Film coating method of circuit board

Abstract

The invention discloses a circuit board coating method, which comprises the following steps of: partially shielding a circuit board to be coated to form an exposed area and a shielding area on the surface of the circuit board; immersing the circuit board in a pre-prepared plating solution, and keeping for a first preset time; wherein the plating solution contains metal ions; after the first preset time, the circuit board is taken out, and the liquid on the surface of the circuit board is removed; drying the circuit board, and keeping at room temperature for a second preset time to deposit a metal layer on the exposed area; and cleaning the circuit board. According to the technical scheme, high-cost equipment and materials are not needed, the manufacturing period is short, the manufacturing cost of the circuit board is reduced, the manufacturing efficiency of the circuit board is improved, meanwhile, the manufacturing process is simple, high manufacturing consistency can be achieved, and the quality of the manufactured circuit board is improved.

Description

Technical Field

[0001] This invention relates to the field of coating technology, and more particularly to a coating method for circuit boards. Background Technology

[0002] In the manufacturing of integrated circuits, a layer of metal or alloy material is typically plated onto the surface of the circuit board. Covering the circuit board with a metal film serves several important purposes: 1. Conductivity: The metal film enhances the conductivity of the circuit board, ensuring smooth current flow; 2. Protection: The metal film protects the circuit board from external environmental influences, such as oxidation and corrosion; 3. Heat dissipation: The metal film helps improve the heat dissipation performance of the circuit board, preventing overheating damage. In summary, covering the circuit board with a metal film ensures stable performance and reliable operation, while also improving its durability and lifespan.

[0003] Current coating methods include electrolytic plating, chemical plating, and physical vapor deposition. However, these methods generally require expensive equipment and materials, have long manufacturing cycles, and are not easy to achieve consistency in large-scale production, thus affecting the quality of circuit boards. Summary of the Invention

[0004] The purpose of this invention is to provide a coating method for circuit boards that does not require high-cost equipment and materials, has a short manufacturing cycle, thereby reducing the manufacturing cost of circuit boards and improving the manufacturing efficiency of circuit boards. At the same time, the manufacturing process is simple and can achieve high manufacturing consistency, thereby improving the quality of manufactured circuit boards.

[0005] To achieve the above objectives, embodiments of the present invention provide a coating method for a circuit board, comprising:

[0006] Partially masking the circuit board to be coated creates exposed and masked areas on the surface of the circuit board.

[0007] The circuit board is immersed in a pre-prepared plating solution and kept there for a first preset time; wherein the plating solution contains metal ions;

[0008] After the first preset time has elapsed, the circuit board is removed and the liquid on the surface of the circuit board is removed;

[0009] The circuit board is dried and kept at room temperature for a second preset time to allow a metal layer to be deposited on the exposed area;

[0010] The circuit board is cleaned.

[0011] Furthermore, the plating solution is composed of a water-soluble salt containing metal ions and a soluble reducing agent.

[0012] Furthermore, the metal ion is a copper ion.

[0013] Furthermore, the water-soluble salt containing metal ions in the plating solution is composed of a mixture of 0.35 mol / L CuSO4 and 0.45 mol / L KNO3.

[0014] Furthermore, the soluble reducing agent in the plating solution is ethanol, and the ratio of water-soluble salt containing metal ions to the soluble reducing agent is 1:1.5.

[0015] Furthermore, the first preset time is 20 minutes.

[0016] Furthermore, the second preset time is 60 minutes.

[0017] Furthermore, the cleaning process for the circuit board specifically includes:

[0018] The circuit board is immersed in a cleaning solution to clean it; wherein the cleaning solution includes clean water or distilled water.

[0019] Compared with existing technologies, this invention provides a method for coating a circuit board. First, the circuit board to be coated is partially masked, creating exposed and masked areas on its surface. Next, the circuit board is immersed in a pre-prepared plating solution for a first preset time, wherein the plating solution contains metal ions. After the first preset time, the circuit board is removed, and the liquid on its surface is removed. Then, the circuit board is dried and held at room temperature for a second preset time, allowing a metal layer to be deposited on the exposed areas. Finally, the circuit board is cleaned. This invention eliminates the need for high-cost equipment and materials, shortens the manufacturing cycle, thereby reducing the manufacturing cost of the circuit board and improving its manufacturing efficiency. Furthermore, the simple manufacturing process enables high manufacturing consistency, thus improving the quality of the manufactured circuit boards. Attached Figure Description

[0020] Figure 1 This is a flowchart of a preferred embodiment of a coating method for a circuit board provided by the present invention. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] This invention provides a coating method for circuit boards, see [link to relevant documentation]. Figure 1 The diagram shown is a flowchart of a preferred embodiment of a coating method for a circuit board provided by the present invention, the method comprising steps S11 to S15:

[0023] Step S11: Partially mask the circuit board to be coated, so that exposed areas and masked areas are formed on the surface of the circuit board;

[0024] Step S12: Immerse the circuit board in the pre-prepared plating solution and maintain it for a first preset time; wherein the plating solution contains metal ions;

[0025] Step S13: After the first preset time has elapsed, remove the circuit board and remove the liquid from the surface of the circuit board;

[0026] Step S14: Dry the circuit board and keep it at room temperature for a second preset time to deposit a metal layer on the exposed area;

[0027] Step S15: Clean the circuit board.

[0028] In practice, firstly, the circuit board to be coated is partially masked, creating exposed and masked areas on its surface. This exposes the target area (the corresponding exposed area) for subsequent coating. Next, the partially masked circuit board is immersed in a pre-prepared plating solution containing metal ions and held for a first preset time. After the first preset time, the circuit board is removed from the solution, and the liquid (residual plating solution) on its surface is removed. Then, the circuit board is dried and held at room temperature for a second preset time to allow a metal layer to be deposited on the exposed area, thus completing the coating process. Finally, the coated circuit board is cleaned to remove all remaining impurities and liquid from its surface.

[0029] It should be noted that when removing the circuit board from the plating solution and removing the liquid from the surface of the circuit board, the removed circuit board can be placed in a funnel with the bottom of the circuit board exposed so that the liquid on the surface of the circuit board can flow out through the funnel.

[0030] It should be noted that the embodiments of the present invention provide a low-cost and efficient circuit board coating method, which can improve the efficiency and quality of circuit board manufacturing and is suitable for mass production of high-quality circuit boards in a short period of time.

[0031] In one alternative embodiment, the plating solution consists of a water-soluble salt containing metal ions and a soluble reducing agent.

[0032] Specifically, in conjunction with the above embodiments, the pre-prepared plating solution mainly consists of water-soluble salts containing metal ions and soluble reducing agents. Accordingly, the water-soluble salts containing metal ions and soluble reducing agents are mixed in a certain proportion, and the mixture is stirred until all chemical substances are completely dissolved to obtain the plating solution.

[0033] In one alternative embodiment, the metal ion is a copper ion.

[0034] Specifically, in conjunction with the above embodiments, the metal ions contained in the pre-prepared plating solution are copper ions. Correspondingly, the pre-prepared plating solution is composed of water-soluble salts containing copper ions and soluble reducing agents. The metal layer deposited on the exposed area of ​​the circuit board is a copper layer.

[0035] It is understood that, in addition to copper ions, the metal ions contained in the plating solution can also be other metal ions. The specific metal ions can be selected according to actual needs, and a plating solution containing the selected metal ions can be prepared accordingly. The embodiments of the present invention do not make specific limitations.

[0036] In one alternative embodiment, the water-soluble salt containing metal ions in the plating solution is composed of a mixture of 0.35 mol / L CuSO4 and 0.45 mol / L KNO3.

[0037] Specifically, in conjunction with the above embodiments, the components of the water-soluble salt containing copper ions in the pre-prepared plating solution include CuSO4 and KNO3, wherein CuSO4 is 0.35M (M represents the unit of mole (mol), 0.35M means that there are 0.35 mol of CuSO4 in 1L (or 1kg) of water), and KNO3 is 0.45M (similarly, 0.45M means that there are 0.45 mol of KNO3 in 1L (or 1kg) of water).

[0038] In one optional embodiment, the soluble reducing agent in the plating solution is ethanol, and the ratio of water-soluble salt containing metal ions to the soluble reducing agent is 1:1.5.

[0039] Specifically, in conjunction with the above embodiments, the soluble reducing agent in the pre-prepared plating solution is ethanol, and the ratio of water-soluble salt containing copper ions to ethanol in the pre-prepared plating solution is 1:1.5.

[0040] For example, the preparation process of the plating solution is as follows: First, CuSO4 (0.35M) and KNO3 (0.45M) are mixed together to obtain a first mixture. Then, the first mixture and ethanol are mixed in a ratio of 1:1.5 to obtain a second mixture. After that, the second mixture is stirred until all the chemical substances in the second mixture are completely dissolved, thus obtaining a plating solution containing copper ions.

[0041] In one alternative embodiment, the first preset time is 20 minutes.

[0042] Specifically, in conjunction with the above embodiments, after immersing the circuit board in the pre-prepared plating solution, the circuit board needs to be kept in the plating solution for 20 minutes before being removed from the plating solution.

[0043] In one alternative embodiment, the second preset time is 60 minutes.

[0044] Specifically, in conjunction with the above embodiments, after the circuit board is dried, it needs to be kept at room temperature for 60 minutes to allow a metal layer to be deposited on the exposed areas of the circuit board.

[0045] For example, immersing a circuit board in a plating solution containing copper ions for 20 minutes, removing it, and placing it in a funnel with its bottom exposed to allow the liquid to drain out, then allowing the circuit board to dry and leave it at room temperature for 60 minutes, can deposit 1 to 2 copper layers on the exposed areas of the circuit board.

[0046] It should be noted that during the coating process, copper is reduced to deposited in the central frame of the circuit board, thereby forming a copper layer of uniform thickness. After coating, a distinct copper-colored area and an uncovered circuit board area can be seen on the surface of the exposed area of ​​the circuit board.

[0047] It should be noted that the number and thickness of the copper layer can be controlled according to actual needs, and the embodiments of the present invention do not impose specific limitations.

[0048] In one optional embodiment, the cleaning process of the circuit board specifically includes:

[0049] The circuit board is immersed in a cleaning solution to clean it; wherein the cleaning solution includes clean water or distilled water.

[0050] Specifically, in conjunction with the above embodiments, when cleaning the circuit board, the circuit board can be immersed in the cleaning solution to clean the circuit board and remove all impurities and liquids remaining on the surface of the circuit board.

[0051] It should be noted that the cleaning solution can be water or other liquids (e.g., distilled water).

[0052] Based on all the above embodiments, the implementation process of this solution is described below through a specific embodiment, including: (1) performing partial masking treatment on the circuit board to be coated, so that an unmasked exposed area and a masked area are formed on the surface of the circuit board, thereby exposing the target area to be coated (i.e. the corresponding exposed area) on the surface of the circuit board; (2) preparing the plating solution: first, CuSO4 (0.35M) and KNO3 (0.45M) are mixed together to obtain a first mixture, then the first mixture and ethanol are mixed in a ratio of 1:1.5 to obtain a second mixture, and then the second mixture is stirred until all the chemical substances in the second mixture are completely dissolved. Solution; (3) Immerse the partially shielded circuit board in a pre-prepared plating solution containing copper ions. After keeping it in the plating solution for 20 minutes, remove the circuit board from the plating solution and place the removed circuit board in a funnel so that the bottom of the circuit board is exposed so that the liquid on the surface of the circuit board can flow out through the funnel to remove the residual plating solution on the surface of the circuit board; (4) Dry the circuit board and keep it at room temperature for 60 minutes so that 1 to 2 copper layers are deposited on the exposed area of ​​the circuit board; (5) Immerse the circuit board in clean water or other liquids (e.g., distilled water, etc.) and clean the circuit board with clean water or other liquids to remove all impurities and liquids remaining on the surface of the circuit board.

[0053] In summary, the circuit board coating method provided by this invention involves first partially masking the circuit board to be coated, creating exposed and masked areas on its surface; then immersing the circuit board in a pre-prepared plating solution for a first preset time, wherein the plating solution contains metal ions; after the first preset time, removing the circuit board and removing the liquid from its surface; then drying the circuit board and maintaining it at room temperature for a second preset time to deposit a metal layer on the exposed areas; finally, cleaning the circuit board. This invention eliminates the need for high-cost equipment and materials, has a short manufacturing cycle, and can produce a large number of circuit boards in a short time, thereby reducing manufacturing costs and improving manufacturing efficiency. Furthermore, the manufacturing process of this invention is simple and easy to implement, and the resulting circuit boards have uniform coating with controllable thickness, achieving high manufacturing consistency and thus improving the quality of the manufactured circuit boards.

[0054] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A coating method for a circuit board, characterized in that, include: Partially masking the circuit board to be coated creates exposed and masked areas on the surface of the circuit board. The circuit board is immersed in a pre-prepared plating solution and kept there for a first preset time; wherein the plating solution contains metal ions; After the first preset time has elapsed, the circuit board is removed and the liquid on the surface of the circuit board is removed; The circuit board is dried and kept at room temperature for a second preset time to allow a metal layer to be deposited on the exposed area; The circuit board is cleaned.

2. The coating method for a circuit board as described in claim 1, characterized in that, The plating solution consists of water-soluble salts containing metal ions and soluble reducing agents.

3. The coating method for a circuit board as described in claim 2, characterized in that, The metal ion is a copper ion.

4. The coating method for a circuit board as described in claim 3, characterized in that, The water-soluble salt containing metal ions in the plating solution is composed of a mixture of 0.35 mol / L CuSO4 and 0.45 mol / L KNO3.

5. The coating method for a circuit board as described in claim 4, characterized in that, The soluble reducing agent in the plating solution is ethanol, and the ratio of water-soluble salt containing metal ions to the soluble reducing agent is 1:1.

5.

6. The coating method for a circuit board as described in claim 1, characterized in that, The first preset time is 20 minutes.

7. The coating method for a circuit board as described in claim 1, characterized in that, The second preset time is 60 minutes.

8. The coating method for a circuit board as described in any one of claims 1 to 7, characterized in that, The cleaning process for the circuit board specifically involves: The circuit board is immersed in a cleaning solution to clean it; wherein the cleaning solution includes clean water or distilled water.

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