Novel double-sided brushing device for wafer

Abstract

The invention discloses a novel wafer double-face scrubbing device which comprises a rotating disc used for driving a wafer to rotate, and a plurality of supporting assemblies used for supporting the corners of the wafer are arranged on the rotating disc; the scrubbing assembly comprises an upper scrubbing arm and a lower scrubbing arm, and the wafer is located between the upper scrubbing arm and the lower scrubbing arm; and the number of the nozzle assemblies is at least two, the nozzle assemblies are respectively arranged above and below the wafer, each nozzle assembly comprises a fixed arm, a first nozzle and a second nozzle, the first nozzle and the second nozzle are arranged on the fixed arm, the first nozzle faces the middle part of the wafer, and the second nozzle faces the supporting assembly. The double-face scrubbing device is high in cleaning efficiency.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, and specifically relates to a novel double-sided wafer cleaning device. Background Technology

[0002] Round wafers are the mainstream of the modern semiconductor industry, but square wafers are a new type of solution that is forward-looking and designed to improve efficiency and reduce costs. They have high area utilization, and square chips are manufactured on square substrates with almost no edge waste. They are especially suitable for large-size chips and can theoretically provide 10%-30% more effective area than wafers of the same size.

[0003] However, the edges and sharp corners of square wafers are prone to incomplete cleaning during brushing, resulting in particulate contamination. Tiny particles falling on the wafer surface can cause uneven photoresist coating, mask pattern deformation or breakage, leading to short circuits or open circuits. During thin film deposition or oxide layer growth, particles can become defect centers, causing premature breakdown or leakage of the insulating layer. After etching, particles may also connect to circuit lines that should be isolated, causing short circuits and direct chip failure. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a novel double-sided wafer cleaning device with high cleaning efficiency.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A novel double-sided wafer cleaning device includes:

[0007] A rotating disk is used to drive the wafer to rotate, and the rotating disk is provided with multiple support components for supporting the edges and corners of the wafer;

[0008] A scrubbing assembly includes an upper scrubbing arm and a lower scrubbing arm, with the wafer located between the upper scrubbing arm and the lower scrubbing arm;

[0009] At least two nozzle assemblies are respectively disposed above and below the wafer. Each nozzle assembly includes a fixing arm and a first nozzle and a second nozzle disposed on the fixing arm. The first nozzle faces the center of the wafer, and the second nozzle faces the support assembly.

[0010] In a preferred embodiment, the upper and lower brushing arms have brush holders and cleaning brushes disposed on the brush holders, the diameter of the cleaning brushes being larger than that of the brush holders.

[0011] In a preferred embodiment, the relationship between the moving distance of the cleaning brush and the wafer rotation angle is as follows: Where L is the side length of the wafer, and X is the maximum displacement of the cleaning brush when the wafer is rotated to the θ angle position.

[0012] In a preferred embodiment, the support assembly includes a column and a pin located on the column, the column having a guide slope, and the edges of the wafer being disposed on the guide slope and the pin.

[0013] In a preferred embodiment, the guide slope includes a first guide slope for holding a first side length of the wafer and a second guide slope for holding a second side length of the wafer, and a flow channel is provided between the first guide slope and the second guide slope.

[0014] In a preferred embodiment, the support assembly has a drain outlet and a drain pipe, the drain outlet being located below the water channel.

[0015] In a preferred embodiment, one end of the water trough is located on the upper surface of the column, and the other end is located above the drain outlet.

[0016] In a preferred embodiment, the double-sided scrubbing device further includes a drive mechanism for driving the rotating disk to rotate. The drive mechanism includes a motor and a drive wheel, and the edge of the rotating disk is provided with driven teeth that mesh with the drive wheel.

[0017] In a preferred embodiment, there are multiple drive mechanisms arranged around the edge of the rotating disk.

[0018] In a preferred embodiment, the drive mechanism further includes a motor mounting plate with rollers, the bottom of the rotating disk has a connecting plate and a baffle plate spaced apart, the connecting plate is clamped in the middle of the rollers, and the depth of the baffle plate is greater than the depth of the rollers.

[0019] The present invention adopts the above solution, which has the following advantages compared with the prior art:

[0020] While the rotating disk of the present invention drives the wafer to rotate, the upper and lower brushing arms move along the edge of the wafer toward the center of the wafer and brush the front and back sides of the wafer. The first nozzle on the nozzle assembly sprays cleaning fluid onto the center of the wafer, and the second nozzle sprays cleaning fluid onto the corners of the wafer, ensuring effective cleaning of the wafer and high cleaning efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A perspective view of a double-sided scrubbing device according to an embodiment of the present invention;

[0023] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0024] Figure 3 This is another perspective view of the double-sided scrubbing device according to an embodiment of the present invention;

[0025] Figure 4 for Figure 3 A magnified view of a section at point B in the middle;

[0026] Figure 5 This is a detailed view of the roller and connecting edge mating according to an embodiment of the present invention;

[0027] Figure 6 This is a front view of a double-sided scrubbing apparatus according to an embodiment of the present invention;

[0028] Figure 7 This is a schematic diagram of a support component according to an embodiment of the present invention;

[0029] Figure 8 for Figure 7 A magnified view of a section at point C;

[0030] Figure 9 This is another perspective view of the support component according to an embodiment of the present invention;

[0031] Figure 10 for Figure 9 A magnified view of a section at point D;

[0032] Figure 11 This is a top view of the support component according to an embodiment of the present invention;

[0033] Figure 12 for Figure 11 Sectional view at the center of EE;

[0034] Figure 13 This is a schematic diagram showing the maximum displacement of the cleaning brush, where θ = 0°;

[0035] Figure 14 This is a schematic diagram showing the maximum displacement of the cleaning brush, where θ = 45°.

[0036] in,

[0037] 100. Wafer; 101. First side length; 102. Second side length; 103. Corner;

[0038] 1. Rotary disc; 11. Driven gear; 12. Connecting plate; 13. Water baffle;

[0039] 2. Support components; 21. Column; 211. Step surface; 22. Ejector pin; 221. Guide ramp; 2211. First guide ramp; 2212. Second guide ramp; 23. Water channel; 24. Drain outlet; 25. Drainage pipe;

[0040] 3. Scrubbing assembly; 31. Upper scrubbing arm; 32. Lower scrubbing arm; 33. Brush base; 34. Cleaning brush; 35. Third nozzle;

[0041] 4. Nozzle assembly; 41. Fixed arm; 411. First nozzle; 412. Second nozzle; 5. Drive mechanism; 51. Motor; 52. Drive wheel; 53. Motor mounting plate; 54. Roller; 541. Middle section. Detailed Implementation

[0042] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is for the purpose of aiding understanding the present invention, but does not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0043] This embodiment provides a novel double-sided wafer cleaning device. It should be noted that the wafer used in this double-sided cleaning device is square in shape. Further, refer to... Figures 1 to 12 As shown, the double-sided scrubbing device includes a rotating disk 1, a support assembly 2, a scrubbing assembly 3, and a nozzle assembly 4.

[0044] Furthermore, the rotating disk 1 is disc-shaped with a hollow portion, on which the wafer 100 is disposed. The rotating disk 1 drives the wafer 100 to rotate 360° on a horizontal plane. The support assembly 2 is disposed on the rotating disk 1, combined with... Figure 1 and Figure 2 As shown, the support component 2 is used to support the wafer 100. Specifically, it supports the entire wafer 100 by supporting the corners 103 of the wafer 100. Specifically, the wafer 100 has four corners 103, and the number of corresponding support components 2 is also four. The four corners 103 of the wafer 100 overlap the support component 2.

[0045] Reference Figures 7 to 12As shown, the support assembly 2 includes a column 21 and a pin 22 located on the column 21. A guide slope 221 is provided on the column 21. The corner 103 of the wafer 100 is disposed on the guide slope 221 and the pin 22. Specifically, the pin 22 supports the bottom of the corner 103, and the guide slope 221 supports the side of the corner 103. The guide slope 221 serves as a guide, and its slope facilitates the placement of the wafer 100. More specifically, the guide slope 221 includes a first guide slope 2211 and a second guide slope 2212. The first guide slope 2211 is used to hold the first side length 101 of the wafer 100, and the second guide slope 2212 is used to hold the second side length 102 of the wafer 100. In this embodiment, the lengths of the first side length 101 and the second side length 102 are equal, meaning the wafer is square. In other embodiments, the lengths of the first side length and the second side length may not be equal.

[0046] Furthermore, a water channel 23 is provided between the first guide slope 2211 and the second guide slope 2212. The support assembly 2 has a drain outlet 24 and a drain pipe 25, with the drain outlet 24 located below the water channel 23. When cleaning the wafer, when the nozzle assembly 4 sprays liquid onto the support assembly 2, the liquid can flow along the water channel 23 into the drain outlet 24 and out through the drain pipe 25, preventing water accumulation at the corners 103 of the wafer 100 while also rinsing the sides of the wafer.

[0047] Reference Figure 10 As shown, one end of the water trough 23 is located on the upper surface of the column 21, and the other end is located above the drain outlet 24. Specifically, the column 21 has a stepped surface 211, and the ejector pin 22 is located on the stepped surface 211. When liquid flows in along the water trough 23, it can be splashed back onto the back of the corners 103 of the wafer 100 through the stepped surface 211, thus rinsing the back of the corners 103 of the wafer 100. It should be noted that the ejector pin 22 is cleaned before the wafer is placed into the support assembly 2 to prevent particulate contamination at the contact points with the ejector pin 22 after the wafer 100 is placed on it. This embodiment can perform all-round cleaning of the wafer or ensure that the wafer is cleaned relatively thoroughly.

[0048] Reference Figure 3As shown, the brushing assembly 3 includes an upper brushing arm 31 and a lower brushing arm 32. The wafer 100 is located between the upper brushing arm 31 and the lower brushing arm 32. Further, both the upper brushing arm 31 and the lower brushing arm 32 have a third nozzle 35, a brush holder 33, and a cleaning brush 34 disposed on the brush holder 33. The cleaning brush 34 and the brush holder 33 are cylindrical in shape. The diameter of the cleaning brush 34 is larger than that of the brush holder 33. The cleaning brush 34 can brush a larger wafer area and clean the edges and corners of the wafer more thoroughly. Moreover, if the diameter of the brush holder 33 is larger than that of the cleaning brush 34, interference with the brush holder may easily occur during brushing, especially when brushing the edges and corners of the wafer. Two cleaning brushes are arranged vertically to clean the front and back sides of the wafer 100. When the cleaning brush 34 cleans the wafer 100, the third nozzle 35 sprays cleaning fluid to facilitate the cleaning brush 34 to clean the wafer 100. The water pressure of the third nozzle of the upper cleaning arm 31 is greater than the water pressure of the third nozzle of the lower cleaning arm 32.

[0049] Furthermore, both the upper brush arm 31 and the lower brush arm 32 are equipped with drive motor units to drive the cleaning brush 34 to move. This drive unit is prior art and not the focus of this invention, so it will not be described in detail here. When cleaning the wafer, the cleaning brush 34 moves towards the center of the wafer while rotating around its own axis. Furthermore, the downward pressure exerted by the cleaning brush 34 on the wafer is F=PS. η, where P is the air pressure, S is the cylinder area, and η is the working efficiency. By controlling the air pressure P, the pressure F applied by the cleaning brush to the wafer can be controlled, ensuring both the cleaning efficiency of the brush and preventing the brush from crushing the wafer. For example, the minimum force required for wafer cleaning is F1, which is 1N, and the maximum force it can withstand is F2, which is 5N. The cylinder diameter is 20mm, and η is specifically the cylinder load rate, taken as 0.7. The minimum air pressure P1 = F1 / Sη, and S = πr 2 Substituting F1=1N and r=1cm, we get P1≈0.46N / cm 2 Converting to MPa, P1≈0.046MPa. Similarly, the maximum air pressure is calculated to be P2≈0.23MPa. That is, the air pressure output value P can be between 0.046 and 0.23MPa. By calculating the cylinder input air pressure, it is possible to clean the wafer without crushing it, which is quite convenient to use.

[0050] While rotating, the cleaning brush 34 moves horizontally relative to the wafer 100, moving either from the edge of the wafer 100 towards its center or from its center towards its edge. The distance the cleaning brush 34 moves is... Where L is the side length of the wafer, and X is the maximum displacement of the cleaning brush when the wafer is rotated to the θ angle position.

[0051] See the appendix for details. Figure 13and 14 As shown, as the wafer 100 rotates, the displacement of the cleaning brush 34 will continuously change. In order to ensure that the cleaning brush 34 can contact the wafer 100 every time and will not fall into the gap between the wafer 100 and the rotating disk 1, the cleaning efficiency of the wafer will be improved.

[0052] The maximum value of the cleaning brush displacement is now set: When θ = 0°, X = L / 2; when θ = 45°, The period is π / 4. Furthermore, for any non-negative real numbers a and b, the maximum value max(a,b) can be expressed as a limit: max(a,b) = lim n→∞ (a n +b n ) 1 / n (As n→∞, the larger number raised to the power of n will dominate the result). Substituting a=|cosθ| and b=|sinθ|, the original formula can be rewritten as: More specifically, AB = L / 2. In this embodiment, X represents the starting and ending points of the cleaning brush movement, with the starting point being... Figure 13 The center A of the wafer is the starting point of the cleaning brush displacement. The cleaning brush follows... Figure 13 The brush moves horizontally in the direction of the arrow until it reaches the edge of the wafer, which is the end point of the cleaning brush (or, starting from the edge of the wafer, the cleaning brush moves in the opposite direction of the arrow until it reaches the center A of the wafer).

[0053] The nozzle assembly 4 includes a fixed arm 41 and a first nozzle 411 and a second nozzle 412 disposed on the fixed arm 41. The first nozzle 411 faces the center of the wafer 100, and the second nozzle 412 faces the support assembly 2. The cleaning fluid sprayed from the second nozzle 412 is mainly used to clean the edges and corners 103 of the wafer. Since this embodiment cleans both the front and back sides of the wafer, there are two nozzle assemblies 4, respectively disposed above and below the wafer 100. The second nozzle located above the wafer cleans the edges and corners of the front side of the wafer, and the second nozzle located below the wafer cleans the edges and corners of the back side of the wafer.

[0054] The double-sided scrubbing device also includes a drive mechanism 5, which drives the rotating disk 1 to rotate. Further, the drive mechanism 5 includes a motor 51, a drive wheel 52, and a motor mounting plate 53. The motor 51 drives the drive wheel 52 to rotate. The drive wheel 52 has drive teeth, and the edge of the rotating disk 1 has driven teeth 11 that mesh with the drive teeth. When the motor 51 is turned on, the drive wheel 52 rotates. Because the rotating disk 1 and the drive wheel 52 mesh, the rotating disk 1 rotates accordingly. (Refer to...) Figure 1 As shown, there are multiple drive mechanisms 5, specifically four, which are evenly arranged around the edge of the rotating disk 1.

[0055] Furthermore, combined Figure 4 and Figure 5 As shown, the motor mounting plate 53 is equipped with rollers 54. The bottom of the rotating disk 1 has a connecting plate 12 and a baffle plate 13 spaced apart. The connecting plate 12 and the baffle plate 13 are roughly circular in shape, and a track space is formed between the connecting plate 12 and the baffle plate 13 for the rollers 54 to move. Each motor mounting plate 53 is equipped with two rollers 54. The middle part 541 of the roller 54 has a gap, which clamps the edge of the connecting plate 12 and can play a positioning role for the movement of the entire rotating disk 1. When the connecting plate 13 rotates, the rollers 54 can also push the driven tooth 11 and the driving tooth to mesh, making the meshing connection between the two tighter and the operation of the entire drive mechanism 5 more stable. Furthermore, the depth of the baffle plate 13 is deeper than the depth of the rollers 54 to prevent liquid from entering the rollers 54 or the drive mechanism 5 and affecting the operation of the device. In this embodiment, the rotating disk 1 of the wafer double-sided brushing device drives the wafer 100 to rotate. At the same time, the upper brushing arm 31 and the lower brushing arm 32 move along the edge of the wafer 100 towards the center of the wafer 100 and brush the front and back sides of the wafer 100. The first nozzle 411 on the nozzle assembly 4 sprays cleaning fluid onto the center of the wafer 100, and the second nozzle 412 sprays cleaning fluid onto the corners 103 of the wafer 100, ensuring that the wafer 100 can be effectively cleaned and the cleaning efficiency is high.

[0056] As indicated in this specification and claims, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, and these steps and elements do not constitute an exclusive list; the method or apparatus may also include other steps or elements. The term "and / or" as used herein includes any combination of one or more of the associated listed items.

[0057] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. Furthermore, the descriptions of "up," "down," "left," and "right" used in this invention are only relative to the relative positional relationships of the various components of the invention in the accompanying drawings.

[0058] The above embodiments are merely illustrative of the technical concept and features of the present invention, and are preferred embodiments. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and they should not be construed as limiting the scope of protection of the present invention. All equivalent transformations or modifications made according to the principles of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A novel double-sided wafer cleaning device, characterized in that, include: A rotating disk is used to drive the wafer to rotate, and the rotating disk is provided with multiple support components for supporting the edges and corners of the wafer; A scrubbing assembly includes an upper scrubbing arm and a lower scrubbing arm, with the wafer located between the upper scrubbing arm and the lower scrubbing arm; At least two nozzle assemblies are respectively disposed above and below the wafer. Each nozzle assembly includes a fixing arm and a first nozzle and a second nozzle disposed on the fixing arm. The first nozzle faces the center of the wafer, and the second nozzle faces the support assembly.

2. The double-sided scrubbing device according to claim 1, characterized in that, The upper and lower brushing arms each have a brush base and a cleaning brush mounted on the brush base, the diameter of which is larger than that of the brush base.

3. The double-sided scrubbing device according to claim 2, characterized in that, The relationship between the moving distance of the cleaning brush and the rotation angle of the wafer is as follows: Where L is the side length of the wafer, and X is the maximum displacement of the cleaning brush when the wafer is rotated to the θ angle position.

4. The double-sided scrubbing device according to claim 1, characterized in that, The support assembly includes a column and a pin located on the column. The column is provided with a guide slope, and the edges and corners of the wafer are located on the guide slope and the pin.

5. The double-sided scrubbing device according to claim 4, characterized in that, The guide slope includes a first guide slope for clamping the wafer with a first side length and a second guide slope for clamping the wafer with a second side length, and a water channel is provided between the first guide slope and the second guide slope.

6. The double-sided scrubbing device according to claim 5, characterized in that, The support assembly has a drain outlet and a drain pipe, with the drain outlet located below the water channel.

7. The double-sided scrubbing device according to claim 6, characterized in that, One end of the water trough is located on the upper surface of the column, and the other end is located above the drain outlet.

8. The double-sided scrubbing device according to claim 1, characterized in that, The double-sided scrubbing device also includes a drive mechanism for driving the rotating disk to rotate. The drive mechanism includes a motor and a drive wheel, and the edge of the rotating disk is provided with driven teeth that mesh with the drive wheel.

9. The double-sided scrubbing device according to claim 8, characterized in that, The number of drive mechanisms is multiple, and the multiple drive mechanisms are arranged around the edge of the rotating disk.

10. The double-sided scrubbing device according to claim 8, characterized in that, The drive mechanism also includes a motor mounting plate, on which rollers are provided. The bottom of the rotating disk has a connecting plate and a baffle plate spaced apart. The connecting plate is clamped in the middle of the rollers. The depth of the baffle plate is greater than the depth of the rollers.

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