Display panel, preparation method thereof and display device

Abstract

The invention relates to a display panel, a preparation method thereof and a display device. The display panel is provided with an ambient light area, the ambient light area comprises a light-transmitting sub-area and a non-light-transmitting sub-area surrounding the light-transmitting sub-area, and the display panel comprises a substrate, a planarization layer, a first electrode, a protection structure and a light-emitting structure. The planarization layer is located on one side of the substrate, and a connecting via hole is formed in the planarization layer and located in the light-transmitting sub-area. The first electrode is located on the side, away from the substrate, of the planarization layer and at least covers the side wall of the connecting via hole and part of the planarization layer located in the non-light-transmitting sub-area. The protection structure is located on the side, away from the planarization layer, of the first electrode and at least covers the first electrode located on the side wall of the connecting via hole. The light-emitting structure is located on the side, away from the substrate, of the first electrode of the non-light-transmitting sub-area. The problem of dark spots of the display panel can be prevented.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] With the development of display technology, a technique has emerged that uses photolithography to pattern pixels. This technique typically involves forming an isolation layer with isolation openings. Then, the light-emitting units are formed within these openings.

[0003] Meanwhile, light sensors (such as cameras) are often required in display panels. These sensors are typically located in the ambient light zone. In the ambient light zone, in addition to the conventional isolation openings, the insulating layer also has light-transmitting openings to allow the light sensors to receive ambient light.

[0004] However, the performance of current display panels still needs improvement. Summary of the Invention

[0005] Therefore, it is necessary to provide a display panel, its manufacturing method, and a display device that can prevent dark spots in the display panel, in order to address the above-mentioned technical problems.

[0006] A display panel having a light-transmitting sub-region and a non-light-transmitting sub-region surrounding the light-transmitting sub-region, and the display panel comprising:

[0007] substrate;

[0008] A planarization layer is located on one side of the substrate, and the planarization layer has a connection via located in the light-transmitting sub-region.

[0009] The first electrode is located on the side of the planarization layer away from the substrate, and at least covers the sidewall of the connecting via and a portion of the planarization layer located in the non-transparent sub-region.

[0010] A protective structure is located on the side of the first electrode away from the planarization layer, at least covering the first electrode located on the sidewall of the connection via;

[0011] The light-emitting structure is located on the side of the first electrode in the non-phototransparent region that is away from the substrate.

[0012] In one embodiment, the display panel further includes an isolation layer located on the side of the first electrode away from the substrate, and the isolation layer includes the protective structure and the isolation structure. The isolation structure forms a first opening, and the isolation structure and the protective structure together form a light-transmitting opening. The light-transmitting opening is located in a portion of the light-transmitting sub-region, and the first opening is located in the non-light-transmitting sub-region, exposing a portion of the first electrode.

[0013] The light-emitting structure is located within the area defined by the first opening;

[0014] Optionally, the light-emitting structure includes a light-emitting unit and a second electrode, wherein the light-emitting unit is located between the first electrode and the second electrode, and the second electrode is connected to the isolation structure;

[0015] Optionally, the display panel further includes an encapsulation layer comprising a plurality of encapsulation units, wherein the encapsulation units are at least partially located within the area defined by the first opening and cover the light-emitting structure.

[0016] 3. According to the above-described display panel, the isolation layer includes at least two isolation sublayers, and the protective structure is located in at least one of the isolation sublayers;

[0017] Optionally, the isolation layer includes a first isolation sublayer and a second isolation sublayer, wherein the first isolation sublayer is located on the side of the second isolation sublayer closer to the substrate, and the orthographic projection of the first isolation sublayer on the substrate is located within the orthographic projection of the second isolation sublayer on the substrate;

[0018] Optionally, the isolation layer further includes a third isolation sublayer, which is located on the side of the first isolation sublayer away from the second isolation sublayer, and the orthographic projection of the first isolation sublayer on the substrate is located within the orthographic projection of the third isolation sublayer on the substrate;

[0019] Optionally, the protective structure is located in at least one of the first isolation sublayer, the second isolation sublayer, and the third isolation sublayer.

[0020] In one embodiment, the display panel further includes:

[0021] An insulating layer is located on the side of the isolation layer closer to the substrate and covers the first electrode and the side of the planarization layer away from the substrate, and the insulating layer is configured to form a second opening that exposes at least a portion of the first electrode, the second opening communicating with the first opening;

[0022] Furthermore, the protective structure at least covers the insulating layer located on the sidewall of the connection via;

[0023] Optionally, the insulating layer covers the light-transmitting sub-region;

[0024] Optionally, the insulating layer includes a pixel definition layer;

[0025] Optionally, the insulating layer may be made of inorganic materials.

[0026] In one embodiment, the light-transmitting sub-region includes a protective partition and a light-transmitting partition, the orthographic projection of the connecting via on the substrate is located within the orthographic projection of the protective partition on the substrate, and the protective structure covers the first electrode located in the protective partition and exposes the structure within the light-transmitting partition;

[0027] Optionally, in the protection zone, the first electrode continuously covers the bottom of the connection via, the sidewall of the connection via, and a portion of the planarization layer around the outer periphery of the connection via;

[0028] Optionally, the orthographic projection of the protective partition on the substrate is 1 to 2 times the orthographic projection of the connecting via on the substrate;

[0029] Optionally, the orthographic projection shape of the protective partition on the substrate is the same as the orthographic projection shape of the connecting via on the substrate.

[0030] In one embodiment, the protective structure is connected to the isolation structure, or the protective structure and the isolation structure are spaced apart.

[0031] In one embodiment, the display panel further includes an isolation layer located on the side of the first electrode away from the substrate; and the isolation layer is configured to form a light-transmitting opening and a first opening, the light-transmitting opening being located in the light-transmitting sub-region, the first opening being located in the non-light-transmitting sub-region, and exposing a portion of the first electrode;

[0032] The material of the protective structure is different from that of the isolation layer, and the orthographic projection of the light-transmitting opening on the substrate coincides with the orthographic projection of the light-transmitting sub-region on the substrate.

[0033] In one embodiment, the protective structure is made of a light-transmitting material;

[0034] Optionally, the material of the protective structure includes a transparent conductive material or a transparent semiconductor material;

[0035] Optionally, the transparent conductive material includes indium tin oxide, and the transparent semiconductor material includes indium gallium zinc oxide;

[0036] Optionally, the protective structure is made of a transparent conductive material, and the protective structure is spaced apart from the isolation layer.

[0037] In one embodiment, the orthographic projection of the protective structure onto the substrate covers the light-transmitting sub-region.

[0038] In one embodiment,

[0039] The display panel further includes an insulating layer located on the side of the isolation layer near the substrate and covering the first electrode and the planarization layer. The insulating layer is configured to form a second opening that exposes the first electrode, and the second opening communicates with the first opening.

[0040] The protective structure is stacked with the insulating layer, and the surfaces of the protective structure and the insulating layer that are close to each other coincide on the orthographic projection of the substrate.

[0041] Optionally, the orthographic projection of the second opening on the substrate is located within the orthographic projection range of the first opening on the substrate.

[0042] In one embodiment, the display panel includes signal lines located on the side of the planarization layer near the substrate, the connection vias exposing the signal lines, and the first electrode being connected to the signal lines through the connection vias.

[0043] A method for manufacturing a display panel, the display panel having a phototransparent region and a non-phototransparent region surrounding the phototransparent region, the method comprising:

[0044] Provide substrate;

[0045] A planarization layer is formed on the substrate, and the planarization layer has a connection via located in the light-transmitting sub-region.

[0046] A first electrode is formed on the side of the planarization layer away from the substrate, and the first electrode at least covers the sidewall of the connection via and a portion of the planarization layer located in the non-transparent sub-region.

[0047] A protective structure is formed that at least covers the first electrode located on the sidewall of the connection via;

[0048] A light-emitting structure is formed on the first electrode in the non-phototransparent region.

[0049] In one embodiment, before forming the light-emitting structure on the first electrode in the non-phototransparent region, the method further includes:

[0050] An isolation layer is formed on the side of the first electrode away from the substrate, and the isolation layer is at least located in the non-transparent sub-region, and is configured to form a light-transmitting opening and a first opening, the light-transmitting opening being located in the light-transmitting sub-region, the first opening being located in the non-transparent sub-region, and exposing the first electrode;

[0051] The formation of a light-emitting structure on the first electrode in the non-phototransparent region includes:

[0052] A light-emitting structure is formed within the area defined by the first opening. The light-emitting structure includes a light-emitting unit and a second electrode. The light-emitting unit is located between the first electrode and the second electrode, and the second electrode is connected to the isolation layer.

[0053] In one embodiment, forming a light-emitting structure within the area defined by the first opening includes:

[0054] A light-emitting material layer and a second electrode material layer are sequentially deposited on the surface of the structure after the isolation structure is formed.

[0055] An encapsulation material layer is formed on the surface of the second electrode material layer;

[0056] The encapsulation material layer is dry etched to form an encapsulation unit at least within a first opening corresponding to the target color;

[0057] The second electrode material layer and the light-emitting material layer are wet-etched to form the second electrode and the light-emitting unit in the first opening corresponding to the target color.

[0058] In one embodiment, forming an isolation layer on the side of the first electrode away from the substrate includes:

[0059] An insulating material layer is formed covering the first electrode and the planarization layer;

[0060] An insulating material layer is formed on the insulating material layer;

[0061] The isolation material layer is patterned to form the protective structure and the isolation structure. The isolation structure forms the first opening, and the isolation structure and the protective structure together form a light-transmitting opening. The light-transmitting opening is located in a part of the light-transmitting sub-region, and the first opening is located in the non-light-transmitting sub-region, exposing part of the first electrode.

[0062] The insulating material layer is patterned to form an insulating layer and a second opening, the second opening being connected to the first opening.

[0063] In one embodiment, the protective structure that at least covers the first electrode located on the sidewall of the connection via includes:

[0064] An insulating material layer is formed covering the first electrode and the planarization layer;

[0065] A protective material layer is formed on the insulating material layer;

[0066] The protective material layer is patterned to form the protective structure located in the light-transmitting sub-region;

[0067] An insulating material layer is formed on the surface of the protective structure and the insulating material layer;

[0068] The insulating material layer is patterned to form an insulating structure, a light-transmitting opening, and a first opening;

[0069] The insulating material layer is patterned and formed in the second opening connected to the first opening.

[0070] In one embodiment, the protective structure that at least covers the first electrode located on the sidewall of the connection via includes:

[0071] An insulating material layer is formed covering the first electrode and the planarization layer;

[0072] A protective material layer is formed on the surface of the insulating material layer;

[0073] The protective material layer and the insulating material layer are sequentially patterned to form the protective structure and the insulating layer.

[0074] A display panel having a light-transmitting sub-region and a non-light-transmitting sub-region surrounding the light-transmitting sub-region, and the display panel comprising:

[0075] substrate;

[0076] A planarization layer is located on one side of the substrate, and the planarization layer has a connection via located in the light-transmitting sub-region.

[0077] The first electrode is located on the side of the planarization layer away from the substrate, and at least covers the sidewall of the connecting via and a portion of the planarization layer located in the non-transparent sub-region.

[0078] An isolation layer is located on the side of the first electrode away from the substrate. The isolation layer encloses and forms a light-transmitting opening and a first opening. The first opening is located in a non-phototransmitting sub-region and exposes part of the first electrode. The light-transmitting opening is located in the phototransmitting sub-region.

[0079] A protective structure is located on the side of the first electrode away from the planarization layer, at least covering the first electrode located on the sidewall of the connection via;

[0080] The light-emitting structure is located within the first opening on the side of the first electrode away from the substrate.

[0081] In one embodiment, the orthographic projection of the protective structure on the substrate does not overlap with the orthographic projection of the isolation layer on the substrate, or the orthographic projection of the protective structure on the substrate partially overlaps with the orthographic projection of the isolation layer on the substrate.

[0082] A display device includes a display panel as described above.

[0083] The aforementioned display panel, its fabrication method, and display device include a protective structure within the display panel. This protective structure at least covers the first electrode located on the sidewall of the connecting via. The protective structure protects the first electrode during dry etching, preventing its exposure and subsequent corrosion by wet etching, thereby preventing dark spot issues in the display panel. Attached Figure Description

[0084] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0085] Figures 1 to 4 These are schematic diagrams of the ambient light area structure of the display panel in different embodiments, wherein (a) is a partial planar schematic diagram of the ambient light area, and (b) is a partial cross-sectional schematic diagram of the ambient light area;

[0086] Figure 5 This is a partial cross-sectional schematic diagram of the ambient light area of ​​the display panel in yet another embodiment;

[0087] Figure 6 This is a schematic diagram of the manufacturing process of a display panel in one embodiment.

[0088] Explanation of reference numerals in the attached figures:

[0089] 110 - Signal line, 120 - Planarization layer, 200 - First electrode, 300 - Protective structure, 400 - Light-emitting structure, 410 - Light-emitting unit, 420 - Second electrode, 500 - Isolation layer, 500a - Isolation structure, 510 - First isolation sub-layer, 520 - Second isolation sub-layer, 530 - Third isolation sub-layer, 600 - Encapsulation layer, 700 - Insulating layer, A1 - Transparent sub-region, A2 - Non-transparent sub-region, 10 - Connection via, 20 - Transparent opening. Detailed Implementation

[0090] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0091] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0092] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0093] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as "on" another layer or substrate, the layer or element may be directly on said other layer or substrate, or there may be intermediate layers. Furthermore, it is understood that when a layer is referred to as "between" two layers, the layer may be the only layer between said two layers, or there may be one or more intermediate layers. Additionally, the same reference numerals always denote the same elements.

[0094] In the following embodiments, when a layer, region, or element is “connected,” it can be interpreted as the layer, region, or element being connected not only directly but also through other constituent elements placed therebetween. For example, when a layer, region, element, etc., is described as being connected or electrically connected, the layer, region, element, etc., can not only be directly connected or directly electrically connected, but can also be connected or electrically connected through another layer, region, element, etc., placed therebetween.

[0095] In the following text, although terms such as “first” and “second” may be used to describe various components, these components are not necessarily limited to the terms above. The terms above are only used to distinguish one component from another. It will also be understood that expressions used in the singular form include plural expressions, unless the singular form has a distinctly different meaning in the context.

[0096] When a phrase such as “at least one of…” follows a list of elements, it modifies the entire list of elements, not individual elements within that list. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items. As used in the application documents, the term “and / or” includes any and all combinations of one or more of the associated listed items. It should also be understood that terms such as “comprising / including” or “having” specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0097] Electronic or electrical devices and / or any other related devices or components (e.g., display devices including a display panel and a display panel driver, wherein the display panel driver further includes a drive controller, a gate driver, a gamma reference voltage generator, a data driver, and a transmit driver) according to embodiments of the concepts described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, various components of these devices may be formed on an integrated circuit (IC) chip or on a separate IC chip. Additionally, various components of these devices may be implemented on a flexible printed circuit film, a tape-on-a-package (TCP), a printed circuit board (PCB), or formed on a substrate. Furthermore, various components of these devices may be processes or threads running on one or more processors in one or more computing devices to execute computer program instructions and interact with other system components to perform the various functions described herein. Computer program instructions are stored in memory, which may be implemented in a computing device using standard storage devices such as random access memory (RAM). Computer program instructions may also be stored in other non-transitory computer-readable media such as CD-ROMs, flash drives, etc. Furthermore, those skilled in the art will recognize that the functions of various computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed across one or more other computing devices, without departing from the spirit and scope of the exemplary embodiments of the present application.

[0098] While exemplary embodiments of the display panel and the display device including the display panel have been specifically described herein, many modifications and variations will be apparent to those skilled in the art. Therefore, it will be understood that the display panel and the display device including the display panel, constructed according to the principles of this application, may be implemented in ways other than those specifically described herein. This application is also defined in the claims and their equivalents.

[0099] In one embodiment, see Figure 1 This provides a display panel.

[0100] The display panel has a phototransparent area and a non-phototransparent area surrounding the phototransparent area.

[0101] As an example, the display panel may have an ambient light area. This ambient light area can serve as the first display area. Furthermore, the display panel may also have, but is not limited to, a second display area. Both the second display area and the ambient light area can be used for display. The second display area can be the main display area of ​​the display panel, and its area can be larger than that of the ambient light area. Simultaneously, the ambient light area can also be used to house photosensitive devices, fingerprint recognition circuits, or cameras, etc.

[0102] Transparent region A1 and non-transparent region A2 can be located in the ambient light region.

[0103] Transparent sub-region A1 can be used to allow ambient light to pass through. As an example, several transparent sub-regions A1 can be provided at intervals within the same ambient light area. Non-transparent sub-regions A2 can surround the transparent sub-regions A1. The area of ​​the ambient light area other than the transparent sub-regions A1 is the non-transparent sub-region A2.

[0104] The display panel includes a substrate, a planarization layer 120, a first electrode 200, a protective structure 300, and a light-emitting structure 400.

[0105] The substrate may have a photosensitive device, an under-display fingerprint recognition circuit, or an under-display camera located in the ambient light zone. The photosensitive device senses the light from the phototransmitting sub-region A1.

[0106] The planarization layer 120 is located on one side of the substrate.

[0107] As an example, the display panel also includes signal lines 110. Signal lines 110 may be located on the side of the planarization layer 120 close to the substrate, and the planarization layer 120 may cover signal lines 110.

[0108] The substrate can have multiple wiring layers, and each wiring layer can have multiple traces to provide various signals to the display panel. Here, "signal line 110" can be a trace on the top wiring layer that is furthest from the substrate.

[0109] The planarization layer 120 can cover the top wiring layer, thereby covering the signal line 110.

[0110] Meanwhile, the planarization layer 120 has a connection via 10. The connection via 10 is located in the phototransparent sub-region A1, thereby exposing the signal line 110. The first electrode 200 is connected to the signal line 110 through the connection via 10, thereby enabling the signal in the signal line 110 to be extracted. The planarization layer 120 has a through hole, which exposes the signal line 110 located below the planarization layer 120. By filling the through hole with a conductive metal material to form the connection via 10, the connection between the first electrode 200 and the signal line 110 is realized through the connection via 10. However, due to process limitations and material properties, there will be a discontinuity between the surface of the conductive metal material and the surface of the planarization layer 120, and the side of the connection via 10 facing away from the substrate will expose part of the planarization layer 120.

[0111] The first electrode 200 can be either an anode or a cathode.

[0112] The first electrode 200 is located on the side of the planarization layer 120 away from the substrate, and at least covers the sidewall of the connecting via 10 and a portion of the planarization layer 120 located in the non-transparent region.

[0113] As an example, the first electrode 200 can extend from the bottom of the connection via 10 to the planarization layer 120 located in the non-transparent region A2. Therefore, the first electrode 200 can be electrically connected to the signal line 110 at the bottom of the connection via 10 and lead the signal on the signal line 110 to the non-transparent region A2, thereby providing an anode signal or a cathode signal to the light-emitting structure 400 located in the non-transparent region A2.

[0114] The protective structure 300 is located on the side of the first electrode 200 away from the planarization layer 120. The protective structure 300 at least covers the first electrode 200 located on the sidewall of the connecting via 10, thereby protecting the first electrode 200 on the sidewall of the connecting via 10. It should be noted that the protective structure 300 and the first electrode 200 on the sidewall of the connecting via 10 can be in direct contact, and a centrally located film layer can also be present between them.

[0115] The protective structure 300 can be a single-layer structure or a multi-layer structure; there is no restriction on this.

[0116] The light-emitting structure 400 may include a light-emitting unit 410. The display panel may include multiple light-emitting structures 400 of different colors. In the light-emitting structures 400 of different colors, the light-emitting unit 410 may be made of different materials, thereby emitting light of different colors.

[0117] The light-emitting structure 400 is located on the side of the first electrode 200 in the non-transparent region A2 that is away from the substrate.

[0118] It is understandable that, in addition to the ambient light zone, the second display zone may also have a light-emitting structure 400.

[0119] The first electrode 200 can provide an anode signal or a cathode signal to the light-emitting structure 400 so that it emits light.

[0120] Simultaneously, the first electrode 200 covers the portion of the connecting via 10 extending into the phototransmitter region A1 to achieve complete contact with the connecting via 10. That is, the first electrode 200 covers part of the exposed planarization layer 120. However, the first electrode 200 is relatively thin and cannot compensate for the discontinuity between the upper surface of the metal material layer and the upper surface of the PLN layer of the connecting via 10. This results in a first slope on the sidewall of the connecting via 10, leading to a thinner first electrode 200 on the sidewall of the connecting via 10, and also a thinner film covering the first electrode 200 at that location. In the display panel manufacturing process, etching steps are frequently involved. At this time, the film covering the first electrode 200 located on the sidewall of the connecting via 10 is easily etched through during dry etching, exposing the first electrode 200. Exposing the first electrode 200 can lead to corrosion of the first electrode 200 during subsequent wet etching, which can prevent the first electrode 200 from supplying power to the light-emitting structure 400, resulting in the light-emitting structure 400 not emitting light and causing dark spots.

[0121] In this embodiment, a protective structure 300 is provided in the display panel, which at least covers the first electrode 200 located on the sidewall of the connecting via 10. The protective structure 300 can protect the first electrode 200 during dry etching, thereby preventing the first electrode 200 from being exposed during dry etching, thus preventing the first electrode 200 from being corroded, and thus preventing dark spot problems.

[0122] In one embodiment, please refer to... Figure 1 The display panel also includes an isolation layer 500. The isolation layer 500 is located on the side of the first electrode 200 away from the substrate.

[0123] The isolation layer 500 includes a protective structure 300 and an isolation structure 500a. The isolation structure 500a forms a first opening. The isolation structure 500a and the protective structure 300 together form a light-transmitting opening 20.

[0124] The light-transmitting opening 20 is located in a portion of the phototransmitting sub-region A1, thereby allowing ambient light to pass through the phototransmitting sub-region A1. The first opening is located in the non-phototransmitting sub-region A2 and exposes a portion of the first electrode 200.

[0125] The light-emitting structure 400 is located within the area defined by the first opening.

[0126] As an example, the light-emitting structure 400 includes a light-emitting unit 410 and a second electrode 420.

[0127] The light-emitting unit 410 is located between the first electrode 200 and the second electrode 420, thereby forming a light-emitting device with the first electrode 200 and the second electrode 420 on both sides. As an example, the first electrode 200 can be set as the anode and the second electrode 420 as the cathode. Alternatively, the first electrode 200 can be set as the cathode and the second electrode 420 as the anode.

[0128] Meanwhile, the second electrode 420 of the light-emitting structure 400 can be electrically connected to the isolation structure 500a.

[0129] In this embodiment, the protective structure 300 and the isolation structure 500a can be formed simultaneously during the formation of the isolation layer 500, thereby simplifying the process. Furthermore, when the isolation structure 500a and the protective structure 300 comprise the same number of film layers, the isolation layer 500 can be prepared using a single photomask.

[0130] In one embodiment, please refer to... Figure 1 The display panel also includes an encapsulation layer 600. The encapsulation layer 600 includes a plurality of encapsulation units. The encapsulation units are at least partially located within the area defined by the first opening and cover the light-emitting structure 400.

[0131] Specifically, the display panel may include multiple light-emitting structures 400 of different colors. During the fabrication of the display panel, after the insulating layer 500 is formed, light-emitting structures 400 of different colors can be formed sequentially. After one color of light-emitting structure 400 is formed, another color of light-emitting structure 400 is formed.

[0132] In the process of forming the light-emitting structure 400 of each color, a light-emitting material layer can be deposited across the entire surface first, followed by a second electrode material layer. The deposited light-emitting material layer and the second electrode material layer are separated at the first opening by an isolation layer 500. Then, an encapsulation material layer is deposited across the entire surface using a chemical vapor deposition process. Afterward, a photoresist mask is formed using a photolithography process. Then, based on the photoresist mask, the encapsulation material layer is dry-etched. Afterward, the first electrode 200 material layer and the light-emitting material layer are wet-etched, thereby forming the encapsulation unit, the first electrode 200, and the light-emitting unit 410 within the first opening corresponding to the target color. Finally, the photoresist mask is removed.

[0133] During this process, the thickness of both the light-emitting material layer and the second electrode material layer on the sidewall of the connecting via 10 is relatively thin. When dry etching the encapsulation material layer, the second electrode material layer located on the sidewall of the connecting via 10 may not effectively block the dry etching gas, resulting in the second electrode material layer and the light-emitting material layer being etched through, potentially exposing the first electrode 200 on the sidewall of the connecting via 10. Subsequently, when wet etching the first electrode 200 material layer and the light-emitting material layer, the exposed first electrode 200 may be corroded, leading to dark spot problems.

[0134] In this embodiment, the first electrode 200 connected to the sidewall of the via 10 is covered by the protective structure 300. During dry etching of the encapsulation material layer, even if the second electrode material layer connected to the sidewall of the via 10 cannot effectively block the dry etching gas, the first electrode 200 can still be protected by the protective structure 300 after the second electrode material layer connected to the sidewall of the via 10 and the light-emitting material layer are also etched through, thereby preventing dark spot problems.

[0135] In one embodiment, the isolation layer 500 includes at least two isolation sublayers. The protective structure 300 is located in at least one of the isolation sublayers.

[0136] Specifically, the isolation layer 500 may be formed by multiple isolation sublayers, and the isolation structure 500a may include all the isolation sublayers of the isolation layer 500. The protective structure 300 may include all the isolation sublayers of the isolation layer 500, or it may include some of the isolation sublayers of the isolation layer 500.

[0137] For example, the isolation layer 500 includes a first isolation sublayer 510 and a second isolation sublayer 520. The first isolation sublayer 510 is located on the side of the second isolation sublayer 520 closer to the substrate, and the orthographic projection of the first isolation sublayer 510 on the substrate is located within the orthographic projection of the second isolation sublayer 520 on the substrate.

[0138] At this time, the isolation structure 500a includes a first isolation sublayer 510 and a second isolation sublayer 520. The protection structure 300 may include the first isolation sublayer 510, or the second isolation sublayer 520, or both the first isolation sublayer 510 and the second isolation sublayer 520.

[0139] For example, the isolation layer 500 includes a third isolation sublayer 530, a first isolation sublayer 510, and a second isolation sublayer 520. The third isolation sublayer 530 is located on the side of the first isolation sublayer 510 away from the second isolation sublayer 520. The orthographic projection of the first isolation sublayer 510 on the substrate lies within the orthographic projection of the third isolation sublayer 530 on the substrate.

[0140] At this time, the isolation structure 500a includes a third isolation sublayer 530, a first isolation sublayer 510, and a second isolation sublayer 520. The protective structure 300 may include at least one of the third isolation sublayer 530, the first isolation sublayer 510, and the second isolation sublayer 520. As an example, the material of the first isolation sublayer 510 may be a conductive material (e.g., aluminum), and the second electrode 420 may be connected to the first isolation sublayer 510. At this time, the material of the second isolation sublayer 520 may be a conductive material (e.g., Ti) or an insulating material. The material of the third isolation sublayer 530 may be a conductive material (e.g., Mo) or an insulating material.

[0141] In the fabrication process of isolation layer 500, an isolation material layer can be formed first. The isolation material layer may include a first isolation sub-material layer and a second isolation sub-material layer formed sequentially. Alternatively, the isolation material layer may include a third isolation sub-material layer, a first isolation sub-material layer, and a second isolation sub-material layer formed sequentially. Then, the isolation material layer can be patterned and etched to form isolation layer 500. Specifically, the second isolation sub-material layer at the top can be dry-etched first to form second isolation sub-layer 520. Then, the first isolation sub-material layer (or the first and third isolation sub-material layers) can be wet-etched to form first isolation sub-layer 510 (or first and third isolation sub-layers 530).

[0142] During this process, the first insulator material layer (or the first insulator material layer and the third insulator material layer) connecting the sidewalls of via 10 is relatively thin. When dry etching the second insulator material layer, the first insulator material layer (or the first insulator material layer and the third insulator material layer) located on the sidewalls of via 10 may not effectively block the dry etching gas and may be etched through, potentially exposing the first electrode 200 connecting the sidewalls of via 10. Subsequently, when wet etching is performed on the first insulator material layer (or the first insulator material layer and the third insulator material layer), the exposed first electrode 200 may be corroded, leading to dark spot problems.

[0143] In this embodiment, the first electrode 200 connected to the sidewall of the via 10 can be covered by the protective structure 300. When the first isolator material layer is dry-etched, even if the first isolator material layer (or the first isolator material layer and the third isolator material layer) connected to the sidewall of the via 10 is etched through, the first electrode 200 can still be protected by the protective structure 300, thereby preventing dark spot problems.

[0144] In one embodiment, please refer to... Figure 1 The display panel also includes an insulating layer 700. The material of the insulating layer may include inorganic materials.

[0145] The insulating layer 700 is located on the side of the isolation layer 500 closer to the substrate, and the insulating layer 700 covers the first electrode 200 and the side of the planarization layer 120 away from the substrate. At this time, the insulating layer 700 can insulate and isolate the first electrode 200 from the isolation layer 500.

[0146] The insulating layer 700 is configured to form a second opening, which is connected to the first opening, thereby exposing at least a portion of the first electrode 200, so that the light-emitting structure 400 can be connected to the first electrode 200.

[0147] As an example, the insulating layer 700 includes a pixel definition layer. In this case, the orthographic projection of the second opening on the substrate can lie within the orthographic projection of the first opening on the substrate, thereby defining the pixel size. Of course, the insulating layer 700 can also be used only to insulate the first electrode 200 from the insulating layer 500. In this case, the orthographic projection of the second opening on the substrate may not lie within the orthographic projection of the first opening on the substrate.

[0148] As an example, the insulating layer 700 can also completely cover the phototransparent region A1, specifically covering the anode and the like located in the phototransparent region A1, thereby protecting it.

[0149] The protective structure 300 at least covers the insulating layer 700 located on the sidewall of the connection via 10, thereby preventing the insulating layer 700 from being etched and thus protecting the first electrode 200 under the insulating layer 700.

[0150] For example, during the formation of the light-emitting structure 400 for each color, if the second electrode material layer and the light-emitting material layer connecting the sidewall of the via 10 are also etched through during the dry etching of the encapsulation material layer, the insulating layer 700 connecting the sidewall of the via 10 is also at risk of being etched through due to its thinness, thereby making the first electrode 200 at risk of being corroded by subsequent wet etching.

[0151] At this time, the insulating layer 700 is protected by the protective structure 300, thereby preventing the insulating layer 700 from being etched through and thus preventing dark spot problems. Meanwhile, the area of ​​the phototransparent region A1, besides the connecting via 10, may also have signal lines 110. In this case, the insulating layer 700 covers the phototransparent region A1, thereby completely covering the first electrode 200 and this portion of the signal lines 110. Therefore, after dry etching of the encapsulation material layer, during wet etching of the second electrode material layer and the light-emitting material layer, the insulating layer 700 can prevent the signal lines 110 from being corroded.

[0152] Of course, in other embodiments, the insulating layer 700 may not be formed in the area corresponding to the connection via 10, thereby allowing the protective structure 300 to directly contact and protect the first electrode 200. Alternatively, the insulating layer 700 may not be formed in the phototransparent sub-region A1. In this case, for example, the signal line 110 in the area of ​​the phototransparent sub-region A1 other than the connection via 10 can be protected by the protective structure 300. Alternatively, the display panel may not include the insulating layer 700. In this case, for example, the material of the third isolation sub-layer 530 of the isolation layer 500 can be set to the insulating layer 700, thereby isolating the isolation layer 500 from the first electrode 200.

[0153] In one embodiment, see Figure 2 The light-transmitting sub-region A1 includes a protective partition A11 and a light-transmitting partition A12. The orthographic projection of the connecting via 10 on the substrate is located within the orthographic projection of the protective partition A11 on the substrate.

[0154] The protective structure covers the first electrode 200 located in the protection zone A11, thereby effectively protecting the first electrode 200 as a whole within the connection via 10.

[0155] Optionally, in the protection zone A11, the first electrode 200 continuously covers the bottom of the connection via 10, the sidewall of the connection via 10, and a portion of the planarization layer 120 around the connection via 10.

[0156] At the same time, the protective structure 300 exposes the structure within the light-transmitting zone A12, thereby exposing the light-transmitting sub-zone A1 outside the protective zone A11.

[0157] The protective structure 300 is located within the isolation layer 500. The material of the isolation layer 500 typically includes metal. Metal has poor light transmittance. Therefore, by exposing the light-transmitting sub-region A1 outside the protective partition A11, the protective structure 300 can effectively ensure the light transmittance of the light-transmitting sub-region A1.

[0158] Optionally, the orthographic projection of the protection partition A11 on the substrate is 1 to 2 times the orthographic projection of the connecting via A12 on the substrate;

[0159] Optionally, the orthographic projection shape of the protection partition A11 on the substrate is the same as the orthographic projection shape of the connecting via A12 on the substrate.

[0160] In other embodiments, please refer to Figure 1 The protective structure 300 may not completely cover the connecting via 10, but only cover the sidewall of the connecting via 10, thereby preventing process errors from causing the protective structure 300 to extend beyond the connecting via 10 and affecting the transmittance of the light-transmitting sub-region A1.

[0161] In one embodiment, see Figure 1The protective structure 300 is connected to the isolation structure 500a. This reduces the difficulty of fabricating the isolation layer 500.

[0162] In one embodiment, see Figure 2 The protection structure 300 and the isolation structure 500a are spaced apart. At this time, the protection structure 300 will not receive any signal (such as a cathode signal), thereby causing coupling interference to the signal on the first electrode 200 (such as an anode), thus making the potential on the first electrode 200 and the second electrode 420 connected to the isolation structure 500a more accurate.

[0163] In one embodiment, see Figure 3 The display panel also includes an isolation layer 500. The isolation layer 500 is located on the side of the first electrode 200 away from the substrate.

[0164] The isolation layer 500 is configured to form a light-transmitting opening 20 and a first opening. The light-transmitting opening 20 is located in a portion of the light-transmitting sub-region A1, thereby allowing ambient light to pass through the light-transmitting sub-region A1. The first opening is located in the non-light-transmitting sub-region A2 and exposes a portion of the first electrode 200.

[0165] The material of the protective structure 300 is different from that of the isolation layer 500. The orthographic projection of the light-transmitting opening 20 on the substrate coincides with the orthographic projection of the light-transmitting sub-region A1 on the substrate. That is, the light-transmitting sub-region A1 is the area where the light-transmitting opening 20 is located.

[0166] At this point, the protective structure 300 and the isolation layer 500 can be formed separately, thereby making the forming process of the isolation layer 500 compatible with existing processes.

[0167] In one embodiment, the material of the protective structure 300 is a light-transmitting material. In this case, the light transmittance within the light-transmitting sub-region A1 can be effectively improved.

[0168] As an example, the material of the protective structure 300 includes a transparent conductive material or a transparent semiconductor material. The transparent conductive material may include, but is not limited to, indium tin oxide (ITO), and the transparent semiconductor material may include, but is not limited to, indium gallium zinc oxide (IGZO).

[0169] As an example, the material of the protective structure 300 includes a transparent conductive material (such as ITO). The protective structure 300 is spaced apart from the isolation layer 500, so that the protective structure 300 is not connected to a signal (such as a cathode signal), thereby causing coupling interference to the signal on the first electrode 200 (such as an anode), thus making the potential on the first electrode 200 and the second electrode 420 connected to the isolation layer 500 more accurate.

[0170] In one embodiment, see Figure 4The orthographic projection of the protective structure 300 on the substrate covers the phototransparent region A1, thereby filling the phototransparent region A1.

[0171] When the material of the protective structure 300 is a light-transmitting material, it has very little obstruction to the light transmittance within the phototransmitting sub-region A1. In this case, by covering the phototransmitting sub-region A1 with the protective structure 300, the first electrode 200 and signal line 110 within the phototransmitting sub-region A1 can be fully protected. At the same time, covering the phototransmitting sub-region A1 with the protective structure 300 can increase its size, thereby reducing the difficulty of its fabrication process.

[0172] In one embodiment, see Figure 5 The display panel also includes an insulating layer 700.

[0173] The insulating layer 700 is located on the side of the isolation layer 500 closer to the substrate, and the insulating layer 700 covers the first electrode 200 and the planarization layer 120. At this time, the insulating layer 700 can insulate and isolate the first electrode 200 from the isolation layer 500.

[0174] The insulating layer 700 is configured to form a second opening, which is connected to the first opening, thereby exposing the first electrode 200 and allowing the light-emitting structure 400 to be connected to the first electrode 200.

[0175] As an example, the insulating layer 700 includes a pixel definition layer. In this case, the orthographic projection of the second opening on the substrate can lie within the orthographic projection of the first opening on the substrate, thereby defining the pixel size. Of course, the insulating layer 700 can also be used only to insulate the first electrode 200 from the insulating layer 500. In this case, the orthographic projection of the second opening on the substrate may not lie within the orthographic projection of the first opening on the substrate.

[0176] Meanwhile, the protective structure 300 and the insulating layer 700 are stacked. Specifically, the protective structure 300 can be located above or below the insulating layer 700.

[0177] Furthermore, the orthographic projections of the adjacent surfaces of the protective structure 300 and the insulating layer 700 on the substrate coincide.

[0178] When the protective structure 300 can be located above the insulating layer 700, please refer to Figure 5 The orthographic projection of the lower surface of the protective structure 300 onto the substrate can coincide with the orthographic projection of the upper surface of the insulating layer 700 onto the substrate. When the protective structure 300 can be located below the insulating layer 700, the orthographic projection of the upper surface of the protective structure 300 onto the substrate can coincide with the orthographic projection of the lower surface of the insulating layer 700 onto the substrate.

[0179] In this embodiment, during the manufacturing process of the display panel, the protective structure 300 and the insulating layer 700 can be formed on the same photomask, thereby simplifying the process steps and reducing the process cost.

[0180] In one embodiment, see Figure 6 This paper provides a method for manufacturing a display panel.

[0181] The display panel has a light-transmitting sub-area A1 and a non-light-transmitting sub-area A2.

[0182] As an example, the display panel can have an ambient light area. Additionally, the display panel can also have a second display area. Both the second display area and the ambient light area can be used for display. Meanwhile, the ambient light area can also be used to house a photosensitive device, fingerprint recognition circuitry, or a camera, etc.

[0183] Transparent region A1 and non-transparent region A2 can be located in the ambient light region.

[0184] Transparent sub-region A1 can be used to allow ambient light to pass through. As an example, several transparent sub-regions A1 can be provided at intervals within the same ambient light area. Non-transparent sub-regions A2 can surround the transparent sub-regions A1. The area of ​​the ambient light area other than the transparent sub-regions A1 is the non-transparent sub-region A2.

[0185] The manufacturing method of the display panel includes the following steps:

[0186] Step S10: Provide a substrate.

[0187] Photosensitive devices, under-display fingerprint recognition circuits, or under-display cameras located in the ambient light zone can be formed on the substrate.

[0188] Step S20: A planarization layer is formed on the substrate. The planarization layer has connection vias located in the phototransparent region.

[0189] As an example, signal line 110 can be formed before forming the planarization layer. Then, a planarization layer 120 is formed to cover signal line 110. Connecting vias 10 within the planarization layer 120 can expose a portion of signal line 110.

[0190] Multiple wiring layers can be formed on the substrate, and multiple traces can be set on each wiring layer to provide various signals to the display panel. Here, "signal line 110" can be a trace on the top wiring layer that is furthest from the substrate.

[0191] The planarization layer 120 can cover the top wiring layer, thereby covering the signal line 110. The connection vias 10 within the planarization layer 120 expose the signal line 110, so that they can be used to bring out the signals in the signal line 110.

[0192] In step S40, a first electrode is formed on the side of the planarization layer away from the substrate. The first electrode at least covers the sidewall of the connecting via and a portion of the planarization layer located in the non-transparent region.

[0193] As an example, a first electrode 200 may be formed extending from the bottom of the connecting via 10 to the side of the planarization layer 120 away from the signal line 110.

[0194] The first electrode 200 can be either an anode or a cathode.

[0195] The first electrode 200 extends from the bottom of the connecting via 10 to the planarization layer 120 located in the non-transparent sub-region A2. Therefore, the first electrode 200 can be electrically connected to the signal line 110 at the bottom of the connecting via 10 and lead the signal on the signal line 110 to the non-transparent sub-region A2.

[0196] Step S60: Form a protective structure 300 that at least covers the first electrode 200 located on the sidewall of the connection via 10.

[0197] The protective structure 300 can be a single-layer structure or a multi-layer structure; there is no restriction on this.

[0198] The protective structure 300 at least covers the first electrode 200 located on the sidewall of the connecting via 10, thereby protecting the insulating layer 700 on the sidewall of the connecting via 10. It should be noted that here, the protective structure 300 and the first electrode 200 on the sidewall of the connecting via 10 can be in direct contact, and there can also be an intermediate film layer between them.

[0199] In step S80, a light-emitting structure 400 is formed on the first electrode 200 in the non-phototransparent region A2.

[0200] The light-emitting structure 400 may include a light-emitting unit 410. The display panel may include multiple light-emitting structures 400 of different colors. In the light-emitting structures 400 of different colors, the light-emitting unit 410 may be made of different materials, thereby emitting light of different colors.

[0201] The light-emitting structure 400 is located on the first electrode 200 in the non-transparent region A2. It can be understood that, in addition to the ambient light region, the second display region may also have a light-emitting structure 400.

[0202] The first electrode 200 can provide an anode signal or a cathode signal to the light-emitting structure 400 so that it emits light.

[0203] Meanwhile, the presence of the via 10 creates a slope on its sidewall, resulting in a thinner first electrode 200 and a thinner film covering it. In the display panel manufacturing process, etching is frequently involved. During dry etching, the film covering the first electrode 200 on the sidewall of the via 10 is easily etched through, exposing the first electrode 200. This exposure makes it easier for subsequent wet etching to corrode the first electrode 200, preventing it from supplying power to the light-emitting structure 400 and causing the structure to fail to emit light, resulting in dark spots.

[0204] In this embodiment, a protective structure 300 is formed at least on the first electrode 200 connected to the sidewall of the via 10. The protective structure 300 can protect the first electrode 200 during dry etching, thereby preventing the first electrode 200 from being exposed during dry etching, thus preventing the first electrode 200 from being corroded, and thus preventing dark spot problems.

[0205] In one embodiment, prior to step S80, the method further includes:

[0206] In step S70, an isolation layer 500 is formed on the side of the first electrode 200 away from the substrate. The isolation layer 500 is located at least in the non-transparent region A2 and is configured to form a light-transmitting opening 20 and a first opening. The light-transmitting opening 20 is located in the light-transmitting region A1, and the first opening is located in the non-transparent region A2, exposing the first electrode 200.

[0207] An isolation material layer can first be formed on the side of the first electrode 200 away from the substrate. Then, the isolation material layer is patterned to form the isolation layer 500.

[0208] The first opening formed by the 500 isolation layer can be in the form of a small mouth and a large belly.

[0209] Step S80 includes:

[0210] Step S82: A light-emitting structure 400 is formed in the area defined by the first opening. The light-emitting structure 400 includes a light-emitting unit 410 and a second electrode 420. The light-emitting unit 410 is located between the first electrode 200 and the second electrode 420. The second electrode 420 is connected to the isolation layer 500.

[0211] As an example, step S82 includes:

[0212] In step S822, a light-emitting material layer and a second electrode material layer are sequentially deposited on the surface of the structure after the isolation structure 500a is formed.

[0213] The vapor-deposited luminescent material layer and the second electrode material layer are separated at the first opening by the isolation layer 500.

[0214] Step S824: An encapsulation material layer is formed on the surface of the second electrode material layer.

[0215] The entire surface of the encapsulation material layer can be deposited using chemical vapor deposition (CVD) technology.

[0216] Step S826: Dry etching is performed on the encapsulation material layer to form an encapsulation unit at least within the first opening corresponding to the target color.

[0217] The target color is the color currently being processed.

[0218] A photoresist mask can first be formed using photolithography. Then, based on the photoresist mask, the packaging material layer is dry-etched to form the packaging unit within the first opening corresponding to the target color.

[0219] The photoresist mask can extend from the first opening corresponding to the target color to the upper surface of the photoresist mask on both sides. At this time, the packaging unit can also extend partially above the isolation layer 500 on both sides of the first opening corresponding to the target color.

[0220] Step S828: Wet etching is performed on the second electrode material layer and the light-emitting material layer to form the second electrode 420 and the light-emitting unit 410 in the first opening corresponding to the target color.

[0221] During this process, the thickness of both the light-emitting material layer and the second electrode material layer on the sidewall of the connecting via 10 is relatively thin. When dry etching the encapsulation material layer, the second electrode material layer located on the sidewall of the connecting via 10 may not effectively block the dry etching gas, resulting in the second electrode material layer and the light-emitting material layer being etched through, potentially exposing the first electrode 200 on the sidewall of the connecting via 10. Subsequently, when wet etching the first electrode 200 material layer and the light-emitting material layer, the exposed first electrode 200 may be corroded, leading to dark spot problems.

[0222] In this embodiment, the first electrode 200 connected to the sidewall of the via 10 is covered by the protective structure 300. During dry etching of the encapsulation material layer, even if the second electrode material layer connected to the sidewall of the via 10 cannot effectively block the dry etching gas, the first electrode 200 can still be protected by the protective structure 300 after the second electrode material layer connected to the sidewall of the via 10 and the light-emitting material layer are also etched through, thereby preventing dark spot problems.

[0223] In one embodiment, step S70 includes:

[0224] Step S72: An insulating material layer is formed covering the first electrode 200 and the planarization layer 120.

[0225] An insulating material layer can be applied to the first electrode 200 and the planarization layer 120 using processes such as chemical vapor deposition. The material of the insulating material layer may include, but is not limited to, silicon oxide.

[0226] Step S74: An insulating material layer is formed on the insulating material layer.

[0227] The isolation material layer can be formed through processes such as physical vapor deposition.

[0228] Step S76: The isolation material layer is patterned to form the protective structure 300 and the isolation structure 500a.

[0229] The isolation structure 500a forms a first opening. The isolation structure 500a and the protective structure 300 together form a light-transmitting opening 20. The light-transmitting opening 20 is located in a portion of the light-transmitting sub-region A1, thereby allowing ambient light to pass through the light-transmitting sub-region A1. The first opening is located in the non-light-transmitting sub-region A2 and exposes a portion of the first electrode 200.

[0230] As an example, the isolation material layer can be patterned based on the first photomask to form the protective structure 300 and the isolation structure 500a.

[0231] Specifically, firstly, a first photoresist is coated onto the isolation material layer. Then, based on a first photomask, the first photoresist can be exposed and developed to form a first patterned photoresist. Then, based on the first patterned photoresist, the isolation material layer can be etched to form the protective structure 300 and the isolation structure 500a.

[0232] At this time, the protective structure 300 and the isolation structure 500a are formed simultaneously and have the same number of film layers. For example, both the protective structure 300 and the isolation structure 500a include a first isolation sublayer 510 and a second isolation sublayer 520. Alternatively, both the protective structure 300 and the isolation structure 500a may include a third isolation sublayer 530, a first isolation sublayer 510, and a second isolation sublayer 520.

[0233] Based on the same photomask, both the protective structure 300 and the isolation structure 500a are formed simultaneously, thereby reducing process costs and improving process efficiency.

[0234] As an example, the isolation material layer may include a first isolation sub-material layer and a second isolation sub-material layer formed sequentially. When patterning the isolation material layer, a first patterned photoresist may first be formed. Then, the second isolation sub-material layer is dry-etched based on the first patterned photoresist to form the second isolation sub-layer 520. Then, the first isolation sub-material layer is wet-etched based on the first patterned photoresist to form the first isolation sub-layer 510. The orthographic projection of the first isolation sub-layer 510 onto the substrate lies within the orthographic projection of the second isolation sub-layer 520 onto the substrate. The first patterned photoresist is then removed.

[0235] As an example, the isolation material layer may include a third isolation sub-material layer, a first isolation sub-material layer, and a second isolation sub-material layer formed sequentially. When patterning the isolation material layer, a first patterned photoresist may be formed first. Then, the second isolation sub-material layer is dry-etched based on the first patterned photoresist to form a second isolation sub-layer 520. Then, the first and third isolation sub-material layers are wet-etched sequentially based on the first patterned photoresist to form a first isolation sub-layer 510 and a third isolation sub-layer 530. The orthographic projection of the first isolation sub-layer 510 onto the substrate lies within the orthographic projection of the second isolation sub-layer 520 onto the substrate. Furthermore, the orthographic projection of the first isolation sub-layer 510 onto the substrate lies within the orthographic projection of the third isolation sub-layer 530 onto the substrate. The first patterned photoresist is then removed.

[0236] Step S78: The insulating material layer is patterned to form an insulating layer 700 and a second opening, which is connected to the first opening.

[0237] When patterning the insulating material layer, a second patterned photoresist can be formed first. Then, the insulating material layer is dry-etched based on the second patterned photoresist to form the insulating layer 700. The second patterned photoresist is then removed.

[0238] An insulating layer 700 is formed between the isolation layer 500 and the first electrode 200, thereby effectively insulating the isolation layer 500 from the first electrode 200. At the same time, the insulating layer 700 can cover the first electrode 200 connected to the sidewall of the via 10, thereby providing better protection for the first electrode 200.

[0239] In one embodiment, step S60 includes:

[0240] Step S61: Form an insulating material layer covering the first electrode and the planarization layer.

[0241] Step S62: A protective material layer is formed on the insulating material layer.

[0242] Step S63: Pattern the protective material layer to form a protective structure located in the phototransparent region.

[0243] First, a third photoresist can be coated onto the protective material layer. Then, based on a second photomask, the third photoresist can be exposed and developed to form a third patterned photoresist. Next, the protective material layer can be etched based on the third patterned photoresist to form the protective structure 300.

[0244] Step S64: Form an insulating material layer on the surface of the protective structure and the insulating material layer.

[0245] Step S65: The isolation material layer is patterned to form an isolation structure, a light-transmitting opening, and a first opening.

[0246] First, a first photoresist can be coated onto the isolation material layer. Then, the first photoresist can be exposed and developed based on a third photomask to form a first patterned photoresist. Next, the isolation material layer can be etched based on the first patterned photoresist to form the isolation structure 500a.

[0247] At this point, the protective structure 300 and the isolation structure 500a are distributed and formed, thereby improving process flexibility.

[0248] As an example, the material of the protective structure 300 can be a light-transmitting material, thereby effectively improving the light transmittance of the light-transmitting sub-region A1. In this case, the protective structure 300 can cover the entire light-transmitting sub-region A1.

[0249] Step S66: Pattern the insulating material layer to form a second opening connected to the first opening.

[0250] The insulating material layer can be patterned using a dry etching process. The remaining insulating material layer after etching can form an insulating layer. The insulating layer may include, but is not limited to, a pixel definition layer.

[0251] In one embodiment, step S60 includes:

[0252] Step S61a: Form an insulating material layer covering the first electrode and the planarization layer.

[0253] Step S62a: A protective material layer is formed on the surface of the insulating material layer.

[0254] The protective material layer can be formed through processes such as deposition.

[0255] Subsequently, an insulating material layer can be formed on top of the protective material layer. At this point, the insulating material layer, the protective material layer, and the insulating material layer are formed in sequence.

[0256] In step S63a, the protective material layer and the insulating material layer are sequentially patterned to form the protective structure 300 and the insulating layer 700.

[0257] A fourth photoresist can first be formed on the protective material layer. Then, based on the fourth photomask, the fourth photoresist can be exposed and developed to form a fourth patterned photoresist. Then, based on the fourth patterned photoresist, the protective material layer and the insulating material layer can be etched to form the protective structure 300 and the insulating layer 700.

[0258] In this embodiment, the protective structure 300 and the insulating layer 700 can be formed using the same photomask, thereby reducing process costs and improving process efficiency.

[0259] In one embodiment, step S60 includes:

[0260] Step S61b: A protective material layer is formed on the surface of the first electrode 200 and the surface of the planarization layer 120.

[0261] The protective material layer can be formed through processes such as deposition.

[0262] Subsequently, an insulating material layer can be formed on the protective material layer. An insulating material layer can then be formed on the insulating material layer. At this point, the protective material layer, the insulating material layer, and the insulating material layer are formed sequentially.

[0263] Step S62b: An insulating material layer is formed on the surface of the protective material layer;

[0264] In step S63b, the insulating material layer and the protective material layer are sequentially patterned to form the insulating layer 700 and the protective structure 300.

[0265] A fourth photoresist can first be formed on a protective material layer. Then, based on a fourth photomask, the fourth photoresist can be exposed and developed to form a fourth patterned photoresist. Then, based on the fourth patterned photoresist, an insulating material layer and a protective material layer can be etched to form an insulating layer 700 and a protective structure 300.

[0266] In this embodiment, the protective structure 300 and the insulating layer 700 can be formed using the same photomask, thereby reducing process costs and improving process efficiency.

[0267] In one embodiment, a display panel is also provided.

[0268] The display panel has a light-transmitting sub-area A1 and a non-light-transmitting sub-area A2 surrounding the light-transmitting sub-area A1.

[0269] The display panel includes a substrate, a planarization layer 120, a first electrode 200, an isolation layer 500, a protective structure 300, and a light-emitting structure 400.

[0270] The planarization layer 120 is located on one side of the substrate. The planarization layer 120 has a connection via 10, which is located in the light-transmitting sub-region A1.

[0271] The first electrode 200 is located on the side of the planarization layer 120 away from the substrate. The first electrode 200 at least covers the sidewall of the connecting via 10 and a portion of the planarization layer 120 located in the non-transparent sub-region A2.

[0272] An isolation layer 500 is located on the side of the first electrode 200 away from the substrate. The isolation layer 500 encloses and forms a light-transmitting opening 20 and a first opening. The first opening is located in the non-phototransparent sub-region A2 and exposes a portion of the first electrode 200. The light-transmitting opening 20 is located in the phototransparent sub-region A1.

[0273] The protective structure 300 is located on the side of the first electrode 200 away from the planarization layer 120. The protective structure 300 at least covers the first electrode 200 located on the sidewall of the connecting via 10.

[0274] The protective structure 300 can be part of the isolation layer 500, or it can be a different membrane layer from the isolation layer 500.

[0275] As an example, the orthographic projection of the protective structure 300 on the substrate does not overlap with the orthographic projection of the isolation layer 500 on the substrate.

[0276] As another example, the orthographic projection of the protective structure 300 on the substrate partially overlaps with the orthographic projection of the isolation layer 500 on the substrate.

[0277] The light-emitting structure 400 is located on the side of the first electrode 200 away from the substrate within the first opening.

[0278] Based on the same inventive concept, this application also provides a display device (not shown), which includes the display panel 100 in the above embodiments.

[0279] It is understood that the display device in the embodiments of this application can be any product or component with display function, such as OLED display device, QLED display device, electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable device, Internet of Things device, etc., and the embodiments disclosed in this application do not limit this.

[0280] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0281] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0282] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel has a light-transmitting sub-region and a non-light-transmitting sub-region surrounding the light-transmitting sub-region, and the display panel includes: substrate; A planarization layer is located on one side of the substrate, and the planarization layer has a connection via located in the light-transmitting sub-region. The first electrode is located on the side of the planarization layer away from the substrate, and at least covers the sidewall of the connecting via and a portion of the planarization layer located in the non-transparent sub-region. A protective structure is located on the side of the first electrode away from the planarization layer, and at least covers the first electrode located on the sidewall of the connection via; The light-emitting structure is located on the side of the first electrode in the non-phototransparent region that is away from the substrate.

2. The display panel according to claim 1, characterized in that, The display panel further includes an isolation layer located on the side of the first electrode away from the substrate. The isolation layer includes the protective structure and the isolation structure. The isolation structure forms a first opening, and the isolation structure and the protective structure together form a light-transmitting opening. The light-transmitting opening is located in a portion of the light-transmitting sub-region. The first opening is located in the non-light-transmitting sub-region and exposes a portion of the first electrode. The light-emitting structure is located within the area defined by the first opening; Optionally, the light-emitting structure includes a light-emitting unit and a second electrode, wherein the light-emitting unit is located between the first electrode and the second electrode, and the second electrode is connected to the isolation structure; Optionally, the display panel further includes an encapsulation layer comprising a plurality of encapsulation units, wherein the encapsulation units are at least partially located within the area defined by the first opening and cover the light-emitting structure.

3. The display panel according to claim 2, characterized in that, The isolation layer includes at least two isolation sublayers, and the protective structure is located in at least one of the isolation sublayers; Optionally, the isolation layer includes a first isolation sublayer and a second isolation sublayer, wherein the first isolation sublayer is located on the side of the second isolation sublayer closer to the substrate, and the orthographic projection of the first isolation sublayer on the substrate is located within the orthographic projection of the second isolation sublayer on the substrate; Optionally, the isolation layer further includes a third isolation sublayer, which is located on the side of the first isolation sublayer away from the second isolation sublayer, and the orthographic projection of the first isolation sublayer on the substrate is located within the orthographic projection of the third isolation sublayer on the substrate; Optionally, the protective structure is located in at least one of the first isolation sublayer, the second isolation sublayer, and the third isolation sublayer.

4. The display panel according to claim 2, characterized in that, The display panel also includes: An insulating layer is located on the side of the isolation layer closer to the substrate and covers the first electrode and the side of the planarization layer away from the substrate, and the insulating layer is configured to form a second opening that exposes at least a portion of the first electrode, the second opening communicating with the first opening; Furthermore, the protective structure at least covers the insulating layer located on the sidewall of the connection via; Optionally, the insulating layer covers the light-transmitting sub-region; Optionally, the insulating layer includes a pixel definition layer; Optionally, the insulating layer may be made of inorganic materials.

5. The display panel according to claim 2, characterized in that, The light-transmitting sub-region includes a protective partition and a light-transmitting partition. The orthographic projection of the connecting via on the substrate is located within the orthographic projection of the protective partition on the substrate. The protective structure covers the first electrode located in the protective partition and exposes the structure within the light-transmitting partition. Optionally, in the protection zone, the first electrode continuously covers the bottom of the connection via, the sidewall of the connection via, and a portion of the planarization layer around the outer periphery of the connection via; Optionally, the orthographic projection of the protective partition on the substrate is 1 to 2 times the orthographic projection of the connecting via on the substrate; Optionally, the orthographic projection shape of the protective partition on the substrate is the same as the orthographic projection shape of the connecting via on the substrate.

6. The display panel according to claim 4, characterized in that, The protective structure is connected to the isolation structure, or the protective structure and the isolation structure are spaced apart.

7. The display panel according to claim 1, characterized in that, The display panel further includes an isolation layer located on the side of the first electrode away from the substrate; and the isolation layer is configured to form a light-transmitting opening and a first opening, the light-transmitting opening being located in the light-transmitting sub-region, the first opening being located in the non-light-transmitting sub-region, and exposing a portion of the first electrode; The material of the protective structure is different from that of the isolation layer, and the orthographic projection of the light-transmitting opening on the substrate coincides with the orthographic projection of the light-transmitting sub-region on the substrate.

8. The display panel according to claim 7, characterized in that, The protective structure is made of a light-transmitting material; Optionally, the material of the protective structure includes a transparent conductive material or a transparent semiconductor material; Optionally, the transparent conductive material includes indium tin oxide, and the transparent semiconductor material includes indium gallium zinc oxide; Optionally, the protective structure is made of a transparent conductive material, and the protective structure is spaced apart from the isolation layer.

9. The display panel according to claim 8, characterized in that, The orthographic projection of the protective structure onto the substrate covers the light-transmitting sub-region.

10. The display panel according to claim 8, characterized in that, The display panel further includes an insulating layer located on the side of the isolation layer near the substrate and covering the first electrode and the planarization layer. The insulating layer is configured to form a second opening that exposes the first electrode, and the second opening communicates with the first opening. The protective structure is stacked with the insulating layer, and the surfaces of the protective structure and the insulating layer that are close to each other coincide on the orthographic projection of the substrate. Optionally, the orthographic projection of the second opening on the substrate is located within the orthographic projection range of the first opening on the substrate.

11. The display panel according to claim 1, characterized in that, The display panel includes signal lines located on the side of the planarization layer near the substrate, the connection vias expose the signal lines, and the first electrode is connected to the signal lines through the connection vias.

12. A method for manufacturing a display panel, characterized in that, The display panel has a phototransparent sub-region and a non-phototransparent sub-region surrounding the phototransparent sub-region, and the method for manufacturing the display panel includes: Provide substrate; A planarization layer is formed on the substrate, and the planarization layer has a connection via located in the light-transmitting sub-region; A first electrode is formed on the side of the planarization layer away from the substrate, and the first electrode at least covers the sidewall of the connection via and a portion of the planarization layer located in the non-transparent sub-region. A protective structure is formed that at least covers the first electrode located on the sidewall of the connection via; A light-emitting structure is formed on the first electrode in the non-phototransparent region.

13. The method for manufacturing a display panel according to claim 12, characterized in that, Before forming the light-emitting structure on the first electrode in the non-transparent region, the method further includes: An isolation layer is formed on the side of the first electrode away from the substrate, and the isolation layer is at least located in the non-transparent sub-region, and is configured to form a light-transmitting opening and a first opening, the light-transmitting opening being located in the light-transmitting sub-region, the first opening being located in the non-transparent sub-region, and exposing the first electrode; The formation of a light-emitting structure on the first electrode in the non-transparent region includes: A light-emitting structure is formed within the area defined by the first opening. The light-emitting structure includes a light-emitting unit and a second electrode. The light-emitting unit is located between the first electrode and the second electrode, and the second electrode is connected to the isolation layer.

14. The method for manufacturing a display panel according to claim 13, characterized in that, The formation of a light-emitting structure within the area defined by the first opening includes: A light-emitting material layer and a second electrode material layer are sequentially deposited on the surface of the structure after the isolation structure is formed. An encapsulation material layer is formed on the surface of the second electrode material layer; The encapsulation material layer is dry etched to form an encapsulation unit at least within a first opening corresponding to the target color; The second electrode material layer and the light-emitting material layer are wet-etched to form the second electrode and the light-emitting unit in the first opening corresponding to the target color.

15. The method for manufacturing a display panel according to claim 13, characterized in that, The method of forming an isolation layer on the side of the first electrode away from the substrate includes: An insulating material layer is formed covering the first electrode and the planarization layer; An insulating material layer is formed on the insulating material layer; The isolation material layer is patterned to form the protective structure and the isolation structure. The isolation structure forms the first opening, and the isolation structure and the protective structure together form a light-transmitting opening. The light-transmitting opening is located in a part of the light-transmitting sub-region, and the first opening is located in the non-light-transmitting sub-region, exposing part of the first electrode. The insulating material layer is patterned to form an insulating layer and a second opening, the second opening being connected to the first opening.

16. The method for manufacturing a display panel according to claim 12, characterized in that, The protective structure that at least covers the first electrode located on the sidewall of the connection via includes: An insulating material layer is formed covering the first electrode and the planarization layer; A protective material layer is formed on the insulating material layer; The protective material layer is patterned to form the protective structure located in the light-transmitting sub-region; An insulating material layer is formed on the surface of the protective structure and the insulating material layer; The insulating material layer is patterned to form an insulating structure, a light-transmitting opening, and a first opening; The insulating material layer is patterned and formed in the second opening connected to the first opening.

17. The method for manufacturing a display panel according to claim 12, characterized in that, The protective structure that at least covers the first electrode located on the sidewall of the connection via includes: An insulating material layer is formed covering the first electrode and the planarization layer; A protective material layer is formed on the surface of the insulating material layer; The protective material layer and the insulating material layer are sequentially patterned to form the protective structure and the insulating layer.

18. A display panel, characterized in that, The display panel has a light-transmitting sub-region and a non-light-transmitting sub-region surrounding the light-transmitting sub-region, and the display panel includes: substrate; A planarization layer is located on one side of the substrate, and the planarization layer has a connection via located in the light-transmitting sub-region. The first electrode is located on the side of the planarization layer away from the substrate, and at least covers the sidewall of the connecting via and a portion of the planarization layer located in the non-transparent sub-region. An isolation layer is located on the side of the first electrode away from the substrate. The isolation layer encloses and forms a light-transmitting opening and a first opening. The first opening is located in a non-phototransmitting sub-region and exposes part of the first electrode. The light-transmitting opening is located in the phototransmitting sub-region. A protective structure is located on the side of the first electrode away from the planarization layer, and at least covers the first electrode located on the sidewall of the connection via; The light-emitting structure is located within the first opening on the side of the first electrode away from the substrate.

19. The display panel according to claim 18, characterized in that, The orthographic projection of the protective structure on the substrate does not overlap with the orthographic projection of the isolation layer on the substrate, or the orthographic projection of the protective structure on the substrate partially overlaps with the orthographic projection of the isolation layer on the substrate.

20. A display device, characterized in that, Includes the display panel as described in any one of claims 1-10.

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