and materials with excellent electrical conductivity can be used to form the internal electrodes 121 and 122. For example, the internal electrodes 121 and 122 may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0048] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for the internal electrodes onto a ceramic green sheet. The conductive paste for the internal electrodes includes at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. As a method for printing the conductive paste for the internal electrodes, screen printing, gravure printing, etc., can be used, and this disclosure is not limited thereto.

[0049] In addition, the thickness te of the inner electrodes 121 and 122 does not need to be specifically limited.

[0050] To ensure the reliability of the multilayer electronic component 100 under high-voltage environments, the thickness te of the inner electrodes 121 and 122 can be less than or equal to 3.0 μm. Furthermore, to achieve miniaturization and high capacitance in the multilayer electronic component 100, the thickness te of the inner electrodes 121 and 122 can be less than or equal to 1.0 μm, and to more easily achieve ultra-miniaturization and high capacitance, the thickness te of the inner electrodes 121 and 122 can be less than or equal to 0.6 μm, and more preferably, less than or equal to 0.4 μm.

[0051] In this case, the thickness te of the inner electrodes 121 and 122 can be a concept of the thickness te of at least one of the multiple inner electrodes 121 and 122, or it can be a concept of the thickness te of each of all the inner electrodes 121 and 122.

[0052] Here, the thickness te of the inner electrodes 121 and 122 can refer to the dimension of the inner electrodes 121 and 122 in the first direction. In addition, the thickness te of the inner electrodes 121 and 122 can refer to the average thickness te of the inner electrodes 121 and 122, and can also refer to the average dimension of the inner electrodes 121 and 122 in the first direction.

[0053] The average dimensions of the inner electrodes 121 and 122 in the first direction can be measured by scanning images of cross-sections of the main body 110 in the first and second directions at 10,000x magnification using a scanning electron microscope (SEM). More specifically, the average dimension of an inner electrode in the first direction can be calculated as an average value by measuring the dimension of an inner electrode in the first direction at 10 points equidistant from each other in the second direction in the scanned image. The 10 equidistant points can be specified in the capacitor forming section Ac. Furthermore, the average thickness of the inner electrodes in the first direction can be further generalized by extending the average value measurement to the thickness values ​​of the 10 inner electrodes 121 and 122.

[0054] Furthermore, in some exemplary embodiments of this disclosure, the thickness td of at least one of the plurality of dielectric layers 111 and the thickness te of at least one of the plurality of internal electrodes 121 and 122 can satisfy 2×te. <td。

[0055] In other words, the thickness td of one of the dielectric layers 111 may be more than twice the thickness te of one of the inner electrodes 121 and 122. Preferably, the average thickness td of the plurality of dielectric layers 111 may be more than twice the average thickness te of the plurality of inner electrodes 121 and 122.

[0056] Typically, reliability issues arising from the reduction in breakdown voltage (BDV) under high-voltage conditions are a major concern for high-voltage electrical and electronic components.

[0057] Therefore, in order to prevent the breakdown voltage from decreasing under high voltage conditions, the average thickness td of dielectric layer 111 can be more than twice the average thickness te of inner electrodes 121 and 122, thereby increasing the thickness of dielectric layer (which is the distance between inner electrodes) and improving breakdown voltage characteristics.

[0058] When the average thickness td of dielectric layer 111 is less than or equal to twice the average thickness te of inner electrodes 121 and 122, the breakdown voltage may be reduced due to the thinner average thickness of the dielectric layer (which is the distance between the inner electrodes), and a short circuit may occur between the inner electrodes.

[0059] Additionally, the main body 110 may include cover portions 112 and 113 disposed on two surfaces in a first direction of the capacitor forming portion Ac.

[0060] Specifically, the main body 110 may include a first covering portion 112 disposed on one surface of the capacitor forming portion Ac in the first direction and a second covering portion 113 disposed on another surface of the capacitor forming portion Ac in the first direction. More specifically, the main body 110 may include an upper covering portion 112 disposed on the upper part of the capacitor forming portion Ac in the first direction and a lower covering portion 113 disposed on the lower part of the capacitor forming portion Ac in the first direction.

[0061] The first cover portion 112 and the second cover portion 113 can be formed by providing or stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor forming portion Ac in the first direction, respectively, and can mainly serve to prevent damage to the inner electrodes 121 and 122 due to physical stress and / or chemical stress.

[0062] The first cover portion 112 and the second cover portion 113 do not include the inner electrodes 121 and 122, and may include the same dielectric material as the dielectric material of the dielectric layer 111 of the capacitor forming portion Ac. That is, the first cover portion 112 and the second cover portion 113 may include ceramic materials, such as barium titanate (BaTiO3) based ceramic materials.

[0063] Furthermore, the thickness tc of the covering portions 112 and 113 does not need to be particularly limited, and in the following description, the thickness tc of the covering portions 112 and 113 may refer to the thickness tc of each of the first covering portion 112 and the second covering portion 113.

[0064] However, to more easily achieve miniaturization and high capacitance of multilayer electronic components, the thickness tc of the covers 112 and 113 can be less than or equal to 100 μm, preferably less than or equal to 30 μm, and more preferably less than or equal to 20 μm for ultra-small products. The thickness tc of the covers 112 and 113 can be greater than or equal to 1 μm, and preferably greater than or equal to 5 μm.

[0065] Here, the thickness tc of the covers 112 and 113 can refer to the first dimension of the covers 112 and 113.

[0066] In addition, the thickness tc of the covering portions 112 and 113 may refer to the average thickness tc of the covering portions 112 and 113, and may refer to the average dimension of the covering portions 112 and 113 in the first direction.

[0067] The average dimensions of the covers 112 and 113 in the first direction can be measured by scanning images of the first and second direction sections of the body 110 at 10,000x magnification using a scanning electron microscope (SEM). More specifically, the average dimension can refer to the average value calculated from the image obtained by scanning one of the covers by measuring the dimensions in the first direction at 10 points equidistant from each other in the second direction.

[0068] Furthermore, the average dimension of the cover portion measured by the above method in the first direction may have a dimension that is substantially the same as the average dimension of the cover portion in the first direction measured in the first and third direction sections of the body 110.

[0069] Additionally, the multilayer electronic assembly 100 may include side edges 114 and 115 disposed on two surfaces of the body 110 in the third direction.

[0070] More specifically, the side edge portions 114 and 115 may include a first side edge portion 114 disposed on the fifth surface 5 of the body 110 and a second side edge portion 115 disposed on the sixth surface 6 of the body 110.

[0071] The side edges 114 and 115 primarily serve to prevent damage to the inner electrodes 121 and 122 due to physical and / or chemical stress.

[0072] The first side edge portion 114 and the second side edge portion 115 do not include the inner electrodes 121 and 122, and may include the same dielectric material as the dielectric material of the dielectric layer 111 of the capacitor forming portion Ac. That is, the first side edge portion 114 and the second side edge portion 115 may include ceramic materials, such as barium titanate (BaTiO3) based ceramic materials.

[0073] Furthermore, the thickness of the side edge portions 114 and 115 need not be specifically limited, but in the following description of the thickness of the side edge portions 114 and 115 may refer to the thickness of each of the first side edge portion 114 and the second side edge portion 115.

[0074] However, to more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the side edge portions 114 and 115 can be less than or equal to 50 μm, preferably less than or equal to 30 μm, and more preferably less than or equal to 20 μm in ultra-small products. The thickness of the side edge portions 114 and 115 can be greater than or equal to 1 μm, preferably greater than or equal to 5 μm.

[0075] Here, the thickness of the side edge portions 114 and 115 can be a concept including the third-direction (average) thickness WM0 of each of the main side edge portions 114-0 and 115-0 disposed on the fifth surface 5 and the sixth surface 6, but is not particularly limited thereto. It can also be a concept including the first-direction (average) dimension of each of the first extensions 114-1, 114-2, 115-1 and 115-2 of the side edge portions described below and the second-direction (average) dimension of each of the second extensions 114-3, 114-4, 115-3 and 115-4 of the side edge portions described below. In this case, the third-direction (average) thickness of each of the main side edge portions 114-0 and 115-0, the first-direction (average) dimension of each of the first extensions 114-1, 114-2, 115-1 and 115-2, and the second-direction (average) dimension of each of the second extensions 114-3, 114-4, 115-3 and 115-4 can be substantially the same. The following will describe each region of the side edge portions 114 and 115 in detail.

[0076] In addition, the thickness of the side edge portions 114 and 115 may refer to the average thickness of each of the side edge portions 114 and 115.

[0077] For example, the average dimensions of the main side edges 114-0 and 115-0 provided on the fifth surface 5 and the sixth surface 6 in the third direction can be measured by scanning images of the first and third direction cross sections of the multilayer electronic assembly 100 at 10,000x magnification using a scanning electron microscope (SEM). More specifically, the average dimension can refer to the average value calculated by measuring the third direction dimension at 10 points equidistant from each other in the first direction in an image obtained by scanning a side edge.

[0078] Furthermore, to achieve miniaturization and increase the capacitance of multilayer ceramic capacitors, it is necessary to maximize the effective area of ​​the internal electrodes (increasing the effective volume fraction required to achieve the capacitance). To achieve small size and high capacitance in multilayer ceramic capacitors, the internal electrodes can be manufactured to expose themselves in the width direction (i.e., the third direction) of the body, thereby maximizing the width dimension of the internal electrodes through a borderless design. In this case, a method is applied whereby ceramic green sheets for the side edges are individually attached in the width direction to the surface of the exposed internal electrodes of the body, and then the ceramic green sheets are sintered to prevent the internal electrodes from being exposed to the outside.

[0079] The side edge portion can be formed by attaching ceramic green sheets separately to the side edge portion, which can improve the capacitance per unit volume of multilayer ceramic capacitors. However, during the plating process, problems such as shortened sheet life or defects may occur due to the penetration of external moisture or plating solution at the joint interface between the body and the side edge portion.

[0080] In this disclosure, the side edge portion may be formed to extend further than a conventional side edge portion to cover the body and may be disposed on the body such that the penetration path of external moisture and / or plating solution that penetrates through the joint interface formed between the body and the side edge portion can be blocked or removed, thereby solving the above-mentioned problems.

[0081] Therefore, in a multilayer electronic assembly 100 according to some example embodiments of the present disclosure, the side edges 114 and 115 may include main side edges 114-0 and 115-0 disposed on the fifth surface 5 and the sixth surface 6, and first extensions 114-1, 114-2, 115-1 and 115-2 configured to extend to a portion of the first surface 1 and a portion of the second surface 2.

[0082] That is, the first side edge portion 114 may include a first main side edge portion 114-0 disposed on the fifth surface 5 and first extension portions 114-1 and 114-2 disposed on a portion of the first surface 1 and a portion of the second surface 2, respectively. Specifically, the first extension portions 114-1 and 114-2 of the first side edge portion may include a first-first extension portion 114-1 disposed on a portion of the first surface 1 and a first-second extension portion 114-2 disposed on a portion of the second surface 2.

[0083] The second side edge portion 115 may include a second main side edge portion 115-0 disposed on the sixth surface 6 and first extension portions 115-1 and 115-2 disposed on a portion of the first surface 1 and a portion of the second surface 2, respectively. Specifically, the first extension portions 115-1 and 115-2 of the second side edge portion may include a first-first extension portion 115-1 disposed on a portion of the first surface 1 and a first-second extension portion 115-2 disposed on a portion of the second surface 2.

[0084] Unless otherwise stated in this disclosure, the description of the first extensions 114-1, 114-2, 115-1, and 115-2 of the side edge portions can also be applied to the first extensions 114-1 and 114-2 of the first side edge portions and the first extensions 115-1 and 115-2 of the second side edge portions. Furthermore, the description of the first extensions 114-1 and 114-2 of the first side edge portions can also be applied to the first-first extension 114-1 disposed on a portion of the first surface 1 and the first-second extension 114-2 disposed on a portion of the second surface 2. Similarly, the description of the first extensions 115-1 and 115-2 of the second side edge portions can also be applied to the first-first extension 115-1 disposed on a portion of the first surface 1 and the first-second extension 115-2 disposed on a portion of the second surface 2.

[0085] The side edges 114 and 115 may include first extensions 114-1, 114-2, 115-1 and 115-2 configured to extend into a portion of the first surface 1 and a portion of the second surface 2 of the body, thereby effectively preventing the penetration of external moisture and / or plating solution, thus improving moisture resistance reliability.

[0086] At least a portion of the first extensions 114-1, 114-2, 115-1, and 115-2 may have curvature, i.e., may include curved regions.

[0087] In this case, when the average thickness of the side edges 114 and 115 is WM0, and the radius of curvature of at least a portion of the first extensions 114-1, 114-2, 115-1, and 115-2 is R, WM0 and R can satisfy 1.1. <R / WM0<2。

[0088] Here, the average thickness WM0 of the side edge portions 114 and 115 can be the average thickness WM0 of each of the first main side edge portion 114-0 and the second main side edge portion 115-0, and the radius of curvature R of at least a portion of the first extension portions 114-1, 114-2, 115-1 and 115-2 can refer to the radius of curvature R of a portion of one of the first extension portions 114-1, 114-2, 115-1 and 115-2.

[0089] More specifically, for example, the ratio (R / WM0) of the radius of curvature R of at least a portion of the first-second extension 115-2 of the second side edge portion to the average thickness WM0 of the second main side edge portion 115-0 can satisfy 1.1. <R / WM0<2。

[0090] When WM0 and R satisfy 1.1 < R / WM0 < 2, the interface between the main body 110 and the side edge portions 114 and 115 can be sufficiently covered, thereby preventing moisture from penetrating from the outside and improving the moisture-proof reliability.

[0091] In the case where WM0 and R are such that R / WM0 ≤ 1.1, it may not be possible to sufficiently improve the moisture-proof reliability, and in the design of the side edge portions 114 and 115, it may be difficult to make WM0 and R satisfy 2 ≤ R / WM0. Even if 2 ≤ R / WM0 is satisfied, it may be difficult to achieve miniaturization of the multilayer electronic component 100.

[0092] In some embodiments, the average thickness WM0 of the side edge portions 114 and 115 may satisfy 5 μm ≤ WM0 ≤ 30 μm.

[0093] For ease of measurement, the average thickness WM0 of the side edge portions 114 and 115 may be, for example, the average dimension WM0 in the third direction of each of the main side edge portions 114-0 and 115-0 provided on the fifth surface 5 and the sixth surface 6, but the present disclosure is not particularly limited thereto.

[0094] When WM0 < 5 μm is satisfied, there may be a concern that the inner electrodes 121 and 122 cannot be sufficiently protected. The upper limit value of WM0 is not particularly limited, but in order to achieve miniaturization of the multilayer electronic component 100, WM0 may preferably be WM0 ≤ 30 μm.

[0095] A method for measuring the radius of curvature R of at least a partial region of the first extension portions 114-1, 114-2, 115-1 and 115-2 may be as follows, for example.

[0096] Refer to Figure 8First, a scanning electron microscope (SEM) is used to image cross-sections of the multilayer electronic assembly 100, including the main body 110 (including the first cover 112), the first-second extension 115-2 of the second side edge portion, and the second external electrode 132, in both a first and third direction. In this case, in addition to a scanning electron microscope (SEM), a transmission electron microscope (TEM) or a scanning transmission electron microscope (STEM) can also be used. In the image captured by the scanning electron microscope (SEM), point SP1 represents the point where the main side edge portion 115-0 of the second side edge portion is farthest from the capacitor forming portion Ac, based on the extension line ELC of the interface between the first cover 112 and the capacitor forming portion Ac. In some embodiments, the extension line ELC can be a line parallel to the third direction. Next, point SP2 represents the point where, based on the first direction, the first-second extension 115-2 of the second side edge portion is farthest from the capacitor forming portion Ac. Here, point SP2 can be the point of maximum height of the first-second extension 115-2 of the second side edge portion. Additionally, when the distance (including direction) from point SP2 to point SP1 measured along the outer contour line (surface) of the second side edge 115 is LC0, the distance from point SP2 to point SP3, which is half of LC0 (in the same direction as LC0), can be LC1. When drawing any circle including SP2 and SP3, a virtual circle with a radius of curvature R can be obtained. In this case, R can be the radius of curvature of at least a portion of the first extensions 114-1, 114-2, 115-1, and 115-2.

[0097] In addition, in order to facilitate the measurement of the thickness of each of the first cover portion 112, the first-second extension portion 115-2 of the second side edge portion, the first electrode layer 132a of the second outer electrode, the first plating layer 132b of the second outer electrode and the second plating layer 132c of the second outer electrode, when drawing an extension line ELM including point SP2 from the capacitor forming portion Ac based on the first direction, the first direction dimension of each component can be interpreted as the thickness of the corresponding component.

[0098] More specifically, for example, the first-direction dimension of the first covering portion 112 on the extension line ELM can be interpreted as the thickness tc of the first covering portion, the first-direction dimension of the first-second extension portion 115-2 of the second side edge portion on the extension line ELM can be interpreted as the thickness TM of the first-second extension portion 115-2 of the second side edge portion, the first-direction dimension of the first electrode layer 132a on the extension line ELM can be interpreted as the thickness T1 of the first electrode layer 132a, the first-direction dimension of the first plating layer 132b on the extension line ELM can be interpreted as the thickness T2 of the first plating layer 132b, and the first-direction dimension of the second plating layer 132c on the extension line ELM can be interpreted as the thickness T3 of the second plating layer 132c. However, the present disclosure is not particularly limited thereto, and the thickness of each component can be defined by a general measurement method or the thickness measurement method described in the present disclosure.

[0099] The radius of curvature R of at least a partial region of the first extension portions 114-1, 114-2, 115-1, and 115-2 may satisfy 11 μm < R < 20 μm.

[0100] When R satisfies 11 μm < R < 20 μm, the interface between the main body 110 and the side edge portions 114 and 115 can be sufficiently covered, thereby preventing external moisture from penetrating and improving the moisture-proof reliability.

[0101] In the case where R is R ≤ 11 μm, the moisture-proof reliability may not be sufficiently improved. In the design of the side edge portions 114 and 115, it may be difficult to make R satisfy 20 μm ≤ R. Even if 20 μm ≤ R is satisfied, it may be difficult to miniaturize the multilayer electronic component 100.

[0102] In addition, when the curvature value of at least a partial region of the first extension portions 114-1, 114-2, 115-1, and 115-2 is κ, κ may satisfy 50 nm -1 < κ < 90 nm -1 . Here, the curvature value κ can be the reciprocal of the radius of curvature R (κ = 1 / R).

[0103] By satisfying 50 nm -1 < κ < 90 nm -1 , the interface between the main body 110 and the side edge portions 114 and 115 can be sufficiently covered, thereby preventing external moisture from penetrating and improving the moisture-proof reliability.

[0104] When κ ≤ 50 nm is satisfied -1 , the moisture-proof reliability may not be sufficiently improved, and in the design of the side edge portions 114 and 115, it may be difficult to make κ satisfy 90 nm -1 ≤ κ. Even if κ is 90 nm -1 ≤ κ, it may be difficult to miniaturize the multilayer electronic component 100.

[0105] The first extensions 114-1, 114-2, 115-1 and 115-2 of the side edge portion will be described in detail below.

[0106] When the third dimension at the center of the second direction of the first extensions 114-1, 114-2, 115-1 and 115-2 is WM1, and the third dimension at the end of the second direction of the first extensions 114-1, 114-2, 115-1 and 115-2 is WC1, WM1≤WC1 can be satisfied.

[0107] Since the first extensions 114-1, 114-2, 115-1 and 115-2 satisfy WM1≤WC1, the interfacial adhesion between the main body 110 and the side edge portions 114 and 115 can be excellent. Specifically, moisture penetration in corner portions of the main body 110 that are prone to external moisture penetration (e.g., the area where the main body 110, side edge portions 114 and 115 and external electrodes 131 and 132 intersect) can be further suppressed, thereby further improving the moisture-proof reliability of the multilayer electronic assembly 100.

[0108] Regarding WM1 and WC1 of the first extensions 114-1, 114-2, 115-1 and 115-2, the first-second extension 114-2 of the first side edge portion is described as an example and explained more specifically as follows.

[0109] In the first-second extension 114-2 of the first side edge portion disposed on the second surface 2, when the first-second extension 114-2 of the first side edge portion is divided into three equal regions in the second direction, the central region of the three equal regions may correspond to the central portion of the first-second extension 114-2 of the first side edge portion, and the remaining regions on both sides may correspond to the ends of the first-second extension 114-2 of the first side edge portion. In this case, the third directional dimension of the first-second extension 114-2 at any point in the second direction among the central portions of the first-second extension 114-2 of the first side edge portion may be WM1, and the third directional dimension of the first-second extension 114-2 at any point in the second direction among the ends of the first-second extension 114-2 of the first side edge portion may be WC1.

[0110] In a more preferred example, in the central portion of the first-second extension 114-2 of the first side edge portion, the third-dimensional minimum dimension of the first-second extension 114-2 of the first side edge portion may be WM1, and in the end portion of the first-second extension 114-2 of the first side edge portion, the third-dimensional dimension of the region of the first-second extension 114-2 of the first side edge portion disposed on the third surface 3 and the extension surface of the third surface 3 may be WC1, but this disclosure is not particularly limited thereto, and in the end portion of the first-second extension 114-2 of the first side edge portion, the third-dimensional dimension of the region of the first-second extension 114-2 of the first side edge portion disposed on the fourth surface 4 and the extension surface of the fourth surface 4 may also be WC1. In this specification, the first-second extension 114-2 of the first side edge portion is described as an example, but unless there is a contradiction, the description of the first-second extension 114-2 of the first side edge portion can also be applied to the first-first extension 114-1 of the first side edge portion and the first-first extension 115-1 and the first-second extension 115-2 of the second side edge portion.

[0111] Additionally, in some exemplary embodiments of the multilayer electronic assembly 100 according to this disclosure, the first extensions 114-1, 114-2, 115-1 and 115-2 of the side edge portion may include regions having a generally concave shape, and preferably, the first extensions 114-1, 114-2, 115-1 and 115-2 may be regions having a generally concave shape.

[0112] Additionally, in some exemplary embodiments of the multilayer electronic assembly 100 according to this disclosure, the first extensions 114-1, 114-2, 115-1, and 115-2 of the side edge portions may include a region in which the third-direction dimension of the first extensions 114-1, 114-2, 115-1, and 115-2 of the side edge portions increases from the second-direction central portion of the first extensions 114-1, 114-2, 115-1, and 115-2 of the side edge portions toward the second-direction end portion of the first extensions 114-1, 114-2, 115-1, and 115-2 of the side edge portions, and preferably, the first extensions 114-1, 114-2, 115-1, and 115-2 may be an enlarged region in which the third-direction dimension increases from the second-direction central portion toward the second-direction end portion as described above.

[0113] The first extensions 114-1, 114-2, 115-1 and 115-2 of the side edge portion may include a generally concave shape, or include a region whose third-direction dimension increases from the central portion of the second direction toward the end of the second direction, such that the interfacial bonding force between the body 110 and the side edge portions 114 and 115 can be excellent, and the moisture-proof reliability can be further improved.

[0114] Additionally, in some example embodiments of the multilayer electronic assembly 100 according to this disclosure, the side edge portions 114 and 115 may include second extensions 114-3, 114-4, 115-3 and 115-4 configured to extend into a portion of the third surface 3 and a portion of the fourth surface 4.

[0115] That is, the first side edge portion 114 may include second extensions 114-3 and 114-4 disposed on a portion of the third surface 3 and a portion of the fourth surface 4. Specifically, the second extensions 114-3 and 114-4 of the first side edge portion may include a second-first extension 114-3 disposed on a portion of the third surface 3 and a second-second extension 114-4 disposed on a portion of the fourth surface 4.

[0116] The second side edge portion 115 may include second extensions 115-3 and 115-4 disposed on a portion of the third surface 3 and a portion of the fourth surface 4. Specifically, the second extensions 115-3 and 115-4 of the second side edge portion may include a second-first extension 115-3 disposed on a portion of the third surface 3 and a second-second extension 115-4 disposed on a portion of the fourth surface 4.

[0117] More specifically, the first side edge portion 114 may include a main side edge portion 114-0 disposed on the fifth surface 5, a second-first extension portion 114-3 configured to extend to a portion of the third surface 3, and a second-second extension portion 114-4 configured to extend to a portion of the fourth surface 4. The second side edge portion 115 may include a main side edge portion 115-0 disposed on the sixth surface 6, a second-first extension portion 115-3 configured to extend to a portion of the third surface 3, and a second-second extension portion 115-4 configured to extend to a portion of the fourth surface 4.

[0118] In this disclosure, unless otherwise stated, the description of the second extensions 114-3, 114-4, 115-3, and 115-4 of the side edge portions can also be applied to the second extensions 114-3 and 114-4 of the first side edge portions and the second extensions 115-3 and 115-4 of the second side edge portions. Furthermore, the description of the second extensions 114-3 and 114-4 of the first side edge portions can also be applied to the second-first extension 114-3 disposed on a portion of the third surface 3 and the second-second extension 114-4 disposed on a portion of the fourth surface 4. Similarly, the description of the second extensions 115-3 and 115-4 of the second side edge portions can also be applied to the second-first extension 115-3 disposed on a portion of the third surface 3 and the second-second extension 115-4 disposed on a portion of the fourth surface 4.

[0119] Since the side edge portions 114 and 115 include second extension portions 114-3, 114-4, 115-3, and 115-4 that are set to extend to a part of the third surface 3 and a part of the fourth surface 4 of the main body, moisture-proof reliability can be improved by effectively preventing the penetration of external moisture and / or plating solution.

[0120] At least a partial region of the second extension portions 114-3, 114-4, 115-3, and 115-4 may have a curvature, that is, may include a curved region.

[0121] In this case, when the average thickness of the side edge portions 114 and 115 is WM0, and the radius of curvature of at least a partial region of the second extension portions 114-3, 114-4, 115-3, and 115-4 is R', WM0 and R' may satisfy 1.1 < R' / WM0 < 2. That is, the radius of curvature of at least a partial region of the second extension portion may be the same as the radius of curvature of at least a partial region of the first extension portion.

[0122] By making WM0 and R' satisfy 1.1 < R' / WM0 < 2, the interface between the main body 110 and the side edge portions 114 and 115 can be sufficiently covered, so that moisture can be prevented from penetrating from the outside, thereby improving moisture-proof reliability.

[0123] If WM0 and R' satisfy R' / WM0 ≤ 1.1, moisture-proof reliability may not be sufficiently improved. In the design of the side edge portions 114 and 115, it may be difficult to make WM0 and R' satisfy 2 ≤ R' / WM0. Even if 2 ≤ R' / WM0 is satisfied, it may be difficult to miniaturize the multilayer electronic component 100.

[0124] Here, the average thickness WM0 of the side edge portions 114 and 115 is the same as above, so redundant description thereof will be omitted.

[0125] The method for measuring the radius of curvature R' of at least a partial region of the second extension portions 114-3, 114-4, 115-3, and 115-4 may be the same as the method for measuring the radius of curvature R of at least a partial region of the first extension portions 114-1, 114-2, 115-1, and 115-2, and can be easily understood by those skilled in the art.

[0126] The radius of curvature R' of at least a partial region of the second extension portions 114-3, 114-4, 115-3, and 115-4 may satisfy 11 μm < R' < 20 μm.

[0127] By satisfying 11 μm < R' < 20 μm, the interface between the main body 110 and the side edge portions 114 and 115 can be sufficiently covered, thereby preventing external moisture from penetrating and improving moisture-proof reliability.

[0128] When R'≤11μm is met, the moisture resistance reliability may not be sufficiently improved, and in the design of the side edges 114 and 115, it may be difficult to make R' satisfy 20μm≤R', and even if 20μm≤R' is satisfied, it may be difficult to achieve miniaturization of the multilayer electronic component 100.

[0129] Furthermore, when the curvature values ​​of at least a portion of the second extensions 114-3, 114-4, 115-3, and 115-4 are defined as к', к' can satisfy 50nm -1 <к'<90nm -1 Here, the curvature value к′ can be the reciprocal of the radius of curvature R′ (к′=1 / R′).

[0130] By meeting 50nm -1 <к'<90nm -1 It can fully cover the interface between the main body 110 and the side edges 114 and 115, thereby preventing external moisture penetration and improving moisture-proof reliability.

[0131] When к'≤50nm -1 At that time, it may not be possible to fully improve moisture resistance reliability, and in the design of the side edge portions 114 and 115, it may be difficult to make к' meet 90nm. -1 ≤к', even if к' is 90nm -1 ≤к' may also make it difficult to achieve miniaturization of the multilayer electronic component 100.

[0132] The second extensions 114-3, 114-4, 115-3 and 115-4 of the side edge portion will be described in detail below.

[0133] When the third dimension in the third direction at the center of the first direction of the second extensions 114-3, 114-4, 115-3 and 115-4 is WM2, and the third dimension in the third direction at the end of the first direction of the second extensions 114-3, 114-4, 115-3 and 115-4 is WC2, WM2≤WC2 can be satisfied.

[0134] Since the second extensions 114-3, 114-4, 115-3 and 115-4 satisfy WM2≤WC2, the interfacial adhesion between the main body 110 and the side edge portions 114 and 115 can be excellent. Specifically, moisture penetration in corner portions of the main body 110 that are prone to external moisture penetration (e.g., the area where the main body 110, side edge portions 114 and 115 and external electrodes 131 and 132 intersect) can be further suppressed, thereby further improving the moisture-proof reliability of the multilayer electronic assembly 100.

[0135] When the second extension parts 114-3, 114-4, 115-3, and 115-4 satisfy WC2 < WM2, there may be concerns about external moisture penetration, which reduces the moisture-proof reliability.

[0136] Regarding WM2 and WC2 of the second extension parts 114-3, 114-4, 115-3, and 115-4, the second-first extension part 114-3 of the first side edge part can be described more specifically as an example as follows.

[0137] In the second-first extension part 114-3 of the first side edge part provided on the third surface 3, when the second-first extension part 114-3 of the first side edge part is divided into three equal regions in the first direction, the central region of the three equal regions can correspond to the central part of the second-first extension part 114-3 of the first side edge part, and the remaining upper region and lower region can correspond to the ends of the second-first extension part 114-3 of the first side edge part. In this case, the third-direction dimension of the second-first extension part 114-3 at any point in the first direction among the central parts of the second-first extension part 114-3 of the first side edge part can be WM2, and the third-direction dimension of the second-first extension part 114-3 at any point in the first direction among the ends of the second-first extension part 114-3 of the first side edge part can be WC2.

[0138] For a more preferred example, among the central parts of the second-first extension part 114-3 of the first side edge part, the minimum third-direction dimension of the second-first extension part 114-3 of the first side edge part can be WM2, and among the ends of the second-first extension part 114-3 of the first side edge part, the third-direction dimension of the region of the second-first extension part 114-3 of the first side edge part provided on the first surface 1 and the extended surface of the first surface 1 can be WC2, but the present disclosure is not particularly limited thereto, and among the ends of the second-first extension part 114-3 of the first side edge part, the third-direction dimension of the region of the second-first extension part 114-3 of the first side edge part provided on the second surface 2 and the extended surface of the second surface 2 can also be WC2. Additionally, as Figure 6 shown, WC2 can also represent the maximum dimension in the third direction from the edge of the first-first extension part 114-1 on the first surface 1 to the outermost edge of the first side edge part 114. In this specification, the second-first extension part 114-3 of the first side edge part is described as an example, but its description can be equally applied to the second-second extension part 114-4 of the first side edge part and the second-first extension part 115-3 and the second-second extension part 115-4 of the second side edge part.

[0139] Additionally, in another example embodiment of the multilayer electronic assembly 100 according to the present disclosure, the second extensions 114-3, 114-4, 115-3 and 115-4 of the side edge portion may include regions having a generally concave shape, and preferably, the second extensions 114-3, 114-4, 115-3 and 115-4 may be regions having a generally concave shape.

[0140] Additionally, in some example embodiments of the multilayer electronic assembly 100 according to this disclosure, the second extensions 114-3, 114-4, 115-3, and 115-4 of the side edge portion may include a region in which the third-direction dimension of the second extensions 114-3, 114-4, 115-3, and 115-4 of the side edge portion increases from the central portion in the first direction of the first side edge portion and the central portion in the second side edge portion toward the end portion in the first direction of the second extensions 114-3, 114-4, 115-3, and 115-4 of the side edge portion, and preferably, the second extensions 114-3, 114-4, 115-3, and 115-4 may be an enlarged region in which the third-direction dimension increases from the central portion in the first direction toward the end portion in the first direction as described above.

[0141] The second extensions 114-3, 114-4, 115-3 and 115-4 of the side edge may include a generally concave shape, or may include a region whose third-direction dimension increases from the central portion of the first direction toward the end of the first direction, such that the interfacial bonding force between the body 110 and the side edge portions 114 and 115 can be excellent, and the moisture-proof reliability can be further improved.

[0142] The second extensions 114-3, 114-4, 115-3 and 115-4 may be configured to contact the portions of the inner electrodes 121 and 122 exposed on the third surface 3 and fourth surface 4 of the body 110.

[0143] More specifically, the second-first extension 114-3 of the first side edge portion may be configured to contact one end of the first inner electrode 121 exposed on the third surface 3 in the second direction, and the second-second extension 114-4 of the first side edge portion may be configured to contact one end of the second inner electrode 122 exposed on the fourth surface 4 in the second direction.

[0144] The second-first extension 115-3 of the second side edge portion may be configured to contact the other end of the first inner electrode 121 exposed on the third surface 3 in the second direction, and the second-second extension 115-4 of the second side edge portion may be configured to contact the other end of the second inner electrode 122 exposed on the fourth surface 4 in the second direction.

[0145] The second extensions 114-3, 114-4, 115-3 and 115-4 can be configured as part of the areas of the first inner electrode 121 and the second inner electrode 122 that are respectively exposed to the third surface 3 and the fourth surface 4 of the body 110, thereby more effectively preventing external moisture from penetrating into the interior and deteriorating the inner electrodes.

[0146] In another exemplary embodiment of this disclosure, side edge portions 114 and 115 may simultaneously include first extension portions 114-1, 114-2, 115-1 and 115-2 and second extension portions 114-3, 114-4, 115-3 and 115-4. More specifically, the first side edge portion 114 may simultaneously include first extension portions 114-1 and 114-2 and second extension portions 114-3 and 114-4, and the second side edge portion 115 may simultaneously include first extension portions 115-1 and 115-2 and second extension portions 115-3 and 115-4. Their descriptions are the same as described above, therefore, redundant descriptions will be omitted.

[0147] In some example embodiments of this disclosure, the multilayer electronic component 100 is described as having a structure including two external electrodes 131 and 132, but the number or shape of the external electrodes 131 and 132 may be changed depending on the shape of the internal electrodes 121 and 122 or for other purposes.

[0148] External electrodes 131 and 132 may be disposed on the main body 110 and may be connected to internal electrodes 121 and 122.

[0149] More specifically, the external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively, and may include a first external electrode 131 and a second external electrode 132 connected to the first internal electrode 121 and the second internal electrode 122, respectively. That is, the first external electrode 131 may be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0150] Additionally, the external electrodes 131 and 132 may be configured to extend to a portion of the first surface 1 and a portion of the second surface 2 of the body 110, and / or may be configured to extend to a portion of the fifth surface 5 and a portion of the sixth surface 6 of the body 110. That is, the first external electrode 131 may be disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5 and a portion of the sixth surface 6 of the body 110, as well as on the third surface 3 of the body 110, and the second external electrode 132 may be disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5 and a portion of the sixth surface 6 of the body 110, as well as on the fourth surface 4 of the body 110.

[0151] The outer electrodes 131 and 132 may be configured as part of the side edge portions 114 and 115.

[0152] For example, the first external electrode 131 and the second external electrode 132 may be disposed on the third surface 3 and the fourth surface 4, respectively, and may be configured to extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6. In this case, when the first side edge portion 114 and the second side edge portion 115 are disposed on the fifth surface 5 and the sixth surface 6, respectively, and are configured to extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the third surface 3, and a portion of the fourth surface 4, the first external electrode 131 and the second external electrode 132 may be configured to cover the first side edge portion 114 and the second side edge portion 115.

[0153] In addition, the external electrodes 131 and 132 can be formed of any conductive material such as metal, and the specific material can be determined by taking into account electrical properties, structural stability, etc. Furthermore, the external electrodes 131 and 132 can have a multilayer structure.

[0154] For example, external electrodes 131 and 132 may include an electrode layer disposed on the body 110 and a plating layer disposed on the electrode layer. In this case, the electrode layer may include a first electrode layer disposed on the body and a second electrode layer disposed on the first electrode layer, and the plating layer may include a first plating layer disposed on the electrode layer and a second plating layer disposed on the first plating layer, but this disclosure is not particularly limited thereto. The contents of the electrode layer and the plating layer will be described in more detail below.

[0155] For a more specific example of the first electrode layers 131a and 132a, the first electrode layers 131a and 132a may be sintered electrode layers comprising a first conductive metal and glass.

[0156] The first electrode layers 131a and 132a can be formed by transferring a sheet including a first conductive metal onto the body 110, or by applying a conductive paste (prepared by adding a glass frit to the first conductive metal) to the body 110 and then sintering the conductive paste, or by immersing the body 110 in a paste including the first conductive metal, but this disclosure is not particularly limited thereto.

[0157] The first conductive metal included in the first electrode layers 131a and 132a is not particularly limited, as long as the first conductive metal is a material that can be electrically connected to the inner electrodes 121 and 122 for forming a capacitor, and for example, the first conductive metal may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and alloys thereof.

[0158] The first electrode layers 131a and 132a may include glass to improve their bonding with the body 110.

[0159] In some example embodiments of this disclosure, the average thickness of the first electrode layers 131a and 132a may be greater than or equal to 1 μm and less than or equal to 8 μm.

[0160] When the average thickness of the first electrode layers 131a and 132a is greater than or equal to 1 μm and less than or equal to 8 μm, the electrical connectivity can be excellent while achieving miniaturization of the multilayer electronic component 100.

[0161] When the average thickness of the first electrode layers 131a and 132a is less than 1 μm, the electrical connectivity may be insufficient, and when the average thickness of the first electrode layers 131a and 132a exceeds 8 μm, it may be difficult to achieve miniaturization of the multilayer electronic component 100.

[0162] In this case, in the cross-sections of the first electrode layers 131a and 132a, the area of ​​the region with a thickness of less than 1 μm relative to the total area of ​​the first electrode layers 131a and 132a may be less than 8%, and preferably less than or equal to 5%, more preferably less than or equal to 2%. In this document, "the cross-section of the first electrode layers 131a and 132a" can be any cross-section in which the thickness of the first electrode layers 131a and 132a can be observed.

[0163] When the area where the thickness of the first electrode layers 131a and 132a is less than 1 μm is less than 8%, the miniaturization of the multilayer electronic component 100 can be achieved, while achieving excellent electrical connectivity.

[0164] When the area of ​​the first electrode layers 131a and 132a with a thickness of less than 1 μm is greater than or equal to 8%, the first electrode layers 131a and 132a may not have sufficient electrical connectivity and may have short-circuit defects.

[0165] In addition, in the cross-section of the first electrode layers 131a and 132a, the area of ​​the region with a thickness of 1 μm or more and less than or equal to 5 μm of the first electrode layers 131a and 132a accounts for more than or equal to 80% of the total area of ​​the first electrode layers 131a and 132a, preferably more than or equal to 85%, and more preferably more than or equal to 90%.

[0166] When the area of ​​the first electrode layers 131a and 132a with a thickness greater than or equal to 1 μm and less than or equal to 5 μm is greater than or equal to 80%, the miniaturization of the multilayer electronic component 100 can be achieved, while achieving excellent electrical connectivity.

[0167] When the area of ​​the first electrode layers 131a and 132a with a thickness greater than or equal to 1 μm and less than or equal to 5 μm is less than 80%, there may be concerns about insufficient electrical connectivity or short-circuit defects, and it may be difficult to realize the multilayer electronic component 100.

[0168] The method for measuring the position-dependent thickness of the first electrode layers 131a and 132a can be as follows, but is not limited to: First, a cross-sectional image including the outer electrode in a first direction and a third direction is captured using a scanning electron microscope (SEM), and the first electrode layer is selected. In this step, the first electrode layer can be selected from the region between the distinguishable second electrode layer and the main body (side edge). Next, the thickness of the selected first electrode layer is measured in 0.5 μm increments using a thickness measurement program built into the SEM, and the measured values ​​are then displayed as a bar chart, etc., to determine the position-dependent thickness of the first electrode layers 131a and 132a.

[0169] In this disclosure, by adopting a shape in which the middle edges 114 and 115 are arranged to extend to some portions of the first to fourth surfaces, i.e., including the structure of the first extensions 114-1, 114-2, 115-1 and 115-2 and / or the second extensions 114-3, 114-4, 115-3 and 115-4, the first electrode layers 131a and 132a can be formed thinly and uniformly.

[0170] Therefore, when the paste for the external electrode is formed on the body, the paste for the external electrode can form eddies through the first and second extensions of the side edge portion, thereby suppressing the flow of the paste for the external electrode on the edge portion of the body and providing a thin and uniform external electrode. On the other hand, in a conventional side edge portion structure without the first and second extensions, the edge region of the body has almost no curvature (when the radius of curvature is relatively small), and the flow of the paste for the external electrode may be rapid. Therefore, due to insufficient formation of the external electrode thickness, the external electrode may hardly be formed, and the external electrode may be formed thick in the central portion of the body where the flow is relatively slow due to surface tension. In addition, in a conventional side edge portion structure without the first and second extensions, the edge region of the body has a curve (when the radius of curvature is relatively large), and due to the slow flow of the paste for the external electrode, the thickness of the external electrode may be formed thin, but it may be formed unevenly.

[0171] In addition, in some example embodiments of this disclosure, the average thickness of the first electrode layers 131a and 132a may be thinner than the average thickness of the plating layers 131b, 132b, 131c and 132c described below.

[0172] Since the average thickness of the first electrode layers 131a and 132a is thinner than the average thickness of the plating layers 131b, 132b, 131c and 132c, miniaturization of the multilayer electronic component 100 can be achieved while maintaining excellent electrical connectivity.

[0173] When the average thickness of the first electrode layers 131a and 132a is greater than the average thickness of the plating layers 131b, 132b, 131c and 132c, it may be difficult to achieve miniaturization of the multilayer electronic component 100.

[0174] In this disclosure, for example, a method for measuring the thickness or average thickness of the outer electrodes 131 and 132 may be described as follows, and the thickness or average thickness of each layer may be measured even if the outer electrodes 131 and 132 are formed of a multilayer structure. Hereinafter, a method for measuring the thickness T1 or average thickness of the first electrode layers 131a and 132a will be described, but the same method may also be used to measure the thickness or average thickness of the second electrode layer or plating described below.

[0175] First, scanning electron microscopy (SEM) is used to image first and third directional cross-sections of the first cover 112, the first-second extension 115-2 of the second side edge portion, and the second external electrode 132 of the multilayer electronic assembly 100. In this case, not only scanning electron microscopy (SEM) but also transmission electron microscopy (TEM) or scanning transmission electron microscopy (STEM) can be used. In the images captured by the scanning electron microscope (SEM), the first electrode layer 132a of the second external electrode covering the first cover 112 and the first-second extension 115-2 of the second side edge portion is observed, and layer classification is performed. In this case, when the second external electrode 132 is formed of a multilayer structure, the boundary surfaces of each layer can be distinguished from each other, and when it is difficult to distinguish the boundary surfaces, energy-dispersive X-ray spectroscopy (EDS) can be used to classify the layers according to the main component materials contained in each layer. Then, the shortest distance from the outer surface of the first-second extension 115-2 of the second side edge 115 to the outer surface of the first electrode layer 132a of the second outer electrode is measured and quantified at 3000 points. In this case, the shortest distance from the second side edge 115 to the first electrode layer 132a of the second outer electrode can refer to the thickness T1 of the first electrode layer 132a of the second outer electrode. There are no particular limitations on the method used to measure the shortest distance, and any procedure capable of measuring distance can be used. In addition, the average value of the shortest distances measured in this way at 3000 points can correspond to the average thickness of the first electrode layer 132a of the second outer electrode.

[0176] Although not shown in the accompanying drawings, the electrode layer may also include a second electrode layer, and the second electrode layer may be a conductive resin layer, which is a resin-based electrode comprising a second conductive metal and a resin.

[0177] The second electrode layer may be disposed on the first electrode layers 131a and 132a, which are disposed on the main body 110, but this disclosure is not particularly limited thereto.

[0178] The second conductive metal included in the second electrode layer can be used to perform electrical connections with the first electrode layers 131a and 132a.

[0179] There are no particular limitations on the second conductive metal included in the second electrode layer, as long as the second conductive metal is a material that can be electrically connected to the first electrode layers 131a and 132a, and may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and alloys thereof.

[0180] The conductive metal included in the first electrode layers 131a and 132a may be referred to as the first conductive metal, and the conductive metal included in the second electrode layer may be referred to as the second conductive metal. The first conductive metal and the second conductive metal may be the same as each other or different. When the first electrode layers 131a and 132a and the second electrode layer each include multiple conductive metals, some of the multiple conductive metals in the first electrode layers 131a and 132a may be the same as some of the multiple conductive metals in the second electrode layer, but this disclosure does not impose any particular limitation.

[0181] The second electrode layer can be used to improve flexural strength by incorporating resin.

[0182] The second conductive metal included in the second electrode layer may include at least one of spherical particles and flake-shaped particles. That is, the second conductive metal may be formed only of flake-shaped particles, or only of spherical particles, or a mixture of flake-shaped and spherical particles. Here, spherical particles may also include those that are not perfectly spherical, and for example, may include those with a length ratio (major axis to minor axis) of less than or equal to 1.45. Flake-shaped particles refer to particles having a flat and elongated shape, and this disclosure is not particularly limited, but for example, the length ratio (major axis to minor axis) may be greater than or equal to 1.95. The lengths of the major and minor axes of the spherical particles and flake-shaped particles can be measured from images obtained by scanning cross-sections in the first and second directions obtained by cutting the central portion of the multilayer electronic assembly in a third direction using a scanning electron microscope (SEM).

[0183] The resin included in the second electrode layer can be used to ensure adhesive and damping properties. There are no particular limitations on the resin included in the second electrode layer, as long as the resin has adhesive and damping properties and can be mixed with the second conductive metal particles to form a paste, and it may include, for example, epoxy resin.

[0184] Additionally, the second electrode layer may include multiple second conductive metal particles, an intermetallic compound, and a resin. An intermetallic compound may be included to further improve electrical connectivity with the first electrode layers 131a and 132a. The intermetallic compound can be used to improve electrical connectivity by connecting multiple metal particles, and can also serve to surround and connect the multiple metal particles.

[0185] In this case, the intermetallic compound may include a metal with a melting point lower than the resin's curing temperature. That is, because the intermetallic compound includes a metal with a melting point lower than the resin's curing temperature, this metal melts during the drying and curing process and forms an intermetallic compound with some of the metal particles to surround the remaining metal particles. In this case, the intermetallic compound may preferably include a low-melting-point metal with a melting point of 300°C or less.

[0186] For example, intermetallic compounds may include tin (Sn) with a melting point of 213°C to 220°C. During the drying and curing process, Sn is melted, and the molten Sn wets high-melting-point metal particles such as silver (Ag), nickel (Ni), or copper (Cu) through capillary action, and reacts with some of the silver (Ag), nickel (Ni), and copper (Cu) metal particles to form intermetallic compounds such as Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn. Unreacted silver (Ag), nickel (Ni), or copper (Cu) remains as metal particles.

[0187] Therefore, the plurality of second conductive metal particles include one or more of Ag, Ni and Cu, and the intermetallic compound may include one or more of Ag3Sn, Ni3Sn4, Cu6Sn5 and Cu3Sn.

[0188] Platings 131b, 132b, 131c, and 132c can be used to improve mounting characteristics. There are no particular limitations on the type of platings 131b, 132b, 131c, and 132c, and they may include at least one of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof.

[0189] For example, coatings 131b, 132b, 131c and 132c can be formed as single layers of coatings 131b and 132b, or can be formed by multiple coatings 131b, 132b, 131c and 132c.

[0190] More specifically, the plating layers 131b, 132b, 131c and 132c may include first plating layers 131b and 132b disposed on the electrode layer and second plating layers 131c and 132c disposed on the first plating layers 131b and 132b.

[0191] For example, the first plating layers 131b and 132b may be Ni plating layers including nickel (Ni), and the second plating layers 131c and 132c may be Sn plating layers including tin (Sn). However, this disclosure is not particularly limited thereto, and the first plating layers 131b and 132b may be Sn plating layers including tin (Sn), and the second plating layers 131c and 132c may be Ni plating layers including nickel (Ni).

[0192] There are no particular restrictions on the thickness of the first coating 131b and 132b and the second coating 131c and 132c, but the thickness T2 of the first coating 131b and 132b can be greater than or equal to 1 μm and less than or equal to 10 μm, and the thickness T3 of the second coating 131c and 132c can be greater than or equal to 3 μm and less than or equal to 15 μm.

[0193] The size of the multilayer electronic component 100 is not particularly limited. However, in order to achieve miniaturization while simultaneously achieving high capacitance, the thickness of the dielectric layer and internal electrodes should be reduced to increase the number of layers. Therefore, according to this disclosure, the effects are more pronounced in multilayer electronic components 100 with dimensions of 3216 (length × width: 3.2 mm × 1.6 mm), 2012 (length × width: 2.0 mm × 1.2 mm), 1005 (length × width: 1.0 mm × 0.5 mm), 0603 (length × width: 0.6 mm × 0.3 mm), 0402 (length × width: 0.4 mm × 0.2 mm), or 0201 (length × width: 0.2 mm × 0.1 mm) or smaller.

[0194] The present disclosure will be described in more detail below with reference to examples, but this is only to aid in a concrete understanding of the disclosure, and the scope of the disclosure is not limited by the examples.

[0195] <Experimental Example> In Comparative Examples 1 and 2, MLCCs with conventional side edge portions were manufactured in sheet form. That is, the side edge portions of the comparative examples correspond to a structure in which the side edge portions are only provided on the two surfaces (the fifth and sixth surfaces) of the main body in the third direction, and are not provided on the two surfaces (the first to the fourth surfaces) of the main body in the first direction and the two surfaces (the first to the fourth surfaces) in the second direction.

[0196] More specifically, Comparative Example 1 and Comparative Example 2 include: a main body including a capacitor forming portion and a cover portion, the capacitor forming portion including a dielectric layer and an inner electrode, the cover portion being disposed on two surfaces of the capacitor forming portion in a first direction; a side edge portion being disposed on two surfaces of the main body in a third direction; and an outer electrode being disposed on the outer side of the main body and including a first electrode layer, a first plating layer and a second plating layer.

[0197] In Invention Examples 1 and 2, MLCCs with attached side edge portions according to some exemplary embodiments of the present disclosure were manufactured in sheet form. That is, the side edge portions of the invention examples correspond to structures disposed on the fifth and sixth surfaces of the body and extending from the fifth and sixth surfaces to at least one of the first surface, a portion of the second surface, a portion of the third surface, and a portion of the fourth surface, and the MLCCs are manufactured in the same manner as the comparative examples, except for the structure of the side edge portions.

[0198] In the following text, the radius of curvature and curvature value of the corner of the side edge portion of Comparative Example 1 and Invention Example 1 are compared and measured, and the thickness of the first electrode layer of Comparative Example 1 and Invention Example 1 is compared.

[0199] First, a cross-section of Comparative Example 1, including the main body, the first and second extensions of the second side edge, and the second external electrode, was photographed using a scanning electron microscope (SEM) in the first and third directions. The following radii of curvature or curvatures were calculated using the measurement method described above, and although not shown in the accompanying drawings, will be readily understood by those skilled in the art. In this case, the point furthest from the capacitor formation portion, where the extension line of the interface between the first cover portion and the capacitor formation portion contacts the main side edge portion of the second side edge portion, is denoted as SP1. Next, the point furthest from the capacitor formation portion in the first direction, based on the first direction, is denoted as SP2. Furthermore, the point representing half the distance (including direction) from point SP2 to point SP1 measured along the outer contour line (surface) of the second side edge portion is denoted as SP3. Additionally, when an arbitrary circle including points SP2 and SP3 is drawn and the radius of curvature R is measured, the radius of curvature R is 10 μm, and when expressed as a curvature value к, the curvature value к is 100 nm. -1 .

[0200] Additionally, the thickness of the first electrode layer observable in the captured images was measured, and Figure 9A The thickness of the first electrode layer of Comparative Example 1 is shown by region in different colors, and the percentage of each thickness is shown as a histogram.

[0201] The thickness of the first electrode layer in Comparative Example 1 was measured to be greater than 0 μm and less than 13 μm, with a median of 3.49 μm and a standard deviation of 2.45. Based on this, it can be seen that the thickness of the first electrode layer in Comparative Example 1 is relatively thick but not uniform. Furthermore, Figure 9A The arrows in the image indicate the region where the thickness of the first electrode layer, located at the corner of the body, is less than 1 μm, and the region where the thickness of the first electrode layer is less than 1 μm is measured to be 8%.

[0202] When the radius of curvature R of Example 1 was measured using the above method, the radius of curvature R was 15 μm, and when expressed as a curvature value к, the curvature value к was 66.7 nm. -1 .

[0203] Figure 9B The thickness of the first electrode layer of Invention Example 1 is shown by region using different colors, and a histogram is used to show the percentage of each thickness.

[0204] The thickness of the first electrode layer in Example 1 was measured to be greater than or equal to 1 μm and less than or equal to 5 μm, with a median of 2.83 μm and a standard deviation of 0.98. Based on this, it can be seen that the thickness of the first electrode layer in Example 1 is relatively thin and uniform. Furthermore, the area where the thickness of the first electrode layer is less than 1 μm was measured to be 2%.

[0205] Based on this, it can be seen that the side edge structure provided on a portion of the first to fourth surfaces of the main body can make the thickness of the first electrode layer thin and uniform.

[0206] Next, the moisture-proof reliability of Comparative Example 2 and Invention Example 2 will be evaluated.

[0207] Figure 10A This is a graph showing the results of the moisture-proof reliability assessment of Comparative Example 2. Figure 10B This is a graph showing the results of the moisture-proof reliability assessment of Invention Example 2.

[0208] After manufacturing 40 sample wafers for Comparative Example 2 and Invention Example 2 respectively, an 8-hour moisture-proof reliability evaluation was conducted under conditions of 85°C, 85% relative humidity, and 1.2V. Among the 40 sample wafers, the insulation resistance (IR) value decreased to less than or equal to 10 Ω·cm. 6 Samples with an Ω-value were considered defective.

[0209] In Comparative Example 2, 3 out of 40 sample pieces were defective, while in Inventive Example 2, none of the 40 sample pieces were defective.

[0210] Based on this, it can be seen that the side edge structure set on a portion of the first to fourth surfaces of the main body has the effect of improving moisture-proof reliability.

[0211] Although exemplary embodiments of this disclosure have been described in detail above, this disclosure is not limited to the above embodiments and drawings, but is defined by the appended claims. Therefore, those skilled in the art can make various substitutions, modifications, or changes without departing from the scope of this disclosure as defined by the appended claims, and such substitutions, modifications, or changes should be construed as being included within the scope of this disclosure.

[0212] Furthermore, the expression "example embodiment" as used in this disclosure does not imply the same embodiment and is provided to emphasize and explain different unique features. However, the embodiments presented above do not preclude implementation in combination with features of another embodiment. For example, although an item described in a particular embodiment is not described in another embodiment, the item may be understood as a description related to the other embodiment unless there is a description of the item that is contrary to or contradictory in another embodiment.

[0213] In this disclosure, these terms are used only to describe particular embodiments and are not intended to limit the scope of this disclosure. Unless the context clearly indicates otherwise, the singular form may also include the plural form.

Claims

1. A multilayer electronic component, comprising: The body includes a capacitor forming portion and a cover portion. The capacitor forming portion includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction. The cover portion is disposed on two surfaces of the capacitor forming portion in the first direction. The body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and opposite to each other in the third direction. External electrodes are disposed on the third surface and the fourth surface; and The side edge portion includes a main side edge portion disposed on the fifth surface and the sixth surface. The side edge portion further includes a first extension, which is configured to extend into a portion of the first surface and a portion of the second surface, wherein at least a portion of the first extension has curvature. When the average thickness of the main side edge is WM0 and the radius of curvature of the at least part of the first extension is R. WM0 and R satisfy 1.1 <R / WM0<2。 2. The multilayer electronic component according to claim 1, wherein, R satisfies 11μm <R<20μm。 3. The multilayer electronic component according to claim 1, wherein, When the curvature value of the at least part of the first extension is к, к satisfies 50nm -1 <к<90nm -1 .

4. The multilayer electronic component according to claim 1, wherein, WM0 satisfies 5μm≤WM0≤30μm.

5. The multilayer electronic component according to claim 1, wherein, The external electrode extends to a portion of the first surface and a portion of the second surface, and the external electrode includes a first electrode layer configured to cover the first extension, and the average thickness of the first electrode layer is greater than or equal to 1 μm and less than or equal to 8 μm.

6. The multilayer electronic component according to claim 5, wherein, In the cross-section of the first electrode layer, the area of ​​the region with a thickness of less than 1 μm accounts for less than 8% of the total area of ​​the first electrode layer.

7. The multilayer electronic component according to claim 5, wherein, In the cross-section of the first electrode layer, the area of ​​the region with a thickness greater than or equal to 1 μm and less than or equal to 5 μm accounts for more than 80% of the total area of ​​the first electrode layer.

8. The multilayer electronic component according to claim 1, wherein, The external electrode extends to a portion of the first surface and a portion of the second surface, and the external electrode includes a first electrode layer configured to cover the first extension and a plating layer disposed on the first electrode layer. The average thickness of the first electrode layer is thinner than the average thickness of the coating.

9. The multilayer electronic assembly according to any one of claims 1-8, wherein, The dimension of the first extension in the third direction increases from the central portion in the second direction toward the end in the second direction.

10. The multilayer electronic assembly according to any one of claims 1-8, wherein, The side edge portion further includes a second extension, which is configured to extend into a portion of the third surface and a portion of the fourth surface, and at least a portion of the second extension has curvature. The radius of curvature of at least a portion of the second extension is the same as the radius of curvature of at least a portion of the first extension.

11. The multilayer electronic assembly according to claim 10, wherein, The second extension increases in size in the third direction from the central portion in the first direction toward the end in the first direction.

12. A multilayer electronic component, comprising: The body includes a capacitor forming portion and a cover portion. The capacitor forming portion includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction. The cover portion is disposed on two surfaces of the capacitor forming portion in the first direction. The body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and opposite to each other in the third direction. External electrodes are disposed on the third surface and the fourth surface; and The side edge portion includes a main side edge portion disposed on the fifth surface and the sixth surface. The side edge portion further includes a first extension, which is configured to extend into a portion of the first surface and a portion of the second surface, wherein at least a portion of the first extension has curvature. The external electrode extends to a portion of the first surface and a portion of the second surface, and the external electrode includes a first electrode layer configured to cover the first extension, and the average thickness of the first electrode layer is greater than or equal to 1 μm and less than or equal to 8 μm.

13. The multilayer electronic assembly according to claim 12, wherein, When the radius of curvature of the at least part of the first extension is R, R satisfies 11 μm. <R<20μm。 14. The multilayer electronic assembly according to claim 13, wherein, When the average thickness of the main side edge is WM0, WM0 and R satisfy 1.1 <R / WM0<2。 15. The multilayer electronic assembly according to claim 12, wherein, When the curvature value of the at least part of the first extension is к, к satisfies 50nm -1 <к<90nm -1 .

16. The multilayer electronic assembly according to claim 12, wherein, When the average dimension of the main side edge portion disposed on the fifth surface and the sixth surface in the third direction is defined as WM0, WM0 satisfies 5μm≤WM0≤30μm.

17. The multilayer electronic assembly according to claim 12, wherein, In the cross-section of the first electrode layer, the area of ​​the region with a thickness of less than 1 μm accounts for less than 8% of the total area of ​​the first electrode layer.

18. The multilayer electronic assembly according to claim 12, wherein, In the cross-section of the first electrode layer, the area of ​​the region with a thickness greater than or equal to 1 μm and less than or equal to 5 μm accounts for more than 80% of the total area of ​​the first electrode layer.

19. The multilayer electronic assembly according to claim 12, wherein, The external electrode also includes a plating layer disposed on the first electrode layer. The average thickness of the first electrode layer is thinner than the average thickness of the coating.

20. The multilayer electronic assembly according to any one of claims 12-19, wherein, The side edge portion further includes a second extension, which is configured to extend into a portion of the third surface and a portion of the fourth surface, and at least a portion of the second extension has curvature. The radius of curvature of at least a portion of the second extension is the same as the radius of curvature of at least a portion of the first extension.

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